WO2021052250A1

WO2021052250A1 - Atomization core, atomizer and electronic atomization device

Info

Publication number: WO2021052250A1
Application number: PCT/CN2020/114718
Authority: WO
Inventors: 叶琴
Original assignee: 深圳麦克韦尔科技有限公司
Priority date: 2019-09-16
Filing date: 2020-09-11
Publication date: 2021-03-25
Also published as: CN110584212A

Abstract

An atomization core (10), an atomizer (20) and an electronic atomization device. The atomizer (20) has a liquid storage cavity (700) for storing a liquid. The atomization core (10) comprises: a base (100) for introducing a liquid from the liquid storage cavity (700); a first heating element (200) and a second heating element (300) which are provided on the base (100), the first heating element (200) pre-heating the liquid to be introduced into the base (100), the second heating element (300) heating and atomizing the liquid which has been introduced into the base (100), and the heating temperature of the second heating element (300) being higher than the preheating temperature of the first heating element (200); and a valve assembly (400), comprising a sealing piston (410) capable of moving in the liquid storage cavity (700) and having a first position and a second position, and when the first heating element (200) stops working, the sealing piston (410) preventing the liquid from contacting the base (100) in the first position, and when the first heating element (200) works, the sealing piston (410) allowing the liquid to contact the base (100) in the second position. In this way, liquid leakage and dry burning of the atomization core (10) can be avoided.

Description

Atomizing core, atomizer and electronic atomizing device

Technical field

This application relates to the field of electronic atomization technology, in particular to an atomization core, an atomizer and an electronic atomization device.

Background technique

Electronic atomization devices have a similar appearance and taste to ordinary cigarettes, but usually do not contain other harmful components such as tar and suspended particles in cigarettes. Therefore, electronic atomization devices are commonly used as substitutes for cigarettes. In the existing electronic atomization device, the liquid is usually transported to the atomization surface of the atomization core under capillary action for atomization. During the suction process, it is easy to cause the atomization core to dry and produce burnt smell and other harmful substances. In addition, the electronic atomization device will leak when it is stopped, which will affect the user experience.

Summary of the invention

According to various embodiments of the present application, there is provided an atomizing core of an atomizer, the atomizer having a liquid storage cavity for storing liquid, including: a base body for introducing the liquid in the liquid storage cavity;

The first heating element is arranged on the base and used for preheating the liquid to be introduced into the base;

A second heating element arranged on the substrate and used for heating and atomizing the liquid introduced into the substrate, the heating temperature of the second heating element is higher than the preheating temperature of the first heating element; and

The valve assembly includes a sealed piston, which can move in the liquid storage chamber and has a first position and a second position. When the first heating element stops working, the sealed piston is in the first position. The position prevents the liquid from contacting the base body, and when the first heating body is working, the sealing piston allows the liquid to contact the base body at the second position.

In one of the embodiments, the valve assembly further includes a memory deformation spring connected with the sealing piston, and when the first heating element stops working, the memory deformation spring is in a normal temperature shape so that the sealing piston is located In the first position, when the first heating element is working, the memory deformation spring absorbs heat and is in a thermally deformed shape to drive the sealing piston to move from the first position to the second position.

In one of the embodiments, the memory deformation spring is directly connected to the first heating body or directly connected to the base body.

In one of the embodiments, the first heating body and the second heating body form a parallel circuit, and the resistance of the first heating body is greater than the resistance of the second heating body.

In one of the embodiments, it further includes a first electrical connector for connecting the positive pole of the power supply and a second electrical connector for connecting the negative pole of the power supply. The first electrical connector is connected to the first heating element and the second electrical connector. One end of the heating element is connected, and the second electrical connector is connected to the other end of the first heating element and the second heating element.

In one of the embodiments, the first and second electrical connectors are in the shape of a membrane or a line; the first and second electrical connectors are respectively arranged on two opposite outer surfaces of the base; or, the first , The second electrical connection pieces are respectively penetrated inside the base body.

