WO2021147676A1 - 电子组件及电子设备 - Google Patents

电子组件及电子设备 Download PDF

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Publication number
WO2021147676A1
WO2021147676A1 PCT/CN2021/070490 CN2021070490W WO2021147676A1 WO 2021147676 A1 WO2021147676 A1 WO 2021147676A1 CN 2021070490 W CN2021070490 W CN 2021070490W WO 2021147676 A1 WO2021147676 A1 WO 2021147676A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
reinforcement
board
frame
Prior art date
Application number
PCT/CN2021/070490
Other languages
English (en)
French (fr)
Inventor
郭健强
王晓岩
罗文君
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021147676A1 publication Critical patent/WO2021147676A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • This application relates to the field of electronic technology, in particular to an electronic component and an electronic device.
  • Electronic products such as mobile phones, tablet computers, notebook computers, smart wearable devices, etc.
  • electronic products have become indispensable tools in people's daily lives.
  • electronic products are equipped with electronic components such as display modules, camera modules, sound cavity components, batteries, antennas and other electronic components through printed circuit board assembly (PCBA) single boards.
  • PCBA printed circuit board assembly
  • the sandwich printed circuit board is assembled with a single board, including a main board 11 and a daughter board 12 connected by a frame board (FB) 13.
  • the solder joints 14 located between the frame board 13 and the main board 11 and between the frame board 13 and the sub-board 12 have low standoffs and the distance between the solder joints 14 and the center of the single board (distance- The to-neutral point (DNP) is large and is composed of relatively low-strength low-temperature solder, which results in low mechanical reliability of the solder joint 14 and easily breaks when subjected to an external force, which may lead to product damage.
  • DNP to-neutral point
  • the embodiments of the present application provide an electronic component and an electronic device, which are used to solve the problem of how to enhance the reliability of the connection between the frame board and the printed circuit board.
  • an electronic component including: a frame board having a first side; a first printed circuit board located on the first side of the frame board and connected to the frame board; at least one first reinforcing member; The reinforcing member is located on the side surface of the frame board and is arranged close to the first printed circuit board; the first reinforcing member is connected with the frame board and the first printed circuit board; wherein, the side surface of the frame board intersects the first printed circuit board.
  • the first reinforcing member connected with the frame board and the first printed circuit board is added, and the thickness of the first reinforcing member is made smaller than the thickness of the frame board.
  • both the first reinforcement member and the frame plate play a role of supporting the first printed circuit board. Therefore, it is equivalent to the first reinforcement to share the mechanical drop stress of the frame board and the first printed circuit board (according to the simulation of the stress analysis software, the stress between the frame board and the first printed circuit board can be reduced when the mechanical falls 64%), thereby improving the supporting effect of the frame board on the first printed circuit board. And, because the thickness of the first reinforcement is smaller than the thickness of the frame plate. Therefore, the second electronic device can be arranged in the gap between the first reinforcing member and the second printed circuit board, without affecting the wiring efficiency and space of the second printed circuit board. Therefore, while increasing the supporting effect of the frame board and the first printed circuit board, the integration degree of each device in the electronic assembly can be improved, and the miniaturization of the electronic assembly can be realized.
  • At least part of the at least one first reinforcement member wraps around the outline of the frame plate.
  • the structure is simple and the supporting surface is wide.
  • At least part of the at least one first reinforcement member is a block structure, and each first reinforcement member is connected to at least one side surface of the frame plate.
  • the structure is highly variable, and the structure of the first reinforcing member can be adjusted according to the arrangement of the components in the electronic assembly.
  • the shape of the frame plate is a plate-like structure.
  • the frame board has an opening that penetrates the frame board in a direction perpendicular to the first printed circuit board.
  • a first reinforcement member is arranged in the opening, and the first reinforcement member is connected to multiple sides of the frame plate to divide the opening into multiple regions.
  • the structure is flexible and can support the first printed circuit board to the greatest extent.
  • At least part of the at least one first reinforcement is located in the opening. While improving the supporting effect of the frame board on the first printed circuit board, there is no need to expand the outer contour of the frame board, so as to improve the integration degree of the electronic components.
  • At least part of the at least one first reinforcement includes a plurality of stacked reinforcement parts; adjacent reinforcement parts are connected, and along a direction away from the first printed circuit board, the cross-sectional area of the reinforcement part gradually Reduce; at least part of the plurality of reinforcing parts is connected to the frame board, and the reinforcing part closest to the first printed circuit board is connected to the first printed circuit board.
  • the reliability of the board connection is to achieve the purpose of improving the reliability and stability of the connection between the frame board and the first printed circuit board.
  • At least part of the at least one first reinforcement includes overlapping multi-layer reinforcements; the overlapping reinforcements are connected to each other, and each layer of reinforcement is connected to the first printed circuit board.
  • the second printed circuit board faces the first printed circuit board side, electronic devices such as resistors and power management units need to be provided.
  • the unevenness of the second printed circuit board can be avoided.
  • the connection area between the first reinforcement member and the first printed circuit board is enhanced.
  • the first reinforcement member and the frame plate are an integral structure.
  • the structure is simple and easy to prepare.
  • the thickness of the first reinforcement member in a direction perpendicular to the first printed circuit board is 0.2-0.5 mm; the width of the first reinforcement member is 0.2-2.0 mm.
  • the thickness of the first reinforcement member in the first direction perpendicular to the first printed circuit board is too large, and the space occupied by the first reinforcement member is too large, which affects the arrangement of other devices in the electronic assembly.
  • the thickness of the first reinforcing member is too small, and the stability of the connection between the first reinforcing member and the first printed circuit board is poor.
  • the thickness of the reinforcing part in a direction perpendicular to the first printed circuit board is 0.2-0.5 mm.
  • the thickness of the first reinforcement member in the first direction perpendicular to the first printed circuit board is too large, and the space occupied by the first reinforcement member is too large, which affects the arrangement of other devices in the electronic assembly.
  • the thickness of the first reinforcement is too small to achieve the supporting effect.
  • the first reinforcing member is welded to the first printed circuit board, the distance between adjacent solder joints is 0.4mm-0.8mm, and the width of the solder joints is 0.3mm-0.6mm. If the pitch of the solder joints is too small or too large, the soldering effect will be poor.
  • the frame board further has a second side opposite to the first side;
  • the electronic component further includes a second printed circuit board and a second reinforcement;
  • the second printed circuit board is located on the second side of the frame board and is connected to the The frame board is connected;
  • the second reinforcement member is located on the side of the frame board and is arranged close to the second printed circuit board;
  • the second reinforcement member is connected to both the frame board and the second printed circuit board.
  • an electronic device including the electronic component of any one of the first aspects.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of an electronic component provided by the related art
  • FIG. 2 is a schematic structural diagram of an electronic device provided by an embodiment of this application.
  • 3a is a schematic cross-sectional structure diagram of an electronic component provided by an embodiment of the application.
  • Fig. 3b is a schematic structural diagram of a frame plate provided by an embodiment of the application.
  • Fig. 3c is a schematic structural diagram of another frame plate provided by an embodiment of the application.
  • 3d is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • FIG. 4 is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • Figure 5a is a structural relationship diagram between a frame plate and a first reinforcement provided by an embodiment of the application
  • FIG. 5b is a structural relationship diagram of another frame plate and a first reinforcement member provided by an embodiment of the application.
  • 5c is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • FIG. 5d is a schematic top view of an electronic component provided by an embodiment of the application.
  • Figure 5e is a cross-sectional view taken along the line A1-A2 in Figure 5d;
  • 5f is a schematic top view of another electronic component provided by an embodiment of the application.
  • FIG. 6a is a schematic top view of yet another electronic component provided by an embodiment of the application.
  • FIG. 6b is a schematic top view of another electronic component provided by an embodiment of this application.
  • FIG. 7a is a schematic top view of yet another electronic component provided by an embodiment of the application.
  • FIG. 7b is a schematic top view of yet another electronic component provided by an embodiment of the application.
  • FIG. 8 is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • FIG. 9 is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • 10a is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • 10b is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • 10c is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • FIG. 11 is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • FIG. 12a is a structural relationship diagram of yet another frame plate and a first reinforcement member provided by an embodiment of the application.
  • FIG. 12b is a structural relationship diagram between another frame plate and the first reinforcement member according to an embodiment of the application.
  • FIG. 12c is a structural relationship diagram between another frame plate and the first reinforcement member provided by an embodiment of the application.
  • FIG. 12d is a structural relationship diagram of yet another frame plate and the first reinforcement member provided by an embodiment of the application.
  • Fig. 13a is a structural relationship diagram of yet another frame plate and a first reinforcement member provided by an embodiment of the application;
  • FIG. 13b is a structural relationship diagram of yet another frame plate and the first reinforcement member provided by an embodiment of the application.
  • FIG. 13c is a structural relationship diagram between another frame plate and the first reinforcement member provided by an embodiment of the application.
  • FIG. 13d is a structural relationship diagram of yet another frame plate and the first reinforcement member provided by an embodiment of the application.
  • Fig. 14a is a structural relationship diagram of yet another frame plate and a first reinforcing member provided by an embodiment of the application;
  • FIG. 14b is a structural relationship diagram of yet another frame plate and the first reinforcement member provided by an embodiment of the application.
