WO2021179360A1 - Chip assembly and flue gas heat exchanger - Google Patents

Chip assembly and flue gas heat exchanger Download PDF

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Publication number
WO2021179360A1
WO2021179360A1 PCT/CN2020/082173 CN2020082173W WO2021179360A1 WO 2021179360 A1 WO2021179360 A1 WO 2021179360A1 CN 2020082173 W CN2020082173 W CN 2020082173W WO 2021179360 A1 WO2021179360 A1 WO 2021179360A1
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WO
WIPO (PCT)
Prior art keywords
chip
flue gas
air port
heat exchanger
air
Prior art date
Application number
PCT/CN2020/082173
Other languages
French (fr)
Chinese (zh)
Inventor
詹凌云
张文锋
王丹娟
Original Assignee
浙江银轮机械股份有限公司
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Application filed by 浙江银轮机械股份有限公司 filed Critical 浙江银轮机械股份有限公司
Publication of WO2021179360A1 publication Critical patent/WO2021179360A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/0219Arrangements for sealing end plates into casing or header box; Header box sub-elements

Definitions

  • the present disclosure relates to the technical field of heat exchange equipment, and in particular to a chip assembly and a flue gas heat exchanger.
  • EGR exhaust gas recirculation technology
  • EHRS waste heat recovery technology
  • the present disclosure provides a chip assembly and a flue gas heat exchanger.
  • the present disclosure provides a chip assembly including a first intermediate chip and a second intermediate chip stacked in a first direction, a flue gas flow channel is formed between the first intermediate chip and the second intermediate chip, The flue gas channel is a closed structure, and the flue gas channel has an air port configured to communicate with the flue gas pipe.
  • the edge of the first intermediate chip forms a first flanging
  • the edge of the second intermediate chip forms a second flanging
  • the first flanging overlaps the second flanging to form an airtight The flue gas flow channel.
  • the beneficial effects of the technical solutions provided by the embodiments of the present disclosure include at least: during the assembly process, the first intermediate chip and the second intermediate chip in the chip assembly can be positioned and overlapped by the first flange and the second flange.
  • the use of the above structure can not only improve the assembly efficiency, but also improve the accuracy of assembly, thereby making the flue gas heat exchanger more suitable for mass production.
  • the first intermediate chip further includes a first body and a first bending portion, and the first bending portion is located between the first body and the first flange to connect the first The main body and the first flange, the first bending part protrudes toward the direction of the flue gas flow channel; and/or,
  • the second intermediate chip further includes a second body and a second bending portion, and the second bending portion is located between the second body and the second flange to connect the second body and the second flange.
  • the second flanging, the second bending part protrudes in the direction of the flue gas flow channel.
  • both the first intermediate chip and the second intermediate chip are formed by stamping.
  • the beneficial effects of the technical solutions provided by the embodiments of the present disclosure include at least: by using the above-mentioned first bending portion, and/or, the second bending portion, the intermediate chip has a certain release margin during thermal expansion, and the use of the intermediate chip
  • the flexibility to release the margin can reduce the possibility of damage to the intermediate chip and the product using the intermediate chip during thermal expansion, improve product reliability, and facilitate the discharge of flue gas condensed corrosive liquid to avoid corrosion problems.
  • the fins includes fins, and there are two air ports, one of the air ports is an air inlet and the other is an air outlet, the fins are installed in the flue gas flow channel, and the fins
  • the blade has a straight tooth portion, and the position of the straight tooth portion corresponds to the position of the air inlet.
  • the fin further has a heat exchange part; the heat exchange part includes any one of corrugated, staggered teeth or flat fin structure.
  • the beneficial effects of the technical solution provided in this embodiment at least include: the use of straight teeth in the fins can weaken the heat exchange capacity at the air inlet, and at the same time can reduce the wall temperature at the air inlet, thereby reducing thermal stress and heat. Fatigue failure risk, and at the same time, it can also enhance the pressure resistance of one side of the coolant flow channel; in addition to the straight tooth part, the fin also includes a heat exchange part, where the heat exchange part and the straight tooth part together form the fin as a whole;
  • the heat exchange part of the fin can choose a structure with stronger heat exchange capacity, such as corrugated, staggered teeth or a straight fin structure with a smaller tooth pitch, which is configured to improve the heat exchange capacity and make the product more compact; among them, the fin It can be in split form, or it can be made as a whole.
  • the present disclosure also provides a flue gas heat exchanger, including a cover and a chip unit connected to the cover, the chip unit includes at least one of the above-mentioned chip components, and the cover is between the outer wall of the chip unit A first liquid flow path is formed between.
  • a liquid channel penetrating the chip assembly in a first direction is formed on the chip assembly, the liquid channel is in communication with the first liquid flow channel, and the liquid channel is connected to the flue gas
  • the flow channels are sealed and isolated.
  • the beneficial effects of the technical solution provided by this embodiment at least include: connecting the liquid flow channels in the chip unit and around the chip unit through the liquid channel as a whole, so that the flue gas flow channel is covered by the liquid flow channel, improving heat exchange efficiency and exchange rate. Thermal performance, while reducing the flue gas channel wall temperature, improving product reliability.
  • the liquid channel includes a first cylindrical portion formed on the first intermediate chip and a second cylindrical portion formed on the second intermediate chip, and the first cylindrical portion is inserted into the second cylindrical portion .
  • the beneficial effects of the technical solution provided by this embodiment at least include: connecting the first cylinder part and the second cylinder part in the form of plug-in connection, and forming a liquid channel, which realizes the technical effects of simple installation, improved production efficiency, and cost reduction, so that The flue gas heat exchanger is more suitable for mass production.
  • the chip unit includes at least two of the chip components stacked in a first direction, a second liquid channel is formed between adjacent chip components, and the first liquid channel is connected to the The second liquid flow channels communicate with each other.
  • the beneficial effects of the technical solution provided in this embodiment at least include: the heat exchange performance of the flue gas heat exchanger can be improved by using multiple chip assemblies.
  • the first intermediate chip and the second intermediate chip are each formed with the air port;
  • the air port formed on the first intermediate chip is a first air port, and in the first direction, the first air port is The air port forms a protrusion protruding to the outside of the flue gas flow channel;
  • the air port formed on the second intermediate chip is a second air port, and in the first direction, the second air port forms a flow toward the flue gas A protrusion protruding from the inner side of the channel; between two adjacent chip assemblies, the first air port of one of the chip assemblies and the second air port of the other chip are inserted and sealed.
  • the beneficial effects of the technical solution provided by this embodiment include: during the assembly process, the communication between the flue gas flow channels of each chip assembly can be realized through the mating of the first air port and the second air port between the chip assemblies. , Improve the assembly efficiency, and the mating of the first air port and the second air port between the chip components can also play a role in positioning the assembly between the chip units, improve the assembly accuracy, and make the flue gas heat exchanger more Suitable for mass production.
  • the first air port and the second air port may both be air inlets or both air outlets.
  • the covering member includes a first cover plate configured to cooperate with a first intermediate chip located at the outermost side of the chip unit in the first direction, on the first cover plate A third air port is formed, and the first air port of the first intermediate chip located at the outermost side of the chip unit is inserted and sealed with the third air port.
  • a plurality of third air ports are provided along the extending direction of the first cover plate in the second direction.
  • the number of the first air ports of the first intermediate chip corresponds to the number of the third air ports one-to-one, and each of the third air ports corresponds to the first air port of the first intermediate chip. And it is sealed and configured to form the second liquid flow channel between any two adjacent third gas ports.
  • the beneficial effects of the technical solution provided in this embodiment at least include: the connection between the flue gas flow channel in each chip assembly and the flue gas pipe is realized through the connection between the third gas port and the first gas port, and at the same time, the first gas port and the third gas port are connected to each other.
  • the plug-in connection is simple and convenient, which improves the production efficiency, reduces the production cost, and makes the flue gas heat exchanger more suitable for mass production.
  • the third air port is corresponding to the air inlet
  • the first air port is the air outlet
  • the third air port is corresponding to the air outlet
  • multiple first air ports and multiple third air ports are used
  • Multiple second liquid flow channels are formed between them, which can better realize the connection between the flue gas flow channels in each chip assembly and the flue gas pipes.
  • the multiple second liquid flow channels and liquid channels are used to make the chip unit and surrounding The liquid flow channel is connected as a whole, so that the flue gas flow channel is covered by the second liquid flow channel, and the heat exchange efficiency and heat exchange performance are improved.
  • the first middle chip has a crescent flanging formed at the edge of the first air port, and the crescent flanging extends obliquely in a direction away from the first cover plate.
  • the crescent flanging of the bottom matching chip is a first crescent flanging
  • the crescent flanging of the first intermediate chip other than the bottom matching chip is a second crescent flanging
  • the first crescent flanging The area of the side is smaller than the area of the second crescent flanging, and the angle between the first crescent flanging and the bottom matching chip is greater than the angle between the second crescent flanging and the first intermediate chip.
  • the beneficial effects of the technical solution provided by this embodiment at least include: guiding the flue gas flow through the crescent flanges, so that the flue gas flow is evenly distributed, and avoiding large thermal stresses when the temperature field difference is large.
  • it also includes a fluid inlet flange and a fluid outlet flange;
  • the fluid inlet flange is installed at the air inlet and the liquid inlet of the first cover plate, and the fluid outlet flange is installed at the air outlet and the liquid outlet of the first cover plate.
  • the cover includes a second cover plate configured to cooperate with a second intermediate chip located at the outermost side of the chip unit in the first direction, on the second cover plate A port blocking portion is formed, and in the first direction, the port blocking portion is a protrusion extending toward the chip unit.
  • the second port of the second intermediate chip located at the outermost side of the chip unit is connected to the The air port blocking part is plugged and sealed.
  • a plurality of the air port blocking portions are provided along the extension direction of the second cover plate in the second direction.
  • the number of the second air ports of the second intermediate chip corresponds to the number of the air port blocking portions one-to-one, and each of the air port blocking portions corresponds to the second air port of the second intermediate chip It is plugged and sealed, and is configured such that the first liquid flow channel is formed between any two adjacent air port blocking parts.
  • the beneficial effects of the technical solution provided by this embodiment at least include: at the second cover plate, the air port blocking part is matched with the second air port, and the air port blocking part and the second air port can be easily and conveniently matched through plugging, and the production is improved.
  • Efficiency reducing production costs, making the flue gas heat exchanger more suitable for mass production; at the same time, using multiple air port blocking parts and the second air port to form multiple first liquid flow channels, which can better realize each
  • the flue gas flow channel in the chip assembly is connected with the flue gas pipe, and a plurality of first liquid flow channels and liquid channels are used to connect the liquid flow channels in the chip unit and around the chip unit as a whole, so that the flue gas flow channel is covered by the first liquid flow.
