WO2021177863A2 - Printed circuit board having a cooling radiator - Google Patents
Printed circuit board having a cooling radiator Download PDFInfo
- Publication number
- WO2021177863A2 WO2021177863A2 PCT/RU2021/050119 RU2021050119W WO2021177863A2 WO 2021177863 A2 WO2021177863 A2 WO 2021177863A2 RU 2021050119 W RU2021050119 W RU 2021050119W WO 2021177863 A2 WO2021177863 A2 WO 2021177863A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- printed circuit
- circuit board
- cooling radiator
- generating electrical
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 50
- 238000010079 rubber tapping Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the utility model relates to electronic equipment, in particular to the design of a printed circuit board with a cooling radiator and can be used at enterprises of the radio-electronic, aviation, space, and automobile industries.
- the closest analogue (prototype) in terms of the set of essential features to the claimed utility model is "Heat-conducting installation element for attaching a printed circuit board to a radiator" according to RF patent N ° 2495507 for an invention (MIC G12B 15/06; N05K7 / 20; H01L23 / 34; F21V29 / 00).
- the specified device for dissipating heat for a heat-generating electrical component comprises a heat sink, a printed circuit board configured to be placed on the heat sink, wherein the printed circuit board comprises a dielectric substrate provided with a heat-conducting layer on the side facing away from the heat sink, a heat-generating electrical component located on the printed circuit board.
- the technical result consists in improving heat removal from heat-generating electrical components while maintaining the strength and rigidity of the printed circuit board with a cooling radiator, as well as increasing maintainability. This technical result is achieved due to the entire set of essential features.
- a printed circuit board with a cooling radiator includes a cooling radiator, a printed circuit board adapted to be placed on a cooling radiator, while the printed circuit board contains a heat-conducting sublayer and heat-generating electrical components, and holes are made in the printed circuit board through which it is tightly fixed to the cooling radiator, as well as windows for placing heat-generating electrical components directly on the surface of the cooling radiator, and a heat-conducting sublayer is made between the cooling radiator and the heat-generating electrical components.
- the printed circuit board is fixed to the cooling radiator by means of screws or self-tapping screws, or rivets, or their combinations.
- heat-generating electrical components diodes or transistors, or microcircuits, or processors, or LEDs, or their combinations are used.
- the heat-generating electrical components are fixed to the cooling radiator using clamps or screws, or self-tapping screws, or their combinations.
- heat-conducting pastes or heat-conducting gaskets or heat-conducting spraying were used.
- FIG. 1 the claimed printed circuit board is shown.
- the printed circuit board 1 is tightly fixed on the cooling heatsink 2.
- the printed circuit board 1 has fastening holes through which, with fasteners, for example, screws, self-tapping screws, rivets or other fasteners, the printed circuit board 1 is tightly fixed to the cooling heatsink 2.
- the printed circuit board 1 made of any material suitable for PCB manufacturing technologies.
- windows 3 are made, designed to accommodate heat-generating electrical components 4 on the surface of the cooling radiator 2.
- the printed circuit board 1 is designed to carry out the operation of an electrical circuit for converting, transmitting current, voltage, control signals, performing work and interacting various electronic components ...
- Heat-generating electrical components 4 are installed in the windows of the printed circuit board 1 directly to the cooling radiator 2 through one heat-conducting sublayer.
- the heat-generating electrical components 4 are fixed to the cooling radiator 2 by any known method that ensures heat transfer, for example, using clamps, screws, self-tapping screws and other fasteners.
- the heat-conducting sublayer is a heat-conducting material intended for application and installation between the heat-generating electrical component 4 and the cooling radiator 2. Heat-conducting pastes, heat-conducting gaskets, heat-conducting spraying, heat-conducting glue can be used as the heat-conducting sublayer.
- the heat-conducting sublayer is designed to transfer heat from the heat-generating electrical component 4 to the cooling radiator 2 for subsequent heat removal to the surrounding space.
- the leads of the electronic components 4 are connected to the printed circuit board 1 by surface mounting.
- the cooling radiator 2 is made of metal or other material that provides heat dissipation.
- the cooling radiator 2 can be made of aluminum, copper, or other material that provides heat dissipation.
