WO2021135473A1 - 连接器组件、连接器、网络设备和制造方法 - Google Patents

连接器组件、连接器、网络设备和制造方法 Download PDF

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Publication number
WO2021135473A1
WO2021135473A1 PCT/CN2020/119048 CN2020119048W WO2021135473A1 WO 2021135473 A1 WO2021135473 A1 WO 2021135473A1 CN 2020119048 W CN2020119048 W CN 2020119048W WO 2021135473 A1 WO2021135473 A1 WO 2021135473A1
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WO
WIPO (PCT)
Prior art keywords
shielding
sheet
terminals
terminal
wall
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Application number
PCT/CN2020/119048
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English (en)
French (fr)
Inventor
曹树钊
刘天明
吴才章
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华为技术有限公司
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Publication of WO2021135473A1 publication Critical patent/WO2021135473A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve

Definitions

  • This application relates to the field of communications, and in particular to a connector assembly, a connector, a network device, and a manufacturing method.
  • the communication equipment includes components such as network cards, line cards, and high-speed backplanes.
  • the two components in the communication equipment are connected by two connectors. For the two connectors, one of the connectors is plugged into one of the components, the other connector is plugged into the other component, and the two connectors are connected to each other, so that the two components are connected.
  • the connector includes a plurality of connector components arranged in parallel.
  • the M ground shielding terminals are embedded in the carrier in parallel, and the N differential pair signal terminals are also embedded in the carrier in parallel.
  • Each differential pair signal terminal includes two signal terminals arranged in parallel. For any signal terminal, one end of the signal terminal is used to plug into one component, and the other end of the signal terminal is used to plug into another component. .
  • a grounding shield terminal cannot shield the signal interference between two adjacent differential pair signal terminals, and the shielding effect is poor.
  • the present application provides a connector assembly, a connector, a network device, and a manufacturing method to improve the shielding effect.
  • the technical solution is as follows:
  • the M first ground shielding terminals are located between the first shielding structure and the second shielding structure, and N mutually isolated first shielding channels are formed between the first shielding structure and the second shielding structure.
  • the N first differential pair signal terminals are respectively arranged in the N first shielding channels.
  • N first shielding channels isolated from each other are formed between the first shielding structure and the second shielding structure, the N first differential pair signal terminals are respectively arranged in the N first shielding channels, so that for any first shielding channel
  • the shielding channel and the first differential pair signal terminal in any one of the first shielding channels, and any one of the first shielding channels can shield the signal interference generated by the first differential pair signal terminal, so as to reduce the interference to the other N-1
  • the intensity of interference generated by a differential pair of signal terminals improves the shielding effect.
  • the first shielding structure includes a first shielding sheet and M first shielding walls
  • the second shielding structure includes a second shielding sheet and M second shielding walls, the first shielding sheet and the second shielding wall.
  • the shielding sheets are arranged oppositely; between the first shielding sheet and the second shielding sheet, the M first shielding walls, the M first ground shielding terminals, and the M second shielding walls form M partition walls, which are adjacent to each other
  • the space between the two partition walls is a first shielding channel; each partition wall includes a first shielding wall fixed on the first shielding sheet, a second shielding wall fixed on the second shielding sheet, and a A first grounding shielding terminal between the first shielding wall and the second shielding wall. Since the M first shielding walls, the M first grounding shielding terminals, and the M second shielding walls form M partition walls, the M partition walls separate the first shielding sheet and the second shielding sheet The space is divided into N shielded channels.
  • a carrier is provided in any first shielding channel, and the carrier is respectively parallel to the first shielding sheet and the second shielding sheet; the carrier is fixed to the first shielding channel.
  • the first partition wall and the second partition wall are the partition walls on both sides of any first shielding channel, and are located in any first shielding channel.
  • the first differential pair of signal terminals in the shielding channel is embedded in the carrier.
  • the first differential pair signal terminal located in any first shield channel is embedded on the carrier Because the first ground shielding terminal is located in the middle of the partition wall, the two signal terminals included in the first differential pair signal terminal can be located in the middle of any first shielding channel, ensuring that the first differential pair signal terminal includes signal terminals There is a gap with the first shielding sheet, and a gap with the second shielding sheet. The first shielding sheet and the second shielding sheet are connected to the ground terminal, so as to prevent the signal terminal and the ground terminal from being short-circuited.
  • the first differential pair signal terminal in any one of the first shielding channels includes a first signal terminal and a second signal terminal, and both the first signal terminal and the second signal terminal are embedded in the carrier.
  • the first signal terminal and the second signal terminal are arranged in parallel and opposite to each other, and the surface passing the first signal terminal and the second signal terminal is perpendicular to the carrier or parallel to the carrier.
  • the first signal terminal and the second signal terminal are embedded in the carrier of any one of the first shielding channels, so that signal coupling is performed between the first signal terminal and the second signal terminal in any one of the first shielding channels.
  • a first shielding channel shields the interference around the first signal terminal and the second signal terminal.
  • each first grounding shield terminal of the M first grounding shielding terminals is a first pin
  • the other end of each first grounding shielding terminal is a mating end.
  • the side of the first shielding sheet close to the first pin of each first grounding shielding terminal is provided with M second pins for grounding, and the first shielding sheet is close to the side of the mating end of each first grounding shielding terminal M first bosses are provided, and the M first bosses are respectively in contact with the mating ends of the M first grounding shielding terminals.
  • the side of the second shielding sheet close to the first pin of each first grounding shielding terminal is provided with M third pins for grounding, and the second shielding sheet is close to the side of the mating end of each first grounding shielding terminal M second bosses are provided, and the M second bosses are respectively in contact with the mating ends of the M first grounding shielding terminals.
  • an interconnected grounding shielding system is formed by the first shielding sheet, the second shielding sheet and the M first grounding shielding terminals.
  • a first through hole is provided on any partition wall, a second through hole communicating with the first through hole is provided on the first shielding sheet, and the first through hole A connecting piece is provided in the second through hole, and the connecting piece is used to connect the first shielding sheet and any partition wall.
  • a third through hole communicating with the first through hole is provided on the second shielding sheet, and the connecting member also extends into the third through hole for connecting the second shielding sheet and any partition wall , which can further improve the stability of the connector assembly.
  • the connecting member is a component formed by welding in the first through hole and the second through hole by a welding material. Since the connector is a part formed by welding, that is, the connector assembly is formed by welding, the connection of the connector assembly is more stable, and the shielding effect of the first shielding channel is higher.
  • any partition wall is provided with a receiving space
  • the first shielding sheet is provided with a first opening aligned with the receiving space
  • the second shielding sheet is provided with a receiving space.
  • Space-aligned second openings are provided with filling walls in the first opening, the accommodating space and the second opening. Since the partition wall is filled with infill walls, the shielding effect of the first shielding channel can be increased by the infill walls.
  • the filling wall is a part formed by welding a welding material in the first opening, the receiving space, and the second opening. Since the filling wall is a part formed by welding, that is, the connector assembly is formed by welding, the connection of the connector assembly is more stable, and the shielding effect of the first shielding channel is higher.
  • the soldering material is a solder paste material with a soldering peak temperature greater than or equal to 100 degrees and less than or equal to 320 degrees. In this way, the soldering temperature is relatively low, avoiding damage to the plating layer on the surface of the first grounding shield terminal and the shape of the carrier.
  • a first insulating component is provided between the first differential pair signal terminal and the first shielding sheet located in any first shielding channel, and is connected to all the first shielding channels.
  • a second insulating part is arranged between the second shielding sheets. This effectively prevents the signal terminals of the first differential pair from contacting the first shielding sheet and the second shielding sheet.
  • it further includes a third shielding structure, M second ground shielding terminals, and N second differential pair signal terminals.
  • the third shielding structure and the second shielding structure are far away from one of the first shielding structure.
  • the side faces are arranged oppositely; the M second grounding shielding terminals are located between the second shielding structure and the third shielding structure, and N mutually isolated second shielding channels are formed between the second shielding structure and the third shielding structure, N
  • the two second differential pair signal terminals are respectively located in the N second shielding channels.
  • the second shielding structure further includes M third shielding walls, the third shielding structure includes third shielding sheets and M fourth shielding walls, and the second shielding sheets are far away from the first shielding structure.
  • One side is arranged opposite to the third shielding sheet; between the second shielding sheet and the third shielding sheet, M third shielding walls, M second grounding shielding terminals and M fourth shielding walls form M partition walls, The space between two adjacent partition walls is a second shielding channel; each partition wall includes a third shielding wall fixed on the second shielding sheet, a fourth shielding wall fixed on the third shielding sheet, and A second grounding shield terminal between a third shielding wall and a fourth shielding wall.
  • the present application provides a connector, including a plurality of connector assemblies described in the first aspect or any one of the possible implementation manners of the first aspect, the plurality of connector assemblies are parallel to each other, and the For any two adjacent connector assemblies in the connector assembly, there is a gap between the two connector assemblies, and the two connecting devices are arranged oppositely.
  • the two sides of any connector assembly are the first shielding sheet and the second shielding sheet, and the first shielding sheet and the second shielding sheet are separated into N mutually isolated N pieces by a partition wall.
  • any one of the first shielding channels can prevent the differential pair signal terminal located in the first shielding channel from causing signal interference to other differential pair signal terminals, which not only improves the adjacent two in the same connector assembly
  • the shielding effect between the signal terminals of the differential pair also improves the shielding effect between two adjacent connector components.
  • it further includes: a base shell, a plurality of first mounting slots are provided in the base shell, each connector assembly of the plurality of connector assemblies corresponds to a first mounting slot, each One end of the connector assembly is respectively installed in the first installation slot corresponding to each connector assembly. In this way, a plurality of connector components are formed into a connector.
  • it further includes: a fixing piece, wherein a plurality of second mounting grooves are provided in the fixing piece, each connector component corresponds to a second mounting groove, and the other end of each connector component is installed separately In the second mounting groove corresponding to each connector assembly.
  • a fixing piece wherein a plurality of second mounting grooves are provided in the fixing piece, each connector component corresponds to a second mounting groove, and the other end of each connector component is installed separately In the second mounting groove corresponding to each connector assembly.
  • this application provides a network device, the network device including the connector provided in the second aspect or any one of the possible implementation manners of the second aspect.
  • the present application provides a method for manufacturing a connector assembly.
  • a first shielding structure, a second shielding structure, M first ground shielding terminals, and N first differential pair signal terminals are obtained.
  • M N+1, N is an integer greater than 1.
  • N is an integer greater than 1.
  • N first shielding channels isolated from each other are formed between the first shielding structure and the second shielding structure, the N first differential pair signal terminals are respectively located in the N first shielding channels, so that for any first shield Channel and the first differential pair signal terminal in any one of the first shielding channels, and any one of the first shielding channels can shield the signal interference generated by the first differential pair signal terminal, so as to reduce the interference to other N-1 first signal terminals.
  • the interference intensity generated by the differential pair signal terminal improves the shielding effect.
  • M first shielding walls are formed on the surface of the first shielding sheet to obtain the first shielding structure; M second shielding walls are formed on the surface of the second shielding sheet, In order to obtain the second shielding structure.
  • the M first grounding shielding terminals and N first differential pair signal terminals are embedded in the carrier plate, and there is a first grounding shielding terminal between two adjacent first grounding shielding terminals. Differential pair signal terminal.
  • the second shielding structure is buckled on the other surface of the carrier plate, and the i-th second shielding wall included in the second shielding structure and the i-th first grounding shielding terminal in the carrier plate contact. In this way, the space between the first shielding sheet and the second shielding sheet is divided into N shielding channels.
  • the i-th first shielding wall, the i-th first grounding shielding terminal, and the i-th second shielding wall form the i-th partition wall
  • the The i partition walls are provided with a first through hole
  • the first shielding sheet is provided with a second through hole communicating with the first through hole.
  • the second through hole and the first through hole are welded by a welding material to form a connecting piece in the second through hole and the first through hole, and the connecting piece is used to connect the first through hole.
  • i partition walls and the first shielding sheet In this way, it is ensured that the first shielding structure, the second shielding structure and the M first grounded shielding ends form a stable overall structure, thereby improving the stability of the connector assembly.
  • the i-th first shielding wall, the i-th first grounding shielding terminal, and the i-th second shielding wall form the i-th partition wall
  • the The i partition walls are provided with a containing space
  • the first shielding sheet is provided with a first opening communicating with the containing space
  • the second shielding sheet is provided with a second opening communicating with the containing space.
  • the first opening, the receiving space, and the second opening are welded by a welding material to form a filling wall in the first opening, the receiving space, and the second opening, the filling wall Used to connect the first shielding sheet, the i-th partition wall and the second shielding sheet. Since the partition wall is filled with infill walls, the shielding effect of the first shielding channel can be increased by the infill walls.
  • a first insulating part is formed by injection molding on the surface of the first shielding sheet where the M first shielding walls are provided, and/or, the second shielding sheet is provided with A second insulating component is formed by injection molding on the surface of the M second shielding walls. This effectively prevents the signal terminals of the first differential pair from contacting the first shielding sheet and the second shielding sheet.
  • FIG. 1 is a schematic structural diagram of an orthogonal interconnection system formed by two connectors provided by an embodiment of the present application
  • Figure 2 is an exploded view of a connector assembly provided by an embodiment of the present application.
  • Figure 3 is a cross-sectional view of a connector assembly provided by an embodiment of the present application.
  • Figure 4 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 5 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 6 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 7 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 8 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 9 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 10 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 11 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 12 is a schematic diagram of test results provided by an embodiment of the present application.
  • Figure 13 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 14 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • 15 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Figure 16 is a cross-sectional view of another connector assembly provided by an embodiment of the present application.
  • Fig. 17 is a schematic structural diagram of an insulating sheet provided by an embodiment of the present application.
  • Figure 18 is a cross-sectional view of a connector provided by an embodiment of the present application.
  • FIG. 19 is a schematic structural diagram of a fixing sheet provided by an embodiment of the present application.
  • 20 is a schematic structural diagram of an end guard provided by an embodiment of the present application.
  • FIG. 21 is a flowchart of a method for manufacturing a connector assembly provided by an embodiment of the present application.
  • Communication equipment often includes multiple printed circuit boards (printed circuit boards, PCBs).
  • PCBs printed circuit boards
  • the two PCBs are often connected through two connectors.
  • the two connectors are called the first connector A1 (also called the male connector) and the second connector A2 (also called the female connector), and the two PCBs are called They are the first PCBA3 and the second PCBA4.
  • the first connector A1 is connected to the first PCBA3, the second connector A2 is connected to the second PCBA4, and the first connector A1 is connected to the second connector A2.
  • Two connectors are connected to two PCBs.
  • the connector includes a plurality of connector components, and for any one of the plurality of connector components, the structure of the connector component will be described in detail below.
