WO2021070412A1

WO2021070412A1 - Measurement socket

Info

Publication number: WO2021070412A1
Application number: PCT/JP2020/019984
Authority: WO
Inventors: 周治三森
Original assignee: 株式会社Ｓｄｋ
Priority date: 2019-10-09
Filing date: 2020-05-20
Publication date: 2021-04-15
Also published as: JP6877805B1; JPWO2021070412A1

Abstract

Provided is a measurement socket that is capable of bringing a connector of an electronic module into precise contact with a contact pin so as to ensure electrical conduction therebetween.　The present invention pertains to a measurement socket for measuring an electronic module, said socket comprising: a base having a recess on which the electronic module is to be placed; a cover which is laid over the base; a contact pin for achieving electrical conduction with the electronic module; and a contact guide which is provided to the cover and which, as the cover is laid over the base having the electronic module placed thereon, guides the contact pin to a contact location on the electronic module. Therein, the contact guide has an engagement recess in which a connector can be accommodated, the contact guide is suspended by the cover, and, when the cover is laid over the base, an inner surface of the engagement recess of the contact guide comes into contact with the connector, thereby guiding the contact guide to the position of the connector while engaged with the connector.

Description

Measurement socket

The present invention relates to a measurement socket used when performing continuity inspection, characteristic measurement, etc. of an electronic module.

Conventionally, as a measurement socket (hereinafter, also simply referred to as "socket") used when electrically measuring an electronic component such as an IC, a socket that presses and positions the electronic component in one direction is disclosed. There is. For example, Patent Document 1 discloses a socket for a semiconductor device that presses the surface of an IC package for positioning.

Further, in Patent Document 2, points are formed on the side surfaces orthogonal to the positioning portion on the opposite side of the positioning portion of the electrical component housed in the housing portion, which is operated by the pressing operation of pressing the electrical component of the socket cover. Disclosed is a socket for electrical components provided with one-sided means of contacting and offsetting the electrical component with respect to the positioning unit.

Further, in Patent Document 3, before the electric component is pressed by the pressing member on the socket body, the side surface of the electric component is brought into contact with the fixed guide portion provided on a part of the peripheral edge portion of the mounting portion. A socket for an electrical component is disclosed that includes means for pushing the opposite side surface toward the fixed guide portion to bring the electrical component into contact with the fixed guide portion to position the electrical component at a predetermined mounting position.

In Patent Document 4, a package having a rectangular flat shape is housed in a package accommodating portion on the socket body, and the surface of the package is directed toward the socket body by a pressing member of the socket cover attached to the socket body so as to be openable and closable. By pressing, the electrode formed on the back surface of the package is brought into contact with the contact pin installed on the socket body, and the socket for electrical components that electrically connects the electrode of the package and the external electrical test circuit with the contact pin is formed. Will be disclosed.

Patent Document 5 describes a measurement socket for an electronic module, which has a base having a recess on which the electronic module is placed, a first cover rotatably attached to the base, and the base. On the other hand, the first cover is provided with a second cover rotatably attached and a contact pin provided on the first cover for obtaining continuity with the electronic module, and the first cover is mounted on the base of the electronic module. A measuring socket is disclosed in which the second cover is configured to cover the electronic module prior to the first cover upon closing.

Japanese Unexamined Patent Publication No. 2011-023164 Japanese Unexamined Patent Publication No. 2005-061948 Japanese Unexamined Patent Publication No. 2004-296155 Japanese Unexamined Patent Publication No. 2012-164434 JP-A-2018-040678

However, when the electronic module is placed on the base of the measurement socket and the cover is closed, if the electronic module is misaligned on the base, the connector on the electronic module side and the contact on the cover side when the cover is closed. Poor contact with the pin is likely to occur. In particular, in an electronic module in which electronic components and connectors are connected to a flexible substrate, the electronic components and connectors may be lifted and arranged due to elastic force, bending, twisting, or the like of the flexible substrate. Closing the cover while the electronic module is floating may cause poor continuity. In recent years, the pitch between the terminals of the connector has become narrower, and the flexible substrate may be provided with a bent portion, so that the connector on the electronic module side and the contact pin on the cover side are accurately aligned in the measurement socket. Is becoming more and more difficult.

