WO2021143583A1 - Packaging film layer, display screen, and electronic device - Google Patents

Abstract

Provided are a packaging film layer (10), a display screen (100), and an electronic device (1000). The packaging film layer (10) comprises a first protective layer (11), a buffer layer (12), and a first transition layer (13). The buffer layer (12) is used for reducing the stress that the packaging film layer (10) bears when the packaging film layer (10) is bent; the first transition layer (13) is arranged between the first protective layer (11) and the buffer layer (12); the refractive index of the first transition layer (13) is between the first refractive index and the second refractive index.

Description

Packaging film, display screen and electronic equipment

Priority information

This application requests the priority and rights of the patent application with the patent application number 202010046705.2 filed with the State Intellectual Property Office of China on January 16, 2020, and the full text is incorporated herein by reference.

Technical field

This application relates to packaging technology, in particular to a packaging film layer, a display screen and an electronic device.

Background technique

In order to protect the components (such as the display screen), the display screen can be packaged with a packaging film layer.

Summary of the invention

The embodiments of the present application provide a packaging film layer, a display screen, and an electronic device.

The packaging film layer of the embodiment of the present application includes a first protective layer, a buffer layer and a first transition layer. The first protective layer has a first refractive index, and the buffer layer has a second refractive index, wherein the difference between the first refractive index and the second refractive index is greater than a preset refractive index. The buffer layer is used to reduce the stress borne by the packaging film layer when the packaging film layer is bent. The first transition layer is disposed between the first protective layer and the buffer layer, and the refractive index of the first transition layer is between the first refractive index and the second refractive index.

The display screen of the embodiment of the present application includes a display layer and an encapsulation film layer. The display layer is used for displaying images; the display layer is arranged on a side of the buffer layer away from the first protective layer. The packaging film layer includes: a first protective layer, a buffer layer, and a first transition layer. The first protective layer has a first refractive index, and the buffer layer has a second refractive index, wherein the difference between the first refractive index and the second refractive index is greater than a preset refractive index. The buffer layer is used to reduce the stress borne by the packaging film layer when the packaging film layer is bent. The first transition layer is disposed between the first protective layer and the buffer layer, and the refractive index of the first transition layer is between the first refractive index and the second refractive index.

The electronic device of the embodiment of the present application includes a camera and a display screen, and the display screen includes a display layer and an encapsulation film layer. The display layer is used for displaying images; the display layer is arranged on a side of the buffer layer away from the first protective layer. The packaging film layer includes: a first protective layer, a buffer layer, and a first transition layer. The first protective layer has a first refractive index, and the buffer layer has a second refractive index, wherein the difference between the first refractive index and the second refractive index is greater than a preset refractive index. The buffer layer is used to reduce the stress borne by the packaging film layer when the packaging film layer is bent. The first transition layer is disposed between the first protective layer and the buffer layer, and the refractive index of the first transition layer is between the first refractive index and the second refractive index. The display layer includes a display area for displaying images, the display area is formed with opposite front and back sides, and the light emitted by the display screen is directed toward the front side along the back side and passes through the buffer layer , The first transition layer and the first protective layer are emitted to the outside, and the camera is arranged on the side of the back surface of the display layer.

The additional aspects and advantages of the present application will be partly given in the following description, and part of them will become obvious from the following description, or be understood through the practice of the present application.

Description of the drawings

The above and/or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, in which:

1 to 7 are schematic diagrams of the structure of the packaging film layer of some embodiments of the present application;

8 to 10 are schematic diagrams of the structure of the display screen of some embodiments of the present application;

11 to 13 are schematic diagrams of the reflectivity of the display screen of some embodiments of the present application to light of different wavelengths;

FIG. 14 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

Fig. 15 is a schematic cross-sectional view of Fig. 14 along the section line XV-XV.

Detailed ways

The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary, and are intended to explain the present application, but should not be understood as a limitation to the present application.

The packaging film layer of the embodiment of the present application includes a first protective layer, a buffer layer, and a first transition layer. The first protective layer has a first refractive index; the buffer layer has a second refractive index, wherein the first refractive index and the second refractive index The difference of the ratio is greater than the preset refractive index, the buffer layer is used to reduce the stress that the packaging film layer bears when the packaging film layer is bent; and the first transition layer is arranged between the first protective layer and the buffer layer, and the first transition layer The refractive index of the layer is between the first refractive index and the second refractive index.

In some embodiments, the first protective layer is formed of silicon nitride, and the buffer layer is formed of a polymer material.

In some embodiments, the first transition layer is formed of silicon oxide or silicon oxynitride.

In some embodiments, the first transition layer includes a first layer and a second layer, and the buffer layer, the second layer, the first layer, and the first protective layer are stacked in sequence.

In some embodiments, the refractive index of the first layer is between the first refractive index and the refractive index of the second layer, and the refractive index of the second layer is between the refractive index of the first layer and the second refractive index.

In some embodiments, the first protective layer is formed of silicon nitride, the first layer is formed of silicon oxynitride, the second layer is formed of silicon oxide, and the buffer layer is formed of a polymer material.

In some embodiments, the encapsulation film layer further includes a second protective layer, and the buffer layer is disposed between the first protective layer and the second protective layer.

In some embodiments, the second protective layer has a third refractive index, and the difference between the third refractive index and the second refractive index is greater than a preset refractive index. The encapsulation film layer further includes a second transition layer, and the second transition layer is arranged Between the buffer layer and the second protective layer, the refractive index of the second transition layer is between the third refractive index and the second refractive index, and the second transition layer is formed of silicon oxide or silicon oxynitride.

In some embodiments, the encapsulation film layer further includes a third transition layer, the third transition layer is disposed on the side of the first protective layer away from the buffer layer, and the refractive index of the third transition layer is at the level of the first refractive index and air. Between the refractive indices, the second transition layer is formed of silicon oxide or silicon oxynitride.

In some embodiments, the thickness of the first transition layer is less than the first predetermined thickness.

In some embodiments, the thickness of the second transition layer is less than the second predetermined thickness.

In some embodiments, the thickness of the third transition layer is less than the third predetermined thickness.

The display screen of the embodiment of the present application includes a display layer and an encapsulation film layer. The display layer is used for displaying images; the display layer is arranged on the side of the buffer layer away from the first protective layer. The packaging film layer includes a first protective layer, a buffer layer and a first transition layer. The first protective layer has a first refractive index, and the buffer layer has a second refractive index, wherein the difference between the first refractive index and the second refractive index is greater than the preset refractive index. The buffer layer is used to reduce the stress borne by the packaging film when the packaging film is bent. The first transition layer is arranged between the first protection layer and the buffer layer, and the refractive index of the first transition layer is between the first refractive index and the second refractive index.

In some embodiments, the first protective layer is formed of silicon nitride, and the buffer layer is formed of a polymer material.

In some embodiments, the first transition layer is formed of silicon oxide or silicon oxynitride.

In some embodiments, the first transition layer includes a first layer and a second layer, and the buffer layer, the second layer, the first layer, and the first protective layer are stacked in sequence.

In some embodiments, the refractive index of the first layer is between the first refractive index and the refractive index of the second layer, and the refractive index of the second layer is between the refractive index of the first layer and the second refractive index.