  • an embodiment of the present application provides a connector assembly, including:
  • the first shielding structure 1, the second shielding structure 2, M first grounding shielding terminals 3 and N first differential pair signal terminals 4, M N+1, N is an integer greater than 1, the first shielding structure 1 and The second shielding structure 2 is arranged relatively;
  • the M first ground shielding terminals 3 are located between the first shielding structure 1 and the second shielding structure 2, and N mutually isolated first shielding channels 5 are formed between the first shielding structure 1 and the second shielding structure 2;
  • the N first differential pair signal terminals 4 are respectively arranged in the N first shielding channels 5.
  • N first shielding channels 5 isolated from each other are formed between the first shielding structure 1 and the second shielding structure 2, and the N first differential pair signal terminals 4 are respectively arranged in the N first shielding channels 5, so
  • the signal interference generated by any first differential pair signal terminal 4 is shielded by the first shielding channel 5 where the first differential pair signal terminal is located, reducing any one The intensity of the signal interference generated by the first differential pair signal terminal 4 to the other first differential pair signal terminals 4.
  • the signal interference intensity generated by other first differential pair signal terminals 4 to any one of the first differential pair signal terminals is also reduced, and the shielding effect is improved.
  • first and second instances are listed here to illustrate the detailed structure of the connector assembly in detail.
  • the first instance and the second instance are:
  • the first shielding structure 1 includes a first shielding sheet 11 and M first shielding walls 12, and the second shielding structure 2 includes a second shielding The sheet 21 and the M second shielding walls 22, and the first shielding sheet 11 and the second shielding sheet 21 are arranged opposite to each other.
  • the M first shielding walls 12, the M first ground shielding terminals 3, and the M second shielding walls 22 form M partition walls 6, which correspond to each other
  • the space between the two adjacent partition walls 6 is a first shielding channel 5; that is, the first shielding channel 5 is separated by the first shielding sheet 11, the second shielding sheet 21 and the adjacent two The space enclosed by wall 6.
  • the any one partition wall includes a first shielding wall 12 fixed on the first shielding sheet 11, and a second shielding wall fixed on the second shielding sheet 21 22, and a first grounding shield terminal 3 located between the one first shielding wall 12 and the one second shielding wall 22.
  • any one of the first shielding channels 5 is provided with a carrier 71, and the carrier 71 is parallel to the first shielding sheet 11 and the second shielding sheet 21, respectively.
  • the carrier 71 is fixed on the first ground shield terminal 3 in the first partition wall 61 and on the first ground shield terminal 3 in the second partition wall 62.
  • the first partition wall 61 and the second partition wall 62 are either of the first A shielding channel 5 has partition walls on both sides, and the first differential pair signal terminal 4 located in any one of the first shielding channels 5 is embedded on the carrier 71.
  • the carrier 71 in any one of the first shielding channels 5 may be a part of the carrier plate 7.
  • the carrier plate 7 can be provided with M elongated openings, each of the M first grounding shielding terminals 3 corresponds to a elongated opening, and each first grounding shielding terminal 3 is respectively embedded in Each first grounding shield terminal 3 corresponds to the elongated opening.
  • the any one of the first grounding shielding terminals 3 is embedded in the elongated opening corresponding to the any one of the first grounding shielding terminals 3, and the elongated The opening is divided into a first groove 72 and a second groove 73.
  • the first groove 72 is used for accommodating a first shielding wall 12 fixed on the first shielding sheet 11
  • the second groove 73 is used for accommodating and fixing the second A second shielding wall 22 on the shielding sheet 21. In this way, when the first shielding structure 1, the carrier plate 7 and the second shielding structure 2 are assembled, the first groove 72 and the second groove 73 have a positioning function, which can facilitate the assembly of the three into a connector assembly.
  • the carrier plate 7 there is a space between two adjacent first ground shielding terminals 3, the two adjacent first ground shielding terminals 3 are arranged in parallel and opposite to each other, and adjacent The part between the two first ground shielding terminals 3 is a carrier 71.
  • the N first differential pair signal terminals 4 are embedded in the carrier plate 7, and there is a first differential pair signal terminal 4 between the two adjacent first ground shielding terminals 3.
  • the first differential pair signal terminal 4 includes a first signal terminal 41 and a second signal terminal 42. Both the terminal 41 and the second signal terminal 42 are embedded in the carrier 71 in any one of the first shielding channels 5.
  • the first signal terminal 41 and the second signal terminal 42 may be embedded in the carrier 71 in any one of the first shielding channels 5 in the following first embedding manner or second embedding manner.
  • the first embedding method or the second embedding method are:
  • the first embedding mode see FIG. 3, in any one of the first shielding channels 5, the first signal terminal 41 and the second signal terminal 42 are arranged in parallel and opposite to each other, passing through the surface of the first signal terminal 41 and the second signal terminal 42 and The carrier 71 is vertical.
  • the surface of the carrier 71 close to the first shielding sheet 11 is provided with a third groove 74, and the first signal terminal 41 is embedded in the third groove 74
  • the surface of the carrier 71 close to the second shielding sheet 21 is provided with a fourth groove 75, the second signal terminal 42 is embedded in the bottom of the fourth groove 75, and the first signal terminal 41 and the second signal terminal 42 are parallel and Relative settings.
  • the cross section of the first grounding shielding terminal 3 is an I-shaped structure, and the first grounding shielding terminal 3 is embedded in a long strip of the carrier plate 7. In the opening.
  • the first ground shielding terminal 3 may be composed of a first part and a second part, and the cross section of the first part and the second part are both half I-shaped, and the two parts are aligned left and right to form a first I-shaped cross section.
  • the second embedding method in any one of the first shielding channels 5, the first signal terminal 41 and the second signal terminal 42 are arranged in parallel and opposite to each other, passing through the surface of the first signal terminal 41 and the second signal terminal 42 and The carrier 71 is parallel.
  • the carrier 71 is provided with a third groove 74 on the surface close to the first shielding sheet 11, the carrier 71 is provided with a fourth groove 75 on the surface close to the second shielding sheet 21, the first signal terminal 41 and the second The signal terminal 42 is embedded in the bottom of the third groove 74 or the fourth groove 75.
  • the first signal terminal 41 and the second signal terminal 42 included in the first differential pair signal terminal 4 are embedded in the bottom of the fourth groove 75.
  • each of the aforementioned first ground shielding terminals 3 may be a metal material. When implemented, it may be a metal alloy material, for example, a copper alloy material or the like.
  • the surface of each first ground shielding terminal 3 is also provided with a plating layer.
  • each of the aforementioned first signal terminals 41 may be a metal material. When implemented, it may be a metal alloy material, for example, a copper alloy material or the like.
  • the surface of each first signal terminal 41 is also provided with a plating layer.
  • each second signal terminal 42 described above may be a metal material. When implemented, it may be a metal alloy material, for example, a copper alloy material or the like.
  • the surface of each second signal terminal 42 is also provided with a plating layer.
  • the M first shielding walls 12 are fixed on the surface of the first shielding sheet 11 close to the second shielding structure 2, adjacent There is an interval between the two first shielding walls 12, and the two adjacent first shielding walls 12 are arranged in parallel and opposite to each other.
  • the M second shielding walls 22 are fixed on the surface of the second shielding sheet 21 close to the first shielding structure 1, adjacent There is an interval between the two second shielding walls 22, and the two adjacent second shielding walls 22 are arranged in parallel and opposite to each other.
  • the first shielding structure 1 can be buckled on one surface of the carrier plate 7, and the second shielding structure 2 can be buckled on the other surface of the carrier plate 7.
  • the first shielding structure 1 includes the i-th first shielding wall 12 in contact with the i-th first grounding shielding terminal 3, and the second shielding structure 2 includes the i-th second shielding wall 22 and the i-th first shielding wall 22.
  • the grounding shield terminal 3 is in contact, so that M partition walls 6 are formed between the first shielding sheet 11 included in the first shielding structure 1 and the second shielding sheet 21 included in the second shielding structure 2, as well as the first shielding sheet 11 and The space between the second shielding sheets 21 is partitioned by the M partition walls 6 into N first shielding channels 5 isolated from each other.
  • the first shielding sheet 11 and the M first shielding walls 12 may be integrally formed.
  • a single-layer gold tape stamping and drawing process may be used to form M first shielding walls 12 on the first shielding sheet 11 .
  • the M first shielding walls 12 are welded to the first shielding sheet 11.
  • the M first shielding walls 12 can be manufactured by a double-layer gold tape stamping process, and then the M first shielding walls 12 can be manufactured through a laser welding process. The shielding wall 12 is welded to the first shielding sheet 11.
  • the second shielding sheet 21 and the M second shielding walls 22 may be integrally formed.
  • a single-layer gold tape stamping and drawing process may be used to form M second shielding walls 22 on the second shielding sheet 21 .
  • the M second shielding walls 22 are welded to the second shielding sheet 21.
  • M second shielding walls 22 can be manufactured by a double-layer gold tape stamping process, and then the M second shielding walls 22 can be manufactured by a laser welding process. The shielding wall 22 is welded to the second shielding sheet 21.
  • the above-mentioned first shielding sheet 11 and the first shielding wall 12 are made of metal materials.
  • it may be a metal alloy material, for example, it may be a copper alloy material.
  • the second shielding sheet 21 and the second shielding wall 22 are also made of metal materials.
  • it may be a metal alloy material, for example, it may be a copper alloy material.
  • the first shielding structure can be connected by the following structures 1.
  • the carrier plate 7 and the second shielding structure 2 are connected as a whole.
  • the two structures are:
  • a first through hole 63 is provided on the any partition wall 6, and a first shielding sheet 11 is provided with a first through hole 63 communicating with the first through hole 63.
  • Two through holes 13, the first through hole 63 and the second through hole 13 are provided with a connecting piece 64, and the connecting piece 64 is used to connect the first shielding sheet 11 and any one of the partition walls 6.
  • a plurality of first through holes 63 may be provided on any one of the partition walls 6, and correspondingly, the first shielding sheet 11 is provided with a second through hole 13 communicating with each of the first through holes 63.
  • any partition wall 6 includes a first shielding wall 12, a second shielding wall 22, and a first grounding shielding terminal 3 located between the first shielding wall 12 and the second shielding wall 22. Therefore, the first through hole 63 includes three sections, which are the first section of through holes located in the first shielding wall 12, the second section of through holes located in the first ground shielding terminal 3, and the second section of through holes located in the second shielding wall 22. Three-section through hole.
  • the connecting member 64 is a welding column formed by welding the first through hole 63 and the second through hole 13 with a welding material. That is to say: after the first shielding structure 1 is buckled on one surface of the carrier plate 7 and the second shielding structure 2 is buckled on the other surface of the carrier plate 7, in the second through hole of the first shielding sheet 11 13 and the first through hole 63 of any one of the partition walls 6, a connecting piece 64 is formed by welding with a welding material, so that the first shielding sheet 11 and the any one of the partition walls 6 can be connected through the connecting piece 64. Since the connecting member 64 is formed by welding, the first shielding structure 1, the carrier plate 7 and the second shielding structure 2 are directly welded into a whole, which improves the robustness and reliability of the overall structure.
  • the connecting member 64 is a glue column formed in the first through hole 63 and the second through hole 13.
  • the material of the glue column can be plastic or conductive glue.
  • the second shielding sheet 22 is provided with a third through hole 23 aligned with the first through hole 63, and the connecting member 64 also extends into the third through hole 23 for connecting the second through hole.
  • the connecting member 64 when the connecting member 64 is a welding column formed by welding with a welding material, it can be buckled on a surface of the carrier plate 7 in the first shielding structure 1, and the second shielding structure 2 can be buckled on a surface of the carrier plate 7.
  • the second through hole 13 of the first shielding sheet 11, the first through hole 63 of any one of the partition walls 6 and the third through hole 23 of the second shielding sheet 21 are formed by welding using a welding material
  • One connecting piece 64 can connect the first shielding sheet 11, the partition wall 6 and the second shielding sheet 21 through the connecting piece 63.
  • the second structure see FIG. 7 or FIG. 8, for any partition wall 6, the partition wall 6 is provided with an accommodation space, and the first shielding sheet 11 is provided with a first opening 14 aligned with the accommodation space.
  • the second shielding sheet 21 is provided with a second opening 24 aligned with the accommodating space.
  • the first opening 14, the accommodating space and the second opening 24 are provided with a filling wall 65 which can be connected to the first shielding sheet 11, The any one of the partition wall 6 and the second shielding sheet 21.
  • the filling wall 65 is a part formed by welding in the first opening 14, the accommodating space, and the second opening 24 by welding materials. That is to say: after the first shielding structure 1 is buckled on one surface of the carrier plate 7 and the second shielding structure 2 is buckled on the other surface of the carrier plate 7, in the first opening 14 of the first shielding sheet 11
  • the accommodating space in any one of the partition walls 6 and the second opening 24 of the second shielding sheet 21 are welded with a welding material to form a filler wall 65, so that the first shielding sheet 11 and the second opening 24 can be connected through the filler wall 65 A partition wall 6 and a second shielding sheet 21.
  • the aforementioned soldering material is a solder paste material with a soldering peak temperature greater than or equal to 100 degrees and less than or equal to 320 degrees.
  • the aforementioned soldering material is a solder paste material with a soldering peak temperature greater than or equal to 100 degrees and less than or equal to 270 degrees.
  • the welding peak temperature may be 100, 150, 200, 250, 270, 300, or 320. or,
  • the aforementioned soldering material is a solder paste material with a soldering peak temperature greater than or equal to 120 degrees and less than or equal to 200 degrees.
  • the welding peak temperature can be 120, 150, 200, 220, or the like.
  • the material of the carrier plate 7 can be a plastic material, and the soldering peak temperature of the solder paste material is greater than or equal to 100 degrees and less than or equal to 320 degrees, or greater than or equal to 120 degrees and less than or equal to 200 degrees, yes A low-temperature welding material, which avoids plastic deformation and damage to the plating layer on the surface of the first ground shielding terminal 3 during welding.
  • the tin paste material is tin-silver-copper alloy (SnAgCu), tin-bismuth alloy (SnBi), tin-indium alloy (SnIn), tin-bismuth-silver alloy (SnBiAg), tin-bismuth-silver-indium alloy (SnBiAgIn), or the like.
  • the connector assembly further includes a third shielding structure 8, M second ground shielding terminals 91 and N second differential pair signal terminals 92, the third shielding structure 8 and the second
  • the shielding structure 2 is arranged opposite to one side away from the first shielding structure 1;
  • the M second ground shielding terminals 91 are located between the second shielding structure 2 and the third shielding structure 8, and N mutually isolated second shielding channels 93 are formed between the second shielding structure 2 and the third shielding structure 8.
