WO2021044630A1 - Encased film capacitor manufacturing method and manufacturing system - Google Patents

Encased film capacitor manufacturing method and manufacturing system Download PDF

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WO2021044630A1
WO2021044630A1 PCT/JP2019/035263 JP2019035263W WO2021044630A1 WO 2021044630 A1 WO2021044630 A1 WO 2021044630A1 JP 2019035263 W JP2019035263 W JP 2019035263W WO 2021044630 A1 WO2021044630 A1 WO 2021044630A1
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film capacitor
case
capacitor element
film
manufacturing
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PCT/JP2019/035263
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French (fr)
Japanese (ja)
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真司 田口
節 戸村
千恵 金子
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日立エーアイシー株式会社
日立化成株式会社
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Priority to PCT/JP2019/035263 priority Critical patent/WO2021044630A1/en
Publication of WO2021044630A1 publication Critical patent/WO2021044630A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

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  • the present invention relates to a manufacturing method and a manufacturing system of a case-type film capacitor.
  • the present inventors have studied a film capacitor having a small capacitance change and a low dielectric loss tangent in a high temperature region. Then, in the study by the present inventors, it was found that the capacitor may swell during the reflow process for mounting the case-type film capacitor.
  • It includes a step and a sixth step of sealing the film condenser element housed in the case with a resin, and adjusts the amount of water contained in the film condenser element between the third step and the sixth step.
  • a method for manufacturing a case-type film capacitor having a further process.
  • the method of the present invention since it is possible to suppress an increase in the capacitance of the capacitor due to moisture absorption, it is possible to reduce the variation in capacitance in the manufacture of the case type film capacitor. Further, according to the method of the present invention, it is possible to manufacture a case-type film capacitor whose capacitance does not easily decrease under a high temperature load. The present inventors consider that such an effect is obtained by sufficiently suppressing the phenomenon that the vapor-deposited metal of the metallized film disappears due to the reaction between the moisture and the vapor-deposited metal.
  • the dielectric film contains a polyetherimide resin.
  • the water content adjusting step can be performed by vacuum drying with a vacuum degree of 100 Pa or less and a temperature of 50 ° C. or more. In this case, the influence on the productivity of the case-type film capacitor can be further reduced.
  • the amount of water contained in the film capacitor element is 0.25% by mass or less in the vacuum drying step.
  • the water content adjusting step is provided between the third step and the fourth step.
  • the method of the present invention further includes an oil impregnation step of impregnating the film capacitor element that has undergone the water content adjusting step with insulating oil before the fourth step. May be good.
  • the film capacitor element that has undergone the vacuum drying step may be stored in an atmosphere with a humidity of 10% or less until it is subjected to the fourth step.
  • the water content adjusting step is provided between the fifth step and the sixth step.
  • the present invention is also a system for manufacturing a case-type film capacitor including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, the dielectric film and the film.
  • a means for laminating or winding a metallized film having a metal vapor deposition film provided on the surface, a means for molding the laminated or wound metallized film, and a metallikon electrode are provided on the molded metallized film.
  • a case-type film capacitor manufacturing system including a means for sealing the film with a resin and a means for adjusting the amount of water contained in the film capacitor element.
  • case-type film capacitor manufacturing system of the present invention a case-type film capacitor having sufficient reflow resistance can be obtained. Further, according to the manufacturing system of the present invention, it is possible to reduce the variation in capacitance in the manufacturing of the case type film capacitor. Further, according to the manufacturing system of the present invention, it is possible to manufacture a case-type film capacitor whose capacitance does not easily decrease under a high temperature load.
  • the case-type film capacitor manufacturing system of the present invention may further include means for storing the film capacitor element having an adjusted water content at a predetermined humidity.
  • the case-type film capacitor manufacturing system of the present invention may further include an oil impregnation means for impregnating the film capacitor element having an adjusted water content with insulating oil.
  • the present invention also includes a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, and the amount of water contained in the film capacitor element is 0.25% by mass or less.
  • a type film capacitor Provided is a type film capacitor.
  • the present invention it is possible to provide a case-type film capacitor having sufficient reflow resistance, a method for manufacturing the case-type film capacitor capable of manufacturing the case-type film capacitor, and a manufacturing system.
  • the method and manufacturing system for the case-type film capacitor of the present invention can reduce the variation in capacitance in the manufacture of the case-type film capacitor, and the case-type film whose capacitance does not easily decrease under a high temperature load. It is also useful for manufacturing capacitors.
  • the numerical range indicated by using “-" indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value of the numerical range of one step can be arbitrarily combined with the upper limit value or the lower limit value of the numerical range of another step.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
  • “A or B” may include either A or B, or both.
  • the materials exemplified in the present specification may be used alone or in combination of two or more.
  • FIG. 1 is a flow chart for explaining an embodiment of a method for manufacturing a case-type film capacitor according to the present invention.
  • the method for manufacturing a case-type film capacitor of the present embodiment is a method for manufacturing a case-type film capacitor including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element.
  • the method of the present embodiment includes a first step (S1) of laminating or winding a dielectric film and a metallized film having a metal vapor deposition film provided on one surface of the film.
  • FIG. 2 is a flow chart for explaining another embodiment of the method for manufacturing a case-type film capacitor according to the present invention.
  • the moisture content adjustment step (SD) is followed by moisture content.
  • the method is the same as that shown in FIG. 1 except that the film capacitor element that has undergone the quantity adjusting step is further provided with a step (SS) of storing the film capacitor element in a predetermined humidity atmosphere until it is subjected to the fourth step.
  • SS step of storing the film capacitor element in a predetermined humidity atmosphere until it is subjected to the fourth step.
  • Examples of the dielectric film constituting the metallized film include PET (polyethylene terephthalate), PPS (polyphenylene sulfide), PPE (polyphenylene ether) PBT (polybutylene terephthalate), POM (polyoxymethylene), PPO (polyphenyl oxide), and the like.
  • Resin molded products such as PEI (polyetherimide) and vacuum resin molded products such as polyvinyl chloride and polycarbonate can be used.
  • the dielectric film contains a polyetherimide resin.
  • the thickness of the dielectric film can be 3 ⁇ m to 20 ⁇ m, preferably 3.5 ⁇ m to 15 ⁇ m, and more preferably 3.5 ⁇ m to 12 ⁇ m. Within such a range, it becomes easy to achieve both weather resistance and strength and small size and light weight. Further, from the viewpoint of increasing the capacity and reducing the size, the thickness of the dielectric film is preferably 3 ⁇ m to 12 ⁇ m, more preferably 3.5 ⁇ m to 10 ⁇ m.
  • Examples of the material of the metal vapor deposition film include aluminum, copper, zinc, and alloys thereof. Silicon, titanium, or the like may be added to the metal vapor deposition film.
  • the metal vapor deposition film can be formed by vacuum vapor deposition or the like.
  • the thickness of the vapor-deposited film can be set in the same manner as the thickness for a normal metallized film capacitor. For example, the thickness at which a resistance value of 1 ⁇ / ⁇ to 50 ⁇ / ⁇ can be obtained can be set.
  • a known metal foil may be used instead of the metal vapor deposition film.
  • the laminated or wound metallized film is formed into a predetermined shape.
  • the side surface of the wound body can be pressed to form a flat shape.
  • the molding includes the case where the laminated body or the wound body is individually separated as it is.
  • FIG. 3B shows a molded body 20 in which the wound body of the metallized film 1 is pressure-molded into a flat shape.
  • the metallikon electrode can be provided by spraying a metal or alloy such as zinc, copper, aluminum, tin, or solder on both end faces of the laminated or wound metallized film. At this time, the side surface of the laminated body or the wound body may be protected by taping. Further, the surface of the metallikon electrode may be plated.
