JP4904336B2 - Radar device antenna and manufacturing method thereof - Google Patents

Description

  The present invention relates to an antenna for a radar device and a manufacturing method thereof, and more particularly to an antenna for a high-frequency radar device having a fine structure and a manufacturing method thereof.

  In recent years, in response to an increase in the amount of information associated with the advancement of information technology, development of systems using microwaves and millimeter waves has been promoted in communication systems using radio. In addition, as for radar devices, devices using high frequency bands suitable for automobile-mounted radars are being developed. For example, a quasi-millimeter wave band of 22 to 29 GHz and a millimeter wave band of 70 to 81 GHz are used. Yes.

  As described above, in a system using a high frequency band, it is possible to manufacture a high-performance radar. However, as the wavelength becomes shorter, the antenna device is downsized and high processing accuracy is required. Become so. As a conventional method for manufacturing an antenna device with high accuracy, for example, a method described in Patent Document 1 is known. Patent Document 1 discloses a method of manufacturing an antenna device 900 having a fine structure as shown in FIG.

  The antenna device 900 described in Patent Document 1 has a structure in which an antenna pattern 905, a through hole 904, an electrode 906, and the like are finely formed. It is described that such a fine structure is formed integrally with a dielectric 902 by using an injection molding method or a hot emboss molding method. Further, it is described that a conductive film is formed in the electrode 906 to form an electrode pole.

JP 2004-304611 A

  However, in the antenna manufacturing method described in Patent Document 1, an injection molding method or a hot emboss molding method is used in order to form a fine structure such as the antenna pattern 905, the through-hole 904, and the electrode 906 integrally with the dielectric 902. However, a manufacturing method for forming a conductor layer inside the through hole 904 or the electrode 906 is not disclosed. The electrode 906 is only described as forming a conductive film therein. In an antenna having a fine structure, there is a problem with a method of forming a conductor layer with high precision in the fine structure portion.

  Accordingly, the present invention has been made to solve the above-described problems, and provides a radar device antenna having a fine structure and a method of manufacturing a radar device antenna having high processing accuracy and excellent productivity. Objective.

The first aspect of the manufacturing method of the radar antenna of the present invention, a radiation unit substrate formed of a dielectric, an antenna element formed on one surface of the radiation part substrate, the other surface of the radiating portion substrate A ground board formed on the other side of the radiation board across the ground board, a transmission line formed on the surface of the line board opposite to the ground board side, A first feed-line through-hole that electrically connects the antenna element and the transmission line through the radiating portion substrate and the line substrate, and the antenna element and the ground plane through the radiating portion substrate. the a electrically connected to the second feed line manufacturing process of the antenna for a radar device including a through hole, a containing a through-hole which, first on one side of the radiating portion substrate by injection molding Copper foil is placed A radiation unit substrate forming process in which the second copper foil forming said radiating portion substrate disposed on the other surface of the part substrate, the first pattern including the antenna element by etching the first copper foil And forming the line substrate by an injection molding method on the other surface side of the radiating portion substrate, and a pattern forming step of forming the second pattern including the ground plane by etching the second copper foil A line substrate forming step , wherein the radiating portion substrate forming step includes disposing the first copper foil on one inner surface of the first mold and forming the first copper foil on the other inner surface facing the one inner surface. A step of disposing the second copper foil, and inserting a precision pin into an insertion hole previously formed in the first mold, thereby allowing the first copper foil and the second copper foil to have a predetermined size. And forming the hole in the state where the precision pin is inserted. A step of the radiating portion substrate first through hole is formed is injection molded by injecting a mold to the resin, the through hole by plating a predetermined metal on the inside of the first through holes The line substrate forming step includes fixing the radiation portion substrate to one inner surface of the second mold, and forming a third copper foil on the other inner surface facing the one inner surface. A precision pin is inserted into the placement step, the insertion hole formed in the second mold in advance, and the first feed line through hole on the radiation part substrate side formed in the radiation part substrate molding step. Forming a hole of a predetermined size in the third copper foil, and injecting a resin into the second mold with the precision pin inserted, thereby forming a second through hole. Injection molding the line substrate, and the third copper foil Forming a transmission line by etching and forming a through hole for the first feeder line on the line substrate side by plating a predetermined metal inside the second through hole. The through-hole is positioned with high accuracy by inserting the precision pin into the insertion hole formed by positioning with high precision in advance in the first mold and the second mold, and a predetermined hole diameter. It is characterized by being formed with high accuracy .