In some embodiments, the first protective layer is formed of silicon nitride, the first layer is formed of silicon oxynitride, the second layer is formed of silicon oxide, and the buffer layer is formed of a polymer material.

In some embodiments, the encapsulation film layer further includes a second protective layer, and the buffer layer is disposed between the first protective layer and the second protective layer.

In some embodiments, the second protective layer has a third refractive index, and the difference between the third refractive index and the second refractive index is greater than a preset refractive index. The encapsulation film layer further includes a second transition layer, and the second transition layer is arranged Between the buffer layer and the second protective layer, the refractive index of the second transition layer is between the third refractive index and the second refractive index, and the second transition layer is formed of silicon oxide or silicon oxynitride.

In some embodiments, the encapsulation film layer further includes a third transition layer, the third transition layer is disposed on the side of the first protective layer away from the buffer layer, and the refractive index of the third transition layer is at the level of the first refractive index and air. Between the refractive indices, the second transition layer is formed of silicon oxide or silicon oxynitride.

In some embodiments, the thickness of the first transition layer is less than the first predetermined thickness.

In some embodiments, the thickness of the second transition layer is less than the second predetermined thickness.

In some embodiments, the thickness of the third transition layer is less than the third predetermined thickness.

In some embodiments, the display layer includes a substrate, an anode, a light-emitting layer, and a cathode that are stacked in sequence, wherein the cathode and the anode are used to energize the light-emitting layer to make the light-emitting layer emit light and display images; the substrate is used to control the light-emitting layer of the light-emitting layer. To display the image.

In some embodiments, the display screen further includes a light extraction layer, the light extraction layer is disposed between the second protective layer and the cathode, and the light extraction layer is used to transmit light from the light emitting layer to the encapsulation film layer.

In some embodiments, the substrate has a fourth refractive index, and the display screen further includes an anti-reflection coating. The anti-reflection coating is arranged on the side of the substrate away from the anode. The refractive index of the anti-reflection coating is between the fourth refractive index and the refractive index of air. between.

The electronic device of the embodiment of the present application includes a camera and a display screen, and the display screen includes a display layer and an encapsulation film layer. The display layer is used for displaying images; the display layer is arranged on the side of the buffer layer away from the first protective layer. The packaging film layer includes a first protective layer, a buffer layer and a first transition layer. The first protective layer has a first refractive index, and the buffer layer has a second refractive index, wherein the difference between the first refractive index and the second refractive index is greater than the preset refractive index. The buffer layer is used to reduce the stress borne by the packaging film when the packaging film is bent. The first transition layer is arranged between the first protection layer and the buffer layer, and the refractive index of the first transition layer is between the first refractive index and the second refractive index. The display layer includes a display area for displaying images. The display area is formed with opposite front and back sides. The light emitted by the display screen is directed toward the front along the back and passes through the buffer layer, the first transition layer and the first protective layer. For external emission, the camera is set on the side of the back of the display layer.

Please refer to FIG. 1, the packaging film layer 10 of the embodiment of the present application includes a first protective layer 11, a buffer layer 12 and a first transition layer 13. The first protective layer 11 has a first refractive index, and the buffer layer 12 has a second refractive index, and the difference between the first refractive index and the second refractive index is greater than or equal to the preset refractive index. The buffer layer 12 is used to reduce the stress borne by the packaging film layer 10 when the packaging film layer 10 is bent. The first transition layer 13 is disposed between the first protection layer 11 and the buffer layer 12, and the refractive index of the first transition layer 13 is between the first refractive index and the second refractive index.

It should be noted that the first protective layer 11, the buffer layer 12 and the first transition layer 13 are all made of transparent materials, so that light can propagate between the first protective layer 11, the buffer layer 12 and the first transition layer 13. When light enters another medium from one medium, the light will be refracted and reflected due to the different refractive indexes of the two mediums. When light is reflected between multiple media, the reflectivity of the light is determined based on the difference in refractive index between the two media. The reflectivity refers to the ratio of the reflected light in a unit of light to the entire unit of light. For example, if a beam of light propagates between the first protective layer 11 and the buffer layer 12, the reflectivity of the encapsulation film layer 10 is 7.28%, that is, 7.28% of the beam of light will be on the first protective layer 11 or buffer layer. Reflect within 12. The greater the difference in refractive index between the two media, the greater the corresponding reflectivity, indicating that the proportion of light reflected between the two media is greater. Therefore, when the difference between the first refractive index of the first protective layer 11 and the second refractive index of the buffer layer 12 is greater than or equal to the preset refractive index, the first protective layer 11 and the buffer layer 12 are provided between the first refractive index. For the transition layer 13, the refractive index of the first transition layer 13 is between the first refractive index and the second refractive index, so as to reduce the reflectivity of light when passing through the first protective layer 11 and the buffer layer 12.

Wherein, the preset refractive index may be a preset known value, the preset refractive index may be (0, 1.00], for example, the preset refractive index may be 0.01, 0.02, 0.05, 0.1, 0.11, 0.12, 0.20, 0.30, 0.31, 0.32, 0.33, 0.35, 0.38, 0.40, 0.50, 1.00, etc. Take the preset refractive index of 0.20 as an example for illustration, and the difference between the first refractive index and the second refractive index is 0.3 When the refractive index difference between the first protective layer 11 and the buffer layer 12 is large, the reflectivity in the encapsulation film layer 10 is relatively large. Therefore, the first transition layer 13 can be provided in the encapsulation film layer 10. , In order to reduce the reflectivity in the packaging film layer 10.

The high reflectivity of the packaging film layer will cause serious reflection of light when passing through the packaging film layer, which is not conducive to the light passing through the display screen, and the imaging effect of the camera under the display screen is poor. In addition, the light emitted by the display screen under the encapsulation film layer will also be seriously reflected when passing through the encapsulation film layer. As part of the light from the display screen is reflected, the screen image that the user sees is distorted, which reduces user experience.

In the encapsulation film layer 10 of the embodiment of the present application, a first transition layer 13 is provided between the first protective layer 11 and the buffer layer 12, and the refractive index of the first transition layer 13 is between the refractive index of the first protective layer 11 and the buffer layer 12 Between the refractive indexes, light can propagate between the first protective layer 11 and the first transition layer 13 with a small difference in refractive index, and between the first transition layer 13 and the buffer layer 12 with a small difference in refractive index. On the one hand, compared to light directly passing through the first protective layer 11 and the buffer layer 12, the reflectivity of the light passing through the first protective layer 11, the first transition layer 13, and the buffer layer 12 in turn is smaller, due to the reduction in The reflection between the first protective layer 11 and the buffer layer 12 is beneficial for light to pass through the packaging film layer 10 better, and the camera arranged under the screen can receive more light, and the imaging quality is better. On the other hand, the light emitted by the display screen 100 (shown in FIG. 15) has a smaller reflectivity when propagating between the buffer layer 12 and the first transition layer 13, the first transition layer 13 and the first protection layer 11, making the user The seen image of the display screen 100 is clearer, which improves the user experience.

