WO2021083437A1 - A method and a device for heat removal from a flat nir-mir laser mirror - Google Patents

A method and a device for heat removal from a flat nir-mir laser mirror Download PDF

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Publication number
WO2021083437A1
WO2021083437A1 PCT/CZ2020/050084 CZ2020050084W WO2021083437A1 WO 2021083437 A1 WO2021083437 A1 WO 2021083437A1 CZ 2020050084 W CZ2020050084 W CZ 2020050084W WO 2021083437 A1 WO2021083437 A1 WO 2021083437A1
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WO
WIPO (PCT)
Prior art keywords
mirror
heat sink
anyone
epoxy layer
microchannel
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Application number
PCT/CZ2020/050084
Other languages
French (fr)
Inventor
Jan CVRČEK
Reza AMANI
Martin SMRŽ
Original Assignee
Fyzikalni Ustav Av Cr, V.V.I.
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Application filed by Fyzikalni Ustav Av Cr, V.V.I. filed Critical Fyzikalni Ustav Av Cr, V.V.I.
Publication of WO2021083437A1 publication Critical patent/WO2021083437A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0401—Arrangements for thermal management of optical elements being part of laser resonator, e.g. windows, mirrors, lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
    • H01S3/1123—Q-switching
    • H01S3/113—Q-switching using intracavity saturable absorbers