  • Road coating improves heat exchange efficiency and heat exchange performance.
  • a closed flue gas flow channel is formed inside the chip assembly itself, instead of using a gas chamber and a main board to connect the core to form a closed flue gas heat exchanger as in the traditional flue gas heat exchanger.
  • the flue gas flow channel therefore, reduces the types of parts required for manufacturing the flue gas heat exchanger, reduces the assembly difficulty, and makes the flue gas heat exchanger more suitable for mass production.
  • FIG. 1 is a schematic structural diagram of an embodiment of a flue gas heat exchanger provided by an embodiment of the disclosure
  • Figure 2 is a cross-sectional view at A-A in Figure 1;
  • Figure 3 is a partial cross-sectional view at B-B in Figure 1;
  • FIG. 4 is a schematic diagram of an explosive structure of an implementation of a flue gas heat exchanger provided by an embodiment of the disclosure
  • FIG. 5 is a schematic structural diagram of an implementation manner of a bottom matching chip provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic structural diagram of an implementation manner of a first intermediate chip provided by an embodiment of the disclosure.
  • FIG. 7 is a schematic structural diagram of an embodiment of a fin provided by an embodiment of the disclosure.
  • connection should be understood in a broad sense.
  • they can be fixed or detachable.
  • Connected or integrally connected it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • the specific meanings of the above-mentioned terms in the present disclosure can be understood in specific situations.
  • the plate-fin flue gas heat exchanger in the prior art generally consists of a number of chip components with built-in fins and corresponding holes on the tube plates at both ends to form a core assembly. It is assembled with shell, air chamber and water inlet and outlet to form a heat exchanger.
  • existing heat exchanger parts have many types and relatively complicated assembly, which is not suitable for mass production.
  • the chip assembly provided by this embodiment can at least alleviate the problems that the existing heat exchangers have a large variety of parts, relatively complicated assembly, and are not suitable for mass production. At least one of them.
  • an embodiment of the present disclosure provides a chip assembly 500, which includes a first intermediate chip 530 and a second intermediate chip 510 that are stacked in a first direction.
  • a flue gas channel 700 is formed between the middle chips 510, the flue gas channel 700 is a closed structure, and the flue gas channel 700 has an air port configured to communicate with the flue gas pipe.
  • the chip assembly 500 forms a closed flue gas flow channel 700 inside itself, instead of using a gas chamber and a main board to connect the core as in the traditional flue gas heat exchanger.
  • the airtight flue gas flow channel 700 therefore, reduces the types of parts required to manufacture the flue gas heat exchanger, reduces the assembly difficulty, and makes the flue gas heat exchanger more suitable for mass production; and, because the embodiments of the present disclosure provide
  • the chip assembly 500 removes the structure such as the chamber body and the main board, further reducing the production cost of the flue gas heat exchanger; the first intermediate chip 530 and the second intermediate chip 510 can be formed by stamping, which has higher production efficiency and lower cost.
  • the edge of the first middle chip 530 forms a first flanging
  • the edge of the second middle chip 510 forms a second flanging
  • the first flanging and the second flanging overlap to form a closed flue gas flow channel 700 .
  • the first intermediate chip 530 and the second intermediate chip 510 in the chip assembly 500 can be positioned and overlapped by the first flange and the second flange.
  • the use of the above structure can not only improve the assembly efficiency, but also The accuracy of assembly can be improved, and the flue gas heat exchanger is more suitable for mass production.
  • the first intermediate chip 530 further includes a first body and a first bending portion 512, the first bending portion 512 is located between the first body and the first flange to connect the first body and the first flange, The first bending portion 512 protrudes toward the direction of the flue gas flow channel 700; and/or,
  • the second intermediate chip 510 further includes a second body and a second bending portion 534.
  • the second bending portion 534 is located between the second body and the second flange to connect the second body and the second flange.
  • the portion 534 protrudes toward the direction of the flue gas flow channel 700.
  • both the first intermediate chip 530 and the second intermediate chip 510 are formed by stamping.
  • the beneficial effects of the technical solution provided by the embodiments of the present disclosure include at least: by using the above-mentioned first bending portion 512 and/or the second bending portion 534, the intermediate chip has a certain release margin during thermal expansion, and the use of The flexibility of the release margin of the intermediate chip can reduce the possibility of damage to the intermediate chip and products using the intermediate chip during thermal expansion, improve product reliability, and facilitate the discharge of flue gas condensed corrosive liquid to avoid corrosion problems.
  • the chip assembly 500 provided by the embodiment of the present disclosure includes a fin 520, and there are two air ports, one of which is an air inlet and the other is an air outlet, and the fin 520 is installed in the flue gas flow channel 700 Inside, the fin 520 has a straight tooth portion 521, and the position of the straight tooth portion 521 corresponds to the position of the air inlet.
  • the fin 520 further has a heat exchange part; the heat exchange part includes any one of corrugated, staggered teeth or flat fin structures.
  • the fin 520 adopts a straight tooth part 521 to weaken the heat exchange capacity at the air inlet, and reduce the wall temperature at the air inlet to reduce thermal stress, reduce the risk of thermal fatigue failure, and strengthen the coolant flow path.
  • the heat exchange part can adopt a structure with stronger heat exchange capacity, such as corrugated, staggered teeth or a flat fin structure with a smaller tooth pitch, which is configured to improve the heat exchange capacity and make the product more compact; among them, the fin 520 can It can be split, or it can be made as a whole.
  • the embodiment of the present disclosure further provides a flue gas heat exchanger, which includes a cover and a chip unit connected to the cover.
  • the chip unit includes at least one chip assembly 500 provided in the above embodiment of the present disclosure, the cover and the outer wall of the chip unit A first liquid flow channel 600 is formed therebetween.
  • the flue gas heat exchanger provided by the present disclosure adopts the chip assembly 500 provided by the present disclosure, and a closed flue gas flow channel 700 is formed inside itself, instead of a traditional flue gas heat exchanger.
  • the air chamber and the main board are needed to connect the core to form a closed flue gas flow channel 700. Therefore, the types of parts required for manufacturing the flue gas heat exchanger are reduced, the assembly difficulty is reduced, and the flue gas heat exchanger is more suitable for batches. Production; And, because the flue gas heat exchanger provided by the embodiments of the present disclosure removes the structure such as the chamber body and the main board, the production cost of the flue gas heat exchanger is further reduced.
  • a liquid inlet and a liquid outlet communicating with the first liquid flow channel 600 are formed on the cover.
  • a liquid channel 800 penetrating the chip assembly 500 in the first direction is formed on the chip assembly 500, the liquid channel 800 is in communication with the first liquid flow channel 600, and the liquid channel 800 and the flue gas flow channel 700 are sealed isolation.
  • the liquid channel in the chip unit and the liquid channel around the chip unit are connected as a whole through the liquid channel 800, so that the flue gas channel 700 is covered by the liquid channel, which improves the heat exchange efficiency and heat exchange performance, and reduces the wall temperature of the flue gas channel. Improve product reliability.
  • the liquid channel 800 includes a first cylindrical portion 533 formed on the first intermediate chip 530 and a second cylindrical portion 511 formed on the second intermediate chip 510, and the first cylindrical portion 533 is inserted into the second cylindrical portion 511.
  • the first cylindrical part 533 and the second cylindrical part 511 are connected by plug-in form, and the liquid channel 800 is formed, which realizes the technical effects of simple installation, improved production efficiency, and reduced cost, making the flue gas heat exchanger more suitable for mass production .
  • the chip unit includes at least two chip assemblies 500 stacked in a first direction, a second liquid flow channel 900 is formed between adjacent chip assemblies 500, the first liquid flow channel 600 and the second liquid flow channel 900 Connected between.
  • the use of multiple chip assemblies 500 can improve the heat exchange performance of the flue gas heat exchanger.
  • both the first intermediate chip 530 and the second intermediate chip 510 are formed with air ports;
  • the air port formed on the first intermediate chip 530 is a first air port, and the first air port forms a flue gas flow path in the first direction A protruding protrusion on the outside of 700;
  • the air port formed on the second intermediate chip 510 is a second air port, and in the first direction, the second air port forms a protrusion protruding to the inner side of the flue gas flow channel 700; adjacent Between the two chip assemblies 500, the first air port of one chip assembly 500 and the second air port of the other chip are inserted and sealed.
  • the communication between the flue gas channels 700 of each chip assembly 500 can be realized, and the assembly efficiency is improved.
  • the plug-in cooperation of the first air port and the second air port between the components can also play a role in positioning the assembly between the chip units, improve the assembly accuracy, and make the flue gas heat exchanger more suitable for mass production.
  • the first air port and the second air port may both be air inlets or both air outlets.
  • the cover includes a first cover 300, the first cover 300 is configured to cooperate with the first intermediate chip 530 located at the outermost side of the chip unit in the first direction, and a third cover 300 is formed on the first cover 300.
  • the air port, the first air port of the first intermediate chip 530 located at the outermost side of the chip unit and the third air port are inserted and sealed.
  • the flue gas flow channel 700 in each chip assembly 500 is connected with the flue gas pipe.
  • the insertion between the first air port and the third air port is simple and convenient, which improves the production efficiency , Which reduces the production cost and makes the flue gas heat exchanger more suitable for mass production.
  • the first air port is an air inlet
  • the third air port is correspondingly an air inlet
  • the first air port is an air outlet
  • the third air port is correspondingly an air outlet.
  • a plurality of third air ports are provided along the extending direction of the first cover plate 300 in the second direction.
  • the number of the first air ports of the first intermediate chip 530 corresponds to the number of the third air ports one-to-one, and each third air port is correspondingly plugged and sealed with the first air port of the first intermediate chip 530, and the configuration is arbitrary
  • a second liquid flow channel 900 is formed between two adjacent third gas ports. Using multiple first gas ports and multiple third gas ports to form multiple second liquid flow passages 900 can better realize the connection between the flue gas flow channels 700 in each chip assembly and the flue gas pipes, and use multiple second liquid flow channels.
  • the flow channel 900 and the liquid channel 800 connect the liquid flow channels in the chip unit and around the chip unit as a whole, so that the flue gas flow channel 700 is covered by the second liquid flow channel 900, which improves heat exchange efficiency and heat exchange performance.
  • the first direction is along the vertical arrangement direction of the flue gas heat exchanger
  • the second direction is along the horizontal arrangement direction of the flue gas heat exchanger; in other words, the first direction is the vertical arrangement direction of the flue gas heat exchanger.
