WO2021166037A1 - Laser processing machine - Google Patents

Laser processing machine Download PDF

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Publication number
WO2021166037A1
WO2021166037A1 PCT/JP2020/006088 JP2020006088W WO2021166037A1 WO 2021166037 A1 WO2021166037 A1 WO 2021166037A1 JP 2020006088 W JP2020006088 W JP 2020006088W WO 2021166037 A1 WO2021166037 A1 WO 2021166037A1
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WO
WIPO (PCT)
Prior art keywords
optical element
optical
processing machine
laser beam
laser processing
Prior art date
Application number
PCT/JP2020/006088
Other languages
French (fr)
Japanese (ja)
Inventor
京藤　友博
恭平 石川
瀬口　正記
智毅 桂
古田　啓介
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2020530406A priority Critical patent/JP6833117B1/en
Priority to PCT/JP2020/006088 priority patent/WO2021166037A1/en
Publication of WO2021166037A1 publication Critical patent/WO2021166037A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot

Definitions

  • the present disclosure relates to a laser processing machine that processes a work piece by irradiating a laser beam.
  • Patent Document 1 includes two conical lenses and a moving mechanism for moving each conical lens in the optical axis direction, and a laser processing machine that switches the beam mode by changing the distance between the conical lenses. Is disclosed.
  • the conventional laser machine disclosed in Patent Document 1 requires a moving mechanism having a long length in the optical axis direction in order to secure a moving distance of each conical lens in the optical axis direction in the moving mechanism. .. Further, the larger the beam diameter is changed, the longer the moving distance of each conical lens becomes, and the larger the moving mechanism becomes. Therefore, according to the conventional technique, the laser processing machine has a problem that it is difficult to switch the beam mode due to a small configuration.
  • the present disclosure has been made in view of the above, and an object of the present disclosure is to obtain a laser processing machine capable of switching the intensity distribution in the cross section of the laser beam by a compact configuration.
  • the laser processing machine processes a work piece by irradiating a laser beam.
  • the laser processing machine includes a light source that emits a laser beam and a switching unit that switches the intensity distribution in the cross section of the laser beam.
  • the switching unit includes a plurality of optical elements and a moving mechanism for individually moving each of the plurality of optical elements to a position on the optical axis of the laser beam and a position off the optical axis.
  • the laser processing machine has an effect that the intensity distribution in the cross section of the laser beam can be switched by a compact configuration.
  • the figure for demonstrating the optical characteristic of the 1st optical element which the switching unit of the laser processing machine which concerns on Embodiment 1 has.
  • FIG. 1 is a diagram showing a schematic configuration of a laser processing machine according to a first embodiment.
  • the laser processing machine 1 processes the workpiece 2 by irradiating the laser beam.
  • the laser machining machine 1 includes a laser oscillator 3 which is a light source that emits a laser beam, a processing head 4 that emits a laser beam toward a workpiece 2, and a transmission path of the laser beam from the laser oscillator 3 to the processing head 4.
  • the transmission cable 5 is provided, a processing table 10 on which the workpiece 2 is placed, and a control device 11 for controlling the laser processing machine 1 are provided.
  • an optical system including a collimating optical system 6, a zoom optical system 7, and a condensing optical system 8 is housed.
  • the collimating optical system 6 parallelizes the laser beam emitted from the transmission cable 5.
  • the zoom optical system 7 has a plurality of lenses 9.
  • the zoom optical system 7 adjusts the beam diameter by adjusting the distance between the lenses 9 by the lens driving unit that moves each lens 9.
  • the illustration of the lens drive unit is omitted.
  • the condensing optical system 8 converges the laser beam.
  • the machining table 10 moves in the two-dimensional direction.
  • the laser processing machine 1 changes the irradiation position of the laser beam on the workpiece 2 by moving the processing table 10.
  • the laser processing machine 1 includes a beam mode, that is, a switching unit 12 for switching the intensity distribution in the cross section of the laser beam.
  • the switching unit 12 is arranged inside the processing head 4.
  • the switching unit 12 has a first optical element 13 and a second optical element 14, which are a plurality of optical elements.
  • Each of the first optical element 13 and the second optical element 14 has a position on the optical axis AX of the laser beam and a position deviated from the optical axis AX between the collimating optical system 6 and the zoom optical system 7. It is possible to move individually in.
  • FIG. 1 shows how the first optical element 13 and the second optical element 14 are arranged on the optical axis AX.
  • the laser beam emitted from the collimating optical system 6 is incident on the first optical element 13.
  • the laser beam emitted from the first optical element 13 is incident on the second optical element 14.
  • the laser beam emitted from the second optical element 14 is incident on the zoom optical system 7.
  • the first optical element 13 and the second optical element 14 are arranged at positions deviated from the optical axis AX, the laser beam emitted from the collimating optical system 6 is incident on the zoom optical system 7.
  • the laser beam emitted from the collimating optical system 6 is the first. It is incident on the optical element 13 of the above. The laser beam emitted from the first optical element 13 is incident on the zoom optical system 7.
  • the laser beam emitted from the collimating optical system 6 is the second. It is incident on the optical element 14 of the above. The laser beam emitted from the second optical element 14 is incident on the zoom optical system 7.
  • the control device 11 outputs an oscillation control signal corresponding to each command value such as peak output, pulse width, number of pulses, and pulse frequency to the laser oscillator 3.
  • the laser oscillator 3 emits a laser beam according to an oscillation control signal.
  • the control device 11 outputs a zoom control signal corresponding to the command value of the beam diameter to the lens driving unit.
  • the lens driving unit moves each lens 9 according to the zoom control signal.
  • the control device 11 outputs a position control signal corresponding to the position command value to the processing table 10.
  • the machining table 10 moves according to the position control signal.
  • the control device 11 outputs a switching command to the switching unit 12.
  • the switching command is a command for switching the beam mode.
  • the switching unit 12 switches the beam mode by moving the first optical element 13 and the second optical element 14 according to the switching command.
  • the first optical element 13 and the second optical element 14 are conical lenses having a conical convex surface.
  • Each of the first optical element 13 and the second optical element 14 has a conical surface which is a conical convex surface and a plane opposite to the conical surface.
  • the vertices of the cone may be simply referred to as vertices.
  • the plane of the first optical element 13 is directed to the incident side of the laser beam.
  • the plane of the second optical element 14 is directed toward the emission side of the laser beam.
  • the conical surface of the first optical element 13 and the conical surface of the second optical element 14 face each other.
  • the first optical element 13 and the second optical element 14 are separated from each other in the optical axis direction so as not to collide with each other.
  • the central axis of the first optical element 13 and the central axis of the second optical element 14 are the optical axes. Matches AX. Even if at least one of the first optical element 13 and the second optical element 14 is moved onto the optical axis AX from a position deviated from the optical axis AX, the collimating optical system 6, the zoom optical system 7, and the condensing optical system No deviation of the central axis of the laser beam from each center of 8 occurs.
  • the optical system included in the laser processing machine 1 is not limited to that described in the first embodiment.
  • the positions of the first optical element 13 and the second optical element 14 on the optical axis AX are not limited to the positions on the incident side of the zoom optical system 7, but may be the positions on the exit side of the zoom optical system 7.
  • the optical system may include optical components other than the collimating optical system 6, the zoom optical system 7, and the condensing optical system 8.
  • FIG. 2 is a diagram for explaining the optical characteristics of the first optical element included in the switching unit of the laser processing machine according to the first embodiment.
  • the first optical element 13 When the Gaussian beam is incident on the plane 16 of the first optical element 13, the first optical element 13 forms a ring-shaped beam.
  • the optical distance from the apex of the first optical element 13 to the image plane S is L
  • the diameter of the ring that is the spot of the beam on the image plane S is R 1
  • the plane perpendicular to the central axis of the cone and the cone plane 15 are The following equation (1) holds, where ⁇ is the angle formed and n is the refractive index of the first optical element 13.
  • the unit of L and R 1 is mm
  • the unit of ⁇ is degree.
  • R 1 2L x tan ⁇ (n-1) x ⁇ ... (1)
  • ⁇ be the angle formed by the beam emitted from the first optical element 13 and the optical axis AX, and ⁇ is expressed by the following equation (2). Further, the following equation (3) holds, where d is the width of the ring-shaped beam and R0 is the diameter of the beam incident on the first optical element 13. The units of d and R 0 are mm, and the units of ⁇ and ⁇ are degrees.
  • ⁇ sin -1 (n ⁇ sin ⁇ ) - ⁇ ⁇ ⁇ ⁇ (2)
  • d R 0/2 ⁇ ⁇ ⁇ (3)
  • the second optical element 14 When the Gaussian beam is incident on the conical surface 15 of the second optical element 14, the second optical element 14 forms a ring-shaped beam.
  • the diameter of the ring formed by the second optical element 14 is different from the diameter of the ring formed by the first optical element 13.
  • the first optical element 13 and the second optical element 14 have optical characteristics for obtaining different intensity distributions in the workpiece 2.
  • the Gaussian beam when the Gaussian beam is incident on the plane 16 of the first optical element 13 in a state where the first optical element 13 and the second optical element 14 are arranged on the optical axis AX,
  • the first optical element 13 and the second optical element 14 form a ring-shaped beam.
  • the diameter of the ring formed by the combination of the first optical element 13 and the second optical element 14 is different from the diameter of the ring formed when the first optical element 13 is alone.
  • the diameter of the ring formed by the combination of the first optical element 13 and the second optical element 14 is also different from the diameter of the ring formed when the second optical element 14 is alone.
  • the first optical element 13 and the second optical element 14 are used in combination with each other, so that each of the first optical element 13 and the second optical element 14 is used. Irradiates a laser beam with an intensity distribution different from each intensity distribution when is used alone.
  • FIG. 3 is a diagram showing a configuration of a switching unit among the laser processing machines according to the first embodiment.
  • the first optical element 13 is attached to the lens holder 17.
  • the second optical element 14 is attached to the lens holder 18.
  • the switching unit 12 has a slide portion 19 that moves the first optical element 13 together with the lens holder 17, and a slide portion 20 that moves the second optical element 14 together with the lens holder 18.
  • FIG. 3 shows the cross sections of the first optical element 13, the second optical element 14, and the lens holders 17 and 18, and the side surfaces of the slide portions 19 and 20.
  • the slide portion 19 and the slide portion 20 have a moving mechanism for individually moving each of the first optical element 13 and the second optical element 14 to a position on the optical axis AX and a position deviated from the optical axis AX. Constitute.
  • the slide portion 19 moves the first optical element 13 in the linear direction between the first position on the optical axis AX and the second position deviated from the optical axis AX.
  • the slide portion 20 moves the second optical element 14 in the linear direction between the third position on the optical axis AX and the fourth position deviated from the optical axis AX.
  • the linear direction is a direction included in the two-dimensional direction perpendicular to the optical axis AX.
  • FIG 3 shows a state when the first optical element 13 is arranged at the first position and the second optical element 14 is arranged at the third position, and the first optical element 13 is the first. It shows a state when the second optical element 14 is arranged at the second position and the second optical element 14 is arranged at the fourth position.
  • the slide unit 19 moves the first optical element 13 to the first position and the second position by reciprocating the first optical element 13 in the linear direction.
  • the slide unit 20 moves the second optical element 14 to the third position and the fourth position by reciprocating the second optical element 14 in the linear direction.
  • the slide portions 19 and 20 are, for example, linear slide cylinders.
  • the slide portions 19 and 20 may be any mechanism as long as they can move in the linear direction, and may be a mechanism other than the linear slide cylinder.
  • the switching unit 12 sets the beam mode at the imaging position, which is the optical design position, in the four beam modes. Switch.
  • the laser processing machine 1 irradiates a laser beam in a beam mode selected from the four beam modes.
  • the first beam mode among the four beam modes is a beam mode in which the first optical element 13 and the second optical element 14 are arranged on the optical axis AX.
