CN110375573A - Chip assembly and cooler - Google Patents
Chip assembly and cooler Download PDFInfo
- Publication number
- CN110375573A CN110375573A CN201910724937.6A CN201910724937A CN110375573A CN 110375573 A CN110375573 A CN 110375573A CN 201910724937 A CN201910724937 A CN 201910724937A CN 110375573 A CN110375573 A CN 110375573A
- Authority
- CN
- China
- Prior art keywords
- chip
- flange
- hole
- connecting hole
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
- F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/083—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning capable of being taken apart
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The present invention relates to heat exchange equipment technology, in particular to a kind of chip assembly and cooler.The chip assembly, including the first chip and the second chip being oppositely arranged；First chip is fixedly connected with the second chip, and forms cavity between the first chip and the second chip；Including the fin being arranged in cavity, fin fills up cavity.Fin is full of entire cavity, and heat exchange medium can flow in entire cavity, makes full use of to realize to cavity, reduces the loss of effective heat exchange area, increase effective heat exchange area, to improve heat exchanger effectiveness.Moreover, fin keeps the assembling process of chip assembly simple full of entire cavity so as to reduce the component being arranged in cavity, to improve production efficiency, production cost is reduced.It can be avoided setting chip cushion block, to avoid the weight for avoiding setting chip cushion block to lead to oil cooler since there are differences in height to lead to failure welding between chip cushion block and fin.
Description
Technical field
The present invention relates to heat exchange equipment technology, in particular to a kind of chip assembly and cooler.
Background technique
Currently, as depicted in figs. 1 and 2, oil cooler is connected and composed by multiple chip assemblies stacking, chip assembly includes the
One chip 01, the second chip 02, fin 03 and two chip cushion blocks 04.02 peripheral flanging of first chip 01 and the second chip, into
Row closes inserting and seals, and fin 03 and two chip cushion blocks 04 are folded between the first chip 01 and the second chip 02, and along core
The length direction of piece, two chip cushion blocks 04 are separately positioned on the both ends of the fin.
The chip assembly of this structure the problem is that, the effective heat exchange area loss of cooler is larger.
Summary of the invention
The purpose of the present invention is to provide a kind of chip assembly and coolers, to solve having for cooler in the prior art
Effect heat exchange area loses larger technical problem.
The present invention provides a kind of chip assembly, including the first chip and the second chip being oppositely arranged；First chip
It is fixedly connected with second chip, and forms cavity between first chip and second chip；
Including the fin being arranged in the cavity, the fin fills up the cavity.
Further, first chip is equipped with the first connecting hole, and second chip is equipped with the second connecting hole, institute
Fin is stated equipped with intermediate connecting hole, and first connecting hole, the intermediate connecting hole and second connecting hole are mutually right
It should be arranged；
The edge flange of at least one of both first connecting hole and second connecting hole is arranged, it is described at least
The flange of one is plugged in the intermediate connecting hole and is connected and fixed with the edge with the other of described the two.
Further, the equal flange setting in the edge of the edge of first connecting hole and second connecting hole, two institutes
It states flange to be plugged in the intermediate connecting hole, two flange are connected and fixed.
Further, one in two flange be set in two flange another outside.
Further, two flanging weldeds are fixed.
The present invention also provides a kind of cooler, including said chip component, multiple chip assemblies are along predetermined direction heap
Folded setting.
Further, first medium recirculation hole on first chip is respectively equipped with second medium on second chip
Recirculation hole, the first medium recirculation hole are correspondingly arranged with the second medium recirculation hole；
The edge of first medium recirculation hole and second medium recirculation hole is arranged to the direction flange far from the cavity, phase
In adjacent two chip assemblies, the flange of the first medium recirculation hole in a chip assembly is set in another
The flange of the second medium recirculation hole of the chip assembly is connected and fixed.
Further, the fin is equipped with intermediate medium recirculation hole, and the intermediate medium recirculation hole and described first are situated between
Mass flow through-hole and second medium recirculation hole are corresponding.
Further, cooler further includes the spacer ring being arranged in a ring, and two adjacent cores are arranged in the spacer ring
Between piece component, the spacer ring is set in outside the flange of first medium recirculation hole and the flange of the second medium recirculation hole.
Further, cooler further includes backing plate, and the bottom in multiple chip assemblies, institute is arranged in the backing plate
It states backing plate and is equipped with annular groove, the flange and second medium stream of the first medium recirculation hole in the chip assembly of the bottom
One of both flange of through-hole plug in the groove.
