WO2021077269A1 - Module de détection ultrasonore et dispositif électronique - Google Patents

Module de détection ultrasonore et dispositif électronique Download PDF

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Publication number
WO2021077269A1
WO2021077269A1 PCT/CN2019/112382 CN2019112382W WO2021077269A1 WO 2021077269 A1 WO2021077269 A1 WO 2021077269A1 CN 2019112382 W CN2019112382 W CN 2019112382W WO 2021077269 A1 WO2021077269 A1 WO 2021077269A1
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WO
WIPO (PCT)
Prior art keywords
ultrasonic
layer
detection module
sensor
thin film
Prior art date
Application number
PCT/CN2019/112382
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English (en)
Chinese (zh)
Inventor
曾武祥
Original Assignee
南昌欧菲生物识别技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to PCT/CN2019/112382 priority Critical patent/WO2021077269A1/fr
Publication of WO2021077269A1 publication Critical patent/WO2021077269A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition

Definitions

  • This application relates to the technical field of fingerprint identification, and in particular to an ultrasonic detection module and electronic equipment.
  • the purpose of the present application is to provide an ultrasonic detection module and an electronic device containing the same, so that at least one of contour marks and wrinkles can be eliminated or reduced.
  • the ultrasonic detection module includes an ultrasonic sensor, a first thin film component, a second thin film component, and a cover plate that are stacked in sequence, and the ultrasonic sensor is used to emit an ultrasonic signal toward the cover plate and is used to receive the reflection of a target object.
  • the first thin film component is used to reduce or eliminate at least one of the contour print and the wrinkle print generated on the second thin film component when the ultrasonic sensor is attached, and the second thin film component is used Display preset colors.
  • the application also provides an electronic device.
  • the electronic device includes a device body and an ultrasonic detection module, and at least a part of the ultrasonic detection module is arranged in the device body.
  • the ultrasonic detection module of the present application disposes the first thin film component between the second thin film component and the ultrasonic sensor, so that when the ultrasonic sensor is attached, it can eliminate or reduce the direct impact of the second thin film component.
  • the ultrasonic sensor and the second thin film component are not directly bonded by glue, which also avoids the wrinkles of each film layer in the second thin film component caused by the curing and shrinkage of the glue.
  • FIG. 1 is a schematic diagram of the structure of an ultrasonic detection module provided by this application.
  • FIG. 2 is a schematic diagram of the structure of the first thin film assembly shown in FIG. 1.
  • FIG. 3 is a schematic diagram of the structure of the second thin film assembly shown in FIG. 1.
  • FIG. 4 is a schematic structural diagram of an ultrasonic detection module provided with a sensor base film provided by this application.
  • FIG. 5 is a schematic diagram of the first arrangement of the flexible circuit board provided by the application in the ultrasonic detection module.
  • FIG. 6 is a schematic diagram of a second arrangement of the flexible circuit board provided by the application in the ultrasonic detection module.
  • FIG. 7 is a schematic diagram of the electronic device provided by the first embodiment of this application.
  • Fig. 8 is a schematic structural diagram of the electronic device shown in Fig. 7 on the A-A section.
  • FIG. 9 is a schematic diagram of an electronic device provided by the second embodiment of this application.
  • Fig. 10 is a schematic structural diagram of the electronic device shown in Fig. 9 on the B-B section.
  • FIG. 11 is a schematic diagram of an electronic device provided by the third embodiment of this application.
  • Fig. 12 is a schematic structural diagram of the electronic device shown in Fig. 11 on the C-C section.
  • FIG. 13 is a schematic diagram of the electrical connection relationship between the ultrasonic sensor and the processor provided by this application.
  • the target object detected by the ultrasonic detection module of the present application 10 is a biological feature. It can be understood that the target object detected includes but is not limited to fingerprints, palm prints, pulses, facial features, and other biological features. The implementation of the present application is performed by detecting fingerprint features. Exemplary description, but not limiting.
  • FIG. 1 is a schematic diagram of the structure of the ultrasonic detection module provided by this application.
  • the ultrasonic detection module 10 includes an ultrasonic sensor 100, a first thin film component 200, a second thin film component 300, and a cover 400.
  • the ultrasonic sensor 100, the first thin film component 200, the second thin film component 300, and the cover 400 are stacked in sequence.
  • the ultrasonic sensor 100 is used to transmit an ultrasonic signal toward the cover 400 and is used to receive an ultrasonic signal reflected by a target object.
