WO2019245123A1 - Touch sensor module - Google Patents

Touch sensor module Download PDF

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Publication number
WO2019245123A1
WO2019245123A1 PCT/KR2018/016848 KR2018016848W WO2019245123A1 WO 2019245123 A1 WO2019245123 A1 WO 2019245123A1 KR 2018016848 W KR2018016848 W KR 2018016848W WO 2019245123 A1 WO2019245123 A1 WO 2019245123A1
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WO
WIPO (PCT)
Prior art keywords
coil
touch sensor
sensor module
circuit board
substrate
Prior art date
Application number
PCT/KR2018/016848
Other languages
French (fr)
Korean (ko)
Inventor
윤성호
김기현
박종찬
Original Assignee
주식회사 파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 파트론 filed Critical 주식회사 파트론
Publication of WO2019245123A1 publication Critical patent/WO2019245123A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds

Definitions

  • the present invention relates to a touch sensor module.
  • a portable electronic device such as a smart phone, an MP3, or a home appliance such as a refrigerator is provided with a touch sensor panel for inputting or switching a command using a touch operation.
  • the touch sensor module is not only a two-dimensional touch sensing method for detecting a touch point using coordinates of the X and Y axes, but also a three-dimensional touch sensing method for additionally detecting a touch intensity applied in the Z-axis direction.
  • the problem to be solved by the present invention is to reduce the installation area of the touch sensor module.
  • Another object of the present invention is to improve the sensitivity of the touch sensor module.
  • the touch sensor module for solving the above problems consists of a bobbin portion having a substrate and an insertion pillar protruding from the substrate, a coil line and a coil portion inserted into the insertion pillar, the coil portion. And a circuit board connected to each other, and an upper layer spaced apart from each other by a predetermined distance on the coil unit, wherein the coil unit includes a plurality of coil layers stacked along a height direction of the insertion pillar.
  • the circuit board is located below the substrate of the bobbin portion
  • the substrate may include an opening through which a leader line extending from the coil line of the coil part passes.
  • the circuit board may include a conductive pad electrically connected to the leader line, and the conductive pad may be exposed through the opening to be connected to the leader line.
  • the touch sensor module according to the above feature may further include a reinforcement plate positioned below the circuit board.
  • the reinforcement plate may be made of polyimide or stainless steel.
  • the insertion pillar may protrude from the substrate toward the upper layer.
  • the circuit board may be positioned on the substrate of the bobbin part and include a through hole through which the insertion pillar passes.
  • the coil unit may pass through the through hole.
  • the coil unit may be positioned in direct contact with an upper surface of the circuit board.
  • the insertion pillar may protrude from the substrate toward the circuit board.
  • the insertion pillar may be positioned in direct contact with the upper surface of the circuit board.
  • the touch sensor module according to the above feature may further include support pillars protruding from the substrate toward the circuit board at both sides of the insertion pillar.
  • the touch sensor module according to the above feature may further include a spacer positioned between the upper layer and the plurality of coil units.
  • the touch sensor module according to the above feature may further include a spacer positioned between the upper layer and the substrate of the bobbin portion.
  • the upper layer may be made of metal.
  • the bobbin portion may be made of metal, plastic or ferrite.
  • the touch sensor module according to the above feature may further include an electromagnetic wave blocking film attached to a lower surface of the circuit board.
  • the bobbin part and the number of the coil parts positioned in the bobbin part may be plural, respectively, and the plurality of bobbin parts may be spaced apart from each other at predetermined intervals along the extending direction of the substrate.
  • each coil part is made of coil lines wound around the X, Y, and Z axes, the coil part has a larger number of turns than the case of forming a winding part by printing a pattern on a corresponding surface.
  • the coil part of this example has laminated
  • each coil part is formed using a coil wire having a diameter much thinner than the width of the pattern, the formation area of the coil part is greatly reduced.
  • the touch sensor module of the present example is located in a region having a narrow width, such as a side having a narrow width, in a product to which the touch sensor module is applied, the freedom of design of the touch sensor module is greatly improved.
  • FIG. 1 is a perspective view of a touch sensor module according to an embodiment of the present invention.
  • FIG. 2 is an exploded front view of a part of the touch sensor module shown in FIG. 1.
  • FIG. 3 is a cross-sectional view of the touch sensor module shown in FIG. 1 taken along line III-III.
  • FIG. 4 is an exploded perspective view of the touch sensor module shown in FIG. 1.
  • FIG. 5 is a view of the coil unit of the touch sensor module according to an embodiment of the present invention, (a) is a plan view of the coil unit, (b) is a side view of the coil unit.
  • FIG. 6 is a perspective view of a touch sensor module according to another embodiment of the present invention.
  • FIG. 7 is an exploded front view of a part of the touch sensor module illustrated in FIG. 6.
  • FIG. 8 is a perspective view of a touch sensor module according to another embodiment of the present invention.
  • FIG. 9 is an exploded front view of a part of the touch sensor module illustrated in FIG. 8.
  • FIGS. 1 to 5 a touch sensor module according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5.
  • the touch sensor module 100 is a touch sensor module that uses the concept of an inductive force touch sensor.
  • Inductance force touch sensor consists of a spiral coil and a metal coil wound in a spiral and detects the pressure (ie touch) generated at the touch point by using an inductance that changes according to a change in the gap between conductors positioned on the coil. It is a tactile sensor.
  • the induced current is changed in response to the change in the intensity of the magnetic field, and the strength of the force applied to the corresponding portion is detected according to the oscillation of the resonance frequency.
  • the touch sensor module 100 using this principle, as shown in Figures 1 to 4, the reinforcement plate 11 located at the bottom, the circuit board 13 located on the reinforcement plate 11 ), A bobbin portion 15 positioned on the circuit board 13, at least one coil portion 17 wound around the X, Y, and Z axes, and a spacer positioned on the plurality of coil portions 17. And a top film 110 positioned over the spacer 19.
  • the reinforcement plate 11 constitutes a lower surface of the touch sensor module 100, and stably supports and fixes the circuit board 13 positioned immediately above.
  • the reinforcement plate 11 may be made of a material having excellent durability and excellent strength, and may be made of plastic, which is a non-conductive material, or stainless steel (SUS), which is a conductive material.
  • plastic which is a non-conductive material
  • SUS stainless steel
  • the portion of the product (for example, the touch sensor module 100) is applied to the lower portion of the reinforcing plate 11 under the influence of each coil unit 17 The effect of attenuating the intensity of the eddy current generated at the surface of the frame] is generated.
  • the reinforcing plate 11 may be made of polyimide as one example.
  • this reinforcement plate 11 may be omitted as necessary.
  • the circuit board 13 supplies signals and power necessary for the operation of the touch sensor module 100, and is equipped with electrical and electronic elements necessary for operation, and for inputting and outputting signals and power to the mounted electrical and electronic elements.
  • Wiring, a pad P13, and the like are printed, and wiring and the like are also printed at the end for electrical connection with an external device.
  • the pad P13 is preferably formed on the upper surface of the circuit board 13. Therefore, each coil unit 17 receives a necessary signal from the circuit board 13 through the corresponding pad (P13).
  • circuit board 13 supports the coil unit 17 positioned thereon together with the reinforcing plate 15 positioned below, and also serves to stably maintain the position of the coil unit 17.
  • the circuit board 13 may be made of a flexible printed circuit board (FPCB) or a rigid printed circuit board (rigid printed circuit board).
  • FPCB flexible printed circuit board
  • rigid printed circuit board rigid printed circuit board
  • the circuit board 13 is preferably made of a rigid printed circuit board.
  • an electromagnetic wave blocking film for blocking electromagnetic interference may be additionally attached to the lower surface of the circuit board 13 (that is, the surface opposite to the surface adjacent to the bobbin portion 15).
  • the electromagnetic wave shielding film is provided with a plating layer and an insulating layer.
  • the intensity of the eddy current generated on the surface of the corresponding part of the product located on the lower portion of the circuit board 13 Attenuation effect occurs.
  • the sensitivity of the touch sensor module 100 is improved.
  • the bobbin portion 15 is a portion into which a hollow formed in the center portion of the coil portion 17 is inserted, and as shown in FIG. 2, an insertion column 152 positioned on the substrate 151 and the substrate 151. ).
  • the insertion pillar 152 is a portion in which the hollow of the coil part 17 is inserted, the number of the coil parts 17 is the same.
  • the number of the insertion pillars 152 is also plural, and in this case, the plurality of insertion pillars 152 may extend in the extending direction of the substrate 151. Are located at regular intervals.
  • substrate 151 is a flat part as a part in which the coil part 17 is located.
  • the insertion pillar 152 is formed to protrude upward from the substrate 151.
  • the substrate 151 is electrically and physically connected to the lead wire L11 and the circuit board 13 which are connected to both ends of the coil wire constituting the coil part 17 inserted into each insertion column 152.
  • An opening 1511 for the connection is located adjacent to each insertion column 152. At this time, it is obvious that the number of the openings 1511 is also the same as the number of the coil units 17.
  • the opening 1511 is a hole that completely passes through the substrate 151. Accordingly, the lead lines L11 at both ends of the coil part 17 positioned at the adjacent insertion pillar 152 pass through the opening 1511 and are connected to the corresponding pad P13 of the circuit board 13.
  • the insertion column 152 is inserted into the center hole (ie, hollow) of each coil part wound in a circular or oval shape, and serves to stably position the coil part.
  • Each coil wire is wound in a planar direction (ie, X-axis and Y-axis direction) and in a vertical direction (ie, Z-axis direction) so as to form a hollow, and formed as a coil part 17. Then, each formed coil part 17 is It is inserted into the insertion pillar 152 and positioned on the substrate 151.
  • each coil portion 17 When each coil portion 17 is inserted into the corresponding insertion column 152, the inner surface of the inserted coil portion 17 is in contact with the outer surface of the insertion column 152 to maintain a contact state or spaced by a predetermined distance
  • the inner side surface of the coil unit 17 and the outer side surface of the insertion pillar 152 may maintain a non-contact state.
  • the height of the insertion pillar 152 is higher than the height of the corresponding coil unit 17 so that the coil unit 17 is damaged or disconnected due to the change in thickness of the touch sensor module 100 generated when the touch sensor module 100 is touched. Will be prevented.
  • the height of the insertion pillar 152 may be determined in consideration of the thickness change amount of the touch sensor module 100 during the touch operation.