In another aspect of the method for manufacturing an antenna for a radar device of the present invention, the through hole includes a through hole that forms a cavity that surrounds the antenna element, and the first pattern includes a through hole that forms the cavity. An annular conductor pattern to be connected is included.

  In another aspect of the method for manufacturing an antenna for a radar device of the present invention, the second pattern includes a pattern of the ground plane formed so as to be in non-contact with the first feed line through hole. Features.

According to another aspect of the method for manufacturing an antenna for a radar device of the present invention, in the radiating portion substrate forming step, the radiating portion substrate is formed by bending the radiating portion substrate into two or more planes. 1 through hole is formed, and in the line substrate forming step, the line substrate is formed with two or more planes bent in parallel with each of the two or more planes of the radiation portion substrate, and two or more of the line substrates are formed. The second through hole is formed in each of the planes .

A first aspect of the antenna for a radar apparatus according to the present invention is an antenna for a radar apparatus manufactured using the method for manufacturing an antenna for a radar apparatus according to any one of the first to fourth aspects. Te, a radiation part board which is bent into two or more planes a dielectric, wherein the antenna element formed on one surface of each of the plane of the radiation portion a substrate and the other of each of the plane of the radiation portion substrate A ground plate formed on the surface, a line substrate formed in parallel to each plane of the radiating portion substrate across the ground plate, and a surface opposite to the surface of the line substrate in contact with the ground plate A transmission line; a first feed line that electrically connects the antenna element and the transmission line; a second feed line that electrically connects the antenna element and the ground plane; the antenna element; Electrical connection to the ground plane A plurality of through holes, characterized in that it comprises a cavity formed of electrically connected to the ring conductor of said through hole at one surface of the radiation portion substrate.

  Another aspect of the antenna for a radar device according to the present invention is characterized in that the transmission line electrically connects the antenna elements formed on the respective planes of the radiating portion substrate.

  As described above, according to the present invention, it is possible to provide a radar device antenna having a fine structure and a method for manufacturing a radar device antenna having high processing accuracy and excellent productivity.

  A radar device antenna and a manufacturing method thereof according to a preferred embodiment of the present invention will be described in detail with reference to the drawings. Each component having the same function is denoted by the same reference numeral for simplification of illustration and description.

  A method for manufacturing an antenna for a radar apparatus according to an embodiment of the present invention will be described using the antenna 100 for a radar apparatus shown in FIG. The radar device antenna 100 is an example of an antenna used for radar using an ultra-wideband in a quasi-millimeter wave band. FIG. 2 shows a plan view (a) of the radar device antenna 100 and a cross-sectional view (b) taken along the A-A ′ plane. The radar apparatus antenna 100 includes an antenna element 110 on one surface of a radiation board 101 formed of a predetermined dielectric, and the antenna element 110 is formed of four antenna parts 111 to 114 having a trapezoidal shape. A bow-tie antenna element. A ground plane 102 is formed on the other surface of the radiation unit substrate 101.

  The radar apparatus antenna 100 further has a cavity 120 formed on one surface of the radiation unit substrate 101 so as to surround the antenna element 110. The cavity 120 includes a plurality of through holes 122 arranged along the four sides of the radiation part substrate 101 and an annular conductor 121 connecting the plurality of through holes 122. Each through-hole 122 has a structure in which a conductor layer is formed on the inner wall of a through-hole that penetrates the radiating portion substrate 101. The conductor layer formed on the inner wall of the through hole 122 is connected to the annular conductor 121 on one surface of the radiating portion substrate 101, and is connected to the ground plane 102 on the other surface of the radiating portion substrate 101.