An object of the present invention is to provide a measurement socket capable of accurately contacting a connector of an electronic module and a contact pin to obtain reliable conduction.

In order to solve the above problems, the present invention is a measurement socket for measuring an electronic module having a flexible substrate, an electronic component and a connector connected to the flexible substrate, and a recess for mounting the electronic module. The contact pin is provided on the cover, the contact pin is provided on the cover, and the contact pin is contacted with the electronic module by covering the base on which the electronic module is mounted. With a contact guide that guides to a position, the contact guide has a fitting recess that can accommodate the connector, the contact guide is suspended from the cover, and the cover is placed on the base to cover the fitting recess of the contact guide. The inner surface comes into contact with the connector, and the contact guide is brought into the position of the connector while being fitted to the connector.

According to such a configuration, since the contact guide is suspended on the cover, the contact guide can be called in according to the contact position of the electronic module by covering the base on which the electronic module is placed with the cover. It can be moved to obtain accurate conduction between the contact pin and the electronic module. Further, when the electronic module is mounted on the base, even if the position of the connector varies depending on the flexible substrate, the inner surface of the fitting recess of the contact guide comes into contact with the connector by covering the base with the cover, and the contact guide. Is moved so as to be called into the position of the connector while being fitted with the connector, so that it is possible to absorb the variation in the position of the connector and obtain reliable continuity between the contact pin and the connector.

In the measuring socket of the present invention, the contact guide may be suspended so as to be movable in at least two directions orthogonal to each other along the reference plane of the cover. As a result, by covering the base on which the electronic module is placed with a cover, the contact guide can be called into the contact position of the electronic module while moving along the reference plane.

In the measurement socket of the present invention, the contact guide may be suspended so as to be movable in the normal direction of the reference surface of the cover. As a result, by covering the base on which the electronic module is placed with a cover, the contact guide can be called into the contact position of the electronic module while moving in the normal direction of the reference plane.

In the measuring socket of the present invention, the contact guide may be rotatably suspended from the cover. As a result, by covering the base on which the electronic module is placed with a cover, the contact guide can be called into the contact position of the electronic module while moving in the rotational direction.

The measuring socket of the present invention may further include an urging means provided between the contact guide and the cover. As a result, the contact guide is suspended on the cover by the urging force of the urging means, and the contact guide is moved and called by using the urging force.

In the measuring socket of the present invention, the contact guide has a substantially rectangular convex portion, and an urging means may be provided between the four side walls of the convex portion and the cover. As a result, the contact guide is suspended by the balance of the urging forces of the four urging means, and the degree of freedom of movement of the contact guide can be increased.

In the measuring socket of the present invention, it is preferable that the opening portion on the inner surface of the fitting recess is provided with a tapered surface that extends to the opening side. As a result, the position of the fitting recess is brought into the position of the connector while the outer surface of the connector is in contact with the tapered surface.

In the measuring socket of the present invention, the contact guide may be arranged in the hole provided in the cover and suspended so as to be movable within the gap between the contact guide and the wall of the hole. As a result, the contact guide can be movably suspended within the range of the hole provided in the cover, and the movement of the contact guide can be restricted within the range of the hole.

In the measuring socket of the present invention, the cover may be provided so as to rotate with respect to the base by a hinge. In the configuration in which the cover rotates with respect to the base, the contact between the contact pin on the cover side and the electronic module on the base side becomes slanted. Even in such an oblique contact, the contact pin can be accurately guided to the contact position of the electronic module by the contact guide suspended on the cover.

The measurement socket of the present invention may be configured so that the contact guide is called into the position of the electronic module mounted on the base by covering the base with a cover. As a result, the contact pin can be accurately guided to the contact position of the electronic module by the operation of covering the cover with the electronic module mounted on the base.

The measurement socket of the present invention includes a plurality of contact guides, and the plurality of contact guides may be independently suspended from the cover. As a result, each of the plurality of contact guides moves and guides independently to the contact position of the corresponding electronic module.

According to the present invention, it is possible to provide a measurement socket capable of accurately contacting a connector of an electronic module and a contact pin to obtain reliable conduction.