  • the bobbin portion 15 may be made of various materials such as metal, plastic, or ferrite.
  • the substrate 151 and the insertion pillar 152 may be integrally formed of one material.
  • the substrate 151 and the insertion pillar 152 may be separated and combined.
  • the substrate 151 and the insertion pillar 152 may be formed of different materials.
  • the substrate 151 may be formed of a plastic material
  • the insertion pillar 152 may be formed of a ferrite material.
  • the substrate 151 is made of a non-conductive material having high resistance, the strength of the eddy current generated at the lower end of the coil unit 17 is reduced, thereby increasing the sensitivity of the touch sensor module 100.
  • the coil portion 17 is a portion into which the coil portions 17 are inserted.
  • the coil portion 17 is formed by winding the coil wire not only in the planar direction but also in the height direction as described above, so that the number of turns of the coil wire is greatly increased.
  • one coil line forming the coil unit 17 is wound a predetermined number of times so that a hollow portion is formed in the center of the plane to form one coil layer (eg, the first coil layer).
  • the coil wire is wound again a predetermined number of times on the formed first coil layer to form another coil layer (eg, the second coil layer) on the first coil layer.
  • n coil layers are sequentially formed along the height direction.
  • the number of coil layers may be determined according to the height of the insertion pillar 152 into which the formed coil part 17 is inserted.
  • the coil portion 17 of the present example has a plurality of coil layers formed by one coil line connected without interruption, and an example of the coil portion 17 according to the present example is shown in FIGS. 5A and 5B. Is shown.
  • each coil layer has a plurality of winding operations in a planar direction, and as shown in FIG. 5B, a plurality of coil layers are stacked in the height direction. It can be seen.
  • the coil portion 17 of the present example is formed by winding coil lines instead of being spirally printed on the surface of the substrate in the form of a pattern made of metal such as copper. Therefore, since the coil part 17 is formed by using a coil wire having a much thinner width than the pattern formed by printing the material on the corresponding surface, the number of windings wound on the same plane is further increased and additionally, when the pattern is printed. A plurality of coil layers are also formed in the height direction.
  • the number of windings of the coil wound in the same area is greatly increased, so the inductance value of the coil portion 17 also increases significantly. As a result, the sensitivity of the touch sensor module 100 is improved.
  • the coil unit 17 formed by the winding operation of the coil wire there are two lead wires L11 extending from both ends of the coil wire and extending outwards, and these lead wires L11 extend from the circuit board 13. It is connected to the located control unit. Therefore, the alternating current output from the control device is applied to each lead line L11 of the connected coil part 17.
  • the spacer 19 positioned on the coil portion 17 has a plate shape having a substantially rectangular planar shape and is located in contact with the upper surface of the coil portion 17.
  • the spacer 19 is positioned not only on the upper surface of each coil part 17 but also on the empty space between two adjacent coil parts 17.
  • the coil unit 17 is positioned to be spaced apart from the upper layer 110 by a predetermined interval determined according to the thickness of the spacer 19.
  • the spacer 19 is a foam foam that is used for waterproofing and dustproofing materials having elasticity having excellent restoring force and compression ratio, such as polyethylene, polyurethane, polyolefin, and the like. It may be made of a tape or the like of a shape (no gap into which water is introduced into the step or warpage, and the substrate withstands high water pressure without passing through the water).
  • the coil unit 17 and the upper layer 110 are maintained at a constant interval by the spacer 19 when the touch sensor module 100 is not in operation, that is, when the touch operation is not made.
  • the point is pressed in proportion to the magnitude of the force.
  • the change in the distance between the coil unit 17 and the upper layer 110 is made at the touch point according to the touch operation, and the inductance of the coil unit 17 is changed according to the change in the gap between the coil unit 17 and the upper layer 110. Change. Therefore, the controller (not shown) detects a change in inductance generated during the touch operation, and thus the touch operation at the corresponding point is detected.
  • the spacer 19 is in the form of a plate located on the entire surface above the coil portion 17, but alternatively, the spacer 19 is located only at the edge of the bobbin portion 15 or the edge of the reinforcing plate 11.
  • the spacer 19 may not exist on the upper portion of the portion 17.
  • the plurality of coils 17 and the upper film 110 are spaced apart by the height of the spacer 19, but unlike the present example, air is formed between each of the coil parts 17 and the upper film 110. Becomes an air gap in which is present.
  • the upper layer 110 is intended to cause a change in inductance according to a change in the distance between the coil units 17 that change depending on whether or not the touch.
  • the upper layer 110 may be made of a conductive material such as a metal such as aluminum (Al) or copper (Cu), and may have a plate shape for covering the entire spacer 19.
  • a conductive material such as a metal such as aluminum (Al) or copper (Cu)
  • the touch point of the upper layer 110 is bent in proportion to the strength of the applied force, thereby reducing the distance between the upper layer 110 and the coil unit 17. do.
  • the magnitude of the induced current at the corresponding point of the upper layer 110 where the touch operation occurs is increased, and the magnetic field generated at the coil unit 17 at the corresponding point decreases due to the increase of the induced current.
  • the degree of force applied to the touch point of the upper layer 110 that is, the degree of pressing in the Z-axis direction is sensed.
  • the touch sensor module 100a will be described with reference to FIGS. 6 and 7.
  • the touch sensor module 100a illustrated in FIGS. 6 and 7 has a different position than the touch sensor module 100 illustrated in FIGS. 1 to 5, and the reinforcement plate 11 is omitted. Has a structure.
  • the touch sensor module 100a of this example includes a bobbin portion 15 having a substrate 151a and an insertion post 152, a circuit board 13a positioned on the bobbin portion 15, and a circuit board 13a. ), A plurality of coil parts 17 inserted into the insertion pillar 152 of the bobbin part 15 protruding through the spacer member, a spacer 19 and a spacer 19 positioned on the plurality of coil parts 17. A top film 110 positioned on the top surface).
  • the circuit board 13a includes a plurality of through holes 131 for protruding the insertion pillar 152.
  • the through hole 131 has a size that completely penetrates each coil portion 17 or only the insertion pillar 152 completely.
  • each coil part 17 penetrates the corresponding through hole 131 to provide a bobbin part ( It is located directly on the substrate 151 of 15).
  • each coil part 17 is positioned directly on the circuit board 151. do.
  • the coil line of each coil part 17 has a corresponding pad (a) of the adjacent circuit board 13a. Directly connected to P13). Therefore, an opening for electrical and physical connection with the coil unit 17 is unnecessary in the circuit board 13a.
  • the bobbin part 15 positioned at the bottom thereof serves as a reinforcement plate supporting the coil part 17 and the upper layer 110 positioned at the top.
  • the touch sensor module 100b according to another exemplary embodiment of the present invention is also positioned on the reinforcement plate 11 and the reinforcement plate 11 and the circuit board 13b and the circuit board 13b.
  • the touch sensor module 100b of the present example is different from the bobbin portion 15 of the touch sensor module 100 in the position and shape of the bobbin portion 15b.
  • the bobbin portion 15b is positioned directly below the spacer 19, and a plurality of protrusions protrude from the substrate 151b and the substrate 151b to the lower side, that is, the circuit board 13.
  • the substrate 151 of the bobbin part 15 forms a lower plate, and a plurality of substrates 151 are formed on the upper side, that is, toward the spacer 19, from the lower substrate 151.
  • the insertion column 152 protrudes.
  • the substrate 151b of the bobbin portion 15b forms an upper plate, and a plurality of insertion pillars 152b protrude from the upper substrate 151b to the lower side, and the insertion pillar 152b.
  • Support pillars 153 are located on both sides of the).
  • each of the insertion pillars 152b is positioned on the corresponding surface of the circuit board 13 so as to be in contact with the surface. Are stacked sequentially from the corresponding side of the plane.
  • each coil part 17b is located in contact with the corresponding surface of the circuit board 13, the coil line of each coil part 17b is directly connected with the corresponding pad 13 located on the circuit board 13. .
  • circuit board 13 does not have to have a separate opening for electrical and physical connection between the lead line L11 of each coil part 17b and the circuit board 13, each coil part ( The connection operation between the leader line L11 of 17b and the corresponding pad P13 of the printed circuit 13b is easily performed.
  • the support pillar 153 protruding downward from the substrate 151b is a support for allowing the bobbin portion 15b to be more stably positioned on the circuit board 13.
  • the support pillar 153 may be integrally formed with the insertion pillar 152b or may be formed separately from the insertion pillar 152 and attached to the substrate 151b.
  • the support pillar 153 is positioned between two adjacent coil parts 17, thereby preventing interference between two adjacent coil parts 17.
  • the reliability of the operation of the touch sensor module 100b is improved.
  • the spacer 19 of this example is located on the corresponding surface of the board
  • the spacer 19 may be disposed on the entire surface of the substrate 151b or may be located only at the edge of the substrate 151b such that an air gap may exist between the upper layer 110 and the substrate 151b.
  • the upper layer 110 maintains a constant distance from the substrate 151b of the bobbin portion 15b, more specifically, each coil portion 17, and the spacer during the touch operation of the upper layer 110.
  • the compression operation of 19 causes a change in distance between the upper film 110 and the coil portion 17.
  • 151, 151b substrate 152, 152b: insertion pillar
  • support pillar 17 coil portion

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  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
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Abstract

The present invention relates to a touch sensor module. The touch sensor module comprises: a bobbin unit having a substrate and an insertion pole protruding from the substrate; a coil unit formed of a coil wire and inserted into the insertion pole; a circuit board connected to the coil unit; and an upper membrane spaced apart by a predetermined distance above the coil unit, wherein the coil unit includes a plurality of coil layers stacked along the height direction of the insertion pole.

Description

터치센서 모듈Touch sensor module
본 발명은 터치센서 모듈에 관한 것이다.The present invention relates to a touch sensor module.
일반적으로 스마트폰(smart phone), MP3와 같은 휴대용 전자 기기나 냉장고 등의 가전 기기에는 터치(touch) 동작을 이용하여 명령어의 입력이나 스위칭 동작을 실시하는 터치센서패널(touch panel)이 부착되어 있다.In general, a portable electronic device such as a smart phone, an MP3, or a home appliance such as a refrigerator is provided with a touch sensor panel for inputting or switching a command using a touch operation. .
