WO2021077704A1 - Method of cutting optical imaging element - Google Patents

Method of cutting optical imaging element Download PDF

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Publication number
WO2021077704A1
WO2021077704A1 PCT/CN2020/086932 CN2020086932W WO2021077704A1 WO 2021077704 A1 WO2021077704 A1 WO 2021077704A1 CN 2020086932 W CN2020086932 W CN 2020086932W WO 2021077704 A1 WO2021077704 A1 WO 2021077704A1
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optical imaging
imaging element
viewpoint
aerial
cutting
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PCT/CN2020/086932
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French (fr)
Chinese (zh)
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颜展
张兵
韩成
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像航(上海)科技有限公司
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Publication of WO2021077704A1 publication Critical patent/WO2021077704A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0012Optical design, e.g. procedures, algorithms, optimisation routines

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  • the present invention relates to the manufacturing technology of optical elements, in particular to a cutting method of optical imaging elements.
  • the prior art optical imaging element (microchannel matrix optical waveguide plate) is used for non-medium floating imaging, but now it is generally manufactured by standardized or modular manufacturing, and its size and shape are fixed, and in actual manufacturing, the element
  • the size of is generally large, and in actual application scenarios, there are often site and space restrictions. Not only may the size be smaller, but also strict requirements may be imposed on the specific shape.
  • Many imaging units in the components actually fail to function. Therefore, the size and shape of the existing optical imaging components are difficult to adapt to actual application scenarios, and commercial promotion and large-scale applications are quite difficult.
  • a method for cutting an optical imaging element which includes the following steps:
  • the aerial imaging is located between the viewpoint and the optical imaging element;
  • All projection points of the viewpoint on the plane where the optical imaging element is located enclose a projection area
  • the optical imaging element is cut out according to the outline of the projection area.
  • the aerial imaging is irradiated with several rays, and the several rays form a shadow of the aerial imaging on the plane where the optical imaging element is located, and the shadow is a projection area.
  • the ray is a virtual light
  • the shadow is a virtual shadow
  • the actual rays of the ray are simulated by real objects in the aerial imaging, and the shadows are actual shadows.
  • optical imaging element is a microchannel matrix optical waveguide plate.
  • the optical imaging element includes a light-transmitting laminate arranged in multiple layers, and each layer of the light-transmitting laminate includes a plurality of transparent strips attached side by side, and the bonding surface of the transparent strip and/or the bonding surface
  • the opposite surface is provided with a reflective surface, the reflective surface is made of vaporized/plated metal, or a pasted reflective film, and the transparent strips of the adjacent layers are orthogonal to each other.
  • the angle between the two sides of the optimal reflection area and the two orthogonal transparent bars is not less than 15°.
  • the body of the aerial imaging and the aerial imaging are symmetrical with respect to the optical imaging element, and the viewpoint is located in the optimal reflection zone.
  • the posture of the optical imaging element includes the direction of the plane of the light-transmitting laminate and the direction of the transparent strip.
  • the imaging quality can be kept unchanged, the cost can be reduced, the occupied space can be saved, and the use scene can be expanded.
  • FIG. 1 is a method flowchart of a method for cutting an optical imaging element according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of an orthogonal structure of an optical imaging element according to an optical imaging element cutting method according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of the principle of the optimal reflection area of the cutting method of the optical imaging element according to the embodiment of the present invention.
  • FIG. 4 is one of the schematic diagram examples of the projection of the viewpoint on the plane of the optical imaging element according to the cutting method of the optical imaging element according to the embodiment of the present invention
  • FIG. 5 is a schematic diagram of the structure of the optical imaging element cut according to the projection area in FIG. 4;
  • FIG. 7 is a schematic diagram of the structure of the optical imaging element cut according to the projection area in FIG. 6.
  • FIGS. 1-7 which is used for the production of optical imaging elements, which can cut various shapes of optical imaging elements, and has a wide range of application scenarios.
  • the optical imaging element cutting method according to the embodiment of the present invention, in this embodiment, as shown in Figures 2 and 3, the optical imaging element is a micro-channel matrix optical waveguide flat plate, including a multilayer stack
  • the light-transmitting laminate 1 is provided, and each layer of the light-transmitting laminate 1 includes a plurality of transparent strips 11 attached side by side.