  • the second beam mode out of the four beam modes is a beam when the first optical element 13 is arranged at a position deviated from the optical axis AX and the second optical element 14 is arranged on the optical axis AX.
  • the third beam mode among the four beam modes is a beam when the first optical element 13 is arranged on the optical axis AX and the second optical element 14 is arranged at a position deviated from the optical axis AX. The mode.
  • the fourth beam mode out of the four beam modes is a beam mode in which the first optical element 13 and the second optical element 14 are arranged at positions deviated from the optical axis AX.
  • the laser machining machine 1 selects a beam mode from four beam modes according to a designated machining condition.
  • FIG. 4 is a diagram for explaining the first beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the first embodiment.
  • the distance between the first optical element 13 and the second optical element 14 is a length ⁇ L.
  • the length ⁇ L is predetermined in the design of the switching unit 12.
  • the laser beam that has passed through the transmission cable 5 diffuses from the exit end of the transmission cable 5 and enters the collimating optical system 6.
  • the laser beam emitted from the collimating optical system 6 is incident on the first optical element 13.
  • the laser beam emitted from the first optical element 13 is incident on the second optical element 14.
  • the laser beam incident on the first optical element 13 is a Gaussian beam having a beam diameter of D0 and a peak intensity of P0.
  • FIG. 4 shows a graph showing the intensity distribution M0 of the laser beam incident on the first optical element 13. In the graph, the vertical axis represents the intensity and the horizontal axis represents the position in the direction of the beam diameter.
  • the second optical element 14 When the laser beam having the intensity distribution M0 propagates between the first optical element 13 and the second optical element 14, the second optical element 14 emits a laser beam having a divergence angle of ⁇ 1.
  • the divergence angle is the angle formed by the laser beam and the optical axis AX.
  • L2 is an optical design distance from the second optical element 14 to the image plane S, and is an optical distance between the apex of the second optical element 14 and the image plane S.
  • the intensity distribution of the laser beam on the image plane S is the intensity distribution M1 in which the beam diameter is D1 and the peak intensity is P1.
  • FIG. 4 shows a graph showing the intensity distribution M1.
  • FIG. 5 is a diagram for explaining a second beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the first embodiment.
  • the laser beam emitted from the collimating optical system 6 is the first. Propagates outside the optical element 13 of the above and enters the second optical element 14.
  • FIG. 5 shows a graph showing the intensity distribution M0 of the laser beam incident on the second optical element 14.
  • the intensity distribution of the laser beam on the image plane S is an intensity distribution M2 in which the beam diameter is D2 and the peak intensity is P2. D1> D2 and P1 ⁇ P2 hold.
  • FIG. 5 shows a graph showing the intensity distribution M2.
  • FIG. 6 is a diagram for explaining a third beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the first embodiment.
  • the laser beam emitted from the collimating optical system 6 is the first. It is incident on the optical element 13 of the above.
  • FIG. 6 shows a graph showing the intensity distribution M0 of the laser beam incident on the first optical element 13. The laser beam emitted from the first optical element 13 propagates outside the second optical element 14.
  • L1 is an optical design distance from the first optical element 13 to the image plane S, and is an optical distance between the apex of the first optical element 13 and the image plane S.
  • the intensity distribution of the laser beam on the image plane S is an intensity distribution M3 in which the beam diameter is D3 and the peak intensity is P3.
  • FIG. 6 shows a graph showing the intensity distribution M3 of the laser beam at such a position.
  • FIG. 7 is a diagram for explaining a fourth beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the first embodiment.
  • the laser beam emitted from the collimating optical system 6 is sent to the first optical element 13 in the switching unit 12. And propagate outside the second optical element 14.
  • the laser beam emitted from the switching unit 12 is a Gaussian beam having a beam diameter of D4 and a peak intensity of P4. D4 ⁇ D0 and P4 ⁇ P0 hold.
  • FIG. 7 shows a graph showing the intensity distribution M4 of the laser beam emitted from the switching unit 12.
  • the laser processing machine 1 adjusts the beam diameter of the laser beam propagating through the switching unit 12 by the zoom optical system 7. Further, the laser processing machine 1 appropriately converges the laser beam after adjusting the beam diameter in the zoom optical system 7 by the condensing optical system 8 and irradiates the workpiece 2.
  • the laser processing machine 1 irradiates the laser beam in the first beam mode with the first optical element 13 and the second optical element 14 arranged on the optical axis AX.
  • the first beam mode is a first intensity distribution according to the optical characteristics provided in the combination of the first optical element 13 and the second optical element 14.
  • the laser processing machine 1 is in a second beam mode in a state where the first optical element 13 is arranged at a position deviated from the optical axis AX and the second optical element 14 is arranged on the optical axis AX. Irradiate the laser beam.
  • the second beam mode is a second intensity distribution according to the optical characteristics provided in the second optical element 14.
  • the laser processing machine 1 has a third beam mode in a state where the first optical element 13 is arranged on the optical axis AX and the second optical element 14 is arranged at a position deviated from the optical axis AX. Irradiate the laser beam of.
  • the third beam mode is a third intensity distribution according to the optical characteristics provided in the first optical element 13.
  • the laser machine 1 When the laser machine 1 irradiates the laser beam of the first beam mode, the second beam mode, or the third beam mode, a ring-shaped spot is formed on the workpiece 2.
  • the laser beams of the first beam mode, the second beam mode, and the third beam mode are suitable for cutting thick sheet metal.
  • the beam diameter, peak intensity or divergence angle in each of the first beam mode, the second beam mode and the third beam mode is the beam of the laser beam incident on the first optical element 13 or the second optical element 14.
  • Diameter, cone apex angle in first optical element 13, conical apex angle in second optical element 14, optical distance between first optical element 13 and image plane S, second optical element It can be arbitrarily designed according to the optical distance between the 14 and the image plane S, the refractive index of the first optical element 13, the refractive index of the second optical element 14, and the like.
  • the beam diameter, peak intensity or divergence angle in each of the first beam mode, the second beam mode and the third beam mode is the material of the workpiece 2, the thickness of the workpiece 2, and the laser oscillator 3. It can be arbitrarily changed by combining various conditions such as output conditions, processing speed, assist gas, focal position, and required processing quality.
  • the conditions of the assist gas include conditions such as the type of gas or the gas pressure.
  • the number of optical elements included in the switching unit 12 is not limited to two.
  • the switching unit 12 may have a plurality of optical elements that can be individually moved, and the number of optical elements is arbitrary.
  • Each of the plurality of optical elements has optical characteristics for obtaining different intensity distributions in the workpiece 2. Further, in the laser processing machine 1, since each of the plurality of optical elements is used in combination with each other, the laser beam having an intensity distribution different from each intensity distribution when each of the plurality of optical elements is used alone. Irradiate.
  • Each of the plurality of optical elements is not limited to the conical lens.
  • Each of the plurality of optical elements may be an aspherical lens having the same optical characteristics as the conical lens.
  • the switching unit 12 moves each of the plurality of optical elements individually in the linear direction to move the plurality of optical elements to a position on the optical axis AX and a position deviated from the optical axis AX. Move each individually.
  • the switching unit 12 switches the beam mode of the laser beam by individually moving each of the plurality of optical elements to a position on the optical axis AX and a position deviating from the optical axis AX.
  • the length of the switching unit 12 in the optical axis direction can be shorter than that in the case of moving each optical element in the optical axis direction. In the laser processing machine 1, even if the switching unit 12 is small, the beam diameter can be greatly changed by moving each of the plurality of optical elements.
  • the laser processing machine 1 can reduce the size of the system including the switching unit 12 and the optical system.
  • the cleanliness of the optical components mounted on the system can be maintained by a simple structure. Further, the laser processing machine 1 can extend the life of the optical component by maintaining the cleanliness of the optical component.
  • the laser machine 1 can perform highly accurate positioning of optical components with simple control as compared with the case where the system is large. Further, the laser processing machine 1 can reduce the manufacturing cost as compared with the case where the system is large.
  • the laser processing machine 1 has an effect that the intensity distribution in the cross section of the laser beam can be switched by a compact configuration.
  • FIG. 8 is a diagram showing a configuration of a switching unit among the laser processing machines according to the second embodiment.
  • the switching unit 30 included in the laser processing machine 1 according to the second embodiment has a moving mechanism for rotating each of the plurality of optical elements.
  • the same components as those in the first embodiment are designated by the same reference numerals, and the configurations different from those in the first embodiment will be mainly described.
  • the switching unit 30 has a rotating unit 31 that rotates the first optical element 13 together with the lens holder 17, and a rotating unit 32 that rotates the second optical element 14 together with the lens holder 18.
  • the rotating unit 31 and the rotating unit 32 have a moving mechanism for individually moving each of the first optical element 13 and the second optical element 14 to a position on the optical axis AX and a position deviated from the optical axis AX.
  • the rotating portion 31 is attached to the end of the lens holder 17. In a state where the first optical element 13 is arranged at the first position on the optical axis AX, the rotating portion 31 rotates 90 degrees around the rotating shaft 33, so that the first optical element 13 becomes a first. It moves from the position of 1 to the second position off the optical axis AX. In the state where the first optical element 13 is arranged at the second position, the rotating portion 31 rotates 90 degrees in the direction opposite to the movement from the first position to the second position, whereby The first optical element 13 moves from the second position to the first position. The rotating unit 31 rotates the first optical element 13 between the first position and the second position.
  • the rotating portion 32 is attached to the end of the lens holder 18. In a state where the second optical element 14 is arranged at the third position on the optical axis AX, the rotating portion 32 rotates 90 degrees around the rotating shaft 34, so that the second optical element 14 is seconded. It moves from the third position to the fourth position off the optical axis AX. In the state where the second optical element 14 is arranged at the fourth position, the rotating portion 32 rotates 90 degrees in the direction opposite to the movement from the third position to the fourth position, whereby The second optical element 14 moves from the fourth position to the third position. The rotating unit 32 rotates the second optical element 14 between the third position and the fourth position. FIG.
  • FIG 8 shows a state in which the first optical element 13 is arranged at the first position and the second optical element 14 is arranged at the third position, and the first optical element 13 is the first. It shows a state when the second optical element 14 is arranged at the second position and the second optical element 14 is arranged at the fourth position.
  • Each of the rotating parts 31 and 32 is, for example, a motor.
  • Each of the rotating portions 31 and 32 may be a mechanism other than the motor as long as it is a rotatable mechanism.
  • the switching unit 30 switches the beam mode at the imaging position between the four beam modes by individually moving the first optical element 13 and the second optical element 14 according to the switching command. Similar to the first embodiment, the laser processing machine 1 irradiates the laser beam of the beam mode selected from the four beam modes.
  • the first optical element 13 and the second optical element 14 are arranged on the optical axis AX as in the case shown in FIG. NS.
  • the intensity distribution of the laser beam on the image plane S is the intensity distribution M1 in which the beam diameter is D1 and the peak intensity is P1.
  • FIG. 9 is a diagram for explaining a second beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the second embodiment.
  • the first optical element 13 is arranged at a position deviated from the optical axis AX
  • the second optical element 14 is arranged on the optical axis AX.
  • the intensity distribution of the laser beam on the image plane S is the intensity distribution M2 in which the beam diameter is D2 and the peak intensity is P2.
  • FIG. 10 is a diagram for explaining a third beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the second embodiment.
  • the first optical element 13 is arranged on the optical axis AX
  • the second optical element 14 is arranged at a position deviated from the optical axis AX.
  • the intensity distribution of the laser beam on the image plane S is the intensity distribution M3 in which the beam diameter is D3 and the peak intensity is P3.
  • FIG. 11 is a diagram for explaining a fourth beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the second embodiment.
  • the first optical element 13 and the second optical element 14 are arranged at positions deviated from the optical axis AX.
  • the laser beam emitted from the switching unit 30 is a Gaussian beam having a beam diameter of D4 and a peak intensity of P4, as in the case shown in FIG. 7.