In some embodiments, the first protective layer 11 may be formed of silicon nitride. The structure of silicon nitride is relatively dense, which can effectively prevent external water vapor, oxygen, etc. from entering the packaging film layer 10, thereby preventing damage to the packaging film layer 10. The protected components (such as the fingerprint module or the display layer 20 shown in FIG. 8) cause damage. The buffer layer 12 is formed of a polymer material, and the polymer material may include a fluorine-containing resin. The fluorine-containing resin may be polytetrafluoroethylene, which has excellent dielectric properties and high flexibility. The buffer layer 12 effectively increases the flexibility of the packaging film layer 10, reduces the pressure that the packaging film layer 10 bears when bending, and prevents the packaging film layer 10 from cracking.

The thickness of the first protective layer 11 may be 1000 nm, that is, the thickness of the silicon nitride layer may be 1000 nm. At this time, the refractive index of silicon nitride to visible light with a wavelength of 550 nm is 1.85, that is, the first refractive index is 1.85. The thickness of the buffer layer 12 may be 8000 nm, that is, the thickness of the polymer material layer may be 8000 nm. At this time, the refractive index of the polymer material to visible light with a wavelength of 550 nm is 1.52, that is, the second refractive index is 1.52. The difference between the first refractive index and the second refractive index is 0.33.

In some embodiments, the first transition layer 13 may use any material whose refractive index is between the second refractive index and the first refractive index. For example, the first transition layer 13 can be any material with a refractive index between (1.52, 1.85). It should be noted that the material needs to be a transparent material. Wherein, the first transition layer 13 may be formed of silicon oxide, and the refractive index of silicon oxide to visible light with a wavelength of 550 nm is 1.65. At this time, the packaging film layer 10 may include a polymer material layer, a silicon oxide layer, and a silicon nitride layer stacked in sequence, and the difference in refractive index between the silicon nitride layer and the silicon oxide layer is 1.85-1.65=0.20 . Compared with the refractive index difference between the silicon nitride layer and the polymer material layer of 0.33, the refractive index difference between the silicon nitride layer and the silicon oxide layer is smaller. That is, compared with the reflectance of light between the silicon nitride layer and the polymer material layer, the reflectance of light between the silicon nitride layer and the silicon oxide layer is smaller. In other words, light is less likely to be reflected between the silicon nitride layer and the silicon oxide layer. Similarly, the difference in refractive index between the silicon oxide layer and the polymer material layer is 1.65-1.52=0.13, that is, the reflectivity of light between the silicon oxide layer and the polymer material layer is smaller. In other words, the packaging film layer 10 reduces the reflectivity of light in the packaging film layer 10 by adding a layer of silicon oxide between the silicon nitride layer and the polymer material layer.

The first transition layer 13 can also be formed of silicon oxynitride, and the refractive index of silicon oxynitride to visible light with a wavelength of 550 nm is 1.75. At this time, the packaging film layer 10 may include a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer stacked in sequence, and the difference in refractive index between the silicon nitride layer and the silicon oxynitride layer is 1.85-1.75= 0.10, compared with the refractive index difference between the silicon nitride layer and the polymer material layer of 0.33, the refractive index difference between the silicon nitride layer and the silicon oxynitride layer is smaller. Similarly, the difference in refractive index between the silicon oxynitride layer and the polymer material layer is 1.75-1.52=0.23, that is, the reflectivity of light between the silicon oxynitride layer and the polymer material layer is smaller. In other words, the packaging film layer 10 reduces the reflectivity of light in the packaging film layer 10 by adding a layer of silicon oxynitride between the silicon nitride layer and the polymer material layer.

The first transition layer 13 can also be made of aluminum oxide or tungsten trioxide, wherein the refractive index of aluminum oxide to visible light with a wavelength of 550nm is 1.63, and the refractive index of tungsten trioxide to visible light with a wavelength of 550nm is 1.70. When the packaging film layer 10 includes a polymer material layer, an aluminum oxide layer, and a silicon nitride layer stacked in sequence, the difference in refractive index between the silicon nitride layer and the aluminum oxide layer is 1.85-1.63= 0.22, the refractive index difference between the polymer material layer and the aluminum oxide layer is 1.63-1.52=0.11, compared with the refractive index difference between the silicon nitride layer and the polymer material layer of 0.33, nitrogen The difference in refractive index between the silicon dioxide layer and the aluminum oxide layer is smaller, and the difference in refractive index between the polymer material layer and the aluminum oxide layer is also smaller. In other words, the packaging film layer 10 reduces the reflectivity of light in the packaging film layer 10 by adding a layer of aluminum oxide between the silicon nitride layer and the polymer material layer.

When the packaging film layer 10 includes a polymer material layer, a tungsten trioxide layer, and a silicon nitride layer stacked in sequence, the difference in refractive index between the silicon nitride layer and the tungsten trioxide layer is 1.85-1.70=0.15, The refractive index difference between the polymer material layer and the tungsten trioxide layer is 1.70-1.52=0.18, which is 0.33 compared to the refractive index difference between the silicon nitride layer and the polymer material layer of 0.33, and the silicon nitride layer The refractive index difference with the tungsten trioxide layer is smaller, and the refractive index difference between the polymer material layer and the tungsten trioxide layer is also smaller. In other words, the packaging film layer 10 reduces the reflectivity of light in the packaging film layer 10 by adding a layer of tungsten trioxide between the silicon nitride layer and the polymer material layer.

Since the preparation of silicon oxide and silicon oxynitride is similar to the preparation of silicon nitride, the corresponding silicon oxide, silicon oxynitride and silicon nitride can be prepared by controlling the introduction of different gases. These gases can include monosilane, oxygen, ammonia, and so on. Compared with the first transition layer 13 made of other materials, the first transition layer 13 made of silicon oxide or silicon oxynitride has a simpler preparation process. The corresponding requirements can be obtained simply by controlling different gases. No need to add a new process to the preparation.

Referring to FIG. 2, in some embodiments, the first transition layer 13 may include a first layer 131 and a second layer 132, and the packaging film layer 10 may include a buffer layer 12, a second layer 132, and a second layer 132 stacked in sequence. One layer 131 and the first protective layer 11. Wherein, the refractive index of the first layer 131 of the first transition layer 13 is between the first refractive index of the first protective layer 11 and the refractive index of the second layer 132; the refractive index of the second layer 132 of the first transition layer 13 It is between the refractive index of the first layer 131 and the second refractive index of the buffer layer 12. For example, the first protective layer 11 is formed of silicon nitride, that is, the first refractive index is 1.85, and the first layer 131 of the first transition layer 13 is formed of silicon oxynitride, that is, the refractive index of the first layer 131 of the first transition layer 13 is The second layer 132 of the first transition layer 13 is formed of silicon oxide. That is, the refractive index of the second layer 132 of the first transition layer 13 is 1.65. The buffer layer 12 can be formed of a polymer material. It may be a fluorine-containing resin, that is, the second refractive index is 1.52. At this time, in the packaging film layer 10, the refraction between the first protective layer 11, the first layer 131 of the first transition layer 13, the second layer 132 of the first transition layer 13, and the two adjacent layers of the buffer layer 12 The difference in refractive index is smaller than the difference in refractive index between the silicon nitride layer and the polymer material layer, which further reduces the overall reflectivity of the packaging film layer 10; moreover, the first protective layer 11 and the first transition layer The refractive index of the first layer 131 of the layer 13, the second layer 132 of the first transition layer 13 and the buffer layer 12 are successively reduced, and the difference in refractive index between the two adjacent layers is all a small value , Further reducing the overall reflectivity of the packaging film layer 10.

