WO2021077639A1 - Directional coupler for use in multi-beam antenna feed network - Google Patents
Directional coupler for use in multi-beam antenna feed network Download PDFInfo
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- WO2021077639A1 WO2021077639A1 PCT/CN2020/071941 CN2020071941W WO2021077639A1 WO 2021077639 A1 WO2021077639 A1 WO 2021077639A1 CN 2020071941 W CN2020071941 W CN 2020071941W WO 2021077639 A1 WO2021077639 A1 WO 2021077639A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
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- the invention relates to the technical field of communication equipment, in particular to a directional coupler applied to a multi-beam antenna feed network.
- the core of the multi-beam antenna is its beam forming network, which is a multi-input and multi-beam antenna.
- the output feeder network can switch beams through the feeder network.
- Butler matrix (a matrix type) has simple structure and good phase characteristics, so it is often used in the feeder network of multi-beam antennas.
- Butler matrix is mainly used in the feeder network of multi-beam antennas. It consists of a 3dB directional coupler and various phase shifters.
- the current 3dB directional coupler structure mainly includes a planar structure and a multilayer structure.
- the distance between the parallel coupling lines is small, and it is difficult to achieve strong coupling in a wide frequency band.
- the usual solutions in the industry are: 1. Adopt a multi-layer multi-segment coupling line structure to increase the coupling and increase the bandwidth; 2. Change by adding multiple additional capacitors The impedance of the odd and even mode achieves the effect of impedance matching; in the multi-layer board coupler, the dielectric substrate becomes the key to the impedance of the odd and even mode.
- the same type of dielectric substrate is used to make the transmission mode a TEM mode (transverse electromagnetic mode, transverse electromagnetic wave). Mode), which is convenient to reduce standing waves and achieve 3dB strong coupling.
- the transmission mode of the coupled line is a mixed mode, and it is difficult to achieve good signal transmission under the condition of 3dB coupling.
- the purpose of the present invention is to provide a directional coupler applied to a multi-beam antenna feed network, which can achieve a phase shift of 90°, reduce standing waves to achieve good transmission performance, and is well applied to multiple antennas.
- a directional coupler applied to a multi-beam antenna feed network which can achieve a phase shift of 90°, reduce standing waves to achieve good transmission performance, and is well applied to multiple antennas.
- the feeder network of the beam In the feeder network of the beam.
- the present invention provides a directional coupler applied to a multi-beam antenna feed network, which includes a first microstrip line structure, a second microstrip line structure, and an intermediate dielectric substrate.
- the first microstrip line Structure, the intermediate dielectric substrate and the second microstrip line structure are pressed up and down in sequence, the first coupling line of the first microstrip line structure is placed on the top layer of the intermediate dielectric substrate, and the second microstrip line structure
- the second coupling line with a line structure is placed on the bottom layer of the intermediate dielectric substrate.
- the first microstrip line structure includes a first copper foil, a first dielectric substrate, and the first coupling line that are sequentially stacked and stacked
- the second microstrip line structure includes a second copper foil, a second dielectric substrate, and the second coupling line that are sequentially stacked in layers, and the first copper foil and the second copper foil are respectively set to the orientation
- the upper and lower layers of the coupler, the first coupling line and the first copper foil and the second copper foil are connected to each other by punching, and the second coupling line is connected to the first copper foil and the The second copper foils are connected to each other by punching.
- the dielectric constant of the first dielectric substrate and the second dielectric substrate is 3.
- the height of the intermediate dielectric substrate is 0.15 mm, and the dielectric constant is 3.5.
- the first coupling line and the second coupling line are composed of a first port section, a first connection section, a coincidence section, a second connection section, and
- the copper wires of the second port section are connected in sequence, and the first port section and the second port section are perpendicular to the first connection section and the second connection section in opposite directions, and the overlapping section Displaced in parallel with the first connecting section and the second connecting section;
- the structures of the first coupling line and the second coupling line are distributed in a mirror image in the vertical direction, and the first coupling line and The overlapping sections of the second coupling line overlap in the vertical direction.
- the line width of the first port section, the first connection section, the second connection section, and the second port section is 1.1 mm ,
- the line width of the overlapping section is 0.55mm;
- the horizontal line distance between the first connecting section of the first coupling line and the second connecting section of the second coupling line is 0.16mm,
- the horizontal line distance between the second connecting section of the first coupling line and the first connecting section of the second coupling line is 0.16 mm.
- the intermediate dielectric substrate is set to be used for thermal fusion to press the PP of the first microstrip line structure and the second microstrip line structure (polypropylene, polypropylene) film.
- the directional coupler applied to the multi-beam antenna feed network of the present invention includes a first microstrip line structure, a second microstrip line structure, and an intermediate dielectric substrate.
