WO2021136356A1 - 电子板卡及电子板卡的芯片散热器的设置方法 - Google Patents

电子板卡及电子板卡的芯片散热器的设置方法 Download PDF

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Publication number
WO2021136356A1
WO2021136356A1 PCT/CN2020/141311 CN2020141311W WO2021136356A1 WO 2021136356 A1 WO2021136356 A1 WO 2021136356A1 CN 2020141311 W CN2020141311 W CN 2020141311W WO 2021136356 A1 WO2021136356 A1 WO 2021136356A1
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Prior art keywords
chips
chip
electronic board
heat dissipation
heat
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PCT/CN2020/141311
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English (en)
French (fr)
Inventor
王健伟
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北京灵汐科技有限公司
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Priority claimed from CN201922481309.8U external-priority patent/CN211577806U/zh
Priority claimed from CN201911414325.3A external-priority patent/CN113126723A/zh
Priority claimed from CN201911414317.9A external-priority patent/CN113126722A/zh
Priority claimed from CN201922472073.1U external-priority patent/CN211577832U/zh
Application filed by 北京灵汐科技有限公司 filed Critical 北京灵汐科技有限公司
Publication of WO2021136356A1 publication Critical patent/WO2021136356A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • This application belongs to the field of electronics and electrical appliances, and relates to an electronic board card and a method for setting a chip radiator of the electronic board card.
  • the present disclosure provides an electronic board card and a method for setting the chip heat sink of the electronic board card.
  • the present application provides an electronic board card.
  • the electronic board card includes a housing, a plurality of heat sinks are installed in the housing, a plurality of chips are installed on the electronic board, and a heat sink is provided on each chip, Each heat sink includes a base that generates heat conduction with the chip and heat dissipation teeth arranged on the base.
  • the electronic board card includes: part or all of the heat sinks have different heat dissipation areas.
  • a method for setting a chip heat sink of an electronic board card is also provided.
  • a plurality of chips are mounted on the electronic board card, each chip is provided with a heat sink, and each heat sink includes a base and a chip that generate heat conduction with the chip.
  • the heat dissipating teeth provided on the base the method includes: adjusting the heat dissipation of part or all of the heat sinks corresponding to the plurality of chips.
  • An electronic integration device which includes a plurality of electronic boards of the present disclosure, and integrates the plurality of electronic boards together.
  • the setting method includes: The multiple chips are chips that work at the same frequency.
  • a computing device including the electronic board or electronic integrated device described in any one of the above.
  • FIG. 1 is a schematic diagram of the PCIe board provided by the present application.
  • FIG. 2 is a schematic diagram of the temperature curve of the PCIe board card chip provided by the present application.
  • FIG. 3 is a schematic diagram of the principle of the method for setting the radiator provided by the present application.
  • FIG. 4 is a schematic diagram of another PCIe board provided by the present application.
  • Fig. 5 is a schematic diagram of a PCIe board with air guiding components provided by the present application (the length direction of the strip structure is parallel to the flow direction of the cooling air);
  • Fig. 6 is a schematic diagram of another PCIe board with air guiding components provided by the present application (the length direction of the strip structure is transverse to the flow direction of the cooling air);
  • Fig. 7 is a schematic diagram of cascading multi-level PCIe boards provided by the present application.
  • 1-PCIe board 2-first radiator, 3-second radiator, 4-inlet end, 5-outlet end, 6-connection interface, 7-air guide component, 21-first heat sink Tooth, 31-the second heat dissipation tooth.
  • first, second, third, etc. may be used herein to describe various structures, these structures should not be limited by these terms. These terms are used to distinguish one structure from another. Therefore, the first structure discussed below may be referred to as the second structure without departing from the teaching of the concepts of the present disclosure.
  • the term "and/or" includes any one and all combinations of one or more of the associated listed items.
  • the present disclosure provides a method for setting the chip heat sink of an electronic board (Peripheral Component Interconnect Express (PCIe) board 1), which is used in the product design process of the PCIe board.
  • PCIe board can adopt a front and rear dual chip layout, such as the front and rear dual chips are distributed in the direction of the cooling air flow.
  • the temperature of the rear chip is relatively high, which causes the heat dissipation of the latter chip to carry the heat of the front chip, which makes the temperature of the two chips inconsistent.
  • the temperature of the back-end chip is much higher than the temperature of the previous chip, and the temperature of the front chip and the back chip are often different.
  • PCIe board 1 if the temperature difference between the front chip and the back chip is large, and the temperature of the latter chip is too high, to give full play to the computing power, the front chip and the back chip need to be at different frequencies, and a more complex algorithm needs to be designed.
  • an electronic board card including a housing, a plurality of heat sinks installed in the housing, a plurality of chips are mounted on the electronic board card, and each chip is provided with a heat sink, and each chip is equipped with a heat sink.
  • Each of the heat sinks includes a base that generates heat conduction with the chip and heat dissipation teeth arranged on the base, and the electronic board includes: part or all of the heat sinks have different heat dissipation areas.
  • the heat dissipation area includes at least one of the following: the heat dissipation area of the heat dissipation teeth of the radiator, and the density of the heat dissipation teeth.
  • an electronic board card wherein a plurality of chips are mounted on the board card, each chip is provided with a heat sink, and each heat sink includes a base that conducts heat conduction with the chip and is arranged on the base.
  • the heat dissipation teeth on the upper part of the heat sink, the heat dissipation area of some or all of the heat dissipation teeth and/or the density of the heat dissipation teeth are different, so that some or all of the multiple chips can achieve different heat dissipation, thereby reducing the number of chips during operation.
  • the temperature difference is provided.
  • a plurality of chips are sequentially arranged along the direction of the cooling air flow and gradually increase the heat dissipation area of the heat dissipation teeth corresponding to the heat sink.
  • Part or all of the heat dissipating teeth of the plurality of heat sinks are set to be different in at least one of the following: height and size, so as to reduce the temperature difference between the plurality of chips during operation; and
  • the radiating teeth of part or all of the plurality of heat sinks are provided with different densities to reduce the temperature difference between the plurality of chips during operation.
  • a plurality of chips are mounted on the electronic board, and a heat sink is provided on the plurality of chips.
  • Each chip is provided with a heat sink, and each heat sink includes a base that generates heat conduction with the chip and a heat dissipation tooth set on the base.
  • the multiple chips include a first chip and a second chip.
  • There is a first heat sink 2 the first heat sink 2 includes first heat dissipation teeth 21, the second chip is provided with a second heat sink 3, and the second heat sink 3 includes second heat dissipation teeth 31.
  • the height of the first heat dissipation teeth 21 is smaller than The height of the second heat dissipation tooth 31 of the second chip.
  • the first chip is arranged close to the air inlet 4 of the cooling air of the board, and the second chip is arranged close to the air outlet 5 of the cooling air of the board.
  • one chip may correspond to one heat sink, or multiple chips may correspond to one heat sink.
  • the electronic board is a PCIe board.
  • the electronic board is formed in a box shape, a plurality of chips and a plurality of heat sinks are located in the box, and the box is formed with an air inlet and an air outlet.
  • the plurality of chips are sequentially arranged along the direction in which the cooling air flows and gradually increase the heat dissipation area of the heat dissipation teeth of the heat sink corresponding to the plurality of chips.
  • the heat dissipation teeth of the plurality of chips have the same width and different heights, and the height of the heat dissipation teeth of the heat sink corresponding to the plurality of chips gradually increases along the direction in which the cooling wind flows.
  • the plurality of chips include a first chip and a second chip, the first chip is arranged close to the inlet end of the cooling air of the board, and the second chip is arranged close to the outlet end of the cooling air of the board; the first chip
  • the height of the heat dissipating teeth is smaller than the height of the heat dissipating teeth of the second chip.
  • the height of the heat dissipating teeth of some or all of the heat sinks is different, and the density of the heat dissipating teeth of some or all of the heat sinks is different.
  • the electronic board is formed in a box shape, a plurality of chips and a plurality of heat sinks are located in the box, and the box is formed with an air inlet and an air outlet.
  • the temperature difference between the multiple chips during operation is: the temperature difference between the multiple chips during operation at a preset frequency.
  • the multiple chips are all working chips with the same frequency.
  • the electronic board is a PCIe card.
  • An electronic integrated device includes a plurality of electronic boards described in the present disclosure, and integrates the plurality of electronic boards together.
  • a computing device including the electronic board or electronic integrated device described in any one of the above.
  • the heat sinks of the multiple chips have the same width and different heights, and the heat sinks corresponding to the multiple chips gradually increase in height along the direction in which the cooling air flows.
