WO2021080546A1 - Thermal graphite sponge - Google Patents

Thermal graphite sponge Download PDF

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Publication number
WO2021080546A1
WO2021080546A1 PCT/TR2020/050980 TR2020050980W WO2021080546A1 WO 2021080546 A1 WO2021080546 A1 WO 2021080546A1 TR 2020050980 W TR2020050980 W TR 2020050980W WO 2021080546 A1 WO2021080546 A1 WO 2021080546A1
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WO
WIPO (PCT)
Prior art keywords
heat
sponge
graphite
thermal
chip
Prior art date
Application number
PCT/TR2020/050980
Other languages
French (fr)
Inventor
Soner UMAÇ
Original Assignee
Srmco Elektri̇k İç Ve Diş Ti̇c. San. Ltd. Şti̇.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Srmco Elektri̇k İç Ve Diş Ti̇c. San. Ltd. Şti̇. filed Critical Srmco Elektri̇k İç Ve Diş Ti̇c. San. Ltd. Şti̇.
Publication of WO2021080546A1 publication Critical patent/WO2021080546A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/046—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite

Definitions

  • the invention relates to a thermal graphite sponge that allows cooling the materials and extending the economic life of the same by providing heat transfer of the heat material groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays.
  • COF chip on film
  • COG chip on glass
  • COP chip on plastic
  • LCD liquid crystal display
  • OLED organic light emitting diodes
  • LED light emitting diode
  • Displays have become a permanent part of the human life with the developing technology.
  • the displays are continuously developed so as to provide the efficiency and high resolution required by the human being with the rapid development of technology.
  • displays such as LCD (Liquid Crystal Display), OLED (Organic Light Emitting Diodes), LED (Light Emitting Diode) is actively used in the devices such as televisions, laptops, phones and tablets etc.
  • heat material groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) are used. These material groups that heat and emit heat are required to be cooled effectively.
  • the invention subject to description relates to a thermal graphite sponge that provides heat transfer of the material groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays.
  • COF chip on film
  • COG chip on glass
  • COP chip on plastic
  • LCD liquid crystal display
  • OLED organic light emitting diodes
  • LED light emitting diode
  • Carbon conductors used in the state of the art may leave dust and similar particles on the materials in which they are used. These dusts may give damage to the electronic components of the display in time.
  • a thermal graphite sheet and production method thereof is disclosed in a Taiwan patent application numbered TW201408594 (A) encountered in the literature research made.
  • Said product relates to a graphite film sheet whose thickness is made thin, does not contain thermal sponge in its structure and does not have similar features around the graphite such as film and the like. It does not have sufficient flexibility and compressibility. It is estimated that the cooling and heat transfer efficiency is low. Spread of the graphite dusts around due to lack of film around the graphite.
  • the invention is a thermal graphite sponge which exceeds the state of the art, eliminates the disadvantages and has some additional features.
  • the aim of the invention is to provide a thermal graphite sponge so as to provide heat transfer of the material groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays.
  • COF chip on film
  • COG chip on glass
  • COP chip on plastic
  • LCD liquid crystal display
  • OLED organic light emitting diodes
  • LED light emitting diode
  • Another aim of the invention is to provide a thermal graphite sponge that prevents the formation of point hot areas so as to provide heat transfer in the material groups that heat and emit heat.
  • Another aim of the invention is to provide a novel thermal graphite sponge with stretching and compressing abilities so as to be used on irregular and elastic surfaces of the COF (Chip on film), COG (Chip on glass), COP (Chip on plastic) materials.
  • Another aim of the invention is to provide a novel thermal graphite sponge in which the graphite surface is wrapped with a thin film so as to prevent graphite particles from leaving dust and residuals on the surface.
  • Another aim of the invention is to provide a novel thermal graphite sponge that is nonflammable, electromagnetic compatible, anti-vibration, with customizable sizes and providing electrical insulation.
  • the present invention is a thermal graphite sponge that allows cooling the products and extending the economic life of the same by providing heat transfer of the heat material and product groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays, characterized in that, it comprises the following; a heat resistant sponge that allows the thermal graphite sponge to be used in flexible and irregular areas by means of its ability of stretching and compression in the middle portion, an adhesive layer between the heat resistant sponge and the graphite layer that adheres the heat resistant sponge and the graphite layer, a graphite layer with high thermal conduction that is adhered to the adhesive layer and the heat resistant sponge, thermal conductive band on any surface thereof which absorbs the heat from material and product groups that heat and emit
  • Figure - 1 is a perspective view of the inventive thermal graphite sponge.
  • Figure - 2 is a section view of the inventive thermal graphite sponge.
  • Figure- 3 is a view showing the condition of the thermal graphite sponge used in COG type material.
  • Figure- 4 is a view showing the condition of the thermal graphite sponge used in COF type material.
  • Figure- 5 is a view showing the condition of the thermal graphite sponge used in COP type material.
  • thermo graphite sponge (10) is described by means of examples only for clarifying the subject matter such that no limiting effect is created.
  • a thermal graphite sponge (10) that allows cooling the products and extending the economic life of the same by providing heat transfer of the heat material and product groups that heat and emit heat such as COF (chip on film) (B), COG (chip on glass) (A), COP (chip on plastic) (C) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays.
  • COF chip on film
  • COG chip on glass
  • COP chip on plastic
  • LCD liquid crystal display
  • OLED organic light emitting diodes
  • LED light emitting diode
  • Thermal graphite sponge (10) has a rectangular prism form with oval edges according to the shape. However, it can be rectangular, square, circular, triangular, polygonal, planar (sheet), semicircular section as well as it can have a section form that cannot be defined in any form. Thermal graphite sponge (10) is a product made from a nonflammable, electromagnetic compatible, anti vibration, compressible and flexible material.
  • the thermal graphite sponge (10) comprises heat resistant sponge (14) at its center.
  • the external surface of said heat resistant sponge (14) is coated with the adhesive layer (13).
  • the adhesive layer (13) provides the adhesion of the heat resistant sponge (14) and the graphite layer (12).
  • the graphite layer (12) has high thermal conductivity.
  • effective heat transfer can be provided between product or material groups that heat or emit heat. It is possible to use the thermal graphite sponge (10) in flexible and irregular areas by means of the ability of stretching and compression of the heat resistant sponge (14).
  • the external surface of the graphite layer (12) is coated with PET film (11), thus the spread of the graphite dust and particles to the surface where the thermal graphite sponge (10) is used is eliminated.
  • Said band (15) can be a thermally conductive or non- thermally conductive band.
  • thermal graphite sponge (10) The views of the applied condition of the inventive thermal graphite sponge (10) are given in Figure 3 on COG (chip on glass) (A), in Figure 4 on COF (chip on film) (B) and in Figure 5 COP (chip on plastic) (C).
  • the thermal graphite sponge (10) can stretch and compress so as to realize the heat transfer massively between the material with non-planarform such as COF (chip on film) (B), COG (chip on glass) (A), COP (chip on plastic) (C) etc. This situation can be explicitly seen in the Figures 3, 4 and 5.
  • the thermal graphite sponge (10) can be used for the purpose of heat transfer in the LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays in the telecommunication equipment, consumer electronics, LED and thermal lighting, cooling and memory modules except for COF (chip on film) (B), COG (chip on glass) (A), COP (chip on plastic) (C) materials.