Definitions

  • the present invention pertains to optics.
  • the present invention is dedicated to a method and a device for heat removal from a flat NIR-MIR laser mirror, more particularly to cooling elements used in a laser system.
  • High-average-power laser systems are suffering from the heat generated in laser components.
  • these laser components such as mirrors, gratings, or Q-switchers are placed in water-cooled mounts. Between the laser components and the mounts, a sheet of graphite or indium is usually used. This technique of heat removal is not very efficient and has resulted in a poor beam pointing in most high-average-power laser systems especially when the average power approaches the kW-class regime.
  • Document US 2005/0019694 discloses a laser amplifying system.
  • the system comprises heat sink.
  • a laser disc is attached to the heat sink via adhesive layer.
  • a reflective layer can be provided in between the heat sink and the laser.
  • the similar solution is disclosed in document US 2015/0171586.
  • the document relates to a solid-state laser arrangement capable to withstand high-thermal loads.
  • a thin mirror is known by the skilled person in the art as a mirror with a thickness less than 1 mm with a high thermal conductivity in the substrate.
  • a flat thin mirror is known by the skilled person in the art as a mirror with a peak to valley (PV) surface deformation less than 60 nm in a clear aperture higher than 80% of the diameter of the optic. Typical radius of curvature is higher than 1 km.
  • PV peak to valley
  • NIR mirror, resp. NIR thin mirror, resp. NIR flat thin mirror are known by skilled person in the art that they are such mirrors capable to reflect radiation having wavelength in near infrared spectrum, it is usually accepted that wavelength of NIR is from 0.8 ⁇ m to 1.3 ⁇ m.
  • Mid-IR mirror, resp. mid-IR thin mirror, resp. mid-IR flat thin mirror are known by skilled person in the art that they are such mirrors capable to reflect radiation having wavelength in mid-wave infrared spectrum, it is usually accepted that wavelength of mid-IR is from 2 ⁇ m to 5 ⁇ m.
  • overheating which is generally considered as a heat corresponding to temperature above 50°C, it also provides several complications such as strong fluorescence; coating absorption.
  • the above-mentioned problem is solved by a method for heat removal from an optical element.
  • the method comprises steps of: attaching the mirror to a polished heat sink via epoxy layer, the epoxy layer having lower coefficient of thermal expansion comparable to that of material from which the heat sink is made of; and providing a cooling medium flowing through a microchannel provided in the heat sink, preferably created by laser micro-machining.
  • the microchannels may be created by other techniques as well.
  • Epoxy layer has various thermal expansion coefficients depending on material. However, it is essential for the present invention to have the thermal expansion coefficient lower than material from which the heat sink is made of. For example, if the material of heat sink is copper, the epoxy layer shall have thermal expansion coefficient lower and preferably being comparable to that of copper.
  • the above mentioned method can efficiently remove heat from the surface, which may further comprises a coating, and provide good pointing stability of a laser which is not affected by vibration of mirrors due to accumulated heat thereon.
  • Lower coefficient of thermal expansion than that of metal from which the heat sink is made of avoids deformation of the optics under high heat load.
  • a polished heat sink provides less deformation on the mirror, especially on the flat mirror, after bonding and ensures a thinner epoxy layer between the thin mirror and the heat sink. Moreover, it assists easier flow of the epoxy layer through spin coating technique.
  • the steps are providing for a mid-IR thin mirror, preferably flat thin mirror.
  • a mid-IR thin mirror preferably flat thin mirror.
  • the definition of mid-IR thin mirror, resp. thin mirror are adopted from prior art, are generally known by the skilled person in the art and are available in textbooks.
  • water is flowing through the microchannel.
  • the cooling medium is flowing through the microchannel which is from metal, preferably Cu, Ni, CuW, or lnvar.
  • the material of heat sink and the material of the microchannel is the same.
  • the problem is solved by a device for heat removal from a mirror, the device comprises: the mirror thermally attached to a polished heat sink via epoxy layer, the epoxy layer having a lower coefficient of thermal expansion than material from which the heat sink is made of, wherein the heat sink comprises a microchannel, wherein cooling medium is flowing therein.
  • the heat sink is from a single body, including the embodiment where the material of the heat sink and the microchannels is the same.
  • the heat sink comprises plurality of microchannel.
  • the heat sink comprising an inlet for the cooling medium with a large diameter so that a high flow rate (>1 l/min) of the cooling water is achieved.
  • the thickness of the epoxy layer is less than 5 ⁇ m depending on the viscosity of the epoxy. A higher viscosity results in a thicker epoxy layer due to difficulty of epoxy flow on the polished heat sink. An epoxy with a low viscosity less than 3 S (300 cPs), results in a thickness less than 1 ⁇ m.
  • the mirror thickness can be up to 1 mm in order to modify the curvature during the bonding process.
  • the mirror has acquired a concave shape using epoxy layer, the curvature radius of the mirror is more than 1 km.
  • the mirror is a mid-IR thin mirror, preferably mid-IR flat thin mirror.
  • the device further comprises a coating on the mirror.
  • the above-described device can be used especially for heat-removal from the mid-IR mirror, especially in q-switched laser.
  • FIG. 1 shows a top view and cross section of the device in accordance with the present invention.
  • the device comprises a water-cooled thin mirror 2 to enhance the performance of a kW-class laser system.
  • a high-power laser diode (2-3 kW) provides a laser beam directed to a flat thin mirror 2 .
  • the laser beam at mid-IR wavelength heated up the flat thin mirror 2 .
  • Thickness of the mirror 2 was 1 mm.
  • the mirror 2 was thermally attached to a heat sink having a micro-channel structure therein. Through the micro-channel structure, a cooling medium was flowing.
  • the cooling medium is water.
  • the epoxy layer 4 has coefficient of thermal expansion less than material from which the heat sink 1 is made of. For example, if the heat sink 1 is made of copper, the epoxy layer has a thermal expansion of 16x10 -6 m/(m K).
  • the heat sink 1 must be made of thermally conductive material, preferably metal, more preferably Cu, Ni, CuW, or lnvar. However, the thermal conductivity is implicit feature of the heat sink 1.
  • the heat sink 1 is made of single body.
  • the microchannel is preferably made of the same material as the heat sink, i.e. Cu, Ni, CuW, or lnvar.
  • the heat sink 1 further comprises plurality of microchannel through which the cooling medium, preferably water, flows.
  • the cooling medium preferably water
  • the thickness of the epoxy layer 4 is ranging from 1 ⁇ m to 5 ⁇ m depending on the viscosity of the epoxy layer 4.
  • an inlet 3 is mounted to the heat sink 1 .
  • the above-described device can be also used in a q-switched laser system for removal of heat from a saturable absorber with a coating 2 .

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Lasers (AREA)

Abstract

The present invention pertains a method and a device for heat removal from optical elements. A method and corresponding device comprises the steps / means for of: attaching the mirror (2) to a heat sink (1) via epoxy layer; and providing a cooling medium flowing through a microchannel provided in the heat sink (1).

