WO2021167325A1

WO2021167325A1 - Gas supply device and deposition device comprising same

Info

Publication number: WO2021167325A1
Application number: PCT/KR2021/001977
Authority: WO
Inventors: 안범모; 엄영흠; 강신구
Original assignee: (주)포인트엔지니어링
Priority date: 2020-02-18
Filing date: 2021-02-16
Publication date: 2021-08-26
Also published as: KR20210105139A

Abstract

In a gas supply device according to a preferred embodiment of the present invention, a constraining member having a thermal expansion coefficient smaller than the thermal expansion coefficient of a body is provided in a groove formed around a first area. Accordingly, a gas supply device that does not allow thermal deformation of the body can be provided.

Description

Gas supply device and deposition device having the same

The present invention relates to a gas supply device, and more particularly, to a gas supply device for preventing thermal expansion deformation due to heat by inserting a restraining member into the interior of a body.

Since the deposition process has the advantage of forming a film uniformly on a large-area substrate at a high speed, it is widely used in the manufacture of semiconductor devices or LCD panels.

The deposition apparatus includes a susceptor in which a substrate is horizontally seated and a heater is built therein, and a gas supply device that injects gas through a gas hole provided inside the upper portion of the susceptor. In order to obtain uniform film formation characteristics in such a deposition apparatus, various conditions, such as uniform gas supply, uniform temperature distribution, and a constant distance between the substrate and the plasma electrode, are required.

The gas supply device expands by receiving heat from a heater built into the susceptor. As the lower surface of the gas supply device expands more than the upper surface, the gas supply device is deformed to be bent. Since this deformation makes the distance between the substrate and the gas supply device non-uniform, the plasma density becomes non-uniform, thereby forming a non-uniform film on the substrate. This problem becomes more problematic as the substrate becomes larger in area and the semiconductor pattern is miniaturized to several nm.

As an invention for solving this problem, it is known that it is described in Korean Patent Registration No. 10-0492135 (hereinafter referred to as 'Patent Document 1'). Patent Document 1 adopts the configuration of two outer circumferential grooves in the outer portion of the substrate in order to prevent the gas supply device from being bent and deformed due to thermal expansion. This outer circumferential groove acts as a mechanical bellows for allowing horizontal deformation according to thermal expansion.

However, since the technical means of Patent Document 1 allows horizontal deformation, the position of the gas hole of the gas supply device also causes displacement in the horizontal direction. For this reason, the technical means of Patent Document 1 causes a problem of impairing the film formation uniformity in the semiconductor micro-process as the pitch between the gas holes of the gas supply device is changed according to the temperature range.

[Prior art literature]

[Patent Literature]

(Patent Document 1) Korean Patent No. 10-0492135

The present invention has been devised to solve the above problems, and by providing a constraining member having a thermal expansion coefficient lower than the thermal expansion coefficient of the body in a second region that is a peripheral region of a first region in which a through hole is provided, thermal expansion of a gas supply device An object of the present invention is to provide a gas supply device that does not allow deformation by

A gas supply apparatus according to one aspect of the present invention includes: a body including a first area having a through hole and a second area having a groove in a shape surrounding the first area from the outside of the first area; and a restraining member provided in the groove and configured to not allow thermal deformation of the body while having a thermal expansion coefficient smaller than the thermal expansion coefficient of the body.

In addition, the restraining member is located closer to the lower surface side than the upper surface side of the body.

In addition, the restraining member is provided as an integral metal band.

In addition, a plurality of the constraining members are provided inside the groove.

In addition, the grooves are provided in the form of an arc spaced apart along the circumference of the first region, and the restraining member is provided in each of the grooves.

In addition, the restraining member is filled with a metallic material.

In addition, a heating wire is provided on the upper portion of the constraining member.

A deposition apparatus according to one aspect of the present invention includes a body including a first region having a through hole and a second region having a groove in a shape surrounding the first region from the outside of the first region and the groove a gas supply device provided in and having a thermal expansion coefficient smaller than the thermal expansion coefficient of the body and including a restraining member for not allowing thermal deformation of the body; and a susceptor having a heater therein.

The gas supply apparatus according to the preferred embodiment of the present invention as described above has the following effects.