In some embodiments, the refractive index of the first layer 131 of the first transition layer 13 and the refractive index of the second layer 132 of the first transition layer 13 are switchable. For example, the first protective layer 11 is formed of silicon nitride, that is, the first refractive index is 1.85. The first layer 131 of the first transition layer 13 is formed of silicon oxide, that is, the refractive index of the first layer 131 of the first transition layer 13 is 1.65. The second layer 132 of the first transition layer 13 is formed of silicon oxynitride, that is, the refractive index of the second layer 132 of the first transition layer 13 is 1.75. The buffer layer 12 may be formed of a polymer material, and the polymer material may be a fluorine-containing resin, that is, the second refractive index is 1.52. At this time, compared to the case where the packaging film layer 10 only includes the first protective layer 11 and the buffer layer 12, two first transition layers 13 are added between the first protective layer 11 and the buffer layer 12, so that the packaging film layer 10 The refractive index difference between two adjacent film layers is smaller, that is, the reflectivity of the packaging film layer 10 is smaller.

In some embodiments, the thickness of the first transition layer 13 is less than or equal to the first preset thickness. The first preset thickness can be any value in [80nm, 220nm], for example, the first preset thickness can be 80nm, 90nm, 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, 200nm, 210nm, 220nm and so on. In the embodiment of the present application, the first predetermined thickness is 200 nm. When the first transition layer 13 is formed of silicon oxide, the thickness of the first transition layer 13 may be 95 nm; when the first transition layer 13 is formed of a layer of silicon oxynitride, the thickness of the first transition layer 13 may be 80 nm When the first transition layer 13 is formed using a layer of silicon oxide and a layer of silicon oxynitride, the thickness of the first transition layer 13 may be 175 nm. Of course, the first transition layer 13 can also have other thicknesses, which will not be listed here. Since the thickness of the first protective layer 11 may be 1000 nm, and the thickness of the buffer layer 12 may be 8000 nm, therefore, when the thickness of the first transition layer 13 is less than or equal to the first preset thickness, the thickness of the first transition layer 13 is The thickness of the packaging film layer 10 has less influence, and the packaging film layer 10 is lighter and thinner.

Referring to FIG. 3, the packaging film layer 10 of the embodiment of the present application may further include a second protective layer 14, and the buffer layer 12 is disposed between the first protective layer 11 and the second protective layer 14. The first protection layer 11 and the second protection layer 14 can effectively protect the components protected by the packaging film layer 10 (for example, a fingerprint module or the display layer 20 shown in FIG. 8 ). The material of the second protection layer 14 may be the same as the material of the first protection layer 11, for example, the second protection layer 14 is formed of silicon nitride. Of course, the material of the second protective layer 14 may be different from that of the first protective layer 11. In the embodiment of the present application, the first protective layer 11 and the second protective layer 14 are both formed of silicon nitride, and the compactness of the structure of the silicon nitride material can meet the requirements of normal use, because the manufacturing process of silicon nitride is relatively simple Therefore, the manufacturing cost of the packaging film layer 10 can be reduced. The second protective layer 14 formed of silicon nitride can prevent moisture, oxygen, etc. from passing through the second protective layer 14 from damaging the components protected by the packaging film layer 10 (for example, the fingerprint module or the display layer 20 shown in FIG. 8 ).

Referring to FIG. 4, in some embodiments, the second protective layer 14 has a third refractive index. Since the second protective layer 14 and the first protective layer 11 are both silicon nitride, the third refractive index may be the same as the third refractive index. A refractive index is the same, both can be 1.85. When the difference between the third refractive index and the second refractive index is greater than or equal to the preset refractive index, it indicates that the refractive index difference between the buffer layer 12 and the second protective layer 14 is relatively large. A second transition layer 15 is provided in the middle, and the refractive index of the second transition layer 15 is between the third refractive index and the second refractive index, so as to reduce the reflectivity of the packaging film layer 10. When the difference between the third refractive index and the second refractive index is less than the preset refractive index, it means that the refractive index difference between the buffer layer 12 and the second protective layer 14 is relatively small, and the reflectivity in the packaging film layer 10 is relatively high. Therefore, there is no need to provide the second transition layer 15 in the packaging film layer 10.

In some embodiments, the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, and a silicon nitride layer stacked in sequence. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer stacked in sequence. When the first transition layer 13 includes the first layer 131 and the second layer 132, the encapsulation film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon oxide layer stacked in sequence. Or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon oxynitride layer, and a silicon nitride layer stacked in sequence.

In some embodiments, the second transition layer 15 may be formed of silicon oxynitride. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, and a silicon nitride layer stacked in sequence. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer stacked in sequence. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, and an oxynitride layer that are stacked in sequence. A silicon layer and a silicon nitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, a silicon oxide layer, and a silicon nitride layer stacked in sequence.

5, in some embodiments, the second transition layer 15 may include a first layer 151 and a second layer 152, the first layer 151 of the second transition layer 15 may be formed of silicon oxide, and the second transition layer 15 The second layer 152 can be formed of silicon oxynitride. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, and a silicon nitride layer stacked in sequence. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer stacked in sequence. Floor. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, and a silicon nitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, and a silicon oxynitride layer stacked in sequence. Layer and silicon nitride layer.

Of course, the materials of the first layer 151 of the second transition layer 15 and the second layer 152 of the second transition layer 15 can be exchanged. For example, the first layer 151 of the second transition layer 15 may be formed of silicon oxynitride, and the second layer 152 of the second transition layer 15 may be formed of silicon oxide. At this time, when the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, and a nitride layer that are sequentially stacked. Silicon layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Floor. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, and a silicon nitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, and a silicon oxynitride layer stacked in sequence. Layer and silicon nitride layer.

In some embodiments, the thickness of the second transition layer 15 is less than or equal to the second predetermined thickness. The second preset thickness can be the same as the first preset thickness, and will not be repeated here. Of course, the second preset thickness may also be different from the first preset thickness. For example, the second preset thickness is greater than the first preset thickness, or the second preset thickness is less than the first preset thickness. One enumerate.

Please refer to FIG. 6, the packaging film layer 10 of the embodiment of the present application may further include a third transition layer 16. The third transition layer 16 is disposed on the side of the first protection layer 11 away from the buffer layer 12. The refractive index of the third transition layer 16 may be between the first refractive index of the first protective layer 11 and the refractive index of air. Wherein, the third transition layer 16 may be one layer or two layers. The third transition layer 16 can be arbitrarily combined with the first transition layer 13 of different materials and layers and/or the second transition layer 15 of different materials and layers.

In some embodiments, the third transition layer 16 may be formed of silicon oxide, and the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxide layer stacked in sequence. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, a silicon nitride layer, and a silicon oxide layer stacked in sequence. . When the first transition layer 13 includes the first layer 131 and the second layer 132, the encapsulation film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon oxide layer stacked in sequence. Layer, silicon nitride layer, and silicon oxide layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon oxynitride layer, and a silicon nitride layer stacked in sequence And silicon oxide layer.