  • the number of optical elements included in the switching unit 30 is not limited to two. Similar to the switching unit 12 of the first embodiment, the switching unit 30 may have a plurality of optical elements that can be individually moved, and the number of optical elements is arbitrary.
  • the switching unit 30 individually rotates each of the plurality of optical elements so that each of the plurality of optical elements is individually moved to a position on the optical axis AX and a position deviated from the optical axis AX. Move to.
  • the switching unit 30 switches the beam mode of the laser beam by individually moving each of the plurality of optical elements to a position on the optical axis AX and a position deviated from the optical axis AX.
  • the laser processing machine 1 can reduce the size of the system including the switching unit 30 and the optical system. As described above, the laser processing machine 1 according to the second embodiment has an effect that the intensity distribution in the cross section of the laser beam can be switched by a compact configuration.
  • FIG. 12 is a diagram showing a configuration of a switching unit among the laser processing machines according to the third embodiment.
  • the shape of each of the plurality of optical elements is different from the shape of each of the plurality of optical elements in the first or second embodiment.
  • the same components as those in the first or second embodiment are designated by the same reference numerals, and the configurations different from those in the first or second embodiment will be mainly described.
  • the switching unit 40 of the laser processing machine 1 has a first optical element 41 and a second optical element 42, which are a plurality of optical elements.
  • Each of the first optical element 41 and the second optical element 42 is an aspherical lens having a convex surface having a conical shape with a rounded top. The top is the part of the cone that contains the vertices.
  • the first optical element 41 has a tip portion 43 having a conical shape with a rounded top.
  • the second optical element 42 has a tip portion 44 shaped like a conical top with a rounded top.
  • the tip 43 of the first optical element 41 and the tip 44 of the second optical element 42 face each other.
  • the first optical element 41 is attached to the lens holder 17 in the same manner as the first optical element 13 shown in FIG. 3 or FIG.
  • the second optical element 42 is attached to the lens holder 18 in the same manner as the second optical element 14 shown in FIG. 3 or FIG.
  • the switching unit 40 has a moving mechanism for individually moving each of the first optical element 41 and the second optical element 42 to a position on the optical axis AX and a position deviated from the optical axis AX.
  • the moving mechanism is the slide portions 19 and 20 shown in FIG. 3 or the rotating portions 31 and 32 shown in FIG. In FIG. 12, the lens holders 17 and 18 and the moving mechanism are not shown.
  • the first optical element 41 and the second optical element 42 have optical characteristics for obtaining different intensity distributions in the workpiece 2.
  • the first optical element 41 and the second optical element 42 are used in combination with each other, so that each of the first optical element 41 and the second optical element 42 can be used independently. It irradiates a laser beam with an intensity distribution different from each intensity distribution when used.
  • the number of optical elements included in the switching unit 40 is not limited to two. Similar to the switching units 12 and 30 of the first or second embodiment, the switching unit 40 may have a plurality of optical elements that can be individually moved, and the number of optical elements is arbitrary. Each of the plurality of optics has a convex surface having a conical shape with a rounded top.
  • each of the plurality of optical elements has a convex surface having a conical shape with a rounded top.
  • the switching unit 40 can relax the position accuracy of each of the plurality of optical elements.
  • the laser processing machine 1 can stably irradiate the laser beam without improving the position accuracy of each of the plurality of optical elements.
  • the configuration shown in the above embodiments is an example of the contents of the present disclosure.
  • the configurations of each embodiment can be combined with other known techniques.
  • the configurations of the respective embodiments may be combined as appropriate. It is possible to omit or change a part of the configuration of each embodiment without departing from the gist of the present disclosure.

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Abstract

A laser processing machine (1) is provided with: a laser oscillator (3) as a light source which emits a laser beam; and a switching unit (12) for switching an intensity distribution in a cross-sectional plane of the laser beam. The switching unit (12) has: a first optical element (13) and a second optical element (14) as a plurality of optical elements; and a moving mechanism for moving the first optical element (13) and the second optical element (14) individually to a position on an optical axis of the laser beam and a position deviated from the optical axis, respectively.

Description

レーザ加工機Laser processing machine
　本開示は、レーザビームを照射することによって被加工物を加工するレーザ加工機に関する。 The present disclosure relates to a laser processing machine that processes a work piece by irradiating a laser beam.
　レーザビームの横断面における強度分布であるビームモードを切り替え可能なレーザ加工機が知られている。レーザ加工機は、被加工物の材質、被加工物の厚さ、または加工の種別などに適したビームモードを選択することによって、加工速度を向上し得る。特許文献１には、２つの円錐形レンズと、各円錐形レンズを光軸方向へ移動させる移動機構とを備え、各円錐形レンズの間の距離を変化させることによってビームモードを切り替えるレーザ加工機が開示されている。 A laser machine that can switch the beam mode, which is the intensity distribution in the cross section of the laser beam, is known. The laser machining machine can improve the machining speed by selecting a beam mode suitable for the material of the workpiece, the thickness of the workpiece, the type of machining, and the like. Patent Document 1 includes two conical lenses and a moving mechanism for moving each conical lens in the optical axis direction, and a laser processing machine that switches the beam mode by changing the distance between the conical lenses. Is disclosed.
特開２０１９－４２７９３号公報JP-A-2019-42793
　特許文献１に開示される従来のレーザ加工機は、移動機構において各円錐形レンズの光軸方向への移動距離を確保するために、光軸方向における長さが長い移動機構が必要であった。さらに、ビーム径を大きく変化させる場合ほど、各円錐形レンズの移動距離が長くなることによって移動機構は大型になる。そのため、従来の技術によると、レーザ加工機は、小型な構成によってビームモードの切り替えを実現することが難しいという問題があった。 The conventional laser machine disclosed in Patent Document 1 requires a moving mechanism having a long length in the optical axis direction in order to secure a moving distance of each conical lens in the optical axis direction in the moving mechanism. .. Further, the larger the beam diameter is changed, the longer the moving distance of each conical lens becomes, and the larger the moving mechanism becomes. Therefore, according to the conventional technique, the laser processing machine has a problem that it is difficult to switch the beam mode due to a small configuration.
　本開示は、上記に鑑みてなされたものであって、小型な構成によってレーザビームの横断面における強度分布を切り替え可能とするレーザ加工機を得ることを目的とする。 The present disclosure has been made in view of the above, and an object of the present disclosure is to obtain a laser processing machine capable of switching the intensity distribution in the cross section of the laser beam by a compact configuration.
　上述した課題を解決し、目的を達成するために、本開示にかかるレーザ加工機は、レーザビームを照射することによって被加工物を加工する。本開示にかかるレーザ加工機は、レーザビームを出射する光源と、レーザビームの横断面における強度分布を切り替える切替えユニットと、を備える。切替えユニットは、複数の光学素子と、レーザビームの光軸上の位置と光軸から外れた位置とへ複数の光学素子の各々を個別に移動させる移動機構と、を有する。 In order to solve the above-mentioned problems and achieve the object, the laser processing machine according to the present disclosure processes a work piece by irradiating a laser beam. The laser processing machine according to the present disclosure includes a light source that emits a laser beam and a switching unit that switches the intensity distribution in the cross section of the laser beam. The switching unit includes a plurality of optical elements and a moving mechanism for individually moving each of the plurality of optical elements to a position on the optical axis of the laser beam and a position off the optical axis.
　本開示にかかるレーザ加工機は、小型な構成によってレーザビームの横断面における強度分布を切り替えることができるという効果を奏する。 The laser processing machine according to the present disclosure has an effect that the intensity distribution in the cross section of the laser beam can be switched by a compact configuration.
実施の形態１にかかるレーザ加工機の概略構成を示す図The figure which shows the schematic structure of the laser processing machine which concerns on Embodiment 1. 実施の形態１にかかるレーザ加工機の切替えユニットが有する第１の光学素子の光学特性について説明するための図The figure for demonstrating the optical characteristic of the 1st optical element which the switching unit of the laser processing machine which concerns on Embodiment 1 has. 実施の形態１にかかるレーザ加工機のうち切替えユニットの構成を示す図The figure which shows the structure of the switching unit among the laser processing machines which concerns on Embodiment 1. 実施の形態１にかかるレーザ加工機が照射するレーザビームのビームモードのうち第１のビームモードについて説明するための図The figure for demonstrating the 1st beam mode among the beam modes of the laser beam irradiated by the laser processing machine which concerns on Embodiment 1. 実施の形態１にかかるレーザ加工機が照射するレーザビームのビームモードのうち第２のビームモードについて説明するための図The figure for demonstrating the 2nd beam mode among the beam modes of the laser beam irradiated by the laser processing machine which concerns on Embodiment 1. 実施の形態１にかかるレーザ加工機が照射するレーザビームのビームモードのうち第３のビームモードについて説明するための図The figure for demonstrating the 3rd beam mode among the beam modes of the laser beam irradiated by the laser processing machine which concerns on Embodiment 1. 実施の形態１にかかるレーザ加工機が照射するレーザビームのビームモードのうち第４のビームモードについて説明するための図The figure for demonstrating the 4th beam mode among the beam modes of the laser beam irradiated by the laser processing machine which concerns on Embodiment 1. 実施の形態２にかかるレーザ加工機のうち切替えユニットの構成を示す図The figure which shows the structure of the switching unit among the laser processing machines which concerns on Embodiment 2. 実施の形態２にかかるレーザ加工機が照射するレーザビームのビームモードのうち第２のビームモードについて説明するための図The figure for demonstrating the 2nd beam mode among the beam modes of the laser beam irradiated by the laser processing machine which concerns on Embodiment 2. 実施の形態２にかかるレーザ加工機が照射するレーザビームのビームモードのうち第３のビームモードについて説明するための図The figure for demonstrating the 3rd beam mode among the beam modes of the laser beam irradiated by the laser processing machine which concerns on Embodiment 2. 実施の形態２にかかるレーザ加工機が照射するレーザビームのビームモードのうち第４のビームモードについて説明するための図The figure for demonstrating the 4th beam mode among the beam modes of the laser beam irradiated by the laser processing machine which concerns on Embodiment 2. 実施の形態３にかかるレーザ加工機のうち切替えユニットの構成を示す図The figure which shows the structure of the switching unit among the laser processing machines which concerns on Embodiment 3.
　以下に、実施の形態にかかるレーザ加工機を図面に基づいて詳細に説明する。なお、この実施の形態により本開示が限定されるものではない。 The laser processing machine according to the embodiment will be described in detail below based on the drawings. The present disclosure is not limited to this embodiment.
実施の形態１．
　図１は、実施の形態１にかかるレーザ加工機の概略構成を示す図である。実施の形態１にかかるレーザ加工機１は、レーザビームを照射することによって被加工物２を加工する。レーザ加工機１は、レーザビームを出射する光源であるレーザ発振器３と、被加工物２へ向けてレーザビームを出射する加工ヘッド４と、レーザ発振器３から加工ヘッド４へのレーザビームの伝送路である伝送ケーブル５と、被加工物２が載せられる加工テーブル１０と、レーザ加工機１を制御する制御装置１１とを備える。 Embodiment 1.
FIG. 1 is a diagram showing a schematic configuration of a laser processing machine according to a first embodiment. The laser processing machine 1 according to the first embodiment processes the workpiece 2 by irradiating the laser beam. The laser machining machine 1 includes a laser oscillator 3 which is a light source that emits a laser beam, a processing head 4 that emits a laser beam toward a workpiece 2, and a transmission path of the laser beam from the laser oscillator 3 to the processing head 4. The transmission cable 5 is provided, a processing table 10 on which the workpiece 2 is placed, and a control device 11 for controlling the laser processing machine 1 are provided.