The gas supply device does not allow thermal deformation due to thermal expansion of the body by embedding a restraining member having a thermal expansion coefficient smaller than the thermal expansion coefficient of the body embedded in the body. Through this, the uniformity of the film formation is improved.

In addition, by providing a second constraining member having a relatively large coefficient of thermal expansion than the first constraining member between the first constraining member having a small coefficient of thermal expansion and the body having a large thermal expansion coefficient, the second constraining member prevents thermal deformation due to thermal expansion of the body It is possible to prevent shear failure that may occur in the body while absorbing relatively.

In addition, since a plurality of grooves are formed along the circumference of the first region and provided with the restraining member, thermal deformation of the body is not allowed and the restraining member can be more easily inserted into the groove.

In addition, by providing the constraining member in a manner of filling the interior of the groove with a metal material, the constraining member may be provided in various shapes regardless of the shape.

In addition, by providing the heating wire on the upper surface of the restraining member, it is possible to prevent thermal deformation due to thermal expansion of the body by reducing the temperature difference between the lower portion of the body and the upper portion of the body.

1 is a cross-sectional view showing a deposition apparatus;

Figure 2 is an exploded perspective view of a gas supply device according to a first embodiment of the present invention.

3 is a bottom plan view of a gas supply device according to a first preferred embodiment of the present invention.

4 is a cross-sectional view of a gas supply device according to a first preferred embodiment of the present invention;

5 is a cross-sectional view of a gas supply device according to a second preferred embodiment of the present invention.

Figure 6 (a) is a plan view of the constraining member of the gas supply device according to a third preferred embodiment of the present invention.

6 (b) is a bottom plan view of a gas supply device according to a third preferred embodiment of the present invention;

7 is a cross-sectional view of a gas supply device according to a fourth preferred embodiment of the present invention.

8 is a cross-sectional view of a gas supply device according to a fifth preferred embodiment of the present invention.

9 is a cross-sectional view of a gas supply device according to a sixth preferred embodiment of the present invention.

The following is merely illustrative of the principles of the invention. Therefore, those skilled in the art can devise various devices that, although not explicitly described or shown herein, embody the principles of the invention and are included in the spirit and scope of the invention. In addition, it should be understood that all conditional terms and examples listed herein are, in principle, expressly intended only for the purpose of understanding the inventive concept and are not limited to the specifically enumerated embodiments and states as such. .

The above-described objects, features and advantages will become more apparent through the following detailed description in relation to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the invention pertains will be able to easily practice the technical idea of the invention. .

Hereinafter, a first preferred embodiment of the present invention will be described with reference to FIGS. 1 to 4 .

1 to 4 , the gas supply device 1 has a first area 11 provided with a through hole 13 and a shape surrounding the first area 11 from the outside of the first area 11 . Thermal deformation of the body 10 while having a thermal expansion coefficient smaller than the thermal expansion coefficient of the body 10 and provided in the body 10 and the groove 14 including the second region 12 provided with the furnace groove 14 It may include a constraining member 20 to not allow the.

1 is a diagram illustrating a deposition apparatus 2 including a gas supply apparatus 1 according to a preferred embodiment of the present invention.

The deposition apparatus 2 treats a workpiece or substrate 3 with a chemical process, which is one of a series of steps for manufacturing a semiconductor or other electronic device on the workpiece. The workpiece is supported in the deposition apparatus 2 by a susceptor 6 . Typical examples of a workpiece or substrate 3 processed in the deposition apparatus 2 include rectangular glass substrates used for flat panel displays or circular semiconductor wafers on which circuits are integrated.

The side wall and the bottom wall of the deposition apparatus 2 are provided as a single wall 15 . A hinged lid 16 and a gas inlet manifold top wall 18 are provided at the top of the deposition apparatus 2 . The interior of the deposition apparatus 2 can be accessed by lifting the lid 16 . An O-ring 19 (some not shown) provides a vacuum seal between the sidewall 15 , the lid 16 , and the gas inlet manifold top wall 18 . The side and bottom walls 15 , the leads 16 and the gas inlet manifold top wall 18 are all considered parts of the deposition apparatus 2 wall.

