WO2021109320A1

WO2021109320A1 - Led filament and lighting device

Info

Publication number: WO2021109320A1
Application number: PCT/CN2020/071333
Authority: WO
Inventors: 刘吉伟; 杨宇; 孟吉安; 黄胜; 姚庆林; 石红丽
Original assignee: 中山市木林森电子有限公司
Priority date: 2019-12-06
Filing date: 2020-01-10
Publication date: 2021-06-10
Also published as: CN211208478U

Abstract

An LED filament and a lighting device, the LED filament comprising: a line support (10); an electrode contact (20), the electrode contact (20) comprising a first electrode contact (210) and a second electrode contact (220), wherein the first electrode contact (210) and the second electrode contact (220) are arranged at two ends of the line support (10), respectively; a chipset (30), the chipset (30) being arranged on the line support (10) and connected to the first electrode contact (210) and the second electrode contact (220) by means of solder wires (40). The chipset (30) comprises at least two first chipsets (310) connected to each other in series or in parallel, and the first chipset (310) comprises at least one chip. By means of the above-described manner, the LED filament can achieve different low-voltage drives by setting a set number of chips into different structures having mixed serial and parallel connections, and can thus be applied to different power source drives, and enabled to have a broader application range.

Description

LED filament and lighting device

Technical field

The present invention relates to the field of LED technology, in particular to an LED filament and a lighting device.

Background technique

Nowadays, with the continuous development of LED, the research of LED filament has gradually made breakthrough progress. Among them, the power drive mode adopted by the LED filament is usually high-voltage drive to replace the traditional incandescent lamp.

The traditional incandescent lamp has a narrow application area, and because the conventional filament usually uses a full-series die-bonding wire method, it will be limited by the length of the bracket and the wire bonding process, so that each bracket has a minimum and maximum Therefore, it is impossible to achieve a lower voltage and apply to different power drives.

Utility model content

The main technical problem to be solved by the present invention is to provide an LED filament and lighting device, which can realize different low-voltage drives, so that they can be applied to different power sources and have a wider range of applications.

In order to solve the above technical problems, a technical solution adopted by the present invention is to provide an LED filament and a lighting device, wherein the LED filament includes: a circuit holder; an electrode contact piece, the electrode contact piece includes a first electrode contact piece and a second electrode The contact piece, the first electrode contact piece and the second electrode contact piece are respectively arranged on the two ends of the circuit support; the chip set, the chip set is arranged on the circuit support, and is connected to the first electrode contact piece and the second electrode contact through the bonding wire Chip, where the chipset includes multiple chips.

Wherein, a first lead and a second lead that are parallel to each other are provided on both sides of the circuit support; wherein, the chip set includes at least two first chip sets connected in parallel with each other, and the first end of the first chip set is connected to The first lead, the second end of the first chip set is connected to the second lead through a bonding wire, and the first lead and the second lead are respectively connected to the first electrode contact piece and the second electrode contact piece through the bonding wire.

Wherein, the first chipset includes at least two chips connected in series.

Wherein, a plurality of the chips in the chip set are parallel to each other, and the first end faces the direction of the first electrode contact piece, and the second end faces the direction of the second electrode contact piece, and are arranged on the circuit support at equal intervals.

Wherein, a first resistor and a second resistor, as well as a first high voltage chip and a second high voltage chip are respectively arranged on the circuit support near the first electrode contact piece and the second electrode contact piece; wherein, the first resistor and the second resistor The resistors are respectively connected in series to the first lead and the second lead, and are respectively connected to the first high-voltage chip and the second high-voltage chip, and the first high-voltage chip and the second high-voltage chip are respectively connected to the first electrode contact piece and the second electrode contact. sheet.

Wherein, the chip set includes at least two first chip sets connected in parallel with each other, the first chip set includes one chip, and the first end of each chip is connected to the first electrode through the soldering Contacts; the second end of each of the chips is connected to the second electrode contact by a bonding wire.