  • the N second differential pair signal terminals 92 are respectively located in the N second shielding channels 93.
  • the second shielding structure 2 further includes M third shielding walls 25, the third shielding structure 8 includes third shielding sheets 81 and M fourth shielding walls 82, and the second shielding sheets 21 are far away from the first shielding structure 1.
  • the third shielding sheet 81 is oppositely arranged on one side;
  • M third shielding walls 25, M second ground shielding terminals 91 and M fourth shielding walls 82 form M partition walls 6, two adjacent to each other.
  • the space between the partition walls 6 is a second shielded channel 93;
  • Each partition wall 6 includes a third shielding wall 25 fixed on the second shielding sheet 21, a fourth shielding wall 82 fixed on the third shielding sheet 81, and the third shielding wall 25 and the one One second ground shield terminal 91 between the fourth shield walls 82.
  • any partition wall 6 located between the second shielding sheet 21 and the third shielding sheet 81, any partition wall 6 is also provided with a first through hole 61, and the connecting member 63 extends into either The first through hole 61 in the partition wall 6 is used to fix the third shielding structure 8, the M second ground shielding terminals 91 and the N second differential pair signal terminals 92 to the second shielding structure 2. or,
  • any one of the partition walls 6 is also provided with a receiving space, which is aligned with the second opening 24 on the second shielding sheet 21, and the above-mentioned filling wall 65 also extends into the receiving space to connect the third shielding structure 8,
  • the M second ground shielding terminals 91 and the N second differential pair signal terminals 92 are fixed to the second shielding structure 2.
  • the structure of the second differential pair signal terminal 92 is the same as the structure of the first differential pair signal terminal 4.
  • the second differential pair signal terminal 92 is embedded in the carrier plate 7.
  • the detailed structure Please refer to the above description of the first differential pair signal terminal 4, which will not be described in detail here.
  • the connector assembly may include multiple structures composed of the M second ground shielding terminals 91, the M second differential pair signal terminals 92 and the third shielding structure 8.
  • the multiple structures are superimposed together to form a connector assembly as shown in FIG. 11.
  • the carrier plate 7 is also provided with at least one spacer rib 72.
  • the any one of the spacer ribs 72 is fixed on the carrier plate 7 for fixing the M first shields.
  • the ground terminal 3 and the N first differential pair signal terminals 4 are fixed on the carrier plate 7.
  • the carrier plate 7 is close to the first shielding structure 1
  • At least one rib 72 is provided on the first surface of the carrier plate 7, and at least one rib 72 is also provided on the second surface of the carrier plate 7 close to the second shielding structure 2.
  • any first shielding wall 12 at least one notch (not shown in the figure) is further provided on any first shielding wall 12, and each notch corresponds to a rib 72 provided on the first surface.
  • each notch corresponds to a rib 72 provided on the first surface.
  • any second shielding wall 22 is further provided with at least one notch 29, and each notch 29 corresponds to a rib (not shown in the figure) provided on the second surface .
  • each rib on the second surface extends into the corresponding gap of each rib on any one of the second shielding walls 12.
  • one surface of the carrier plate 7 is provided with At least one rib 72.
  • the first shielding wall 12 when at least one rib 72 is provided on the first surface of the carrier plate 7 close to the first shielding structure 1, for any first shielding wall 12, the first shielding wall 12 is also provided with At least one notch (not shown in the figure), and each notch corresponds to a rib 72 provided on the first surface.
  • each rib 72 on the first surface extends into the corresponding gap of each rib 72 on any one of the first shielding walls 12.
  • each notch 29 corresponds to a rib (not shown in the figure) provided on the second surface.
  • the simulation tests were carried out on the two kinds of connector groups, in which the connecting piece 64 in one connector assembly is a welding post formed by welding, and the connecting piece 64 in the other connector assembly is made of glue. column.
  • the connector assembly includes any first differential pair signal terminal that transmits a signal with a signal frequency of 14Ghz, and the connector assembly includes the other first The sum of the intensity of signal interference generated by the differential pair signal terminals on any one of the first differential pair signal terminals is -46.8db.
  • any first differential pair signal terminal included in the connector assembly transmits a signal with a signal frequency of 14Ghz, and the other first differential pair signal terminals included in the connector assembly are The sum of the intensity of signal interference generated on the signal terminals of any first differential pair is -58.3db.
  • the test result shows that the shielding effect of the connector assembly where the connecting piece 64 is a welding post is higher, and the shielding effect of interference can be further improved.
  • the embodiment of the present application also provides a second example, see Figure 13 and Figure 14.
  • the first shielding structure 1 includes a first shielding sheet 11
  • the second shielding structure 2 includes The second shielding sheet 21, the first shielding sheet 11 and the second shielding sheet 21 are arranged oppositely; the height of each first ground shielding terminal 3 is equal to the thickness of the carrier plate 7.
  • the M first shielding ground terminals 3 are located between the first shielding sheet 11 and the second shielding sheet 21, and divide the space between the first shielding sheet 11 and the second shielding sheet 21 into N mutually isolated first Shield channel 5.
  • the N first differential pair signal terminals 4 are respectively arranged in the N first shielding channels 5.
  • first shielding channel 5 Between the first shielding sheet 11 and the second shielding sheet 21, the space between two adjacent first ground shielding terminals 3 is a first shielding channel 5; that is, the one first shielding channel 5 is formed by The space enclosed by the first shield sheet 11, the second shield sheet 21 and the two adjacent first ground shield terminals 3.
  • any one of the first shielding channels 5 includes a carrier 71, and the carrier 71 is respectively parallel to the first shielding sheet 11 and the second shielding sheet 21;
  • the carrier 71 is fixed on the first ground shielding terminals 3 on both sides of any one of the first shielding channels 5, and the first differential pair signal terminals 4 located in any one of the first shielding channels 5 are embedded on the carrier 71.
  • the carrier 71 is a part of the carrier plate 7.
  • the carrier plate 7 can be provided with M elongated openings.
  • the M first ground shielding terminals 3 correspond to one elongated opening, and each first grounding shielding terminal 3 is respectively fixed in Each first ground shield terminal 3 corresponds to the elongated opening, and in the carrier plate 7, there is a gap between two adjacent first ground shield terminals 3, and the two adjacent first ground shield terminals 3 are arranged in parallel and opposite to each other.
  • the carrier 71 in the first shielding channel 5 is provided with a third groove 74 on the surface close to the first shielding sheet 11, and a fourth groove 75 is provided on the surface close to the second shielding sheet 21 .
  • the first signal terminal 41 and the second signal terminal 42 included in the first differential pair signal terminal 4 in any one of the first shielding channels 5 the first signal terminal 41 is embedded in the bottom of the third groove 74, and the second signal The terminal 42 is embedded in the bottom of the fourth groove 75; or, the first signal terminal 41 and the second signal terminal 42 are embedded in the bottom of the third groove 74, or the first signal terminal 41 and the second signal terminal 42 are embedded in The bottom of the fourth groove 75.
  • each first ground shielding terminal 3 is the first pin 31, which is used to be plugged into the ground terminal of the PCB.
  • the other end of each first ground shielding terminal 3 is a mating end 32 for connecting with the mating end of the first grounding shielding terminal 3 included in other connectors.
  • the mating end may be a shrapnel structure or the like.
  • the any one of the first grounding shielding terminals 3 includes a first part and a second part, and the first pins 31 of any one of the first grounding shielding terminals 3 include the pins of the first part and the second part. Two-part pin.
  • the side of the first shielding sheet 11 close to the first pin 31 of each first grounding shielding terminal 3 is provided with M second pins 16 for grounding, and the second pins 16 on the first shielding sheet 11 are used for Yu is plugged into the ground terminal of the PCB.
  • the side of the first shielding sheet 11 close to the mating end 32 of each first grounding shielding terminal 3 is provided with M first bosses 17, and the M first bosses 17 are matched with the M first grounding shielding terminals 3 respectively. End 32 touches.
  • the side of the second shielding sheet 21 close to the first pin 31 of each first grounding shielding terminal 3 is provided with M third pins 26 for grounding, and the third pins 26 on the second shielding sheet 21 are used for Yu is plugged into the ground terminal of the PCB.
  • the side of the second shielding sheet 21 close to the mating end 32 of each first grounding shielding terminal 3 is provided with M second bosses 27, and the M second bosses 27 are matched with the M first grounding shielding terminals 3 respectively. End 32 touches.
  • the first shielding ground terminal 3 is a terminal with a bent structure or a terminal with a straight structure.
  • the first pin 31 and the mating end 32 of the first ground shield terminal 3 may be perpendicular.
  • each first signal terminal 41 is a fourth pin, which is used to be plugged into the ground terminal of the PCB.
  • the other end of each first signal terminal 41 is a mating end for connecting with mating ends of signal terminals included in other connectors.
  • One end of each second signal terminal 42 is a fifth pin, which is used to plug into the ground terminal of the PCB.
  • the other end of each second signal terminal 42 is a mating end for connecting with mating ends of signal terminals included in other connectors.
  • the first signal terminal 41 is a terminal with a bent structure or a terminal with a straight structure.
  • the fourth pin and the mating end of the first signal terminal 41 may be perpendicular.
  • the first signal terminal 42 is a terminal with a bent structure or a terminal with a straight structure.
  • the second signal terminal 42 is a terminal with a bent structure
  • the fifth pin of the second signal terminal 42 and the mating end may be perpendicular.
  • a first insulating component is provided between the first differential pair signal terminal 4 and the first shielding sheet 11 in any one of the first shielding channels 5 51, and a second insulating member 52 is provided between the second shielding sheet 21 and the second shielding sheet 21.
  • the first insulating component 51 or the second insulating component 52 is provided with M elongated openings, and each first shielding wall 12 corresponds to a elongated opening, or each second shielding wall 22 corresponds to a elongated opening. Strip opening.
  • the first insulating component 51 is formed on the surface of the first shielding sheet 11 close to the second shielding sheet 21 through an injection molding process.
  • a second insulating member 52 is formed on the surface of the second shielding sheet 21 close to the first shielding sheet 11 through an injection molding process.
  • the second shielding sheet 21 (or the first shielding sheet 11) is further provided with positioning posts 28, and the carrier plate 7 is further provided with positioning holes 73.
  • the positioning pillar 28 is also formed in the first insulating member 51, or when the second insulating member 52 is formed, the positioning pillar 28 is also formed in the second insulating member 52.
  • the i-th first shielding wall 12 in the first shielding structure 1 can be accurately connected to the i-th first shielding wall 12 in the first shielding structure 1
  • the first ground shielding end 3 is in contact with each other, and when the second shielding structure 2 is buckled on the carrier plate 7, the i-th second shielding wall 22 in the second shielding structure 2 can be accurately connected to the i-th A grounding shield end 3 contacts.
  • a positioning column 28 is provided in the open area of the second shielding sheet 21 (or the first shielding sheet 11), and a positioning hole 73 is provided in the open area of the carrier plate 7.
  • the N first differential pair signal terminals are respectively located in the N first shielding channels.
  • the interference signal generated by the first differential pair signal terminal in any first shielded channel will be shielded by any first shielded channel to prevent the first differential pair signal terminal from affecting other first differential pair signal terminals , Thereby improving the shielding effect.
  • the above-mentioned connector assembly can be used to transmit high-frequency signals, for example, can be used to transmit signals with a signal frequency of 56Ghz.
  • first shielding structure, the N first ground shielding terminals and the second shielding structure are connected to form an integral structure by welding columns or filling walls formed by welding, which improves the reliability, robustness and stability of the connector assembly.
  • the interference signal generated by any first differential pair signal terminal to other first differential pair signal terminals is relatively strong, but the shielding effect of the connector assembly provided by the embodiment of the application is great. Therefore, even when high-frequency signals are transmitted, the signal interference intensity generated by any one of the first differential pair signal terminals to other first differential pair signal terminals is reduced, so that high-frequency signals can be efficiently transmitted.
  • an embodiment of the present application also provides a connector, which includes a plurality of any one of the embodiments shown in FIG. 2 to FIG. 11 or any one of the embodiments shown in FIG. 13 to FIG.
  • the connector assembly a includes a plurality of any one of the embodiments shown in FIG. 2 to FIG. 11 or any one of the embodiments shown in FIG. 13 to FIG.
  • the plurality of connector components a are parallel to each other. For any two adjacent connector components a of the plurality of connector components a, there is a gap between the two adjacent connector components a, and the adjacent The two connector components a are arranged oppositely.
  • the connector further includes: a base shell b.
  • a plurality of first mounting slots (not shown in the figure) are provided in the base shell b, and each of the plurality of connector assemblies a
  • Each connector assembly a corresponds to a first installation slot, and one end of each connector assembly a is respectively installed in the first installation slot corresponding to each connector assembly a.
  • the plurality of connector assemblies a can form a connector more stably.
  • the connector further includes:
  • the fixing piece c is a comb-shaped structure.
  • a plurality of second mounting grooves c1 are provided in the fixing piece c.
  • Each connector assembly a corresponds to a second mounting groove c1, and the other end of each connector assembly a is respectively It is installed in the second installation groove c1 corresponding to each connector assembly a.
  • the plurality of connector assemblies a can form a connector more stably, and the firmness of the connector can be improved.
  • the connector further includes:
  • the end guard d is provided with a plurality of perforations d1.
  • the perforation d1 includes a first side hole d11, a second side hole d12, and a middle perforation d13 located between the first side hole d11 and the second side hole d12 .
  • one of the first ground shielding terminals 3 includes The first part of the pin, the fourth pin of the first signal terminal 41, the fifth pin of the second signal terminal 42, and the other first ground shielding terminal 3 includes the second part of the pin passing end A perforation d1 in the guard d.
  • the first part of the pin included in one of the first grounding shielding terminals 3 is in interference fit with the first side hole d11 of the through hole 31
  • the second part of the pin included in the other first grounding shielding terminal 3 is in interference fit with the through hole.
  • the second side hole d12 of 31 has an interference fit.
  • the fourth pin of the first signal terminal 41 and the fifth pin of the second signal terminal 42 pass through the middle hole d13 of the hole d1, and the fourth pin of the first signal terminal 41 and the second signal terminal
  • the fifth pin of 42 is not in contact with the periphery of the middle perforation d13 of the perforation d1.
  • Each second pin 16 on the 11 is interference fit with the corresponding through hole d1 of each second pin 16 respectively.
  • a perforation d1 corresponding to the third pin 26 on the second shielding sheet 21 included in any connector assembly a, and the second shielding sheet included in any connector assembly a is respectively in interference fit with the through hole d1 corresponding to each third pin 26.
  • first shield sheet 11, the second shield sheet 21 and each first ground shield terminal 3 are interconnected by the end shield d to form a ground return system.
