WO2021135609A1 - 一种三路任意功分比Gysel型功分器/合路器 - Google Patents

一种三路任意功分比Gysel型功分器/合路器 Download PDF

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Publication number
WO2021135609A1
WO2021135609A1 PCT/CN2020/125573 CN2020125573W WO2021135609A1 WO 2021135609 A1 WO2021135609 A1 WO 2021135609A1 CN 2020125573 W CN2020125573 W CN 2020125573W WO 2021135609 A1 WO2021135609 A1 WO 2021135609A1
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port
transmission line
branch transmission
characteristic impedance
combiner
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PCT/CN2020/125573
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English (en)
French (fr)
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薛泉
陈海东
李虹萍
车文荃
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华南理工大学
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Publication of WO2021135609A1 publication Critical patent/WO2021135609A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/04—Coupling devices of the waveguide type with variable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type

Definitions

  • the invention relates to the technical field of electronic devices, in particular to a three-way Gysel type power divider/combiner with any power division ratio.
  • a power divider is a device that divides the energy of a channel of input signal into two or more channels to output equal or unequal energy, or combines the energy of multiple channels to output one channel. At this time, it is called a combiner.
  • Power dividers are widely used in antenna feed systems, phased array radar systems, etc.
  • the Wilkinson-type power divider is one of the most typical power dividers, but the distributed capacitance effect between the isolation resistance and the floor limits its application in high-power applications.
  • the advantage of the Gysel-type power divider lies in its large power capacity. , Can be used in high power occasions.
  • Gysel-type power dividers have two outputs.
  • Gysel-type power dividers with three outputs most of the Gysel-type power dividers are equally divided in power to achieve three-way equal division, and most of them are difficult to achieve on one plane in terms of structural layout.
  • the published patent CN 204809372 U proposes a three-division Gysel-type power divider/combiner.
  • the one-way three-way Gysel-type power divider can only realize the average power distribution, and the structure of the Gysel-type power divider has not been given yet.
  • the design formula of the power divider is not been given yet.
  • the purpose of the present invention is to provide a three-way Gysel type power divider/combiner with any power division ratio.
  • the present invention is realized by at least one of the following technical solutions.
  • a three-channel Gysel type power divider/combiner with any power division ratio including a circuit board, a metal frame, and an adapter.
  • the circuit board is placed in the metal frame; the circuit board includes a microstrip structure, a dielectric substrate, and a ground metal.
  • the tape structure is attached to the upper surface of the dielectric substrate, and the grounding metal is attached to the lower surface of the dielectric substrate; the adapter is connected to the microstrip structure through the bottom layer of the metal frame and the dielectric substrate.
  • the lengths of the three first-level transmission lines, the six first branch transmission lines, and the six second branch transmission lines are all a quarter of the wavelength at the operating frequency.
  • the characteristic impedance of the first-level transmission line connecting Port 0 to Port 1 is .
  • the characteristic impedance of the first-level transmission line connected to Port 2 is .
  • the characteristic impedance of the first-level transmission line connected to Port 3 is .
  • every two first branch transmission lines, two second branch transmission lines, and two grounding resistors form an isolation network, which are respectively P 12 , P 13 , and P 23 .
  • the characteristic impedance of the first branch transmission line connected to port Port 1 is , The characteristic impedance of the first branch transmission line connected to Port 2 is ; Isolated network The characteristic impedance of the first branch transmission line connected to port Port 1 is , The characteristic impedance of the first branch transmission line connected to Port 3 is ; Isolated network The characteristic impedance of the first branch transmission line connected to Port 2 is , The characteristic impedance of the first branch transmission line connected to Port 3 is .
  • isolate the network The characteristic impedance of the second branch transmission line connected to Port 1 in , The characteristic impedance of the second branch transmission line connected to Port 2 is ; Isolated network The characteristic impedance of the second branch transmission line connected to Port 1 in , The characteristic impedance of the second branch transmission line connected to Port 3 is ; Isolated network The characteristic impedance of the second branch transmission line connected to Port 2 is , The characteristic impedance of the second branch transmission line connected to Port 3 is .