- the first microstrip line structure, the intermediate dielectric substrate And the second microstrip line structure is pressed up and down in sequence, the first coupling line of the first microstrip line structure is placed on the top layer of the intermediate dielectric substrate, and the second coupling line of the second microstrip line structure
- the wires are placed on the bottom layer of the intermediate dielectric substrate. Therefore, the present invention can achieve a 90° phase shift, reduce standing waves to achieve good transmission performance, and is well applied to a multi-beam feeder network.
- Fig. 1 is an exploded view of the structure of a directional coupler applied to a multi-beam antenna feed network according to a preferred embodiment of the present invention
- FIG. 2 is a plan sectional view of the first coupling line and the second coupling line of the directional coupler applied to the multi-beam antenna feed network according to the preferred embodiment of the present invention
- Fig. 3 is a schematic diagram of the current direction of Fig. 2.
- Figure 1 shows a directional coupler applied to a multi-beam antenna feed network according to a preferred embodiment of the present invention, including a first microstrip line structure, a second microstrip line structure, and an intermediate dielectric substrate 14.
- the first The microstrip line structure, the intermediate dielectric substrate 14 and the second microstrip line structure are pressed up and down in sequence, the first coupling line 13 of the first microstrip line structure is placed on the top layer of the intermediate dielectric substrate 14, and the second microstrip line structure
- the second coupling line 15 with a line structure is placed on the bottom layer of the intermediate dielectric substrate 14.
- a three-layer directional coupler can be formed, so as to achieve 3dB coupling under the condition of 1.695GHz-2.69GHz, that is, the coupler can be applied In the feed network of multi-beam antennas in the 1.695GHz-2.69GHz frequency band.
- the first microstrip line structure of this embodiment includes a first copper foil 11, a first dielectric substrate 12, and the first coupling line 13 that are stacked in sequence
- the second microstrip line structure includes The second copper foil 17, the second dielectric substrate 16 and the second coupling line 15 are stacked separately, the first copper foil 11 and the second copper foil 17 are respectively set as the upper and lower layers of the directional coupler, so The first coupling line 13 and the first copper foil 11 and the second copper foil 17 are connected to each other by punching, and the second coupling line 15 is connected with the first copper foil 11 and the second copper foil 17 by punching. Connect to each other.
- the uppermost layer and the lowermost layer are both copper foil, that is, the ground of the coupling line, and the first coupling line 13 and the second coupling line 15 are connected to the ground of the upper and lower layers respectively through perforation; wherein, the first The dielectric constant of the dielectric substrate 12 and the second dielectric substrate 16 is 3; of course, different dielectric constants may be used in different embodiments.
- the height of the intermediate dielectric substrate 14 is 0.15 mm, and the dielectric constant is 3.5.
- the intermediate dielectric substrate 14 of the present embodiment is set as a PP film used for thermal fusion to press the first microstrip line structure and the second microstrip line structure. That is, the middle layer is laminated with a pp film, and its dielectric constant is 3.5. In engineering manufacturing, the pp film will melt when heated and fill in the place where there is no circuit, causing the thickness to change, about 0.15mm, so that it is formed A three-layer board coupler is installed, and two coupling lines are respectively placed on the bottom and top layers of the middle layer.
- the first coupling line 13 and the second coupling line 15 are formed by connecting copper wires of a first port section, a first connection section, a coincidence section, a second connection section, and a second port section in sequence, and the first port
- the section and the second port section are in opposite directions perpendicular to the first connection section and the second connection section, respectively, and the overlap section and the first connection section and the second connection section are dislocated and distributed in parallel; the first coupling
- the structures of the line 13 and the second coupling line 15 are distributed in a mirror image in the vertical direction, and the overlapping sections of the first coupling line 13 and the second coupling line 15 overlap in the vertical direction.
- the first coupling line 13 includes a first port section 110, a first connection section 111, a coincidence section 140, a second connection section 441, and a second port section 440;
- the second coupling line 15 includes The first port section 330, the first connecting section 331, the overlapping section 230, the second connecting section 221, and the second port section 220; as shown in the figure, the first port section and the second port end of the two coupling lines are Distributed in the opposite direction, and connected with the first connecting section, the overlapping section and the second connecting section to form a Z-like shape, wherein the first connecting section and the second connecting section are in a straight line, and the overlapping section is The straight line is dislocated and protruding and is parallel to the first and second connecting sections; because the first and second microstrip line structures are in a state of pressing up and down, that is, the first coupling line 13 and The second coupling line 15 is in a mirror image effect in the plane, as shown in the figure; the above-mentioned wiring structure ensures
- the line width of the first port section, the first connecting section, the second connecting section, and the second port section is 1.1 mm, and the line width of the overlapping section is 0.55 mm;
- the horizontal line distance between the first connecting section of the first coupling line and the second connecting section of the second coupling line is 0.16 mm, and the second connecting section of the first coupling line is The horizontal line distance between the first connecting sections of the second coupling line is 0.16 mm.
