WO2021167127A1 - Touch sensor module and electronic device using same - Google Patents

Touch sensor module and electronic device using same Download PDF

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Publication number
WO2021167127A1
WO2021167127A1 PCT/KR2020/002387 KR2020002387W WO2021167127A1 WO 2021167127 A1 WO2021167127 A1 WO 2021167127A1 KR 2020002387 W KR2020002387 W KR 2020002387W WO 2021167127 A1 WO2021167127 A1 WO 2021167127A1
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WO
WIPO (PCT)
Prior art keywords
sensor
target
sensors
defense
touch
Prior art date
Application number
PCT/KR2020/002387
Other languages
French (fr)
Korean (ko)
Inventor
김태원
윤성호
김기현
Original Assignee
주식회사 파트론
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Publication of WO2021167127A1 publication Critical patent/WO2021167127A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/0418Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/046Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means

Definitions

  • the present invention relates to a touch sensor module and an electronic device using the same.
  • a touch panel for outputting various operating states and inputting commands such as commands by a touch operation is provided to portable electronic devices such as smart phones and MP3 devices or home appliances such as refrigerators. is attached.
  • the touch panel may include only a touch sensor module for recognizing a user's touch operation, or a display device module for visually outputting information as well as a touch sensor module may be combined together.
  • the display module used in the touch panel is typically an OLED (organic light emitting diode) display device, particularly an active matrix organic light emitting diode (AMOLED) or a liquid crystal display (liquid crystal display). do.
  • OLED organic light emitting diode
  • AMOLED active matrix organic light emitting diode
  • liquid crystal display liquid crystal display
  • the touch sensor module uses a two-dimensional touch sensing method that detects a touch point using the coordinates of the X and Y axes, as well as a three-dimensional touch sensing method that additionally detects the intensity of the touch applied in the Z-axis direction, which is the pressing direction. is becoming
  • the problem to be solved by the present invention is to increase the accuracy of the touch determination operation of the touch sensor module.
  • An electronic device for solving the above problems includes at least one target sensor located below the target area and a plurality of defense sensors located below the non-target area located adjacent to the target area and at least some of the plurality of defense sensors may be electrically connected to at least one of a series connection and a parallel connection.
  • a magnitude of an impedance output from each target sensor may be the same as a magnitude of an impedance output from a plurality of defense sensors electrically connected to each other.
  • the impedance may be inductance, resistance, or capacitance.
  • the one target sensor and the plurality of defense sensors may be formed of a coil, a resistor, or a capacitor.
  • Mounting positions of the target sensor and the plurality of defense sensors may be located on different surfaces.
  • the target sensor may be located on a side portion of the electronic device, and at least one of the plurality of defense sensors may be located on the front portion.
  • a portion of the plurality of defense sensors may be positioned on a side surface, and the target sensor may be positioned between two defense sensors.
  • the number of sensors for the target may be plural, and each sensor for the target may be located between two adjacent sensors for defense.
  • the plurality of target sensors and the defense sensors positioned on both sides of each target sensor may be positioned on a side surface of the electronic device.
  • a touch sensor module includes at least one target sensor positioned under a target area and a plurality of defense sensors positioned under a non-target area positioned adjacent to the target area, wherein the plurality of At least some of the defense sensors may be electrically connected to at least one of a series connection and a parallel connection.
  • a magnitude of an impedance output from each target sensor may be the same as a magnitude of an impedance output from a plurality of defense sensors electrically connected to each other.
  • the impedance may be inductance, resistance or capacitance.
  • the one target sensor and the plurality of defense sensors may be formed of a coil, a resistor, or a capacitor.
  • a defense sensor unit is provided in addition to the target sensor unit. For this reason, a malfunction of the target sensor unit located in the target area is prevented by a touch operation of the non-target area where the defense sensor unit is located by using the operation state of the defense sensor unit.
  • FIG. 1 is a conceptual cross-sectional view of a touch sensor module according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram illustrating an example in which a touch sensor module according to an embodiment of the present invention is applied to a smartphone.
  • 3 to 4B are diagrams illustrating various arrangement examples of a target sensor and a defense reference sensor disposed in a touch sensor module according to an embodiment of the present invention.
  • the touch sensor module when a touch operation is performed according to an operation of a user, etc., in the touch sensor module, a distance change between the touch unit (ie, the touch surface) and the sensor layer generated by the pressure applied to the touched area occurs. Accordingly, the sensor provided in the sensor layer generates and outputs an impedance of the corresponding magnitude according to the generated distance change, and determines whether the corresponding area is touched by using the output change amount of the impedance.
  • the impedance output from the sensor layer may be inductance, resistance, or capacitance.
  • the sensor provided in the sensor layer is a coil, a resistor, or a capacitor. ) can be
  • the touch sensor module 1 shown in FIG. 1 includes a lower film 110 located at the bottom, a sensor for a target (eg, a coil for a target) 1221 located on the lower film 110 and a sensor for defense (eg, for defense)
  • a sensor for a target eg, a coil for a target
  • a sensor for defense eg, for defense
  • the sensor layer 120 in which the coil) 1231 to 1234 are positioned the cover 130 positioned on the sensor layer 120 , and the spacer 140 positioned between the sensor layer 120 and the cover 130 .
  • the target sensor 1221 and the defensive sensor 1231-1234 are described as being a coil as an example.
  • the device may be a device in which the state of an electrical signal outputted by a change in distance according to the .
  • the number of sensors 1221 for the target in FIG. 1 is illustrated as one, it may be plural if necessary, and the number of sensors for defense 1231 to 1234 may also be one or five or more.
  • Each of the lower layer 110 and the cover 130 may be made of a material having high conductivity.
  • the lower layer 110 and the cover 130 are formed in the form of a plate made of a metal such as aluminum (Al) or copper (Cu), and are positioned to correspond to each other on opposite sides with the sensor layer 120 interposed therebetween. .
  • the lower layer 110 and the cover 130 may be made of different materials.
  • the lower layer 110 may be made of a material having a low conductivity and a high dielectric constant
  • the cover 130 may be made of a material having a high conductivity.
  • the material having low conductivity and high dielectric constant may be a material used for shielding polyimide, polyethylene terephthalate (PET), or Electro Magnetic Interference (EMI).
  • PET polyethylene terephthalate
  • EMI Electro Magnetic Interference
  • a magnetic field is applied to the target sensor 1221 and the defensive sensor 1231-1234 located in the sensor layer 120 from the driving signal applying unit.
  • An induced current that is an eddy current is generated in the lower film 110 and the cover 130 according to the generated magnetic field.
  • the intensity of the generated induced current may vary depending on the distance between the corresponding sensors 1221 and 1231-1234 and the corresponding lower layer 110 and the cover 130 . Accordingly, as the distance between the corresponding film such as the corresponding lower film 110 or the cover 130 and the corresponding sensor decreases according to a touch operation of the cover 130 , the corresponding lower film 110 and the cover 130 . ) may increase, and the magnitude of inductance generated in the corresponding sensor decreases due to the increase in the eddy current strength.
  • one example of the touch sensor module 1 of this example uses the change in the intensity of the induced current, and uses the concept of operation of an inductive force sensor.
  • the sensor layer 20 includes a capacitor rather than a coil in the touch sensor module, a change in capacitance is used, and an operation concept of a capacitive force sensor is used.
  • the lower layer 110 may be positioned in contact with the sensor layer 120 through an adhesive or the like below the sensor layer 120 , or may be positioned under the sensor layer 120 through an adhesive layer formed by applying an adhesive.
  • the cover 130 may be positioned to be spaced apart from the corresponding sensors 1221 and 1231-1234 of the sensor layer 120 positioned below by the thickness of the spacer 140 by the spacer 140 .
  • the spacer 140 may also be stably positioned in the corresponding portions of the sensor layer 120 and the cover 130 in contact with them through an adhesive applied to the lower surface and the upper surface thereof.
  • the separation distance between the lower film 110 and the corresponding sensors 1221 and 1231-1234 that is, the interval L11 is the cover 130 and the corresponding sensors 1221 and 1231- spaced apart by the spacer 140 . 1234) and the separation distance (L12) is much narrower.
  • the lower layer 110 may be formed of a single flat plate similar to the cover 130 .
  • the lower layer 110 may perform an electromagnetic shielding function with an electric circuit such as a battery located under the touch sensor module 110 .
  • the touch sensor module 1 accurately controls each sensor 1221 , 1231-1234 according to the degree of touch of the upper film cover 130 without the influence of electromagnetic waves emitted from the electric circuit located on the lower portion. ), the amount of change in inductance is sensed.
  • the lower layer 110 may be omitted if necessary.
  • the cover 130 positioned on the sensor layer 120 may be made of not only a metal material but also a conductive material such as ITO, and has a plate shape covering the entire sensor layer 120 positioned below.
  • the cover 130 may be a touch unit exposed to the outside to directly perform a user's touch operation.
  • a display module including a liquid crystal display device or an organic light emitting display device may be positioned on the cover 130 .
  • the upper film of the display module may be the touch unit.
  • the touch sensor module 1 of this example detects the magnitude of the inductance that changes in proportion to the applied physical force and determines the degree of touch in the Z-axis direction (that is, the thickness direction of the touch sensor module 1).
  • the sensor layer 120 positioned between the lower layer 110 and the cover 130 includes the substrate 121 and at least one target sensor 1221 positioned on the upper and lower surfaces of the substrate 121 and at least one. of the defense sensor (1231-1234) is provided.
  • the substrate 121 may be an insulating substrate made of a non-conductive material.
  • the upper and lower surfaces of the substrate 121 on which the sensors 1221 and 1231-1234 are positioned are molded using epoxy, etc., so that the sensors 1221 and 1231-1234 are placed in the molding part.
  • this molding process can be omitted.
  • the target sensor 1221 positioned on the upper and lower surfaces of the substrate 121 may be positioned under the target region AR1 of the cover 130 to correspond to the target region AR1 .
  • the target area AR1 of the cover 130 is an area in which a normal touch operation is performed to drive the touch sensor module 1 such as a button or a switch operated by a touch operation.
  • the target sensor 1221 may constitute a part of the touch sensor unit.
  • the user prefferably touch the target area AR1 in order to normally operate the button or switch provided with the target sensor unit.
  • the target sensor 1221 may constitute a target sensor unit implemented as a power switch of a smart phone by mounting a smart phone on the side part SS1.
  • the defense sensors 1231-1234 may also be positioned on the upper and lower surfaces of the substrate 121 to be positioned below the non-target area AR2 to correspond to the non-target area AR2 .
  • the non-target area AR2 of the cover 130 is an area excluding the target area AR1 in which a normal touch operation of the touch sensor module 1 is performed, and may be located adjacent to the target area AR1 . .
  • the defense sensors 1231-1234 may also form a part of the touch sensor unit.
  • the defense sensors 1231-1234 may serve to prevent a malfunction of the target sensor 1221 .
  • the touch operation of the non-target area AR2 may be recognized by using the change in inductance of the defense sensors 1231-1234.
  • target sensors 1221 and defense sensors 1231-1234 are arranged in polygonal shapes of various shapes such as a square, circular shapes such as spirals or ovals, and receive an alternating current from the outside.
  • Each target sensor 1221 and defense sensor 1231-1234 may include a plurality of winding portions wound in a polygonal shape, a circular shape, or an oval shape.
  • each of the sensors 1221 and 1231-1234 has an input terminal and an output terminal, and one long line made of a conductive material such as metal is wound in a desired shape, and both ends of the long wire receive a signal input. It may be possible as an input terminal and an output terminal for outputting a signal, respectively.
  • the defense sensors 1231-1234 are electrically connected to each other, and may be connected to at least one of a series connection and a parallel connection to output one inductance.
