WO2021184403A1 - Mems麦克风 - Google Patents

Mems麦克风 Download PDF

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Publication number
WO2021184403A1
WO2021184403A1 PCT/CN2020/081043 CN2020081043W WO2021184403A1 WO 2021184403 A1 WO2021184403 A1 WO 2021184403A1 CN 2020081043 W CN2020081043 W CN 2020081043W WO 2021184403 A1 WO2021184403 A1 WO 2021184403A1
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WIPO (PCT)
Prior art keywords
substrate
metal
conductive
mems
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/081043
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English (en)
French (fr)
Inventor
柏杨
饶成辉
洪亭亭
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AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Publication of WO2021184403A1 publication Critical patent/WO2021184403A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the invention relates to the technical field of electro-acoustic conversion, in particular to a MEMS microphone.
  • MEMS microphone is an electrical energy transducer manufactured based on MEMS (Micro Electro Mechanical System) technology, which has the characteristics of small size, good frequency response characteristics, and low noise. With the development of smaller and thinner electronic devices, MEMS microphones are more and more widely used in electronic devices.
  • MEMS Micro Electro Mechanical System
  • ESD Electro-Static discharge
  • ESD electrostatic discharge
  • ESD is a discipline formed since the middle of the 20th century to study the generation, harm, and protection of static electricity. Therefore, it is customary in the world to refer to equipment used for electrostatic protection as ESD, and the Chinese name is electrostatic resistance.
  • ESD electrostatic discharge the buried capacitance buried resistance layer in the ASIC chip and the package substrate is easily broken down to cause a short circuit or an open circuit. The heat generated by the ESD current is also easy to burn the material, and even affects the MEMS chip, resulting in a MEMS microphone. ’S failure.
  • the purpose of the present invention is to provide a MEMS microphone, which aims to solve the problem of open circuit or short circuit caused by the breakdown of the electrostatic discharge current in the ASIC chip and the buried resistance layer in the substrate.
  • the first MEMS microphone disclosed in the present invention includes a housing with a packaging cavity, and a MEMS chip and an ASIC chip installed in the packaging cavity.
  • the housing includes a housing for mounting the MEMS chip and the ASIC chip.
  • the substrate and the shell surrounding the substrate to form the packaging cavity, the microphone further includes a first metal lead that electrically connects the ASIC chip and the substrate, and a first metal lead that electrically connects the ASIC chip and the MEMS chip.
  • the MEMS microphone further includes a conductive dust-proof net covering the acoustic through-hole, a first ground pad fixedly connected to the conductive dust-proof net, and A first grounding lug on the outer surface of the substrate and electrically connected to the ground terminal of an external circuit, and a metal conductive element that is simultaneously electrically connected to the first metal lead, the first grounding pad, and the first grounding lug.
  • the conductive dust-proof net is arranged on a surface of the substrate close to the MEMS chip or a surface away from the MEMS chip.
  • the conductive dust-proof net is arranged inside the substrate.
  • the metal conductive element includes a first metal conductive element penetrating through the substrate and electrically connected to the first metal lead at one end and electrically connected to the first grounding lug at the other end, and one end electrically connected to the first metal lead.
  • the metal conductive member has the other end electrically connected to the second metal conductive member of the first ground pad.
  • the MEMS microphone further includes a conductive glue for electrically connecting the conductive dust-proof net and the first ground pad.
  • the first ground pad includes no less than two.
  • the substrate is a circuit board.
  • the metal conductive member is a metalized through hole or a conductive wire.
  • the second type of MEMS microphone disclosed in the present invention includes a housing with a packaging cavity, and a MEMS chip and an ASIC chip installed in the packaging cavity.
  • the housing includes a housing for mounting the MEMS chip and the ASIC chip.
  • the substrate and the shell surrounding the substrate to form the packaging cavity, the microphone further includes a first metal lead that electrically connects the ASIC chip and the substrate, and a first metal lead that electrically connects the ASIC chip and the MEMS chip.
  • Two metal leads characterized in that an acoustic through hole is provided on the substrate, and the MEMS microphone further includes a conductive dust-proof net covering the acoustic through hole and disposed on the surface of the substrate away from the MEMS chip, A second grounding pad electrically connected to the conductive dust-proof net and a metal conductive member that electrically connects the first metal lead and the second grounding pad, and the conductive dust-proof net is electrically connected to the ground terminal of the external circuit. connect.