  • the first thin film component 200 is used to reduce or eliminate at least one of the contour print and the wrinkle print generated on the second thin film component 300 when the ultrasonic sensor 100 is attached.
  • the second thin film component 300 is used for Display preset colors. Wherein, the preset color can be set according to specific display requirements, which is not limited in the embodiment of the present application.
  • the ultrasonic detection module 10 of the present application disposes the first thin film component 200 between the second thin film component 300 and the ultrasonic sensor 100, so that when the ultrasonic sensor 100 is attached, the factors can be eliminated or reduced.
  • the ultrasonic sensor 100 and the second membrane assembly 300 are not directly bonded by glue, which also avoids the wrinkles of the membrane layers in the second membrane assembly 300 caused by the curing and shrinkage of the glue.
  • the acoustic impedance of the first membrane component 200 matches the acoustic impedance required for the ultrasonic signal transmission.
  • the ultrasonic signal emitted by the ultrasonic sensor 100 has a strong ability to penetrate the material.
  • the ultrasonic signal will be reflected by, absorbed by, and penetrated by the material during the propagation process.
  • the materials encountered in the process are different.
  • the above-mentioned reflection The degree of absorption and penetration will also change. Therefore, by using the propagation characteristics of the ultrasonic signal, the location of the fingerprint ridge and the ridge can be distinguished, thereby further completing the fingerprint identification.
  • first thin film component 200 and a second thin film component 300 there are a first thin film component 200 and a second thin film component 300.
  • the acoustic impedance and thickness of the first thin film component 200 and the second thin film component 300 will affect the ultrasonic signal in the The propagation between the ultrasonic sensor 100 and the cover 400, therefore, the acoustic impedance of the first membrane component 200 matches the acoustic impedance required for the ultrasonic signal transmission, which can improve the fingerprint recognition of the ultrasonic sensor 100 Sensitivity and accuracy.
  • FIG. 2 is a schematic structural diagram of the first thin film assembly shown in FIG. 1.
  • the first thin film component 200 includes a first adhesive layer 210, an ultrasonic matching layer 220, and a second adhesive layer 230.
  • the ultrasonic matching layer 220 is bonded to the ultrasonic sensor 100 through the first adhesive layer 210, and the ultrasonic matching layer 220 is bonded to the second thin film assembly 300 through the second adhesive layer 230 .
  • the first adhesive layer 210 can be, but is not limited to, glue, and the glue will produce a relatively large contraction force after curing.
  • the ultrasonic sensor 100 is attached to the side of the ultrasonic matching layer 220 away from the second thin film assembly 300 through the first adhesive layer 210, and the ultrasonic matching layer is attached through the second adhesive layer 230. 220 is attached to the side of the second membrane component 300 away from the cover 400 to prevent the ultrasonic sensor 100 and the second membrane component 300 from being directly attached by glue, which increases the size of the ultrasonic sensor 100 and the second membrane component. The distance between the thin film components 300.
  • the second adhesive layer 230 is made of a soft material, it will absorb most of the stress. Therefore, it can eliminate or reduce the stress The contour print produced on the second film assembly 300.
  • the overall thickness of the first thin film component 200, the second thin film component 300, and the cover 400 matches the peak value of the ultrasonic signal.
  • the thickness of the ultrasonic matching layer 220 is 50 nm-300 nm, and the acoustic impedance of the ultrasonic matching layer 220 is less than 5 ⁇ .
  • the hardness of the material of the ultrasonic matching layer 220 is greater than the hardness of the material of the second adhesive layer 230 and less than the hardness of the material of the ultrasonic sensor 100.
  • the second adhesive layer 230 is an OCA layer.
  • OCA is an optically clear adhesive (OCA).
  • OCA is colorless and transparent, has a light transmittance of over 90%, and has good bonding strength, can be cured at room temperature or medium temperature, and has the characteristics of small curing shrinkage.
  • the ultrasonic sensor 100 transmits an ultrasonic signal toward the cover 400, and receives the ultrasonic signal reflected by the target object on the side of the cover 400.
  • the ultrasonic needs to penetrate each film layer of the first film component 200 and the second film back and forth.
  • the thickness of each thin film layer in the first thin film component 200 is controlled within a reasonable range, so that the first thin film component 200 200.