  • two connectors can be used to connect two PCBs, the two connectors are the first connector A1 and the second connector A2, and the two PCBs are the first PCB A3 and the second PCB, respectively.
  • Two PCBA4 Two PCBA4.
  • Each pin included in the first connector A1 is plugged into the first PCBA3, and each pin included in the second connector A2 is plugged into the second PCBA4.
  • the mating end included in the first connector A1 is plugged into the mating end included in the second connector A2, so that the first PCBA3 and the second PCBA4 are connected through the first connector A1 and the second connector A2.
  • the base shell b of the first connector A1 is further provided with a guide protrusion b1
  • the base shell b of the second connector A2 is also provided with a receiving portion that cooperates with the guide protrusion b1.
  • each ground shield terminal 3, each first signal terminal 41 and each second signal terminal 42 in the first connector A1 may all be bent terminals, and each ground shield terminal 3 in the second connector A2,
  • Each first signal terminal 41 and each second signal terminal 42 may also be bent terminals, so that the first connector A1 and the second connector A2 can form an orthogonal interconnection system.
  • the orthogonal interconnection system can be used to connect a first PCBA3 and a second PCBA4 that are perpendicular to each other.
  • any one of the first shielding channels 5 in the connector assembly included in the first connector A1 and the carrier 71 in any one of the first shielding channels 5 pass through
  • the surfaces of the first signal terminal 41 and the second signal terminal 42 are perpendicular to the carrier 71.
  • the second connector A1 includes any one of the first shielding channels 5 in the connector assembly, and for the carrier 71 in any one of the first shielding channels 5, the surfaces passing through the first signal terminal 41 and the second signal terminal 42 are connected to each other.
  • the carrier 71 is parallel.
  • the material of the above-mentioned base shell b is a plastic material, for example, it may be a liquid crystal polymer (LCP) material, and the base shell b may be formed by injection molding.
  • LCP liquid crystal polymer
  • the material of the above-mentioned fixing piece c is a metal material, for example, it may be a stainless steel material, and the stainless steel material may be stamped and formed to obtain the fixing piece c.
  • the surface of the fixing piece c may be electroplated with a plating layer.
  • the material of the end guard d is a plastic material, for example, it can be an LCP material, and the end guard d can be formed by injection molding.
  • the surface of the end guard d may be electroplated with a conductive layer.
  • the connector includes a plurality of connector components.
  • the two sides of any connector component are the first shielding sheet and the second shielding sheet, the first shielding wall, the second shielding sheet and the second shielding sheet.
  • the shielding wall and the grounding shielding terminal are welded to form a stable and reliable partition wall structure.
  • the first shielding sheet and the second shielding sheet are separated by a partition wall into N mutually isolated N first shielding channels, any one
  • the first shielding channel can prevent the differential pair signal terminals located in the first shielding channel from causing signal interference to other differential pair signal terminals, which not only improves the interference between two adjacent differential pair signal terminals in the same connector assembly
  • the shielding effect also improves the shielding effect between two adjacent connector components.
  • an embodiment of the present application provides a method for manufacturing a connector assembly.
  • the connector assembly can be any one of the embodiments shown in FIGS. 2 to 11 or any implementation shown in FIGS. 13 to 16
  • the connector components provided by the example include:
  • M first shielding walls 12 may be formed on the surface of the first shielding sheet 11 to obtain the first shielding structure 1;
  • M second shielding walls 22 may be formed on the surface of the second shielding sheet 21, To obtain a second shielding structure 2.
  • the first shielding sheet 11 is provided with M first shielding walls 12 on the surface of the injection molding of the first insulating component 51, and/or, the second shielding sheet 21 is provided with M second shielding walls A second insulating part 52 is formed on the surface of 22 by injection molding.
  • the M first ground shielding terminals 3 and N first differential pair signal terminals 4 are embedded in the carrier plate 7, and there are two adjacent first ground shielding terminals 3 A first differential pair signal terminal 4.
  • Step 102 Using M first ground shielding terminals 3, N mutually isolated first shielding channels 5 are formed between the first shielding structure 1 and the second shielding structure 2 which are arranged oppositely, and N first differential pair signals The terminals 4 are respectively located in the N first shielding channels 5.
  • the second shielding structure 2 is buckled on the other surface of the carrier plate 7, and the i-th second shielding wall 22 included in the second shielding structure 2 is in contact with the i-th first grounding shielding terminal 3 in the carrier plate 7.
  • Step 103 A connecting piece 64 is provided in the first shielding sheet 1, the i-th partition wall 6 and the second shielding sheet 2, and the connecting piece 64 is used to connect the first shielding sheet 1, the i-th partition wall 6 and the second shielding sheet.
  • the i-th partition wall 6 is provided with a first through hole 63
  • the first shielding sheet 11 is provided with a second through hole 13 communicating with the first through hole 63; in this step, the welding material is used in The second through hole 13 and the first through hole 63 are welded to form a connecting piece 64 in the second through hole 13 and the first through hole 63, and the connecting piece 64 is used to connect the i-th partition wall 6 and the first shielding sheet 11.
  • an accommodating space is provided in the i-th partition wall 6, a first opening communicating with the accommodating space is provided in the first shielding sheet 11, and a second opening communicating with the accommodating space is provided in the second shielding sheet 21.