  • isolate the network The grounding resistance connected to Port 1 in , The grounding resistance connected to Port 2 is ; Isolated network The grounding resistance connected to Port 1 in , The grounding resistance connected to Port 3 is ; Isolated network The grounding resistance connected to Port 2 in , The grounding resistance connected to Port 3 is .
  • the port Port 0 of the adapter is connected to one end of the three first-level transmission lines of the microstrip structure through the bottom layer of the metal frame and the dielectric substrate; the port Port n It is connected to one end of the three connection port transmission lines through the side wall of the metal frame, and the port transmission lines are evenly distributed on the edge of the dielectric substrate.
  • the present invention can realize the power distribution and synthesis of any power division ratio and any port impedance, provides a simple and effective design method for the design of three-way Gysel power divider, and overcomes the traditional three-way Gysel power divider.
  • the defects of equal power distribution ratio and equal port load can make each port of the three-way unequal-divided Gysel power divider have good matching, and each output port has good isolation;
  • the present invention enables three-way
  • the power divider structure is realized on a plane, the structure is compact, and the characteristic impedance of the transmission line has a large dynamic adjustable range;
  • the three-channel Gysel type power divider with any power dividing ratio involved in the present invention can withstand high power and is suitable for microwaves. High-power distribution synthesis application.
  • Fig. 1 is a structural topological diagram of the three-way Gysel type power divider with any power division ratio in this embodiment
  • FIG. 2 is a schematic cross-sectional view of the circuit structure of the three-way Gysel type power divider with any power dividing ratio in this embodiment;
  • FIG. 3 is a top view of the circuit structure of the three-way Gysel type power divider with any power dividing ratio in this embodiment
  • FIG. 4 is a simulation and test result diagram of the port reflection coefficient amplitude of the three-way unequal Gysel type power divider of this embodiment
  • FIG. 5 is a simulation and test result diagram of the port transmission coefficient amplitude of the three-way unequal division Gysel type power divider in this embodiment
  • Fig. 6 is a simulation and test result diagram of the port isolation coefficient amplitude of the three-way unequal division Gysel type power divider of this embodiment.
  • a three-way Gysel type power divider/combiner with any power dividing ratio includes a circuit board 3, a metal frame 2, an adapter 1, and the circuit board 3 is placed in the metal frame 2;
  • the circuit board 3 includes a microstrip structure 4, a dielectric substrate 3 and a ground metal 5.
  • the microstrip structure 4 is attached to the upper surface of the dielectric substrate 3, and the ground metal 5 is attached to the lower surface of the dielectric substrate; the adapter 1 passes through the bottom layer of the metal frame 2.
  • the dielectric substrate 3 is connected to the microstrip structure 4.
  • One end of the three first-level transmission lines (a1, a2, a3) is connected to Port 0 at the center at the same time, forming three first-level transmission lines, and the other ends of the three first-level transmission lines (a1, a2, a3) are respectively connected by three Port transmission line e is connected to three ports Port n; at the same time, every two first branch transmission lines are connected to one end of each first level transmission line, and the other end of each first branch transmission line is connected to one end of each second branch transmission line , The other end of each second branch transmission line is connected to the adjacent second branch transmission line; at the same time, each first branch transmission line is connected to one end of the grounding resistance h through the connecting resistance transmission line d, and the other end of the grounding resistance is connected to the grounding plate k.
  • the port Port 0 is arranged at one end of the adapter 1, and the other end of the adapter 1 is connected to the microstrip structure 4 through the bottom layer of the metal frame 2 and the dielectric substrate 3.
  • the port Port 0 of the adapter 1 is connected to one end of the three first-level transmission lines of the microstrip structure 4 through the bottom layer of the metal frame 2 and the dielectric substrate 3; the port Port n is connected to one end of the three connection port transmission lines through the side wall of the metal frame 2, port The transmission line is evenly distributed on the edge of the dielectric substrate 3
  • three isolation networks are formed, namely P 12 , P 13 , and P 23 .
  • Step 1 Determine the working frequency f of the power divider and the power distribution relationship of each output port (power division ratio) ,among them The power of the output ports Port 1, Port 2, and Port 3 respectively;
  • Step 3 Determine the characteristic impedance of the six second branch transmission lines (c12, c13, c31, c32, c23, c21) , And the resistance value of six grounding resistance h .