In one of the embodiments, the substrate has a liquid absorption surface for introducing liquid, the first heating element is in the shape of a film or a line, and the first heating element is directly attached to the liquid absorption surface Or it is embedded in the base body close to the liquid absorption surface.

In one of the embodiments, the substrate has an atomization surface, the second heating element is in the shape of a film or a line, and the second heating element is directly attached to the atomization surface or embedded in the substrate. The position in the body close to the atomization surface.

In one of the embodiments, the preheating temperature of the first heating element is 80°C to 95°C, and the heating temperature of the second heating element is 200°C to 260°C.

In one of the embodiments, the substrate is a porous ceramic substrate with a porosity of 10% to 80%.

In one of the embodiments, the sealing piston slides linearly between the first position and the second position.

An atomizer having a liquid storage cavity for storing liquid, the atomizer comprising any one of the above-mentioned atomizing cores, in the first position, the outer side of the sealing piston and the liquid storage cavity The inner wall surfaces are pressed against each other. In the second position, the outer side surface of the sealing piston and the inner wall surface of the liquid storage cavity are spaced apart from each other to have a gap, and the liquid in the liquid storage cavity passes through the gap Flow to the substrate.

In one of the embodiments, in the first position, a buffer cavity is formed between the sealing piston and the base, and the buffer cavity and the liquid storage cavity are isolated from each other; in the second position, the The buffer cavity communicates with the liquid storage cavity through the gap.

In one of the embodiments, the liquid storage cavity includes a first cavity and a second cavity communicating with each other, the first cavity is disposed closer to the base than the second cavity, and the cross section of the first cavity The size is smaller than or equal to the cross-sectional size of the sealing piston, the cross-sectional size of the second cavity is greater than the cross-sectional size of the sealing piston; in the first position, the sealing piston is matched with the first cavity, In the second position, the sealing piston is located in the second cavity.

In one of the embodiments, along the direction from the first position to the second position, the cross-sectional size of the second cavity gradually increases.

An electronic atomization device includes a power supply and a control circuit. The electronic atomization device further includes a power supply and any one of the above-mentioned atomizers. The power supply is electrically connected to the atomizer, and the control circuit It is used to control the heat generation of both the first heating element and the second heating element.

In one of the embodiments, the first heating element is activated in advance of a preset time relative to the second heating element.

In one of the embodiments, the value range of the preset time is 0.5 seconds to 2 seconds.

The details of one or more embodiments of the present application are set forth in the following drawings and description. Other features, purposes and advantages of this application will become apparent from the description, drawings and claims.

Description of the drawings

FIG. 1 is a schematic cross-sectional structure diagram of an atomizer provided by an embodiment;

2 is a schematic cross-sectional structure diagram of the atomizer shown in FIG. 1 when the sealing piston is in the first position;

3 is a schematic cross-sectional structure diagram of the atomizer shown in FIG. 1 when the sealing piston is in a second position;

4 is a schematic diagram of the three-dimensional structure of the base in FIG. 1;

Fig. 5 is a schematic diagram of the three-dimensional structure of the atomizing core in Fig. 1;

FIG. 6 is a schematic cross-sectional structure diagram of the first example of the atomization core in FIG. 5; FIG.

FIG. 7 is a schematic cross-sectional structure diagram of a second example of the atomization core in FIG. 5; FIG.

Fig. 8 is a schematic diagram of the circuit connection in the atomizer shown in Fig. 1.

In order to better describe and illustrate the embodiments and/or examples of those applications disclosed herein, one or more drawings may be referred to. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed applications, the currently described embodiments and/or examples, and the best mode of those applications currently understood.

detailed description

In order to facilitate the understanding of the application, the application will be described in a more comprehensive manner with reference to the relevant drawings. The preferred embodiments of the application are shown in the accompanying drawings. However, this application can be implemented in many different forms and is not limited to the implementation described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of this application more thorough and comprehensive.