  • FIG. 3C shows a film capacitor element 30 in which metallikon electrodes 2 are provided on both side surfaces of a wound body of a metallized film 1 which is press-molded into a flat shape.
  • the water content contained in the film capacitor element can be adjusted by, for example, vacuum drying or heat drying.
  • the degree of vacuum in vacuum drying can be 100 Pa or less, and from the viewpoint of removing moisture absorbed moisture, 20 Pa or less is preferable, and 10 Pa or less is more preferable.
  • vacuum drying is preferably performed by heating, for example, it can be performed at 50 ° C. or higher, and from the viewpoint of removing hygroscopic moisture and shortening the process, 50 ° C. or higher is preferable, and 80 ° C. or higher is more preferable. preferable. Further, from the viewpoint of preventing deterioration of the performance of the material, 170 ° C. or lower is preferable, and 100 ° C. or lower is more preferable.
  • the vacuum drying time is not particularly limited, but can be set so that the amount of water contained in the film capacitor element is equal to or less than a predetermined value. From the viewpoint of achieving both relaxation of vacuum and temperature conditions and productivity, 12 hours or more is preferable, and 18 hours or more is more preferable.
  • vacuum drying is preferably performed under the conditions of a temperature of 90 to 110 ° C. and a vacuum degree of 10 Pa or less for 15 to 25 hours, preferably 95 to 105 ° C. and a vacuum degree of 6 It is more preferable to carry out for 18 to 24 hours under the condition of .6 Pa or less.
  • the water content contained in the film capacitor element is 0.25% by mass or less, preferably 0.10% by mass or less in the water content adjusting step. It is more preferable to adjust it, and it is further preferable to adjust it to 0.03% by mass or less.
  • the film capacitor element can be stored in a low humidity storage so that the water content adjusted in the water content adjusting step does not increase.
  • the humidity is preferably 10% or less, more preferably 3% or less, and further preferably 1% or less.
  • the temperature can be 0 to 50 ° C., and is preferably 15 to 25 ° C. from the viewpoint of preventing re-absorption of moisture.
  • Low humidity storage may be appropriately provided between each process as needed, but it is preferable to provide it immediately after the water content adjusting process.
  • an oil impregnation step of impregnating the condenser element with insulating oil may be provided immediately after the water content adjusting step. That is, the method of the present embodiment may further include an oil impregnation step of impregnating the film capacitor element that has undergone the water content adjusting step with insulating oil.
  • the capacitor element impregnated with the insulating oil may be stored, the capacitor element before being impregnated with the insulating oil may be stored, or both may be stored.
  • insulating oil a known insulating oil used for a film capacitor element can be used, and examples thereof include silicone oil and fluorine-based oil.
  • silicone oil for example, methyl hydrogen silicone oil which is a cross-linking reactive monomer, a two-component addition reaction type liquid silicone rubber, or the like can be used.
  • Fluorine-based oils include, for example, fluororesins such as polytetrafluoroethylene, polychlorotrifluoroethylene, vinyl fluoride, ethylene trifluoride, vinylidene fluoride, copolymers such as propylene hexafluoride, and the like. Can be used.
  • Examples of the method of impregnating the capacitor element with insulating oil include a method of impregnating the capacitor element with insulating oil from the metallikon electrode surface by a vacuum impregnation method or the like so as to remove air in the element.
  • the external lead-out terminal may be any as long as it can electrically connect the outside and the metallikon electrode, for example, foil, wire, thin plate of metal or alloy such as copper, aluminum, iron, nickel, stainless steel, phosphor bronze, etc. Can be used, and copper or a copper alloy, which is a good electrical conductor, is preferable.
  • the surface of the external lead-out terminal may be plated with tin, solder, or the like.
  • FIG. 4A shows a film capacitor element 40 with an external extraction terminal in which the external extraction terminal 3 is attached to the metallikon electrode 2 of the film capacitor element 30.
  • Examples of the method of attaching the external lead-out terminal include solder connection, welding, and pressure welding.
  • the case may be a resin container for accommodating the capacitor element and having an opening.
  • FIG. 4B shows a mode in which the film capacitor element 40 with an external extraction terminal is housed in the case 4 having an opening.
  • FIG. 4C shows a case-type film capacitor 100 including a case 4, a film capacitor element 40 with an external extraction terminal housed in the case 4, and a sealing resin 5 for sealing the film capacitor element.
  • a resin such as epoxy resin or urethane resin mixed with a filler or the like can be used.
  • a filler hydroxides such as silicon, titanium, aluminum, calcium, zirconium, and magnesium, oxides, carbides, nitrides, and composites thereof can be used.
  • a flame retardant and an antioxidant may be added to the resin composition, if necessary.
  • the case-type film capacitor manufacturing system of the present embodiment includes means for carrying out each step in the case-type film capacitor manufacturing method of the present embodiment described above.
  • the case-type film capacitor of the present embodiment includes a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, and the amount of water contained in the film capacitor element is 0.25. It is less than or equal to mass%.
  • the case-type film capacitor of the present embodiment can be obtained by the above-described method for manufacturing the case-type film capacitor of the present embodiment.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

This method for manufacturing an encased film capacitor is for manufacturing an encased film capacitor provided with: a case; a film capacitor element that is accommodated in the case; and a sealing resin for sealing the film capacitor element. The method comprises: a first step for layering or winding a metalized film that has a dielectric film and a metal deposited film that is provided on one surface of the film; a second step for shaping the layered or wound metalized film; a third step for obtaining a film capacitor element by providing a metal contact electrode to the shaped metalized film; a fourth step for attaching an external lead terminal to the metal contact electrode of the film capacitor element; a fifth step for accommodating in the case the film capacitor element to which the external lead terminal has been attached; and a sixth step for sealing the film capacitor element accommodated in the case with a resin. Further included between the third step and the sixth step is a moisture adjustment step for adjusting the amount of moisture contained in the film capacitor element.

Description

ケース型フィルムコンデンサの製造方法及び製造システムCase-type film capacitor manufacturing method and manufacturing system
　本発明は、ケース型フィルムコンデンサの製造方法及び製造システムに関する。 The present invention relates to a manufacturing method and a manufacturing system of a case-type film capacitor.
　近年、環境への配慮から、省エネルギー化、高効率化に適したインバータ回路が採用されていて、使用電圧が高く誘電損失・寿命特性に優れることから、コンデンサのなかでも金属化フィルムコンデンサを採用する傾向がある。 In recent years, in consideration of the environment, inverter circuits suitable for energy saving and high efficiency have been adopted, and since the working voltage is high and the dielectric loss and life characteristics are excellent, metallized film capacitors are adopted among the capacitors. Tend.
　従来、金属化フィルムコンデンサは以下の手順で作製されていた。まず、誘電体フィルムの一方面上に金属蒸着膜を設けてなる金属化フィルムを二枚重ねて巻回、または多層積層し、電極を引き出す側の端面に亜鉛等の金属を溶射しメタリコンを施した後、必要に応じて熱処理と呼ばれる温度処理を実施し、コンデンサ素子を得る。次に、コンデンサ素子の両端のメタリコン電極に、外部引き出し端子を接続し、樹脂組成物で本体を被覆していた。 Conventionally, metallized film capacitors have been manufactured by the following procedure. First, two metallized films having a metal vapor deposition film provided on one surface of a dielectric film are laminated and wound or laminated in multiple layers, and a metal such as zinc is sprayed on the end surface on the side where the electrode is pulled out to apply a metallikon. If necessary, a temperature treatment called heat treatment is performed to obtain a capacitor element. Next, external lead-out terminals were connected to the metallikon electrodes at both ends of the capacitor element, and the main body was covered with a resin composition.