  • the plurality of chips include a first chip and a second chip, the first chip is arranged close to the inlet end of the cooling air of the board, and the second chip is arranged close to the outlet end of the cooling air of the board; the first chip
  • the height of the heat dissipating teeth is smaller than the height of the heat dissipating teeth of the second chip.
  • the heat sinks of the multiple chips have the same height and different widths, and the heat sinks of the multiple chips are from narrow to wide along the direction in which the cooling wind flows.
  • the heat sinks of the plurality of chips form a stepped shape from low to high along the direction in which the cooling air flows; the air guide members 7 of the plurality of chips form a step from low to high along the direction of the cooling air flow shape.
  • the air guide member 7 of a plurality of chips is arranged on at least one side of the radiator and has a long strip structure.
  • the length direction of the long strip structure is transverse to the flow direction of the cooling wind and flows along the direction of the cooling wind.
  • the length of the long strip structure is from narrow to wide.
  • the above situation is applicable to the case where the width of the heat sink is different.
  • the width of the heat sink corresponding to the first chip is smaller than the width of the heat sink corresponding to the second chip, and the elongated structure is arranged on the heat sink corresponding to the first chip. At least one side, which can affect the cooling wind of the latter radiator.
  • the present disclosure provides an electronic integrated device, which includes a plurality of electronic boards of the present disclosure, and integrates the plurality of electronic boards.
  • an electronic board card wherein a plurality of chips are mounted on the board card, each chip is provided with a heat sink, and each heat sink includes a base that conducts heat conduction with the chip and is arranged at The heat dissipating teeth on the base, the electronic board card includes: the height and/or size of the heat dissipating teeth of part or all of the heat sink and/or the density of the heat dissipating teeth are different, so that part or all of the multiple chips can achieve different heat dissipation. Thereby reducing the temperature difference between multiple chips during operation.
  • the height and/or size of the heat dissipating teeth of some or all of the heat sinks are different, so as to reduce the temperature difference between multiple chips during operation;
  • the radiating teeth of some or all of the heat sinks are arranged differently to reduce the temperature difference between multiple chips during operation.
  • the plurality of chips includes a first chip and a second chip, the first chip is arranged close to the inlet end of the cooling air of the board, and the second chip is arranged close to the outlet end of the cooling air of the board.
  • the electronic board is a PCIe board.
  • the electronic board card is formed in a box shape, a plurality of chips and a plurality of heat sinks are located in the box, and the box is formed with an air inlet and an air outlet.
  • the temperature difference between the plurality of chips during operation is: the temperature difference between the plurality of chips during operation at a preset frequency.
  • the multiple chips are chips that need to work at the same frequency.
  • An electronic integrated device which includes a plurality of electronic boards provided in the present disclosure, and integrates the plurality of electronic boards together.
  • the present disclosure provides a method for setting a chip heat sink of an electronic board card, wherein a plurality of chips are installed on the board card, and a heat sink is provided on each of the plurality of chips, and the heat sink is formed with a plurality of heat dissipation teeth, Including the following steps:
  • S01 First-level heat dissipation adjustment: By adjusting the size of part or all of the heat dissipation teeth of the radiator, multiple chips can achieve different heat dissipation to reduce the temperature difference between multiple chips during operation.
  • S02 Second-level heat dissipation adjustment: By adjusting the density of some or all of the heat dissipation teeth of the radiator, to reduce the temperature difference between multiple chips during operation.
  • this application can also adopt the following methods to reduce the temperature difference between chips:
  • the first level of heat dissipation adjustment By adjusting the density of the heat dissipation teeth of some or all of the radiators, multiple chips can achieve different heat dissipation to reduce the temperature difference between multiple chips during operation.
  • N02 Second-level heat dissipation adjustment: By adjusting the size of part or all of the heat dissipation teeth of the radiator, the temperature difference between multiple chips during operation is reduced.
  • the first level of heat dissipation adjustment By constructing multiple chip models, and by thermodynamic simulation, adjust the size of some or all of the heat sink teeth to reduce the temperature difference between multiple chips during operation;
  • the second level of heat dissipation Adjustment By constructing a model of multiple chips, and by means of thermodynamic simulation, adjust the density of some or all of the heat sink teeth to reduce the temperature difference between multiple chips during operation.
  • step S01 by adjusting the height, length or width of the heat dissipation teeth, the temperature difference between multiple chips during operation is reduced; in step S02, the number of heat dissipation teeth is adjusted to reduce the temperature difference between multiple chips during operation.
  • the temperature difference between the multiple chips during operation is: the temperature difference between the multiple chips during operation at a preset frequency.
  • the present disclosure also provides an electronic integrated device, which includes a plurality of electronic boards of the present disclosure, and integrates the plurality of electronic boards together.
  • the present disclosure also provides a method for setting the chip heat sink of the electronic board according to any one of the above embodiments, or an electronic board according to any one of the above embodiments, or the above-mentioned integrated electronic device, wherein:
  • the multiple chips are chips that work at the same frequency.
  • the present disclosure through two-level stepwise control, firstly, by analyzing the heat generation of the chip, adjusting the height of the heat-dissipating teeth to realize the first-level optimization, and then, through the optimization of the heat-dissipating teeth, the number of teeth of different heat-dissipating teeth is optimized for the second Optimization, so as to achieve the optimization of the heat dissipation effect.
  • the temperature situation of the optimized chip using the first stage of the heat sink of the present disclosure is shown.
  • the curves of DIE1-1 in Fig. 2 correspond to different heights of the heat-dissipating teeth, which are 8, 10, 12, 13, 14, 15, 16, 18, 20, and 22 respectively.
  • the height of the heat dissipating teeth corresponding to the curve of DIE1-2 is the same, both are 22.
  • the present disclosure solves the problem of cascading multi-chip arrays when two chips or multiple chips work at the same frequency at the same time, so that relatively accurate temperature control can be performed, and a better system-level working effect can be achieved.
  • this solution can perform more precise quantization control because it is a two-level control, and can realize that when multiple chips work at the same frequency, each chip can relatively exert the effect of maximum performance.
  • the computing performance of multiple chips can be effectively optimized, the "barrel effect" when working at the same frequency can be effectively avoided, and the integrated computing performance of the entire system chip can be improved.
  • the present disclosure adopts multi-level optimization control to achieve the purpose of temperature balance adjustment.
  • This disclosure mainly focuses on the heat dissipation of high-power chips, for example, when the chips work at the same frequency at similar temperatures, and the chips are cascaded with each other, it can be extended to other product forms, with similar design ideas, in multi-level chip arrays or similar situations
  • the temperature of the front and rear chips or heating modules should be as similar as possible to solve the system-level heat dissipation problem.
  • the height, width or length of the radiator can be adjusted.
  • the heat dissipation teeth of the radiator can be optimized to achieve the chip Or the heating module can approximate the temperature, so as to achieve a configuration with better system-level performance.
  • the present disclosure also provides a computing device, including the electronic board or electronic integrated device of the present disclosure.
  • the applicable scenarios are not only that.
  • this method in order to solve the difference in the heating temperature of the chips of different sorts, this method can also be used to optimize and solve the problem.
  • the product form is not only as shown in the figure. , You can use related methods to optimize the radiator and optimize the system's heat dissipation.
  • the present disclosure provides a method for setting a chip heat sink of an electronic board card and an electronic board card.
  • the electronic board card includes a plurality of chips, and the plurality of chips are correspondingly provided with a plurality of heat sinks, and the heat sink is formed with a plurality of heat dissipation teeth.
  • the present disclosure realizes the reduction of temperature difference through the size adjustment of a plurality of chip heat dissipation teeth, and realizes the first-level adjustment; through the density adjustment of the heat dissipation teeth, a more precise adjustment of the temperature difference is realized.
  • the present disclosure adjusts the size of multiple chip heat sinks and adjusts the density of heat dissipating teeth by constructing models of multiple chips and thermodynamic simulation, so as to reduce the temperature difference between multiple chips during operation and solve the barrel effect
  • the "short board” effect, the heat dissipation capacity of the front and rear chips are basically the same, and a better design is realized, so that the temperature difference between multiple chips is reduced and energy efficiency is improved.
  • the present disclosure provides a method for setting a PCIe board chip radiator and a PCIe board: the present disclosure first realizes the reduction of temperature difference by adjusting the height of the front and rear chip radiators, realizes the first level of adjustment, and can basically solve the problem before and after the chip.
  • the present disclosure provides a method for setting the chip heat sink of an electronic board (Peripheral Component Interconnect Express (PCIe) board 1), which is used in the product design process of the PCIe board.
  • PCIe board can adopt a front and rear dual chip layout, such as the front and rear dual chips are distributed in the direction of the cooling air flow.