It is a perspective view which illustrates the state which opened the measurement socket which concerns on this embodiment. It is a perspective view which illustrates the state which the measurement socket which concerns on this embodiment is closed. (A) to (c) are side views for explaining the operation of closing the cover. It is a perspective view which shows the upper part of a contact guide. It is an enlarged perspective view which shows the upper part of a contact guide. (A) and (b) are perspective views showing the state of fitting the contact guide into the cover. (A) and (b) are enlarged perspective views of the contact guide. (A) and (b) are perspective views explaining the urging means of the contact guide. (A) and (b) are diagrams illustrating the movement of the contact guide. (A) and (b) are schematic views illustrating the operation at the time of fitting the contact guide and the connector. (A) and (b) are diagrams illustrating the movement of the contact guide. (A) and (b) are schematic views illustrating the operation at the time of fitting the contact guide and the connector. It is a front view which illustrates the contact device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same members are designated by the same reference numerals, and the description of the members once described will be omitted as appropriate.

(Measurement socket configuration)
FIG. 1 is a perspective view illustrating a state in which the measurement socket according to the present embodiment is opened.
FIG. 2 is a perspective view illustrating a state in which the measurement socket according to the present embodiment is closed.
The measurement socket 1 according to the present embodiment is a socket used when performing electrical measurement of the electronic module 100. The measurement socket 1 mounts the electronic module 100 to be measured, and obtains electrical contact with the connector 103 of the electronic module 100. In the present embodiment, as the electronic module 100 to be measured, a flexible substrate 102 to which an electronic component 101 and a connector 103 are connected is applied.

A wiring pattern is formed on the flexible substrate 102, and electricity is supplied between the electronic component 101 and the connector 103. Therefore, in the measurement socket 1 of the present embodiment, electrical conduction to the electronic component 101 can be obtained by bringing the contact pin 41, which will be described later, into contact with the terminal of the connector 103.

The measurement socket 1 according to the present embodiment includes a base 10, a cover 20, a contact pin 41, and a contact guide 40. The base 10 has a recess 11 on which the electronic module 100 is mounted. The recess 11 serves as a guide for deciding the arrangement position of the electronic component 101 and the flexible substrate 102. A tapered portion extending upward is provided on the opening side of the recess 11, and a straight portion is provided below the tapered portion. The electronic module 100 placed in the recess 11 is called in by the tapered portion and is housed in the straight portion.

The cover 20 is rotatably attached to the base 10. In this embodiment, the cover 20 is attached via a hinge 50 provided at one end of the base 10. The cover 20 is provided so as to be openable and closable around the axis of the hinge 50.

A latch 60 is provided on, for example, the base 10 of the measurement socket 1. By hooking the latch 60 on the claw 25 of the cover 20 with the cover 20 closed, the closed state of the cover 20 is maintained. The cover 20 is urged in the opening direction by a spring 56 attached to the shaft of the hinge 50. Therefore, by removing the latch 60, the cover 20 is opened by the urging force of the spring 56.

When the electronic module 100 is an optical module, the measurement socket 1 may be used for optical measurement. In this case, a hole 201 is provided in the cover 20, and when the electronic module 100 is placed on the base 10 and the cover 20 is closed, the optical axis of the electronic component 101 corresponds to the hole 201, and the optical axis of the electronic component 101 corresponds to the hole 201. Optical measurements may be made. Therefore, in the measurement socket 1 whose measurement target is the optical module, not only the electrical contact when the electronic module 100 is placed, but also the alignment accuracy of the optical axis of the electronic component 101 with respect to the measurement socket 1 is required. ..

In this embodiment, the holding portion 30 is rotatably attached to the base 10. The holding portion 30 is attached via a hinge 50 to which the cover 20 is attached. The pressing portion 30 is provided so as to be able to open and close around the axis of the hinge 50. That is, the cover 20 and the holding portion 30 are attached to the base 10 so as to be openable and closable via the same hinge 50.

Since the holding portion 30 is arranged closer to the base 10 than the cover 20, when the cover 20 is closed, the holding portion 30 closes to the base 10 side before the cover 20. When the cover 20 is closed and fixed by the latch 60, the holding portion 30 is sandwiched between the cover 20 and the base 10.