In some embodiments, the third transition layer 16 may be formed of silicon oxide, and the second transition layer 15 may be formed of silicon oxynitride. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxide layer stacked in sequence. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, a silicon nitride layer, and a silicon oxide layer that are sequentially stacked. Floor. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, and an oxynitride layer that are stacked in sequence. A silicon layer, a silicon nitride layer, and a silicon oxide layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, silicon oxynitride, a silicon oxide layer, and a silicon nitride layer that are sequentially stacked. And silicon oxide layer.

In some embodiments, the third transition layer 16 can be formed of silicon oxide, the second transition layer 15 can include a first layer 151 and a second layer 152, and the first layer 151 of the second transition layer 15 can be formed of silicon oxide. The second layer 152 of the second transition layer 15 may be formed of silicon oxynitride. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, and Silicon oxide layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Layer and silicon oxide layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxide layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, and a silicon oxide layer stacked in sequence , Silicon oxynitride layer, silicon nitride layer and silicon oxide layer. Of course, the materials of the first layer 151 of the second transition layer 15 and the second layer 152 of the second transition layer 15 can be exchanged. For example, the first layer 151 of the second transition layer 15 may be formed of silicon oxynitride, and the second layer 152 of the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer and Silicon oxide layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Layer and silicon oxide layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxide layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, and a silicon oxide layer stacked in sequence , Silicon oxynitride layer, silicon nitride layer and silicon oxide layer.

In some embodiments, the third transition layer 16 may be formed of silicon oxynitride, and the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxynitride layer that are sequentially stacked. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, a silicon nitride layer, and a silicon oxynitride layer that are sequentially stacked. Floor. When the first transition layer 13 includes the first layer 131 and the second layer 132, the encapsulation film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon oxide layer stacked in sequence. Layer, silicon nitride layer, and silicon oxynitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon oxynitride layer, and a silicon nitride layer stacked in sequence. Layer and silicon oxynitride layer.

In some embodiments, the third transition layer 16 may be formed of silicon oxynitride, and the second transition layer 15 may be formed of silicon oxynitride. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxynitride layer that are sequentially stacked. . When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, a silicon nitride layer, and an oxynitride layer that are sequentially stacked. Silicon layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, and an oxynitride layer that are stacked in sequence. A silicon layer, a silicon nitride layer, and a silicon oxynitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, silicon oxynitride, a silicon oxide layer, and a nitride Silicon and silicon oxynitride layer.

In some embodiments, the third transition layer 16 can be formed of silicon oxynitride, the second transition layer 15 can include a first layer 151 and a second layer 152, and the first layer 151 of the second transition layer 15 can be silicon oxide. Formed, the second layer 152 of the second transition layer 15 can be formed using silicon oxynitride. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, and Silicon oxynitride layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Layer and silicon oxynitride layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxynitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, and a silicon oxide layer stacked in sequence. Layer, silicon oxynitride layer, silicon nitride layer and silicon oxynitride layer. Of course, the materials of the first layer 151 of the second transition layer 15 and the second layer 152 of the second transition layer 15 can be exchanged. For example, the first layer 151 of the second transition layer 15 may be formed of silicon oxynitride, and the second layer 152 of the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer and Silicon oxynitride layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Layer and silicon oxynitride layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxynitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, and a silicon oxide layer stacked in sequence. Layer, silicon oxynitride layer, silicon nitride layer and silicon oxynitride layer.

Referring to FIG. 7, in some embodiments, the third transition layer 16 may include a first layer 161 and a second layer 162, the first layer 161 of the third transition layer 16 may be formed of silicon oxide, and the third transition layer 16 The second layer 162 may be formed of silicon oxynitride, and the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, and Silicon oxide layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, a silicon nitride layer, and a silicon oxynitride layer that are sequentially stacked. Layer and silicon oxide layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the encapsulation film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon oxide layer stacked in sequence. Layer, silicon nitride layer, silicon oxynitride layer, and silicon oxide layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, and a silicon oxynitride layer stacked in sequence , Silicon nitride layer, silicon oxynitride layer and silicon oxide layer.

In some embodiments, the first layer 161 of the third transition layer 16 may be formed of silicon oxide, the second layer 162 of the third transition layer 16 may be formed of silicon oxynitride, and the second transition layer 15 may be formed of silicon oxynitride. . When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, and a silicon oxynitride layer that are sequentially stacked. And silicon oxide layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, a silicon nitride layer, and an oxynitride layer that are sequentially stacked. Silicon layer and silicon oxide layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and an oxide layer that are sequentially stacked. A silicon layer, a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, and an oxynitride layer stacked in sequence. Silicon layer, silicon nitride layer, silicon oxynitride layer and silicon oxide layer.

In some embodiments, the first layer 161 of the third transition layer 16 can be formed of silicon oxide, the second layer 162 of the third transition layer 16 can be formed of silicon oxynitride, and the second transition layer 15 can include the first layer. 151 and the second layer 152, the first layer 151 of the second transition layer 15 may be formed of silicon oxide, and the second layer 152 of the second transition layer 15 may be formed of silicon oxynitride. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, Silicon oxynitride layer and silicon oxide layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Layer, silicon oxynitride layer and silicon oxide layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, and a polymer material stacked in sequence Layer, silicon oxide layer, silicon oxynitride layer, silicon nitride layer, silicon oxynitride layer, and silicon oxide layer. Of course, the materials of the first layer 151 of the second transition layer 15 and the second layer 152 of the second transition layer 15 can be exchanged. For example, the first layer 152 of the second transition layer 15 may be formed of silicon oxynitride, and the second layer 152 of the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, Silicon oxynitride layer and silicon oxide layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Layer, silicon oxynitride layer and silicon oxide layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, and a polymer material stacked in sequence Layer, silicon oxide layer, silicon oxynitride layer, silicon nitride layer, silicon oxynitride layer, and silicon oxide layer.

Of course, the materials of the first layer 161 and the second layer 162 of the third transition layer 16 can be exchanged. In some embodiments, for example, the first layer 161 of the third transition layer 16 can be formed of silicon oxynitride, and the third The second layer 162 of the transition layer 16 may be formed of silicon oxide, and the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, a silicon oxide layer, and a layer of nitrogen that are sequentially stacked. Silicon oxide layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, a silicon nitride layer, and a silicon oxide layer that are sequentially stacked. And silicon oxynitride layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the encapsulation film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon oxide layer stacked in sequence. Layer, silicon nitride layer, silicon oxide layer, and silicon oxynitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, and a silicon oxynitride layer stacked in sequence , Silicon nitride layer, silicon oxide layer and silicon oxynitride layer.

In some embodiments, the first layer 161 of the third transition layer 16 may be formed of silicon oxynitride, the second layer 162 of the third transition layer 16 may be formed of silicon oxide, and the second transition layer 15 may be formed of silicon oxynitride. . When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, a silicon oxide layer, and Silicon oxynitride layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, a silicon nitride layer, and a silicon oxide layer that are sequentially stacked. Layer and silicon oxynitride layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and an oxide layer that are sequentially stacked. A silicon layer, a silicon nitride layer, a silicon oxide layer, and a silicon oxynitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, and an oxynitride layer stacked in sequence. Silicon layer, silicon nitride layer, silicon oxide layer and silicon oxynitride layer.