  • a second grounding lug is further provided on the substrate, and the metal conductive member includes a first metal lead penetrating through the substrate and electrically connected to the first metal lead at one end and electrically connected to the second grounding lug at the other end.
  • the metal conductive member includes a first metal lead penetrating through the substrate and electrically connected to the first metal lead at one end and electrically connected to the second grounding lug at the other end.
  • Three metal conductive elements, and a fourth metal conductive element with one end electrically connected to the third metal conductive element and the other end electrically connected to the second ground pad.
  • the first MEMS microphone of the present invention improves the dust-proof function of the microphone by covering the conductive dust-proof net on the acoustic through hole; Conduction of the grounding lug, the ASIC chip is electrically connected to the first metal lead, and the first metal lead is guided by the metal conductive member to guide the static electricity in the ASIC chip from the first grounding lug or the conductive dust-proof net to the external circuit of the terminal device
  • the conductive dust-proof net is electrically connected to the first grounding pad, and the first grounding pad is guided by the metal conductive member to guide the static electricity in the substrate from the first grounding pad or the conductive dust-proof net to the external circuit of the terminal device
  • it can largely prevent the ASIC chip and the buried resistance layer in the substrate from being broken down or short-circuited by the ESD current; and the heat generated by the electrostatic discharge current in the substrate can be transferred to the conductive dust-proof net, improving The heat dissipation effect of the substrate also improves the reliability
  • the conductive dust-proof net is arranged on the surface of the substrate away from the MEMS chip, so that the conductive dust-proof net can directly contact the ground layer of the external circuit of the terminal device, and the metal conductive element realizes the second Conduction between the grounding pad and the first metal lead, the ASIC chip is electrically connected to the first metal lead, the conductive dust-proof net is electrically connected to the second grounding pad, and the static electricity in the ASIC chip passes through the first metal lead and the metal in turn.
  • the conductive parts and the second grounding pad are introduced into the ground layer of the external circuit of the terminal device by the conductive dust-proof net, which can largely prevent the ASIC chip and the buried resistance layer in the substrate from being broken down by the ESD current and causing an open circuit or a short circuit. ; And the heat generated by the electrostatic discharge current in the substrate can be transferred to the conductive dust-proof net, which improves the heat dissipation effect of the substrate and also improves the reliability of the MEMS microphone.
  • Fig. 1 is a schematic cross-sectional view of a first embodiment of a MEMS microphone of the present invention
  • Figure 2 is a partial enlarged view of circle A in Figure 1;
  • FIG. 3 is a schematic cross-sectional view of the second embodiment of the MEMS microphone of the present invention.
  • Figure 4 is a partial enlarged view of circle B in Figure 3;
  • FIG. 5 is a schematic cross-sectional view of the third embodiment of the MEMS microphone of the present invention.
  • Fig. 6 is a partial enlarged view of circle C in Fig. 5;
  • FIG. 7 is a schematic cross-sectional view of the fourth embodiment of the MEMS microphone of the present invention.
  • a MEMS microphone of this embodiment includes a housing 10 having a packaging cavity 110, and a MEMS chip 13 and an ASIC chip 14 mounted in the packaging cavity 110.
  • the housing 10 includes a housing for mounting The substrate 11 of the MEMS chip 13 and the ASIC chip 14 and the housing 12 surrounding the substrate 11 to form a packaging cavity 110.
  • the microphone also includes a first metal lead 17 electrically connecting the ASIC chip 14 and the substrate 11 and electrically connecting the ASIC chip 14 and the MEMS
  • the second metal lead 18 of the chip 13 is provided with an acoustic through hole 111 on the substrate 11.
  • the MEMS microphone also includes a conductive dust-proof net 15 covering one end of the acoustic through-hole 111 close to the MEMS chip 13, and a conductive dust-proof net 15, and The first ground pad 112 fixedly connected to the conductive dust-proof net 15, the first ground pad 116 provided on the outer surface of the substrate and electrically connected to the ground terminal of the external circuit, and the first metal lead 17 and the first ground pad at the same time 112.
  • the metal conductive member 19 electrically connected to the first grounding pad 116.
  • the conductive dust-proof net 15 in this embodiment is fixed to the inner surface of the substrate 11.
  • the inner surface of the substrate 11 is provided with a first mounting groove 113 for accommodating the conductive dust-proof net 15, and the conductive dust-proof net 15 is arranged at an end of the substrate 11 close to the MEMS chip 13.
