WO2021145268A1 - Board connector, circuit board, and connector device - Google Patents
Board connector, circuit board, and connector device Download PDFInfo
- Publication number
- WO2021145268A1 WO2021145268A1 PCT/JP2021/000342 JP2021000342W WO2021145268A1 WO 2021145268 A1 WO2021145268 A1 WO 2021145268A1 JP 2021000342 W JP2021000342 W JP 2021000342W WO 2021145268 A1 WO2021145268 A1 WO 2021145268A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- board
- mounting surface
- solder
- connection
- substrate
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The present invention makes it possible to avoid cost increases due to coplanarity without decreasing connection reliability. A board connector (20) is provided with: a housing (21) fixed to a circuit board (10); and a plurality of terminal fittings (25) that have board connection sections (28). The plurality of terminal fittings (25) are attached to the housing (21) so that the board connection sections (28) are arranged along a mounting surface (11) of the circuit board (10). Solder (S) for connecting the board connection sections (28) to the mounting surface (11) is affixed without contacting the mounting surface (11). The thickness dimension of the solder (S) is set individually for each of the plurality of board connection sections (28) on the basis of height difference between one board connection section (28), of the plurality of board connection sections (28) arranged along the mounting surface (11), that serves as a reference, and the board connection sections (28) other than the board connection section (28) that serves as a reference.
Description
本開示は、基板用コネクタ、回路基板及びコネクタ装置に関するものである。
This disclosure relates to a board connector, a circuit board, and a connector device.
特許文献１には、ハウジングと、ハウジングに取り付けた複数のコンタクトとを有する表面実装コネクタが開示されている。表面実装コネクタにおいては、基板に対するコンタクトのコプラナリティの向上が重要であるが、コプラナリティを高めるためには、コンタクトの寸法精度や組付け精度等を高める必要があるため、製造コストが高くなる。特許文献１に開示された表面実装コネクタは、コプラナリティに起因するコストアップを回避するため、各コンタクトに取り付けたフレキシブル端子を、半田付けによって基板に接続している。コンタクトと基板との間に介在させたフレキシブル端子が弾性変形することにより、基板に対するコンタクトの整列位置のバラツキが吸収される。
Patent Document 1 discloses a surface mount connector having a housing and a plurality of contacts attached to the housing. In a surface mount connector, it is important to improve the coplanarity of the contact with respect to the substrate. However, in order to improve the coplanarity, it is necessary to improve the dimensional accuracy and the assembly accuracy of the contact, so that the manufacturing cost is high. In the surface mount connector disclosed in Patent Document 1, in order to avoid cost increase due to coplanarity, flexible terminals attached to each contact are connected to the substrate by soldering. The elastic deformation of the flexible terminal interposed between the contact and the substrate absorbs the variation in the alignment position of the contact with respect to the substrate.
上記の表面実装コネクタでは、コンタクトと基板との間に、コンタクトとは別部品であるフレキシブル端子を介在されているため、コンタクトと基板との間において接点の数が増え、接触信頼性が低下するという問題がある。
In the above surface mount connector, since a flexible terminal which is a separate component from the contact is interposed between the contact and the board, the number of contacts increases between the contact and the board, and the contact reliability decreases. There is a problem.
本開示のコネクタ装置、基板用コネクタ及び回路基板は、上記のような事情に基づいて完成されたものであって、接触信頼性を低下させることなく、コプラナリティに起因するコストアップを回避することを目的とする。
The connector device, the connector for the substrate, and the circuit board of the present disclosure are completed based on the above circumstances, and the cost increase due to coplanarity can be avoided without deteriorating the contact reliability. The purpose.
第１の開示の基板用コネクタは、
回路基板に固定されるハウジングと、
基板接続部を有する複数の端子金具とを備え、
前記複数の端子金具は、前記基板接続部が前記回路基板の実装面に沿って並ぶように前記ハウジングに取り付けられ、
前記基板接続部には、前記基板接続部を前記実装面に接続するための半田が、前記実装面と非接触の状態で固着されており、
前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、前記複数の基板接続部毎に個別に設定されている。 The board connector of the first disclosure is
The housing fixed to the circuit board and
Equipped with a plurality of terminal fittings having a board connection part,
The plurality of terminal fittings are attached to the housing so that the board connection portions are arranged along the mounting surface of the circuit board.
Solder for connecting the board connecting portion to the mounting surface is fixed to the board connecting portion in a non-contact state with the mounting surface.
The thickness dimension of the solder is the height of the board connection portion that serves as a reference among the plurality of board connection portions arranged along the mounting surface and the board connection portion other than the reference board connection portion. Based on the difference, it is individually set for each of the plurality of board connection portions.
回路基板に固定されるハウジングと、
基板接続部を有する複数の端子金具とを備え、
前記複数の端子金具は、前記基板接続部が前記回路基板の実装面に沿って並ぶように前記ハウジングに取り付けられ、
前記基板接続部には、前記基板接続部を前記実装面に接続するための半田が、前記実装面と非接触の状態で固着されており、
前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、前記複数の基板接続部毎に個別に設定されている。 The board connector of the first disclosure is
The housing fixed to the circuit board and
Equipped with a plurality of terminal fittings having a board connection part,
The plurality of terminal fittings are attached to the housing so that the board connection portions are arranged along the mounting surface of the circuit board.
Solder for connecting the board connecting portion to the mounting surface is fixed to the board connecting portion in a non-contact state with the mounting surface.
The thickness dimension of the solder is the height of the board connection portion that serves as a reference among the plurality of board connection portions arranged along the mounting surface and the board connection portion other than the reference board connection portion. Based on the difference, it is individually set for each of the plurality of board connection portions.
第２の開示の回路基板は、
実装面を有し、
前記実装面には、ハウジングに取り付けられた複数の端子金具の基板接続部が、前記実装面に沿って並んだ状態で半田を介して接続されるようになっている回路基板であって、
前記実装面において前記複数の基板接続部と個別に対向する複数の接続位置には、前記半田が、前記基板接続部と非接触の状態で固着されており、
前記複数の接続位置における前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、個別に設定されている。 The circuit board of the second disclosure is
Has a mounting surface,
A circuit board in which board connection portions of a plurality of terminal fittings attached to a housing are connected to the mounting surface via solder in a state of being arranged along the mounting surface.
The solder is fixed to the plurality of connection positions individually facing the plurality of board connection portions on the mounting surface in a non-contact state with the substrate connection portions.
The thickness dimension of the solder at the plurality of connection positions is such that the substrate connection portion serving as a reference among the plurality of substrate connection portions arranged along the mounting surface and the substrate connection portion other than the reference substrate connection portion. It is set individually based on the height difference from the board connection part.
実装面を有し、
前記実装面には、ハウジングに取り付けられた複数の端子金具の基板接続部が、前記実装面に沿って並んだ状態で半田を介して接続されるようになっている回路基板であって、
前記実装面において前記複数の基板接続部と個別に対向する複数の接続位置には、前記半田が、前記基板接続部と非接触の状態で固着されており、
前記複数の接続位置における前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、個別に設定されている。 The circuit board of the second disclosure is
Has a mounting surface,
A circuit board in which board connection portions of a plurality of terminal fittings attached to a housing are connected to the mounting surface via solder in a state of being arranged along the mounting surface.
The solder is fixed to the plurality of connection positions individually facing the plurality of board connection portions on the mounting surface in a non-contact state with the substrate connection portions.
The thickness dimension of the solder at the plurality of connection positions is such that the substrate connection portion serving as a reference among the plurality of substrate connection portions arranged along the mounting surface and the substrate connection portion other than the reference substrate connection portion. It is set individually based on the height difference from the board connection part.
第３の開示のコネクタ装置は、
回路基板と、
前記回路基板に固定されたハウジングと、
基板接続部を有し、前記ハウジングに取り付けられた複数の端子金具とを備え、
前記回路基板の実装面に沿って並ぶ複数の前記基板接続部は、半田を介して前記実装面に接続され、
前記実装面と前記基板接続部との間における前記半田の厚さ寸法は、各々の前記基板接続部毎に、前記実装面と前記基板接続部との間隔と同じ寸法となるように個別に設定されており、
前記基板接続部の並び方向における前記半田の幅寸法は、前記複数の基板接続部の相互間で同じ寸法に設定されている。 The connector device of the third disclosure is
With the circuit board
The housing fixed to the circuit board and
It has a board connection, and is equipped with a plurality of terminal fittings attached to the housing.
A plurality of the board connection portions arranged along the mounting surface of the circuit board are connected to the mounting surface via solder.
The thickness dimension of the solder between the mounting surface and the board connecting portion is individually set for each of the board connecting portions so as to have the same dimension as the distance between the mounting surface and the board connecting portion. Has been
The width dimension of the solder in the arrangement direction of the substrate connecting portions is set to be the same dimension between the plurality of substrate connecting portions.