이러한 터치센서 모듈은 X축과 Y축의 좌표를 이용하여 터치 지점을 감지하는 2차원 터치 감지 방식뿐만 아니라 Z축 방향으로 인가되는 터치 강도를 추가로 감지하는 3차원 터치 감지 방식이 이용되고 있다.The touch sensor module is not only a two-dimensional touch sensing method for detecting a touch point using coordinates of the X and Y axes, but also a three-dimensional touch sensing method for additionally detecting a touch intensity applied in the Z-axis direction.
이러한 3차원 터치 감지 방식을 위해, 종래에는 해당 지점에 인가되는 압력의 크기를 감지하거나 이미지를 터치의 강도를 감지하였으나 터치 강도 변화를 정확하게 감지하지 못하는 문제점이 존재한다.For such a three-dimensional touch sensing method, there is a problem in that, although a magnitude of pressure applied to a corresponding point is detected or an intensity of a touch is sensed in an image, a change in touch intensity cannot be accurately sensed.
또한, 터치 동작에 따른 전기적인 신호를 생성하는 감지 패턴 등의 형성을 위해 많은 영역이 요구되어, 터치센서 모듈의 설치 위치가 제한적이었다.In addition, many areas are required to form a sensing pattern for generating an electrical signal according to a touch operation, and thus the installation position of the touch sensor module is limited.
선행기술문헌Prior art literature
대한민국 등록특허 제10-1777733호(등록일자: 2017년09월06일, 발명의 명칭: 이미지센서와 불투명 부재를 이용한 3D 터치 장치)Republic of Korea Patent No. 10-1777733 (Registration date: September 06, 2017, the title of the invention: 3D touch device using an image sensor and an opaque member)
본 발명이 해결하려는 과제는 터치센서 모듈의 설치 영역을 감소시키기 위한 것이다.The problem to be solved by the present invention is to reduce the installation area of the touch sensor module.
본 발명이 해결하려는 다른 과제는 터치센서 모듈의 감도를 향상시키기 위한 것이다.Another object of the present invention is to improve the sensitivity of the touch sensor module.
상기 과제를 해결하기 위한 본 발명의 한 특징에 따른 터치센서 모듈은 기판과 상기 기판에서 돌출되는 삽입 기둥을 구비하는 보빈부, 코일선으로 이루어져 있고 상기 삽입 기둥에 삽입되어 있는 코일부, 상기 코일부와 연결되어 있는 회로기판, 및 상기 코일부 위에 정해진 거리만큼 이격되게 위치하는 상부막을 포함하고, 상기 코일부는 상기 삽입 기둥의 높이 방향으로 따라 적층되어 있는 복수 개의 코일층을 포함한다.The touch sensor module according to an aspect of the present invention for solving the above problems consists of a bobbin portion having a substrate and an insertion pillar protruding from the substrate, a coil line and a coil portion inserted into the insertion pillar, the coil portion. And a circuit board connected to each other, and an upper layer spaced apart from each other by a predetermined distance on the coil unit, wherein the coil unit includes a plurality of coil layers stacked along a height direction of the insertion pillar.
상기 회로기판은 상기 보빈부의 상기 기판 하부에 위치하고 있고, The circuit board is located below the substrate of the bobbin portion,
상기 기판은 코일부의 코일선에서 연장되는 인출선이 관통하는 개구부를 포함할 수 있다. The substrate may include an opening through which a leader line extending from the coil line of the coil part passes.
상기 회로기판은 상기 인출선과 전기적으로 연결되는 도전성 패드를 포함하고, 상기 도전성 패드는 상기 개구부를 통해 노출되어 상기 인출선과 연결될 수 있다. The circuit board may include a conductive pad electrically connected to the leader line, and the conductive pad may be exposed through the opening to be connected to the leader line.
상기 특징에 따른 터치센서 모듈은 상기 회로기판 하부에 위치하고 있는 보강판을 더 포함할 수 있다. The touch sensor module according to the above feature may further include a reinforcement plate positioned below the circuit board.
상기 보강판은 폴리이미드나 스테인리스 스틸로 이루어질 수 있다. The reinforcement plate may be made of polyimide or stainless steel.
상기 삽입 기둥은 상기 기판으로부터 상기 상부막 쪽으로 돌출될 수 있다. The insertion pillar may protrude from the substrate toward the upper layer.
상기 회로기판은 상기 보빈부의 상기 기판 위에 위치하고 있고, 상기 삽입 기둥이 관통하는 관통구를 포함할 수 있다. The circuit board may be positioned on the substrate of the bobbin part and include a through hole through which the insertion pillar passes.
상기 코일부는 상기 관통구를 관통할 수 있다.The coil unit may pass through the through hole.
상기 코일부는 상기 회로기판의 상면에 직접 접촉하여 위치할 수 있다. The coil unit may be positioned in direct contact with an upper surface of the circuit board.
상기 삽입 기둥은 상기 기판으로부터 상기 회로기판 쪽으로 돌출될 수 있다. The insertion pillar may protrude from the substrate toward the circuit board.
상기 삽입 기둥은 상기 회로기판의 상면에 직접 접촉하여 위치할 수 있다. The insertion pillar may be positioned in direct contact with the upper surface of the circuit board.
상기 특징에 따른 터치센서 모듈은 상기 삽입 기둥의 양 측에서 상기 기판으로부터 상기 회로기판 쪽으로 돌출되어 있는 지지 기둥을 더 포함할 수 있다. The touch sensor module according to the above feature may further include support pillars protruding from the substrate toward the circuit board at both sides of the insertion pillar.
상기 특징에 따른 터치센서 모듈은 상기 상부막과 상기 복수 개의 코일부 사이에 위치하는 간격재를 더 포함할 수 있다. The touch sensor module according to the above feature may further include a spacer positioned between the upper layer and the plurality of coil units.
상기 특징에 따른 터치센서 모듈은 상기 상부막과 상기 보빈부의 상기 기판 사이에 위치하는 간격재를 더 포함할 수 있다. The touch sensor module according to the above feature may further include a spacer positioned between the upper layer and the substrate of the bobbin portion.
상기 상부막은 금속으로 이루어질 수 있다.The upper layer may be made of metal.
상기 보빈부는 금속, 플라스틱 또는 페라이트로 이루어질 수 있다. The bobbin portion may be made of metal, plastic or ferrite.
상기 특징에 따른 터치센서 모듈은 상기 회로기판의 하부면에 부착되어 있는 전자기파 차단 필름을 더 포함할 수 있다.The touch sensor module according to the above feature may further include an electromagnetic wave blocking film attached to a lower surface of the circuit board.
상기 보빈부와 상기 보빈부에 위치하는 상기 코일부의 개수는 각각 복수 개일 수 있고, 복수 개의 보빈부는 상기 기판의 연장 방향을 따라 정해진 간격으로 이격되게 위치할 수 있다.The bobbin part and the number of the coil parts positioned in the bobbin part may be plural, respectively, and the plurality of bobbin parts may be spaced apart from each other at predetermined intervals along the extending direction of the substrate.
이러한 본 발명의 특징에 따르면, 각 코일부는 X,Y 및Z축으로 감겨 있는 코일선으로 이루어지므로, 해당 면에 패턴을 인쇄하여 권선부를 형성하는 경우에 비해 많은 권선 수를 갖게 된다.According to the characteristics of the present invention, since each coil part is made of coil lines wound around the X, Y, and Z axes, the coil part has a larger number of turns than the case of forming a winding part by printing a pattern on a corresponding surface.
더욱이, 본 예의 코일부는 보빈부의 높이 방향을 따라 복수 개의 코일층이 순차적으로 적층되어 있으므로, 각 코일부의 권선 수는 더욱더 증가한다.Moreover, since the coil part of this example has laminated | stacked several coil layers sequentially along the height direction of a bobbin part, the number of turns of each coil part further increases.
따라서, 패턴을 인쇄하여 코일부를 형성하는 경우에 비해, 각 코일부의 인덕턴스 크기를 크게 향상시킬 수 있으므로, 터치센서 모듈의 감도가 크게 향상된다.Therefore, compared with the case of printing the pattern to form the coil part, since the inductance size of each coil part can be greatly improved, the sensitivity of the touch sensor module is greatly improved.
또한, 패턴의 폭보다 훨씬 얇은 지름을 갖는 코일선을 이용하여 각 코일부를 형성하므로 코일부의 형성 면적이 크게 감소한다. In addition, since each coil part is formed using a coil wire having a diameter much thinner than the width of the pattern, the formation area of the coil part is greatly reduced.
따라서, 터치센서 모듈이 적용되는 제품에서 좁은 폭을 갖는 측면 등과 같이 좁은 폭을 갖는 영역에도 본 예의 터치센서 모듈이 위치하므로, 터치센서 모듈의 설계의 자유도가 크게 향상된다.Therefore, since the touch sensor module of the present example is located in a region having a narrow width, such as a side having a narrow width, in a product to which the touch sensor module is applied, the freedom of design of the touch sensor module is greatly improved.
도 1은 본 발명의 일 실시예에 따른 터치센서 모듈의 사시도이다.1 is a perspective view of a touch sensor module according to an embodiment of the present invention.
도 2는 도 1에 도시한 터치센서 모듈 일부에 분해 정면도이다.FIG. 2 is an exploded front view of a part of the touch sensor module shown in FIG. 1.
도 3은 도 1에 도시한 터치센서 모듈을 Ⅲ-Ⅲ 선을 따라 잘라 얻어진 단면도이다.3 is a cross-sectional view of the touch sensor module shown in FIG. 1 taken along line III-III.
도 4는 도 1에 도시한 터치센서 모듈의 분해 사시도이다.4 is an exploded perspective view of the touch sensor module shown in FIG. 1.
도 5는 본 발명의 한 실시예에 따른 터치센서 모듈의 코일부에 대한 도면으로서, (a)는 코일부의 평면도이고, (b)는 코일부의 측면도이다.5 is a view of the coil unit of the touch sensor module according to an embodiment of the present invention, (a) is a plan view of the coil unit, (b) is a side view of the coil unit.
도 6는 본 발명의 다른 실시예에 따른 터치센서 모듈의 사시도이다.6 is a perspective view of a touch sensor module according to another embodiment of the present invention.
도 7은 도 6에 도시한 터치센서 모듈 일부에 분해 정면도이다.FIG. 7 is an exploded front view of a part of the touch sensor module illustrated in FIG. 6.
도 8는 본 발명의 또 다른 실시예에 따른 터치센서 모듈의 사시도이다.8 is a perspective view of a touch sensor module according to another embodiment of the present invention.