  • the output from the target sensor 1221 is The magnitude of the inductance and the magnitude of the impedance (eg, inductance) output from the at least one defense sensor 1231-1234 electrically connected to each other may be the same.
  • a signal processing unit (not shown) that determines whether the target area AR1 is touched using signals output from the target sensor 1221 and the at least one defense sensor 1231-1234, respectively. The judgment operation can be performed more easily.
  • a touch sensor module 1 having a sensor for a target (eg, a coil for a target) (TC11) and a sensor for a defense (eg, a coil for a defense) (DC11-DC14) according to an embodiment of the present invention is provided
  • a smartphone 100 is shown as an example of an electronic device that is doing this.
  • the smartphone 100 shown in FIG. 2 may have a display module mounted on the front part FS1.
  • the touch sensor module mounted on the smart phone 100 includes two defense sensors (eg, first and second defense sensors) located on the side portion SS1 of the smart phone 100 (DC11, DC12), a smart phone ( 100) of the front part FS1, that is, two defense sensors (eg, third and fourth defense sensors) (DC113, DC14) located on the front part FS1 of the display module, and the side part of the smartphone 100 ( A single target sensor TC11 located in SS1) may be provided.
  • two defense sensors eg, first and second defense sensors located on the side portion SS1 of the smart phone 100
  • a smart phone ( 100) of the front part FS1 that is, two defense sensors (eg, third and fourth defense sensors) (DC113, DC14) located on the front part FS1 of the display module
  • a single target sensor TC11 located in SS1 may be provided.
  • the plurality of defense sensors (eg, first to fourth defense sensors) DC11-DC14 positioned on the front part FS1 and the side part SS1 of the smartphone 100 are targets positioned on the side part SS1. It may be positioned in a form surrounding the sensor TC11 for use.
  • the first and second defense sensors DC11 and DC12 may be located on both sides of the target sensor TC11 located on the side surface SS1, respectively, and the remaining third and The fourth defense sensors DC13 and DC14 may be located in the area of the front portion FS1 corresponding to the area of the side portion SS1 positioned on both sides of the target sensor TC11 as a reference.
  • the third defense sensor DC13 positioned on the front part FS1 is the front part FS1 corresponding to the area between the first defense sensor DC11 positioned on the side part SS1 and the target sensor TC11.
  • the fourth defense sensor DC14 positioned on the front part FS1 and located on the front part FS1 corresponds to the region between the target sensor TC11 and the second defense sensor DC12 positioned on the side part SS1. It may be located in the area of the front part FS1.
  • the touch sensor module shown in FIG. 2 may have a planar shape as shown in (a) of FIG. 3 .
  • one target sensor TC11 and a plurality of defensive sensors DC11-DC14 are spaced apart from each other on the same substrate 121 , and a plurality of defensive sensors DC11-DC14 ) may be electrically connected to constitute one defensive sensor unit DC10.
  • each of the sensors DC11-DC14 and TC11 has a plurality of winding parts WP11-WP15 wound in a rectangular planar shape, but unlike each sensor DC11- At least one of DC14 and TC11) may include only one winding portion.
  • the target sensor TC11 and the first and second defense sensors DC11 and DC12 are located on the side portion SS1 of the electronic device 100 , and the third and fourth defense sensors The sensors DC13 and DC14 are located on the front part FS1 of the electronic device 100 .
  • the channel of the signal output from the target sensor TC11 may be set as the first channel CH1 as the main channel, and a plurality of electrically connected defensive sensors DC11-DC14, that is, the defensive sensor unit DC10.
  • the channel of the output signal may be determined as the second channel CH2.
  • the plurality of defense sensors DC11-DC14 are electrically connected to each other as previously described.
  • the target sensor TC11 when the electronic device 100 is in a non-operational state in which no touch operation is performed on the target area AR1 and the non-target area AR2 where the corresponding sensor is located, the target sensor TC11 ), the magnitude of the signal output from the first channel CH1 (that is, the magnitude of the inductance) and the magnitude of the signal output from the second channel CH2, the output of the defense sensor unit DC10, may be the same have.
  • the first and second defensive sensors DC11 and DC12 located on the side portion SS1 may be connected in series, and the third and The fourth defense sensors DC13 and DC14 may be connected in series.
  • the corresponding defense sensor groups (DC11 and DC12, DC13 and DC14) connected in series with each other may be connected in parallel again.
  • An equivalent circuit diagram for the target sensor TC11 and the defensive sensor DC11-DC14 may be the same as that of FIG. 3B .
  • the target sensor TC11 and the defensive sensor DC11-DC14 receive a driving signal required for operation from the connected driving signal applying unit 200 and output signal of the corresponding state. , that is, a signal output through the respective channels CH1 and CH2 is applied to a signal processing unit (not shown). For this reason, the signal processing unit determines whether a touch operation has occurred in the target area AR1 in which the target sensor TC11 is located by using the state of the signal input to each channel CH1 and CH2.
  • the target sensor TC11 corresponds to the target area AR1.
  • the generated inductance is greatly reduced by the pressure applied to the target area AR1.
  • the non-target area AR2 of the side portion SS1 adjacent to the target sensor TC11 is heard in the opposite direction of the pressure applied opposite to the target area AR1.
  • the inductance of at least one of the first and second defense sensors DC11 and DC12 may increase due to the lifting phenomenon of the non-target area AR2 of the side portion SS1.
  • the amount of change in inductance of the first and second defense sensors DC11 and DC12 is much smaller than the amount of change in inductance of the target sensor TC11.
  • the state change of the front part FS1 and the side part SS1 can be made opposite to each other, so the defensive sensor located on the side part SS1 (
  • the states (ie, increase or decrease) of data output from DC11 and DC12 and the defense sensors DC13 and DC14 located on the front part FS1 may be opposite to each other.
  • inductance changes of the first and second defense sensors DC11 and DC12 positioned to correspond to the non-target area AR2 of the side part SS1 are generated by the touch operation of the target area AR1, but the amount of change Since it does not affect the touch determination of the target sensor, the touch occurrence determination of the target area (AR1) is normally performed.
  • the inductance output from the target sensor is Compared to the size, the size of the inductance output from the defense sensors (DC11-DC14) connected in series and parallel with each other increases. Accordingly, it is determined that the touch operation does not occur in the target area AR1 even if the touch operation occurs in the portion of the non-target area AR2 adjacent to the target area AR1 .
  • all of the plurality of defense sensors DC11 - may be mounted on a surface different from the surface on which the target sensor TC11 is mounted.
  • the electronic device may be In the case of the same smartphone 100 , the target sensor TC11 may be located on the side portion SS1 of the smartphone, and all of the defense sensors DC11-DC14 may be located on the front portion FS1 of the smartphone.
  • the defense sensors DC11 - DC14 positioned on the front part FS1 may be spaced apart from each other at different positions of the front part FS1 .
  • the number of sensors for the target TC11 may be one, and the number of sensors for defense DC11-DC14 may be four.
  • first and third defense sensors DC11 and DC13 positioned on the front part FS1 may be connected in series, and the second and fourth defense sensors DC12 and DC14 positioned on the front part FS1 are connected in series. can be connected
  • the corresponding defense sensor groups (DC11 and DC13, DC12 and DC14) connected in series with each other may be connected in parallel again.
  • the inductance of the target sensor TC11 significantly changes, that is, decreases, while Since the inductance change of the defensive sensor unit DC10 located on the front part FS1 is connected in series and parallel to each other, a very small change in inductance occurs compared to the target sensor TC11 . Accordingly, the touch state of the target area AR1 can be accurately detected using the change in inductance of the target sensor TC11.
  • the inductance change of the target sensor TC11 located under the target area AR1 is non-target. Since the change in inductance of the defensive sensor unit DC10 located below the area AR2 is much smaller than the change in the inductance, it is determined that the touch operation occurs in the non-target area AR2 instead of the target area AR1 .
  • a plurality of defense sensors DC11-DC14 are positioned to surround the target sensor TC11 positioned to correspond to the target region AR1, and the inductance output from the defense sensor DC11-DC14 is used to surround the non-target region. Whether or not (AR2) is touched is accurately determined.
  • 4A and 4B show another example of a sensor for a target and a sensor for defense.
  • a plurality of target sensors may include two first and second target sensors TC111 and TC112 .
  • the first target sensor TC111 is used for a volume up switch and the second target sensor TC112 is used as a volume down switch. switch) can be used.
  • the first and second target sensors TC111 and TC112 may be located on the same surface, for example, on the side surface SS1 of the smartphone.
  • the plurality of defense sensors may include a total of five first to fifth defense sensors DC111-DC115.
  • the three defense sensors DC111-DC113 located on both sides of the first and second target sensors TC111 and TC112, respectively, may be located on the side part SS1, and the other two sensors for defense DC114, DC115 ) may be located on the front portion FS1, which is a surface other than the side portion SS1.
  • the sensors for each target may be located between two adjacently located defensive sensors (between DC111 and DC112, between DC112 and DC113), and a plurality of sensors for targets (TC111, TC112) and each target
  • the sensors for defense (DC111-DC113) positioned on both sides of the sensors for use (TC111, TC112) may be positioned on the same side (eg, side part) of the electronic device.
  • At least one of the defense sensors DC111-DC113 positioned on the side part SS1 may be positioned on the front part FS1 that is different from the side part SS1 on which the target sensors TC111 and TC112 are positioned.
  • One of the remaining two defense sensors DC114 and DC115 may be positioned to correspond to the first target sensor TC111, and the other one of the other two defense sensors DC114 and DC115 is the second target sensor TC112. ) may be positioned to surround the corresponding target sensors TC111 and TC112, respectively.
  • the first target sensor (TC111) can be surrounded by three defensive sensors (DC111, DC112, DC114), the second target sensor (TC112) is three defensive sensors (DC111, DC112, DC115) can be surrounded by
  • FIG. 4B An example of the electrical connection of the plurality of defense sensors DC111-DC115 is shown in FIG. 4B .
  • the first defense sensor DC111 and the fourth defense sensor DC114 may be connected in series with each other, and the third defense sensor DC113 and the fifth defense sensor DC115 may be connected in series with each other.
  • the two defense sensor groups (DC111 and DC114, DC113 and DC115) connected in series may be connected in parallel with each other.
  • the third defense sensor DC113 may not be electrically connected to the other defense sensors DC111, DC112, DC114, and DC115.
  • the first channel CH11 connected to the first target sensor TC111, the second channel CH12 connected to the second target sensor TC112, and the second defense sensor DC112 The inductance of the corresponding size is measured through the third channel (CH13) connected to each other and the fourth channel (CH14) connected to the first, third, fourth and fifth defensive sensor groups (DC111, DC113, DC115) electrically connected to each other. It may output to a signal processing unit (not shown). Even in this case, the impedance (eg, inductance) output from each channel CH11 to CH14 may have the same magnitude as each other when the electronic device is in a non-operational state by the impedance matching operation.
  • the signal processing unit uses a change in a signal output to each channel CH11-CH14 to first and second target regions in which the first and second target sensors TC111 and TC112 are located. It is possible to determine whether a touch operation is performed and whether a non-touch operation is performed.

Abstract

The present invention relates to a touch sensor module. The touch sensor module comprises: at least one target sensor located below a target area; and a plurality of defense sensors located below a non-target area that is located adjacent to the target area. At least some of the plurality of defense sensors are electrically connected to each other by means of at least one of a series connection and a parallel connection.

Description

터치센서 모듈 및 이를 이용하는 전자 기기Touch sensor module and electronic device using the same
본 발명은 터치센서 모듈 및 이를 이용하는 전자 기기에 관한 것이다.The present invention relates to a touch sensor module and an electronic device using the same.