  • the temperature of the rear chip is relatively high, which causes the heat dissipation of the latter chip to carry the heat of the front chip, which makes the temperature of the two chips inconsistent.
  • the temperature of the back-end chip is much higher than the temperature of the previous chip, and the temperature of the front chip and the back chip are often different.
  • PCIe board 1 if the temperature difference between the front chip and the back chip is large, and the temperature of the latter chip is too high, to give full play to the computing power, the front chip and the back chip need to be at different frequencies, and a more complex algorithm needs to be designed.
  • the present disclosure provides a method for setting a chip heat sink of an electronic board (PCIe board 1), which is applied to multi-chip array cascading.
  • PCIe board 1 In the dual-chip PCIe board card 1, in order to ensure that the two front and rear chips work at the same frequency, through the optimization of the design of the front and rear heat dissipation teeth, the temperature of the back chip is reduced, and the temperature of the two chips is as close as possible, so that the frequency is basically the same. In this way, the maximum computing power of the product can be exerted. Through the optimization of the heat dissipation gear, the problem of working at the same frequency can be solved, avoiding the design of complex algorithm control, and realizing the situation where the working at the same frequency can exert the maximum computing power.
  • a plurality of chips are mounted on the electronic board card, each chip is provided with a heat sink, and each heat sink includes a base that generates heat conduction with the chip And the heat dissipation teeth provided on the base, by adjusting the heat dissipation of the plurality of heat sinks corresponding to part or all of the plurality of chips, so as to reduce the temperature difference between the plurality of chips during operation.
  • adjusting the heat dissipation of the radiator includes: the first level of heat dissipation adjustment: through the adjustment of the heat dissipation area of part or all of the multiple radiators, the multiple chips can achieve different heat dissipation, thereby reducing the number of chips during operation. Temperature difference between
  • the second level of heat dissipation adjustment by arranging multiple air guiding components on part or all of the multiple radiators, the multiple air guiding components affect the airflow through some or all of the radiators, reducing the operation of multiple chips The temperature difference between.
  • Adjusting the heat dissipation capacity of the heat sinks corresponding to the multiple chips includes the following steps:
  • S010 First-level heat dissipation adjustment: By adjusting the size of some or all of the multiple heat sinks, multiple chips can achieve different heat dissipation, thereby reducing the temperature difference between multiple chips during operation.
  • S020 Second-level heat dissipation adjustment: By arranging multiple air guide parts 7 on some or all of the multiple heat sinks, the temperature difference between multiple chips during operation is reduced.
  • the heat dissipation teeth on the front and rear chips are optimized, and the heat dissipation area of the heat dissipation teeth and the matching with the air duct are controlled by simulation.
  • the simulation software Through the simulation software, the final temperature of the front and rear chips can be controlled within a certain range, so that the final temperature of the front and rear chips can be controlled within a certain range. Realize the same frequency work of the chip, and exert the maximum "computing power" and "energy efficiency ratio" of the whole.
  • the first level of optimization is realized, and the air volume structure is adjusted to achieve a more fine dynamic adjustment of heat, and the front chip and the rear chip
  • the temperature control is more precise, so as to achieve the best effect.
  • the first-level heat dissipation adjustment of the present disclosure by constructing a model of multiple chips, and by thermodynamic simulation, adjust the size of multiple chip heat sinks to reduce the temperature difference between multiple chips during operation;
  • second-level heat dissipation Adjustment By constructing a model of multiple chips, and by means of thermodynamic simulation, the structure and arrangement of the multiple air guiding components 7 arranged on the heat sinks of some chips are adjusted to reduce the temperature difference between the multiple chips during operation.
  • step S010 the height of the heat sink is adjusted to reduce the temperature difference between multiple chips during operation; in step S020, the number of multiple air guide members 7 is adjusted to reduce the temperature difference between multiple chips during operation.
  • the temperature difference between the multiple chips during operation is: the temperature difference between the multiple chips during operation at a preset frequency.
  • the present disclosure also provides an electronic board card with a plurality of chips mounted on the board, and a heat sink is provided on the plurality of chips.
  • the plurality of chips includes a first chip and a second chip.
  • the height of the first heat sink 2 of the first chip is smaller than the height of the second heat sink 3 of the second chip, and the first heat sink 2 of the first chip is provided with the Multiple wind guide parts7.
  • the first chip is arranged close to the air inlet 4 of the cooling air of the board, and the second chip is arranged close to the air outlet 5 of the cooling air of the board.
  • the plurality of wind guide members 7 are in a plurality of strip-shaped structures, and the plurality of strip-shaped structures are arranged at intervals.
  • the electronic board is also provided with a connection interface 6 near the air inlet 4, and the connection interface 6 may be a power interface.
  • the plurality of wind guide members 7 are a plurality of elongated structures, and the plurality of elongated structures are arranged at intervals.
  • the air guide member 7 is arranged on the heat sink of the first chip.
  • the present disclosure provides an electronic board card, wherein a plurality of chips are installed on the electronic board card, each chip is provided with a heat sink, and the electronic board card includes: part or all of the plurality of chip heat sinks have different heat dissipation areas , So that part or all of the chips can achieve different heat dissipation, reducing the temperature difference between the multiple chips during operation.
  • the multiple chips are arranged in sequence along the direction in which the cooling air flows, and the heat dissipation area of the heat sink corresponding to the multiple chips gradually increases.
  • the heat sinks of the multiple chips have the same width and different heights, and the heat sinks corresponding to the multiple chips gradually increase in height along the direction in which the cooling air flows.
  • the heat sinks of part or all of the chips are provided with air guide members 7 to make the cooling air flow through the heat sinks of some or all of the chips different, so as to reduce the temperature difference between the multiple chips during operation.
  • the heat sinks of the plurality of chips form a stepped shape from low to high along the direction in which the cooling air flows; the air guide members of the plurality of chips form a stepped shape from low to high along the direction of the cooling air flow .
  • the length direction of the plurality of strip-like structures is arranged substantially parallel to the flow direction of the cooling air (Figure 5); or the length direction of the plurality of strip-like structures is arranged substantially transverse to the flow direction of the cooling air (Figure 6).
  • the length direction of the plurality of strip structures is arranged substantially transverse to the flow direction of the cooling wind, the height of the plurality of strip structures is different, and is formed in a stepped shape, and the height of the plurality of strip structures gradually increases along the direction in which the cooling wind flows.
  • the electronic board card of the present disclosure may be a PCIe card.
  • the heat sinks of the multiple chips have the same width and different heights, and the heat sinks corresponding to the multiple chips gradually increase in height along the direction in which the cooling air flows.
  • the electronic board is arranged in a box body, the box body is provided with an air inlet and an air outlet for cooling air, and the air guide member is arranged on the upper end surface of the radiator corresponding to the air guide member and the box Between the top cover of the body.
  • the plurality of wind guide members are a plurality of elongated structures arranged side by side, and the length direction of the plurality of elongated structures is arranged substantially parallel to the flow direction of the cooling wind; or the length of the plurality of elongated structures The direction is approximately transversely and perpendicular to the flow direction of the cooling wind.
  • the heat sinks of the multiple chips have the same height and different widths, and the heat sinks of the multiple chips are from narrow to wide along the direction in which the cooling wind flows.
  • the heat sinks of the plurality of chips form a stepped shape from low to high along the direction in which the cooling air flows; the air guide members of the plurality of chips form a stepped shape from low to high along the direction of the cooling air flow .
  • the air guide member 7 of a plurality of chips is arranged on at least one side of the radiator and has a long strip structure.
  • the length direction of the strip structure is transverse to the flow direction of the cooling wind and flows along the cooling wind.
  • the length of the long strip structure is from narrow to wide.
  • the length direction of the plurality of elongated structures is substantially transverse to the flow direction of the cooling wind, the heights of the plurality of elongated structures are different, and are formed in a stepped shape, and the height of the plurality of elongated structures gradually increases in the direction of the cooling wind.
  • the multiple chips are all working chips with the same frequency.
  • the present disclosure also provides an electronic integrated device, which includes a plurality of electronic boards described in the present disclosure, and integrates the plurality of electronic boards together.
  • the electronic board card of the present disclosure may be a PCIe card.
  • the present disclosure also provides an electronic integrated device, which includes a plurality of electronic boards described in the present disclosure, and integrates the plurality of electronic boards together.
  • the temperature difference between the multiple chips during operation is: the temperature difference between the multiple chips during operation at a preset frequency.
  • the present disclosure also provides an electronic board card.
  • a plurality of chips are mounted on the electronic board card, and each chip is provided with a heat sink.