回路基板と、
前記回路基板に固定されたハウジングと、
基板接続部を有し、前記ハウジングに取り付けられた複数の端子金具とを備え、
前記回路基板の実装面に沿って並ぶ複数の前記基板接続部は、半田を介して前記実装面に接続され、
前記実装面と前記基板接続部との間における前記半田の厚さ寸法は、各々の前記基板接続部毎に、前記実装面と前記基板接続部との間隔と同じ寸法となるように個別に設定されており、
前記基板接続部の並び方向における前記半田の幅寸法は、前記複数の基板接続部の相互間で同じ寸法に設定されている。 The connector device of the third disclosure is
With the circuit board
The housing fixed to the circuit board and
It has a board connection, and is equipped with a plurality of terminal fittings attached to the housing.
A plurality of the board connection portions arranged along the mounting surface of the circuit board are connected to the mounting surface via solder.
The thickness dimension of the solder between the mounting surface and the board connecting portion is individually set for each of the board connecting portions so as to have the same dimension as the distance between the mounting surface and the board connecting portion. Has been
The width dimension of the solder in the arrangement direction of the substrate connecting portions is set to be the same dimension between the plurality of substrate connecting portions.
本開示によれば、接触信頼性を低下させることなく、コプラナリティに起因するコストアップを回避することができる。
According to the present disclosure, it is possible to avoid the cost increase due to coplanarity without lowering the contact reliability.
［本開示の実施形態の説明］
最初に本開示の実施形態を列記して説明する。
第１の開示の基板用コネクタは、
（１）回路基板に固定されるハウジングと、基板接続部を有する複数の端子金具とを備え、前記複数の端子金具は、前記基板接続部が前記回路基板の実装面に沿って並ぶように前記ハウジングに取り付けられ、前記基板接続部には、前記基板接続部を前記実装面に接続するための半田が、前記実装面と非接触の状態で固着されており、前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、前記複数の基板接続部毎に個別に設定されている。 [Explanation of Embodiments of the present disclosure]
First, the embodiments of the present disclosure will be listed and described.
The board connector of the first disclosure is
(1) A housing fixed to a circuit board and a plurality of terminal fittings having a board connection portion are provided, and the plurality of terminal fittings are said so that the board connection portions are lined up along a mounting surface of the circuit board. A solder for connecting the board connection portion to the mounting surface is fixed to the board connection portion attached to the housing in a non-contact state with the mounting surface, and the thickness dimension of the solder is determined. Based on the height difference between the board connection portion that serves as a reference among the plurality of board connection portions arranged along the mounting surface and the board connection portion other than the reference board connection portion, the plurality of the board connection portions. It is set individually for each board connection.
最初に本開示の実施形態を列記して説明する。
第１の開示の基板用コネクタは、
（１）回路基板に固定されるハウジングと、基板接続部を有する複数の端子金具とを備え、前記複数の端子金具は、前記基板接続部が前記回路基板の実装面に沿って並ぶように前記ハウジングに取り付けられ、前記基板接続部には、前記基板接続部を前記実装面に接続するための半田が、前記実装面と非接触の状態で固着されており、前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、前記複数の基板接続部毎に個別に設定されている。 [Explanation of Embodiments of the present disclosure]
First, the embodiments of the present disclosure will be listed and described.
The board connector of the first disclosure is
(1) A housing fixed to a circuit board and a plurality of terminal fittings having a board connection portion are provided, and the plurality of terminal fittings are said so that the board connection portions are lined up along a mounting surface of the circuit board. A solder for connecting the board connection portion to the mounting surface is fixed to the board connection portion attached to the housing in a non-contact state with the mounting surface, and the thickness dimension of the solder is determined. Based on the height difference between the board connection portion that serves as a reference among the plurality of board connection portions arranged along the mounting surface and the board connection portion other than the reference board connection portion, the plurality of the board connection portions. It is set individually for each board connection.
第１の開示の構成によれば、実装面と基板接続部との間における半田の厚さ寸法は、実装面に沿って並ぶ複数の基板接続部のうち１つの基準となる基板接続部と、基準となる基板接続部以外の基板接続部との高低差に基づいて、複数の基板接続部毎に個別に設定されているので、コプラナリティが低くても実装面と基板接続部とを確実に接触させることができる。よって、接触信頼性を低下させることなく、コプラナリティに起因するコストアップを回避することができる。
According to the configuration of the first disclosure, the thickness dimension of the solder between the mounting surface and the board connecting portion is determined by determining the substrate connecting portion as a reference among a plurality of board connecting portions arranged along the mounting surface. Since it is set individually for each of multiple board connection parts based on the height difference from the board connection part other than the reference board connection part, the mounting surface and the board connection part are surely contacted even if the coplanarity is low. Can be made to. Therefore, it is possible to avoid the cost increase due to coplanarity without lowering the contact reliability.
第２の開示の回路基板は、
（２）実装面を有し、前記実装面には、ハウジングに取り付けられた複数の端子金具の基板接続部が、前記実装面に沿って並んだ状態で半田を介して接続されるようになっている回路基板であって、前記実装面において前記複数の基板接続部と個別に対向する複数の接続位置には、前記半田が、前記基板接続部と非接触の状態で固着されており、前記複数の接続位置における前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、個別に設定されている。 The circuit board of the second disclosure is
(2) It has a mounting surface, and board connection portions of a plurality of terminal fittings attached to the housing are connected to the mounting surface via solder in a state of being lined up along the mounting surface. The solder is fixed to a plurality of connection positions individually facing the plurality of board connection portions on the mounting surface in a non-contact state with the substrate connection portion. The thickness dimension of the solder at the plurality of connection positions is the substrate connection portion that serves as a reference among the plurality of substrate connection portions that are lined up along the mounting surface, and the substrate other than the substrate connection portion that serves as the reference. It is set individually based on the height difference from the connection part.
（２）実装面を有し、前記実装面には、ハウジングに取り付けられた複数の端子金具の基板接続部が、前記実装面に沿って並んだ状態で半田を介して接続されるようになっている回路基板であって、前記実装面において前記複数の基板接続部と個別に対向する複数の接続位置には、前記半田が、前記基板接続部と非接触の状態で固着されており、前記複数の接続位置における前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、個別に設定されている。 The circuit board of the second disclosure is
(2) It has a mounting surface, and board connection portions of a plurality of terminal fittings attached to the housing are connected to the mounting surface via solder in a state of being lined up along the mounting surface. The solder is fixed to a plurality of connection positions individually facing the plurality of board connection portions on the mounting surface in a non-contact state with the substrate connection portion. The thickness dimension of the solder at the plurality of connection positions is the substrate connection portion that serves as a reference among the plurality of substrate connection portions that are lined up along the mounting surface, and the substrate other than the substrate connection portion that serves as the reference. It is set individually based on the height difference from the connection part.
第２の開示の構成によれば、実装面の複数の接続位置においては、半田の厚さ寸法が、実装面に沿って並ぶ複数の基板接続部のうち１つの基準となる基板接続部と、基準となる基板接続部以外の基板接続部との高低差に基づいて、個別に設定されているので、コプラナリティが低くても実装面と基板接続部とを確実に接触させることができる。よって、接触信頼性を低下させることなく、コプラナリティに起因するコストアップを回避することができる。
According to the configuration of the second disclosure, at a plurality of connection positions on the mounting surface, the thickness dimension of the solder is a substrate connection portion that serves as a reference among the plurality of board connection portions arranged along the mounting surface. Since the individual settings are made based on the height difference from the board connection portion other than the reference board connection portion, the mounting surface and the board connection portion can be reliably brought into contact with each other even if the coplanarity is low. Therefore, it is possible to avoid the cost increase due to coplanarity without lowering the contact reliability.
第３の開示のコネクタ装置は、
（３）回路基板と、前記回路基板に固定されたハウジングと、基板接続部を有し、前記ハウジングに取り付けられた複数の端子金具とを備え、前記回路基板の実装面に沿って並ぶ複数の前記基板接続部は、半田を介して前記実装面に接続され、前記実装面と前記基板接続部との間における前記半田の厚さ寸法は、各々の前記基板接続部毎に、前記実装面と前記基板接続部との間隔と同じ寸法となるように個別に設定されており、前記基板接続部の並び方向における前記半田の幅寸法は、前記複数の基板接続部の相互間で同じ寸法に設定されている。 The connector device of the third disclosure is
(3) A plurality of circuit boards, a housing fixed to the circuit board, a plurality of terminal fittings having a board connection portion and attached to the housing, and arranged along the mounting surface of the circuit board. The board connection portion is connected to the mounting surface via solder, and the thickness dimension of the solder between the mounting surface and the board connection portion is set to the mounting surface for each of the board connection portions. It is individually set to have the same dimension as the distance from the board connection portion, and the width dimension of the solder in the arrangement direction of the board connection portion is set to the same dimension between the plurality of board connection portions. Has been done.