일반적으로 스마트폰(smart phone), MP3와 같은 휴대용 전자 기기나 냉장고 등의 가전 기기에는 다양한 동작 상태를 출력하고, 터치(touch) 동작에 의한 명령어 등의 입력 동작을 위한 터치 패널(touch panel)이 부착되어 있다.In general, a touch panel for outputting various operating states and inputting commands such as commands by a touch operation is provided to portable electronic devices such as smart phones and MP3 devices or home appliances such as refrigerators. is attached.
따라서, 터치 패널은 사용자의 터치 동작을 인식하기 위한 터치센서 모듈만을 구비하거나, 터치센서 모듈뿐만 아니라 정보를 시각적으로 출력하는 표시장치 모듈도 함께 결합되어 있는 경우도 있다.Accordingly, the touch panel may include only a touch sensor module for recognizing a user's touch operation, or a display device module for visually outputting information as well as a touch sensor module may be combined together.
이때, 터치 패널에 사용되는 표시장치 모듈은 대표적으로 올레드(OLED, organic light emitting diode) 표시 장치, 특히 아몰레드(AMOLED, active matrix organic light emitting diode)나 액정 표시 장치(liquid crystal display)가 이용된다.In this case, the display module used in the touch panel is typically an OLED (organic light emitting diode) display device, particularly an active matrix organic light emitting diode (AMOLED) or a liquid crystal display (liquid crystal display). do.
또한, 터치센서 모듈은 X축과 Y축의 좌표를 이용하여 터치 지점을 감지하는 2차원 터치 감지 방식뿐만 아니라 누르는 방향인 Z축 방향으로 인가되는 터치 강도를 추가로 감지하는 3차원 터치 감지 방식이 이용되고 있다.In addition, the touch sensor module uses a two-dimensional touch sensing method that detects a touch point using the coordinates of the X and Y axes, as well as a three-dimensional touch sensing method that additionally detects the intensity of the touch applied in the Z-axis direction, which is the pressing direction. is becoming
이러한 3차원 터치 감지 방식을 위해, 종래에는 압력 감지부나 이미지 감지부를 이용하여 터치의 강도를 감지하였으나 터치 강도 변화를 정확하게 감지하지 못하는 문제점이 존재한다.For such a three-dimensional touch sensing method, conventionally, although the intensity of the touch is sensed using a pressure sensing unit or an image sensing unit, there is a problem in that a change in the touch strength cannot be accurately detected.
또한, 터치를 감지하는 센서의 설치 위치에 따라서도 정확히 터치 여부를 감지하지 못하는 문제가 발생한다.Also, depending on the installation position of the sensor for detecting the touch, there is a problem in that it is not possible to accurately detect whether the touch has been made.
[선행기술문헌][Prior art literature]
[특허문헌][Patent Literature]
대한민국 등록특허 제10-1777733호(등록일자: 2017년 09월 06일, 발명의 명칭: 이미지센서와 불투명 부재를 이용한 3D 터치 장치)Republic of Korea Patent No. 10-1777733 (Registration date: September 06, 2017, title of invention: 3D touch device using an image sensor and an opaque member)
본 발명이 해결하려는 과제는 터치센서 모듈의 터치 판정 동작의 정확도를 높이기 위한 것이다.The problem to be solved by the present invention is to increase the accuracy of the touch determination operation of the touch sensor module.
상기 과제를 해결하기 위한 본 발명의 한 특징에 따른 전자 기기는 타겟 영역 하부에 위치하는 적어도 하나의 타겟용 센서 및 상기 타겟 영역과 인접하게 위치하고 있는 비타겟 영역 하부에 위치하는 복수 개의 방어용 센서를 포함하고, 상기 복수 개의 방어용 센서 중 적어도 일부는 직렬 연결 및 병렬 연결 중 적어도 하나의 연결로 전기적으로 연결될 수 있다.An electronic device according to one aspect of the present invention for solving the above problems includes at least one target sensor located below the target area and a plurality of defense sensors located below the non-target area located adjacent to the target area and at least some of the plurality of defense sensors may be electrically connected to at least one of a series connection and a parallel connection.
상기 터치센서 모듈이 미동작 상태일 때, 각 타겟용 센서에서 출력되는 임피던스의 크기와 서로 전기적으로 연결된 복수 개의 방어용 센서에서 출력되는 임피던스의 크기는 동일할 수 있다. When the touch sensor module is in a non-operational state, a magnitude of an impedance output from each target sensor may be the same as a magnitude of an impedance output from a plurality of defense sensors electrically connected to each other.
상기 임피던스는 인덕턴스(inductance), 레지스턴스(resistance) 또는 커패시턴스(capacitance)일 수 있다.The impedance may be inductance, resistance, or capacitance.
상기 하나의 타겟용 센서와 상기 복수 개의 방어용 센서는 코일(coil), 저항(resistor) 또는 커패시터(capacitor)로 이루어질 수 있다.The one target sensor and the plurality of defense sensors may be formed of a coil, a resistor, or a capacitor.
상기 타겟용 센서와 복수 개의 방어용 센서의 장착 위치는 서로 다른 면에 위치할 수 있다. Mounting positions of the target sensor and the plurality of defense sensors may be located on different surfaces.
상기 타겟용 센서는 상기 전자 기기의 측면부에 위치하고, 복수 개의 방어용 센서 중 적어도 하나는 전면부에 위치할 수 있다. The target sensor may be located on a side portion of the electronic device, and at least one of the plurality of defense sensors may be located on the front portion.
상기 복수 개의 방어용 센서의 일부가 측면부에 위치하고, 상기 타겟용 센서는 두 개의 방어용 센서 사이에 위치할 수 있다.A portion of the plurality of defense sensors may be positioned on a side surface, and the target sensor may be positioned between two defense sensors.
상기 타겟용 센서의 개수는 복수 개일 수 있고, 각 타겟용 센서는 인접하게 위치한 두 방어용 센서 사이에 위치할 수 있다.The number of sensors for the target may be plural, and each sensor for the target may be located between two adjacent sensors for defense.
복수 개의 타겟용 센서 및 각 타겟용 센서 양 측에 위치하는 상기 방어용 센서는 상기 전자 기기의 측면부에 위치할 수 있다.The plurality of target sensors and the defense sensors positioned on both sides of each target sensor may be positioned on a side surface of the electronic device.
본 발명의 다른 특징에 따른 터치센서 모듈은 타겟 영역 하부에 위치하는 적어도 하나의 타겟용 센서 및 상기 타겟 영역과 인접하게 위치하고 있는 비타겟 영역 하부에 위치하는 복수 개의 방어용 센서를 포함하고, 상기 복수 개의 방어용 센서 중 적어도 일부는 직렬 연결 및 병렬 연결 중 적어도 하나의 연결로 전기적으로 연결될 수 있다.A touch sensor module according to another aspect of the present invention includes at least one target sensor positioned under a target area and a plurality of defense sensors positioned under a non-target area positioned adjacent to the target area, wherein the plurality of At least some of the defense sensors may be electrically connected to at least one of a series connection and a parallel connection.
상기 터치센서 모듈이 미동작 상태일 때, 각 타겟용 센서에서 출력되는 임피던스의 크기와 서로 전기적으로 연결된 복수 개의 방어용 센서에서 출력되는 임피던스의 크기는 동일할 수 있다. When the touch sensor module is in a non-operational state, a magnitude of an impedance output from each target sensor may be the same as a magnitude of an impedance output from a plurality of defense sensors electrically connected to each other.
상기 임피던스는 인덕턴스, 레지스턴스 또는 커패시턴스일 수 있다.The impedance may be inductance, resistance or capacitance.
상기 하나의 타겟용 센서와 상기 복수 개의 방어용 센서는 코일, 저항 또는 커패시터로 이루어질 수 있다.The one target sensor and the plurality of defense sensors may be formed of a coil, a resistor, or a capacitor.
이러한 특징에 따르면, 타겟 센서부 이외에 방어 센서부를 구비하고 있다. 이로 인해, 방어 센서부의 동작 상태를 이용하여, 방어 센서부가 위치한 비타겟 영역의 터치 동작에 의해 타겟 영역에 위치한 타겟 센서부의 오동작이 방지된다.According to this characteristic, a defense sensor unit is provided in addition to the target sensor unit. For this reason, a malfunction of the target sensor unit located in the target area is prevented by a touch operation of the non-target area where the defense sensor unit is located by using the operation state of the defense sensor unit.
따라서, 터치센서 모듈에서의 터치 여부 판정 동작의 정확도가 크게 향상된다.Accordingly, the accuracy of the touch determination operation in the touch sensor module is greatly improved.
이에 따라, 터치센서 모듈을 구비하는 기기에 장착되어 있는 터치 구동 소자의 정확한 터치 판정 동작이 이루어져 해당 기기의 동작의 신뢰성이 향상된다.Accordingly, an accurate touch determination operation of the touch driving element mounted on the device including the touch sensor module is performed, and thus the reliability of the operation of the device is improved.
도 1은 본 발명의 일 실시예에 따른 터치센서 모듈의 개념적인 단면도이다.1 is a conceptual cross-sectional view of a touch sensor module according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 터치센서 모듈이 스마트폰에 적용된 예를 도시한 개략도이다.2 is a schematic diagram illustrating an example in which a touch sensor module according to an embodiment of the present invention is applied to a smartphone.
도 3 내지 도 4b는 본 발명의 일 실시예에 따른 터치센서 모듈에 배치되어 있는 타겟용 센서와 방어용 기준 센서의 다양한 배치 예를 도시한 도면이다. 3 to 4B are diagrams illustrating various arrangement examples of a target sensor and a defense reference sensor disposed in a touch sensor module according to an embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 실시예들을 상세히 설명한다. 본 발명을 설명하는데 있어서, 해당 분야에 이미 공지된 기술 또는 구성에 대한 구체적인 설명을 부가하는 것이 본 발명의 요지를 불분명하게 할 수 있다고 판단되는 경우에는 상세한 설명에서 이를 일부 생략하도록 한다. 또한, 본 명세서에서 사용되는 용어들은 본 발명의 실시예들을 적절히 표현하기 위해 사용된 용어들로서, 이는 해당 분야의 관련된 사람 또는 관례 등에 따라 달라질 수 있다. 따라서, 본 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is determined that adding a detailed description of a technique or configuration already known in the relevant field may make the gist of the present invention unclear, some of these will be omitted from the detailed description. In addition, the terms used in this specification are terms used to properly express the embodiments of the present invention, which may vary according to a person or custom in the relevant field. Accordingly, definitions of these terms should be made based on the content throughout this specification.
여기서 사용되는 전문용어는 단지 특정 실시예를 언급하기 위한 것이며, 본 발명을 한정하는 것을 의도하지 않는다. 여기서 사용되는 단수 형태들은 문구들이 이와 명백히 반대의 의미를 나타내지 않는 한 복수 형태들도 포함한다. 명세서에서 사용되는 '포함하는'의 의미는 특정 특성, 영역, 정수, 단계, 동작, 요소 및/또는 성분을 구체화하며, 다른 특정 특성, 영역, 정수, 단계, 동작, 요소, 성분 및/또는 군의 존재나 부가를 제외시키는 것은 아니다.The terminology used herein is for the purpose of referring to specific embodiments only, and is not intended to limit the invention. As used herein, the singular forms also include the plural forms unless the phrases clearly indicate the opposite. As used herein, the meaning of 'comprising' specifies a particular characteristic, region, integer, step, operation, element and/or component, and other specific characteristic, region, integer, step, operation, element, component, and/or group. It does not exclude the existence or addition of
이하, 첨부된 도면을 참고로 하여 본 발명의 일 실시예에 따른 터치센서 모듈 및 이를 이용하는 전자 기기에 대해서 설명하도록 한다.Hereinafter, a touch sensor module and an electronic device using the same according to an embodiment of the present invention will be described with reference to the accompanying drawings.