　加工ヘッド４の内部には、コリメート光学系６、ズーム光学系７および集光光学系８を含む光学系が収納されている。コリメート光学系６は、伝送ケーブル５から出射したレーザビームを平行化させる。ズーム光学系７は、複数のレンズ９を有する。各レンズ９を移動させるレンズ駆動部により各レンズ９の間隔が調整されることによって、ズーム光学系７は、ビーム径を調整する。レンズ駆動部の図示は省略する。集光光学系８は、レーザビームを収束させる。加工テーブル１０は、２次元方向において移動する。レーザ加工機１は、加工テーブル１０を移動させることによって、被加工物２におけるレーザビームの照射位置を変化させる。 Inside the processing head 4, an optical system including a collimating optical system 6, a zoom optical system 7, and a condensing optical system 8 is housed. The collimating optical system 6 parallelizes the laser beam emitted from the transmission cable 5. The zoom optical system 7 has a plurality of lenses 9. The zoom optical system 7 adjusts the beam diameter by adjusting the distance between the lenses 9 by the lens driving unit that moves each lens 9. The illustration of the lens drive unit is omitted. The condensing optical system 8 converges the laser beam. The machining table 10 moves in the two-dimensional direction. The laser processing machine 1 changes the irradiation position of the laser beam on the workpiece 2 by moving the processing table 10.
　レーザ加工機１は、ビームモード、すなわちレーザビームの横断面における強度分布を切り替える切替えユニット１２を備える。切替えユニット１２は、加工ヘッド４の内部に配置されている。切替えユニット１２は、複数の光学素子である第１の光学素子１３と第２の光学素子１４とを有する。 The laser processing machine 1 includes a beam mode, that is, a switching unit 12 for switching the intensity distribution in the cross section of the laser beam. The switching unit 12 is arranged inside the processing head 4. The switching unit 12 has a first optical element 13 and a second optical element 14, which are a plurality of optical elements.
　第１の光学素子１３と第２の光学素子１４との各々は、コリメート光学系６とズーム光学系７との間において、レーザビームの光軸ＡＸ上の位置と光軸ＡＸから外れた位置とにおいて個別に移動が可能とされている。図１には、第１の光学素子１３と第２の光学素子１４とが光軸ＡＸ上に配置されている様子を示している。 Each of the first optical element 13 and the second optical element 14 has a position on the optical axis AX of the laser beam and a position deviated from the optical axis AX between the collimating optical system 6 and the zoom optical system 7. It is possible to move individually in. FIG. 1 shows how the first optical element 13 and the second optical element 14 are arranged on the optical axis AX.
　第１の光学素子１３と第２の光学素子１４とが光軸ＡＸ上に配置されているとき、コリメート光学系６から出射したレーザビームは、第１の光学素子１３へ入射する。第１の光学素子１３から出射したレーザビームは、第２の光学素子１４へ入射する。第２の光学素子１４から出射したレーザビームは、ズーム光学系７へ入射する。第１の光学素子１３と第２の光学素子１４とが光軸ＡＸから外れた位置に配置されているとき、コリメート光学系６から出射したレーザビームは、ズーム光学系７へ入射する。第１の光学素子１３が光軸ＡＸ上に配置され、かつ第２の光学素子１４が光軸ＡＸから外れた位置に配置されているとき、コリメート光学系６から出射したレーザビームは、第１の光学素子１３へ入射する。第１の光学素子１３から出射したレーザビームは、ズーム光学系７へ入射する。第１の光学素子１３が光軸ＡＸから外れた位置に配置され、かつ第２の光学素子１４が光軸ＡＸ上に配置されているとき、コリメート光学系６から出射したレーザビームは、第２の光学素子１４へ入射する。第２の光学素子１４から出射したレーザビームは、ズーム光学系７へ入射する。 When the first optical element 13 and the second optical element 14 are arranged on the optical axis AX, the laser beam emitted from the collimating optical system 6 is incident on the first optical element 13. The laser beam emitted from the first optical element 13 is incident on the second optical element 14. The laser beam emitted from the second optical element 14 is incident on the zoom optical system 7. When the first optical element 13 and the second optical element 14 are arranged at positions deviated from the optical axis AX, the laser beam emitted from the collimating optical system 6 is incident on the zoom optical system 7. When the first optical element 13 is arranged on the optical axis AX and the second optical element 14 is arranged at a position deviated from the optical axis AX, the laser beam emitted from the collimating optical system 6 is the first. It is incident on the optical element 13 of the above. The laser beam emitted from the first optical element 13 is incident on the zoom optical system 7. When the first optical element 13 is arranged at a position deviated from the optical axis AX and the second optical element 14 is arranged on the optical axis AX, the laser beam emitted from the collimating optical system 6 is the second. It is incident on the optical element 14 of the above. The laser beam emitted from the second optical element 14 is incident on the zoom optical system 7.
　制御装置１１は、ピーク出力、パルス幅、パルス数およびパルス周波数などの各指令値に応じた発振制御信号をレーザ発振器３へ出力する。レーザ発振器３は、発振制御信号に従ってレーザビームを出射する。制御装置１１は、ビーム径の指令値に応じたズーム制御信号をレンズ駆動部へ出力する。レンズ駆動部は、ズーム制御信号に従って各レンズ９を移動させる。制御装置１１は、位置指令値に応じた位置制御信号を加工テーブル１０へ出力する。加工テーブル１０は、位置制御信号に従って移動する。制御装置１１は、切替え指令を切替えユニット１２へ出力する。切替え指令は、ビームモードを切り替えるための指令である。切替えユニット１２は、切替え指令に従って第１の光学素子１３と第２の光学素子１４とを移動させることによってビームモードを切り替える。 The control device 11 outputs an oscillation control signal corresponding to each command value such as peak output, pulse width, number of pulses, and pulse frequency to the laser oscillator 3. The laser oscillator 3 emits a laser beam according to an oscillation control signal. The control device 11 outputs a zoom control signal corresponding to the command value of the beam diameter to the lens driving unit. The lens driving unit moves each lens 9 according to the zoom control signal. The control device 11 outputs a position control signal corresponding to the position command value to the processing table 10. The machining table 10 moves according to the position control signal. The control device 11 outputs a switching command to the switching unit 12. The switching command is a command for switching the beam mode. The switching unit 12 switches the beam mode by moving the first optical element 13 and the second optical element 14 according to the switching command.
　次に、第１の光学素子１３と第２の光学素子１４とについて説明する。第１の光学素子１３と第２の光学素子１４とは、円錐形の凸面を有する円錐形レンズである。第１の光学素子１３と第２の光学素子１４との各々は、円錐形の凸面である円錐面と、円錐面とは逆側の平面とを有する。なお、以下の説明にて、円錐形の頂点を、単に頂点と称することがある。 Next, the first optical element 13 and the second optical element 14 will be described. The first optical element 13 and the second optical element 14 are conical lenses having a conical convex surface. Each of the first optical element 13 and the second optical element 14 has a conical surface which is a conical convex surface and a plane opposite to the conical surface. In the following description, the vertices of the cone may be simply referred to as vertices.
　第１の光学素子１３と第２の光学素子１４とが光軸ＡＸ上に配置されているとき、第１の光学素子１３の平面は、レーザビームの入射側に向けられる。第２の光学素子１４の平面は、レーザビームの出射側に向けられる。第１の光学素子１３の円錐面と第２の光学素子１４の円錐面とは、互いに向かい合わせられる。なお、第１の光学素子１３と第２の光学素子１４とは、互いにぶつかることが無いように、光軸方向において互いに離されている。 When the first optical element 13 and the second optical element 14 are arranged on the optical axis AX, the plane of the first optical element 13 is directed to the incident side of the laser beam. The plane of the second optical element 14 is directed toward the emission side of the laser beam. The conical surface of the first optical element 13 and the conical surface of the second optical element 14 face each other. The first optical element 13 and the second optical element 14 are separated from each other in the optical axis direction so as not to collide with each other.
　第１の光学素子１３と第２の光学素子１４とが光軸ＡＸ上に配置されているとき、第１の光学素子１３の中心軸と第２の光学素子１４の中心軸とは、光軸ＡＸと一致する。第１の光学素子１３と第２の光学素子１４との少なくとも一方を光軸ＡＸから外れた位置から光軸ＡＸ上へ移動させても、コリメート光学系６、ズーム光学系７および集光光学系８の各中心からのレーザビームの中心軸のずれは生じない。なお、レーザ加工機１が有する光学系は、実施の形態１にて説明するものに限られない。光軸ＡＸ上における第１の光学素子１３および第２の光学素子１４の位置は、ズーム光学系７の入射側の位置に限られず、ズーム光学系７の出射側の位置でも良い。光学系には、コリメート光学系６、ズーム光学系７および集光光学系８以外の光学部品が含まれても良い。 When the first optical element 13 and the second optical element 14 are arranged on the optical axis AX, the central axis of the first optical element 13 and the central axis of the second optical element 14 are the optical axes. Matches AX. Even if at least one of the first optical element 13 and the second optical element 14 is moved onto the optical axis AX from a position deviated from the optical axis AX, the collimating optical system 6, the zoom optical system 7, and the condensing optical system No deviation of the central axis of the laser beam from each center of 8 occurs. The optical system included in the laser processing machine 1 is not limited to that described in the first embodiment. The positions of the first optical element 13 and the second optical element 14 on the optical axis AX are not limited to the positions on the incident side of the zoom optical system 7, but may be the positions on the exit side of the zoom optical system 7. The optical system may include optical components other than the collimating optical system 6, the zoom optical system 7, and the condensing optical system 8.
　次に、第１の光学素子１３および第２の光学素子１４の光学特性について説明する。図２は、実施の形態１にかかるレーザ加工機の切替えユニットが有する第１の光学素子の光学特性について説明するための図である。 Next, the optical characteristics of the first optical element 13 and the second optical element 14 will be described. FIG. 2 is a diagram for explaining the optical characteristics of the first optical element included in the switching unit of the laser processing machine according to the first embodiment.
　第１の光学素子１３の平面１６へガウシアンビームが入射した場合に、第１の光学素子１３は、リング状のビームを形成する。第１の光学素子１３の頂点から像面Ｓまでの光学距離をＬ、像面Ｓにおけるビームのスポットであるリングの直径をＲ１、円錐形の中心軸に垂直な面と円錐面１５とがなす角度をα、第１の光学素子１３の屈折率をｎとして、次の式（１）が成り立つ。なお、ＬおよびＲ１の単位はｍｍ、αの単位は度である。
Ｒ１＝２Ｌ×ｔａｎ｛（ｎ－１）×α｝　　・・・（１） When the Gaussian beam is incident on the plane 16 of the first optical element 13, the first optical element 13 forms a ring-shaped beam. The optical distance from the apex of the first optical element 13 to the image plane S is L, the diameter of the ring that is the spot of the beam on the image plane S is R 1 , and the plane perpendicular to the central axis of the cone and the cone plane 15 are The following equation (1) holds, where α is the angle formed and n is the refractive index of the first optical element 13. The unit of L and R 1 is mm, and the unit of α is degree.
R 1 = 2L x tan {(n-1) x α} ... (1)
　第１の光学素子１３から出射するビームと光軸ＡＸとがなす角度をθとして、θは、次の式（２）により表される。また、リング状のビームの幅をｄ、第１の光学素子１３へ入射するビームの直径をＲ０として、次の式（３）が成り立つ。なお、ｄおよびＲ０の単位はｍｍ、θおよびαの単位は度である。
θ＝ｓｉｎ－１（ｎ×ｓｉｎα）－α　　・・・（２）
ｄ＝Ｒ０／２　　・・・（３） Let θ be the angle formed by the beam emitted from the first optical element 13 and the optical axis AX, and θ is expressed by the following equation (2). Further, the following equation (3) holds, where d is the width of the ring-shaped beam and R0 is the diameter of the beam incident on the first optical element 13. The units of d and R 0 are mm, and the units of θ and α are degrees.