Wherein, the chip set includes at least two first chip sets connected in series, the first chip set includes at least two chips connected in parallel, and the first end of a first chip set close to the first electrode contact in the chip set is welded The wire is connected to the first electrode contact piece, and the second end of a first chip group in the chip group that is close to the second electrode contact piece is connected to the second electrode contact piece through a bonding wire.

Wherein, a plurality of the chips in the chipset are all parallel to each other, and the first end faces one side of the circuit support, and the second end faces the other side of the circuit support, and are arranged on the circuit support at equal intervals.

Among them, the circuit support is a ceramic circuit support or a glass circuit support.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide an LED filament, the LED filament includes: a circuit support; electrode contact piece, the electrode contact piece includes a first electrode contact piece and a second electrode contact piece Chip, the first electrode contact piece and the second electrode contact piece are respectively arranged at both ends of the circuit support; a chip set, the chip set is arranged on the circuit support, and is connected to the The first electrode contact piece and the second electrode contact piece; both sides of the circuit support are provided with a first lead and a second lead that are parallel to each other; the chipset includes at least two first and second lead wires connected in parallel with each other. Chip set, the first end of the first chip set is connected to the first lead through the bonding wire, and the second end of the first chip set is connected to the second lead through the bonding wire, so The first lead and the second lead are respectively connected to the first electrode contact piece and the second electrode contact piece through the bonding wire; a plurality of the chips in the first chip set are all parallel to each other , And the first end faces the direction of the first electrode contact piece, and the second end faces the direction of the second electrode contact piece, and are arranged on the circuit support at equal intervals.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide an illuminating device, wherein the illuminating device includes the LED filament as described above.

The beneficial effect of the present invention is that in the present invention, the chipset includes at least two first chip sets connected in series or parallel with each other, and the first chip set includes at least one chip. Through the above method, the LED filament of the present invention can realize different low-voltage drive by setting a set number of chips into different series, parallel and parallel structures, so that it can be applied to different power sources and make it possible. The scope of application is broader.

Description of the drawings

Fig. 1 is a schematic structural diagram of the first embodiment of the LED filament of the present invention;

2 is a schematic diagram of the structure of the second embodiment of the LED filament of the present invention;

3 is a schematic diagram of the structure of the third embodiment of the LED filament of the present invention;

4 is a schematic diagram of the structure of the fourth embodiment of the LED filament of the present invention;

5 is a schematic diagram of the structure of the fifth embodiment of the LED filament of the present invention;

Fig. 6 is a schematic structural diagram of a sixth embodiment of the LED filament of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

Please refer to FIG. 1, where FIG. 1 is a schematic structural diagram of the first embodiment of the LED filament of the present invention. In this embodiment, the LED filament includes a circuit holder 10, an electrode contact piece 20, a chip set 30, and a bonding wire 40.

Wherein, the electrode contact piece 20 further includes a first electrode contact piece 210 and a second electrode contact piece 220, and the first electrode contact piece 210 and the second electrode contact piece 220 are respectively disposed at both ends of the circuit support 10 for connection Both ends of the external power supply.

Wherein, the circuit support can be a ceramic circuit support or a glass circuit support, which is not limited in the present invention.

Wherein, the chip set 30 is disposed on the circuit support 10, and its positive and negative poles are respectively connected to the first electrode contact piece 210 and the second electrode contact piece 220 through the bonding wires 40. The chip set 30 includes four first chip sets 310 connected in parallel, and each of the first chip sets 310 further includes a chip 3110 and a chip 3120.

It is understandable that the chipset 30 can be fixed to the circuit support 10 by fixing a set number of chips by bonding wires, so that after the set number of chips are arranged, the corresponding bonding wires can be adjusted. To adjust the series-parallel relationship of each chip in the chipset 30, it can be matched with different driving voltages.

Optionally, the chipset 30 may further divide each set number of chips connected in series into groups according to needs, so as to obtain at least two first chip sets 310, wherein each first chip set 310 is further divided into groups. The first chipset 310 may be connected in parallel, and the first chipset 310 may further include at least two chips connected in series. In other embodiments, the first chipset 310 may also include only one chip, which is not limited in the present invention.

