WO2021121559A1 - A housing for an electronic device - Google Patents

A housing for an electronic device Download PDF

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Publication number
WO2021121559A1
WO2021121559A1 PCT/EP2019/085589 EP2019085589W WO2021121559A1 WO 2021121559 A1 WO2021121559 A1 WO 2021121559A1 EP 2019085589 W EP2019085589 W EP 2019085589W WO 2021121559 A1 WO2021121559 A1 WO 2021121559A1
Authority
WO
WIPO (PCT)
Prior art keywords
microslots
layer
housing
functionality
conductive
Prior art date
Application number
PCT/EP2019/085589
Other languages
French (fr)
Inventor
Alexander Khripkov
Harri Lasarov
Janne Ilvonen
Dong Liu
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Priority to PCT/EP2019/085589 priority Critical patent/WO2021121559A1/en
Publication of WO2021121559A1 publication Critical patent/WO2021121559A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone

Definitions

  • the disclosure relates to a housing for an electronic device, as well as a method of manufacturing such a housing.
  • a housing for an electronic device comprising a multilayer structure and a functionality layer superimposed onto a layer of the multilayer structure, the functionality layer comprising a conductive material, a non-conductive microslot pattern being formed in said functionality layer, , the functionality layer having at least one conductive area and at least one non-conductive area, the conductive area and the non-conductive area forming at least one electronic functionality.
  • This pattern structure allows electronic functionalities to be arranged at or near an outside of the electronic device, improving the performance of the electronic functionality as well as allowing more electronic functionality to be fitted into the device. Furthermore, this solution facilitates a layered structure which is mechanically strong and easy to assemble.
  • the electronic functionality is at least one of an antenna radiator, a wireless power unit, a user interaction sensor, and a visual unit.
  • the non-conductive microslot pattern comprises a first set of microslots and a second set of microslots extending in the functionality layer, the microslots being filled with a non-conductive material such that micropatches of conductive material are formed between the non-conductive microslots, at least two micropatches being conductively interconnected.
  • the microslot pattern extends uninterruptedly along the entire functionality layer, providing a uniform appearance and an as large surface as possible for arranging electronic functionality.
  • the microslots of the first set of microslots are spaced along the entire functionality layer.
  • the first set of microslots extend in a first direction in the functionality layer
  • the second set of microslots extend in a second direction in the functionality layer, the first direction extending at an angle >0° to the second direction, the microslots of the first set of microslots being spaced in the second direction, the microslots of the second set of microslots being spaced in the first direction.
  • the first set of microslots extend concentrically in the functionality layer, and the second set of microslots extend in a radial direction, from a center point of the first set of microslots, in the functionality layer, the microslots of the first set of microslots being spaced in the radial direction, the microslots of the second set of microslots being spaced along a circumference of each microslot.
  • the microslots and the micropatches have a common dimension in a direction perpendicular to a main plane of the functionality layer, allowing electronic functionality such as antennas to be formed together with underlying layers of the multilayer structure.
  • the conductive area comprises at least two adjacent micropatches being conductively interconnected across the microslot separating the two adjacent micropatches.
  • the conductive interconnection comprises the conductive material, facilitating a simple yet reliable interconnection.
  • the non-conductive area comprises at least one micropatch conductively isolated from all adjacent micropatches.
  • the housing further comprises an appearance layer superimposed onto the functionality layer at a side opposite to the multilayer structure, the appearance layer extending into and filling the microslots, providing a smooth outer surface having a uniform appearance as well as a protective cover for the functionality layer.
  • the housing further comprises a reinforcement layer, the functionality layer and the multilayer structure being supported by the reinforcement layer.
  • the reinforcement layer comprises thermoset resin.
  • the functionality layer comprises at least one of aluminum, copper, stainless steel, and conductive alloys.
  • an area of each micropatch depends on the number of conductive connections connecting to the micropatch, giving flexibility in the number and arrangement of electronic functionalities provided.
  • the multilayer structure comprises electronic circuitry, and each layer of the multilayer structure comprises at least one of a conductive material and a dielectric material, at least two of the layers being directly interconnected by means of conductive interconnection joints, and at least part of the electronic circuitry being embedded in at least one of the layers.
  • the electronic circuitry reinforces the multilayer structure and, correspondingly, the multilayer structure protects the electronic circuitry.
  • At least one conductive material layer comprises at least one radio frequency element, the radio frequency element being one of an antenna radiator, an antenna cut, a parasitic antenna element, a reflector or director for mmWave antenna, a wavetrap for sub-6 GHz or mmWave antenna, a transmission line, a power divider, a soldering pad, a connector, an IC component, a PCB trace, a CPU, a GPU, a RAM, a switch, a feedline, and a resonator, allowing a wide range of radio frequency elements to be embedded within the multilayer structure.
  • the radio frequency element being one of an antenna radiator, an antenna cut, a parasitic antenna element, a reflector or director for mmWave antenna, a wavetrap for sub-6 GHz or mmWave antenna, a transmission line, a power divider, a soldering pad, a connector, an IC component, a PCB trace, a CPU, a GPU, a RAM, a switch,
  • an electronic device comprising at least a display and a housing according to the above, the display and the frame structure of the housing forming an outer surface of the electronic device.
  • the multilayer structure of the housing further comprises at least one of an antenna array, a battery, a printed circuit board, a coaxial cable, an RFIC, and an antenna connection.