  • the bonding surface of the transparent strip 11 and/or the opposite surface of the bonding surface is provided with a reflective surface. Pasted reflective film or vaporized/plated metal layer, vaporized/plated silver or aluminum, etc., the transparent strips 11 of adjacent layers are orthogonal to each other, and the method of cutting the optical imaging element includes the following steps:
  • step 1 as shown in Figures 1, 4, and 6, the aerial imaging viewpoint E is determined according to the application scenario, assuming that the coordinates of the viewpoint are E(x0, y0, z0), and the viewpoint is the viewing point of the user viewing aerial imaging point.
  • step 2 as shown in Figures 1, 4, and 6, according to the viewpoint E, the specific display position of the aerial imaging Q is determined, assuming that the set of points of the aerial imaging Q ⁇ Tn(xn,yn,zn)
  • the optimal reflection area 2 of the optical imaging element is determined according to the position of the viewpoint E and the specific position of the aerial imaging Q; in this embodiment, two of the optimal reflection area 2
  • the angle between the side boundary and the two orthogonal transparent strips 11 is not less than 15°
  • the boundary angle range of the optimal reflection zone 2 is not more than 60°
  • 60° is the best and maximum range to ensure the best imaging effect .
  • step 4 as shown in Figures 1, 4, and 6, the posture and position of the optical imaging element are determined according to the optimal reflection zone 2; in this embodiment, the body of the aerial imaging Q and the aerial imaging Q are symmetrical with respect to the optical imaging element ,
  • the viewpoint E is located in the optimal reflection zone 2, therefore, the posture of the optical imaging element includes: the direction of the plane of the light-transmitting laminate 1 and the direction of the transparent strip 11.
  • step 5 the viewpoint E is projected to the plane where the optical imaging element is located in multiple directions.
  • the multiple directions are the viewpoints.
  • the direction of the line connecting each point of the contour of E and the aerial imaging Q, that is, the viewpoint E is projected to the plane where the optical imaging element is located through the ray ETn.
  • the viewpoint E is not inside the aerial imaging, and the aerial imaging Q is located at the viewpoint E and Between optical imaging elements.
  • the projection of point E on the plane where the optical imaging element is located can be achieved by the following two methods, and the projection area can be obtained:
  • the real object is illuminated by the actual light source.
  • the real object is simulated according to the contour of the aerial imaging Q. After the real object is blocked, it is left on the plane where the optical imaging element is located.
  • the actual shadow is the projection area.
  • step 7 as shown in Figures 1, 5, and 7, the optical imaging element is cut out according to the outline of the projection area, that is, the minimum shape and size of the optical imaging element of the microchannel matrix optical waveguide plate, which greatly saves consumables and costs. , And save floor space.
  • the shape of the projection area can be various shapes, therefore, the application scenarios are greatly expanded.
  • FIGS. 1-7 the cutting method of the optical imaging element according to the embodiment of the present invention is described with reference to FIGS. 1-7, which can not only ensure the imaging quality is unchanged, but also reduce the cost, save the occupied space, and expand the use scene.

Abstract

Disclosed is a method of cutting an optical imaging element, comprising the following steps: determining a viewpoint of an aerial image on the basis of an application scenario, where the viewpoint is a point from which a user views the aerial image; determining a specific display position of the aerial image on the basis of the viewpoint; determining an optimal reflection region of an optical imaging element on the basis of the position of the viewpoint and the specific display position of the aerial image; determining a posture and a position of the optical imaging element on the basis of the optimal reflection region; projecting the viewpoint along multiple directions to a plane in which the optical imaging element is located, where the multiple directions are directions connecting the viewpoint to each point of an outline of the aerial image, the viewpoint is not within the aerial image, and the aerial image is located between the viewpoint and the optical imaging element; forming a projection region by enclosing all projected points of the viewpoint on the plane in which the optical imaging element is located; and performing cutting on the optical imaging element on the basis of the outline of the projection region. The present invention is capable of ensuring an unchanged image quality, reducing costs, saving floor space, and expanding application scenarios.

Description

光学成像元件的切割方法Cutting method of optical imaging element 技术领域Technical field
本发明涉及光学元件的制造技术,特别涉及一种光学成像元件的切割方法。The present invention relates to the manufacturing technology of optical elements, in particular to a cutting method of optical imaging elements.