  • the direction is the stacking method of the flue gas heat exchanger
  • the second direction is the horizontal extension direction of the first cover plate 300.
  • the first middle chip 530 has a crescent flanging formed at the edge of the first air port, and the crescent flanging extends obliquely in a direction away from the first cover plate 300.
  • the crescent flanging of the bottom matching chip is the first crescent flanging 532
  • the crescent flanging of the first intermediate chip 530 except the bottom matching chip is the second crescent flanging 531
  • the crescent flanging of the first crescent flanging 532 The area is smaller than the area of the second crescent flange 531, and the angle between the first crescent flange 532 and the bottom chip is greater than the angle between the second crescent flange 531 and the first middle chip 530.
  • the beneficial effects of the technical solution provided in this embodiment at least include: guiding the flue gas flow through the crescent flanges, so that the flue gas flow is evenly distributed, and avoiding large thermal stresses when the temperature field difference is large.
  • the cover includes a second cover plate 100 configured to cooperate with the second intermediate chip 510 located at the outermost side of the chip unit in the first direction, and an air port seal is formed on the second cover plate 100
  • the plugging portion 110, in the first direction, the port plugging portion 110 is a protrusion extending toward the chip unit, and the second port of the second intermediate chip 510 located at the outermost side of the chip unit is inserted and sealed with the port plugging portion 110 .
  • the air port blocking part 110 cooperates with the second air port through plug-in connection to realize the simple and convenient cooperation between the air port blocking part 110 and the second air port, which improves the production efficiency, reduces the production cost, and makes the flue gas hot.
  • the switch is more suitable for mass production.
  • a fluid inlet flange 200 is installed at the air inlet and liquid inlet of the first cover plate 300
  • a fluid outlet flange 400 is installed at the air outlet and liquid outlet of the first cover plate 300.
  • a plurality of air port blocking parts 110 are provided along the extending direction of the second cover plate 100 in the second direction.
  • the number of the second air ports of the second intermediate chip 510 corresponds to the number of the air port blocking parts 110 one-to-one, and each of the air port blocking parts 110 corresponds to the second air port of the second intermediate chip 510 and is plugged and sealed.
  • the first liquid flow channel 600 is formed between any two adjacent air port blocking parts 110.
  • the multiple first liquid flow channels 600 are formed between the multiple air port blocking parts 110 and the second air ports, which can better realize the connection of the flue gas flow channels 700 and the flue gas pipes in each chip assembly, and use multiple first liquid
  • the flow channel 600 and the liquid channel 800 connect the liquid flow channels in the chip unit and around the chip unit as a whole, so that the flue gas flow channel 700 is covered by the first liquid flow channel 600 to improve heat exchange efficiency and heat exchange performance.
  • the chip assembly and the flue gas heat exchanger provided by the embodiments of the present disclosure utilize the inside of the chip assembly itself to form a closed flue gas flow channel, which reduces the heat exchange of the manufacturing flue gas, reduces the assembly difficulty, and makes the flue gas heat exchanger More suitable for mass production.

Abstract

The present invention relates to the technical field of heat exchange devices, and in particular, to a chip assembly and a flue gas heat exchanger. The chip assembly comprises first intermediate chips and second intermediate chips which are stacked in a first direction. Flue gas channels are formed between the first intermediate chips and the second intermediate chips. The flue gas channels are of a closed structure, and have air ports configured to be in communication with flue gas pipelines. The purpose of the present invention is to provide a chip assembly and a flue gas heat exchanger in view of the problems of a wide variety and relatively complicated assembly of parts of the current heat exchanger.

Description

芯片组件及烟气热交换器Chip assembly and flue gas heat exchanger
相关申请的交叉引用Cross-references to related applications
本申请要求于2020年03月12日提交中国专利局的申请号为202010170498.1、名称为“芯片组件及烟气热交换器”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application filed with the Chinese Patent Office on March 12, 2020 with the application number 202010170498.1, titled "Chip Assembly and Flue Gas Heat Exchanger", the entire content of which is incorporated into this application by reference .
技术领域Technical field
本公开涉及换热设备技术领域,具体而言,涉及一种芯片组件及烟气热交换器。The present disclosure relates to the technical field of heat exchange equipment, and in particular to a chip assembly and a flue gas heat exchanger.
背景技术Background technique
随着废气再循环技术(EGR)和废热回收技术(EHRS)的发展,各种烟气热交换器相继产生。其中,板翅式烟气热交换器由于其卓越的换热性能得到广泛应用。With the development of exhaust gas recirculation technology (EGR) and waste heat recovery technology (EHRS), various flue gas heat exchangers have been produced one after another. Among them, the plate-fin flue gas heat exchanger is widely used due to its excellent heat exchange performance.
但是,由于现有的热交换器存在较多缺陷,无法满足现有的需求。However, because the existing heat exchanger has many defects, it cannot meet the existing demand.
公开内容Public content
本公开为了至少能够缓解目前热交换器存在的零件种类较多,装配相对复杂,不适合大批量生产的诸多技术问题中的一个,本公开提供一种芯片组件及烟气热交换器。In order to at least alleviate one of the many technical problems that the current heat exchanger has a large variety of parts, relatively complicated assembly, and is not suitable for mass production, the present disclosure provides a chip assembly and a flue gas heat exchanger.
为了实现上述目的,本公开采用以下技术方案:In order to achieve the above objectives, the present disclosure adopts the following technical solutions:
本公开提供一种芯片组件,包括在第一方向上叠置的第一中间芯片和第二中间芯片,在所述第一中间芯片与所述第二中间芯片之间形成有烟气流道,所述烟气流道为密闭结构,且所述烟气流道具有配置成与烟气管道连通的气口。The present disclosure provides a chip assembly including a first intermediate chip and a second intermediate chip stacked in a first direction, a flue gas flow channel is formed between the first intermediate chip and the second intermediate chip, The flue gas channel is a closed structure, and the flue gas channel has an air port configured to communicate with the flue gas pipe.
可选地,所述第一中间芯片的边缘形成第一翻边,所述第二中间芯片 的边缘形成第二翻边,所述第一翻边与所述第二翻边搭接以形成密闭的所述烟气流道。Optionally, the edge of the first intermediate chip forms a first flanging, the edge of the second intermediate chip forms a second flanging, and the first flanging overlaps the second flanging to form an airtight The flue gas flow channel.
本公开实施例提供的技术方案的有益效果至少包括:在组装的过程中,芯片组件中的第一中间芯片与第二中间芯片之间能够通过第一翻边和第二翻边进行定位搭接,利用上述结构不但能够提高装配效率,还可以提高装配的精确度,进而使得烟气换热器更加适用于批量生产。The beneficial effects of the technical solutions provided by the embodiments of the present disclosure include at least: during the assembly process, the first intermediate chip and the second intermediate chip in the chip assembly can be positioned and overlapped by the first flange and the second flange The use of the above structure can not only improve the assembly efficiency, but also improve the accuracy of assembly, thereby making the flue gas heat exchanger more suitable for mass production.
可选地,所述第一中间芯片还包括第一主体和第一弯折部,所述第一弯折部位于所述第一主体与所述第一翻边之间以连接所述第一主体和所述第一翻边,所述第一弯折部向所述烟气流道方向凸出;和/或,Optionally, the first intermediate chip further includes a first body and a first bending portion, and the first bending portion is located between the first body and the first flange to connect the first The main body and the first flange, the first bending part protrudes toward the direction of the flue gas flow channel; and/or,
所述第二中间芯片还包括第二主体和第二弯折部,所述第二弯折部位于所述第二主体与所述第二翻边之间以连接所述第二主体和所述第二翻边,所述第二弯折部向所述烟气流道方向凸出。The second intermediate chip further includes a second body and a second bending portion, and the second bending portion is located between the second body and the second flange to connect the second body and the second flange. The second flanging, the second bending part protrudes in the direction of the flue gas flow channel.
可选地,第一中间芯片和第二中间芯片均采用冲压成型。Optionally, both the first intermediate chip and the second intermediate chip are formed by stamping.
本公开实施例提供的技术方案的有益效果至少包括:通过采用上述第一弯折部,和/或,第二弯折部,使中间芯片在热膨胀时具有一定的释放余量,利用中间芯片的释放余量的伸缩性,能够降低中间芯片及应用了该中间芯片的产品在热膨胀时损坏的可能,提高了产品可靠性,且便于烟气冷凝腐蚀液排出,以免产生腐蚀问题。The beneficial effects of the technical solutions provided by the embodiments of the present disclosure include at least: by using the above-mentioned first bending portion, and/or, the second bending portion, the intermediate chip has a certain release margin during thermal expansion, and the use of the intermediate chip The flexibility to release the margin can reduce the possibility of damage to the intermediate chip and the product using the intermediate chip during thermal expansion, improve product reliability, and facilitate the discharge of flue gas condensed corrosive liquid to avoid corrosion problems.
可选地,包括翅片,所述气口有两个,其中一个所述气口为进气口、另一个所述气口为出气口,所述翅片安装在所述烟气流道内,所述翅片具有直齿部,所述直齿部的位置与所述进气口的位置对应。可选地,翅片还具有换热部;换热部包括波纹、错齿或平直翅片结构中任意一个。Optionally, it includes fins, and there are two air ports, one of the air ports is an air inlet and the other is an air outlet, the fins are installed in the flue gas flow channel, and the fins The blade has a straight tooth portion, and the position of the straight tooth portion corresponds to the position of the air inlet. Optionally, the fin further has a heat exchange part; the heat exchange part includes any one of corrugated, staggered teeth or flat fin structure.
本实施例提供的技术方案的有益效果至少包括:翅片采用了直齿部能够弱化进气口处的换热能力,并同时能够降低进气口处的壁面温度,从而 降低了热应力减少热疲劳失效风险,同时还可以起到加强冷却液流道一侧的耐压能力;翅片除直齿部之外还包括换热部,其中,换热部和直齿部共同形成翅片整体;翅片的换热部可以选用换热能力更强的结构,如波纹、错齿或齿距更小的平直翅片结构,配置成提高换热能力,使得产品更为紧凑;其中,翅片可以采用分体形式,或者也可以做成整张。The beneficial effects of the technical solution provided in this embodiment at least include: the use of straight teeth in the fins can weaken the heat exchange capacity at the air inlet, and at the same time can reduce the wall temperature at the air inlet, thereby reducing thermal stress and heat. Fatigue failure risk, and at the same time, it can also enhance the pressure resistance of one side of the coolant flow channel; in addition to the straight tooth part, the fin also includes a heat exchange part, where the heat exchange part and the straight tooth part together form the fin as a whole; The heat exchange part of the fin can choose a structure with stronger heat exchange capacity, such as corrugated, staggered teeth or a straight fin structure with a smaller tooth pitch, which is configured to improve the heat exchange capacity and make the product more compact; among them, the fin It can be in split form, or it can be made as a whole.