  A line substrate 103 is provided on the opposite side of the radiating portion substrate 101 with the ground plate 102 interposed therebetween, and a transmission line 104 is formed on the surface of the line substrate 103 opposite to the surface in contact with the ground plate 102. In addition, the first feed line 105 that feeds power from the transmission line 104 to the antenna element 110 through the radiation board 101 and the line board 103 and the radiation board 101 without contact with the ground plane 102. A second feed line 106 that electrically connects the antenna element 110 and the ground plane 102 is provided. The first feed line 105 is connected near the upper sides of the antenna parts 111 and 112, and the second feed line 106 is connected near the upper sides of the antenna parts 113 and 114. A predetermined electronic component can be further mounted on the line substrate 103.

  The radar device antenna 100 is formed in a structure in which the antenna element 110 and the transmission line 104 are arranged on a plane parallel to each other, and the antenna shape is thus a flat plate. By adopting such a flat plate shape, the arrangement space can be reduced, and an array antenna can be easily configured by arranging a plurality of antenna elements 110 on the same plane.

  The cavity 120 formed in the radiating portion substrate 101 is provided so as to reduce the influence of the surface wave formed on the radiating portion substrate 101 and obtain good radiation characteristics (radiation pattern, gain). As the operating frequency increases, it is necessary to increase the processing accuracy of the antenna as the wavelength decreases. The through hole 122 constituting the cavity 120 is positioned with high precision in the radiation part substrate 101, and a conductor layer is formed on the inner wall after the through hole is formed with high precision.

  The radar device antenna manufacturing method of this embodiment is a method of manufacturing the radar device antenna 100 by forming a fine structure such as the cavity 120 with high accuracy. A method for manufacturing an antenna for a radar apparatus according to this embodiment will be described with reference to FIG. FIG. 1 shows a cross-sectional view of a mold used in the manufacturing method of the present embodiment.

  The method for manufacturing an antenna for a radar device according to the present embodiment includes a radiation part substrate molding step of forming the radiation part substrate 101 by an injection molding method to produce the radiation part substrate 101 including the antenna element 110, and radiation part substrate molding. A pattern forming step of forming a pattern on both surfaces of the radiating portion substrate 101 after the step, and a through hole forming step of forming the first feeder line 105, the second feeder line 106, and the through hole 122 on the radiating portion substrate 101; have. Moreover, in order to produce the line board | substrate 103 provided with the transmission line 104, the line board | substrate shaping | molding process which shape | molds the line board | substrate 103 by the injection molding method, and the transmission line formation process which forms the transmission line 104 in one surface of the line board | substrate 103 And a feed line forming step for forming the first feed line 105 on the line substrate 103.

  The fine-structure cavity 120 is formed by arranging a plurality of through-holes 122 having a small diameter. The position accuracy and the hole diameter accuracy of the through-hole 122, the first feed line 105, the second of the antenna element 110, and the like. Since the accuracy of the position of the feeder line 106 and the accuracy of the hole diameter affect the radiation characteristics, a substrate processing technique for forming through holes with high accuracy of about ± 10 μm, for example, is required. When the through holes 122 are formed by drilling with a drilling machine, the positional accuracy of the through holes is about ± 50 μm, and such processing accuracy is not preferable for the radiation characteristics of the antenna 100 for the radar device. Will have an impact.

  Therefore, in the method for manufacturing an antenna for a radar device according to this embodiment, an injection molding method using a mold is applied in the radiation portion substrate molding step. FIG. 1 is a diagram for explaining a step of manufacturing the radiation part substrate 101 using a mold in the radiation part substrate molding step. In the radiation part substrate molding process of the present embodiment, the radiation part substrate 101 is molded by an injection molding method using the first mold 151 (151a, 151b, 151c, 151d).

  In the first step shown in FIG. 1 (a), the first copper foil 131 and the second copper foil 132 are arranged on the molds 151a and 151c on the opposing surfaces of the first mold 151, respectively. Here, it is assumed that the mold 151a is disposed on the surface of the radiation unit substrate 101 on the antenna element 110 side, and the mold 151c is disposed on the surface of the radiation unit substrate 101 on the ground plane 102 side. The first copper foil 131 and the second copper foil 132 can be fixed by adhering or adsorbing to the molds 151a and 151c, respectively.

