WO2021103847A1

WO2021103847A1 - Surface-mount nut, circuit board assembly, and electronic device

Info

Publication number: WO2021103847A1
Application number: PCT/CN2020/121757
Authority: WO
Inventors: 史洪宾; 陈曦; 鄢邦松; 易源; 王海涛
Original assignee: 华为技术有限公司
Priority date: 2019-11-25
Filing date: 2020-10-19
Publication date: 2021-06-03
Also published as: CN212509158U

Abstract

A surface-mount nut (20), a circuit board assembly (10), and an electronic device. A blocking portion (30) is provided at an opening (24) of an internal threaded hole (21) at a second end (23) of the surface-mount nut (20), and blocks at least a portion of the opening (24), such that a soldering surface at a bottom end of the surface-mount nut (20) is provided with an added portion corresponding to the blocking portion (30), thus increasing the area of soldering, and improving the connection reliability of the surface-mount nut (20). The blocking portion (30) can prevent soldering from spreading upwards into the internal threaded hole (21) of the surface-mount nut (20) and causing improper installation of a screw. In an assembly scenario in which a tail portion of a screw may interfere with the circuit board due to misuse of a long screw or inadvertent omission of a support frame, the blocking portion (30) abuts the tail portion of the long screw, thus facilitating identification of an incorrect operation such as using a long screw or omitting a support frame by mistake.

Description

SMD nut, circuit board assembly and electronic equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201922052463.3, and the application name is "SMD nut, circuit board assembly and electronic equipment" on November 25, 2019, the entire content of which is incorporated by reference In this application.

Technical field

This application relates to the technical field of terminals, and in particular to a patch nut, circuit board assembly and electronic equipment.

Background technique

With the development of electronic technology, the assembly density of integrated circuit boards is getting higher and higher. In the board-level high-density layout scenario, many times the bottom surface of the circuit board (Bottom) needs to be screwed, and the top surface (Top) needs to be laid out with other devices or For structural parts, it is impossible to realize the screw through-board structure. In this case, it is generally considered to adopt a patch nut design to solve the problem, so as to maximize the utilization rate of the single board area.

As shown in FIGS. 1, 2, and 3, the existing patch nut structure includes a patch nut body 70. The patch nut body 70 is provided with an internal threaded hole 71, and the internal threaded hole 71 penetrates the patch nut body 70. The patch nut is generally reflow soldered to the circuit board 72 through Surface Mount Technology (SMT). The shape of the pad on the circuit board corresponds to the structure of the lower end of the patch nut body 70, which is a ring-shaped racetrack structure. .

However, the welding surface at the bottom end of the existing SMD nut has a circular racetrack structure. On the one hand, the welding area is small, and the SMD nut is prone to fall off and fail due to the drop of the whole machine or other external impact forces; on the other hand, the solder is easy to climb up. To the internal thread, the screw cannot be assembled in place; in addition, in the screw assembly scene, it is easy to install the long screw by mistake or miss the bracket to cause the screw tail to directly abut on the circuit board, causing the circuit board to break.

Utility model content

The embodiments of the present application provide a patch nut, a circuit board assembly, and an electronic device. By setting the patch nut in a non-penetrating or partially penetrating structure, the area of the welding surface at the bottom end of the patch nut is increased, and the impact force and the circuit The effective area of the plate increases, and the impact force per unit area on the bottom of the nut decreases. In the case of the whole machine falling or being subjected to external impact, the failure of the patch nut is reduced, and the connection reliability of the patch nut is enhanced. ; At the same time, the non-penetrating or partially penetrating structure of the SMD nut can block or extend the soldering path from the solder to the internal thread, which can avoid the problem of improper screw assembly caused by the solder climbing the internal threaded hole of the SMD nut; in addition, misuse Long screws or missing brackets cause the screw tail to interfere with the assembly scene of the circuit board. The shielding part can abut the tail of the long screw. By identifying the height of the screw, the wrong long screw can be identified.

The first aspect of the embodiments of the present application provides a chip nut, the chip nut is provided with an internal threaded hole, the chip nut has a first end and a second end, and the second end is used for the chip to the circuit board, the internal threaded hole Extending from the end surface of the first end to the end surface of the second end, the orifice of the internal threaded hole at the second end is provided with a shielding portion, and the shielding portion is used to shield at least a part of the area of the orifice.

The second end of the internally threaded hole is provided with a shielding portion, and the shielding portion shields at least part of the orifice. Therefore, the welding surface of the bottom end of the chip nut and the corresponding solder are increased compared with the prior art. The part corresponding to the shielding part is removed, so the welding area becomes larger, the impact force generated by the whole machine falling is transmitted to the circuit board through the bottom surface of the chip nut, the impact force and the circuit board are increased, and the impact per unit area of the bottom surface of the nut Therefore, in the case of a drop of the whole machine, the fall-off failure of the patch nut is reduced, and the connection reliability of the patch nut is enhanced; in addition, compared with the prior art, the shielding part blocks or extends the solder to The crawling path of the internal thread of the chip nut can avoid the problem of screw assembly caused by the solder climbing the internal threaded hole of the chip nut; in addition, the wrong use of long screws or missing brackets causes the screw tail to interfere with the assembly scene of the circuit board. Compared with the prior art, the shielding part can abut against the tail of the long screw, and by identifying the height of the screw, the wrong long screw can be identified.

In a possible implementation manner, the shielding portion completely shields the aperture, and the surface of the shielding portion facing away from the first end is flush with the end surface of the second end.

By completely shielding the hole of the internal threaded hole at the second end, and the shielding part is flush with the end surface of the second end, the welding area can be maximized without changing the outer contour shape of the chip nut, so that the chip The anti-dropping effect of the nut is the best. It can also prevent the solder from entering the internal threaded hole of the chip nut, and avoid affecting the fit of the screw and the internal thread. It can also prevent hard interference between the screws and the circuit board caused by the wrong screws, which may cause delamination of the circuit board or breakage of internal wiring.

In a possible implementation manner, the shielding portion has a first opening, and in the projection of the patch nut toward the circuit board, the projection of the edge of the first opening is located within the projection of the edge of the internal threaded hole.

This arrangement, on the one hand, increases the soldering area of the bottom end of the chip nut, on the other hand, the screw is blocked by the shielding part, which can avoid the hard interference between the screw and the circuit board caused by the wrong screw installation, resulting in delamination or internal circuit board. Broken wiring.

In a possible implementation manner, the shielding portion and the patch nut are formed integrally or separately.

The shielding part and the patch nut are integrally formed, and the reliability of the connection between the shielding part and the patch nut is high, the two are not easily separated, and they are easy to process. The shielding part and the patch nut are formed separately. For the patch nut that is already a finished product, the original patch nut can be upgraded to the highly reliable patch of the application by simply adding the shielding part. Nuts, the modification process is also easier.

In a possible implementation manner, the outer side wall of the second end of the patch nut is an oblique side wall, and the oblique side wall is inclined toward the center line of the patch nut.

By arranging the outer side wall of the second end of the chip nut with a sloped side wall, it is convenient for the solder to climb along the sloped side wall to the surface of the sloped side wall, which can increase the contact area between the chip nut and the solder, making it difficult for the mounting nut to escape from the circuit. The board falls off.

In a possible implementation, the outer side wall of the second end of the patch nut is perpendicular to the end surface of the second end.

This arrangement can make the chip nut easy to process.

In a possible implementation, a recess is provided on the outer side wall of the second end of the patch nut, or,

A recess is provided on the end surface of the second end of the patch nut, or,

The outer side wall of the second end of the patch nut is provided with a recess, and the end surface of the second end of the patch nut is provided with a recess.