도 9은 도 8에 도시한 터치센서 모듈 일부에 분해 정면도이다.FIG. 9 is an exploded front view of a part of the touch sensor module illustrated in FIG. 8.
본 발명을 설명하는데 있어서, 이하, 첨부된 도면을 참조하여 본 발명의 실시예들을 상세히 설명한다. 본 발명의 분야에 이미 공지된 기술 또는 구성에 대한 구체적인 설명을 부가하는 것이 본 발명의 요지를 불분명하게 할 수 있다고 판단되는 경우에는 상세한 설명에서 이를 일부 생략하도록 한다. 또한, 본 명세서에서 사용되는 용어들은 본 발명의 실시예들을 적절히 표현하기 위해 사용된 용어들로서, 이는 해당 분야의 관련된 사람 또는 관례 등에 따라 달라질 수 있다. 따라서, 본 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.In the following description of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings. If it is determined that the detailed description of the technology or configuration already known in the field of the present invention may obscure the gist of the present invention, it will be omitted from the detailed description. In addition, terms used in the present specification are terms used to properly express the embodiments of the present invention, which may vary according to related persons or customs in the art. Therefore, the definitions of the terms should be made based on the contents throughout the specification.
여기서 사용되는 전문용어는 단지 특정 실시예를 언급하기 위한 것이며, 본 발명을 한정하는 것을 의도하지 않는다. 여기서 사용되는 단수 형태들은 문구들이 이와 명백히 반대의 의미를 나타내지 않는 한 복수 형태들도 포함한다. 명세서에서 사용되는 '포함하는'의 의미는 특정 특성, 영역, 정수, 단계, 동작, 요소 및/또는 성분을 구체화하며, 다른 특정 특성, 영역, 정수, 단계, 동작, 요소, 성분 및/또는 군의 존재나 부가를 제외시키는 것은 아니다.The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a,” “an,” and “the” include plural forms as well, unless the phrases clearly indicate the opposite. As used herein, the meaning of “comprising” specifies a particular characteristic, region, integer, step, operation, element and / or component, and other specific characteristics, region, integer, step, operation, element, component and / or group. It does not exclude the presence or addition of.
이하, 첨부된 도 1 내지 도 5를 참조하여 본 발명의 일 실시예에 따른 터치센서 모듈에 대해서 설명하도록 한다.Hereinafter, a touch sensor module according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5.
본 예에 따른 터치센서 모듈(100)은 인덕턴스 포스 터치 센서(inductive force touch sensor)의 개념을 이용하는 터치센서 모듈이다.The touch sensor module 100 according to the present example is a touch sensor module that uses the concept of an inductive force touch sensor.
인덕턴스 포스 터치 센서는 나선형으로 감겨 있는 나선형 코일과 금속 등으로 이루어져 있고 코일 위에 위치하는 도전체 사이의 간격 변화에 따라 변하는 인덕턴스(inductance)를 이용하여 터치 지점에 발생하는 압력(즉 터치 여부)을 감지하는 촉각 센서이다.Inductance force touch sensor consists of a spiral coil and a metal coil wound in a spiral and detects the pressure (ie touch) generated at the touch point by using an inductance that changes according to a change in the gap between conductors positioned on the coil. It is a tactile sensor.
즉, 나선형 코일에 교류 전류가 인가되면, 나선형 코일 주변에 자기장이 형성되며, 이때, 나선형 코일과 이격하여 도전체(예, 금속막)가 위치하면 나선형 코일에 인가되는 전류 방향과 대칭되게 유도 전류가 생성된다.That is, when an alternating current is applied to the helical coil, a magnetic field is formed around the helical coil. At this time, when a conductor (eg, a metal film) is positioned away from the helical coil, the induced current is symmetrical with the current direction applied to the helical coil. Is generated.
이때, 유도 전류는 자기장의 세기 변화에 대응하여 가변되며, 공진 주파수의 발진에 따라 해당 부위에 인가되는 힘의 세기가 감지된다.At this time, the induced current is changed in response to the change in the intensity of the magnetic field, and the strength of the force applied to the corresponding portion is detected according to the oscillation of the resonance frequency.
따라서, 이러한 원리를 이용하는 본 예에 따른 터치센서 모듈(100)은 도 1 내지 도 4에 도시한 것처럼, 가장 하부에 위치하는 보강판(11), 보강판(11) 위에 위치하는 회로기판(13), 회로기판(13) 위에 위치하는 보빈부(bobbin portion)(15), X, Y 및 Z축으로 감겨 있는 적어도 하나의 코일부(17), 복수 개의 코일부(17) 위에 위치하는 간격재(19), 그리고 간격재(19) 위에 위치하는 상부막(110)을 구비한다.Therefore, the touch sensor module 100 according to the present example using this principle, as shown in Figures 1 to 4, the reinforcement plate 11 located at the bottom, the circuit board 13 located on the reinforcement plate 11 ), A bobbin portion 15 positioned on the circuit board 13, at least one coil portion 17 wound around the X, Y, and Z axes, and a spacer positioned on the plurality of coil portions 17. And a top film 110 positioned over the spacer 19.
보강판(11)은 터치센서 모듈(100)의 하부면을 구성하는 것으로서, 바로 위에 위치하는 회로기판(13)을 안정적으로 지지하며 고정하는 역할을 수행한다.The reinforcement plate 11 constitutes a lower surface of the touch sensor module 100, and stably supports and fixes the circuit board 13 positioned immediately above.
이러한 보강판(11)은 내구성이 우수하고 강도가 뛰어난 재료로 이루어질 수 있고, 비전도성 물질인 플라스틱(plastic) 또는 전도성 물질인 스테인리스 스틸(SUS) 등으로이루어질 수 있다.The reinforcement plate 11 may be made of a material having excellent durability and excellent strength, and may be made of plastic, which is a non-conductive material, or stainless steel (SUS), which is a conductive material.
이때, 보강판(11)이 저항율이 높은 재질로 이루어질 경우, 각 코일부(17)의 영향에 의해 보강판(11) 하부에 위치한 부분[예, 터치센서 모듈(100)이 적용되는 제품의 금속 프레임(frame)]의 표면에서 생성되는 와전류의 세기를 감쇄시키는 효과가 발생된다.At this time, when the reinforcing plate 11 is made of a material having a high resistivity, the portion of the product (for example, the touch sensor module 100) is applied to the lower portion of the reinforcing plate 11 under the influence of each coil unit 17 The effect of attenuating the intensity of the eddy current generated at the surface of the frame] is generated.
이러한 보강판(11)은 하나의 예로서 폴리이미드(polyimide)로 이루어질 수 있다.The reinforcing plate 11 may be made of polyimide as one example.
대안적인 예에서, 이러한 보강판(11)은 필요에 따라 생략될 수 있다.In an alternative example, this reinforcement plate 11 may be omitted as necessary.
회로기판(13)은 터치센서 모듈(100)의 동작에 필요한 신호와 전원 등을 공급하며 동작에 필요한 전기전자 소자들이 실장되어 있고, 실장된 전기전자 소자들로의 신호 입출력 및 전원 공급 등을 위해 배선과 패드(pad)(P13) 등이 인쇄되어 있으며, 외부 장치와의 전기적인 연결을 위해 단부에도 배선 등이 인쇄되어 있다. 여기서 패드(P13)는 회로기판(13)의 상면에 형성되어 있는 것이 바람직하다. 따라서, 각 코일부(17)는 해당 패드(P13)를 통해 필요한 신호를 회로기판(13)으로부터 입력 받는다.The circuit board 13 supplies signals and power necessary for the operation of the touch sensor module 100, and is equipped with electrical and electronic elements necessary for operation, and for inputting and outputting signals and power to the mounted electrical and electronic elements. Wiring, a pad P13, and the like are printed, and wiring and the like are also printed at the end for electrical connection with an external device. Here, the pad P13 is preferably formed on the upper surface of the circuit board 13. Therefore, each coil unit 17 receives a necessary signal from the circuit board 13 through the corresponding pad (P13).
또한, 회로기판(13)은 하부에 위치한 보강판(15)과 함께 그 위에 위치한 코일부(17)를 지지하고 코일부(17)의 위치를 안정적으로 유지하는 역할도 수행한다.In addition, the circuit board 13 supports the coil unit 17 positioned thereon together with the reinforcing plate 15 positioned below, and also serves to stably maintain the position of the coil unit 17.
이러한 회로기판(13)은 가요성 인쇄회로기판(FPCB, flexible printed circuit board)이나 경성 인쇄회로기판(rigid printed circuit board)으로 이루어질 수 있다.The circuit board 13 may be made of a flexible printed circuit board (FPCB) or a rigid printed circuit board (rigid printed circuit board).
대안적인 예에 따른 터치센서 모듈(100)에서, 보강판(11)이 생략될 경우, 회로기판(13)은 경성 인쇄회로기판으로 이루어지는 것이 좋다.In the touch sensor module 100 according to an alternative example, when the reinforcing plate 11 is omitted, the circuit board 13 is preferably made of a rigid printed circuit board.
또한, 회로기판(13)의 하부면[즉, 보빈부(15)와 인접해 있는 면의 반대쪽 면]에는 전자기파 간섭(EMI, electromagnetic interference) 차단을 위한 전자기파 차단 필름이 추가로 부착될 수 있다. In addition, an electromagnetic wave blocking film for blocking electromagnetic interference (EMI) may be additionally attached to the lower surface of the circuit board 13 (that is, the surface opposite to the surface adjacent to the bobbin portion 15).
이때, 전자기파 차단 필름은 도금층과 절연층을 구비하고 있다. 따라서, 보강판(11)의 경우와 마찬가지로, 전자기파 차단 필름이 회로기판(13)의 하부면에 부착될 경우, 회로기판(13)의 하부에 위치한 제품의 해당 부분 표면에 생성되는 와전류의 세기가 감쇄되는 효과가 발생된다. 이로 인해, 터치센서 모듈(100)의 감도가 향상된다.At this time, the electromagnetic wave shielding film is provided with a plating layer and an insulating layer. Thus, as in the case of the reinforcing plate 11, when the electromagnetic wave blocking film is attached to the lower surface of the circuit board 13, the intensity of the eddy current generated on the surface of the corresponding part of the product located on the lower portion of the circuit board 13 Attenuation effect occurs. As a result, the sensitivity of the touch sensor module 100 is improved.