  • Each heat sink includes a base that generates heat conduction with the chip and is arranged at The heat dissipating teeth on the base, the electronic board card includes: part or all of the multiple heat sinks have different heat dissipation capacity, so that part or all of the multiple chips realize the heat dissipation corresponding to the multiple chips, so as to reduce The temperature difference between the multiple chips during operation.
  • the air flow through some or all of the heat sinks is affected, and the temperature difference between the plurality of chips during operation is reduced.
  • the plurality of chips includes a first chip and a second chip.
  • the height of the heat sink of the first chip is smaller than the height of the heat sink of the second chip; the heat sink of the first chip is provided with a plurality of wind guide parts to reduce the number of chips. The temperature difference between runtimes.
  • the first chip is arranged close to the inlet end of the cooling air of the board, and the second chip is arranged close to the outlet end of the cooling air of the board.
  • the plurality of wind guide members are in a plurality of strip-shaped structures, and the plurality of strip-shaped structures are arranged at intervals.
  • the length directions of the plurality of strip structures are arranged substantially parallel to the flow direction of the cooling wind; or the length directions of the plurality of strip structures are arranged substantially transverse to the flow direction of the cooling wind.
  • the length direction of the plurality of strip-shaped structures is arranged substantially transverse to the flow direction of the cooling wind, the height of the plurality of strip-shaped structures is different, and is formed in a stepped shape, and the height of the plurality of strip-shaped structures gradually increases in the direction of the cooling wind.
  • An electronic integrated device which includes a plurality of any one of the electronic boards described in the present disclosure, and integrates the plurality of electronic boards.
  • the present disclosure also provides a method for setting the chip heat sink of the electronic board according to any one of the above embodiments, or an electronic board according to any one of the above embodiments, or the above-mentioned integrated electronic device, wherein:
  • the multiple chips are chips that work at the same frequency.
  • the unit of the height of the radiating teeth is millimeter mm.
  • the present disclosure solves the problem that when two chips or multiple chips work at the same frequency at the same time, in the case of multi-chip arrays cascaded, relatively accurate temperature control can be performed, and a better system-level working effect can be achieved.
  • the solution of this application is a two-level control, and the first-level control can be controlled in a relative range.
  • the second-level control can be implemented with a simple structure and more precise quantitative control, which can be achieved by simple pasting.
  • the present disclosure adopts multi-level control to achieve the purpose of temperature regulation.
  • the main application of the present disclosure is focused on the heat dissipation of high-power chips. For example, when the chips work at similar temperatures and are cascaded with each other at the same frequency, they can be extended to other product forms. The design ideas are similar, and different heat sinks can be installed in different positions.
  • the uniformity of the temperature of the chip is achieved through the universality of the radiator installation position, the difference in the height of the radiator and the control of the dynamic temperature control "valve".
  • the present disclosure provides a method for setting a chip radiator of an electronic board and an electronic board.
  • the present disclosure firstly adjusts the height of the front and rear chip radiators to reduce the difference in temperature and achieve the first level of adjustment, and then through the "valve" (air guide member 7) that controls the air volume, to achieve more precise adjustment of the temperature difference,