背景技术Background technique
现有技术的光学成像元件(微通道矩阵光波导平板)用于无介质浮空成像,但在现在一般都是采用标准化制造或模块化制造,其尺寸和形状固定,并且,实际制造时,元件的尺寸一般较大,而在实际应用场景中,很多时候会出现场地、空间的限制,不仅可能会要求尺寸小一些,也可能会对具体形状提出苛刻的要求,同时,由于成像原理的限制,元件中的很多成像单元实际并未能真正发挥作用,因此,现有的光学成像元件的尺寸和形状都难以较好适应实际应用场景,商业推广和规模应用存在较大难度。The prior art optical imaging element (microchannel matrix optical waveguide plate) is used for non-medium floating imaging, but now it is generally manufactured by standardized or modular manufacturing, and its size and shape are fixed, and in actual manufacturing, the element The size of is generally large, and in actual application scenarios, there are often site and space restrictions. Not only may the size be smaller, but also strict requirements may be imposed on the specific shape. At the same time, due to the limitation of the imaging principle, Many imaging units in the components actually fail to function. Therefore, the size and shape of the existing optical imaging components are difficult to adapt to actual application scenarios, and commercial promotion and large-scale applications are quite difficult.
发明内容Summary of the invention
根据本发明实施例,提供了一种光学成像元件的切割方法,包含如下步骤:According to an embodiment of the present invention, a method for cutting an optical imaging element is provided, which includes the following steps:
根据应用场景确定空中成像的视点,所述视点为用户观看空中成像的观看点;Determine a viewpoint of aerial imaging according to the application scenario, where the viewpoint is a viewpoint from which a user views aerial imaging;
根据所述视点,确定空中成像的具体显示位置;Determine the specific display position of aerial imaging according to the viewpoint;
根据所述视点的位置和所述空中成像的具体显示位置,确定所述光学成像元件的最优反射区;Determining the optimal reflection area of the optical imaging element according to the position of the viewpoint and the specific display position of the aerial imaging;
根据最优反射区确定所述光学成像元件的姿态和位置;Determining the posture and position of the optical imaging element according to the optimal reflection area;
将所述视点沿多个方向投影至所述光学成像元件所在平面,所述多个方向为所述视点与所述空中成像的轮廓各个点的连线方向,所述视点不在所述空中成像内部,所述空中成像位于视点与光学成像元件之间;Project the viewpoint to the plane where the optical imaging element is located in multiple directions, where the multiple directions are the connection directions between the viewpoint and each point of the contour of the aerial imaging, and the viewpoint is not inside the aerial imaging , The aerial imaging is located between the viewpoint and the optical imaging element;
所述视点在所述光学成像元件所在平面的所有投影点围成投影区;All projection points of the viewpoint on the plane where the optical imaging element is located enclose a projection area;
按照所述投影区的轮廓切割出光学成像元件。The optical imaging element is cut out according to the outline of the projection area.
进一步,以所述视点为起点,通过若干射线照射所述空中成像,所述若干射线在所述光学成像元件所在平面上形成所述空中成像的阴影,该阴影为投影区。Further, taking the viewpoint as a starting point, the aerial imaging is irradiated with several rays, and the several rays form a shadow of the aerial imaging on the plane where the optical imaging element is located, and the shadow is a projection area.
进一步,所述射线为虚拟光线,所述阴影为虚拟阴影。Further, the ray is a virtual light, and the shadow is a virtual shadow.
进一步,所述射线实际光线,所述空中成像用实物模拟,所述阴影为实际阴影。Further, the actual rays of the ray are simulated by real objects in the aerial imaging, and the shadows are actual shadows.
进一步,所述光学成像元件为微通道矩阵光波导平板。Further, the optical imaging element is a microchannel matrix optical waveguide plate.
进一步,所述光学成像元件包含多层层叠设置的透光层叠体,所述每层透光层叠体包含若干并排贴合的透明条,所述透明条的贴合面和/或该贴合面的相对面设有反射面,所述反射面为蒸/电镀金属,或粘贴的反射膜,所述相邻层的透明条相互正交。Further, the optical imaging element includes a light-transmitting laminate arranged in multiple layers, and each layer of the light-transmitting laminate includes a plurality of transparent strips attached side by side, and the bonding surface of the transparent strip and/or the bonding surface The opposite surface is provided with a reflective surface, the reflective surface is made of vaporized/plated metal, or a pasted reflective film, and the transparent strips of the adjacent layers are orthogonal to each other.