  • a method of manufacturing a housing for an electronic device comprising the steps of providing a frame structure and a multilayer structure in a mold, applying an injection- mold plastic layer over the frame structure and the multilayer structure, applying a functionality layer onto a surface of the injection- mold plastic layer and onto a surface of the frame structure, forming a non-conductive microslot pattern in the functionality layer such that the functionality layer comprises at least one conductive area and at least one non-conductive area, and applying an appearance layer onto the functionality layer, the appearance layer extending into the microslot pattern.
  • This methods facilitates manufacture of a housing allowing electronic functionalities to be arranged at or near an outside of an electronic device, hence improving the performance of the electronic functionality as well as allowing more electronic functionality to be fitted into the device. Furthermore, this solution facilitates a layered structure which is mechanically strong and easy to assemble.
  • the non-conductive microslot pattern is formed by at least partially penetrating the functionality layer with a first set of microslots and a second set of microslots, the first set of microslots and the second set of microslots forming two individual slot patterns.
  • the functionality layer comprises a conductive material
  • the appearance layer comprises a non-conductive material
  • Fig. 1 shows a partial cross-sectional view of an electronic device in accordance with one embodiment of the present invention
  • Fig. 2 shows a schematic, exploded view of a housing in accordance with one embodiment of the present invention
  • Fig. 3 shows a cross-sectional side view of a housing in accordance with one embodiment of the present invention
  • Fig. 4 shows a top view of a housing in accordance with one embodiment of the present invention
  • Fig. 5 shows a schematic illustration of method steps for manufacturing a housing in accordance with one embodiment of the present invention.
  • Fig. 1 shows an electronic device 2 comprising at least a display 12 and a housing 1.
  • the display 12 and the frame structure 4 of the housing 1 may form the outer surface of the electronic device 2, as shown in Fig. 1.
  • the display 12 and the frame structure 4 of the housing 1 may also form only a part of the outer surface of the electronic device 2, e.g. in an embodiment where some of the outer surface is made up of a side frame located between the display 12 and the frame structure 4 (not shown).
  • the housing 1 comprises a multilayer structure 3, as shown in Fig. 2, and a functionality layer 5 superimposed onto a layer of the multilayer structure 3, as shown in Fig. 3, preferably a layer forming an outer surface of the multilayer structure 3.
  • At least one of the layers of the multilayer structure 3 comprises a plate section and a rim section, the rim section extending from a periphery of the plate section in a direction essentially perpendicular to a main plane of the plate section, as shown in Figs. 1 and 2.
  • the rim section is connected to the display 12 along the rim edge farthest from the plate section.
  • the multilayer structure 3 may be curved, such that the transition between rim section and plate section is curved.
  • the multilayer structure 3 may comprise all components located within the electronic device 2, such as battery and printed circuit boards.
  • the multilayer structure 3 comprises electronic circuitry 11, and each layer of the multilayer structure 3 comprises a conductive material, a dielectric material, or a combination of conductive material and dielectric material.
  • the dielectric material in adjoining layers may overlap such that individual dielectric sections of adjoined layers together form a dielectric filled cavity in a conductive surrounding.
  • At least two of the layers may be directly interconnected by means of conductive interconnection joints, and at least part of the electronic circuitry 11 may be embedded in at least one of the layers.
  • At least two of the layers may be connected by means of conductive interconnection joints, configured to form multiple regions within the multilayer structure 3, which regions are mutually electromagnetically isolated and configured as various electronic circuitry features.
  • the electronic circuitry 11 may comprise batteries, integrated circuits, printed circuit boards, speakers, cameras, vibration motors etc.
  • the multilayer structure 3 may be formed by adhering layers to each other by means of an adhesive, by depositing layers onto each other e.g. by means of 3D printing, or by injection molding.
  • At least one of the conductive material layers may comprise at least one radio frequency element, the radio frequency element being one of an antenna radiator, an antenna cut, a parasitic antenna element, a reflector or director for mmWave antenna, a wavetrap for sub6G or mmWave antenna, a transmission line, a power divider, a soldering pad, a connector, an IC component, a PCB trace, a CPU, a GPU, a RAM, a switch, a feedline, and a resonator.
  • the radio frequency element being one of an antenna radiator, an antenna cut, a parasitic antenna element, a reflector or director for mmWave antenna, a wavetrap for sub6G or mmWave antenna, a transmission line, a power divider, a soldering pad, a connector, an IC component, a PCB trace, a CPU, a GPU, a RAM, a switch, a feedline, and a resonator.
  • the multilayer structure 3 of the housing 1 may comprise at least one of an antenna array, a battery, a printed circuit board, a coaxial cable, an RFIC, and an antenna connection.
  • the functionality layer 5 comprises a conductive material penetrated by a non-conductive microslot pattern 6, as shown in more detail in Figs. 3 and 4. 15.
  • the material of the functionality layer 5 may comprise at least one of aluminum, copper, stainless steel, and conductive alloys.
  • the functionality layer 5 has at least one conductive area A1 and at least one non-conductive area A2, the conductive area A1 and the non-conductive area A2 forming at least one electronic functionality.
  • the electronic functionality may be at least one of an antenna radiator, a wireless power unit, a user interaction sensor, and a visual unit.