本公开还提供一种烟气热交换器,包括覆盖件和连接于所述覆盖件的芯片单元,所述芯片单元包括至少一个上述的芯片组件,所述覆盖件与所述芯片单元的外壁之间形成第一液体流道。The present disclosure also provides a flue gas heat exchanger, including a cover and a chip unit connected to the cover, the chip unit includes at least one of the above-mentioned chip components, and the cover is between the outer wall of the chip unit A first liquid flow path is formed between.
可选地,在所述芯片组件上形成有在第一方向上贯穿所述芯片组件的液体通道,所述液体通道与所述第一液体流道连通,且所述液体通道与所述烟气流道之间密封隔离。Optionally, a liquid channel penetrating the chip assembly in a first direction is formed on the chip assembly, the liquid channel is in communication with the first liquid flow channel, and the liquid channel is connected to the flue gas The flow channels are sealed and isolated.
本实施例提供的技术方案的有益效果至少包括:通过液体通道使芯片单元内以及芯片单元周围的液体流道连通为一体,使烟气流道被液体流道包覆,提高换热效率及换热性能,同时降低烟气通道壁面温度,提高了产品可靠性。The beneficial effects of the technical solution provided by this embodiment at least include: connecting the liquid flow channels in the chip unit and around the chip unit through the liquid channel as a whole, so that the flue gas flow channel is covered by the liquid flow channel, improving heat exchange efficiency and exchange rate. Thermal performance, while reducing the flue gas channel wall temperature, improving product reliability.
可选地,所述液体通道包括形成于所述第一中间芯片的第一筒部和形成于第二中间芯片的第二筒部,所述第一筒部与所述第二筒部插接。Optionally, the liquid channel includes a first cylindrical portion formed on the first intermediate chip and a second cylindrical portion formed on the second intermediate chip, and the first cylindrical portion is inserted into the second cylindrical portion .
本实施例提供的技术方案的有益效果至少包括:通过插接的形式连接第一筒部和第二筒部,并形成液体通道,实现了安装简便,提高生产效率,降低成本的技术效果,使得烟气热交换器更加适用于批量生产。The beneficial effects of the technical solution provided by this embodiment at least include: connecting the first cylinder part and the second cylinder part in the form of plug-in connection, and forming a liquid channel, which realizes the technical effects of simple installation, improved production efficiency, and cost reduction, so that The flue gas heat exchanger is more suitable for mass production.
可选地,所述芯片单元包括至少两个在第一方向上叠置的所述芯片组件,相邻所述芯片组件之间形成第二液体流道,所述第一液体流道与所述第二液体流道之间连通。Optionally, the chip unit includes at least two of the chip components stacked in a first direction, a second liquid channel is formed between adjacent chip components, and the first liquid channel is connected to the The second liquid flow channels communicate with each other.
本实施例提供的技术方案的有益效果至少包括:通过采用多个芯片组 件能够提高烟气热交换器的换热性能。The beneficial effects of the technical solution provided in this embodiment at least include: the heat exchange performance of the flue gas heat exchanger can be improved by using multiple chip assemblies.
可选地,所述第一中间芯片和所述第二中间芯片上均形成有所述气口;在所述第一中间芯片上形成的气口为第一气口,在第一方向上所述第一气口形成向所述烟气流道的外侧凸出的凸起;在所述第二中间芯片上形成的气口为第二气口,在第一方向上所述第二气口形成向所述烟气流道的内侧凸出的凸起;相邻的两个所述芯片组件之间,其中一个所述芯片组件的第一气口与另一个芯片所述第二气口之间插接且密封。Optionally, the first intermediate chip and the second intermediate chip are each formed with the air port; the air port formed on the first intermediate chip is a first air port, and in the first direction, the first air port is The air port forms a protrusion protruding to the outside of the flue gas flow channel; the air port formed on the second intermediate chip is a second air port, and in the first direction, the second air port forms a flow toward the flue gas A protrusion protruding from the inner side of the channel; between two adjacent chip assemblies, the first air port of one of the chip assemblies and the second air port of the other chip are inserted and sealed.
本实施例提供的技术方案的有益效果包括:在装配的过程中,通过各芯片组件之间第一气口和第二气口的插接配合,能够实现各芯片组件的烟气流道之间的连通,提高了装配效率,且各芯片组件之间第一气口和第二气口的插接配合能够对芯片单元之间的装配还能够起到定位作用,提高了装配精度,使烟气热交换器更加适用于批量生产。第一气口和第二气口可以均为进气口或均为出气口。The beneficial effects of the technical solution provided by this embodiment include: during the assembly process, the communication between the flue gas flow channels of each chip assembly can be realized through the mating of the first air port and the second air port between the chip assemblies. , Improve the assembly efficiency, and the mating of the first air port and the second air port between the chip components can also play a role in positioning the assembly between the chip units, improve the assembly accuracy, and make the flue gas heat exchanger more Suitable for mass production. The first air port and the second air port may both be air inlets or both air outlets.
可选地,所述覆盖件包括第一盖板,所述第一盖板配置成与在第一方向上位于所述芯片单元最外侧的第一中间芯片配合,在所述第一盖板上形成有第三气口,该位于所述芯片单元最外侧的第一中间芯片的第一气口与所述第三气口插接且密封。Optionally, the covering member includes a first cover plate configured to cooperate with a first intermediate chip located at the outermost side of the chip unit in the first direction, on the first cover plate A third air port is formed, and the first air port of the first intermediate chip located at the outermost side of the chip unit is inserted and sealed with the third air port.
可选地,第三气口沿着第一盖板在第二方向的延伸方向设置有多个。Optionally, a plurality of third air ports are provided along the extending direction of the first cover plate in the second direction.
可选地,所述第一中间芯片的第一气口的数量与所述第三气口的数量一一对应,每一个所述第三气口均对应与所述第一中间芯片的第一气口插接且密封,配置成任意相邻的两个所述第三气口之间形成所述第二液体流道。Optionally, the number of the first air ports of the first intermediate chip corresponds to the number of the third air ports one-to-one, and each of the third air ports corresponds to the first air port of the first intermediate chip. And it is sealed and configured to form the second liquid flow channel between any two adjacent third gas ports.
本实施例提供的技术方案的有益效果至少包括:通过第三气口与第一气口之间的连接实现各芯片组件内烟气流道与烟气管道连接,同时,第一 气口与第三气口之间的插接简单方便,提高了生产效率,降低了生产成本,使烟气热交换器更适配置成批量生产。第一气口为进气口时,第三气口相应的为进气口,第一气口为出气口时,第三气口相应的为出气口;同时,利用多个第一气口与多个第三气口之间形成多个第二液体流道,能够更好的实现各芯片组件内烟气流道与烟气管道连接,利用多条第二液体流道和液体通道使芯片单元内以及芯片单元周围的液体流道连通为一体,使烟气流道被第二液体流道包覆,提高换热效率及换热性能。The beneficial effects of the technical solution provided in this embodiment at least include: the connection between the flue gas flow channel in each chip assembly and the flue gas pipe is realized through the connection between the third gas port and the first gas port, and at the same time, the first gas port and the third gas port are connected to each other. The plug-in connection is simple and convenient, which improves the production efficiency, reduces the production cost, and makes the flue gas heat exchanger more suitable for mass production. When the first air port is the air inlet, the third air port is corresponding to the air inlet, and when the first air port is the air outlet, the third air port is corresponding to the air outlet; at the same time, multiple first air ports and multiple third air ports are used Multiple second liquid flow channels are formed between them, which can better realize the connection between the flue gas flow channels in each chip assembly and the flue gas pipes. The multiple second liquid flow channels and liquid channels are used to make the chip unit and surrounding The liquid flow channel is connected as a whole, so that the flue gas flow channel is covered by the second liquid flow channel, and the heat exchange efficiency and heat exchange performance are improved.
可选地,所述第一中间芯片具有月牙翻边,所述月牙翻边形成于第一气口的边缘处,所述月牙翻边向远离所述第一盖板的方向倾斜延伸。Optionally, the first middle chip has a crescent flanging formed at the edge of the first air port, and the crescent flanging extends obliquely in a direction away from the first cover plate.
可选地,所述配底芯片的月牙翻边为第一月牙翻边,除所述配底芯片以外的其他第一中间芯片的月牙翻边为第二月牙翻边,所述第一月牙翻边的面积小于第二月牙翻边的面积,且所述第一月牙翻边与所述配底芯片之间的角度大于所述第二月牙翻边与第一中间芯片之间的角度。Optionally, the crescent flanging of the bottom matching chip is a first crescent flanging, the crescent flanging of the first intermediate chip other than the bottom matching chip is a second crescent flanging, and the first crescent flanging The area of the side is smaller than the area of the second crescent flanging, and the angle between the first crescent flanging and the bottom matching chip is greater than the angle between the second crescent flanging and the first intermediate chip.
本实施例提供的技术方案的有益效果至少包括:通过月牙翻边引导烟气气流,使得烟气气流分配均匀,避免了温度场差异较大时会产生较大的热应力。The beneficial effects of the technical solution provided by this embodiment at least include: guiding the flue gas flow through the crescent flanges, so that the flue gas flow is evenly distributed, and avoiding large thermal stresses when the temperature field difference is large.
可选地,还包括流体入口法兰和流体出口法兰;Optionally, it also includes a fluid inlet flange and a fluid outlet flange;
所述流体入口法兰安装于所述第一盖板的进气口及进液口处,所述流体出口法兰安装于第一盖板的出气口和出液口处。The fluid inlet flange is installed at the air inlet and the liquid inlet of the first cover plate, and the fluid outlet flange is installed at the air outlet and the liquid outlet of the first cover plate.
可选地,所述覆盖件包括第二盖板,所述第二盖板配置成与在第一方向上位于所述芯片单元最外侧的第二中间芯片配合,在所述第二盖板上形成有气口封堵部,在第一方向上所述气口封堵部为向所述芯片单元伸出的凸起,该位于所述芯片单元最外侧的第二中间芯片的第二气口与所述气口封堵部插接且密封。Optionally, the cover includes a second cover plate configured to cooperate with a second intermediate chip located at the outermost side of the chip unit in the first direction, on the second cover plate A port blocking portion is formed, and in the first direction, the port blocking portion is a protrusion extending toward the chip unit. The second port of the second intermediate chip located at the outermost side of the chip unit is connected to the The air port blocking part is plugged and sealed.