It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or a central element may also be present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or an intermediate element may be present at the same time. The terms "inner", "outer", "left", "right" and similar expressions used herein are for illustrative purposes only, and do not mean that they are the only embodiments.

Referring to FIGS. 1 to 3 at the same time, the electronic atomization device provided by an embodiment of the present application includes a power supply, a control circuit, and an atomizer 20. The power supply is electrically connected to the atomizer 20 through an electrode 600, and the power supply is used for the atomizer 20. Provide electricity. The atomizer 20 is provided with a liquid storage cavity 700 and an atomization cavity 810. The liquid storage cavity 700 and the atomization cavity 810 are isolated from each other but not connected. The liquid storage cavity 700 is used to store liquids represented by aerosol generating substrates. The smoke formed after atomization overflows from the atomization cavity 810. The atomizer 20 is also provided with an air inlet channel 201 and an air inlet channel 202. The air inlet channel 201 communicates the atomizing cavity 810 with the outside. The air inlet channel 202 also communicates the atomizing cavity 810 with the outside. The outside air passes through the air inlet channel. 201 enters the atomization cavity 810 to carry the smoke in the atomization cavity 810, and then the smoke is sucked by the user through the inhalation channel 202. The solid arrow in FIG. 1 points to the gas flow path. As shown in FIG. 2, the atomizer 20 includes an atomizing core 10, and the atomizing core 10 includes a base 100, a first heating body 200, a second heating body 300 and a valve assembly 400.

Referring to Figure 2, in some embodiments, the substrate 100 is a porous ceramic substrate, that is, the substrate 100 is made of a porous ceramic material. The substrate 100 contains a large number of micropores and has a certain porosity. The porosity can be defined as The percentage of the volume of the pores to the total volume of the material in the natural state. The porosity of the matrix 100 is 10% to 80%. As the porosity of the matrix 100 increases, the flow resistance of the matrix 100 to the liquid decreases and the penetration of the liquid is enhanced. ability. At the same time, when the viscosity of the liquid increases, the resistance to the flow of the liquid in the base 100 increases. Therefore, when the porosity of the substrate 100 decreases and the viscosity of the liquid increases, it will be difficult or even impossible for the liquid to penetrate into the substrate 100 through the micropores, thereby preventing the liquid from leaking from the surface of the substrate 100. The waste of the liquid in the liquid storage chamber 700 is avoided, and the liquid leaked from the base 100 is further prevented from flowing into the power source to pollute and corrode the related electronic components in the power source, so as to ensure that the electronic atomization device can work normally. Furthermore, the matrix 100 made of porous ceramic material has good high temperature resistance characteristics, and the liquid in the liquid storage chamber 700 will not chemically react with the matrix 100 under high temperature conditions, preventing the liquid from participating in unnecessary chemical reactions. waste.

2 and 4 to 7 at the same time, the base 100 has a liquid absorbing surface 110 and an atomizing surface 120. When the liquid in the liquid storage chamber 700 contacts the liquid absorbing surface 110, the base 100 has a certain porosity, so that the base 100 has a certain porosity. 100 can form capillary action, so that the liquid enters the interior of the base 100 through the liquid absorption surface 110, and the liquid that enters the interior of the base 100 further reaches the atomization surface 120 to be atomized to form smoke. The atomization surface 120 defines a part of the boundary of the atomization cavity 810, so that the mist formed by atomization on the atomization surface 120 will first overflow into the atomization cavity 810, and then pass through the inhalation channel 202 to be sucked by the user.