Optionally, when the number of chips arranged on the circuit support 10 is set to 8, that is, the total number of chips included in the chipset 30 is 8, then the corresponding setting of the bonding wires 40 can be used to make them Each chip is connected in parallel with each other to further connect to the first electrode contact 210 and the second electrode contact 220, so as to be externally connected to both ends of a low-voltage power supply. Accordingly, the output voltage of the power supply is 3V; and when Connect each adjacent two of the 8 chips in series, and further connect the series-connected chip group in parallel to connect to the first electrode contact piece 210 and the second electrode contact piece 220, as shown in FIG. Every two chips 3110 and chip 3120 constitute a first chip group 310, and each first chip group 310 is connected in parallel with each other to form a chip group 30, and is respectively connected to the first electrode contact 210 and the second electrode contact 220, At this time, the output voltage of the corresponding driving power supply is 6V, and in other embodiments, the total number of chips included in the chipset 30 may also be other numbers, that is, the first chipset 310 included in the chipset 30 Other numbers are also possible, but if the first chipset 310 both include two

chips

3110 and 3120 connected in series, the output voltage of the corresponding driving power supply is still 6V, which is not limited by the present invention. Wherein, the corresponding external power supply can be a DC low-voltage power supply or an AC low-voltage voltage source, and power is supplied to the corresponding chipset 310 through the first electrode contact piece 210 and the second electrode contact piece 220 and the set bonding wire 40. .

Optionally, a first lead 510 and a second lead 520 parallel to each other are further set on both sides of the circuit support 10, and correspondingly, the chip set 30 includes four first chip sets 310 connected in parallel, wherein, The first end of the first chip set 310 may be connected to the second lead 520 by a bonding wire 40, and the second end of the first chip set 310 may be connected to the first lead 510 by a bonding wire, so that the second lead 520 and the second lead A lead 510 is further connected to the first electrode contact piece 210 and the second electrode contact piece 220 through the bonding wire 40. It is understandable that the first lead 510 and the second lead 520 can be understood as a piece of wire or a transfer terminal, so as to realize a more reliable and convenient parallel connection of each first chip set 310, and further pass through the first lead 510 and the second lead 520 are connected to the first electrode contact 210 and the second electrode contact 220, thereby avoiding the risk of crossover or disconnection of the welding wires due to the existence of the matching welding wire 40 being too long, and eventually leading to The corresponding circuit is broken, causing the corresponding LED filament to malfunction and fail to light up.

Optionally, each chip in the chip set 30 is firstly arranged in parallel with each other and arranged on the circuit support 10 at equal intervals, so as to further set the series-parallel relationship of each chip as required to complete the corresponding wire bonding process. Wherein, the positive and second ends of each chip in the chipset 30 respectively face the same direction, and the first end thereof faces the direction of the first electrode contact 210, and the second end faces the direction of the second electrode contact 220. The direction is arranged horizontally to reduce the difficulty of completing the corresponding welding line.

Different from the situation in the prior art, the LED filament in the present invention includes: a circuit holder; an electrode contact piece, the electrode contact piece includes a first electrode contact piece and a second electrode contact piece, and the first electrode contact piece and the second electrode contact piece Are respectively arranged at both ends of the circuit support; the chip set is arranged on the circuit support, and is connected to the first electrode contact piece and the second electrode contact piece through a bonding wire, wherein the chip set includes at least two mutual series or mutual Parallel first chipset, the first chipset includes chips. Through the above method, the LED filament of the present invention can realize different low-voltage drive by setting a set number of chips into different series, parallel and parallel structures, so that it can be applied to different power sources and make it possible. The scope of application is broader.

Please refer to FIG. 2, which is a schematic structural diagram of a second embodiment of the present invention. It is understandable that the difference between the LED filament in this embodiment and the LED filament in the first embodiment of the present invention in FIG. 1 is that the number of chips included in the first chip set 310 is one.

Wherein, the chipset 30 includes three first chipsets 310 connected in parallel, and each of the first chipsets 310 only includes one chip, that is, each chip included in the chipset 30 is connected in parallel with each other. At this time, the voltage of the matched driving power supply is 3V, and in other embodiments, the first chipset 310 included in the chipset 30, that is, the total number of chips included may also be other numbers, and Each of the first chipset 310, that is, the chips are connected in parallel with each other, and the voltage of the driving power supply matched with it at this time is still 3V, which is not limited by the present invention.