（３）回路基板と、前記回路基板に固定されたハウジングと、基板接続部を有し、前記ハウジングに取り付けられた複数の端子金具とを備え、前記回路基板の実装面に沿って並ぶ複数の前記基板接続部は、半田を介して前記実装面に接続され、前記実装面と前記基板接続部との間における前記半田の厚さ寸法は、各々の前記基板接続部毎に、前記実装面と前記基板接続部との間隔と同じ寸法となるように個別に設定されており、前記基板接続部の並び方向における前記半田の幅寸法は、前記複数の基板接続部の相互間で同じ寸法に設定されている。 The connector device of the third disclosure is
(3) A plurality of circuit boards, a housing fixed to the circuit board, a plurality of terminal fittings having a board connection portion and attached to the housing, and arranged along the mounting surface of the circuit board. The board connection portion is connected to the mounting surface via solder, and the thickness dimension of the solder between the mounting surface and the board connection portion is set to the mounting surface for each of the board connection portions. It is individually set to have the same dimension as the distance from the board connection portion, and the width dimension of the solder in the arrangement direction of the board connection portion is set to the same dimension between the plurality of board connection portions. Has been done.
第３の開示の構成によれば、実装面と基板接続部との間における半田の厚さ寸法は、各々の基板接続部毎に、実装面と基板接続部との間隔と同じ寸法となるように個別に設定されているので、コプラナリティが低くても実装面と基板接続部とを確実に接触させることができる。コプラナリティを高める必要がないので、コプラナリティを高めることに起因してコストがアップすることを回避できる。基板接続部の並び方向における半田の幅寸法は、複数の基板接続部の相互間で同じ寸法に設定されているので、隣り合う基板接続部同士が短絡するおそれがない。よって、接触信頼性を低下させることなく、コプラナリティに起因するコストアップを回避することができる。
According to the configuration of the third disclosure, the thickness dimension of the solder between the mounting surface and the board connecting portion is the same as the distance between the mounting surface and the board connecting portion for each board connecting portion. Since they are individually set to, the mounting surface and the board connection portion can be reliably brought into contact with each other even if the coplanarity is low. Since it is not necessary to increase the coplanarity, it is possible to avoid an increase in cost due to the increase in coplanarity. Since the width dimension of the solder in the arrangement direction of the board connection portions is set to the same dimension between the plurality of board connection portions, there is no possibility that the adjacent board connection portions will be short-circuited. Therefore, it is possible to avoid the cost increase due to coplanarity without lowering the contact reliability.
［本開示の実施形態の詳細］
［実施例１］
本開示のコネクタ装置Ａを具体化した実施例１を、図１～図３を参照して説明する。なお、本発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。本実施例１において、前後の方向については、図１における右方を前方と定義する。上下の方向については、図１～３にあらわれる向きを、そのまま上方、下方と定義する。 [Details of Embodiments of the present disclosure]
[Example 1]
The first embodiment of the connector device A of the present disclosure will be described with reference to FIGS. 1 to 3. It should be noted that the present invention is not limited to these examples, and is indicated by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims. In the first embodiment, the right side in FIG. 1 is defined as the front in the front-back direction. Regarding the vertical direction, the directions appearing in FIGS. 1 to 3 are defined as upward and downward as they are.
［実施例１］
本開示のコネクタ装置Ａを具体化した実施例１を、図１～図３を参照して説明する。なお、本発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。本実施例１において、前後の方向については、図１における右方を前方と定義する。上下の方向については、図１～３にあらわれる向きを、そのまま上方、下方と定義する。 [Details of Embodiments of the present disclosure]
[Example 1]
The first embodiment of the connector device A of the present disclosure will be described with reference to FIGS. 1 to 3. It should be noted that the present invention is not limited to these examples, and is indicated by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims. In the first embodiment, the right side in FIG. 1 is defined as the front in the front-back direction. Regarding the vertical direction, the directions appearing in FIGS. 1 to 3 are defined as upward and downward as they are.
コネクタ装置Ａは、回路基板１０と、回路基板１０の実装面１１（図１，２における上面）に表面実装される基板用コネクタ２０とを備えている。回路基板１０は平面からなる実装面１１を有する。実装面１１には、回路（図示省略）が形成されている。実装面１１のうち後述する複数の基板接続部２８と個別に対向する複数の部位は、接続位置１２となっている。
The connector device A includes a circuit board 10 and a board connector 20 surface-mounted on the mounting surface 11 (upper surface in FIGS. 1 and 2) of the circuit board 10. The circuit board 10 has a mounting surface 11 made of a flat surface. A circuit (not shown) is formed on the mounting surface 11. A plurality of portions of the mounting surface 11 that individually face the plurality of board connecting portions 28, which will be described later, are connected positions 12.
基板用コネクタ２０は、合成樹脂製のハウジング２１と、ハウジング２１に取り付けた複数の端子金具２５とを備えている。図１に示すように、ハウジング２１は、回路基板１０の実装面１１に対して直角な壁状をなす端子保持部２２と、端子保持部２２の外周縁から前方へ片持ち状に突出したフード部２３とを有する単一部品である。
The board connector 20 includes a housing 21 made of synthetic resin and a plurality of terminal fittings 25 attached to the housing 21. As shown in FIG. 1, the housing 21 has a terminal holding portion 22 having a wall shape perpendicular to the mounting surface 11 of the circuit board 10, and a hood protruding forward from the outer peripheral edge of the terminal holding portion 22 in a cantilever shape. It is a single component having a portion 23.
端子金具２５は、細長い金属線材を曲げ加工して成形されている。端子金具２５は、端子接続部２６と、脚部２７と、基板接続部２８とを有する単一部品である。端子接続部２６は、実装面１１と平行をなし、端子保持部２２の壁面と直角に前後方向に延びている。端子金具２５は、端子接続部２６を端子保持部２２に対して貫通形態で圧入することによって、ハウジング２１に保持されている。端子接続部２６の先端部（前端部）は、端子保持部２２からフード部２３内に突出している。脚部２７は、端子保持部２２の後方、即ちハウジング２１の外部に配されている。脚部２７は、端子接続部２６の基端部（後端部）から回路基板１０に向かって延出している。
The terminal fitting 25 is formed by bending an elongated metal wire. The terminal fitting 25 is a single component having a terminal connecting portion 26, a leg portion 27, and a board connecting portion 28. The terminal connecting portion 26 is parallel to the mounting surface 11 and extends in the front-rear direction at right angles to the wall surface of the terminal holding portion 22. The terminal fitting 25 is held in the housing 21 by press-fitting the terminal connecting portion 26 into the terminal holding portion 22 in a penetrating manner. The tip (front end) of the terminal connection portion 26 projects from the terminal holding portion 22 into the hood portion 23. The legs 27 are arranged behind the terminal holding portion 22, that is, outside the housing 21. The leg portion 27 extends from the base end portion (rear end portion) of the terminal connection portion 26 toward the circuit board 10.
基板接続部２８は、脚部２７の下端部（端子接続部２６とは上下方向反対側の端部）から実装面１１に沿うように延出した形態である。基板接続部２８の下面は、基板用コネクタ２０を回路基板１０に取り付けたときに実装面１１と対向する対向面２９となっている。ハウジング２１に複数の端子金具２５を取り付けた状態では、複数の端子金具２５に形成されている複数の基板接続部２８が、実装面１１に沿って左右方向（基板接続部２８の長さ方向と直交する方向）に所定ピッチで並列するように配置されている。基板用コネクタ２０を回路基板１０に取り付けた状態では、対向面２９と、実装面１１の接続位置１２との間には、基板接続部２８を実装面１１（回路）に対して導通可能に接続するための半田Ｓが介在している。
The board connection portion 28 has a form extending from the lower end portion of the leg portion 27 (the end portion on the side opposite to the terminal connection portion 26 in the vertical direction) along the mounting surface 11. The lower surface of the board connection portion 28 is a facing surface 29 facing the mounting surface 11 when the board connector 20 is attached to the circuit board 10. In a state where the plurality of terminal fittings 25 are attached to the housing 21, the plurality of board connecting portions 28 formed on the plurality of terminal fittings 25 are arranged in the left-right direction (the length direction of the board connecting portion 28) along the mounting surface 11. They are arranged in parallel at a predetermined pitch (in orthogonal directions). When the board connector 20 is attached to the circuit board 10, the board connection portion 28 is electrically connected to the mounting surface 11 (circuit) between the facing surface 29 and the connection position 12 of the mounting surface 11. The solder S for the purpose is interposed.