  • the MEMS chip 13 has a back cavity, and the acoustic through hole 111 communicates with the back cavity.
  • one surface of the conductive dust-proof net 15 is opposite to the back cavity of the MEMS chip 13, and the other surface of the conductive dust-proof net 15 is in communication with the acoustics.
  • the holes 111 communicate with each other. During the heat dissipation process, both surfaces of the conductive dust-proof net 15 can dissipate heat well.
  • the conductive dust-proof net 15 is covered on the acoustic through hole 111, thereby improving the dust-proof function of the microphone; the arrangement of the metal conductive member 19 can realize the first metal lead 17 and the first ground pad 112 As well as the conduction of the first grounding pad 116, the ASIC chip 14 is electrically connected to the first metal lead 17, and the first metal lead 17 is guided by the metal conductive member 19 to introduce the static electricity in the ASIC chip 14 from the first grounding pad 116 In the ground layer of the external circuit of the terminal device, the first ground pad 112 is guided by the metal conductive member 19 to guide the static electricity in the substrate 11 from the first ground pad 116 into the ground layer of the external circuit of the terminal device.
  • the ASIC chip 14 and the buried resistance layer in the substrate 11 Prevent the ASIC chip 14 and the buried resistance layer in the substrate 11 from being broken down by the ESD current to cause an open circuit or short circuit; and the heat generated by the electrostatic discharge current in the substrate 11 can be transferred to the conductive dust-proof net 15 to improve the heat dissipation effect of the substrate 11 , Has also improved the reliability of MEMS microphones.
  • the metal conductive member 19 includes a first metal conductive member 191 that penetrates the substrate 11 and is electrically connected to the first metal lead 17 at one end, and the other end is electrically connected to the first grounding pad 116, and one end is electrically connected to the first metal conductive member.
  • the other end of the member 191 is electrically connected to the second metal conductive member 192 of the first ground pad 112.
  • the first metal conductive member 191 and the second metal conductive member 192 of this solution are perpendicular to each other, which minimizes the use of consumables, and realizes the grounding of the ASIC chip 14 and the grounding of the conductive dust-proof net 15 at the same time.
  • the MEMS microphone further includes a conductive glue 16 for electrically connecting the conductive dust-proof net 15 and the first grounding pad 112.
  • the conductive dust-proof net 15 and the first grounding pad 112 are conductively connected through the conductive glue 16.
  • the conductive glue 16 can not only realize the fixed connection between the conductive dust-proof net 15 and the bonding pad, but also connect the conductive path between the conductive dust-proof net 15 and the bonding pad.
  • the first grounding pad 116 and the first grounding pad 112 are both fixedly connected to the body of the substrate 11. During the connection process between the first grounding pad 116 and the first metal conductive member 191, the first metal is electrically conductive.
  • the member 191 is also fixed in the substrate 11, so there is no need to increase the use of conductive glue 16 between the two.
  • the first ground pad 112 includes no less than two.
  • Two first grounding pads 112 are symmetrically arranged at the bottom of the first mounting groove 113, and the two first grounding pads 112 are respectively fixedly connected to the two ends of the conductive dust-proof net 15 through the conductive glue 16, which can ensure the conductive and anti-
  • the fixing stability of the dust net 15 can also ensure that the two first grounding pads 112 discharge static electricity to the conductive dust net 15 at the same time, so that the discharge of static electricity is more uniform and safe.
  • the present invention is not limited to the use of the two first ground pads 112, and the number of pads can also be increased or decreased according to specific requirements.
  • the substrate 11 is a circuit board. Both the ASIC chip 14 and the MEMS chip 13 are electrically connected to the circuit board through the first metal lead 17.
  • the metal conductive member 19 is a metalized through hole or a conductive wire, and the metal conductive member 19 mainly serves to connect the first metal lead 17 and the first ground pad 112 to the first ground pad 116, respectively.
  • the metal conductive member 19 mainly serves to connect the first metal lead 17 and the first ground pad 112 to the first ground pad 116, respectively.
  • the conductive dust-proof net 15 in this embodiment is fixed inside the substrate 11. Specifically, a second mounting groove 114 for accommodating the conductive dust-proof net 15 is provided between the inner surface and the outer surface of the substrate 11, and the conductive dust-proof net 15 covers the middle position of the channel of the acoustic through hole 111.
