WO2019245123A1

WO2019245123A1 - Touch sensor module

Info

Publication number: WO2019245123A1
Application number: PCT/KR2018/016848
Authority: WO
Inventors: 윤성호; 김기현; 박종찬
Original assignee: 주식회사 파트론
Priority date: 2018-06-22
Filing date: 2018-12-28
Publication date: 2019-12-26
Also published as: KR20200000061A; KR102127986B1

Abstract

The present invention relates to a touch sensor module. The touch sensor module comprises: a bobbin unit having a substrate and an insertion pole protruding from the substrate; a coil unit formed of a coil wire and inserted into the insertion pole; a circuit board connected to the coil unit; and an upper membrane spaced apart by a predetermined distance above the coil unit, wherein the coil unit includes a plurality of coil layers stacked along the height direction of the insertion pole.

Description

Touch sensor module

The present invention relates to a touch sensor module.

In general, a portable electronic device such as a smart phone, an MP3, or a home appliance such as a refrigerator is provided with a touch sensor panel for inputting or switching a command using a touch operation. .

The touch sensor module is not only a two-dimensional touch sensing method for detecting a touch point using coordinates of the X and Y axes, but also a three-dimensional touch sensing method for additionally detecting a touch intensity applied in the Z-axis direction.

For such a three-dimensional touch sensing method, there is a problem in that, although a magnitude of pressure applied to a corresponding point is detected or an intensity of a touch is sensed in an image, a change in touch intensity cannot be accurately sensed.

In addition, many areas are required to form a sensing pattern for generating an electrical signal according to a touch operation, and thus the installation position of the touch sensor module is limited.

Prior art literature

Republic of Korea Patent No. 10-1777733 (Registration date: September 06, 2017, the title of the invention: 3D touch device using an image sensor and an opaque member)

The problem to be solved by the present invention is to reduce the installation area of the touch sensor module.

Another object of the present invention is to improve the sensitivity of the touch sensor module.

The touch sensor module according to an aspect of the present invention for solving the above problems consists of a bobbin portion having a substrate and an insertion pillar protruding from the substrate, a coil line and a coil portion inserted into the insertion pillar, the coil portion. And a circuit board connected to each other, and an upper layer spaced apart from each other by a predetermined distance on the coil unit, wherein the coil unit includes a plurality of coil layers stacked along a height direction of the insertion pillar.

The circuit board is located below the substrate of the bobbin portion,

The substrate may include an opening through which a leader line extending from the coil line of the coil part passes.

The circuit board may include a conductive pad electrically connected to the leader line, and the conductive pad may be exposed through the opening to be connected to the leader line.

The touch sensor module according to the above feature may further include a reinforcement plate positioned below the circuit board.

The reinforcement plate may be made of polyimide or stainless steel.

The insertion pillar may protrude from the substrate toward the upper layer.

The circuit board may be positioned on the substrate of the bobbin part and include a through hole through which the insertion pillar passes.

The coil unit may pass through the through hole.

The coil unit may be positioned in direct contact with an upper surface of the circuit board.

The insertion pillar may protrude from the substrate toward the circuit board.

The insertion pillar may be positioned in direct contact with the upper surface of the circuit board.

The touch sensor module according to the above feature may further include support pillars protruding from the substrate toward the circuit board at both sides of the insertion pillar.

The touch sensor module according to the above feature may further include a spacer positioned between the upper layer and the plurality of coil units.

The touch sensor module according to the above feature may further include a spacer positioned between the upper layer and the substrate of the bobbin portion.

The upper layer may be made of metal.

The bobbin portion may be made of metal, plastic or ferrite.

The touch sensor module according to the above feature may further include an electromagnetic wave blocking film attached to a lower surface of the circuit board.

The bobbin part and the number of the coil parts positioned in the bobbin part may be plural, respectively, and the plurality of bobbin parts may be spaced apart from each other at predetermined intervals along the extending direction of the substrate.