By providing a recess on the end surface of the second end of the chip nut, the contact area between the chip nut and the solder is increased, the shear/stretch resistance of the chip nut solder joint is improved, and the risk of the chip nut falling off can be reduced ; The outer side wall of the second end is provided with a recessed portion, and the outer side wall of the second end is provided with a recessed portion and the end surface of the second end is provided with a recessed portion. The effects of these two technical solutions are similar, and both can increase the patch nut The contact area with the solder improves the shear/stretch resistance of the solder joints of the SMD nut, which can reduce the risk of falling off the SMD nut.

In a possible implementation manner, the inner wall of the recessed portion is a curved surface, or the inner wall of the recessed portion is formed by connecting at least two inner surfaces.

The inner wall of the recess is curved, which makes it easier for solder to enter the recess. When the inner wall of the recessed portion is formed by connecting at least two inner surfaces, the processing of the recessed portion is facilitated.

In a possible implementation, the recess is an annular groove, and the annular groove is arranged around the center line of the patch nut.

By setting the depressed part as a ring-shaped groove, the solder in the depressed part is formed as a whole. The distribution of the depressed part is more uniform in the entire circumferential range around the center line, which is beneficial to the uniform force of the solder in the depressed part, so that The patch nut has a better anti-dropping effect.

In a possible implementation manner, the concave portion includes at least two annular grooves, and the at least two annular grooves are arranged at intervals.

By providing a plurality of annular grooves, the anti-dropping effect of the solder in the recessed portion on the chip nut can be enhanced.

In a possible implementation, the recess includes a plurality of dot-shaped grooves arranged at intervals.

If a plurality of dot grooves are arranged at intervals, the solder in the dot grooves has an anchoring effect on the entire solder, which can effectively prevent the solder from falling off the chip nut.

In a possible implementation manner, the inner threaded hole is provided with an enlarged diameter portion near the inner wall of the shielding portion, and the inner diameter of the enlarged diameter portion is larger than the inner diameter of the inner threaded hole.

This is equivalent to forming a sinker structure inside the internal thread, so that when the solder at the bottom of the chip nut wants to enter the internal threaded hole along the internal threaded hole close to the second end of the hole, the enlarged diameter part provides a tin holding space for the solder , It can reduce the risk of the screw and the patch nut not being locked in place by the solder climbing up to the thread.

In a possible implementation manner, the outer side wall of the second end of the patch nut protrudes outward to form a boss structure.

This can increase the soldering area between the bottom of the chip nut and the circuit board.

The second aspect of the embodiments of the present application provides a circuit board assembly, which is applied to electronic equipment, and includes a circuit board and the above-mentioned patch nut; the circuit board is provided with a pad, and the pad is connected to the end surface of the second end of the patch nut .

Since the hole at the second end of the internally threaded hole is provided with a shielding portion, and the shielding portion shields at least a part of the hole, the welding surface of the bottom end of the chip nut and the corresponding solder increase the part corresponding to the shielding portion, Therefore, the welding area becomes larger. In the case of the whole machine falling or being subjected to external impact, the area of impact force and the circuit board will increase, and the impact force per unit area on the bottom of the nut will decrease, reducing the failure of the chip nut. Enhance the connection reliability of the SMD nut; at the same time, the shielding part of the SMD nut can block or extend the solder climbing path to the internal thread, which can prevent the solder from climbing up the internal threaded hole of the SMD nut to cause the screw assembly problem; in addition; , In the assembly scene where the wrong use of long screws or missing brackets causes the screw tail to interfere with the circuit board, the shielding part can abut the long screw tail, and the wrong long screw can be identified by identifying the height of the screw.

The third aspect of the embodiments of the present application provides an electronic device, which at least includes a display screen, a middle frame, a back cover, and the above-mentioned circuit board assembly. The display screen and the back cover are respectively located on both sides of the middle frame, and the circuit board assembly is located on the display screen and the back cover. In the cavity enclosed by the middle frame, or the circuit board assembly is located in the cavity enclosed by the back cover and the middle frame.

The above-mentioned electronic equipment includes the above-mentioned circuit board assembly, thereby increasing the soldering area of the chip nut and the circuit board, increasing the force area of the whole machine drop or other external impact on the circuit board, and reducing the unit of the bottom surface of the nut. The impact force on the area can reduce the risk of chip nut falling off and enhance the connection reliability of the chip nut; at the same time, the cover part of the chip nut can block or extend the creeping path of the solder to the internal thread, which can prevent the solder from climbing up. The internal threaded hole of the chip nut leads to the problem of improper assembly of the screw; in addition, the wrong use of long screws or missing brackets causes the screw tail to interfere with the assembly scene of the circuit board. The shielding part can abut the tail of the long screw, and the screw is raised by identifying the height of the screw. , Can identify the wrong use of long screws.

Description of the drawings

FIG. 1 is a schematic diagram of a three-dimensional structure of a prior art patch nut applied to a circuit board;

Fig. 2 is a schematic cross-sectional structure diagram of a prior art patch nut applied to a circuit board;

Figure 3 is a schematic top view of a prior art patch nut;

4 is a schematic diagram of a three-dimensional structure of an electronic device provided by an embodiment of the application;

FIG. 5 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the application;

6 is a schematic diagram of the structure of the circuit board assembly of the electronic device installed on the middle frame according to an embodiment of the application;

FIG. 7 is a schematic structural diagram of a circuit board assembly of an electronic device provided by an embodiment of the application;

8 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device provided by an embodiment of the application;

9 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 10 is a schematic diagram of a principle for preventing screws from being installed incorrectly in a circuit board assembly of an electronic device according to an embodiment of the application; FIG.

11 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device provided by an embodiment of the application;

12 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 13 is a schematic diagram of a principle of preventing screws from being installed incorrectly in a circuit board assembly of an electronic device according to an embodiment of the application;

14 is a cross-sectional view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application;

15 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

16 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 17 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device according to an embodiment of the application;

17A is a bottom view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application;

FIG. 17B is a perspective view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application; FIG.

18 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

19 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device provided by an embodiment of the application;

19A is a bottom view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application;

19B is a perspective view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application;

20 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

21 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device provided by an embodiment of the application;

22 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 23 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 23A is a bottom view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application; FIG.

FIG. 23B is a top view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application; FIG.

FIG. 23C is a perspective view of a patch nut in a circuit board assembly of an electronic device provided by an embodiment of the application; FIG.

24 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

25 is a cross-sectional view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application;

25A is a bottom view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application;

25B is a top view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application;

25C is a perspective view of the patch nut in the circuit board assembly of the electronic device provided by an embodiment of the application;

FIG. 26 is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 27 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device according to an embodiment of the application;

27A is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

28 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device provided by an embodiment of the application;

28A is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 29 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device according to an embodiment of the application;

29A is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 30 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device according to an embodiment of the application;

30A is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 31 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 31A is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

32 is a cross-sectional view of a patch nut in a circuit board assembly of an electronic device provided by an embodiment of the application;

32A is a partial cross-sectional view of a circuit board assembly of an electronic device according to an embodiment of the application;

33A is a stress simulation diagram of various parts of a chip nut in a circuit board assembly of an electronic device in the prior art when subjected to shear stress;

FIG. 33B is a stress simulation diagram of various parts of a chip nut in a circuit board assembly of an electronic device in the prior art when subjected to tensile stress; FIG.