Please refer to FIG. 3, which is a schematic structural diagram of a third embodiment of the present invention. It is understandable that the difference between the LED filament in this embodiment and the LED filament in the first embodiment of the present invention in FIG. 1 is that the number of chips included in the first chip set 310 is four.

Wherein, the chipset 30 includes two first chipsets 310 connected in parallel, and each first chipset 310 further includes four

chips

3110, 3120, 3130, and 3140 connected in series. At this time, The voltage of the matched driving power supply is 12V.

It is understandable that, in this embodiment, the voltage of the driving power supply corresponding to the chip group 30 in the LED filament is matched with the number of chips connected in series in each first chip group 310 included in the LED filament. The number of at least two first chip groups 310 connected in parallel in the chipset 30 does not affect the voltage of the corresponding driving power supply. It can be seen from this that, when in other embodiments, the first chipset 310 in parallel with each other included in the chipset 30 may also be another number, but if the first chipset 310 includes 4 chips in series with each other. At this time, the voltage of the matched driving power supply is still 12V, which is not limited by the present invention.

Wherein, when the number of chips connected in series included in the first chipset 310 is n (n is a positive integer greater than 1), correspondingly, the voltage of the driving power supply matched with it is 3 nV. For example, when the number of the first chipset 310 connected in parallel with each other included in the chipset 30 is 2, and the number of chips connected in series included in the first chipset 310 is 12, the voltage of the corresponding driving power supply is 36V; and When the number of the first chipset 310 connected in parallel in the chipset 30 is 4, and the number of chips connected in series in the first chipset 310 is 5, the voltage of the corresponding driving power supply is 15V. It can be seen that it can be matched with different power supply voltages by setting the number of serially connected chips included in each first chip group 310 in parallel with each other in the chipset 30, so that it can only be set by adjusting the LED filament. The series-parallel relationship between the number of chips is matched to different driving voltages, so that it can be applied to different power supply drives, and it can be applied in a wider range.

Among them, the achievable driving voltage of the chipset 30 is determined by the upper limit of the number of chips that can be accommodated on the circuit support 10 and the corresponding series-parallel relationship of each chip. The achievable driving voltage range can be 3V- 150V, in order to be able to apply the driving power scheme covering low and high voltage, and the low voltage part of it can also be driven by a battery, and there is no need to change the process of the conventional die-bonding wire, so that its production yield and efficiency are higher.

Please refer to FIG. 4, which is a schematic structural diagram of a fourth embodiment of the present invention. It is understandable that the difference between the LED filament in this embodiment and the LED filament in the first embodiment of the present invention in FIG. 1 is that the LED filament further includes a first resistor 610 and a second resistor 620, as well as a first high-voltage chip 710 and a second resistor. Two high-voltage chips 720.

Wherein, the first resistor 610 and the second resistor 620, as well as the first high voltage chip 710 and the second high voltage chip 720 are respectively arranged on the circuit support 10 at positions close to the first electrode contact piece 210 and the second electrode contact piece 220.

Wherein, the first resistor 610 and the second resistor 620 are respectively connected in series to the first lead 510 and the second lead 520, and are further connected to the first high voltage chip 710 and the second high voltage chip 720, respectively, and connect the first lead 510 and the second lead The second lead 520 is divided into 4 parts to separate the part connected to the chip of the first lead 510 and the second lead 520 from the part connected to the first high-voltage chip 710 and the second high-voltage chip 720, and the first high-voltage chip 710 And the second high voltage chip 720 is connected to the first electrode contact 210 and the second electrode contact 220, respectively.

It is understandable that, in this embodiment, by connecting the chip set 30 to the first electrode contact piece 210 and the second electrode contact piece 220 respectively in series, a high-voltage chip capable of reverse withstand voltage and a working voltage and a corresponding high-voltage chip are connected in series. The resistance method can play the role of steady current and voltage stabilization during the forward conduction and reverse cut-off of the chipset 30, so as to effectively avoid the possible failure of the LED filament during overcurrent and overvoltage, so that the performance of the LED filament is improved. perfect.