  • FIG. 14c is a cross-sectional view along the B1-B2 direction in FIG. 14b according to an embodiment of the application;
  • FIG. 14d is another cross-sectional view along the B1-B2 direction in FIG. 14b according to an embodiment of the application;
  • Fig. 14e is a structural relationship diagram of yet another frame plate and the first reinforcing member provided by an embodiment of the application;
  • FIG. 15 is a schematic cross-sectional structure diagram of another electronic component provided by an embodiment of the application.
  • 1-electronic equipment 2-display module; 3-middle frame; 4-shell; 5-cover board; 11-main board; 12-daughter board; 13-frame board; 14-soldering point; 100-electronic component; 10-first printed circuit board; 20-first reinforcement; 21-reinforcement part; 30-second printed circuit board; 41-first electronic device; 42-second electronic device; 50-second reinforcement .
  • connection should be understood in a broad sense.
  • “connected” can be a fixed connection, a detachable connection, or a whole; it can be a direct connection, or Can be indirectly connected through an intermediary.
  • the embodiment of the application provides an electronic device, which can be a terminal device with a display interface such as a mobile phone, a TV, a monitor, a tablet computer, a car computer, etc., or a smart display wearable device such as a smart watch, a smart bracelet, or Communication equipment such as servers, storages, base stations, or smart cars, etc.
  • a terminal device with a display interface such as a mobile phone, a TV, a monitor, a tablet computer, a car computer, etc.
  • a smart display wearable device such as a smart watch, a smart bracelet, or Communication equipment such as servers, storages, base stations, or smart cars, etc.
  • the electronic device 1 mainly includes a display module 2, a middle frame 3, a casing (also called a battery cover, a rear casing) 4 and a cover 5.
  • the display module 2 has a light-emitting side that allows people to see the display screen and a back surface opposite to the above-mentioned light-emitting side.
  • the back of the display module 2 is close to the middle frame 3, and the cover plate 5 is provided on the light-emitting side of the display module 2.
  • the above-mentioned display module 2 includes a display panel (DP).
  • the display module 2 is a liquid crystal display module.
  • the above-mentioned display screen is a liquid crystal display (LCD).
  • the display module 2 also includes a backlight unit (BLU) located on the back of the liquid crystal display screen (away from the side surface of the LCD for displaying images).
  • BLU backlight unit
  • the backlight module can provide a light source to the liquid crystal display, so that each sub-pixel in the liquid crystal display can emit light to realize image display.
  • the display module 2 is an organic light emitting diode display module.
  • the above-mentioned display screen is an organic light emitting diode (OLED) display screen. Since each sub-pixel in the OLED display screen is provided with an electroluminescent layer, the OLED display screen can realize self-luminescence after receiving the working voltage. In this case, the above-mentioned backlight module does not need to be provided in the display module 2 with the OLED display screen.
  • the cover plate 5 is located on the side of the display module 2 away from the middle frame 3, and the cover plate 5 may be, for example, cover glass (CG), which may have a certain degree of toughness.
  • CG cover glass
  • the middle frame 3 is located between the display module 2 and the housing 4, and the surface of the middle frame 3 away from the display module 2 is used for arranging the electronic component 100. After the housing 4 and the middle frame 3 are closed, the above-mentioned electronic component 100 is located between the housing 4 and the middle frame 3.
  • the above-mentioned electronic component 100 may be, for example, a wireless access point (AP) integrated on a printed circuit board assembly (PCBA) single board, and double-rate synchronous dynamic random access memory (double data rate).
  • AP wireless access point
  • PCBA printed circuit board assembly
  • double data rate double data rate
  • DDR digital data rate
  • UFS unix filing system, UNIX file system
  • RF PA radio frequency power amplifier
  • RFIC radio frequency integrated circuit chip
  • power management unit power management unit
  • WIFI wireless local area network
  • charger charger
  • an embodiment of the present application provides an electronic component 100, which aims to improve the stability of the electronic component 100.
  • the electronic assembly 100 includes a frame board (FB) 13, a first printed circuit board (PCB) 10, and at least one first reinforcement 20.
  • FB frame board
  • PCB printed circuit board
  • the frame board 13 has a first side A and a second side B opposite to the first side A, wherein the frame board 13 may be a PCB, for example.
  • the first printed circuit board 10 is located on the first side A of the frame board 13, and the frame board 13 has a side surface a that intersects the first printed circuit board 10.
  • the shape of the frame plate 13 is a plate-like structure.
  • FIG. 3b takes the frame board 13 as a rectangular board as an example for illustration.
  • the multiple surfaces constituting the outer contour of the frame plate 13 are all side faces a of the frame plate 13.
  • the shape of the frame plate 13 is a plate-like structure, and the frame plate 13 has a first direction X perpendicular to the first printed circuit board that penetrates the frame plate 13 Opening 131.
  • the shape of the opening 131 is not limited, and the orthographic projection of the opening 131 on the first printed circuit board 10 can be a closed figure of any shape.
  • FIG. 3c uses the rectangular shape of the opening 131 as an example.
  • the multiple surfaces constituting the outer contour of the frame plate 13 are side surfaces a of the frame plate 13, and each surface constituting the contour of the opening 131 is also the side surface a of the frame plate 13.
  • the first printed circuit board 10 and the frame board 13 are electrically connected.
  • the manner in which the first printed circuit board 10 and the frame board 13 are connected is not limited.
  • ball grid array (BGA) or wafer level chip scale packaging (WLCSP) technology can be used to weld the first printed circuit board 10 and the frame board 13.
  • WLCSP wafer level chip scale packaging
  • the electronic component 100 includes a first reinforcement member 20.
  • the electronic assembly 100 includes a plurality of first reinforcing members 20.
  • each first reinforcement 20 is located on the side a of the frame plate 13, and each first reinforcement 20 is close to the first print. ⁇ circuit board 10 is set.
  • the first reinforcement member 20 may be provided on the side where any one of the side surfaces a of the frame plate 13 is located.
  • the first reinforcing member 20 is disposed close to the first printed circuit board 10, that is, the first reinforcing member 20 is disposed on an end of the frame plate 13 close to the first side A. It can be understood that the first reinforcing member 20 is away from the second side B of the frame plate 13 and is disposed close to the first side A of the frame plate 13. Therefore, regardless of the structure of the first reinforcement member 20, along the first direction X perpendicular to the first printed circuit board 10, the thickness h2 of the first reinforcement member 20 is smaller than the thickness h1 of the first printed circuit board 10.
  • the space between the first reinforcement 20 and the second side B of the first printed circuit board 10 can be used to arrange other electronic components.
  • the first reinforcing member 20 In order to enable the first reinforcing member 20 to strengthen the connection between the first printed circuit board 10 and the frame board 13, as shown in FIGS. 3a and 3d, the first reinforcing member 20 is connected to the frame board 13 and the first printed circuit board 13 The circuit boards 10 are all connected.
  • the first reinforcing member 20 is located on the side a of the frame plate 13, in order to simplify the structure, in some embodiments, the first reinforcing member 20 is connected to the side a of the frame plate 13.
  • the first reinforcement 20 and the frame plate 13 are separate structures.
  • the connection mode of the first reinforcement 20 and the side a of the frame plate 13 for example, the first reinforcement 20 and the frame plate 13 may be bonded or welded. .
  • the first reinforcing member 20 and the frame plate 13 are an integral structure, and the two are directly connected as a connection structure when the preparation is completed.
  • the frame board 13 is a PCB, and the shape of the first reinforcement 20 located on the side a of the frame board 13 is milled by a milling cutter.
  • connection manner of the first reinforcing member 20 and the first printed circuit board 10 may be the same as the connection manner of the frame board 13 and the first printed circuit board 10, so as to reduce the process steps and simplify the process.
  • PCBA printed circuit board assembly
  • the electronic component 100 includes a frame board 13, a first printed circuit board 10, a first reinforcement member 20 and a second printed circuit board 30.
  • the shape of the frame plate 13 is a plate-like structure with a first side A and a second side B opposite to each other.
  • the first printed circuit board 10 is located on the first side A of the frame board 13 and is electrically connected to the frame board 13.
  • the second printed circuit board 30 is located on the second side B of the frame board 13 and is electrically connected to the frame board 13.
  • the first reinforcing member 20 is located on the side a of the frame board 13, and the first reinforcing member 20 is disposed close to the first printed circuit board 10. Wherein, the first reinforcing member 20 is connected to both the frame board 13 and the first printed circuit board 10.
  • the electronic component 100 includes a first reinforcement member 20, and the first reinforcement member 20 surrounds the frame plate.
  • the contour of 13 is one week.
  • the first reinforcement member 20 is provided with solder joints 14 on a circumference, and the first reinforcement member 20 is welded to the first printed circuit board 10 through the solder joints 14.
  • a welding spot 14 is provided in a partial area of the first reinforcing member 20, and the first reinforcing member 20 is welded to the first printed circuit board 10 through the welding spot 14.
  • solder joint 14 may be tin plating, nickel plating, gold plating, organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), and electroless nickel palladium immersion gold (electroless nickel electroless plating). palladium immersion gold, ENEPIG) etc.
  • the thickness h2 of the first reinforcement member 20 in the first direction X perpendicular to the first printed circuit board 10 is too large, and the space occupied by the first reinforcement member 20 is too large, affecting the electronic assembly 100 Arrangement of other devices.