进一步,所述最优反射区的两侧边界与正交的两根透明条的夹角都不小于15°。Further, the angle between the two sides of the optimal reflection area and the two orthogonal transparent bars is not less than 15°.
进一步,所述空中成像的本体与所述空中成像相对光学成像元件对称,所述视点位于所述最优反射区中。Further, the body of the aerial imaging and the aerial imaging are symmetrical with respect to the optical imaging element, and the viewpoint is located in the optimal reflection zone.
所述光学成像元件的姿态包含:透光层叠体平面的朝向和透明条的方向。The posture of the optical imaging element includes the direction of the plane of the light-transmitting laminate and the direction of the transparent strip.
根据本发明实施例的光学成像元件的切割方法,既能保证成像品质不变,还能降低成本,并节约占地空间,扩展使用场景。According to the cutting method of the optical imaging element according to the embodiment of the present invention, the imaging quality can be kept unchanged, the cost can be reduced, the occupied space can be saved, and the use scene can be expanded.
要理解的是,前面的一般描述和下面的详细描述两者都是示例性的,并且意图在于提供要求保护的技术的进一步说明。It should be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the claimed technology.
附图说明Description of the drawings
图1为根据本发明实施例光学成像元件的切割方法的方法流程图;FIG. 1 is a method flowchart of a method for cutting an optical imaging element according to an embodiment of the present invention;
图2为根据本发明实施例光学成像元件的切割方法的光学成像元件的正交结构示意图;2 is a schematic diagram of an orthogonal structure of an optical imaging element according to an optical imaging element cutting method according to an embodiment of the present invention;
图3为根据本发明实施例光学成像元件的切割方法的最优反射区的原理示意图;3 is a schematic diagram of the principle of the optimal reflection area of the cutting method of the optical imaging element according to the embodiment of the present invention;
图4为根据本发明实施例光学成像元件的切割方法的视点在光学成像元件平面的投影示意图示例之一;4 is one of the schematic diagram examples of the projection of the viewpoint on the plane of the optical imaging element according to the cutting method of the optical imaging element according to the embodiment of the present invention;
图5为根据图4中的投影区切割后的光学成像元件的结构示意图;5 is a schematic diagram of the structure of the optical imaging element cut according to the projection area in FIG. 4;
图6为根据本发明实施例光学成像元件的切割方法的视点在光学成像元件平面的投影示意图示例之二;6 is the second example of the projection of the viewpoint on the plane of the optical imaging element according to the cutting method of the optical imaging element according to the embodiment of the present invention;
图7为根据图6中的投影区切割后的光学成像元件的结构示意图。FIG. 7 is a schematic diagram of the structure of the optical imaging element cut according to the projection area in FIG. 6.
具体实施方式Detailed ways
以下将结合附图,详细描述本发明的优选实施例,对本发明做进一步阐述。Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and the present invention will be further explained.
首先,将结合图1~7描述根据本发明实施例的光学成像元件的切割方法,用于光学成像元件的制作,能够切割出各种形状的光学成像元件,应用场景很广。First, the cutting method of the optical imaging element according to the embodiment of the present invention will be described with reference to FIGS. 1-7, which is used for the production of optical imaging elements, which can cut various shapes of optical imaging elements, and has a wide range of application scenarios.