Please refer to FIG. 5, which is a schematic structural diagram of a fifth embodiment of the present invention. It is understandable that the difference between the LED filament in this embodiment and the LED filament in the first embodiment of the present invention in FIG. 1 is that the chip set 30 includes a first chip set 310, and the first chip set 310 further includes Five

chips

3110, 3120, 3130, 3140, and 3150 are connected in parallel with each other, and the LED filament does not include the first lead 510 and the second lead 520.

Among them, the chip 3110, the chip 3120, the chip 3130, the chip 3140, and the chip 3150 are connected to the first electrode contact piece 210 and the second electrode contact piece 220 after being connected in parallel with each other. The voltage of is 3V, and in other embodiments, the number of parallel-connected chips included in the first chipset 310 may also have other values, which is not limited in the present invention.

Wherein, each chip in the chip set 310 is parallel to each other, and the positive electrode faces one side of the circuit support 10, and the negative electrode faces the other side of the circuit support 10, and is arranged on the circuit support 10 at equal intervals.

Please refer to FIG. 6, which is a schematic structural diagram of a sixth embodiment of the present invention. It is understandable that the difference between the LED filament in this embodiment and the LED filament in the fifth embodiment of the present invention in FIG. 5 is that the chip set 30 includes two first chip sets 310 connected in series, and each first chip The group 310 further includes three parallel-connected

chips

3110, 3120, and 3130.

Among them, the two first chip sets 310 included in the chipset 30 are connected to the first electrode contact piece 210 and the second electrode contact piece 220 after being connected in series with each other to connect an external low-voltage power supply, and at this time, they are matched with each other. The voltage of the driving power supply is 6V.

It is understandable that, in this embodiment, the voltage value of the driving power supply corresponding to the chip set 30 in the LED filament is determined by the number of the first chip set 310 connected in series with each other, and the first chip set 30 The number of the included at least two chips connected in parallel does not affect the voltage of the corresponding driving power supply. It can be seen from this that, in other embodiments, the first chipset 310 may include other numbers of chips connected in parallel, but the corresponding driving power supply voltage is still not 6V, which is not limited in the present invention.

Wherein, when the number of the first chip group 310 connected in series in the chip group 30 is m (m is a positive integer greater than 1), correspondingly, the voltage of the driving power supply matched with it is 3 mV. For example, when the number of the first chipset 310 connected in series with each other included in the chipset 30 is 11, and the number of chips connected in parallel with each other included in the first chipset 310 is 2, the voltage of the corresponding driving power supply is 33V; When the number of the first chip group 310 connected in series with each other included in the group 30 is 8 and the number of the first chip group 310 connected in parallel with each other is 3, the voltage of the corresponding driving power supply is 24V. It can be seen that matching with different power supply voltages can be achieved by setting the number of first chip sets 310 in series with each other in the chip set 30, and the chips included in each first chip set 310 are connected in parallel, so that only through Adjust the series-parallel relationship between the set number of chips in the LED filament to match different driving voltages, so that it can be applied to different power drivers, and it can be applied to a wider range without modification The corresponding welding wire fixture can realize a variety of low-voltage solutions, so as to significantly improve the brightness of the LED filament and achieve lower cost.

Based on the general inventive concept, the present invention also provides a lighting device, wherein the lighting device includes the LED filament as described above.

Different from the situation in the prior art, the LED filament in the present invention includes: a circuit holder; an electrode contact piece, the electrode contact piece includes a first electrode contact piece and a second electrode contact piece, and the first electrode contact piece and the second electrode contact piece Are respectively arranged at both ends of the circuit support; the chip set is arranged on the circuit support, and is connected to the first electrode contact piece and the second electrode contact piece through a bonding wire, wherein the chip set includes at least two mutual series or mutual The first chipset connected in parallel, the first chipset includes at least one chip. Through the above method, the LED filament of the present invention can realize different low-voltage drive by setting a set number of chips into different series, parallel and parallel structures, so that it can be applied to different power sources and make it possible. The scope of application is broader.