  • the thickness h2 of the first reinforcing member 20 is too small, and the stability of the connection between the first reinforcing member 20 and the first printed circuit board 10 is poor.
  • the thickness h2 of the first reinforcing member 20 along the first direction X perpendicular to the first printed circuit board 10 is 0.2-0.5 mm.
  • the width w of the first reinforcement member 20 is 0.2-2.0 mm.
  • the first reinforcing member 20 is connected to the frame board 13 and the first printed circuit board 10, it is equivalent to increasing the contact area between the frame board 13 and the first printed circuit board 10. Therefore, the supporting effect of the frame board 13 on the first printed circuit board 10 can be increased, so as to improve the reliability and stability of the connection between the frame board 13 and the first printed circuit board 10.
  • the number of solder joints 14 and the size of the solder joints 14 are compared with the first reinforcement 20 and the first printed circuit board.
  • the welding effect of the board 10 is closely related.
  • the pitch between adjacent solder joints 14 is 0.4mm-0.8mm, and the solder joints 14 The width is 0.3mm-0.6mm.
  • the width of the solder joint 14 can be understood as the size of the solder joint 14 along the arrangement direction of the solder joint 14.
  • the first reinforcement 20 has a plate-like structure.
  • the stability of the connection between the first reinforcing member 20 and the frame plate 13 is further improved, thereby improving the first reinforcing member 20 and the first printed circuit board.
  • the reliability and stability of the connection between the circuit board 10 and the frame board 13 are improved to achieve the purpose of improving the reliability and stability of the connection between the frame board 13 and the first printed circuit board 10.
  • the first reinforcement member 20 includes a plurality of reinforcement portions 21 stacked in a thickness direction of the first reinforcement member 20.
  • the adjacent reinforcing portions 21 are connected, and along the direction away from the first printed circuit board 10 (that is, along the direction from the first printed circuit board 10 to the second printed circuit board 30) Y, the horizontal direction of the reinforced portion 21
  • the cross-sectional area gradually decreases; at least part of the plurality of reinforcing parts 21 is connected to the frame board 13 (in FIG. 5c, each reinforcing part 21 is connected to the frame board 13 as an example), which is closest to the first printed circuit board
  • the reinforcing part 21 of 10 is connected to the first printed circuit board 10.
  • the cross-sectional area of the reinforcing portion 21 refers to the area of the cross-section of the reinforcing portion 21 in a direction parallel to the first printed circuit board 10.
  • the cross-sectional area of the reinforcing portion 21 is gradually reduced, and may be sequentially reduced according to a fixed law, or there may be no fixed law, but the overall trend is decreasing.
  • the first reinforcing member 20 includes overlapping multi-layer reinforcing parts 21. As shown in FIG. The overlapping reinforcing parts 21 are connected, and each layer of the reinforcing parts 21 is connected to the first printed circuit board 10.
  • the first reinforcement member 20 includes overlapping multiple layers of reinforcement portions 21, and each layer may include one reinforcement portion 21 or multiple reinforcement portions 21.
  • the first reinforcement 20 includes multiple layers of reinforcement 21, each layer of reinforcement 21 may be connected to the frame plate 13, or Only part of the reinforcing part 21 is connected to the frame plate 13. However, each layer of the reinforcing portion 21 is connected to the first printed circuit board 10. Therefore, the solder joints 14 on the reinforcing portion 21 farther from the first printed circuit board 10 are compared to those closer to the first printed circuit board 10. The solder joint 14 on the portion 21 has a small thickness along the first direction X.
  • the structure of the multi-layered reinforcement portion 21 in the first reinforcement member 20 is not limited, as long as the multi-layered reinforcement portion 21 is overlapped, the first reinforcement member 20 is formed around the frame plate 13 as a whole. Just one week.
  • FIG. 5f for clarity of illustration, different filling patterns are used to represent the reinforcing parts 21 of different layers. After the two layers of reinforcing parts 21 are overlapped with each other, they go around the frame plate 13 once.
  • the thickness of the reinforcement portion 21 along the direction Y perpendicular to the first printed circuit board 10 is 0.2-0.5mm.
  • the electronic assembly 100 includes a first reinforcement 20, and the first reinforcement 20 is disposed at Any side a of the frame plate 13.
  • the frame plate 13 includes a plurality of side surfaces a, and the first reinforcement member 20 can be arranged at any position on any side surface.
  • the first reinforcing member 20 is located on the side of one side a.
  • the first reinforcement 20 may also be located on the side where the multiple side faces a are located.
  • the first reinforcing member 20 is plate-shaped.
  • the first reinforcing member 20 includes a plurality of reinforcing parts 21 stacked in the thickness direction of the first reinforcing member 20.
  • the adjacent reinforcing portions 21 are connected, and along the direction away from the first printed circuit board 10 (that is, along the direction from the first printed circuit board 10 to the second printed circuit board 30) Y, the horizontal direction of the reinforced portion 21
  • the cross-sectional area gradually decreases; at least part of the plurality of reinforcing parts 21 is connected to the frame board 13, and the reinforcing part 21 closest to the first printed circuit board 10 is connected to the first printed circuit board 10.
  • the first reinforcement 20 has a stepped shape.
  • the first reinforcing member 20 includes overlapping multi-layer reinforcing portions 21.
  • the overlapping reinforcing parts 21 are connected, and each layer of the reinforcing parts 21 is connected to the first printed circuit board 10.
  • the electronic assembly 100 includes a plurality of first reinforcements 20, and the first reinforcements 20 are In a block structure, each first reinforcement 20 is connected to at least one side a of the frame plate 13.
  • the first reinforcing member 20 may be a structure of any shape, and may be a regular structure as shown in FIG. 7a, or an irregular structure as shown in FIG. 7b.
  • the structure of the first reinforcing member 20 illustrated in FIGS. 7a and 7b is only for illustration and does not make any limitation.
  • the first reinforcement member 20 may be connected to one side a of the frame plate 13. As shown in FIG. 7b, the first reinforcement member 20 may also be connected to multiple side surfaces a of the frame plate 13.
  • the first reinforcing member 20 is plate-shaped.
  • the first reinforcing member 20 is stepped.
  • the first reinforcing member 20 includes overlapping multi-layer reinforcing portions 21.
  • the reinforcement 21 can be overlapped with other first reinforcements 20.
  • each of the two first reinforcement members 20 includes overlapping multi-layer reinforcement portions 21, and the reinforcement portions 21 of the two first reinforcement members 20 are overlapped.
  • the first reinforcing member 20 includes overlapping multi-layered reinforcing portions 21, and the reinforcing portion 21 of the first reinforcing member 20 overlaps with other first reinforcing members 20 having a plate-like structure.
  • the electronic component 100 includes a plurality of first reinforcing members 20, and the structure of the plurality of first reinforcing members 20 is not limited to the same, and may be the first reinforcing member 20 of any of the above-mentioned structures.
  • a part of the first reinforcement member 20 has a plate-shaped structure
  • a part of the first reinforcement member 20 has a stepped structure
  • a part of the first reinforcement member 20 has a structure that includes overlapping multilayer reinforcements. ⁇ 21 ⁇ Department 21.
  • the structure in order to enrich the functions of the electronic component 100, the structure is integrated.
  • the electronic assembly 100 further includes a first electronic device 41 and a second electronic device 42.
  • the first electronic device 41 is electrically connected to the first printed circuit board 10
  • the second electronic device 42 is electrically connected to the second printed circuit board 30.
  • the first electronic device 41 may be, for example, a radio frequency integrated circuit chip (RFIC), a resistance (resistance), a wireless local area network (wireless fidelity, WIFI), etc.
  • the second electronic device 42 may be, for example, a power management unit (PMU), a resistor, a package on package (POP) structure, etc.
  • the stacked package structure may, for example, be integrated with a wireless access point (AP) , Double data rate memory (double data rate, DDR) and other devices.
  • the first reinforcing member 20 connected to the frame board 13 and the first printed circuit board 10 is added, and the thickness of the first reinforcing member 20 is made smaller than the thickness of the frame board 13.
  • the first reinforcing member 20 and the frame board 13 both function to support the first printed circuit board 10. Therefore, it is equivalent to that the first reinforcing member 20 shares the mechanical drop stress of the frame board 13 and the first printed circuit board 10 (according to the simulation of stress analysis software, the frame board 13 and the first printed circuit board 10 can be combined when the mechanical drop The stress therebetween is reduced by 64%), thereby improving the supporting effect of the frame board 13 on the first printed circuit board 10. And, because the thickness of the first reinforcement 20 is smaller than the thickness of the frame plate 13.
  • the second electronic device 42 can be arranged in the gap between the first reinforcing member 20 and the second printed circuit board 30, without affecting the wiring efficiency and space of the second printed circuit board 30. Therefore, while increasing the supporting effect of the frame board 13 and the first printed circuit board 10, the integration degree of each device in the electronic assembly 100 can be improved, and the miniaturization of the electronic assembly 100 can be realized.
  • connection area between the frame board 13 and the first printed circuit board 10 is increased to improve the connection effect between the frame board 13 and the first printed circuit board 10.
  • the structure adopted in the embodiment of the present application is in the electronic When the component 100 is repaired, there is no problem of removing glue, and the operation is more convenient.
  • FIG. 9 by increasing the width of the frame board 13 (the parts on both sides of the frame board 13 in FIG. 9) as a non-functional area that has no effect on the circuit function, the frame board 13 and the first printed circuit board 10 are improved.
