WO2021184451A1 - 一种柔性衬底材料、柔性衬底制备方法及柔性显示面板 - Google Patents

一种柔性衬底材料、柔性衬底制备方法及柔性显示面板 Download PDF

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WO2021184451A1
WO2021184451A1 PCT/CN2020/083539 CN2020083539W WO2021184451A1 WO 2021184451 A1 WO2021184451 A1 WO 2021184451A1 CN 2020083539 W CN2020083539 W CN 2020083539W WO 2021184451 A1 WO2021184451 A1 WO 2021184451A1
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flexible substrate
graphene
matrix
flexible
preparing
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French (fr)
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查宝
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TCL China Star Optoelectronics Technology Co Ltd
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TCL China Star Optoelectronics Technology Co Ltd
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Priority to US16/765,803 priority Critical patent/US20220115608A1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/70—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres
    • D04H1/72—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
    • D04H1/728—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged by electro-spinning
    • D—TEXTILES; PAPER
    • D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
    • D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
    • D01D5/00—Formation of filaments, threads, or the like
    • D01D5/0007—Electro-spinning
    • D—TEXTILES; PAPER
    • D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
    • D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
    • D01D5/00—Formation of filaments, threads, or the like
    • D01D5/0007—Electro-spinning
    • D01D5/0015—Electro-spinning characterised by the initial state of the material
    • D01D5/003—Electro-spinning characterised by the initial state of the material the material being a polymer solution or dispersion
    • D—TEXTILES; PAPER
    • D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
    • D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
    • D01F1/00—General methods for the manufacture of artificial filaments or the like
    • D01F1/02—Addition of substances to the spinning solution or to the melt
    • D01F1/10—Other agents for modifying properties
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/407—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties containing absorbing substances, e.g. activated carbon
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • D—TEXTILES; PAPER
    • D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
    • D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
    • D01F6/00—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof
    • D01F6/58—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products
    • D01F6/74—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products from polycondensates of cyclic compounds, e.g. polyimides, polybenzimidazoles
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2101/00—Inorganic fibres
    • D10B2101/10—Inorganic fibres based on non-oxides other than metals
    • D10B2101/12—Carbon; Pitch
    • D10B2101/122—Nanocarbons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technology, in particular to a flexible substrate material, a method for preparing a flexible substrate, and a flexible display panel.
  • OLED Organic Light-Emitting Diode
  • Micro-LED Micro-Light Emitting Diode
  • LCD liquid crystal Display
  • OLED display technology and Micro-LED display technology still have some details to be perfected, and these details restrict the wide application and development of OLED display technology and Micro-LED display technology.
  • both OLED display technology and Micro-LED display technology adopt active light-emitting means.
  • the resolution increases, the demand for color resistance per unit area increases, resulting in more heat per unit area.
  • the generated heat needs to be released in time to avoid the negative impact of the high temperature on the display device.
  • Existing OLED flexible display panels and Micro-LED flexible display panels generally use polyimide as the flexible substrate material, but the thermal conductivity of the polyimide flexible substrate is limited.
  • the invention provides a flexible substrate material, a method for preparing a flexible substrate, and a flexible display panel.
  • the flexible substrate can be improved while ensuring good bending characteristics and deformation resistance.
  • the heat conduction performance of the bottom thereby improving the heat dissipation performance of the flexible display panel.
  • a flexible substrate material including:
  • Graphene reinforcements are dispersed in the flexible matrix, and are connected to the flexible matrix by chemical bonds; each of the graphene reinforcements includes a graphene matrix and metal nanoparticles, and the graphene matrix is a sheet structure, so The metal nanoparticles are distributed on the surface of the sheet structure of the graphene matrix.
  • the flexible substrate material is modified by doping the graphene reinforcement in the flexible matrix.
  • the graphene matrix has good thermal conductivity, and the thermal conductivity can reach up to 5000W/(m ⁇ K), thereby effectively improving the flexible substrate The heat conduction performance.
  • the graphene matrix adopts a sheet-layer structure, and metal nanoparticles are distributed on the surface of the sheet-layer structure to prevent any two or more sheet-layer structures of the graphene matrix from agglomerating in the flexible matrix.
  • the material of the flexible matrix is polyethersulfone, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyimide, polyarylate, and One or more of glass fiber reinforced plastics.
  • the material of the flexible substrate is polyimide.
  • the material of the metal nanoparticles is one or more of silver, copper, iron, titanium, nickel, and platinum.
  • the material of the metal nanoparticles is silver.
  • the sheet structure of the graphene matrix is a single layer, and the metal nanoparticles are distributed on at least one surface of the single layer.
  • the sheet structure of the graphene matrix is a composite layer, and the metal nanoparticles are distributed on at least one of the upper and lower outermost surfaces of the composite layer.
  • an embodiment of the present invention provides a method for preparing a flexible substrate, including the following steps:
  • each of the graphene reinforcements includes a graphene matrix and metal nanoparticles, the graphene matrix has a sheet structure, and the metal nanoparticles are distributed on the graphene matrix of the sheet structure On the surface
  • the flexible substrate material solution is formed into a film by electrospinning to obtain a flexible substrate in which the graphene reinforcement is dispersed in the flexible matrix.
  • the step of preparing the graphene reinforcement includes:
  • the second mixture is filtered to obtain a filtrate, and the filtrate is the graphene reinforcement.