A spring 65 may be provided between the cover 20 and the holding portion 30. Since the cover 20 and the pressing portion 30 are connected by the spring 65, the pressing portion 30 also rotates in conjunction with the rotating operation of the cover 20. When the cover 20 is closed with the electronic module 100 placed on the base 10, the pressing portion 30 is put on the electronic module 100 before the cover 20. As a result, when the electronic module 100 is placed in the recess 11 of the base 10, even if the electronic module 100 is lifted or misaligned, it is regulated by the pressing portion 30.

The contact pin 41 is a contact for obtaining continuity with the electronic module 100. Specifically, the contact pin 41 comes into contact with the terminal of the connector 103 of the electronic module 100 to obtain continuity with the electronic module 100. Since a plurality of terminals are arranged on the connector 103, a plurality of contact pins 41 are provided according to the number and arrangement of the terminals of the connector 103.

The contact guide 40 guides the contact pin 41 to the contact position of the electronic module 100. The contact guide 40 is provided on the cover 20, and by covering the base 10 on which the electronic module 100 is placed with the cover 20, it serves to guide the contact pin 41 to the position of the terminal of the connector 103 of the electronic module 100.

In the present embodiment, the contact guide 40 is suspended (supported in a state of being bridged) on the cover 20. That is, the contact guide 40 is arranged in the hole 20h provided in the cover 20, and is suspended so as to be movable within the gap between the contact guide 40 and the hole 20h.

The measurement socket 1 may be provided with a plurality of contact guides 40. In the present embodiment, since the electronic module 100 is provided with the two connectors 103, the two contact guides 40A and 40B are provided correspondingly.

(Cover operation)
Next, the details of the operation of the cover 20 of the measurement socket 1 according to the present embodiment will be described.
3A to 3C are side views illustrating an operation of closing the cover.
First, as shown in FIG. 3A, the electronic module 100 is placed in the recess 11 of the base 10 with the cover 20 and the holding portion 30 open. The electronic module 100 may be placed in a predetermined position in the recess 11, or may be placed in a slightly displaced position inside the recess 11. Further, when the flexible board 102 is bent or twisted, the position of the connector 103 connected to the flexible board 102 may not be stable.

Next, as shown in FIG. 3 (b), the cover 20 is closed. Since the spring 65 is provided between the cover 20 and the pressing portion 30, the pressing portion 30 is also closed in conjunction with the cover 20. Then, the pressing portion 30 is put on the electronic module 100 on the base 10 before the cover 20.

Here, when the electronic module 100 is placed in the normal position of the recess 11, the pressing portion 30 does not come into contact with the electronic module 100 when the pressing portion 30 is closed. On the other hand, when the electronic component 101 is floating, the electronic component 101 is pressed from above by the pressing portion 30, and is corrected to the normal position of the recess 11.

Next, as shown in FIG. 3C, the cover 20 is further closed and fixed by the latch 60. In this state, the holding portion 30 is sandwiched between the cover 20 and the base 10. When the cover 20 is closed, the contact guide 40 of the cover 20 is fitted with the connector 103 of the electronic module 100.

In the present embodiment, since the contact guide 40 is suspended on the cover 20, the contact guide 40 is movably provided with respect to the cover 20. Therefore, even if the position of the connector 103 is misaligned, when the contact guide 40 is fitted to the connector 103 by covering the cover 20, the contact guide 40 is moved so as to be called in according to the position of the connector 103. Become (self-alignment). When the contact guide 40 is fitted to the connector 103, the contact pin 41 is exposed from the contact guide 40 and comes into contact with the terminal of the connector 103. As a result, accurate continuity between the contact pin 41 and the terminal of the connector 103 can be obtained.

(Structure of contact guide)
Next, the details of the contact guide will be described.
FIG. 4 is a perspective view showing the upper part of the contact guide. FIG. 4 shows a state in which the contact guide cover 210 shown in FIG. 2 is removed.
FIG. 5 is an enlarged perspective view showing the upper part of the contact guide. FIG. 5 shows a state in which the top cover 200 shown in FIG. 4 is removed.
6 (a) and 6 (b) are perspective views showing a state in which the contact guide is fitted into the cover. FIG. 6A shows a state in which the contact guide 40 is fitted into the cover 20, and FIG. 6B shows a state in which the contact guide 40A (40) is removed from the cover 20.
7 (a) and 7 (b) are enlarged perspective views of the contact guide.
8 (a) and 8 (b) are perspective views illustrating a contact guide urging means.