4 to 7 at the same time, in some embodiments, the first heating element 200 is disposed on the base 100, and the first heating element 200 can be set to a certain preheating temperature to preheat the liquid to be introduced into the liquid absorption surface 110, The preheating temperature can range from 80°C to 95°C. For example, the preheating temperature can be 80°C, 85°C, 90°C, or 95°C. When the atomizer 20 is working, the first heating element 200 preheats the liquid to be introduced into the substrate 100, so that the temperature of the liquid near the liquid absorption surface 110 is increased relative to normal temperature. Since the viscosity of the liquid is inversely proportional to the temperature, the preheating After that, the viscosity of the liquid will be lower than that of the liquid at room temperature. At this time, the flow resistance of the liquid with reduced viscosity in the matrix 100 is reduced and the flow speed increases, so that more liquid permeates into the matrix 100 and reaches the base 100 per unit time. The atomization surface 120 is for atomization. The first heating element 200 may be a film-shaped preheating film, or may be a linear preheating wire. For example, the first heating element 200 can be directly attached to the liquid absorption surface 110. Obviously, the first heating element 200 protrudes to a certain height relative to the liquid absorption surface 110. For another example, the first heating element 200 is embedded and completely hidden inside the base 100. Of course, the first heating element 200 is arranged close to the liquid absorption surface 110, so that the heat generated by the first heating element 200 is quickly transferred to the liquid absorption surface 110. Also shorten the transfer path to further reduce heat loss. For another example, a part of the liquid absorption surface 110 may also be recessed to form a groove, and the first heating element 200 is matched with the groove, that is, the first heating element 200 is embedded in the base body 100, and the first heating element 200 is in the embedded state. The surface of the liquid absorption surface 110 can also be kept flush with the unrecessed part of the liquid absorption surface 110. According to actual requirements, the first heating element 200 may be connected to the base 100 through a printing process, a spraying process or an electroplating process, and the first heating element 200 may be made of a metal material.

In some embodiments, the second heating element 300 is disposed on the substrate 100, and the second heating element 300 can form a heating temperature for atomizing the liquid introduced into the substrate. Therefore, the heating temperature of the second heating element 300 will be higher. It is the preheating temperature of the first heating element 200. The heating temperature of the second heating element 300 can range from 200°C to 260°C, for example, the heating temperature can be 200°C, 210°C, 240°C, or 260°C. The second heating element 300 may be a film-shaped heating film or a linear heating wire. For example, the second heating element 300 may be directly attached to the atomizing surface 120. Obviously, the second heating element 300 protrudes to a certain height relative to the atomizing surface 120. For another example, the second heating element 300 is embedded and completely hidden inside the base 100. Of course, the second heating element 300 is arranged close to the atomizing surface 120, so that the heat generated by the second heating element 300 is quickly transferred to the atomizing surface 120. Also shorten the transfer path to further reduce heat loss. For another example, a part of the atomizing surface 120 can also be recessed to form a groove, and the second heating element 300 is matched with the groove, that is, the second heating element 300 is embedded in the base 100, and the second heating element 300 is in the embedded state. The surface of the atomization surface 120 can also be kept flush with the unrecessed part of the atomization surface 120. According to actual needs, the second heating body 300 may be connected to the base 100 through a printing process, a spraying process, or an electroplating process. The second heating body 300 may be made of stainless steel, titanium metal, titanium alloy material, or the like.

The control circuit can enable the first heating element 200 to be activated by a preset time in advance relative to the second heating element 300. When the control circuit activates the first heating element 200 to preheat the liquid to be introduced into the substrate 100 for a set time, the liquid is heated during the preheating time and the viscosity is reduced, ensuring that enough liquid penetrates during the preheating time period When the second heating element 300 starts to start inside the base 100 and reaches the atomizing surface 120, it can effectively prevent dry burning caused by insufficient liquid in the base 100 or untimely supply. The value range of the preset time is 0.5 seconds to 2 seconds. For example, the value of the preset time can be 0.5 seconds, 1 second, 1.5 seconds, or 2 seconds.