According to the characteristics of the present invention, since each coil part is made of coil lines wound around the X, Y, and Z axes, the coil part has a larger number of turns than the case of forming a winding part by printing a pattern on a corresponding surface.

Moreover, since the coil part of this example has laminated | stacked several coil layers sequentially along the height direction of a bobbin part, the number of turns of each coil part further increases.

Therefore, compared with the case of printing the pattern to form the coil part, since the inductance size of each coil part can be greatly improved, the sensitivity of the touch sensor module is greatly improved.

In addition, since each coil part is formed using a coil wire having a diameter much thinner than the width of the pattern, the formation area of the coil part is greatly reduced.

Therefore, since the touch sensor module of the present example is located in a region having a narrow width, such as a side having a narrow width, in a product to which the touch sensor module is applied, the freedom of design of the touch sensor module is greatly improved.

1 is a perspective view of a touch sensor module according to an embodiment of the present invention.

FIG. 2 is an exploded front view of a part of the touch sensor module shown in FIG. 1.

3 is a cross-sectional view of the touch sensor module shown in FIG. 1 taken along line III-III.

4 is an exploded perspective view of the touch sensor module shown in FIG. 1.

5 is a view of the coil unit of the touch sensor module according to an embodiment of the present invention, (a) is a plan view of the coil unit, (b) is a side view of the coil unit.

6 is a perspective view of a touch sensor module according to another embodiment of the present invention.

FIG. 7 is an exploded front view of a part of the touch sensor module illustrated in FIG. 6.

8 is a perspective view of a touch sensor module according to another embodiment of the present invention.

FIG. 9 is an exploded front view of a part of the touch sensor module illustrated in FIG. 8.

In the following description of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings. If it is determined that the detailed description of the technology or configuration already known in the field of the present invention may obscure the gist of the present invention, it will be omitted from the detailed description. In addition, terms used in the present specification are terms used to properly express the embodiments of the present invention, which may vary according to related persons or customs in the art. Therefore, the definitions of the terms should be made based on the contents throughout the specification.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a,” “an,” and “the” include plural forms as well, unless the phrases clearly indicate the opposite. As used herein, the meaning of “comprising” specifies a particular characteristic, region, integer, step, operation, element and / or component, and other specific characteristics, region, integer, step, operation, element, component and / or group. It does not exclude the presence or addition of.

Hereinafter, a touch sensor module according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5.

The touch sensor module 100 according to the present example is a touch sensor module that uses the concept of an inductive force touch sensor.

Inductance force touch sensor consists of a spiral coil and a metal coil wound in a spiral and detects the pressure (ie touch) generated at the touch point by using an inductance that changes according to a change in the gap between conductors positioned on the coil. It is a tactile sensor.

That is, when an alternating current is applied to the helical coil, a magnetic field is formed around the helical coil. At this time, when a conductor (eg, a metal film) is positioned away from the helical coil, the induced current is symmetrical with the current direction applied to the helical coil. Is generated.

At this time, the induced current is changed in response to the change in the intensity of the magnetic field, and the strength of the force applied to the corresponding portion is detected according to the oscillation of the resonance frequency.

Therefore, the touch sensor module 100 according to the present example using this principle, as shown in Figures 1 to 4, the reinforcement plate 11 located at the bottom, the circuit board 13 located on the reinforcement plate 11 ), A bobbin portion 15 positioned on the circuit board 13, at least one coil portion 17 wound around the X, Y, and Z axes, and a spacer positioned on the plurality of coil portions 17. And a top film 110 positioned over the spacer 19.

The reinforcement plate 11 constitutes a lower surface of the touch sensor module 100, and stably supports and fixes the circuit board 13 positioned immediately above.

The reinforcement plate 11 may be made of a material having excellent durability and excellent strength, and may be made of plastic, which is a non-conductive material, or stainless steel (SUS), which is a conductive material.