  • the metal salt solution is a silver nitrate solution
  • the metal nanoparticles in the graphene reinforcement are silver nanoparticles.
  • the concentration of the silver nitrate solution ranges from 150 to 200 g/mol.
  • the mass ratio between the graphene oxide having a sheet structure and the silver nitrate solution is 50-60:1.
  • the reducing agent is D-glucose.
  • the molar ratio of the D-glucose to the silver nitrate solution is 1:1.2.
  • the reaction temperature of the reduction reaction is 100-120° C. to avoid damage to the reaction system due to high temperature.
  • the reaction time of the reduction reaction is 10-12 hours to ensure that the reduction reaction is sufficient.
  • the preparation of the flexible substrate material solution includes the following steps:
  • the raw materials for preparing the flexible matrix are added, and the mixture is uniformly mixed to fully react to obtain a flexible substrate material solution.
  • the dispersion solution is tetrahydrofuran
  • the raw materials of the flexible matrix are dianhydrides and diamines
  • the corresponding steps of preparing the flexible substrate material solution include:
  • the thickness of the flexible substrate is 10-1000 micrometers.
  • an embodiment of the present invention provides a flexible display panel, including: a flexible substrate manufactured by the flexible substrate manufacturing method described in the second aspect.
  • the flexible substrate material provided by the present invention is a composite material obtained by doping a graphene reinforcement into a flexible polymer material.
  • the flexible substrate material has both good bending characteristics, deformation resistance and high thermal conductivity, thereby greatly improving the heat dissipation performance of the flexible substrate. Because the graphene matrix has a strong ⁇ - ⁇ conjugated bond, agglomeration is prone to occur in polymer materials, so it is difficult to uniformly disperse in polymer materials.
  • the present invention further distributes metal nanoparticles on the surface of the sheet structure of the graphene matrix to form a point-to-surface dispersion effect (that is, the metal nanoparticles prevent any two or more sheet layers of the graphene matrix The structures contact each other and gather), thereby effectively preventing the occurrence of agglomeration.
  • the method for preparing a flexible substrate includes the steps of preparing a graphene reinforcement; preparing a flexible substrate material solution; forming the flexible substrate material solution into a film by electrostatic spinning to obtain a flexible substrate.
  • the preparation method has the advantages of fewer procedures, simple operation, easy control, and easy realization of industrialized production.
  • the flexible display panel provided by the present invention including the flexible substrate prepared by the flexible substrate preparation method provided by the present invention, has superior heat dissipation performance, meets the high requirements for heat dissipation performance of OLED and Micro-LED display technologies, and is beneficial to broaden OLED ,
  • the application scope of Micro-LED display technology promotes the rapid development of OLED and Micro-LED display technology.
  • Fig. 1 is a schematic diagram of the structure of a flexible substrate material in an embodiment of the present invention.
  • Fig. 2 is a schematic flow chart of a method for preparing a flexible substrate in an embodiment of the present invention.
  • Fig. 3 is a schematic diagram of the flow of step S1 in Fig. 2.
  • FIG. 4 is a schematic diagram of the flow of step S2 in FIG. 2.
  • a flexible substrate material including:
  • a plurality of graphene reinforcements are dispersed in the flexible matrix and are connected to the flexible matrix by chemical bonds; each of the graphene reinforcements includes a graphene matrix and a plurality of metal nanoparticles, and the graphene matrix is A tiny sheet structure, and the plurality of metal nanoparticles are distributed on at least one surface of the sheet structure of the graphene matrix.
  • the flexible substrate material provided by the embodiment of the present invention is a composite material, and the flexible substrate is doped with graphene reinforcement by modifying the traditional flexible substrate material (that is, a flexible matrix). , Thereby greatly improving the thermal conductivity of the flexible substrate material.
  • each of the graphene substrates has a one-layer structure. Since the graphene matrix has outstanding thermal conductivity and mechanical properties, doping it into the flexible matrix can greatly improve the thermal conductivity of the flexible substrate.
  • the graphene matrix has a strong ⁇ - ⁇ conjugated bond
  • agglomeration is likely to occur between the sheet structures of multiple graphene matrixes in polymer materials (such as flexible substrates), so it is difficult to Evenly dispersed in polymer materials. Therefore, a plurality of metal nanoparticles are distributed on at least one surface of the sheet structure of each graphene matrix to obtain a graphene reinforcement, which can greatly weaken the force of the ⁇ - ⁇ conjugated bond to form a point-to-surface
  • the dispersion effect that is, the metal nanoparticles prevent the sheet structures of any two or more graphene substrates from contacting and gathering with each other), thereby promoting the uniform dispersion of the graphene reinforcement in the flexible substrate.
  • the lateral length dimension of the sheet structure of the graphene matrix is generally between 2 to 70 microns, and the thickness is between 2 to 10 nanometers, and a single graphene matrix sheet structure It can exist in the form of a single layer, or in the form of a composite layer, and the composite layer may be composed of multiple single layers such as 2, 5, 10, 20, or 30.
  • the multiple metal nanoparticles are distributed on at least one surface of the single layer; when the sheet structure of a single graphene matrix is When the composite layer exists, the plurality of metal nanoparticles are distributed on at least one of the upper and lower outermost surfaces of the composite layer to prevent any two adjacent sheet structures from contacting and gathering with each other.