  • a welding material is used to weld the first opening, the receiving space, and the second opening to form a filling wall 65 in the first opening, the receiving space, and the second opening, and the filling wall 65 is used to connect the first shielding sheet 11.
  • the i-th partition wall 6 and the second shielding sheet 21 is used to connect the first shielding sheet 11.
  • N mutually isolated first shielding channels are formed between the first shielding structure and the second shielding structure that are arranged oppositely, and N first differential pairs are formed.
  • the signal terminals are respectively located in the N first shielding channels.

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Abstract

本申请公开了一种连接器组件、连接器、网络设备和制造方法，属于通信领域。所述连接器组件包括：第一屏蔽结构、第二屏蔽结构、M个第一接地屏蔽端子和N个第一差分对信号端子，M＝N+1，N为大于1的整数，所述第一屏蔽结构和所述第二屏蔽结构相对设置；所述M个第一接地屏蔽端子位于所述第一屏蔽结构和所述第二屏蔽结构之间并通过焊接得到的连接件形成稳定可靠的分隔墙，并通过分隔墙在所述第一屏蔽结构和所述第二屏蔽结构之间形成N个相互隔离的第一屏蔽通道；所述N个第一差分对信号端子分别设置在所述N个第一屏蔽通道中。本申请能够提高屏蔽效果。

Description

连接器组件、连接器、网络设备和制造方法
本申请要求于2019年12月31日提交的申请号为201911423186.0、发明名称为“连接器组件、连接器、网络设备和制造方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信领域，特别涉及一种连接器组件、连接器、网络设备和制造方法。
背景技术
通信设备包括网卡、线卡和高速背板等部件，通信设备中的两两部件通过两个连接器相连。对于该两个连接器，其中一个连接器插接在其中一部件，另一个连接器插接在另一部件，该两个连接器再相互连接，如此实现连接两个部件。
针对任一个连接器，该连接器包括并行设置的多个连接器组件。连接器组件包括载体、M个接地屏蔽端子和N个差分对信号端子，M＝N+1，N为大于1的整数。该M个接地屏蔽端子并行地嵌入在载体中，该N个差分对信号端子也并行地嵌入在载体中，相邻的两个接地屏蔽端子之间存在一个差分对信号端子，这样通过接地屏蔽端子屏蔽相邻两个差分对信号端子之间相互产生的干扰。每个差分对信号端子包括并行设置的两个信号端子，针对任一个信号端子，该信号端子的一端用于插接在一个部件上，该信号端子的另一端用于插接在另一个部件上。
在实现本申请的过程中，发明人发现现有技术至少存在以下问题：
通过一个接地屏蔽端子并不能屏蔽相邻两个差分对信号端子之间的信号干扰，屏蔽效果较差。
发明内容
本申请提供了一种连接器组件、连接器、网络设备和制造方法，以提高屏蔽效果。所述技术方案如下：
第一方面，本申请提供了一种连接器组件，包括：第一屏蔽结构、第二屏蔽结构、M个第一接地屏蔽端子和N个第一差分对信号端子，M＝N+1，N为大于1的整数，第一屏蔽结构和第二屏蔽结构相对设置。该M个第一接地屏蔽端子位于第一屏蔽结构和第二屏蔽结构之间，并在第一屏蔽结构和第二屏蔽结构之间形成N个相互隔离的第一屏蔽通道。该N个第一差分对信号端子分别设置在N个第一屏蔽通道中。由于在第一屏蔽结构和第二屏蔽结构之间形成N个相互隔离的第一屏蔽通道，该N个第一差分对信号端子分别设置在N个第一屏蔽通道中，这样对于任一个第一屏蔽通道和该任一个第一屏蔽通道内的第一差分对信号端子，该任一个第一屏蔽通道可以屏蔽该第一差分对信端子产生的信号干扰，以减小对其他N-1个第一差分对信号端子产生的干扰强度，从而提高了屏蔽效果。
在一种可能的实现方式中，第一屏蔽结构包括第一屏蔽片和M个第一屏蔽墙，第二屏蔽结构包括第二屏蔽片和M个第二屏蔽墙，第一屏蔽片和第二屏蔽片相对设置；在第一屏蔽片和第二屏蔽片之间，该M个第一屏蔽墙、该M个第一接地屏蔽端子和该M个第二屏蔽墙形成M个分隔墙，相邻两个分隔墙之间的空间为一个第一屏蔽通道；每个分隔墙包括固定在第一屏蔽片上的一个第一屏蔽墙，固定在第二屏蔽片上的一个第二屏蔽墙，以及位于该一个第一屏蔽墙和该一个第二屏蔽墙之间的一个第一接地屏蔽端子。由于该M个第一屏蔽墙、该M个第一接地屏蔽端子和该M个第二屏蔽墙形成M个分隔墙，这样通过该M个分隔墙将第一屏蔽片和第二屏蔽片之间的空间分隔成N个屏蔽通道。
在另一种可能的实现方式中，针对任一个第一屏蔽通道，任一个第一屏蔽通道中设有载体，该载体分别平行于第一屏蔽片和第二屏蔽片；该载体固定在第一分隔墙中的第一接地屏蔽端子和第二分隔墙中的第一接地屏蔽端子上，第一分隔墙和第二分隔墙为任一个第一屏蔽通道的两侧分隔墙，位于任一个第一屏蔽通道中的第一差分对信号端子嵌入在载体中。由于该载体固定在第一分隔墙中的第一接地屏蔽端子上和第二分隔墙中的第一接地屏蔽端子上，位于任一个第一屏蔽通道中的第一差分对信号端子嵌入在载体上，由于第一接地屏蔽端子位于分隔墙的中部，这样可以使第一差分对信号端子包括的两个信号端子位于该任一个第一屏蔽通道的中部，保证第一差分对信号端子包括的信号端子与第一屏蔽片之间存在间隙，以及与第二屏蔽片之间存在间隙。第一屏蔽片与第二屏蔽片与接地端相连，从而避免信号端子与接地端短接。
在另一种可能的实现方式中，任一个第一屏蔽通道中的第一差分对信号端子包括第一信号端子和第二信号端子，第一信号端子和所述第二信号端子均嵌入在载体中，第一信号端子和第二信号端子平行且相对设置，经过第一信号端子和第二信号端子的面与载体垂直或与载体平行。第一信号端子和第二信号端子嵌入在该任一个第一屏蔽通道的载体中，这样在该任一个第一屏蔽通道中，第一信号端子和第二信号端子之间进行信号耦合，该任一个第一屏蔽通道中屏蔽该第一信号端子和第二信号端子四周的干扰。
在另一种可能的实现方式中，该M个第一接地屏蔽端子中的每个第一接地屏蔽端子的一端为第一引脚，每个第一接地屏蔽端子的另一端为配合端。第一屏蔽片靠近每个第一接地屏蔽端子的第一引脚的侧部设有M个用于接地的第二引脚，第一屏蔽片靠近每个第一接地屏蔽端子的配合端的侧部设有M个第一凸台，M个第一凸台分别与M个第一接地屏蔽端子的配合端接触。第二屏蔽片靠近每个第一接地屏蔽端子的第一引脚的侧部设有M个用于接地的第三引脚，第二屏蔽片靠近每个第一接地屏蔽端子的配合端的侧部设有M个第二凸台，M个第二凸台分别与M个第一接地屏蔽端子的配合端接触。这样通过第一屏蔽片、第二屏蔽片和该M个第一接地屏蔽端子形成互联的一个接地屏蔽系统。
在另一种可能的实现方式中，针对任一个分隔墙，任一个分隔墙上设有第一通孔，第一屏蔽片上设有与第一通孔连通的第二通孔，第一通孔和第二通孔中设有连接件，连接件用于连接第一屏蔽片和任一个分隔墙。这样保证第一屏蔽结构、第二屏蔽结构和该M个第一接地 屏蔽端形成一个结构稳定的整体结构，从而提高连接器组件的稳定性。
在另一种可能的实现方式中，第二屏蔽片上设有与第一通孔连通的第三通孔，连接件还延伸入第三通孔，用于连接第二屏蔽片和任一个分隔墙，从而可以进一步提高连接器组件的稳定性。
在另一种可能的实现方式中，连接件为通过焊接材料在第一通孔和第二通孔中焊接形成的部件。由于连接件是焊接形成的部件，即通过焊接形成连接器组件，使连接器组件连接的更加稳定，以及使第一屏蔽通道屏蔽的效果更高。
在另一种可能的实现方式中，针对任一个分隔墙，任一个分隔墙设有容纳空间，第一屏蔽片中设有与容纳空间对齐的第一开口，第二屏蔽片中设有与容纳空间对齐的第二开口，第一开口、容纳空间和第二开口中设有填充墙。由于在分隔墙中填充有填充墙，通过填充墙可以增加第一屏蔽通道屏蔽的效果。
在另一种可能的实现方式中，填充墙为通过焊接材料在所述第一开口、容纳空间和第二开口中焊接形成的部件。由于填充墙是焊接形成的部件，即通过焊接形成连接器组件，使连接器组件连接的更加稳定，以及使第一屏蔽通道屏蔽的效果更高。
在另一种可能的实现方式中，焊接材料为焊接峰值温度大于或等于100度且小于或等于320度的锡膏材料。这样焊接的温度较低，避免破坏第一接地屏蔽端子表面的镀层以及载体的形状。
在另一种可能的实现方式中，针对任一个第一屏蔽通道，位于任一个第一屏蔽通道中的第一差分对信号端子与第一屏蔽片之间设有第一绝缘部件，以及与所述第二屏蔽片之间设有第二绝缘部件。这样有效地避免第一差分对信号端子与第一屏蔽片和第二屏蔽片接触。
在另一种可能的实现方式中，还包括第三屏蔽结构、M个第二接地屏蔽端子和N个第二差分对信号端子，第三屏蔽结构与第二屏蔽结构远离第一屏蔽结构的一侧面相对设置；该M个第二接地屏蔽端子位于第二屏蔽结构和第三屏蔽结构之间，并在第二屏蔽结构和第三屏蔽结构之间形成N个相互隔离的第二屏蔽通道，N个第二差分对信号端子分别位于N个第二屏蔽通道中。
在另一种可能的实现方式中，第二屏蔽结构还包括M个第三屏蔽墙，第三屏蔽结构包括第三屏蔽片和M个第四屏蔽墙，第二屏蔽片远离第一屏蔽结构的一侧面和第三屏蔽片相对设置；在第二屏蔽片和第三屏蔽片之间，M个第三屏蔽墙、M个第二接地屏蔽端子和M个第四屏蔽墙形成M个分隔墙，相邻两个分隔墙之间的空间为一个第二屏蔽通道；每个分隔墙包括固定在第二屏蔽片上的一个第三屏蔽墙，固定在第三屏蔽片上的一个第四屏蔽墙，以及位于一个第三屏蔽墙和一个第四屏蔽墙之间的一个第二接地屏蔽端子。
第二方面，本申请提供了一种连接器，包括多个第一方面或第一方面任一种可能的实现方式所述的连接器组件，该多个连接器组件相互平行，针对该多个连接器组件中的任意相邻的两个连接器组件，该两个连接器组件之间存在间隔，且该两个连接器件相对设置。针对任一个连接器组件，该任一个连接器组件的两侧是第一屏蔽片和第二屏蔽片，第一屏蔽片和第二屏蔽片之间使用分隔墙分隔成N个相互隔离的N个第一屏蔽通道，任一个第一屏蔽通道可以阻止位于该第一屏蔽通道内的差分对信号端子对其他差分对信号端子产生信号干扰，这样不仅在同一个连接器组件内提高了相邻两个差分对信号端子之间的屏蔽效果，以也提高了在相邻两个连接器组件之间的屏蔽效果。
在一种可能的实现方式中，还包括：机座壳，机座壳中设有多个第一安装槽，多个连接器组件中的每个连接器组件对应一个第一安装槽，每个连接器组件的一端分别安装在每个连接器组件对应的第一安装槽中。如此将多个连接器组件形成一个连接器。
在另一种可能的实现方式中，还包括：固定片，固定片中设有多个第二安装槽，每个连接器组件对应一个第二安装槽，每个连接器组件的另一端分别安装在每个连接器组件对应的第二安装槽中。这样可以使该多个连接器组件更加稳定的形成一个连接器，增加了连接器的结构稳定性。
第三方面，本申请提供了一种网络设备，所述网络设备包括第二方面或第二方面的任一种可能实现方式提供的连接器。
第四方面，本申请提供了一种制造连接器组件的方法，在所述方法中，获取第一屏蔽结构、第二屏蔽结构、M个第一接地屏蔽端子和N个第一差分对信号端子，M＝N+1，N为大于1的整数。使用所述M个第一接地屏蔽端子，在相对设置的所述第一屏蔽结构和所述第二屏蔽结构之间形成N个相互隔离的第一屏蔽通道，且所述N个第一差分对信号端子分别位于所述N个第一屏蔽通道中。由于在第一屏蔽结构和第二屏蔽结构之间形成N个相互隔离的第一屏蔽通道，该N个第一差分对信号端子分别位于N个第一屏蔽通道中，这样对于任一个第一屏蔽通道和该任一个第一屏蔽通道内的第一差分对信号端子，该任一个第一屏蔽通道可以屏蔽该第一差分对信端子产生的信号干扰，以减小对其他N-1个第一差分对信号端子产生的干扰强度，从而提高了屏蔽效果。
在一种可能的实现方式中，在第一屏蔽片的表面上形成M个第一屏蔽墙，以得到所述第一屏蔽结构；在第二屏蔽片的表面上形成M个第二屏蔽墙，以得到所述第二屏蔽结构。
在另一种可能的实现方式中，在载体平板中嵌入所述M个第一接地屏蔽端子和N个第一差分对信号端子，相邻的两个第一接地屏蔽端子之间存在一个第一差分对信号端子。将所述第一屏蔽结构扣合在所述载体平板的一表面，且所述第一屏蔽结构包括的第i个第一屏蔽墙与所述载体平板中的第i个第一接地屏蔽端子接触，i＝1、2、3、……、M。将所述第二屏蔽 结构扣合在所述载体平板的另一表面，且所述第二屏蔽结构包括的第i个第二屏蔽墙与所述载体平板中的第i个第一接地屏蔽端子接触。如此将第一屏蔽片和第二屏蔽片之间的空间分隔成N个屏蔽通道。
在另一种可能的实现方式中，所述第i个第一屏蔽墙、所述第i个第一接地屏蔽端子和所述第i个第二屏蔽墙组成第i个分隔墙，所述第i个分隔墙中设有第一通孔，所述第一屏蔽片中设有与所述第一通孔连通的第二通孔。通过焊接材料在所述第二通孔和所述第一通孔中焊接，以在所述第二通孔和所述第一通孔中形成连接件，所述连接件用于连接所述第i个分隔墙和所述第一屏蔽片。这样保证第一屏蔽结构、第二屏蔽结构和该M个第一接地屏蔽端形成一个结构稳定的整体结构，从而提高连接器组件的稳定性。
在另一种可能的实现方式中，所述第i个第一屏蔽墙、所述第i个第一接地屏蔽端子和所述第i个第二屏蔽墙组成第i个分隔墙，所述第i个分隔墙中设有容纳空间，所述第一屏蔽片中设有与所述容纳空间连通的第一开口，所述第二屏蔽片中设有与所述容纳空间连通的第二开口。通过焊接材料在所述第一开口、所述容纳空间和所述第二开口中焊接，以在所述第一开口、所述容纳空间和所述第二开口中形成填充墙，所述填充墙用于连接所述第一屏蔽片、所述第i个分隔墙和所述第二屏蔽片。由于在分隔墙中填充有填充墙，通过填充墙可以增加第一屏蔽通道屏蔽的效果。
在另一种可能的实现方式中，在所述第一屏蔽片设有所述M个第一屏蔽墙的表面上注塑形成第一绝缘部件，和/或，在所述第二屏蔽片设有所述M个第二屏蔽墙的表面上注塑形成第二绝缘部件。这样有效地避免第一差分对信号端子与第一屏蔽片和第二屏蔽片接触。
附图说明
图1是本申请实施例提供的由两个连接器形成的正交互连系统的结构示意图；
图2是本申请实施例提供的一种连接器组件的爆炸图；
图3是本申请实施例提供的一种连接器组件的截面图；
图4是本申请实施例提供的另一种连接器组件的截面图；
图5是本申请实施例提供的另一种连接器组件的截面图；
图6是本申请实施例提供的另一种连接器组件的截面图；
图7是本申请实施例提供的另一种连接器组件的截面图；
图8是本申请实施例提供的另一种连接器组件的截面图；
图9是本申请实施例提供的另一种连接器组件的截面图；