The above are only the embodiments of the present invention, and do not limit the scope of the present invention. Any equivalent structure or equivalent principle transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related technologies In the same way, all fields are included in the scope of patent protection of the present invention.

Claims

An LED filament, characterized in that the LED filament comprises:

Line support

An electrode contact piece, the electrode contact piece includes a first electrode contact piece and a second electrode contact piece, the first electrode contact piece and the second electrode contact piece are respectively arranged at both ends of the circuit support;

A chip set, the chip set is arranged on the circuit support, and connected to the first electrode contact piece and the second electrode contact piece through a bonding wire, wherein the chip set includes at least two or A first chipset connected in parallel, and the first chipset includes at least one chip.
The LED filament of claim 1, wherein:

A first lead and a second lead that are parallel to each other are provided on both sides of the circuit support;

Wherein, the chipset includes at least two first chipsets connected in parallel with each other, the first end of the first chipset is connected to the first lead through the bonding wire, and the The second end is connected to the second lead through the bonding wire, and the first and second leads are respectively connected to the first electrode contact piece and the second electrode contact piece through the bonding wire .
The LED filament of claim 2, wherein:

The first chipset includes at least two of the chips connected in series.
The LED filament of claim 3, wherein:

A plurality of the chips in the chip set are all parallel to each other, and the first end faces the direction of the first electrode contact, and the second end faces the direction of the second electrode contact, and are arranged at equal intervals in the On the line support.
The LED filament of claim 2, wherein:

A first resistor and a second resistor, and a first high-voltage chip and a second high-voltage chip are respectively provided on the circuit support at positions close to the first electrode contact piece and the second electrode contact piece;

Wherein, the first resistor and the second resistor are respectively connected in series to the first lead and the second lead, and are respectively connected to the first high-voltage chip and the second high-voltage chip, and the first A high-voltage chip and the second high-voltage chip are respectively connected to the first electrode contact piece and the second electrode contact piece.
The LED filament of claim 1, wherein:

The chip set includes at least two first chip sets connected in parallel with each other, the first chip set includes one chip, and the first end of each chip is connected to the first electrode contact by the soldering ; The second end of each of the chips is connected to the second electrode contact by a bonding wire.
The LED filament of claim 1, wherein:

The chipset includes at least two of the first chipset connected in series, the first chipset includes at least two of the chips connected in parallel, and the first chip group is close to the first electrode contact piece The first end of the chip set is connected to the first electrode contact through the bonding wire, and the second end of the first chip set close to the second electrode contact is connected to the second electrode through the bonding wire Contact piece.
The LED filament according to claim 6 or 7, characterized in that:

The multiple chips in the chipset are all parallel to each other, and the first end faces one side of the circuit support, and the second end faces the other side of the circuit support, and are arranged at equal intervals. The line support.
The LED filament of claim 1, wherein:

The circuit support is a ceramic circuit support or a glass circuit support.
An LED filament, characterized in that the LED filament comprises:

Line support

An electrode contact piece, the electrode contact piece includes a first electrode contact piece and a second electrode contact piece, the first electrode contact piece and the second electrode contact piece are respectively arranged at both ends of the circuit support;

A chip set, the chip set is arranged on the circuit support and connected to the first electrode contact piece and the second electrode contact piece through a bonding wire;

A first lead and a second lead that are parallel to each other are provided on both sides of the circuit support;

The chipset includes at least two first chipsets connected in parallel with each other, the first end of the first chipset is connected to the first lead by the bonding wire, and the second end of the first chipset The terminal is connected to the second lead through the bonding wire, and the first and second leads are respectively connected to the first electrode contact piece and the second electrode contact piece through the bonding wire;

The plurality of chips in the first chip set are all parallel to each other, and the first end faces the direction of the first electrode contact, and the second end faces the direction of the second electrode contact, and are arranged at equal intervals. The line support.
A lighting device, characterized in that the lighting device comprises the LED filament according to any one of claims 1-9.