  • the second electronic device 42 can be disposed under the first reinforcement 20, the second electronic device 42 does not need to extend to the edge, and the integration of the devices in the electronic assembly 100 is higher.
  • the second embodiment is similar to the first embodiment in that: the structure of the frame plate 13 and the first reinforcing member 20 are the same.
  • the electronic component 100 further includes a second reinforcing member.
  • the electronic component 100 further includes a second reinforcing member 50, the second reinforcing member 50 is located on the side of the frame plate 13, and the second reinforcing member 50 is disposed close to the second printed circuit board 30; the second reinforcing member 50 It is connected to both the frame board 13 and the second printed circuit board 30.
  • the structure of the second reinforcement member 50 may be the same as the structure of any of the first reinforcement members 20 illustrated in the first embodiment.
  • the structure of the second reinforcement member 50 may be the same as the structure of the first reinforcement member 20 shown in FIG.
  • the structure of the second reinforcement member 50 is also the same as the structure of the first reinforcement member 20 shown in FIG. 6a, and is a block structure.
  • the electronic assembly 100 may also include a plurality of second reinforcement members 50.
  • the structure of the second reinforcement member 50 may be the same as the structure of the first reinforcement member 20 illustrated in FIG. 7a, and is a block structure.
  • the second reinforcement member 50 has the same structure as the first reinforcement member 20, and the second reinforcement member 50 has a plate-like structure.
  • the second reinforcement 50 and the first reinforcement 20 have the same structure, and the second reinforcement 50 may have a stepped structure.
  • the second reinforcement member 50 has the same structure as the first reinforcement member 20, and the second reinforcement member 50 may be an overlapping structure.
  • the difference between the second reinforcement 50 and the first reinforcement 20 is that the first reinforcement 20 is connected to the first printed circuit board 10, and the second reinforcement 50 is connected to the second printed circuit board 30.
  • the features of 50 will not be repeated here, and reference may be made to the description of the first reinforcing member 20 in the first embodiment above.
  • the material and preparation process of the second reinforcement member 50 may be the same as those of the first reinforcement member 20.
  • the connection manner of the second reinforcement member 50 and the frame plate 13 may also be the same as the connection manner of the first reinforcement member 20 and the frame plate 13.
  • the connection manner of the second reinforcement member 50 and the second printed circuit board 30 may also be the same as the connection manner of the first reinforcement member 20 and the first printed circuit board 10.
  • the first reinforcing member 20 between the first printed circuit board 10 and the frame board 13, and the second reinforcing member 50 between the second printed circuit board 30 and the frame board 13, it is possible to separately The connection reliability between the first printed circuit board 10 and the frame board 13 and the connection reliability between the second printed circuit board 30 and the frame board 13 are improved. No matter which of the first printed circuit board 10 and the second printed circuit board 30 is the main board and which is the daughter board, the reliability of the sandwich printed circuit board assembling the single board is relatively high, and the reliability of the product can be improved.
  • the third embodiment is similar to the first embodiment in that the structure of the first reinforcing member 20 is the same.
  • the third embodiment is different from the first embodiment in that the structure of the frame plate 13 is different.
  • the shape of the frame plate 13 is a plate-like structure, and the frame plate 13 has an opening 131 penetrating the frame plate 13 in a first direction X perpendicular to the first printed circuit board.
  • the multiple surfaces of the outer contour of the frame plate 13 are the side a of the frame plate 13, and the contour of the opening 131 (the inner contour of the frame plate 13) is also the side a of the frame plate 13.
  • the structure of the first reinforcement member 20 may be the same as the structure of the first reinforcement member 20 in the first embodiment, but in this embodiment, the first reinforcement member 20 may not only be provided on the outer contour of the frame plate 13 On the side, as shown in FIG. 11, the first reinforcement 20 may also be provided on the side where the inner contour of the frame plate 13 is located.
  • the structure of the first reinforcing member 20 will not be repeated, and the description of the first reinforcing member 20 in the first embodiment can be referred to, and the description will be focused on the location of the first reinforcing member 20.
  • the first reinforcing member 20 is on the periphery of the frame plate 13, the first reinforcing member 20 is easy to prepare. In some embodiments, as shown in FIG. 12a, the first reinforcing member 20 wraps around the outer contour of the frame plate 13 once. Or, as shown in FIG. 12b, the first reinforcement 20 is provided on the outer side of the frame plate 13.
  • the first reinforcement 20 Since the first reinforcement 20 is inside the frame plate 13, there is no need to increase the outer contour of the frame plate 13, thereby reducing the size of the frame plate 13. In some embodiments, as shown in FIG. 12c, the first reinforcement member 20 wraps around the inner contour of the frame plate 13 once. Alternatively, as shown in FIG. 12d, the first reinforcing member 20 may also be provided on the inner side of the frame plate 13.
  • first reinforcement members 20 are all provided on the periphery of the frame plate 13.
  • a plurality of first reinforcement members 20 are all provided on the inner side of the frame plate 13.
  • the first reinforcing member 20 may be a block structure of any shape. Due to the stability of the triangle, in order to enhance the stability of the connection between the first reinforcing member 20 and the frame plate 13, as shown in FIG. 13b, in some embodiments, the first reinforcing member 20 is provided at the corner of the frame plate 13. It is connected to the two sides of the frame plate 13.
  • the first reinforcement 20 may include overlapping multiple layers of reinforcement 21. Since the frame board 13 has an opening 131, the position of the opening 131 is not connected to the first printed circuit board 10, so that the frame board 13 is easily separated from the first printed circuit board 10. As shown in FIG. 13c, in some embodiments, the first reinforcement 20 including the multi-layer reinforcement 21 overlaps another first reinforcement 20 in the electronic component 100. Of course, in the case where the plurality of first reinforcement members 20 include multiple layers of reinforcement parts 21, part of the reinforcement parts 21 may not overlap with other first reinforcement members 20.
  • part of the plurality of first reinforcements 20 is arranged on the inner side of the frame plate 13 and part is arranged on the outer side of the frame plate 13.
  • FIG. 13d illustrates the first reinforcement member 20 of various structures, that is, the structures of the multiple first reinforcement members 20 included in the electronic assembly 100 are not necessarily the same, and the first reinforcement member 20 may be the first embodiment described above.
  • the structure of any of the first reinforcement 20 shown in FIG. 13d illustrates the first reinforcement member 20 of various structures, that is, the structures of the multiple first reinforcement members 20 included in the electronic assembly 100 are not necessarily the same, and the first reinforcement member 20 may be the first embodiment described above. The structure of any of the first reinforcement 20 shown in FIG.
  • the fourth embodiment is similar to the third embodiment in that the structure of the frame plate 13 is the same.
  • the difference between the fourth embodiment and the first embodiment is that the structure of the first reinforcing member 20 located in the opening 131 is different.
  • the electronic component 100 includes a first reinforcement member 20 located in the opening 131.
  • the first reinforcement member 20 is connected to a plurality of side surfaces a of the frame plate 13 and divides the opening 131 into a plurality of regions. .
  • the first reinforcing member 20 has a mesh structure, which divides the opening 131 into a plurality of regions, but the shape and size of the divided regions are not limited.
  • FIGS. 14a and 14b are only A kind of hint.
  • the cross-sectional shape of the first reinforcing member 20 in this embodiment may be the same as the cross-sectional shape of the first reinforcing member 20 in the first embodiment.
  • the first reinforcing member 20 is a plate-shaped structure.
  • the first reinforcement 20 has a stepped structure.
  • the first reinforcement member 20 has an overlapping structure.
  • the middle part is easy to sink.
  • the reinforcing portion 21 is equivalent to a bridge, and the reinforcing portion 21 relatively far away from the first printed circuit board 10 is equivalent to a bridge pier, thereby improving the connection effect between the first reinforcing member 20 and the first printed circuit board 10.
  • any of the first reinforcing members 20 shown in the first embodiment can still be provided on the periphery of the frame plate 13.
  • the electronic component 100 provided in this embodiment can adjust the shape of the first reinforcing member 20 according to the arrangement of the first electronic device 41 on the first printed circuit board 10 and the second electronic device 42 on the second printed circuit board 30 , To maximize the contact area between the first reinforcing member 20 and the first printed circuit board 10, thereby improving the supporting effect of the frame board 13 on the first printed circuit board 10.
  • the fifth embodiment is similar to the third and fourth embodiments in that: the structure of the frame plate 13 and the first reinforcing member 20 are the same.
  • the electronic assembly 100 further includes a second reinforcing member 50.
  • the electronic component 100 further includes a second reinforcing member 50, the second reinforcing member 50 is located on the side of the frame plate 13, and the second reinforcing member 50 is disposed close to the second printed circuit board 30; the second reinforcing member 50 It is connected to both the frame board 13 and the second printed circuit board 30.
  • the structure of the second reinforcement member 50 may be the same as the structure of the first reinforcement member 20 illustrated in the third and fourth embodiments.