During a process for manufacturing a semiconductor or other electronic device on a workpiece or substrate 3 , one or more gases are supplied to the deposition apparatus 2 through a gas inlet manifold. The gas inlet manifold includes a gas inlet manifold upper wall 18 and a gas supply 1 , wherein gas passes through a gas inlet orifice 28 of the gas inlet manifold upper wall 18 to the gas supply 1 . and the gas flows into the deposition device 2 through the gas supply device 1 . The gas inlet manifold further includes a gas inlet manifold sidewall, the gas inlet manifold sidewall also referred to as a gas sealing sidewall, the gas inlet manifold sidewall being disposed between the upper wall 18 and the gas supply 1 . Provides sealing. The gas inlet manifold top wall 18 , the sidewalls and the gas supply 1 are joined to form the interior region of the gas inlet manifold.

An external gas source supplies process gas to one or more gas inlet orifices (28) in the gas inlet manifold upper wall (18) through which the process gas is directed to the interior region (26) of the gas inlet manifold (26). ) to flow. Process gases flow from the interior region 26 of the gas inlet manifold into the interior of the deposition apparatus 2 through one or more typically hundreds or thousands of through-holes 13 in the gas supply 1 .

The sidewall sealing of the gas inlet manifold is achieved by a dielectric liner 24 covering the inner wall of the chamber lid 16 .

The gas inlet manifold includes a gas inlet deflector consisting of a circular disk 34 having a diameter slightly larger than the diameter of the gas inlet orifice 28 and suspended below the orifice by posts not shown.

A cover 39 may generally be provided over the chamber lid 16 . The cover 39 prevents foreign substances from coming into contact with the gas inlet manifold upper wall 18 or the gas supply device 1 .

A dielectric liner 35 may be provided between the cover 39 and the gas inlet manifold upper wall 18 . The dielectric liner 35 may be provided along the periphery of the upper surface of the gas inlet manifold upper wall 18 , and one side of the dielectric liner is in contact with the gas inlet manifold upper wall 18 and the other side is in contact with the cover 29 and Abutting can be provided.

The components of the deposition apparatus 2 must be made of a material that does not contaminate the semiconductor manufacturing process performed in the chamber and is resistant to corrosion by the process gas. Preferably, all parts except for the O-ring, dielectric spacer and liner are made of aluminum or an aluminum alloy.

The body 10 of the gas supply device 1 may be formed in a polygonal shape, such as a circle or a rectangle, and in the following description, the body 10 will be illustrated and described as an example in which the shape of the body 10 is a circle.

The body 10 may be formed in the form of a circular plate, and the outer surface of the body 10 may be formed in a stepped shape. The body 10 is formed so that the diameter of the upper surface is larger than the diameter of the lower surface, the outer surface of the body 10 is to have a stepped shape. The body 10 is preferably made of aluminum or an aluminum alloy.

2 to 3 , the body 10 includes a first region 11 having a through hole 13 and a second region 12 surrounding the first region 11 . can be

The first area 11 is an area provided with a plurality of through holes 13 . The first region 11 refers to a region from the center of the lower surface of the body 10 to a point where the second region 12 starts. In other words, the first region 11 refers to a region formed inside the second region 12 .

The through-holes 13 may be formed to pass through the body 10 in the first region 11 , and the through-holes 13 may be evenly distributed throughout the first region 11 . The through hole 13 serves to communicate the upper portion of the body 10 with the lower portion of the body 10 , and the gas moves from the upper portion of the body 10 to the lower portion of the body 10 through the through hole 13 . can

The second region 12 is a region in which the through hole 13 is not provided. The second region 12 refers to a region from the outermost surface of the lower surface of the body 10 to a point where the first region 11 starts. In other words, the second region 12 refers to a region surrounding the first region 11 from the outside of the first region 11 . A band-shaped groove 14 having a predetermined depth may be provided in the second region 12 .

The groove 14 may be provided in a shape surrounding the first region 11 in the second region 12 .

The groove 14 may be formed to be convex upward from the lower surface of the body 10 . The constraining member 20 and the closing member 30 may be sequentially inserted along the inside of the groove 14 . The groove 14 may be formed so that the entrance width of the opening is larger than the width of the upper side of the opening. That is, the groove 14 may be formed so that an inner width into which the restraining member 20 is inserted is smaller than an outer width into which the closing member 30 is inserted.