The contact guide 40 includes a base 410, a substantially rectangular convex portion 420 protruding from the base 410, and a guide portion 430 protruding to the opposite side of the convex portion 420 of the base 410. For convenience of explanation, the side of the base 410 where the convex portion 420 is provided is referred to as the upper side (upper side), and the side where the guide portion 430 is provided is referred to as the lower side (lower side).

The base 410 is provided on a substantially rectangular parallelepiped, and a cable 440 that conducts with the contact pin 41 is attached. The cable 440 is composed of a flexible substrate, and inputs / outputs a signal from the outside of the measurement socket 1 to the terminal of the connector 103 in contact with the contact pin 41.

The base 410 is fitted into the recess 202 provided in the cover 20, and the recess 202 is provided with a hole 20h. When the base 410 is fitted into the recess 202, the guide portion 430 enters the hole 20h. ..

A spring holder 425 is arranged adjacent to each of the four side walls of the convex portion 420 provided in a substantially rectangular shape. The spring holder 425 is provided with a hole 425h for accommodating the coil spring 450, which is an example of the urging means. For example, one spring holder 425 is provided with two holes 425h in parallel, and each hole 425h accommodates a coil spring 450. A coil spring 450 is arranged in the convex portion 420 so as to face each of the two orthogonal directions.

The coil spring 450 housed in the hole 425h of the spring holder 425 is incorporated between the side wall of the convex portion 420 and the top cover 200 facing the side wall. That is, the top cover 200 is provided with a substantially cross-shaped hole into which the convex portion 420 and the four spring holders 425 can be fitted, and by mounting the top cover 200 on the cover 20, this is achieved. The convex portion 420 and the four spring holders 425 are fitted into the holes.

In this state, by incorporating the coil spring 450 into the hole 425h of the spring holder 425, the convex portion 420 is pressed by the coil spring 450 from four directions and is supported by the balance of the urging force of the coil spring 450. Therefore, the contact guide 40 is suspended from the cover 20 by the convex portion 420 supported by the coil spring 450. Therefore, when a force is applied to the contact guide 40, the coil spring 450 expands and contracts to move the position of the convex portion 420, and the position of the contact guide 40 also moves accordingly.

The guide portion 430 protruding downward from the base 410 is provided in a frame shape, and the contact pin 41 is arranged inside the frame of the guide portion 430. By closing the cover 20, the connector 103 of the electronic module 100 is fitted into the frame of the guide portion 430. As described above, since the contact guide 40 is suspended from the cover 20 by the convex portion 420 supported by the coil spring 450, when the guide portion 430 is fitted into the connector 103, it receives an external force from the connector 103. The position of the contact guide 40 moves with the expansion and contraction of the coil spring 450, and the guide portion 430 is aligned so as to be called into the position of the connector 103.

(Movement of contact guide)
Next, the movement of the contact guide will be described.
9 (a) to 10 (b) are diagrams illustrating the movement of the contact guide. In FIGS. 9 and 10, FIG. 9A is a perspective view and FIG. 10B is a sectional view. 9 (a) and 9 (b) show a state in which the contact guide 40 is located at one end of a predetermined movement range, and FIGS. 10 (a) and 10 (b) show the contact guide 40 in a predetermined movement. The state located at the other end of the range is shown.

The contact guide 40 is suspended on the cover 20 by a convex portion 420 supported by the coil spring 450, and can move in at least two directions orthogonal to each other along the reference plane RS of the cover 20. Here, the reference surface RS is a contact surface (lower surface of the top cover 200) with the base 410 in the top cover 200. For convenience of explanation, the two directions orthogonal to each other along the reference plane RS are referred to as the X direction and the Y direction. Further, the normal direction of the reference plane RS is referred to as the Z direction. When the convex portion 420 moves due to the expansion and contraction of the coil spring 450, the contact guide 40 can move in the XY direction along the reference surface RS.

9 (a) and 9 (b) show a state in which the contact guide 40 has moved to one end in the X direction. In this case, the convex portion 420 is pushed in the direction of the arrow A, the spring holder 425A on one end side of the two

spring holders

425A and 425B facing each other in the X direction is pushed, and the coil spring 450A contracts. On the other hand, the coil spring 450B on the other end side extends and the spring holder 425B pushes the convex portion 420 toward one end side.