Referring to FIGS. 4 to 8 at the same time, in some embodiments, the atomizing core 10 further includes a first electrical connector 510 and a second electrical connector 520. The first electrical connector 510 is used to connect the positive electrode of the power supply through the electrode 600. The second electrical connector 520 is used to connect to the negative electrode of the power supply through the electrode 600. The first electrical connector 510 is connected to one end of the first heating element 200 and one end of the second heating element 300. At the same time, the second electrical connector 520 is connected to the other end of the first heating element 200 and the other end of the second heating element 300. Both ends are connected. At this time, through the joint action of the first electrical connector 510 and the second electrical connector 520, the first heating element 200 and the second heating element 300 form a parallel circuit, and the first heating element 200 and the second heating element 300 It can be regarded as two resistors arranged in parallel in the circuit, and the power supply supplies power to the parallel circuit. The resistance of the first heating element 200 is higher than the resistance of the second heating element 300. Since the voltages applied to the first heating element 200 and the second heating element 300 are equal, the second heating element 300 generates The amount of heat generated by the first heating element 200 is higher than that of the first heating element 200, so that the heating temperature of the second heating element 300 is higher than the preheating temperature of the first heating element 200. Of course, the first heating body 200 and the second heating body 300 can also form a series circuit. At this time, the resistance of the first heating body 200 is smaller than the resistance of the second heating body 300, which can also make the preheating temperature of the first heating body 200 It is lower than the heating temperature of the second heating element 300.

Both the first electrical connection member 510 and the second electrical connection member 520 may be a diaphragm-shaped electrical connection film or a line-shaped electrical connection wire. In this case, the diaphragm-shaped or linear-shaped first electrical connection member 510 The second electrical connection member 520 and the second electrical connection member 520 may be attached to two opposite outer surfaces of the base 100 respectively. In the case where the first heating element 200 is located on the liquid absorption surface 110 and the second heating element 300 is located on the atomizing surface 120, a through hole 130 may be provided in the base body 100. The through hole 130 is a through hole and penetrates the liquid absorption surface 110 at the same time. As with the atomizing surface 120, the number of through holes 130 is two, one of the through holes 130 may be penetrated with the first electrical connector 510, and the other through hole 130 may be penetrated with the second electrical connector 520. The first electrical connector 510 and the second electrical connector 520 may also be connected to the base 100 through a printing process, a spraying process, or an electroplating process.

According to the actual viscosity of the liquid and the required smoke concentration, the preheating temperature of the first heating element 200 and the heating temperature of the second heating element 300 can also be automatically adjusted by the control circuit. When the viscosity of the liquid increases and the required smoke is sucked When the concentration increases, it means that more liquid must reach the atomizing surface 120 in a unit time to atomize to form a larger amount of smoke. At this time, for example, the first heating element 200 and the second heating element 300 are formed In the case of a parallel circuit, the preheating temperature can be increased by increasing the voltage applied by the power supply to further reduce the liquid concentration and increase the flow speed of the liquid in the substrate 100; at the same time, the heating temperature is increased to make the second heating element 300 It can generate enough heat per unit time to atomize the liquid. Conversely, when the viscosity of the liquid decreases and the concentration of smoke required for suction decreases, the voltage loaded on the first heating element 200 and the second heating element 300 can be reduced.

Referring to FIGS. 4 to 7 at the same time, in some embodiments, the base 100 is roughly rectangular parallelepiped. The base 100 has an upper side 101, a lower side 102, a front side 103, a rear side 104, a right end surface 105 and a left end surface 106. The upper side 101 of the base 100 is the liquid absorption surface 110, that is, the first heating element 200 is located on the upper side 101; the lower side 102 of the base 100 is the atomizing surface 120, that is, the second heating element 300 is located on the lower side 102. At this time, the suction The liquid surface 110 and the atomizing surface 120 are parallel to each other. The first electrical connection member 510 may be located on the left end surface 106, and the second electrical connection member 520 may be located on the right end surface 105. Of course, the front side 103 or the back side 104 of the base 100 may be the liquid absorption surface 110, and the lower side 102 of the base 100 is still the atomization surface 120. At this time, the liquid absorption surface 110 and the atomization surface 120 are perpendicular to each other. In other embodiments, the shape of the base 100 may be cylindrical or the like.