At this time, when the reinforcing plate 11 is made of a material having a high resistivity, the portion of the product (for example, the touch sensor module 100) is applied to the lower portion of the reinforcing plate 11 under the influence of each coil unit 17 The effect of attenuating the intensity of the eddy current generated at the surface of the frame] is generated.

The reinforcing plate 11 may be made of polyimide as one example.

In an alternative example, this reinforcement plate 11 may be omitted as necessary.

The circuit board 13 supplies signals and power necessary for the operation of the touch sensor module 100, and is equipped with electrical and electronic elements necessary for operation, and for inputting and outputting signals and power to the mounted electrical and electronic elements. Wiring, a pad P13, and the like are printed, and wiring and the like are also printed at the end for electrical connection with an external device. Here, the pad P13 is preferably formed on the upper surface of the circuit board 13. Therefore, each coil unit 17 receives a necessary signal from the circuit board 13 through the corresponding pad (P13).

In addition, the circuit board 13 supports the coil unit 17 positioned thereon together with the reinforcing plate 15 positioned below, and also serves to stably maintain the position of the coil unit 17.

The circuit board 13 may be made of a flexible printed circuit board (FPCB) or a rigid printed circuit board (rigid printed circuit board).

In the touch sensor module 100 according to an alternative example, when the reinforcing plate 11 is omitted, the circuit board 13 is preferably made of a rigid printed circuit board.

In addition, an electromagnetic wave blocking film for blocking electromagnetic interference (EMI) may be additionally attached to the lower surface of the circuit board 13 (that is, the surface opposite to the surface adjacent to the bobbin portion 15).

At this time, the electromagnetic wave shielding film is provided with a plating layer and an insulating layer. Thus, as in the case of the reinforcing plate 11, when the electromagnetic wave blocking film is attached to the lower surface of the circuit board 13, the intensity of the eddy current generated on the surface of the corresponding part of the product located on the lower portion of the circuit board 13 Attenuation effect occurs. As a result, the sensitivity of the touch sensor module 100 is improved.

The bobbin portion 15 is a portion into which a hollow formed in the center portion of the coil portion 17 is inserted, and as shown in FIG. 2, an insertion column 152 positioned on the substrate 151 and the substrate 151. ).

At this time, since the insertion pillar 152 is a portion in which the hollow of the coil part 17 is inserted, the number of the coil parts 17 is the same.

Therefore, as shown in FIG. 1, when the number of the coil units 17 is plural, the number of the insertion pillars 152 is also plural, and in this case, the plurality of insertion pillars 152 may extend in the extending direction of the substrate 151. Are located at regular intervals.

The board | substrate 151 is a flat part as a part in which the coil part 17 is located.

The insertion pillar 152 is formed to protrude upward from the substrate 151.

The substrate 151 is electrically and physically connected to the lead wire L11 and the circuit board 13 which are connected to both ends of the coil wire constituting the coil part 17 inserted into each insertion column 152. An opening 1511 for the connection is located adjacent to each insertion column 152. At this time, it is obvious that the number of the openings 1511 is also the same as the number of the coil units 17.

In this case, the opening 1511 is a hole that completely passes through the substrate 151. Accordingly, the lead lines L11 at both ends of the coil part 17 positioned at the adjacent insertion pillar 152 pass through the opening 1511 and are connected to the corresponding pad P13 of the circuit board 13.

As described above, the insertion column 152 is inserted into the center hole (ie, hollow) of each coil part wound in a circular or oval shape, and serves to stably position the coil part.

Each coil wire is wound in a planar direction (ie, X-axis and Y-axis direction) and in a vertical direction (ie, Z-axis direction) so as to form a hollow, and formed as a coil part 17. Then, each formed coil part 17 is It is inserted into the insertion pillar 152 and positioned on the substrate 151.