34A is a stress simulation diagram of each part of the chip nut in the circuit board assembly of the electronic device provided in scenario 1 when subjected to shear stress;

FIG. 34B is a stress simulation diagram of each part of the chip nut in the circuit board assembly of the electronic device provided in scenario 1 when subjected to tensile stress;

35A is a stress simulation diagram of each part of the chip nut in the circuit board assembly of the electronic device provided in scenario 2 when subjected to shear stress;

35B is a stress simulation diagram of each part of the chip nut in the circuit board assembly of the electronic device provided in the second scenario when tensile stress is applied;

36A is a comparison diagram of the maximum shear stress on the patch nut in the circuit board assembly of the electronic device provided in the prior art and the scenario one and the scenario two;

FIG. 36B is a comparison diagram of the proportion of the area where the shear stress on the patch nut exceeds 10 MPa in the circuit board assembly of the electronic device provided in the scene 1 and the scene 2 in the prior art;

36C is a comparison diagram of the maximum tensile stress on the patch nut in the circuit board assembly of the electronic device provided in the prior art and the scenario one and the scenario two;

FIG. 36D is a comparison diagram of the proportion of the area where the tensile stress on the patch nut exceeds 10 MPa in the circuit board assembly of the electronic device provided in the scene 1 and the scene 2 in the prior art.

Description of reference signs:

100-mobile phone; 10-circuit board assembly; 11, 72-circuit board; 20- patch nut; 21, 71- internal threaded hole; 22- first end; 23- second end; 24- orifice; 25, 73-Solder; 26-Long screw; 27-Protection bracket; 28-Boss structure; 29-Slanted side wall; 30-Shadow part; 31-First opening; 40-Annular groove; 41-Point groove ; 50- Enlarged diameter part; 70- Nut body; 81- Display screen; 82- Rear cover; 83- Middle frame; 85- Battery; 86- Sound device; 87- Metal middle plate; 88- Top frame; 89- Bottom Border; 90-left border; 91-right border.

Detailed ways

The terminology used in the implementation mode part of this application is only used to explain the specific embodiments of the application, and is not intended to limit the application. The implementation manners of the embodiments of the application will be described in detail below with reference to the accompanying drawings.

The embodiments of this application provide an electronic device, including but not limited to mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (UMPC), handheld computers, walkie-talkies, netbooks, POS machines, and personal digital assistants Mobile or fixed terminals such as personal digital assistant (PDA), driving recorder, wearable device, or virtual reality device.

In the embodiment of the present application, the mobile phone 100 is taken as the above electronic device as an example for description. FIGS. 4 and 5 respectively show the overall structure and the split structure of the mobile phone 100. As shown in FIG. 5, the mobile phone 100 may include: a display screen 81 and the back cover 82, between the display screen 81 and the back cover 82, a middle frame 83, a circuit board assembly 10, a battery 85 and a sounding device 86 can be arranged. Among them, the circuit board assembly 10, the battery 85 and the sound emitting device 86 can be arranged on the middle frame 83. For example, the circuit board assembly 10, the battery 85 and the sound emitting device 86 are arranged on the side of the middle frame 83 facing the back cover 82, and are located on the back cover. 82 and the middle frame 83; or the circuit board assembly 10, the battery 85 and the sound emitting device 86 can be arranged on the side of the middle frame 83 facing the display screen 81, in the cavity enclosed by the display screen 81 and the middle frame 83 In the body.

In the embodiment of the present application, when the battery 85 is arranged on the middle frame 83, for example, a battery compartment can be arranged on the side of the middle frame 83 facing the rear cover 82, and the battery 85 is installed in the battery compartment on the middle frame 83 (as shown in Figure 5). Shown in the dashed box). In the embodiment of the present application, the battery 85 can be connected to the charging management module and the circuit board assembly 10 through the power management module. The power management module receives input from the battery 85 and/or the charging management module, and is a processor, internal memory, external memory, The display screen 81, the camera, the communication module, etc. supply power. The power management module can also be used to monitor battery capacity, battery cycle times, battery health status (leakage, impedance) and other parameters. In some other embodiments, the power management module may also be provided in the processor of the circuit board assembly 10. In other embodiments, the power management module and the charging management module may also be provided in the same device.

In order to realize the external playback function of the mobile phone 100, as shown in FIG. 5, the mobile phone 100 may further include: a sound generating device 86, which can convert an audio electric signal into a sound signal, and the mobile phone 100 can play music through the sound generating device 86, or realize Handsfree. The sound generating device 86 may be provided on the side of the middle frame 83 facing the rear cover 82. In the embodiment of the present application, a microphone (not shown), that is, a microphone, is also provided in the mobile phone 100. The microphone is used to convert sound signals into electrical signals. When making a call or sending voice information, the user can use the mouth to approach the microphone to make a sound. To input the sound signal to the microphone.

In the embodiment of the present application, the display screen 81 may be an organic light-emitting diode (OLED) display or a liquid crystal display (LCD). It should be understood that the display screen 81 may include a display and a touch control device, the display is used to output display content to the user, and the touch control device is used to receive a touch event input by the user on the display screen 81.

In the embodiment of the present application, the back cover 82 may be a metal cover, a glass cover, a plastic cover, or a ceramic cover. In the embodiment of the present application, the material of the back cover 82 is not limited.

In the embodiment of the present application, as shown in FIG. 5, the middle frame 83 may include a metal middle plate 87 and a frame. The frame is arranged one week along the outer circumference of the metal middle plate 87. For example, the frame may include a top frame 88 and a bottom frame that are arranged oppositely. 89, and a left frame 90 and a right frame 91 located between the top frame 88 and the bottom frame 89 and opposite to each other. Wherein, the connection between each frame and the metal middle plate 87 includes, but is not limited to, welding, clamping, and integral injection molding.

The material of the metal middle plate 87 may be aluminum or aluminum alloy, or the material of the metal middle plate 87 may be stainless steel. It should be noted that the material of the metal middle plate 87 includes but is not limited to the above-mentioned materials.

Among them, each frame (top frame 88, bottom frame 89, left frame 90, and right frame 91) can be a metal frame, a glass frame, or a plastic frame or a ceramic frame.

In order to show the structure of the circuit board assembly 10 mounted on the middle frame 83 more clearly, as shown in FIG. 6, the circuit board assembly 10 and the battery 85 are sequentially arranged on the metal middle plate 87. Of course, in FIG. 6, a case where the circuit board assembly 10 is located above the battery 85 is taken as an example for description. The circuit board assembly 10 may also be located at a position below, on the left side, or on the right side of the battery 85.

It should be noted that in some other examples, the mobile phone 100 may include a display screen 81 and a back cover. The back cover may be the back cover 82 and the frame in FIG. 5 (ie, the top frame 88, the bottom frame 89, the left frame 90 and A back cover formed by a unibody formed by a frame composed of a right frame 91). The circuit board assembly 10 and the battery 85 are located in a cavity enclosed by the display screen 81 and the back cover.

It is understandable that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the mobile phone 100. In other embodiments of the present application, the mobile phone 100 may include more or fewer components than those shown in the figure, or combine certain components, or split certain components, or arrange different components. For example, the mobile phone 100 may also include a camera (such as a front camera and a rear camera) and a flashlight.

The structure of the mobile phone 100 is described below by taking the structure of the mobile phone 100 as described above as an example.

In this application, referring to FIG. 7, the circuit board assembly 10 may include a circuit board 11. Circuit boards are classified according to their structures, and can be divided into rigid printed circuit boards (Printed Circuit Board, PCB), flexible printed circuit boards (Flexible Printed Circuit board, FPC), and rigid-flex printed circuit boards. The circuit board 11 in this application can adopt any of the above-mentioned circuit boards.