  • the flexible matrix is polyimide, polyethersulfone, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyarylate, and glass fiber
  • the embodiment of the present invention is preferably polyimide.
  • Polyimide is a type of polymer whose repeating unit uses imide groups as structural characteristic groups. It has good mechanical properties, high insulation properties, high temperature resistance, corrosion resistance, and dielectric properties. It has the advantages of low electrical loss and is one of the polymer materials with ideal comprehensive performance.
  • the material of the metal nanoparticles is one or more of silver, copper, iron, titanium, nickel, and platinum.
  • the embodiment of the present invention is preferably silver, and the nano-silver particles have the advantages of good stability, low cost, easy acquisition, and simple production process.
  • a flexible substrate material 10 specifically a polyimide 12 doped with graphene reinforcement 11, the graphene reinforcement 11 is uniformly dispersed in the polyimide 12 and combined with the polyimide The 12 is connected by a chemical bond.
  • each of the graphene reinforcements 11 includes a graphene matrix 111 and a plurality of nano silver particles 112.
  • the graphene matrix 111 is graphene with a tiny sheet structure, and the plurality of nano The silver particles 112 are distributed on at least one surface (for example, the upper and lower surfaces) of the graphene matrix 111.
  • the flexible substrate material 10 can be used to prepare/as a flexible substrate of an organic light-emitting diode (OLED) flexible display panel and/or a micro-light-emitting diode (Micro-LED) flexible display panel, so as to improve the flexibility of the flexible display panel on the organic light-emitting diode (OLED) flexible display panel.
  • OLED organic light-emitting diode
  • Micro-LED micro-light-emitting diode
  • an embodiment of the present invention provides a method for preparing a flexible substrate.
  • the material of the flexible substrate is the flexible substrate material described in the first aspect. Referring to FIG. 2, the method includes the following steps:
  • each of the graphene reinforcements includes a graphene matrix and metal nanoparticles; the graphene matrix has at least one sheet structure, and the metal nanoparticles are distributed on the surface of the sheet structure of the graphene matrix .
  • the step S1 includes the following steps:
  • the graphene reinforcement is prepared by an oxidation-reduction reaction method.
  • the raw materials for preparing the graphene reinforcement are graphene oxide and a metal salt solution, and the two are mixed to obtain a first mixture.
  • Graphene oxide is a tiny sheet structure. Its unique two-dimensional structure and abundant oxygen-containing functional groups enable it to be uniformly and stably dispersed in the metal salt solution, and graphene oxide has a strong effect on the metal cations of the metal salt solution.
  • the adsorption capacity promotes the attachment of metal cations in the metal salt solution to the graphene oxide.
  • the graphene oxide and the metal salt solution undergo a reduction reaction, so that metal nanoparticles are uniformly distributed on the surface of the sheet structure of the graphene matrix, thereby forming a graphene reinforcement doped with metal nanoparticles .
  • the reaction temperature of the reduction reaction is 100 to 120° C.
  • the reaction time is 10 to 12 hours, which ensures that the reduction reaction is sufficient while avoiding high temperature damage to the reaction system.
  • the second mixture is filtered, and the filtrate is taken for drying treatment, such as a drying operation, to obtain the graphene reinforcement.
  • the step S1 includes the following steps:
  • the graphene oxide having a sheet structure and the silver nitrate solution are mixed in a mass ratio of 50-60:1, and the concentration of the silver nitrate solution is in the range of 150-200 g/mol.
  • D-glucose is added dropwise to the first mixture until the molar ratio of D-glucose to the silver nitrate solution in the reaction system reaches 1:1.2, then the addition of D-glucose is stopped.
  • the graphene reinforcement and the raw materials of the flexible matrix are mixed to prepare a flexible substrate material solution.
  • the flexible substrate material solution is a flexible matrix solution doped with graphene reinforcements, and the graphene reinforcements are uniformly dispersed in the flexible matrix.
  • the preparation of the flexible substrate material solution includes the following steps:
  • the graphene reinforcement is uniformly dispersed in a specific dispersion solution to obtain a graphene dispersion solution.
  • the specific dispersion solution needs to meet conditions: ideal compatibility with the graphene reinforcement; and cannot react with the graphene reinforcement, the flexible matrix, and the raw materials for preparing the flexible matrix.
  • the step of preparing a solution of flexible substrate material includes the following steps:
  • the flexible substrate material solution is formed into a film by electrospinning to obtain the flexible substrate.
  • the graphene reinforcement is dispersed in the flexible matrix.
  • the electrospinning method is a special fiber manufacturing process in which the polymer solution or melt is jet-spinned in a strong electric field to produce polymer filaments with nanometer diameter.
  • the electrospinning method is a special form of electrostatic atomization of polymer fluids. Under the action of an electric field, the droplets at the needle tip change from a spherical shape to a conical shape, and extend from the tip of the cone to obtain fibrous filaments. When it is large enough, the polymer droplets can overcome the surface tension to form a jet stream, the charged polymer jet stretches, and finally solidifies to form a fiber.
  • the electrospinning method has the advantages of simple operation, low cost, and controllable process.
  • the prepared flexible substrate has the characteristics of uniform fiber diameter distribution, large specific surface area, and large porosity, which is beneficial to improve the heat dissipation effect of the flexible substrate.
  • the embodiment of the present invention does not specifically limit the process parameters of the electrospinning method, and can be selected according to actual needs.