In some embodiments, the first layer 161 of the third transition layer 16 may be formed of silicon oxynitride, the second layer 162 of the third transition layer 16 may be formed of silicon oxide, and the second transition layer 15 may include the first layer. 151 and the second layer 152, the first layer 151 of the second transition layer 15 may be formed of silicon oxide, and the second layer 152 of the second transition layer 15 may be formed of silicon oxynitride. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, Silicon oxide layer and silicon oxynitride layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Layer, silicon oxide layer and silicon oxynitride layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, a silicon nitride layer, a silicon oxide layer, and a silicon oxynitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, and a polymer material stacked in sequence Layer, silicon oxide layer, silicon oxynitride layer, silicon nitride layer, silicon oxide layer, and silicon oxynitride layer. Of course, the materials of the first layer 151 of the second transition layer 15 and the second layer 152 of the second transition layer 15 can be exchanged. For example, the first layer 151 of the second transition layer 15 may be formed of silicon oxynitride, and the second layer 152 of the second transition layer 15 may be formed of silicon oxide. When the first transition layer 13 is formed of silicon oxide, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxide layer, a silicon nitride layer, Silicon oxide layer and silicon oxynitride layer. When the first transition layer 13 is formed of silicon oxynitride, the packaging film layer 10 includes a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and a silicon nitride layer that are sequentially stacked. Layer, silicon oxide layer and silicon oxynitride layer. When the first transition layer 13 includes the first layer 131 and the second layer 132, the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a polymer material layer, and an oxynitride layer that are sequentially stacked. A silicon layer, a silicon oxide layer, a silicon nitride layer, a silicon oxide layer, and a silicon oxynitride layer; or the packaging film layer 10 may include a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, and a polymer material stacked in sequence Layer, silicon oxide layer, silicon oxynitride layer, silicon nitride layer, silicon oxide layer, and silicon oxynitride layer.

In some embodiments, the packaging film layer 10 may also default to the second transition layer 15, that is, the packaging film layer 10 includes the third transition layer 16 and the first transition layer 13, and the second transition layer 15 is not provided.

In some embodiments, the thickness of the third transition layer 16 is less than or equal to the third predetermined thickness. The third predetermined thickness may be the same as the above-mentioned first predetermined thickness and/or the second predetermined thickness, which will not be repeated here. Of course, the third preset thickness may also be different from the first preset thickness or the second preset thickness, and will not be listed here.

Since the thickness of the first transition layer 13, the second transition layer 15 and the third transition layer 16 can be respectively less than or equal to the preset thickness, the thickness of the first transition layer 13, the second transition layer 15 and the third transition layer 16 is avoided This affects the thickness of the packaging film layer 10.

Referring to FIG. 8, the display screen 100 of the embodiment of the present application includes a display layer 20 and the packaging film layer 10 of any of the above embodiments. The display layer 20 is provided on the side of the buffer layer 12 away from the first protective layer 11. For example, the packaging film layer 10 includes a second protective layer 14, a second transition layer 15, a buffer layer 12, a first transition layer 13, a first protective layer 11, and a third transition layer 16 stacked in sequence. At this time, the display layer 20 is disposed on the side of the second protection layer 14 away from the second transition layer 15. The display layer 20 is arranged under the encapsulation film layer 10, and the display layer 20 is encapsulated by the encapsulation film layer 10, which ensures that the display layer 20 is not interfered by external water vapor and oxygen.

Specifically, the first protective layer 11 and the second protective layer 14 can be formed of silicon nitride. The dense molecular structure of silicon nitride can protect the display layer 20 more densely to prevent external moisture and oxygen from causing damage to the display screen 100. damage.

In some embodiments, the display layer 20 may include a substrate 24, an anode 23, a light-emitting layer 22, and a cathode 21 that are sequentially stacked.

Specifically, the cathode 21 and the anode 23 are used to energize the light-emitting layer 22 to make the light-emitting layer 22 emit light and display an image. In a display screen 100, there may be a plurality of cathodes 21, light-emitting layers 22, and anodes 23 arranged in a matrix. By controlling each cathode 21 and anode 23 to be energized, the corresponding light-emitting layer 22 emits light, so that the display The image is displayed on 100. The light-emitting layer 22 may be formed of an organic material, for example, the organic material is Organic Electro-Luminescence.

The substrate 24 is used to control the light emission of the light emitting layer 22 to display an image. Among them, the substrate 24 is used to support the display layer 20 and the packaging film layer 10. The controller (for example, CPU) can transmit current and signals through the substrate 24 to control the light-emitting layer to emit light. The substrate 24 may include a TFT substrate.

Referring to FIG. 9, in some embodiments, the display screen 100 further includes a light extraction layer 25, wherein the material of the light extraction layer 25 may be the same as the material of the light emitting layer 22, for example, the material of the light extraction layer 25 is organic EL . Of course, the light extraction layer 25 can also be made of other materials. For example, the material of the light extraction layer 25 is an electron-blocking layer (EBL) or the like. The light extraction layer 25 is provided between the second protective layer 14 and the cathode 21. The second protective layer 14 can protect the light extraction layer 25 to prevent water vapor and oxygen from entering the light extraction layer 25 and damage the light extraction layer 25. The light emitted by the light emitting layer 22 can be conducted by the light extraction layer 25 to the encapsulation film layer 10 to prevent the light in the light emitting layer 22 from being reflected multiple times in the display screen 100, thereby increasing the light emitted from the light emitting layer 22 on the display screen 100. Light transmission efficiency within.

Referring to FIG. 10, in some embodiments, the substrate 24 has a fourth refractive index, and the display screen 100 may further include an anti-reflection film 26, and the anti-reflection film 26 is disposed on the side of the substrate 24 away from the anode 23. The refractive index of the antireflection film 26 is between the fourth refractive index and the air refractive index. For example, the fourth refractive index of the substrate 24 is 1.5, and the refractive index of air is approximately 1. Therefore, the light passing through the packaging film layer 10 will be reflected when passing through the substrate 24. Therefore, when the refractive index of the antireflection film 26 is at (1, 1.5), the light enters the air through the substrate 24, and the reflectivity decreases.

In some embodiments, the display screen 100 may further include a polymer film material, and the polymer film material may be provided on the side of the packaging film layer 10 away from the display layer 20. Specifically, the polymer membrane material may be provided on the side of the third transition layer 16 away from the first protective layer 11. The polymer film material may be a polarizer or a touch screen film, etc., to realize functions such as a touch screen of the display screen 100.

Please continue to refer to FIG. 9. In one embodiment, the display screen 100 includes a third transition layer 16, a first protection layer 11, a first transition layer 13, a buffer layer 12, a second transition layer 15, a second protection layer 14, The light extraction layer 25, the cathode 21, the light emitting layer 22, the anode 23, and the substrate 24. The corresponding third transition layer 16, the first protective layer 11, the first transition layer 13, the buffer layer 12, the second transition layer 15 and the second protective layer 14 are corresponding to the materials, thickness and refractive index of the corresponding relationship as shown in Table 1. .