  • the non-conductive microslot pattern 6 may comprise a first set of microslots 6a and a second set of microslots 6b extending in the functionality layer 5, the microslots 6a, 6b being filled with a non-conductive material such that micropatches 7 of conductive material are formed between the non-conductive microslots 6a, 6b. At least two micropatches 7 are conductively interconnected, adjacent micropatches 7 being interconnected across one microslot 6a, 6b.
  • the microslots 6a, 6b have a length and a width, as seen in directions comprised in the main plane of the functionality layer 5 and the multilayer structure 3.
  • the width may be between 3- 200 pm, preferably less than 15 pm.
  • the length may correspond to the outer dimensions of the functionality layer 5.
  • the microslot pattern 6 extends not only at the surface of the functionality layer 5, but through the entire volume of the functionality layer 5 as seen in a direction perpendicular to the main plane of the functionality layer 5 and the multilayer structure 3, giving the microslots 6a, 6b a depth.
  • the microslots 6a, 6b and the micropatches 7 have a common dimension in a direction perpendicular to the main plane, i.e. the microslots 6a, 6b have a depth which is identical to the thickness of the micropatches 7 as shown in Fig. 3.
  • the functionality layer 5 may have a thickness of 10-100 pm.
  • the micropattem 6 may form antennas on or near the outside of the electronic device, and further antennas may be formed in the underlying conductive layers of the multilayer structure 3.
  • the area of each micropatch 7 depends on the number of conductive connections 8 connecting to the micropatch 7.
  • the microslots 6a, 6b are shaped such that there is constant density throughout the conductive A1 and non-conductive A2 areas. This facilitates a visually uniform metallic outer surface.
  • the microslot pattern 6 may extend uninterruptedly along the entire surface of the functionality layer 5. At least the microslots of the first set of microslots 6a may be spaced along the entire functionality layer 5. The microslots of the second set of microslots 6b may also be spaced along the entire functionality layer 5.
  • the first set of microslots 6a extend in a first direction in the functionality layer 5, and the second set of microslots 6b extend in a second direction in the functionality layer 5.
  • the first direction extends at an angle >0° to the second direction, e.g. at a 90° angle as shown in Fig. 4.
  • the microslots 6a of the first set of microslots 6a are spaced in the second direction, and the microslots 6b of the second set of microslots 6b are spaced in the first direction.
  • the first set of microslots 6a extend concentrically in the functionality layer 5.
  • the second set of microslots 6b extend in a radial direction from a center point of the first set of microslots 6a in the functionality layer 5.
  • the microslots 6a of the first set of microslots 6a are spaced in the radial direction, and the microslots 6b of the second set of microslots 6b are spaced along a circumference of each microslot 6a, such that the first ends of the microslots 6b are all arranged at the same location, i.e. at the center point of the first set of microslots 6a, and the second ends of the microslots 6b are spaced along the circumference of each concentrically arranged microslot 6a.
  • the conductive area A1 may comprise at least two adjacent micropatches 7 which are conductively interconnected across the microslot 6a, 6b separating the two adjacent micropatches 7, as shown in Fig. 4.
  • the conductive interconnection 8 may comprise conductive material, i.e. an uninterrupted, narrow section of conductive material extending across the microslot 6a, 6b from one micropatch 7 to an adjacent micropatch 7, in a direction perpendicular to the longitudinal extent of the microslot 6a, 6b.
  • Such connected areas may form antenna conductors, i.e. antenna elements such as dipoles, monopoles, patches, parasitic resonators, antenna impedance matching structures, etc.
  • the non-conductive area A2 may comprise at least one micropatch 7 conductively isolated from all adjacent micropatches 7. Isolated areas effectively comprise radio-frequency transparent regions.
  • the housing 1 may further comprise an appearance layer 9 superimposed onto the functionality layer 5 at a side opposite to the multilayer structure 3, such that the functionality layer 5 is arranged between the appearance layer 9 and the multilayer structure 3.
  • the appearance layer 9 extends over the entire surface of the functionality layer 5 and also extends into the microslots 6a, 6b, filling the microslots 6a, 6b completely except from any microslot sections occupied by conductive interconnections 8.
  • the functionality layer 5 forms the outside of the housing 1, which outside is then covered by the appearance layer 9.
  • the appearance layer 9 fulfills the functions of protecting the functionality layer 5, providing a uniform metallic outer surface to the device, and/or adding color to the housing 1.
  • the housing 1 may further comprise a reinforcement layer 10, shown in Fig. 5, the functionality layer 5 and the multilayer structure 3 being supported by the reinforcement layer 10.
  • the reinforcement layer 10 may comprise an injection molded plastic such as thermoset resin.
  • the present invention furthermore relates to a method of manufacturing the housing 1 described above. The method comprises the steps described below and shown in Fig. 5.
  • the first step comprises providing a frame structure 4 and a multilayer structure 3 in a mold (not shown).
  • the frame structure 4 may comprise polycarbonate, polybutylene terephthalate, polyphenylene sulfide, a polyamide, polyetheretherketone, polyaryletherketone, or mixtures of those materials.
  • a layer 10 such as an injection- mold plastic layer, is applied over the frame structure
  • the functionality layer 5 is applied onto a surface of the injection- mold plastic layer 10 and a surface of the frame structure 4, as shown in Fig. 5c.