　また、車載電装用等のコンデンサは高い耐熱性及び耐候性を有していることが求められる。このような用途に適した金属化フィルムコンデンサとして、コンデンサ素子を樹脂ケースに収納し、ケース内のコンデンサ素子を樹脂で封止したケース型フィルムコンデンサが作製されている（例えば、下記特許文献１を参照）。 In addition, capacitors for in-vehicle electrical equipment are required to have high heat resistance and weather resistance. As a metallized film capacitor suitable for such applications, a case-type film capacitor in which a capacitor element is housed in a resin case and the capacitor element in the case is sealed with a resin has been manufactured (for example, Patent Document 1 below). reference).
特開２０１３－１９７４３０号公報Japanese Unexamined Patent Publication No. 2013-197430
　ところで、車載用途では、部品の高密度化などにより部品の使用温度が上昇している。そこで、本発明者らは、高温領域において容量変化が少なく、誘電正接が低いフィルムコンデンサについて検討を行った。そして、本発明者らによる検討のなかで、ケース型フィルムコンデンサを実装するリフロー処理時にコンデンサの膨れが発生する場合があることが判明した。 By the way, in in-vehicle applications, the operating temperature of parts is rising due to the high density of parts. Therefore, the present inventors have studied a film capacitor having a small capacitance change and a low dielectric loss tangent in a high temperature region. Then, in the study by the present inventors, it was found that the capacitor may swell during the reflow process for mounting the case-type film capacitor.
　本発明は、充分な耐リフロー性を有するケース型フィルムコンデンサ、それを作製することができるケース型フィルムコンデンサの製造方法及び製造システムを提供することを目的とする。 An object of the present invention is to provide a case-type film capacitor having sufficient reflow resistance, a method for manufacturing the case-type film capacitor capable of manufacturing the case-type film capacitor, and a manufacturing system.
　上記課題を解決するために本発明者らは更に検討を行ったところ、コンデンサ素子内の吸湿した水分が、リフロー実装による温度上昇により気化し、急激に膨張したことが原因であることが判明した。誘電体フィルムの材料を乾燥することはこれまでにも行われているが、コンデンサ素子の吸湿やその含水量については特定されていなかった。そして、本発明者らは、特定の工程間にコンデンサ素子の含水量を調整することにより、飽和吸湿量が大きい材料からなる誘電体フィルムを用いた場合であってもリフロー時に膨れが発生しにくいケース型フィルムコンデンサを効率よく作製できることを見出し、本発明を完成するに至った。 As a result of further studies by the present inventors in order to solve the above problems, it was found that the cause was that the moisture absorbed in the capacitor element was vaporized due to the temperature rise due to the reflow mounting and rapidly expanded. .. Although drying of the material of the dielectric film has been performed so far, the moisture absorption of the capacitor element and its water content have not been specified. By adjusting the water content of the capacitor element during a specific process, the present inventors are less likely to cause swelling during reflow even when a dielectric film made of a material having a large saturated moisture absorption amount is used. We have found that a case-type film capacitor can be efficiently produced, and have completed the present invention.
　すなわち、本発明は、ケースと、ケースに収容されたフィルムコンデンサ素子と、フィルムコンデンサ素子を封止する封止樹脂とを備えるケース型フィルムコンデンサの製造方法であって、誘電体フィルム及び該フィルムの一方面上に設けられた金属蒸着膜を有する金属化フィルムを積層又は巻回する第１工程と、積層又は巻回された金属化フィルムを成形する第２工程と、成形された金属化フィルムにメタリコン電極を設けることによりフィルムコンデンサ素子を得る第３工程と、フィルムコンデンサ素子のメタリコン電極に外部引き出し端子を取り付ける第４工程と、外部引き出し端子が取り付けられたフィルムコンデンサ素子をケースに収容する第５工程と、ケースに収容されたフィルムコンデンサ素子を樹脂で封止する第６工程とを備え、第３工程と第６工程との間に、フィルムコンデンサ素子に含まれる水分量を調整する水分量調整工程を更に有するケース型フィルムコンデンサの製造方法を提供する。 That is, the present invention is a method for manufacturing a case-type film capacitor including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, the dielectric film and the film. On the other hand, the first step of laminating or winding a metallized film having a metallized film provided on the surface, the second step of molding the laminated or wound metallized film, and the molded metallized film. The third step of obtaining a film capacitor element by providing a metallikon electrode, the fourth step of attaching an external lead-out terminal to the metallikon electrode of the film capacitor element, and the fifth step of accommodating the film capacitor element to which the external lead-out terminal is attached in a case. It includes a step and a sixth step of sealing the film condenser element housed in the case with a resin, and adjusts the amount of water contained in the film condenser element between the third step and the sixth step. Provided is a method for manufacturing a case-type film capacitor having a further process.
　本発明のケース型フィルムコンデンサの製造方法によれば、上記の第３工程と第６工程との間に水分量調整工程を有することにより、コンデンサ素子が吸湿した水分を充分に除去することができ、充分な耐リフロー性を有するケース型フィルムコンデンサを得ることができる。 According to the method for manufacturing a case-type film capacitor of the present invention, by having a water content adjusting step between the above-mentioned third step and the sixth step, the moisture absorbed by the capacitor element can be sufficiently removed. , A case-type film capacitor having sufficient reflow resistance can be obtained.
　また、本発明の方法によれば、吸湿に起因するコンデンサの静電容量の増加を抑制することができることから、ケース型フィルムコンデンサの製造において静電容量のばらつきを小さくすることができる。更に、本発明の方法によれば、高温負荷時において静電容量が低下しにくいケース型フィルムコンデンサを製造することができる。このような効果は、水分と蒸着金属との反応によって金属化フィルムの蒸着金属が消失する現象を充分に抑制できることにより得られたものと本発明者らは考えている。 Further, according to the method of the present invention, since it is possible to suppress an increase in the capacitance of the capacitor due to moisture absorption, it is possible to reduce the variation in capacitance in the manufacture of the case type film capacitor. Further, according to the method of the present invention, it is possible to manufacture a case-type film capacitor whose capacitance does not easily decrease under a high temperature load. The present inventors consider that such an effect is obtained by sufficiently suppressing the phenomenon that the vapor-deposited metal of the metallized film disappears due to the reaction between the moisture and the vapor-deposited metal.
　高温領域において容量変化が少なく、誘電正接が低いフィルムコンデンサを得る観点から、上記誘電体フィルムがポリエーテルイミド樹脂を含むことが好ましい。 From the viewpoint of obtaining a film capacitor having a small capacitance change in a high temperature region and a low dielectric loss tangent, it is preferable that the dielectric film contains a polyetherimide resin.
　上記水分量調整工程は、真空度１００Ｐａ以下、温度５０℃以上の真空乾燥により行うことができる。この場合、ケース型フィルムコンデンサの生産性への影響をより小さくすることができる。 The water content adjusting step can be performed by vacuum drying with a vacuum degree of 100 Pa or less and a temperature of 50 ° C. or more. In this case, the influence on the productivity of the case-type film capacitor can be further reduced.
　ケース型フィルムコンデンサの耐リフロー性を更に向上させる観点から、上記真空乾燥工程において、フィルムコンデンサ素子に含まれる水分量を０．２５質量％以下に調整することが好ましい。 From the viewpoint of further improving the reflow resistance of the case type film capacitor, it is preferable to adjust the amount of water contained in the film capacitor element to 0.25% by mass or less in the vacuum drying step.