  • the overall thickness of the second membrane component 300 and the cover plate 400 matches the peak value of the ultrasonic signal, matches the acoustic impedance, and can improve the accuracy and sensitivity of fingerprint recognition.
  • the ultrasonic matching layer 220 is a key material for matching the peak value of the ultrasonic signal and matching the acoustic impedance.
  • the common second membrane module 300 on the market is usually provided with a layer of OCA glue to adhere to the cover plate 400.
  • the OCA glue is formulated by the manufacturer and has only one thickness based on industry standards.
  • the thickness of the second adhesive layer 230 (OCA layer) can be set according to specific requirements, and is not limited here.
  • the ultrasonic matching layer 220 includes a first PET layer 222 and a metal layer 221, and the metal layer 221 is carried on the first PET layer 222.
  • PET is polyethylene terephthalate (PET).
  • PET is polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • the metal layer 221 is an aluminum metal film layer.
  • the metal layer 221 may be, but is not limited to, a film layer formed by a coating process or a plating process, and the metal layer 221 is disposed on the side of the first PET layer 222 close to the first adhesive layer 210, or, It is arranged on the side of the first PET layer away from the first adhesive layer 210. Further, the metal layer 221 is an aluminum metal film layer.
  • the metal layer 221 on the side of the first PET layer 222 couples with the user's finger for the touch operation to form a capacitor.
  • the ultrasonic detection module 10 is applied to the electronic device 1, the change of the capacitance value can trigger other events, such as waking up the screen, turning on the ultrasonic sensor 100, and so on.
  • FIG. 3 is a schematic structural diagram of the second thin film assembly shown in FIG. 1.
  • the second film assembly 300 includes a third adhesive layer 320 and a color layer 310, and the color layer 310 is bonded to the cover 400 through the third adhesive layer 320.
  • the color layer 310 includes a second PET layer 313, a texture layer 312, and an ink layer 311, the second PET layer 313 is bonded to the third adhesive layer 320, the texture layer 312 and the ink layer 311 is sequentially stacked on the side of the second PET layer 313 away from the cover 400.
  • the color layer 310 can display a preset color.
  • the color layer 310 includes a second PET layer 313, a texture layer 312, and an ink layer 311.
  • the second PET layer 313 is used as a soft substrate, and the texture layer 312 has a preset color.
  • the film layer can be set with the desired glare color according to needs, and the ink layer 311 is used as a background layer and has the characteristic of opaque light to increase the display effect of the texture layer 312.
  • the third adhesive layer 320 can be, but is not limited to, OCA.
  • OCA has an adhesive effect and can also penetrate the preset color effect of the color layer 310 well.
  • the cover plate 400 is transparent, and the user can see the preset color displayed by the color layer 310 from one side of the cover plate 400, and the cover plate 400 layer may be, but not limited to, glass.
  • the ultrasonic sensor 100 when the ultrasonic sensor 100 is attached to the ultrasonic matching layer 220 through the first adhesive layer 210, wrinkles may be generated on the ultrasonic matching layer 220 after the first adhesive layer 210 is cured and shrunk, and the ultrasonic matching layer 220 It is attached to the second adhesive layer 230, so that the second adhesive layer 230 will also produce a corresponding mark.
  • the second adhesive layer 230 uses a soft material as the transitional bonding layer, the wrinkle print generated on the ultrasonic matching layer 220 will be absorbed, so that the wrinkle deformation will not be transferred to the color layer 310, or to a large extent The transmission of wrinkle deformation is reduced. Therefore, the use of a sparse and soft second adhesive layer 230 between the color layer 310 and the ultrasonic sensor 100 can protect the color layer 310 and present a good color effect.
  • FIG. 4 is a schematic structural diagram of an ultrasonic detection module provided with a sensor base film provided by this application.
  • the ultrasonic detection module 10 further includes a sensor base film 500, the sensor base film 500 is located on the side of the ultrasonic sensor 100 away from the cover 400, the sensor base film 500 is used to reflect incident to the sensor Ultrasonic signal of base film 500.
  • the sensor base film 500 may be, but is not limited to, a hot-pressed adhesive film.
  • the sensor base film 500 provided on one side of the ultrasonic sensor 100 can reflect the ultrasonic signal incident on the sensor base film 500.
  • the area of the cover 400 facing away from the surface of the second film assembly 300 and corresponding to the location of the ultrasonic sensor 100 is the fingerprint touch area.