  • Applying the functionality layer 5 may comprise a dielectric metallization process, such as vapor or chemical vacuum metallization, arc spraying, electroless plating, or electroplating.
  • a conductive foil is laminated onto the multilayer structure 3.
  • a non-conductive microslot pattern 6 is formed in the functionality layer 5, see Fig. 5d, such that the functionality layer 5 comprises at least one conductive area A1 and at least one non- conductive area A2.
  • the non-conductive microslot pattern 6 may be formed by penetrating the functionality layer
  • the non-conductive microslot pattern 6 may be formed by laser removing the conductive material.
  • the functionality layer 5 may be polished and an appearance layer 9 applied onto the functionality layer 5.
  • the functionality layer 5 may comprise a conductive material and the appearance layer 9 may comprise a non-conductive material and be applied by means of anodizing.
  • the appearance layer 9 extends into the microslot pattern 6, at least partially filling the microslots 6a, 6b.
  • the appearance layer 9 may be formed of various compounds of metal oxide and coloring materials.
  • the functionality layer 5 comprises an aluminum sheet and the appearance layer 9 is formed by anodizing, forming an aluminum oxide.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)

Abstract

A housing (1) for an electronic device (2), the housing (1) comprising a multilayer structure (3) and a functionality layer (5) superimposed onto a layer of the multilayer structure (3). The functionality layer (5) comprises a conductive material penetrated by a non-conductive microslot pattern (6). The functionality layer (5) has at least one conductive area (A1) and at least one non-conductive area (A2), the conductive area (A1) and the non-conductive area (A2) forming at least one electronic functionality. This allows the electronic functionality to be arranged at an outside of an electronic device, improving the performance of the electronic functionality as well as allowing more electronic functionality to be fitted into the device.

Description

A HOUSING FOR AN ELECTRONIC DEVICE
TECHNICAL FIELD
The disclosure relates to a housing for an electronic device, as well as a method of manufacturing such a housing.
BACKGROUND
One of the most important factors to consider when designing modem mobile electronic devices is the physical appearance combined with the improved functionalities. In this development using a full-metal housing or a glass back cover with a metal frame becomes more and more popular.
However, future mobile electronic devices need to support millimeter-wave bands, e.g. 24 GHz, 28 GHz and 42 GHz, as well as sub-6 GHz bands in order to accommodate increased data rates. The volume reserved for all the antennas in a mobile electronic device is very limited and the added millimeter-wave antennas should ideally be accommodated to the same volume as the sub-6 GHz antennas. Increasing the volume reserved for antennas would make the electronic device larger, bulkier, and less attractive to users. Current millimeter-wave antennas either require such additional volume, or if placed in the same volume, significantly reduce the efficiency of sub-6 GHz antennas. Sub-6 GHz antennas may be embedded directly to the outer surface of the metal housing, which requires the provision of antenna cuts in the housing in order to achieve the desired antenna performance.
The movement towards very large displays, covering as much as possible of the electronic device, also makes the space available for antennas very limited, forcing either the size of the antennas to be significantly reduced, and performance impaired, or a large part of the display to be inactive.
Additionally, large openings in the body of the mobile electronic device are undesirable since they weaken the mechanical structure of the body, make manufacture and assembly more difficult, and make the appearance of the device less attractive to users. SUMMARY
The foregoing and other objects are achieved by the features of the independent claims. Further implementation forms are apparent from the dependent claims, the description, and the figures.
According to a first aspect, there is provided a housing for an electronic device, the housing comprising a multilayer structure and a functionality layer superimposed onto a layer of the multilayer structure, the functionality layer comprising a conductive material, a non-conductive microslot pattern being formed in said functionality layer, , the functionality layer having at least one conductive area and at least one non-conductive area, the conductive area and the non-conductive area forming at least one electronic functionality.
This pattern structure allows electronic functionalities to be arranged at or near an outside of the electronic device, improving the performance of the electronic functionality as well as allowing more electronic functionality to be fitted into the device. Furthermore, this solution facilitates a layered structure which is mechanically strong and easy to assemble.
In a possible implementation form of the first aspect, the electronic functionality is at least one of an antenna radiator, a wireless power unit, a user interaction sensor, and a visual unit.
In a further possible implementation form of the first aspect, the non-conductive microslot pattern comprises a first set of microslots and a second set of microslots extending in the functionality layer, the microslots being filled with a non-conductive material such that micropatches of conductive material are formed between the non-conductive microslots, at least two micropatches being conductively interconnected.
In a further possible implementation form of the first aspect, the microslot pattern extends uninterruptedly along the entire functionality layer, providing a uniform appearance and an as large surface as possible for arranging electronic functionality.
In a further possible implementation form of the first aspect, at least the microslots of the first set of microslots are spaced along the entire functionality layer. In a further possible implementation form of the first aspect, the first set of microslots extend in a first direction in the functionality layer, and the second set of microslots extend in a second direction in the functionality layer, the first direction extending at an angle >0° to the second direction, the microslots of the first set of microslots being spaced in the second direction, the microslots of the second set of microslots being spaced in the first direction.
In a further possible implementation form of the first aspect, the first set of microslots extend concentrically in the functionality layer, and the second set of microslots extend in a radial direction, from a center point of the first set of microslots, in the functionality layer, the microslots of the first set of microslots being spaced in the radial direction, the microslots of the second set of microslots being spaced along a circumference of each microslot.