图10是本申请实施例提供的另一种连接器组件的截面图；
图11是本申请实施例提供的另一种连接器组件的截面图；
图12是本申请实施例提供的测试结果示意图；
图13是本申请实施例提供的另一种连接器组件的截面图；
图14是本申请实施例提供的另一种连接器组件的截面图；
图15是本申请实施例提供的另一种连接器组件的截面图；
图16是本申请实施例提供的另一种连接器组件的截面图；
图17是本申请实施例提供的绝缘片的结构示意图；
图18是本申请实施例提供的一种连接器的截面图；
图19是本申请实施例提供的一种固定片的结构示意图；
图20是本申请实施例提供的一种端护片的结构示意图；
图21是本申请实施例提供的一种制造连接器组件的方法流程图。
具体实施方式
下面将结合附图对本申请实施方式作进一步地详细描述。
通信设备中往往包括多个印制电路板(printed circuit board，PCB)，对于存在连接关系的两个PCB，该两个PCB往往通过两个连接器相连。参见图1，为了便于说明称该两个连接器分别为第一连接器A1(又可称为公连接器)和第二连接器A2(又可称为母连接器)，称该两个PCB分别为第一PCBA3和第二PCBA4，第一连接器A1与第一PCBA3相连，第二连接器A2与第二PCBA4相连，第一连接器A1与第二连接器A2相连，如此实现通过该两个连接器连接了两个PCB。
对于上述任一个连接器，该连接器包括多个连接器组件，针对该多个连接器组件中的任一个连接器组件，接下来将详细说明该连接器组件的结构。
参见图2-4，本申请实施例提供了一种连接器组件，包括：
第一屏蔽结构1、第二屏蔽结构2、M个第一接地屏蔽端子3和N个第一差分对信号端子4，M＝N+1，N为大于1的整数，第一屏蔽结构1和第二屏蔽结构2相对设置；
M个第一接地屏蔽端子3位于第一屏蔽结构1和第二屏蔽结构2之间，并在第一屏蔽结构1和第二屏蔽结构2之间形成N个相互隔离的第一屏蔽通道5；
N个第一差分对信号端子4分别设置在N个第一屏蔽通道5中。
由于在第一屏蔽结构1和第二屏蔽结构2之间形成N个相互隔离的第一屏蔽通道5，而N个第一差分对信号端子4分别设置在N个第一屏蔽通道5中，这样对于任意一个第一差分对信号端子4，该任一个第一差分对信号端子4产生的信号干扰被该任一个第一差分对信号端子所在第一屏蔽通道5所屏蔽，减小了该任一个第一差分对信号端子4对其他第一差分对信号端子4产生的信号干扰强度。同样，也减小了其他的第一差分对信号端子4对该任一个第一差分对信号端子产生的信号干扰强度，提高了屏蔽效果。
可选的，上述连接器组件的详细结构有多种，在此列举了如下第一种实例和第二种实例来详细说明连接器组件的详细结构。该第一种实例和第二种实例分别为：
第一种实例，参见图3和图4所示的连接器组件的截面图，第一屏蔽结构1包括第一屏蔽片11和M个第一屏蔽墙12，第二屏蔽结构2包括第二屏蔽片21和M个第二屏蔽墙22，第一屏蔽片11和第二屏蔽片21相对设置。
在第一屏蔽片11和第二屏蔽片21之间，该M个第一屏蔽墙12、该M个第一接地屏蔽端子3和该M个第二屏蔽墙22形成M个分隔墙6，相邻两个分隔墙6之间的空间为一个第一屏蔽通道5；也就是说，该一个第一屏蔽通道5是由第一屏蔽片11、第二屏蔽片21和该相 邻的两个分隔墙6围成的空间。
针对该M个分隔墙6中的任一个分隔墙，该任一个分隔墙包括固定在第一屏蔽片11上的一个第一屏蔽墙12，固定在第二屏蔽片21上的一个第二屏蔽墙22，以及位于该一个第一屏蔽墙12和该一个第二屏蔽墙22之间的一个第一接地屏蔽端子3。
可选的，参见图3和图4，针对任一个第一屏蔽通道5，任一个第一屏蔽通道5中设有载体71，载体71分别平行于第一屏蔽片11和第二屏蔽片21。
载体71固定在第一分隔墙61中的第一接地屏蔽端子3上和第二分隔墙62中的第一接地屏蔽端子3上，第一分隔墙61和第二分隔墙62为该任一个第一屏蔽通道5的两侧分隔墙，位于该任一个第一屏蔽通道5中的第一差分对信号端子4嵌入在载体71上。
参见图2至4，该任一个第一屏蔽通道5中的载体71可以为载体平板7的一部分。载体平板7中可以设置M个长条形开口，该M个第一接地屏蔽端子3中的每个第一接地屏蔽端子3对应一个长条形开口，每个第一接地屏蔽端子3分别嵌入在每个第一接地屏蔽端子3对应的长条形开口中。
参见图3和图4，针对任一个第一接地屏蔽端子3，该任一个第一接地屏蔽端子3嵌入在该任一个第一接地屏蔽端子3对应的长条形开口中，将该长条形开口分成第一凹槽72和第二凹槽73，第一凹槽72用于容纳固定在第一屏蔽片11上的一个第一屏蔽墙12，第二凹槽73用于容纳固定在第二屏蔽片21上的一个第二屏蔽墙22。这样组装第一屏蔽结构1、载体平板7和第二屏蔽结构2时，第一凹槽72和第二凹槽73具有定位作用，可以方便将三者组装成一个连接器组件。
参见图3和图4，在载体平板7中，相邻的两个第一接地屏蔽端子3之间存在间隔，该相邻的两个第一接地屏蔽端子3平行且相对设置，以及相邻的两个第一接地屏蔽端子3之间的部分为载体71。
参见图2，该N个第一差分对信号端子4嵌入在载体平板7中，且该相邻的两个第一接地屏蔽端子3之间存在一个第一差分对信号端子4。
对于上述任一个第一屏蔽通道5中的第一差分对信号端子4，参见图3或图4，该第一差分对信号端子4包括第一信号端子41和第二信号端子42，第一信号端子41和第二信号端子42均嵌入在该任一第一屏蔽通道5中的载体71中。
可选的，第一信号端子41和第二信号端子42可以通过如下第一嵌入方式或第二嵌入方式嵌入在该任一第一屏蔽通道5中的载体71中。该第一嵌入方式或第二嵌入方式分别为：
第一嵌入方式，参见图3，在该任一个第一屏蔽通道5内第一信号端子41和第二信号端子42平行且相对设置，经过第一信号端子41和第二信号端子42的面与该载体71垂直。
例如参见图3，对于该任一个第一屏蔽通道5内的载体71，该载体71靠近第一屏蔽片11的表面设有第三凹槽74，第一信号端子41嵌入在第三凹槽74的底部，该载体71靠近第二屏蔽片21的表面设有第四凹槽75，第二信号端子42嵌入在第四凹槽75的底部，第一信号端子41和第二信号端子42平行且相对设置。
可选的，在第一嵌入方式中，针对任一个第一接地屏蔽端子3，第一接地屏蔽端子3的截面为工字形结构，第一接地屏蔽端子3嵌入在载体平板7的一个长条形开口中。
可选的，第一接地屏蔽端子3可以由第一部分和第二部分组成，第一部分的截面和第二部分的截面均是半工字形，将两部分左右对合，形成截面为工字形的第一接地屏蔽端子3。
第二嵌入方式，参见图4，在该任一个第一屏蔽通道5内第一信号端子41和第二信号端子42平行且相对设置，经过第一信号端子41和第二信号端子42的面与该载体71平行。
可选的，该载体71靠近第一屏蔽片11的表面设有第三凹槽74，该载体71靠近第二屏蔽片21的表面设有第四凹槽75，第一信号端子41和第二信号端子42嵌入在第三凹槽74或第四凹槽75的底部。例如，参见图4，该第一差分对信号端子4包括的第一信号端子41和第二信号端子42嵌入在第四凹槽75的底部。
可选的，上述每个第一接地屏蔽端子3的材料可以为金属材料。在实现时，可以为金属合金材料，例如可以为铜合金材料等。每个第一接地屏蔽端子3的表面还设有镀层。
可选的，上述每个第一信号端子41的材料可以为金属材料。在实现时，可以为金属合金材料，例如可以为铜合金材料等。每个第一信号端子41的表面还设有镀层。
可选的，上述每个第二信号端子42的材料可以为金属材料。在实现时，可以为金属合金材料，例如可以为铜合金材料等。每个第二信号端子42的表面还设有镀层。
对于第一屏蔽结构1包括的第一屏蔽片11和M个第一屏蔽墙12，该M个第一屏蔽墙12固定在第一屏蔽片11靠近第二屏蔽结构2的表面上，相邻的两个第一屏蔽墙12之间存在间隔，该相邻的两个第一屏蔽墙12平行且相对设置。
该M个第一屏蔽墙12中的每个第一屏蔽墙12对应一个第一接地屏蔽端子3，即第i个第一屏蔽墙12对应第i个第一接地屏蔽端子3，i＝1、2、3、……、M。
对于第二屏蔽结构2包括的第二屏蔽片21和M个第二屏蔽墙22，该M个第二屏蔽墙22固定在第二屏蔽片21靠近第一屏蔽结构1的表面上，相邻的两个第二屏蔽墙22之间存在间隔，该相邻的两个第二屏蔽墙22平行且相对设置。
该M个第二屏蔽墙22中的每个第二屏蔽墙22对应一个第一接地屏蔽端子3，即第i个第二屏蔽墙22对应第i个第一接地屏蔽端子3，i＝1、2、3、……、M。
参见图2至4，第一屏蔽结构1可以扣合在载体平板7的一表面上，第二屏蔽结构2可以扣合在载体平板7的另一表面上。且第一屏蔽结构1包括的第i个第一屏蔽墙12与第i个第一接地屏蔽端子3的接触，第二屏蔽结构2包括的第i个第二屏蔽墙22与第i个第一接地屏蔽端子3的接触，如此在第一屏蔽结构1包括的第一屏蔽片11和第二屏蔽结构2包括的第二屏蔽片21之间形成M个分隔墙6，以及第一屏蔽片11和第二屏蔽片21之间的空间被该M个分隔墙6分隔成N个相互隔离的第一屏蔽通道5。
可选的，第一屏蔽片11与该M个第一屏蔽墙12可以一体成型，例如，可以采用单层金带冲压抽引工艺，在第一屏蔽片11上形成M个第一屏蔽墙12。或者，该M个第一屏蔽墙12焊接在第一屏蔽片11上，例如，可以采用双层金带冲压工艺制造出M个第一屏蔽墙12，然后通过激光焊接工艺将该M个第一屏蔽墙12焊接在第一屏蔽片11上。
可选的，第二屏蔽片21与该M个第二屏蔽墙22可以一体成型，例如，可以采用单层金带冲压抽引工艺，在第二屏蔽片21上形成M个第二屏蔽墙22。或者，该M个第二屏蔽墙22焊接在第二屏蔽片21上，例如，可以采用双层金带冲压工艺制造出M个第二屏蔽墙22，然后通过激光焊接工艺将该M个第二屏蔽墙22焊接在第二屏蔽片21上。
可选的，上述第一屏蔽片11和第一屏蔽墙12为金属材料。在实现时，可以为金属合金材料，例如可以为铜合金材料。上述第二屏蔽片21和第二屏蔽墙22也为金属材料。在实现时，可以为金属合金材料，例如可以为铜合金材料。
可选的，在第一屏蔽结构1扣合在载体平板7的一表面上，第二屏蔽结构2扣合在载体平板7的另一表面上后，可以通过如下几种结构将第一屏蔽结构1、载体平板7和第二屏蔽结构2连接成一个整体。在此列举了如下两种结构，该两种结构分别为：
第一种结构，参见图5或6，针对任一个分隔墙6，该任一个分隔墙6上设有第一通孔63，第一屏蔽片11上设有与第一通孔63连通的第二通孔13，第一通孔63和第二通孔13中设有连接件64，连接件64用于连接第一屏蔽片11和该任一个分隔墙6。
可选的，该任一个分隔墙6上可以设有多个第一通孔63，相应的，第一屏蔽片11上设有与每个第一通孔63连通的第二通孔13。
该任一个分隔墙6包括一个第一屏蔽墙12、第二屏蔽墙22和位于第一屏蔽墙12和第二屏蔽墙22之间的一个第一接地屏蔽端子3。所以第一通孔63包括三段，分别为位于第一屏蔽墙12中的第一段通孔，位于第一接地屏蔽端子3中的第二段通孔和位于第二屏蔽墙22中的第三段通孔。
该连接件64为通过焊接材料在第一通孔63和第二通孔13中焊接形成的焊接柱。也就是说：在第一屏蔽结构1扣合在载体平板7的一表面上，第二屏蔽结构2扣合在载体平板7的另一表面上后，在第一屏蔽片11的第二通孔13和该任一个分隔墙6的第一通孔63中，使用焊接材料焊接形成一个连接件64，从而可以通过连接件64连接第一屏蔽片11和该任一个分隔墙6。由于连接件64是通过焊接形成的，这样直接将第一屏蔽结构1、载体平板7和第二屏蔽结构2焊接成一个整体，提高整体结构的牢固性和可靠性。
在一些实施例中，该连接件64为在第一通孔63和第二通孔13中形成的胶柱。该胶柱的材料可以为塑胶或导电胶等。
可选的，参见图7或图8，第二屏蔽片22上设有与第一通孔63对齐的第三通孔23，连接件64还延伸入第三通孔23，用于连接第二屏蔽片21和任一个分隔墙6。
可选的，该连接件64为通过焊接材料焊接形成的焊接柱的情况，可以在第一屏蔽结构1扣合在载体平板7的一表面上，第二屏蔽结构2扣合在载体平板7的另一表面上后，在第一屏蔽片11的第二通孔13、该任一个分隔墙6的第一通孔63和第二屏蔽片21的第三通孔23中，使用焊接材料焊接形成一个连接件64，从而可以通过连接件63连接第一屏蔽片11、该任一个分隔墙6和第二屏蔽片21。
第二种结构，参见图7或图8，针对任一个分隔墙6，该任一个分隔墙6设有容纳空间，第一屏蔽片11中设有与该容纳空间对齐的第一开口14，第二屏蔽片21中设有与该容纳空间对齐的第二开口24，第一开口14、该容纳空间和第二开口24中设有填充墙65，该填充墙65可以连接第一屏蔽片11、该任一个分隔墙6和第二屏蔽片21。
可选的，填充墙65为通过焊接材料在第一开口14、该容纳空间和第二开口24中焊接形成的部件。也就是说：在第一屏蔽结构1扣合在载体平板7的一表面上，第二屏蔽结构2扣合在载体平板7的另一表面上后，在第一屏蔽片11的第一开口14、该任一个分隔墙6中的容纳空间和第二屏蔽片21的第二开口24中，使用焊接材料焊接形成一个填充墙65，从而可以通过该填充墙65连接第一屏蔽片11、该任一个分隔墙6和第二屏蔽片21。
可选的，上述焊接材料为焊接峰值温度大于或等于100度且小于或等于320度的锡膏材料。
可选的，上述焊接材料为焊接峰值温度大于或等于100度且小于或等于270度的锡膏材 料。
例如，该焊接峰值温度可以为100、150、200、250、270、300或320等。或者，
可选的，上述焊接材料为焊接峰值温度大于或等于120度且小于或等于200度的锡膏材料。例如，该焊接峰值温度可以为120、150、200或220等。
可选的，载体平板7的材料可以为塑胶材料，而上述锡膏材料的焊接峰值温度大于或等于100度且小于或等于320度，或者，大于或等于120度且小于或等于200度，是一种低温焊接材料，这样在焊接时避免塑胶变形以及破坏第一接地屏蔽端子3表面的镀层。
可选的，该锡膏材料为锡银铜合金(SnAgCu)、锡铋合金(SnBi)、锡铟合金(SnIn)、锡铋银合金(SnBiAg)或锡铋银铟合金(SnBiAgIn)等。
可选的，参见图9或图10，该连接器组件还包括第三屏蔽结构8、M个第二接地屏蔽端子91和N个第二差分对信号端子92，第三屏蔽结构8与第二屏蔽结构2远离第一屏蔽结构1的一侧面相对设置；
M个第二接地屏蔽端子91位于第二屏蔽结构2和第三屏蔽结构8之间，并在第二屏蔽结构2和第三屏蔽结构8之间形成N个相互隔离的第二屏蔽通道93，N个第二差分对信号端子92分别位于N个第二屏蔽通道93中。
可选的，第二屏蔽结构2还包括M个第三屏蔽墙25，第三屏蔽结构8包括第三屏蔽片81和M个第四屏蔽墙82，第二屏蔽片21远离第一屏蔽结构1的一侧面和第三屏蔽片81相对设置；
在第二屏蔽片21和第三屏蔽片81之间，M个第三屏蔽墙25、M个第二接地屏蔽端子91和M个第四屏蔽墙82形成M个分隔墙6，相邻两个分隔墙6之间的空间为一个第二屏蔽通道93；
每个分隔墙6包括固定在第二屏蔽片21上的一个第三屏蔽墙25，固定在第三屏蔽片81上的一个第四屏蔽墙82，以及位于该一个第三屏蔽墙25和该一个第四屏蔽墙82之间的一个第二接地屏蔽端子91。
可选的，对于位于第二屏蔽片21和第三屏蔽片81之间的任一个分隔墙6，该任一个分隔墙6中也设有第一通孔61，连接件63延伸入该任一个分隔墙6中的第一通孔61，以将第三屏蔽结构8、M个第二接地屏蔽端子91和N个第二差分对信号端子92固定到第二屏蔽结构2上。或者，