10 (a) and 10 (b) are schematic views illustrating the operation when the contact guide and the connector are fitted.
FIG. 10 shows an operation when the contact guide 40 moves in the direction of the arrow A as in FIG. 9.
The guide portion 430 of the contact guide 40 is provided with a fitting recess 431 capable of accommodating the connector 103. The inner surface of the fitting recess 431 is provided with a fitting surface 432 that comes into contact with the outer surface of the connector 103 when the connector 103 is accommodated. It is preferable that the opening portion on the inner surface of the fitting recess 431 is provided with a tapered surface 433 that expands toward the opening side.

As shown in FIG. 10A, when the guide portion 430 is separated from the connector 103 (the state before fitting), the contact guide 40 suspended from the cover 20 has the urging force of the

coil springs

450A and 450B. It is placed in a neutral position by balance. In the electronic module 100 mounted on the base 10, for example, the position of the connector 103 with respect to the base 10 may be displaced due to bending or bending of the flexible substrate 102.

By covering the base 10 with the cover 20 in this state, the guide portion 430 approaches the connector 103, and when the connector 103 begins to fit into the fitting recess 431, the outer surface of the connector 103 becomes the fitting surface 432 of the fitting recess 431. When they come into contact with each other, the guide portion 430 moves so as to be attracted to the position of the connector 103 while being fitted to the connector 103. When the fitting recess 431 is provided with the tapered surface 433, the position of the fitting recess 431 is called into the position of the connector 103 while the outer surface of the connector 103 is in contact with the tapered surface 433, and the fitting recess 431 is easily fitted.

As a result, as shown in FIG. 10B, the contact guide 40 suspended from the cover 20 moves in the direction of arrow A (the direction in which the connector 103 is displaced), and the fitting recess 431 is formed in the connector 103. It moves so as to follow the position, and the connector 103 and the fitting recess 431 are fitted.

11 (a) and 11 (b) show a state in which the contact guide 40 has moved to the other end in the X direction, contrary to FIGS. 9 (a) and 9 (b). In this case, the convex portion 420 is pushed in the direction of the arrow B, the spring holder 425B on the other end side of the two

spring holders

425A and 425B facing each other in the X direction is pushed, and the coil spring 450B contracts. On the other hand, the coil spring 450A on one end side extends and the spring holder 425A pushes the convex portion 420 toward the other end side.

12 (a) and 12 (b) are schematic views illustrating the operation when the contact guide and the connector are fitted.
FIG. 12 shows an operation when the contact guide 40 moves in the direction of the arrow B as in FIG.

As shown in FIG. 12A, when the guide portion 430 is separated from the connector 103 (the state before fitting), the contact guide 40 suspended from the cover 20 has the urging force of the

coil springs

By covering the base 10 with the cover 20 in this state, the guide portion 430 approaches the connector 103, and when the connector 103 begins to fit into the fitting recess 431, the outer surface of the connector 103 becomes the fitting surface 432 of the fitting recess 431. When they come into contact with each other, the guide portion 430 moves so as to be attracted to the position of the connector 103 while being fitted to the connector 103.

As a result, as shown in FIG. 12B, the contact guide 40 suspended from the cover 20 moves in the direction of arrow B (the direction in which the connector 103 is displaced), and the fitting recess 431 is formed in the connector 103. It moves so as to follow the position, and the connector 103 and the fitting recess 431 are fitted.

As described above, in the present embodiment, the contact guide 40 is suspended on the cover 20, is arranged in the neutral position by the balance of the urging forces of the

coil springs

450A and 450B, and is arranged along the reference plane RS by the external force. It can be moved. As a result, even if the position of the connector 103, which is the object of fitting, is misaligned, the contact guide 40 moves so as to follow the misalignment, and the connector 103 is securely fitted while absorbing the misalignment. You will be able to meet.

In the present embodiment, the electronic module 100 in which the electronic component 101 and the connector 103 are connected to the flexible substrate 102 is the measurement target, and the terminal position of the connector 103 that contacts the contact pin 41 is provided with reference to the position of the connector 103. Has been done. Since many terminals of the connector 103 are juxtaposed at a narrow pitch, the contact between each terminal and the contact pin 41 can be made by fitting the fitting recess 431 with reference to the outer surface of the connector 103 to make a contact at an accurate position. It will be realized.