  • Step 4 Calculate the characteristic impedance values of the three first-stage transmission lines of the power splitter and the characteristic impedance values of the six first branch transmission lines according to the conditions determined above:
  • Step 5 According to the calculated impedance value of the transmission line and the characteristics of the board used, the line width and length of the transmission line are synthesized.
  • the circuit board of the three-way Gysel type power divider/combiner provided by the present invention with any power division ratio can be directly printed on the high-frequency PCB printed board.
  • the length and width of the transmission line of the present invention are different according to the working frequency of the power splitter and the difference of the PCB board.
  • the power allocation ratio of Port1, Port2, and Port3 is ,
  • the high frequency PCB board is Rogers 5880, the dielectric constant is 2.2, and the thickness is 0.787mm.
  • Step d1. Calculate the characteristic impedance of the first-level transmission line from the first path to the third path:
  • Step d2. Calculate the characteristic impedance of the two first-level lines in the isolation network P 12 between the first path and the second path with , Its value is:
  • Step e Synthesize the actual line width and length of the transmission line according to the calculated impedance value of the transmission line and the characteristics of the board used.
  • the reflection coefficient of Port n is .
  • the simulation result is represented by SS(n,n)
  • the test result is represented by MS(n,n). It can be seen from Figure 4 that in the range of 3.3-3.7GHz, the reflection coefficients of one input port and three output ports are all Less than -20dB, with good port matching.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Microwave Amplifiers (AREA)
  • Waveguides (AREA)

Abstract

本发明公开了一种三路任意功分比Gysel型功分器/合路器，一种三路任意功分比Gysel型功分器/合路器，包括电路板、金属框架、转接头，电路板放置在金属框架内；电路板包括微带结构、介质基板和接地金属，微带结构附着在介质基板的上表面，接地金属附着在介质基板的下表面；转接头通过金属框架的底层和介质基板与微带结构连接。本发明的三路任意功分比Gysel型功分器/合路器，能够实现任意功率分配比、任意端口负载的功率分配与合成，既可作为功分器实现功率分配，也可作为合路器实现功率合成，并且克服了现有功分器只有等功率分配比、等端口负载，以及难以在一个平面内实现的缺陷。

Description

一种三路任意功分比Gysel型功分器/合路器 技术领域
本发明涉及电子器件技术领域，具体涉及一种三路任意功分比Gysel型功分器/合路器。
 背景技术