  • the flexible substrate material solution can be formed into a film on a temporary carrier substrate by electrospinning to obtain a flexible substrate attached to the carrier substrate, and finally the flexible substrate Tear from the carrier substrate for use.
  • the temporary carrier substrate is a reusable rigid substrate or flexible substrate to provide a temporary support surface.
  • the rigid substrate can be made of glass, metal, etc.
  • the flexible substrate can be made of plastic or other materials, but it needs to have enough
  • the support thickness for example, in the embodiment of the present invention, the carrier substrate is preferably a glass substrate.
  • the thickness of the flexible substrate is 10-1000 microns, which can be used as a flexible substrate for OLED flexible display panels and Micro-LED flexible display panels, and its heat resistance and thermal conductivity characteristics are significantly better than traditional flexible substrates. Substrate.
  • an embodiment of the present invention provides a flexible display panel, including: a flexible substrate manufactured by the flexible substrate manufacturing method described in the second aspect.
  • the flexible display panel may be an OLED flexible display panel, including: a flexible substrate, a thin film transistor array layer, and a plurality of OLED display units (such as a red resistor, a green resistor, and a blue resistor) stacked from bottom to top.
  • OLED display unit such as a red resistor, a green resistor, and a blue resistor
  • the flexible substrate is a flexible substrate prepared by the method for preparing a flexible substrate in the second aspect of the present invention, and other layers or The components can all adopt existing technology products.
  • the OLED flexible display panel can be provided with other functional layers according to actual needs, such as a polarizer, a protective layer, a touch control layer, etc., and the above functional layers can all adopt existing technology products.
  • the flexible display panel may be a Micro-LED flexible display panel, including: a flexible substrate, an integrated circuit layer, and an LED matrix layer stacked from bottom to top.
  • the flexible substrate adopts the present invention.
  • other layers or components can all adopt existing technology products.