  • the conductive dust-proof net 15 is covered on the acoustic through hole 111, thereby improving the dust-proof function of the microphone;
  • a grounding pad 112 and the first grounding pad 116 are connected, the ASIC chip 14 is electrically connected to the first metal lead 17, and the first metal lead 17 is guided by the metal conductive member 19 to remove the static electricity in the ASIC chip 14 from the first
  • the grounding pad 116 is guided into the ground layer of the external circuit of the terminal device.
  • the first grounding pad 112 is guided by the metal conductive member 19 to remove the static electricity in the substrate 11, which can largely avoid the embedded capacitance in the ASIC chip 14 and the substrate 11.
  • the buried resistance layer is broken down by the ESD current to cause an open circuit or a short circuit; and the heat generated by the electrostatic discharge current in the substrate 11 can be transferred to the conductive dust-proof net 15 to improve the heat dissipation effect of the substrate 11 and the reliability of the MEMS microphone.
  • the second mounting groove 114 is opened inside the substrate 11, which does not affect the surface morphology of the substrate 11 at all, and the conductive dust-proof net 15 is more concealed.
  • the conductive dust-proof net 15 is preferably arranged at an intermediate position between the inner surface and the outer surface of the substrate 11, so that the discharge of static electricity is more sufficient and uniform, and the conductive dust-proof net 15 is more fully utilized.
  • the conductive dust-proof net 15 is provided on the surface of the substrate 11 away from the MEMS chip 13, and the conductive dust-proof net 15 is electrically connected to the substrate 11.
  • the connected second ground pad 117 and the metal conductive member 19 electrically connecting the first metal lead 17 and the second ground pad 117, and the conductive dust-proof net 15 is electrically connected to the ground terminal of the external circuit.
  • the outer surface of the substrate 11 is provided with a first mounting groove 113 for accommodating the conductive dust-proof net 15, and the conductive dust-proof net 15 covers an end of the acoustic through hole 111 away from the MEMS chip 13.
  • the conductive dust-proof net 15 is arranged on the outer surface of the substrate 11, and the outer surface of the conductive dust-proof net 15 and the outer surface of the substrate 11 are in the same horizontal plane, which can ensure that the conductive dust-proof net 15 does not take up extra space, and it can also be realized at the same time.
  • the conductive dust-proof net 15 can be in direct physical contact with the ground layer of the external circuit of the terminal device, which increases the grounding area for electrostatic discharge, and can better carry out electrostatic discharge and heat dissipation.
  • the conductive dust-proof net 15 is arranged on the surface of the substrate 11 away from the MEMS chip 13, so that the conductive dust-proof net 15 can be directly connected to the ground of the external circuit of the terminal device.
  • the metal conductive member 19 realizes the conduction between the second grounding pad 117 and the first metal lead 17, the ASIC chip 14 is electrically connected to the first metal lead 17, and the conductive dust-proof net 15 is connected to the second grounding pad 117 Electrically connected, the static electricity in the ASIC chip 14 passes through the first metal lead 17, the metal conductive member 19 and the second ground pad 117 in turn, and is introduced into the ground layer of the external circuit of the terminal device by the conductive dust-proof net 15 to a large extent.
  • the ASIC chip 14 and the buried resistance layer in the substrate 11 Prevent the ASIC chip 14 and the buried resistance layer in the substrate 11 from being broken down by the ESD current to cause an open circuit or short circuit; and the heat generated by the electrostatic discharge current in the substrate 11 can be transferred to the conductive dust-proof net 15 to improve the heat dissipation effect of the substrate 11 , Has also improved the reliability of MEMS microphones.
  • the conductive dust-proof net 15 of this embodiment is set to a direct grounding position, which can directly discharge static electricity. Compared with the first and second embodiments, there is no need to add a first grounding pad 116, the structure is simpler and the effect is more significant. .
  • a second grounding pad 118 is further provided on the substrate 11, and the metal conductive member 19 includes a through substrate 11 and both ends are electrically connected to the first metal lead 17 and the second metal lead 17 respectively.