可选地,所述气口封堵部沿着所述第二盖板在第二方向的延伸方向设置有多个。Optionally, a plurality of the air port blocking portions are provided along the extension direction of the second cover plate in the second direction.
可选地,所述第二中间芯片的第二气口的数量与所述气口封堵部的数量一一对应,每一个所述气口封堵部均对应与所述第二中间芯片的第二气口插接且密封,配置成任意相邻的两个所述气口封堵部之间形成所述第一液体流道。Optionally, the number of the second air ports of the second intermediate chip corresponds to the number of the air port blocking portions one-to-one, and each of the air port blocking portions corresponds to the second air port of the second intermediate chip It is plugged and sealed, and is configured such that the first liquid flow channel is formed between any two adjacent air port blocking parts.
本实施例提供的技术方案的有益效果至少包括:在第二盖板处,通过气口封堵部与第二气口配合,通过插接实现气口封堵部与第二气口配合简单方便,提高了生产效率,降低了生产成本,使烟气热交换器更适配置成批量生产;同时,利用多个气口封堵部与第二气口之间形成多个第一液体流道,能够更好的实现各芯片组件内烟气流道与烟气管道连接,利用多条第一液体流道和液体通道使芯片单元内以及芯片单元周围的液体流道连通为一体,使烟气流道被第一液体流道包覆,提高换热效率及换热性能。The beneficial effects of the technical solution provided by this embodiment at least include: at the second cover plate, the air port blocking part is matched with the second air port, and the air port blocking part and the second air port can be easily and conveniently matched through plugging, and the production is improved. Efficiency, reducing production costs, making the flue gas heat exchanger more suitable for mass production; at the same time, using multiple air port blocking parts and the second air port to form multiple first liquid flow channels, which can better realize each The flue gas flow channel in the chip assembly is connected with the flue gas pipe, and a plurality of first liquid flow channels and liquid channels are used to connect the liquid flow channels in the chip unit and around the chip unit as a whole, so that the flue gas flow channel is covered by the first liquid flow. Road coating improves heat exchange efficiency and heat exchange performance.
本公开提供的技术方案至少可以达到以下有益效果:The technical solution provided by the present disclosure can at least achieve the following beneficial effects:
本公开所提供的芯片组件及烟气热交换器,芯片组件自身内部即形成密闭的烟气流道,而非如传统的烟气热交换器需采用气室及主板连接芯体以形成密闭的烟气流道,因此,减少了制造烟气热交换器所需要零件的种类,降低了装配难度,使烟气热交换器更适于批量生产。In the chip assembly and flue gas heat exchanger provided by the present disclosure, a closed flue gas flow channel is formed inside the chip assembly itself, instead of using a gas chamber and a main board to connect the core to form a closed flue gas heat exchanger as in the traditional flue gas heat exchanger. The flue gas flow channel, therefore, reduces the types of parts required for manufacturing the flue gas heat exchanger, reduces the assembly difficulty, and makes the flue gas heat exchanger more suitable for mass production.
本公开的附加技术特征及其优点将在下面的描述内容中阐述地更加明显,或通过本公开的具体实践可以了解到。The additional technical features and advantages of the present disclosure will be more apparent in the following description, or can be understood through specific practices of the present disclosure.
附图说明Description of the drawings
为了更清楚地说明本公开具体实施方式的技术方案,下面将对具体实施方式描述中所需要使用的附图作简单地介绍。显而易见地,下面描述中 的附图是本公开的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the specific embodiments of the present disclosure, the following will briefly introduce the drawings that need to be used in the description of the specific embodiments. Obviously, the drawings in the following description are some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.
图1为本公开实施例提供的烟气热交换器的一种实施方式的结构示意图;FIG. 1 is a schematic structural diagram of an embodiment of a flue gas heat exchanger provided by an embodiment of the disclosure;
图2为图1中A-A处的剖视图;Figure 2 is a cross-sectional view at A-A in Figure 1;
图3为图1中B-B处的局部剖视图;Figure 3 is a partial cross-sectional view at B-B in Figure 1;
图4为本公开实施例提供的烟气热交换器的一种实施方式的爆炸结构示意图;4 is a schematic diagram of an explosive structure of an implementation of a flue gas heat exchanger provided by an embodiment of the disclosure;
图5为本公开实施例所提供的配底芯片的一种实施方式的结构示意图;FIG. 5 is a schematic structural diagram of an implementation manner of a bottom matching chip provided by an embodiment of the disclosure; FIG.
图6为本公开实施例所提供的第一中间芯片的一种实施方式的结构示意图;6 is a schematic structural diagram of an implementation manner of a first intermediate chip provided by an embodiment of the disclosure;
图7为本公开实施例所提供的翅片的一种实施方式的结构示意图。FIG. 7 is a schematic structural diagram of an embodiment of a fin provided by an embodiment of the disclosure.
附图标记:100-第二盖板;110-气口封堵部;200-流体入口法兰;300-第一盖板;400-流体出口法兰;500-芯片组件;510-第二中间芯片;511-第二筒部;512-第一弯折部;520-翅片;521-直齿部;530-第一中间芯片;531-第二月牙翻边;532-第一月牙翻边;533-第一筒部;534-第二弯折部;600-第一液体流道;700-烟气流道;800-液体通道;900-第二液体流道。Reference signs: 100-second cover plate; 110-port blocking part; 200-fluid inlet flange; 300-first cover plate; 400-fluid outlet flange; 500-chip assembly; 510-second intermediate chip 511-second barrel part; 512-first bending part; 520-fin; 521-straight tooth part; 530-first intermediate chip; 531-second crescent flanging; 532-first crescent flanging; 533-first cylinder part; 534-second bending part; 600-first liquid flow channel; 700-flue gas flow channel; 800-liquid channel; 900-second liquid flow channel.
具体实施方式Detailed ways
下面将结合附图对本公开的技术方案进行清楚、完整地描述,显然,所描述的实施例是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。The technical solutions of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present disclosure.
在本公开的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、 “右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本公开和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。此外,术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性。In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the pointed device or element must have a specific orientation or a specific orientation. The structure and operation cannot therefore be construed as a limitation of the present disclosure. In addition, the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.
在本公开的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本公开中的具体含义。In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, they can be fixed or detachable. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the present disclosure can be understood in specific situations.
需要说明的是,现有技术中的板翅式烟气热交换器,一般由若干内置翅片的芯片组件与两端管板上对应的孔插接装配构成芯子组件,在使芯子组件与壳体、气室及进出水口等装配构成热交换器。但是,这种现有的热交换器零件种类较多,装配相对复杂,不适合大批量生产。It should be noted that the plate-fin flue gas heat exchanger in the prior art generally consists of a number of chip components with built-in fins and corresponding holes on the tube plates at both ends to form a core assembly. It is assembled with shell, air chamber and water inlet and outlet to form a heat exchanger. However, such existing heat exchanger parts have many types and relatively complicated assembly, which is not suitable for mass production.
针对现有的热交换器存在问题,本实施例提供的一种芯片组件,以至少能够缓解现有技术中存在的热交换器零件种类较多,装配相对复杂,不适合大批量生产的问题中的至少一个。In view of the problems of the existing heat exchangers, the chip assembly provided by this embodiment can at least alleviate the problems that the existing heat exchangers have a large variety of parts, relatively complicated assembly, and are not suitable for mass production. At least one of them.
如图1至图7所示,本公开实施例提供一种芯片组件500,包括在第一方向上叠置的第一中间芯片530和第二中间芯片510,在第一中间芯片530与第二中间芯片510之间形成有烟气流道700,烟气流道700为密闭结构,且烟气流道700具有配置成与烟气管道连通的气口。As shown in FIGS. 1 to 7, an embodiment of the present disclosure provides a chip assembly 500, which includes a first intermediate chip 530 and a second intermediate chip 510 that are stacked in a first direction. A flue gas channel 700 is formed between the middle chips 510, the flue gas channel 700 is a closed structure, and the flue gas channel 700 has an air port configured to communicate with the flue gas pipe.
需要说明的是,本公开实施例所提供的芯片组件500,其自身内部即形成密闭的烟气流道700,而非如传统的烟气热交换器需采用气室及主板连接 芯体以形成密闭的烟气流道700,因此,减少了制造烟气热交换器所需要零件的种类,降低了装配难度,使烟气热交换器更适于批量生产;且,由于本公开实施例提供的芯片组件500去掉了室体和主板等结构,进一步降低了烟气热交换器的生产成本;第一中间芯片530和第二中间芯片510可采用冲压成型,生产效率较高,成本较低。It should be noted that the chip assembly 500 provided by the embodiment of the present disclosure forms a closed flue gas flow channel 700 inside itself, instead of using a gas chamber and a main board to connect the core as in the traditional flue gas heat exchanger. The airtight flue gas flow channel 700, therefore, reduces the types of parts required to manufacture the flue gas heat exchanger, reduces the assembly difficulty, and makes the flue gas heat exchanger more suitable for mass production; and, because the embodiments of the present disclosure provide The chip assembly 500 removes the structure such as the chamber body and the main board, further reducing the production cost of the flue gas heat exchanger; the first intermediate chip 530 and the second intermediate chip 510 can be formed by stamping, which has higher production efficiency and lower cost.
可选地,第一中间芯片530的边缘形成第一翻边,第二中间芯片510的边缘形成第二翻边,第一翻边与第二翻边搭接以形成密闭的烟气流道700。在组装的过程中,芯片组件500中的第一中间芯片530与第二中间芯片510之间能够通过第一翻边和第二翻边进行定位搭接,利用上述结构不但能够提高装配效率,还可以提高了装配的精确度,进而使得烟气换热器更加适用于批量生产。Optionally, the edge of the first middle chip 530 forms a first flanging, the edge of the second middle chip 510 forms a second flanging, and the first flanging and the second flanging overlap to form a closed flue gas flow channel 700 . During the assembly process, the first intermediate chip 530 and the second intermediate chip 510 in the chip assembly 500 can be positioned and overlapped by the first flange and the second flange. The use of the above structure can not only improve the assembly efficiency, but also The accuracy of assembly can be improved, and the flue gas heat exchanger is more suitable for mass production.
可选地,第一中间芯片530还包括第一主体和第一弯折部512,第一弯折部512位于第一主体与第一翻边之间以连接第一主体和第一翻边,第一弯折部512向烟气流道700方向凸出;和/或,Optionally, the first intermediate chip 530 further includes a first body and a first bending portion 512, the first bending portion 512 is located between the first body and the first flange to connect the first body and the first flange, The first bending portion 512 protrudes toward the direction of the flue gas flow channel 700; and/or,
第二中间芯片510还包括第二主体和第二弯折部534,第二弯折部534位于第二主体与第二翻边之间以连接第二主体和第二翻边,第二弯折部534向烟气流道700方向凸出。The second intermediate chip 510 further includes a second body and a second bending portion 534. The second bending portion 534 is located between the second body and the second flange to connect the second body and the second flange. The portion 534 protrudes toward the direction of the flue gas flow channel 700.