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  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention, in the telecommunication equipment, consumer electronics, LED and thermal lighting, cooling and memory modules, is a thermal graphite sponge (10) that allows cooling the products and extending the economic life of the same by providing heat transfer of the material and product groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays, characterized in that, it comprises the following; a heat resistant sponge (14) that allows the thermal graphite sponge (10) to be used in flexible and irregular areas by means of its ability of stretching and compression in the middle portion, an adhesive layer (13) between the heat resistant sponge (14) and the graphite layer (12) that adheres the heat resistant sponge (14) and the graphite layer (12), a graphite layer (12) with high thermal conduction that is adhered to the adhesive layer (13) and the heat resistant sponge (14), a thermal conductive band (15) on any surface thereof which absorbs the heat from material and product groups that heat and emit heat.

Description

THERMAL GRAPHITE SPONGE Technological Field:
The invention relates to a thermal graphite sponge that allows cooling the materials and extending the economic life of the same by providing heat transfer of the heat material groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays.
State of the Art:
Displays have become a permanent part of the human life with the developing technology. The displays are continuously developed so as to provide the efficiency and high resolution required by the human being with the rapid development of technology. In this sense, displays such as LCD (Liquid Crystal Display), OLED (Organic Light Emitting Diodes), LED (Light Emitting Diode) is actively used in the devices such as televisions, laptops, phones and tablets etc. In said new generation displays, heat material groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) are used. These material groups that heat and emit heat are required to be cooled effectively. The invention subject to description relates to a thermal graphite sponge that provides heat transfer of the material groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays.
Various malfunctions occur in the displays and their drives as a result of heating of the materials such as COF (chip on film), COG (chip on glass), COP (chip on plastic) that are used in LCD (liquid crystal display), OLED (organic light emitting diodes), and LED (light emitting diode) displays used in the state of the art. Shutdowns can be experienced on the displays. In the state of the art, mass cooling is applied so as to eliminate these problems. Since materials such as COF (chip on film), COG (chip on glass), COP (chip on plastic) are not plane materials depending on their structures, cooler contact can be obtained over tangent. For this reason, mass cooling carried out with the aluminum coolers and thermal pads cannot be used for these material types. Rather than mass cooling, only carbon based high thermal conductors can be used in the point contact. However, quick and effective cooling cannot be provided with the point contact cooling.
In the state of the art, in cooling materials such as COF (chip on film), COG (chip on glass), COP (chip on plastic), when point contact carbon conductors are used, overheating may be seen at points that are not in contact with the cooled material. This point heating may cause failures in the displays.
Carbon conductors used in the state of the art may leave dust and similar particles on the materials in which they are used. These dusts may give damage to the electronic components of the display in time.
A thermal graphite sheet and production method thereof is disclosed in a Taiwan patent application numbered TW201408594 (A) encountered in the literature research made. Said product relates to a graphite film sheet whose thickness is made thin, does not contain thermal sponge in its structure and does not have similar features around the graphite such as film and the like. It does not have sufficient flexibility and compressibility. It is estimated that the cooling and heat transfer efficiency is low. Spread of the graphite dusts around due to lack of film around the graphite.
Consequently, a thermal graphite sponge is required in which the state of the art is exceeded, the disadvantages are eliminated. Brief Description of the Invention:
The invention is a thermal graphite sponge which exceeds the state of the art, eliminates the disadvantages and has some additional features.
The aim of the invention is to provide a thermal graphite sponge so as to provide heat transfer of the material groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays.
Another aim of the invention is to provide a thermal graphite sponge that prevents the formation of point hot areas so as to provide heat transfer in the material groups that heat and emit heat.
Another aim of the invention is to provide a novel thermal graphite sponge with stretching and compressing abilities so as to be used on irregular and elastic surfaces of the COF (Chip on film), COG (Chip on glass), COP (Chip on plastic) materials.
Another aim of the invention is to provide a novel thermal graphite sponge in which the graphite surface is wrapped with a thin film so as to prevent graphite particles from leaving dust and residuals on the surface. Another aim of the invention is to provide a novel thermal graphite sponge that is nonflammable, electromagnetic compatible, anti-vibration, with customizable sizes and providing electrical insulation.