  In the second step shown in FIG. 1B, the inner mold 152 is placed in the first mold 151, and the first feed line 105, the second feed line 106, and the through hole 122 are precisely formed. The pin 153 is inserted. At the position where the precision pin 153 is inserted, holes for allowing the precision pins 153 to be inserted into the molds 151a and 151c and the inner mold 152 are provided with high accuracy in advance. By inserting the precision pin 153 into the first mold 151, a hole having a predetermined size is precisely formed in the first copper foil 131 and the second copper foil 132. In addition, you may use the 1st copper foil 131 and the 2nd copper foil 132 which formed said hole previously, and a 2nd step becomes unnecessary in this case.

  In the third step shown in FIG. 1C, the inner mold 152 is removed from the first mold 151 after the precision pin 153 is pulled out from the first mold 151. Thereafter, only the precision pin 153 is inserted into the first mold 151 again.

  In the fourth step shown in FIG. 1D, the first mold 151 into which the precision pin 153 is inserted is sealed, and, for example, a low dielectric constant resin 154 is injected under pressure. After the resin 154 injected into the mold 151 is solidified, the precision pin 153 is pulled out from the first mold 151, and the first mold 151 is opened to remove the molded radiation part substrate 101.

  FIG. 3 shows a cross-sectional view of the radiating portion substrate 101 formed in the radiating portion substrate forming step. 3A is a cross-sectional view taken along the plane A-A ′ of the plan view of FIG. 2A, and FIG. 3B is a cross-sectional view taken along the plane B-B ′. As shown in the figure, through holes 105a, 106a, and 122a (first through holes) are formed at positions where the first feed line 105, the second feed line 106, and the through hole 122 are formed, respectively. . In the radar device antenna manufacturing method of the present embodiment, since the first through hole is formed by injection molding, the first through hole can be formed with high accuracy of, for example, about ± 10 μm. In addition, the first copper foil 131 and the second copper foil 132 fixed to both surfaces of the radiating portion substrate 101 are drilled with high accuracy at the entrance and exit of the first through hole.

  In the radiating part substrate forming step, when the radiating part substrate 101 in which the first feed line 105, the second feed line 106, and the first through hole for the through hole 122 are formed with high accuracy is formed, the subsequent through As a hole forming step, a conductor layer 133 is formed on the inner walls of the first through holes 105a, 106a, 122a by plating. FIG. 4 shows a cross-sectional view of the radiation part substrate 101 formed up to the through hole forming step. 4A is a cross-sectional view taken along the plane A-A ′ of the plan view of FIG. 2A, and FIG. 4B is a cross-sectional view taken along the plane B-B ′. As shown in the figure, the antenna element 110 and the annular conductor 121 of the cavity 120 are formed on one surface of the radiating portion substrate 101, and the ground plane 102 is formed on the other surface of the radiating portion substrate 101.

  Next, as a pattern forming step, the first copper foil 131 is etched to form a first pattern including the antenna element 110, and the second copper foil 132 is etched to form a second pattern including the ground plane 102. Form. In addition to the pattern of the antenna element 110, the first pattern includes a pattern of the annular conductor 121 that connects the through holes 122 constituting the cavity 120. Further, as the second pattern, a pattern of the ground plane 102 is formed such that the through hole 105a for the first power supply line 105 is not in contact with the ground plane 102. Note that the order of the through hole forming step and the pattern forming step can be interchanged.

  As shown in FIG. 4A, the first feed line 105 is electrically connected to the antenna element 110, and is formed in a through hole that is not in contact with the ground plane 102. Further, the second feed line 106 is formed in a through hole that is electrically connected to the antenna element 110 and the ground plane 102. Further, as shown in FIG. 4A, the through hole 122 constituting the cavity 120 is electrically connected to the annular conductor 121 and the ground plane 102.

  Next, a method for manufacturing the line substrate 103 disposed on the base plate 102 side of the radiation unit substrate 101 will be described below. The line substrate 103 can be manufactured by using a conventional printed circuit board manufacturing method. A process of manufacturing the line substrate 103 using a conventional printed circuit board manufacturing method will be described below.