The constraining member 20 may have the same shape as the shape of the groove 14 . In other words, the constraining member 20 may be formed in an integral metal band shape. The restraining member 20 serves to prevent the lower surface of the body 10 from being deformed by thermal expansion due to heat. Therefore, the constraining member 20 is preferably made of a material having a coefficient of thermal expansion smaller than that of the body 10 . The constraining member 20 is preferably made of SUS material.

Alternatively, the constraining member 20 may be formed of a composite molding including a powder component having a low coefficient of thermal expansion. In this case, the density of the powder may be uniformly distributed in the constraining member 20 , but the density of the powder may be different in the upper and lower portions of the constraining member 20 . In other words, the powder density in the upper portion of the restraining member 20 may be higher than the powder density in the lower portion of the restraining member 20 , and on the contrary, the powder density in the lower portion of the restraining member 20 is 20) may be higher than the powder density at the top.

The closing member 30 may be formed in the same shape as the constraining member 20 and may be formed in an integral metal grime shape. The closing member 30 is inserted into the opening of the groove 14 to cover the opening of the groove 14 . The finishing member 30 may be coupled to the body 10 by a method such as argon welding, electron beam welding, brazing bonding, or friction stir welding. The width of the closing member 30 may be greater than the width of the constraining member 20 .

The closing member 30 is coupled to the body 10 at the lower side of the constraining member 20 to prevent the constraining member 20 seated in the groove 14 from being separated in the lower direction of the body 10 . The closing member 30 is preferably made of the same material as the body 10 . For example, the finishing member 30 may be made of aluminum or an aluminum alloy material.

As shown in FIG. 4 , the restraining member 20 and the closing member 30 may be sequentially seated in the groove 14 provided in the body 10 at the lower portion of the body 10 . In this case, the restraining member 20 may be located closer to the lower surface side than the upper surface side of the body 10 .

Specifically, the groove 14 may be provided such that the center line of the groove 14 is located at a position lower than the center line CL with respect to the center line CL of the body 10 . The groove 14 is formed convexly in the upper direction of the body 10 from the lower surface of the body 10 . At this time, the height of the center line of the groove 14 is lower than or equal to the center line CL of the body 10 . can be located in Accordingly, the position of the center line of the constraining member 20 provided in the groove 14 is located at a lower position than the center line CL of the body 10 .

Hereinafter, the effect of the gas supply device 1 according to the first preferred embodiment of the present invention will be described.

The gas supply device 1 has a constraint member 20 having a lower coefficient of thermal expansion than the coefficient of thermal expansion of the body 10 in the second region 12 , which is a region surrounding the first region 11 from the outside of the first region 11 . By providing a, deformation due to thermal expansion is not allowed.

As shown in FIG. 1 , the body 10 may be heated by heat generated by a process performed in the deposition apparatus 2 . Heat is applied to the lower side of the body 10 by a heater built into the susceptor 6 , and thermal expansion deformation in which the lower side of the body 10 expands outwardly is made, in the first region 11 . A force is applied so that the pitch interval of the provided through-holes 13 is widened.

In this case, the restraining member 20 may be provided in the second region 12 that is the outer surface of the first region 11 of the body 10 to prevent the first region 11 from being expanded by heat. That is, the constraining member 20 is formed in the shape of a circular metal band to restrain the first region 11 from the outer surface of the first region 11 to prevent the first region 11 from expanding in the outward direction. will be. That is, unless the constraining member 20 constraining the first region 11 is thermally deformed, the body 10 is also not thermally deformed.

Therefore, the gas supply device 1 does not allow thermal deformation due to thermal expansion of the body 10 by embedding the constraining member 20 having a thermal expansion coefficient smaller than the thermal expansion coefficient of the body 10 by embedding it in the body. .

본 발명의 바람직한 제2실시 예에 따른 가스 공급장치(1a)Gas supply device (1a) according to a second preferred embodiment of the present invention

Hereinafter, a gas supply device 1a according to a second preferred embodiment of the present invention will be described with reference to FIG. 5 .