该任一个分隔墙6也设有容纳空间，该容纳空间与第二屏蔽片21上的第二开口24对齐，且上述填充墙65也延伸入该容纳空间中，以将第三屏蔽结构8、M个第二接地屏蔽端子91和N个第二差分对信号端子92固定到第二屏蔽结构2上。
可选的，第二差分对信号端子92的结构与第一差分对信号端子4的结构相同，在任一个第二屏蔽通道93中，第二差分对信号端子92嵌入在载体平板7中，详细结构可以参见上述对第一差分对信号端子4的描述，在此不再详细说明。
可选的，参见图11，该连接器组件可以包括多个由该M个第二接地屏蔽端子91、该M个第二差分对信号端子92和第三屏蔽结构8所组成的结构。该多个结构叠加在一起形成如图11所示的连接器组件。
可选的，参见图2，载体平板7上还设有至少一个隔筋72，对于该任一个隔筋72，该任一个隔筋72固定在载体平板7上，用于将M个第一屏蔽接地端子3和N个第一差分对信号 端子4固定在载体平板7上。
可选的，在第一差分对信号端子4包括的第一信号端子41和第二信号端子42采用上述第一嵌入方式嵌入在载体平板7中的情况下，载体平板7靠近第一屏蔽结构1的第一表面上设有至少一个隔筋72，载体平板7靠近第二屏蔽结构2的第二表面上也设有至少一个隔筋72。
相应的，针对任一个第一屏蔽墙12，该任一个第一屏蔽墙12上还设有至少一个缺口(图中未画出)，每个缺口对应设在第一表面上的一个隔筋72。在第一屏蔽结构1扣合在载体平板7上时，第一表面上的每个隔筋72分别伸入该任一个第一屏蔽墙12上的该每个隔筋72对应的缺口。以及，针对任一个第二屏蔽墙22，该任一个第二屏蔽墙22上还设有至少一个缺口29，每个缺口29对应设在第二表面上的一个隔筋(图中未画出)。在第二屏蔽结构2扣合在载体平板7上时，第二表面上的每个隔筋分别伸入该任一个第二屏蔽墙12上的该每个隔筋对应的缺口。
可选的，在第一差分对信号端子4包括的第一信号端子41和第二信号端子42采用上述第二嵌入方式嵌入在载体平板7中的情况下，载体平板7的一个表面上设有至少一个隔筋72。
相应的，在载体平板7靠近第一屏蔽结构1的第一表面上设有至少一个隔筋72的情况下，针对任一个第一屏蔽墙12，该任一个第一屏蔽墙12上还设有至少一个缺口(图中未画出)，每个缺口对应设在第一表面上的一个隔筋72。在第一屏蔽结构1扣合在载体平板7上时，第一表面上的每个隔筋72分别伸入该任一个第一屏蔽墙12上的该每个隔筋72对应的缺口。或者，在载体平板7靠近第二屏蔽结构2的第二表面上设有至少一个隔筋72的情况下，针对任一个第二屏蔽墙22，该任一个第二屏蔽墙22上还设有至少一个缺口29，每个缺口29对应设在第二表面上的一个隔筋(图中未画出)。在第二屏蔽结构2扣合在载体平板7上时，第二表面上的每个隔筋分别伸入该任一个第二屏蔽墙12上的该每个隔筋对应的缺口29。
接下来，参见图12，分别对两种连接器组进行的仿真测试，其中一种连接器组件中的连接件64是焊接形成的焊接柱，另一种连接器组件中的连接件64是胶柱。在该测试时，对于连接件64为胶柱的连接器组件，该连接器组件包括的任一个第一差分对信号端子中传输信号频率为14Ghz的信号，该连接器组件包括的其他各第一差分对信号端子在该任一个第一差分对信号端子上产生的信号干扰的强度总和为-46.8db。对于连接件64为焊柱的连接器组件，该连接器组件包括的任一个第一差分对信号端子中传输信号频率为14Ghz的信号，该连接器组件包括的其他各第一差分对信号端子在该任一个第一差分对信号端子上产生的信号干扰的强度总和为-58.3db。测试结果表明连接件64为焊接柱的连接器组件屏蔽效果更高，可以进一步提高屏蔽干扰的效果。
对于连接器组件，本申请实施例还提供了第二种实例，参见图13和图14，在第二种实施例中，第一屏蔽结构1包括第一屏蔽片11，第二屏蔽结构2包括第二屏蔽片21，第一屏蔽片11和第二屏蔽片21相对设置；每个第一接地屏蔽端子3的高度等于载体平板7的厚度。
该M个第一屏蔽接地端子3位于第一屏蔽片11和第二屏蔽片21之间，并将第一屏蔽片11和第二屏蔽片21之间的空间分隔成N个相互隔离的第一屏蔽通道5。N个第一差分对信号端子4分别设置在N个第一屏蔽通道5中。
在第一屏蔽片11和第二屏蔽片21之间，相邻两个第一接地屏蔽端子3之间的空间为一个第一屏蔽通道5；也就是说，该一个第一屏蔽通道5是由第一屏蔽片11、第二屏蔽片21和该相邻的两个第一接地屏蔽端子3围成的空间。
可选的，参见图13和图14，针对任一个第一屏蔽通道5，任一个第一屏蔽通道5中包括载体71，载体71分别平行于第一屏蔽片11和第二屏蔽片21；
载体71固定在该任一个第一屏蔽通道5的两侧第一接地屏蔽端子3上，位于该任一个第一屏蔽通道5中的第一差分对信号端子4嵌入在载体71上。
载体71是载体平板7中的一部分，载体平板7中可以设置M个长条形开口，该M个第一接地屏蔽端子3对应一个长条形开口，每个第一接地屏蔽端子3分别固定在每个第一接地屏蔽端子3对应的长条形开口中，且在载体平板7中，相邻的两个第一接地屏蔽端子3之间存在间隔，该相邻的两个第一接地屏蔽端子3平行且相对设置。
在该任一个第一屏蔽通道5，第一屏蔽通道5中的载体71靠近第一屏蔽片11的表面设有第三凹槽74，靠近第二屏蔽片21的表面设有第四凹槽75。对于该任一个第一屏蔽通道5中的第一差分对信号端子4包括的第一信号端子41和第二信号端子42，第一信号端子41嵌入在第三凹槽74的底部，第二信号端子42嵌入在第四凹槽75的底部；或者，第一信号端子41和第二信号端子42嵌入在第三凹槽74的底部，或者，第一信号端子41和第二信号端子42嵌入在第四凹槽75的底部。
可选的，在上述第一种实例或第二种实例中，每个第一接地屏蔽端子3的一端为第一引脚31，用于插接在PCB的接地端上。每个第一接地屏蔽端子3的另一端为配合端32，用于与其他连接器包括的第一接地屏蔽端子3的配合端连接。
可选的，配合端可以为弹片结构等。对于任一个第一接地屏蔽端子3，该任一个第一接地屏蔽端子3包括第一部分和第二部分，该任一个第一接地屏蔽端子3的第一引脚31包括第一部分的引脚和第二部分的引脚。
第一屏蔽片11靠近每个第一接地屏蔽端子3的第一引脚31的侧部设有M个用于接地的第二引脚16，第一屏蔽片11上的第二引脚16用于插接在PCB的接地端上。第一屏蔽片11靠近每个第一接地屏蔽端子3的配合端32的侧部设有M个第一凸台17，M个第一凸台17分别与M个第一接地屏蔽端子3的配合端32接触。
第二屏蔽片21靠近每个第一接地屏蔽端子3的第一引脚31的侧部设有M个用于接地的第三引脚26，第二屏蔽片21上的第三引脚26用于插接在PCB的接地端上。第二屏蔽片21靠近每个第一接地屏蔽端子3的配合端32的侧部设有M个第二凸台27，M个第二凸台27分别与M个第一接地屏蔽端子3的配合端32接触。
可选的，对于上述任一个第一屏蔽接地端子3，该第一屏蔽接地端子3是弯形结构的端子或直线结构的端子。在该第一屏蔽接地端子3是弯形结构的端子时，该第一接地屏蔽端子3的第一引脚31和配合端32可以垂直。
可选的，在上述第一种实例或第二种实例中，每个第一信号端子41的一端为第四引脚，用于插接在PCB的接地端上。每个第一信号端子41的另一端为配合端，用于与其他连接器包括的信号端子的配合端连接。每个第二信号端子42的一端为第五引脚，用于插接在PCB的接地端上。每个第二信号端子42的另一端为配合端，用于与其他连接器包括的信号端子的配合端连接。
可选的，对于上述任一个第一信号端子41，该第一信号端子41是弯形结构的端子或直线结构的端子。在该第一信号端子41是弯形结构的端子时，该第一信号端子41的第四引脚和配合端可以垂直。
可选的，对于上述任一个第二信号端子42，该第一信号端子42是弯形结构的端子或直线结构的端子。在该第二信号端子42是弯形结构的端子时，该第二信号端子42的第五引脚和配合端可以垂直。
可选的，参见图15和16，针对任一个第一屏蔽通道5，位于任一个第一屏蔽通道5中的第一差分对信号端子4与第一屏蔽片11之间设有第一绝缘部件51，以及与第二屏蔽片21之间设有第二绝缘部件52。
参见图17，第一绝缘部件51或第二绝缘部件52上设置M个长条形开口，每个第一屏蔽墙12对应一个长条形开口，或者，每个第二屏蔽墙22对应一个长条形开口。
可选的，在第一屏蔽片11靠近第二屏蔽片21的表面上通过注塑工艺形成第一绝缘部件51。以及，在第二屏蔽片21靠近第一屏蔽片11的表面上通过注塑工艺形成第二绝缘部件52。
可选的，参见图2，第二屏蔽片21(或第一屏蔽片11)还设有定位柱28，载体平板7上还设有定位孔73。或者，在形成第一绝缘部件51时还在第一绝缘部件51形成定位柱28，或者，在形成第二绝缘部件52时还在第二绝缘部件52形成定位柱28。这样通过该定位柱28和该定位孔73，在将第一屏蔽结构1扣合在载体平板7上时，可以准确地将第一屏蔽结构1中的第i个第一屏蔽墙12与第i个第一接地屏蔽端3接触，以及在将第二屏蔽结构2扣合在载体平板7上时，可以准确地将第二屏蔽结构2中的第i个第二屏蔽墙22与第i个第一接地屏蔽端3接触。
可选的，在第二屏蔽片21(或第一屏蔽片11)的空旷区设有定位柱28，载体平板7的空旷区设有定位孔73。
在本申请实施例中，由于在第一屏蔽结构和第二屏蔽结构之间形成N个相互隔离的第一屏蔽通道，N个第一差分对信号端子分别位于该N个第一屏蔽通道中。这样在任一个第一屏蔽通道中的第一差分对信号端子产生的干扰信号，会被该任一个第一屏蔽通道所屏蔽，避免该第一差分对信号端子对其他第一差分对信号端子产生影响，从而提高了屏蔽效果。上述连接器组件可以用于传输高频信号，例如可以用于传输信号频率为56Ghz的信号。另外，第一屏蔽结构、该N个第一接地屏蔽端子和第二屏蔽结构通过焊接形成的焊接柱或填充墙连接成一个整体结构，提高了连接器组件的可靠性，牢固性和稳定性。其中，在传输高频信号时，任一个第一差分对信号端子对其他第一差分对信号端子产生的干扰信号较强，但由于本申请实施例提供的连接器组件的屏蔽效果得到很大的提高，这样即使在传输高频信号时，也减小该任一个第一差分对信号端子对其他第一差分对信号端子产生的信号干扰强度，所以可以高效地传输高频信号。
参见图18，本申请实施例还提供了一种连接器，该连接器包括多个如图2至图11所示的任一个实施例或如图13至图16所示的任一个实施例提供的连接器组件a。
该多个连接器组件a相互平行，针对该多个连接器组件a中的任意相邻两个连接器组件a，该相邻的两个连接器组件a之间存在间隔，且该相邻的两个连接器组件a相对设置。
可选的，参见图1，该连接器还包括：机座壳b，机座壳b中设有多个第一安装槽(图中未画出)，该多个连接器组件a中的每个连接器组件a对应一个第一安装槽，每个连接器组件a的一端分别安装在每个连接器组件a对应的第一安装槽中。这样可以使该多个连接器组件a可以较稳定地形成连接器。
可选的，参见图19，该连接器还包括：
固定片c，固定片c是梳子形结构，固定片c中设有多个第二安装槽c1，每个连接器组件a对应一个第二安装槽c1，每个连接器组件a的另一端分别安装在每个连接器组件a对应的第二安装槽c1中。这样可以使该多个连接器组件a可以更加稳定地形成连接器，提高连接器的牢固性。
可选的，参见图20，该连接器还包括：
端护片d，端护片d中设有多个穿孔d1，该穿孔d1包括第一侧孔d11、第二侧孔d12和位于第一侧孔d11和第二侧孔d12之间中间穿孔d13。
对于相邻的两个第一接地屏蔽端子3和位于该相邻的两个第一接地屏蔽端子3之间的第一信号端子41和第二信号端子42，其中一个第一接地屏蔽端子3包括的第一部分的引脚、该第一信号端子41的第四引脚、该第二信号端子42的第五引脚和另一个第一接地屏蔽端子3包括的第二部分的引脚穿过端护片d上的一个穿孔d1。其中，其中一个第一接地屏蔽端子3包括的第一部分的引脚与该穿孔31的第一侧孔d11过盈配合，另一个第一接地屏蔽端子3包括的第二部分的引脚与该穿孔31的第二侧孔d12过盈配合。该第一信号端子41的第四引脚和该第二信号端子42的第五引脚穿过该穿孔d1的中间穿孔d13，该第一信号端子41的第四引脚和该第二信号端子42的第五引脚不与该穿孔d1的中间穿孔d13的四周接触。
可选的，在端护片d中，任一个连接器组件a包括的第一屏蔽片11上的第二引脚16对应的一个穿孔d1，该任一个连接器组件a包括的第一屏蔽片11上的每个第二引脚16分别与每个第二引脚16对应的穿孔d1过盈配合。
可选的，在端护片d中，任一个连接器组件a包括的第二屏蔽片21上的第三引脚26对应的一个穿孔d1，该任一个连接器组件a包括的第二屏蔽片21上的每个第三引脚26分别与每个第三引脚26对应的穿孔d1过盈配合。
这样通过端护片d将第一屏蔽片11、第二屏蔽片21和每个第一接地屏蔽端子3互联成一个接地回流系统。
可选的，参见图1，可以使用两个连接器来连接两个PCB，该两个连接器分别为第一连接器A1和第二连接器A2，该两个PCB分别为第一PCBA3和第二PCBA4。
第一连接器A1包括的各引脚插接在第一PCBA3上，第二连接器A2包括的各引脚插接在第二PCBA4上。第一连接器A1中包括的配合端插接到第二连接器A2包括的配合端，如此通过第一连接器A1和第二连接器A2连接第一PCBA3和第二PCBA4。
可选的，参见图1，第一连接器A1的机座壳b上还设有导向凸部b1，第二连接器A2的机座壳b上还设有与该导向凸部b1配合的收容槽b2，通过该导向凸部b1和收容槽b2可以方便地将第一连接器A1中包括的配合端插接到第二连接器A2包括的配合端。
可选的，第一连接器A1中的各接地屏蔽端子3，各第一信号端子41和各第二信号端子42可以均为弯形端子，第二连接器A2中的各接地屏蔽端子3，各第一信号端子41和各第二信号端子42也可以均为弯形端子，这样第一连接器A1和第二连接器A2可以形成正交互连系统。如图1所示，该正交互联系统可以用于连接相互垂直的第一PCBA3和第二PCBA4。
可选的，在形成正交互联系统的情况下，第一连接器A1包括的连接器组件中的任一个第一屏蔽通道5，以及对于该任一个第一屏蔽通道5内的载体71，经过第一信号端子41和第二信号端子42的面与该载体71垂直。
第二连接器A1包括的连接器组件中的任一个第一屏蔽通道5，以及对于该任一个第一屏蔽通道5内的载体71，经过第一信号端子41和第二信号端子42的面与该载体71平行。
可选的，上述机座壳b的材料为塑胶材料，例如可以为液晶聚合物(liquid crystal polymer，LCP)材料，机座壳b可以通过模具注塑而成。
可选的，上述固定片c的材料为金属材料，例如可以为不锈钢材料，可以对不锈钢材料采用冲压成型，得到固定片c。
可选的，固定片c表面可以电镀有镀层。
可选的，端护片d的材料为塑胶材料，例如可以为LCP材料，端护片d可以通过模具注塑而成。
可选的，端护片d表面可以电镀有导电层。
在本申请实施例中，连接器包括多个连接器组件，针对任一个连接器组件，该任一个连接器组件的两侧是第一屏蔽片和第二屏蔽片，第一屏蔽墙、第二屏蔽墙和接地屏蔽端子通过焊接得到的连接件形成稳定可靠的分隔墙结构，第一屏蔽片和第二屏蔽片之间使用分隔墙分隔成N个相互隔离的N个第一屏蔽通道，任一个第一屏蔽通道可以阻止位于该第一屏蔽通道内的差分对信号端子对其他差分对信号端子产生信号干扰，这样不仅在同一个连接器组件内提高了相邻两个差分对信号端子之间的屏蔽效果，也提高了在相邻两个连接器组件之间的屏蔽效果。