본 예에서, 터치센서 모듈은 사용자 등의 동작에 따라 터치 동작이 이루어질 때, 터치된 영역에 인가되는 압력에 의해 발생하는 터치부(즉, 터치면)과 센서층과의 거리 변화가 발생한다. 이에 따라, 센서층에 구비된 센서는 발생하는 거리 변화에 따라 해당 크기의 임피던스(impedance)를 발생시켜 출력하여, 출력되는 임피던스의 변화량을 이용하여 해당 영역의 터치 여부를 판정하게 된다.In the present example, when a touch operation is performed according to an operation of a user, etc., in the touch sensor module, a distance change between the touch unit (ie, the touch surface) and the sensor layer generated by the pressure applied to the touched area occurs. Accordingly, the sensor provided in the sensor layer generates and outputs an impedance of the corresponding magnitude according to the generated distance change, and determines whether the corresponding area is touched by using the output change amount of the impedance.
이때, 센서층에서 출력되는 임피던스는 인덕턴스(inductance), 레지스턴스(resistance) 또는 커패시턴스(capacitance)일 수 있고, 이를 위해, 센서층에 구비된 센서는 코일(coil), 저항(resistor) 또는 커패시터(capacitance)일 수 있다. In this case, the impedance output from the sensor layer may be inductance, resistance, or capacitance. For this purpose, the sensor provided in the sensor layer is a coil, a resistor, or a capacitor. ) can be
이러한 본 발명의 일 실시예에 따른 터치센서 모듈(1)의 한 예를 도 1을 참고로 하여 설명한다.An example of such a touch sensor module 1 according to an embodiment of the present invention will be described with reference to FIG. 1 .
도 1에 도시한 터치센서 모듈(1)은 맨 하부에 위치하는 하부막(110), 하부막(110) 위에 위치하고 타겟용 센서(예, 타겟용 코일)(1221)와 방어용 센서(예, 방어용 코일)(1231~1234)가 위치하는 센서층(120), 센서층(120) 위에 위치하는 커버(130), 그리고 센서층(120)과 커버(130) 사이에 위치하는 간격재(140)를 구비할 수 있다. The touch sensor module 1 shown in FIG. 1 includes a lower film 110 located at the bottom, a sensor for a target (eg, a coil for a target) 1221 located on the lower film 110 and a sensor for defense (eg, for defense) The sensor layer 120 in which the coil) 1231 to 1234 are positioned, the cover 130 positioned on the sensor layer 120 , and the spacer 140 positioned between the sensor layer 120 and the cover 130 . can be provided
이하에서, 타겟용 센서(1221)와 방어용 센서(1231-1234)는, 위에 기술한 것처럼, 코일(coil)인 것을 일 예로 설명하지만, 이미 기술한 것처럼 이에 한정되지 않고 저항이나 커패시터와 같이 터치 동작에 따른 거리 변화에 의해 출력되는 전기적인 신호의 상태가 변화는 소자일 수 있다. Hereinafter, the target sensor 1221 and the defensive sensor 1231-1234, as described above, are described as being a coil as an example. The device may be a device in which the state of an electrical signal outputted by a change in distance according to the .
또한, 도 1에서 타겟용 센서(1221)의 개수는 한 개로 도시되어 있지만, 필요에 따라 복수 개일 수 있고, 또한 방어용 센서(1231~1234)의 개수 역시 한 개이거나 5개 이상일 수 있다.In addition, although the number of sensors 1221 for the target in FIG. 1 is illustrated as one, it may be plural if necessary, and the number of sensors for defense 1231 to 1234 may also be one or five or more.
하부막(110) 및 커버(130)은 각각 전도성이 높은 물질로 이루어질 수 있다. 이 경우, 하부막(110) 및 커버(130)은 알루미늄(Al)이나 구리(Cu)와 같은 금속으로 이루어진 판 형태로 이루어져 있고, 센서층(120)을 사이에 두고 서로 반대편에서 대응되게 위치하고 있다.Each of the lower layer 110 and the cover 130 may be made of a material having high conductivity. In this case, the lower layer 110 and the cover 130 are formed in the form of a plate made of a metal such as aluminum (Al) or copper (Cu), and are positioned to correspond to each other on opposite sides with the sensor layer 120 interposed therebetween. .
하지만, 하부막(110)과 커버(130)은 서로 다른 물질로 이루어질 수 있다. 이 경우, 하부막(110)은 전도성이 낮고 유전율이 높은 물질로 이루어질 수 있고 커버(130)은 전도성이 높은 물질로 이루어질 수 있다.However, the lower layer 110 and the cover 130 may be made of different materials. In this case, the lower layer 110 may be made of a material having a low conductivity and a high dielectric constant, and the cover 130 may be made of a material having a high conductivity.
이때, 전도성이 낮고 유전율이 높은 물질은 폴리이미드(polyimid), PET(polyethylene terephthalate) 또는 EMI(Electro Magnetic Interference) 차폐를 위해 사용되는 물질일 수 있다.In this case, the material having low conductivity and high dielectric constant may be a material used for shielding polyimide, polyethylene terephthalate (PET), or Electro Magnetic Interference (EMI).
구동신호 인가부로부터 센서층(120)에 위치한 타겟용 센서(1221)와 방어용 센서(1231-1234)로 교류 전류가 인가되면, 타겟용 센서(1221)와 방어용 센서(1231-1234)에는 자기장이 발생하고 발생된 자기장에 따라 하부막(110) 및 커버(130)에는 와전류인 유도 전류가 발생한다.When an alternating current is applied to the target sensor 1221 and the defensive sensor 1231-1234 located in the sensor layer 120 from the driving signal applying unit, a magnetic field is applied to the target sensor 1221 and the defensive sensor 1231-1234. An induced current that is an eddy current is generated in the lower film 110 and the cover 130 according to the generated magnetic field.
이때, 발생되는 유도 전류의 세기는 해당 센서(1221, 1231-1234)와 해당 하부막(110) 및 커버(130) 간의 거리에 따라 달라질 수 있다. 따라서, 커버(130) 등의 터치 동작에 따라, 해당 하부막(110)이나 커버(130)와 같은 해당 막과 이에 대응하는 해당 센서와의 거리가 감소할수록 해당 하부막(110)과 커버(130)에 형성되는 와전류의 세기는 증가할 수 있고, 와전류 세기의 증가로 인해 해당 센서에서 발생하는 인덕턴스(inductance)의 크기가 반대로 감소하게 된다. In this case, the intensity of the generated induced current may vary depending on the distance between the corresponding sensors 1221 and 1231-1234 and the corresponding lower layer 110 and the cover 130 . Accordingly, as the distance between the corresponding film such as the corresponding lower film 110 or the cover 130 and the corresponding sensor decreases according to a touch operation of the cover 130 , the corresponding lower film 110 and the cover 130 . ) may increase, and the magnitude of inductance generated in the corresponding sensor decreases due to the increase in the eddy current strength.
따라서, 본 예의 터치센서 모듈(1)의 한 예는 이러한 유도 전류의 세기 변화를 이용한 것으로서, 인덕턴스 포스 센서(inductive force sensor)의 동작 개념을 사용한다. Therefore, one example of the touch sensor module 1 of this example uses the change in the intensity of the induced current, and uses the concept of operation of an inductive force sensor.
하지만, 터치센서 모듈에서 센서층(20)이 코일이 아닌 커패시터를 구비하는 경우, 커패시턴스의 변화를 이용한 것으로서, 정정용량 포스 센서(capacitance force sensor)의 동작 개념을 사용한다. However, in the case where the sensor layer 20 includes a capacitor rather than a coil in the touch sensor module, a change in capacitance is used, and an operation concept of a capacitive force sensor is used.
이러한 하부막(110)은 센서층(120) 하부에 접착제 등을 통해 센서층(120)과 접하게 위치하거나 접착제 도포에 형성된 접착층을 통해 센서층(120) 하부에 위치할 수 있다.The lower layer 110 may be positioned in contact with the sensor layer 120 through an adhesive or the like below the sensor layer 120 , or may be positioned under the sensor layer 120 through an adhesive layer formed by applying an adhesive.
또한, 커버(130)는 간격재(140)에 의해 간격재(140)의 두께만큼 하부에 위치한 센서층(120)의 해당 센서(1221, 1231-1234)와 이격되게 위치할 수 있다.In addition, the cover 130 may be positioned to be spaced apart from the corresponding sensors 1221 and 1231-1234 of the sensor layer 120 positioned below by the thickness of the spacer 140 by the spacer 140 .
간격재(140) 역시 자신의 하부면과 상부면에 도포된 접착제 등을 통해 이들과 각각 접하는 센서층(120) 및 커버(130)의 해당 부분에 안정적으로 위치할 수 있다.The spacer 140 may also be stably positioned in the corresponding portions of the sensor layer 120 and the cover 130 in contact with them through an adhesive applied to the lower surface and the upper surface thereof.
따라서, 하부막(110)과 각 해당 센서(1221, 1231-1234) 간의 이격 거리 즉, 간격(L11)은 간격재(140)에 의해 이격되어 있는 커버(130)과 해당 센서(1221, 1231-1234)와의 이격 거리(L12)보다 훨씬 좁다.Accordingly, the separation distance between the lower film 110 and the corresponding sensors 1221 and 1231-1234, that is, the interval L11 is the cover 130 and the corresponding sensors 1221 and 1231- spaced apart by the spacer 140 . 1234) and the separation distance (L12) is much narrower.
본 예에서, 하부막(110)은 커버(130)과 동일하게 하나의 평판으로 이루어질 수 있다.In this example, the lower layer 110 may be formed of a single flat plate similar to the cover 130 .
하부막(110)은 터치센서 모듈(110)의 하부에 위치하는 배터리(battery) 등과 같은 전기 회로와의 전자기 차폐(electromagnetic shielding) 기능을 수행할 수 있다.The lower layer 110 may perform an electromagnetic shielding function with an electric circuit such as a battery located under the touch sensor module 110 .
따라서, 하부막(110)에 의해, 터치센서 모듈(1)은 하부에 위치한 전기 회로에서 방출되는 전자기파의 영향 없이 상부막인 커버(130)의 터치 정도에 따라 정확하게 각 센서(1221, 1231-1234)의 인덕턴스의 변화량이 감지된다.Accordingly, by the lower film 110 , the touch sensor module 1 accurately controls each sensor 1221 , 1231-1234 according to the degree of touch of the upper film cover 130 without the influence of electromagnetic waves emitted from the electric circuit located on the lower portion. ), the amount of change in inductance is sensed.
이러한 하부막(110)은 필요에 따라 생략될 수 있다.The lower layer 110 may be omitted if necessary.
센서층(120)의 상부에 위치하는 커버(130)는 금속 물질뿐만 아니라 ITO와 같은 도전성 물질로도 이루어질 수 있고, 하부에 위치하고 있는 센서층(120) 전체를 덮고 있는 판 형태로 이루어져 있다.The cover 130 positioned on the sensor layer 120 may be made of not only a metal material but also a conductive material such as ITO, and has a plate shape covering the entire sensor layer 120 positioned below.
이러한 커버(130)는 외부로 노출되어 사용자의 터치 동작이 직접적으로 이루어지는 터치부일 수 있다.The cover 130 may be a touch unit exposed to the outside to directly perform a user's touch operation.