When each coil portion 17 is inserted into the corresponding insertion column 152, the inner surface of the inserted coil portion 17 is in contact with the outer surface of the insertion column 152 to maintain a contact state or spaced by a predetermined distance The inner side surface of the coil unit 17 and the outer side surface of the insertion pillar 152 may maintain a non-contact state.

The height of the insertion pillar 152 is higher than the height of the corresponding coil unit 17 so that the coil unit 17 is damaged or disconnected due to the change in thickness of the touch sensor module 100 generated when the touch sensor module 100 is touched. Will be prevented.

In this case, the height of the insertion pillar 152 may be determined in consideration of the thickness change amount of the touch sensor module 100 during the touch operation.

The bobbin portion 15 may be made of various materials such as metal, plastic, or ferrite. In the bobbin portion 15, the substrate 151 and the insertion pillar 152 may be integrally formed of one material.

In some cases, the substrate 151 and the insertion pillar 152 may be separated and combined. In this case, the substrate 151 and the insertion pillar 152 may be formed of different materials. For example, the substrate 151 may be formed of a plastic material, and the insertion pillar 152 may be formed of a ferrite material.

When the substrate 151 is made of a non-conductive material having high resistance, the strength of the eddy current generated at the lower end of the coil unit 17 is reduced, thereby increasing the sensitivity of the touch sensor module 100.

As described above, the coil portion 17 is a portion into which the coil portions 17 are inserted.

As described above, the coil portion 17 is formed by winding the coil wire not only in the planar direction but also in the height direction as described above, so that the number of turns of the coil wire is greatly increased.

That is, one coil line forming the coil unit 17 is wound a predetermined number of times so that a hollow portion is formed in the center of the plane to form one coil layer (eg, the first coil layer).

Then, the coil wire is wound again a predetermined number of times on the formed first coil layer to form another coil layer (eg, the second coil layer) on the first coil layer.

In this manner, since another coil layer is sequentially formed on the coil layer formed again after one coil layer is formed, n coil layers are sequentially formed along the height direction. In this case, the number of coil layers may be determined according to the height of the insertion pillar 152 into which the formed coil part 17 is inserted.

Accordingly, the coil portion 17 of the present example has a plurality of coil layers formed by one coil line connected without interruption, and an example of the coil portion 17 according to the present example is shown in FIGS. 5A and 5B. Is shown.

As shown in FIG. 5A, each coil layer has a plurality of winding operations in a planar direction, and as shown in FIG. 5B, a plurality of coil layers are stacked in the height direction. It can be seen.

In this way, the coil portion 17 of the present example is formed by winding coil lines instead of being spirally printed on the surface of the substrate in the form of a pattern made of metal such as copper. Therefore, since the coil part 17 is formed by using a coil wire having a much thinner width than the pattern formed by printing the material on the corresponding surface, the number of windings wound on the same plane is further increased and additionally, when the pattern is printed. A plurality of coil layers are also formed in the height direction.

For this reason, compared with the case of printing the pattern to form the coil portion, the number of windings of the coil wound in the same area is greatly increased, so the inductance value of the coil portion 17 also increases significantly. As a result, the sensitivity of the touch sensor module 100 is improved.

In the coil unit 17 formed by the winding operation of the coil wire, there are two lead wires L11 extending from both ends of the coil wire and extending outwards, and these lead wires L11 extend from the circuit board 13. It is connected to the located control unit. Therefore, the alternating current output from the control device is applied to each lead line L11 of the connected coil part 17.

The spacer 19 positioned on the coil portion 17 has a plate shape having a substantially rectangular planar shape and is located in contact with the upper surface of the coil portion 17.

Therefore, when the number of the coil parts 17 is plural, the spacer 19 is positioned not only on the upper surface of each coil part 17 but also on the empty space between two adjacent coil parts 17.

Due to the spacer 19, the coil unit 17 is positioned to be spaced apart from the upper layer 110 by a predetermined interval determined according to the thickness of the spacer 19.