- the cooling radiator 2 has holes 5 for fastening the printed circuit board 1. Screws or other fasteners can be used as fastening elements.
- a printed circuit board with a cooling radiator works as follows. During the operation of the electrical circuit, the heat from the heat-generating electrical component 4 will go through the heat-conducting layer to the cooling radiator 2 and then to the surrounding space. During operation, a printed circuit board with a cooling radiator experiences shock and vibration loads as a result of which the printed circuit board is destroyed, the soldering is destroyed. In the proposed design, all shock and vibration loads are absorbed by the cooling radiator 2, which is due to the tight fastening of the printed circuit board 1 to the cooling radiator 2. Cooling radiator 2, which has a higher rigidity than the printed circuit board 1, reduces the likelihood of destruction of the printed circuit board 1 and soldering.
- the design of the printed circuit board with the cooling heatsink provides access to the heat-generating electrical components 4 without additional disassembly and has only one heat-conducting layer between the cooling heatsink 2 and the heat-generating electrical component 4. This provides high heat dissipation characteristics simultaneously with high structural rigidity and serviceability. heat-generating electrical components 4.
- the design of the printed circuit board with a heat sink provides maximum structural rigidity, which guarantees a low probability of cracks in soldering, electronic components, conductors printed circuit board when exposed to shock vibration and any other types of loads and mechanical influences, as well as the minimum time for replacing electronic components and the possibility of using the extreme cooling fins of the radiator for design purposes.
- the design is applicable regardless of the design of the cooling heatsink, the material of the cooling heatsink, the thickness of the PCB and the material of the PCB.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to electronic technology. The technical result is to improve heat removal from heat-generating electrical components while maintaining the strength and structural rigidity of a printed circuit board with a cooling radiator and to increase reparability. The essence of the utility model consists in that a printed circuit board with a cooling radiator includes a cooling radiator and a printed circuit board designed so as to be arranged on the cooling radiator, wherein the printed circuit board comprises a heat-conducting substrate and heat-generating electrical components, wherein the printed circuit board has holes, by means of which it is tightly fastened to the cooling radiator, and has ports for arranging the heat-generating electrical components directly on the surface of the cooling radiator, whereas the heat-conducting substrate is arranged between the cooling radiator and the heat-generating electrical components.
Description
Печатная плата с радиатором охлаждения PCB with heatsink
ОБЛАСТЬ ТЕХНИКИ FIELD OF TECHNOLOGY
Полезная модель относится к электронной технике, в частности к конструкции печатной платы с радиатором охлаждения и может найти применение на предприятиях радиоэлектронной, авиационной, космической, автомобильной промышленности. The utility model relates to electronic equipment, in particular to the design of a printed circuit board with a cooling radiator and can be used at enterprises of the radio-electronic, aviation, space, and automobile industries.
ПРЕДШЕСТВУЮЩИЙ УРОВЕНЬ ТЕХНИКИ PRIOR ART
Известны различные конструкции печатных плат с радиатором охлаждения. Various designs of printed circuit boards with a cooling radiator are known.