  • the arrangement of the second grounding pad 118 can increase the stability and efficiency of electrostatic discharge.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本发明提供了一种MEMS麦克风。本发明的MEMS麦克风，包括具有封装腔体的壳体以及MEMS芯片和ASIC芯片，所述MEMS麦克风还包括覆盖于所述声学通孔的导电防尘网、与所述导电防尘网固定连接的第一接地焊盘以及设置于所述基板外表面且与外部电路的接地端电连接的第一接地焊片以及同时与所述第一金属引线、第一接地焊盘、第一接地焊片电连接的金属导电件。第一金属引线通过金属导电件的引导将ASIC芯片中的静电由第一接地焊片或导电防尘网导入终端设备的外部电路的地层中，第一接地焊盘通过金属导电件的引导将基板中的静电由第一接地焊片或导电防尘网导入终端设备的外部电路的地层中，可很大程度上避免ASIC芯片以及基板中的埋容埋阻层被ESD电流击穿造成开路或短路。

Description

MEMS麦克风 技术领域
本发明涉及电声转换技术领域，尤其涉及一种MEMS麦克风。
 背景技术
MEMS麦克风是基于MEMS（微型机电系统）技术制造的电能换声器，其具有体积小、频响特性好、噪声低等特点。随着电子设备的小巧化、薄型化发展，MEMS麦克风被越来越广泛地运用到电子设备中。
手机、平板等移动终端的功能越来越强大，随着电路板越做越小，集成度越来远高，手机中的MEMS麦克风越来越容易受到静电的损害。ESD（Electro-Static discharge）的意思是“静电释放”。ESD是20世纪中期以来形成的以研究静电的产生、危害及静电防护等的学科。因此，国际上习惯将用于静电防护的器材统称为ESD，中文名称为静电阻抗器。在ESD静电放电的场景下，ASIC芯片、封装基板中的埋容埋阻层易被击穿造成短路或开路，ESD电流产生的热量也易烧坏材料，甚至会影响到MEMS芯片，造成MEMS麦克风的失效。
 技术问题
本发明的目的在于提供一种MEMS麦克风，旨在解决ASIC芯片以及基板中的埋容埋阻层被静电释放电流击穿造成开路或短路的问题。
 技术解决方案
本发明的技术方案如下：
本发明公开的第一种MEMS麦克风，包括具有封装腔体的壳体以及安装于所述封装腔体内的MEMS芯片和ASIC芯片，所述壳体包括用于安装所述MEMS芯片和所述ASIC芯片的基板以及与所述基板围设形成所述封装腔体的外壳，所述麦克风还包括电连接所述ASIC芯片与所述基板的第一金属引线以及电连接所述ASIC芯片与MEMS芯片的第二金属引线，所述基板上设有声学通孔，所述MEMS麦克风还包括覆盖于所述声学通孔的导电防尘网、与所述导电防尘网固定连接的第一接地焊盘、设置于所述基板外表面且与外部电路的接地端电连接的第一接地焊片以及同时与所述第一金属引线、第一接地焊盘、第一接地焊片电连接的金属导电件。
优选地，所述导电防尘网设置于所述基板靠近所述MEMS芯片的表面或远离所述MEMS芯片的表面。
优选地，所述导电防尘网设置于所述基板内部。
优选地，所述金属导电件包括贯通所述基板且一端电连接所述第一金属引线、另一端电连接所述第一接地焊片的第一金属导电件，以及一端电连接所述第一金属导电件且另一端电连接所述第一接地焊盘的第二金属导电件。
优选地，所述MEMS麦克风还包括实现所述导电防尘网与所述第一接地焊盘电连接的导电胶。
优选地，所述第一接地焊盘包括不少于两个。
优选地，所述基板为线路板。
优选地，所述金属导电件为金属化通孔或导电线。
本发明公开的第二种MEMS麦克风，包括具有封装腔体的壳体以及安装于所述封装腔体内的MEMS芯片和ASIC芯片，所述壳体包括用于安装所述MEMS芯片和所述ASIC芯片的基板以及与所述基板围设形成所述封装腔体的外壳，所述麦克风还包括电连接所述ASIC芯片与所述基板的第一金属引线以及电连接所述ASIC芯片与MEMS芯片的第二金属引线，其特征在于，所述基板上设有声学通孔，所述MEMS麦克风还包括覆盖于所述声学通孔且设置于所述基板远离所述MEMS芯片的表面的导电防尘网、与所述导电防尘网电连接的第二接地焊盘以及电连接所述第一金属引线与所述第二接地焊盘的金属导电件，所述导电防尘网与外部电路的接地端电连接。