  • the flexible display panel provided by the third aspect of the present invention can be applied to a variety of display devices.
  • the display device can be a mobile phone, a tablet computer, a notebook computer, a digital camera, a digital video camera, a smart wearable device, and a smart weighing device. Any product or component with display function such as electronic scales, car monitors or televisions.
  • the smart wearable device may be a smart bracelet, smart watch, smart glasses, or the like.

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Abstract

一种柔性衬底材料（10），包括：柔性基体（12）以及分散于柔性基体（12）中的石墨烯增强体（11），石墨烯增强体（11）包括石墨烯基体（111）和金属纳米颗粒（112），石墨烯基体（111）为片层结构，金属纳米颗粒（112）分布于石墨烯基体（111）的片层结构的表面上。一种柔性衬底材料（10）的制备方法以及柔性显示面板。

Description

一种柔性衬底材料、柔性衬底制备方法及柔性显示面板 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性衬底材料、柔性衬底制备方法及柔性显示面板。
背景技术
随着显示技术的快速发展，有机发光二极管(Organic Light-Emitting Diode，OLED)显示技术和微发光二极管(Micro Light Emitting Diode，Micro-LED)显示技术由于具有低功耗、高亮度、超高分辨率与色彩饱和度、反应速度快等优点，以及无需背光源、能够自发光的特性，所以被认为是取代液晶显示技术(Liquid Crystal Display，LCD)的新一代显示技术。
技术问题
目前，OLED显示技术和Micro-LED显示技术还有一些细节问题有待完善，这些细节问题制约了OLED显示技术和Micro-LED显示技术的广泛应用及发展。例如，OLED显示技术和Micro-LED显示技术均采用主动发光手段，随着解析度的提高，单位面积的色阻需求量就越多，使得单位面积产生的热量越多。为了保证显示装置正常工作，需要及时将产生的热量释放出去，以避免高温对显示装置的负面影响。现 有的OLED柔性显示面板和Micro-LED柔性显示面板一般采用聚酰亚胺作为柔性衬底材料，但聚酰亚胺柔性衬底的热传导性能有限。
因此，开发具有高热传导性能的柔性衬底材料，是拓宽OLED显示技术和Micro-LED显示技术应用范围的关键因素之一。
技术解决方案
本发明提供了一种柔性衬底材料、柔性衬底制备方法及柔性显示面板，通过对柔性衬底材料进行改性，在保证柔性衬底良好弯折特性和抗变形能力的同时，提高柔性衬底的热传导性能，从而提升柔性显示面板的散热性能。
第一方面，本发明实施例提供一种柔性衬底材料，包括：
柔性基体；以及
石墨烯增强体，分散于所述柔性基体中，与所述柔性基体通过化学键连接；每一所述石墨烯增强体包括石墨烯基体和金属纳米颗粒，所述石墨烯基体为片层结构，所述金属纳米颗粒分布于所述石墨烯基体的片层结构的表面上。
通过柔性基体中掺杂石墨烯增强体的方式来实现柔性衬底材料的改性，石墨烯基体具有良好的热传导性，热传导系数最高可达5000W/(m·K)，从而有效提升柔性衬底的热传导 性能。此外，所述石墨烯基体采用片层结构，并且片层结构的表面上分布有金属纳米颗粒，以防止任两个或多个石墨烯基体的片层结构之间在柔性基体中出现团聚现象。
在一些实施例中，所述柔性基体的材料为聚醚砜、聚碳酸脂、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚酰亚胺、多芳基化合物以及玻璃纤维增强塑料中的一种或多种。
在一些实施例中，所述柔性基体的材料为聚酰亚胺。
在一些实施例中，所述金属纳米颗粒的材料为银、铜、铁、钛、镍以及铂中的一种或多种。
在一些实施例中，所述金属纳米颗粒的材料为银。
在一些实施例中，所述石墨烯基体的片层结构为单一层体，所述金属纳米颗粒分布于所述单一层体的至少一表面上。
在一些实施例中，所述石墨烯基体的片层结构为复合层，所述金属纳米颗粒分布于所述复合层的上下两最外侧表面中的至少一表面上。
第二方面，本发明实施例提供了一种柔性衬底制备方法，包括以下步骤：
制备石墨烯增强体，每一所述石墨烯增强体包括石墨烯基体和金属纳米颗粒，所述石墨烯基体为片层结构，所述金属纳米颗粒分布于所述石墨烯基体的片层结构的表面上；
将所述石墨烯增强体与柔性基体的原料混合，以制备柔性衬底材料溶液；以及
将所述柔性衬底材料溶液通过静电纺丝方式成膜，以得到柔性衬底，在所述柔性衬底中，所述石墨烯增强体分散于所述柔性基体中。
在一些实施例中，制备所述石墨烯增强体的步骤包括：
将具有片层结构的氧化石墨烯与金属盐溶液混合，得到第一混合物；
向所述第一混合物中加入还原剂，以进行还原反应，得到第二混合物；以及
过滤所述第二混合物得到滤出物，所述滤出物即为所述石墨烯增强体。
在一些实施例中，所述金属盐溶液为硝酸银溶液，对应所述石墨烯增强体中的所述金属纳米颗粒为银纳米颗粒。
在一些实施例中，所述硝酸银溶液的浓度范围为150～200g/mol。