  • the ultrasonic sensor 100 will emit an ultrasonic signal and receive the user’s fingerprint
  • the touch area emits the ultrasonic signal reflected by the finger of the touching action.
  • the ultrasonic signal emitted by the ultrasonic sensor 100 will propagate around the location of the ultrasonic sensor 100, and the range of the ultrasonic signal that the finger can cover is only one of them.
  • the sensor base film 500 can reflect the ultrasonic signal and superimpose it with the ultrasonic signal propagating toward the finger to strengthen the intensity of the ultrasonic signal propagating toward the finger, so as to improve the fingerprint recognition Precision and sensitivity.
  • FIG. 5 is a schematic diagram of the first arrangement of the flexible circuit board in the ultrasonic detection module provided by this application.
  • the ultrasonic sensor 100 protrudes from one end of the sensor base film 500, and on the side of the ultrasonic sensor 100 that protrudes toward the sensor base film 500, the ultrasonic sensor 100 and the sensor base film 500 form a receiving space.
  • the ultrasonic detection module 10 further includes a flexible circuit board 600, one end of the flexible circuit board 600 is accommodated in the accommodating space and is electrically connected to the ultrasonic sensor 100.
  • the protrusion described in the above embodiment means that the area of the sensor base film 500 is smaller than that of the ultrasonic sensor 100, so that when the sensor base film 500 is stacked on the ultrasonic sensor 100, at least one side of the ultrasonic sensor 100 will be opposite to the sensor base.
  • the side edges of the film 500 extend and protrude.
  • the ultrasonic sensor 100 communicates signals with other functional elements through the flexible circuit board 600.
  • the ultrasonic detection module 10 when applied to the electronic device 1, the ultrasonic sensor 100 communicates with the main board of the electronic device 1 through the flexible circuit board 600. Electrical connection for mutual transmission of signals. Therefore, it is required that the connection between the ultrasonic sensor 100 and the flexible circuit board 600 must be firm and not fall off. Furthermore, by making one end of the ultrasonic sensor 100 protrude from the sensor base film 500, the ultrasonic sensor 100 and the sensor base film 500 form an accommodation space, and one end of the flexible circuit board 600 is accommodated in the accommodation space.
  • the ultrasonic sensor 100, the first thin film component 200, the second thin film component 300, and the cover 400 are very thin, they also have a certain quality.
  • the two thin film components 300 and the cover 400 are under their own gravity, so that the electrical connection performance between the ultrasonic sensor 100 and the flexible circuit board 600 accommodated in the accommodating space is good.
  • FIG. 6 is a schematic diagram of a second arrangement of the flexible circuit board provided in the application in the ultrasonic detection module.
  • the sensor base film 500 protrudes from the side wall of the ultrasonic sensor 100, the sensor base film 500, the ultrasonic sensor 100, and the first thin film component 200 are enclosed in a containing space, and the ultrasonic detection module 10 also includes a flexible circuit board 600, one end of the flexible circuit board 600 is accommodated in the accommodating space and is electrically connected to the ultrasonic sensor 100.
  • One end of the sensor base film 500 protrudes from the ultrasonic sensor 100, and one end of the flexible circuit board 600 is accommodated in the sensor base film 500, the ultrasonic sensor 100, and the first thin film component 200 to form a accommodating space, so that the ultrasonic sensor 100
  • the projection area on the bonding surface is smaller than the projection area of the sensor base film 500 on the bonding surface, that is, the projection of the ultrasonic sensor 100 along the bonding direction is within the projection range of the sensor base film 500 along the bonding direction.
  • the side of the sensor 100 close to the sensor base film 500 can be completely covered by the sensor base film 500, which is beneficial to increase the area of the ultrasonic signal incident on the sensor base film 500 and to improve the accuracy of fingerprint recognition.
  • FIG. 7 is a schematic diagram of the electronic device provided by the first embodiment of the application
  • FIG. 8 is the electronic device shown in FIG. Schematic diagram of the equipment on the AA section.
  • the electronic device 1 includes a device body 20 and an ultrasonic detection module 10, and at least part of the ultrasonic detection module 10 is disposed in the device body 20. Please refer to the previous description for the ultrasonic detection module 10, which will not be repeated here.
  • the electronic device 1 includes, but is not limited to, devices with fingerprint recognition functions, such as smart phones, e-books, or in-vehicle control screens.