보빈부(15)는 코일부(17)의 가운데 부분에 형성된 중공(中孔)이 삽입되는 부분으로서, 도 2에 도시한 것처럼, 기판(151) 및 기판(151)에 위치하는 삽입 기둥(152)을 구비한다. The bobbin portion 15 is a portion into which a hollow formed in the center portion of the coil portion 17 is inserted, and as shown in FIG. 2, an insertion column 152 positioned on the substrate 151 and the substrate 151. ).
이때, 삽입 기둥(152)은 코일부(17)의 중공이 삽입되어 위치하는 부분이므로, 코일부(17)의 개수와 동일하다.At this time, since the insertion pillar 152 is a portion in which the hollow of the coil part 17 is inserted, the number of the coil parts 17 is the same.
따라서, 도 1에 도시한 것처럼, 코일부(17)의 개수가 복수 개일 경우, 삽입 기둥(152)의 개수 역시 복수 개이고, 이 경우 복수 개의 삽입 기둥(152)은 기판(151)의 연장 방향을 따라 정해진 간격으로 위치한다.Therefore, as shown in FIG. 1, when the number of the coil units 17 is plural, the number of the insertion pillars 152 is also plural, and in this case, the plurality of insertion pillars 152 may extend in the extending direction of the substrate 151. Are located at regular intervals.
기판(151)은 코일부(17)가 위치하는 부분으로서 평탄부이다. The board | substrate 151 is a flat part as a part in which the coil part 17 is located.
삽입 기둥(152)은 기판(151)에서 상부 방향으로 돌출된 형태로 형성된다.The insertion pillar 152 is formed to protrude upward from the substrate 151.
이러한 기판(151)에는 각 삽입 기둥(152)에 삽입되어 있는 코일부(17)를 구성하는 코일선의 양단과 각각 연결되어 도출된 인출선(L11)과 회로기판(13)과의 전기적 및 물리적인 연결을 위한 개구부(1511)가 각 삽입 기둥(152)에 인접하게 위치한다. 이때, 개구부(1511)의 개수 역시 코일부(17)의 개수와 동일함은 당연한다.The substrate 151 is electrically and physically connected to the lead wire L11 and the circuit board 13 which are connected to both ends of the coil wire constituting the coil part 17 inserted into each insertion column 152. An opening 1511 for the connection is located adjacent to each insertion column 152. At this time, it is obvious that the number of the openings 1511 is also the same as the number of the coil units 17.
이때, 개구부(1511)는 기판(151)을 완전히 관통하는 구멍이다. 따라서, 인접한 삽입 기둥(152)에 위치하고 있는코일부(17)의 양단의 인출선(L11)은 해당 개구부(1511)를 통과하여 회로기판(13)의 해당 패드(P13)에 연결된다.In this case, the opening 1511 is a hole that completely passes through the substrate 151. Accordingly, the lead lines L11 at both ends of the coil part 17 positioned at the adjacent insertion pillar 152 pass through the opening 1511 and are connected to the corresponding pad P13 of the circuit board 13.
삽입 기둥(152)은 이미 기술한 것처럼, 원형이나 타원형 형태로 감겨있는 각 코일부의 가운데 구멍(즉, 중공)이 삽입되어, 해당 코일부의 위치를 안정적으로 위치시키는 역할을 한다.As described above, the insertion column 152 is inserted into the center hole (ie, hollow) of each coil part wound in a circular or oval shape, and serves to stably position the coil part.
각 코일선은 가운데 중공이 형성되도록 평면 방향(즉, X축과 Y축 방향)과 수직 방향[즉, Z축 방향]으로 감겨져 코일부(17)로 형성된 후, 각 형성된 코일부(17)는 삽입 기둥(152)에 삽입되어 기판(151) 상에 위치한다. Each coil wire is wound in a planar direction (ie, X-axis and Y-axis direction) and in a vertical direction (ie, Z-axis direction) so as to form a hollow, and formed as a coil part 17. Then, each formed coil part 17 is It is inserted into the insertion pillar 152 and positioned on the substrate 151.
각 코일부(17)가 해당 삽입 기둥(152)에 삽입될 때, 삽입된 코일부(17)의 내측면은 삽입 기둥(152)의 외측면과 접해 있어 접촉 상태를 유지하거나 일정 거리만큼 이격되어 코일부(17)의 내측면과 삽입 기둥(152)의 외측면은 비접촉 상태를 유지할 수 있다.When each coil portion 17 is inserted into the corresponding insertion column 152, the inner surface of the inserted coil portion 17 is in contact with the outer surface of the insertion column 152 to maintain a contact state or spaced by a predetermined distance The inner side surface of the coil unit 17 and the outer side surface of the insertion pillar 152 may maintain a non-contact state.
삽입 기둥(152)의 높이는 대응하는 코일부(17)의 높이보다 높아 터치센서 모듈(100)의 터치 동작 시 발생하는 터치센서 모듈(100)의 두께 변화로 인한 코일부(17)의 손상이나 단선을 방지하게 된다.The height of the insertion pillar 152 is higher than the height of the corresponding coil unit 17 so that the coil unit 17 is damaged or disconnected due to the change in thickness of the touch sensor module 100 generated when the touch sensor module 100 is touched. Will be prevented.
이때, 삽입 기둥(152)의 높이는 터치 동작 시 터치센서 모듈(100)의 두께 변화량을 고려하여 정해질 수 있다.In this case, the height of the insertion pillar 152 may be determined in consideration of the thickness change amount of the touch sensor module 100 during the touch operation.
이러한 보빈부(15)는 금속, 플라스틱 또는 페라이트(ferrite) 등과 같은 다양한 재료로 이루어질 수 있다. 보빈부(15)에서 기판(151)과 삽입 기둥(152)은 하나의 재질로 일체로 형성될 수 있다.The bobbin portion 15 may be made of various materials such as metal, plastic, or ferrite. In the bobbin portion 15, the substrate 151 and the insertion pillar 152 may be integrally formed of one material.
경우에 따라서 기판(151)과 삽입 기둥(152)은 분리되어 형성되었다가 결합된 것일 수 있다. 이러한 경우 기판(151)과 삽입 기둥(152)은 서로 다른 재질로 형성된 것일 수 있다. 예를 들어, 기판(151)은 플라스틱 재질로 형성되고, 삽입 기둥(152)은 페라이트 재질로 형성될 수 있다.In some cases, the substrate 151 and the insertion pillar 152 may be separated and combined. In this case, the substrate 151 and the insertion pillar 152 may be formed of different materials. For example, the substrate 151 may be formed of a plastic material, and the insertion pillar 152 may be formed of a ferrite material.
기판(151)은 저항이 높은 비전도성 물질로 이루어질 경우, 해당 코일부(17)의 하단부에서 생성되는 와류의 세기가 감소되어 터치센서 모듈(100)의 감도를 높이는 효과가 발생한다.When the substrate 151 is made of a non-conductive material having high resistance, the strength of the eddy current generated at the lower end of the coil unit 17 is reduced, thereby increasing the sensitivity of the touch sensor module 100.
코일부(17)는, 이미 기술한 것처럼, 각 코일부(17)가 삽입되어 있는 부분이다.As described above, the coil portion 17 is a portion into which the coil portions 17 are inserted.
이처럼, 코일부(17)는 이미 설명한 것처럼 평면 방향뿐만 아니라 높이 방향으로도 코일선이 감겨 형성되므로, 코일선의 권선 회수가 크게 증가한다. As described above, the coil portion 17 is formed by winding the coil wire not only in the planar direction but also in the height direction as described above, so that the number of turns of the coil wire is greatly increased.
즉, 코일부(17)를 형성하는 하나의 코일선은 해당 평면에서 가운데 부분이 빈 구멍이 형성되도록 정해진 횟수만큼 감겨져 하나의 코일층(예, 제1 코일층)을 형성한다.That is, one coil line forming the coil unit 17 is wound a predetermined number of times so that a hollow portion is formed in the center of the plane to form one coil layer (eg, the first coil layer).
그런 다음, 형성된 제1 코일층 위에서 다시 정해진 횟수만큼 코일선이 권선되어 제1 코일층 위에 다른 코일층(예, 제2 코일층)이 형성된다.Then, the coil wire is wound again a predetermined number of times on the formed first coil layer to form another coil layer (eg, the second coil layer) on the first coil layer.
이러한 방식으로 하나의 코일층이 형성된 후 다시 형성된 코일층 위에 또 다른 코일층이 순차적으로 형성되므로, n개의 코일층이 높이 방향으로 따라 순차적으로 형성된다. 이때, 코일층의 개수는 형성된 코일부(17)가 삽입되는 삽입 기둥(152)의 높이에 따라 정해질 수 있다.In this manner, since another coil layer is sequentially formed on the coil layer formed again after one coil layer is formed, n coil layers are sequentially formed along the height direction. In this case, the number of coil layers may be determined according to the height of the insertion pillar 152 into which the formed coil part 17 is inserted.
따라서, 본 예의 코일부(17)는 끊김없이 연결된 하나의 코일선으로 형성된 복수 개의 코일층을 구비하고, 본 예에 따른 코일부(17)의 예는 도 5의 (a)와 (b)에 도시되어 있다.Accordingly, the coil portion 17 of the present example has a plurality of coil layers formed by one coil line connected without interruption, and an example of the coil portion 17 according to the present example is shown in FIGS. 5A and 5B. Is shown.
도 5의 (a)에 도시되어 있는 것처럼, 각 코일층은 평면 방향으로 복수 번의 권선 동작이 이루어져 있고, 도 5의 (b)에 도시한 것처럼, 높이 방향으로도 복수 개의 코일층이 적층되어 있음을 알 수 있다.As shown in FIG. 5A, each coil layer has a plurality of winding operations in a planar direction, and as shown in FIG. 5B, a plurality of coil layers are stacked in the height direction. It can be seen.
이와 같이, 본 예의 코일부(17)는 구리 등의 금속으로 이루어져 있는 패턴 형태로 기판의 면에 나선형으로 인쇄되어 형성되는 대신, 코일선을 권선하여 형성된다. 따라서, 해당 재료를 해당 면에 인쇄하여 형성되는 패턴보다 훨씬 얇은 폭을 갖는 코일선을 이용하여 코일부(17)가 형성되므로, 패턴을 인쇄하는 경우보다 동일한 평면에 권선되는 권선수가 훨씬 증가하며 추가적으로 높이 방향으로도 복수 개의 코일층이 형성된다.In this way, the coil portion 17 of the present example is formed by winding coil lines instead of being spirally printed on the surface of the substrate in the form of a pattern made of metal such as copper. Therefore, since the coil part 17 is formed by using a coil wire having a much thinner width than the pattern formed by printing the material on the corresponding surface, the number of windings wound on the same plane is further increased and additionally, when the pattern is printed. A plurality of coil layers are also formed in the height direction.