図２に示すように、回路基板１０に基板用コネクタ２０を取り付けた状態において、実装面１１と基板接続部２８（対向面２９）との対向間隔は、端子金具２５の寸法公差やハウジング２１に対する端子金具２５の組付け公差等によってバラツキがある。そのため、各接続位置１２に同一量のクリーム半田（図示省略）を塗布し、リフロー炉内でクリーム半田を溶融して基板接続部２８を実装面１１に接続する方法では、実装面１１と基板接続部２８との間の接続信頼性に支障が出るおそれがある。具体的には、実装面１１との対向間隔の大きい基板接続部２８においては、半田Ｓの量が不足して接続不良を来すことが懸念される。実装面１１との対向間隔が小さい基板接続部２８においては、実装面１１と基板接続部２８との間からはみ出した半田Ｓが、隣り合う半田Ｓに接触して短絡することが懸念される。なお、図２では、発明の内容を把握し易くするため、実装面１１と基板接続部２８との対向間隔のバラツキは、誇張して描いている。
As shown in FIG. 2, when the board connector 20 is attached to the circuit board 10, the facing distance between the mounting surface 11 and the board connecting portion 28 (facing surface 29) is based on the dimensional tolerance of the terminal fitting 25 and the housing 21. There are variations due to the assembly tolerance of the terminal fitting 25 and the like. Therefore, in the method of applying the same amount of cream solder (not shown) to each connection position 12, melting the cream solder in the reflow furnace, and connecting the substrate connection portion 28 to the mounting surface 11, the mounting surface 11 and the substrate are connected. There is a possibility that the connection reliability with the unit 28 will be hindered. Specifically, in the substrate connecting portion 28 having a large facing distance from the mounting surface 11, there is a concern that the amount of solder S may be insufficient to cause a connection failure. In the board connecting portion 28 having a small facing distance from the mounting surface 11, there is a concern that the solder S protruding from between the mounting surface 11 and the board connecting portion 28 may come into contact with the adjacent solder S and cause a short circuit. In FIG. 2, in order to make it easier to understand the content of the invention, the variation in the facing distance between the mounting surface 11 and the substrate connecting portion 28 is exaggerated.
実装面１１に対する基板接続部２８の位置のバラツキを吸収するために、本実施例１のコネクタ装置Ａでは、実装面１１からの基板接続部２８の離隔位置、即ち接続位置１２と対向面２９との対向間隔に基づいて、半田Ｓの量を各基板接続部２８毎に個別に設定している。具体的には、図３に示すように、治具３０を用いて各対向面２９に適正量の半田Ｓを塗着させる。治具３０の上面３１は、実装面１１と平行な水平面となっている。治具３０には、複数の基板接続部２８を個別に収容するための複数の溝部３２が基板接続部２８と同じ配置で並ぶように形成されている。各溝部３２の上端は、治具３０の上面３１に開口している。なお、図３では、発明の内容を把握し易くするため、溝部３２内における基板接続部２８の高さのバラツキは、誇張して描いている。
In order to absorb the variation in the position of the board connecting portion 28 with respect to the mounting surface 11, in the connector device A of the first embodiment, the separation position of the board connecting portion 28 from the mounting surface 11, that is, the connection position 12 and the facing surface 29 The amount of solder S is individually set for each board connecting portion 28 based on the facing distance between the two. Specifically, as shown in FIG. 3, a jig 30 is used to coat each facing surface 29 with an appropriate amount of solder S. The upper surface 31 of the jig 30 is a horizontal plane parallel to the mounting surface 11. The jig 30 is formed so that a plurality of groove portions 32 for individually accommodating the plurality of substrate connecting portions 28 are arranged in the same arrangement as the substrate connecting portions 28. The upper end of each groove 32 is open to the upper surface 31 of the jig 30. In FIG. 3, in order to make it easier to understand the content of the invention, the variation in the height of the substrate connecting portion 28 in the groove portion 32 is exaggerated.
半田Ｓを基板接続部２８に塗着する際には、基板用コネクタ２０を上下反転させ、複数の基板接続部２８を複数の溝部３２に個別に収容する。このとき、治具３０の上面３１と直交する上下方向において、治具３０の上面３１に対するハウジング２１の位置が、回路基板１０に基板用コネクタ２０を取り付けたときの実装面１１に対するハウジング２１の位置と同じ位置となるようにする。これにより、治具３０の上面３１と各基板接続部２８の対向面２９との上下方向の間隔が、回路基板１０に基板用コネクタ２０を取り付けたときの接続位置１２と対向面２９との間隔と同じ寸法となる。
When the solder S is applied to the substrate connecting portion 28, the substrate connector 20 is turned upside down, and the plurality of substrate connecting portions 28 are individually accommodated in the plurality of groove portions 32. At this time, in the vertical direction orthogonal to the upper surface 31 of the jig 30, the position of the housing 21 with respect to the upper surface 31 of the jig 30 is the position of the housing 21 with respect to the mounting surface 11 when the board connector 20 is attached to the circuit board 10. Make sure it is in the same position as. As a result, the vertical distance between the upper surface 31 of the jig 30 and the facing surface 29 of each board connecting portion 28 is the distance between the connection position 12 and the facing surface 29 when the board connector 20 is attached to the circuit board 10. It has the same dimensions as.
このように基板接続部２８を治具３０にセットした状態では、各溝部３２内のうち基板接続部２８よりも上方には、実装面１１に対する基板接続部２８との対向間隔と同じ深さの空きスペース３３が形成される。この空きスペース３３の深さは各基板接続部２８毎に異なっている。各空きスペース３３内には、微少径（数μｍ）の半田ボール（図示省略）が充填される。半田ボールの充填量は、治具３０の上面３１までの高さとする。これにより、実装面１１に対する基板接続部２８の対向間隔に比例した個数の半田ボールが、空きスペース３３内に充填され、各基板接続部２８の対向面２９に塗着される。
In the state where the board connecting portion 28 is set in the jig 30 in this way, the depth of each groove portion 32 above the board connecting portion 28 is the same as the distance between the mounting surface 11 and the substrate connecting portion 28. An empty space 33 is formed. The depth of the empty space 33 is different for each board connection portion 28. Each empty space 33 is filled with a solder ball (not shown) having a very small diameter (several μm). The filling amount of the solder balls is the height up to the upper surface 31 of the jig 30. As a result, a number of solder balls proportional to the distance between the board connecting portions 28 and the mounting surface 11 are filled in the empty space 33 and applied to the facing surfaces 29 of the board connecting portions 28.
実装面１１に沿って並ぶ複数の基板接続部２８のうち、いずれか１つの基板接続部２８を基準の基板接続部２８として設定したときに、基準とした基板接続部２８と、基準とした基板接続部２８以外の他の複数の基板接続部２８との間に高低差（即ち、実装面１１と基板接続部２８との対向間隔のバラツキ）が生じる。上記の治具３０を用いることにより、各基板接続部２８の対向面２９には、実装面１１に対する基板接続部２８の対向間隔に応じた適正な厚さの半田Ｓが塗着される。
When any one of the plurality of board connection portions 28 arranged along the mounting surface 11 is set as the reference substrate connection portion 28, the reference substrate connection portion 28 and the reference substrate A height difference (that is, a variation in the facing distance between the mounting surface 11 and the board connecting portion 28) occurs between the plurality of board connecting portions 28 other than the connecting portion 28. By using the jig 30, solder S having an appropriate thickness corresponding to the distance between the board connecting portions 28 and the mounting surface 11 is applied to the facing surfaces 29 of the substrate connecting portions 28.
半田Ｓを基板接続部２８に塗着した後、基板用コネクタ２０を実装面１１に載置し、各基板接続部２８の半田Ｓを実装面１１の所定の接続位置１２に接触させる。そして、回路基板１０と基板用コネクタ２０をリフロー炉（図示省略）内に搬入することにより、基板接続部２８と実装面１１を半田Ｓを介して接続する。この後は、回路基板１０と基板用コネクタ２０を冷却すれば、コネクタ装置Ａの製造が完了する。
After the solder S is applied to the board connection portion 28, the board connector 20 is placed on the mounting surface 11, and the solder S of each board connection portion 28 is brought into contact with the predetermined connection position 12 of the mounting surface 11. Then, by carrying the circuit board 10 and the board connector 20 into a reflow furnace (not shown), the board connection portion 28 and the mounting surface 11 are connected via the solder S. After that, if the circuit board 10 and the board connector 20 are cooled, the production of the connector device A is completed.
本実施例１のコネクタ装置Ａは、回路基板１０と、基板用コネクタ２０と備えている。基板用コネクタ２０、回路基板１０に固定されたハウジング２１と、基板接続部２８を有し、ハウジング２１に取り付けられた複数の端子金具２５とを備えている。回路基板１０の実装面１１に沿って並ぶ複数の基板接続部２８は、半田Ｓを介して実装面１１に接続されている。実装面１１と基板接続部２８との間における半田Ｓの厚さ寸法は、各々の基板接続部２８毎に、実装面１１と基板接続部２８との間隔と同じ寸法となるように個別に設定されている。基板接続部２８の並び方向における半田Ｓの幅寸法は、複数の基板接続部２８の相互間で同じ寸法に設定されている。
The connector device A of the first embodiment includes a circuit board 10 and a board connector 20. It has a board connector 20, a housing 21 fixed to a circuit board 10, and a board connecting portion 28, and includes a plurality of terminal fittings 25 attached to the housing 21. A plurality of board connecting portions 28 arranged along the mounting surface 11 of the circuit board 10 are connected to the mounting surface 11 via the solder S. The thickness dimension of the solder S between the mounting surface 11 and the board connecting portion 28 is individually set so as to be the same dimension as the distance between the mounting surface 11 and the board connecting portion 28 for each board connecting portion 28. Has been done. The width dimension of the solder S in the arrangement direction of the board connecting portions 28 is set to be the same dimension between the plurality of board connecting portions 28.