　生産性の点で、上記水分量調整工程が、上記第３工程と上記第４工程との間に設けられていることが好ましい。 From the viewpoint of productivity, it is preferable that the water content adjusting step is provided between the third step and the fourth step.
　本発明の方法は、フィルムコンデンサ素子の水分量を抑制する観点から、上記第４工程の前に、上記水分量調整工程を経たフィルムコンデンサ素子に絶縁オイルを含浸するオイル含浸工程を更に備えていてもよい。 From the viewpoint of suppressing the water content of the film capacitor element, the method of the present invention further includes an oil impregnation step of impregnating the film capacitor element that has undergone the water content adjusting step with insulating oil before the fourth step. May be good.
　また、上記真空乾燥工程を経たフィルムコンデンサ素子を、第４工程に供されるまで湿度１０％以下の雰囲気で保管してもよい。 Further, the film capacitor element that has undergone the vacuum drying step may be stored in an atmosphere with a humidity of 10% or less until it is subjected to the fourth step.
　フィルムコンデンサ素子の水分量を抑制する観点から、上記水分量調整工程が、上記第５工程と上記第６工程との間に設けられていることが好ましい。 From the viewpoint of suppressing the water content of the film capacitor element, it is preferable that the water content adjusting step is provided between the fifth step and the sixth step.
　本発明はまた、ケースと、ケースに収容されたフィルムコンデンサ素子と、フィルムコンデンサ素子を封止する封止樹脂とを備えるケース型フィルムコンデンサを製造するシステムであって、誘電体フィルム及び該フィルムの一方面上に設けられた金属蒸着膜を有する金属化フィルムを積層又は巻回する手段と、積層又は巻回された金属化フィルムを成形する手段と、成形された金属化フィルムにメタリコン電極を設けてフィルムコンデンサ素子を得る手段と、フィルムコンデンサ素子のメタリコン電極に外部引き出し端子を取り付ける手段と、外部引き出し端子が取り付けられたフィルムコンデンサ素子をケースに収容する手段と、ケースに収容されたフィルムコンデンサ素子を樹脂で封止する手段と、フィルムコンデンサ素子に含まれる水分量を調整する水分量調整手段とを備えるケース型フィルムコンデンサの製造システムを提供する。 The present invention is also a system for manufacturing a case-type film capacitor including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, the dielectric film and the film. On the other hand, a means for laminating or winding a metallized film having a metal vapor deposition film provided on the surface, a means for molding the laminated or wound metallized film, and a metallikon electrode are provided on the molded metallized film. A means for obtaining a film capacitor element, a means for attaching an external lead-out terminal to the metallikon electrode of the film capacitor element, a means for accommodating the film capacitor element to which the external lead-out terminal is attached in a case, and a film capacitor element housed in the case. Provided is a case-type film capacitor manufacturing system including a means for sealing the film with a resin and a means for adjusting the amount of water contained in the film capacitor element.
　本発明のケース型フィルムコンデンサの製造システムによれば、充分な耐リフロー性を有するケース型フィルムコンデンサを得ることができる。また、本発明の製造システムによれば、ケース型フィルムコンデンサの製造において静電容量のばらつきを小さくすることができる。更に、本発明の製造システムによれば、高温負荷時において静電容量が低下しにくいケース型フィルムコンデンサを製造することができる。 According to the case-type film capacitor manufacturing system of the present invention, a case-type film capacitor having sufficient reflow resistance can be obtained. Further, according to the manufacturing system of the present invention, it is possible to reduce the variation in capacitance in the manufacturing of the case type film capacitor. Further, according to the manufacturing system of the present invention, it is possible to manufacture a case-type film capacitor whose capacitance does not easily decrease under a high temperature load.
　本発明のケース型フィルムコンデンサの製造システムは、水分量が調整されたフィルムコンデンサ素子を所定の湿度で保管する手段を更に備えていてもよい。 The case-type film capacitor manufacturing system of the present invention may further include means for storing the film capacitor element having an adjusted water content at a predetermined humidity.
　本発明のケース型フィルムコンデンサの製造システムは、水分量が調整された前記フィルムコンデンサ素子に絶縁オイルを含浸するオイル含浸手段を更に備えていてもよい。 The case-type film capacitor manufacturing system of the present invention may further include an oil impregnation means for impregnating the film capacitor element having an adjusted water content with insulating oil.
　本発明はまた、ケースと、ケースに収容されたフィルムコンデンサ素子と、フィルムコンデンサ素子を封止する封止樹脂とを備え、フィルムコンデンサ素子に含まれる水分量が０．２５質量％以下であるケース型フィルムコンデンサを提供する。 The present invention also includes a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, and the amount of water contained in the film capacitor element is 0.25% by mass or less. Provided is a type film capacitor.
　本発明のケース型フィルムコンデンサによれば、充分な耐リフロー性を有することができる。 According to the case-type film capacitor of the present invention, it is possible to have sufficient reflow resistance.
　本発明によれば、充分な耐リフロー性を有するケース型フィルムコンデンサ、それを作製することができるケース型フィルムコンデンサの製造方法及び製造システムを提供することができる。 According to the present invention, it is possible to provide a case-type film capacitor having sufficient reflow resistance, a method for manufacturing the case-type film capacitor capable of manufacturing the case-type film capacitor, and a manufacturing system.
　また、本発明のケース型フィルムコンデンサの製造方法及び製造システムは、ケース型フィルムコンデンサの製造において静電容量のばらつきを小さくすること、及び、高温負荷時において静電容量が低下しにくいケース型フィルムコンデンサを製造することにも有用である。 Further, the method and manufacturing system for the case-type film capacitor of the present invention can reduce the variation in capacitance in the manufacture of the case-type film capacitor, and the case-type film whose capacitance does not easily decrease under a high temperature load. It is also useful for manufacturing capacitors.
本発明に係るケース型フィルムコンデンサの製造方法の一実施形態を説明するためのフロー図である。It is a flow diagram for demonstrating one Embodiment of the manufacturing method of the case type film capacitor which concerns on this invention. 本発明に係るケース型フィルムコンデンサの製造方法の別の実施形態を説明するためのフロー図である。It is a flow diagram for demonstrating another embodiment of the manufacturing method of the case type film capacitor which concerns on this invention. （ａ）、（ｂ）及び（ｃ）はそれぞれ、第１の工程、第２の工程及び第３の工程を説明するための図である。(A), (b) and (c) are diagrams for explaining the first step, the second step and the third step, respectively. （ａ）、（ｂ）及び（ｃ）はそれぞれ、第４の工程、第５の工程及び第６の工程を説明するための図である。(A), (b) and (c) are diagrams for explaining the fourth step, the fifth step and the sixth step, respectively.
　本明細書において、「～」を用いて示された数値範囲は、「～」の前後に記載される数値をそれぞれ最小値及び最大値として含む範囲を示す。本明細書に段階的に記載されている数値範囲において、ある段階の数値範囲の上限値又は下限値は、他の段階の数値範囲の上限値又は下限値と任意に組み合わせることができる。本明細書に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。「Ａ又はＢ」とは、Ａ及びＢのどちらか一方を含んでいればよく、両方とも含んでいてもよい。本明細書に例示する材料は、特に断らない限り、１種を単独で又は２種以上を組み合わせて用いることができる。 In the present specification, the numerical range indicated by using "-" indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively. In the numerical range described stepwise in the present specification, the upper limit value or the lower limit value of the numerical range of one step can be arbitrarily combined with the upper limit value or the lower limit value of the numerical range of another step. In the numerical range described in the present specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples. "A or B" may include either A or B, or both. Unless otherwise specified, the materials exemplified in the present specification may be used alone or in combination of two or more.