如图1~7所示,根据本发明实施例的光学成像元件的切割方法,在本实施例中,如图2、3所示,光学成像元件为微通道矩阵光波导平板,包含多层层叠设置的透光层叠体1,每层透光层叠体1包含若干并排贴合的透明条11,透明条11的贴合面和/或该贴合面的相对面设有反射面,反射面为粘贴的反射膜或蒸/镀金属层,蒸/镀银或铝等,相邻层的透明条11相互正交,切割光学成像元件的方法包含如下步骤:As shown in Figures 1-7, the optical imaging element cutting method according to the embodiment of the present invention, in this embodiment, as shown in Figures 2 and 3, the optical imaging element is a micro-channel matrix optical waveguide flat plate, including a multilayer stack The light-transmitting laminate 1 is provided, and each layer of the light-transmitting laminate 1 includes a plurality of transparent strips 11 attached side by side. The bonding surface of the transparent strip 11 and/or the opposite surface of the bonding surface is provided with a reflective surface. Pasted reflective film or vaporized/plated metal layer, vaporized/plated silver or aluminum, etc., the transparent strips 11 of adjacent layers are orthogonal to each other, and the method of cutting the optical imaging element includes the following steps:
在步骤1中,如图1、4、6所示,根据应用场景确定空中成像的视点E,假设该视点的坐标为E(x0,y0,z0),所述视点为用户观看空中成像的观看点。In step 1, as shown in Figures 1, 4, and 6, the aerial imaging viewpoint E is determined according to the application scenario, assuming that the coordinates of the viewpoint are E(x0, y0, z0), and the viewpoint is the viewing point of the user viewing aerial imaging point.
在步骤2中,如图1、4、6所示,根据所述视点E,确定空中成像Q的具体显示位置,假设空中成像Q的点的集合{Tn(xn,yn,zn)|n∈N}。In step 2, as shown in Figures 1, 4, and 6, according to the viewpoint E, the specific display position of the aerial imaging Q is determined, assuming that the set of points of the aerial imaging Q {Tn(xn,yn,zn)|n∈ N}.
在步骤3中,如图1、3所示,根据视点E的位置和空中成像Q的具体位置,确定光学成像元件的最优反射区2;在本实施例中,最优反射区2的两侧边界与正交的两根透明条11的夹角都不小于15°,最优反射区2的边界夹角范围不大于60°,以60°为最佳、最大范围,保证最佳成像效果。In step 3, as shown in Figures 1 and 3, the optimal reflection area 2 of the optical imaging element is determined according to the position of the viewpoint E and the specific position of the aerial imaging Q; in this embodiment, two of the optimal reflection area 2 The angle between the side boundary and the two orthogonal transparent strips 11 is not less than 15°, the boundary angle range of the optimal reflection zone 2 is not more than 60°, and 60° is the best and maximum range to ensure the best imaging effect .
在步骤4中,如图1、4、6所示,根据最优反射区2确定光学成像元件的姿态和位置;在本实施例中,空中成像Q的本体与空中成像Q相对光学成像元件对称,视点E位于最优反射区2中,因此,光学成像元件的姿态包含:透光层叠体1平面的朝向和透明条11的方向。In step 4, as shown in Figures 1, 4, and 6, the posture and position of the optical imaging element are determined according to the optimal reflection zone 2; in this embodiment, the body of the aerial imaging Q and the aerial imaging Q are symmetrical with respect to the optical imaging element , The viewpoint E is located in the optimal reflection zone 2, therefore, the posture of the optical imaging element includes: the direction of the plane of the light-transmitting laminate 1 and the direction of the transparent strip 11.
在步骤5中,如图1、4、6所示,将视点E沿多个方向投影至光学成像元件所在平面,假设该平面为Ax+By+Cz+D=0,该多个方向为视点E与空中成像Q的轮廓各个点的连线方向,即通过射线ETn将视点E向光学成像元件所在平面进行投影,在本实施例中,视点E不在空中成像内部,空中成像Q位于视点E与光学成像元件之间。In step 5, as shown in Figures 1, 4, and 6, the viewpoint E is projected to the plane where the optical imaging element is located in multiple directions. Assuming that the plane is Ax+By+Cz+D=0, the multiple directions are the viewpoints. The direction of the line connecting each point of the contour of E and the aerial imaging Q, that is, the viewpoint E is projected to the plane where the optical imaging element is located through the ray ETn. In this embodiment, the viewpoint E is not inside the aerial imaging, and the aerial imaging Q is located at the viewpoint E and Between optical imaging elements.
在步骤6中,如图1、4、6所示,视点E在所述光学成像元件所在平面,即Ax+By+Cz+D=0的所有投影点围成投影区。In step 6, as shown in FIGS. 1, 4, and 6, the viewpoint E is on the plane where the optical imaging element is located, that is, all the projection points of Ax+By+Cz+D=0 enclose a projection area.