θ = sin -1 (n × sin α) -α ・ ・ ・ (2)
d = R 0/2・ ・ ・ (3)
　第２の光学素子１４の円錐面１５へガウシアンビームが入射した場合に、第２の光学素子１４は、リング状のビームを形成する。第２の光学素子１４によって形成されるリングの直径は、第１の光学素子１３によって形成されるリングの直径とは異なる。第１の光学素子１３と第２の光学素子１４とは、被加工物２において互いに異なる強度分布を得るための光学特性を備える。 When the Gaussian beam is incident on the conical surface 15 of the second optical element 14, the second optical element 14 forms a ring-shaped beam. The diameter of the ring formed by the second optical element 14 is different from the diameter of the ring formed by the first optical element 13. The first optical element 13 and the second optical element 14 have optical characteristics for obtaining different intensity distributions in the workpiece 2.
　図１に示すように第１の光学素子１３と第２の光学素子１４とが光軸ＡＸ上に配置されている状態において第１の光学素子１３の平面１６へガウシアンビームが入射した場合に、第１の光学素子１３および第２の光学素子１４は、リング状のビームを形成する。第１の光学素子１３と第２の光学素子１４との組み合わせによって形成されるリングの直径は、第１の光学素子１３が単独である場合に形成されるリングの直径とは異なる。第１の光学素子１３と第２の光学素子１４との組み合わせによって形成されるリングの直径は、第２の光学素子１４が単独である場合に形成されるリングの直径とも異なる。これにより、レーザ加工機１は、第１の光学素子１３と第２の光学素子１４とが互いに組み合わせられて使用されることによって、第１の光学素子１３と第２の光学素子１４との各々が単独で使用される場合における各強度分布とは異なる強度分布のレーザビームを照射する。 As shown in FIG. 1, when the Gaussian beam is incident on the plane 16 of the first optical element 13 in a state where the first optical element 13 and the second optical element 14 are arranged on the optical axis AX, The first optical element 13 and the second optical element 14 form a ring-shaped beam. The diameter of the ring formed by the combination of the first optical element 13 and the second optical element 14 is different from the diameter of the ring formed when the first optical element 13 is alone. The diameter of the ring formed by the combination of the first optical element 13 and the second optical element 14 is also different from the diameter of the ring formed when the second optical element 14 is alone. As a result, in the laser processing machine 1, the first optical element 13 and the second optical element 14 are used in combination with each other, so that each of the first optical element 13 and the second optical element 14 is used. Irradiates a laser beam with an intensity distribution different from each intensity distribution when is used alone.
　次に、第１の光学素子１３と第２の光学素子１４とを移動させる移動機構について説明する。図３は、実施の形態１にかかるレーザ加工機のうち切替えユニットの構成を示す図である。第１の光学素子１３は、レンズホルダ１７に取り付けられている。第２の光学素子１４は、レンズホルダ１８に取り付けられている。切替えユニット１２は、レンズホルダ１７とともに第１の光学素子１３を移動させるスライド部１９と、レンズホルダ１８とともに第２の光学素子１４を移動させるスライド部２０とを有する。図３には、第１の光学素子１３、第２の光学素子１４およびレンズホルダ１７，１８の各断面と、スライド部１９，２０の各側面とを示している。 Next, a moving mechanism for moving the first optical element 13 and the second optical element 14 will be described. FIG. 3 is a diagram showing a configuration of a switching unit among the laser processing machines according to the first embodiment. The first optical element 13 is attached to the lens holder 17. The second optical element 14 is attached to the lens holder 18. The switching unit 12 has a slide portion 19 that moves the first optical element 13 together with the lens holder 17, and a slide portion 20 that moves the second optical element 14 together with the lens holder 18. FIG. 3 shows the cross sections of the first optical element 13, the second optical element 14, and the lens holders 17 and 18, and the side surfaces of the slide portions 19 and 20.
　スライド部１９とスライド部２０とは、光軸ＡＸ上の位置と光軸ＡＸから外れた位置とへ第１の光学素子１３と第２の光学素子１４との各々を個別に移動させる移動機構を構成する。スライド部１９は、光軸ＡＸ上の第１の位置と光軸ＡＸから外れた第２の位置との間において第１の光学素子１３を直線方向へ移動させる。スライド部２０は、光軸ＡＸ上の第３の位置と光軸ＡＸから外れた第４の位置との間において第２の光学素子１４を直線方向へ移動させる。直線方向は、光軸ＡＸに垂直な２次元方向に含まれる方向である。図３には、第１の光学素子１３が第１の位置に配置され、かつ第２の光学素子１４が第３の位置に配置されているときの様子と、第１の光学素子１３が第２の位置に配置され、かつ第２の光学素子１４が第４の位置に配置されているときの様子とを示している。 The slide portion 19 and the slide portion 20 have a moving mechanism for individually moving each of the first optical element 13 and the second optical element 14 to a position on the optical axis AX and a position deviated from the optical axis AX. Constitute. The slide portion 19 moves the first optical element 13 in the linear direction between the first position on the optical axis AX and the second position deviated from the optical axis AX. The slide portion 20 moves the second optical element 14 in the linear direction between the third position on the optical axis AX and the fourth position deviated from the optical axis AX. The linear direction is a direction included in the two-dimensional direction perpendicular to the optical axis AX. FIG. 3 shows a state when the first optical element 13 is arranged at the first position and the second optical element 14 is arranged at the third position, and the first optical element 13 is the first. It shows a state when the second optical element 14 is arranged at the second position and the second optical element 14 is arranged at the fourth position.
　スライド部１９は、直線方向において第１の光学素子１３を往復移動させることによって、第１の位置と第２の位置とへ第１の光学素子１３を移動させる。スライド部２０は、直線方向において第２の光学素子１４を往復移動させることによって、第３の位置と第４の位置とへ第２の光学素子１４を移動させる。各スライド部１９，２０は、例えばリニアスライドシリンダである。各スライド部１９，２０は、直線方向への移動が可能な機構であれば良く、リニアスライドシリンダ以外の機構であっても良い。 The slide unit 19 moves the first optical element 13 to the first position and the second position by reciprocating the first optical element 13 in the linear direction. The slide unit 20 moves the second optical element 14 to the third position and the fourth position by reciprocating the second optical element 14 in the linear direction. The slide portions 19 and 20 are, for example, linear slide cylinders. The slide portions 19 and 20 may be any mechanism as long as they can move in the linear direction, and may be a mechanism other than the linear slide cylinder.
　次に、レーザ加工機１によるビームモードの切り替えについて説明する。切替えユニット１２は、切替え指令にしたがって第１の光学素子１３と第２の光学素子１４とを個別に移動させることによって、光学的な設計位置である結像位置におけるビームモードを４つのビームモードにおいて切り替える。レーザ加工機１は、４つのビームモードの中から選択されたビームモードのレーザビームを照射する。 Next, switching of the beam mode by the laser processing machine 1 will be described. By individually moving the first optical element 13 and the second optical element 14 according to the switching command, the switching unit 12 sets the beam mode at the imaging position, which is the optical design position, in the four beam modes. Switch. The laser processing machine 1 irradiates a laser beam in a beam mode selected from the four beam modes.
　４つのビームモードのうち第１のビームモードは、第１の光学素子１３と第２の光学素子１４とが光軸ＡＸ上に配置される場合のビームモードである。４つのビームモードのうち第２のビームモードは、第１の光学素子１３が光軸ＡＸから外れた位置に配置され、かつ第２の光学素子１４が光軸ＡＸ上に配置される場合のビームモードである。４つのビームモードのうち第３のビームモードは、第１の光学素子１３が光軸ＡＸ上に配置され、かつ第２の光学素子１４が光軸ＡＸから外れた位置に配置される場合のビームモードである。４つのビームモードのうち第４のビームモードは、第１の光学素子１３と第２の光学素子１４とが光軸ＡＸから外れた位置に配置される場合のビームモードである。レーザ加工機１は、指定された加工条件に従って４つのビームモードの中からビームモードを選択する。 The first beam mode among the four beam modes is a beam mode in which the first optical element 13 and the second optical element 14 are arranged on the optical axis AX. The second beam mode out of the four beam modes is a beam when the first optical element 13 is arranged at a position deviated from the optical axis AX and the second optical element 14 is arranged on the optical axis AX. The mode. The third beam mode among the four beam modes is a beam when the first optical element 13 is arranged on the optical axis AX and the second optical element 14 is arranged at a position deviated from the optical axis AX. The mode. The fourth beam mode out of the four beam modes is a beam mode in which the first optical element 13 and the second optical element 14 are arranged at positions deviated from the optical axis AX. The laser machining machine 1 selects a beam mode from four beam modes according to a designated machining condition.
　図４は、実施の形態１にかかるレーザ加工機が照射するレーザビームのビームモードのうち第１のビームモードについて説明するための図である。第１の光学素子１３と第２の光学素子１４とが光軸ＡＸ上に配置されているとき、第１の光学素子１３と第２の光学素子１４との間隔は、長さΔＬである。長さΔＬは、切替えユニット１２の設計においてあらかじめ決定されている。 FIG. 4 is a diagram for explaining the first beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the first embodiment. When the first optical element 13 and the second optical element 14 are arranged on the optical axis AX, the distance between the first optical element 13 and the second optical element 14 is a length ΔL. The length ΔL is predetermined in the design of the switching unit 12.
　伝送ケーブル５を通過したレーザビームは、伝送ケーブル５の出射端から拡散して、コリメート光学系６へ入射する。コリメート光学系６から出射したレーザビームは、第１の光学素子１３へ入射する。第１の光学素子１３から出射したレーザビームは、第２の光学素子１４へ入射する。 The laser beam that has passed through the transmission cable 5 diffuses from the exit end of the transmission cable 5 and enters the collimating optical system 6. The laser beam emitted from the collimating optical system 6 is incident on the first optical element 13. The laser beam emitted from the first optical element 13 is incident on the second optical element 14.
　第１の光学素子１３へ入射するレーザビームは、ビーム径がＤ０、かつピーク強度がＰ０であるガウシアンビームである。図４には、第１の光学素子１３へ入射するレーザビームの強度分布Ｍ０を表すグラフを示している。グラフにおいて、縦軸は強度、横軸はビーム径の方向における位置を表す。 The laser beam incident on the first optical element 13 is a Gaussian beam having a beam diameter of D0 and a peak intensity of P0. FIG. 4 shows a graph showing the intensity distribution M0 of the laser beam incident on the first optical element 13. In the graph, the vertical axis represents the intensity and the horizontal axis represents the position in the direction of the beam diameter.
　強度分布Ｍ０のレーザビームが第１の光学素子１３と第２の光学素子１４とを伝播すると、第２の光学素子１４からは、発散角がθ１であるレーザビームが出射する。発散角は、レーザビームと光軸ＡＸとがなす角である。Ｌ２は、第２の光学素子１４から像面Ｓまでの光学的な設計距離であって、第２の光学素子１４の頂点と像面Ｓとの間の光学距離である。像面Ｓにおけるレーザビームの強度分布は、ビーム径がＤ１、かつピーク強度がＰ１である強度分布Ｍ１となる。図４には、強度分布Ｍ１を表すグラフを示している。 When the laser beam having the intensity distribution M0 propagates between the first optical element 13 and the second optical element 14, the second optical element 14 emits a laser beam having a divergence angle of θ1. The divergence angle is the angle formed by the laser beam and the optical axis AX. L2 is an optical design distance from the second optical element 14 to the image plane S, and is an optical distance between the apex of the second optical element 14 and the image plane S. The intensity distribution of the laser beam on the image plane S is the intensity distribution M1 in which the beam diameter is D1 and the peak intensity is P1. FIG. 4 shows a graph showing the intensity distribution M1.
　図５は、実施の形態１にかかるレーザ加工機が照射するレーザビームのビームモードのうち第２のビームモードについて説明するための図である。第１の光学素子１３が光軸ＡＸから外れた位置に配置され、かつ第２の光学素子１４が光軸ＡＸ上に配置されているとき、コリメート光学系６から出射したレーザビームは、第１の光学素子１３の外を伝播して、第２の光学素子１４へ入射する。図５には、第２の光学素子１４へ入射するレーザビームの強度分布Ｍ０を表すグラフを示している。 FIG. 5 is a diagram for explaining a second beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the first embodiment. When the first optical element 13 is arranged at a position deviated from the optical axis AX and the second optical element 14 is arranged on the optical axis AX, the laser beam emitted from the collimating optical system 6 is the first. Propagates outside the optical element 13 of the above and enters the second optical element 14. FIG. 5 shows a graph showing the intensity distribution M0 of the laser beam incident on the second optical element 14.