On the other hand, the position of the connector 103 changes due to misalignment in the connection of the connector 103 to the flexible substrate 102, or even if the connector 103 is connected to an accurate position on the flexible substrate 102, the elastic force, bending, twisting, etc. of the flexible substrate 102. become. In recent years, since the flexible substrate 102 has become relatively hard and may be bent, the relative positional relationship between the electronic component 101 connected to the flexible substrate 102 and the connector 103 tends to be unstable. .. Therefore, if the terminal of the connector 103 and the contact pin 41 are aligned with respect to the electronic component 101, accurate contact is often not possible.

In the present embodiment, even if the position of the connector 103, which is the object of fitting with the guide portion 430, is displaced, the fitting surface 432 of the fitting recess 431 comes into contact with the outer surface of the connector 103, so that the connector 103 is suspended. The contact guide 40 is moved so that the fitting recess 431 of the guide portion 430 can be fitted in accordance with the position of the connector 103 in which the deviation occurs.

Here, in the socket for electrical parts disclosed in Patent Document 4, when the socket cover is closed, the pressing member moves according to the inclined surface on the socket body side. However, the contact guide 40 does not move so as to absorb the misalignment of the connector 103, which is the object of fitting (contact) as in the present embodiment. That is, in Patent Document 4, the assembly error between the socket cover and the socket body is absorbed, and when the package which is the object of contact is misaligned with respect to the socket body, the misalignment is absorbed. It is not possible to make accurate contact. This is because it is assumed that the package is correctly placed on the socket body.

In the present embodiment, the contact guide 40 corresponds to the case where the position of the connector 103, which is the object to be fitted with the fitting recess 431 of the guide portion 430, is displaced, and even if the displacement occurs, the contact guide 40 follows the position of the connector 103. Can be moved. Therefore, it is possible to directly absorb the misalignment of the connector 103, which is the object of fitting (connection), and reliably fit the fitting recess 431 of the guide portion 430 and the connector 103. It becomes. By securely fitting the fitting recess 431 with reference to the position of the connector 103, it is possible to accurately bring the contact pins 41 into contact with a plurality of terminals juxtaposed with the connector 103 at a narrow pitch.

Although the examples of movement in the X direction are shown in FIGS. 9 to 12, the same applies to the movement in the Y direction. Further, the contact guide 40 may be suspended so as to be movable in the Z direction. For example, when suspending the contact guide 40, a slight gap is provided between the upper surface of the base 410 and the lower surface of the top cover 200 (reference surface RS). That is, thereby, the contact guide 40 is supported by the coil spring 450 in a slightly floating state in the Z direction. As a result, the contact guide 40 can move not only in the XY direction but also in the Z direction. Further, when the contact guide 40 is supported in a floating state in the Z direction, the contact guide 40 can also move in the rotation direction (rotation direction centered on each of the three axes in the XYZ direction). As a result, when the contact guide 40 is fitted with the connector 103 of the electronic module 100, the contact guide 40 moves according to the position and orientation of the connector 103, and the contact guide 40 is securely fitted even if the connector 103 is misaligned. In this way, the contact pin 41 and the terminal of the connector 103 can be brought into contact with each other.

(Contact device)
Next, the contact device will be described.
FIG. 13 is a front view illustrating the contact device.
The contact device 500 according to the present embodiment includes a base 10, a cover 20, a holding portion 30, a contact pin 41, and a contact guide 40, similarly to the measurement socket 1 described above. In the contact device 500, the cover 20 and the pressing portion 30 are configured to move up and down with respect to the base 10.

The base 10 is provided with a recess 11 on which the electronic module 100 is placed. The base 10 is provided with columns 15 at four positions, for example. The cover 20 is supported by the support column 15 and is provided so as to be vertically movable along the support column 15. A spring 17 is provided on the support column 15 to urge the cover 20 upward. The cover 20 is put on the base 10 by being pushed by a drive mechanism (not shown) with a force exceeding the urging force of the spring 17.

The holding portion 30 is provided between the base 10 and the cover 20. The pressing portion 30 is configured so that when the cover 20 is lowered and put on the base 10, the pressing portion 30 is put on the electronic module 100 before the cover 20.