In order to fulfill all aims mentioned above and that will be understood from the following detailed description, in the telecommunication equipment, consumer electronics, LED and thermal lighting, cooling and memory modules, the present invention is a thermal graphite sponge that allows cooling the products and extending the economic life of the same by providing heat transfer of the heat material and product groups that heat and emit heat such as COF (chip on film), COG (chip on glass), COP (chip on plastic) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays, characterized in that, it comprises the following; a heat resistant sponge that allows the thermal graphite sponge to be used in flexible and irregular areas by means of its ability of stretching and compression in the middle portion, an adhesive layer between the heat resistant sponge and the graphite layer that adheres the heat resistant sponge and the graphite layer, a graphite layer with high thermal conduction that is adhered to the adhesive layer and the heat resistant sponge, thermal conductive band on any surface thereof which absorbs the heat from material and product groups that heat and emit heat. Description of the Figures:
The invention will be described with reference to the accompanying drawings, thus the characteristics of the invention will be understood clearly. However, the aim of this is not to limit the invention with such certain embodiments. On the contrary, it is aimed to cover all alternatives, amendments and equivalents which may be contained in the field defined by the accompanying claims. It is to be understood that the details shown are only shown for the sake of illustrating the preferred embodiments of the present invention and presented for both illustrating the methods and for providing description of the rules of the invention and the conceptual features of the invention to be easily understood. In these figures;
Figure - 1 is a perspective view of the inventive thermal graphite sponge. Figure - 2 is a section view of the inventive thermal graphite sponge. Figure- 3 is a view showing the condition of the thermal graphite sponge used in COG type material. Figure- 4 is a view showing the condition of the thermal graphite sponge used in COF type material.
Figure- 5 is a view showing the condition of the thermal graphite sponge used in COP type material.
The figures which enable to clarify this invention are enumerated as mentioned in the attached figure and they are given with their names herein below.
Description of the References:
10.Thermal graphite sponge
11. PET film
12. Graphite layer
13. Adhesive layer 14. Heat resistant sponge
15. Band
A. COG (chip on glass)
B. COF (chip on film)
C. COP (chip on plastic)
Description of the Invention:
In this detailed description, the inventive thermal graphite sponge (10) is described by means of examples only for clarifying the subject matter such that no limiting effect is created. In the description, in the telecommunication equipment, consumer electronics, LED and thermal lighting, cooling and memory modules, a thermal graphite sponge (10) that allows cooling the products and extending the economic life of the same by providing heat transfer of the heat material and product groups that heat and emit heat such as COF (chip on film) (B), COG (chip on glass) (A), COP (chip on plastic) (C) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays. In Figure 1, a perspective view of the inventive thermal graphite sponge (10) is given. Thermal graphite sponge (10) has a rectangular prism form with oval edges according to the shape. However, it can be rectangular, square, circular, triangular, polygonal, planar (sheet), semicircular section as well as it can have a section form that cannot be defined in any form. Thermal graphite sponge (10) is a product made from a nonflammable, electromagnetic compatible, anti vibration, compressible and flexible material.
In Figure 2, a perspective view of the inventive thermal graphite sponge (10) is given. Accordingly, the thermal graphite sponge (10), comprises heat resistant sponge (14) at its center. The external surface of said heat resistant sponge (14) is coated with the adhesive layer (13). The adhesive layer (13) provides the adhesion of the heat resistant sponge (14) and the graphite layer (12). The graphite layer (12) has high thermal conductivity. Thus, effective heat transfer can be provided between product or material groups that heat or emit heat. It is possible to use the thermal graphite sponge (10) in flexible and irregular areas by means of the ability of stretching and compression of the heat resistant sponge (14). The external surface of the graphite layer (12) is coated with PET film (11), thus the spread of the graphite dust and particles to the surface where the thermal graphite sponge (10) is used is eliminated. There is a band (15) on one surface of the thermal graphite sponge (10) that transmits the heat to the graphite layer (12) by contacting the surface of the product or material groups that heat or emit heat. Said band (15) can be a thermally conductive or non- thermally conductive band.
The views of the applied condition of the inventive thermal graphite sponge (10) are given in Figure 3 on COG (chip on glass) (A), in Figure 4 on COF (chip on film) (B) and in Figure 5 COP (chip on plastic) (C). The thermal graphite sponge (10) can stretch and compress so as to realize the heat transfer massively between the material with non-planarform such as COF (chip on film) (B), COG (chip on glass) (A), COP (chip on plastic) (C) etc. This situation can be explicitly seen in the Figures 3, 4 and 5. The thermal graphite sponge (10) can be used for the purpose of heat transfer in the LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays in the telecommunication equipment, consumer electronics, LED and thermal lighting, cooling and memory modules except for COF (chip on film) (B), COG (chip on glass) (A), COP (chip on plastic) (C) materials.