可选地,第一中间芯片530和第二中间芯片510均采用冲压成型。Optionally, both the first intermediate chip 530 and the second intermediate chip 510 are formed by stamping.
本公开实施例提供的该技术方案的有益效果至少包括:通过采用上述第一弯折部512,和/或,第二弯折部534,使中间芯片在热膨胀时具有一定的释放余量,利用中间芯片的释放余量的伸缩性,能够降低中间芯片及应用了该中间芯片的产品在热膨胀时损坏的可能,提高了产品可靠性,且便于烟气冷凝腐蚀液排出,以免产生腐蚀问题。The beneficial effects of the technical solution provided by the embodiments of the present disclosure include at least: by using the above-mentioned first bending portion 512 and/or the second bending portion 534, the intermediate chip has a certain release margin during thermal expansion, and the use of The flexibility of the release margin of the intermediate chip can reduce the possibility of damage to the intermediate chip and products using the intermediate chip during thermal expansion, improve product reliability, and facilitate the discharge of flue gas condensed corrosive liquid to avoid corrosion problems.
可选地,本公开实施例所提供的芯片组件500,包括翅片520,气口有 两个,其中一个气口为进气口、另一个气口为出气口,翅片520安装在烟气流道700内,翅片520具有直齿部521,直齿部521的位置与进气口的位置对应。可选地,翅片520还具有换热部;换热部包括波纹、错齿或平直翅片结构中任意一个。翅片520采用了直齿部521弱化了进气口处的换热能力,并以降低了进气口处的壁面温度从而降低热应力减少热疲劳失效风险,同时可以起到加强冷却液流道一侧的耐压能力;翅片520除直齿部521之外还包括换热部,其中,换热部和直齿部521共同形成翅片520整体;翅片520的其余部分选用换热部,换热部可以采用换热能力更强的结构,如波纹、错齿或齿距更小的平直翅片结构,配置成提高换热能力,使得产品更为紧凑;其中,翅片520可以采用分体形式,或者也可以做成整张。Optionally, the chip assembly 500 provided by the embodiment of the present disclosure includes a fin 520, and there are two air ports, one of which is an air inlet and the other is an air outlet, and the fin 520 is installed in the flue gas flow channel 700 Inside, the fin 520 has a straight tooth portion 521, and the position of the straight tooth portion 521 corresponds to the position of the air inlet. Optionally, the fin 520 further has a heat exchange part; the heat exchange part includes any one of corrugated, staggered teeth or flat fin structures. The fin 520 adopts a straight tooth part 521 to weaken the heat exchange capacity at the air inlet, and reduce the wall temperature at the air inlet to reduce thermal stress, reduce the risk of thermal fatigue failure, and strengthen the coolant flow path. The pressure resistance capacity of one side; the fin 520 includes a heat exchange part in addition to the straight tooth part 521, wherein the heat exchange part and the straight tooth part 521 together form the fin 520 as a whole; the rest of the fin 520 uses a heat exchange part , The heat exchange part can adopt a structure with stronger heat exchange capacity, such as corrugated, staggered teeth or a flat fin structure with a smaller tooth pitch, which is configured to improve the heat exchange capacity and make the product more compact; among them, the fin 520 can It can be split, or it can be made as a whole.
本公开实施例还提供一种烟气热交换器,包括覆盖件和连接于覆盖件的芯片单元,芯片单元包括至少一个上述本公开实施例所提供的芯片组件500,覆盖件与芯片单元的外壁之间形成第一液体流道600。The embodiment of the present disclosure further provides a flue gas heat exchanger, which includes a cover and a chip unit connected to the cover. The chip unit includes at least one chip assembly 500 provided in the above embodiment of the present disclosure, the cover and the outer wall of the chip unit A first liquid flow channel 600 is formed therebetween.
需要说明的是,本公开所提供的烟气热交换器,采用了本公开所提供的芯片组件500,其自身内部即形成密闭的烟气流道700,而非如传统的烟气热交换器需采用气室及主板连接芯体以形成密闭的烟气流道700,因此,减少了制造烟气热交换器所需要零件的种类,降低了装配难度,使烟气热交换器更适于批量生产;且,由于本公开实施例实施例所提供的烟气热交换器去掉了室体和主板等结构,进一步降低了烟气热交换器的生产成本。在覆盖件上形成有与第一液体流道600连通的进液口和出液口。It should be noted that the flue gas heat exchanger provided by the present disclosure adopts the chip assembly 500 provided by the present disclosure, and a closed flue gas flow channel 700 is formed inside itself, instead of a traditional flue gas heat exchanger. The air chamber and the main board are needed to connect the core to form a closed flue gas flow channel 700. Therefore, the types of parts required for manufacturing the flue gas heat exchanger are reduced, the assembly difficulty is reduced, and the flue gas heat exchanger is more suitable for batches. Production; And, because the flue gas heat exchanger provided by the embodiments of the present disclosure removes the structure such as the chamber body and the main board, the production cost of the flue gas heat exchanger is further reduced. A liquid inlet and a liquid outlet communicating with the first liquid flow channel 600 are formed on the cover.
可选地,在芯片组件500上形成有在第一方向上贯穿芯片组件500的液体通道800,液体通道800与第一液体流道600连通,且液体通道800与烟气流道700之间密封隔离。通过液体通道800使芯片单元内以及芯片单元周围的液体流道连通为一体,使烟气流道700被液体流道包覆,提高换 热效率及换热性能,同时降低烟气通道壁面温度,提高了产品可靠性。Optionally, a liquid channel 800 penetrating the chip assembly 500 in the first direction is formed on the chip assembly 500, the liquid channel 800 is in communication with the first liquid flow channel 600, and the liquid channel 800 and the flue gas flow channel 700 are sealed isolation. The liquid channel in the chip unit and the liquid channel around the chip unit are connected as a whole through the liquid channel 800, so that the flue gas channel 700 is covered by the liquid channel, which improves the heat exchange efficiency and heat exchange performance, and reduces the wall temperature of the flue gas channel. Improve product reliability.
可选地,液体通道800包括形成于第一中间芯片530的第一筒部533和形成于第二中间芯片510的第二筒部511,第一筒部533与第二筒部511插接。通过插接的形式连接第一筒部533和第二筒部511,并形成液体通道800,实现了安装简便,提高生产效率,降低成本的技术效果,使烟气热交换器更加适用于批量生产。Optionally, the liquid channel 800 includes a first cylindrical portion 533 formed on the first intermediate chip 530 and a second cylindrical portion 511 formed on the second intermediate chip 510, and the first cylindrical portion 533 is inserted into the second cylindrical portion 511. The first cylindrical part 533 and the second cylindrical part 511 are connected by plug-in form, and the liquid channel 800 is formed, which realizes the technical effects of simple installation, improved production efficiency, and reduced cost, making the flue gas heat exchanger more suitable for mass production .
可选地,芯片单元包括至少两个在第一方向上叠置的芯片组件500,相邻芯片组件500之间形成第二液体流道900,第一液体流道600与第二液体流道900之间连通。通过采用多个芯片组件500能够提高烟气热交换器的换热性能。Optionally, the chip unit includes at least two chip assemblies 500 stacked in a first direction, a second liquid flow channel 900 is formed between adjacent chip assemblies 500, the first liquid flow channel 600 and the second liquid flow channel 900 Connected between. The use of multiple chip assemblies 500 can improve the heat exchange performance of the flue gas heat exchanger.
可选地,第一中间芯片530和第二中间芯片510上均形成有气口;在第一中间芯片530上形成的气口为第一气口,在第一方向上第一气口形成向烟气流道700的外侧凸出的凸起;在第二中间芯片510上形成的气口为第二气口,在第一方向上第二气口形成向烟气流道700的内侧凸出的凸起;相邻的两个芯片组件500之间,其中一个芯片组件500的第一气口与另一个芯片第二气口之间插接且密封。在装配的过程中,通过各芯片组件500之间第一气口和第二气口的插接配合,能够实现各芯片组件500的烟气流道700之间的连通,提高了装配效率,且各芯片组件之间第一气口和第二气口的插接配合能够对芯片单元之间的装配还能够起到定位作用,提高了装配精度,使烟气热交换器更加适用于批量生产。第一气口和第二气口可以均为进气口或均为出气口。Optionally, both the first intermediate chip 530 and the second intermediate chip 510 are formed with air ports; the air port formed on the first intermediate chip 530 is a first air port, and the first air port forms a flue gas flow path in the first direction A protruding protrusion on the outside of 700; the air port formed on the second intermediate chip 510 is a second air port, and in the first direction, the second air port forms a protrusion protruding to the inner side of the flue gas flow channel 700; adjacent Between the two chip assemblies 500, the first air port of one chip assembly 500 and the second air port of the other chip are inserted and sealed. During the assembly process, through the mating of the first air port and the second air port between the chip assemblies 500, the communication between the flue gas channels 700 of each chip assembly 500 can be realized, and the assembly efficiency is improved. The plug-in cooperation of the first air port and the second air port between the components can also play a role in positioning the assembly between the chip units, improve the assembly accuracy, and make the flue gas heat exchanger more suitable for mass production. The first air port and the second air port may both be air inlets or both air outlets.
可选地,覆盖件包括第一盖板300,第一盖板300配置成与在第一方向上位于芯片单元最外侧的第一中间芯片530配合,在第一盖板300上形成有第三气口,该位于芯片单元最外侧的第一中间芯片530的第一气口与第 三气口插接且密封。通过第三气口与第一气口之间的连接实现各芯片组件500内烟气流道700与烟气管道连接,同时,第一气口与第三气口之间的插接简单方便,提高了生产效率,降低了生产成本,使烟气热交换器更适配置成批量生产。第一气口为进气口时,第三气口相应的为进气口,第一气口为出气口时,第三气口相应的为出气口。Optionally, the cover includes a first cover 300, the first cover 300 is configured to cooperate with the first intermediate chip 530 located at the outermost side of the chip unit in the first direction, and a third cover 300 is formed on the first cover 300. The air port, the first air port of the first intermediate chip 530 located at the outermost side of the chip unit and the third air port are inserted and sealed. Through the connection between the third air port and the first air port, the flue gas flow channel 700 in each chip assembly 500 is connected with the flue gas pipe. At the same time, the insertion between the first air port and the third air port is simple and convenient, which improves the production efficiency , Which reduces the production cost and makes the flue gas heat exchanger more suitable for mass production. When the first air port is an air inlet, the third air port is correspondingly an air inlet, and when the first air port is an air outlet, the third air port is correspondingly an air outlet.