コネクタ装置Ａの技術的意義は、次の通りである。実装面１１と基板接続部２８との間における半田Ｓの厚さ寸法を、各々の基板接続部２８毎に、実装面１１と基板接続部２８との間隔と同じ寸法となるように個別に設定したので、実装面１１に対する基板接続部２８のコプラナリティが低くても実装面１１と基板接続部２８とを確実に接触させることができる。基板接続部２８の並び方向における半田Ｓの幅寸法は、複数の基板接続部２８の相互間で同じ寸法に設定されているので、隣り合う基板接続部２８同士が短絡するおそれがない。よって、接触信頼性を低下させることなく、コプラナリティに起因するコストアップを回避することができる。
The technical significance of the connector device A is as follows. The thickness dimension of the solder S between the mounting surface 11 and the board connecting portion 28 is individually set for each board connecting portion 28 so as to have the same dimension as the distance between the mounting surface 11 and the board connecting portion 28. Therefore, even if the coplanarity of the board connecting portion 28 with respect to the mounting surface 11 is low, the mounting surface 11 and the board connecting portion 28 can be reliably brought into contact with each other. Since the width dimension of the solder S in the arrangement direction of the board connecting portions 28 is set to the same dimension between the plurality of board connecting portions 28, there is no possibility that the adjacent board connecting portions 28 are short-circuited. Therefore, it is possible to avoid the cost increase due to coplanarity without lowering the contact reliability.
本実施例１の基板用コネクタ２０は、回路基板１０に固定されるハウジング２１と、基板接続部２８を有する複数の端子金具２５とを備える。複数の端子金具２５は、基板接続部２８が回路基板１０の実装面１１に沿って並ぶようにハウジング２１に取り付けられている。基板接続部２８には、基板接続部２８を実装面１１に接続するための半田Ｓが、実装面１１と非接触の状態で固着されている。半田Ｓの厚さ寸法は、実装面１１に沿って並ぶ複数の基板接続部２８のうち１つの基準となる基板接続部２８と、基準となる基板接続部２８以外の基板接続部２８との高低差に基づいて、複数の基板接続部２８毎に個別に設定されている。
The board connector 20 of the first embodiment includes a housing 21 fixed to the circuit board 10 and a plurality of terminal fittings 25 having a board connecting portion 28. The plurality of terminal fittings 25 are attached to the housing 21 so that the board connection portions 28 are lined up along the mounting surface 11 of the circuit board 10. A solder S for connecting the board connecting portion 28 to the mounting surface 11 is fixed to the board connecting portion 28 in a non-contact state with the mounting surface 11. The thickness dimension of the solder S is the height of the reference board connection portion 28 of one of the plurality of board connection portions 28 arranged along the mounting surface 11 and the substrate connection portion 28 other than the reference board connection portion 28. Based on the difference, each of the plurality of board connection portions 28 is individually set.
半田Ｓの厚さを、各基板接続部２８毎に個別に設定したことにより、実装面１１に対する基板接続部２８のコプラナリティが低くても、実装面１１と基板接続部２８とを確実に接触させることができる。即ち、基板接続部２８と実装面１１との間に介在する半田Ｓの量は、過不足無く適正に設定され、基板接続部２８の並び方向における半田Ｓの幅寸法は、全ての基板接続部２８間でほぼ一定の寸法である。したがって、半田Ｓの量が不足することに起因して、基板接続部２８と実装面１１との接触不良が生じることはない。また、半田Ｓの量が過剰であることに起因して、隣り合う半田Ｓ同士が接触することがないので、端子金具２５間の短絡を防止できる。よって、接触信頼性を低下させることなく、コプラナリティに起因するコストアップを回避することができる。
By individually setting the thickness of the solder S for each board connecting portion 28, even if the coplanarity of the board connecting portion 28 with respect to the mounting surface 11 is low, the mounting surface 11 and the board connecting portion 28 are reliably brought into contact with each other. be able to. That is, the amount of solder S interposed between the board connecting portion 28 and the mounting surface 11 is set appropriately without excess or deficiency, and the width dimension of the solder S in the arrangement direction of the board connecting portion 28 is the width dimension of all the board connecting portions. The dimensions are almost constant between 28. Therefore, poor contact between the board connecting portion 28 and the mounting surface 11 does not occur due to the insufficient amount of solder S. Further, since the adjacent solders S do not come into contact with each other due to the excessive amount of the solder S, a short circuit between the terminal fittings 25 can be prevented. Therefore, it is possible to avoid the cost increase due to coplanarity without lowering the contact reliability.
［実施例２］
本開示のコネクタ装置Ｂを具体化した実施例２を、図４～図５を参照して説明する。本実施例２のコネクタ装置Ｂは、回路基板１０に基板用コネクタ２０を取り付ける前の状態において、半田Ｓを回路基板１０に塗着している。実施例２の回路基板１０は実施例１の回路基板１０と同じ部材である。実施例２の基板用コネクタ２０は、基板接続部２８に半田Ｓが塗着されないという点を除いて、実施例１の基板用コネクタ２０と同一の構成である。実施例１と同じ構成については、同一符号を付し、構造、作用及び効果の説明は省略する。 [Example 2]
Example 2 embodying the connector device B of the present disclosure will be described with reference to FIGS. 4 to 5. In the connector device B of the second embodiment, the solder S is applied to thecircuit board 10 in a state before the board connector 20 is attached to the circuit board 10. The circuit board 10 of the second embodiment is the same member as the circuit board 10 of the first embodiment. The substrate connector 20 of the second embodiment has the same configuration as the substrate connector 20 of the first embodiment except that the solder S is not adhered to the substrate connection portion 28. The same components as those in the first embodiment are designated by the same reference numerals, and the description of the structure, action and effect will be omitted.
本開示のコネクタ装置Ｂを具体化した実施例２を、図４～図５を参照して説明する。本実施例２のコネクタ装置Ｂは、回路基板１０に基板用コネクタ２０を取り付ける前の状態において、半田Ｓを回路基板１０に塗着している。実施例２の回路基板１０は実施例１の回路基板１０と同じ部材である。実施例２の基板用コネクタ２０は、基板接続部２８に半田Ｓが塗着されないという点を除いて、実施例１の基板用コネクタ２０と同一の構成である。実施例１と同じ構成については、同一符号を付し、構造、作用及び効果の説明は省略する。 [Example 2]
Example 2 embodying the connector device B of the present disclosure will be described with reference to FIGS. 4 to 5. In the connector device B of the second embodiment, the solder S is applied to the
回路基板１０の実装面１１に形成された複数の接続位置１２には、微少径（数μｍ）の半田ボール（図示省略）が塗着されている。各接続位置１２に塗着する半田ボールの個数は、実装面１１に沿って並ぶ複数の基板接続部２８のうち１つの基準となる基板接続部２８と、基準となる基板接続部２８以外の基板接続部２８との高低差（即ち、回路基板１０に基板用コネクタ２０を取り付けた状態における実装面１１と基板接続部２８との対向間隔の違い）に基づいて、個別に設定されている。
Solder balls (not shown) having a very small diameter (several μm) are coated on the plurality of connection positions 12 formed on the mounting surface 11 of the circuit board 10. The number of solder balls to be applied to each connection position 12 is the substrate connection portion 28 as a reference among the plurality of substrate connection portions 28 arranged along the mounting surface 11, and the substrates other than the reference substrate connection portion 28. It is individually set based on the height difference from the connection portion 28 (that is, the difference in the facing distance between the mounting surface 11 and the board connection portion 28 when the board connector 20 is attached to the circuit board 10).
基準となる基板接続部２８と、基準となる基板接続部２８以外の基板接続部２８との高低差は、画像解析によって検出される。この検出結果に基づき、実装面１１との対向間隔が大きい基板接続部２８については、半田ボールの塗着個数が比較的多く設定され、実装面１１との対向間隔が小さい基板接続部２８については、半田ボールの塗着個数が比較的少なく設定される。これにより、回路基板１０に基板用コネクタ２０を取り付ける前の状態において、実装面１１に対する基板接続部２８の対向間隔に比例する適正厚さの半田Ｓが、各接続位置１２に塗着される。
The height difference between the reference substrate connection portion 28 and the substrate connection portion 28 other than the reference substrate connection portion 28 is detected by image analysis. Based on this detection result, a relatively large number of solder balls are set for the substrate connection portion 28 having a large facing distance from the mounting surface 11, and the substrate connecting portion 28 having a small facing distance from the mounting surface 11 is set. , The number of solder balls to be applied is set to be relatively small. As a result, in the state before the board connector 20 is attached to the circuit board 10, solder S having an appropriate thickness proportional to the facing distance of the board connecting portion 28 with respect to the mounting surface 11 is applied to each connection position 12.