Claims

1- The invention is a thermal graphite sponge (10) that allows cooling the products and extending the economic life of the same by providing heat transfer (transmission) of the material and product groups that heat and emit heat such as COF (chip on film) (B), COG (chip on glass) (A), COP (chip on plastic) (C) used in LCD (liquid crystal display), OLED (organic light emitting diodes), LED (light emitting diode) displays, in the telecommunication equipment, consumer electronics, LED and thermal lighting, cooling and memory modules, characterized in that, it comprises the following;
- a heat resistant sponge (14) that allows the thermal graphite sponge (10) to be used in flexible and irregular areas by means of its ability of stretching and compression in the middle portion,
- an adhesive layer (13) between the heat resistant sponge (14) and the graphite layer (12) that adheres the heat resistant sponge (14) and the graphite layer (12),
- a graphite layer (12) with high thermal conduction that is adhered to the adhesive layer (13) and the heat resistant sponge (14),
- a thermal conductive band (15) on any surface thereof which absorbs the heat from material and product groups that heat and emit heat.
2- Thermal graphite sponge (10) according to claim 1, characterized in that; it can have rectangular, square, circular, triangular, polygonal, planar (sheet), semicircular section as well as it can have a section form that cannot be defined in any form.
3- Thermal graphite sponge (10) according to claim 1, characterized in that; it comprises PET film (11) on the graphite layer (12) that eliminates spread of graphite dust and particles to the surface.
PCT/TR2020/050980 2019-10-24 2020-10-22 Thermal graphite sponge WO2021080546A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TR2019/16510 2019-10-24
TR201916510 2019-10-24

Publications (1)

Publication Number Publication Date
WO2021080546A1 true WO2021080546A1 (en) 2021-04-29

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WO (1) WO2021080546A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
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