优选地，所述基板上还设有第二接地焊片，所述金属导电件包括贯通所述基板且一端电连接所述第一金属引线、另一端电连接所述第二接地焊片的第三金属导电件，以及一端电连接所述第三金属导电件且另一端电连接所述第二接地焊盘的第四金属导电件。
 有益效果
本发明的有益效果在于：
本发明的第一种MEMS麦克风通过将导电防尘网覆盖于声学通孔上，从而改善了麦克风的防尘功能；金属导电件的设置实现了第一金属引线、第一接地焊盘以及第一接地焊片的导通，ASIC芯片与第一金属引线电连接，第一金属引线通过金属导电件的引导将ASIC芯片中的静电由第一接地焊片或导电防尘网导入终端设备的外部电路的地层中，导电防尘网与第一接地焊盘电连接，第一接地焊盘通过金属导电件的引导将基板中的静电由第一接地焊片或导电防尘网导入终端设备的外部电路的地层中，可很大程度上避免ASIC芯片以及基板中的埋容埋阻层被ESD电流击穿造成开路或短路；且基板中静电释放电流产生的热量可转移至导电防尘网中，提高基板的散热效果，也提升了MEMS麦克风的可靠性。
本发明的第二种MEMS麦克风通过将导电防尘网设置于基板远离所述MEMS芯片的表面，使得导电防尘网可直接与终端设备的外部电路的地层相接触，金属导电件实现了第二接地焊盘与第一金属引线之间的导通，ASIC芯片与第一金属引线电连接，导电防尘网与第二接地焊盘电连接，ASIC芯片中的静电依次经过第一金属引线、金属导电件以及第二接地焊盘并由导电防尘网导入终端设备的外部电路的地层中，可很大程度上避免ASIC芯片以及基板中的埋容埋阻层被ESD电流击穿造成开路或短路；且基板中静电释放电流产生的热量可转移至导电防尘网中，提高基板的散热效果，也提升了MEMS麦克风的可靠性。
 附图说明
图1为本发明MEMS麦克风第一实施例的的剖视示意图；
图2为图1中圆圈A中的局部放大图；
图3为本发明MEMS麦克风第二实施例的的剖视示意图；
图4为图3中圆圈B中的局部放大图；
图5为本发明MEMS麦克风第三实施例的的剖视示意图；
图6为图5中圆圈C中的局部放大图；
图7为本发明MEMS麦克风第四实施例的剖视示意图。
 本发明的实施方式
下面结合附图和实施方式对本发明作进一步说明。
第一实施例
请参阅图1-2，本实施例的一种MEMS麦克风，包括具有封装腔体110的壳体10以及安装于封装腔体110内的MEMS芯片13和ASIC芯片14，壳体10包括用于安装MEMS芯片13和ASIC芯片14的基板11以及与基板11围设形成封装腔体110的外壳12，麦克风还包括电连接ASIC芯片14与基板11的第一金属引线17以及电连接ASIC芯片14与MEMS芯片13的第二金属引线18，基板11上设有声学通孔111，MEMS麦克风还包括覆盖于声学通孔111靠近MEMS芯片13的一端的导电防尘网15、与导电防尘网15、与导电防尘网15固定连接的第一接地焊盘112、设置于基板外表面且与外部电路的接地端电连接的第一接地焊片116以及同时与第一金属引线17、第一接地焊盘112、第一接地焊片116电连接的金属导电件19。
需要说明的是，本实施例中的导电防尘网15固定于基板11的内表面。具体地基板11的内表面设有容置导电防尘网15的第一安装槽113，导电防尘网15设置于基板11靠近MEMS芯片13的一端。MEMS芯片13具有背腔，声学通孔111与背腔相通，本实施例中的导电防尘网15的一表面与MEMS芯片13的背腔相对，导电防尘网15的另一表面与声学通孔111相通，在散热过程，导电防尘网15的两表面均可很好散热。
本实施例的MEMS麦克风通过将导电防尘网15覆盖于声学通孔111上，从而改善了麦克风的防尘功能；金属导电件19的设置可以实现第一金属引线17、第一接地焊盘112以及第一接地焊片116的导通，ASIC芯片14与第一金属引线17电连接，第一金属引线17通过金属导电件19的引导将ASIC芯片14中的静电由第一接地焊片116导入终端设备的外部电路的地层中，第一接地焊盘112通过金属导电件19的引导将基板11中的静电由第一接地焊片116导入终端设备的外部电路的地层中，可很大程度上避免ASIC芯片14以及基板11中的埋容埋阻层被ESD电流击穿造成开路或短路；且基板11中静电释放电流产生的热量可转移至导电防尘网15中，提高基板11的散热效果，也提升了MEMS麦克风的可靠性。