  • the heat dissipation capacity of the front and rear chips is basically the same, and a better design is realized, so that the temperature difference between multiple chips is reduced and energy efficiency is improved.
  • the present disclosure provides a method for setting a chip heat sink of an electronic board card and an electronic board card.
  • the PCIe board card includes a plurality of chips, and a plurality of heat sinks are correspondingly provided on the plurality of chips.
  • the present disclosure realizes the reduction of temperature difference through height adjustment of multiple chip heat sinks, and realizes the first-level adjustment; by controlling the air guide component, more precise adjustment of the temperature difference is realized.
  • the present disclosure adjusts the size of multiple chip radiators and wind guide components by constructing models of multiple chips and thermodynamic simulation, reducing the temperature difference between multiple chips during operation, and solving the "short" in the barrel effect theory. With the "board” effect, the heat dissipation capacity of the front and rear chips is basically the same, achieving a better design, which reduces the temperature difference between multiple chips and improves energy efficiency.

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Abstract

本申请提供一种电子板卡及电子板卡的芯片散热器的设置方法，所述电子板卡包括多个芯片，多个芯片上对应设置有多个散热器。

Description

电子板卡及电子板卡的芯片散热器的设置方法
本申请要求在2019年12月31日提交中国专利局、申请号为201911414317.9、在2019年12月31日提交中国专利局、申请号为201911414325.3、在2019年12月31日提交中国专利局、申请号为201922472073.1和在2019年12月31日提交中国专利局、申请号为201922481309.8的中国专利申请的优先权，以上申请的全部内容通过引用结合在本申请中。
技术领域
本申请属于电子和电器领域，涉及一种电子板卡及电子板卡的芯片散热器的设置方法。
背景技术
随着大数据和深度学习得到越来越多应用，对于底层硬件和芯片也提出了新的要求。与处理器强调“处理能力”不同，大数据和深度学习应用强调的是“算力”以及“能效比”。由于大数据和深度学习应用算法中的特征提取和处理使用的都是实际的计算，因此需要高算力的芯片以期在尽可能短的时间里完成计算。另一方面，能效比也是重要指标。能效比指的是完成计算所需要的能量，能效比越大则完成相同计算消耗的能量越小。
在大功率芯片领域，例如在芯片阵列级联中的应用场景，芯片的散热优化越来越成为产品设计的关注点。对于双芯片板卡或是多芯片板卡需要调节工作频率和功耗一致的情况，很难比较精确快速的调节，而复杂的算法又过于复杂，且具有一定的滞后性，整体的效果也未必理想。
在实际的多级芯片矩阵中，往往存在风道情况复杂以及温度分布不均的情况，如果要进行临时性精确调节，往往需要反复临时调整和生产散热器，产品成本、周期和复杂度都比较高。实际产品的情况较为复杂，包括安装装配工艺，产品制造质量差异、板卡在整机中的分布布局和整机在系统中位置，这些实际产品的情况都会对板卡前后芯片散热情况产生影响。
而对于多芯片大规模集群阵列的情况，往往希望芯片能够高效的同频工作，能够发挥系统的最大优势，而对于芯片的温度散热温度如何能够尽量做到灵活调控，如何充分发挥每一个芯片的运算效率一直是个问题。
发明内容
本公开提供一种电子板卡及电子板卡的芯片散热器的设置方法。
本申请提供一种电子板卡，所述电子板卡包括外壳，安装在所述外壳内的多个散热器，所述电子板卡上安装有多个芯片，每个芯片上设有散热器，每个散热器包括与芯片产生热传导作用的基座和设置在基座上的散热齿，所述电子板卡包括：部分或全部散热器的散热面积设置不同。
还提供一种电子板卡的芯片散热器的设置方法，所述电子板卡上安装有多个芯片，每个芯片上设有散热器，每个散热器包括与芯片产生热传导作用的基座和设置在基座上的散热齿，所述方法包括：调整部分或全部所述多个芯片对应的散热器的散热量。
还提供一种电子集成装置，包括多个本公开的电子板卡，并将所述多个电子板卡集成到一起。
还提供一种如上述任一所述的电子板卡的芯片散热器的设置方法，或者一种如上述任一所述的电子板卡，或者如上述的电子集成装置，所述设置方法包括：所述多个芯片为同频工作的芯片。
还提供一种计算设备，包括上述任一项所述的电子板卡或电子集成装置。
附图说明
图1是本申请提供的PCIe板卡的示意图；
图2是本申请提供的PCIe板卡芯片的温度曲线示意图；
图3是本申请提供的散热器的设置方法的原理示意图；
图4是本申请提供的另一种PCIe板卡的示意图；
图5是本申请提供的一种带有导风部件的PCIe板卡的示意图(条状结构的长度方向平行于冷却风的流动方向)；
图6是本申请提供的另一种带有导风部件的PCIe板卡的示意图(条状结构的长度方向横向于冷却风的流动方向)；
图7是本申请提供的多级PCIe板卡级联在一起的示意图。
其中：1-PCIe板卡，2-第一散热器，3-第二散热器，4-进风端，5-出风端，6-连接接口，7-导风部件，21-第一散热齿，31-第二散热齿。
具体实施方式
现在将参考附图描述示例实施例。然而，示例实施例能够以多种形式实施，且不应被理解为限于在此阐述的实施例。在图中相同的附图标记表示相同或类似的部分，因而将省略对它们的重复描述。
此外，所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。可以实现本公开的技术方案而没有特定细节中的一个或更多，或者可以采用其它的方法、组元、装置、步骤等。在其它情况下，不示出或描述公知方法、装置、实现或者操作以避免模糊本公开的多个方面。
虽然本文中可能使用术语第一、第二、第三等来描述多种结构，但这些结构不应受这些术语限制。这些术语乃用以区分一结构与另一结构。因此，下文论述的第一结构可称为第二结构而不偏离本公开概念的教示。如本文中所使用，术语“及/或”包括相关联的列出项目中的任一个及一或多者的所有组合。
附图只是示例实施例的示意图，附图中的模块或流程并不一定是实施本公开所必须的，因此不能用于限制本公开的保护范围。
下面结合附图1-7对本公开中的实施方式的内容进行描述。
如图1所示，本公开提供一种电子板卡(高速串行计算机扩展总线标准(Peripheral Component Interconnect Express，PCIe)板卡1)的芯片散热器的设置方法，在PCIe板卡的产品设计过程中，为了在有限设备空间内充分发挥系统性能，PCIe板卡可采用前后双芯片的布局方式，如前、后双芯片为在冷却风的流动方向上，前、后分布。而双芯片的布局方式，由于进入后芯片的冷却风已经冷却了前芯片，后芯片的温度较高，从而导致散热方面往往后一个芯片的要承载前面芯片的热量，从而使两个芯片温度不一致，后端芯片的温度远高于前一个芯片的温度，前芯片和后芯片温度往往有一定差异。
在PCIe板卡1中，如果前芯片和后芯片之间温度差异大，且后一个芯片温度过高，要充分发挥算力，需要前芯片和后芯片在不同频率，需要设计较为复杂的算法实现算力的发挥；但对于芯片矩阵连接，且需要工作在同样频率的情况，即使通过复杂的算法优化，也只能以最低频率为基准，芯片的算力和能效比都会降低。
一实施例中，提供一种电子板卡，包括外壳，安装在所述外壳内的多个散热器，所述电子板卡上安装有多个芯片，每个芯片上均设有散热器，每个散热器均包括与芯片产生热传导作用的基座和设置在所述基座上的散热齿，所述电子板卡包括：部分或全部散热器的散热面积设置不同。
其中：所述散热面积包括以下至少之一：散热器的散热齿的散热面积、散热齿的疏密。