In the contact device 500, the cover 20 and the holding portion 30 are lowered with the electronic module 100 placed in the recess 11 of the base 10. As a result, the connector 103 is fitted into the contact guide 40, and the contact pin 41 and the terminal of the connector 103 come into contact with each other. Since the contact guide 40 is suspended from the cover 20, even if the position of the connector 103 is displaced, the contact guide 40 is called in according to the position of the connector 103 when the contact guide 40 is fitted to the connector 103. Therefore, accurate continuity between the contact pin 41 and the terminal of the connector 103 can be obtained.

As described above, according to the embodiment, it is possible to provide the measurement socket 1 capable of accurately contacting the connector 103 of the electronic module 100 and the contact pin 41 to obtain reliable conduction.

Although the present embodiment and specific examples thereof have been described above, the present invention is not limited to these examples. For example, the electronic module 100 to be measured is an example in which the electronic component 101 and the connector 103 are connected to the flexible substrate 102, but the configuration of the electronic module 100 is not limited to this. In addition, those skilled in the art appropriately adding, deleting, or changing the design of each of the above-described embodiments or specific examples thereof, and those in which the features of each embodiment are appropriately combined are also included in the present invention. As long as it has a gist, it is included in the scope of the present invention.

1 ... Measuring socket 10 ... Base 11 ... Recess 15 ... Support 17 ... Spring 20 ... Cover 20h ... Hole 25 ... Claw 30 ... Holding

part

40, 40A, 40B ... Contact guide 41 ... Contact pin 50 ... Hinge 56 ... Spring 60 ... Latch 65 ... Spring 100 ... Electronic module 101 ... Electronic component 102 ... Flexible board 103 ... Connector 200 ... Top cover 201 ... Hole 202 ... Recessed 210 ... Contact guide cover 410 ... Base 420 ...

Convex part

425, 425A, 425B ... Spring Holder 425h ... Hole 430 ... Guide portion 431 ... Fitting recess 432 ... Fitting surface 433 ... Tapered surface 440 ...

Cable

450, 450A, 450B ... Coil spring 500 ... Contact device A, B ... Arrow RS ... Reference surface

Claims

A measurement socket for measuring an electronic module having a flexible substrate and an electronic component and a connector connected to the flexible substrate.
A base having a recess on which the electronic module is placed,
The cover that covers the base and
A contact pin for obtaining continuity with the electronic module,
A contact guide provided on the cover and guiding the contact pin to the contact position of the electronic module by covering the base on which the electronic module is mounted is provided.
The contact guide has a fitting recess that can accommodate the connector.
The contact guide is suspended from the cover and
By covering the base with the cover, the inner surface of the fitting recess of the contact guide comes into contact with the connector, and the contact guide is called into the position of the connector while being fitted to the connector. Measurement socket.
The measurement socket according to claim 1, wherein the contact guide is suspended so as to be movable in at least two directions orthogonal to each other along a reference plane of the cover.
The measurement socket according to claim 2, wherein the contact guide is suspended so as to be movable in the normal direction of the reference surface of the cover.
The measurement socket according to claim 2 or 3, wherein the contact guide is rotatably suspended from the cover.
The measuring socket according to any one of claims 1 to 4, further comprising an urging means provided between the contact guide and the cover.
The contact guide has a substantially rectangular convex portion and has a substantially rectangular convex portion.
The measuring socket according to claim 5, wherein the urging means is provided between the four side walls of the convex portion and the cover.
The measurement socket according to any one of claims 1 to 6, wherein a tapered surface extending to the opening side is provided in the opening portion on the inner surface of the fitting recess.
The contact guide is arranged in a hole provided in the cover.
The measuring socket according to any one of claims 1 to 7, which is movably suspended within a gap between the contact guide and the wall of the hole.
The measurement socket according to any one of claims 1 to 8, wherein the cover is provided so as to rotate with respect to the base by a hinge.
The measurement socket according to any one of claims 1 to 9, wherein the contact guide is called to the position of the electronic module mounted on the base by covering the base with the cover.
Equipped with multiple contact guides
The measuring socket according to any one of claims 1 to 10, wherein the plurality of contact guides are independently suspended from the cover.