　強度分布Ｍ０のレーザビームが第２の光学素子１４を伝播すると、第２の光学素子１４からは、発散角がθ２であるレーザビームが出射する。θ１＞θ２が成り立つ。像面Ｓにおけるレーザビームの強度分布は、ビーム径がＤ２、かつピーク強度がＰ２である強度分布Ｍ２となる。Ｄ１＞Ｄ２、かつＰ１＜Ｐ２が成り立つ。図５には、強度分布Ｍ２を表すグラフを示している。 When the laser beam having the intensity distribution M0 propagates through the second optical element 14, the laser beam having a divergence angle of θ2 is emitted from the second optical element 14. θ1> θ2 holds. The intensity distribution of the laser beam on the image plane S is an intensity distribution M2 in which the beam diameter is D2 and the peak intensity is P2. D1> D2 and P1 <P2 hold. FIG. 5 shows a graph showing the intensity distribution M2.
　図６は、実施の形態１にかかるレーザ加工機が照射するレーザビームのビームモードのうち第３のビームモードについて説明するための図である。第１の光学素子１３が光軸ＡＸ上に配置され、かつ第２の光学素子１４が光軸ＡＸから外れた位置に配置されているとき、コリメート光学系６から出射したレーザビームは、第１の光学素子１３へ入射する。図６には、第１の光学素子１３へ入射するレーザビームの強度分布Ｍ０を表すグラフを示している。第１の光学素子１３から出射したレーザビームは、第２の光学素子１４の外を伝播する。 FIG. 6 is a diagram for explaining a third beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the first embodiment. When the first optical element 13 is arranged on the optical axis AX and the second optical element 14 is arranged at a position deviated from the optical axis AX, the laser beam emitted from the collimating optical system 6 is the first. It is incident on the optical element 13 of the above. FIG. 6 shows a graph showing the intensity distribution M0 of the laser beam incident on the first optical element 13. The laser beam emitted from the first optical element 13 propagates outside the second optical element 14.
　強度分布Ｍ０のレーザビームが第１の光学素子１３を伝播すると、第１の光学素子１３からは、発散角がθ３であるレーザビームが出射する。θ１＞θ２＞θ３が成り立つ。Ｌ１は、第１の光学素子１３から像面Ｓまでの光学的な設計距離であって、第１の光学素子１３の頂点と像面Ｓとの間の光学距離である。像面Ｓにおけるレーザビームの強度分布は、ビーム径がＤ３、かつピーク強度がＰ３である強度分布Ｍ３となる。Ｄ１＞Ｄ２＞Ｄ３、かつＰ１＜Ｐ２＜Ｐ３が成り立つ。図６には、かかる位置におけるレーザビームの強度分布Ｍ３を表すグラフを示している。 When the laser beam having the intensity distribution M0 propagates through the first optical element 13, the laser beam having a divergence angle of θ3 is emitted from the first optical element 13. θ1> θ2> θ3 holds. L1 is an optical design distance from the first optical element 13 to the image plane S, and is an optical distance between the apex of the first optical element 13 and the image plane S. The intensity distribution of the laser beam on the image plane S is an intensity distribution M3 in which the beam diameter is D3 and the peak intensity is P3. D1> D2> D3 and P1 <P2 <P3 hold. FIG. 6 shows a graph showing the intensity distribution M3 of the laser beam at such a position.
　図７は、実施の形態１にかかるレーザ加工機が照射するレーザビームのビームモードのうち第４のビームモードについて説明するための図である。第１の光学素子１３と第２の光学素子１４とが光軸ＡＸから外れた位置に配置されているとき、コリメート光学系６から出射したレーザビームは、切替えユニット１２において第１の光学素子１３および第２の光学素子１４の外を伝播する。切替えユニット１２から出射したレーザビームは、ビーム径がＤ４、かつピーク強度がＰ４であるガウシアンビームである。Ｄ４≒Ｄ０、かつＰ４≒Ｐ０が成り立つ。図７には、切替えユニット１２から出射したレーザビームの強度分布Ｍ４を表すグラフを示している。 FIG. 7 is a diagram for explaining a fourth beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the first embodiment. When the first optical element 13 and the second optical element 14 are arranged at positions deviated from the optical axis AX, the laser beam emitted from the collimating optical system 6 is sent to the first optical element 13 in the switching unit 12. And propagate outside the second optical element 14. The laser beam emitted from the switching unit 12 is a Gaussian beam having a beam diameter of D4 and a peak intensity of P4. D4≈D0 and P4≈P0 hold. FIG. 7 shows a graph showing the intensity distribution M4 of the laser beam emitted from the switching unit 12.
　いずれのビームモードが選択された場合も、レーザ加工機１は、切替えユニット１２を伝播したレーザビームのビーム径をズーム光学系７によって調整する。また、レーザ加工機１は、ズーム光学系７でのビーム径の調整を経たレーザビームを集光光学系８によって適切に収束させて、被加工物２へ照射する。 Regardless of which beam mode is selected, the laser processing machine 1 adjusts the beam diameter of the laser beam propagating through the switching unit 12 by the zoom optical system 7. Further, the laser processing machine 1 appropriately converges the laser beam after adjusting the beam diameter in the zoom optical system 7 by the condensing optical system 8 and irradiates the workpiece 2.
　このように、レーザ加工機１は、第１の光学素子１３と第２の光学素子１４とが光軸ＡＸ上に配置された状態にて、第１のビームモードのレーザビームを照射する。第１のビームモードは、第１の光学素子１３と第２の光学素子１４との組み合わせに備わる光学特性に応じた第１の強度分布である。レーザ加工機１は、第１の光学素子１３が光軸ＡＸから外れた位置に配置され、かつ第２の光学素子１４が光軸ＡＸ上に配置された状態にて、第２のビームモードのレーザビームを照射する。第２のビームモードは、第２の光学素子１４に備わる光学特性に応じた第２の強度分布である。レーザ加工機１は、第１の光学素子１３が光軸ＡＸ上に配置され、かつ第２の光学素子１４が光軸ＡＸ上から外れた位置に配置された状態にて、第３のビームモードのレーザビームを照射する。第３のビームモードは、第１の光学素子１３に備わる光学特性に応じた第３の強度分布である。 In this way, the laser processing machine 1 irradiates the laser beam in the first beam mode with the first optical element 13 and the second optical element 14 arranged on the optical axis AX. The first beam mode is a first intensity distribution according to the optical characteristics provided in the combination of the first optical element 13 and the second optical element 14. The laser processing machine 1 is in a second beam mode in a state where the first optical element 13 is arranged at a position deviated from the optical axis AX and the second optical element 14 is arranged on the optical axis AX. Irradiate the laser beam. The second beam mode is a second intensity distribution according to the optical characteristics provided in the second optical element 14. The laser processing machine 1 has a third beam mode in a state where the first optical element 13 is arranged on the optical axis AX and the second optical element 14 is arranged at a position deviated from the optical axis AX. Irradiate the laser beam of. The third beam mode is a third intensity distribution according to the optical characteristics provided in the first optical element 13.
　レーザ加工機１が第１のビームモード、第２のビームモードまたは第３のビームモードのレーザビームを照射することによって、被加工物２においてリング状のスポットが形成される。第１のビームモード、第２のビームモードおよび第３のビームモードの各レーザビームは、厚い板金を切断する加工に適している。 When the laser machine 1 irradiates the laser beam of the first beam mode, the second beam mode, or the third beam mode, a ring-shaped spot is formed on the workpiece 2. The laser beams of the first beam mode, the second beam mode, and the third beam mode are suitable for cutting thick sheet metal.
　第１のビームモード、第２のビームモードおよび第３のビームモードの各々におけるビーム径、ピーク強度または発散角は、第１の光学素子１３または第２の光学素子１４へ入射するレーザビームのビーム径、第１の光学素子１３における円錐形の頂角、第２の光学素子１４における円錐形の頂角、第１の光学素子１３と像面Ｓとの間の光学距離、第２の光学素子１４と像面Ｓとの間の光学距離、第１の光学素子１３の屈折率、および第２の光学素子１４の屈折率などに対応して任意に設計可能である。また、第１のビームモード、第２のビームモードおよび第３のビームモードの各々におけるビーム径、ピーク強度または発散角は、被加工物２の材質、被加工物２の厚さ、レーザ発振器３の出力条件、加工速度、アシストガス、焦点位置、要求される加工品質といった各種条件の組み合わせによって任意に変更可能である。アシストガスの条件には、ガスの種類、またはガス圧といった条件が含まれる。 The beam diameter, peak intensity or divergence angle in each of the first beam mode, the second beam mode and the third beam mode is the beam of the laser beam incident on the first optical element 13 or the second optical element 14. Diameter, cone apex angle in first optical element 13, conical apex angle in second optical element 14, optical distance between first optical element 13 and image plane S, second optical element It can be arbitrarily designed according to the optical distance between the 14 and the image plane S, the refractive index of the first optical element 13, the refractive index of the second optical element 14, and the like. Further, the beam diameter, peak intensity or divergence angle in each of the first beam mode, the second beam mode and the third beam mode is the material of the workpiece 2, the thickness of the workpiece 2, and the laser oscillator 3. It can be arbitrarily changed by combining various conditions such as output conditions, processing speed, assist gas, focal position, and required processing quality. The conditions of the assist gas include conditions such as the type of gas or the gas pressure.
　切替えユニット１２が有する光学素子の数は２つに限られない。切替えユニット１２は各々を個別に移動可能な複数の光学素子を有していれば良く、光学素子の数は任意である。複数の光学素子の各々は、被加工物２において互いに異なる強度分布を得るための光学特性を備える。また、レーザ加工機１は、複数の光学素子の各々が互いに組み合わせられて使用されることによって、複数の光学素子の各々が単独で使用される場合における各強度分布とは異なる強度分布のレーザビームを照射する。複数の光学素子の各々は、円錐形レンズに限られない。複数の光学素子の各々は、円錐形レンズと同様の光学特性を備える非球面レンズであっても良い。 The number of optical elements included in the switching unit 12 is not limited to two. The switching unit 12 may have a plurality of optical elements that can be individually moved, and the number of optical elements is arbitrary. Each of the plurality of optical elements has optical characteristics for obtaining different intensity distributions in the workpiece 2. Further, in the laser processing machine 1, since each of the plurality of optical elements is used in combination with each other, the laser beam having an intensity distribution different from each intensity distribution when each of the plurality of optical elements is used alone. Irradiate. Each of the plurality of optical elements is not limited to the conical lens. Each of the plurality of optical elements may be an aspherical lens having the same optical characteristics as the conical lens.
　実施の形態１によると、切替えユニット１２は、複数の光学素子の各々を直線方向へ個別に移動させることによって、光軸ＡＸ上の位置と光軸ＡＸから外れた位置とへ複数の光学素子の各々を個別に移動させる。切替えユニット１２は、光軸ＡＸ上の位置と光軸ＡＸから外れた位置とへ複数の光学素子の各々を個別に移動させることによって、レーザビームのビームモードを切り替える。光軸方向における切替えユニット１２の長さは、光軸方向へ各光学素子を移動させる場合よりも短くすることができる。レーザ加工機１は、切替えユニット１２が小型であっても、複数の光学素子の各々を移動させることによってビーム径を大きく変化させることができる。レーザ加工機１は、切替えユニット１２と光学系とを含むシステムを小型にすることができる。 According to the first embodiment, the switching unit 12 moves each of the plurality of optical elements individually in the linear direction to move the plurality of optical elements to a position on the optical axis AX and a position deviated from the optical axis AX. Move each individually. The switching unit 12 switches the beam mode of the laser beam by individually moving each of the plurality of optical elements to a position on the optical axis AX and a position deviating from the optical axis AX. The length of the switching unit 12 in the optical axis direction can be shorter than that in the case of moving each optical element in the optical axis direction. In the laser processing machine 1, even if the switching unit 12 is small, the beam diameter can be greatly changed by moving each of the plurality of optical elements. The laser processing machine 1 can reduce the size of the system including the switching unit 12 and the optical system.