이로 인해, 패턴을 인쇄하여 코일부를 형성하는 경우에 비해, 동일 면적에서 권선되는 코일의 권선 수가 크게 증가하므로 코일부(17)의 인덕턴스 값 역시 크게 증가한다. 이로 인해, 터치센서 모듈(100)의 감도가 향상된다.For this reason, compared with the case of printing the pattern to form the coil portion, the number of windings of the coil wound in the same area is greatly increased, so the inductance value of the coil portion 17 also increases significantly. As a result, the sensitivity of the touch sensor module 100 is improved.
코일선의 권선 동작에 의해 형성된 코일부(17)에는 코일선의 양단에서부터 각각 연장되어 외부로 도출되는 있는 두 개의 인출선(L11)이 존재하며, 이들 인출선(L11)은 회로기판(13)으로부터에 위치한 제어 장치와 연결되어 있다. 따라서, 제어 장치에서 출력되는 교류 전류는 연결된 코일부(17)의 각 인출선(L11)으로 인가된다.In the coil unit 17 formed by the winding operation of the coil wire, there are two lead wires L11 extending from both ends of the coil wire and extending outwards, and these lead wires L11 extend from the circuit board 13. It is connected to the located control unit. Therefore, the alternating current output from the control device is applied to each lead line L11 of the connected coil part 17.
코일부(17) 위에 위치하는 간격재(19)는 대략 직사각형의 평면 형상을 갖는 하나의 판 형태를 갖고 있고, 코일부(17)의 상부면과 접하게 위치하고 있다.The spacer 19 positioned on the coil portion 17 has a plate shape having a substantially rectangular planar shape and is located in contact with the upper surface of the coil portion 17.
따라서, 코일부(17)의 개수가 복수 개일 때, 간격재(19)는 각 코일부(17)의 상부면뿐만 아니라 인접한 두 코일부(17) 사이의 빈 공간 위에도 위치한다.Therefore, when the number of the coil parts 17 is plural, the spacer 19 is positioned not only on the upper surface of each coil part 17 but also on the empty space between two adjacent coil parts 17.
이러한 간격재(19)로 인해, 코일부(17)는 간격재(19)의 두께에 따라 정해지는 일정 간격만큼 상부막(110)과 이격되게 위치한다.Due to the spacer 19, the coil unit 17 is positioned to be spaced apart from the upper layer 110 by a predetermined interval determined according to the thickness of the spacer 19.
본 예에서, 간격재(19)는 복원력과 압축율이 우수한 탄성을 갖는 재료, 예를 들어, 폴리에틸렌(polyethylene), 폴리우레탄(polyurethane), 폴리오레핀(polyolefin) 등 방수 및 방진용으로 사용되는 발포체 폼 형태(단차나 휨에 물이 투입되는 틈이 없으며, 기재가 물에 통과하지 않고 높은 수압에 견딤)의 테이프(Tape) 등으로 이루어질 수 있다.In this example, the spacer 19 is a foam foam that is used for waterproofing and dustproofing materials having elasticity having excellent restoring force and compression ratio, such as polyethylene, polyurethane, polyolefin, and the like. It may be made of a tape or the like of a shape (no gap into which water is introduced into the step or warpage, and the substrate withstands high water pressure without passing through the water).
따라서, 코일부(17)와 상부막(110)은 터치센서 모듈(100)이 미동작 시 즉, 터치 동작이 이루어지지 않을 때 간격재(19)에 의해 일정한 간격을 유지하게 되고, 상부막(110)의 어느 한 지점에서 터치 동작이 발생하여 상부막(110) 쪽으로 물리적인 힘이 가해질 때 해당 지점은 힘의 크기에 비례하게 눌러진다.Accordingly, the coil unit 17 and the upper layer 110 are maintained at a constant interval by the spacer 19 when the touch sensor module 100 is not in operation, that is, when the touch operation is not made. When a touch operation occurs at any one point of 110 and a physical force is applied toward the upper layer 110, the point is pressed in proportion to the magnitude of the force.
이러한 터치 동작에 따른 터치 지점에 코일부(17)와 상부막(110) 간의 간격 변화가 이루어지고, 코일부(17)와 상부막(110) 간의 간격 변화에 따라 코일부(17)의 인덕턴스가 변화한다. 따라서, 터치 동작 시 발생하는 인덕턴스 변화를 제어부(도시하지 않음)에 의해 감지하여, 해당 지점에서의 터치 동작이 감지된다. The change in the distance between the coil unit 17 and the upper layer 110 is made at the touch point according to the touch operation, and the inductance of the coil unit 17 is changed according to the change in the gap between the coil unit 17 and the upper layer 110. Change. Therefore, the controller (not shown) detects a change in inductance generated during the touch operation, and thus the touch operation at the corresponding point is detected.
이때, 해당 지점에서의 터치 동작이 해제되면, 간격재(19)의 우수한 복원력에 의해 상부막(110)과 해당 코일부(17) 간의 간격은 초기 상태로 신속하게 되돌아간다. At this time, when the touch operation at the corresponding point is released, the gap between the upper layer 110 and the coil unit 17 is quickly returned to the initial state by the excellent restoring force of the spacer 19.
본 예의 경우, 간격재(19)는 코일부(17) 위의 전체면에 위치하는 판 형이지만, 이와는 달리, 보빈부(15)의 가장자리부나 보강판(11)의 가장자리부에만 위치하고 복수 개의 코일부(17) 상부에는 간격재(19)가 존재하지 않을 수 있다. 이런 경우, 복수 개의 코일부(17)와 상부막(110) 사이는 간격재(19)의 높이만큼 이격되어 있지만, 본 예와 달리, 각 코일부(17)와 상부막(110) 사이에는 공기가 존재하는 에어갭(air gap)이 된다.In this example, the spacer 19 is in the form of a plate located on the entire surface above the coil portion 17, but alternatively, the spacer 19 is located only at the edge of the bobbin portion 15 or the edge of the reinforcing plate 11. The spacer 19 may not exist on the upper portion of the portion 17. In this case, the plurality of coils 17 and the upper film 110 are spaced apart by the height of the spacer 19, but unlike the present example, air is formed between each of the coil parts 17 and the upper film 110. Becomes an air gap in which is present.
상부막(110)은 터치 여부에 따라 변하는 코일부(17) 간의 간격 변화에 따라 인덕턴스의 변화를 초래하기 위한 것이다.The upper layer 110 is intended to cause a change in inductance according to a change in the distance between the coil units 17 that change depending on whether or not the touch.
이러한 상부막(110)은 알루미늄(Al)이나 구리(Cu)와 같은 금속과 같은 도전성 물질로 이루어질 수 있고, 간격재(19) 전체를 덮기 위한 판 형태로 이루어져 있다.The upper layer 110 may be made of a conductive material such as a metal such as aluminum (Al) or copper (Cu), and may have a plate shape for covering the entire spacer 19.
따라서, 회로기판(13)에 연결된 인출선(L11)을 통해 각 코일부(17)로 교류 전류가 인가되어 각 코일부(17)에 자기장이 발생하면, 발생된 자기장에 따라 상부막(110)에는 코일부(17)에 인가되는 전류 방향과 대칭되게 와전류인 유도 전류가 발생하며, 이때, 발생되는 유도 전류의 세기는 인접한 코일부(17)와 상부막(110)의 해당 부분 간의 거리에 따라 달라진다. Therefore, when an alternating current is applied to each coil unit 17 through the lead line L11 connected to the circuit board 13, and a magnetic field is generated in each coil unit 17, the upper layer 110 is formed according to the generated magnetic field. Induced eddy current is generated symmetrically with respect to the current direction applied to the coil unit 17, the intensity of the induced current generated according to the distance between the adjacent coil unit 17 and the corresponding portion of the upper film 110 Different.
이때, 해당하는 코일부(17)와 상부막(110) 간의 거리가 감소할수록 상부막(110)의 해당 지점에 형성되는 와전류의 세기는 증가한다.At this time, as the distance between the corresponding coil unit 17 and the upper layer 110 decreases, the intensity of the eddy current formed at the corresponding point of the upper layer 110 increases.
따라서, 상부막(110)의 표면을 사용자가 누르게 되면, 상부막(110)의 터치 지점은 인가되는 힘의 세기에 비례하게 휘게 되어 상부막(110)과 해당 코일부(17) 간의 거리가 감소한다. 이로 인해, 터치 동작이 발생한 상부막(110)의 해당 지점에서의 유도 전류의 크기는 증가하고, 증가하는 유도 전류의 영향에 의해 해당 지점의 코일부(17)에서 발생하는 자기장이 감소한다.Therefore, when the user presses the surface of the upper layer 110, the touch point of the upper layer 110 is bent in proportion to the strength of the applied force, thereby reducing the distance between the upper layer 110 and the coil unit 17. do. As a result, the magnitude of the induced current at the corresponding point of the upper layer 110 where the touch operation occurs is increased, and the magnetic field generated at the coil unit 17 at the corresponding point decreases due to the increase of the induced current.
이러한 자기장의 감소는 코일부(17)의 실효 인덕턴스를 감소시키게 된다. This reduction in magnetic field reduces the effective inductance of the coil unit 17.
이러한 터치 동작에 따른 인덕턴스 변화를 감지하여, 상부막(110)의 터치 지점에 가해지는 힘의 정도 즉, Z축 방향으로의 눌림 정도가 감지된다.By detecting the change in inductance according to the touch operation, the degree of force applied to the touch point of the upper layer 110, that is, the degree of pressing in the Z-axis direction is sensed.
다음, 도 6 내지 도 9를 참고로 하여 본 발명의 다른 실시예에 따른 터치센서 모듈(100a, 100b)에 대하여 설명한다.Next, the touch sensor modules 100a and 100b according to another embodiment of the present invention will be described with reference to FIGS. 6 to 9.