- the traveling wave is input from port 1 to port 4. Due to the induced electromotive force generated by the mutual inductance auxiliary line, the induced current is generated. The induced current is generated by the mutual capacitance and the direction is the same. The opposite direction of the magnetic coupling current leads to energy cancellation.
- the structure of this embodiment can realize that the coupling current output from port 2 is half of the input current of port 1, and the capacitance is compensated to achieve a three-decibel coupling function in the case of a multilayer dielectric substrate.
- the coupler is formed by pressing two single-layer microstrip couplers, the dielectric constant of the pp slice is inconsistent with the dielectric constant of the dielectric substrate in the single microstrip coupler, and mixed modes will be generated during the transmission process. , Resulting in poor coupling and transmission performance.
- the coupler can achieve a strong coupling effect, and an additional capacitance is added to achieve impedance matching.
- the directional coupler applied to the multi-beam antenna feed network of the present invention uses a multi-layer board coupling line structure, which achieves 3dB strong coupling in a wide frequency band, reduces return loss and improves isolation .
- the two microstrip coupling lines are pressed together using pp sheets to form a stripline structure with a dielectric constant of 3.5 in the middle layer and a dielectric constant of 3.0 in the upper and lower layers.
- the wiring structure of the coupler is also very good.
- the inconsistency of the odd and even mode phase velocities caused by the unevenness of the medium is solved, the present invention can realize a phase shift of 90°, and can be well applied to a multi-beam feeder network.
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Abstract
The present invention is suitable for use in the technical field of communication devices, and provides a directional coupler for use in a multi-beam antenna feed network, comprising a first microstrip line structure, a second microstrip line structure, and a middle layer dielectric substrate, the first microstrip line structure, the middle layer dielectric substrate, and the second microstrip line structure being pressed and fixed together in sequence, a first coupling line of the first microstrip line structure being arranged at the top layer of the middle layer dielectric substrate, and a second coupling line of the second microstrip line structure being arranged at the bottom layer of the middle layer dielectric substrate. Thus, the present invention can implement 90 degree phase shift, reducing standing waves to achieve good transmission performance, and being well-suited to use in a multi-beam feed network.
Description
本发明涉及通信设备技术领域,尤其涉及一种应用于多波束天线馈电网络的定向耦合器。The invention relates to the technical field of communication equipment, in particular to a directional coupler applied to a multi-beam antenna feed network.
随着移动通信用户的激增,通信系统的容量已经无法满足用户需求,而使用多波束天线可以提高现有的通信容量,多波束天线的核心是其波束形成网络,它是一种多输入、多输出的馈电网络,通过该馈电网络便能实现波束的切换,Butler矩阵(一种矩阵类型)结构简单,相位特性好,因此常常被应用在多波束天线的馈电网络中,Butler矩阵主要有3dB定向耦合器和各种移相器组成,现如今的3dB定向耦合器结构主要有平面结构和多层结构,由于平面结构耦合器带宽窄,无法在工程应用中很好的实现宽频带耦合,且同极化隔离不高,则需要在多层结构上实现降低驻波,达到3dB耦合的效果。With the rapid increase of mobile communication users, the capacity of the communication system can no longer meet the needs of users, and the use of multi-beam antennas can increase the existing communication capacity. The core of the multi-beam antenna is its beam forming network, which is a multi-input and multi-beam antenna. The output feeder network can switch beams through the feeder network. Butler matrix (a matrix type) has simple structure and good phase characteristics, so it is often used in the feeder network of multi-beam antennas. Butler matrix is mainly used in the feeder network of multi-beam antennas. It consists of a 3dB directional coupler and various phase shifters. The current 3dB directional coupler structure mainly includes a planar structure and a multilayer structure. Due to the narrow bandwidth of the planar structure coupler, it is impossible to achieve a good broadband coupling in engineering applications. , And the co-polarization isolation is not high, it is necessary to reduce the standing wave on the multilayer structure to achieve the effect of 3dB coupling.
平行耦合线之间的间距小,很难做到宽频带的强耦合,业内通常的解决方案是:1.采用多层多段耦合线结构,增加耦合增加带宽;2.通过增加多段附加电容来改变奇偶模的阻抗从而达到阻抗匹配的效果;在多层板耦合器中,介质基板成为影响奇偶模特性阻抗的关键,通常采用种类相同的介质基板使得传输模为TEM模(transverse electromagnetic mode,横电磁波模式),便于降低驻波、实现3dB强耦合,当介质基板不均匀时,耦合线的传输模为混合模,很难在实现3dB耦合的情况下信号能够良好传输。The distance between the parallel coupling lines is small, and it is difficult to achieve strong coupling in a wide frequency band. The usual solutions in the industry are: 1. Adopt a multi-layer multi-segment coupling line structure to increase the coupling and increase the bandwidth; 2. Change by adding multiple additional capacitors The impedance of the odd and even mode achieves the effect of impedance matching; in the multi-layer board coupler, the dielectric substrate becomes the key to the impedance of the odd and even mode. Usually, the same type of dielectric substrate is used to make the transmission mode a TEM mode (transverse electromagnetic mode, transverse electromagnetic wave). Mode), which is convenient to reduce standing waves and achieve 3dB strong coupling. When the dielectric substrate is uneven, the transmission mode of the coupled line is a mixed mode, and it is difficult to achieve good signal transmission under the condition of 3dB coupling.