功分器是一种将一路输入信号能量分成两路或多路输出相等或不相等能量的器件，或将多路信号能量合成一路输出，此时称为合路器。功分器被广泛应用于天线馈电系统、相控阵列雷达系统等。Wilkinson型功分器是最典型的功分器之一，但是其使用的隔离电阻与地板之间的分布电容效应限制了它在高功率场合的应用，Gysel型功分器的优势在于功率容量大，可用于高功率场合。
目前常见的Gysel型功分器多为两路输出，对于三路输出的Gysel型功分器，大都是功率平均分配，实现三路等分，且大多在结构布局上难以在一个平面上实现。例如已公开的专利CN 204809372 U提出了一种三等分Gysel型功分器/合路器，该一分三路Gysel型功分器只能实现功率平均分配，且尚未给出该结构Gysel型功分器的设计公式。
 技术解决方案
本发明的目的在于提供一种三路任意功分比Gysel型功分器/合路器。
本发明至少通过如下技术方案之一实现。
一种三路任意功分比Gysel型功分器/合路器，包括电路板、金属框架、转接头，电路板放置在金属框架内；电路板包括微带结构、介质基板和接地金属，微带结构附着在介质基板的上表面，接地金属附着在介质基板的下表面；转接头通过金属框架的底层和介质基板与微带结构连接。
进一步地，微带结构包括负载阻值为R x0的端口Port 0、三个负载阻值为R xn的端口Port n，n=1、2、3、三根第一级传输线、六根第一分支传输线、六根第二分支传输线、三根连接端口传输线和六个接地板；所述三根第一级传输线一端同时连接于位于中心的端口Port 0，另一端分别通过三根连接端口传输线与三个端口Port n连接；同时每两根第一分支传输线与每根第一级传输线的一端连接，每根第一分支传输线的另一端与每根第二分支传输线的一端连接，每根第二分支传输线的另一端与相邻的第二分支传输线连接；同时每根第一分支传输线通过连接电阻传输线与接地电阻的一端连接，接地电阻另一端与接地板连接。
进一步地，三根第一级传输线、六根第一分支传输线和六根第二分支传输线的长度均为工作频率下波长的四分之一。
进一步地，端口Port 0连接到端口Port 1的第一级传输线的特性阻抗为
Figure 659039dest_path_image001
，连接到端口Port 2的第一级传输线的特性阻抗为
Figure 202278dest_path_image002
，连接到端口Port 3的第一级传输线的特性阻抗为
Figure 903386dest_path_image003
。
进一步地，所述每两根第一分支传输线、两个第二分支传输线，以及两个接地电阻组成一个隔离网络，分别为P 12、P 13、P 23。
进一步地，隔离网络
Figure 136746dest_path_image004
 中连接到端口Port 1的第一分支传输线的特性阻抗为
Figure 872489dest_path_image005
，连接到端口Port 2的第一分支传输线的特性阻抗为
Figure 55471dest_path_image006
；隔离网络
Figure 243876dest_path_image007
 中连接到端口Port 1的第一分支传输线的特性阻抗为
Figure 65945dest_path_image008
，连接到端口Port 3的第一分支传输线的特性阻抗为
Figure 125037dest_path_image009
；隔离网络
Figure 321663dest_path_image010
 中连接到端口Port 2的第一分支传输线的特性阻抗为
Figure 233249dest_path_image011
，连接到端口Port 3的第一分支传输线的特性阻抗为
Figure 360474dest_path_image012
。
进一步地，隔离网络
Figure 87122dest_path_image004
 中连接到端口Port 1的第二分支传输线的特性阻抗为
Figure 405714dest_path_image013
，连接到端口Port 2的第二分支传输线的特性阻抗为
Figure 303132dest_path_image014
；隔离网络
Figure 984780dest_path_image007
 中连接到端口Port 1的第二分支传输线的特性阻抗为
Figure 51088dest_path_image015
，连接到端口Port 3的第二分支传输线的特性阻抗为
Figure 714150dest_path_image016
；隔离网络
Figure 784350dest_path_image010
 中连接到端口Port 2的第二分支传输线的特性阻抗为
Figure 223684dest_path_image017
，连接到端口Port 3的第二分支传输线的特性阻抗为
Figure 846295dest_path_image018
。
进一步地，隔离网络
Figure 799750dest_path_image004
 中连接到端口Port 1的接地电阻为
Figure 406181dest_path_image019
，连接到端口Port 2的接地电阻为
Figure 695211dest_path_image020
；隔离网络
Figure 1690dest_path_image007
 中连接到端口Port 1的接地电阻为
Figure 803292dest_path_image021
，连接到端口Port 3的接地电阻为
Figure 661134dest_path_image022
；隔离网络
Figure 206384dest_path_image010