It is understandable that a plurality of electronic components are soldered on the circuit board 11. In order to protect these electronic components, a protective bracket (not shown) is generally covered above the circuit board; in some other examples, the circuit board 11 A connection port (not shown) is also provided for connecting with an external plug-in lead. The protective bracket can also press the port of the external plug-in lead on the connection port to prevent the external plug-in lead from loosening. The protective bracket can generally be fixed to the circuit board 11 through a patch nut 20. Illustratively, the patch nut can be reflow soldered to the corresponding pad of the circuit board through Surface Mount Technology (SMT). The protective bracket is fixed to the patch nut 20 by screws, so that the protective bracket is arranged above the circuit board 11.

In the prior art, when the electronic device is dropped or subjected to an impact, or after a drop or drum reliability test, the through-type SMD nut has a small welding surface area for welding, and the SMD nut is self-contained from the circuit. The risk of the board falling off is greater, which will cause the protective bracket to loosen and the reliability of the electronic device will deteriorate. However, the present application can enhance the reliability of the connection between the patch nut 20 and the circuit board without changing the outer contour size of the patch nut 20, and reduce the risk of the patch nut falling off.

In the embodiment of the present application, referring to Figures 8 and 9, the SMD nut 20 is provided with an internal threaded hole 21, which is used to cooperate with a threaded connection such as a screw, so that the screw can pass through the part to be fixed For example, after the protective bracket is screwed together with the internal threaded hole 21, the protective bracket can be fixed on the circuit board 11. The patch nut 20 includes a first end 22 and a second end 23. For example, the second end 23 can be attached to the circuit board 11. The method of attaching the patch nut 20 to the circuit board 11 can include but is not limited to reflow soldering, such as , It can also be dip soldering and other methods. The patch nut 20 involved in the present application is a through-type patch nut 20. For example, the internally threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23 so as to penetrate the entire thickness of the patch nut 20 direction.

In the example of the present application, in order to increase the soldering area between the bottom of the patch nut 20 and the circuit board 11, part of the solution is to make the outer side wall of the second end 23 of the patch nut 20 protrude outward to form a boss structure 28 as an example. Description.

Of course, in some other examples, the outer side wall of the second end 23 of the patch nut 20 may be perpendicular to the end surface of the second end 23 to make the patch nut 20 easy to process.

In the embodiment of the present application, the orifice 24 of the internally threaded hole 21 at the second end 23 (hereinafter referred to as the orifice 24 for short) is provided with a shielding portion 30 for shielding at least a part of the orifice 24. Blocking at least a part of the orifice 24 as described above has the following advantages.

In the first aspect, compared with the prior art, the welding surface of the second end 23 of the SMD nut 20 increases the part corresponding to the shielding portion 30, so the welding area becomes larger. It is understandable that it corresponds to the welding surface The solder 25 provided correspondingly increases the part corresponding to the shielding portion 30, which increases the contact area between the patch nut 20 and the solder 25, and reduces the risk of the patch nut 20 falling off.

In the second aspect, the hole 24 is provided with a shielding portion 30. When the shielding portion 30 completely shields the hole 24, the solder 25 at the bottom of the chip nut 20 will not enter the internal threaded hole 21, so it will not affect the screw and The threaded fit of the internal threaded hole 21; when the shielding portion 30 partially shields the orifice 24, compared with the prior art in which the orifice 24 is completely opened, at least the size of the opening of the orifice 24 is reduced, and the size of the opening along the orifice is reduced. 24. The amount of solder 25 that crawls into the female threaded hole 21 can reduce the degree of screw lock failure caused by the solder 25 crawling up to the thread.

In the third aspect, when the long screw is screwed into the chip nut 20 by mistake, or the protective bracket on the circuit board 11 is missing, the screw will not be forcibly screwed because it is blocked by the shielding portion 30 It is inserted into the chip nut 20, so there will be no hard interference with the circuit board 11, which can prevent the circuit board 11 from being layered or the internal wiring of the circuit board 11 from being broken.

In the embodiment of the present application, the shielding portion 30 may be integrally formed with the patch nut 20, so that the reliability of the connection between the shielding portion 30 and the patch nut 20 is high, the two are not easily separated, and they are easy to process. In some other examples, the shielding portion 30 and the patch nut 20 are formed separately. For example, for the patch nut 20 that is already a finished product, simply welding the shielding portion 30 at the opening 24 to remove the original Some patch nuts 20 are upgraded to the highly reliable patch nuts 20 of this application, and the modification process is relatively easy and easy to industrialize.

In the embodiment of the present application, the scenarios where the orifice 24 of the patch nut 20 is non-penetrating and partially penetrating are described respectively.

As shown in Figures 8 and 9 is the case where the shielding portion 30 completely shields the orifice 24. The welding area can be maximized without changing the outer contour shape of the patch nut 20 to make the patch nut 20 The best anti-dropping effect is achieved. 10, when the long screw 26 is screwed into the patch nut 20 by mistake, for example, the long screw 26 is blocked by the blocking portion 30 and cannot be screwed in further, so the height of the long screw 26 is obvious Higher than the protective bracket 27, a detectable floating height H will be generated. Therefore, there is no long screw 26 forcibly screwing into the patch nut 20, which may cause hard interference with the circuit board 11, delamination of the circuit board 11, or circuit The internal wiring of the board 11 is broken. The situation of missing the protective bracket 27 on the circuit board 11 is similar to this, and will not be repeated here.

It can be understood that when the shielding portion 30 completely shields the aperture 24, the solder 25 will not enter the internal threaded hole 21, and therefore will not affect the fit of the screw and the patch nut 20.

In the embodiment of the present application, the surface of the shielding portion 30 facing away from the first end 22 is flush with the end surface of the second end 23. It is convenient for the solder 25 to connect the shielding portion 30 and the circuit board 11.

In some other examples, the shielding portion 30 may also partially shield the aperture 24. For example, as shown in Figures 11 and 12, the shielding portion 30 has a first opening 31. In the projection of the chip nut 20 toward the circuit board 11, the projection of the edge of the first opening 31 is located on the projection of the edge of the female threaded hole 21 In this way, even if the shielding portion 30 has an opening, it is also located within the shielding range of the female threaded hole 21. Compared with the fully open hole 24 of the prior art, the welding area of the second end 23 of the patch nut 20 is changed. Large, to increase the contact area between the chip nut 20 and the solder 25 to reduce the risk of the chip nut 20 falling off.

In the above solution, as shown in FIG. 12, even if the solder 25 at the bottom of the chip nut 20 crawls into the female threaded hole 21 along the edge of the first opening 31, this is in contrast to the prior art in which the hole 24 is completely opened. Compared with, at least the crawling path of the solder 25 is increased, and the amount of the solder 25 crawling into the female threaded hole 21 along the orifice 24 is reduced. Therefore, the degree of screw locking caused by the solder 25 climbing up to the thread can be reduced. . As shown in Figure 13, when the long screw 26 is screwed into the patch nut 20 by mistake, the long screw 26 is blocked by the shielding portion 30 and cannot be screwed in further, so the height of the long screw 26 is significantly higher than the protection The bracket 27 produces a detectable floating height H, so there is no screw that is forcibly screwed into the patch nut 20, resulting in hard interference with the circuit board 11, delamination of the circuit board 11, or internal wiring of the circuit board 11 Fracture situation. The situation of missing the protective bracket 27 on the circuit board 11 is similar to this, and will not be repeated here.

Of course, in the embodiment of the present application, the first opening 31 can be realized by drilling holes in the shielding portion 30, or can be formed by other common processing methods in the mechanical field, such as planing and milling. Exemplarily, the diameter of the first opening 31 may be half of the diameter of the internal threaded hole.