　以下、図面を参照しながら、本発明を実施するための形態について詳細に説明する。本発明は、以下の実施形態に限定されるものではない。 Hereinafter, a mode for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.
［ケース型フィルムコンデンサの製造方法］
　図１は、本発明に係るケース型フィルムコンデンサの製造方法の一実施形態を説明するためのフロー図である。本実施形態のケース型フィルムコンデンサの製造方法は、ケースと、ケースに収容されたフィルムコンデンサ素子と、フィルムコンデンサ素子を封止する封止樹脂とを備えるケース型フィルムコンデンサの製造方法である。 [Manufacturing method of case type film capacitor]
FIG. 1 is a flow chart for explaining an embodiment of a method for manufacturing a case-type film capacitor according to the present invention. The method for manufacturing a case-type film capacitor of the present embodiment is a method for manufacturing a case-type film capacitor including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element.
　図１に示されるように、本実施形態の方法は、誘電体フィルム及び該フィルムの一方面上に設けられた金属蒸着膜を有する金属化フィルムを積層又は巻回する第１工程（Ｓ１）と、積層又は巻回された金属化フィルムを成形する第２工程（Ｓ２）と、成形された金属化フィルムにメタリコン電極を設けることによりフィルムコンデンサ素子を得る第３工程（Ｓ３）と、フィルムコンデンサ素子のメタリコン電極に外部引き出し端子を取り付ける第４工程（Ｓ４）と、外部引き出し端子が取り付けられたフィルムコンデンサ素子をケースに収容する第５工程（Ｓ５）と、ケースに収容されたフィルムコンデンサ素子を樹脂で封止する第６工程（Ｓ６）とを備え、第３工程と第６工程との間に、フィルムコンデンサ素子に含まれる水分量を調整する水分量調整工程（ＳＤ）を更に有する。なお、本実施形態においては、水分量調整工程（ＳＤ）が第３工程と第４工程との間に設けられているが、第４工程と第５工程との間、又は、第５工程と第６工程との間に水分量調整工程（ＳＤ）を設けていてもよく、水分量調整工程（ＳＤ）を２以上設けることもできる。 As shown in FIG. 1, the method of the present embodiment includes a first step (S1) of laminating or winding a dielectric film and a metallized film having a metal vapor deposition film provided on one surface of the film. The second step (S2) of forming a laminated or wound metallized film, the third step (S3) of obtaining a film capacitor element by providing a metallikon electrode on the molded metallized film, and a film capacitor element. The fourth step (S4) of attaching the external lead-out terminal to the metallikon electrode of the above, the fifth step (S5) of accommodating the film capacitor element to which the external lead-out terminal is attached in the case, and the resin of the film capacitor element housed in the case. The film has a sixth step (S6) of sealing with, and further has a water content adjusting step (SD) for adjusting the amount of water contained in the film condenser element between the third step and the sixth step. In this embodiment, the water content adjusting step (SD) is provided between the third step and the fourth step, but it is between the fourth step and the fifth step, or with the fifth step. A water content adjusting step (SD) may be provided between the sixth step and two or more water content adjusting steps (SD).
　図２は、本発明に係るケース型フィルムコンデンサの製造方法の別の実施形態を説明するためのフロー図であり、本実施形態に係る方法は、水分量調整工程（ＳＤ）に続いて、水分量調整工程を経たフィルムコンデンサ素子を、第４工程に供されるまで所定の湿度の雰囲気で保管する工程（ＳＳ）を更に有すること以外は、図１に示される方法と同様である。以下、この実施形態に基づき本発明に係るケース型フィルムコンデンサの製造方法について説明する。 FIG. 2 is a flow chart for explaining another embodiment of the method for manufacturing a case-type film capacitor according to the present invention. In the method according to the present embodiment, the moisture content adjustment step (SD) is followed by moisture content. The method is the same as that shown in FIG. 1 except that the film capacitor element that has undergone the quantity adjusting step is further provided with a step (SS) of storing the film capacitor element in a predetermined humidity atmosphere until it is subjected to the fourth step. Hereinafter, a method for manufacturing a case-type film capacitor according to the present invention will be described based on this embodiment.
（Ｓ１）
　金属化フィルムを構成する誘電体フィルムとしては、ＰＥＴ（ポリエチレンテレフタレート）、ＰＰＳ（ポリフェニレンサルファイド）、ＰＰＥ（ポリフェニレンエーテル）ＰＢＴ（ポリブチレンテレフタレート）、ＰＯＭ（ポリオキシメチレン）、ＰＰＯ（ポリフェニルオキサイド）、ＰＥＩ（ポリエーテルイミド）等の樹脂成形品、ポリ塩化ビニル、ポリカーボネート等の真空樹脂成形品を用いることができる。本実施形態の方法によれば、飽和吸湿量が大きい材料（例えば、ＰＥＩ、ＰＥＴ、ＰＰＳなど）を含む誘電体フィルムを用いた場合であってもリフロー時に膨れが発生しにくいケース型フィルムコンデンサを効率よく作製できる。高温領域において容量変化が少なく、誘電正接が低いフィルムコンデンサを得る観点から、誘電体フィルムがポリエーテルイミド樹脂を含むことが好ましい。 (S1)
Examples of the dielectric film constituting the metallized film include PET (polyethylene terephthalate), PPS (polyphenylene sulfide), PPE (polyphenylene ether) PBT (polybutylene terephthalate), POM (polyoxymethylene), PPO (polyphenyl oxide), and the like. Resin molded products such as PEI (polyetherimide) and vacuum resin molded products such as polyvinyl chloride and polycarbonate can be used. According to the method of the present embodiment, even when a dielectric film containing a material having a large saturated moisture absorption (for example, PEI, PET, PPS, etc.) is used, a case-type film capacitor that does not easily swell during reflow is used. Can be manufactured efficiently. From the viewpoint of obtaining a film capacitor having a small capacitance change in a high temperature region and a low dielectric loss tangent, it is preferable that the dielectric film contains a polyetherimide resin.
　誘電体フィルムの厚さは、３μｍ～２０μｍとすることができ、３．５μｍ～１５μｍが好ましく、３．５μｍ～１２μｍがより好ましい。このような範囲であると、耐候性及び強度と小型軽量性との両立が容易となる。また、大容量化、小型化の観点から、誘電体フィルムの厚さは、３μｍ～１２μｍが好ましく、３．５μｍ～１０μｍがより好ましい。 The thickness of the dielectric film can be 3 μm to 20 μm, preferably 3.5 μm to 15 μm, and more preferably 3.5 μm to 12 μm. Within such a range, it becomes easy to achieve both weather resistance and strength and small size and light weight. Further, from the viewpoint of increasing the capacity and reducing the size, the thickness of the dielectric film is preferably 3 μm to 12 μm, more preferably 3.5 μm to 10 μm.
　金属蒸着膜の材質としては、例えば、アルミニウム、銅、亜鉛、及びそれらの合金などが挙げられる。金属蒸着膜には、ケイ素、チタンなどが添加されていてもよい。 Examples of the material of the metal vapor deposition film include aluminum, copper, zinc, and alloys thereof. Silicon, titanium, or the like may be added to the metal vapor deposition film.
　金属蒸着膜は、真空蒸着などにより製膜できる。蒸着膜の厚さは、通常の金属化フィルムコンデンサ用の厚さと同様に設定することができる。例えば、１Ω／□～５０Ω／□の抵抗値が得られる厚さを設定することができる。金属蒸着膜に代えて公知の金属箔を用いてもよい。 The metal vapor deposition film can be formed by vacuum vapor deposition or the like. The thickness of the vapor-deposited film can be set in the same manner as the thickness for a normal metallized film capacitor. For example, the thickness at which a resistance value of 1Ω / □ to 50Ω / □ can be obtained can be set. A known metal foil may be used instead of the metal vapor deposition film.