  • the ultrasonic detection module 10 is disposed at the back cover 30 of the electronic device 1, the device body 20 includes a back cover 30, and the back cover 30 includes a back plate 32 and is connected to the back plate 32.
  • the periphery of the frame 31 is connected by bending, the back plate 32 is provided with a through hole 33, and the cover plate 400 is embedded in the through hole 33.
  • the cover plate 400 is embedded in the through hole 33, and the user can not only see the preset color presented by the second film assembly 300 from the side of the cover plate 400 away from the second film assembly 300, but also The space occupied by the ultrasonic detection module 10 is reduced, so that the functional elements in the electronic device 1 can be more rationally arranged using space, thereby reducing the thickness of the electronic device 1.
  • the back cover 30 includes a frame 31 and a back plate 32.
  • the frame 31 is connected to the device body 20.
  • the back plate 32 is provided with a through hole 33, and the cover plate 400 is embedded in the through hole 33.
  • the side wall of the back plate 32 forming the through hole 33 has a first guiding inclined surface 34 which is beneficial to guide the user's fingers to be quickly placed on the surface of the cover 400 for fingerprint identification.
  • FIG. 9 is a schematic diagram of the electronic device provided by the second embodiment of the application
  • FIG. 10 is a schematic structural diagram of the electronic device shown in FIG. 9 on the B-B section.
  • the device body 20 includes a transparent back cover 40, and the transparent back cover 40 constitutes the cover 400 of the ultrasonic detection module 10.
  • the transparent back cover 40 Utilizing the transparent characteristics of the transparent back cover 40, the transparent back cover 40 is directly used as the cover plate 400 of the ultrasonic detection module 10, so that the user can see from the side of the transparent back cover 40 away from the second film assembly 300
  • the preset color presented by the second thin film assembly 300 can reduce the thickness of the electronic device 1.
  • the area projected by the ultrasonic sensor 100 on the surface of the transparent back cover 40 away from the second film assembly 300 is the fingerprint touch area.
  • the transparent back cover 40 is provided with a groove 41, and the groove 41 has a second guiding inclined surface 42. The two guiding bevels 42 facilitate the user's finger to be quickly placed in the fingerprint touch area.
  • FIG. 11 is a schematic diagram of the electronic device provided by the third embodiment of this application
  • FIG. 12 is a schematic diagram of the structure of the electronic device shown in FIG. 11 on the C-C cross-section.
  • the ultrasonic detection module 10 is arranged on the display side of the electronic device 1; the device body 20 includes a display screen 50, and the display screen 50 includes a display screen body 52 and The display body 52 is laminated with a transparent protective cover plate 51, and the transparent protective cover plate 51 constitutes the cover plate 400 of the ultrasonic detection module 10.
  • the transparent protective cover 51 is directly used as the cover 400 of the ultrasonic detection module 10, so that the user can move away from the transparent protective cover 51 from one part of the second thin film assembly 300.
  • the thickness of the electronic device 1 can be reduced.
  • FIG. 13 is a schematic diagram of the electrical connection relationship between the ultrasonic sensor and the processor provided in this application.
  • the electronic device 1 further includes a processor 700 that is electrically connected to the ultrasonic detection module 10, the first thin film component 200 includes a metal layer 221, and the processor 700 is used for When the metal layer 221 and the target object are coupled to form a capacitor, the capacitance value of the capacitor is obtained, and the ultrasonic sensor 100 is turned on or off according to the capacitance value.
  • the processor 700 obtains the capacitance value of the capacitor, and when the capacitance value is greater than or equal to a preset threshold, the processor 700 turns on the ultrasonic sensor 100.
  • the processor 700 controls the ultrasonic sensor 100 to remain off.
  • the processor 700 will obtain the capacitance value of the capacitor and compare the capacitance value with a preset threshold. Finally, the ultrasonic sensor 100 is controlled to be turned on or off according to the comparison result. It is understandable that the size of the capacitance will change with the change of the distance between the plates. The smaller the distance between the plates, the greater the capacitance value. In other words, the greater the finger pressure, the greater the capacitance value, and vice versa.
  • the processor 700 sends an opening instruction to the ultrasonic sensor 100, and the ultrasonic sensor 100 transmits an ultrasonic signal after receiving the signal, and receives the ultrasonic wave reflected by the finger.