Наиболее близким по совокупности существенных признаков к заявленной полезной модели аналогом (прототипом) является «Теплопроводный установочный элемент для крепления печатной платы к радиатору» по патенту РФ N° 2495507 на изобретение (МИК G12B 15/06; Н05К7/20; H01L23/34; F21V29/00). Указанное устройство для рассеяния тепла для выделяющего тепло электрического компонента, содержит радиатор, печатную плату, выполненную с возможностью размещения на радиаторе, при этом печатная плата содержит диэлектрическую подложку, снабженную теплопроводным слоем на стороне, обращенной от радиатора, выделяющий тепло электрический компонент, размещенный на печатной плате и находящийся в тепловом контакте с теплопроводным слоем, отличающееся тем, что тепловыделяющий установочный элемент прикреплен к теплопроводному слою посредством пайки, причем установочный элемент имеет соединительную часть, выполненную с возможностью зацепления с углублением в радиаторе, обеспечивая тем самым крепление печатной платы к радиатору, так что обеспечивается тепловой канал от выделяющего тепло электрического компонента через теплопроводный слой и установочный элемент к радиатору. Данное техническое решение обладает следующими недостатками. Сложная конструкция из нескольких теплопроводных слоев и размещение
выделяющего тепло электрического компонента непосредственно на поверхности печатной платы ухудшают теплоотвод от выделяющего тепло электрического компонента по сравнению с предлагаемым вариантом конструкции. The closest analogue (prototype) in terms of the set of essential features to the claimed utility model is "Heat-conducting installation element for attaching a printed circuit board to a radiator" according to RF patent N ° 2495507 for an invention (MIC G12B 15/06; N05K7 / 20; H01L23 / 34; F21V29 / 00). The specified device for dissipating heat for a heat-generating electrical component comprises a heat sink, a printed circuit board configured to be placed on the heat sink, wherein the printed circuit board comprises a dielectric substrate provided with a heat-conducting layer on the side facing away from the heat sink, a heat-generating electrical component located on the printed circuit board. board and in thermal contact with the heat-conducting layer, characterized in that the heat-generating mounting element is attached to the heat-conducting layer by soldering, and the mounting element has a connecting part configured to engage with a recess in the heat sink, thereby securing the printed circuit board to the heat sink, so that a heat channel is provided from the heat-generating electrical component through the heat-conducting layer and the mounting element to the radiator. This technical solution has the following disadvantages. Complex construction of several heat-conducting layers and placement the heat-generating electrical component directly on the surface of the printed circuit board degrades the heat dissipation from the heat-generating electrical component as compared to the proposed design.
РАСКРЫТИЕ ИЗОБРЕТЕНИЯ DISCLOSURE OF THE INVENTION
Технический результат заключается в улучшении теплоотвода от выделяющих тепло электрических компонентов при сохранении прочности и жесткости конструкции печатной платы с радиатором охлаждения, а также повышении ремонтопригодности. Данный технический результат достигается за счет всей совокупности существенных признаков. The technical result consists in improving heat removal from heat-generating electrical components while maintaining the strength and rigidity of the printed circuit board with a cooling radiator, as well as increasing maintainability. This technical result is achieved due to the entire set of essential features.
Сущность полезной модели состоит в том, что печатная плата с радиатором охлаждения включает радиатор охлаждения, печатную плату, выполненную с возможностью размещения на радиаторе охлаждения, при этом печатная плата содержит теплопроводящий подслой и выделяющие тепло электрические компоненты, причем в печатной плате выполнены отверстия, через которые она вплотную закреплена на радиаторе охлаждения, а также окна для размещения выделяющих тепло электрических компонентов напрямую на поверхности радиатора охлаждения, а теплопроводящий подслой выполнен между радиатором охлаждения и выделяющими тепло электрическими компонентами. Вместе с тем, печатная плата закреплена на радиаторе охлаждения посредствам винтов либо саморезов, либо заклепок, либо их комбинаций. А в качестве выделяющих тепло электрических компонентов применены диоды либо транзисторы, либо микросхемы, либо процессоры, либо светодиоды, либо их комбинации. В то же время, выделяющие тепло электрические компоненты закреплены на радиаторе охлаждения при помощи прижимов либо винтов, либо саморезов, либо их комбинаций. А в качестве теплопроводящего подслоя использованы теплопроводящие пасты либо теплопроводящие прокладки, либо теплопроводящее напыление. The essence of the invention lies in the fact that a printed circuit board with a cooling radiator includes a cooling radiator, a printed circuit board adapted to be placed on a cooling radiator, while the printed circuit board contains a heat-conducting sublayer and heat-generating electrical components, and holes are made in the printed circuit board through which it is tightly fixed to the cooling radiator, as well as windows for placing heat-generating electrical components directly on the surface of the cooling radiator, and a heat-conducting sublayer is made between the cooling radiator and the heat-generating electrical components. At the same time, the printed circuit board is fixed to the cooling radiator by means of screws or self-tapping screws, or rivets, or their combinations. And as heat-generating electrical components, diodes or transistors, or microcircuits, or processors, or LEDs, or their combinations are used. At the same time, the heat-generating electrical components are fixed to the cooling radiator using clamps or screws, or self-tapping screws, or their combinations. And as a heat-conducting sublayer, heat-conducting pastes or heat-conducting gaskets or heat-conducting spraying were used.