　金属化フィルムは、例えば２枚重ねて巻回する又は複数枚を多層積層することができる。図３の（ａ）は、２枚重ねた金属化フィルム１を巻回して、巻回体１０を得ている態様を示す。 For example, two metallized films can be stacked and wound, or a plurality of metallized films can be laminated in multiple layers. FIG. 3A shows a mode in which two metallized films 1 are wound to obtain a wound body 10.
（Ｓ２）
　積層又は巻回された金属化フィルムは、所定の形状に成形される。例えば、巻回体の側面を加圧して偏平状に成形することができる。なお、成形には、積層体又は巻回体をそのまま個片化する場合も包含される。図３の（ｂ）は、金属化フィルム１の巻回体を扁平状に加圧成形した成形体２０を示す。 (S2)
The laminated or wound metallized film is formed into a predetermined shape. For example, the side surface of the wound body can be pressed to form a flat shape. The molding includes the case where the laminated body or the wound body is individually separated as it is. FIG. 3B shows a molded body 20 in which the wound body of the metallized film 1 is pressure-molded into a flat shape.
（Ｓ３）
　メタリコン電極は、積層又は巻回された金属化フィルムの両端面に、亜鉛、銅、アルミニウム、錫、はんだ等の金属又は合金を溶射することにより設けることができる。このとき、積層体又は巻回体の側面は、テーピングすることによって保護されていてもよい。また、メタリコン電極は、表面にめっきを施してもよい。 (S3)
The metallikon electrode can be provided by spraying a metal or alloy such as zinc, copper, aluminum, tin, or solder on both end faces of the laminated or wound metallized film. At this time, the side surface of the laminated body or the wound body may be protected by taping. Further, the surface of the metallikon electrode may be plated.
　こうして得られるフィルムコンデンサ素子は、微小欠陥部の自己回復のための電圧処理、絶縁オイル含浸などを施すことができる。図３の（ｃ）は、扁平状に加圧成形された金属化フィルム１の巻回体の両側面にメタリコン電極２が設けられたフィルムコンデンサ素子３０を示す。 The film capacitor element thus obtained can be subjected to voltage treatment for self-healing of minute defects, insulation oil impregnation, and the like. FIG. 3C shows a film capacitor element 30 in which metallikon electrodes 2 are provided on both side surfaces of a wound body of a metallized film 1 which is press-molded into a flat shape.
（ＳＤ）
　水分量調整工程では、例えば、真空乾燥又は熱乾燥によってフィルムコンデンサ素子に含まれる水分量を調整することができる。真空乾燥における真空度は、１００Ｐａ以下とすることができ、吸湿水分の除去の観点から、２０Ｐａ以下が好ましく、１０Ｐａ以下がより好ましい。 (SD)
In the water content adjusting step, the water content contained in the film capacitor element can be adjusted by, for example, vacuum drying or heat drying. The degree of vacuum in vacuum drying can be 100 Pa or less, and from the viewpoint of removing moisture absorbed moisture, 20 Pa or less is preferable, and 10 Pa or less is more preferable.
　また、真空乾燥は、加熱して行うことが好ましく、例えば、５０℃以上で行うことができ、吸湿水分の除去や工程の短時間化の観点から、５０℃以上が好ましく、８０℃以上がより好ましい。また、材料の性能劣化を防止する観点から、１７０℃以下が好ましく、１００℃以下がより好ましい。 Further, vacuum drying is preferably performed by heating, for example, it can be performed at 50 ° C. or higher, and from the viewpoint of removing hygroscopic moisture and shortening the process, 50 ° C. or higher is preferable, and 80 ° C. or higher is more preferable. preferable. Further, from the viewpoint of preventing deterioration of the performance of the material, 170 ° C. or lower is preferable, and 100 ° C. or lower is more preferable.
　真空乾燥の時間は、特に限定されないが、フィルムコンデンサ素子に含まれる水分量が所定値以下となるように設定することができる。真空度及び温度条件の緩和と、生産性とを両立する観点から、１２時間以上が好ましく、１８時間以上がより好ましい。 The vacuum drying time is not particularly limited, but can be set so that the amount of water contained in the film capacitor element is equal to or less than a predetermined value. From the viewpoint of achieving both relaxation of vacuum and temperature conditions and productivity, 12 hours or more is preferable, and 18 hours or more is more preferable.
　本実施形態において、誘電体フィルムがポリエーテルイミドを含む場合、真空乾燥を、温度９０～１１０℃、真空度１０Ｐａ以下の条件で１５～２５時間行うことが好ましく、９５～１０５℃、真空度６．６Ｐａ以下の条件で１８～２４時間行うことがより好ましい。 In the present embodiment, when the dielectric film contains polyetherimide, vacuum drying is preferably performed under the conditions of a temperature of 90 to 110 ° C. and a vacuum degree of 10 Pa or less for 15 to 25 hours, preferably 95 to 105 ° C. and a vacuum degree of 6 It is more preferable to carry out for 18 to 24 hours under the condition of .6 Pa or less.
　ケース型フィルムコンデンサの耐リフロー性を更に向上させる観点から、水分量調整工程において、フィルムコンデンサ素子に含まれる水分量を０．２５質量％以下に調整することが好ましく、０．１０質量％以下に調整することがより好ましく、０．０３質量％以下に調整することが更に好ましい。 From the viewpoint of further improving the reflow resistance of the case type film capacitor, it is preferable to adjust the water content contained in the film capacitor element to 0.25% by mass or less, preferably 0.10% by mass or less in the water content adjusting step. It is more preferable to adjust it, and it is further preferable to adjust it to 0.03% by mass or less.
（ＳＳ）
　この工程では、水分量調整工程で調整した水分量が増加しないようにフィルムコンデンサ素子を低湿度保管庫に保管することができる。保管条件としては、湿度が１０％以下であることが好ましく、３％以下であることがより好ましく、１％以下であることが更に好ましい。温度は、０～５０℃とすることができ、再吸湿を防ぐ観点から、１５～２５℃が好ましい。 (SS)
In this step, the film capacitor element can be stored in a low humidity storage so that the water content adjusted in the water content adjusting step does not increase. As the storage conditions, the humidity is preferably 10% or less, more preferably 3% or less, and further preferably 1% or less. The temperature can be 0 to 50 ° C., and is preferably 15 to 25 ° C. from the viewpoint of preventing re-absorption of moisture.
　低湿度保管は、各工程間に必要に応じて適宜設けてもよいが、水分量調整工程直後に設けることが好ましい。 Low humidity storage may be appropriately provided between each process as needed, but it is preferable to provide it immediately after the water content adjusting process.
　また、本実施形態においては、コンデンサ素子に絶縁オイルを含浸するオイル含浸工程を、水分量調整工程の直後に設けてもよい。すなわち、本実施形態の方法は、上記水分量調整工程を経たフィルムコンデンサ素子に絶縁オイルを含浸するオイル含浸工程を更に備えていてもよい。この場合、上記工程ＳＳは、絶縁オイルを含浸したコンデンサ素子を保管してもよく、絶縁オイルを含浸する前のコンデンサ素子を保管してもよく、両者を保管してもよい。 Further, in the present embodiment, an oil impregnation step of impregnating the condenser element with insulating oil may be provided immediately after the water content adjusting step. That is, the method of the present embodiment may further include an oil impregnation step of impregnating the film capacitor element that has undergone the water content adjusting step with insulating oil. In this case, in the step SS, the capacitor element impregnated with the insulating oil may be stored, the capacitor element before being impregnated with the insulating oil may be stored, or both may be stored.