可选地,第三气口沿着第一盖板300在第二方向的延伸方向设置有多个。可选地,第一中间芯片530的第一气口的数量与第三气口的数量一一对应,每一个第三气口均对应与第一中间芯片530的第一气口插接且密封,配置成任意相邻的两个第三气口之间形成第二液体流道900。利用多个第一气口与多个第三气口之间形成多个第二液体流道900,能够更好的实现各芯片组件内烟气流道700与烟气管道连接,利用多条第二液体流道900和液体通道800使芯片单元内以及芯片单元周围的液体流道连通为一体,使烟气流道700被第二液体流道900包覆,提高换热效率及换热性能。Optionally, a plurality of third air ports are provided along the extending direction of the first cover plate 300 in the second direction. Optionally, the number of the first air ports of the first intermediate chip 530 corresponds to the number of the third air ports one-to-one, and each third air port is correspondingly plugged and sealed with the first air port of the first intermediate chip 530, and the configuration is arbitrary A second liquid flow channel 900 is formed between two adjacent third gas ports. Using multiple first gas ports and multiple third gas ports to form multiple second liquid flow passages 900 can better realize the connection between the flue gas flow channels 700 in each chip assembly and the flue gas pipes, and use multiple second liquid flow channels. The flow channel 900 and the liquid channel 800 connect the liquid flow channels in the chip unit and around the chip unit as a whole, so that the flue gas flow channel 700 is covered by the second liquid flow channel 900, which improves heat exchange efficiency and heat exchange performance.
需要说明的是,如图2所示,第一方向为沿着烟气热交换器的竖直布置方向,第二方向为沿着烟气热交换器的水平布置方向;换句话说,第一方向为烟气热交换器的叠加方式,第二方向为第一盖板300的水平延伸方向。It should be noted that, as shown in Figure 2, the first direction is along the vertical arrangement direction of the flue gas heat exchanger, and the second direction is along the horizontal arrangement direction of the flue gas heat exchanger; in other words, the first direction is the vertical arrangement direction of the flue gas heat exchanger. The direction is the stacking method of the flue gas heat exchanger, and the second direction is the horizontal extension direction of the first cover plate 300.
可选地,第一中间芯片530具有月牙翻边,月牙翻边形成于第一气口的边缘处,月牙翻边向远离第一盖板300的方向倾斜延伸。Optionally, the first middle chip 530 has a crescent flanging formed at the edge of the first air port, and the crescent flanging extends obliquely in a direction away from the first cover plate 300.
可选地,配底芯片的月牙翻边为第一月牙翻边532,除配底芯片以外的其他第一中间芯片530的月牙翻边为第二月牙翻边531,第一月牙翻边532的面积小于第二月牙翻边531的面积,且第一月牙翻边532与配底芯片之间的角度大于第二月牙翻边531与第一中间芯片530之间的角度。Optionally, the crescent flanging of the bottom matching chip is the first crescent flanging 532, the crescent flanging of the first intermediate chip 530 except the bottom matching chip is the second crescent flanging 531, and the crescent flanging of the first crescent flanging 532 The area is smaller than the area of the second crescent flange 531, and the angle between the first crescent flange 532 and the bottom chip is greater than the angle between the second crescent flange 531 and the first middle chip 530.
本实施例提供的技术方案的有益效果至少包括:通过月牙翻边引导烟 气气流,使得烟气气流分配均匀,避免了温度场差异较大时会产生较大的热应力。The beneficial effects of the technical solution provided in this embodiment at least include: guiding the flue gas flow through the crescent flanges, so that the flue gas flow is evenly distributed, and avoiding large thermal stresses when the temperature field difference is large.
可选地,覆盖件包括第二盖板100,第二盖板100配置成与在第一方向上位于芯片单元最外侧的第二中间芯片510配合,在第二盖板100上形成有气口封堵部110,在第一方向上气口封堵部110为向芯片单元伸出的凸起,该位于芯片单元最外侧的第二中间芯片510的第二气口与气口封堵部110插接且密封。在第二盖板100处,通过气口封堵部110与第二气口配合通过插接实现气口封堵部110与第二气口配合简单方便,提高了生产效率,降低了生产成本,使烟气热交换器更适配置成批量生产。在第一盖板300的进气口及进液口处,安装有流体入口法兰200,在第一盖板300的出气口和出液口处,安装有流体出口法兰400。Optionally, the cover includes a second cover plate 100 configured to cooperate with the second intermediate chip 510 located at the outermost side of the chip unit in the first direction, and an air port seal is formed on the second cover plate 100 The plugging portion 110, in the first direction, the port plugging portion 110 is a protrusion extending toward the chip unit, and the second port of the second intermediate chip 510 located at the outermost side of the chip unit is inserted and sealed with the port plugging portion 110 . At the second cover plate 100, the air port blocking part 110 cooperates with the second air port through plug-in connection to realize the simple and convenient cooperation between the air port blocking part 110 and the second air port, which improves the production efficiency, reduces the production cost, and makes the flue gas hot. The switch is more suitable for mass production. A fluid inlet flange 200 is installed at the air inlet and liquid inlet of the first cover plate 300, and a fluid outlet flange 400 is installed at the air outlet and liquid outlet of the first cover plate 300.
可选地,气口封堵部110沿着第二盖板100在第二方向的延伸方向设置有多个。可选地,第二中间芯片510的第二气口的数量与气口封堵部110的数量一一对应,每一个气口封堵部110均对应与第二中间芯片510的第二气口插接且密封,配置成任意相邻的两个气口封堵部110之间形成第一液体流道600。利用多个气口封堵部110与第二气口之间形成多个第一液体流道600,能够更好的实现各芯片组件内烟气流道700与烟气管道连接,利用多条第一液体流道600和液体通道800使芯片单元内以及芯片单元周围的液体流道连通为一体,使烟气流道700被第一液体流道600包覆,提高换热效率及换热性能。Optionally, a plurality of air port blocking parts 110 are provided along the extending direction of the second cover plate 100 in the second direction. Optionally, the number of the second air ports of the second intermediate chip 510 corresponds to the number of the air port blocking parts 110 one-to-one, and each of the air port blocking parts 110 corresponds to the second air port of the second intermediate chip 510 and is plugged and sealed. , The first liquid flow channel 600 is formed between any two adjacent air port blocking parts 110. The multiple first liquid flow channels 600 are formed between the multiple air port blocking parts 110 and the second air ports, which can better realize the connection of the flue gas flow channels 700 and the flue gas pipes in each chip assembly, and use multiple first liquid The flow channel 600 and the liquid channel 800 connect the liquid flow channels in the chip unit and around the chip unit as a whole, so that the flue gas flow channel 700 is covered by the first liquid flow channel 600 to improve heat exchange efficiency and heat exchange performance.
最后应说明的是:以上各实施例仅用以说明本公开的技术方案,而非对其限制;尽管参照前述各实施例对本公开进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或 者替换,并不使相应技术方案的本质脱离本公开各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, not to limit it; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present disclosure. Scope.
工业实用性Industrial applicability
本公开实施例提供的一种芯片组件及烟气热交换器,利用芯片组件自身内部即形成密闭的烟气流道,减少了制造烟气热交换,降低了装配难度,使烟气热交换器更适于批量生产。The chip assembly and the flue gas heat exchanger provided by the embodiments of the present disclosure utilize the inside of the chip assembly itself to form a closed flue gas flow channel, which reduces the heat exchange of the manufacturing flue gas, reduces the assembly difficulty, and makes the flue gas heat exchanger More suitable for mass production.

Claims (20)

  1. 一种芯片组件,其特征在于,包括在第一方向上叠置的第一中间芯片和第二中间芯片,在所述第一中间芯片与所述第二中间芯片之间形成有烟气流道,所述烟气流道为密闭结构,且所述烟气流道具有配置成与烟气管道连通的气口。A chip assembly, characterized by comprising a first intermediate chip and a second intermediate chip stacked in a first direction, and a flue gas flow channel is formed between the first intermediate chip and the second intermediate chip The flue gas channel is a closed structure, and the flue gas channel has an air port configured to communicate with the flue gas pipe.
  2. 根据权利要求1所述的芯片组件,其特征在于,所述第一中间芯片的边缘形成第一翻边,所述第二中间芯片的边缘形成第二翻边,所述第一翻边与所述第二翻边搭接以形成密闭的所述烟气流道。The chip assembly according to claim 1, wherein the edge of the first intermediate chip forms a first flanging, the edge of the second intermediate chip forms a second flanging, and the first flanging is connected to the second flanging. The second flange is overlapped to form the airtight flue gas flow channel.
  3. 根据权利要求2所述的芯片组件,其特征在于,所述第一中间芯片还包括第一主体和第一弯折部,所述第一弯折部位于所述第一主体与所述第一翻边之间以连接所述第一主体和所述第一翻边,所述第一弯折部向所述烟气流道方向凸出;和/或,The chip assembly according to claim 2, wherein the first intermediate chip further comprises a first body and a first bending portion, and the first bending portion is located between the first body and the first bending portion. Between the flanges to connect the first body and the first flange, the first bending portion protrudes toward the flue gas flow channel; and/or,
    所述第二中间芯片还包括第二主体和第二弯折部,所述第二弯折部位于所述第二主体与所述第二翻边之间以连接所述第二主体和所述第二翻边,所述第二弯折部向所述烟气流道方向凸出。The second intermediate chip further includes a second body and a second bending portion, and the second bending portion is located between the second body and the second flange to connect the second body and the second flange. The second flanging, the second bending part protrudes in the direction of the flue gas flow channel.
  4. 根据权利要求1-3中任意一项所述的芯片组件,其特征在于,所述第一中间芯片和第二中间芯片均采用冲压成型。The chip assembly according to any one of claims 1 to 3, wherein the first intermediate chip and the second intermediate chip are both stamped and formed.
  5. 根据权利要求1-4中任意一项所述的芯片组件,其特征在于,包括翅片,所述气口有两个,其中一个所述气口为进气口、另一个所述气口为出气口,所述翅片安装在所述烟气流道内,所述翅片具有直齿部,所述直齿部的位置与所述进气口的位置对应。The chip assembly according to any one of claims 1 to 4, which comprises a fin, and there are two air ports, one of the air ports is an air inlet, and the other is an air outlet, The fin is installed in the flue gas flow channel, and the fin has a straight tooth part, and the position of the straight tooth part corresponds to the position of the air inlet.