在本实施例中,可以通过如下两张方法实现E点在光学成像元件所在平面的投影并获得投影区:In this embodiment, the projection of point E on the plane where the optical imaging element is located can be achieved by the following two methods, and the projection area can be obtained:
方法一:method one:
如图1、4、6所示,以视点E为起点,获得射线ETn的坐标,虚拟照射空中成像Q,即{Tn(xn,yn,zn)|n∈N},射线ETn与Ax+By+Cz+D=0相交,空中成像Q的点集虚拟遮挡后,形成的阴影的所有交点的集合为{Tn’(xn’,yn’,zn’)|n∈N},该集合即为投影区。因此,在本方法中,通过坐标系和视点E、空中成像Q以及光学成像元件所在平面的坐标,模拟用户视线,采用虚拟光线作为射线,获得虚拟阴影。As shown in Figures 1, 4, and 6, taking the viewpoint E as the starting point, the coordinates of the ray ETn are obtained, and the aerial image Q is irradiated virtually, ie {Tn(xn,yn,zn)|n∈N}, the ray ETn and Ax+By +Cz+D=0 intersect, after the point set of aerial imaging Q is virtually occluded, the set of all the intersection points of the shadow formed is {Tn'(xn',yn',zn')|n∈N}, this set is Projection area. Therefore, in this method, the user's line of sight is simulated through the coordinate system and the viewpoint E, the aerial imaging Q, and the coordinates of the plane where the optical imaging element is located, and virtual light rays are used as rays to obtain virtual shadows.
方法二:Method Two:
如图1、4、6所示,以视点E为起点,通过实际光源对实物进行照射,该实物按照空中成像Q的轮廓进行实物模拟,经过实物遮挡后,在光学成像元件所在平面上留下了实际阴影,即为投影区。As shown in Figures 1, 4, and 6, taking the viewpoint E as the starting point, the real object is illuminated by the actual light source. The real object is simulated according to the contour of the aerial imaging Q. After the real object is blocked, it is left on the plane where the optical imaging element is located. The actual shadow is the projection area.
在步骤7中,如图1、5、7所示,按照投影区的轮廓切割出光学成像元件,即为微通道矩阵光波导平板的光学成像元件的最小形状与大小,大大节约了耗材和成本,并节约了占地空间。并且,该投影区的形状可以为各种形状,因此,大大扩展了应用场景。In step 7, as shown in Figures 1, 5, and 7, the optical imaging element is cut out according to the outline of the projection area, that is, the minimum shape and size of the optical imaging element of the microchannel matrix optical waveguide plate, which greatly saves consumables and costs. , And save floor space. Moreover, the shape of the projection area can be various shapes, therefore, the application scenarios are greatly expanded.
以上,参照图1~7描述了根据本发明实施例的光学成像元件的切割方法,既能保证成像品质不变,还能降低成本,并节约占地空间,扩展使用场景。Above, the cutting method of the optical imaging element according to the embodiment of the present invention is described with reference to FIGS. 1-7, which can not only ensure the imaging quality is unchanged, but also reduce the cost, save the occupied space, and expand the use scene.
需要说明的是,在本说明书中,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个光学成像元件的切割方法”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that in this specification, the terms "include", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements , But also includes other elements that are not explicitly listed, or elements inherent to this process, method, article, or equipment. Without more restrictions, the element defined by the sentence "including a cutting method of an optical imaging element" does not exclude the existence of other same elements in the process, method, article, or equipment including the element.
尽管本发明的内容已经通过上述优选实施例作了详细介绍,但应当认识到上述的描述不应被认为是对本发明的限制。在本领域技术人员阅读了上述内容后,对于本发明的多种修改和替代都将是显而易见的。因此,本发明的保护范围应由所附的权利要求来限定。Although the content of the present invention has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as limiting the present invention. After those skilled in the art have read the above content, various modifications and alternatives to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims (9)

  1. 一种光学成像元件的切割方法,其特征在于,包含如下步骤:A method for cutting an optical imaging element, which is characterized in that it comprises the following steps:
    根据应用场景确定空中成像的视点,所述视点为用户观看空中成像的观看点;Determine a viewpoint of aerial imaging according to the application scenario, where the viewpoint is a viewpoint from which a user views aerial imaging;
    根据所述视点,确定空中成像的具体显示位置;Determine the specific display position of aerial imaging according to the viewpoint;
    根据所述视点的位置和所述空中成像的具体显示位置,确定所述光学成像元件的最优反射区;Determining the optimal reflection area of the optical imaging element according to the position of the viewpoint and the specific display position of the aerial imaging;
    根据所述最优反射区确定所述光学成像元件的姿态和位置;Determining the posture and position of the optical imaging element according to the optimal reflection area;
    将所述视点沿多个方向投影至所述光学成像元件所在平面,所述多个方向为所述视点与所述空中成像的轮廓各个点的连线方向,所述视点不在所述空中成像内部,所述空中成像位于视点与光学成像元件之间;Project the viewpoint to the plane where the optical imaging element is located in multiple directions, where the multiple directions are the connection directions between the viewpoint and each point of the contour of the aerial imaging, and the viewpoint is not inside the aerial imaging , The aerial imaging is located between the viewpoint and the optical imaging element;
    所述视点在所述光学成像元件所在平面的所有投影点围成投影区;All projection points of the viewpoint on the plane where the optical imaging element is located enclose a projection area;
    按照所述投影区的轮廓切割出光学成像元件。The optical imaging element is cut out according to the outline of the projection area.