综上可知,现有的方法在实际使用上,存在着较多的问题,所以有必要加以改进。In summary, the existing methods have many problems in actual use, so it is necessary to improve them.
发明内容Summary of the invention
针对上述的缺陷,本发明的目的在于提供一种应用于多波束天线馈电网络的定向耦合器,能够实现90°的相移,降低驻波以达到良好的传输性能,很好的应用于多波束的馈电网络中。In view of the above-mentioned shortcomings, the purpose of the present invention is to provide a directional coupler applied to a multi-beam antenna feed network, which can achieve a phase shift of 90°, reduce standing waves to achieve good transmission performance, and is well applied to multiple antennas. In the feeder network of the beam.
为了实现上述目的,本发明提供一种应用于多波束天线馈电网络的定向耦合器,包括有第一微带线结构、第二微带线结构以及中层介质基板,所述第一 微带线结构、所述中层介质基板以及所述第二微带线结构依次上下压合固定,所述第一微带线结构的第一耦合线置于所述中层介质基板的顶层,所述第二微带线结构的第二耦合线置于所述中层介质基板的底层。In order to achieve the above objective, the present invention provides a directional coupler applied to a multi-beam antenna feed network, which includes a first microstrip line structure, a second microstrip line structure, and an intermediate dielectric substrate. The first microstrip line Structure, the intermediate dielectric substrate and the second microstrip line structure are pressed up and down in sequence, the first coupling line of the first microstrip line structure is placed on the top layer of the intermediate dielectric substrate, and the second microstrip line structure The second coupling line with a line structure is placed on the bottom layer of the intermediate dielectric substrate.
根据所述的应用于多波束天线馈电网络的定向耦合器,所述第一微带线结构包括有依次分层叠置的第一铜箔、第一介质基板和所述第一耦合线,所述第二微带线结构包括有依次分层叠置的第二铜箔、第二介质基板和所述第二耦合线,所述第一铜箔和所述第二铜箔分别设为所述定向耦合器的上下层,所述第一耦合线与所述第一铜箔和所述第二铜箔之间通过打孔相互连接,所述第二耦合线与所述第一铜箔和所述第二铜箔之间通过打孔相互连接。According to the directional coupler applied to the multi-beam antenna feed network, the first microstrip line structure includes a first copper foil, a first dielectric substrate, and the first coupling line that are sequentially stacked and stacked, so The second microstrip line structure includes a second copper foil, a second dielectric substrate, and the second coupling line that are sequentially stacked in layers, and the first copper foil and the second copper foil are respectively set to the orientation The upper and lower layers of the coupler, the first coupling line and the first copper foil and the second copper foil are connected to each other by punching, and the second coupling line is connected to the first copper foil and the The second copper foils are connected to each other by punching.
根据所述的应用于多波束天线馈电网络的定向耦合器,所述第一介质基板和所述第二介质基板的介电常数为3。According to the directional coupler applied to the multi-beam antenna feed network, the dielectric constant of the first dielectric substrate and the second dielectric substrate is 3.
根据所述的应用于多波束天线馈电网络的定向耦合器,所述中层介质基板的高为0.15mm,且介电常数为3.5。According to the directional coupler applied to the multi-beam antenna feed network, the height of the intermediate dielectric substrate is 0.15 mm, and the dielectric constant is 3.5.
根据所述的应用于多波束天线馈电网络的定向耦合器,所述第一耦合线和所述第二耦合线都由第一端口段、第一衔接段、重合段、第二衔接段以及第二端口段的铜线依次连接而成,所述第一端口段和所述第二端口段呈反方向分别垂直于所述第一衔接段和所述第二衔接段上,所述重合段与所述第一衔接段和所述第二衔接段错位平行分布;所述第一耦合线和所述第二耦合线的结构在竖直方向上呈镜像分布,且所述第一耦合线和所述第二耦合线的所述重合段在竖直方向上重合。According to the directional coupler applied to the multi-beam antenna feed network, the first coupling line and the second coupling line are composed of a first port section, a first connection section, a coincidence section, a second connection section, and The copper wires of the second port section are connected in sequence, and the first port section and the second port section are perpendicular to the first connection section and the second connection section in opposite directions, and the overlapping section Displaced in parallel with the first connecting section and the second connecting section; the structures of the first coupling line and the second coupling line are distributed in a mirror image in the vertical direction, and the first coupling line and The overlapping sections of the second coupling line overlap in the vertical direction.