一实施例中，提供一种电子板卡，所述板卡上安装有多个芯片，每个芯片上设有散热器，每个散热器包括与芯片产生热传导作用的基座和设置在基座上的散热齿，部分或全部散热器的散热齿的散热面积和/或散热齿的疏密设置不同，使部分或全部的多个芯片实现不同的散热，从而减少多个芯片在运行时之间的温差。
一实施例中，多个芯片沿冷却风流动的方向依次设置并逐渐增大其对应散热器的散热齿的散热面积。
设置部分或全部的多个散热器的散热齿的以下至少之一不同：高度、大小，以减少在运行时所述多个芯片之间的温差；以及
设置部分或全部的多个散热器的散热齿的疏密不同，以减少在运行时所述多个芯片之间的温差。
如图1所示，本公开的电子板卡，所述电子板卡上安装有多个芯片，多个芯片上均设有散热器。每个芯片上均设有散热器，每个散热器均包括与芯片产生热传导作用的基座和设置在基座上的散热齿，多个芯片包括第一芯片和第二芯片，第一芯片设有第一散热器2，第一散热器2包括第一散热齿21，第二芯片设有第二散热器3，第二散热器3包括第二散热齿31，第一散热齿21的高度小于第二芯片的第二散热齿31的高度。第一芯片靠近板卡的冷却风的进风端4设置，第二芯片靠近板卡冷却风的出风端5设置。
在一种实施方式中，一个芯片可以对应一个散热器，也可以多个芯片对应一个散热器。
所述电子板卡为PCIe板卡。所述电子板卡形成为盒状，多个芯片和多个散热器位于所述盒内，所述盒形成有进风口和出风口。
所述多个芯片沿冷却风流动的方向依次设置并逐渐增大所述多个芯片对应的散热器的散热齿的散热面积。
所述多个芯片的散热齿具有相同的宽度和不同的高度，所述多个芯片沿所述冷却风流动的方向，所述多个芯片对应的散热器的散热齿的高度逐渐增高。
所述多个芯片包括第一芯片和第二芯片，所述第一芯片靠近板卡的冷却风的进风端设置，第二芯片靠近板卡冷却风的出风端设置；所述第一芯片的散热齿的高度小于第二芯片的散热齿的高度。
设置部分或全部散热器的散热齿的高度不同，并且部分或全部散热器的散热齿的疏密设置不同。
所述电子板卡形成为盒状，多个芯片和多个散热器位于所述盒内，所述盒形成有进风口和出风口。
所述多个芯片在运行时之间的温差为：多个芯片在预设频率运行时之间的温差。
所述多个芯片均为同频工作芯片。所述电子板卡为PCIe卡。
还电子集成装置，包括多个本公开所述的电子板卡，并将所述多个电子板卡集成一起。
还提供一种计算设备，包括上述任一项所述的电子板卡或电子集成装置。
多个芯片的散热器具有相同的宽度和不同的高度，所述多个芯片对应的散热器沿所述冷却风流动的方向，高度逐渐增高。
所述多个芯片包括第一芯片和第二芯片，所述第一芯片靠近板卡的冷却风的进风端设置，第二芯片靠近板卡冷却风的出风端设置；所述第一芯片的散热齿的高度小于第二芯片的散热齿的高度。
多个芯片的散热器具有相同的高度和不同的宽度，所述多个芯片的散热器沿所述冷却风流动的方向，从窄到宽。
多个芯片的散热器沿所述冷却风流动的方向，形成从低到高的阶梯状；所述多个芯片的导风部件7沿所述冷却风流动的方向，形成从低到高的阶梯状。
多个芯片的导风部件7设置在所述散热器的至少一侧，为长条形结构，所述长条形结构的长度方向横向于冷却风的流动方向，且沿所述冷却风流动的方向，长条形结构的长度从窄到宽。上述这种情况，适用于散热器的宽度不同的情况，如第一芯片对应的散热器的宽度小于第二芯片对应的散热器的宽度，长条形结构设置在第一芯片对应的散热器的至少一侧，从而可影响后一个散热器的冷却风。
本公开提供一种电子集成装置，包括多个本公开的电子板卡，并将所述多个电子板卡集成一起。
一实施例中，提供一种电子板卡，所述板卡上安装有多个芯片，每个芯片上均设有散热器，每个散热器均包括与芯片产生热传导作用的基座和设置在基座上的散热齿，电子板卡包括：部分或全部散热器的散热齿的高度和/或大小和/或散热齿的疏密设置不同，使部分或全部的多个芯片实现不同的散 热，从而减少多个芯片在运行时之间的温差。
一实施例中，设置部分或全部散热器的散热齿的高度和/或大小不同，减少多个芯片在运行时之间的温差；
设置部分或全部散热器的散热齿疏密设置不同，减少多个芯片在运行时之间的温差。
一实施例中，多个芯片包括第一芯片和第二芯片，第一芯片靠近板卡的冷却风的进风端设置，第二芯片靠近板卡冷却风的出风端设置。
一实施例中，所述电子板卡为PCIe板卡。
一实施例中，所述电子板卡形成为盒状，多个芯片和多个散热器位于所述盒内，所述盒形成有进风口和出风口。
一实施例中，所述多个芯片在运行时之间的温差为：多个芯片在预设频率运行时之间的温差。
一实施例中，所述多个芯片为需要同频工作的芯片。
还提供一种电子集成装置：包括多个本公开提供的一个电子板卡，并将所述多个电子板卡集成一起。
本公开提供一种电子板卡的芯片散热器的设置方法，所述板卡上安装有多个芯片，所述多个芯片上均设有散热器，所述散热器形成有多个散热齿，包括如下步骤：
S01：第一级散热调整：通过调整部分或全部散热器的散热齿的尺寸，使多个芯片实现不同的散热，以减少在运行时多个芯片之间的温差。
S02：第二级散热调整：通过调整部分或全部散热器的散热齿的疏密，以减少在运行时多个芯片之间的温差。
同样地，本申请也可采用如下方式以减少芯片间的温差：
N01：第一级散热调整：通过调整部分或全部散热器的散热齿的疏密，使多个芯片实现不同的散热，以减少在运行时多个芯片之间的温差。
N02：第二级散热调整：通过调整部分或全部散热器的散热齿的尺寸，以减少在运行时多个芯片之间的温差。
第一级散热调整：通过构建多个芯片的模型，并通过热力学仿真的方式，调整部分或全部散热器的散热齿的尺寸，以减少在运行时多个芯片之间的温差；第二级散热调整：通过构建多个芯片的模型，并通过热力学仿真的方式，调整部分或全部散热器的散热齿的疏密，减少在运行时多个芯片之间的温差。 步骤S01中通过调整散热齿的高度、长度或宽度，减少在运行时多个芯片之间的温差；步骤S02中通过调整散热齿的个数，减少在运行时多个芯片之间的温差。
所述在运行时多个芯片之间的温差为：在预设频率运行时多个芯片之间的温差。
如图7所示，本公开还提供一种电子集成装置，包括多个本公开的电子板卡，并将所述多个电子板卡集成到一起。
本公开还提供一种上述实施例任一所述的电子板卡的芯片散热器的设置方法，或者一种上述实施例任一所述的电子板卡，或者如上述的电子集成装置，其中：所述多个芯片为同频工作的芯片。
本公开中，通过两级的逐步控制，首先，通过分析芯片的发热量，调整散热齿的高度，实现第一级的优化，然后，通过散热齿的优化，优化不同散热齿的齿数进行二次优化，从而实现散热效果的优化。
如图2和表1所示，示意出了采用本公开的散热器的第一级的优化的芯片的温度情况，首先通过前后散热齿的高度差异，通过仿真，找到最佳的温度位置和散热齿高度。图2中DIE1-1的曲线对应的散热齿高度不同，分别为8、10、12、13、14、15、16、18、20、22。DIE1-2的曲线对应的散热齿高度相同，均为22。
表1
Figure PCTCN2020141311-appb-000001
本公开的散热器的第一级的优化的芯片的温度情况，其结果如表2所示。
表2
Figure PCTCN2020141311-appb-000002
本公开解决两个芯片或多个芯片同时同频工作时，对多芯片阵列级联的情况，能够进行比较精确的温度控制，实现较优的系统级工作效果。相对于相关技术，此方案由于是两级控制，可以进行更加精细的量化控制，可以实现多芯片同频工作时，每一个芯片都相对能够发挥最大性能的效果。
在不增加均热板或热管成本的情况下，能够有效优化多芯片的运算性能，能够有效避免同频工作时的“木桶效应”，提高整个系统的芯片综合运算性能。
在多级芯片阵列互联的产品使用中，通过第一级的散热齿高度优化和第二级散热齿的疏密的优化，实现前后芯片之间的温度均衡，从而实现芯片阵列系统性能的更优化，本公开采用了多级优化控制达到温度均衡调节的目的。
本公开主要集中在大功率芯片散热中，例如应用于芯片同频工作在相近温度，芯片之间相互级联的情况，可以扩展到其它产品形态，设计思想类似，在多级芯片阵列或类似情况中，需要前后芯片或发热模块的温度尽量相似，解决系统级的散热问题，可以通过散热器高度、宽度或长度的调节，也可以在此基础上，对散热器的散热齿进行优化，达到芯片或发热模块能够温度近似，从而实现系统级性能较优的配置。
本公开还提供一种计算设备，包括本公开的电子板卡或电子集成装置。
本公开中，适用场景不仅仅如此，在不同功耗和不同芯片的场景，为了解决不同排序的芯片发热温度的不同，也可以采用此方法进行优化和解决，产品形态也不仅仅如图例所示，可以采用相关方法，对散热器进行优化，优化系统散热。
本公开提供的电子板卡的芯片散热器的设置方法及电子板卡，电子板卡包括多个芯片，多个芯片上对应设置有多个散热器，所述散热器形成有多个散热齿。本公开通过多个芯片散热齿的尺寸调整，实现温度的差异性缩小，实现第一级别的调整；通过散热齿的疏密调整，实现温度差异的更加精确调整。本公开通过构建多个芯片的模型，通过热力学仿真的方式，调整多个芯片散热器的尺寸，和调整散热齿的疏密，以减少在运行时多个芯片之间的温差，解决木桶效应理论中“短板”效应，前后芯片散热能力基本一致，实现较优设计，从而使得多个芯片的温度差值缩小，提高能效。
本公开提供一种PCIe板卡芯片散热器的设置方法及PCIe板卡：本公开首先通过前后芯片散热器的高度调整，实现温度的差异性缩小，实现第一级别的调整，能够基本解决芯片前后温度在一定范围内的优化；后面对前后散热齿的疏密的优化，实现第二级的调整，将系统的散热面积与系统风阻更加优化，能让系统的散热更加均衡，芯片的效能发挥更优。