The gas supply device 1a according to the second preferred embodiment of the present invention may be configured by further including a second restraining member 22 in the gas supply device 1 according to the first preferred embodiment of the present invention. have. Therefore, the description of the gas supply apparatus 1 according to the first preferred embodiment of the present invention described above may be applied to other configurations of the gas supply apparatus 1a according to the second preferred embodiment of the present invention, and overlapping descriptions is omitted.

As shown in FIG. 5 , the gas supply device 1a may include a plurality of restraining members 20 .

A plurality of restraining members 20 may be provided in the groove 14 . The plurality of constraining members 20 may be vertically stacked inside the groove 14 .

For example, as shown in FIG. 5 , the constraining member 20 may include a first constraining member 21 and a second constraining member 22 .

The first restraining member 21 may be provided under the second restraining member 22 inside the groove 14 . The first restraining member 21 may be provided between the second restraining member 22 and the closing member 30 . The upper surface of the first constraining member 21 may be in contact with the lower surface of the second constraining member 22 , and the lower surface of the first constraining member 21 may be in contact with the closing member 30 .

The thermal expansion coefficient of the first constraining member 21 and the thermal expansion coefficient of the second constraining member 22 may be different from each other.

The first constraining member 21 may have a coefficient of thermal expansion smaller than that of the second constraining member 22 .

The second constraining member 22 may be provided on the first constraining member 21 inside the groove 14 . The upper surface of the second restraining member 22 may be in contact with the body 10 , and the lower surface of the second restraining member 22 may be in contact with the upper surface of the first restraining member 21 . The second constraining member 22 may have a coefficient of thermal expansion greater than the coefficient of thermal expansion of the first constraining member 21 and smaller than the coefficient of thermal expansion of the body 10 .

In other words, the coefficient of thermal expansion of the first constraining member 21 , the second constraining member 22 and the body 10 has the smallest coefficient of thermal expansion of the first constraining member 21 , and the thermal expansion coefficient of the body 10 is the most it can be big

In this way, as the coefficient of thermal expansion increases sequentially from the lower part to the upper part of the body 10 in the interior of the groove 14, shear failure that may occur when the body 10 is deformed by thermal deformation can be prevented. have.

Between the first constraining member 21 having a relatively small coefficient of thermal expansion and the body 10 having a relatively large coefficient of thermal expansion in the groove 14, the thermal expansion coefficient is greater than that of the first constraining member 21 and the thermal expansion is greater than that of the body 10 By providing the second constraining member 22 having a small coefficient, the difference in the coefficient of thermal expansion between the body 10 and the first constraining member 21 may be reduced.

Specifically, when the body 10 is thermally expanded, the first constraining member 21 and the second constraining member 22 do not allow deformation by restraining the body 10 from being deformed due to thermal expansion. At this time, when the difference between the coefficients of thermal expansion of the first constraining member 21 and the body 10 is large, a shear failure phenomenon may occur in the body 10 .

Therefore, by providing a second constraining member 22 having a relatively large coefficient of thermal expansion than the first constraining member 21 between the first constraining member 21 having a small thermal expansion coefficient and the body 10 having a large thermal expansion coefficient, The second constraint member 22 can relatively absorb thermal deformation due to thermal expansion of the body 10 and prevent shear fracture that may occur in the body 10 .

Alternatively, the coefficient of thermal expansion of the first constraining member 21 may be greater than that of the second constraining member 22 .

As such, the first and second constraining

members

21 and 22 have different coefficients of thermal expansion to prevent shear failure that may occur in the body 10 due to the difference in the abrupt thermal expansion coefficient between the constraining member 20 and the body 10 . can do.

As such, the plurality of constraining members 20 may have different coefficients of thermal expansion, and at least one of the plurality of constraining members 20 may be composed of at least one of a metal material, a composite molding, or a filler. In addition, the plurality of constraining members 20 may have different volumes, heights, areas, or shapes, and may be made of materials having different physical properties, chemical properties, and thermal properties.