在一些实施例中，所述具有片层结构的氧化石墨烯与所述硝酸银溶液之间的质量比为50～60:1。
在一些实施例中，所述还原剂为D-葡萄糖。
在一些实施例中，所述D-葡萄糖与所述硝酸银溶液的摩 尔比为1:1.2。
在一些实施例中，所述还原反应的反应温度为100～120℃，避免高温对反应体系的破坏。
在一些实施例中，所述还原反应的反应时间为10～12h，确保还原反应充分。
在一些实施例中，所述制备柔性衬底材料溶液，包括以下步骤：
将所述石墨烯增强体与分散溶液混合，以制备石墨烯分散溶液；以及
向所述石墨烯分散溶液中，加入用于制备所述柔性基体的原料，混合均匀以反应充分，得到柔性衬底材料溶液。
在一些实施例中，所述分散溶液为四氢呋喃，所述柔性基体的原料为二酸酐和二胺，对应制备所述柔性衬底材料溶液的步骤包括：
将所述石墨烯增强体均匀分散于四氢呋喃中，得到所述石墨烯分散溶液；以及
按照二酸酐和二胺1：1的质量比，加入至所述石墨烯分散溶液中，混合均匀以反应充分，得到所述柔性衬底材料溶液。
在一些实施例中，所述柔性衬底的厚度为10～1000微 米。
第三方面，本发明实施例提供了一种柔性显示面板，包括：采用第二方面中所述的柔性衬底制备方法所制得的柔性衬底。
有益效果
本发明提供的柔性衬底材料，是在柔性高分子材料中掺杂石墨烯增强体而得到的复合型材料。所述柔性衬底材料兼具良好的弯折特性、抗变形能力以及高热传导性能，从而极大地提升了柔性衬底的散热性能。由于石墨烯基体具有很强的π-π共轭键作用，在高分子材料中易发生团聚现象，所以难以在高分子材料中均匀分散。因此，本发明进一步在石墨烯基体的片层结构的表面上分布金属纳米颗粒，形成由点至面的分散效应(亦即，由金属纳米颗粒防止任两个或多个石墨烯基体的片层结构相互接触及聚集)，进而有效阻止团聚现象的发生。
本发明提供的柔性衬底制备方法，包括步骤：制备石墨烯增强体；制备柔性衬底材料溶液；将所述柔性衬底材料溶液通过静电纺丝方式成膜，得到柔性衬底。所述制备方法具有工序少、操作简单、易于控制、便于实现工业化生产等优点。
本发明提供的柔性显示面板，包括本发明提供的柔性衬底制备方法制得的柔性衬底，具有优越的散热性能，满足OLED、Micro-LED显示技术对散热性能的高要求，有利于拓宽OLED、Micro-LED显示技术的应用范围，促进OLED、Micro-LED显示技术的快速发展。
附图说明
图1是本发明实施例中柔性衬底材料的结构示意图。
图2是本发明实施例中柔性衬底制备方法的流程示意图。
图3是图2中步骤S1的流程示意图。
图4是图2中步骤S2的流程示意图。
本发明的实施方式
为让本发明上述目的、特征及优点更明显易懂，下文特举本发明较佳实施例，并配合附图，作详细说明如下。再者，本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
具体的，第一方面，本发明实施例提供了一种柔性衬底材料，包括：
一柔性基体；以及
多个石墨烯增强体，分散于所述柔性基体中，与所述柔性基体通过化学键连接；每一所述石墨烯增强体包括一石墨烯基体和多个金属纳米颗粒，所述石墨烯基体为一微小的片层结构，所述多个金属纳米颗粒分布于所述石墨烯基体的片层结构的至少一表面上。
具体的，本发明实施例提供的柔性衬底材料为一种复合型材料，通过对传统的柔性衬底材料(即为柔性基体)进行改性，在所述柔性基体中掺杂石墨烯增强体，从而极大地提升了柔性衬底材料的热传导性能。
具体的，所述石墨烯基体各具有一片层结构。由于石墨烯基体具有突出的导热性能与力学性能，所以将其掺杂于柔性基体中可大幅度地提升柔性衬底的热传导性能。
需要说明的是，由于石墨烯基体具有很强的π-π共轭键作用，在高分子材料(如：柔性基体)中多个石墨烯基体的片层结构之间易发生团聚现象，所以难以在高分子材料中均匀分散。因此，在每一所述石墨烯基体的片层结构的至少一表面上分布多个金属纳米颗粒以得到石墨烯增强体，可极大地弱化π-π共轭键作用力，形成由点至面的分散效应(亦即，由金属纳米颗粒防止任两个或多个石墨烯基体的片层结构相 互接触及聚集)，进而促使所述石墨烯增强体均匀分散于所述柔性基体中。
在一些实施例中，所述石墨烯基体的片层结构的横向长度尺寸通常介于2至70微米之间，及厚度介于2至10纳米之间，且单一个石墨烯基体的片层结构可为单一层体形式存在，亦可为一复合层形式存在，所述复合层形式可能是由2、5、10、20或30个等多个单层叠加而成。当单一个石墨烯基体的片层结构以单一层体形式存在时，所述的多个金属纳米颗粒分布于所述单一层体的至少一表面上；当单一个石墨烯基体的片层结构以复合层形式存在时，所述的多个金属纳米颗粒分布于所述复合层的上下两最外侧表面中的至少一表面上，以以防止任两相邻的片层结构相互接触及聚集。
在一些实施例中，所述柔性基体为聚酰亚胺、聚醚砜、聚碳酸脂、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物以及玻璃纤维增强塑料中的一种或多种。本发明实施例优选为聚酰亚胺，聚酰亚胺是重复单元以酰亚胺基为结构特征基团的一类聚合物，具有机械性能佳、绝缘性能高、耐高温、耐腐蚀、介电损耗小等优点，是综合性能理想的高分子材料之一。
在一些实施例中，所述金属纳米颗粒的材料为银、铜、 铁、钛、镍以及铂中的一种或多种。本发明实施例优选为银，纳米银颗粒具有稳定性好、成本较低、易获取、生产工艺简单的优点。