In a further possible implementation form of the first aspect, the microslots and the micropatches have a common dimension in a direction perpendicular to a main plane of the functionality layer, allowing electronic functionality such as antennas to be formed together with underlying layers of the multilayer structure.
In a further possible implementation form of the first aspect, the conductive area comprises at least two adjacent micropatches being conductively interconnected across the microslot separating the two adjacent micropatches.
In a further possible implementation form of the first aspect, the conductive interconnection comprises the conductive material, facilitating a simple yet reliable interconnection.
In a further possible implementation form of the first aspect, the non-conductive area comprises at least one micropatch conductively isolated from all adjacent micropatches.
In a further possible implementation form of the first aspect, the housing further comprises an appearance layer superimposed onto the functionality layer at a side opposite to the multilayer structure, the appearance layer extending into and filling the microslots, providing a smooth outer surface having a uniform appearance as well as a protective cover for the functionality layer.
In a further possible implementation form of the first aspect, the housing further comprises a reinforcement layer, the functionality layer and the multilayer structure being supported by the reinforcement layer. In a further possible implementation form of the first aspect, the reinforcement layer comprises thermoset resin.
In a further possible implementation form of the first aspect, the functionality layer comprises at least one of aluminum, copper, stainless steel, and conductive alloys.
In a further possible implementation form of the first aspect, an area of each micropatch depends on the number of conductive connections connecting to the micropatch, giving flexibility in the number and arrangement of electronic functionalities provided.
In a further possible implementation form of the first aspect, the multilayer structure comprises electronic circuitry, and each layer of the multilayer structure comprises at least one of a conductive material and a dielectric material, at least two of the layers being directly interconnected by means of conductive interconnection joints, and at least part of the electronic circuitry being embedded in at least one of the layers. The electronic circuitry reinforces the multilayer structure and, correspondingly, the multilayer structure protects the electronic circuitry.
In a further possible implementation form of the first aspect, at least one conductive material layer comprises at least one radio frequency element, the radio frequency element being one of an antenna radiator, an antenna cut, a parasitic antenna element, a reflector or director for mmWave antenna, a wavetrap for sub-6 GHz or mmWave antenna, a transmission line, a power divider, a soldering pad, a connector, an IC component, a PCB trace, a CPU, a GPU, a RAM, a switch, a feedline, and a resonator, allowing a wide range of radio frequency elements to be embedded within the multilayer structure.
According to a second aspect, there is provided an electronic device comprising at least a display and a housing according to the above, the display and the frame structure of the housing forming an outer surface of the electronic device.
In a possible implementation form of the second aspect, the multilayer structure of the housing further comprises at least one of an antenna array, a battery, a printed circuit board, a coaxial cable, an RFIC, and an antenna connection.
According to a third aspect, there is provided a method of manufacturing a housing for an electronic device, the method comprising the steps of providing a frame structure and a multilayer structure in a mold, applying an injection- mold plastic layer over the frame structure and the multilayer structure, applying a functionality layer onto a surface of the injection- mold plastic layer and onto a surface of the frame structure, forming a non-conductive microslot pattern in the functionality layer such that the functionality layer comprises at least one conductive area and at least one non-conductive area, and applying an appearance layer onto the functionality layer, the appearance layer extending into the microslot pattern. This methods facilitates manufacture of a housing allowing electronic functionalities to be arranged at or near an outside of an electronic device, hence improving the performance of the electronic functionality as well as allowing more electronic functionality to be fitted into the device. Furthermore, this solution facilitates a layered structure which is mechanically strong and easy to assemble.
In a possible implementation form of the third aspect, the non-conductive microslot pattern is formed by at least partially penetrating the functionality layer with a first set of microslots and a second set of microslots, the first set of microslots and the second set of microslots forming two individual slot patterns.
In a further possible implementation form of the third aspect, the functionality layer comprises a conductive material, and the appearance layer comprises a non-conductive material.
This and other aspects will be apparent from and the embodiments described below.
BRIEF DESCRIPTION OF THE DRAWINGS
In the following detailed portion of the present disclosure, the aspects, embodiments and implementations will be explained in more detail with reference to the example embodiments shown in the drawings, in which: Fig. 1 shows a partial cross-sectional view of an electronic device in accordance with one embodiment of the present invention;
Fig. 2 shows a schematic, exploded view of a housing in accordance with one embodiment of the present invention; Fig. 3 shows a cross-sectional side view of a housing in accordance with one embodiment of the present invention;
Fig. 4 shows a top view of a housing in accordance with one embodiment of the present invention; Fig. 5 shows a schematic illustration of method steps for manufacturing a housing in accordance with one embodiment of the present invention.
DETAILED DESCRIPTION
Fig. 1 shows an electronic device 2 comprising at least a display 12 and a housing 1. The display 12 and the frame structure 4 of the housing 1 may form the outer surface of the electronic device 2, as shown in Fig. 1. The display 12 and the frame structure 4 of the housing 1 may also form only a part of the outer surface of the electronic device 2, e.g. in an embodiment where some of the outer surface is made up of a side frame located between the display 12 and the frame structure 4 (not shown). The housing 1 comprises a multilayer structure 3, as shown in Fig. 2, and a functionality layer 5 superimposed onto a layer of the multilayer structure 3, as shown in Fig. 3, preferably a layer forming an outer surface of the multilayer structure 3.