본 발명의 바람직한 제3실시 예에 따른 가스 공급장치(1b)Gas supply device (1b) according to a third preferred embodiment of the present invention

Hereinafter, a gas supply device 1b according to a third preferred embodiment of the present invention will be described with reference to FIG. 6 .

In the gas supply apparatus 1b according to the third preferred embodiment of the present invention, the shape of the constraining member 20a of the gas supply apparatus 1 according to the first preferred embodiment of the present invention is different. Accordingly, the description of the gas supply apparatus 1 according to the first preferred embodiment of the present invention described above may be applied to other configurations of the gas supply apparatus 1b according to the third preferred embodiment of the present invention, and overlapping descriptions is omitted.

As shown in FIG. 6 , the gas supply device 1b may be provided in an arc shape in which the constraining members 20a are spaced apart.

The groove 14 may be provided in the form of an arc spaced apart from the lower surface of the body 10 along the circumference of the first region 11 . A plurality of grooves 14 may be provided along the circumference of the first region 11 . The constraint member 20a and the closing member 30a may be provided in the groove 14 to have the same shape as the groove 14 .

When the restraining member 20a is formed in a circular band shape and inserted into the groove 14 , it may be difficult to insert the restraining member 20a into the groove 14 even if a small error occurs in the dimension of the restraining member 20a.

However, if a plurality of grooves 14 are formed in the shape of an arc along the circumference of the first region 11 and the constraint member 20a is formed and inserted in the same way as the shape of the groove 14, the groove 14 is more easily It is possible to insert the constraining member (20a) to the.

Accordingly, by providing the constraining member 20a by forming a plurality of grooves 14 along the periphery of the first region 11 , thermal deformation of the body 10 is not allowed and the constraining member 20a can be more easily removed at the same time. It can be inserted into the groove (14).

본 발명의 바람직한 제4실시 예에 따른 가스 공급장치(1c)Gas supply device (1c) according to a fourth preferred embodiment of the present invention

Hereinafter, a gas supply device 1c according to a fourth preferred embodiment of the present invention will be described with reference to FIG. 7 .

In the gas supply apparatus 1c according to the fourth preferred embodiment of the present invention, the constraint member 20b of the gas supply apparatus 1 according to the first preferred embodiment of the present invention may be configured in a different manner. Accordingly, the description of the gas supply device 1 according to the first preferred embodiment of the present invention described above may be applied to other configurations of the gas supply device 1c according to the fourth preferred embodiment of the present invention, and overlapping descriptions is omitted.

As shown in FIG. 7 , the restraining member 20b may be provided by filling the inside of the groove 14 with a metal material. In other words, the constraining member 20b is formed in the peripheral region of the first region 11 by filling the metal material in a liquid state into the groove 14 and then solidifying the metal material after the groove 14 is formed. 20b) can be provided.

As such, by providing the constraining member 20b in such a way that the metal material is filled in the groove 14, the constraining member can be provided in various shapes regardless of the shape.

본 발명의 바람직한 제5실시 예에 따른 가스 공급장치(1d)Gas supply device (1d) according to a fifth preferred embodiment of the present invention

The gas supply device 1d according to the fifth preferred embodiment of the present invention may be configured by further including the heating wire 40 in the gas supply device 1 according to the first preferred embodiment of the present invention. Accordingly, the description of the gas supply apparatus 1 according to the first preferred embodiment of the present invention described above may be applied to other configurations of the gas supply apparatus 1d according to the fifth preferred embodiment of the present invention, and overlapping descriptions is omitted.

As shown in FIG. 8 , in the gas supply device 1d according to the fifth exemplary embodiment of the present invention, a heating wire 40 may be provided on an upper portion of the restraining member 20 .

The heating wire 40 may be provided on the upper portion of the restraining member 20c inside the groove 14 . In other words, the upper surface of the heating wire 40 may be in contact with the body 10 and the lower surface may be in contact with the upper surface of the restraining member 20c.

The heating wire 40 may be formed in the shape of a circular band having a cross section of a polygonal shape, such as a circle or a square. For example, as shown in FIG. 7A , the heating wire 40 may be formed in a circular band shape having a circular cross-section. At this time, the upper surface of the restraining member 20c in contact with the heating wire 40 may have a seating groove concave inwardly. The heating wire 40 may be provided while being seated in the seating groove of the restraining member 20c.