하지만, 대안적인 예에서, 커버(130) 상부에는 액정 표시 장치이나 유기 발광 표시 장치 등으로 이루어진 표시장치 모듈이 위치할 수 있다. 이 경우, 사용자에 의한 직접적인 터치 동작이 이루어지는 부분은 표시장치 모듈의 상부막이므로, 표시장치 모듈의 상부막이 터치부가 될 수 있다. However, in an alternative example, a display module including a liquid crystal display device or an organic light emitting display device may be positioned on the cover 130 . In this case, since the portion where a direct touch operation is performed by the user is the upper film of the display module, the upper film of the display module may be the touch unit.
이와 같이, 사용자에 의해 터치부인 커버(130)의 터치 동작이 이루어지면, 터치 동작 시 인가되는 물리적인 힘에 비례하게 커버(130)는 휘어지고, 터치 지점에서 커버(130)와 센서층(120) 간의 거리가 감소하여 터치 지점에 대응하는 코일인 해당 센서(1221, 1231-1234)의 인덕턴스가 변하게 된다. In this way, when a touch operation of the cover 130, which is the touch unit, is performed by the user, the cover 130 is bent in proportion to the physical force applied during the touch operation, and the cover 130 and the sensor layer 120 at the touch point. ), the inductance of the corresponding sensors 1221 and 1231-1234, which are coils corresponding to the touch point, is changed.
따라서, 본 예의 터치센서 모듈(1)은 인가되는 물리적인 힘과 비례하여 변하는 인덕턴스의 크기를 감지해 Z축 방향[즉 터치센처 모듈(1)의 두께 방향]으로의 터치 정도를 판정한다.Accordingly, the touch sensor module 1 of this example detects the magnitude of the inductance that changes in proportion to the applied physical force and determines the degree of touch in the Z-axis direction (that is, the thickness direction of the touch sensor module 1).
하부막(110)과 커버(130) 사이에 위치하는 센서층(120)은 기판(121)과 기판(121)의 상부면과 하부면에 위치하는 적어도 하나의 타겟용 센서(1221)와 적어도 하나의 방어용 센서(1231-1234)를 구비한다.The sensor layer 120 positioned between the lower layer 110 and the cover 130 includes the substrate 121 and at least one target sensor 1221 positioned on the upper and lower surfaces of the substrate 121 and at least one. of the defense sensor (1231-1234) is provided.
이때, 기판(121)은 비도전성 물질로 이루어진 절연 기판일 수 있다.In this case, the substrate 121 may be an insulating substrate made of a non-conductive material.
도 1에서, 센서(1221, 1231-1234)가 위치하는 기판(121)의 상부면과 하부면에는 에폭시(epoxy) 등을 이용하여 몰딩 처리가 이루어져 센서(1221, 1231-1234)는 몰딩부 속에 위치하지만, 이러한 몰딩 처리는 생략될 수 있다.In FIG. 1, the upper and lower surfaces of the substrate 121 on which the sensors 1221 and 1231-1234 are positioned are molded using epoxy, etc., so that the sensors 1221 and 1231-1234 are placed in the molding part. However, this molding process can be omitted.
기판(121)의 상부면과 하부면에 위치하고 있는 타겟용 센서(1221)는 커버(130)의 타겟 영역(AR1) 하부에 위치하여 타겟 영역(AR1)에 대응되게 위치할 수 있다.The target sensor 1221 positioned on the upper and lower surfaces of the substrate 121 may be positioned under the target region AR1 of the cover 130 to correspond to the target region AR1 .
본 예에서, 커버(130)의 타겟 영역(AR1)은 터치 동작에 의해 동작되는 버튼이나 스위치 등의 터치센서 모듈(1)을 구동시키기 위해 정상적인 터치 동작이 이루어지는 영역이다. 이때, 타겟용 센서(1221)는 터치 센서부의 일부를 구성할 수 있다.In this example, the target area AR1 of the cover 130 is an area in which a normal touch operation is performed to drive the touch sensor module 1 such as a button or a switch operated by a touch operation. In this case, the target sensor 1221 may constitute a part of the touch sensor unit.
따라서, 사용자는 타겟 센서부를 구비한 버튼이나 스위치를 정상적으로 동작시키기 위해서는 타겟 영역(AR1)을 터치하는 것이 좋다. Accordingly, it is preferable for the user to touch the target area AR1 in order to normally operate the button or switch provided with the target sensor unit.
이러한 타겟용 센서(1221)는 스마트폰(smart phone)이 측면부(SS1)에 장착되어 스마트폰의 전원 스위치 등으로 구현된 타겟 센서부를 구성할 수 있다.The target sensor 1221 may constitute a target sensor unit implemented as a power switch of a smart phone by mounting a smart phone on the side part SS1.
방어용 센서(1231-1234) 역시 기판(121)의 상부면과 하부면에 위치하여 비타겟 영역(AR2)의 하부에 위치하여 비타겟 영역(AR2)에 대응되게 위치할 수 있다.The defense sensors 1231-1234 may also be positioned on the upper and lower surfaces of the substrate 121 to be positioned below the non-target area AR2 to correspond to the non-target area AR2 .
본 예에서, 커버(130)의 비타겟 영역(AR2)은 터치센서 모듈(1)의 정상적인 터치 동작이 이루어지는 타겟 영역(AR1)을 제외한 영역으로서, 타겟 영역(AR1)과 인접하게 위치할 수 있다.In this example, the non-target area AR2 of the cover 130 is an area excluding the target area AR1 in which a normal touch operation of the touch sensor module 1 is performed, and may be located adjacent to the target area AR1 . .
이러한 방어용 센서(1231-1234) 역시 터치 센서부의 일부를 구성할 수 있다.The defense sensors 1231-1234 may also form a part of the touch sensor unit.
방어용 센서(1231-1234)는 타겟용 센서(1221)의 오동작을 방지하기 위한 역할을 수행할 수 있다.The defense sensors 1231-1234 may serve to prevent a malfunction of the target sensor 1221 .
즉, 타겟 용역(AR1)이 아닌 비타겟 영역(AR2)의 터치 동작에 의해, 타겟 영역(AR1)에 대응하게 위치한 커버(130)의 부분과 타겟용 센서(1221) 간의 거리 변화가 발생하더라도, 방어용 센서(1231-1234)의 인덕턴스 변화를 이용하여 비타겟 영역(AR2)의 터치 동작이 인식될 수 있도록 한다.That is, even if a change in the distance between the part of the cover 130 positioned corresponding to the target area AR1 and the target sensor 1221 occurs by a touch operation of the non-target area AR2 rather than the target area AR1, The touch operation of the non-target area AR2 may be recognized by using the change in inductance of the defense sensors 1231-1234.
이러한 방어용 센서(1231-1234)의 동작에 대해서는 다음에 좀 더 상세히 설명한다.The operation of these defense sensors 1231-1234 will be described in more detail next.
이러한 타겟용 센서(1221)와 방어용 센서(1231-1234)는 사각형과 같은 다양한 형태의 다각형 형태, 나선형과 같은 원형 형태나 타원형 형태로 배치되어 있고, 외부로부터 교류 전류를 인가받는다. These target sensors 1221 and defense sensors 1231-1234 are arranged in polygonal shapes of various shapes such as a square, circular shapes such as spirals or ovals, and receive an alternating current from the outside.
각 타겟용 센서(1221)와 방어용 센서(1231-1234)는 다각형 형태, 원형 형태 또는 타원형 형태로 권선된 복수 개의 권선 부분을 구비할 수 있다.Each target sensor 1221 and defense sensor 1231-1234 may include a plurality of winding portions wound in a polygonal shape, a circular shape, or an oval shape.
이때, 각 센서(1221, 1231-1234)는 입력단과 출력단을 갖고 있고 금속과 같은 도전 물질로 이루어져 있는 하나의 긴 선(line)이 원하는 형태로 권선되어 있고, 긴 선의 양 단은 신호의 입력이 이루어지는 입력단과 신호의 출력이 이루어지는 출력단으로 각각 가능할 수 있다.At this time, each of the sensors 1221 and 1231-1234 has an input terminal and an output terminal, and one long line made of a conductive material such as metal is wound in a desired shape, and both ends of the long wire receive a signal input. It may be possible as an input terminal and an output terminal for outputting a signal, respectively.
또한, 방어용 센서(1231-1234)는 전기적으로 서로 연결되어 있어, 직렬 연결 및 병렬 연결 중 적어도 하나로 연결되어 하나의 인덕턴스를 출력할 수 있다.In addition, the defense sensors 1231-1234 are electrically connected to each other, and may be connected to at least one of a series connection and a parallel connection to output one inductance.
이때, 터치센서 모듈(1)의 비동작 상태, 즉 타겟 영역(AR1)과 비타겟 영역(AR2)에 어떠한 물리적인 압력이 인가되지 않은 비터치 상태일 때, 타겟용 센서(1221)에서 출력되는 인덕턴스의 크기와 서로 전기적으로 연결되어 있는 적어도 하나의 방어용 센서(1231-1234)에서 출력되는 임피던스(예, 인덕턴스)의 크기는 서로 동일할 수 있다. 이러한 임피던스 매칭이 이루어질 경우, 타겟용 센서(1221)와 적어도 하나의 방어용 센서(1231-1234)에서 각각 출력되는 신호를 이용하여 타겟 영역(AR1)의 터치 여부를 판단하는 신호 처리부(미도시)의 판단 동작이 좀 더 용이하게 행해질 수 있다. At this time, when the touch sensor module 1 is in a non-operational state, that is, in a non-touch state in which no physical pressure is applied to the target area AR1 and the non-target area AR2, the output from the target sensor 1221 is The magnitude of the inductance and the magnitude of the impedance (eg, inductance) output from the at least one defense sensor 1231-1234 electrically connected to each other may be the same. When such impedance matching is performed, a signal processing unit (not shown) that determines whether the target area AR1 is touched using signals output from the target sensor 1221 and the at least one defense sensor 1231-1234, respectively. The judgment operation can be performed more easily.
다음, 도 2 내지 도 4b를 참고하여, 도 1에 도시된 터치센서 모듈에 구비된 타겟용 센서와 방어용 센서의 다양한 예를 설명한다. Next, various examples of a sensor for a target and a sensor for defense provided in the touch sensor module shown in FIG. 1 will be described with reference to FIGS. 2 to 4B .
도 2에는 본 발명의 일 실시예에 따른 타겟용 센서(예, 타겟용 코일)(TC11)와 방어용 센서(예, 방어용 코일)(DC11-DC14)를 구비하고 있는 터치센서 모듈(1)을 구비하고 있는 전자 기기의 한 예로서 스마트폰(100)이 도시되어 있다. 2, a touch sensor module 1 having a sensor for a target (eg, a coil for a target) (TC11) and a sensor for a defense (eg, a coil for a defense) (DC11-DC14) according to an embodiment of the present invention is provided A smartphone 100 is shown as an example of an electronic device that is doing this.
도 2에 도시한 스마트폰(100)은 표시장치 모듈이 전면부(FS1)에 장착되어 있을 수 있다. The smartphone 100 shown in FIG. 2 may have a display module mounted on the front part FS1.
이러한 스마트폰(100)에 장착되어 있는 터치센서 모듈은 스마트폰(100)의 측면부(SS1)에 위치한 두 개의 방어용 센서(예, 제1 및 제2 방어용 센서)(DC11, DC12), 스마트폰(100)의 전면부(FS1), 즉 표시장치 모듈의 전면부(FS1)에 위치한 두 개의 방어용 센서(예, 제3 및 제4 방어용 센서)(DC113, DC14) 및 스마트폰(100)의 측면부(SS1)에 위치한 하나의 타겟용 센서(TC11)를구비할 수 있다.The touch sensor module mounted on the smart phone 100 includes two defense sensors (eg, first and second defense sensors) located on the side portion SS1 of the smart phone 100 (DC11, DC12), a smart phone ( 100) of the front part FS1, that is, two defense sensors (eg, third and fourth defense sensors) (DC113, DC14) located on the front part FS1 of the display module, and the side part of the smartphone 100 ( A single target sensor TC11 located in SS1) may be provided.