半田Ｓを回路基板１０に塗着した後、基板用コネクタ２０を実装面１１に載置し、各接続位置１２の半田Ｓに、各接続位置１２と対向する基板接続部２８の対向面２９を接触させる。そして、回路基板１０と基板用コネクタ２０をリフロー炉（図示省略）内に搬入することにより、基板接続部２８と実装面１１を半田Ｓを介して接続する。この後は、回路基板１０と基板用コネクタ２０を冷却すれば、コネクタ装置Ｂの製造が完了する。
After the solder S is applied to the circuit board 10, the board connector 20 is placed on the mounting surface 11, and the solder S at each connection position 12 is provided with the facing surface 29 of the board connecting portion 28 facing each connection position 12. Make contact. Then, by carrying the circuit board 10 and the board connector 20 into a reflow furnace (not shown), the board connection portion 28 and the mounting surface 11 are connected via the solder S. After that, if the circuit board 10 and the board connector 20 are cooled, the production of the connector device B is completed.
本実施例２の回路基板１０の実装面１１には、ハウジング２１に取り付けられた複数の端子金具２５の基板接続部２８が、実装面１１に沿って並んだ状態で半田Ｓを介して接続されるようになっている。実装面１１において複数の基板接続部２８と個別に対向する複数の接続位置１２には、回路基板１０に基板用コネクタ２０を取り付ける前の状態において、半田Ｓが、基板接続部２８と非接触の状態で固着されている。図４に示すように、複数の接続位置１２における半田Ｓの厚さ寸法は、実装面１１に沿って並ぶ複数の基板接続部２８のうち１つの基準となる基板接続部２８と、基準となる基板接続部２８以外の基板接続部２８との高低差に基づいて、個別に設定されている。なお、図４では、発明の内容を把握し易くするため、半田Ｓの厚さの違いを誇張して描いている。
Board connection portions 28 of a plurality of terminal fittings 25 attached to the housing 21 are connected to the mounting surface 11 of the circuit board 10 of the second embodiment via solder S in a state of being lined up along the mounting surface 11. It has become so. At the plurality of connection positions 12 individually facing the plurality of board connection portions 28 on the mounting surface 11, the solder S is not in contact with the substrate connection portions 28 in the state before the board connector 20 is attached to the circuit board 10. It is stuck in the state. As shown in FIG. 4, the thickness dimension of the solder S at the plurality of connection positions 12 is a reference with the board connection portion 28 which is one of the plurality of board connection portions 28 arranged along the mounting surface 11. It is individually set based on the height difference from the board connecting portion 28 other than the board connecting portion 28. In FIG. 4, the difference in the thickness of the solder S is exaggerated in order to make it easier to understand the content of the invention.
接続位置１２に塗布する半田Ｓの厚さを、各接続位置１２と対応する各基板接続部２８毎に個別に設定したので、実装面１１（接続位置１２）に対する基板接続部２８のコプラナリティが低くても、実装面１１と基板接続部２８とを確実に接触させることができる。即ち、基板接続部２８と実装面１１との間に介在する半田Ｓの量は、過不足無く適正に設定され、基板接続部２８の並び方向における半田Ｓの幅寸法は、全ての基板接続部２８間でほぼ一定の寸法である。したがって、半田Ｓの量が不足することに起因して、基板接続部２８と実装面１１との間で接触不良が生じることはない。また、半田Ｓの量が過剰であることに起因して、隣り合う半田Ｓ同士が接触することがないので、端子金具２５間の短絡を防止できる。よって、接触信頼性を低下させることなく、コプラナリティに起因するコストアップを回避することができる。
Since the thickness of the solder S applied to the connection position 12 is individually set for each board connection portion 28 corresponding to each connection position 12, the coplanarity of the board connection portion 28 with respect to the mounting surface 11 (connection position 12) is low. However, the mounting surface 11 and the board connection portion 28 can be reliably brought into contact with each other. That is, the amount of solder S interposed between the board connecting portion 28 and the mounting surface 11 is set appropriately without excess or deficiency, and the width dimension of the solder S in the arrangement direction of the board connecting portion 28 is the width dimension of all the board connecting portions. The dimensions are almost constant between 28. Therefore, poor contact between the board connecting portion 28 and the mounting surface 11 does not occur due to the insufficient amount of solder S. Further, since the adjacent solders S do not come into contact with each other due to the excessive amount of the solder S, a short circuit between the terminal fittings 25 can be prevented. Therefore, it is possible to avoid the cost increase due to coplanarity without lowering the contact reliability.
［実施例３］
本開示のコネクタ装置Ｃを具体化した実施例３を、図６～図７を参照して説明する。本実施例３のコネクタ装置Ｃは、基板接続部２８に対する半田Ｓの塗着厚さを上記実施例１とは異なる形態としたものである。その他の構成については上記実施例１と同じであるため、同じ構成については、同一符号を付し、構造、作用及び効果の説明は省略する。 [Example 3]
Example 3 embodying the connector device C of the present disclosure will be described with reference to FIGS. 6 to 7. In the connector device C of the third embodiment, the coating thickness of the solder S on thesubstrate connecting portion 28 is different from that of the first embodiment. Since other configurations are the same as those in the first embodiment, the same configurations are designated by the same reference numerals, and the description of the structure, action, and effect will be omitted.
本開示のコネクタ装置Ｃを具体化した実施例３を、図６～図７を参照して説明する。本実施例３のコネクタ装置Ｃは、基板接続部２８に対する半田Ｓの塗着厚さを上記実施例１とは異なる形態としたものである。その他の構成については上記実施例１と同じであるため、同じ構成については、同一符号を付し、構造、作用及び効果の説明は省略する。 [Example 3]
Example 3 embodying the connector device C of the present disclosure will be described with reference to FIGS. 6 to 7. In the connector device C of the third embodiment, the coating thickness of the solder S on the
本実施例３のコネクタ装置Ｃは、リフロー工程において基板用コネクタ２０のハウジング２１が熱変形することに起因する接触不良を解消するものである。リフロー炉内で加熱されたハウジング２１は、図７に示すように、ハウジング２１の左右方向両端部を回路基板１０の実装面１１から上方へ遠ざけるような形態で湾曲する。そのため、熱変形前に比べると、実装面１１と基板接続部２８との対向間隔は、ハウジング２１の左右両端に近い基板接続部２８ほど大きくなる。なお、図７では、発明の内容を把握し易くするため、ハウジング２１の湾曲の曲率は、誇張して描いている。
The connector device C of the third embodiment eliminates contact defects caused by thermal deformation of the housing 21 of the board connector 20 in the reflow process. As shown in FIG. 7, the housing 21 heated in the reflow furnace is curved so that both left and right ends of the housing 21 are moved upward from the mounting surface 11 of the circuit board 10. Therefore, the facing distance between the mounting surface 11 and the substrate connecting portion 28 is larger as the substrate connecting portion 28 closer to the left and right ends of the housing 21 than before the thermal deformation. In FIG. 7, the curvature of the curvature of the housing 21 is exaggerated in order to make it easier to understand the content of the invention.
ハウジング２１の湾曲変形に起因する基板接続部２８と実装面１１との接触不良を回避するため、図６に示すように、基板接続部２８の対向面２９に塗着する半田Ｓの厚さは、実装面１１と基板接続部２８との対向間隔のバラツキを解消するためのバラツキ吸収用の厚さ寸法に、ハウジング２１の湾曲変形を吸収するための変形吸収用の厚さ寸法を加えた寸法に設定されている。具体的には、ハウジング２１の左右両端に近い基板接続部２８ほど、変形吸収用の厚さ寸法が大きくなる。なお、図６では、発明の内容を把握し易くするため、実装面１１と基板接続部２８との対向間隔のバラツキを誇張して描いており、半田Ｓの塗着厚さも誇張して描いている。
As shown in FIG. 6, the thickness of the solder S to be applied to the facing surface 29 of the substrate connecting portion 28 is set in order to avoid poor contact between the substrate connecting portion 28 and the mounting surface 11 due to the curved deformation of the housing 21. , The thickness dimension for absorbing the variation for eliminating the variation in the facing distance between the mounting surface 11 and the board connecting portion 28, plus the thickness dimension for absorbing the deformation for absorbing the curved deformation of the housing 21. Is set to. Specifically, the substrate connection portion 28 closer to the left and right ends of the housing 21 has a larger thickness dimension for deformation absorption. In FIG. 6, in order to make it easier to understand the content of the invention, the variation in the facing distance between the mounting surface 11 and the substrate connecting portion 28 is exaggerated, and the coating thickness of the solder S is also exaggerated. There is.
基板接続部２８の対向面２９に半田を塗着する方法の一例としては、実施例１と同様、上面に複数の溝部が形成された治具（図示省略）を用いることができる。本実施例３の場合、治具の上面は、ハウジング２１の湾曲時の曲率と同じ曲率の曲面に成形されたものとしておく。各溝部に基板接続部２８を収容し、各溝部の空きスペースに半田ボール（図示省略）を充填すればよい。治具を用いない方法としては、実施例２のように、半田ボールを基板接続部２８の対向面２９に吹き付けるようにしてもよい。この場合の半田ボールの吹き付け個数は、画像解析によって検出された基板接続部２８の位置のバラツキに対応する個数と、ハウジング２１の湾曲変形に伴う基板接続部２８の変位量に比例する個数とを併せた数である。
As an example of the method of applying solder to the facing surface 29 of the substrate connecting portion 28, a jig (not shown) having a plurality of grooves formed on the upper surface can be used as in the first embodiment. In the case of the third embodiment, it is assumed that the upper surface of the jig is formed into a curved surface having the same curvature as the curvature of the housing 21 when it is curved. The substrate connection portion 28 may be accommodated in each groove portion, and the empty space in each groove portion may be filled with solder balls (not shown). As a method without using a jig, a solder ball may be sprayed on the facing surface 29 of the substrate connecting portion 28 as in the second embodiment. In this case, the number of solder balls sprayed is the number corresponding to the variation in the position of the substrate connecting portion 28 detected by the image analysis and the number proportional to the displacement amount of the substrate connecting portion 28 due to the bending deformation of the housing 21. It is a combined number.