Alternatively, as shown in FIG. 8(b) , the heating wire 40 may be provided between the groove 14 and the through hole 13 .

As such, by providing the heating wire 40 on the upper surface or the side surface of the restraining member 20c, by reducing the temperature difference between the temperature of the lower portion and the upper portion of the body 10, thermal deformation due to thermal expansion of the body 10 can be prevented. have.

본 발명의 바람직한 제6실시 예에 따른 가스 공급장치(1e)Gas supply device (1e) according to a sixth preferred embodiment of the present invention

Hereinafter, a gas supply device 1e according to a sixth preferred embodiment of the present invention will be described with reference to FIG. 9 .

The gas supply device 1e according to the sixth preferred embodiment of the present invention includes a plurality of grooves 14 and a constraining member 20 in the gas supply device 1 according to the first preferred embodiment of the present invention. can be Accordingly, the description of the gas supply apparatus 1 according to the first preferred embodiment of the present invention described above may be applied to other configurations of the gas supply apparatus 1e according to the sixth preferred embodiment of the present invention, and overlapping descriptions is omitted.

As shown in FIG. 9 , in the gas supply device 1e according to the sixth preferred embodiment of the present invention, a plurality of grooves 14 may be provided in the horizontal direction of the body 10 .

A plurality of grooves 14 may be provided in the second region 12 in a horizontal direction. The grooves 14 have different outer diameters and are provided in plurality, and a restraining member 20 may be provided in any one of the respective grooves 14 .

Specifically, two grooves 14 may be provided in the second region 12 . As shown in FIG. 9( a ), the constraining member 20 may be provided in both of the two grooves 14 .

Alternatively, as shown in FIG. 9( b ), the restraining member 20 may be provided in only one of the two grooves 14 .

In addition, three grooves 14 may be provided in the second region 12 , and as shown in FIG. 9( c ), the restraining member 20 is provided in two grooves 14 among the three grooves 14 . ) may be provided.

That is, the first constraining member 20a may be provided in the groove 14 provided on the inner side of the plurality of grooves 14, and the second constraining member 20b may be provided in the groove 14 provided between the outer side and the inner side. may be provided.

As such, by providing a plurality of grooves 14 in the horizontal direction of the body 10 , thermal deformation due to thermal expansion of the body 10 may not be more reliably allowed.

In addition, by providing a plurality of grooves 14 and selectively providing the constraining members 20 inside the grooves 14 , the number of constraining members 20 is flexibly changed according to the temperature inside the deposition apparatus 2 . Thus, it is possible to effectively cope with thermal deformation due to thermal expansion of the body 10 .

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify the present invention within the scope without departing from the spirit and scope of the present invention described in the claims below. Or it can be carried out by modification.

[Explanation of code]

1, 1a, 1b, 1c, 1d, 1e: gas supply device

10: gas supply

20, 20a, 20b, 20c: constraint member

30: no finish

40: hot wire

Claims

A body comprising: a body including a first area having a through hole and a second area having a groove in a shape surrounding the first area from the outside of the first area; and

and a restraining member provided in the groove and having a thermal expansion coefficient smaller than the thermal expansion coefficient of the body and not allowing thermal deformation of the body.
According to claim 1,

The constraining member is a gas supply device located closer to the lower surface side than the upper surface side of the body.
According to claim 1,

The constraining member is a gas supply device provided with an integral metal band.
According to claim 1,

The constraining member is a gas supply device provided in plurality in the groove.
According to claim 1,

The groove is provided in the form of an arc spaced apart along the circumference of the first region,

A gas supply device in which the constraining member is provided in each of the grooves.
According to claim 1,

The constraining member is a gas supply device filled with a metal material.
According to claim 1,

A gas supply device provided with a heating wire on the upper portion of the restraining member.
A body including a first region having a through hole and a second region having a groove in a shape surrounding the first region from the outside of the first region, and a thermal expansion provided in the groove and smaller than the coefficient of thermal expansion of the body a gas supply device including a restraining member having a coefficient and not allowing thermal deformation of the body; and

A deposition apparatus comprising a; a susceptor having a heater therein.