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Abstract

本申请提供一种电子组件及电子设备，涉及电子技术领域，用于解决如何增强框架板与印制电路板连接可靠性的问题。电子组件，包括：框架板，具有第一侧；第一印制电路板，位于框架板的第一侧，且与框架板连接；至少一个第一加强件；第一加强件位于框架板的侧面，且靠近第一印制电路板设置；第一加强件与框架板和第一印制电路板均连接；其中，框架板的侧面与第一印制电路板相交。

Description

电子组件及电子设备
本申请要求于2020年01月20日提交国家知识产权局、申请号为202020133945.1、申请名称为“电子组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，尤其涉及一种电子组件及电子设备。
背景技术
电子产品(例如手机、平板电脑、笔记本电脑、智能穿戴设备等)已成为人们日常生活不可或缺的工具。通常情况下，电子产品通过三明治印刷电路板装配(printed circuit boards assembly，PCBA)单板搭载电子元器件，如连接显示模组、摄像模组、音腔组件、电池、天线等电子部件。
如图1所示，三明治印刷电路板装配单板，包括通过框架板(frame board，FB)13连接的主板11和子板12。而位于框架板13与主板11之间和框架板13与子板12之间的焊点14，由于其具有焊点14高度小(low standoff)、焊点14到单板中心的距离(distance-to-neutral point，DNP)大、由强度相对较差的低温焊料构成等特性，导致焊点14的机械可靠性较低，在受到外力时容易断裂，从而导致产品损坏。
发明内容
本申请实施例提供一种电子组件及电子设备，用于解决如何增强框架板与印制电路板连接可靠性的问题。
为达到上述目的，本实施例采用如下技术方案：
第一方面，提供一种电子组件，包括：框架板，具有第一侧；第一印制电路板，位于框架板的第一侧，且与框架板连接；至少一个第一加强件；第一加强件位于框架板的侧面，且靠近第一印制电路板设置；第一加强件与框架板和第一印制电路板均连接；其中，框架板的侧面与第一印制电路板相交。本申请实施例中，通过增加与框架板和第一印制电路板连接的第一加强件，并使第一加强件的厚度小于框架板的厚度。这样一来，由于第一加强件与框架板均起到对第一印制电路板进行支撑的作用。因此，相当于第一加强件分担了框架板与第一印制电路板的机械跌落应力(根据应力分析软件模拟仿真，机械跌落时可将框架板与第一印制电路板之间的应力降低64％)，从而提高了框架板对第一印制电路板的支撑效果。并且，由于第一加强件的厚度小于框架板的厚度。因此，第一加强件与第二印制电路板之间的空隙处可以设置第二电子器件，不影响第二印制电路板的布线效率和空间。从而可以在增加框架板与第一印制电路板的支撑效果的同时，提高电子组件中各器件的集成度，实现电子组件小型化。
可选的，至少一个第一加强件中的至少部分，绕框架板的轮廓一周。结构简单，支撑面广。
可选的，至少一个第一加强件中的至少部分为块状结构，且每个第一加强件与框架板的至少一个侧面相连接。结构可变性强，可根据电子组件中各器件的排布，调整第一加强件的结构。
可选的，框架板的形状为板状结构。
可选的，框架板具有沿垂直于第一印制电路板的方向贯穿框架板的开口。
可选的，开口内设置有一第一加强件，该第一加强件与框架板的多个侧面相连接，将开口划分为多个区域。结构灵活，可最大程度的对第一印制电路板起到支撑作用。
可选的，至少一个第一加强件中的至少部分，位于开口内。在提高框架板对第一印制电路板的支撑效果的同时，无需将框架板的外轮廓外扩，以提高电子组件的集成度。
可选的，至少一个第一加强件中的至少部分，包括层叠设置的多个加强部；相邻加强部相连接，且沿远离第一印制电路板的方向，加强部的横截面积逐渐减小；多个加强部中的至少部分与框架板连接，最靠近第一印制电路板的加强部与第一印制电路板连接。这样一来，在不增加第一加强件与第一印制电路板的连接面积的同时，进一步提高第一加强件与框架板连接的稳定性，从而提高第一加强件与第一印制电路板连接的可靠性，以达到提高框架板与第一印制电路板连接的可靠性和稳定性的目的。
可选的，至少一个第一加强件中的至少部分，包括搭接的多层加强部；相互搭接的加强部相连接，且每层加强部均与第一印制电路板连接。考虑到第二印制电路板朝向第一印制电路板一侧还需设置电阻、电源管理单元等电子器件，通过加强部搭接的方式，能够在避开第二印制电路板上高低不平的电子器件的同时，增强第一加强件与第一印制电路板的连接面积。
可选的，第一加强件与框架板为一体结构。结构简单，便于制备。
可选的，第一加强件沿垂直于第一印制电路板的方向上的厚度为0.2-0.5mm；第一加强件的宽度为0.2-2.0mm。第一加强件沿垂直于第一印制电路板的第一方向上的厚度太大，第一加强件占据的空间太大，影响电子组件中其他器件的排布。第一加强件的厚度太小，第一加强件与第一印制电路板连接的稳定性较差。
可选的，加强部沿垂直于第一印制电路板的方向上的厚度为0.2-0.5mm。第一加强件沿垂直于第一印制电路板的第一方向上的厚度太大，第一加强件占据的空间太大，影响电子组件中其他器件的排布。第一加强件的厚度太小，起不到支撑效果。
可选的，第一加强件与第一印制电路板焊接，相邻焊点之间的间距为0.4mm-0.8mm，焊点的宽度为0.3mm-0.6mm。焊点间距太小或太大，焊接效果均较差。
可选的，框架板还具有与第一侧相对的第二侧；电子组件还包括第二印制电路板和第二加强件；第二印制电路板位于框架板的第二侧，且与框架板连接；第二加强件位于框架板的侧面，且靠近第二印制电路板设置；第二加强件与框架板和第二印制电路板均连接。通过在第一印制电路板与框架板之间设置第一加强件，在第二印制电路板与框架板之间设置第二加强件，可以分别提高第一印制电路板与框架板的连接可靠性和第二印制电路板与框架板的连接可靠性。无论第一印制电路板和第二印制电路板哪个是主板，哪个是子板，三明治印刷电路板装配单板的可靠性的比较高，可提高产品的可信赖性。
第二方面，提供一种电子设备，包括第一方面任一项的电子组件。
附图说明
图1为相关技术提供的一种电子组件的截面结构示意图；
图2为本申请实施例提供的一种电子设备的结构示意图；
图3a为本申请实施例提供的一种电子组件的截面结构示意图；
图3b为本申请实施例提供的一种框架板的结构示意图；
图3c为本申请实施例提供的另一种框架板的结构示意图；
图3d为本申请实施例提供的另一种电子组件的截面结构示意图；
图4为本申请实施例提供的又一种电子组件的截面结构示意图；
图5a为本申请实施例提供的一种框架板与第一加强件的结构关系图；
图5b为本申请实施例提供的另一种框架板与第一加强件的结构关系图；
图5c为本申请实施例提供的又一种电子组件的截面结构示意图；
图5d为本申请实施例提供的一种电子组件的俯视示意图；
图5e为沿图5d中A1-A2向的剖视图；
图5f为本申请实施例提供的另一种电子组件的俯视示意图；
图6a为本申请实施例提供的又一种电子组件的俯视示意图；
图6b为本申请实施例提供的又一种电子组件的俯视示意图；
图7a为本申请实施例提供的又一种电子组件的俯视示意图；
图7b为本申请实施例提供的又一种电子组件的俯视示意图；
图8为本申请实施例提供的又一种电子组件的截面结构示意图；
图9为本申请实施例提供的又一种电子组件的截面结构示意图；
图10a为本申请实施例提供的又一种电子组件的截面结构示意图；
图10b为本申请实施例提供的又一种电子组件的截面结构示意图；
图10c为本申请实施例提供的又一种电子组件的截面结构示意图；
图11为本申请实施例提供的又一种电子组件的截面结构示意图；
图12a为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图12b为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图12c为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图12d为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图13a为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图13b为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图13c为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图13d为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图14a为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图14b为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图14c为本申请实施例提供的一种沿图14b中B1-B2向的剖视图；
图14d为本申请实施例提供的另一种沿图14b中B1-B2向的剖视图；
图14e为本申请实施例提供的又一种框架板与第一加强件的结构关系图；
图15为本申请实施例提供的又一种电子组件的截面结构示意图。
附图标记：
1-电子设备；2-显示模组；3-中框；4-壳体；5-盖板；11-主板；12-子板；13-框架板；14-焊点；100-电子组件；10-第一印制电路板；20-第一加强件；21-加强部； 30-第二印制电路板；41-第一电子器件；42-第二电子器件；50-第二加强件。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