　レーザ加工機１は、切替えユニット１２と光学系とを含むシステムを小型にできることにより、かかるシステムに搭載される光学部品の清浄度を簡易な構造によって維持することができる。また、レーザ加工機１は、光学部品の清浄度を維持することによって、光学部品の長寿命化が可能となる。レーザ加工機１は、システムが大型である場合に比べて、光学部品同士の高精度な位置決めを簡易な制御によって行うことができる。また、レーザ加工機１は、システムが大型である場合に比べて、製造コストの低減が可能となる。 Since the system including the switching unit 12 and the optical system can be miniaturized in the laser processing machine 1, the cleanliness of the optical components mounted on the system can be maintained by a simple structure. Further, the laser processing machine 1 can extend the life of the optical component by maintaining the cleanliness of the optical component. The laser machine 1 can perform highly accurate positioning of optical components with simple control as compared with the case where the system is large. Further, the laser processing machine 1 can reduce the manufacturing cost as compared with the case where the system is large.
　以上により、実施の形態１にかかるレーザ加工機１は、小型な構成によってレーザビームの横断面における強度分布を切り替えることができるという効果を奏する。 As described above, the laser processing machine 1 according to the first embodiment has an effect that the intensity distribution in the cross section of the laser beam can be switched by a compact configuration.
実施の形態２．
　図８は、実施の形態２にかかるレーザ加工機のうち切替えユニットの構成を示す図である。実施の形態２にかかるレーザ加工機１が有する切替えユニット３０は、複数の光学素子の各々を回転させる移動機構を有する。実施の形態２では、上記の実施の形態１と同一の構成要素には同一の符号を付し、実施の形態１とは異なる構成について主に説明する。 Embodiment 2.
FIG. 8 is a diagram showing a configuration of a switching unit among the laser processing machines according to the second embodiment. The switching unit 30 included in the laser processing machine 1 according to the second embodiment has a moving mechanism for rotating each of the plurality of optical elements. In the second embodiment, the same components as those in the first embodiment are designated by the same reference numerals, and the configurations different from those in the first embodiment will be mainly described.
　切替えユニット３０は、レンズホルダ１７とともに第１の光学素子１３を回転させる回転部３１と、レンズホルダ１８とともに第２の光学素子１４を回転させる回転部３２とを有する。回転部３１と回転部３２とは、光軸ＡＸ上の位置と光軸ＡＸから外れた位置とへ第１の光学素子１３と第２の光学素子１４との各々を個別に移動させる移動機構を構成する。 The switching unit 30 has a rotating unit 31 that rotates the first optical element 13 together with the lens holder 17, and a rotating unit 32 that rotates the second optical element 14 together with the lens holder 18. The rotating unit 31 and the rotating unit 32 have a moving mechanism for individually moving each of the first optical element 13 and the second optical element 14 to a position on the optical axis AX and a position deviated from the optical axis AX. Constitute.
　回転部３１は、レンズホルダ１７の端部に取り付けられている。第１の光学素子１３が光軸ＡＸ上の第１の位置に配置されている状態において、回転部３１が回転軸３３を中心に９０度回転することによって、第１の光学素子１３は、第１の位置から、光軸ＡＸから外れた第２の位置へ移動する。第１の光学素子１３が第２の位置に配置されている状態において、第１の位置から第２の位置への移動のときとは逆の方向へ回転部３１が９０度回転することによって、第１の光学素子１３は、第２の位置から第１の位置へ移動する。回転部３１は、第１の位置と第２の位置との間において第１の光学素子１３を回転させる。 The rotating portion 31 is attached to the end of the lens holder 17. In a state where the first optical element 13 is arranged at the first position on the optical axis AX, the rotating portion 31 rotates 90 degrees around the rotating shaft 33, so that the first optical element 13 becomes a first. It moves from the position of 1 to the second position off the optical axis AX. In the state where the first optical element 13 is arranged at the second position, the rotating portion 31 rotates 90 degrees in the direction opposite to the movement from the first position to the second position, whereby The first optical element 13 moves from the second position to the first position. The rotating unit 31 rotates the first optical element 13 between the first position and the second position.
　回転部３２は、レンズホルダ１８の端部に取り付けられている。第２の光学素子１４が光軸ＡＸ上の第３の位置に配置されている状態において、回転部３２が回転軸３４を中心に９０度回転することによって、第２の光学素子１４は、第３の位置から、光軸ＡＸから外れた第４の位置へ移動する。第２の光学素子１４が第４の位置に配置されている状態において、第３の位置から第４の位置への移動のときとは逆の方向へ回転部３２が９０度回転することによって、第２の光学素子１４は、第４の位置から第３の位置へ移動する。回転部３２は、第３の位置と第４の位置との間において第２の光学素子１４を回転させる。図８には、第１の光学素子１３が第１の位置に配置され、かつ第２の光学素子１４が第３の位置に配置されているときの様子と、第１の光学素子１３が第２の位置に配置され、かつ第２の光学素子１４が第４の位置に配置されているときの様子とを示している。 The rotating portion 32 is attached to the end of the lens holder 18. In a state where the second optical element 14 is arranged at the third position on the optical axis AX, the rotating portion 32 rotates 90 degrees around the rotating shaft 34, so that the second optical element 14 is seconded. It moves from the third position to the fourth position off the optical axis AX. In the state where the second optical element 14 is arranged at the fourth position, the rotating portion 32 rotates 90 degrees in the direction opposite to the movement from the third position to the fourth position, whereby The second optical element 14 moves from the fourth position to the third position. The rotating unit 32 rotates the second optical element 14 between the third position and the fourth position. FIG. 8 shows a state in which the first optical element 13 is arranged at the first position and the second optical element 14 is arranged at the third position, and the first optical element 13 is the first. It shows a state when the second optical element 14 is arranged at the second position and the second optical element 14 is arranged at the fourth position.
　各回転部３１，３２は、例えばモータである。各回転部３１，３２は、回転可能な機構であれば良く、モータ以外の機構であっても良い。 Each of the rotating parts 31 and 32 is, for example, a motor. Each of the rotating portions 31 and 32 may be a mechanism other than the motor as long as it is a rotatable mechanism.
　次に、レーザ加工機１によるビームモードの切り替えについて説明する。切替えユニット３０は、切替え指令にしたがって第１の光学素子１３と第２の光学素子１４とを個別に移動させることによって、結像位置におけるビームモードを４つのビームモードにおいて切り替える。実施の形態１と同様に、レーザ加工機１は、４つのビームモードの中から選択されたビームモードのレーザビームを照射する。 Next, switching of the beam mode by the laser processing machine 1 will be described. The switching unit 30 switches the beam mode at the imaging position between the four beam modes by individually moving the first optical element 13 and the second optical element 14 according to the switching command. Similar to the first embodiment, the laser processing machine 1 irradiates the laser beam of the beam mode selected from the four beam modes.
　レーザ加工機１が第１のビームモードのレーザビームを照射する場合、第１の光学素子１３と第２の光学素子１４とは、図４に示す場合と同様に、光軸ＡＸ上に配置される。図４に示すように、像面Ｓにおけるレーザビームの強度分布は、ビーム径がＤ１、かつピーク強度がＰ１である強度分布Ｍ１となる。 When the laser processing machine 1 irradiates the laser beam in the first beam mode, the first optical element 13 and the second optical element 14 are arranged on the optical axis AX as in the case shown in FIG. NS. As shown in FIG. 4, the intensity distribution of the laser beam on the image plane S is the intensity distribution M1 in which the beam diameter is D1 and the peak intensity is P1.
　図９は、実施の形態２にかかるレーザ加工機が照射するレーザビームのビームモードのうち第２のビームモードについて説明するための図である。図９に示すように、第１の光学素子１３は光軸ＡＸから外れた位置に配置され、かつ第２の光学素子１４は光軸ＡＸ上に配置される。図５に示す場合と同様に、像面Ｓにおけるレーザビームの強度分布は、ビーム径がＤ２、かつピーク強度がＰ２である強度分布Ｍ２となる。 FIG. 9 is a diagram for explaining a second beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the second embodiment. As shown in FIG. 9, the first optical element 13 is arranged at a position deviated from the optical axis AX, and the second optical element 14 is arranged on the optical axis AX. Similar to the case shown in FIG. 5, the intensity distribution of the laser beam on the image plane S is the intensity distribution M2 in which the beam diameter is D2 and the peak intensity is P2.
　図１０は、実施の形態２にかかるレーザ加工機が照射するレーザビームのビームモードのうち第３のビームモードについて説明するための図である。図１０に示すように、第１の光学素子１３は光軸ＡＸ上に配置され、かつ第２の光学素子１４は光軸ＡＸから外れた位置に配置される。図６に示す場合と同様に、像面Ｓにおけるレーザビームの強度分布は、ビーム径がＤ３、かつピーク強度がＰ３である強度分布Ｍ３となる。 FIG. 10 is a diagram for explaining a third beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the second embodiment. As shown in FIG. 10, the first optical element 13 is arranged on the optical axis AX, and the second optical element 14 is arranged at a position deviated from the optical axis AX. Similar to the case shown in FIG. 6, the intensity distribution of the laser beam on the image plane S is the intensity distribution M3 in which the beam diameter is D3 and the peak intensity is P3.
　図１１は、実施の形態２にかかるレーザ加工機が照射するレーザビームのビームモードのうち第４のビームモードについて説明するための図である。図１１に示すように、第１の光学素子１３と第２の光学素子１４とは、光軸ＡＸから外れた位置に配置される。切替えユニット３０から出射したレーザビームは、図７に示す場合と同様に、ビーム径がＤ４、かつピーク強度がＰ４であるガウシアンビームである。 FIG. 11 is a diagram for explaining a fourth beam mode among the beam modes of the laser beam irradiated by the laser processing machine according to the second embodiment. As shown in FIG. 11, the first optical element 13 and the second optical element 14 are arranged at positions deviated from the optical axis AX. The laser beam emitted from the switching unit 30 is a Gaussian beam having a beam diameter of D4 and a peak intensity of P4, as in the case shown in FIG. 7.
　切替えユニット３０が有する光学素子の数は２つに限られない。実施の形態１の切替えユニット１２と同様に、切替えユニット３０は各々を個別に移動可能な複数の光学素子を有していれば良く、光学素子の数は任意である。 The number of optical elements included in the switching unit 30 is not limited to two. Similar to the switching unit 12 of the first embodiment, the switching unit 30 may have a plurality of optical elements that can be individually moved, and the number of optical elements is arbitrary.
　実施の形態２によると、切替えユニット３０は、複数の光学素子の各々を個別に回転させることによって、光軸ＡＸ上の位置と光軸ＡＸから外れた位置とへ複数の光学素子の各々を個別に移動させる。切替えユニット３０は、光軸ＡＸ上と光軸ＡＸから外れた位置とへ複数の光学素子の各々を個別に移動させることによって、レーザビームのビームモードを切り替える。実施の形態１と同様に、レーザ加工機１は、切替えユニット３０と光学系とを含むシステムを小型にすることができる。以上により、実施の形態２にかかるレーザ加工機１は、小型な構成によってレーザビームの横断面における強度分布を切り替えることができるという効果を奏する。 According to the second embodiment, the switching unit 30 individually rotates each of the plurality of optical elements so that each of the plurality of optical elements is individually moved to a position on the optical axis AX and a position deviated from the optical axis AX. Move to. The switching unit 30 switches the beam mode of the laser beam by individually moving each of the plurality of optical elements to a position on the optical axis AX and a position deviated from the optical axis AX. Similar to the first embodiment, the laser processing machine 1 can reduce the size of the system including the switching unit 30 and the optical system. As described above, the laser processing machine 1 according to the second embodiment has an effect that the intensity distribution in the cross section of the laser beam can be switched by a compact configuration.