이때, 스마트폰(100)의 전면부(FS1)와 측면부(SS1)에 위치하고 있는 복수 개의 방어용 센서(예, 제1 내지 제4 방어용 센서)(DC11-DC14)는 측면부(SS1)에 위치하는 타겟용 센서(TC11)를 에워싸고 있는 형태로 위치할 수 있다.At this time, the plurality of defense sensors (eg, first to fourth defense sensors) DC11-DC14 positioned on the front part FS1 and the side part SS1 of the smartphone 100 are targets positioned on the side part SS1. It may be positioned in a form surrounding the sensor TC11 for use.
예를 들어, 도 2에 도시한 것처럼, 측면부(SS1)에 위치한 타겟용 센서(TC11)의 양 측에 각각 제1 및 제2 방어용 센서(DC11, DC12)가 위치할 수 있고, 나머지 제3 및 제4 방어용 센서(DC13, DC14)는 타겟용 센서(TC11)를 기준으로 양쪽에 각각 위치하는 측면부(SS1)의 영역과 대응하는 전면부(FS1)의 영역에 위치할 수 있다.For example, as shown in FIG. 2 , the first and second defense sensors DC11 and DC12 may be located on both sides of the target sensor TC11 located on the side surface SS1, respectively, and the remaining third and The fourth defense sensors DC13 and DC14 may be located in the area of the front portion FS1 corresponding to the area of the side portion SS1 positioned on both sides of the target sensor TC11 as a reference.
이때, 전면부(FS1)에 위치하는 제3 방어용 센서(DC13)는 측면부(SS1)에 위치한 제1 방어용 센서(DC11)와 타겟용 센서(TC11) 사이의 영역에 대응되는 전면부(FS1)의 영역에 위치할 수 있고, 전면부(FS1)에 위치하는 제4 방어용 센서(DC14)는 측면부(SS1)에 위치한 타겟용 센서(TC11)와 제2 방어용 센서(DC12)와 사이의 영역에 대응되는 전면부(FS1)의 영역에 위치할 수 있다.At this time, the third defense sensor DC13 positioned on the front part FS1 is the front part FS1 corresponding to the area between the first defense sensor DC11 positioned on the side part SS1 and the target sensor TC11. The fourth defense sensor DC14 positioned on the front part FS1 and located on the front part FS1 corresponds to the region between the target sensor TC11 and the second defense sensor DC12 positioned on the side part SS1. It may be located in the area of the front part FS1.
도 2에 도시한 터치센서 모듈은 도 3의 (a)와 같은 평면 형상을 가질 수 있다.The touch sensor module shown in FIG. 2 may have a planar shape as shown in (a) of FIG. 3 .
도 3의 (a)에 도시한 것처럼, 하나의 타겟용 센서(TC11)와 복수 개의 방어용 센서(DC11-DC14)는 동일한 기판(121)에 서로 이격되게 위치하고 있고, 복수 개의 방어용 센서(DC11-DC14)는 전기적으로 연결되어 하나의 방어용 센서부(DC10)를 구성할 수 있다.As shown in (a) of FIG. 3 , one target sensor TC11 and a plurality of defensive sensors DC11-DC14 are spaced apart from each other on the same substrate 121 , and a plurality of defensive sensors DC11-DC14 ) may be electrically connected to constitute one defensive sensor unit DC10.
도 3의 (a)를 참고하면, 각 센서(DC11-DC14, TC11)는 모두 사각형의 평면 형상으로 권선되어 있는 복수 개의 권선 부분(WP11-WP15)을 구비하고 있지만, 이와 달리 각 센서(DC11-DC14, TC11) 중 적어도 하나는 하나의 권선 부분만을 구비할 수 있다.Referring to (a) of FIG. 3 , each of the sensors DC11-DC14 and TC11 has a plurality of winding parts WP11-WP15 wound in a rectangular planar shape, but unlike each sensor DC11- At least one of DC14 and TC11) may include only one winding portion.
이미 설명한 것처럼, 도 3의 (a)에서 타겟용 센서(TC11)와 제1 및 제2 방어용 센서(DC11, DC12)는 전자 기기(100)의 측면부(SS1)에 위치하고, 제3 및 제4 방어용 센서(DC13, DC14)는 전자 기기(100)의 전면부(FS1)에 위치하고 있다.As already described, in (a) of FIG. 3 , the target sensor TC11 and the first and second defense sensors DC11 and DC12 are located on the side portion SS1 of the electronic device 100 , and the third and fourth defense sensors The sensors DC13 and DC14 are located on the front part FS1 of the electronic device 100 .
이때, 타겟용 센서(TC11)에서 출력되는 신호의 채널은 메인 채널로서 제1 채널(CH1)로 정할 수 있고, 전기적으로 서로 연결된 복수 개의 방어용 센서(DC11-DC14) 즉 방어용 센서부(DC10)에서 출력되어 신호의 채널은 제2 채널(CH2)로 정할 수 있다.At this time, the channel of the signal output from the target sensor TC11 may be set as the first channel CH1 as the main channel, and a plurality of electrically connected defensive sensors DC11-DC14, that is, the defensive sensor unit DC10. The channel of the output signal may be determined as the second channel CH2.
따라서, 하나의 채널(CH2)을 구성하는 복수 개의 방어용 센서(DC11-DC14)간의 간섭을 최소화하고 메인 채널인 제1 채널(CH1)과의 임피던스 매칭을 위해, 복수 개의 방어용 센서(DC11-DC14)는 이미 기술한 것처럼 서로 전기적으로 연결되어 있다. Therefore, in order to minimize the interference between the plurality of defense sensors DC11-DC14 constituting one channel CH2 and to match the impedance with the first channel CH1, which is the main channel, the plurality of defense sensors DC11-DC14 are electrically connected to each other as previously described.
이로 인해, 이미 기술한 것처럼, 해당 센서가 위치하고 있는 타겟 영역(AR1)과 비타겟 영역(AR2)에 어떠한 터치 동작이 이루어지지 않는 전자 기기(100)의 미동작 상태일 때, 타겟용 센서(TC11)에서 출력인 제1 채널(CH1)에서 출력되는 신호의 크기(즉, 인덕턴스의 크기)와 방어용 센서부(DC10)의 출력인 제2 채널(CH2)에서 출력되는 신호의 크기는 서로 동일할 수 있다. For this reason, as described above, when the electronic device 100 is in a non-operational state in which no touch operation is performed on the target area AR1 and the non-target area AR2 where the corresponding sensor is located, the target sensor TC11 ), the magnitude of the signal output from the first channel CH1 (that is, the magnitude of the inductance) and the magnitude of the signal output from the second channel CH2, the output of the defense sensor unit DC10, may be the same have.
방어용 센서부(DC10)의 전기적인 연결의 한 예로서, 측면부(SS1)에 위치한 제1 및 제2 방어용 센서(DC11, DC12)는 직렬로 연결될 수 있고, 전면부(FS1)에 위치한 제3 및 제4 방어용 센서(DC13, DC14)는 직렬로 연결될 수 있다. 또한 서로 직렬로 연결된 해당 방어용 센서군(DC11 및 DC12, DC13 및 DC14)는 다시 병렬로 연결될 수 있다.As an example of the electrical connection of the defensive sensor unit DC10, the first and second defensive sensors DC11 and DC12 located on the side portion SS1 may be connected in series, and the third and The fourth defense sensors DC13 and DC14 may be connected in series. In addition, the corresponding defense sensor groups (DC11 and DC12, DC13 and DC14) connected in series with each other may be connected in parallel again.
이러한 타겟용 센서(TC11)와 방어용 센서(DC11-DC14)에 대한 등가 회로도는 도 3의 (b)와 같을 수 있다.An equivalent circuit diagram for the target sensor TC11 and the defensive sensor DC11-DC14 may be the same as that of FIG. 3B .
도 3의 (b)에 도시한 것처럼, 타겟용 센서(TC11)와 방어용 센서(DC11-DC14)는 연결되어 있는 구동신호 인가부(200)로부터 동작에 필요한 구동 신호를 수신하여 해당 상태의 출력 신호, 즉 각 해당 채널(CH1, CH2)을 통해 출력되는 신호를 신호 처리부(미도시)로 인가한다. 이로 인해, 신호 처리부는 각 채널(CH1, CH2)로 입력되는 신호의 상태를 이용하여 타겟용 센서(TC11)가 위치하는 타겟 영역(AR1)에 터치 동작이 발생했는 지의 여부를 판단하게 된다.As shown in (b) of FIG. 3 , the target sensor TC11 and the defensive sensor DC11-DC14 receive a driving signal required for operation from the connected driving signal applying unit 200 and output signal of the corresponding state. , that is, a signal output through the respective channels CH1 and CH2 is applied to a signal processing unit (not shown). For this reason, the signal processing unit determines whether a touch operation has occurred in the target area AR1 in which the target sensor TC11 is located by using the state of the signal input to each channel CH1 and CH2.
이런 경우, 사용자에 의해 올바르게 타겟 영역(AR1)이 터치되어 터치된 타겟 영역(AR1)의 부분이 압력이 인가되는 방향으로 눌리게 되면, 타겟 영역(AR1)에 대응되게 타겟용 센서(TC11)에서 발생하는 인덕턴스는 타겟 영역(AR1)에 인가되는 압력에 의해 크게 감소한다.In this case, when the target area AR1 is correctly touched by the user and the touched portion of the target area AR1 is pressed in the direction in which the pressure is applied, the target sensor TC11 corresponds to the target area AR1. The generated inductance is greatly reduced by the pressure applied to the target area AR1.
하지만, 이러한 타겟 영역(AR1)의 터치 동작에 의해, 타겟용 센서(TC11)에 인접한 측면부(SS1)의 비타겟 영역(AR2)은 타겟 영역(AR1)과는 반대로 인가되는 압력의 반대 방향으로 들리게 될 수 있고, 이러한 측면부(SS1)의 비타겟 영역(AR2)의 들림 현상에 의해, 제1 및 제2 방어용 센서(DC11, DC12) 중 적어도 하나의 인덕턴스는 증가할 수 있다. 하지만, 이러한 제1 및 제2 방어용 센서(DC11, DC12)의 인덕턴스 변화량은 타겟용 센서(TC11)의 인덕턴스의 변화량보다 훨씬 작다.However, by the touch operation of the target area AR1, the non-target area AR2 of the side portion SS1 adjacent to the target sensor TC11 is heard in the opposite direction of the pressure applied opposite to the target area AR1. The inductance of at least one of the first and second defense sensors DC11 and DC12 may increase due to the lifting phenomenon of the non-target area AR2 of the side portion SS1. However, the amount of change in inductance of the first and second defense sensors DC11 and DC12 is much smaller than the amount of change in inductance of the target sensor TC11.
이때, 전면부(FS1)인 비타겟 영역(AR2)에는 사용자의 터치 동작으로 인한 압력 변화가 거의 없으므로, 서로 직렬로 연결된 제3 및 제4 방어용 센서(DC13, DC14)에 따른 인덕턴스의 변화는 거의 발생하지 않게 된다.At this time, since there is almost no pressure change due to a user's touch operation in the non-target area AR2 that is the front part FS1 , the change in inductance according to the third and fourth defense sensors DC13 and DC14 connected in series with each other is almost non-existent. won't happen
이와 같이, 전면부(FS1)나 측면부(SS1)에 터치 동작이 발생할 경우, 전면부(FS1)와 측면부(SS1)의 상태 변화가 서로 반대로 이루어질 수 있으므로, 측면부(SS1)에 위치하는 방어용 센서(DC11, DC12)와 전면부(FS1)에 위치하는 방어용 센서(DC13, DC14)에서 출력되는 데이터의 상태(즉, 증가 또는 감소)는 서로 반대일 수 있다. As such, when a touch operation occurs on the front part FS1 or the side part SS1, the state change of the front part FS1 and the side part SS1 can be made opposite to each other, so the defensive sensor located on the side part SS1 ( The states (ie, increase or decrease) of data output from DC11 and DC12 and the defense sensors DC13 and DC14 located on the front part FS1 may be opposite to each other.