  First, as the line substrate 103, a single-sided copper-clad plate is attached to the base plate 102 side of the radiation portion substrate 101 by press molding with a sheet-like adhesive. Next, a through hole is formed at a position where the first feeder line 105 is disposed. Thereafter, a conductor layer is plated on the inner wall of the through hole, and is electrically connected to the conductor layer on the inner wall of the through hole 105 a for the first feeder line 105 formed on the radiation board 101. Finally, the transmission line 104 is formed by etching the copper on the single-sided copper-clad plate.

  However, when the line substrate 103 is manufactured using the above-described conventional method for manufacturing a printed circuit board, a through hole for the first feeder line 105 is drilled using a drilling machine. Therefore, the positional accuracy of the through hole becomes about ± 50 μm, which adversely affects the radiation characteristics of the radar device antenna 100.

  On the other hand, in the method for manufacturing an antenna for a radar device according to the present embodiment, the line substrate 103 can be formed with high accuracy by using the injection molding method for the wiring substrate 103 as well. The method of manufacturing the line substrate 103 according to the present embodiment includes a line substrate forming step of forming the line substrate 103 by an injection molding method, a transmission line forming step of forming the transmission line 104 on one surface of the line substrate 103, and a line substrate. 103 includes a feed line forming step for forming the first feed line 105.

  A method for manufacturing the line substrate 103 according to the present embodiment will be described with reference to FIGS. FIG. 5 is a diagram for explaining a step of producing the line substrate 103 using a mold in the line substrate forming step. In the line substrate forming step of the present embodiment, the line substrate 103 is formed by an injection molding method using the second mold 155 (155a, 155b, 155c, 155d).

  In the first step shown in FIG. 5A, the radiating portion substrate 101 prepared above is fixed to the mold 155a on one side of the second mold 155 facing the second mold 155, and the first surface 155c has the first step. 3 copper foils 134 are arranged. The metal mold 155 is configured such that, for example, a recess or a groove is formed in the metal mold 155a or the metal molds 155b and 155d so that the radiating portion substrate 101 can be fixed. Or you may make it adsorb | suck the radiation | emission part board | substrate 101 to the metal mold | die 155a. The third copper foil 134 can be fixed by being attached to or adsorbed to the mold 155c.

  In the second step shown in FIG. 5B, the inner mold 156 is placed in the second mold 155, and the precision pin 153 is placed at a position where the first feed line 105 is formed. At positions where the precision pins 153 are arranged, holes for allowing the precision pins 153 to be inserted into the molds 155a and 155c and the inner mold 156 are provided with high accuracy in advance. In addition, a through hole for the first feed line 105 is already formed in the radiation part substrate 101. By inserting the precision pin 153 into the second mold 155 and the first feed line 105 through hole of the radiating portion substrate 101, a hole of a predetermined size is precisely formed in the third copper foil 134. .

  In the third step shown in FIG. 5C, after the precision pin 153 is pulled out from the second mold 155, the inner mold 156 is removed from the first mold 151. Thereafter, only the precision pin 153 is inserted into the second mold 155 again.

  In the fourth step shown in FIG. 5D, the second mold 155 with the precision pin 153 inserted is sealed, and a low dielectric constant resin 157, for example, is injected into it by applying pressure. The resin 157 may be the same as the resin 154 used in the radiation portion substrate molding process. After the resin 157 injected into the mold 155 is solidified, the precision pin 153 is pulled out from the second mold 155, and the second mold 155 is opened to take out the molded line substrate 103.

FIG. 6 shows a cross-sectional view of the radiation part substrate 101 and the line substrate 103 formed up to the above-described line substrate forming step. 6A shows a cross-sectional view taken along the plane AA ′ of the plan view of FIG. 2A, and FIG. 6B shows a cross-sectional view taken along the line BB ′. As shown in the figure, a through hole 105 b (second through hole) is formed in the line substrate 103 at a position where the first feed line 105 is formed. The through hole 105b is formed with high precision positioning with the through hole 105a formed in the radiating portion substrate 101. In the radar device antenna manufacturing method of the present embodiment, since the first through hole and the second through hole are formed by injection molding, the first through hole is formed with high accuracy of, for example, about ± 10 μm. can do. Further, the third copper foil 134 is perforated with high accuracy at the outlet of the second through hole 105b.