In the embodiment of the present application, as shown in FIG. 14 and FIG. 15, in order to increase the reliability of the connection between the patch nut 20 and the circuit board 11, the outer side wall of the second end 23 of the patch nut 20 may be inclined. Exemplarily, the outer side wall of the second end 23 of the patch nut 20 is an oblique side wall 29, and the oblique side wall 29 is inclined toward the center line direction O of the patch nut 20. Taking the patch nut 20 with the boss structure 28 at the second end 23 as an example, the outer side wall of the boss structure 28 is formed as an inclined side wall 29. For example, the entire circumferential outer side wall of the boss structure 28 may form an inclined side wall 29, or part of the outer side wall of the boss structure 28 may form an inclined side wall 29. As shown in FIG. 15, the solder 25 crawls to the inclined side On the surface of the wall 29, compared with the prior art, the solder 25 and the surface of the inclined side wall 29 are also in contact, thereby increasing the contact area between the patch nut 20 and the solder 25, making it difficult for the patch nut 20 to fall off the circuit board 11.

The position where the inclined side wall 29 is formed may include, but is not limited to, on the surface of the above-mentioned boss structure 28. For example, as shown in FIG. 16, the outer side wall of the second end 23 of the patch nut 20 may be directly formed as a slanted side wall. 29.

In the embodiment of the present application, it is also possible that the outer side wall of the second end 23 of the patch nut 20 is provided with a recessed portion, or the end surface of the second end 23 of the patch nut 20 is provided with a recessed portion, or The outer side wall of the second end 23 of the chip nut 20 is provided with a recessed portion, and the end surface of the second end 23 of the patch nut 20 is provided with a recessed portion. By providing a recess on the end surface of the second end 23 of the SMD nut 20, the contact area between the SMD nut 20 and the solder 25 is increased, and the shear/stretch resistance of the solder joints of the SMD nut 20 is improved, which can reduce The risk of the patch nut 20 falling off; the second end 23 is provided with a recess on the outer side wall, and the second end 23 is provided with a recess on the outer side wall, and the second end 23 is provided with a recess on the end surface, these two technologies The effects of the solutions are also similar. Both can increase the contact area between the patch nut 20 and the solder 25, improve the shear/stretch resistance of the solder joint of the patch nut 20, and reduce the risk of the patch nut 20 falling off.

In the embodiment of the present application, the inner wall of the recessed portion is a curved surface, which makes it easier for the solder 25 to enter the recessed portion. Or the inner wall of the recessed portion is formed by connecting at least two inner surfaces, for example, the recessed portion is a square recessed portion or a dovetail-shaped recessed portion, which facilitates the processing of the recessed portion.

It is understandable that the structure and arrangement position of the recessed portion can be various, for example, as shown in FIG. 17, FIG. 17A, FIG. 17B, and FIG. 18, taking the patch nut 20 with the boss structure 28 as an example To illustrate, the recessed portion is an annular groove 40, and the annular groove 40 is arranged around the center line of the patch nut 20. In the case of setting the recessed portion as a continuous annular groove 40, the solder 25 located in the recessed portion is formed as a whole in the circumferential direction. The distribution of the recessed portion is relatively uniform in the entire circumferential range around the center line, which is beneficial to The uniform force of the solder 25 in the recessed portion makes the chip nut 20 have a better anti-dropping effect. In some other examples, the recessed portion may be an intermittent annular groove, that is, although the recessed portion is not continuous, the whole is roughly formed as an annular groove. The purpose of this arrangement is also to facilitate the circumferential range around the centerline. , As far as possible to make the distribution of the solder 25 more uniform, which is beneficial to the uniform force of the solder 25. When the chip nut 20 shown in FIG. 18 is mounted on the circuit board 11, the solder 25 not only enters the annular groove 40 on the end surface of the second end 23 of the chip nut 20, but also runs along the boss The outer side wall of the structure 28 crawls and enters into the annular groove 40 on the outer side wall. As a result, the entire edge of the solder 25 is formed into a mesh structure, so that the chip nut 20 and the solder 25 are fixed more firmly.

In the embodiment of the present application, the inner wall of the annular groove 40 may be a curved surface or a structure formed by connecting multiple inner surfaces. Regarding the number of annular grooves 40, as shown in FIG. 18, one is provided on the side wall, and four are provided on the end surface of the second end 23 of the patch nut 20, and other numbers are also possible. It is understandable that In the case where a plurality of annular grooves 40 are provided, the anti-dropping effect of the solder 25 in the recessed portion on the chip nut 20 can be enhanced.

In a possible implementation manner, the recessed portion may further include a plurality of dot-shaped grooves 41 arranged at intervals. Exemplarily, referring to FIG. 19, FIG. 19A, FIG. 19B, and FIG. 20, a plurality of dot-shaped grooves 41 are spaced apart and arranged independently, then the solder 25 in the dot-shaped groove 41 produces a kind of effect on the entire patch nut 20 Similar to the anchoring effect, the solder 25 can be effectively prevented from falling off the chip nut 20. For example, the inner wall of the dot groove 41 may be formed as a curved surface, and the groove depth of the dot groove 41 is approximately the same as the width and length of the groove of the dot groove 41, so that a plurality of dot grooves 41 may be formed. It is a plurality of point-shaped anchor grooves, and the entire edge of the solder 25 is formed as an anchor structure with multiple branches like a tree root, so that the solder 25 and the patch nut 20 are not easy to fall off. In the case where the chip nut 20 shown in FIG. 20 is mounted on the circuit board 11, the solder 25 not only enters into the dot groove 41 on the end surface of the second end of the chip nut 20, but also along the boss structure 28 The side wall crawls and enters into the dot-shaped groove 41 on the side wall.

The extension length of the dot-shaped groove 41 is not limited to the above-mentioned short size, and the dot-shaped groove 41 can also be formed as a long groove, which can facilitate the processing process of the dot-shaped groove 41.

In the embodiment of the present application, as shown in FIGS. 21 and 22, the inner wall of the internally threaded hole 21 close to the second end of the orifice 24 is provided with an enlarged diameter portion 50, and the inner diameter of the enlarged diameter portion 50 is larger than the inner diameter of the internally threaded hole 21 . This is equivalent to forming a sinker structure inside the female threaded hole 21, so that when the solder 25 at the bottom of the chip nut 20 wants to enter the female threaded hole 21 along the opening 24, the enlarged diameter portion 50 provides the solder 25 with tin The space can reduce the risk of the screw and the patch nut 20 not being locked in place due to the solder 25 climbing up and attaching to the thread.

As described above: the hole is provided with a shielding portion, the outer side wall of the second end of the patch nut is an oblique side wall, the outer side wall of the second end of the patch nut, a recessed portion is provided on the end surface of the second end, and an internal thread The hole near the inner wall of the orifice is provided with an enlarged diameter part, etc., all of which are to enhance the connection reliability of the patch nut and prevent the patch nut from falling off. It is understandable that those skilled in the art will select some of the above-listed solutions Any combination can achieve the same anti-dropping effect. Therefore, the scope of this application should include solutions formed by any combination of some of the above solutions, as well as solutions formed by using each of the above solutions separately.