Referring to FIGS. 1 to 3 at the same time, in some embodiments, the valve assembly 400 includes a sealed piston 410 and a memory deformation spring 420. When at room temperature, the memory deformation spring 420 is in an initially compressed normal temperature shape, and the temperature rises when absorbing heat When it is high, the memory deformation spring 420 can be stretched and elongated to be in a thermally deformed shape. When the heat is released and the temperature is lowered to normal temperature, the memory deformation spring 420 transforms the thermally deformed shape extended by extension into the initially compressed normal temperature shape. In short, according to the temperature change, the memory deformation spring 420 will be stretched or compressed. The upper end of the memory deformation spring 420 can be directly connected to the sealing piston 410, and the lower end of the memory deformation spring 420 can be directly connected to the first heating element 200, so that the memory deformation spring 420 can directly absorb the heat of the first heating element 200 and deform; or the memory deformation The lower end of the spring 420 is directly connected to the liquid absorption surface 110 of the base body 100, so that the memory deformation spring 420 directly absorbs the heat on the liquid absorption surface 110 and deforms.

The sealing piston 410 is located in the liquid storage chamber 700. When the memory deformation spring 420 is stretched or compressed, it can drive the sealing piston 410 to reciprocate between the first position 11 and the second position 12. The movement is in the form of linear sliding. Of course, the movement can also be in the form of curved rotation. When at room temperature, referring to FIG. 2, the memory deformation spring 420 makes the sealing piston 410 at the first position 11. At this time, the sealing piston 410 prevents the liquid in the liquid storage chamber 700 from being introduced into the base 100 at the first position 11. When heat is absorbed and the temperature rises, referring to FIG. 3, the memory deformation spring 420 stretches and pushes the sealing piston 410 upward to move from the first position 11 to the second position 12. At this time, the sealing piston 410 is in the second position 12. The liquid in the liquid storage cavity 700 is allowed to be introduced into the base 100.

In some embodiments, the liquid storage cavity 700 includes a first cavity 710 and a second cavity 720. The first cavity 710 is located below the second cavity 720, that is, the first cavity 710 is located closer to the base 100 than the second cavity 720. The first cavity 710 may be a cylindrical cavity, the second cavity 720 may be a conical cavity, and the sealing piston 410 may be cylindrical. The cross-sectional dimension b of the first cavity 710 is less than or equal to the cross-sectional dimension a of the sealing piston 410, and the cross-sectional dimension c of the second cavity 720 is greater than the cross-sectional dimension a of the sealing piston 410. In the first position 11, the sealing piston 410 is located in the first cavity 710 and forms a buffer cavity 820 between the base 100 and the liquid absorption surface 110 of the base 100 defining a part of the boundary of the buffer cavity 820. The memory deformation spring 420 can be located in the Cache cavity 820. Since the cross-sectional dimension b of the first cavity 710 is less than or equal to the cross-sectional dimension a of the sealing piston 410, the sealing piston 410 and the first cavity 710 form an interference fit. At this time, the outer side surface of the sealing piston 410 and the liquid storage cavity 700 The inner wall surfaces of the inner wall press against each other, so that the buffer cavity 820 and the second cavity 720 are isolated from each other, and the liquid contained in the second cavity 720 cannot enter the buffer cavity 820 and further penetrates into the interior of the substrate 100 and reaches the atomization surface 120. When the sealing piston 410 slides linearly from the first cavity 710 to the second cavity 720 and is in the second position 12, since the cross-sectional dimension c of the second cavity 720 is greater than the cross-sectional dimension a of the sealing piston 410, the sealing piston 410 A clearance fit is formed with the second cavity 720. At this time, the outer side surface of the sealing piston 410 and the inner wall surface of the liquid storage cavity 700 are spaced apart from each other to have a gap 730, so that the liquid storage cavity 700 communicates with the buffer cavity 820 through the gap 730 , The liquid contained in the second cavity 720 enters the buffer cavity 820 through the gap 730, so as to further penetrate into the substrate 100 and reach the atomization surface 120. The direction indicated by the dashed arrow in FIG. 3 is the flow path of the liquid. When the second cavity 720 is a tapered cavity, along the direction from the first position 11 to the second position 12 (ie, the direction from bottom to top), the cross-sectional size of the second cavity 720 gradually increases.