КРАТКОЕ ОПИСАНИЕ ЧЕРТЕЖЕЙ
Полезная модель поясняется графически, где: на фиг. 1 - изображена заявляемая печатная плата. BRIEF DESCRIPTION OF DRAWINGS The utility model is illustrated graphically, where: in FIG. 1 - the claimed printed circuit board is shown.
ЛУЧШИЙ ВАРИАНТ ОСУЩЕСТВЛЕНИЯ ИЗОБРЕТЕНИЯ Печатная плата 1 вплотную закреплена на радиаторе охлаждения 2. В печатной плате 1 выполнены крепежные отверстия, через которые крепежом, например, винтовым, саморезами, заклепками либо иным крепежом, печатная плата 1 вплотную закреплена к радиатору охлаждения 2. Печатная плата 1 выполнена из любого материала пригодного для технологий изготовления печатных плат. В печатной плате 1 выполнены окна 3, предназначенные для размещения в них выделяющих тепло электрических компонентов 4 на поверхности радиатора охлаждения 2. Печатная плата 1 предназначена для осуществления работы электрической схемы преобразования, передачи тока, напряжения, управляющих сигналов, осуществления работы и взаимодействия различных электронных компонентов. В качестве выделяющих тепло электрических компонентов 4 могут быть применены диоды, транзисторы, микросхемы, процессоры, светодиоды и прочие электронные компоненты. Выделяющие тепло электрические компоненты 4 установлены в окнах печатной платы 1 напрямую к радиатору охлаждения 2 через один теплопроводящий подслой. Выделяющие тепло электрические компоненты 4 закреплены на радиаторе охлаждения 2 любым известным способом обеспечивающем передачу тепла, например, при помощи прижимов, винтов, саморезов и иных крепежных элементов. Теплопроводящий подслой представляет собой теплопроводный материал предназначенный для нанесения и установки между выделяющим тепло электрическим компонентом 4 и радиатором охлаждения 2. В качестве теплопроводящего подслоя могут быть использованы теплопроводящие пасты, теплопроводящие прокладки, теплопроводящее напыление, теплопроводящий клей. Теплопроводящий подслой предназначен для передачи тепла от выделяющего тепло электрического компонента 4 на радиатор охлаждения 2 для последующего отведения тепла в окружающее
пространство. Выводы электронных компонентов 4 присоединены к печатной плате 1 поверхностным монтажом. Радиатор охлаждения 2 выполнен из металла либо иного материала обеспечивающего отведение тепла. Радиатор охлаждения 2 может быть выполнен из алюминия, меди, или иного материала, обеспечивающего отведение тепла. Радиатор охлаждения 2 имеет отверстия 5 для крепления печатной платы 1. В качестве элементов крепления могут быть использованы винты либо иные крепежные элементы. BEST MODE FOR CARRYING OUT THE INVENTION The printed circuit board 1 is tightly fixed on the cooling heatsink 2. The printed circuit board 1 has fastening holes through which, with fasteners, for example, screws, self-tapping screws, rivets or other fasteners, the printed circuit board 1 is tightly fixed to the cooling heatsink 2. The printed circuit board 1 made of any material suitable for PCB manufacturing technologies. In the printed circuit board 1, windows 3 are made, designed to accommodate heat-generating electrical components 4 on the surface of the cooling radiator 2. The printed circuit board 1 is designed to carry out the operation of an electrical circuit for converting, transmitting current, voltage, control signals, performing work and interacting various electronic components ... Diodes, transistors, microcircuits, processors, LEDs and other electronic components can be used as heat-generating electrical components 4. Heat-generating electrical components 4 are installed in the windows of the printed circuit board 1 directly to the cooling radiator 2 through one heat-conducting sublayer. The heat-generating electrical components 4 are fixed to the cooling radiator 2 by any known method that ensures heat transfer, for example, using clamps, screws, self-tapping screws and other fasteners. The heat-conducting sublayer is a heat-conducting material intended for application and installation between the heat-generating electrical component 4 and the cooling radiator 2. Heat-conducting pastes, heat-conducting gaskets, heat-conducting spraying, heat-conducting glue can be used as the heat-conducting sublayer. The heat-conducting sublayer is designed to transfer heat from the heat-generating electrical component 4 to the cooling radiator 2 for subsequent heat removal to the surrounding space. The leads of the electronic components 4 are connected to the printed circuit board 1 by surface mounting. The cooling radiator 2 is made of metal or other material that provides heat dissipation. The cooling radiator 2 can be made of aluminum, copper, or other material that provides heat dissipation. The cooling radiator 2 has holes 5 for fastening the printed circuit board 1. Screws or other fasteners can be used as fastening elements.