  • the fingerprint model is formed by the received ultrasonic signal
  • the processor 700 compares the fingerprint model with the preset fingerprint stored in the fingerprint library, and if the fingerprint model matches the preset fingerprint successfully, unlocking is realized.
  • the processor 700 sends a shutdown instruction to the ultrasonic sensor 100.

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Abstract

L'invention porte sur un module de détection ultrasonore et sur un dispositif électronique. Le module de détection ultrasonore comprend un capteur ultrasonore, un premier ensemble film mince, un second ensemble film mince et une plaque de recouvrement qui sont disposés séquentiellement de manière empilée, le capteur ultrasonore étant utilisé pour transmettre un signal ultrasonore à la plaque de recouvrement, et étant utilisé pour recevoir un signal ultrasonore réfléchi par un objet cible ; le premier ensemble film mince est utilisé pour affaiblir ou supprimer au moins l'une des marques de contour et des marques de plis générées sur le second ensemble film mince lorsque le capteur ultrasonore est fixé ; et le second ensemble film mince est utilisé pour afficher une couleur prédéfinie. Selon le module de détection ultrasonore dans la présente invention, des repères de fixation provoqués par la présence d'une contrainte de fixation et différents taux de retrait de couches de film dans le second ensemble film mince peuvent être supprimés ou affaiblis, et les plis générées par les couches de film dans le second ensemble film mince en raison du retrait de durcissement de la colle sont également évitées.
PCT/CN2019/112382 2019-10-21 2019-10-21 Module de détection ultrasonore et dispositif électronique WO2021077269A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/CN2019/112382 WO2021077269A1 (fr) 2019-10-21 2019-10-21 Module de détection ultrasonore et dispositif électronique

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Application Number Priority Date Filing Date Title
PCT/CN2019/112382 WO2021077269A1 (fr) 2019-10-21 2019-10-21 Module de détection ultrasonore et dispositif électronique

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Citations (8)

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Publication number Priority date Publication date Assignee Title
CN207182317U (zh) * 2017-09-12 2018-04-03 南昌欧菲生物识别技术有限公司 超声波指纹识别模组及电子设备
CN207571757U (zh) * 2017-11-02 2018-07-03 蓝思科技（长沙）有限公司 光学指纹传感器结构及电子设备
CN108731716A (zh) * 2017-04-13 2018-11-02 南昌欧菲生物识别技术有限公司 超声波传感器及电子装置
CN109492497A (zh) * 2017-09-12 2019-03-19 南昌欧菲生物识别技术有限公司 超声波指纹识别模组及电子设备制造方法
CN109753856A (zh) * 2017-11-07 2019-05-14 上海箩箕技术有限公司 电子设备
CN109747244A (zh) * 2017-11-07 2019-05-14 上海箩箕技术有限公司 电子设备
WO2019112314A1 (fr) * 2017-12-06 2019-06-13 삼성전자 주식회사 Appareil électronique dans lequel un élément conducteur pour bloquer le bruit généré par un dispositif d'affichage est disposé entre le dispositif d'affichage et un capteur ultrasonore
CN110197160A (zh) * 2019-05-31 2019-09-03 京东方科技集团股份有限公司 显示面板、显示装置及指纹模组的贴合方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108731716A (zh) * 2017-04-13 2018-11-02 南昌欧菲生物识别技术有限公司 超声波传感器及电子装置
CN207182317U (zh) * 2017-09-12 2018-04-03 南昌欧菲生物识别技术有限公司 超声波指纹识别模组及电子设备
CN109492497A (zh) * 2017-09-12 2019-03-19 南昌欧菲生物识别技术有限公司 超声波指纹识别模组及电子设备制造方法
CN207571757U (zh) * 2017-11-02 2018-07-03 蓝思科技（长沙）有限公司 光学指纹传感器结构及电子设备
CN109753856A (zh) * 2017-11-07 2019-05-14 上海箩箕技术有限公司 电子设备
CN109747244A (zh) * 2017-11-07 2019-05-14 上海箩箕技术有限公司 电子设备
WO2019112314A1 (fr) * 2017-12-06 2019-06-13 삼성전자 주식회사 Appareil électronique dans lequel un élément conducteur pour bloquer le bruit généré par un dispositif d'affichage est disposé entre le dispositif d'affichage et un capteur ultrasonore
CN110197160A (zh) * 2019-05-31 2019-09-03 京东方科技集团股份有限公司 显示面板、显示装置及指纹模组的贴合方法

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