When the electronic atomization device stops working, both the first heating element 200 and the second heating element 300 stop heating, the memory deformation spring 420 is in a normal temperature shape, and the sealing piston 410 is in interference fit with the first cavity 710, and the liquid cannot flow from the second cavity. The cavity 720 enters the buffer cavity 820 to penetrate into the interior of the base 100, thereby effectively preventing the liquid that penetrates into the interior of the base 100 from leaking from the surface of the base 100. When the electronic atomization device starts to work, first, the control circuit activates the first heating element 200, and the memory deformation spring 420 absorbs the heat of the first heating element 200 and stretches and stretches and transforms from a normal temperature shape to a thermally deformed shape, thereby sealing the piston 410 is pushed from the first cavity 710 to the second cavity 720, the liquid enters the buffer cavity 820 and absorbs heat, and the liquid whose viscosity decreases after absorbing the heat quickly penetrates into the substrate 100 and reaches the atomizing surface 120. Then, after the first heating element 200 is preheated for a preset time, the control circuit then activates the second heating element 300, so that there is enough liquid in the base 100 for the second heating element 300 to atomize to form smoke for the user to inhale. .

Therefore, when the electronic atomization device is placed in storage, the memory deformation spring 420 makes the sealing piston 410 in the first position 11 and prevents the liquid from contacting with the base 100 to be introduced into the base 100, thereby preventing the liquid from leaking on the surface of the base 100 and avoiding the electronic mist Leakage occurs when the chemical device is put on hold. When the electronic atomization device is working, the first heating element 200 works to generate heat. This heat has two functions. On the one hand, the memory deformation spring 420 absorbs heat and drives the sealing piston 410 to move from the first position 11 to the second position 12. Ensure that the liquid can contact the liquid absorbing surface 110 of the substrate 100; on the other hand, the liquid in contact with the liquid absorbing surface 110 absorbs heat to reduce viscosity, thereby reducing the flow resistance of the liquid in the substrate 100 and increasing the liquid flow speed, ensuring that the liquid can It penetrates into the base 100 in time and reaches the atomization surface 120 to ensure that there is enough liquid in the base 100 per unit time for the second heating element 300 to heat and atomize, and prevent dry burning in the base 100 due to insufficient liquid supply, ensuring that users On the basis of experience, the service life and safety performance of the electronic atomization device are improved.

The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, All should be considered as the scope of this specification.

The above-mentioned embodiments only express several implementation manners of the present application, and their description is relatively specific and detailed, but they should not be understood as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can be made, and these all fall within the protection scope of this application. Therefore, the scope of protection of the patent of this application shall be subject to the appended claims.

Claims

An atomizing core of an atomizer, the atomizer having a liquid storage cavity for storing liquid, characterized in that, the atomizing core includes:

The base body is used to introduce the liquid in the liquid storage cavity;

The first heating element is arranged on the base and used for preheating the liquid to be introduced into the base;

A second heating element arranged on the substrate and used for heating and atomizing the liquid introduced into the substrate, the heating temperature of the second heating element is higher than the preheating temperature of the first heating element; and