Description

A method and a device for heat removal from a flat NIR-MIR laser mirror
The present invention pertains to optics. In particular, the present invention is dedicated to a method and a device for heat removal from a flat NIR-MIR laser mirror, more particularly to cooling elements used in a laser system.
High-average-power laser systems are suffering from the heat generated in laser components. Usually, these laser components such as mirrors, gratings, or Q-switchers are placed in water-cooled mounts. Between the laser components and the mounts, a sheet of graphite or indium is usually used. This technique of heat removal is not very efficient and has resulted in a poor beam pointing in most high-average-power laser systems especially when the average power approaches the kW-class regime.
Document US 2005/0019694 discloses a laser amplifying system. The system comprises heat sink. A laser disc is attached to the heat sink via adhesive layer. In between the heat sink and the laser, a reflective layer can be provided. The similar solution is disclosed in document US 2015/0171586. The document relates to a solid-state laser arrangement capable to withstand high-thermal loads.
The above mentioned documents disclose a general feature (plate-like solid-state body) and species, an active medium as an embodiment to be cooled.
A thin mirror is known by the skilled person in the art as a mirror with a thickness less than 1 mm with a high thermal conductivity in the substrate.
A flat thin mirror is known by the skilled person in the art as a mirror with a peak to valley (PV) surface deformation less than 60 nm in a clear aperture higher than 80% of the diameter of the optic. Typical radius of curvature is higher than 1 km.
NIR mirror, resp. NIR thin mirror, resp. NIR flat thin mirror are known by skilled person in the art that they are such mirrors capable to reflect radiation having wavelength in near infrared spectrum, it is usually accepted that wavelength of NIR is from 0.8 µm to 1.3 µm.
Mid-IR mirror, resp. mid-IR thin mirror, resp. mid-IR flat thin mirror are known by skilled person in the art that they are such mirrors capable to reflect radiation having wavelength in mid-wave infrared spectrum, it is usually accepted that wavelength of mid-IR is from 2 µm to 5 µm.
Due to overheating, which is generally considered as a heat corresponding to temperature above 50°C, it also provides several complications such as strong fluorescence; coating absorption.
To avoid heating up of laser mirrors in a high-average-power laser system, it is proposed the below defined invention to enhance the performance of a kW-class laser system. Therefore, it is an object of the present invention to provide better solution to the currently known in the state-of-the-art.
According to a first aspect of the present invention, the above-mentioned problem is solved by a method for heat removal from an optical element. The method comprises steps of:
attaching the mirror to a polished heat sink via epoxy layer, the epoxy layer having lower coefficient of thermal expansion comparable to that of material from which the heat sink is made of; and
providing a cooling medium flowing through a microchannel provided in the heat sink, preferably created by laser micro-machining. It shall be understood that the microchannels may be created by other techniques as well.
Epoxy layer has various thermal expansion coefficients depending on material. However, it is essential for the present invention to have the thermal expansion coefficient lower than material from which the heat sink is made of. For example, if the material of heat sink is copper, the epoxy layer shall have thermal expansion coefficient lower and preferably being comparable to that of copper.
The above mentioned method can efficiently remove heat from the surface, which may further comprises a coating, and provide good pointing stability of a laser which is not affected by vibration of mirrors due to accumulated heat thereon. Lower coefficient of thermal expansion than that of metal from which the heat sink is made of avoids deformation of the optics under high heat load. A polished heat sink provides less deformation on the mirror, especially on the flat mirror, after bonding and ensures a thinner epoxy layer between the thin mirror and the heat sink. Moreover, it assists easier flow of the epoxy layer through spin coating technique.
Mirror, resp. mid-IR mirror, thin mirror, mid-IR flat thin mirror are species in respect to flat plate-like solid-state body or reflector.
In a preferred embodiment, the steps are providing for a mid-IR thin mirror, preferably flat thin mirror. The definition of mid-IR thin mirror, resp. thin mirror are adopted from prior art, are generally known by the skilled person in the art and are available in textbooks.