根据所述的应用于多波束天线馈电网络的定向耦合器,所述第一端口段、所述第一衔接段、所述第二衔接段以及所述第二端口段的线宽为1.1mm,所述重合段的线宽为0.55mm;所述第一耦合线的所述第一衔接段与所述第二耦合线的所述第二衔接段之间的水平线距为0.16mm,所述第一耦合线的所述第二衔接段与所述第二耦合线的所述第一衔接段之间的水平线距为0.16mm。According to the directional coupler applied to the multi-beam antenna feed network, the line width of the first port section, the first connection section, the second connection section, and the second port section is 1.1 mm , The line width of the overlapping section is 0.55mm; the horizontal line distance between the first connecting section of the first coupling line and the second connecting section of the second coupling line is 0.16mm, the The horizontal line distance between the second connecting section of the first coupling line and the first connecting section of the second coupling line is 0.16 mm.
根据所述的应用于多波束天线馈电网络的定向耦合器,所述中层介质基板设为用于热熔以压合所述第一微带线结构和所述第二微带线结构的PP(polypropylene,聚丙烯)膜。According to the directional coupler applied to the multi-beam antenna feed network, the intermediate dielectric substrate is set to be used for thermal fusion to press the PP of the first microstrip line structure and the second microstrip line structure (polypropylene, polypropylene) film.
本发明所述应用于多波束天线馈电网络的定向耦合器包括有第一微带线结构、第二微带线结构以及中层介质基板,所述第一微带线结构、所述中层介质 基板以及所述第二微带线结构依次上下压合固定,所述第一微带线结构的第一耦合线置于所述中层介质基板的顶层,所述第二微带线结构的第二耦合线置于所述中层介质基板的底层。借此,本发明能够实现90°的相移,降低驻波以达到良好的传输性能,很好的应用于多波束的馈电网络中。The directional coupler applied to the multi-beam antenna feed network of the present invention includes a first microstrip line structure, a second microstrip line structure, and an intermediate dielectric substrate. The first microstrip line structure, the intermediate dielectric substrate And the second microstrip line structure is pressed up and down in sequence, the first coupling line of the first microstrip line structure is placed on the top layer of the intermediate dielectric substrate, and the second coupling line of the second microstrip line structure The wires are placed on the bottom layer of the intermediate dielectric substrate. Therefore, the present invention can achieve a 90° phase shift, reduce standing waves to achieve good transmission performance, and is well applied to a multi-beam feeder network.
图1为本发明优选实施例所述应用于多波束天线馈电网络的定向耦合器的结构爆炸图;Fig. 1 is an exploded view of the structure of a directional coupler applied to a multi-beam antenna feed network according to a preferred embodiment of the present invention;
图2为本发明优选实施例所述应用于多波束天线馈电网络的定向耦合器的所述第一耦合线和所述第二耦合线的平面剖视图;2 is a plan sectional view of the first coupling line and the second coupling line of the directional coupler applied to the multi-beam antenna feed network according to the preferred embodiment of the present invention;
图3为图2的电流方向示意图。Fig. 3 is a schematic diagram of the current direction of Fig. 2.
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.
图1示出本发明优选实施例所述的应用于多波束天线馈电网络的定向耦合器,包括有第一微带线结构、第二微带线结构以及中层介质基板14,所述第一微带线结构、中层介质基板14以及第二微带线结构依次上下压合固定,所述第一微带线结构的第一耦合线13置于中层介质基板14的顶层,所述第二微带线结构的第二耦合线15置于中层介质基板14的底层。通过将两个微带线结构与一中层介质基板14经过工艺压合制成一个三层板的定向耦合器,从而能实现在1.695GHz-2.69GHz情况下的3dB耦合,即该耦合器可应用于1.695GHz-2.69GHz频段的多波束天线的馈电网络中。Figure 1 shows a directional coupler applied to a multi-beam antenna feed network according to a preferred embodiment of the present invention, including a first microstrip line structure, a second microstrip line structure, and an intermediate dielectric substrate 14. The first The microstrip line structure, the intermediate dielectric substrate 14 and the second microstrip line structure are pressed up and down in sequence, the first coupling line 13 of the first microstrip line structure is placed on the top layer of the intermediate dielectric substrate 14, and the second microstrip line structure The second coupling line 15 with a line structure is placed on the bottom layer of the intermediate dielectric substrate 14. By combining two microstrip line structures with a mid-layer dielectric substrate 14 through the process, a three-layer directional coupler can be formed, so as to achieve 3dB coupling under the condition of 1.695GHz-2.69GHz, that is, the coupler can be applied In the feed network of multi-beam antennas in the 1.695GHz-2.69GHz frequency band.