Работает печатная плата с радиатором охлаждения следующим образом. В процессе функционирования электрической схемы тепло от выделяющего тепло электрического компонента 4 будет уходить через теплопроводящий слой на радиатор охлаждения 2 и далее - в окружающее пространство. В процессе эксплуатации печатная плата с радиатором охлаждения испытывает ударные и вибрационные нагрузки вследствие чего происходит разрушение печатной платы, разрушение пайки. В предлагаемой конструкции все ударные и вибрационные нагрузки воспринимает на себя радиатор охлаждения 2, что обусловлено плотным закреплением печатной платы 1 на радиаторе охлаждения 2. Радиатор охлаждения 2, имеющий более высокую жесткость, чем печатная плата 1, снижает вероятность разрушения печатной платы 1 и пайки. При этом конструкция печатной платы с радиатором охлаждения обеспечивает доступ к выделяющим тепло электрическим компонентам 4 без дополнительной разборки и имеет всего один теплопроводящий слой между радиатором охлаждения 2 и выделяющим тепло электрическим компонентом 4. Это обеспечивает высокие характеристики теплоотвода одновременно с высокой жесткостью конструкции и доступностью для обслуживания выделяющих тепло электрических компонентов 4. A printed circuit board with a cooling radiator works as follows. During the operation of the electrical circuit, the heat from the heat-generating electrical component 4 will go through the heat-conducting layer to the cooling radiator 2 and then to the surrounding space. During operation, a printed circuit board with a cooling radiator experiences shock and vibration loads as a result of which the printed circuit board is destroyed, the soldering is destroyed. In the proposed design, all shock and vibration loads are absorbed by the cooling radiator 2, which is due to the tight fastening of the printed circuit board 1 to the cooling radiator 2. Cooling radiator 2, which has a higher rigidity than the printed circuit board 1, reduces the likelihood of destruction of the printed circuit board 1 and soldering. At the same time, the design of the printed circuit board with the cooling heatsink provides access to the heat-generating electrical components 4 without additional disassembly and has only one heat-conducting layer between the cooling heatsink 2 and the heat-generating electrical component 4. This provides high heat dissipation characteristics simultaneously with high structural rigidity and serviceability. heat-generating electrical components 4.
ПРОМЫШЛЕННАЯ ПРИМЕНИМОСТЬ INDUSTRIAL APPLICABILITY
Конструкция печатной платы с радиатором охлаждения, обеспечивает максимальную жесткость конструкции, что гарантирует низкую вероятность возникновения трещин в пайке, электронных компонентах, проводниках
печатной платы при воздействии ударных вибрационных и любых иных видов нагрузок и механических воздействий, а также минимальное время на замену электронных компонентов и возможность использования крайних ребер охлаждения радиатора в конструктивных целях. Конструкция применима независимо от конструкции радиатора охлаждения, материала радиатора охлаждения, толщины печатной платы и материала печатной платы.
The design of the printed circuit board with a heat sink, provides maximum structural rigidity, which guarantees a low probability of cracks in soldering, electronic components, conductors printed circuit board when exposed to shock vibration and any other types of loads and mechanical influences, as well as the minimum time for replacing electronic components and the possibility of using the extreme cooling fins of the radiator for design purposes. The design is applicable regardless of the design of the cooling heatsink, the material of the cooling heatsink, the thickness of the PCB and the material of the PCB.