此外，本申请中，“上”、“下”、“左”、“右”等方位术语是相对于附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件所放置的方位的变化而相应地发生变化。
在本申请中，除非另有明确的规定和限定，术语“连接”应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或成一体；可以是直接相连，也可以通过中间媒介间接相连。
本申请实施例提供一种电子设备，该电子设备可以为手机、电视、显示器、平板电脑、车载电脑等具有显示界面的终端设备，或者为智能手表、智能手环等智能显示穿戴设备，或者为服务器、存储器、基站等通信设备，或者为智能汽车等。本申请实施例对上述电子设备的具体形式不做特殊限制。以下实施例为了方便说明，均是以电子设备为手机为例进行举例说明。
在此情况下，如图2所示，电子设备1主要包括显示模组2、中框3、壳体(或者称为电池盖、后壳)4以及盖板5。
显示模组2具有能够使人看到显示画面的出光侧和与上述出光侧相对设置的背面，显示模组2的背面靠近中框3，盖板5设置在显示模组2的出光侧。
上述显示模组2，包括显示屏(display panel，DP)。
在本申请的一种可能的实施例中，显示模组2为液晶显示模组。在此情况下，上述显示屏为液晶显示屏(liquid crystal display，LCD)。基于此，显示模组2还包括位于液晶显示屏背面(远离LCD用于显示画面的一侧表面)的背光模组(back light unit，BLU)。
背光模组可以向液晶显示屏提供光源，以使得液晶显示屏中的各个亚像素(sub pixel)能够发光以实现图像显示。
或者，在本申请的另一种可能的实施例中，显示模组2为有机发光二极管显示模组。在此情况下，上述显示屏为有机发光二极管(organic light emitting diode，OLED)显示屏。由于OLED显示屏中每个亚像素内设置有电致发光层，所以可以使得OLED显示屏在接收到工作电压后，实现自发光。在此情况下，具有OLED显示屏的显示模组2中无需再设置上述背光模组。
盖板5位于显示模组2远离中框3一侧，盖板5例如可以是盖板玻璃(cover glass，CG)，该盖板玻璃可以具有一定的韧性。
中框3位于显示模组2和壳体4之间，中框3远离显示模组2的表面用于设置电 子组件100。壳体4与中框3盖合后，上述电子组件100位于壳体4与中框3之间。
其中，上述电子组件100，例如可以是在三明治印刷电路板装配(printed circuit boards assembly，PCBA)单板上集成无线接入点(access point，AP)，双倍速率同步动态随机存储器(double data rate，DDR)，UFS(unix filing system，UNIX文件系统)，射频功率放大器(radio frequency power amplifier，RF PA)，射频集成电路(radio frequency integrated circuit chip，RFIC)，电源管理单元(power management unit，PMU)，无线局域网(wireless fidelity，WIFI)，充电器(charger)等电子部件后得到的器件。
电子组件100中各部件之间连接的稳定性，直接影响着电子组件100的性能和寿命。基于此，本申请实施例提供一种电子组件100，旨在提高电子组件100的稳定性。
以下，对电子组件100的结构进行举例说明。
如图3a所示，电子组件100包括框架板(frame board，FB)13、第一印制电路板(printed circuit boards，PCB)10以及至少一个第一加强件20。
如图3b所示，框架板13具有第一侧A和与第一侧A相对的第二侧B，其中，框架板13例如可以是PCB。
如图3a所示，第一印制电路板10位于框架板13的第一侧A，框架板13具有与第一印制电路板10相交的侧面a。
关于框架板13的结构，在一种可能的实施例中，如图3b所示，框架板13的形状为板状结构。
其中，框架板13在第一印制电路板10上的正投影可以是任意形状的封闭图形，图3b以框架板13为矩形板为例进行示意。
在这种情况下，构成框架板13的外轮廓的多个面均为框架板13的侧面a。
在另一种可能的实施例中，如图3c所示，框架板13的形状为板状结构，且框架板13具有沿垂直于第一印制电路板的第一方向X贯穿框架板13的开口131。
其中，不对开口131的形状进行限定，开口131在第一印制电路板10上的正投影可以是任意形状的封闭图形，图3c以开口131为矩形为例进行示意。
在这种情况下，构成框架板13的外轮廓的多个面为框架板13的侧面a，构成开口131的轮廓的各个面也为框架板13的侧面a。
为了使第一印制电路板10与框架板13实现信号互通，第一印制电路板10与框架板13电连接。
其中，不对第一印制电路板10与框架板13连接的方式进行限定。例如，可以采用球状引脚栅格阵列封装(ball grid array，BGA)或者晶圆片级芯片规模封装(wafer level chip scale packaging，WLCSP)技术使第一印制电路板10与框架板13焊接，以实现第一印制电路板10与框架板13的连接。
关于第一加强件20的数量，在一种可能的实施例中，如图3a所示，电子组件100包括一个第一加强件20。
关于第一加强件20的数量，在另一种可能的实施例中，如图3d所示，电子组件100包括多个第一加强件20。
无论电子组件100包括一个第一加强件20，还是包括多个第一加强件20，每个第 一加强件20都位于框架板13的侧面a，且每个第一加强件20靠近第一印制电路板10设置。参考图3b和图3c的相关描述可知，框架板13的侧面a可以为多个，因此，第一加强件20可以设置于框架板13的侧面a中的任一个侧面a所在侧。
第一加强件20靠近第一印制电路板10设置，也就是说，第一加强件20设置在框架板13靠近第一侧A的一端。可以理解的是，第一加强件20远离框架板13的第二侧B，靠近框架板13的第一侧A设置。因此，无论第一加强件20是什么样的结构，沿垂直于第一印制电路板10的第一方向X，第一加强件20的厚度h2小于第一印制电路板10的厚度h1，第一加强件20与第一印制电路板10的第二侧B之间的空间可以用来排布其他电子元器件。
为了能使第一加强件20对第一印制电路板10与框架板13的连接起到加强作用，如图3a和图3d所示，第一加强件20与框架板13和第一印制电路板10均连接。
由于第一加强件20位于框架板13的侧面a，为了简化结构，在一些实施例中，第一加强件20与框架板13的侧面a连接。
可选的，第一加强件20与框架板13为分立结构，关于第一加强件20与框架板13的侧面a的连接方式，例如可以将第一加强件20与框架板13粘接或者焊接。
可选的，第一加强件20与框架板13为一体结构，二者在制备完成时直接为连接结构。
例如，框架板13为PCB，通过铣刀，铣出位于框架板13侧面a的第一加强件20的形状。
关于第一加强件20与第一印制电路板10的连接方式，例如，可以与框架板13与第一印制电路板10的连接方式相同，以减少工艺步骤，简化工艺。
需要说明的是，通常情况下，电子产品通过三明治印刷电路板装配(printed circuit boards assembly，PCBA)单板搭载电子元器件，PCBA单板通常包括主板、子板和位于主板和子板之间，且分别与主板和子板连接的框架板13。上述第一印制电路板10可以是主板，也可以是子板。
以下，以几个实施例对本申请提供的电子组件100的结构进行说明。
实施例一
如图4所示，电子组件100包括框架板13、第一印制电路板10、第一加强件20以及第二印制电路板30。
如图3b所示，框架板13的形状为板状结构，具有相对的第一侧A和第二侧B。
如图4所示，第一印制电路板10位于框架板13的第一侧A，且与框架板13电连接。第二印制电路板30位于框架板13的第二侧B，且与框架板13电连接。
第一加强件20位于框架板13的侧面a，且第一加强件20靠近第一印制电路板10设置。其中，第一加强件20与框架板13和第一印制电路板10均连接。
关于电子组件100包括的第一加强件20的数量和结构，在一种可能的实施例中，如图5a所示，电子组件100包括一个第一加强件20，第一加强件20绕框架板13的轮廓一周。
在这种情况下，可选的，如图5a所示，第一加强件20的一周均设置有焊点14，第一加强件20通过焊点14与第一印制电路板10焊接。
或者，可选的，如图5b所示，第一加强件20的部分区域设置有焊点14，第一加强件20通过焊点14与第一印制电路板10焊接。
其中，焊点14例如可以是镀锡、镀镍、镀金、有机保焊膜(organic solderability preservatives，OSP)、化镍金(electroless nickel immersion gold，ENIG)、化学镀镍钯浸金(electroless nickel electroless palladium immersion gold，ENEPIG)等。
通过应力分析软件分析得到，第一加强件20沿垂直于第一印制电路板10的第一方向X上的厚度h2太大，第一加强件20占据的空间太大，影响电子组件100中其他器件的排布。第一加强件20的厚度h2太小，第一加强件20与第一印制电路板10连接的稳定性较差。基于此，在一些实施例中，如图4所示，第一加强件20沿垂直于第一印制电路板10的第一方向X上的厚度h2为0.2-0.5mm。
同理，第一加强件20的宽度w太大对第一加强件20与框架板13的连接效果要求较高，第一加强件20的宽度w太小对框架板13的辅助支撑效果不明显。基于此，在一些实施例中，如图4所示，第一加强件20的宽度w为0.2-2.0mm。
这样一来，由于第一加强件20与框架板13和第一印制电路板10均连接，相当于增加了框架板13与第一印制电路板10的接触面积。因此，可以增加框架板13对第一印制电路板10的支撑效果，以提高框架板13与第一印制电路板10连接的可靠性和稳定性。