따라서, 타겟 영역(AR1)의 터치 동작에 의해, 측면부(SS1)의 비타겟 영역(AR2)에 대응되게 위치한 제1 및 제2 방어용 센서(DC11, DC12)의 인덕턴스 변화가 발생하지만, 그 변화량이 타겟 센서의 터치 판단에 영향을 미치지 않게 되어 타겟 영역(AR1)의 터치 발생 판단은 정상적으로 이루어지게 됩니다.Accordingly, inductance changes of the first and second defense sensors DC11 and DC12 positioned to correspond to the non-target area AR2 of the side part SS1 are generated by the touch operation of the target area AR1, but the amount of change Since it does not affect the touch determination of the target sensor, the touch occurrence determination of the target area (AR1) is normally performed.
하지만, 사용자의 오동작이나 사용자의 의지에 무관하게 전면부(FS1)나 측면부(SS1)의 비타겟 영역(AR2)이 외부적인 압력이 가해져 터치된 상태가 발생하는 경우, 타겟 센서에서 출력되는 인덕턴스의 크기에 비해 서로 직렬 및 병렬로 연결된 방어용 센서(DC11-DC14)에서 출력되는 인덕턴스의 크기가 증가하게 된다. 이로 인해, 타겟 영역(AR1)에 인접한 비타겟 영역(AR2)의 부분에 터치 동작이 발생하더라도 타겟 영역(AR1)에는 터치 동작이 발생하지 않은 것으로 판단된다. However, when the non-target area AR2 of the front part FS1 or the side part SS1 is touched by external pressure regardless of the user's malfunction or the user's will, the inductance output from the target sensor is Compared to the size, the size of the inductance output from the defense sensors (DC11-DC14) connected in series and parallel with each other increases. Accordingly, it is determined that the touch operation does not occur in the target area AR1 even if the touch operation occurs in the portion of the non-target area AR2 adjacent to the target area AR1 .
도 2와 달리, 복수 개의 방어용 센서(DC11-(DC14) 모두는 타겟용 센서(TC11)가 장착되어 있는 면과 다른 면에 장착될 수 있다. 예를 들어, 전자 기기가 도 2에 도시한 것과 같은 스마트폰(100)인 경우, 타겟용 센서(TC11)는 스마트폰의 측면부(SS1)에 위치하고, 방어용 센서(DC11-DC14) 모두는 스마트폰의 전면부(FS1)에 위치할 수 있다. Unlike Fig. 2, all of the plurality of defense sensors DC11 - (DC14) may be mounted on a surface different from the surface on which the target sensor TC11 is mounted. For example, the electronic device may be In the case of the same smartphone 100 , the target sensor TC11 may be located on the side portion SS1 of the smartphone, and all of the defense sensors DC11-DC14 may be located on the front portion FS1 of the smartphone.
이때, 전면부(FS1)에 모두 위치하는 방어용 센서(DC11-DC14)는 전면부(FS1)의 서로 다른 위치에 이격되게 위치할 수 있다. 이런 경우에도, 도 2 및 도 3의 (a)와 같이, 타겟용 센서(TC11)의 개수는 하나이고, 방어용 센서(DC11-DC14)의 개수는 네 개일 수 있다.In this case, the defense sensors DC11 - DC14 positioned on the front part FS1 may be spaced apart from each other at different positions of the front part FS1 . Even in this case, as shown in FIGS. 2 and 3 ( a ), the number of sensors for the target TC11 may be one, and the number of sensors for defense DC11-DC14 may be four.
이와 같이, 복수 개의 방어용 센서(DC11-DC14)가 모두 타겟용 센서(TC11)가 위치한 면(SS1)과 다른 면인 전면부(FS1)에 위치할 때, 복수 개의 방어용 센서(DC11-DC14)의 전기적인 연결의 예는 다음과 같을 수 있다(도 3의 (c) 참고). In this way, when the plurality of defense sensors DC11-DC14 are all located on the front part FS1 that is different from the surface SS1 where the target sensor TC11 is located, the electricity of the plurality of defense sensors DC11-DC14 An example of a formal connection may be as follows (refer to (c) of FIG. 3).
즉, 전면부(FS1)에 위치한 제1 및 제3 방어용 센서(DC11, DC13)는 직렬로 연결될 수 있고, 전면부(FS1)에 위치한 제2 및 제4 방어용 센서(DC12, DC14)는 직렬로 연결될 수 있다. 또한 서로 직렬로 연결된 해당 방어용 센서군(DC11 및 DC13, DC12 및 DC14)는 다시 병렬로 연결될 수 있다.That is, the first and third defense sensors DC11 and DC13 positioned on the front part FS1 may be connected in series, and the second and fourth defense sensors DC12 and DC14 positioned on the front part FS1 are connected in series. can be connected In addition, the corresponding defense sensor groups (DC11 and DC13, DC12 and DC14) connected in series with each other may be connected in parallel again.
이런 경우, 타겟 영역(AR1)인 전자 기기(100)의 측면부(SS1)에 터치가 발생하면, 이미 기술한 것처럼, 타겟용 센서(TC11)의 인덕턴스는 큰 폭으로 변화하여, 즉 감소하는 반면, 전면부(FS1)에 위치한 방어용 센서부(DC10)의 인덕턴스 변화는 서로 직렬 및 병렬로 연결되어 있으므로 타겟용 센서(TC11)보다 매우 적은 인덕턴스 변화를 발생하게 된다. 따라서, 타겟용 센서(TC11)의 인덕턴스 변화를 이용하여 정확하게 타겟 영역(AR1)의 터치 상태가 감지될 수 있게 된다.In this case, when a touch occurs on the side portion SS1 of the electronic device 100, which is the target area AR1, as already described, the inductance of the target sensor TC11 significantly changes, that is, decreases, while Since the inductance change of the defensive sensor unit DC10 located on the front part FS1 is connected in series and parallel to each other, a very small change in inductance occurs compared to the target sensor TC11 . Accordingly, the touch state of the target area AR1 can be accurately detected using the change in inductance of the target sensor TC11.
하지만, 타겟 영역(AR1)이 아닌 전면부(FS1)의 어느 한 부분에 압력이 인가되어 터치 동작이 이루어지게 되면, 타겟 영역(AR1) 하부에 위치한 타겟용 센서(TC11)의 인덕턴스 변화는 비타겟 영역(AR2) 하부에 위치한 방어용 센서부(DC10)의 인덕턴스 변화보다 훨씬 작게 되므로, 타겟 영역(AR1)이 아닌 비타겟 영역(AR2)에 터치 동작이 발생한 상태로 판단된다.However, when a touch operation is performed by applying pressure to any part of the front part FS1 other than the target area AR1, the inductance change of the target sensor TC11 located under the target area AR1 is non-target. Since the change in inductance of the defensive sensor unit DC10 located below the area AR2 is much smaller than the change in the inductance, it is determined that the touch operation occurs in the non-target area AR2 instead of the target area AR1 .
이와 같이, 타겟 영역(AR1)에 대응되게 위치한 타겟용 센서(TC11)를 에워싸게 복수 개의 방어용 센서(DC11-DC14)가 위치하여 방어용 센서(DC11-DC14)에서 출력되는 인덕턴스를 이용하여 비타겟 영역(AR2)의 터치 여부가 정확히 판정된다.In this way, a plurality of defense sensors DC11-DC14 are positioned to surround the target sensor TC11 positioned to correspond to the target region AR1, and the inductance output from the defense sensor DC11-DC14 is used to surround the non-target region. Whether or not (AR2) is touched is accurately determined.
따라서, 비타겟 영역(AR2)에 터치 동작이 발생함에도 타겟 영역(AR1)이 터치한 상태로 잘못 판단되는 오동작이 크게 감소한다.Accordingly, even when a touch operation occurs in the non-target area AR2 , an erroneous operation that is erroneously determined as a touch state in the target area AR1 is greatly reduced.
도 4a 및 도 4b는 타겟용 센서와 방어용 센서의 다른 예를 도시한다.4A and 4B show another example of a sensor for a target and a sensor for defense.
도 4a에 도시한 것처럼, 본 예에서, 타겟용 센서는 복수 개로서 일 예로 2개인 제1 및 제2 타겟용 센서(TC111, TC112)를 구비할 수 있다. 이때, 전자 기기가 도 2에 도시한 것과 같이 스마트폰일 때, 제1 타겟용 센서(TC111)는 볼륨 업 스위치(volume up switch)에 사용되고 제2 타겟용 센서(TC112)를 볼륨 다운 스위치(volume down switch)에 사용될 수 있다.As shown in FIG. 4A , in this example, a plurality of target sensors may include two first and second target sensors TC111 and TC112 . At this time, when the electronic device is a smart phone as shown in FIG. 2 , the first target sensor TC111 is used for a volume up switch and the second target sensor TC112 is used as a volume down switch. switch) can be used.
이런 경우, 제1 및 제2 타겟용 센서(TC111, TC112)는 동일한 면, 예를 들어, 스마트폰의 측면부(SS1)에 위치할 수 있다.In this case, the first and second target sensors TC111 and TC112 may be located on the same surface, for example, on the side surface SS1 of the smartphone.
또한, 복수 개의 방어용 센서는 총 5개인 제1 내지 제5 방어용 센서(DC111-DC115)를 구비할 수 있다.In addition, the plurality of defense sensors may include a total of five first to fifth defense sensors DC111-DC115.
제1 및 제2 타겟용 센서(TC111, TC112)의 양 측에 각각 위치하는 세 개의 방어용 센서(DC111-DC113)는 모두 측면부(SS1)에 위치할 수 있고, 나머지 두 개의 방어용 센서(DC114, DC115)는 측면부(SS1)가 아닌 다른 면인 전면부(FS1)에 위치할 수 있다. The three defense sensors DC111-DC113 located on both sides of the first and second target sensors TC111 and TC112, respectively, may be located on the side part SS1, and the other two sensors for defense DC114, DC115 ) may be located on the front portion FS1, which is a surface other than the side portion SS1.
이로 인해, 각 타겟용 센서(TC111, TC112)는 인접하게 위치한 두 방어용 센서 사이(DC111 및 DC112 사이, DC112 및 DC113 사이)에 위치할 수 있고, 복수 개의 타겟용 센서(TC111, TC112)와 각 타겟용 센서(TC111, TC112) 양 측에 위치하는 방어용 센서(DC111-DC113)는 전자 기기의 동일한 면(예, 측면부)에 위치할 수 있다.Due to this, the sensors for each target (TC111, TC112) may be located between two adjacently located defensive sensors (between DC111 and DC112, between DC112 and DC113), and a plurality of sensors for targets (TC111, TC112) and each target The sensors for defense (DC111-DC113) positioned on both sides of the sensors for use (TC111, TC112) may be positioned on the same side (eg, side part) of the electronic device.
하지만, 측면부(SS1)에 위치한 방어용 센서(DC111-DC113) 중 적어도 하나는 타겟용 센서(TC111, TC112)가 위치한 측면부(SS1)와 다른 면인 전면부(FS1)에 위치할 수 있다.However, at least one of the defense sensors DC111-DC113 positioned on the side part SS1 may be positioned on the front part FS1 that is different from the side part SS1 on which the target sensors TC111 and TC112 are positioned.
