WO2021044630A1 - Procédé et système de fabrication de condensateur à film encapsulé - Google Patents

Procédé et système de fabrication de condensateur à film encapsulé Download PDF

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Publication number
WO2021044630A1
WO2021044630A1 PCT/JP2019/035263 JP2019035263W WO2021044630A1 WO 2021044630 A1 WO2021044630 A1 WO 2021044630A1 JP 2019035263 W JP2019035263 W JP 2019035263W WO 2021044630 A1 WO2021044630 A1 WO 2021044630A1
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WO
WIPO (PCT)
Prior art keywords
film capacitor
case
capacitor element
film
manufacturing
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Application number
PCT/JP2019/035263
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English (en)
Japanese (ja)
Inventor
真司 田口
節 戸村
千恵 金子
Original Assignee
日立エーアイシー株式会社
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立エーアイシー株式会社, 日立化成株式会社 filed Critical 日立エーアイシー株式会社
Priority to PCT/JP2019/035263 priority Critical patent/WO2021044630A1/fr
Publication of WO2021044630A1 publication Critical patent/WO2021044630A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

Definitions

  • the present invention relates to a manufacturing method and a manufacturing system of a case-type film capacitor.
  • the present inventors have studied a film capacitor having a small capacitance change and a low dielectric loss tangent in a high temperature region. Then, in the study by the present inventors, it was found that the capacitor may swell during the reflow process for mounting the case-type film capacitor.
  • It includes a step and a sixth step of sealing the film condenser element housed in the case with a resin, and adjusts the amount of water contained in the film condenser element between the third step and the sixth step.
  • a method for manufacturing a case-type film capacitor having a further process.
  • the method of the present invention since it is possible to suppress an increase in the capacitance of the capacitor due to moisture absorption, it is possible to reduce the variation in capacitance in the manufacture of the case type film capacitor. Further, according to the method of the present invention, it is possible to manufacture a case-type film capacitor whose capacitance does not easily decrease under a high temperature load. The present inventors consider that such an effect is obtained by sufficiently suppressing the phenomenon that the vapor-deposited metal of the metallized film disappears due to the reaction between the moisture and the vapor-deposited metal.
  • the dielectric film contains a polyetherimide resin.
  • the water content adjusting step can be performed by vacuum drying with a vacuum degree of 100 Pa or less and a temperature of 50 ° C. or more. In this case, the influence on the productivity of the case-type film capacitor can be further reduced.
  • the amount of water contained in the film capacitor element is 0.25% by mass or less in the vacuum drying step.
  • the water content adjusting step is provided between the third step and the fourth step.
  • the method of the present invention further includes an oil impregnation step of impregnating the film capacitor element that has undergone the water content adjusting step with insulating oil before the fourth step. May be good.
  • the film capacitor element that has undergone the vacuum drying step may be stored in an atmosphere with a humidity of 10% or less until it is subjected to the fourth step.
  • the water content adjusting step is provided between the fifth step and the sixth step.
  • the present invention is also a system for manufacturing a case-type film capacitor including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, the dielectric film and the film.
  • a means for laminating or winding a metallized film having a metal vapor deposition film provided on the surface, a means for molding the laminated or wound metallized film, and a metallikon electrode are provided on the molded metallized film.
  • a case-type film capacitor manufacturing system including a means for sealing the film with a resin and a means for adjusting the amount of water contained in the film capacitor element.
  • case-type film capacitor manufacturing system of the present invention a case-type film capacitor having sufficient reflow resistance can be obtained. Further, according to the manufacturing system of the present invention, it is possible to reduce the variation in capacitance in the manufacturing of the case type film capacitor. Further, according to the manufacturing system of the present invention, it is possible to manufacture a case-type film capacitor whose capacitance does not easily decrease under a high temperature load.