如图3所示，本公开提供一种电子板卡(高速串行计算机扩展总线标准(Peripheral Component Interconnect Express，PCIe)板卡1)的芯片散热器的设置方法，在PCIe板卡的产品设计过程中，为了在有限设备空间内充分发挥系统性能，PCIe板卡可采用前后双芯片的布局方式，如前、后双芯片为在冷却风的流动方向上，前、后分布。而双芯片的布局方式，由于进入后芯片的冷却风已经冷却了前芯片，后芯片的温度较高，从而导致散热方面往往后一个芯片的要承载前面芯片的热量，从而使两个芯片温度不一致，后端芯片的温度远高于前一个芯片的温度，前芯片和后芯片温度往往有一定差异。
在PCIe板卡1中，如果前芯片和后芯片之间温度差异大，且后一个芯片温度过高，要充分发挥算力，需要前芯片和后芯片在不同频率，需要设计较为复杂的算法实现算力的发挥；但对于芯片矩阵连接，且需要工作在同样频率的情况，即使通过复杂的算法优化，也只能以最低频率为基准，芯片的算力和能效比都会降低。
本公开提供一种电子板卡(PCIe板卡1)的芯片散热器的设置方法，应用于多芯片阵列级联。在双芯片的PCIe板卡1中，为了保障不同前后两个芯片同频工作，通过前后散热齿的设计优化，将后面的芯片温度降低，两个芯片的温度尽量靠近，从而实现频率基本相同，从而发挥产品的最大算力效果，通过散热齿的优化，解决同频工作问题，避免设计复杂的算法控制，实现同频工作发挥最大算力的情况。
本公开的电子板卡的芯片散热器的设置方法，所述电子板卡上安装有多 个芯片，每个芯片上设有散热器，每个散热器包括与芯片之间产生热传导作用的基座和设置在基座上的散热齿，通过调整部分或全部所述多个芯片对应的多个散热器的散热量，以减小在运行时所述多个芯片之间的温差。
可选的，调整散热器的散热量包括：第一级散热调整：通过部分或全部的多个散热器的散热面积调整，使多个芯片实现不同的散热，从而减少多个芯片在运行时之间的温差；
第二级散热调整：通过在部分或全部的多个散热器上设置多个导风部件，通过所述多个导风部件，影响通过部分或全部散热器的气流，减少多个芯片在运行时之间的温差。
调整所述多个芯片对应的散热器的散热量包括如下步骤：
S010：第一级散热调整：通过调整部分或全部的多个散热器的尺寸，使多个芯片实现不同的散热，从而减少在运行时多个芯片之间的温差。
S020：第二级散热调整：通过在部分或全部的多个散热器上设置多个导风部件7，减少在运行时多个芯片之间的温差。
本公开在产品优化过程，通过前后芯片上的散热齿优化，以及通过仿真控制散热齿的散热面积以及与风道的匹配，通过仿真软件，可以将前后芯片的最终温度控制在一定范围，从而能够实现芯片的同频工作，发挥整体的最大“算力”和“能效比”。
本公开中，通过两级的逐步控制，通过分析芯片的发热量，调整散热齿的高度，实现第一级的优化，通过调节风量结构，实现更加精细的动态调整热量，将前芯片和后芯片的温度控制更加精确化，从而达到最好效果。
本公开的第一级散热调整：通过构建多个芯片的模型，并通过热力学仿真的方式，调整多个芯片散热器的尺寸，以减少在运行时多个芯片之间的温差；第二级散热调整：通过构建多个芯片的模型，并通过热力学仿真的方式，调整部分芯片的散热器上设置的多个导风部件7的结构和布置，以减少在运行时多个芯片之间的温差。
步骤S010中通过调整散热器的高度，减少在运行时多个芯片之间的温差；步骤S020中通过调整多个导风部件7的个数，减少在运行时多个芯片之间的温差。所述在运行时多个芯片之间的温差为：在预设频率运行时多个芯片之间的温差。
如图4，5和6所示，本公开还提供一种电子板卡，所述板卡上安装有多个芯片，多个芯片上均设有散热器。多个芯片包括第一芯片和第二芯片，第一芯片的第一散热器2的高度小于第二芯片的第二散热器3的高度，第一芯 片的第一散热器2上设有所述多个导风部件7。第一芯片靠近板卡的冷却风的进风端4设置，第二芯片靠近板卡冷却风的出风端5设置。所述多个导风部件7为多个条状结构，多个条状结构间隔设置。电子板卡靠近进风端4的地方还设有连接接口6，连接接口6可为电源接口。在一实施例中，所述多个导风部件7为多个长条形结构，多个长条形结构间隔设置。所述导风部件7设置在所述第一芯片的散热器上。
本公开提供一种电子板卡，所述电子板卡上安装有多个芯片，每一芯片上设有一散热器，电子板卡包括：所述多个芯片散热器部分或全部具有不同的散热面积，以使所述部分或全部芯片实现不同的散热，减小所述多个芯片在运行时之间的温差。
多个芯片沿冷却风流动的方向依次设置，多个芯片对应的散热器的散热面积逐渐增大。
多个芯片的散热器具有相同的宽度和不同的高度，所述多个芯片对应的散热器沿所述冷却风流动的方向，高度逐渐增高。
部分或全部芯片的散热器上设有导风部件7，使所述部分或全部芯片的散热器流经的冷却风风量不同，以减小在运行时所述多个芯片之间的温差。
多个芯片的散热器沿所述冷却风流动的方向，形成从低到高的阶梯状；所述多个芯片的导风部件沿所述冷却风流动的方向，形成从低到高的阶梯状。
多个条状结构的长度方向大致平行于冷却风的流动方向设置(图5)；或者多个条状结构的长度方向大致横向于冷却风的流动方向设置(图6)。
多个条状结构的长度方向大致横向于冷却风的流动方向设置，多个条状结构的高度不同，形成为阶梯状，多个条状结构沿冷却风流动的方向高度逐渐增加。
本公开的所述电子板卡可为PCIe卡。
多个芯片的散热器具有相同的宽度和不同的高度，所述多个芯片对应的散热器沿所述冷却风流动的方向，高度逐渐增高。
所述电子板卡设置在一盒体中，所述盒体设有冷却风的进风口和出风口，所述导风部件设在所述导风部件对应的散热器的上端面与所述盒体的顶盖之间。
所述多个导风部件为多个并排设置的长条形结构，所述多个长条形结构的长度方向大致平行于冷却风的流动方向设置；或者所述多个长条形结构的长度方向大致横向垂直于冷却风的流动方向设置。
多个芯片的散热器具有相同的高度和不同的宽度，所述多个芯片的散热器沿所述冷却风流动的方向，从窄到宽。
多个芯片的散热器沿所述冷却风流动的方向，形成从低到高的阶梯状；所述多个芯片的导风部件沿所述冷却风流动的方向，形成从低到高的阶梯状。
多个芯片的导风部件7设置在所述散热器的至少一侧，为长条形结构，所述长条形结构的长度方向横向于冷却风的流动方向，且沿所述冷却风流动的方向，长条形结构的长度从窄到宽。上述这种情况，适用于散热器的宽度不同的情况，如第一芯片对应的散热器的宽度小于第二芯片对应的散热器的宽度，长条形结构设置在第一芯片对应的散热器的至少一侧，从而可影响后一个散热器的冷却风。
多个长条形结构的长度方向大致横向于冷却风的流动方向设置，多个长条形结构的高度不同，形成为阶梯状，多个长条形结构沿冷却风的方向高度逐渐增加。
所述多个芯片均为同频工作芯片。
本公开还提供一种电子集成装置，包括多个本公开所述的电子板卡，并将所述多个电子板卡集成到一起。
本公开的所述电子板卡可为PCIe卡。
如图7所示，本公开还提供一种电子集成装置，包括多个本公开所述的电子板卡，并将所述多个电子板卡集成到一起。
所述多个芯片在运行时之间的温差为：多个芯片在预设频率运行时之间的温差。
本公开还提供一种电子板卡，所述电子板卡上安装有多个芯片，每个芯片上设有一个散热器，每个散热器包括与芯片之间产生热传导作用的基座和设置在所述基座上的散热齿，所述电子板卡包括：部分或全部的多个散热器的散热量不同，以使部分或全部的多个芯片实现所述多个芯片对应的散热，以减少在运行时所述多个芯片之间的温差。
通过在部分或全部的多个散热器上设置多个导风部件，影响通过部分或全部散热器的气流，减少多个芯片在运行时之间的温差。
多个芯片包括第一芯片和第二芯片，第一芯片的散热器的高度小于第二芯片的散热器的高度；第一芯片的散热器上设有多个导风部件，以减少多个芯片在运行时之间的温差。
第一芯片靠近板卡的冷却风的进风端设置，第二芯片靠近板卡冷却风的 出风端设置。
所述多个导风部件为多个条状结构，多个条状结构间隔设置。
多个条状结构的长度方向大致平行于冷却风的流动方向设置；或者多个条状结构的长度方向大致横向于冷却风的流动方向设置。
多个条状结构的长度方向大致横向于冷却风的流动方向设置，多个条状结构的高度不同，形成为阶梯状，多个条状结构沿冷却风的方向高度逐渐增加。
还提供一种电子集成装置，包括多个本公开所述的任意一个电子板卡，并将所述多个电子板卡集成一起。
本公开还提供一种上述实施例任一所述的电子板卡的芯片散热器的设置方法，或者一种上述实施例任一所述的电子板卡，或者如上述的电子集成装置，其中：所述多个芯片为同频工作的芯片。
如表3所示，示意出了采用不同的散热器(散热齿)高度和不同的控制阀(导风部件7)的本公开的PCIe卡的芯片温度情况。
表3
Figure PCTCN2020141311-appb-000003
从表3可以看出，通过散热齿高度的调整和导风部件7个数的调整，可显著减少前芯片和后芯片运行时的温度。其中，散热齿的高度的单位为毫米mm。
本公开解决两个芯片或多个芯片同时同频工作时，在多芯片阵列级联的情况，能够进行比较精确的温度控制，实现较优的系统级工作效果。相对于需要不断的生产制造散热器，再通过实验不断验证效果，既成本不低，且比较耗时间的方式，本申请的方案由于是两级控制，第一级控制在相对范围控制即可，第二级控制可以通过简单的结构，可以进行更加精细的量化控制，可通过简单的粘贴就可以实现。
在实际的产品中，由于大规模的矩阵式分布，即使在仿真摸底阶段芯片的前后温差很小，但在实际的情况都会存在一定的差异性，如果通过不断生成和替换散热器来实现温度调节，无论周期和成本都是比较高的，而通过简单的温度控制“阀”(导风部件7)结构，就可以解决此问题。
本公开的制造成本、实现难度和周期都进行了优化，效果也会更加精确。
在多级芯片阵列互联的产品使用中，通过第一级的散热齿高度优化和第二级的动态控制“阀”的精确控制，实现芯片之间的温度均衡，从而实现算力最大化和最优“能效比”，本公开采用了多级控制达到温度调节的目的。本公开主要应用集中在大功率芯片散热中，例如应用于芯片工作在相近温度，同频率相互级联的情况，可以扩展到其它产品形态，设计思想类似，可以将不同散热器安装到不同位置的芯片上，通过散热器安装位置的通用，并通过散热器高度的差异和动态温度控制“阀”的控制，达到芯片温度的均衡性。