The valve assembly includes a sealed piston, which can move in the liquid storage chamber and has a first position and a second position. When the first heating element stops working, the sealed piston is in the first position. The position prevents the liquid from contacting the base body, and when the first heating body is working, the sealing piston allows the liquid to contact the base body at the second position.
The atomizing core of claim 1, wherein the valve assembly further comprises a memory deformation spring connected to the sealing piston, and when the first heating element stops working, the memory deformation spring is at a normal temperature The shape makes the sealing piston at the first position. When the first heating element is working, the memory deformation spring absorbs heat and is in a thermally deformed shape to drive the sealing piston from the first position to the second position.
The atomizing core according to claim 2, wherein the memory deformation spring is directly connected to the first heating body or directly connected to the base body.
The atomizing core according to claim 1, wherein the first heating body and the second heating body form a parallel circuit, and the resistance of the first heating body is greater than the resistance of the second heating body .
The atomizing core according to claim 1, further comprising a first electrical connector for connecting the positive pole of the power source and a second electrical connector for connecting the negative pole of the power source, the first electrical connector being One end of the first heating element is connected to one end of the second heating element, and the second electrical connector is connected to one end of the first heating element and the other end of the second heating element.
The atomizing core according to claim 5, wherein the first and second electrical connectors are in the shape of a membrane or a line; the first and second electrical connectors are respectively disposed on two oppositely disposed base bodies. On the outer surface; or, the first and second electrical connections are respectively penetrated inside the base body.
The atomizing core of claim 1, wherein the substrate has a liquid absorbing surface for introducing liquid, the first heating element is in the shape of a film or a line, and the first heating element is directly attached Attached to the liquid absorbing surface or embedded in the base at a position close to the liquid absorbing surface.
The atomizing core according to claim 1, wherein the substrate has an atomizing surface, the second heating element is in the shape of a membrane or a line, and the second heating element is directly attached to the fog The atomization surface or is embedded in the base body at a position close to the atomization surface.
The atomizing core according to claim 1, wherein the preheating temperature of the first heating element is 80°C to 95°C, and the heating temperature of the second heating element is 200°C to 260°C.
The atomizing core according to claim 1, wherein the substrate is a porous ceramic substrate with a porosity of 10% to 80%.
The atomizing core according to claim 1, wherein the sealing piston slides linearly between the first position and the second position.
An atomizer having a liquid storage cavity for storing liquid, wherein the atomizer comprises the atomizing core according to any one of claims 1 to 11, and when in the first position, the The outer side surface of the sealing piston and the inner wall surface of the liquid storage cavity are pressed against each other. In the second position, the outer side surface of the sealing piston and the inner wall surface of the liquid storage cavity are spaced apart from each other with a gap, The liquid in the liquid storage cavity flows to the substrate through the gap.
The atomizer according to claim 12, wherein when in the first position, a buffer cavity is formed between the sealing piston and the base, and the buffer cavity and the liquid storage cavity are isolated from each other; When in the second position, the buffer chamber communicates with the liquid storage chamber through the gap.
The atomizer according to claim 12, wherein the liquid storage cavity comprises a first cavity and a second cavity that are communicated with each other, and the first cavity is disposed closer to the base than the second cavity, The cross-sectional size of the first cavity is less than or equal to the cross-sectional size of the sealed piston, and the cross-sectional size of the second cavity is greater than the cross-sectional size of the sealed piston; in the first position, the sealed piston Cooperating with the first cavity, when in the second position, the sealing piston is located in the second cavity.
The atomizer according to claim 14, wherein the cross-sectional size of the second cavity gradually increases along the direction from the first position to the second position.
An electronic atomization device, comprising a power supply and a control circuit, characterized in that, the electronic atomization device further comprises a power supply and the atomizer according to any one of claims 12 to 15, and the power supply and the atomizer The carburetor is electrically connected, and the control circuit is used to control the heating of both the first heating element and the second heating element.
The electronic atomization device according to claim 16, wherein the first heating element is activated in advance of a preset time relative to the second heating element.
18. The electronic atomization device of claim 17, wherein the preset time ranges from 0.5 seconds to 2 seconds.