The present invention provides a kind of chip assembly, including the first chip and the second chip being oppositely arranged；First chip and
Two chips are fixedly connected, and form cavity between the first chip and the second chip；Including the fin being arranged in cavity, fin is filled out
Full cavity.
Fin is full of entire cavity, and heat exchange medium can flow in entire cavity, to realize to the abundant of cavity
It utilizes, reduces the loss of effective heat exchange area, increase effective heat exchange area, to improve heat exchanger effectiveness.Moreover, wing
Piece keeps the assembling process of chip assembly simple full of entire cavity so as to reduce the component being arranged in cavity, to mention
High efficiency reduces production cost.It can be avoided setting chip cushion block, to avoid due to depositing between chip cushion block and fin
Lead to failure welding in difference in height, setting chip cushion block is avoided to lead to the weight for increasing oil cooler.
Detailed description of the invention
The attached drawing for constituting a part of the invention is used to provide further understanding of the present invention, schematic reality of the invention
It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structure type of cooler in the related technology；
Fig. 2 is the structure type of the chip assembly in cooler shown in FIG. 1；
Fig. 3 is the explosive view of chip assembly according to an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of cooler according to an embodiment of the invention；
Fig. 5 is the structural schematic diagram of cooler according to another embodiment of the present invention；
Fig. 6 is the structural schematic diagram of cushion block in cooler shown in fig. 5.
In figure: the first chip of 1-；The second chip of 2-；3- fin；The first connecting hole of 4-；The second connecting hole of 5-；6-
Intermediate connecting hole；The first flange of 7-；8- first medium recirculation hole；9- second medium recirculation hole；The circulation of 10- intermediate medium
Hole；The second flange of 11-；12- chip assembly；13- spacer ring；14- backing plate；15- groove.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in figure 3, the present invention, which provides a kind of present invention, provides a kind of chip assembly, including the first chip being oppositely arranged
1 and second chip 2；First chip 1 is fixedly connected with the second chip 2, and forms cavity between the first chip 1 and the second chip 2；
Including the fin 3 being arranged in cavity, fin 3 fills up cavity.
In the present embodiment, fin 3 is full of entire cavity, and heat exchange medium can flow in entire cavity, to realize
Cavity is made full use of, the loss of effective heat exchange area is reduced, increases effective heat exchange area, to improve heat exchange
Efficiency.Moreover, fin 3 makes the assembly of chip assembly full of entire cavity so as to reduce the component being arranged in cavity
Journey is simple, to improve production efficiency, reduces production cost.It can be avoided setting chip cushion block, to avoid due to chip mat
There are differences in height to lead to failure welding between block and fin 3, and setting chip cushion block is avoided to lead to the weight of oil cooler.
Wherein, the structure type of the first chip 1 and the second chip 2 being connected and fixed can be a variety of, such as in the first core
Side frame is set between piece 1 and the second chip 2, and one end of side frame and the surrounding edge of the first chip 1 are connected and fixed, the other end
Be connected and fixed with the surrounding edge of the second chip 2, to form cavity, cavity it is sealed around.
Alternatively, the surrounding of the first chip 1 and the surrounding of the second chip 2 are turned over towards the inside of cavity
Side, the flanging welded of the flange of the first chip 1 and the second chip 2, to form cavity, components type is few, and the processing is simple.
As shown in figure 3, further, the first chip 1 is equipped with the first connecting hole 4 on above-described embodiment basis, the
Two chips 2 are equipped with the second connecting hole 5, and fin 3 is equipped with intermediate connecting hole 6, and the first connecting hole 4, intermediate connecting hole 6 and the
Two connecting holes 5 correspond to each other setting；The edge flange setting of at least one of both first connecting hole 4 and the second connecting hole 5,
The flange of at least one is plugged in intermediate connecting hole 6 and is connected and fixed with the edge with the other of the two.
In the present embodiment, the connecting hole for wearing bolt is respectively provided on the first chip 1, the second chip 2 and fin 3,
Specifically, the first connecting hole 4 is arranged in the first chip 1, is arranged on the second connecting hole 5 and fin 3 on the second chip 2 among being arranged
Connecting hole 6, then when multiple chip assemblies stack constitute cooler when, bolt may pass through multiple chip assemblies the first connecting hole 4,
Intermediate connecting hole 6 and the second connecting hole 5, so that cooler is installed on other component.
In the present embodiment, in order to be distinguish with flange hereinafter, the flange of connecting hole is defined as the first flange 7.It is logical
The first flange 7 is crossed to be fixedly connected across connecting hole with the edge of another connecting hole, on the one hand can be fixed to fin 3, make wing
Piece 3 keeps relatively fixed position in cavity；On the other hand it is capable of forming and the runner phase for flow of media in fin 3
The channel mutually separated, avoids medium from being revealed by connecting hole.