本公开提供一种电子板卡的芯片散热器的设置方法及电子板卡。本公开首先通过前后芯片散热器的高度调整，实现温度的差异性缩小，实现第一级别的调整，然后再通过控制风量的“阀门”(导风部件7)，实现温度差异的更加精确调整，解决木桶效应理论中“短板”效应，前后芯片散热能力基本一致，实现较优设计，从而使得多个芯片的温度差值缩小，提高能效。
本公开提供的电子板卡的芯片散热器的设置方法及电子板卡，所述PCIe板卡包括多个芯片，多个芯片上对应设置有多个散热器。本公开通过多个芯片散热器的高度调整，实现温度的差异性缩小，实现第一级别的调整；通过控制导风部件，实现温度差异的更加精确调整。本公开通过构建多个芯片的模型，通过热力学仿真的方式，调整多个芯片散热器的尺寸，调整导风部件，减少在运行时多个芯片之间的温差，解决木桶效应理论中“短板”效应，前后芯片散热能力基本一致，实现较优设计，从而使得多个芯片的温度差值缩小，提高能效。

Claims (39)

  1. 一种电子板卡，所述电子板卡包括外壳，安装在所述外壳内的多个散热器，所述电子板卡上安装有多个芯片，每个芯片上设有散热器，每个散热器包括与芯片产生热传导作用的基座和设置在所述基座上的散热齿，所述电子板卡包括：部分或全部散热器的散热面积设置不同。
  2. 根据权利要求1所述的电子板卡，其中：所述散热面积包括以下至少之一：散热器的散热齿的散热面积、散热齿的疏密。
  3. 根据权利要求2所述的电子板卡，其中：所述多个芯片沿冷却风流动的方向依次设置并逐渐增大所述多个芯片对应的散热器的散热齿的散热面积。
  4. 根据权利要求3所述的电子板卡，其中：所述多个芯片的散热齿具有相同的宽度和不同的高度，所述多个芯片沿所述冷却风流动的方向，所述多个芯片对应的散热器的散热齿的高度逐渐增高。
  5. 根据权利要求4所述的电子板卡，其中：所述多个芯片包括第一芯片和第二芯片，所述第一芯片靠近所述电子板卡的冷却风的进风端设置，所述第二芯片靠近所述电子板卡的冷却风的出风端设置；所述第一芯片对应的散热齿的高度小于所述第二芯片对应的散热齿的高度。
  6. 根据权利要求2所述的电子板卡，其中：设置所述部分或全部散热器的散热齿的高度不同，并且设置所述部分或全部散热器的散热齿的疏密不同。
  7. 根据权利要求1-5中任一项所述的电子板卡，其中：所述电子板卡为高速串行计算机扩展总线标准PCIe卡。
  8. 根据权利要求1所述的电子板卡，其中：所述散热面积包括以下至少之一：部分或全部散热器的散热齿的高度、大小、散热齿的疏密。
  9. 根据权利要求8所述的电子板卡，其中：设置所述部分或全部散热器的散热齿的以下至少之一不同：高度、或大小；
    设置所述部分或全部散热器的散热齿的疏密不同。
  10. 根据权利要求9所述的电子板卡，其中：所述多个芯片包括第一芯片和第二芯片，所述第一芯片靠近所述电子板卡的冷却风的进风端设置，所述第二芯片靠近所述电子板卡的冷却风的出风端设置。
  11. 根据权利要求8-10中任一项所述的电子板卡，其中：所述电子板卡为PCIe板卡。
  12. 根据权利要求1-5、或11所述的电子板卡，其中：所述电子板卡形成为盒状，所述多个芯片和多个散热器位于盒内，所述盒形成有进风口和出风口。
  13. 根据权利要求1所述的电子板卡，其中：所述多个芯片沿冷却风流动的方向依次设置，所述多个芯片对应的散热器的散热面积逐渐增大。
  14. 根据权利要求13所述的电子板卡，其中：所述多个芯片的散热器具有相同的宽度和不同的高度，所述多个芯片对应的散热器沿所述冷却风流动的方向，高度逐渐增高。
  15. 根据权利要求13-14中任意一项所述的电子板卡，还包括：部分或全部芯片的散热器上设有对所述多个芯片具有散热作用的导风部件，使所述部分或全部芯片的散热器流经的冷却风风量不同。
  16. 根据权利要求15所述的电子板卡，其中：所述多个芯片包括第一芯片和第二芯片，所述第一芯片靠近所述电子板卡的冷却风的进风端设置，所述第二芯片靠近所述电子板卡的冷却风的出风端设置；所述第一芯片的散热器的高度小于所述第二芯片的散热器的高度；所述导风部件设置在所述第一芯片的散热器上。
  17. 根据权利要求15所述的电子板卡，其中：所述电子板卡设置在一盒体中，所述盒体设有冷却风的进风口和出风口，所述导风部件设在散热器上端面与所述盒体的顶盖之间。
  18. 根据权利要求15所述的电子板卡，其中：所述导风部件为多个并排设置的长条形结构，多个长条形结构的长度方向大致平行于冷却风的流动方向设置；或者多个长条形结构的长度方向大致横向于冷却风的流动方向设置。
  19. 根据权利要求15所述的电子板卡，其中：所述多个芯片的散热器沿冷却风流动的方向，形成从低到高的阶梯状；所述多个芯片的导风部件沿所述冷却风流动的方向，形成从低到高的阶梯状。
  20. 根据权利要求15所述的电子板卡，其中：所述多个芯片的散热器具有相同的高度和不同的宽度，所述多个芯片的散热器沿冷却风流动的方向，宽度从窄到宽。
  21. 根据权利要求15所述的电子板卡，其中：所述多个芯片的导风部件设置在所述部分或全部芯片的散热器的至少一侧，为长条形结构，所述长条形结构的长度方向横向于冷却风的流动方向，且沿所述冷却风流动的方向，所述长条形结构的长度从窄到宽。
  22. 根据权利要求1-5，13-14，或16-21中任一项所述的电子板卡，其中：所述多个芯片为同频工作芯片。
  23. 根据权利要求1所述的电子板卡，还包括：在部分或全部的多个散热器上设置多个导风部件。
  24. 根据权利要求23所述的电子板卡，其中：所述多个芯片包括第一芯片和第二芯片，所述第一芯片的散热器的高度小于所述第二芯片的散热器的高度；所述第一芯片的散热器上设有多个导风部件。
  25. 根据权利要求24所述的电子板卡，其中：所述第一芯片靠近所述电子板卡的冷却风的进风端设置，所述第二芯片靠近所述电子板卡的冷却风的出风端设置。
  26. 根据权利要求23所述的电子板卡，其中：所述多个导风部件为多个条状结构，所述多个条状结构间隔设置。
  27. 根据权利要求26所述的电子板卡，其中：所述多个条状结构的长度方向大致平行于冷却风的流动方向设置；或者所述多个条状结构的长度方向大致横向于冷却风的流动方向设置。
  28. 根据权利要求26所述的电子板卡，其中：所述多个条状结构的长度方向大致横向于冷却风的流动方向设置，所述多个条状结构的高度不同，形成为阶梯状，所述多个条状结构沿冷却风的方向高度逐渐增加。
  29. 一种电子集成装置，包括多个权利要求1-28中任意一个电子板卡，并将所述多个电子板卡集成到一起。
  30. 一种计算设备，包括如权利要求1-7中任一项所述的电子板卡；或者包括如权利要求29所述的电子集成装置。
  31. 一种电子板卡的芯片散热器的设置方法，所述电子板卡上安装有多个芯片，每个芯片上设有散热器，每个散热器包括与芯片产生热传导作用的基座和设置在所述基座上的散热齿，所述设置方法包括：调整部分或全部所述多个芯片对应的散热器的散热量。
  32. 根据权利要求31所述的设置方法，其中：所述调整部分或全部所述多个芯片对应的散热器的散热量包括：
    第一级散热调整包括：调整部分或全部的多个散热器的散热面积；
    第二级散热调整包括：在部分或全部的多个散热器上设置具有散热作用的多个导风部件，通过所述多个导风部件，影响通过所述部分或全部的多个散热器的气流。
  33. 根据权利要求32所述的设置方法，其中：所述第一级散热调整包括：构建所述多个芯片的模型，通过热力学仿真的方式，调整多个芯片的散热器的尺寸；
    所述第二级散热调整包括：构建所述多个芯片的模型，通过热力学仿真的 方式，调整部分芯片的散热器上设置的多个导风部件的结构和布置。
  34. 根据权利要求32所述的设置方法，其中：在所述第一级散热调整中调整散热器的高度；
    在所述第二级散热调整调整多个导风部件的个数。
  35. 根据权利要求31所述的设置方法，所述调整部分或全部所述多个芯片对应的散热器的散热量包括：
    第一级散热调整包括：调整部分或全部散热器的散热齿的尺寸；第二级散热调整包括：调整部分或全部散热器的散热齿的疏密；
    或者，第一级散热调整包括：调整部分或全部散热器的散热齿的疏密；第二级散热调整包括：调整部分或全部散热器的散热齿的尺寸。
  36. 根据权利要求35所述的设置方法，其中：所述第一级散热调整包括：构建所述多个芯片的模型，通过热力学仿真的方式，调整部分或全部散热器的散热齿的尺寸；
    所述第二级散热调整：构建所述多个芯片的模型，通过热力学仿真的方式，调整部分或全部散热器的散热齿的疏密。
  37. 根据权利要求36所述的设置方法，其中：所述调整部分或全部散热器的散热齿的尺寸包括：调整散热齿的高度、长度或宽度；
    所述调整部分或全部散热器的散热齿的疏密包括：调整散热齿的个数。
  38. 根据权利要求35-37中任一项所述的设置方法，其中：在运行时所述多个芯片之间的温差为：在预设频率运行时所述多个芯片之间的温差。
  39. 一种如权利要求31-38中任一项所述的电子板卡的芯片散热器的设置方法，或者一种如权利要求8-12中任一项所述的电子板卡，或者一种如权利要求23-28中任一项所述的电子板卡，或者如权利要求29所述的电子集成装置，其中：所述多个芯片为同频工作的芯片。
PCT/CN2020/141311 2019-12-31 2020-12-30 电子板卡及电子板卡的芯片散热器的设置方法 WO2021136356A1 (zh)

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