In one embodiment, at least one of the layers of the multilayer structure 3 comprises a plate section and a rim section, the rim section extending from a periphery of the plate section in a direction essentially perpendicular to a main plane of the plate section, as shown in Figs. 1 and 2. The rim section is connected to the display 12 along the rim edge farthest from the plate section. The multilayer structure 3 may be curved, such that the transition between rim section and plate section is curved. In such an embodiment, the multilayer structure 3 may comprise all components located within the electronic device 2, such as battery and printed circuit boards.
In one embodiment the multilayer structure 3 comprises electronic circuitry 11, and each layer of the multilayer structure 3 comprises a conductive material, a dielectric material, or a combination of conductive material and dielectric material. The dielectric material in adjoining layers may overlap such that individual dielectric sections of adjoined layers together form a dielectric filled cavity in a conductive surrounding. At least two of the layers may be directly interconnected by means of conductive interconnection joints, and at least part of the electronic circuitry 11 may be embedded in at least one of the layers. At least two of the layers may be connected by means of conductive interconnection joints, configured to form multiple regions within the multilayer structure 3, which regions are mutually electromagnetically isolated and configured as various electronic circuitry features.
The electronic circuitry 11 may comprise batteries, integrated circuits, printed circuit boards, speakers, cameras, vibration motors etc. The multilayer structure 3 may be formed by adhering layers to each other by means of an adhesive, by depositing layers onto each other e.g. by means of 3D printing, or by injection molding.
At least one of the conductive material layers may comprise at least one radio frequency element, the radio frequency element being one of an antenna radiator, an antenna cut, a parasitic antenna element, a reflector or director for mmWave antenna, a wavetrap for sub6G or mmWave antenna, a transmission line, a power divider, a soldering pad, a connector, an IC component, a PCB trace, a CPU, a GPU, a RAM, a switch, a feedline, and a resonator.
Furthermore, the multilayer structure 3 of the housing 1 may comprise at least one of an antenna array, a battery, a printed circuit board, a coaxial cable, an RFIC, and an antenna connection.
The functionality layer 5 comprises a conductive material penetrated by a non-conductive microslot pattern 6, as shown in more detail in Figs. 3 and 4. 15. The material of the functionality layer 5 may comprise at least one of aluminum, copper, stainless steel, and conductive alloys.
The functionality layer 5 has at least one conductive area A1 and at least one non-conductive area A2, the conductive area A1 and the non-conductive area A2 forming at least one electronic functionality. The electronic functionality may be at least one of an antenna radiator, a wireless power unit, a user interaction sensor, and a visual unit.
The non-conductive microslot pattern 6 may comprise a first set of microslots 6a and a second set of microslots 6b extending in the functionality layer 5, the microslots 6a, 6b being filled with a non-conductive material such that micropatches 7 of conductive material are formed between the non-conductive microslots 6a, 6b. At least two micropatches 7 are conductively interconnected, adjacent micropatches 7 being interconnected across one microslot 6a, 6b.
The microslots 6a, 6b have a length and a width, as seen in directions comprised in the main plane of the functionality layer 5 and the multilayer structure 3. The width may be between 3- 200 pm, preferably less than 15 pm. The length may correspond to the outer dimensions of the functionality layer 5.
The microslot pattern 6 extends not only at the surface of the functionality layer 5, but through the entire volume of the functionality layer 5 as seen in a direction perpendicular to the main plane of the functionality layer 5 and the multilayer structure 3, giving the microslots 6a, 6b a depth. The microslots 6a, 6b and the micropatches 7 have a common dimension in a direction perpendicular to the main plane, i.e. the microslots 6a, 6b have a depth which is identical to the thickness of the micropatches 7 as shown in Fig. 3. The functionality layer 5 may have a thickness of 10-100 pm.
The micropattem 6 may form antennas on or near the outside of the electronic device, and further antennas may be formed in the underlying conductive layers of the multilayer structure 3. The area of each micropatch 7 depends on the number of conductive connections 8 connecting to the micropatch 7. The microslots 6a, 6b are shaped such that there is constant density throughout the conductive A1 and non-conductive A2 areas. This facilitates a visually uniform metallic outer surface.
As shown in Fig. 4, the microslot pattern 6 may extend uninterruptedly along the entire surface of the functionality layer 5. At least the microslots of the first set of microslots 6a may be spaced along the entire functionality layer 5. The microslots of the second set of microslots 6b may also be spaced along the entire functionality layer 5.
In one embodiment, the first set of microslots 6a extend in a first direction in the functionality layer 5, and the second set of microslots 6b extend in a second direction in the functionality layer 5. The first direction extends at an angle >0° to the second direction, e.g. at a 90° angle as shown in Fig. 4. The microslots 6a of the first set of microslots 6a are spaced in the second direction, and the microslots 6b of the second set of microslots 6b are spaced in the first direction. In a further embodiment (not shown), the first set of microslots 6a extend concentrically in the functionality layer 5. The second set of microslots 6b extend in a radial direction from a center point of the first set of microslots 6a in the functionality layer 5. The microslots 6a of the first set of microslots 6a are spaced in the radial direction, and the microslots 6b of the second set of microslots 6b are spaced along a circumference of each microslot 6a, such that the first ends of the microslots 6b are all arranged at the same location, i.e. at the center point of the first set of microslots 6a, and the second ends of the microslots 6b are spaced along the circumference of each concentrically arranged microslot 6a.