In the line substrate forming step, when the line substrate 103 in which the second through hole for the first feeder line 105 is formed with high accuracy is formed, the third copper foil 134 is etched next as the transmission line forming step. Thus, the transmission line 104 is formed. As a subsequent feed line forming step, a conductor layer is formed on the inner wall of the second through hole 105b for the first feed line by plating. The conductor layer on the inner wall of the through hole 105 b is formed so as to be electrically connected to the transmission line 104.

  As described above, in the method for manufacturing an antenna for a radar device according to the present embodiment, the first substrate 150 and the first feeder line 105 having a fine structure are formed by manufacturing the radiation unit substrate 101 and the line substrate 103 using an injection molding method. The two feeder lines 106 and the cavity 120 can be formed with high accuracy. In addition, once a mold for forming the radiating portion substrate 101 and the line substrate 103 is manufactured, it becomes very easy to mass-produce the radiating portion substrate 101 and the line substrate 103 using the mold, and mass production of the antenna 100 for the radar device is facilitated. Can be easily realized.

  Another embodiment of the antenna for a radar apparatus and the method for manufacturing the same according to the present invention will be described with reference to FIGS. FIG. 7 is a developed perspective view of an antenna 200 for a radar apparatus according to another embodiment. FIG. 8 is a perspective view showing a high-frequency substrate 201 that is a component of the radar apparatus antenna 200. The radar device antenna 200 according to this embodiment includes a high-frequency board 201, an electromagnetic shield part 202, a circuit board 203, a radome 204 for housing them, and a case, in which a radiation board 231 and a line board 232 are integrated. 205.

  The high-frequency substrate 201 of this embodiment is formed so that the radiation surface of the antenna is in two directions by being bent into two planes, a first high-frequency substrate 201a and a second high-frequency substrate 201b. Thus, a radar apparatus capable of detecting a wide range can be provided by combining antennas having different radiation plane directions.

  Each of the two high-frequency boards 201a and 201b is configured in the same manner as the radar device antenna 100 shown in FIG. 2, and the radiation board 231a and the line board 232a, and the radiation board 231b and the line board 232b are bonded to each other. Is formed. However, in FIGS. 7 and 8, an array antenna in which antenna elements 210 are arrayed is arranged on each of the radiation part substrates 231a and 231b. That is, the array antenna 206a is disposed on the first high-frequency substrate 201a, and the array antenna 206b is disposed on the second high-frequency substrate 201b.

  Each of the array antennas 206 a and 206 b is configured by arranging antenna elements 210 similar to the antenna elements 110 shown in FIG. 1 in the vertical and horizontal directions and forming cavities 220 so as to surround each antenna element 210. As in the first embodiment, the method for manufacturing an antenna for a radar apparatus according to the present embodiment forms the radiation element substrates 231a and 231b to form the antenna elements 210 and the like, and forms the line substrates 232a and 232b. And forming a transmission line and the like.

  When the high-frequency board 201 is bent into two planes of the first high-frequency board 201a and the second high-frequency board 201b like the radar device antenna 200 of the present embodiment, as shown in FIG. In addition, the high-frequency substrate 201 can be manufactured by separately manufacturing the high-frequency substrates 201a and 201b and bonding them. However, in order to join two high-frequency substrates 201a and 201b that are separately manufactured, connectors and the like for connecting the respective transmission lines for transmitting high-frequency signals are required, resulting in high costs.

  Therefore, in the method for manufacturing an antenna for a radar device according to the present embodiment, the radiation part substrate 231 having two bent flat surfaces as shown in FIG. 8A is integrally formed in the radiation part substrate forming step. . The mold used in the radiation part substrate molding process has a shape corresponding to the bent two-plane radiation part substrate 231, and is located at a predetermined position where a feed line is formed or a through hole for the cavity 220 is formed. It is formed so that a predetermined number of precision pins can be inserted by positioning with high accuracy. By injecting a predetermined resin material into the mold thus formed, a radiation part substrate 231 which is bent in two planes and has a through hole for forming a feed line and a through hole for a cavity is formed. .