在本实施例中，金属导电件19包括贯通基板11且一端电连接第一金属引线17、另一端电连接第一接地焊片116的第一金属导电件191，以及一端电连接第一金属导电件191且另一端电连接第一接地焊盘112的第二金属导电件192。本方案的第一金属导电件191与第二金属导电件192相互垂直，均最大限度的减少了耗材的使用，同时实现了ASIC芯片14的接地以及导电防尘网15的接地。
在本实施例中，MEMS麦克风还包括实现导电防尘网15与第一接地焊盘112电连接的导电胶16。导电防尘网15与第一接地焊盘112通过导电胶16进行导电连接。导电胶16既可以实现导电防尘网15与焊盘的固定连接，同时可以接通导电防尘网15与焊盘之间的导电通路。需要说明的是，第一接地焊片116以及第一接地焊盘112均与基板11本体固定连接，在第一接地焊片116与第一金属导电件191的连接过程中，由于第一金属导电件191也固定于基板11内，所以无需在二者之间增加导电胶16的使用。
在本实施例中，第一接地焊盘112包括不少于两个。第一安装槽113的槽底对称设置有两个第一接地焊盘112，两个第一接地焊盘112分别通过导电胶16与导电防尘网15的两端固定连接，既可以保证导电防尘网15的固定稳定性，同时也可以保证两个第一接地焊盘112同时向导电防尘网15释放静电，使静电的释放更加均匀、安全。当然，本发明并不局限于两个第一接地焊盘112的使用，也可以根据具体需求增加或减少焊盘的数量。
在本实施例中，基板11为线路板。ASIC芯片14以及MEMS芯片13均通过第一金属引线17与线路板电连接。
在本实施例中，金属导电件19为金属化通孔或导电线，金属导电件19主要起到导通第一金属引线17与第一接地焊盘112分别接到第一接地焊片116从而实现静电接地释放，主要其能够实现导电功能即可，其具体结构并不受限制。
第二实施例
请进一步参阅图3-4，与第一实施例不同的是，本实施例中的导电防尘网15固定于基板11的内部。具体地，基板11的内表面与外表面之间设有容置导电防尘网15的第二安装槽114，导电防尘网15覆盖于声学通孔111的孔道中间位置。
本实施例的MEMS麦克风通过将导电防尘网15覆盖于声学通孔111上，从而改善了麦克风的防尘功能；金属导电件19的设置可以实现从ASIC芯片14引出的第一金属引线、第一接地焊盘112以及第一接地焊片116的导通，ASIC芯片14与第一金属引线17电连接，第一金属引线17通过金属导电件19的引导将ASIC芯片14中的静电由第一接地焊片116导入终端设备的外部电路的地层中，第一接地焊盘112通过金属导电件19的引导将基板11中的静电，可很大程度上避免ASIC芯片14以及基板11中的埋容埋阻层被ESD电流击穿造成开路或短路；且基板11中静电释放电流产生的热量可转移至导电防尘网15中，提高基板11的散热效果，也提升了MEMS麦克风的可靠性。
在本实施例中，第二安装槽114开设于基板11内部，完全不影响基板11的表面形态，导电防尘网15设置更加隐蔽。同时，优选地将导电防尘网15设置于基板11内表面与外表面之间的中间位置，从而静电的释放更加充分与均匀，使导电防尘网15得到更充分的利用。
第三实施例
请进一步参阅图5-6，与第一实施例以及第二实施例不同的是，导电防尘网15设于基板11远离MEMS芯片13的表面，基板11上设有与导电防尘网15电连接的第二接地焊盘117以及电连接第一金属引线17与第二接地焊盘117的金属导电件19，导电防尘网15与外部电路的接地端电连接。
需要说明的是，基板11的外表面设有容置导电防尘网15的第一安装槽113，导电防尘网15覆盖于声学通孔111背离MEMS芯片13的一端。导电防尘网15设置在基板11的外表面，且导电防尘网15的外表面与基板11的外表面处于同一水平面，这样既可以保证导电防尘网15不占用多余空间，同时也可以实现导电防尘网15与终端设备的外部电路的地层可以直接进行物理接触，增大了静电释放的接地面积，可以更好的进行静电释放以及散热。