The conductive area A1 may comprise at least two adjacent micropatches 7 which are conductively interconnected across the microslot 6a, 6b separating the two adjacent micropatches 7, as shown in Fig. 4. The conductive interconnection 8 may comprise conductive material, i.e. an uninterrupted, narrow section of conductive material extending across the microslot 6a, 6b from one micropatch 7 to an adjacent micropatch 7, in a direction perpendicular to the longitudinal extent of the microslot 6a, 6b. Such connected areas may form antenna conductors, i.e. antenna elements such as dipoles, monopoles, patches, parasitic resonators, antenna impedance matching structures, etc.
The non-conductive area A2 may comprise at least one micropatch 7 conductively isolated from all adjacent micropatches 7. Isolated areas effectively comprise radio-frequency transparent regions.
The housing 1 may further comprise an appearance layer 9 superimposed onto the functionality layer 5 at a side opposite to the multilayer structure 3, such that the functionality layer 5 is arranged between the appearance layer 9 and the multilayer structure 3. The appearance layer 9 extends over the entire surface of the functionality layer 5 and also extends into the microslots 6a, 6b, filling the microslots 6a, 6b completely except from any microslot sections occupied by conductive interconnections 8. Hence, the functionality layer 5 forms the outside of the housing 1, which outside is then covered by the appearance layer 9. The appearance layer 9 fulfills the functions of protecting the functionality layer 5, providing a uniform metallic outer surface to the device, and/or adding color to the housing 1.
The housing 1 may further comprise a reinforcement layer 10, shown in Fig. 5, the functionality layer 5 and the multilayer structure 3 being supported by the reinforcement layer 10. The reinforcement layer 10 may comprise an injection molded plastic such as thermoset resin. The present invention furthermore relates to a method of manufacturing the housing 1 described above. The method comprises the steps described below and shown in Fig. 5.
As shown in Fig. 5a, the first step comprises providing a frame structure 4 and a multilayer structure 3 in a mold (not shown). The frame structure 4 may comprise polycarbonate, polybutylene terephthalate, polyphenylene sulfide, a polyamide, polyetheretherketone, polyaryletherketone, or mixtures of those materials.
Thereafter a layer 10, such as an injection- mold plastic layer, is applied over the frame structure
4 and the multilayer structure 3, as shown in Fig. 5b.
The functionality layer 5 is applied onto a surface of the injection- mold plastic layer 10 and a surface of the frame structure 4, as shown in Fig. 5c. Applying the functionality layer 5 may comprise a dielectric metallization process, such as vapor or chemical vacuum metallization, arc spraying, electroless plating, or electroplating. Alternatively, a conductive foil is laminated onto the multilayer structure 3.
A non-conductive microslot pattern 6 is formed in the functionality layer 5, see Fig. 5d, such that the functionality layer 5 comprises at least one conductive area A1 and at least one non- conductive area A2.
The non-conductive microslot pattern 6 may be formed by penetrating the functionality layer
5 with a first set of microslots 6a and a second set of microslots 6b, the first set of microslots 6a and the second set of microslots 6b forming two individual slot patterns. The non-conductive microslot pattern 6 may be formed by laser removing the conductive material.
Thereafter, the functionality layer 5 may be polished and an appearance layer 9 applied onto the functionality layer 5. The functionality layer 5 may comprise a conductive material and the appearance layer 9 may comprise a non-conductive material and be applied by means of anodizing. The appearance layer 9 extends into the microslot pattern 6, at least partially filling the microslots 6a, 6b. The appearance layer 9 may be formed of various compounds of metal oxide and coloring materials.
In one embodiment, the functionality layer 5 comprises an aluminum sheet and the appearance layer 9 is formed by anodizing, forming an aluminum oxide. The various aspects and implementations have been described in conjunction with various embodiments herein. However, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed subject-matter, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measured cannot be used to advantage.
The reference signs used in the claims shall not be construed as limiting the scope.

Claims

1.A housing (1) for an electronic device (2), said housing (1) comprising a multilayer structure (3) and a functionality layer (5) superimposed onto a layer of said multilayer structure (3), said functionality layer (5) comprising a conductive material, a non-conductive microslot pattern (6) being formed in said functionality layer (5), said functionality layer (5) having at least one conductive area (Al) and at least one non- conductive area (A2), said conductive area (Al) and said non-conductive area (A2) forming at least one electronic functionality.
2. The housing (1) according to claim 1, wherein said electronic functionality is at least one of an antenna radiator, a wireless power unit, a user interaction sensor, and a visual unit.
3. The housing (1) according to claim 1 or 2, wherein said non-conductive microslot pattern (6) comprises a first set of microslots (6a) and a second set of microslots (6b) extending in said functionality layer (5), said microslots (6a, 6b) being filled with a non-conductive material such that micropatches (7) of conductive material are formed between said non- conductive microslots (6a, 6b), at least two micropatches (7) being conductively interconnected.
4. The housing (1) according to any one of the previous claims, wherein said microslot pattern (6) extends uninterruptedly along the entire functionality layer (5).
5. The housing (1) according to claim 3 or 4, wherein at least the microslots of said first set of microslots (6a) are spaced along the entire functionality layer (5).