本实施例的所述第一微带线结构包括有依次分层叠置的第一铜箔11、第一介质基板12和所述第一耦合线13,所述第二微带线结构包括有依次分层叠置的第二铜箔17、第二介质基板16和所述第二耦合线15,所述第一铜箔11和第二铜箔17分别设为所述定向耦合器的上下层,所述第一耦合线13与第一铜箔11和第二铜箔17之间通过打孔相互连接,所述第二耦合线15与第一铜箔11和第二铜箔17之间通过打孔相互连接。其中,最上层以及最下层都为铜箔,也就是 耦合线的地,所述第一耦合线13和第二耦合线15分别与上下两层地通过打孔相互连接;其中,所述第一介质基板12和第二介质基板16的介电常数为3;当然在不同的实施例中可以是不同的介电常数。The first microstrip line structure of this embodiment includes a first copper foil 11, a first dielectric substrate 12, and the first coupling line 13 that are stacked in sequence, and the second microstrip line structure includes The second copper foil 17, the second dielectric substrate 16 and the second coupling line 15 are stacked separately, the first copper foil 11 and the second copper foil 17 are respectively set as the upper and lower layers of the directional coupler, so The first coupling line 13 and the first copper foil 11 and the second copper foil 17 are connected to each other by punching, and the second coupling line 15 is connected with the first copper foil 11 and the second copper foil 17 by punching. Connect to each other. Wherein, the uppermost layer and the lowermost layer are both copper foil, that is, the ground of the coupling line, and the first coupling line 13 and the second coupling line 15 are connected to the ground of the upper and lower layers respectively through perforation; wherein, the first The dielectric constant of the dielectric substrate 12 and the second dielectric substrate 16 is 3; of course, different dielectric constants may be used in different embodiments.
优选的是,所述中层介质基板14的高为0.15mm,且介电常数为3.5。本实施例的所述中层介质基板14设为用于热熔以压合所述第一微带线结构和第二微带线结构的PP膜。即中间层用pp膜做压合,其介电常数为3.5,在工程制造中,所述pp膜受热会融化,填充到没有线路的地方,导致厚度发生变化,约为0.15mm,这样便形成了一个三层板耦合器,两条耦合线分别置于中间层板的底层、顶层。Preferably, the height of the intermediate dielectric substrate 14 is 0.15 mm, and the dielectric constant is 3.5. The intermediate dielectric substrate 14 of the present embodiment is set as a PP film used for thermal fusion to press the first microstrip line structure and the second microstrip line structure. That is, the middle layer is laminated with a pp film, and its dielectric constant is 3.5. In engineering manufacturing, the pp film will melt when heated and fill in the place where there is no circuit, causing the thickness to change, about 0.15mm, so that it is formed A three-layer board coupler is installed, and two coupling lines are respectively placed on the bottom and top layers of the middle layer.
所述第一耦合线13和第二耦合线15都由第一端口段、第一衔接段、重合段、第二衔接段以及第二端口段的铜线依次连接而成,所述第一端口段和第二端口段呈反方向分别垂直于所述第一衔接段和第二衔接段上,所述重合段与所述第一衔接段和第二衔接段错位平行分布;所述第一耦合线13和第二耦合线15的结构在竖直方向上呈镜像分布,且所述第一耦合线13和第二耦合线15的所述重合段在竖直方向上重合。参见图2,所述第一耦合线13包括有第一端口段110、第一衔接段111、重合段140、第二衔接段441和第二端口段440;所述第二耦合线15包括有第一端口段330、第一衔接段331、重合段230、第二衔接段221和第二端口段220;如图,两条耦合线的所述第一端口段和所述第二端口端呈反方向分布,并与所述第一衔接段、重合段以及第二衔接段连接构成类Z型状,其中,所述第一衔接段和第二衔接段处于一条直线上,所述重合段在该条直线上错位凸出并与第一衔接段和第二衔接段相平行;由于所述第一微带线结构和第二微带线结构呈上下压合状态,即第一耦合线13和第二耦合线15在平面内处于镜像效果,如图所示;上述的走线结构确保了该耦合器在非均匀的介质条件下实现3db的强耦合并能够降低驻波、保持良好的隔离度。具体的是,所述第一端口段、所述第一衔接段、所述第二衔接段以及所述第二端口段的线宽为1.1mm,所述重合段的线宽为0.55mm;所述第一耦合线的所述第一衔接段与所述第二耦合线的所述第二衔接段之间的水平线距为0.16mm,所述第一耦合线的所述第二衔接段与所述第二耦合线的所述第一衔接段之间的水平线距为0.16mm。The first coupling line 13 and the second coupling line 15 are formed by connecting copper wires of a first port section, a first connection section, a coincidence section, a second connection section, and a second port section in sequence, and the first port The section and the second port section are in opposite directions perpendicular to the first connection section and the second connection section, respectively, and the overlap section and the first connection section and the second connection section are dislocated and distributed in parallel; the first coupling The structures of the line 13 and the second coupling line 15 are distributed in a mirror image in the vertical direction, and the overlapping sections of the first coupling line 13 and the second coupling line 15 overlap in the vertical direction. 2, the first coupling line 13 includes a first port section 110, a first connection section 111, a coincidence section 140, a second connection section 441, and a second port section 440; the second coupling line 15 includes The first port section 330, the first connecting section 331, the overlapping section 230, the second connecting section 221, and the second port section 220; as shown in the figure, the first port section and the second port end of the two coupling lines are Distributed in the opposite direction, and connected with the first connecting section, the overlapping section and the second connecting section to form a Z-like shape, wherein the first connecting section and the second connecting section are in a straight line, and the overlapping section is The straight line is dislocated and protruding and is parallel to the first and second connecting sections; because the first and second microstrip line structures are in a state of pressing up and down, that is, the first coupling line 13 and The second coupling line 15 is in a mirror image effect in the plane, as shown in the figure; the above-mentioned wiring structure ensures that the coupler achieves a strong coupling of 3db under non-uniform media conditions and can reduce standing waves and maintain good isolation . Specifically, the line width of the first port section, the first connecting section, the second connecting section, and the second port section is 1.1 mm, and the line width of the overlapping section is 0.55 mm; The horizontal line distance between the first connecting section of the first coupling line and the second connecting section of the second coupling line is 0.16 mm, and the second connecting section of the first coupling line is The horizontal line distance between the first connecting sections of the second coupling line is 0.16 mm.