 中连接到端口Port 2的接地电阻为
Figure 305053dest_path_image023
，连接到端口Port 3的接地电阻为
Figure 277557dest_path_image024
。
进一步地，通过转接头的端口Port 0通过金属框架底层和介质基板连接于微带结构三条第一级传输线的一端；端口Port n通过金属框架侧壁连接于三根连接端口传输线的一端，端口传输线均匀分布于介质基板的边缘。
 有益效果
与现有技术相比，本发明的优点为：
(1)本发明能够实现任意功分比、任意端口阻抗的功率分配与合成，为设计三路Gysel型功分器提供了简单又有效的设计方法，克服了传统的三路Gysel功分器只有等功率分配比、等端口负载的缺陷，可以使三路不等分的Gysel型功分器每个端口都有良好的匹配，每个输出端口有良好的隔离；(2)本发明使三路功分器结构在一个平面上实现，结构紧凑，传输线的特性阻抗动态可调范围大；(3)本发明所涉及的三路任意功分比的Gysel型功分器可以承受高功率，适合微波的高功率分配合成应用。
 附图说明
图1是本实施例三路任意功分比Gysel型功分器的结构拓补图；
图2是本实施例三路任意功分比Gysel型功分器的电路结构剖面示意图；
图3是本实施例三路任意功分比Gysel型功分器的电路结构上视图；
图4是本实施例三路不等分Gysel型功分器的端口反射系数幅值的仿真及测试结果图；
图5是本实施例三路不等分Gysel型功分器的端口传输系数幅值的仿真及测试结果图；
图6是本实施例三路不等分Gysel型功分器的端口隔离系数幅值的仿真及测试结果图。
 本发明的实施方式
下面结合附图对本发明作进一步详细描述。
如图1和图2所示，一种三路任意功分比Gysel型功分器/合路器包括包括电路板3、金属框架2、转接头1，电路板3放置在金属框架2内；电路板3包括微带结构4、介质基板3和接地金属5，微带结构4附着在介质基板3的上表面，接地金属5附着在介质基板的下表面；转接头1通过金属框架2的底层和介质基板3与微带结构4连接。
如图3所示，微带结构4包括负载阻值为R x0的端口Port 0、三个负载阻值为R xn的端口Port n，n=1、2、3、三根第一级传输线（a1、a2、a3）、六根第一分支传输线(b12、b13、b21、b23、b31、b32)、六根第二分支传输线(c12、c13、c31、c32、c23、c21)、三根连接端口传输线e和六个接地板k。三根第一级传输线（a1、a2、a3）一端同时连接于位于中心的端口Port 0，形成三路第一级传输线，三根第一级传输线（a1、a2、a3）的另一端分别通过三根连接端口传输线e与三个端口Port n连接；同时每两根第一分支传输线与每根第一级传输线的一端连接，每根第一分支传输线的另一端连与每根第二分支传输线的一端连接，每根第二分支传输线的另一端与相邻的第二分支传输线连接；同时每根第一分支传输线通过连接电阻传输线d与接地电阻h的一端连接，接地电阻另一端与接地板k连接。
所述端口Port 0设置在转接头1的一端，转接头1的另一端通过金属框架2的底层和介质基板3与微带结构4连接。
通过转接头1的端口Port 0通过金属框架2底层和介质基板3连接于微带结构4三条第一级传输线的一端；端口Port n通过金属框架2侧壁连接于三根连接端口传输线的一端，端口传输线均匀分布于介质基板3的边缘
所述每两根第一分支传输线、两个第二分支传输线，以及两个接地电阻组成一个隔离网络，本实施例形成三个隔离网络，分别为P 12、P 13、P 23。
三路任意功分比Gysel型功分器/合路器的具体执行步骤为：
步骤1、确定功分器的工作频率f、以及每路输出端口的功率分配关系（功分比）
Figure 609312dest_path_image025
，其中
Figure 987947dest_path_image026
分别为输出端口Port 1、Port 2、Port 3的功率大小；
步骤2、确定输入端口Port 0所接负载的电阻
Figure 705237dest_path_image027
 、分口Port n所接负载的电阻
Figure 146845dest_path_image028
, n=1、2，、3；
步骤3、确定六根第二分支传输线(c12、c13、c31、c32、c23、c21)的特性阻抗
Figure 152847dest_path_image029
，和六个接地电阻h的阻值
Figure 335173dest_path_image030
。
步骤4、根据以上所确定的条件，计算功分器三根第一级传输线的特性阻抗值以及六根第一分支传输线的特性阻抗值：
Figure 923280dest_path_image031
 
步骤5、根据计算出的传输线阻抗值和所用板材特性综合出传输线线宽线长。
本发明提供的三路任意功分比Gysel型功分器/合路器的电路板可直接印制在高频PCB印制板上。本发明的传输线线长及线宽等根据功分器的工作频率和PCB板材的不同而不同。
本实例为三路不等分Gysel型功分器，所用工作频点为f=3.5GHz、输入端口Port 0和输出端口Port n的负载阻抗均为50Ω，n=1、2、3。Port1、Port2、Port3的功率分配比为
Figure 503166dest_path_image032
，高频PCB板材是Rogers 5880，介电常数2.2.厚度0.787mm。具体执行步骤为：
步骤a1、确定功分器的工作频率f=3.5GHz，以及各端口的功率分配关系：