In this example, the spacer 19 is a foam foam that is used for waterproofing and dustproofing materials having elasticity having excellent restoring force and compression ratio, such as polyethylene, polyurethane, polyolefin, and the like. It may be made of a tape or the like of a shape (no gap into which water is introduced into the step or warpage, and the substrate withstands high water pressure without passing through the water).

Accordingly, the coil unit 17 and the upper layer 110 are maintained at a constant interval by the spacer 19 when the touch sensor module 100 is not in operation, that is, when the touch operation is not made. When a touch operation occurs at any one point of 110 and a physical force is applied toward the upper layer 110, the point is pressed in proportion to the magnitude of the force.

The change in the distance between the coil unit 17 and the upper layer 110 is made at the touch point according to the touch operation, and the inductance of the coil unit 17 is changed according to the change in the gap between the coil unit 17 and the upper layer 110. Change. Therefore, the controller (not shown) detects a change in inductance generated during the touch operation, and thus the touch operation at the corresponding point is detected.

At this time, when the touch operation at the corresponding point is released, the gap between the upper layer 110 and the coil unit 17 is quickly returned to the initial state by the excellent restoring force of the spacer 19.

In this example, the spacer 19 is in the form of a plate located on the entire surface above the coil portion 17, but alternatively, the spacer 19 is located only at the edge of the bobbin portion 15 or the edge of the reinforcing plate 11. The spacer 19 may not exist on the upper portion of the portion 17. In this case, the plurality of coils 17 and the upper film 110 are spaced apart by the height of the spacer 19, but unlike the present example, air is formed between each of the coil parts 17 and the upper film 110. Becomes an air gap in which is present.

The upper layer 110 is intended to cause a change in inductance according to a change in the distance between the coil units 17 that change depending on whether or not the touch.

The upper layer 110 may be made of a conductive material such as a metal such as aluminum (Al) or copper (Cu), and may have a plate shape for covering the entire spacer 19.

Therefore, when an alternating current is applied to each coil unit 17 through the lead line L11 connected to the circuit board 13, and a magnetic field is generated in each coil unit 17, the upper layer 110 is formed according to the generated magnetic field. Induced eddy current is generated symmetrically with respect to the current direction applied to the coil unit 17, the intensity of the induced current generated according to the distance between the adjacent coil unit 17 and the corresponding portion of the upper film 110 Different.

At this time, as the distance between the corresponding coil unit 17 and the upper layer 110 decreases, the intensity of the eddy current formed at the corresponding point of the upper layer 110 increases.

Therefore, when the user presses the surface of the upper layer 110, the touch point of the upper layer 110 is bent in proportion to the strength of the applied force, thereby reducing the distance between the upper layer 110 and the coil unit 17. do. As a result, the magnitude of the induced current at the corresponding point of the upper layer 110 where the touch operation occurs is increased, and the magnetic field generated at the coil unit 17 at the corresponding point decreases due to the increase of the induced current.

This reduction in magnetic field reduces the effective inductance of the coil unit 17.

By detecting the change in inductance according to the touch operation, the degree of force applied to the touch point of the upper layer 110, that is, the degree of pressing in the Z-axis direction is sensed.

Next, the

touch sensor modules

100a and 100b according to another embodiment of the present invention will be described with reference to FIGS. 6 to 9.

Hereinafter, in comparison with the touch sensor module 100 of FIGS. 1 to 5, the components having the same structure and performing the same function are the same reference numerals as the touch sensor module 100 shown in FIGS. 1 to 5. And the detailed description thereof is omitted.

First, the touch sensor module 100a will be described with reference to FIGS. 6 and 7.

The touch sensor module 100a illustrated in FIGS. 6 and 7 has a different position than the touch sensor module 100 illustrated in FIGS. 1 to 5, and the reinforcement plate 11 is omitted. Has a structure.