参见图3,行波由端口1向端口4输入,由于互感辅线产生感应电动势,从 而产生感应电流,由于互容产生感应电流、方向相同,由端口2输出,而端口3因为电耦合电流和磁耦合电流的方向相反导致能量抵消,本实施例的结构能够实现端口2输出的耦合电流为端口1输入电流的一半,并通过补偿电容,从而在多层介质基板的情况实现三分贝的耦合功能,由于耦合器是由两个单层微带型耦合器压片而成,pp片的介电常数与单个微带型耦合器中介质基板的介电常数不一致,在传输过程中会产生混合模,造成耦合、传输性能变差,本实施例通过使用分层三段交叉耦合线结构,使得耦合器能够达到强耦合的效果,并增加附加电容达到阻抗匹配。Refer to Figure 3, the traveling wave is input from port 1 to port 4. Due to the induced electromotive force generated by the mutual inductance auxiliary line, the induced current is generated. The induced current is generated by the mutual capacitance and the direction is the same. The opposite direction of the magnetic coupling current leads to energy cancellation. The structure of this embodiment can realize that the coupling current output from port 2 is half of the input current of port 1, and the capacitance is compensated to achieve a three-decibel coupling function in the case of a multilayer dielectric substrate. , Because the coupler is formed by pressing two single-layer microstrip couplers, the dielectric constant of the pp slice is inconsistent with the dielectric constant of the dielectric substrate in the single microstrip coupler, and mixed modes will be generated during the transmission process. , Resulting in poor coupling and transmission performance. In this embodiment, by using a layered three-section cross-coupling line structure, the coupler can achieve a strong coupling effect, and an additional capacitance is added to achieve impedance matching.
经实验测试,该耦合器在工作频率1.695GHz-2.69GHz下驻波均保持在1.22以下,且所述定向耦合器的直通端口与耦合端口的相移为90°。Experimental tests show that the standing wave of the coupler is kept below 1.22 at working frequencies of 1.695GHz-2.69GHz, and the phase shift between the through port and the coupled port of the directional coupler is 90°.
综上所述,本发明所述应用于多波束天线馈电网络的定向耦合器使用多层板的耦合线结构,在宽频带实现3dB的强耦合下、降低了回波损耗以及提升了隔离度。使用pp片将两个微带耦合线压合而成,形成了一个中间层介电常数为3.5,上下两层介电常数为3.0的带状线结构,耦合器的走线结构也很好的解决了介质不均匀带来的奇偶模相速的不一致,本发明能实现90°的相移,能很好的应用于多波束的馈电网络中。To sum up, the directional coupler applied to the multi-beam antenna feed network of the present invention uses a multi-layer board coupling line structure, which achieves 3dB strong coupling in a wide frequency band, reduces return loss and improves isolation . The two microstrip coupling lines are pressed together using pp sheets to form a stripline structure with a dielectric constant of 3.5 in the middle layer and a dielectric constant of 3.0 in the upper and lower layers. The wiring structure of the coupler is also very good. The inconsistency of the odd and even mode phase velocities caused by the unevenness of the medium is solved, the present invention can realize a phase shift of 90°, and can be well applied to a multi-beam feeder network.
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Of course, the present invention can also have various other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding All changes and deformations shall belong to the protection scope of the appended claims of the present invention.