例如：一种柔性衬底材料10，具体为掺杂有石墨烯增强体11的聚酰亚胺12，所述石墨烯增强体11均匀分散于聚酰亚胺12中，并与聚酰亚胺12之间通过化学键连接。参阅图1，每一所述石墨烯增强体11包括一石墨烯基体111和多个纳米银颗粒112，所述石墨烯基体111为具有一微小的片层结构的石墨烯，所述多个纳米银颗粒112分布于所述石墨烯基体111的至少一表面上(例如上、下两个表面)。所述柔性衬底材料10可用于制备/作为有机发光二极管(OLED)柔性显示面板和/或微发光二极管(Micro-LED)柔性显示面板的柔性衬底，以提升柔性显示面板对于其上的有机发光二极管元件和微发光二极管元件的散热性能。
第二方面，本发明实施例提供了一种柔性衬底制备方法，所述柔性衬底的材料如第一方面中所述的柔性衬底材料，参阅图2，包括以下步骤：
S1、制备石墨烯增强体。
具体的，每一所述石墨烯增强体包括石墨烯基体和金属纳米颗粒；所述石墨烯基体为至少一片层结构，所述金属纳 米颗粒分布于所述石墨烯基体的片层结构的表面上。
在一些实施例中，所述步骤S1，参阅图3，包括以下步骤：
S1.1、将具有片层结构的氧化石墨烯与金属盐溶液混合，得到第一混合物。
S1.2、向所述第一混合物中加入还原剂，以进行还原反应，得到第二混合物；
具体的，采用氧化还原反应法制备石墨烯增强体。制备所述石墨烯增强体的原料为氧化石墨烯和金属盐溶液，将两者混合得到第一混合物。氧化石墨烯为微小的片层结构，其独特的二维结构和丰富的含氧官能团使其能够均匀稳定地分散于所述金属盐溶液中，并且氧化石墨烯对金属盐溶液的金属阳离子具有强的吸附能力，促使金属盐溶液中的金属阳离子附着于氧化石墨烯上。然后，在还原剂的作用下，氧化石墨烯和金属盐溶液发生还原反应，使得石墨烯基体的片层结构的表面上均匀分布有金属纳米颗粒，因而生成掺有金属纳米颗粒的石墨烯增强体。
在一些实施例中，所述还原反应的反应温度为100～120℃，反应时间为10～12h，确保还原反应充分的同时，避免高温对反应体系的破坏。
S1.3、过滤所述第二混合物得到滤出物，所述滤出物即为所述的石墨烯增强体。
具体的，过滤所述第二混合物，取滤出物进行干燥处理，如进行烘干操作，得到所述的石墨烯增强体。
例如，当所述金属纳米颗粒为银纳米颗粒时，所述步骤S1，包括以下步骤：
S1.1、将具有片层结构的氧化石墨烯与硝酸银溶液混合，得到第一混合物。
具体的，所述具有片层结构的氧化石墨烯与硝酸银溶液是按照50～60:1的质量比进行混合，所述硝酸银溶液的浓度范围为150～200g/mol。
S1.2、向所述第一混合物中逐滴加入具有还原性的D-葡萄糖，在120℃下反应10h，得到第二混合物。
具体的，向所述第一混合物中逐滴加入D-葡萄糖，直至反应体系中D-葡萄糖与所述硝酸银溶液的摩尔比达到1:1.2后，停止加入D-葡萄糖。
S1.3、过滤所述第二混合物，取滤出物进行干燥处理，得到石墨烯增强体。
S2、将所述石墨烯增强体与柔性基体的原料混合，以制备柔性衬底材料溶液。
具体的，所述柔性衬底材料溶液为掺杂有石墨烯增强体的柔性基体溶液，所述石墨烯增强体均匀分散于所述柔性基体中。
在一些实施例中，所述制备柔性衬底材料溶液，参阅图4，包括以下步骤：
S2.1、将所述石墨烯增强体与分散溶液混合，以制备石墨烯分散溶液。
S2.2、向所述石墨烯分散溶液中，加入用于制备所述柔性基体的原料，混合均匀以反应充分，得到柔性衬底材料溶液。
具体的，将石墨烯增强体均匀分散于特定分散溶液中，得到石墨烯分散溶液。所述特定分散溶液需满足条件：与石墨烯增强体的相溶性理想；不能与石墨烯增强体、柔性基体以及制备柔性基体的原料发生反应。
例如：所述分散溶液为四氢呋喃，所述柔性基体的原料为二酸酐和二胺(即所述柔性基体为聚酰亚胺)，则制备柔性衬底材料溶液的步骤，包括以下步骤：
S2.1、将所述石墨烯增强体均匀分散于四氢呋喃溶液中，得到所述石墨烯分散溶液。
S2.2、按照二酸酐和二胺1：1的质量比，将二酸酐和二 胺加入至所述石墨烯分散溶液中，混合均匀以反应充分，得到掺杂有石墨烯增强体的所述聚酰亚胺柔性衬底溶液。
具体的，二酸酐和二胺反应生成聚酰亚胺的化学反应式参阅下述反应式：
Figure PCTCN2020083539-appb-000001
S3、将所述柔性衬底材料溶液通过静电纺丝方式成膜，以得到所述柔性衬底，在所述柔性衬底中，所述石墨烯增强体分散于所述柔性基体中。
具体的，所述静电纺丝方式是一种特殊的纤维制造工艺，聚合物溶液或熔体在强电场中进行喷射纺丝，生产出纳米级直径的聚合物细丝。所述静电纺丝方式是高分子流体静电雾化的特殊形式，在电场的作用下，针头处的液滴由球形变为圆锥形，并从圆锥尖端延伸得到纤维细丝，即：当电场力足够大时，聚合物液滴可克服表面张力形成喷射细流，带电的聚合物射流拉伸化，最终固化形成纤维。静电纺丝方式具有操作简单、成本较低、工艺可控的优点，制备的柔性衬底具有纤维直径分布均匀、比表面积大、孔隙率大的特性，从而有利于提升柔性衬底的散热效果。
需要说明的是，本发明实施例对静电纺丝方式的工艺参 数不作具体限定，可依据实际需求自行选择。
具体的，例如可将所述柔性衬底材料溶液通过静电纺丝方式成膜于一临时的承载基板上，以得到附着于所述承载基板上的柔性衬底，最后再将所述柔性衬底自所述承载基板上撕起备用。其中，所述临时的承载基板为可重复使用的刚性基板或柔性基板，用以提供一临时性的支撑表面，刚性基板可为玻璃、金属等材质，柔性基板可为塑料等材质但需具备足够支撑厚度，例如：本发明实施例优选承载基板为玻璃基板。
在一些实施例中，所述柔性衬底的厚度为10～1000微米，可作为OLED柔性显示面板和Micro-LED柔性显示面板的柔性衬底，其耐热性和热传导特性明显优越于传统的柔性衬底。
第三方面，本发明实施例提供了一种柔性显示面板，包括:采用第二方面中所述的柔性衬底制备方法所制得的柔性衬底。