此外，在第一加强件20与第一印制电路板10通过焊接的方式连接的情况下，考虑到焊点14的数量和焊点14的大小与第一加强件20和第一印制电路板10的焊接效果息息相关。在一些实施例中，位于第一加强件20与第一印制电路板10之间的焊点14中，相邻焊点14之间的间距(pitch)为0.4mm-0.8mm，焊点14的宽度为0.3mm-0.6mm。
需要说明的是，本申请实施例中，焊点14的宽度可以理解为，沿焊点14的排布方向上，焊点14的尺寸。
关于第一加强件20的厚度方向上的形状(截面形状)，可选的，如图4所示，第一加强件20为板状结构。
为了在不增加第一加强件20与第一印制电路板10的连接面积的同时，进一步提高第一加强件20与框架板13连接的稳定性，从而提高第一加强件20与第一印制电路板10连接的可靠性，以达到提高框架板13与第一印制电路板10连接的可靠性和稳定性的目的。可选的，从截面图上来看，如图5c所示，第一加强件20包括沿第一加强件20的厚度方向层叠设置的多个加强部21。
相邻加强部21相连接，且沿远离第一印制电路板10的方向(也就是沿从第一印制电路板10到第二印制电路板30的方向)Y，加强部21的横截面积逐渐减小；多个加强部21中的至少部分与框架板13连接(图5c中以每个加强部21均与框架板13连接为例进行示意)，最靠近第一印制电路板10的加强部21与第一印制电路板10连接。
其中，加强部21的横截面积是指，加强部21沿平行于第一印制电路板10的方向上的截面的面积。加强部21的横截面积逐渐减小，可以是按固定规律依次减小，也可以是没有固定规律，但整体呈减小趋势。
考虑到第二印制电路板30朝向第一印制电路板10一侧还需设置电阻、电源管理单元(power management unit，PMU)等电子器件，为了能够在避开第二印制电路板30上高低不平的电子器件的同时，增强第一加强件20与第一印制电路板10的连接面积。如图5d所示，可选的，第一加强件20包括搭接的多层加强部21。相互搭接的加强部21相连接，且每层加强部21均与第一印制电路板10连接。
其中，如图5d所示，第一加强件20包括搭接的多层加强部21，每层可以包括一个加强部21，也可以包括多个加强部21。
此外，如图5e(沿图5d中A1-A2向的剖视图)所示，第一加强件20包括的多层加强部21，可以是每一层加强部21均与框架板13连接，也可以是仅部分加强部21与框架板13连接。但是，每层加强部21均与第一印制电路板10连接，因此，远离第一印制电路板10的加强部21上的焊点14，相比靠近第一印制电路板10的加强部21上的焊点14，在沿第一方向X上的厚度小。
再者，如图5d和图5f所示，不对第一加强件20中多层加强部21的结构进行限定，只要多层加强部21搭接后，使得第一加强件20整体绕框架板13一周即可。其中，图5f中，为了示意清楚，采用不同填充图案表示不同层的加强部21，两层加强部21相互搭接后，绕框架板13一周。
对于图5c-图5f所示的结构中，为了便于加强部21的制备，以及保证加强部21的强度满足需求，加强部21沿垂直于第一印制电路板10的方向Y上的厚度为0.2-0.5mm。
关于电子组件100包括的第一加强件20的数量和结构，在另一种可能的实施例中，如图6a所示，电子组件100包括一个第一加强件20，第一加强件20设置于框架板13的任意侧面a。
需要说明的是，如图6a所示，框架板13包括多个侧面a，第一加强件20可以设置于任意侧面的任意位置处。如图6a所示，第一加强件20位于一个侧面a所在侧。如图6b所示，第一加强件20也可以位于多个侧面a所在侧。
关于第一加强件20的截面形状，可选的，参考图4中第一加强件20的结构，第一加强件20为板状。
关于第一加强件20的截面形状，可选的，参考上述关于图5c的描述，第一加强件20包括沿第一加强件20的厚度方向层叠设置的多个加强部21。相邻加强部21相连接，且沿远离第一印制电路板10的方向(也就是沿从第一印制电路板10到第二印制电路板30的方向)Y，加强部21的横截面积逐渐减小；多个加强部21中的至少部分与框架板13连接，最靠近第一印制电路板10的加强部21与第一印制电路板10连接。也就是说，第一加强件20为阶梯状。
关于第一加强件20的截面形状，可选的，参考上述关于图5c的描述，第一加强件20包括搭接的多层加强部21。相互搭接的加强部21相连接，且每层加强部21均与第一印制电路板10连接。
关于电子组件100包括的第一加强件20的数量和结构，在另一种可能的实施例中，如图7a所示，电子组件100包括多个第一加强件20，第一加强件20为块状结构，每个第一加强件20与框架板13的至少一个侧面a相连接。
其中，第一加强件20可以是任意形状的结构，可以是如图7a所示的规则结构，也可以是如图7b所示的非规则结构。图7a和图7b中示意的第一加强件20的结构，仅为示意，不做任何限定。
此外，如图7a所示，第一加强件20可以与框架板13的一个侧面a相连接，如图7b所示，第一加强件20也可以与框架板13的多个侧面a相连接。
关于第一加强件20的截面形状，可选的，参考图4中第一加强件20的结构，第一加强件20为板状。
关于第一加强件20的截面形状，可选的，参考上述关于图5c的描述，第一加强件20为阶梯状。
关于第一加强件20的截面形状，可选的，参考上述关于图5c的描述，第一加强件20包括搭接的多层加强部21。
其中，第一加强件20包括搭接的多层加强部21时，加强部21可以与其他第一加强件20搭接。例如，两个第一加强件20均包括搭接的多层加强部21，这两个第一加强件20的加强部21搭接。或者，例如，第一加强件20包括搭接的多层加强部21，这个第一加强件20的加强部21与其他为板状结构的第一加强件20搭接。
需要说明的是，电子组件100包括多个第一加强件20，多个第一加强件20的结构并不限定为相同，可以是上述任一种结构的第一加强件20。例如，多个第一加强件20中，一部分第一加强件20的结构为板状，一部分第一加强件20的结构为阶梯状，一部分第一加强件20的结构包括搭接的多层加强部21。
在一些实施例中，为了使电子组件100的功能丰富化，结构集成化。如图8所示，电子组件100还包括第一电子器件41和第二电子器件42。第一电子器件41与第一印制电路板10电连接，第二电子器件42与第二印制电路板30电连接。
其中，第一电子器件41例如可以是射频集成电路(radio frequency integrated circuit chip，RFIC)、电阻(resistance)、无线局域网(wireless fidelity，WIFI)等。第二电子器件42例如可以是电源管理单元(power management unit，PMU)、电阻、堆叠封装(package on package，POP)结构等，堆叠封装结构例如可以集成有无线接入点(access point，AP)、双倍速率存储器(double data rate，DDR)等器件。
本申请实施例中，通过增加与框架板13和第一印制电路板10连接的第一加强件20，并使第一加强件20的厚度小于框架板13的厚度。这样一来，由于第一加强件20与框架板13均起到对第一印制电路板10进行支撑的作用。因此，相当于第一加强件20分担了框架板13与第一印制电路板10的机械跌落应力(根据应力分析软件模拟仿真，机械跌落时可将框架板13与第一印制电路板10之间的应力降低64％)，从而提高了框架板13对第一印制电路板10的支撑效果。并且，由于第一加强件20的厚度小于框架板13的厚度。因此，如图8所示，第一加强件20与第二印制电路板30之间的空隙处可以设置第二电子器件42，不影响第二印制电路板30的布线效率和空间。从而可以在增加框架板13与第一印制电路板10的支撑效果的同时，提高电子组件100中各器件的集成度，实现电子组件100小型化。
此外，本申请实施例中通过增加框架板13与第一印制电路板10的连接面积，来提高框架板13与第一印制电路板10的连接效果。与通过在框架板13与第一印制电路 板10之间点胶，以提高框架板13与第一印制电路板10的连接效果的结构相比，本申请实施例采用的结构在将电子组件100返修时，不存在去除点胶的问题，操作更为方便。与图9所示的通过增加框架板13的宽度(图9中框架板13两侧边缘的部分)作为对电路功能无影响的非功能区，来提高框架板13与第一印制电路板10的连接效果的结构相比，本申请实施例由于第一加强件20的下方可以设置第二电子器件42，第二电子器件42无需向边缘拓展，电子组件100中各器件的集成度更高。
实施例二
实施例二与实施例一相同的地方在于：框架板13和第一加强件20的结构均相同。
实施例二与实施例一不同的地方在于：电子组件100还包括第二加强件。
如图10a所示，电子组件100还包括第二加强件50，第二加强件50位于框架板13的侧面，且第二加强件50靠近第二印制电路板30设置；第二加强件50与框架板13和第二印制电路板30均连接。
第二加强件50的结构，可以与上述实施例一中示意的任一种第一加强件20的结构相同。例如，电子组件100包括的第二加强件50可以为一个。在这种情况下，从俯视图上看，第二加强件50的结构可以与图5a中示意的第一加强件20的结构相同，绕框架板13一周设置。第二加强件50的结构也与图6a中示意的第一加强件20的结构相同，为块状结构。电子组件100包括的第二加强件50也可以为多个。在这种情况下，从俯视图上看，第二加强件50的结构可以与图7a中示意的第一加强件20的结构相同，为块状结构。
关于第二加强件50的截面形状，如图10a所示，第二加强件50与第一加强件20的结构相同，第二加强件50为板状结构。或者，如图10b所示，第二加强件50与第一加强件20的结构相同，第二加强件50可以为阶梯状结构。或者，如图10c所示，第二加强件50与第一加强件20的结构相同，第二加强件50可以为搭接结构。第二加强件50与第一加强件20的区别在于，第一加强件20与第一印制电路板10连接，第二加强件50与第二印制电路板30连接，对于第二加强件50的特征，此处不再赘述，可参考上述实施例一中关于第一加强件20的描述。