In the following, taking the structure of the circuit board assembly 10 as described above as an example, the structure of the mobile phone 100 will be described separately for the technical solutions listed in Scenario 1 to Scenario 8.

scene one

In this scenario, as shown in FIGS. 23, 23A, 23B, 23C, and 24, the patch nut 20 is provided with an internal threaded hole 21, and the patch nut 20 has a first end 22 and a second end 23, And the second end 23 is used for patching to the circuit board 11, the internal threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23, and the internal threaded hole 21 is located at the opening 24 of the second end 23 for shielding The shielding portion 30 is used to completely shield the aperture 24, and the surface of the shielding portion 30 facing away from the first end 22 is flush with the end surface of the second end 23. In this way, the soldering area between the chip nut 20 and the circuit board 11 can be enlarged, and the solder 25 can be prevented from entering the internal threaded hole 21. At the same time, if the long screw is screwed into the chip nut 20 by mistake, or the circuit board is missed In the case of the protective bracket on the 11, since the long screws are blocked by the shielding portion 30, they will not be forcibly screwed into the patch nut 20, so there will be no hard interference with the circuit board 11, which can avoid the circuit board. 11 delamination or breakage of the internal wiring of the circuit board 11.

In this scenario, the second end 23 of the patch nut 20 is formed as a boss structure 28 to increase the contact area between the patch nut 20 and the circuit board 11. And the outer side wall of the boss structure 28 is formed as a sloping side wall 29, the sloping side wall 29 is inclined toward the center line direction of the patch nut 20, an annular groove 40 is provided on the outer side wall of the second end 23, and the second An annular groove 40 is provided on the end surface of the end 23. As shown in FIG. 24, the solder 25 climbs along the inclined side wall 29 to the surface of the inclined side wall 29 and enters the annular groove 40 on the inclined side wall 29. On the other hand, the solder 25 can also enter the ring structure 40 provided on the end surface of the second end 23, which can increase the contact area between the chip nut 20 and the solder 25, and improve the shear resistance of the solder joint of the chip nut 20. Stretch resistance.

The mounting process of the above-mentioned patch nut 20 on the circuit board 11 may be to print solder paste on the surface of the circuit board 11, and then place the second end 23 of the patch nut 20 on the corresponding pad of the circuit board 11 on which the solder paste has been printed. , The air or nitrogen is heated to a sufficiently high temperature and then blown to the circuit board 11 on which the patch nut 20 has been attached, and the solder is melted and then soldered to the circuit board 11.

Scene two

In this scenario, as shown in FIGS. 25, 25A, 25B, 25C, and 26, the patch nut 20 is provided with an internal threaded hole 21, and the patch nut 20 has a first end 22 and a second end 23, And the second end 23 is used for patching to the circuit board 11, the internal threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23, and the internal threaded hole 21 is located at the opening 24 of the second end 23 for shielding The shielding portion 30 has a first opening 31. In the projection of the chip nut 20 toward the circuit board 11, the projection of the edge of the first opening 31 is located within the projection range of the edge of the female threaded hole 21. In this way, the welding area between the second end 23 of the SMD nut 20 and the circuit board 11 can be enlarged, and since the crawling path of the solder 25 is increased, the solder 25 can also be prevented from entering the thread of the internal threaded hole 21 as much as possible. When the long screw is screwed into the chip nut 20 by mistake, or the protective bracket on the circuit board 11 is missing, since the long screw is blocked by the shielding portion 30, it will not be forcibly screwed into the sticker. In the chip nut 20, there is no hard interference with the circuit board 11, which can prevent the circuit board 11 from being layered or the internal wiring of the circuit board 11 from being broken. It can be understood that, compared with the case where the first opening 31 is not provided on the shielding portion 30, when the internal thread is processed, the debris during the processing can be discharged from the first opening 31, which is more conducive to the processing process.

In this scenario, the second end 23 of the patch nut 20 is formed as a boss structure 28 to increase the contact area between the patch nut 20 and the circuit board 11. And the outer side wall of the boss structure 28 is formed as a slanted side wall 29, the slanted side wall 29 is inclined toward the centerline direction of the patch nut 20, and a plurality of Point-shaped grooves 41 (the inner wall is an arc surface) are arranged at intervals. In addition, the inner threaded hole 21 is provided with an enlarged diameter portion 50 near the inner wall of the shielding portion 30, and the inner diameter of the enlarged diameter portion 50 is larger than the inner diameter of the inner threaded hole 21. Referring to FIG. 26, the solder 25 on the outside of the chip nut 20 climbs along the inclined side wall 29 to the surface of the inclined side wall 29 and enters into the dot groove 41 on the inclined side wall 29. The solder 25 can also enter the point-shaped groove 41 provided on the end surface of the second end 23, which can increase the contact area between the patch nut 20 and the solder 25, and improve the shear/stretch resistance of the solder joint of the patch nut 20. For the solder 25 inside the chip nut 20, crawl along the surface of the first opening 31 to the enlarged diameter portion 50. The enlarged diameter portion 50 can be used to store the solder 25, so the solder 25 will no longer crawl upward along the internal threaded hole 21 Therefore, the influence of the solder 25 on the locking of the screw and the patch nut 20 can be avoided.

Scene three

In this scenario, as shown in Figures 27 and 27A, the patch nut 20 is provided with an internally threaded hole 21, the patch nut 20 has a first end 22 and a second end 23, and the second end 23 is used for patching to the circuit In the plate 11, the internal threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23. The internal threaded hole 21 is located at the second end 23. The opening 24 is provided with a shielding portion 30. The shielding portion 30 is used to make the orifice 24 is completely shielded, and the surface of the shielding portion 30 facing away from the first end 22 is flush with the end surface of the second end 23. In this way, the soldering area between the chip nut 20 and the circuit board 11 can be enlarged, and the solder 25 can be prevented from entering the internal threaded hole 21. At the same time, if the long screw is screwed into the chip nut 20 by mistake, or the circuit board is missed In the case of the protective bracket on the 11, since the long screws are blocked by the shielding portion 30, they will not be forcibly screwed into the patch nut 20, so there will be no hard interference with the circuit board 11, which can avoid the circuit board. 11 delamination or breakage of the internal wiring of the circuit board 11.

In this scenario, the second end 23 of the patch nut 20 is formed as a boss structure 28 to increase the contact area between the patch nut 20 and the circuit board 11. Referring to FIG. 27A, the solder 25 is located on the entire end surface of the second end 23, and the area of the welding surface of the chip nut 20 is increased as much as possible without increasing the outer contour size of the chip nut 20. Improve the shear/stretch resistance of the solder joints of the SMD nut 20.

Scene four

In this scenario, as shown in Figures 28 and 28A, the patch nut 20 is provided with an internally threaded hole 21, the patch nut 20 has a first end 22 and a second end 23, and the second end 23 is used for patching to the circuit Board 11, the internal threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23, the internal threaded hole 21 is located at the opening 24 of the second end 23 is provided with a shielding portion 30, and the shielding portion 30 has a first opening 31 In the projection of the patch nut 20 toward the circuit board 11, the projection of the edge of the first opening 31 is located within the projection range of the edge of the female threaded hole 21. In this way, the welding area between the second end 23 of the SMD nut 20 and the circuit board 11 can be enlarged, and since the crawling path of the solder 25 is increased, the solder 25 can also be prevented from entering the thread of the internal threaded hole 21 as much as possible. When the long screw is screwed into the chip nut 20 by mistake, or the protective bracket on the circuit board 11 is missing, since the long screw is blocked by the shielding portion 30, it will not be forcibly screwed into the sticker. In the chip nut 20, there is no hard interference with the circuit board 11, which can prevent the circuit board 11 from being layered or the internal wiring of the circuit board 11 from being broken. It can be understood that, compared with the case where the first opening 31 is not provided on the shielding portion 30, when the internal thread is processed, the debris during the processing can be discharged from the first opening 31, which is more conducive to the processing process.