  • the case-type film capacitor manufacturing system of the present invention may further include means for storing the film capacitor element having an adjusted water content at a predetermined humidity.
  • the case-type film capacitor manufacturing system of the present invention may further include an oil impregnation means for impregnating the film capacitor element having an adjusted water content with insulating oil.
  • the present invention also includes a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, and the amount of water contained in the film capacitor element is 0.25% by mass or less.
  • a type film capacitor Provided is a type film capacitor.
  • the present invention it is possible to provide a case-type film capacitor having sufficient reflow resistance, a method for manufacturing the case-type film capacitor capable of manufacturing the case-type film capacitor, and a manufacturing system.
  • the method and manufacturing system for the case-type film capacitor of the present invention can reduce the variation in capacitance in the manufacture of the case-type film capacitor, and the case-type film whose capacitance does not easily decrease under a high temperature load. It is also useful for manufacturing capacitors.
  • the numerical range indicated by using “-" indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value of the numerical range of one step can be arbitrarily combined with the upper limit value or the lower limit value of the numerical range of another step.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
  • “A or B” may include either A or B, or both.
  • the materials exemplified in the present specification may be used alone or in combination of two or more.
  • FIG. 1 is a flow chart for explaining an embodiment of a method for manufacturing a case-type film capacitor according to the present invention.
  • the method for manufacturing a case-type film capacitor of the present embodiment is a method for manufacturing a case-type film capacitor including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element.
  • the method of the present embodiment includes a first step (S1) of laminating or winding a dielectric film and a metallized film having a metal vapor deposition film provided on one surface of the film.
  • FIG. 2 is a flow chart for explaining another embodiment of the method for manufacturing a case-type film capacitor according to the present invention.
  • the moisture content adjustment step (SD) is followed by moisture content.
  • the method is the same as that shown in FIG. 1 except that the film capacitor element that has undergone the quantity adjusting step is further provided with a step (SS) of storing the film capacitor element in a predetermined humidity atmosphere until it is subjected to the fourth step.
  • SS step of storing the film capacitor element in a predetermined humidity atmosphere until it is subjected to the fourth step.
  • Examples of the dielectric film constituting the metallized film include PET (polyethylene terephthalate), PPS (polyphenylene sulfide), PPE (polyphenylene ether) PBT (polybutylene terephthalate), POM (polyoxymethylene), PPO (polyphenyl oxide), and the like.
  • Resin molded products such as PEI (polyetherimide) and vacuum resin molded products such as polyvinyl chloride and polycarbonate can be used.
  • the dielectric film contains a polyetherimide resin.
  • the thickness of the dielectric film can be 3 ⁇ m to 20 ⁇ m, preferably 3.5 ⁇ m to 15 ⁇ m, and more preferably 3.5 ⁇ m to 12 ⁇ m. Within such a range, it becomes easy to achieve both weather resistance and strength and small size and light weight. Further, from the viewpoint of increasing the capacity and reducing the size, the thickness of the dielectric film is preferably 3 ⁇ m to 12 ⁇ m, more preferably 3.5 ⁇ m to 10 ⁇ m.
  • Examples of the material of the metal vapor deposition film include aluminum, copper, zinc, and alloys thereof. Silicon, titanium, or the like may be added to the metal vapor deposition film.
  • the metal vapor deposition film can be formed by vacuum vapor deposition or the like.
  • the thickness of the vapor-deposited film can be set in the same manner as the thickness for a normal metallized film capacitor. For example, the thickness at which a resistance value of 1 ⁇ / ⁇ to 50 ⁇ / ⁇ can be obtained can be set.
  • a known metal foil may be used instead of the metal vapor deposition film.
  • the laminated or wound metallized film is formed into a predetermined shape.