Table 1

Film name	material	Thickness (nm)	Refractive index@550nm
The third transition layer 16	Silicon oxide	95	1.65
The first protective layer 11	Silicon nitride	1000	1.85
First transition layer 13	Silicon oxide	95	1.65
Buffer layer 12	Polymer Materials	8000	1.52
The second transition layer 15	Silicon oxide	95	1.65
Second protective layer 14	Silicon nitride	1000	1.85

It can be seen from Table 1 that the third transition layer 16, the first transition layer 13, and the second transition layer 15 are all made of silicon oxide, the first protective layer 11 and the second protective layer 14 are all made of silicon nitride, and the buffer layer 12 is made of silicon oxide. The formation of polymer materials. The display screen 100 includes a substrate 24, an anode 23, a light-emitting layer 22, a cathode 21, a light extraction layer 25, a silicon nitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, and a silicon nitride layer that are sequentially stacked. And silicon oxide layer. For the reflectance detection of the display screen 100, please refer to FIG. 11. FIG. 11 is an oscillation diagram of the display screen 100 in the simulation software. From the oscillation diagram, the average reflectance of the display screen 100 can be obtained as 6.07%. Among them, the average reflectivity refers to that 6.07% of all light (wavelengths between 380 nm and 780 nm) illuminating the display screen 100 will be reflected in the display screen 100.

Please continue to refer to FIG. 9. In another embodiment, the display screen 100 includes a third transition layer 16, a first protection layer 11, a first transition layer 13, a buffer layer 12, a second transition layer 15, and a second protection layer 14. , The light extraction layer 25, the cathode 21, the light emitting layer 22, the anode 23 and the substrate 24. Please refer to Table 2 for the corresponding materials, thickness and refractive index of the third transition layer 16, the first protection layer 11, the first transition layer 13, the buffer layer 12, the second transition layer 15 and the second protection layer 14.

Table 2

Film name	material	Thickness (nm)	Refractive index@550nm
The third transition layer 16	Silicon oxynitride	80	1.75
The first protective layer 11	Silicon nitride	1000	1.85
First transition layer 13	Silicon oxynitride	80	1.75
Buffer layer 12	Polymer Materials	8000	1.52
The second transition layer 15	Silicon oxynitride	80	1.75
Second protective layer 14	Silicon nitride	1000	1.85

It can be seen from Table 2 that the third transition layer 16, the first transition layer 13, and the second transition layer 15 are all formed of silicon oxynitride, the first protective layer 11 and the second protective layer 14 are all formed of silicon nitride, and the buffer layer 12 It is formed of polymer materials. The display screen 100 includes a substrate 24, an anode 23, a light-emitting layer 22, a cathode 21, a light extraction layer 25, a silicon nitride layer, a silicon oxynitride layer, a polymer material layer, a silicon oxynitride layer, and a layer of Silicon layer and silicon oxynitride layer. For the reflectance detection of the display screen 100, please refer to FIG. 12. FIG. 12 is an oscillation graph of the display screen 100 in the simulation software. From the oscillation graph, the average reflectance of the display screen 100 can be obtained as 6.17%.

Please continue to refer to FIG. 9. In another embodiment, the display screen 100 includes a third transition layer 16, a first protection layer 11, a first transition layer 13, a buffer layer 12, a second transition layer 15, and a second protection layer 14. , The light extraction layer 25, the cathode 21, the light emitting layer 22, the anode 23 and the substrate 24. Please refer to Table 3 for the corresponding materials, thickness and refractive index of the third transition layer 16, the first protection layer 11, the first transition layer 13, the buffer layer 12, the second transition layer 15 and the second protection layer 14.

table 3

It can be seen from Table 3 that the third transition layer 16, the first transition layer 13, and the second transition layer 15 are all formed of silicon oxide and silicon oxynitride, and the first protective layer 11 and the second protective layer 14 are all formed of silicon nitride. The buffer layer 12 is formed of a polymer material. Among them, since the refractive index of silicon oxynitride is greater than that of silicon oxide, the silicon oxynitride is arranged in a layer close to silicon nitride, so that the difference in refractive index of two adjacent layers is smaller. The average reflectivity of the display screen 100 is reduced. The display screen 100 includes a substrate 24, an anode 23, a light emitting layer 22, a cathode 21, a light extraction layer 25, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a polymer material layer, a silicon oxide layer, Silicon oxynitride layer, silicon nitride layer, silicon oxynitride layer and silicon oxide. For the reflectance detection of the display screen 100, please refer to FIG. 13. FIG. 13 is an oscillation graph of the display screen 100 in the simulation software. From the oscillation graph, the average reflectance of the display screen 100 can be obtained as 5.56%.

In addition, in some embodiments, the encapsulating film layer 10 can also be used to encapsulate the fingerprint module, so as to prevent external water vapor, gas, etc. from entering the fingerprint module and causing damage to the fingerprint module.

14 and 15 together, the electronic device 1000 of the embodiment of the present application includes a camera 200 and any one of the above-mentioned display screens 100. The display screen 100 includes a display area 110 for displaying images, and the display area 110 is formed with a phase The front side 111 and the back side 112 of the back, the light emitted by the display screen 100 is directed to the front side 111 along the back side 112, and is emitted to the outside after passing through the buffer layer 12, the first transition layer 13 and the first protective layer 11. The camera 200 is set on the display The back 112 of the layer 20 is located on the side.

Specifically, the camera 200 may be a front-mounted under-screen camera, and external light passes through the display screen 100 and is received by the camera 200. If the reflectivity of the display screen 100 is too large, more reflections will occur in the display screen 100, and the light reflected by the display screen 100 may eventually be received by the camera 200, which affects the imaging clarity of the camera 200. Therefore, the first transition layer 13, the second transition layer 15 and the third transition layer 16 are added in the display screen 100 to reduce the average reflectivity of the display screen 100 and improve the imaging clarity of the camera 200. Of course, when the light from the display layer in the display screen 100 passes through the packaging film, the reflectivity is also smaller, which improves the display effect of the display screen 100 in the electronic device 100.

In the display screen 100 and the electronic device 1000 of the embodiment of the present application, a first transition layer 13 is provided between the first protective layer 11 and the buffer layer 12. The refractive index of the first transition layer 13 is at the refractive index and the buffer of the first protective layer 11. The refractive index of the layer 12 is between the first protective layer 11 and the first transition layer 13, and the first transition layer 13 and the buffer layer 12, which have a small difference in refractive index. Compared with the light directly passing through the first protective layer 11 and the buffer layer 12, the reflectivity of the light passing through the first protective layer 11, the first transition layer 13, and the buffer layer 12 in turn is smaller, which reduces the amount of light on the first protective layer. The reflection between the buffer layer 11 and the buffer layer 12 is beneficial for light to pass through the packaging film layer 10 better, and the camera arranged under the screen can receive more light, and the imaging quality is better. On the other hand, the light emitted by the display screen 100 (shown in FIG. 15) has a smaller reflectivity when propagating between the buffer layer 12 and the first transition layer 13, the first transition layer 13 and the first protection layer 11, making the user The image of the display screen 100 seen is clearer, which improves the user experience.