  2. 如权利要求1所述的光学成像元件的切割方法,其特征在于,以所述视点为起点,通过若干射线照射所述空中成像,所述若干射线在所述光学成像元件所在平面上形成所述空中成像的阴影,该阴影为投影区。The method for cutting an optical imaging element according to claim 1, wherein the aerial imaging is irradiated with a plurality of rays from the viewpoint as a starting point, and the plurality of rays form the optical imaging element on the plane where the optical imaging element is located. The shadow imaged in the air, the shadow is the projection area.
  3. 如权利要求2所述的光学成像元件的切割方法,其特征在于,所述射线为虚拟光线,所述阴影为虚拟阴影。3. The method for cutting an optical imaging element according to claim 2, wherein the rays are virtual rays, and the shadows are virtual shadows.
  4. 如权利要求2所述的光学成像元件的切割方法,其特征在于,所述射线实际光线,所述空中成像用实物模拟,所述阴影为实际阴影。The cutting method of an optical imaging element according to claim 2, wherein the ray is actual light, the aerial imaging is simulated by a real object, and the shadow is an actual shadow.
  5. 如权利要求1所述的光学成像元件的切割方法,其特征在于,所述光学成像元件为微通道矩阵光波导平板。8. The method for cutting an optical imaging element according to claim 1, wherein the optical imaging element is a microchannel matrix optical waveguide plate.
  6. 如权利要求5所述的光学成像元件的切割方法,其特征在于,所述光学成像元件包含多层层叠设置的透光层叠体,所述每层透光层叠体包含若干并排贴合的透明条,所述透明条的贴合面和/或该贴合面的相对面设有反射面,所述反射面为蒸/电镀金属,或粘贴的反射膜,所述相邻层的透明条相互正交。The method for cutting an optical imaging element according to claim 5, wherein the optical imaging element comprises a light-transmitting laminated body laminated in multiple layers, and each layer of the light-transmitting laminated body comprises a plurality of transparent strips attached side by side. , The bonding surface of the transparent strip and/or the opposing surface of the bonding surface is provided with a reflective surface, the reflective surface is a vaporized/plated metal, or a pasted reflective film, and the transparent strips of the adjacent layers are aligned with each other cross.
  7. 如权利要求6所述的光学成像元件的切割方法,其特征在于,所述最优反射区的两侧边界与正交的两根透明条的夹角都不小于15°。8. The method for cutting an optical imaging element according to claim 6, wherein the angle between the two sides of the optimal reflection area and the two orthogonal transparent bars is not less than 15°.
  8. 如权利要求7所述的光学成像元件的切割方法,其特征在于,所述空中成像的本体与所述空中成像相对光学成像元件对称,所述视点位于所述最优反射区中。7. The method for cutting an optical imaging element according to claim 7, wherein the aerial imaging body and the aerial imaging are symmetrical with respect to the optical imaging element, and the viewpoint is located in the optimal reflection zone.
  9. 如权利要求8所述的光学成像元件的切割方法,其特征在于,所述光学成像元件的姿态包含:透光层叠体平面的朝向和透明条的方向。8. The method for cutting an optical imaging element according to claim 8, wherein the posture of the optical imaging element includes the direction of the plane of the light-transmitting laminate and the direction of the transparent strip.
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