  6. 一种烟气热交换器,其特征在于,包括覆盖件和连接于所述覆盖件的芯片单元,所述芯片单元包括至少一个如权利要求1-5中任意一项所述的芯片组件,所述覆盖件与所述芯片单元的外壁之间形成第一液体流道。A flue gas heat exchanger, characterized by comprising a cover and a chip unit connected to the cover, the chip unit comprising at least one chip assembly according to any one of claims 1-5, and A first liquid flow channel is formed between the cover and the outer wall of the chip unit.
  7. 根据权利要求6所述的烟气热交换器,其特征在于,在所述芯片组件上形成有在第一方向上贯穿所述芯片组件的液体通道,所述液体通道与所述第一液体流道连通,且所述液体通道与所述烟气流道之间密封隔离。The flue gas heat exchanger according to claim 6, wherein a liquid channel penetrating the chip assembly in a first direction is formed on the chip assembly, and the liquid channel and the first liquid flow The channels are connected, and the liquid channel and the flue gas flow channel are sealed and isolated.
  8. 根据权利要求7所述的烟气热交换器,其特征在于,所述液体通道包括形成于所述第一中间芯片的第一筒部和形成于第二中间芯片的第二筒部,所述第一筒部与所述第二筒部插接。The flue gas heat exchanger according to claim 7, wherein the liquid channel includes a first cylindrical portion formed on the first intermediate chip and a second cylindrical portion formed on the second intermediate chip, the The first cylinder part is plugged into the second cylinder part.
  9. 根据权利要求6-8中任意一项所述的烟气热交换器,其特征在于,所述芯片单元包括至少两个在第一方向上叠置的所述芯片组件,相邻所述芯片组件之间形成第二液体流道,所述第一液体流道与所述第二液体流道之间连通。The flue gas heat exchanger according to any one of claims 6-8, wherein the chip unit includes at least two of the chip components stacked in a first direction, and the chip components are adjacent to each other. A second liquid flow path is formed therebetween, and the first liquid flow path is communicated with the second liquid flow path.
  10. 根据权利要求9所述的烟气热交换器,其特征在于,所述第一中间芯片和所述第二中间芯片上均形成有所述气口;在所述第一中间芯片上形成的气口为第一气口,在第一方向上所述第一气口形成向所述烟气流道的外侧凸出的凸起;在所述第二中间芯片上形成的气口为第二气口,在第一方向上所述第二气口形成向所述烟气流道的内侧凸出的凸起;相邻的两个所述芯片组件之间,其中一个所述芯片组件的第一气口与另一个芯片所述第二气口之间插接且密封。The flue gas heat exchanger according to claim 9, wherein the air ports are formed on both the first intermediate chip and the second intermediate chip; the air ports formed on the first intermediate chip are The first air port, in the first direction, the first air port forms a protrusion protruding to the outside of the flue gas flow channel; the air port formed on the second intermediate chip is the second air port, The upward second air port forms a protrusion protruding to the inside of the flue gas flow channel; between two adjacent chip assemblies, the first air port of one of the chip assemblies is connected to the other chip assembly. The second air ports are inserted and sealed.
  11. 根据权利要求10所述的烟气热交换器,其特征在于,所述第一气口和所述第二气口为均为进气口或均为出气口。The flue gas heat exchanger according to claim 10, wherein the first air port and the second air port are both air inlets or both air outlets.
  12. 根据权利要求10或11所述的烟气热交换器,其特征在于,所述覆盖件包括第一盖板,在第一方向上位于所述芯片单元最外侧的第一中间芯片为配底芯片,所述第一盖板与所述配底芯片配合,在所述第一盖板上形成有第三气口,该配底芯片的第一气口与所述第三气口插接且密封。The flue gas heat exchanger according to claim 10 or 11, wherein the cover includes a first cover plate, and the first intermediate chip located at the outermost side of the chip unit in the first direction is a bottom chip The first cover plate is matched with the bottom matching chip, a third air port is formed on the first cover plate, and the first air port of the bottom matching chip is plugged and sealed with the third air port.
  13. 根据权利要求12所述的烟气热交换器,其特征在于,所述第一中 间芯片具有月牙翻边,所述月牙翻边形成于第一气口的边缘处,所述月牙翻边向远离所述第一盖板的方向倾斜延伸。The flue gas heat exchanger according to claim 12, wherein the first middle chip has a crescent flanging formed at the edge of the first air port, and the crescent flanging is directed away from the first air port. The direction of the first cover plate extends obliquely.
  14. 根据权利要求13所述的烟气热交换器,其特征在于,所述配底芯片的月牙翻边为第一月牙翻边,除所述配底芯片以外的其他第一中间芯片的月牙翻边为第二月牙翻边,所述第一月牙翻边的面积小于第二月牙翻边的面积,且所述第一月牙翻边与所述配底芯片之间的角度大于所述第二月牙翻边与第一中间芯片之间的角度。The flue gas heat exchanger according to claim 13, wherein the crescent flanging of the bottom matching chip is a first crescent flanging, and the crescent flanging of the first intermediate chip except the bottom matching chip Is a second crescent flanging, the area of the first crescent flanging is smaller than the area of the second crescent flanging, and the angle between the first crescent flanging and the bottoming chip is greater than that of the second crescent flanging The angle between the edge and the first middle chip.
  15. 根据权利要求12-14中任意一项所述的烟气热交换器,其特征在于,所述第三气口沿着所述第一盖板在第二方向的延伸方向设置有多个。The flue gas heat exchanger according to any one of claims 12-14, wherein a plurality of the third air ports are provided along the extending direction of the first cover plate in the second direction.
  16. 根据权利要求15所述的烟气热交换器,其特征在于,所述第一中间芯片的第一气口的数量与所述第三气口的数量一一对应,每一个所述第三气口均对应与所述第一中间芯片的第一气口插接且密封,配置成任意相邻的两个所述第三气口之间形成所述第二液体流道。The flue gas heat exchanger according to claim 15, wherein the number of the first air ports of the first intermediate chip corresponds to the number of the third air ports one-to-one, and each of the third air ports corresponds to It is plugged and sealed with the first gas port of the first intermediate chip, and is configured such that the second liquid flow channel is formed between any two adjacent third gas ports.
  17. 根据权利要求12-16中任意一项所述的烟气热交换器,其特征在于,还包括流体入口法兰和流体出口法兰;The flue gas heat exchanger according to any one of claims 12-16, further comprising a fluid inlet flange and a fluid outlet flange;
    所述流体入口法兰安装于所述第一盖板的进气口及进液口处,所述流体出口法兰安装于第一盖板的出气口和出液口处。The fluid inlet flange is installed at the air inlet and the liquid inlet of the first cover plate, and the fluid outlet flange is installed at the air outlet and the liquid outlet of the first cover plate.
  18. 根据权利要求10-17中任意一项所述的烟气热交换器,其特征在于,所述覆盖件包括第二盖板,所述第二盖板配置成与在第一方向上位于所述芯片单元最外侧的第二中间芯片配合,在所述第二盖板上形成有气口封堵部,在第一方向上所述气口封堵部为向所述芯片单元伸出的凸起,该位于所述芯片单元最外侧的第二中间芯片的第二气口与所述气口封堵部插接且密封。The flue gas heat exchanger according to any one of claims 10-17, wherein the cover comprises a second cover plate, and the second cover plate is configured to be located in the first direction from the The outermost second middle chip of the chip unit is matched, and an air port blocking portion is formed on the second cover plate. In the first direction, the air port blocking portion is a protrusion extending toward the chip unit. The second air port of the second intermediate chip located at the outermost side of the chip unit is inserted and sealed with the air port blocking part.
  19. 根据权利要求18所述的烟气热交换器,其特征在于,所述气口封 堵部沿着所述第二盖板在第二方向的延伸方向设置有多个。The flue gas heat exchanger according to claim 18, wherein the air port blocking portion is provided in plurality along the extending direction of the second cover plate in the second direction.
  20. 根据权利要求19所述的烟气热交换器,其特征在于,所述第二中间芯片的第二气口的数量与所述气口封堵部的数量一一对应,每一个所述气口封堵部均对应与所述第二中间芯片的第二气口插接且密封,配置成任意相邻的两个所述气口封堵部之间形成所述第一液体流道。The flue gas heat exchanger according to claim 19, wherein the number of the second air ports of the second intermediate chip corresponds to the number of the air port blocking parts one-to-one, and each of the air port blocking parts They are all correspondingly inserted and sealed with the second air port of the second intermediate chip, and are arranged such that the first liquid flow channel is formed between any two adjacent air port blocking parts.
PCT/CN2020/082173 2020-03-12 2020-03-30 Chip assembly and flue gas heat exchanger WO2021179360A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000310497A (en) * 1999-04-27 2000-11-07 Toyo Radiator Co Ltd Cut plate type heat exchanger for high temperature gas and manufacture thereof
JP2001355978A (en) * 2000-06-12 2001-12-26 Toyo Radiator Co Ltd Gas cooling laminated heat exchanger
CN101358771A (en) * 2008-09-08 2009-02-04 中山华帝燃具股份有限公司 Plate heat exchanger for condensing gas water heater
CN104061809A (en) * 2013-03-19 2014-09-24 德尔福技术有限公司 Heat exchanger
US20150276320A1 (en) * 2014-03-25 2015-10-01 Modine Manufacturing Company Heat recovery system having a plate heat exchanger
CN211782936U (en) * 2020-03-12 2020-10-27 浙江银轮机械股份有限公司 Chip assembly and flue gas heat exchanger

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105651084B (en) * 2016-01-13 2018-01-26 宁波市哈雷换热设备有限公司 Heat-exchangers of the plate type
CN205690942U (en) * 2016-06-08 2016-11-16 上海加冷松芝汽车空调股份有限公司 A kind of stacking brazing plate type heat exchanger
CN110375573A (en) * 2019-08-07 2019-10-25 浙江银轮机械股份有限公司 Chip assembly and cooler

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000310497A (en) * 1999-04-27 2000-11-07 Toyo Radiator Co Ltd Cut plate type heat exchanger for high temperature gas and manufacture thereof
JP2001355978A (en) * 2000-06-12 2001-12-26 Toyo Radiator Co Ltd Gas cooling laminated heat exchanger
CN101358771A (en) * 2008-09-08 2009-02-04 中山华帝燃具股份有限公司 Plate heat exchanger for condensing gas water heater
CN104061809A (en) * 2013-03-19 2014-09-24 德尔福技术有限公司 Heat exchanger
US20150276320A1 (en) * 2014-03-25 2015-10-01 Modine Manufacturing Company Heat recovery system having a plate heat exchanger
CN211782936U (en) * 2020-03-12 2020-10-27 浙江银轮机械股份有限公司 Chip assembly and flue gas heat exchanger

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