In another preferred embodiment which can be combined with any of the mentioned embodiments, water is flowing through the microchannel.
In another preferred embodiment which can be combined with any of the mentioned embodiments, the cooling medium is flowing through the microchannel which is from metal, preferably Cu, Ni, CuW, or lnvar. Preferably the material of heat sink and the material of the microchannel is the same.
According to a second aspect of the present invention, the problem is solved by a device for heat removal from a mirror, the device comprises:
the mirror thermally attached to a polished heat sink via epoxy layer, the epoxy layer having a lower coefficient of thermal expansion than material from which the heat sink is made of, wherein the heat sink comprises a microchannel, wherein cooling medium is flowing therein.
In a preferred embodiment, the heat sink is from a single body, including the embodiment where the material of the heat sink and the microchannels is the same.
In another preferred embodiment which can be combined with any of the mentioned embodiments, the heat sink comprises plurality of microchannel.
In another preferred embodiment which can be combined with any of the mentioned embodiments, the heat sink comprising an inlet for the cooling medium with a large diameter so that a high flow rate (>1 l/min) of the cooling water is achieved.
In another preferred embodiment which can be combined with any of the mentioned embodiments, the thickness of the epoxy layer is less than 5 μm depending on the viscosity of the epoxy. A higher viscosity results in a thicker epoxy layer due to difficulty of epoxy flow on the polished heat sink. An epoxy with a low viscosity less than 3 S (300 cPs), results in a thickness less than 1 μm.
In another preferred embodiment which can be combined with any of the mentioned embodiments, to improve the mirror flatness after bonding, the mirror thickness can be up to 1 mm in order to modify the curvature during the bonding process.
In another preferred embodiment which can be combined with any of the mentioned embodiments, the mirror has acquired a concave shape using epoxy layer, the curvature radius of the mirror is more than 1 km.
In another preferred embodiment which can be combined with any of the mentioned embodiments, wherein the mirror is a mid-IR thin mirror, preferably mid-IR flat thin mirror.
In another preferred embodiment which can be combined with any of the mentioned embodiments, the device further comprises a coating on the mirror.
According to another aspect of the present invention, the above-described device can be used especially for heat-removal from the mid-IR mirror, especially in q-switched laser.
 Fig.1
shows a top view and cross section of the device in accordance with the present invention.
To avoid heating up of laser mirror 2 in a high-average-power laser system, it is proposed a device as described below, the device comprises a water-cooled thin mirror 2 to enhance the performance of a kW-class laser system.
In accordance with the present invention, a high-power laser diode (2-3 kW) provides a laser beam directed to a flat thin mirror 2. The laser beam at mid-IR wavelength heated up the flat thin mirror 2. Thickness of the mirror 2 was 1 mm. The mirror 2 was thermally attached to a heat sink having a micro-channel structure therein. Through the micro-channel structure, a cooling medium was flowing. In a preferred embodiment, the cooling medium is water. There is an epoxy layer 4 in-between the heat sink 1 and flat thin mirror 2 providing thermal conduction between those two elements. The epoxy layer 4 has coefficient of thermal expansion less than material from which the heat sink 1 is made of. For example, if the heat sink 1 is made of copper, the epoxy layer has a thermal expansion of 16x10-6 m/(m K).
The heat sink 1 must be made of thermally conductive material, preferably metal, more preferably Cu, Ni, CuW, or lnvar. However, the thermal conductivity is implicit feature of the heat sink 1.
In a preferred embodiment, the heat sink 1 is made of single body. The microchannel is preferably made of the same material as the heat sink, i.e. Cu, Ni, CuW, or lnvar.
More preferably, the heat sink 1 further comprises plurality of microchannel through which the cooling medium, preferably water, flows.
The thickness of the epoxy layer 4 is ranging from 1 μm to 5 μm depending on the viscosity of the epoxy layer 4.
To the heat sink 1, in particular to the plurality of microchannel, an inlet 3 is mounted.
The above-described device can be also used in a q-switched laser system for removal of heat from a saturable absorber with a coating 2.