相较于现有技术，本实施例的MEMS麦克风通过将导电防尘网15设置于基板11远离所述MEMS芯片13的表面，使得导电防尘网15可直接与终端设备的外部电路的地层相接触，金属导电件19实现了第二接地焊盘117与第一金属引线17之间的导通，ASIC芯片14与第一金属引线17电连接，导电防尘网15与第二接地焊盘117电连接，ASIC芯片14中的静电依次经过第一金属引线17、金属导电件19以及第二接地焊盘117并由导电防尘网15导入终端设备的外部电路的地层中，可很大程度上避免ASIC芯片14以及基板11中的埋容埋阻层被ESD电流击穿造成开路或短路；且基板11中静电释放电流产生的热量可转移至导电防尘网15中，提高基板11的散热效果，也提升了MEMS麦克风的可靠性。
本实施例的导电防尘网15设置为直接接地位置，可以直接进行静电的释放，相较于第一实施例以及第二实施例无需增设第一接地焊片116，结构更简单，效果更显著。
第四实施例
请进一步参阅图7，与第三实施例不同的是，基板11上还设有第二接地焊片118，金属导电件19包括贯通基板11且两端分别电连接第一金属引线17与第二接地焊片118的第三金属导电件193，以及一端电连接第三金属导电件193且另一端电连接第二接地焊盘117的第四金属导电件194。第二接地焊片118的设置可以增加静电释放的稳定性以及效率。
以上的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (10)

  1. 一种MEMS麦克风，包括具有封装腔体的壳体以及安装于所述封装腔体内的MEMS芯片和ASIC芯片，所述壳体包括用于安装所述MEMS芯片和所述ASIC芯片的基板以及与所述基板围设形成所述封装腔体的外壳，所述麦克风还包括电连接所述ASIC芯片与所述基板的第一金属引线以及电连接所述ASIC芯片与MEMS芯片的第二金属引线，其特征在于，所述基板上设有声学通孔，所述MEMS麦克风还包括覆盖于所述声学通孔的导电防尘网、与所述导电防尘网固定连接的第一接地焊盘、设置于所述基板外表面且与外部电路的接地端电连接的第一接地焊片以及同时与所述第一金属引线、第一接地焊盘、第一接地焊片电连接的金属导电件。
  2. 根据权利要求1所述的MEMS麦克风，其特征在于，所述防尘网设置于所述基板靠近所述MEMS芯片的表面或远离所述MEMS芯片的表面。
  3. 根据权利要求1所述的MEMS麦克风，其特征在于，所述导电防尘网设置于所述基板内部。
  4. 根据权利要求1所述的MEMS麦克风，其特征在于，所述金属导电件包括贯通所述基板且一端电连接所述第一金属引线、另一端电连接所述第一接地焊片的第一金属导电件，以及一端电连接所述第一金属导电件且另一端电连接所述第一接地焊盘的第二金属导电件。
  5. 根据权利要求1所述的MEMS麦克风，其特征在于，所述MEMS麦克风还包括实现所述导电防尘网与所述第一接地焊盘电连接的导电胶。
  6. 根据权利要求1所述的MEMS麦克风，其特征在于，所述第一接地焊盘包括不少于两个。
  7. 根据权利要求1所述的MEMS麦克风，其特征在于，所述基板为线路板。
  8. 根据权利要求1所述的MEMS麦克风，其特征在于，所述金属导电件为金属化通孔或导电线。
  9. 一种MEMS麦克风，其特征在于，包括具有封装腔体的壳体以及安装于所述封装腔体内的MEMS芯片和ASIC芯片，所述壳体包括用于安装所述MEMS芯片和所述ASIC芯片的基板以及与所述基板围设形成所述封装腔体的外壳，所述麦克风还包括电连接所述ASIC芯片与所述基板的第一金属引线以及电连接所述ASIC芯片与MEMS芯片的第二金属引线，其特征在于，所述基板上设有声学通孔，所述MEMS麦克风还包括覆盖于所述声学通孔且设置于所述基板远离所述MEMS芯片的表面的导电防尘网、与所述导电防尘网电连接的第二接地焊盘以及电连接所述第一金属引线与所述第二接地焊盘的金属导电件，所述导电防尘网与外部电路的接地端电连接。
  10. 根据权利要求9所述的MEMS麦克风，其特征在于，所述基板上还设有第二接地焊片，所述金属导电件包括贯通所述基板且一端电连接所述第一金属引线、另一端电连接所述第二接地焊片的第三金属导电件，以及一端电连接所述第三金属导电件且另一端电连接所述第二接地焊盘的第四金属导电件。
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