Claims (7)
- 一种应用于多波束天线馈电网络的定向耦合器,其特征在于,包括有第一微带线结构、第二微带线结构以及中层介质基板,所述第一微带线结构、所述中层介质基板以及所述第二微带线结构依次上下压合固定,所述第一微带线结构的第一耦合线置于所述中层介质基板的顶层,所述第二微带线结构的第二耦合线置于所述中层介质基板的底层。A directional coupler applied to a multi-beam antenna feed network, characterized in that it includes a first microstrip line structure, a second microstrip line structure, and an intermediate dielectric substrate. The first microstrip line structure, the The intermediate dielectric substrate and the second microstrip line structure are pressed up and down in sequence, the first coupling line of the first microstrip line structure is placed on the top layer of the intermediate dielectric substrate, and the second microstrip line structure is The second coupling line is placed on the bottom layer of the intermediate dielectric substrate.
- 根据权利要求1所述的应用于多波束天线馈电网络的定向耦合器,其特征在于,所述第一微带线结构包括有依次分层叠置的第一铜箔、第一介质基板和所述第一耦合线,所述第二微带线结构包括有依次分层叠置的第二铜箔、第二介质基板和所述第二耦合线,所述第一铜箔和所述第二铜箔分别设为所述定向耦合器的上下层,所述第一耦合线与所述第一铜箔和所述第二铜箔之间通过打孔相互连接,所述第二耦合线与所述第一铜箔和所述第二铜箔之间通过打孔相互连接。The directional coupler applied to a multi-beam antenna feed network according to claim 1, wherein the first microstrip line structure includes a first copper foil, a first dielectric substrate, and a The first coupling line, the second microstrip line structure includes a second copper foil, a second dielectric substrate, and the second coupling line that are sequentially stacked in layers, the first copper foil and the second copper The foils are respectively set as the upper and lower layers of the directional coupler, the first coupling line and the first copper foil and the second copper foil are connected to each other through perforation, and the second coupling line is connected to the The first copper foil and the second copper foil are connected to each other by punching.
- 根据权利要求2所述的应用于多波束天线馈电网络的定向耦合器,其特征在于,所述第一介质基板和所述第二介质基板的介电常数为3。The directional coupler applied to a multi-beam antenna feed network according to claim 2, wherein the dielectric constant of the first dielectric substrate and the second dielectric substrate is 3.
- 根据权利要求1所述的应用于多波束天线馈电网络的定向耦合器,其特征在于,所述中层介质基板的高为0.15mm,且介电常数为3.5。The directional coupler applied to a multi-beam antenna feed network according to claim 1, wherein the height of the intermediate dielectric substrate is 0.15 mm, and the dielectric constant is 3.5.
- 根据权利要求1所述的应用于多波束天线馈电网络的定向耦合器,其特征在于,所述第一耦合线和所述第二耦合线都由第一端口段、第一衔接段、重合段、第二衔接段以及第二端口段的铜线依次连接而成,所述第一端口段和所述第二端口段呈反方向分别垂直于所述第一衔接段和所述第二衔接段上,所述重合段与所述第一衔接段和所述第二衔接段错位平行分布;所述第一耦合线和所述第二耦合线的结构在竖直方向上呈镜像分布,且所述第一耦合线和所述第二耦合线的所述重合段在竖直方向上重合。The directional coupler applied to a multi-beam antenna feed network according to claim 1, wherein the first coupling line and the second coupling line are both composed of a first port section, a first connecting section, and a superposition. Section, the second connecting section and the second port section are connected in sequence, and the first port section and the second port section are in opposite directions perpendicular to the first connecting section and the second connecting section. In terms of section, the overlapping section is dislocated and distributed in parallel with the first connecting section and the second connecting section; the structures of the first coupling line and the second coupling line are distributed in a mirror image in the vertical direction, and The overlapping sections of the first coupling line and the second coupling line overlap in the vertical direction.
- 根据权利要求5所述的应用于多波束天线馈电网络的定向耦合器,其特征在于,所述第一端口段、所述第一衔接段、所述第二衔接段以及所述第二端口段的线宽为1.1mm,所述重合段的线宽为0.55mm;所述第一耦合线的所述第一衔接段与所述第二耦合线的所述第二衔接段之间的水平线距为0.16mm,所述第一耦合线的所述第二衔接段与所述第二耦合线的所述第一衔接段之间的水平线距为0.16mm。The directional coupler applied to a multi-beam antenna feed network according to claim 5, wherein the first port section, the first connection section, the second connection section, and the second port The line width of the section is 1.1mm, and the line width of the overlapping section is 0.55mm; the horizontal line between the first connecting section of the first coupling line and the second connecting section of the second coupling line The distance is 0.16 mm, and the horizontal line distance between the second connecting section of the first coupling line and the first connecting section of the second coupling line is 0.16 mm.
- 根据权利要求1~6任一项所述的应用于多波束天线馈电网络的定向耦合器,其特征在于,所述中层介质基板设为用于热熔以压合所述第一微带线结构和所述第二微带线结构的PP膜。The directional coupler applied to a multi-beam antenna feed network according to any one of claims 1 to 6, wherein the intermediate dielectric substrate is set for thermal fusion to press the first microstrip line Structure and the second microstrip line structure of the PP film.
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