其中，第二加强件50的材料和制备工艺，可以与第一加强件20相同。第二加强件50与框架板13的连接方式，也可以与第一加强件20与框架板13的连接方式相同。第二加强件50与第二印制电路板30的连接方式，也可以与第一加强件20与第一印制电路板10的连接方式相同。
本实施例中，通过在第一印制电路板10与框架板13之间设置第一加强件20，在第二印制电路板30与框架板13之间设置第二加强件50，可以分别提高第一印制电路板10与框架板13的连接可靠性和第二印制电路板30与框架板13的连接可靠性。无论第一印制电路板10和第二印制电路板30哪个是主板，哪个是子板，三明治印刷电路板装配单板的可靠性的比较高，可提高产品的可信赖性。
实施例三
实施例三与实施例一的相同之处在于，第一加强件20的结构相同。
实施例三与实施例一的不同之处在于，框架板13的结构不同。
如图3c所示，框架板13的形状为板状结构，且框架板13具有沿垂直于第一印制 电路板的第一方向X贯穿框架板13的开口131。在这种情况下，框架板13的外轮廓的多个面为框架板13的侧面a，开口131的轮廓(框架板13的内轮廓)的各个面也为框架板13的侧面a。
本申请实施例中，第一加强件20的结构与实施例一中第一加强件20的结构可以相同，但在本实施例中，第一加强件20不仅可以设置在框架板13的外轮廓所在侧，如图11所示，第一加强件20还可以设置在框架板13的内轮廓所在侧。此处，对第一加强件20的结构不再赘述，可以参考实施例一中关于第一加强件20的描述，重点对第一加强件20的设置位置进行说明。
在电子组件100包括一个第一加强件20的情况下：
由于第一加强件20在框架板13外围时，第一加强件20便于制备。在一些实施例中，如图12a所示，第一加强件20绕框架板13的外轮廓一周。或者，如图12b所示，第一加强件20设置在框架板13的外侧。
由于第一加强件20在框架板13内侧时，无需增大框架板13的外轮廓，从而减小框架板13的尺寸。在一些实施例中，如图12c所示，第一加强件20绕框架板13的内轮廓一周。或者，如图12d所示，第一加强件20也可以设置在框架板13的内侧。
在电子组件100包括多个第一加强件20的情况下：
为了便于制备第一加强件20，在一些实施例中，如图13a所示，多个第一加强件20均设置在框架板13的外围。
为了减小框架板13的尺寸，在一些实施例中，如图13b所示，多个第一加强件20均设置在框架板13的内侧。
其中，第一加强件20可以是任意形状的块状结构。由于三角形具有稳定性，因此，为了增强第一加强件20与框架板13连接的稳定性，如图13b所示，在一些实施例中，第一加强件20设置在框架板13的拐角处，与框架板13的两个侧面连接。
此外，第一加强件20可以包括搭接的多层加强部21。由于框架板13上具有开口131，因此，开口131位置处未与第一印制电路板10连接，导致框架板13容易与第一印制电路板10脱离。如图13c所示，在一些实施例中，包括多层加强部21的第一加强件20，其加强部21与电子组件100中的另一第一加强件20搭接。当然，在多个第一加强件20包括多层加强部21的情况下，部分加强部21也可以不与其他第一加强件20搭接。
为了能够根据第一印制电路板10上的第一电子器件41和第二印制电路板30上的第二电子器件41的设置位置，来调整第一加强件20的布局。在一些实施例中，如图13d所示，多个第一加强件20中部分设置在框架板13的内侧，部分设置在框架板13的外侧。
其中，图13d中示意了多种结构的第一加强件20，也就是说，电子组件100包括的多个第一加强件20的结构不一定相同，第一加强件20可以是上述实施例一中示意的任一种第一加强件20的结构。
本申请实施例中，如图11所示，在电子组件100包括的多个第一加强件20均位于框架板13的开口内的情况下，即使框架板13的外轮廓与第一印制电路板10的外轮廓重合，第一加强件20依旧可以对第一印制电路板10起到稳固效果。而在框架板13 的外轮廓与第一印制电路板10的外轮廓重合的情况下，无法通过增加点胶来提高框架板13与第一印制电路板10的稳固性。
实施例四
实施例四与实施例三的相同之处在于，框架板13的结构相同。
实施例四与实施例一的不同之处在于，位于开口131内的第一加强件20的结构不同。
如图14a和图14b所示，电子组件100包括一个位于开口131内的第一加强件20，第一加强件20与框架板13的多个侧面a相连接，将开口131划分为多个区域。
也就是说，从俯视图上来看，第一加强件20为网状结构，将开口131划分为多个区域，但对于划分出的各个区域的形状、大小并不限定，图14a和图14b仅为一种示意。
需要说明的是，从截面形状来看，本实施例中第一加强件20的截面形状与实施例一中第一加强件20的截面形状可以相同。如图14c(沿图14b中B1-B2向的剖视图)所示，第一加强件20为板状结构。或者，如图14d(沿图14b中B1-B2向的剖视图)所示，第一加强件20为阶梯状结构。或者，如图14e所示，第一加强件20为搭接结构。
此处，如图14e所示，在第一加强件20的跨度较大时，中间部位容易下沉，通过将第一加强件20设置为搭接结构，使得靠近第一印制电路板10的加强部21相当于桥，相对远离第一印制电路板10的加强部21相当于桥墩，从而提高第一加强件20与第一印制电路板10的连接效果。
需要说明的是，框架板13的外围依然可以设置实施例一所示的任一种第一加强件20。
本实施例提供的电子组件100，可根据第一印制电路板10上第一电子器件41和第二印制电路板30第二电子器件42的排布情况，调整第一加强件20的形状，以最大程度的增加第一加强件20与第一印制电路板10的接触面积，从而提高框架板13对第一印制电路板10的支撑效果。
实施例五
实施例五与实施例三和实施例四的相同之处在于：框架板13和第一加强件20的结构相同。
实施例五与实施例三和实施例四的不同之处在于：电子组件100还包括第二加强件50。
如图15所示，电子组件100还包括第二加强件50，第二加强件50位于框架板13的侧面，且第二加强件50靠近第二印制电路板30设置；第二加强件50与框架板13和第二印制电路板30均连接。
第二加强件50的结构，可以与上述实施例三和实施例四中示意的第一加强件20的结构相同。
以上，仅为本申请的具体实施方式，但申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (15)

  1. 一种电子组件，其特征在于，包括：
    框架板，具有第一侧；
    第一印制电路板，位于所述框架板的所述第一侧，且与所述框架板连接；
    至少一个第一加强件；所述第一加强件位于所述框架板的侧面，且靠近所述第一印制电路板设置；所述第一加强件与所述框架板和所述第一印制电路板均连接；
    其中，所述框架板的所述侧面与所述第一印制电路板相交。
  2. 根据权利要求1所述的电子组件，其特征在于，所述至少一个第一加强件中的至少部分，绕所述框架板的轮廓一周。
  3. 根据权利要求1所述的电子组件，其特征在于，所述至少一个第一加强件中的至少部分为块状结构，且每个所述第一加强件与所述框架板的至少一个侧面相连接。
  4. 根据权利要求1所述的电子组件，其特征在于，所述框架板的形状为板状结构。
  5. 根据权利要求4所述的电子组件，其特征在于，所述框架板具有沿垂直于所述第一印制电路板的方向贯穿所述框架板的开口。
  6. 根据权利要求5所述的电子组件，其特征在于，所述开口内设置有一所述第一加强件，该第一加强件与所述框架板的多个侧面相连接，将所述开口划分为多个区域。
  7. 根据权利要求5所述的电子组件，其特征在于，所述至少一个第一加强件中的至少部分，位于所述开口内。
  8. 根据权利要求2或3或6所述的电子组件，其特征在于，所述至少一个第一加强件中的至少部分，包括层叠设置的多个加强部；
    相邻所述加强部相连接，且沿远离所述第一印制电路板的方向，所述加强部的横截面积逐渐减小；多个所述加强部中的至少部分与所述框架板连接，最靠近所述第一印制电路板的所述加强部与所述第一印制电路板连接。
  9. 根据权利要求2或3或6所述的电子组件，其特征在于，所述至少一个第一加强件中的至少部分，包括搭接的多层加强部；
    相互搭接的所述加强部相连接，且每层所述加强部均与所述第一印制电路板连接。
  10. 根据权利要求1所述的电子组件，其特征在于，所述第一加强件与所述框架板为一体结构。
  11. 根据权利要求2所述的电子组件，其特征在于，所述第一加强件沿垂直于所述第一印制电路板的方向上的厚度为0.2-0.5mm；所述第一加强件的宽度为0.2-2.0mm。
  12. 根据权利要求8所述的电子组件，其特征在于，所述加强部沿垂直于所述第一印制电路板的方向上的厚度为0.2-0.5mm。
  13. 根据权利要求2或3或6所述的电子组件，其特征在于，所述第一加强件与所述第一印制电路板焊接，相邻焊点之间的间距为0.4mm-0.8mm，焊点的宽度为0.3mm-0.6mm。
  14. 根据权利要求1所述的电子组件，其特征在于，所述框架板还具有与所述第一侧相对的第二侧；
    所述电子组件还包括第二印制电路板和第二加强件；
    所述第二印制电路板位于所述框架板的所述第二侧，且与所述框架板连接；
    所述第二加强件位于所述框架板的所述侧面，且靠近所述第二印制电路板设置；所述第二加强件与所述框架板和所述第二印制电路板均连接。
  15. 一种电子设备，其特征在于，包括权利要求1-14任一项所述的电子组件。
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