Wherein, can be arranged according to specific needs for wearing the quantity of the connecting hole of bolt, for example, as shown in Figure 3
Setting four, chip assembly are arranged in rectangle, and four connecting holes are arranged at four angles of chip assembly.
The edge flange setting of at least one of both first connecting hole 4 and the second connecting hole 5, can be, and first connects
The edge flange setting in hole 4 is connect, the first flange 7 of the first connecting hole 4 passes through the edge of intermediate connecting hole 6 and the second connecting hole 5
It is fixedly connected, thus, the first flange 7 of the first connecting hole 4 and the edge of the second connecting hole 5 are formed for wearing the logical of bolt
The runner for flow of media in road, the channel and fin 3 separates, and medium is avoided to be revealed by connecting hole.
It is also possible that the edge flange setting of the second connecting hole 5, the second flange 11 of the second connecting hole 5 connect across centre
Hole 6 is connect to be fixedly connected with the edge of the first connecting hole 4, thus, the first flange 7 of the second connecting hole 5 and the side of the first connecting hole 4
Edge forms the channel for wearing bolt, and the channel and fin 3 separate, and medium is avoided to be revealed by connecting hole.
Alternatively, as shown in figure 3, the equal flange in edge at the edge of the first connecting hole 4 and the second connecting hole 5
Setting, two flange are plugged in intermediate connecting hole 6, and two flange are connected and fixed.
In the present embodiment, the equal flange setting in the edge of the edge of the first connecting hole 4 and the second connecting hole 5, in particular, first connects
When the first flange 7 for connecing hole 4 is identical as the height of the first flange 7 of the second connecting hole 5, the first chip 1 and second can be realized
The structure of chip 2 is identical, in process of production, produce a kind of chip, two chip portfolios are formed a chip
Component keeps the type of chip few, facilitates processing.
Wherein, the first flange 7 of the first chip 1 and the first flange 7 of the second chip 2 can be mutually butted, and two first
The auxiliary section of flange 7 in a ring, is parallel to the plane at 3 place of fin.
Alternatively, one in two flange be set in two flange another outside, two flange
Inserting is closed.That is, the first flange 7 of the first connecting hole 4 is set in outside the first flange 7 of the second connecting hole 5 or the second connection
First flange 7 in hole 5 is set in outside the first flange 7 of the first connecting hole 4.The auxiliary section of two flange and putting down where fin 3
Face is vertically arranged, and this connection type connect the first flange 7 of the first connecting hole 4 with the first flange 7 of the second connecting hole 5
Stablize more reliable, sealing effect is more preferable.
Wherein it is possible to realize the connection of two flange by interference fit.
Alternatively, two flanging weldeds are fixed.Stable connection is reliable, first flange 7 can be omited
Micro- expansion, so as to be set in outside another first flange 7, coated with solder between two the first flange 7 is finally completed weldering
It connects.
As shown in figure 4, the present embodiment provides a kind of cooler, including multiple above-mentioned chip assemblies, multiple chip assemblies
It stacks and is arranged along predetermined direction.
Chip assembly 12 in cooler provided in this embodiment it is interior it is intracavitary be full of fin 3, effective heat exchange area is big, more
A chip assembly so 12 stacks, and increased effective heat exchange area is superimposed, thus cooler provided in this embodiment
Heat exchange efficiency is high.
As Fig. 3 and as shown in figure 4, above-described embodiment basis on, further, first medium stream on the first chip 1
Through-hole 8 is respectively equipped with second medium recirculation hole 9 on second chip 2, and first medium recirculation hole 8 is corresponding with second medium recirculation hole 9
Setting；The edge of first medium recirculation hole 8 and second medium recirculation hole 9 is arranged to the direction flange far from cavity, and adjacent two
In a chip assembly, the flange of the first medium recirculation hole 8 in a chip assembly 12 is set in another chip assembly
The second medium recirculation hole 9 flange.
In order to be distinguished with flange above, the equal Xiang Yuan in the edge of first medium recirculation hole 8 and second medium recirculation hole 9
The flange in the setting of direction flange from cavity is the second flange 11.
In the present embodiment, the second flange 11 of the second flange 11 of first medium recirculation hole 8 and second medium recirculation hole 9 to
Extend outside direction, that is, cavity far from other side, the second flange 11 of the first medium recirculation hole 8 in a chip assembly is set in
Second flange 11 of the second medium recirculation hole 9 of another chip assembly 12, so as to connect two neighboring chip assembly
It is connected and fixed during this, chip assembly is positioned, facilitate the assembly of cooler.