나머지 두 개의 방어용 센서(DC114, DC115) 중 하나는 제1 타겟용 센서(TC111)에 대응되게 위치할 수 있고, 나머지 두 개의 방어용 센서(DC114, DC115) 중 다른 하나는 제2 타겟용 센서(TC112)에 대응되게 위치하여, 각각 대응하는 해당 타겟용 센서(TC111, TC112)를 에워싸게 위치할 수 있다.One of the remaining two defense sensors DC114 and DC115 may be positioned to correspond to the first target sensor TC111, and the other one of the other two defense sensors DC114 and DC115 is the second target sensor TC112. ) may be positioned to surround the corresponding target sensors TC111 and TC112, respectively.
이로 인해, 제1 타겟용 센서(TC111)는 세 개의 방어용 센서(DC111, DC112, DC114)로 에워싸여질 수 있고, 제2 타겟용 센서(TC112)는 세 개의 방어용 센서(DC111, DC112, DC115)로 에워싸여질 수 있다.Due to this, the first target sensor (TC111) can be surrounded by three defensive sensors (DC111, DC112, DC114), the second target sensor (TC112) is three defensive sensors (DC111, DC112, DC115) can be surrounded by
이러한 복수 개의 방어용 센서(DC111-DC115)의 전기적인 연결의 한 예는 도 4b와 같다. An example of the electrical connection of the plurality of defense sensors DC111-DC115 is shown in FIG. 4B .
즉, 제1 방어용 센서(DC111)와 제4 방어용 센서(DC114)는 서로 직렬로 연결될 수 있고, 제3 방어용 센서(DC113)와 제5 방어용 센서(DC115)는 서로 직렬로 연결될 수 있다. 이때, 직렬로 연결된 두 방어용 센서군(DC111 및 DC114, DC113 및 DC115)은 서로 병렬로 연결될 수 있다. That is, the first defense sensor DC111 and the fourth defense sensor DC114 may be connected in series with each other, and the third defense sensor DC113 and the fifth defense sensor DC115 may be connected in series with each other. At this time, the two defense sensor groups (DC111 and DC114, DC113 and DC115) connected in series may be connected in parallel with each other.
이때, 제3 방어용 센서(DC113)는 다른 방어용 센서(DC111, DC112, DC114, DC115)와 전기적인 연결이 이루어지지 않을 수 있다.In this case, the third defense sensor DC113 may not be electrically connected to the other defense sensors DC111, DC112, DC114, and DC115.
따라서, 도 4b와 같은 경우, 제1 타겟용 센서(TC111)에 연결된 제1 채널(CH11), 제2 타겟용 센서(TC112)에 연결된 제2 채널(CH12), 제2 방어용 센서(DC112)에 연결된 제3 채널(CH13) 및 서로 전기적으로 연결된 제1, 제3, 제4 및 제5 방어용 센서군(DC111, DC113, DC115)에 연결된 제4 채널(CH14)을 통해 각 해당하는 크기의 인덕턴스를 신호 처리부(미도시)로 출력할 수 있다. 이 경우에도, 임피던스 매칭 동작에 의해, 전자 기기가 미동작 상태일 때, 각 채널(CH11-CH14)에서 출력되는 임피던스(예, 인덕턴스)의 크기를 서로 동일할 수 있다. Accordingly, in the case of FIG. 4B , the first channel CH11 connected to the first target sensor TC111, the second channel CH12 connected to the second target sensor TC112, and the second defense sensor DC112 The inductance of the corresponding size is measured through the third channel (CH13) connected to each other and the fourth channel (CH14) connected to the first, third, fourth and fifth defensive sensor groups (DC111, DC113, DC115) electrically connected to each other. It may output to a signal processing unit (not shown). Even in this case, the impedance (eg, inductance) output from each channel CH11 to CH14 may have the same magnitude as each other when the electronic device is in a non-operational state by the impedance matching operation.
이에 따라, 신호 처리부는 위에 기술한 것처럼, 각 채널(CH11-CH14)로 출력되는 신호의 변화를 이용하여 제1 및 제2 타겟용 센서(TC111, TC112)가 위치하는 제1 및 제2 타겟 영역의 터치 동작 여부 및 비터치 동작 여부를 판단할 수 있다.Accordingly, as described above, the signal processing unit uses a change in a signal output to each channel CH11-CH14 to first and second target regions in which the first and second target sensors TC111 and TC112 are located. It is possible to determine whether a touch operation is performed and whether a non-touch operation is performed.
이상, 본 발명의 터치센서 모듈의 실시예들에 대해 설명하였다. 본 발명은 상술한 실시예 및 첨부한 도면에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자의 관점에서 다양한 수정 및 변형이 가능할 것이다. 따라서 본 발명의 범위는 본 명세서의 청구범위뿐만 아니라 이 청구범위와 균등한 것들에 의해 정해져야 한다.Above, embodiments of the touch sensor module of the present invention have been described. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and variations will be possible from the point of view of those of ordinary skill in the art to which the present invention pertains. Accordingly, the scope of the present invention should be defined not only by the claims of the present specification, but also by those claims and their equivalents.

Claims (13)

  1. 타겟 영역 하부에 위치하는 적어도 하나의 타겟용 센서; 및at least one target sensor positioned below the target area; and
    상기 타겟 영역과 인접하게 위치하고 있는 비타겟 영역 하부에 위치하는 복수 개의 방어용 센서A plurality of defense sensors positioned below the non-target area adjacent to the target area
    를 포함하고,including,
    상기 복수 개의 방어용 센서 중 적어도 일부는 직렬 연결 및 병렬 연결 중 적어도 하나의 연결로 전기적으로 연결되어 있는At least some of the plurality of defense sensors are electrically connected to at least one of a series connection and a parallel connection.
    전자 기기. Electronics.
  2. 제1 항에서,In claim 1,
    상기 터치센서 모듈이 미동작 상태일 때, 각 타겟용 센서에서 출력되는 임피던스의 크기와 서로 전기적으로 연결된 복수 개의 방어용 센서에서 출력되는 임피던스의 크기는 동일한 전자 기기.When the touch sensor module is in a non-operational state, the magnitude of the impedance output from each target sensor and the magnitude of the impedance output from the plurality of defense sensors electrically connected to each other are the same.
  3. 제2 항에서,In claim 2,
    상기 임피던스는 인덕턴스(inductance), 레지스턴스(resistance) 또는 커패시턴스(capacitance)인 전자 기기.The impedance is an inductance (inductance), resistance (resistance) or capacitance (capacitance) of the electronic device.
  4. 제1 항에서,In claim 1,
    상기 하나의 타겟용 센서와 상기 복수 개의 방어용 센서는 코일(coil), 저항(resistor) 또는 커패시터(capacitor)로 이루어진 전자 기기.The one target sensor and the plurality of defense sensors are electronic devices comprising a coil, a resistor, or a capacitor.
  5. 제1 항에서,In claim 1,
    상기 타겟용 센서와 복수 개의 방어용 센서의 장착 위치는 서로 다른 면에 위치하는 전자 기기.An electronic device in which the target sensor and the plurality of defense sensors are mounted on different surfaces.
  6. 제5 항에서,In claim 5,
    상기 타겟용 센서는 상기 전자 기기의 측면부에 위치하고, 복수 개의 방어용 센서 중 적어도 하나는 전면부에 위치하는 전자 기기.The target sensor is located on a side portion of the electronic device, and at least one of the plurality of defense sensors is located on the front portion of the electronic device.
  7. 제5 항에서,In claim 5,
    상기 복수 개의 방어용 센서의 일부가 측면부에 위치하고, 상기 타겟용 센서는 두 개의 방어용 센서 사이에 위치하는 전자 기기.An electronic device in which a portion of the plurality of defense sensors is positioned on a side surface, and the target sensor is positioned between two defense sensors.
  8. 제1 항에서,In claim 1,
    상기 타겟용 센서의 개수는 복수 개이고,The number of sensors for the target is a plurality,
    각 타겟용 센서는 인접하게 위치한 두 방어용 센서 사이에 위치하는 전자 기기.Each target sensor is an electronic device positioned between two adjacent defensive sensors.
  9. 제8 항에서,In claim 8,
    복수 개의 타겟용 센서 및 각 타겟용 센서 양 측에 위치하는 상기 방어용 센서는 상기 전자 기기의 측면부에 위치하는 전자 기기.The plurality of sensors for the target and the sensors for defense located on both sides of the sensors for each target are located on a side surface of the electronic device.
  10. 타겟 영역 하부에 위치하는 적어도 하나의 타겟용 센서; 및at least one target sensor positioned below the target area; and
    상기 타겟 영역과 인접하게 위치하고 있는 비타겟 영역 하부에 위치하는 복수 개의 방어용 센서A plurality of defense sensors positioned below the non-target area adjacent to the target area
    를 포함하고,including,
    상기 복수 개의 방어용 센서 중 적어도 일부는 직렬 연결 및 병렬 연결 중 적어도 하나의 연결로 전기적으로 연결되어 있는At least some of the plurality of defense sensors are electrically connected to at least one of a series connection and a parallel connection.
    터치센서 모듈. touch sensor module.
  11. 제10 항에서,11. In claim 10,
    상기 터치센서 모듈이 미동작 상태일 때, 각 타겟용 센서에서 출력되는 임피던스의 크기와 서로 전기적으로 연결된 복수 개의 방어용 센서에서 출력되는 임피던스의 크기는 동일한 터치센서 모듈.When the touch sensor module is in a non-operational state, the magnitude of the impedance output from each target sensor and the magnitude of the impedance output from the plurality of defense sensors electrically connected to each other are the same.
  12. 제11 항에서,In claim 11,
    상기 임피던스는 인덕턴스, 레지스턴스 또는 커패시턴스인 터치센서 모듈.The impedance is an inductance, resistance or capacitance touch sensor module.
  13. 제11 항에서,In claim 11,
    상기 하나의 타겟용 센서와 상기 복수 개의 방어용 센서는 코일, 저항 또는 커패시터로 이루어진 터치센서 모듈.The one target sensor and the plurality of defense sensors are a touch sensor module composed of a coil, a resistor, or a capacitor.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6310611B1 (en) * 1996-12-10 2001-10-30 Touchsensor Technologies, Llc Differential touch sensor and control circuit therefor
EP1253717A2 (en) * 2001-04-28 2002-10-30 RAWE ELECTRONIC GmbH Capacitive keyboard with evaluation circuit
WO2006019810A2 (en) * 2004-07-15 2006-02-23 Tyco Electronics Corporation Contaminant detecting touch sensitive element
KR20140029662A (en) * 2012-08-29 2014-03-11 삼성전기주식회사 Digitizer
KR20190094990A (en) * 2018-02-06 2019-08-14 (주)파트론 Touch sensor module and touch panel having the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101777733B1 (en) 2016-08-29 2017-09-13 한국생산기술연구원 3D touch divice having image sensors and opaque members

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6310611B1 (en) * 1996-12-10 2001-10-30 Touchsensor Technologies, Llc Differential touch sensor and control circuit therefor
EP1253717A2 (en) * 2001-04-28 2002-10-30 RAWE ELECTRONIC GmbH Capacitive keyboard with evaluation circuit
WO2006019810A2 (en) * 2004-07-15 2006-02-23 Tyco Electronics Corporation Contaminant detecting touch sensitive element
KR20140029662A (en) * 2012-08-29 2014-03-11 삼성전기주식회사 Digitizer
KR20190094990A (en) * 2018-02-06 2019-08-14 (주)파트론 Touch sensor module and touch panel having the same

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