이하에서, 도 1 내지 도 5의 터치센서 모듈(100)과 비교할 때, 동일한 구조를 갖고 같은 기능을 수행하는 구성요소에 대해서는 도 1 내지 도 5에 도시한 터치센서 모듈(100)과 동일한 도면 부호를 부여하며 그에 대한 자세한 설명도 생략한다.Hereinafter, in comparison with the touch sensor module 100 of FIGS. 1 to 5, the components having the same structure and performing the same function are the same reference numerals as the touch sensor module 100 shown in FIGS. 1 to 5. And the detailed description thereof is omitted.
먼저, 도 6 및 도 7를 참고로 하여, 터치센서 모듈(100a)을 설명한다.First, the touch sensor module 100a will be described with reference to FIGS. 6 and 7.
도 6 및 도 7에 도시한 터치센서 모듈(100a)은 도 1 내지 도 5에 도시한 터치센서 모듈(100)과 비교할 때, 회로기판(13a)의 위치가 상이하며 보강판(11)이 생략된 구조를 갖는다.The touch sensor module 100a illustrated in FIGS. 6 and 7 has a different position than the touch sensor module 100 illustrated in FIGS. 1 to 5, and the reinforcement plate 11 is omitted. Has a structure.
즉, 본 예의 터치센서 모듈(100a)은 기판(151a)과 삽입 기둥(152)을 구비하고 있는 보빈부(15), 보빈부(15) 위에 위치하는 회로기판(13a), (회로기판(13a)을 관통하여 돌출되어 있는 보빈부(15)의 삽입 기둥(152)에 삽입되어 있는 복수 개의 코일부(17), 복수 개의 코일부(17) 위에 위치하는 간격재(19) 및 간격재(19) 위에 위치하는 상부막(110)을 구비한다.That is, the touch sensor module 100a of this example includes a bobbin portion 15 having a substrate 151a and an insertion post 152, a circuit board 13a positioned on the bobbin portion 15, and a circuit board 13a. ), A plurality of coil parts 17 inserted into the insertion pillar 152 of the bobbin part 15 protruding through the spacer member, a spacer 19 and a spacer 19 positioned on the plurality of coil parts 17. A top film 110 positioned on the top surface).
이때, 회로기판(13a)은 삽입 기둥(152)을 돌출하기 위한 복수 개의 관통구(131)를 구비하고 있다.In this case, the circuit board 13a includes a plurality of through holes 131 for protruding the insertion pillar 152.
이때, 관통구(131)는 각 코일부(17)를 완전히 관통시키거나 삽입 기둥(152)만이 완전히 관통시키는 크기를 갖고 있다.At this time, the through hole 131 has a size that completely penetrates each coil portion 17 or only the insertion pillar 152 completely.
따라서, 해당 삽입 기둥(152)뿐만 아니라 코일부(17)도 완전히 관통하는 크기로 관통구(131)가 형성되는 경우, 각 코일부(17)는 해당 관통구(131)를 관통하여 보빈부(15)의 기판(151) 위에 바로 위치하게 된다.Therefore, when the through holes 131 are formed to fully penetrate not only the insertion pillar 152 but also the coil part 17, each coil part 17 penetrates the corresponding through hole 131 to provide a bobbin part ( It is located directly on the substrate 151 of 15).
반면, 해당 삽입 기둥(152)만을 완전히 관통하고 해당 코일부(171)는 관통하지 못하는 크기로 관통구(131)가 형성되는 경우, 각 코일부(17)는 회로기판(151) 위에 바로 위치하게 된다.On the other hand, when the through hole 131 is formed to penetrate only the insertion pillar 152 completely and the coil part 171 cannot penetrate, each coil part 17 is positioned directly on the circuit board 151. do.
이와 같이, 보빈부(15)의 기판(151)과 코일부(17) 사이에 회로기판(13a)이 위치하므로, 각 코일부(17)의 코일선은 인접한 회로기판(13a)의 해당 패드(P13)에 바로 연결된다. 따라서, 회로기판(13a)에는 코일부(17)와의 전기적 및 물리적 연결을 위한 개구부가 불필요하다.As described above, since the circuit board 13a is positioned between the substrate 151 of the bobbin part 15 and the coil part 17, the coil line of each coil part 17 has a corresponding pad (a) of the adjacent circuit board 13a. Directly connected to P13). Therefore, an opening for electrical and physical connection with the coil unit 17 is unnecessary in the circuit board 13a.
이러한 도 7의 경우, 별도의 보강판이 위치하지 않으므로, 맨 하부에 위치하는 보빈부(15)는 상부에 위치한 코일부(17)과 상부막(110)을 지지하는 보강판 역할을 하게 된다. In this case, since a separate reinforcement plate is not located, the bobbin part 15 positioned at the bottom thereof serves as a reinforcement plate supporting the coil part 17 and the upper layer 110 positioned at the top.
따라서, 보빈부(17) 위에 회로기판(13a)이 위치하는 도 7의 경우, 터치센서 모듈(100a)의 전체 총 두께는 회로기판(13a)의 두께만큼 감소하는 효과가 발생한다. Therefore, in the case of FIG. 7 in which the circuit board 13a is positioned on the bobbin portion 17, the total thickness of the touch sensor module 100a is reduced by the thickness of the circuit board 13a.
다음, 도 8 및 도 9를 참고로 하여 본 발명의 또 다른 실시예에 따른 터치센서 모듈(100b)에 대하여 설명한다.Next, the touch sensor module 100b according to another embodiment of the present invention will be described with reference to FIGS. 8 and 9.
도 8 및 도 9에 도시한 본 발명의 또 다른 실시예에 따른 터치센서 모듈(100b) 역시 보강판(11), 보강판(11) 위에 위치한 회로기판(13b), 회로기판(13b) 위에 위치하는 보빈부(15b), 보빈부(15b)에 삽입되는 복수 개의 코일부(17), 복수 개의 코일부(17) 위에 위치하는 간격재(19), 그리고 간격재(19) 위에 위치하는 상부막(110)을 구비한다.8 and 9, the touch sensor module 100b according to another exemplary embodiment of the present invention is also positioned on the reinforcement plate 11 and the reinforcement plate 11 and the circuit board 13b and the circuit board 13b. The bobbin portion 15b, the plurality of coil portions 17 inserted into the bobbin portion 15b, the spacer 19 positioned on the plurality of coil portions 17, and the upper layer positioned on the spacer 19. 110.
도 1 내지 도 5와 비교할 때, 본 예의 터치센서 모듈(100b)은 보빈부(15b)의 위치와 형상이 터치센서 모듈(100)의 보빈부(15)와 상이하다. 1 to 5, the touch sensor module 100b of the present example is different from the bobbin portion 15 of the touch sensor module 100 in the position and shape of the bobbin portion 15b.
도 8 및 도 9에 도시한 것처럼, 보빈부(15b)는 간격재(19) 바로 하부에 위치하며, 기판(151b), 기판(151b)에서부터 하부 쪽, 즉 회로기판(13) 쪽으로 돌출된 복수 개의 삽입 기둥(152b) 및 인접한 두 삽입 기둥(152b) 사이에 위치하는 지지 기둥(153)을 구비한다. As shown in FIGS. 8 and 9, the bobbin portion 15b is positioned directly below the spacer 19, and a plurality of protrusions protrude from the substrate 151b and the substrate 151b to the lower side, that is, the circuit board 13. Two supporting pillars 152b and two adjacent supporting pillars 152b.
즉, 도 1 내지 도 4의 터치센서 모듈(100)에서 보빈부(15)의 기판(151)은 하부판을 형성하고, 하부판인 기판(151)에서 상부 쪽, 즉 간격재(19) 쪽으로 복수 개의 삽입 기둥(152)이 돌출되어 있다.That is, in the touch sensor module 100 of FIGS. 1 to 4, the substrate 151 of the bobbin part 15 forms a lower plate, and a plurality of substrates 151 are formed on the upper side, that is, toward the spacer 19, from the lower substrate 151. The insertion column 152 protrudes.
하지만, 이와 반대로, 본 예에서는 보빈부(15b)의 기판(151b)은 상부판을 형성하고 상부판인 기판(151b)에서 하부 쪽으로 복수 개의 삽입 기둥(152b)이 돌출되어 있으며, 삽입 기둥(152b)의 양 측에 지지 기둥(153)이 위치한다.However, on the contrary, in this example, the substrate 151b of the bobbin portion 15b forms an upper plate, and a plurality of insertion pillars 152b protrude from the upper substrate 151b to the lower side, and the insertion pillar 152b. Support pillars 153 are located on both sides of the).
이로 인해, 각 삽입 기둥(152b)은 회로기판(13)의 해당 면 위에 해당 면과 접하게 위치하므로, 각 코일부(17b)를 형성하는 복수 개의 코일층은 기판(171)이 아니라 회로기판(13)의 해당 면에서부터 순차적으로 적층된다.As a result, each of the insertion pillars 152b is positioned on the corresponding surface of the circuit board 13 so as to be in contact with the surface. Are stacked sequentially from the corresponding side of the plane.
이런 경우, 각 코일부(17b)는 회로기판(13)의 해당 면에 접하게 위치하므로, 각 코일부(17b)의 코일선은 회로기판(13) 상에 위치한 해당 패드(13)와 바로 연결된다.In this case, since each coil part 17b is located in contact with the corresponding surface of the circuit board 13, the coil line of each coil part 17b is directly connected with the corresponding pad 13 located on the circuit board 13. .
따라서, 회로기판(13)은 각 코일부(17b)의 인출선(L11)과 회로기판(13)과의 전기적인 및 물리적인 연결을 위한 별도의 개구부를 구비할 필요가 없으므로, 각 코일부(17b)의 인출선(L11)과 인쇄회로(13b)의 해당 패드(P13) 간의 연결 동작이 용이하게 이루어진다. Therefore, since the circuit board 13 does not have to have a separate opening for electrical and physical connection between the lead line L11 of each coil part 17b and the circuit board 13, each coil part ( The connection operation between the leader line L11 of 17b and the corresponding pad P13 of the printed circuit 13b is easily performed.
또한, 기판(151b)에서 아래쪽으로 돌출되어 있는 지지 기둥(153)은 회로기판(13)에 보빈부(15b)가 좀 더 안정적으로 위치할 수 있도록 하는 지지대이다.In addition, the support pillar 153 protruding downward from the substrate 151b is a support for allowing the bobbin portion 15b to be more stably positioned on the circuit board 13.