  When the radiating part substrate 231 is formed in the radiating part substrate forming process, the copper foil provided on one surface of the radiating part substrate 231 is then etched as a pattern forming process to form the annular conductors of the array antenna 206 and the cavity 220 The copper foil provided on the other surface of the radiation part substrate 231 is etched to form a ground plate or the like. In the subsequent through hole forming step, a conductor layer is formed on the inner wall of the feed line through hole or the cavity 220 through hole by plating.

  Similarly to the radiating portion substrate 231, the line substrate 232 is formed integrally with the line substrate 232 having two bent planes as shown in FIG. 8A in the line substrate forming step. The metal mold used in the line substrate forming process has a shape corresponding to the bent two-plane line substrate 232, so that a predetermined number of precision pins can be inserted with high accuracy at the position where the feed line is formed. Is formed. By injecting a predetermined resin material into the mold thus formed, a line substrate 232 which is bent in two planes and has a through hole for forming a feed line is formed.

  After the line substrate 232 is formed in the line substrate forming step, the transmission line is formed by etching the copper foil provided on the surface of the line substrate 232 opposite to the radiation portion substrate 231 as the transmission line forming step. To do. In the subsequent feed line forming step, a conductor layer is formed on the inner wall of the feed line through hole by plating. Thereby, the high frequency substrate 201 is produced.

  The high-frequency board 201 manufactured as described above is connected to the circuit board 203 with the electromagnetic shield part 202 interposed therebetween. The high-frequency board 201, the electromagnetic shield part 202, and the circuit board 203 are integrally stored in the case 205 and covered and sealed with the radome 204.

  As described above, according to the radar device antenna manufacturing method of the present embodiment, the radiation unit substrate 231 and the line substrate 232 are emitted even if the radar device antenna has two or more differently directed radiation surfaces. By producing by using the molding method, the fine-structure feed line and the cavity 220 can be formed with high accuracy. In addition, once a mold for forming the radiating portion substrate 231 and the line substrate 232 is produced, it becomes extremely easy to mass-produce the radiating portion substrate 231 and the line substrate 232 by using this, and mass production of the antenna 200 for the radar apparatus is facilitated. Can be easily realized.

  Note that the description in the present embodiment shows an example of the antenna for a radar device and the method for manufacturing the same according to the present invention, and the present invention is not limited to this. The detailed configuration and detailed operation of the radar device antenna and the manufacturing method thereof in the present embodiment can be changed as appropriate without departing from the spirit of the present invention.

It is sectional drawing of the metal mold | die used for preparation of the radiation | emission part board | substrate for demonstrating the manufacturing method of the antenna for radar apparatuses of 1st Embodiment. It is the top view and sectional drawing of the antenna for radar devices by the manufacturing method of the antenna for radar devices concerning a 1st embodiment. It is sectional drawing of the radiation | emission part board | substrate for demonstrating the manufacturing method of the antenna for radar apparatuses which concerns on 1st Embodiment. It is sectional drawing of the radiation | emission part board | substrate for demonstrating the manufacturing method of the antenna for radar apparatuses which concerns on 1st Embodiment. It is sectional drawing of the metal mold | die used for preparation of the line board | substrate for demonstrating the manufacturing method of the antenna for radar apparatuses of 1st Embodiment. It is sectional drawing of the radiation | emission part board | substrate and wiring board for demonstrating the manufacturing method of the antenna for radar apparatuses which concerns on 1st Embodiment. It is a development perspective view of another radar apparatus antenna by a manufacturing method of a radar apparatus antenna according to a second embodiment. It is a perspective view which shows the high frequency board | substrate of another antenna for radar apparatuses. It is the top view and sectional drawing of the conventional antenna.

Explanation of symbols

100, 200 Radar device antennas 101, 231 Radiation section substrate 102 Ground plate 103, 232 Line substrate 104 Transmission line 105 First feed line 106 Second feed line 110, 210 Antenna elements 111-114 Antenna parts 120, 220 Cavity 121 Ring conductor 122 Through hole 131, 132, 133, 134 Copper foil 151, 155 Mold 152, 156 Inner mold 153 Precision pin 154, 157 Resin 201 High frequency board 202 Electromagnetic shield part 203 Circuit board 204 Radome 205 Case 206 Array antenna

Claims (6)