半田Ｓを基板接続部２８に塗着した後、基板用コネクタ２０を実装面１１に載置する。このとき、複数の基板接続部２８の半田Ｓのうち、左右両端部に配置されている基板接続部２８の半田Ｓ、又は左右両端部に近い位置に配置されている基板接続部２８の半田Ｓのみが、接続位置１２に接触する。左右方向中央部及びその近傍に配置されている基板接続部２８の半田Ｓは、実装面１１の接続位置１２に対し非接触の状態で離隔した位置に浮いている。
After the solder S is applied to the board connection portion 28, the board connector 20 is placed on the mounting surface 11. At this time, among the solders S of the plurality of board connection portions 28, the solder S of the board connection portions 28 arranged at both left and right ends, or the solder S of the board connection portions 28 arranged at positions close to the left and right ends. Only contacts the connection position 12. The solder S of the substrate connecting portion 28 arranged at the central portion in the left-right direction and its vicinity floats at a position separated from the connecting position 12 of the mounting surface 11 in a non-contact state.
この状態で回路基板１０と基板用コネクタ２０をリフロー炉（図示省略）内に搬入して加熱すると、ハウジング２１が湾曲変形し、この変形に伴ってハウジング２１の左右方向中央部及びその近傍に配置されている基板接続部２８の半田Ｓが、実装面１１の接続位置１２に接触する。これにより、全ての基板接続部２８が、実装面１１の各接続位置１２に対して半田Ｓを介して適正な形態で接続される。この後は、回路基板１０と基板用コネクタ２０を冷却すれば、コネクタ装置Ｃの製造が完了する。本実施例３のコネクタ装置Ｃも、実施例１と同様、回路基板１０と基板接続部２８との接触信頼性を低下させることなく、実装面１１に対する基板接続部２８のコプラナリティに起因するコストアップを回避することができる。
When the circuit board 10 and the board connector 20 are carried into a reflow furnace (not shown) and heated in this state, the housing 21 is curved and deformed, and is arranged in the center of the housing 21 in the left-right direction and its vicinity. The solder S of the board connection portion 28 is in contact with the connection position 12 of the mounting surface 11. As a result, all the board connection portions 28 are connected to each connection position 12 of the mounting surface 11 via the solder S in an appropriate manner. After that, if the circuit board 10 and the board connector 20 are cooled, the production of the connector device C is completed. Similar to the first embodiment, the connector device C of the third embodiment also increases the cost due to the coplanarity of the board connecting portion 28 with respect to the mounting surface 11 without lowering the contact reliability between the circuit board 10 and the board connecting portion 28. Can be avoided.
［他の実施例］
本発明は、上記記述及び図面によって説明した実施例に限定されるものではなく、特許請求の範囲によって示される。本発明には、特許請求の範囲と均等の意味及び特許請求の範囲内でのすべての変更が含まれ、下記のような実施形態も含まれることが意図される。
上記実施例１では、基板接続部に半田を固着する手段として、基板接続部を治具の溝部に収容した状態で、溝部の空きスペース内に半田ボールを充填するようにしたが、これに限らず、基板接続部の高さを画像解析することによって、基準となる基板接続部と、基準となる基板接続部以外の基板接続部との高低差を検出し、この高低差に基づいて所定個数の半田ボールを基板接続部に吹き付けるようにしてもよい。具体的には、実装面からの高さが高い基板接続部については、半田ボールの吹き付け個数を多くし、実装面からの高さが低い基板接続部については、半田ボールの吹き付け個数を少なくする。
上記実施例３では、基板接続部に半田を固着する手段として、基板接続部の高さを画像解析することによって、基準となる基板接続部と、基準となる基板接続部以外の基板接続部との高低差を検出し、この高低差に基づいて所定個数の半田ボールを基板接続部に吹き付けたが、これに限らず、予測されるハウジングの変形形態に対応して上面が湾曲した治具を用い、上面を凹ませた溝部に基板接続部を収容した状態で、溝部の空きスペース内に半田ボールを充填してもよい。
上記実施例３では、基板用コネクタを回路基板に取り付ける前の状態において、半田を基板接続部に固着したが、半田を回路基板に固着しておいてもよい。半田を回路基板に固着する場合も、予測されるハウジングの変形形態に基づいて、各接続位置における半田の厚さを、各基板接続部毎に個別に設定すればよい。 [Other Examples]
The present invention is not limited to the examples described in the above description and drawings, but is shown by the scope of claims. The present invention includes the meaning equivalent to the scope of claims and all modifications within the scope of claims, and is intended to include the following embodiments.
In the first embodiment, as a means for fixing the solder to the substrate connection portion, the solder balls are filled in the empty space of the groove portion in the state where the substrate connection portion is housed in the groove portion of the jig, but the present invention is limited to this. Instead, by image analysis of the height of the board connection part, the height difference between the reference board connection part and the board connection part other than the reference board connection part is detected, and a predetermined number is detected based on this height difference. The solder ball may be sprayed onto the board connection portion. Specifically, the number of solder balls sprayed is increased for the board connection portion having a high height from the mounting surface, and the number of solder balls sprayed is reduced for the substrate connection portion having a low height from the mounting surface. ..
In the third embodiment, as a means for fixing the solder to the substrate connection portion, the height of the substrate connection portion is image-analyzed to form a reference substrate connection portion and a substrate connection portion other than the reference substrate connection portion. The height difference was detected, and a predetermined number of solder balls were sprayed onto the board connection based on this height difference. However, the present invention is not limited to this, and a jig having a curved upper surface corresponding to the expected deformation form of the housing is used. In use, a solder ball may be filled in an empty space of the groove portion in a state where the substrate connection portion is housed in the groove portion having a recessed upper surface.
In the third embodiment, the solder is fixed to the board connection portion in the state before the board connector is attached to the circuit board, but the solder may be fixed to the circuit board. Even when the solder is fixed to the circuit board, the thickness of the solder at each connection position may be set individually for each board connection portion based on the predicted deformation form of the housing.
本発明は、上記記述及び図面によって説明した実施例に限定されるものではなく、特許請求の範囲によって示される。本発明には、特許請求の範囲と均等の意味及び特許請求の範囲内でのすべての変更が含まれ、下記のような実施形態も含まれることが意図される。
上記実施例１では、基板接続部に半田を固着する手段として、基板接続部を治具の溝部に収容した状態で、溝部の空きスペース内に半田ボールを充填するようにしたが、これに限らず、基板接続部の高さを画像解析することによって、基準となる基板接続部と、基準となる基板接続部以外の基板接続部との高低差を検出し、この高低差に基づいて所定個数の半田ボールを基板接続部に吹き付けるようにしてもよい。具体的には、実装面からの高さが高い基板接続部については、半田ボールの吹き付け個数を多くし、実装面からの高さが低い基板接続部については、半田ボールの吹き付け個数を少なくする。
上記実施例３では、基板接続部に半田を固着する手段として、基板接続部の高さを画像解析することによって、基準となる基板接続部と、基準となる基板接続部以外の基板接続部との高低差を検出し、この高低差に基づいて所定個数の半田ボールを基板接続部に吹き付けたが、これに限らず、予測されるハウジングの変形形態に対応して上面が湾曲した治具を用い、上面を凹ませた溝部に基板接続部を収容した状態で、溝部の空きスペース内に半田ボールを充填してもよい。
上記実施例３では、基板用コネクタを回路基板に取り付ける前の状態において、半田を基板接続部に固着したが、半田を回路基板に固着しておいてもよい。半田を回路基板に固着する場合も、予測されるハウジングの変形形態に基づいて、各接続位置における半田の厚さを、各基板接続部毎に個別に設定すればよい。 [Other Examples]
The present invention is not limited to the examples described in the above description and drawings, but is shown by the scope of claims. The present invention includes the meaning equivalent to the scope of claims and all modifications within the scope of claims, and is intended to include the following embodiments.
In the first embodiment, as a means for fixing the solder to the substrate connection portion, the solder balls are filled in the empty space of the groove portion in the state where the substrate connection portion is housed in the groove portion of the jig, but the present invention is limited to this. Instead, by image analysis of the height of the board connection part, the height difference between the reference board connection part and the board connection part other than the reference board connection part is detected, and a predetermined number is detected based on this height difference. The solder ball may be sprayed onto the board connection portion. Specifically, the number of solder balls sprayed is increased for the board connection portion having a high height from the mounting surface, and the number of solder balls sprayed is reduced for the substrate connection portion having a low height from the mounting surface. ..