　絶縁オイルとしては、フィルムコンデンサ素子に用いられる公知の絶縁オイルを使用することができ、例えば、シリコーンオイル、フッ素系オイルが挙げられる。シリコーンオイルとしては、例えば、架橋反応性モノマーであるメチルハイドロジェンシリコーンオイル、２成分付加反応型の液状シリコーンゴム等を用いることができる。フッ素系オイルとしては、例えば、ポリテトラフルオロエチレン、ポリクロルトリフルオロエチレン、フッ化ビニル、三フッ化エチレン、フッ化ビニリデン、六フッ化プロピレン等の共重合体、などのフッ素系樹脂を含んでなるものを用いることができる。 As the insulating oil, a known insulating oil used for a film capacitor element can be used, and examples thereof include silicone oil and fluorine-based oil. As the silicone oil, for example, methyl hydrogen silicone oil which is a cross-linking reactive monomer, a two-component addition reaction type liquid silicone rubber, or the like can be used. Fluorine-based oils include, for example, fluororesins such as polytetrafluoroethylene, polychlorotrifluoroethylene, vinyl fluoride, ethylene trifluoride, vinylidene fluoride, copolymers such as propylene hexafluoride, and the like. Can be used.
　コンデンサ素子に絶縁オイルを含浸する方法としては、素子内の空気を取り除けるよう、真空含浸法等により上記メタリコン電極面から絶縁オイルを含浸させる方法が挙げられる。 Examples of the method of impregnating the capacitor element with insulating oil include a method of impregnating the capacitor element with insulating oil from the metallikon electrode surface by a vacuum impregnation method or the like so as to remove air in the element.
（Ｓ４）
　外部引き出し端子は、外部とメタリコン電極との間を電気的に接続できるものであればよく、例えば、銅、アルミニウム、鉄、ニッケル、ステンレス、燐青銅等の金属又は合金の箔、線、薄板等を用いることができ、電気的良導体である銅又は銅合金が好ましい。外部引き出し端子は、表面に錫やはんだ等のめっきを設けてもよい。図４の（ａ）は、フィルムコンデンサ素子３０のメタリコン電極２に外部引き出し端子３が取り付けられた外部引き出し端子付きフィルムコンデンサ素子４０を示す。 (S4)
The external lead-out terminal may be any as long as it can electrically connect the outside and the metallikon electrode, for example, foil, wire, thin plate of metal or alloy such as copper, aluminum, iron, nickel, stainless steel, phosphor bronze, etc. Can be used, and copper or a copper alloy, which is a good electrical conductor, is preferable. The surface of the external lead-out terminal may be plated with tin, solder, or the like. FIG. 4A shows a film capacitor element 40 with an external extraction terminal in which the external extraction terminal 3 is attached to the metallikon electrode 2 of the film capacitor element 30.
　外部引き出し端子の取り付け方法としては、はんだ接続、溶接、圧接などが挙げられる。 Examples of the method of attaching the external lead-out terminal include solder connection, welding, and pressure welding.
（Ｓ５）
　ケースは、コンデンサ素子を収納する樹脂製の容器で、開口部を有するものを用いることができる。図４の（ｂ）は、外部引き出し端子付きフィルムコンデンサ素子４０が、開口部を有するケース４に収容されている態様を示す。 (S5)
The case may be a resin container for accommodating the capacitor element and having an opening. FIG. 4B shows a mode in which the film capacitor element 40 with an external extraction terminal is housed in the case 4 having an opening.
（Ｓ６）
　コンデンサ素子を封止する封止樹脂は、一般的にフィルムコンデンサの封止用に使用されている樹脂組成物をケース内に充填し、硬化させることにより設けられる。図４の（ｃ）は、ケース４と、ケース４に収容された外部引き出し端子付きフィルムコンデンサ素子４０と、フィルムコンデンサ素子を封止する封止樹脂５とを備えるケース型フィルムコンデンサ１００を示す。 (S6)
The sealing resin for sealing the capacitor element is provided by filling the case with a resin composition generally used for sealing a film capacitor and curing it. FIG. 4C shows a case-type film capacitor 100 including a case 4, a film capacitor element 40 with an external extraction terminal housed in the case 4, and a sealing resin 5 for sealing the film capacitor element.
　樹脂組成物としては、エポキシ樹脂、ウレタン樹脂などの樹脂にフィラー等を混ぜたものを用いることができる。フィラーとしては、ケイ素、チタン、アルミニウム、カルシウム、ジルコニウム、マグネシウム等の水酸化物、酸化物、炭化物、窒化物、これらの複合物などが使用できる。樹脂組成物には、必要に応じて、難燃剤、酸化防止剤を添加してもよい。 As the resin composition, a resin such as epoxy resin or urethane resin mixed with a filler or the like can be used. As the filler, hydroxides such as silicon, titanium, aluminum, calcium, zirconium, and magnesium, oxides, carbides, nitrides, and composites thereof can be used. A flame retardant and an antioxidant may be added to the resin composition, if necessary.
［ケース型フィルムコンデンサの製造システム］
　本実施形態のケース型フィルムコンデンサの製造システムは、上述した本実施形態のケース型フィルムコンデンサの製造方法における各工程を実施するための手段を備える。 [Case type film capacitor manufacturing system]
The case-type film capacitor manufacturing system of the present embodiment includes means for carrying out each step in the case-type film capacitor manufacturing method of the present embodiment described above.
［ケース型フィルムコンデンサ］
　本実施形態のケース型フィルムコンデンサは、ケースと、ケースに収容されたフィルムコンデンサ素子と、フィルムコンデンサ素子を封止する封止樹脂と、を備え、フィルムコンデンサ素子に含まれる水分量が０．２５質量％以下である。 [Case type film capacitor]
The case-type film capacitor of the present embodiment includes a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element, and the amount of water contained in the film capacitor element is 0.25. It is less than or equal to mass%.
　本実施形態のケース型フィルムコンデンサは、上述した本実施形態のケース型フィルムコンデンサの製造方法によって得ることができる。 The case-type film capacitor of the present embodiment can be obtained by the above-described method for manufacturing the case-type film capacitor of the present embodiment.
　以下、実施例により本発明を更に具体的に説明する。ただし、本発明は以下の実施例に限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to Examples. However, the present invention is not limited to the following examples.
［フィルムコンデンサ素子の作製］
（作製例１）
　ポリエーテルイミドを溶融状態で押出し、厚さ７μｍのポリエーテルイミドフィルムを作製した。次に、このポリエーテルイミドフィルムの一方面上にアルミニウムを蒸着して、金属蒸着膜を形成し、金属化フィルムを得た。次に、この金属化フィルムを２枚重ね合わせて巻回し、加圧成形して扁平の柱状体（断面が１０ｍｍ×５ｍｍの楕円・扁平状、長さ１４ｍｍ）とした。次に、この柱状体の両端面に、錫－亜鉛系合金の溶射によるメタリコン電極を設けて、フィルムコンデンサ素子を作製した。 [Manufacturing of film capacitor elements]
(Production Example 1)
The polyetherimide was extruded in a molten state to prepare a polyetherimide film having a thickness of 7 μm. Next, aluminum was vapor-deposited on one surface of this polyetherimide film to form a metal-deposited film, and a metallized film was obtained. Next, two metallized films were laminated and wound, and pressure-molded to obtain a flat columnar body (an ellipse / flat shape having a cross section of 10 mm × 5 mm and a length of 14 mm). Next, a metallicon electrode by thermal spraying of a tin-zinc alloy was provided on both end faces of the columnar body to fabricate a film capacitor element.