In this scenario, the second end 23 of the patch nut 20 is formed as a boss structure 28 to increase the contact area between the patch nut 20 and the circuit board 11. Referring to FIG. 28A, the solder 25 on the end surface of the second end 23 of the chip nut 20 climbs along the inclined side wall of the first opening 31 to the inside of the internal threaded hole 21. Compared with the prior art, the solder 25 crawls The path is increased, so the solder 25 will no longer crawl up the thread along the internal threaded hole 21, which can prevent the solder 25 from affecting the locking of the screw and the chip nut 20.

Scene five

In this scenario, as shown in Figures 29 and 29A, the patch nut 20 is provided with an internally threaded hole 21, the patch nut 20 has a first end 22 and a second end 23, and the second end 23 is used for patching to the circuit In the plate 11, the internal threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23. The internal threaded hole 21 is located at the second end 23. The opening 24 is provided with a shielding portion 30. The shielding portion 30 is used to make the orifice 24 is completely shielded, and the surface of the shielding portion 30 facing away from the first end 22 is flush with the end surface of the second end 23. In this way, the soldering area between the chip nut 20 and the circuit board 11 can be enlarged, and the solder 25 can be prevented from entering the internal threaded hole 21. At the same time, if the long screw is screwed into the chip nut 20 by mistake, or the circuit board is missed In the case of the protective bracket on the 11, because the screw encounters the blocking part 30 and is blocked, it will not be forcibly screwed into the patch nut 20, so there will be no hard interference with the circuit board 11, and the circuit board 11 can be avoided. Delamination or breakage of the internal wiring of the circuit board 11.

In this scenario, the second end 23 of the patch nut 20 is formed as a boss structure 28 to increase the contact area between the patch nut 20 and the circuit board 11. An annular groove 40 is provided on the outer side wall of the boss structure 28, and an annular groove 40 is provided on the end surface of the second end 23. As shown in FIG. 29A, the solder 25 climbs along the outer side wall of the boss structure 28 Into the annular groove 40 on the outer side wall, on the other hand, the solder 25 can also enter the annular structure 40 provided on the end surface of the second end 23, which can increase the contact area between the chip nut 20 and the solder 25 and improve the adhesion. Shear/stretch resistance of the welding point of the sheet nut 20.

Scene six

In this scenario, as shown in Figures 30 and 30A, the patch nut 20 is provided with an internally threaded hole 21, the patch nut 20 has a first end 22 and a second end 23, and the second end 23 is used for patching to In the circuit board 11, the internally threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23. The internally threaded hole 21 is located at the second end 23. The opening 24 is completely shielded, and the surface of the shielding portion 30 facing away from the first end 22 is flush with the end surface of the second end 23. In this way, the soldering area between the chip nut 20 and the circuit board 11 can be enlarged, and the solder 25 can be prevented from entering the internal threaded hole 21. At the same time, if the long screw is screwed into the chip nut 20 by mistake, or the circuit board is missed In the case of the protective bracket on the 11, since the long screws are blocked by the shielding portion 30, they will not be forcibly screwed into the patch nut 20, so there will be no hard interference with the circuit board 11, which can avoid the circuit board. 11 delamination or breakage of the internal wiring of the circuit board 11.

In this scenario, the second end 23 of the patch nut 20 is formed as a boss structure 28 to increase the contact area between the patch nut 20 and the circuit board 11. The outer side wall of the boss structure 28 is provided with dot-shaped grooves 41 spaced apart, and the end surface of the second end 23 is also provided with dot-shaped grooves 41. As shown in FIG. 30A, the solder 25 runs along the boss structure 28. The outer side wall climbs into the dot groove 41 on the outer side wall. On the other hand, the solder 25 can also enter the dot groove 41 provided on the end surface of the second end 23, which can increase the chip nut 20 and solder 25 The contact area of the chip nut 20 improves the shear resistance and tensile resistance of the solder joints of the patch nut 20.

Scene Seven

In this scenario, as shown in Figures 31 and 31A, the patch nut 20 is provided with an internally threaded hole 21, the patch nut 20 has a first end 22 and a second end 23, and the second end 23 is used for patching to the circuit In the plate 11, the internal threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23. The internal threaded hole 21 is located at the second end 23. The opening 24 is provided with a shielding portion 30. The shielding portion 30 is used to make the orifice 24 is completely shielded, and the surface of the shielding portion 30 facing away from the first end 22 is flush with the end surface of the second end 23. In this way, the soldering area between the chip nut 20 and the circuit board 11 can be enlarged, and the solder 25 can be prevented from entering the internal threaded hole 21. At the same time, if the long screw is screwed into the chip nut 20 by mistake, or the circuit board is missed In the case of the protective bracket on the 11, since the long screws are blocked by the shielding portion 30, they will not be forcibly screwed into the patch nut 20, so there will be no hard interference with the circuit board 11, which can avoid the circuit board. 11 delamination or breakage of the internal wiring of the circuit board 11.

In this scenario, the second end 23 of the patch nut 20 is formed as a boss structure 28 to increase the contact area between the patch nut 20 and the circuit board 11. In addition, the outer side wall of the boss structure 28 is formed as an inclined side wall 29, which is inclined toward the center line of the chip nut 20. As shown in FIG. 31A, the solder 25 climbs along the inclined side wall 29 to the inclined side wall. The surface of 29 can increase the contact area between the chip nut 20 and the solder 25, and improve the shear/stretch resistance of the solder joint of the chip nut 20.

Scene Eight

In this scenario, as shown in Figures 32 and 32A, the patch nut 20 is provided with an internally threaded hole 21, the patch nut 20 has a first end 22 and a second end 23, and the second end 23 is used for patching to the circuit Board 11, the internal threaded hole 21 extends from the end surface of the first end 22 to the end surface of the second end 23, the internal threaded hole 21 is located at the opening 24 of the second end 23 is provided with a shielding portion 30, and the shielding portion 30 has a first opening 31 In the projection of the patch nut 20 toward the circuit board 11, the projection of the edge of the first opening 31 is located within the projection range of the edge of the female threaded hole 21. In this way, the welding area between the second end 23 of the SMD nut 20 and the circuit board 11 can be enlarged, and since the crawling path of the solder 25 is increased, the solder 25 can also be prevented from entering the thread of the internal threaded hole 21 as much as possible. When the long screw is screwed into the chip nut 20 by mistake, or the protective bracket on the circuit board 11 is missing, since the long screw is blocked by the shielding portion 30, it will not be forcibly screwed into the sticker. In the chip nut 20, there is no hard interference with the circuit board 11, which can prevent the circuit board 11 from being layered or the internal wiring of the circuit board 11 from being broken. It can be understood that, compared with the case where the first opening 31 is not provided on the shielding portion 30, when the internal thread is processed, the debris during the processing can be discharged from the first opening 31, which is more conducive to the processing process.

In this scenario, the inner threaded hole 21 is provided with an enlarged diameter portion 50 near the inner wall of the shielding portion 30. The inner diameter of the enlarged diameter portion 50 is larger than the inner diameter of the inner threaded hole 21, and the second end 23 of the patch nut 20 is formed as a convex The stage structure 28 is used to increase the contact area between the patch nut 20 and the circuit board 11. Referring to FIG. 32A, the solder 25 on the end surface of the second end 23 of the chip nut 20 crawls along the surface of the first opening 31 to the enlarged diameter portion 50. The enlarged diameter portion 50 can be used to store the solder 25, so the solder 25 It will no longer crawl upward along the internal threaded hole 21, which can prevent the solder 25 from affecting the locking of the screw and the patch nut 20.