이러한 지지 기둥(153)은 삽입 기둥(152b)과 일체로 형성될 수 있거나 삽입 기둥(152)과 별개로 형성되어 기판(151b)에 부착될 수 있다.The support pillar 153 may be integrally formed with the insertion pillar 152b or may be formed separately from the insertion pillar 152 and attached to the substrate 151b.
또한, 기판(13) 위에 복수 개의 코일부(17)가 위치할 경우, 인접한 두 코일부(17) 사이에 지지 기둥(153)이 위치하므로, 인접한 두 코일부(17) 간의 간섭 현상을 방지되어, 터치센서 모듈(100b)의 동작에 대한 신뢰성이 향상된다. 또한, 본 예의 간격재(19)는 보빈부(15b)의 기판(151b)의 해당 면 위에 위치한다.In addition, when the plurality of coil parts 17 are positioned on the substrate 13, the support pillar 153 is positioned between two adjacent coil parts 17, thereby preventing interference between two adjacent coil parts 17. The reliability of the operation of the touch sensor module 100b is improved. In addition, the spacer 19 of this example is located on the corresponding surface of the board | substrate 151b of the bobbin part 15b.
따라서, 간격재(19)는 기판(151b)의 전체 면에 위치하거나, 기판(151b)의 가장자리부에만 위치하여 상부막(110)과 기판(151b) 사이에 에어갭이 존재할 수 있다.Accordingly, the spacer 19 may be disposed on the entire surface of the substrate 151b or may be located only at the edge of the substrate 151b such that an air gap may exist between the upper layer 110 and the substrate 151b.
이로 인해, 상부막(110)은 보빈부(15b)의 기판(151b), 좀 더 구체적으로는 각 코일부(17)와 일정한 거리를 유지하게 되며, 상부막(110)의 터치 동작 시 간격재(19)의 압축 동작에 의해 상부막(110)과 코일부(17)와의 거리 변화가 발생하게 된다.As a result, the upper layer 110 maintains a constant distance from the substrate 151b of the bobbin portion 15b, more specifically, each coil portion 17, and the spacer during the touch operation of the upper layer 110. The compression operation of 19 causes a change in distance between the upper film 110 and the coil portion 17.
이상, 본 발명의 터치센서 모듈의 실시예들에 대해 설명하였다. 본 발명은 상술한 실시예 및 첨부한 도면에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자의 관점에서 다양한 수정 및 변형이 가능할 것이다. 따라서 본 발명의 범위는 본 명세서의 청구범위뿐만 아니라 이 청구범위와 균등한 것들에 의해 정해져야 한다.In the above, embodiments of the touch sensor module of the present invention have been described. The present invention is not limited to the above-described embodiment and the accompanying drawings, and various modifications and variations will be possible in view of those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be defined not only by the claims of the present specification but also by the equivalents of the claims.
100, 100a, 100b: 터치센서 모듈 11: 보강판100, 100a, 100b: touch sensor module 11: reinforcement plate
13, 13a, 13b: 회로기판 15, 15b: 보빈부13, 13a, 13b: circuit board 15, 15b: bobbin section
151, 151b: 기판 152, 152b: 삽입 기둥151, 151b: substrate 152, 152b: insertion pillar
153: 지지 기둥 17: 코일부153: support pillar 17: coil portion
19: 간격재 110: 상부막19: spacer 110: upper film

Claims (18)

  1. 기판과 상기 기판에서 돌출되는 삽입 기둥을 구비하는 보빈부;A bobbin portion having a substrate and an insertion pillar protruding from the substrate;
    코일선으로 이루어져 있고 상기 삽입 기둥에 삽입되어 있는 코일부; A coil part formed of a coil wire and inserted into the insertion pillar;
    상기 코일부와 연결되어 있는 회로기판; 및 A circuit board connected to the coil unit; And
    상기 코일부 위에 정해진 거리만큼 이격되게 위치하는 상부막An upper layer spaced apart from the coil unit by a predetermined distance
    을 포함하고,Including,
    상기 코일부는 상기 삽입 기둥의 높이 방향으로 따라 적층되어 있는 복수 개의 코일층을 포함하는 The coil unit includes a plurality of coil layers stacked in the height direction of the insertion pillar.
    터치센서 모듈.Touch sensor module.
  2. 제1 항에 있어서,According to claim 1,
    상기 회로기판은 상기 보빈부의 상기 기판 하부에 위치하고 있고,The circuit board is located below the substrate of the bobbin portion,
    상기 기판은 코일부의 코일선에서 연장되는 인출선이 관통하는 개구부를 포함하는 터치센서 모듈.The substrate includes a touch sensor module including an opening through which the leader line extending from the coil line of the coil portion passes.
  3. 제2 항에 있어서,The method of claim 2,
    상기 회로기판은 상기 인출선과 전기적으로 연결되는 도전성 패드를 포함하고,The circuit board includes a conductive pad electrically connected to the leader line,
    상기 도전성 패드는 상기 개구부를 통해 노출되어 상기 인출선과 연결되는 터치센서 모듈.And the conductive pad is exposed through the opening and connected to the leader line.
  4. 제2 항에 있어서,The method of claim 2,
    상기 회로기판 하부에 위치하고 있는 보강판을 더 포함하는 터치센서 모듈.The touch sensor module further comprises a reinforcing plate located under the circuit board.
  5. 제4 항에 있어서, The method of claim 4, wherein
    상기 보강판은 폴리이미드나 스테인리스 스틸로 이루어져 있는 터치센서 모듈.The reinforcement plate is a touch sensor module made of polyimide or stainless steel.
  6. 제1 항에 있어서,According to claim 1,
    상기 삽입 기둥은 상기 기판으로부터 상기 상부막 쪽으로 돌출되어 있는 터치센서 모듈.The insertion pillar protrudes from the substrate toward the upper layer.
  7. 제1 항에 있어서,According to claim 1,
    상기 회로기판은 상기 보빈부의 상기 기판 위에 위치하고 있고, 상기 삽입 기둥이 관통하는 관통구를 포함하는 터치센서 모듈.The circuit board is positioned on the substrate of the bobbin portion, the touch sensor module including a through hole through which the insertion column passes.
  8. 제7 항에 있어서,The method of claim 7, wherein
    상기 코일부는 상기 관통구를 관통하는 터치센서 모듈.The coil sensor penetrates the through hole.
  9. 제1 항에 있어서,According to claim 1,
    상기 코일부는 상기 회로기판의 상면에 직접 접촉하여 위치하는 터치센서 모듈.The coil unit is a touch sensor module is positioned in direct contact with the upper surface of the circuit board.
  10. 제1 항에 있어서,According to claim 1,
    상기 삽입 기둥은 상기 기판으로부터 상기 회로기판 쪽으로 돌출되어 있는 터치센서 모듈.The insertion pillar protrudes from the substrate toward the circuit board.
  11. 제10 항에 있어서,The method of claim 10,
    상기 삽입 기둥은 상기 회로기판의 상면에 직접 접촉하여 위치하는 터치센서 모듈.The insertion pillar is a touch sensor module positioned in direct contact with the upper surface of the circuit board.
  12. 제10 항에 있어서,The method of claim 10,
    상기 삽입 기둥의 양 측에서 상기 기판으로부터 상기 회로기판 쪽으로 돌출되어 있는 지지 기둥을 더 포함하는 터치센서 모듈. And a support pillar protruding from the substrate toward the circuit board at both sides of the insertion pillar.
  13. 제1 항에 있어서,According to claim 1,
    상기 상부막과 상기 복수 개의 코일부 사이에 위치하는 간격재를 더 포함하는 터치센서 모듈.The touch sensor module further comprises a spacer positioned between the upper layer and the plurality of coil parts.
  14. 제1 항에 있어서,According to claim 1,
    상기 상부막과 상기 보빈부의 상기 기판 사이에 위치하는 간격재를 더 포함하는 터치센서 모듈.The touch sensor module further comprises a spacer positioned between the upper layer and the substrate of the bobbin portion.
  15. 제1 항에 있어서,According to claim 1,
    상기 상부막은 금속으로 이루어져 있는 터치센서 모듈.The upper film is a touch sensor module made of a metal.
  16. 제1 항에 있어서,According to claim 1,
    상기 보빈부는 금속, 플라스틱 또는 페라이트로 이루어져 있는 터치센서 모듈.The bobbin unit is a touch sensor module made of metal, plastic or ferrite.
  17. 제1 항에 있어서,According to claim 1,
    상기 회로기판의 하부면에 부착되어 있는 전자기파 차단 필름을 더 포함하는 터치센서 모듈.The touch sensor module further comprises an electromagnetic wave blocking film attached to the lower surface of the circuit board.
  18. 제1 항에 있어서,According to claim 1,
    상기 보빈부와 상기 보빈부에 위치하는 상기 코일부의 개수는 각각 복수 개이고,The number of the coil portion located in the bobbin portion and the bobbin portion, respectively,
    복수 개의 보빈부는 상기 기판의 연장 방향을 따라 정해진 간격으로 이격되게 위치하는 터치센서 모듈. A plurality of bobbin parts are located at a predetermined interval spaced along the extending direction of the substrate.
PCT/KR2018/016848 2018-06-22 2018-12-28 Touch sensor module WO2019245123A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005266890A (en) * 2004-03-16 2005-09-29 Seiko Epson Corp Touch panel device, control method of touch panel device and pos terminal device
JP4069789B2 (en) * 2003-04-14 2008-04-02 株式会社デンソー Pressure sensor
KR101091005B1 (en) * 2009-11-06 2011-12-08 위니아만도 주식회사 Input device using inductive sensor
US20140055958A1 (en) * 2012-08-23 2014-02-27 Li-Te Hsu 3d touch module and its methode of manufacturing
JP2014524605A (en) * 2011-08-03 2014-09-22 ダヴ Touch interface module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101777733B1 (en) 2016-08-29 2017-09-13 한국생산기술연구원 3D touch divice having image sensors and opaque members

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4069789B2 (en) * 2003-04-14 2008-04-02 株式会社デンソー Pressure sensor
JP2005266890A (en) * 2004-03-16 2005-09-29 Seiko Epson Corp Touch panel device, control method of touch panel device and pos terminal device
KR101091005B1 (en) * 2009-11-06 2011-12-08 위니아만도 주식회사 Input device using inductive sensor
JP2014524605A (en) * 2011-08-03 2014-09-22 ダヴ Touch interface module
US20140055958A1 (en) * 2012-08-23 2014-02-27 Li-Te Hsu 3d touch module and its methode of manufacturing

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