Claims
1. Печатная плата с радиатором охлаждения включающая, радиатор охлаждения, печатную плату, выполненную с возможностью размещения на радиаторе охлаждения, при этом печатная плата содержит теплопроводящий подслой и выделяющие тепло электрические компоненты, отличающаяся тем, что в ней выполнены отверстия, через которые она вплотную закреплена на радиаторе охлаждения, а также окна для размещения выделяющих тепло электрических компонентов напрямую на поверхности радиатора охлаждения, а теплопроводящий подслой выполнен между радиатором охлаждения и выделяющими тепло электрическими компонентами . 1. A printed circuit board with a cooling radiator, including a cooling radiator, a printed circuit board configured to be placed on a cooling radiator, while the printed circuit board contains a heat-conducting sublayer and heat-generating electrical components, characterized in that holes are made in it through which it is tightly fixed on the cooling radiator, as well as windows for placing heat-generating electrical components directly on the surface of the cooling radiator, and a heat-conducting sublayer is made between the cooling radiator and the heat-generating electrical components.
2. Печатная плата с радиатором охлаждения по п. 1 отличающаяся тем, что печатная плата закреплена на радиаторе охлаждения посредствам винтов либо саморезов, либо заклепок, либо их комбинаций. 2. A printed circuit board with a cooling radiator according to claim 1, characterized in that the printed circuit board is fixed to the cooling radiator by means of screws or self-tapping screws, or rivets, or their combinations.
3. Печатная плата с радиатором охлаждения по п. 1 отличающаяся тем, что в качестве выделяющих тепло электрических компонентов применены диоды либо транзисторы, либо микросхемы, либо процессоры, либо светодиоды, либо их комбинации. 3. A printed circuit board with a cooling radiator according to claim 1, characterized in that diodes or transistors, or microcircuits, or processors, or LEDs, or their combinations are used as heat-generating electrical components.
4. Печатная плата с радиатором охлаждения по и. 1 отличающаяся тем, что выделяющие тепло электрические компоненты закреплены на радиаторе охлаждения при помощи прижимов либо винтов, либо саморезов, либо их комбинаций. 4. Printed circuit board with a heatsink for and. 1 characterized in that the heat-generating electrical components are fixed to the cooling radiator by means of clamps or screws, or self-tapping screws, or their combinations.
5. Печатная плата с радиатором охлаждения по и. 1 отличающаяся тем, что в качестве теплопроводящего подслоя использованы теплопроводящие пасты либо теплопроводящие прокладки, либо теплопроводящее напыление.
5. Printed circuit board with a heatsink for and. 1 characterized in that heat-conducting pastes or heat-conducting gaskets or heat-conducting spraying are used as the heat-conducting sublayer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2020109696 | 2020-03-05 | ||
| RU2020109696 | 2020-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2021177863A2 true WO2021177863A2 (en) | 2021-09-10 |
| WO2021177863A3 WO2021177863A3 (en) | 2021-11-11 |
Family
ID=77614134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/RU2021/050119 WO2021177863A2 (en) | 2020-03-05 | 2021-04-30 | Printed circuit board having a cooling radiator |
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| Country | Link |
|---|---|
| WO (1) | WO2021177863A2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5323295A (en) * | 1992-07-21 | 1994-06-21 | P & P Marketing, Inc. | Assembly for integrating heat generating electronic device with nonheat generating devices |
| RU2305380C1 (en) * | 2006-01-10 | 2007-08-27 | Открытое акционерное общество "Научно-производственный комплекс" ЭЛАРА" | Radio-electronic block |
| EP2269429B1 (en) * | 2008-04-17 | 2011-11-02 | Koninklijke Philips Electronics N.V. | Thermally conductive mounting element for attachment of printed circuit board to heat sink |
| RU2650076C1 (en) * | 2017-01-09 | 2018-04-06 | федеральное государственное бюджетное образовательное учреждение высшего образования "Новгородский государственный университет имени Ярослава Мудрого" | Method of installing powerful leds on printed board |
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2021
- 2021-04-30 WO PCT/RU2021/050119 patent/WO2021177863A2/en active Application Filing
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| Publication number | Publication date |
|---|---|
| WO2021177863A3 (en) | 2021-11-11 |
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