In order to verify the anti-dropping effect of the patch nut of the present application, modeling and simulation experiments of shear stress and tensile stress were carried out for the patch nut of the prior art and the patch nut in scenario one and scenario two. Record the results for comparative analysis.

As shown in Figures 33A and 33B, for the prior art patch nut, the maximum shear stress received by the patch nut is 16.457 MPa, and the area where the shear stress exceeds 10 MPa accounts for 53.7%; The position of the maximum tensile stress is the position indicated by the label "B" shown in FIG. 33B. The maximum tensile stress received by the patch nut is 15.874 MPa, and the area where the tensile stress exceeds 10 MPa accounts for 53.3%.

As shown in Figures 34A and 34B, for the patch nut of scene 1, the position of the maximum shearing stress on the patch nut is the position marked "C" shown in Figure 34A, the maximum shearing of the patch nut is The shear stress is 14.337 MPa, and the area where the shear stress exceeds 10 MPa accounts for 16.6%; the position of the maximum tensile stress on the patch nut is the position marked "D" shown in Figure 34B, where the maximum tensile stress is received by the patch nut The tensile stress is 14.029 MPa, and the area where the tensile stress exceeds 10 MPa accounts for 15.2%.

As shown in Figures 35A and 35B, for the patch nut of scene two, the position of the maximum shear stress on the patch nut is the position marked "E" shown in Figure 35A, and the maximum shear stress on the patch nut is The shear stress is 14.520 MPa, and the area where the shear stress exceeds 10 MPa accounts for 17.2%; the position of the maximum tensile stress on the patch nut is the position marked "F" shown in Figure 35B, where the maximum tensile stress is received by the patch nut The tensile stress is 14.166 MPa, and the area with tensile stress exceeding 10 MPa accounts for 15.8%.

Referring to Figure 36A, observe the maximum shear stress of the patch nut, the prior art patch nut is up to 16.5 MPa, the patch nut of scenario 1 is 14.3 MPa, and the patch nut of scenario 2 is 14.5 MPa. It can be seen that, compared with the prior art, the maximum shear stress experienced by the patch nut of scenario 1 is reduced by 13%, and the maximum shear stress received by the patch nut of scenario 2 is reduced by 12%. As far as the maximum shear stress is concerned, the patch nut of scene 1 has the best performance.

Referring to Figure 36B, observe the proportion of the area where the shear stress of the patch nut exceeds 10MPa. The patch nut of the prior art is 53.7%, the patch nut of scene 1 is 16.6%, and the patch nut of scene 2 is 16.6%. The ratio is 17.2%. It can be seen that compared with the prior art, the area where the shear stress of the patch nut exceeds 10 MPa is reduced by 69%, and the area where the shear stress of the patch nut exceeds 10 MPa is reduced by 69% compared with the prior art. The ratio is reduced by 68%. As far as the proportion of the area with higher shear stress is concerned, the patch nut of scene 1 has the best performance.

Referring to Figure 36C, observe the maximum tensile stress of the patch nut. The maximum tensile stress of the patch nut in the prior art is 15.9 MPa, the patch nut of scenario 1 is 14.0 MPa, and the patch nut of scenario 2 is 14.2 MPa, it can be seen that, compared with the prior art, the maximum shear stress of the patch nut of scene 1 is reduced by 12%, and the maximum shear stress of the patch nut of scene 2 is reduced by 11%. As far as the maximum tensile stress is concerned, the chip nut of scene 1 has the best performance.

Referring to Figure 36D, observe the percentage of the area where the shear stress of the patch nut exceeds 10MPa. The patch nut of the prior art is 53.3%, the patch nut of scenario 1 is 15.2%, and the patch nut of scenario 2 is The ratio is 15.8%. It can be seen that compared with the prior art, the area where the shear stress of the patch nut exceeds 10 MPa is reduced by 71.5%, and the area where the shear stress of the patch nut exceeds 10 MPa is reduced by 71.5% compared with the prior art. The ratio is reduced by 70%. As far as the proportion of the area with higher shear stress is concerned, the patch nut of scene 1 has the best performance.

It can be known from the foregoing simulation experiment results and comparisons that the circuit board assembly and electronic equipment adopting the structure of the embodiment of the present application have high reliability.

In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection or Indirect connection through an intermediate medium can be the internal communication between two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the embodiments of the present application can be understood according to specific circumstances.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and It does not have to be used to describe a specific order or sequence.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, not to limit them; although the embodiments of the present application are described in detail with reference to the foregoing embodiments, those of ordinary skill in the art It should be understood that it is still possible to modify the technical solutions described in the foregoing embodiments, or equivalently replace some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the embodiments of this application. The scope of the technical solution of each embodiment.

Claims

A patch nut, characterized in that the patch nut is provided with an internal threaded hole, the patch nut has a first end and a second end, and the second end is used for patching to a circuit board, and The internally threaded hole extends from an end surface of the first end to an end surface of the second end, and an opening of the internally threaded hole at the second end is provided with a shielding portion, and the shielding portion is used to shield the orifice At least part of the area.
The patch nut according to claim 1, wherein the shielding portion completely shields the orifice, and a surface of the shielding portion facing away from the first end is flush with the end surface of the second end .
The patch nut according to claim 1, wherein the shielding portion has a first opening, and in the projection of the patch nut toward the circuit board, the projection of the edge of the first opening is located at Within the range of the projection of the edge of the internal threaded hole.
The patch nut according to any one of claims 1 to 3, wherein the shielding portion and the patch nut are formed integrally or separately.
The patch nut according to any one of claims 1-4, wherein the outer side wall of the second end of the patch nut is an oblique side wall, and the oblique side wall faces the centerline direction of the patch nut tilt.
The patch nut according to any one of claims 1 to 4, wherein the outer side wall of the second end of the patch nut is perpendicular to the end surface of the second end.
The patch nut according to any one of claims 1-6, wherein the outer side wall of the second end of the patch nut is provided with a recess, or,

A recess is provided on the end surface of the second end of the patch nut, or,

A recess is provided on the outer side wall of the second end of the patch nut, and the recess is provided on the end surface of the second end of the patch nut.
The patch nut according to claim 7, wherein the inner wall of the recessed portion is a curved surface, or the inner wall of the recessed portion is formed by connecting at least two inner surfaces.
The patch nut according to claim 7 or 8, wherein the concave portion is an annular groove, and the annular groove is arranged around the center line of the patch nut.
The patch nut according to claim 9, wherein the recessed portion comprises at least two annular grooves, and at least two annular grooves are arranged at intervals.
The patch nut according to claim 7 or 8, wherein the recessed portion includes a plurality of dot-shaped grooves arranged at intervals.
The patch nut according to any one of claims 3-11, wherein the inner threaded hole is provided with an enlarged diameter portion near the inner wall of the shielding portion, and the inner diameter of the enlarged diameter portion is larger than the inner thread The inner diameter of the hole.
The patch nut according to any one of claims 1-12, wherein the outer side wall of the second end of the patch nut protrudes outward to form a boss structure.
A circuit board assembly applied to electronic equipment, characterized in that it comprises a circuit board and the patch nut according to any one of claims 1-13; the circuit board is provided with a pad, and the pad The end surface of the second end of the patch nut is connected by soldering.
An electronic device, comprising at least a display screen, a middle frame, a back cover, and the circuit board assembly of claim 14, wherein the display screen and the back cover are respectively located on both sides of the middle frame, The circuit board assembly is located in a cavity enclosed by the display screen and the middle frame, or,

The circuit board assembly is located in a cavity enclosed by the back cover and the middle frame.