In the third embodiment, as a means for fixing the solder to the substrate connection portion, the height of the substrate connection portion is image-analyzed to form a reference substrate connection portion and a substrate connection portion other than the reference substrate connection portion. The height difference was detected, and a predetermined number of solder balls were sprayed onto the board connection based on this height difference. However, the present invention is not limited to this, and a jig having a curved upper surface corresponding to the expected deformation form of the housing is used. In use, a solder ball may be filled in an empty space of the groove portion in a state where the substrate connection portion is housed in the groove portion having a recessed upper surface.
In the third embodiment, the solder is fixed to the board connection portion in the state before the board connector is attached to the circuit board, but the solder may be fixed to the circuit board. Even when the solder is fixed to the circuit board, the thickness of the solder at each connection position may be set individually for each board connection portion based on the predicted deformation form of the housing.
Ａ…コネクタ装置
Ｂ…コネクタ装置
Ｃ…コネクタ装置
Ｓ…半田
１０…回路基板
１１…実装面
１２…接続位置
２０…基板用コネクタ
２１…ハウジング
２２…端子保持部
２３…フード部
２５…端子金具
２６…端子接続部
２７…脚部
２８…基板接続部
２９…対向面
３０…治具
３１…上面
３２…溝部
３３…空きスペース A ... Connector device B ... Connector device C ... Connector device S ...Solder 10 ... Circuit board 11 ... Mounting surface 12 ... Connection position 20 ... Board connector 21 ... Housing 22 ... Terminal holding part 23 ... Hood part 25 ... Terminal metal fittings 26 ... Terminal connection 27 ... Leg 28 ... Board connection 29 ... Facing surface 30 ... Jig 31 ... Top surface 32 ... Groove 33 ... Empty space
Ｂ…コネクタ装置
Ｃ…コネクタ装置
Ｓ…半田
１０…回路基板
１１…実装面
１２…接続位置
２０…基板用コネクタ
２１…ハウジング
２２…端子保持部
２３…フード部
２５…端子金具
２６…端子接続部
２７…脚部
２８…基板接続部
２９…対向面
３０…治具
３１…上面
３２…溝部
３３…空きスペース A ... Connector device B ... Connector device C ... Connector device S ...
Claims (3)
- 回路基板に固定されるハウジングと、
基板接続部を有する複数の端子金具とを備え、
前記複数の端子金具は、前記基板接続部が前記回路基板の実装面に沿って並ぶように前記ハウジングに取り付けられ、
前記基板接続部には、前記基板接続部を前記実装面に接続するための半田が、前記実装面と非接触の状態で固着されており、
前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、前記複数の基板接続部毎に個別に設定されている基板用コネクタ。 The housing fixed to the circuit board and
Equipped with a plurality of terminal fittings having a board connection part,
The plurality of terminal fittings are attached to the housing so that the board connection portions are arranged along the mounting surface of the circuit board.
Solder for connecting the board connecting portion to the mounting surface is fixed to the board connecting portion in a non-contact state with the mounting surface.
The thickness dimension of the solder is the height of the substrate connection portion that serves as a reference among the plurality of board connection portions arranged along the mounting surface and the substrate connection portion other than the reference substrate connection portion. A board connector that is individually set for each of the plurality of board connection portions based on the difference. - 実装面を有し、
前記実装面には、ハウジングに取り付けられた複数の端子金具の基板接続部が、前記実装面に沿って並んだ状態で半田を介して接続されるようになっている回路基板であって、
前記実装面において前記複数の基板接続部と個別に対向する複数の接続位置には、前記半田が、前記基板接続部と非接触の状態で固着されており、
前記複数の接続位置における前記半田の厚さ寸法は、前記実装面に沿って並ぶ複数の前記基板接続部のうち１つの基準となる前記基板接続部と、前記基準となる基板接続部以外の前記基板接続部との高低差に基づいて、個別に設定されている回路基板。 Has a mounting surface,
A circuit board in which board connection portions of a plurality of terminal fittings attached to a housing are connected to the mounting surface via solder in a state of being arranged along the mounting surface.
The solder is fixed to the plurality of connection positions individually facing the plurality of board connection portions on the mounting surface in a non-contact state with the substrate connection portions.
The thickness dimension of the solder at the plurality of connection positions is such that the substrate connection portion serving as a reference among the plurality of substrate connection portions arranged along the mounting surface and the substrate connection portion other than the reference substrate connection portion. Circuit boards that are individually set based on the height difference from the board connection. - 回路基板と、
前記回路基板に固定されたハウジングと、
基板接続部を有し、前記ハウジングに取り付けられた複数の端子金具とを備え、
前記回路基板の実装面に沿って並ぶ複数の前記基板接続部は、半田を介して前記実装面に接続され、
前記実装面と前記基板接続部との間における前記半田の厚さ寸法は、各々の前記基板接続部毎に、前記実装面と前記基板接続部との間隔と同じ寸法となるように個別に設定されており、
前記基板接続部の並び方向における前記半田の幅寸法は、前記複数の基板接続部の相互間で同じ寸法に設定されているコネクタ装置。 With the circuit board
The housing fixed to the circuit board and
It has a board connection, and is equipped with a plurality of terminal fittings attached to the housing.
A plurality of the board connection portions arranged along the mounting surface of the circuit board are connected to the mounting surface via solder.
The thickness dimension of the solder between the mounting surface and the board connecting portion is individually set for each of the board connecting portions so as to have the same dimension as the distance between the mounting surface and the board connecting portion. Has been
A connector device in which the width dimension of the solder in the arrangement direction of the board connecting portions is set to the same dimension between the plurality of board connecting portions.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-005548 | 2020-01-17 | ||
| JP2020005548A JP2021114378A (en) | 2020-01-17 | 2020-01-17 | Board connector, circuit board, and connector device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2021145268A1 true WO2021145268A1 (en) | 2021-07-22 |
Family
ID=76864630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/000342 WO2021145268A1 (en) | 2020-01-17 | 2021-01-07 | Board connector, circuit board, and connector device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2021114378A (en) |
| WO (1) | WO2021145268A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7389774B2 (en) | 2021-09-06 | 2023-11-30 | 日本航空電子工業株式会社 | connector |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09306571A (en) * | 1996-05-15 | 1997-11-28 | Harness Sogo Gijutsu Kenkyusho:Kk | Connector |
| JP2004023059A (en) * | 2002-06-20 | 2004-01-22 | Japan Aviation Electronics Industry Ltd | Electronic component mounted with soldered terminal |
| JP2007234673A (en) * | 2006-02-27 | 2007-09-13 | Denso Corp | Electronic device and its manufacturing method |
-
2020
- 2020-01-17 JP JP2020005548A patent/JP2021114378A/en active Pending
-
2021
- 2021-01-07 WO PCT/JP2021/000342 patent/WO2021145268A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09306571A (en) * | 1996-05-15 | 1997-11-28 | Harness Sogo Gijutsu Kenkyusho:Kk | Connector |
| JP2004023059A (en) * | 2002-06-20 | 2004-01-22 | Japan Aviation Electronics Industry Ltd | Electronic component mounted with soldered terminal |
| JP2007234673A (en) * | 2006-02-27 | 2007-09-13 | Denso Corp | Electronic device and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021114378A (en) | 2021-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10707606B2 (en) | Electrical connector | |
| US10483666B2 (en) | Socket receiving an electronic component having a plurality of contact pads | |
| US10230177B2 (en) | Electrical connector | |
| US10490951B2 (en) | Electrical connector | |
| US6805277B1 (en) | Process for soldering electric connector onto circuit board | |
| US7682165B2 (en) | Electrical contact with retaining device for clipping solder ball | |
| US7347699B2 (en) | Surface-mounted electrical connector | |
| US10461447B2 (en) | Socket receiving an electronic component having a plurality of contact pads | |
| WO2021145268A1 (en) | Board connector, circuit board, and connector device | |
| JP2003178844A (en) | Coaxial connector | |
| JP2013168517A (en) | Circuit board | |
| US20130267104A1 (en) | Electrical connector having contact for either bga or lga package | |
| JP4167265B2 (en) | Electrical connector using conductive terminal and conductive terminal | |
| JP4625480B2 (en) | Inspection jig | |
| JP2872023B2 (en) | Surface mount connector | |
| JP4028497B2 (en) | connector | |
| JP6308384B2 (en) | PCB with terminal | |
| US6353191B1 (en) | Column grid array connector | |
| US7959446B1 (en) | Electrical element and electrical connector | |
| US20050124186A1 (en) | Electronic device having adapter and connection method thereof | |
| JP2672661B2 (en) | PCB mounted connector | |
| JP2010157701A (en) | Area array adapter | |
| EP3332452B1 (en) | Surface mount contact, electronic device assembly | |
| JPH0745899Y2 (en) | External connection terminal having protrusion and hybrid integrated circuit device including the external connection terminal | |
| CN210723469U (en) | Electrical connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21739904 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 21739904 Country of ref document: EP Kind code of ref document: A1 |