A radiation unit substrate formed of a dielectric, an antenna element formed in said one surface of the radiation portion substrate, said main plate formed on the other surface of the radiating part substrate, the radiation portion of the substrate across the base plate A line substrate disposed on the other surface side, a transmission line formed on a surface of the line substrate opposite to the ground plane side, the radiation element substrate and the antenna substrate penetrating the line substrate. A through hole including a first feed line through hole that electrically connects the transmission line and a second feed line through hole that passes through the radiation portion substrate and electrically connects the antenna element and the ground plane. a method of manufacturing a radar antenna, comprising: a hall, a
A radiation part substrate for molding the radiation part substrate in which a first copper foil is disposed on one surface of the radiation part substrate and a second copper foil is disposed on the other surface of the radiation part substrate by an injection molding method Molding process;
A pattern forming step of etching the first copper foil to form a first pattern including the antenna element, and etching the second copper foil to form a second pattern including the ground plane;
On the other surface side of the radiating portion substrate, a line substrate molding step for molding the line substrate by an injection molding method ,
The radiation part substrate molding step
Disposing the first copper foil on one inner surface of the first mold and disposing the second copper foil on the other inner surface opposite to the one inner surface;
Inserting a precision pin into an insertion hole previously formed in the first mold to form a hole of a predetermined size in the first copper foil and the second copper foil;
Injection-molding the radiation part substrate in which the first through hole is formed by injecting resin into the first mold in a state where the precision pin is inserted ;
Plating the predetermined metal inside the first through hole to form the through hole ,
The line substrate molding process includes
Fixing the radiation part substrate to one inner surface of the second mold, and disposing a third copper foil on the other inner surface opposite to the one inner surface;
A precision pin is inserted into the insertion hole previously formed in the second mold and the first feed line through hole on the radiation part substrate side formed in the radiation part substrate molding step, and the third pin is inserted. Forming a hole of a predetermined size in the copper foil;
Injection-molding the line substrate in which the second through hole is formed by injecting resin into the second mold in a state where the precision pin is inserted;
Etching the third copper foil to form a transmission line;
Plating a predetermined metal inside the second through hole to form the first feed line through hole on the line substrate side, and
By inserting the precision pin into the insertion hole formed by positioning with high precision in advance in the first mold and the second mold, the through hole is positioned with high precision to a predetermined hole diameter. A method of manufacturing an antenna for a radar device, characterized by being formed with high accuracy . The through hole includes a through hole forming a cavity surrounding the antenna element ,
2. The method for manufacturing an antenna for a radar device according to claim 1 , wherein the first pattern includes an annular conductor pattern that connects through holes that form the cavity. 3. Said second pattern, said first radar antenna according to claim 1 or 2, characterized in that it comprises a pattern of the base plate which is formed such that the through holes and the non-contact power feeding line Production method. In the radiation part substrate molding step, the radiation part substrate is bent and molded into two or more planes, and the first through hole is molded in each of the two or more planes ,
In the line substrate forming step, the line substrate is formed with two or more planes bent in parallel with each of the two or more planes of the radiation portion substrate, and the second of each of the two or more planes of the line substrate is formed. The method for manufacturing an antenna for a radar device according to any one of claims 1 to 3 , wherein the through hole is formed . A radar device antenna manufactured using the method for manufacturing a radar device antenna according to any one of claims 1 to 4,
A radiation part substrate made of a dielectric material and bent into two or more planes;
An antenna element formed on one surface of each plane of the radiation unit substrate;
A ground plane formed on the other surface of each plane of the radiation unit substrate;
A line substrate formed in parallel to each plane of the radiation unit substrate with the ground plane interposed therebetween,
A transmission line formed on a surface opposite to the surface in contact with the ground plane of the line substrate;
A first feed line that electrically connects the antenna element and the transmission line;
A second feed line that electrically connects the antenna element and the ground plane;
A cavity composed of a plurality of through holes that electrically connect the antenna element and the ground plane, and an annular conductor that electrically connects the through holes on one surface of the radiating portion substrate;
An antenna for a radar device, comprising: The transmission line is electrically connected between the antenna elements formed on each plane of the radiating portion substrate,
The antenna for a radar device according to claim 5 .

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