Claims (16)

  1. A method for heat removal from a mirror (2), the method comprises the steps of:
    attaching the mirror (2) to a polished heat sink (1) via epoxy layer (4), the epoxy layer (4) having a coefficient of thermal expansion less than material from which the heat sink (1) is made of; and
    providing a cooling medium flowing through a microchannel provided in the heat sink (1).
  2. The method according to claim 1, wherein the steps are providing for a mid-IR thin mirror, preferably flat thin mirror.
  3. The method according to anyone of the preceding claim, wherein water is flowing through microchannel.
  4. The method according to anyone of the preceding claim, wherein the cooling medium is flowing through the microchannel made of metal, preferably Cu, Ni, CuW, or lnvar.
  5. A device for heat removal from a mirror (2), the device comprises
    the mirror (2) thermally attached to a polished heat sink (1) via epoxy layer (4), the epoxy layer (4) having a lower coefficient of thermal expansion than material from which the heat sink (1) is made of, wherein
    the heat sink (1) comprises a microchannel, wherein cooling medium is flowing therein.
  6. The device according to claim 5 wherein the heat sink (1) is from a single body.
  7. The device according to claim 5 or 6 wherein the heat sink (1) comprises plurality of microchannel.
  8. The device according to anyone of the claims 5 to 7 wherein the heat sink (1) is from metal, preferably Cu, Ni, CuW, or lnvar.
  9. The device according to anyone of the claims 5 to 8 wherein the heat sink (1) comprising an inlet (3) for the cooling medium.
  10. The device according to anyone of the claims 5 to 9, wherein the cooling medium is water.
  11. The device according to anyone of the claims 5 – 10, wherein the thickness of the epoxy layer (4) is less than 5 μm.
  12. The device according to anyone of the claim 5 – 11, wherein the mirror (2) is a mid-IR thin mirror, preferably mid-IR flat thin mirror.
  13. The device according to anyone of the claim 5 – 12, wherein thickness of the mirror (2) is up to 1 mm.
  14. The device according to anyone of the claim 5 – 13, wherein curvature radius of the mirror (2) is more than 1 km.
  15. The device according to anyone of the claim 5 – 13 further comprises a coating on the mirror.
  16. Use of the device according to anyone of the claims 5 – 14 for cooling a mirror or a saturable absorber with a coating (2) in a q-switched laser.
PCT/CZ2020/050084 2019-10-29 2020-10-26 A method and a device for heat removal from a flat nir-mir laser mirror WO2021083437A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050019694A1 (en) 2000-08-04 2005-01-27 Trumpf Laser Gmbh + Co. Kg Laser amplifying system
US20150171586A1 (en) 2012-08-23 2015-06-18 Trumpf Laser Gmbh Solid-State Laser
RU2582909C2 (en) * 2013-10-18 2016-04-27 Федеральное государственное бюджетное учреждение науки Физический институт им. П.Н. Лебедева Российской академии наук (ФИАН) Disc laser (versions)

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050019694A1 (en) 2000-08-04 2005-01-27 Trumpf Laser Gmbh + Co. Kg Laser amplifying system
US20150171586A1 (en) 2012-08-23 2015-06-18 Trumpf Laser Gmbh Solid-State Laser
RU2582909C2 (en) * 2013-10-18 2016-04-27 Федеральное государственное бюджетное учреждение науки Физический институт им. П.Н. Лебедева Российской академии наук (ФИАН) Disc laser (versions)

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
EPOXY TECHNOLOGY INC.: "EPO-TEK H20E Technical Data Sheet For Reference Only Electrically Conductive, Silver Epoxy", 1 November 2019 (2019-11-01), XP055713993, Retrieved from the Internet <URL:http://www.epotek.com/site/administrator/components/com_products/assets/files/Style_Uploads/H20E.pdf> [retrieved on 20200713] *
HODGSON N ET AL: "Analytical calculation of temperature profiles in solid state laser disks mounted on multi-layered heat spreaders using Hankel transforms", PROCEEDINGS OF SPIE; [PROCEEDINGS OF SPIE ISSN 0277-786X VOLUME 10524], SPIE, US, vol. 10082, 17 February 2017 (2017-02-17), pages 100820I - 100820I, XP060085166, ISBN: 978-1-5106-1533-5, DOI: 10.1117/12.2249700 *
JAN CVRCEK ET AL: "Development of a High-Quality Epoxy Bonding Technology", 2019 IEEE PHOTONICS CONFERENCE (IPC), 29 September 2019 (2019-09-29) - 3 October 2019 (2019-10-03), pages 1 - 2, XP055714030, ISBN: 978-1-7281-0615-1, DOI: 10.1109/IPCon.2019.8908302 *
ROGER A. PAQUIN: "Materials for optical systems", OPTICAL ENGINEERING HANDBOOK, 1 January 1999 (1999-01-01), XP055231434, Retrieved from the Internet <URL:http://www.astrobooks.ru/download.php?ssid=34604&file=ofc_ch03.pdf> [retrieved on 20151126] *

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