  • the side surface of the wound body can be pressed to form a flat shape.
  • the molding includes the case where the laminated body or the wound body is individually separated as it is.
  • FIG. 3B shows a molded body 20 in which the wound body of the metallized film 1 is pressure-molded into a flat shape.
  • the metallikon electrode can be provided by spraying a metal or alloy such as zinc, copper, aluminum, tin, or solder on both end faces of the laminated or wound metallized film. At this time, the side surface of the laminated body or the wound body may be protected by taping. Further, the surface of the metallikon electrode may be plated.
  • FIG. 3C shows a film capacitor element 30 in which metallikon electrodes 2 are provided on both side surfaces of a wound body of a metallized film 1 which is press-molded into a flat shape.
  • the water content contained in the film capacitor element can be adjusted by, for example, vacuum drying or heat drying.
  • the degree of vacuum in vacuum drying can be 100 Pa or less, and from the viewpoint of removing moisture absorbed moisture, 20 Pa or less is preferable, and 10 Pa or less is more preferable.
  • vacuum drying is preferably performed by heating, for example, it can be performed at 50 ° C. or higher, and from the viewpoint of removing hygroscopic moisture and shortening the process, 50 ° C. or higher is preferable, and 80 ° C. or higher is more preferable. preferable. Further, from the viewpoint of preventing deterioration of the performance of the material, 170 ° C. or lower is preferable, and 100 ° C. or lower is more preferable.
  • the vacuum drying time is not particularly limited, but can be set so that the amount of water contained in the film capacitor element is equal to or less than a predetermined value. From the viewpoint of achieving both relaxation of vacuum and temperature conditions and productivity, 12 hours or more is preferable, and 18 hours or more is more preferable.
  • vacuum drying is preferably performed under the conditions of a temperature of 90 to 110 ° C. and a vacuum degree of 10 Pa or less for 15 to 25 hours, preferably 95 to 105 ° C. and a vacuum degree of 6 It is more preferable to carry out for 18 to 24 hours under the condition of .6 Pa or less.
  • the water content contained in the film capacitor element is 0.25% by mass or less, preferably 0.10% by mass or less in the water content adjusting step. It is more preferable to adjust it, and it is further preferable to adjust it to 0.03% by mass or less.
  • the film capacitor element can be stored in a low humidity storage so that the water content adjusted in the water content adjusting step does not increase.
  • the humidity is preferably 10% or less, more preferably 3% or less, and further preferably 1% or less.
  • the temperature can be 0 to 50 ° C., and is preferably 15 to 25 ° C. from the viewpoint of preventing re-absorption of moisture.
  • Low humidity storage may be appropriately provided between each process as needed, but it is preferable to provide it immediately after the water content adjusting process.
  • an oil impregnation step of impregnating the condenser element with insulating oil may be provided immediately after the water content adjusting step. That is, the method of the present embodiment may further include an oil impregnation step of impregnating the film capacitor element that has undergone the water content adjusting step with insulating oil.
  • the capacitor element impregnated with the insulating oil may be stored, the capacitor element before being impregnated with the insulating oil may be stored, or both may be stored.
  • insulating oil a known insulating oil used for a film capacitor element can be used, and examples thereof include silicone oil and fluorine-based oil.
  • silicone oil for example, methyl hydrogen silicone oil which is a cross-linking reactive monomer, a two-component addition reaction type liquid silicone rubber, or the like can be used.
  • Fluorine-based oils include, for example, fluororesins such as polytetrafluoroethylene, polychlorotrifluoroethylene, vinyl fluoride, ethylene trifluoride, vinylidene fluoride, copolymers such as propylene hexafluoride, and the like. Can be used.
  • Examples of the method of impregnating the capacitor element with insulating oil include a method of impregnating the capacitor element with insulating oil from the metallikon electrode surface by a vacuum impregnation method or the like so as to remove air in the element.