Figure 763508dest_path_image033
；
步骤a2、确定输入端口Port0所接负载的电阻值
Figure 454253dest_path_image034
=50Ω，确定输出端口Port n所接负载的电阻值
Figure 718705dest_path_image035
=50Ω，n=1、2、3；
步骤b、确定六根第一分支传输线的特性阻抗：
Figure 469492dest_path_image036
=35Ω，
Figure 263136dest_path_image037
=35Ω，
Figure 586932dest_path_image038
=35Ω，
Figure 867741dest_path_image039
=35Ω，
Figure 868058dest_path_image040
 =35Ω，
Figure 365642dest_path_image041
 =35Ω；确定六个接地电阻的阻值：
Figure 742396dest_path_image042
=50Ω，
Figure 831706dest_path_image043
=50Ω，
Figure 471766dest_path_image044
=50Ω，
Figure 643597dest_path_image045
 =50Ω，
Figure 761726dest_path_image046
=50Ω，
Figure 548285dest_path_image047
=50Ω；
步骤d1、计算第一路至第三路的第一级传输线的特征阻抗：
Figure 844399dest_path_image048
步骤d2、计算第一路与第二路之间隔离网络P 12中的两根第一级线的特性阻抗
Figure 441209dest_path_image049
 和
Figure 97450dest_path_image050
，其值为：
Figure 738516dest_path_image051
计算第一路与第三路之间隔离网络P 13中的两根第一级线的特性阻抗
Figure 205531dest_path_image052
和
Figure 197627dest_path_image053
，其值为：
Figure 657558dest_path_image054
计算第二路与第三路之间隔离网络P 23中的两根第一级线的特性阻抗
Figure 397805dest_path_image055
 和
Figure 65416dest_path_image056
，其值为：
Figure 92278dest_path_image057
步骤e、根据计算出的传输线阻抗值和所用的板材特性综合出实际传输线线宽线长。
如图4所示，端口Port n的反射系数为
Figure 621479dest_path_image058
，仿真结果用S-S(n,n)表示,测试结果M-S(n,n)表示，从图4中可以看出，在3.3-3.7GHz范围内,一个输入端口、三个输出端口的反射系数均小于-20dB,有良好的端口匹配性。
如图5所示,端口的传输系数为S(0,n)，n=1，2，3，仿真结果用S-S(0,n)表示,测试结果用M-S(0,n)表示,从图5中可以看出, 在3.3-3.7GHz范围内,三个输出端口的功率分配比大致为1：1.94：3，近似于1：2：3，有良好的功率分配特性。
如图6所示,输出端口Port n的隔离系数为S(m,n)，(m=1，2，3；n=1，2，3，且
Figure 800919dest_path_image059
)，仿真结果用S-S(m,n)表示，测试结果用M-S(m,n)表示，从图6中可以看出,在Port n，在3.3-3.7GHz范围内,三个输出端口之间的隔离系数均小于-20dB,有良好的端口隔离性。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (9)

  1. 一种三路任意功分比Gysel型功分器/合路器，其特征在于，包括电路板（3）、金属框架（2）、转接头（1），电路板（3）放置在金属框架（2）内；电路板（3）包括微带结构（4）、介质基板（3）和接地金属（5），微带结构（4）附着在介质基板（3）的上表面，接地金属（5）附着在介质基板的下表面；转接头（1）通过金属框架（2）的底层和介质基板（3）与微带结构（4）连接。
  2. 根据权利要求1所述的三路任意功分比Gysel型功分器/合路器，其特征在于，微带结构（4）包括负载阻值为R x0的端口Port 0、三个负载阻值为R xn的端口Port n，n=1、2、3、三根第一级传输线（a1、a2、a3）、六根第一分支传输线(b12、b13、b21、b23、b31、b32)、六根第二分支传输线(c12、c13、c31、c32、c23、c21)、三根连接端口传输线（e）和六个接地板（k）；所述三根第一级传输线（a1、a2、a3）一端同时连接于位于中心的端口Port 0，另一端分别通过三根连接端口传输线（e）与三个端口Port n连接；同时每两根第一分支传输线与每根第一级传输线的一端连接，每根第一分支传输线的另一端连与每根第二分支传输线的一端连接，每根第二分支传输线的另一端与相邻的第二分支传输线连接；同时每根第一分支传输线通过连接电阻传输线（d）与接地电阻(h)的一端连接，接地电阻另一端与接地板（k）连接。
  3. 根据权利要求2所述的三路任意功分比Gysel型功分器/合路器，其特征在于，三根第一级传输线（a1、a2、a3）、六根第一分支传输线(b12、b13、b21、b23、b31、b32)和六根第二分支传输线(c12、c13、c31、c32、c23、c21)的长度均为工作频率下波长的四分之一。