参见图21，本申请实施例提供了一种制造连接器组件的方法，该连接器组件可以为上述图2至图11所示的任一个实施例或图13至图16所示的任一个实施例提供的连接器组件，包括：
步骤101：获取第一屏蔽结构1、第二屏蔽结构2、M个第一接地屏蔽端子3和N个第一差分对信号端子4，M＝N+1，N为大于1的整数。
在本步骤中，可以在第一屏蔽片11的表面上形成M个第一屏蔽墙12，以得到第一屏蔽结构1；在第二屏蔽片21的表面上形成M个第二屏蔽墙22，以得到第二屏蔽结构2。
参见图15和16，在第一屏蔽片11设有M个第一屏蔽墙12的表面上注塑形成第一绝缘部件51，和/或，在第二屏蔽片21设有M个第二屏蔽墙22的表面上注塑形成第二绝缘部件52。
可选的，参见图2至4，在载体平板7中嵌入该M个第一接地屏蔽端子3和N个第一差分对信号端子4，相邻的两个第一接地屏蔽端子3之间存在一个第一差分对信号端子4。
步骤102：使用M个第一接地屏蔽端子3，在相对设置的第一屏蔽结构1和第二屏蔽结构2之间形成N个相互隔离的第一屏蔽通道5，且N个第一差分对信号端子4分别位于N个第一屏蔽通道5中。
在本步骤中，参见图2-4，将第一屏蔽结构1扣合在载体平板7的一表面，且第一屏蔽结构1包括的第i个第一屏蔽墙12与载体平板7中的第i个第一接地屏蔽端子3接触，i＝1、2、3、……、M。将第二屏蔽结构2扣合在载体平板7的另一表面，且第二屏蔽结构2包括的第i个第二屏蔽墙22与载体平板7中的第i个第一接地屏蔽端子3接触。
步骤103：在第一屏蔽片1、第i个分隔墙6和第二屏蔽片2中设置连接件64，该连接件64用于连接第一屏蔽片1、第i个分隔墙6和第二屏蔽片2，其中由第i个第一屏蔽墙11、第 i个第一接地屏蔽端子3和第i个第二屏蔽墙21组成第i个分隔墙6。
可选的，第i个分隔墙6中设有第一通孔63，第一屏蔽片11中设有与第一通孔63连通的第二通孔13；在本步骤中，通过焊接材料在第二通孔13和第一通孔63中焊接，以在第二通孔13和第一通孔63中形成连接件64，连接件64用于连接第i个分隔墙6和第一屏蔽片11。
可选的，第i个分隔墙6中设有容纳空间，第一屏蔽片11中设有与容纳空间连通的第一开口，第二屏蔽片21中设有与容纳空间连通的第二开口。在本步骤中，通过焊接材料在第一开口、容纳空间和第二开口中焊接，以在第一开口、容纳空间和第二开口中形成填充墙65，填充墙65用于连接第一屏蔽片11、第i个分隔墙6和第二屏蔽片21。
在本申请实施例中，由于使用M个第一接地屏蔽端子，在相对设置的第一屏蔽结构和第二屏蔽结构之间形成N个相互隔离的第一屏蔽通道，且N个第一差分对信号端子分别位于N个第一屏蔽通道中。这样在任一个第一屏蔽通道中的第一差分对信号端子产生的干扰信号，会被该任一个第一屏蔽通道所屏蔽，避免该第一差分对信号端子对其他第一差分对信号端子产生影响，从而提高了屏蔽效果。
以上所述仅为本申请的可选实施例，并不用以限制本申请，凡在本申请的原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (24)

  1. 一种连接器组件，其特征在于，包括：
    第一屏蔽结构(1)、第二屏蔽结构(2)、M个第一接地屏蔽端子(3)和N个第一差分对信号端子(4)，M＝N+1，N为大于1的整数，所述第一屏蔽结构(1)和所述第二屏蔽结构(2)相对设置；
    所述M个第一接地屏蔽端子(3)位于所述第一屏蔽结构(1)和所述第二屏蔽结构(2)之间，并在所述第一屏蔽结构(1)和所述第二屏蔽结构(2)之间形成N个相互隔离的第一屏蔽通道(5)；
    所述N个第一差分对信号端子(4)分别设置在所述N个第一屏蔽通道(5)中。
  2. 如权利要求1所述的连接器组件，其特征在于，所述第一屏蔽结构(1)包括第一屏蔽片(11)和M个第一屏蔽墙(12)，所述第二屏蔽结构(2)包括第二屏蔽片(21)和M个第二屏蔽墙(22)，所述第一屏蔽片(11)和所述第二屏蔽片(21)相对设置；
    在所述第一屏蔽片(11)和所述第二屏蔽片(21)之间，所述M个第一屏蔽墙(12)、所述M个第一接地屏蔽端子(3)和所述M个第二屏蔽墙(22)形成M个分隔墙(6)，相邻两个分隔墙(6)之间的空间为一个第一屏蔽通道(5)；
    每个分隔墙(6)包括固定在所述第一屏蔽片(11)上的一个第一屏蔽墙(12)，固定在所述第二屏蔽片(21)上的一个第二屏蔽墙(22)，以及位于所述一个第一屏蔽墙(12)和所述一个第二屏蔽墙(22)之间的一个第一接地屏蔽端子(3)。
  3. 如权利要求2所述的连接器组件，其特征在于，针对任一个第一屏蔽通道(5)，所述任一个第一屏蔽通道(5)中设有载体(71)，所述载体(71)分别平行于所述第一屏蔽片(11)和所述第二屏蔽片(21)；
    所述载体(71)固定在第一分隔墙(61)中的第一接地屏蔽端子(3)和第二分隔墙(62)中的第一接地屏蔽端子(3)上，所述第一分隔墙(61)和所述第二分隔墙(62)为所述任一个第一屏蔽通道(5)的两侧分隔墙，位于所述任一个第一屏蔽通道(6)中的第一差分对信号端子(4)嵌入在所述载体(71)中。
  4. 如权利要求3所述的连接器组件，其特征在于，所述任一个第一屏蔽通道(5)中的第一差分对信号端子(4)包括第一信号端子(41)和第二信号端子(42)，所述第一信号端子(41)和所述第二信号端子(42)均嵌入在所述载体(71)中，所述第一信号端子(41)和所述第二信号端子(42)平行且相对设置，经过所述第一信号端子(41)和所述第二信号端子(42)的面与所述载体(71)垂直或与所述载体(71)平行。
  5. 如权利要求2至4任一项所述的连接器组件，其特征在于，每个第一接地屏蔽端子(3)的一端为第一引脚(31)，所述每个第一接地屏蔽端子的另一端为配合端(32)；
    所述第一屏蔽片(11)靠近所述每个第一接地屏蔽端子的第一引脚(31)的侧部设有M 个用于接地的第二引脚(16)，所述第一屏蔽片(11)靠近所述每个第一接地屏蔽端子(3)的配合端(32)的侧部设有M个第一凸台(17)，所述M个第一凸台(17)分别与所述M个第一接地屏蔽端子(3)的配合端(32)接触；
    所述第二屏蔽片(21)靠近所述每个第一接地屏蔽端子(3)的第一引脚(31)的侧部设有M个用于接地的第三引脚(26)，所述第二屏蔽片(21)靠近所述每个第一接地屏蔽端子(3)的配合端(32)的侧部设有M个第二凸台(27)，所述M个第二凸台(27)分别与所述M个第一接地屏蔽端子(3)的配合端(32)接触。
  6. 如权利要求2至5任一项所述的连接器组件，其特征在于，针对任一个分隔墙(6)，所述任一个分隔墙(6)上设有第一通孔(63)，所述第一屏蔽片(11)上设有与第一通孔(63)连通的第二通孔(14)，所述第一通孔(63)和所述第二通孔(14)中设有连接件(64)，所述连接件(64)用于连接所述第一屏蔽片(11)和所述任一个分隔墙(6)。
  7. 如权利要求6所述的连接器组件，其特征在于，所述第二屏蔽片(21)上设有与所述第一通孔(63)连通的第三通孔(24)，所述连接件(64)还延伸入所述第三通孔(24)，用于连接所述第二屏蔽片(21)和所述任一个分隔墙(6)。
  8. 如权利要求6或7所述的连接器组件，其特征在于，所述连接件(64)为通过焊接材料在所述第一通孔(63)和所述第二通孔(24)中焊接形成的部件。
  9. 如权利要求2至5任一项所述的连接器组件，其特征在于，针对任一个分隔墙(6)，所述任一个分隔墙(6)设有容纳空间，所述第一屏蔽片(11)中设有与所述容纳空间对齐的第一开口，所述第二屏蔽片(21)中设有与所述容纳空间对齐的第二开口，所述第一开口、所述容纳空间和所述第二开口中设有填充墙(65)。
  10. 如权利要求9所述的连接器组件，其特征在于，所述填充墙(65)为通过焊接材料在所述第一开口、所述容纳空间和所述第二开口中焊接形成的部件。
  11. 如权利要求8或10所述的连接器组件，其特征在于，所述焊接材料为焊接峰值温度大于或等于100度且小于或等于320度的锡膏材料。
  12. 如权利要求2至11任一项所述的连接器组件，其特征在于，针对任一个第一屏蔽通道(5)，位于所述任一个第一屏蔽通道(5)中的第一差分对信号端子(4)与所述第一屏蔽片(11)之间设有第一绝缘部件(51)，以及与所述第二屏蔽片(21)之间设有第二绝缘部件(52)。
  13. 如权利要求2至12任一项所述的连接器组件，其特征在于，还包括第三屏蔽结构(8)、M个第二接地屏蔽端子(91)和N个第二差分对信号端子(92)，所述第三屏蔽结构(8)与所述第二屏蔽结构(2)远离所述第一屏蔽结构(1)的一侧面相对设置；
    所述M个第二接地屏蔽端子(91)位于所述第二屏蔽结构(2)和所述第三屏蔽结构(8)之间，并在所述第二屏蔽结构(2)和所述第三屏蔽结构(8)之间形成N个相互隔离的第二屏蔽通道(93)，所述N个第二差分对信号端子(92)分别位于所述N个第二屏蔽通道(93)中。
  14. 如权利要求13所述的连接器组件，其特征在于，所述第二屏蔽结构(2)还包括M个第三屏蔽墙(25)，所述第三屏蔽结构(8)包括第三屏蔽片(81)和M个第四屏蔽墙(82)，所述第二屏蔽片(21)远离所述第一屏蔽结构(1)的一侧面和所述第三屏蔽片(81)相对设置；
    在所述第二屏蔽片(21)和所述第三屏蔽片(81)之间，所述M个第三屏蔽墙(25)、所述M个第二接地屏蔽端子(91)和所述M个第四屏蔽墙(82)形成M个分隔墙(6)，相邻两个分隔墙(6)之间的空间为一个第二屏蔽通道；
    每个分隔墙(6)包括固定在所述第二屏蔽片(21)上的一个第三屏蔽墙(25)，固定在所述第三屏蔽片(81)上的一个第四屏蔽墙(82)，以及位于所述一个第三屏蔽墙(25)和所述一个第四屏蔽墙(82)之间的一个第二接地屏蔽端子(91)。
  15. 一种连接器，其特征在于，包括多个如权利要求1至14任一项所述的连接器组件，所述多个连接器组件相互平行，针对所述多个连接器组件中的任意相邻的两个连接器组件，所述两个连接器组件之间存在间隔，且所述两个连接器件相对设置。
  16. 如权利要求15所述的连接器，其特征在于，还包括：
    机座壳(b)，所述机座壳(b)中设有多个第一安装槽，所述多个连接器组件中的每个连接器组件对应一个第一安装槽，所述每个连接器组件的一端分别安装在所述每个连接器组件对应的第一安装槽中。
  17. 如权利要求16所述的连接器，其特征在于，还包括：
    固定片(c)，所述固定片(c)中设有多个第二安装槽，所述每个连接器组件对应一个第二安装槽，所述每个连接器组件的另一端分别安装在所述每个连接器组件对应的第二安装槽中。
  18. 一种网络设备，其特征在于，所述网络设备包括如权利要求15至17任一项所述的连接器。
  19. 一种制造连接器组件的方法，其特征在于，所述方法包括：
    获取第一屏蔽结构(1)、第二屏蔽结构(2)、M个第一接地屏蔽端子(3)和N个第一差分对信号端子(4)，M＝N+1，N为大于1的整数；
    使用所述M个第一接地屏蔽端子(3)，在相对设置的所述第一屏蔽结构(1)和所述第二屏蔽结构(2)之间形成N个相互隔离的第一屏蔽通道(5)，且所述N个第一差分对信号端子(4)分别位于所述N个第一屏蔽通道(5)中。
  20. 如权利要求19所述的方法，其特征在于，所述获取第一屏蔽结构(1)、第二屏蔽结构(2)和M个第一接地屏蔽端子(3)，包括：
    在第一屏蔽片(11)的表面上形成M个第一屏蔽墙(12)，以得到所述第一屏蔽结构(1)；
    在第二屏蔽片(21)的表面上形成M个第二屏蔽墙(22)，以得到所述第二屏蔽结构(2)。
  21. 如权利要求20所述的方法，其特征在于，所述在相对设置的所述第一屏蔽结构(1)和所述第二屏蔽结构(2)之间形成N个相互隔离的第一屏蔽通道(5)之前，还包括：
    在载体平板(7)中嵌入所述M个第一接地屏蔽端子(3)和N个第一差分对信号端子(4)，相邻的两个第一接地屏蔽端子(3)之间存在一个第一差分对信号端子(4)；
    所述使用所述M个第一接地屏蔽端子(3)，在相对设置的所述第一屏蔽结构(1)和所述第二屏蔽结构(2)之间形成N个相互隔离的第一屏蔽通道(5)，包括：
    将所述第一屏蔽结构(1)扣合在所述载体平板(7)的一表面，且所述第一屏蔽结构(1)包括的第i个第一屏蔽墙(12)与所述载体平板(7)中的第i个第一接地屏蔽端子(3)接触，i＝1、2、3、……、M；
    将所述第二屏蔽结构(2)扣合在所述载体平板(7)的另一表面，且所述第二屏蔽结构(2)包括的第i个第二屏蔽墙(22)与所述载体平板(7)中的第i个第一接地屏蔽端子(3)接触。
  22. 如权利要求21所述的方法，其特征在于，所述第i个第一屏蔽墙(11)、所述第i个第一接地屏蔽端子(3)和所述第i个第二屏蔽墙(21)组成第i个分隔墙(6)，所述第i个分隔墙(6)中设有第一通孔(63)，所述第一屏蔽片(11)中设有与所述第一通孔(63)连通的第二通孔(13)；
    所述将所述第二屏蔽结构(2)扣合在所述载体平板(7)的另一表面之后，还包括：
    通过焊接材料在所述第二通孔(13)和所述第一通孔(63)中焊接，以在所述第二通孔(13)和所述第一通孔(63)中形成连接件(64)，所述连接件(64)用于连接所述第i个分隔墙(6)和所述第一屏蔽片(11)。
  23. 如权利要求21所述的方法，其特征在于，所述第i个第一屏蔽墙(11)、所述第i个第一接地屏蔽端子(3)和所述第i个第二屏蔽墙(21)组成第i个分隔墙(6)，所述第i个分隔墙(6)中设有容纳空间，所述第一屏蔽片(11)中设有与所述容纳空间连通的第一开口，所述第二屏蔽片(21)中设有与所述容纳空间连通的第二开口；
    所述将所述第二屏蔽结构(2)扣合在所述载体平板(7)的另一表面之后，还包括：
    通过焊接材料在所述第一开口、所述容纳空间和所述第二开口中焊接，以在所述第一开口、所述容纳空间和所述第二开口中形成填充墙(65)，所述填充墙(65)用于连接所述第一屏蔽片(11)、所述第i个分隔墙(6)和所述第二屏蔽片(21)。
  24. 如权利要求20至23任一项所述的方法，其特征在于，所述获取第一屏蔽结构(1)、第二屏蔽结构(2)和M个第一接地屏蔽端子(3)之后，还包括：
    在所述第一屏蔽片(11)设有所述M个第一屏蔽墙(12)的表面上注塑形成第一绝缘部件(51)，和/或，在所述第二屏蔽片(21)设有所述M个第二屏蔽墙(22)的表面上注塑形成第二绝缘部件(52)。
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CN110299649A (zh) * 2019-05-28 2019-10-01 华为技术有限公司 信号连接器
CN110544850A (zh) * 2019-09-02 2019-12-06 深圳万德溙光电科技有限公司 一种可靠弹性接触的高速低损耗连接器及互连系统
CN111193156A (zh) * 2019-12-31 2020-05-22 华为技术有限公司 连接器组件、连接器、网络设备和制造方法

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