That is, the touch sensor module 100a of this example includes a bobbin portion 15 having a substrate 151a and an insertion post 152, a circuit board 13a positioned on the bobbin portion 15, and a circuit board 13a. ), A plurality of coil parts 17 inserted into the insertion pillar 152 of the bobbin part 15 protruding through the spacer member, a spacer 19 and a spacer 19 positioned on the plurality of coil parts 17. A top film 110 positioned on the top surface).

In this case, the circuit board 13a includes a plurality of through holes 131 for protruding the insertion pillar 152.

At this time, the through hole 131 has a size that completely penetrates each coil portion 17 or only the insertion pillar 152 completely.

Therefore, when the through holes 131 are formed to fully penetrate not only the insertion pillar 152 but also the coil part 17, each coil part 17 penetrates the corresponding through hole 131 to provide a bobbin part ( It is located directly on the substrate 151 of 15).

On the other hand, when the through hole 131 is formed to penetrate only the insertion pillar 152 completely and the coil part 171 cannot penetrate, each coil part 17 is positioned directly on the circuit board 151. do.

As described above, since the circuit board 13a is positioned between the substrate 151 of the bobbin part 15 and the coil part 17, the coil line of each coil part 17 has a corresponding pad (a) of the adjacent circuit board 13a. Directly connected to P13). Therefore, an opening for electrical and physical connection with the coil unit 17 is unnecessary in the circuit board 13a.

In this case, since a separate reinforcement plate is not located, the bobbin part 15 positioned at the bottom thereof serves as a reinforcement plate supporting the coil part 17 and the upper layer 110 positioned at the top.

Therefore, in the case of FIG. 7 in which the circuit board 13a is positioned on the bobbin portion 17, the total thickness of the touch sensor module 100a is reduced by the thickness of the circuit board 13a.

Next, the touch sensor module 100b according to another embodiment of the present invention will be described with reference to FIGS. 8 and 9.

8 and 9, the touch sensor module 100b according to another exemplary embodiment of the present invention is also positioned on the reinforcement plate 11 and the reinforcement plate 11 and the circuit board 13b and the circuit board 13b. The bobbin portion 15b, the plurality of coil portions 17 inserted into the bobbin portion 15b, the spacer 19 positioned on the plurality of coil portions 17, and the upper layer positioned on the spacer 19. 110.

1 to 5, the touch sensor module 100b of the present example is different from the bobbin portion 15 of the touch sensor module 100 in the position and shape of the bobbin portion 15b.

As shown in FIGS. 8 and 9, the bobbin portion 15b is positioned directly below the spacer 19, and a plurality of protrusions protrude from the substrate 151b and the substrate 151b to the lower side, that is, the circuit board 13. Two supporting pillars 152b and two adjacent supporting pillars 152b.

That is, in the touch sensor module 100 of FIGS. 1 to 4, the substrate 151 of the bobbin part 15 forms a lower plate, and a plurality of substrates 151 are formed on the upper side, that is, toward the spacer 19, from the lower substrate 151. The insertion column 152 protrudes.

However, on the contrary, in this example, the substrate 151b of the bobbin portion 15b forms an upper plate, and a plurality of insertion pillars 152b protrude from the upper substrate 151b to the lower side, and the insertion pillar 152b. Support pillars 153 are located on both sides of the).

As a result, each of the insertion pillars 152b is positioned on the corresponding surface of the circuit board 13 so as to be in contact with the surface. Are stacked sequentially from the corresponding side of the plane.

In this case, since each coil part 17b is located in contact with the corresponding surface of the circuit board 13, the coil line of each coil part 17b is directly connected with the corresponding pad 13 located on the circuit board 13. .

Therefore, since the circuit board 13 does not have to have a separate opening for electrical and physical connection between the lead line L11 of each coil part 17b and the circuit board 13, each coil part ( The connection operation between the leader line L11 of 17b and the corresponding pad P13 of the printed circuit 13b is easily performed.

