WO2021077772A1 - 一种电缆接头均压罩 - Google Patents
一种电缆接头均压罩 Download PDFInfo
- Publication number
- WO2021077772A1 WO2021077772A1 PCT/CN2020/097253 CN2020097253W WO2021077772A1 WO 2021077772 A1 WO2021077772 A1 WO 2021077772A1 CN 2020097253 W CN2020097253 W CN 2020097253W WO 2021077772 A1 WO2021077772 A1 WO 2021077772A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- passive wireless
- pressure equalizing
- temperature measurement
- chip
- groove
- Prior art date
Links
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G15/00—Cable fittings
- H02G15/08—Cable junctions
- H02G15/10—Cable junctions protected by boxes, e.g. by distribution, connection or junction boxes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
Definitions
- the invention relates to the technical field of power equipment, in particular to a pressure equalizing cover for cable joints.
- the present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention proposes a pressure equalizing cover for cable joints, and a built-in passive wireless temperature measurement chip can improve the accuracy of temperature detection.
- a pressure equalizing cover body wherein a groove is opened on the outside of the pressure equalizing cover body
- Passive wireless temperature measurement chip used to detect the internal temperature of the cable connector and feedback the temperature signal to the external receiving antenna
- the chip fixing mechanism is used to fix the passive wireless temperature measurement chip in the groove.
- the voltage equalization cover of the cable connector according to the first embodiment of the present invention has at least the following beneficial effects: by slotting on the outside of the voltage equalization cover and built-in a passive wireless temperature measurement chip in the groove, accurate temperature measurement can be realized directly from the inside of the cable connector , To avoid the interference of external temperature changes, and the temperature measurement chip does not require power supply and wired transmission modules, which is convenient to install and use, and effectively reduces costs.
- the model of the passive wireless temperature measurement chip is TSC2020-3.
- the model of the passive wireless temperature measurement chip is TSC2509-3.
- the model of the passive wireless temperature measurement chip is TSC1309-3.
- the chip fixing mechanism is a filling layer poured in the groove.
- the filling layer is epoxy resin.
- Figure 1 is a front view of a voltage equalizing cover for a cable connector according to an embodiment of the present invention
- Fig. 2 is a side view of a pressure equalizing cover for a cable connector according to an embodiment of the present invention
- Fig. 3 is a top view of a pressure equalizing cover for a cable connector according to an embodiment of the present invention.
- Chip fixing mechanism 300
- orientation description involved such as up, down, front, back, left, right, etc. indicates the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, but In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be configured and operate in a specific orientation, and therefore cannot be understood as a limitation to the present invention.
- a voltage equalization cover for a cable connector includes: a voltage equalization cover body 100, a passive wireless temperature measurement chip 200, and a chip fixing mechanism 300.
- a groove 110 is provided on the outside of the cover body 100 and a metal reflective surface is formed to enhance the temperature measurement signal of the passive wireless temperature measurement chip 200; the passive wireless temperature measurement chip 200 is used to detect the internal temperature of the cable joint and feedback to the external receiving antenna Temperature signal; a chip fixing mechanism 300 for fixing the passive wireless temperature measurement chip 200 in the groove 110.
- the temperature measurement chip 200 According to the voltage equalization cover of the cable connector of the embodiment of the present invention, by slotting on the outside of the voltage equalization cover and built-in the passive wireless temperature measurement chip 200 in the groove 110, accurate temperature measurement can be realized directly from the inside of the cable connector, avoiding external temperature changes At the same time, the temperature measurement chip does not need power supply and wired transmission module, which is convenient to install and use, and effectively reduces costs.
- grooves in this technical solution are grooved on the basis of the conventional pressure equalizing cover, and the grooves of the pressure equalizing cover are not limited to the shape, size, position, depth, number, etc. in this solution.
- passive wireless temperature measurement chips 200 there are one or more passive wireless temperature measurement chips 200, the number is not uniquely limited, and the specific number is set according to actual needs.
- the model of the passive wireless temperature measurement chip 200 is TSC2020-3, TSC2509-3 or TSC1309-3. These models are only used as specific examples of the technical solution, and may also be other conventionally known Source wireless temperature measurement chip 200 model.
- the passive wireless temperature measurement chip 200 receives the broadcast signal sent by the external reader/writer antenna through the antenna to obtain electromagnetic wave energy as a working power source, and feeds the collected temperature signal to the receiving antenna of the external reader/writer through the antenna.
- the chip fixing mechanism 300 is a filling layer poured in the groove 110.
- other conventionally known fixing structures such as solder paste, fasteners, adhesive tapes, etc., can also be used to realize the fixing of the temperature measurement chip in the groove.
- the filling layer is preferably epoxy resin, and other known resin materials instead of epoxy resin may also be used.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
Description
Claims (7)
- 一种电缆接头均压罩,其特征在于,包括:均压罩本体,所述均压罩本体的外侧开设有一凹槽;无源无线测温芯片,用于检测电缆接头内部温度并向外部接收天线反馈温度信号;芯片固定机构,用于将所述无源无线测温芯片固定于所述凹槽内。
- 根据权利要求1所述的电缆接头均压罩,其特征在于,所述无源无线测温芯片具有一个或多个。
- 根据权利要求1所述的电缆接头均压罩,其特征在于,所述无源无线测温芯片型号为TSC2020-3。
- 根据权利要求1所述的电缆接头均压罩,其特征在于,所述无源无线测温芯片型号为TSC2509-3。
- 根据权利要求1所述的电缆接头均压罩,其特征在于,所述无源无线测温芯片型号为TSC1309-3。
- 根据权利要求1所述的电缆接头均压罩,其特征在于,所述芯片固定机构为浇筑在所述凹槽内的填充层。
- 根据权利要求6所述的电缆接头均压罩,其特征在于,所述填充层为环氧树脂。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911002142.0 | 2019-10-21 | ||
CN201911002142.0A CN110707655A (zh) | 2019-10-21 | 2019-10-21 | 一种电缆接头均压罩 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021077772A1 true WO2021077772A1 (zh) | 2021-04-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/097253 WO2021077772A1 (zh) | 2019-10-21 | 2020-06-19 | 一种电缆接头均压罩 |
Country Status (2)
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CN (1) | CN110707655A (zh) |
WO (1) | WO2021077772A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110707655A (zh) * | 2019-10-21 | 2020-01-17 | 长缆电工科技股份有限公司 | 一种电缆接头均压罩 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070032139A1 (en) * | 2005-07-29 | 2007-02-08 | Chen Min L | Electric device heat-sensitive sleeve structure |
CN206648754U (zh) * | 2016-09-20 | 2017-11-17 | 南京科睿博电气科技有限公司 | 一种包含无源无线温度传感器的高压电缆附件 |
CN110707655A (zh) * | 2019-10-21 | 2020-01-17 | 长缆电工科技股份有限公司 | 一种电缆接头均压罩 |
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2019
- 2019-10-21 CN CN201911002142.0A patent/CN110707655A/zh active Pending
-
2020
- 2020-06-19 WO PCT/CN2020/097253 patent/WO2021077772A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070032139A1 (en) * | 2005-07-29 | 2007-02-08 | Chen Min L | Electric device heat-sensitive sleeve structure |
CN206648754U (zh) * | 2016-09-20 | 2017-11-17 | 南京科睿博电气科技有限公司 | 一种包含无源无线温度传感器的高压电缆附件 |
CN110707655A (zh) * | 2019-10-21 | 2020-01-17 | 长缆电工科技股份有限公司 | 一种电缆接头均压罩 |
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