  • the external lead-out terminal may be any as long as it can electrically connect the outside and the metallikon electrode, for example, foil, wire, thin plate of metal or alloy such as copper, aluminum, iron, nickel, stainless steel, phosphor bronze, etc. Can be used, and copper or a copper alloy, which is a good electrical conductor, is preferable.
  • the surface of the external lead-out terminal may be plated with tin, solder, or the like.
  • FIG. 4A shows a film capacitor element 40 with an external extraction terminal in which the external extraction terminal 3 is attached to the metallikon electrode 2 of the film capacitor element 30.
  • Examples of the method of attaching the external lead-out terminal include solder connection, welding, and pressure welding.
  • the case may be a resin container for accommodating the capacitor element and having an opening.
  • FIG. 4B shows a mode in which the film capacitor element 40 with an external extraction terminal is housed in the case 4 having an opening.
  • FIG. 4C shows a case-type film capacitor 100 including a case 4, a film capacitor element 40 with an external extraction terminal housed in the case 4, and a sealing resin 5 for sealing the film capacitor element.
  • a resin such as epoxy resin or urethane resin mixed with a filler or the like can be used.
  • a filler hydroxides such as silicon, titanium, aluminum, calcium, zirconium, and magnesium, oxides, carbides, nitrides, and composites thereof can be used.
  • a flame retardant and an antioxidant may be added to the resin composition, if necessary.
  • the case-type film capacitor manufacturing system of the present embodiment includes means for carrying out each step in the case-type film capacitor manufacturing method of the present embodiment described above.
  • the case-type film capacitor of the present embodiment includes a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, and the amount of water contained in the film capacitor element is 0.25. It is less than or equal to mass%.
  • the case-type film capacitor of the present embodiment can be obtained by the above-described method for manufacturing the case-type film capacitor of the present embodiment.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un condensateur à film encapsulé destiné à la fabrication d'un condensateur à film encapsulé comportant : un boîtier ; un élément de condensateur à film qui est logé dans le boîtier ; et une résine d'étanchéité pour sceller l'élément de condensateur à film. Le procédé comprend : une première étape de stratification ou d'enroulement d'un film métallisé qui a un film diélectrique et un film déposé métallique qui est disposé sur une surface du film ; une deuxième étape pour la mise en forme du film métallisé stratifié ou enroulé ; une troisième étape pour obtenir un élément de condensateur à film en fournissant une électrode de contact métallique au film métallisé mis en forme ; une quatrième étape pour fixer une borne de connexion externe à l'électrode de contact métallique de l'élément de condensateur à film ; une cinquième étape pour recevoir dans le boîtier l'élément de condensateur à film auquel la borne de connexion externe a été fixée ; et une sixième étape pour sceller l'élément de condensateur à film logé dans le boîtier avec une résine. En outre, entre la troisième étape et la sixième étape se trouve une étape de réglage de l'humidité pour ajuster la quantité d'humidité contenue dans l'élément de condensateur à film.
PCT/JP2019/035263 2019-09-06 2019-09-06 Procédé et système de fabrication de condensateur à film encapsulé WO2021044630A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/JP2019/035263 WO2021044630A1 (fr) 2019-09-06 2019-09-06 Procédé et système de fabrication de condensateur à film encapsulé

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Application Number Priority Date Filing Date Title
PCT/JP2019/035263 WO2021044630A1 (fr) 2019-09-06 2019-09-06 Procédé et système de fabrication de condensateur à film encapsulé

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WO2021044630A1 true WO2021044630A1 (fr) 2021-03-11

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016532U (ja) * 1983-07-08 1985-02-04 日新電機株式会社 モ−ルド形コンデンサ
JPH0357921U (fr) * 1989-10-09 1991-06-05
WO2019146755A1 (fr) * 2018-01-25 2019-08-01 株式会社村田製作所 Condensateur à film, et boîtier externe pour condensateur à film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016532U (ja) * 1983-07-08 1985-02-04 日新電機株式会社 モ−ルド形コンデンサ
JPH0357921U (fr) * 1989-10-09 1991-06-05
WO2019146755A1 (fr) * 2018-01-25 2019-08-01 株式会社村田製作所 Condensateur à film, et boîtier externe pour condensateur à film

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