In addition, the support pillar 153 protruding downward from the substrate 151b is a support for allowing the bobbin portion 15b to be more stably positioned on the circuit board 13.

The support pillar 153 may be integrally formed with the insertion pillar 152b or may be formed separately from the insertion pillar 152 and attached to the substrate 151b.

In addition, when the plurality of coil parts 17 are positioned on the substrate 13, the support pillar 153 is positioned between two adjacent coil parts 17, thereby preventing interference between two adjacent coil parts 17. The reliability of the operation of the touch sensor module 100b is improved. In addition, the spacer 19 of this example is located on the corresponding surface of the board | substrate 151b of the bobbin part 15b.

Accordingly, the spacer 19 may be disposed on the entire surface of the substrate 151b or may be located only at the edge of the substrate 151b such that an air gap may exist between the upper layer 110 and the substrate 151b.

As a result, the upper layer 110 maintains a constant distance from the substrate 151b of the bobbin portion 15b, more specifically, each coil portion 17, and the spacer during the touch operation of the upper layer 110. The compression operation of 19 causes a change in distance between the upper film 110 and the coil portion 17.

In the above, embodiments of the touch sensor module of the present invention have been described. The present invention is not limited to the above-described embodiment and the accompanying drawings, and various modifications and variations will be possible in view of those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be defined not only by the claims of the present specification but also by the equivalents of the claims.

100, 100a, 100b: touch sensor module 11: reinforcement plate

13, 13a, 13b:

circuit board

15, 15b: bobbin section

151, 151b:

substrate

152, 152b: insertion pillar

153: support pillar 17: coil portion

19: spacer 110: upper film

Claims

A bobbin portion having a substrate and an insertion pillar protruding from the substrate;

A coil part formed of a coil wire and inserted into the insertion pillar;

A circuit board connected to the coil unit; And

An upper layer spaced apart from the coil unit by a predetermined distance

Including,

The coil unit includes a plurality of coil layers stacked in the height direction of the insertion pillar.

Touch sensor module.
According to claim 1,

The circuit board is located below the substrate of the bobbin portion,

The substrate includes a touch sensor module including an opening through which the leader line extending from the coil line of the coil portion passes.
The method of claim 2,

The circuit board includes a conductive pad electrically connected to the leader line,

And the conductive pad is exposed through the opening and connected to the leader line.
The method of claim 2,

The touch sensor module further comprises a reinforcing plate located under the circuit board.
The method of claim 4, wherein

The reinforcement plate is a touch sensor module made of polyimide or stainless steel.
According to claim 1,

The insertion pillar protrudes from the substrate toward the upper layer.
According to claim 1,

The circuit board is positioned on the substrate of the bobbin portion, the touch sensor module including a through hole through which the insertion column passes.
The method of claim 7, wherein

The coil sensor penetrates the through hole.
According to claim 1,

The coil unit is a touch sensor module is positioned in direct contact with the upper surface of the circuit board.
According to claim 1,

The insertion pillar protrudes from the substrate toward the circuit board.
The method of claim 10,

The insertion pillar is a touch sensor module positioned in direct contact with the upper surface of the circuit board.
The method of claim 10,

And a support pillar protruding from the substrate toward the circuit board at both sides of the insertion pillar.
According to claim 1,

The touch sensor module further comprises a spacer positioned between the upper layer and the plurality of coil parts.
According to claim 1,

The touch sensor module further comprises a spacer positioned between the upper layer and the substrate of the bobbin portion.
According to claim 1,

The upper film is a touch sensor module made of a metal.
According to claim 1,

The bobbin unit is a touch sensor module made of metal, plastic or ferrite.
According to claim 1,

The touch sensor module further comprises an electromagnetic wave blocking film attached to the lower surface of the circuit board.
According to claim 1,

The number of the coil portion located in the bobbin portion and the bobbin portion, respectively,

A plurality of bobbin parts are located at a predetermined interval spaced along the extending direction of the substrate.