In the description of this specification, descriptions with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean specific features described in conjunction with the embodiment or example , The structure, materials, or characteristics are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples and the features of the different embodiments or examples described in this specification without contradicting each other.

In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless specifically defined otherwise.

Any process or method description described in the flowchart or described in other ways herein can be understood as a module, segment, or part of code that includes one or more executable instructions for implementing specific logical functions or steps of the process , And the scope of the preferred embodiments of the present application includes additional implementations, which may not be in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. This should be It is understood by those skilled in the art to which the embodiments of the present application belong.

Although the embodiments of the present application have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and should not be construed as limitations to the present application. Those of ordinary skill in the art can comment on the foregoing within the scope of the present application. The embodiment undergoes changes, modifications, substitutions, and modifications.

Claims (24)

1. An encapsulation film layer, characterized in that it comprises:

   A first protective layer, the first protective layer having a first refractive index;

   A buffer layer, the buffer layer has a second refractive index, wherein the difference between the first refractive index and the second refractive index is greater than a preset refractive index, and the buffer layer is used for bending the encapsulation film layer Reduce the stress borne by the packaging film layer during folding; and

   The first transition layer, the first transition layer is disposed between the first protective layer and the buffer layer, and the refractive index of the first transition layer is between the first refractive index and the second refractive index between.
2. The packaging film layer of claim 1, wherein the first protective layer is formed of silicon nitride, and the buffer layer is formed of a polymer material.
3. The packaging film layer of claim 2, wherein the first transition layer is formed of silicon oxide or silicon oxynitride.
4. The packaging film layer of claim 1, wherein the first transition layer comprises a first layer and a second layer, and the buffer layer, the second layer, the first layer and the first layer A protective layer is stacked one after another.
5. The packaging film layer of claim 4, wherein the refractive index of the first layer is between the first refractive index and the refractive index of the second layer, and the refractive index of the second layer Between the refractive index of the first layer and the second refractive index.
6. The packaging film layer of claim 5, wherein the first protective layer is formed of silicon nitride, the first layer is formed of silicon oxynitride, and the second layer is formed of silicon oxide. The buffer layer is formed of a polymer material.
7. The packaging film layer according to any one of claims 1 to 6, wherein the packaging film layer further comprises:

   The second protective layer, the buffer layer is arranged between the first protective layer and the second protective layer.
8. 8. The packaging film layer of claim 7, wherein the second protective layer has a third refractive index, and the difference between the third refractive index and the second refractive index is greater than the preset refractive index , The packaging film layer further includes:

   The second transition layer, the second transition layer is disposed between the buffer layer and the second protective layer, and the refractive index of the second transition layer is between the third refractive index and the second refractive index In between, the second transition layer is formed of silicon oxide or silicon oxynitride.
9. 8. The packaging film layer of claim 8, wherein the packaging film layer further comprises:

   The third transition layer, the third transition layer is arranged on the side of the first protective layer away from the buffer layer, and the refractive index of the third transition layer is between the first refractive index and the refractive index of air In between, the second transition layer is formed of silicon oxide or silicon oxynitride.
10. The packaging film layer of claim 9, wherein the thickness of the first transition layer is less than a first preset thickness; and/or

    The thickness of the second transition layer is less than the second preset thickness; and/or

    The thickness of the third transition layer is less than the third preset thickness.
11. A display screen, characterized in that it comprises:

    A display layer, where the display layer is used to display images;

    An encapsulation film layer, the encapsulation film layer includes: a first protective layer, the first protective layer has a first refractive index; a buffer layer, the buffer layer has a second refractive index, wherein the first refractive index and The difference of the second refractive index is greater than the preset refractive index, the buffer layer is used to reduce the stress borne by the packaging film layer when the packaging film layer is bent; and the first transition layer, the first transition layer A transition layer is arranged between the first protective layer and the buffer layer, and the refractive index of the first transition layer is between the first refractive index and the second refractive index.

    The display layer is arranged on a side of the buffer layer away from the first protective layer.
12. 11. The display screen of claim 11, wherein the first protective layer is formed of silicon nitride, and the buffer layer is formed of a polymer material.
13. The display screen of claim 12, wherein the first transition layer is formed of silicon oxide or silicon oxynitride.
14. The display screen of claim 11, wherein the first transition layer includes a first layer and a second layer, and the buffer layer, the second layer, the first layer, and the first layer The protective layers are stacked in sequence.
15. The display screen of claim 14, wherein the refractive index of the first layer is between the first refractive index and the refractive index of the second layer, and the refractive index of the second layer is between Between the refractive index of the first layer and the second refractive index.
16. The display screen of claim 15, wherein the first protective layer is formed of silicon nitride, the first layer is formed of silicon oxynitride, the second layer is formed of silicon oxide, and the buffer The layer is formed of a polymer material.
17. The display screen according to any one of claims 11 to 16, wherein the packaging film layer further comprises a second protective layer, and the buffer layer is disposed on the first protective layer and the second protective layer. Between layers.
18. 18. The display screen of claim 17, wherein the second protective layer has a third refractive index, and the difference between the third refractive index and the second refractive index is greater than the preset refractive index, The encapsulation film layer further includes a second transition layer disposed between the buffer layer and the second protective layer, and the refractive index of the second transition layer is at the third refractive index Between the second refractive index and the second refractive index, the second transition layer is formed of silicon oxide or silicon oxynitride.
19. 18. The display screen of claim 18, wherein the packaging film layer further comprises a third transition layer, and the third transition layer is disposed on a side of the first protective layer away from the buffer layer, The refractive index of the third transition layer is between the first refractive index and the refractive index of air, and the second transition layer is formed of silicon oxide or silicon oxynitride.
20. The display screen of claim 19, wherein:

    The thickness of the first transition layer is less than the first preset thickness; and/or

    The thickness of the second transition layer is less than the second preset thickness; and/or

    The thickness of the third transition layer is less than the third preset thickness.
21. The display screen of claim 11, wherein the display layer comprises a substrate, an anode, a light-emitting layer, and a cathode stacked in sequence, wherein the cathode and the anode are used to energize the light-emitting layer to The light-emitting layer is made to emit light and displays an image; the substrate is used to control the light-emitting layer to emit light to display an image.
22. The display screen of claim 21, wherein the display screen further comprises:

    A light extraction layer, the light extraction layer is disposed between the second protective layer and the cathode, and the light extraction layer is used to conduct light from the light emitting layer to the encapsulation film layer.
23. The display screen of claim 21, wherein the substrate has a fourth refractive index, and the display screen further comprises:

    An anti-reflection coating, the anti-reflection coating is arranged on the side of the substrate away from the anode, and the refractive index of the anti-reflection coating is between the fourth refractive index and the refractive index of air.
24. An electronic device, characterized in that it comprises:

    Camera; and

    The display screen according to any one of claims 11 to 23, the display screen comprising a display area for displaying images, the display area is formed with opposite front and back sides, and the light emitted by the display is along the The back surface points in the direction of the front surface and emits to the outside after passing through the buffer layer, the first transition layer and the first protective layer, and the camera is arranged on the side of the display layer where the back surface is located.

Images