6. The housing (1) according to claim 5, wherein said first set of microslots (6a) extend in a first direction in said functionality layer (5), and said second set of microslots (6b) extend in a second direction in said functionality layer (5), said first direction extending at an angle >0° to said second direction, the microslots (6a) of said first set of microslots (6a) being spaced in said second direction, the microslots (6b) of said second set of microslots (6b) being spaced in said first direction.
7. The housing (1) according to claim 5, wherein said first set of microslots (6a) extend concentrically in said functionality layer (5), and said second set of microslots (6b) extend in a radial direction, from a center point of said first set of microslots (6a), in said functionality layer (5), the microslots (6a) of said first set of microslots (6a) being spaced in said radial direction, the microslots (6b) of said second set of microslots (6b) being spaced along a circumference of each microslot (6a).
8. The housing (1) according to any one of claims 3 to 7 wherein said microslots (6a, 6b) and said micropatches (7) have a common dimension in a direction perpendicular to a main plane of said functionality layer (5).
9. The housing (1) according to any one of claims 3 to 8, wherein said conductive area (Al) comprises at least two adjacent micropatches (7) being conductively interconnected across the microslot (6a, 6b) separating said two adjacent micropatches (7).
10. The housing (1) according to claim 9, wherein the conductive interconnection (8) comprises said conductive material.
11. The housing (1) according to any one of the previous claims, wherein said non- conductive area (A2) comprises at least one micropatch (7) conductively isolated from all adjacent micropatches (7).
12. The housing (1) according to any one of claims 3 to 11, further comprising an appearance layer (9) superimposed onto said functionality layer (5) at a side opposite to said multilayer structure (3), said appearance layer (9) extending into and filling said microslots (6a, 6b).
13. The housing (1) according to any one of the previous claims, further comprising a reinforcement layer (10), said functionality layer (5) and said multilayer structure (3) being supported by said reinforcement layer (10).
14. The housing (1) according to claim 13, wherein said reinforcement layer (10) comprises thermoset resin.
15. The housing (1) according to any one of the previous claims, wherein said functionality layer (5) comprises at least one of aluminum, copper, stainless steel, and conductive alloys.
16. The housing (1) according to any one of claims 3 to 15, wherein an area of each micropatch (7) depends on the number of conductive connections (8) connecting to said micropatch (7).
17. The housing (1) according to any one of the previous claims, wherein said multilayer structure (3) comprises electronic circuitry (11), and each layer of said multilayer structure (3) comprises at least one of a conductive material and a dielectric material, at least two of said layers being directly interconnected by means of conductive interconnection joints, and at least part of said electronic circuitry (11) being embedded in at least one of said layers.
18. The housing (1) according to claim 17, wherein at least one conductive material layer comprises at least one radio frequency element, said radio frequency element being one of an antenna radiator, an antenna cut, a parasitic antenna element, a reflector or director for mmWave antenna, a wavetrap for sub-6 GHz or mmWave antenna, a transmission line, a power divider, a soldering pad, a connector, an IC component, a PCB trace, a CPU, a GPU, a RAM, a switch, a feedline, and a resonator.
19. An electronic device (2) comprising at least a display (12) and a housing (1) according to any one of claims 1 to 18, said display (12) and a frame structure (4) of said housing (1) forming an outer surface of said electronic device (2).
20. The electronic device (2) according to claim 19, wherein the multilayer structure (3) of said housing (1) further comprises at least one of an antenna array, a battery, a printed circuit board, a coaxial cable, an RFIC, and an antenna connection.
21. A method of manufacturing a housing (1) for an electronic device (2), said method comprising the steps of: - providing a frame structure (4) and a multilayer structure (3) in a mold,
- applying an injection- mold plastic layer (10) over said frame structure (4) and said multilayer structure (3), - applying a functionality layer (5) onto a surface of said injection- mold plastic layer (10) and onto a surface of said frame structure (4), functionality layer (5)- forming a non-conductive microslot pattern (6) in said functionality layer (5) such that said functionality layer (5) comprises at least one conductive area (Al) and at least one non-conductive area (A2),
- applying an appearance layer (9) onto said functionality layer (5), said appearance layer extending into said microslot pattern (6).
22. The method according to claim 21, wherein said non-conductive microslot pattern (6) is formed by at least partially penetrating said functionality layer (5) with a first set of microslots (6a) and a second set of microslots (6b), said first set of microslots (6a) and said second set of microslots (6b) forming two individual slot patterns.
23. The method according to claim 21 or 22, wherein said functionality layer (5) comprises a conductive material, and said appearance layer (9) comprises a non-conductive material.
PCT/EP2019/085589 2019-12-17 2019-12-17 A housing for an electronic device WO2021121559A1 (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2778830A2 (en) * 2013-03-13 2014-09-17 Samsung Electronics Co., Ltd. Electronic device and method for manufacturing the same
US20190341688A1 (en) * 2018-05-04 2019-11-07 Samsung Electronics Co., Ltd. Antenna and electronic device including same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2778830A2 (en) * 2013-03-13 2014-09-17 Samsung Electronics Co., Ltd. Electronic device and method for manufacturing the same
US20190341688A1 (en) * 2018-05-04 2019-11-07 Samsung Electronics Co., Ltd. Antenna and electronic device including same

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