実施の形態３．
　図１２は、実施の形態３にかかるレーザ加工機のうち切替えユニットの構成を示す図である。実施の形態３では、複数の光学素子の各々の形状が、実施の形態１または２における複数の光学素子の各々の形状とは異なる。実施の形態３では、上記の実施の形態１または２と同一の構成要素には同一の符号を付し、実施の形態１または２とは異なる構成について主に説明する。 Embodiment 3.
FIG. 12 is a diagram showing a configuration of a switching unit among the laser processing machines according to the third embodiment. In the third embodiment, the shape of each of the plurality of optical elements is different from the shape of each of the plurality of optical elements in the first or second embodiment. In the third embodiment, the same components as those in the first or second embodiment are designated by the same reference numerals, and the configurations different from those in the first or second embodiment will be mainly described.
　実施の形態３にかかるレーザ加工機１の切替えユニット４０は、複数の光学素子である第１の光学素子４１と第２の光学素子４２とを有する。第１の光学素子４１と第２の光学素子４２との各々は、円錐形の頂部が丸められた形状の凸面を有する非球面レンズである。頂部は、円錐形のうち頂点を含む部分である。第１の光学素子４１は、円錐形の頂部が丸められたような形状の先端部４３を有する。第２の光学素子４２は、円錐形の頂部が丸められたような形状の先端部４４を有する。第１の光学素子４１の先端部４３と第２の光学素子４２の先端部４４とは、互いに向かい合わせられている。 The switching unit 40 of the laser processing machine 1 according to the third embodiment has a first optical element 41 and a second optical element 42, which are a plurality of optical elements. Each of the first optical element 41 and the second optical element 42 is an aspherical lens having a convex surface having a conical shape with a rounded top. The top is the part of the cone that contains the vertices. The first optical element 41 has a tip portion 43 having a conical shape with a rounded top. The second optical element 42 has a tip portion 44 shaped like a conical top with a rounded top. The tip 43 of the first optical element 41 and the tip 44 of the second optical element 42 face each other.
　第１の光学素子４１は、図３または図８に示す第１の光学素子１３と同様に、レンズホルダ１７に取り付けられている。第２の光学素子４２は、図３または図８に示す第２の光学素子１４と同様に、レンズホルダ１８に取り付けられている。切替えユニット４０は、光軸ＡＸ上の位置と光軸ＡＸから外れた位置とへ第１の光学素子４１と第２の光学素子４２との各々を個別に移動させる移動機構を有する。移動機構は、図３に示すスライド部１９，２０、または図８に示す回転部３１，３２である。図１２では、レンズホルダ１７，１８と移動機構の図示を省略する。 The first optical element 41 is attached to the lens holder 17 in the same manner as the first optical element 13 shown in FIG. 3 or FIG. The second optical element 42 is attached to the lens holder 18 in the same manner as the second optical element 14 shown in FIG. 3 or FIG. The switching unit 40 has a moving mechanism for individually moving each of the first optical element 41 and the second optical element 42 to a position on the optical axis AX and a position deviated from the optical axis AX. The moving mechanism is the slide portions 19 and 20 shown in FIG. 3 or the rotating portions 31 and 32 shown in FIG. In FIG. 12, the lens holders 17 and 18 and the moving mechanism are not shown.
　第１の光学素子４１と第２の光学素子４２とは、被加工物２において互いに異なる強度分布を得るための光学特性を備える。レーザ加工機１は、第１の光学素子４１と第２の光学素子４２とが互いに組み合わせられて使用されることによって、第１の光学素子４１と第２の光学素子４２との各々が単独で使用される場合における各強度分布とは異なる強度分布のレーザビームを照射する。 The first optical element 41 and the second optical element 42 have optical characteristics for obtaining different intensity distributions in the workpiece 2. In the laser processing machine 1, the first optical element 41 and the second optical element 42 are used in combination with each other, so that each of the first optical element 41 and the second optical element 42 can be used independently. It irradiates a laser beam with an intensity distribution different from each intensity distribution when used.
　切替えユニット４０が有する光学素子の数は２つに限られない。実施の形態１または２の切替えユニット１２，３０と同様に、切替えユニット４０は各々を個別に移動可能な複数の光学素子を有していれば良く、光学素子の数は任意である。複数の光学素子の各々は、円錐形の頂部が丸められた形状の凸面を有する。 The number of optical elements included in the switching unit 40 is not limited to two. Similar to the switching units 12 and 30 of the first or second embodiment, the switching unit 40 may have a plurality of optical elements that can be individually moved, and the number of optical elements is arbitrary. Each of the plurality of optics has a convex surface having a conical shape with a rounded top.
　実施の形態３によると、切替えユニット４０は、複数の光学素子の各々が、円錐形の頂部が丸められた形状の凸面を有する。複数の光学素子の各々が円錐形であって各円錐形の頂点を光軸ＡＸ上に合わせる場合に比べて、切替えユニット４０は、複数の光学素子の各々の位置精度を緩和できる。これにより、レーザ加工機１は、複数の光学素子の各々の位置精度を高めなくても、レーザビームの安定した照射が可能となる。 According to the third embodiment, in the switching unit 40, each of the plurality of optical elements has a convex surface having a conical shape with a rounded top. Compared with the case where each of the plurality of optical elements is conical and the vertices of each conical shape are aligned on the optical axis AX, the switching unit 40 can relax the position accuracy of each of the plurality of optical elements. As a result, the laser processing machine 1 can stably irradiate the laser beam without improving the position accuracy of each of the plurality of optical elements.
　以上の実施の形態に示した構成は、本開示の内容の一例を示すものである。各実施の形態の構成は、別の公知の技術と組み合わせることが可能である。各実施の形態の構成同士が適宜組み合わせられても良い。本開示の要旨を逸脱しない範囲で、各実施の形態の構成の一部を省略、変更することが可能である。 The configuration shown in the above embodiments is an example of the contents of the present disclosure. The configurations of each embodiment can be combined with other known techniques. The configurations of the respective embodiments may be combined as appropriate. It is possible to omit or change a part of the configuration of each embodiment without departing from the gist of the present disclosure.
　１　レーザ加工機、２　被加工物、３　レーザ発振器、４　加工ヘッド、５　伝送ケーブル、６　コリメート光学系、７　ズーム光学系、８　集光光学系、９　レンズ、１０　加工テーブル、１１　制御装置、１２，３０，４０　切替えユニット、１３，４１　第１の光学素子、１４，４２　第２の光学素子、１５　円錐面、１６　平面、１７，１８　レンズホルダ、１９，２０　スライド部、３１，３２　回転部、３３，３４　回転軸、４３，４４　先端部、ＡＸ　光軸。 1 laser processing machine, 2 work piece, 3 laser oscillator, 4 processing head, 5 transmission cable, 6 collimating optical system, 7 zoom optical system, 8 condensing optical system, 9 lens, 10 processing table, 11 control device, 12 , 30, 40 switching unit, 13, 41 first optical element, 14, 42 second optical element, 15 conical surface, 16 flat surface, 17, 18 lens holder, 19, 20 slide part, 31, 32 rotating part, 33,34 rotation axis, 43,44 tip, AX optical axis.

Claims (8)

  1. 　レーザビームを照射することによって被加工物を加工するレーザ加工機であって、
    　前記レーザビームを出射する光源と、
    　前記レーザビームの横断面における強度分布を切り替える切替えユニットと、を備え、
    　前記切替えユニットは、
    　複数の光学素子と、
    　前記レーザビームの光軸上の位置と前記光軸から外れた位置とへ前記複数の光学素子の各々を個別に移動させる移動機構と、を有することを特徴とするレーザ加工機。     A laser processing machine that processes a workpiece by irradiating it with a laser beam.
    A light source that emits the laser beam and
    A switching unit for switching the intensity distribution in the cross section of the laser beam is provided.
    The switching unit is
    With multiple optics
    A laser processing machine comprising: a moving mechanism for individually moving each of the plurality of optical elements to a position on the optical axis of the laser beam and a position deviating from the optical axis.
  2. 　前記複数の光学素子の各々は、前記被加工物において互いに異なる強度分布を得るための光学特性を備えることを特徴とする請求項１に記載のレーザ加工機。 The laser processing machine according to claim 1, wherein each of the plurality of optical elements has optical characteristics for obtaining different intensity distributions in the workpiece.
  3. 　前記複数の光学素子の各々が互いに組み合わせられて使用されることによって、前記複数の光学素子の各々が単独で使用される場合における各強度分布とは異なる強度分布の前記レーザビームを照射することを特徴とする請求項２に記載のレーザ加工機。 By using each of the plurality of optical elements in combination with each other, it is possible to irradiate the laser beam having an intensity distribution different from that of each intensity distribution when each of the plurality of optical elements is used alone. The laser processing machine according to claim 2, wherein the laser processing machine is characterized.
  4. 　前記複数の光学素子である第１の光学素子と第２の光学素子とが前記光軸上に配置された状態にて、前記第１の光学素子と前記第２の光学素子との組み合わせに備わる光学特性に応じた第１の強度分布の前記レーザビームを照射し、
    　前記第１の光学素子が前記光軸から外れた位置に配置され、かつ前記第２の光学素子が前記光軸上に配置された状態にて、前記第２の光学素子に備わる光学特性に応じた第２の強度分布の前記レーザビームを照射し、
    　前記第１の光学素子が前記光軸上に配置され、かつ前記第２の光学素子が前記光軸から外れた位置に配置された状態にて、前記第１の光学素子に備わる光学特性に応じた第３の強度分布の前記レーザビームを照射することを特徴とする請求項１に記載のレーザ加工機。     A combination of the first optical element and the second optical element is provided in a state where the first optical element and the second optical element, which are the plurality of optical elements, are arranged on the optical axis. Irradiate the laser beam with the first intensity distribution according to the optical characteristics,
    In a state where the first optical element is arranged at a position deviated from the optical axis and the second optical element is arranged on the optical axis, depending on the optical characteristics provided in the second optical element. Irradiate the laser beam with the second intensity distribution,
    In a state where the first optical element is arranged on the optical axis and the second optical element is arranged at a position deviated from the optical axis, depending on the optical characteristics provided in the first optical element. The laser processing machine according to claim 1, further comprising irradiating the laser beam having a third intensity distribution.
  5. 　前記移動機構は、前記光軸上の位置と前記光軸から外れた位置との間において前記複数の光学素子の各々を直線方向へ移動させることを特徴とする請求項１から４のいずれか１つに記載のレーザ加工機。 Any one of claims 1 to 4, wherein the moving mechanism moves each of the plurality of optical elements in a linear direction between a position on the optical axis and a position deviated from the optical axis. The laser processing machine described in 1.
  6. 　前記移動機構は、前記光軸上の位置と前記光軸から外れた位置との間において前記複数の光学素子の各々を回転させることを特徴とする請求項１から４のいずれか１つに記載のレーザ加工機。 The moving mechanism according to any one of claims 1 to 4, wherein each of the plurality of optical elements is rotated between a position on the optical axis and a position deviated from the optical axis. Laser processing machine.
  7. 　前記複数の光学素子の各々は、円錐形の凸面を有する円錐形レンズであることを特徴とする請求項１から６のいずれか１つに記載のレーザ加工機。 The laser processing machine according to any one of claims 1 to 6, wherein each of the plurality of optical elements is a conical lens having a conical convex surface.
  8. 　前記複数の光学素子の各々は、円錐形の頂部が丸められた形状の凸面を有するレンズであることを特徴とする請求項１から６のいずれか１つに記載のレーザ加工機。 The laser processing machine according to any one of claims 1 to 6, wherein each of the plurality of optical elements is a lens having a convex surface having a conical shape with a rounded top.
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