As shown in figure 3, further, fin 3 is equipped with intermediate medium recirculation hole 10 on above-described embodiment basis,
Intermediate medium recirculation hole 10 and first medium recirculation hole 8 and second medium recirculation hole 9 are corresponding.In the present embodiment, on fin 3
It is also provided with medium flow field through-hole, then medium can be made to enter fin 3 by first medium recirculation hole 8 or second medium recirculation hole 9
More smooth when runner, resistance is small.
The spacer ring of conventional structure can be used between two neighboring chip assembly.
Alternatively, spacer ring 13 is arranged in a ring, and spacer ring is arranged between two adjacent chip assemblies, every
Circle 13 is set in outside the flange of first medium recirculation hole 8 and the flange of second medium recirculation hole 9, and spacer ring 13 is by being set in second
Outside flange 11, so that it may be positioned, structure is simple, easy for installation.
Conventional backing plate can be used the first medium recirculation hole 8 or second medium in the chip assembly for being located at the bottom
Recirculation hole 9 is blocked, if the first chip 1 is located at the lower section of the second chip 2, backing plate blocks the first connecting hole 4, if
Second chip 2 is located at the lower section of the first chip 1, then backing plate blocks the second connecting hole 5.It needs to go the second flange 11 at this time
Fall.
Optionally, as shown in Figure 5 and Figure 6, backing plate 14 is equipped with annular groove 15, in the chip assembly of the bottom
One of both flange of the flange of first medium recirculation hole 8 and second medium recirculation hole 9 are plugged in the groove 15.
In the present embodiment, the structure of backing plate 14 is adapted with the structure of the second flange 11, flange installation.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
In addition, it will be appreciated by those of skill in the art that although above-mentioned some embodiments include institute in other embodiments
Including certain features rather than other feature, but the combination of the feature of different embodiment means in scope of the present application
Within and form different embodiments.The one of any of embodiment claimed mode can come in any combination
It uses.In addition, the information disclosed in the background technology section is intended only to deepen the understanding to the general background technology of the application,
And it is not construed as recognizing or implying in any form that the information constitutes the prior art known to those skilled in the art.
Claims (10)
1. a kind of chip assembly, which is characterized in that including the first chip and the second chip being oppositely arranged；First chip with
Second chip is fixedly connected, and forms cavity between first chip and second chip；
Including the fin being arranged in the cavity, the fin fills up the cavity.
2. chip assembly according to claim 1, which is characterized in that first chip is equipped with the first connecting hole, institute
The second chip is stated equipped with the second connecting hole, the fin is equipped with intermediate connecting hole, and first connecting hole, the centre
Connecting hole and second connecting hole correspond to each other setting；
The edge flange of at least one of both first connecting hole and second connecting hole is arranged, it is described at least one
The flange be plugged in the intermediate connecting hole to be connected and fixed with the other of both described edge.
3. chip assembly according to claim 2, which is characterized in that the edge of first connecting hole and described second connects
The equal flange setting in edge in hole is connect, two flange are plugged in the intermediate connecting hole, and two flange connections are solid
It is fixed.
4. chip assembly according to claim 3, which is characterized in that one in two flange is set in two institutes
It states outside another in flange.
5. chip assembly according to claim 4, which is characterized in that two flanging weldeds are fixed.
6. a kind of cooler, which is characterized in that multiple including multiple chip assemblies according to any one of claims 1 to 5
The chip assembly is stacked along predetermined direction to be arranged.
7. cooler according to claim 6, which is characterized in that first medium recirculation hole on first chip, it is described
Second medium recirculation hole is respectively equipped on second chip, the first medium recirculation hole is corresponding with the second medium recirculation hole to be set
It sets；
The edge of first medium recirculation hole and second medium recirculation hole is arranged to the direction flange far from the cavity, and adjacent two
In a chip assembly, the flange of the first medium recirculation hole in a chip assembly is set in described in another
The flange of the second medium recirculation hole in chip assembly is connected and fixed.
8. cooler according to claim 7, which is characterized in that the fin is equipped with intermediate medium recirculation hole, described
Intermediate medium recirculation hole and the first medium recirculation hole and second medium recirculation hole are corresponding.
9. cooler according to claim 7, which is characterized in that further include the spacer ring being arranged in a ring, the spacer ring is set
It sets between two adjacent chip assemblies, the spacer ring is set in the flange of first medium recirculation hole and described second and is situated between
Outside the flange of mass flow through-hole.