例如，所述柔性显示面板可为OLED柔性显示面板，包括：由下而上依次层叠设置的一柔性衬底、一薄膜晶体管阵列层、多个OLED显示单元(如具有红色阻、绿色阻和蓝色阻的OLED显示单元)、一封装层和一保护盖板，所述柔性衬底 为采用本发明第二方面中所述柔性衬底制备方法所制得的柔性衬底，其他组成的层或部件均可采用现有技术产品。所述OLED柔性显示面板可根据实际需求设置其他功能层，如：偏光片、保护层和触控层等，上述功能层均可采用现有技术产品。
例如，所述柔性显示面板可为Micro-LED柔性显示面板，包括：由下而上依次层叠设置的一柔性衬底、一集成电路层和一LED矩阵层，所述柔性衬底为采用本发明第二方面中所述柔性衬底制备方法所制得的柔性衬底，其他组成的层或部件均可采用现有技术产品。
本发明第三方面提供的柔性显示面板可应用于多种显示装置中，具体的，所述显示装置可为手机、平板电脑、笔记本电脑、数码相机、数码摄像机、智能可穿戴设备、智能称重电子秤、车载显示器或电视机等任何具有显示功能的产品或部件。其中，所述智能可穿戴设备可为智能手环、智能手表或智能眼镜等。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。

Claims (20)

  1. 一种柔性衬底材料，包括：
    柔性基体；以及
    石墨烯增强体，分散于所述柔性基体中，与所述柔性基体通过化学键连接；每一所述石墨烯增强体包括石墨烯基体和金属纳米颗粒，所述石墨烯基体为片层结构，所述金属纳米颗粒分布于所述石墨烯基体的片层结构的表面上。
  2. 根据权利要求1所述的柔性衬底材料，其中，所述柔性基体的材料为聚酰亚胺、聚醚砜、聚碳酸脂、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物以及玻璃纤维增强塑料中的一种或多种。
  3. 根据权利要求2所述的柔性衬底材料，其中，所述柔性基体的材料为聚酰亚胺。
  4. 根据权利要求1所述的柔性衬底材料，其中，所述金属纳米颗粒的材料为银、铜、铁、钛、镍以及铂中的一种或多种。
  5. 根据权利要求1所述的柔性衬底材料，其中，所述金属纳米颗粒的材料为银。
  6. 根据权利要求1所述的柔性衬底材料，其中，所述石墨烯基体的片层结构为单一层体，所述金属纳米颗粒分布于 所述单一层体的至少一表面上。
  7. 根据权利要求1所述的柔性衬底材料，其中，所述石墨烯基体的片层结构为复合层，所述金属纳米颗粒分布于所述复合层的上下两最外侧表面中的至少一表面上。
  8. 一种柔性衬底制备方法，其中，包括以下步骤：
    制备石墨烯增强体，每一所述石墨烯增强体包括石墨烯基体和金属纳米颗粒，所述石墨烯基体为片层结构，所述金属纳米颗粒分布于所述石墨烯基体的片层结构的表面上；
    将所述石墨烯增强体与柔性基体的原料混合，以制备柔性衬底材料溶液；以及
    将所述柔性衬底材料溶液通过静电纺丝方式成膜，以得到柔性衬底，在所述柔性衬底中，所述石墨烯增强体分散于所述柔性基体中。
  9. 根据权利要求8所述的柔性衬底制备方法，其中，制备所述石墨烯增强体的步骤包括：
    将具有片层结构的氧化石墨烯与金属盐溶液混合，得到第一混合物；
    向所述第一混合物中加入还原剂，以进行还原反应，得到第二混合物；以及
    过滤所述第二混合物得到滤出物，所述滤出物即为所述 石墨烯增强体。
  10. 根据权利要求9所述的柔性衬底制备方法，其中，所述金属盐溶液为硝酸银溶液，对应所述石墨烯增强体中的所述金属纳米颗粒为银纳米颗粒。
  11. 根据权利要求10所述的柔性衬底制备方法，其中，所述硝酸银溶液的浓度范围为150～200g/mol。
  12. 根据权利要求11所述的柔性衬底制备方法，其中，所述具有片层结构的氧化石墨烯与所述硝酸银溶液之间的质量比为50～60:1。
  13. 根据权利要求10所述的柔性衬底制备方法，其中，所述还原剂为D-葡萄糖。
  14. 根据权利要求13所述的柔性衬底制备方法，其中，所述D-葡萄糖与所述硝酸银溶液的摩尔比为1:1.2。
  15. 根据权利要求14所述的柔性衬底制备方法，其中，所述还原反应的反应温度为100～120℃。
  16. 权利要求15所述的柔性衬底制备方法，其中，所述还原反应的反应时间为10～12h。
  17. 根据权利要求8所述的柔性衬底制备方法，其中，制备所述柔性衬底材料溶液的步骤包括：
    将所述石墨烯增强体与分散溶液混合，以制备石墨烯分 散溶液；以及
    向所述石墨烯分散溶液中，加入用于制备所述柔性基体的原料，混合均匀以反应充分，得到柔性衬底材料溶液。
  18. 根据权利要求17所述的柔性衬底制备方法，其中，所述分散溶液为四氢呋喃，所述柔性基体的原料为二酸酐和二胺，对应制备所述柔性衬底材料溶液的步骤包括：
    将所述石墨烯增强体均匀分散于四氢呋喃中，得到所述石墨烯分散溶液；以及
    按照二酸酐和二胺1：1的质量比，加入至所述石墨烯分散溶液中，混合均匀以反应充分，得到所述柔性衬底材料溶液。
  19. 根据权利要求8所述的柔性衬底制备方法，所述所述柔性衬底的厚度为10～1000微米。
  20. 一种柔性显示面板，其中，包括：柔性衬底，所述柔性衬底的材料包括：
    柔性基体；以及
    石墨烯增强体，分散于所述柔性基体中，与所述柔性基体通过化学键连接；每一所述石墨烯增强体包括石墨烯基体和金属纳米颗粒，所述石墨烯基体为片层结构，所述金属纳米颗粒分布于所述石墨烯基体的片层结构的表面上；
    其中，所述柔性基体的材料为聚酰亚胺，所述金属纳米颗粒的材料为银，所述石墨烯基体的片层结构为单一层体或复合层，所述金属纳米颗粒分布于所述单一层体的至少一表面上，或者所述金属纳米颗粒分布于所述复合层的上下两最外侧表面中的至少一表面上。
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