  4. 根据权利要求2所述的三路任意功分比Gysel型功分器/合路器，其特征在于，端口Port 0连接到端口Port 1的第一级传输线（a1）的特性阻抗为
    Figure dest_path_image002aa
    ，连接到端口Port 2的第一级传输线（a2）的特性阻抗为
    Figure dest_path_image004aa
    ，连接到端口Port 3的第一级传输线（a3）的特性阻抗为
    Figure dest_path_image006aa
    。
  5. 根据权利要求2所述的三路任意功分比Gysel型功分器/合路器，其特征在于，所述每两根第一分支传输线、两个第二分支传输线，以及两个接地电阻组成一个隔离网络，分别为P 12、P 13、P 23。
  6. 根据权利要求5所述的三路任意功分比Gysel型功分器/合路器，其特征在于，隔离网络
    Figure dest_path_image008aaaaaa
    中连接到端口Port 1的第一分支传输线（b12）的特性阻抗为
    Figure dest_path_image010aa
    ，连接到端口Port 2的第一分支传输线（b21）的特性阻抗为
    Figure dest_path_image012aa
    ；隔离网络
    Figure dest_path_image014aaaaaa
    中连接到端口Port 1的第一分支传输线（b13）的特性阻抗为
    Figure dest_path_image016aa
    ，连接到端口Port 3的第一分支传输线（b31）的特性阻抗为
    Figure dest_path_image018aa
    ；隔离网络
    Figure dest_path_image020aaaaaa
    中连接到端口Port 2的第一分支传输线（b23）的特性阻抗为
    Figure dest_path_image022aa
    ，连接到端口Port 3的第一分支传输线（b32）的特性阻抗为
    Figure dest_path_image024aa
    。
  7. 根据权利要求5所述的三路任意功分比Gysel型功分器/合路器，其特征在于，隔离网络
    Figure dest_path_image008aaaaaaa
    中连接到端口Port 1的第二分支传输线（c12）的特性阻抗为
    Figure dest_path_image026aa
    ，连接到端口Port 2的第二分支传输线（c21）的特性阻抗为
    Figure dest_path_image028aa
    ；隔离网络
    Figure dest_path_image014aaaaaaa
    中连接到端口Port 1的第二分支传输线（c13）的特性阻抗为
    Figure dest_path_image030aa
    ，连接到端口Port 3的第二分支传输线（c31）的特性阻抗为
    Figure dest_path_image032aa
    ；隔离网络
    Figure dest_path_image020aaaaaaa
    中连接到端口Port 2的第二分支传输线（c23）的特性阻抗为
    Figure dest_path_image034aa
    ，连接到端口Port 3的第二分支传输线（c32）的特性阻抗为
    Figure dest_path_image036aa
    。
  8. 根据权利要求5所述的三路任意功分比Gysel型功分器/合路器，其特征在于，隔离网络
    Figure dest_path_image008aaaaaaaa
    中连接到端口Port 1的接地电阻为
    Figure dest_path_image038aa
    ，连接到端口Port 2的接地电阻为
    Figure dest_path_image040aa
    ；隔离网络
    Figure dest_path_image014aaaaaaaa
    中连接到端口Port 1的接地电阻为
    Figure dest_path_image042aa
    ，连接到端口Port 3的接地电阻的为
    Figure dest_path_image044aa
    ；隔离网络
    Figure dest_path_image020aaaaaaaa
    中连接到端口Port 2的接地电阻为
    Figure dest_path_image046aa
    ，连接到端口Port 3的接地电阻为
    Figure dest_path_image048aa
    。
  9. 根据权利要求1~8任一项所述的三路任意功分比Gysel型功分器/合路器，其特征在于，通过转接头（1）的端口Port 0通过金属框架（2）底层和介质基板（3）连接于微带结构（4）三条第一级传输线（a）的一端；端口Port n通过金属框架（2）侧壁连接于三根连接端口传输线（e）的一端，端口传输线（e）均匀分布于介质基板（3）的边缘。
     
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