10. cooler according to claim 7, which is characterized in that further include backing plate, the backing plate is arranged multiple described
The bottom in chip assembly, the backing plate are equipped with annular groove, the first medium stream in the chip assembly of the bottom
One of both flange of the flange of through-hole and second medium recirculation hole plug in the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910724937.6A CN110375573A (en) | 2019-08-07 | 2019-08-07 | Chip assembly and cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910724937.6A CN110375573A (en) | 2019-08-07 | 2019-08-07 | Chip assembly and cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110375573A true CN110375573A (en) | 2019-10-25 |
Family
ID=68258242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910724937.6A Pending CN110375573A (en) | 2019-08-07 | 2019-08-07 | Chip assembly and cooler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110375573A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111238267A (en) * | 2020-03-12 | 2020-06-05 | 浙江银轮机械股份有限公司 | Chip assembly and flue gas heat exchanger |
| WO2021136437A1 (en) * | 2019-12-31 | 2021-07-08 | 浙江银轮机械股份有限公司 | Chip, chip assembly, core and intercooler |
| CN114234699A (en) * | 2021-12-13 | 2022-03-25 | 浙江银轮新能源热管理系统有限公司 | Chip unit, core and cooler |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844827A (en) * | 2006-04-26 | 2006-10-11 | 南京工业大学 | Seal-free stainless steel plate fin type heat exchanger |
| CN101305254A (en) * | 2005-09-14 | 2008-11-12 | 贝洱工业公司 | Heat exchanger |
| CN201392119Y (en) * | 2009-04-23 | 2010-01-27 | 浙江银轮机械股份有限公司 | Plate-fin cooler with strip seal structure |
| CN101793471A (en) * | 2010-01-19 | 2010-08-04 | 无锡宏盛换热器制造有限责任公司 | Superposed plate-fin heat exchanger |
| CN202659301U (en) * | 2012-05-08 | 2013-01-09 | 广西玉林达业机械配件有限公司 | Detachable engine oil cooler core sealed by O-shaped rings |
| CN108240721A (en) * | 2017-12-05 | 2018-07-03 | 珠海市领创智能物联网研究院有限公司 | A kind of refrigerator heat exchanger |
| CN207703054U (en) * | 2018-01-09 | 2018-08-07 | 浙江银轮机械股份有限公司 | A kind of oil cooler with subaisle |
| CN207703051U (en) * | 2017-12-27 | 2018-08-07 | 浙江银轮机械股份有限公司 | A kind of oil cooler of U-shaped channel |
| CN109073337A (en) * | 2016-05-13 | 2018-12-21 | 株式会社电装 | Laminated type heat exchanger |
-
2019
- 2019-08-07 CN CN201910724937.6A patent/CN110375573A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101305254A (en) * | 2005-09-14 | 2008-11-12 | 贝洱工业公司 | Heat exchanger |
| CN1844827A (en) * | 2006-04-26 | 2006-10-11 | 南京工业大学 | Seal-free stainless steel plate fin type heat exchanger |
| CN201392119Y (en) * | 2009-04-23 | 2010-01-27 | 浙江银轮机械股份有限公司 | Plate-fin cooler with strip seal structure |
| CN101793471A (en) * | 2010-01-19 | 2010-08-04 | 无锡宏盛换热器制造有限责任公司 | Superposed plate-fin heat exchanger |
| CN202659301U (en) * | 2012-05-08 | 2013-01-09 | 广西玉林达业机械配件有限公司 | Detachable engine oil cooler core sealed by O-shaped rings |
| CN109073337A (en) * | 2016-05-13 | 2018-12-21 | 株式会社电装 | Laminated type heat exchanger |
| CN108240721A (en) * | 2017-12-05 | 2018-07-03 | 珠海市领创智能物联网研究院有限公司 | A kind of refrigerator heat exchanger |
| CN207703051U (en) * | 2017-12-27 | 2018-08-07 | 浙江银轮机械股份有限公司 | A kind of oil cooler of U-shaped channel |
| CN207703054U (en) * | 2018-01-09 | 2018-08-07 | 浙江银轮机械股份有限公司 | A kind of oil cooler with subaisle |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021136437A1 (en) * | 2019-12-31 | 2021-07-08 | 浙江银轮机械股份有限公司 | Chip, chip assembly, core and intercooler |
| CN111238267A (en) * | 2020-03-12 | 2020-06-05 | 浙江银轮机械股份有限公司 | Chip assembly and flue gas heat exchanger |
| CN114234699A (en) * | 2021-12-13 | 2022-03-25 | 浙江银轮新能源热管理系统有限公司 | Chip unit, core and cooler |
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Application publication date: 20191025 |
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