（真空乾燥）
　上記で得られたフィルムコンデンサ素子について、以下の条件で真空乾燥を行った。
真空度：６．６Ｐａ
温度：５０℃、７０℃、９５℃
乾燥時間：３時間、６時間、１２時間、１８時間、２４時間 (Vacuum drying)
The film capacitor element obtained above was vacuum dried under the following conditions.
Vacuum degree: 6.6 Pa
Temperature: 50 ° C, 70 ° C, 95 ° C
Drying time: 3 hours, 6 hours, 12 hours, 18 hours, 24 hours
（水分量の測定）
　真空乾燥前のフィルムコンデンサ素子に含まれる水分量、及び上記真空乾燥後のフィルムコンデンサ素子に含まれる水分量について、カールフィッシャー水分計ＭＫＣ－６１０（京都電子工業株式会社製、製品型番）及び水分気化装置ＡＤＰ－６１１（京都電子工業株式会社製、製品型番）を用いて測定した。なお、測定試料は、フィルムコンデンサ素子を、断面が１０ｍｍ×５ｍｍの楕円・扁平状、長さが５ｍｍの大きさに切断したものを用意した。 (Measurement of water content)
Regarding the amount of water contained in the film condenser element before vacuum drying and the amount of water contained in the film condenser element after vacuum drying, Karl Fischer Moisture Analyzer MKC-610 (manufactured by Kyoto Denshi Kogyo Co., Ltd., product model number) and moisture vaporization The measurement was performed using the apparatus ADP-611 (manufactured by Kyoto Electronics Industry Co., Ltd., product model number). As the measurement sample, a film capacitor element cut into an elliptical / flat shape having a cross section of 10 mm × 5 mm and a length of 5 mm was prepared.
（耐リフロー性の評価）
　真空乾燥していないフィルムコンデンサ素子、及び上記真空乾燥後のフィルムコンデンサ素子について、以下の方法にしたがって耐リフロー性を評価した。なお、試験数ｎは５とした。
（１）フィルムコンデンサ素子を、大気中、１７０℃で１０分加熱する。
（２）加熱後のフィルムコンデンサ素子について膨れの発生の有無を確認する。
（３）０．２ｍｍ以上の膨れが見られた場合を「膨れ有」とし、そうでない場合を「膨れ無」とする。 (Evaluation of reflow resistance)
The reflow resistance of the film capacitor element that was not vacuum-dried and the film capacitor element that had been vacuum-dried was evaluated according to the following method. The number of tests n was set to 5.
(1) The film capacitor element is heated in the air at 170 ° C. for 10 minutes.
(2) Check for the presence or absence of swelling in the film capacitor element after heating.
(3) When a swelling of 0.2 mm or more is observed, it is defined as “with swelling”, and when it is not, it is defined as “no swelling”.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　１…金属化フィルム、２…メタリコン電極、３…外部引き出し端子、４…ケース、５…封止樹脂、１０…巻回体、２０…成形体、３０…フィルムコンデンサ素子、４０…外部引き出し端子付きフィルムコンデンサ素子、１００…ケース型フィルムコンデンサ。 1 ... Metallic film, 2 ... Metallicon electrode, 3 ... External lead-out terminal, 4 ... Case, 5 ... Encapsulating resin, 10 ... Winding body, 20 ... Molded body, 30 ... Film capacitor element, 40 ... With external lead-out terminal Film capacitor element, 100 ... Case type film capacitor.

Claims (12)

  1. 　ケースと、前記ケースに収容されたフィルムコンデンサ素子と、前記フィルムコンデンサ素子を封止する封止樹脂と、を備えるケース型フィルムコンデンサの製造方法であって、
    　誘電体フィルム及び該フィルムの一方面上に設けられた金属蒸着膜を有する金属化フィルムを積層又は巻回する第１工程と、
    　積層又は巻回された前記金属化フィルムを成形する第２工程と、
    　成形された前記金属化フィルムにメタリコン電極を設けることによりフィルムコンデンサ素子を得る第３工程と、
    　前記フィルムコンデンサ素子の前記メタリコン電極に外部引き出し端子を取り付ける第４工程と、
    　外部引き出し端子が取り付けられた前記フィルムコンデンサ素子をケースに収容する第５工程と、
    　前記ケースに収容された前記フィルムコンデンサ素子を樹脂で封止する第６工程と、を備え、
    　前記第３工程と前記第６工程との間に、前記フィルムコンデンサ素子に含まれる水分量を調整する水分量調整工程を更に有する、ケース型フィルムコンデンサの製造方法。     A method for manufacturing a case-type film capacitor including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element.
    The first step of laminating or winding a dielectric film and a metallized film having a metal vapor deposition film provided on one surface of the film, and
    The second step of forming the laminated or wound metallized film and
    The third step of obtaining a film capacitor element by providing a metallikon electrode on the molded metallized film, and
    A fourth step of attaching an external lead-out terminal to the metallikon electrode of the film capacitor element, and
    The fifth step of accommodating the film capacitor element to which the external extraction terminal is attached in the case, and
    A sixth step of sealing the film capacitor element housed in the case with a resin is provided.
    A method for manufacturing a case-type film capacitor, further comprising a water content adjusting step for adjusting the water content contained in the film capacitor element between the third step and the sixth step.
  2. 　前記誘電体フィルムがポリエーテルイミド樹脂を含む、請求項１に記載のケース型フィルムコンデンサの製造方法。 The method for manufacturing a case-type film capacitor according to claim 1, wherein the dielectric film contains a polyetherimide resin.
  3. 　前記水分量調整工程が、真空度１００Ｐａ以下、温度５０℃以上の真空乾燥により行われる、請求項１又は２に記載のケース型フィルムコンデンサの製造方法。 The method for manufacturing a case-type film capacitor according to claim 1 or 2, wherein the water content adjusting step is performed by vacuum drying with a vacuum degree of 100 Pa or less and a temperature of 50 ° C. or more.
  4. 　前記水分量調整工程において、前記フィルムコンデンサ素子に含まれる水分量を０．２５質量％以下に調整する、請求項１～３のいずれか一項に記載のケース型フィルムコンデンサの製造方法。 The method for manufacturing a case-type film capacitor according to any one of claims 1 to 3, wherein in the water content adjusting step, the water content contained in the film capacitor element is adjusted to 0.25% by mass or less.
  5. 　前記水分量調整工程が、前記第３工程と前記第４工程との間に設けられている、請求項１～４のいずれか一項に記載のケース型フィルムコンデンサの製造方法。 The method for manufacturing a case-type film capacitor according to any one of claims 1 to 4, wherein the water content adjusting step is provided between the third step and the fourth step.
  6. 　前記第４工程の前に、前記水分量調整工程を経た前記フィルムコンデンサ素子に絶縁オイルを含浸するオイル含浸工程を更に備える、請求項５に記載のケース型フィルムコンデンサの製造方法。 The method for manufacturing a case-type film capacitor according to claim 5, further comprising an oil impregnation step of impregnating the film capacitor element that has undergone the water content adjusting step with insulating oil before the fourth step.
  7. 　前記水分量調整工程を経た前記フィルムコンデンサ素子を、前記第４工程に供されるまで湿度１０％以下の雰囲気で保管する、請求項５又は６に記載のケース型フィルムコンデンサの製造方法。 The method for manufacturing a case-type film capacitor according to claim 5 or 6, wherein the film capacitor element that has undergone the water content adjusting step is stored in an atmosphere having a humidity of 10% or less until it is subjected to the fourth step.
  8. 　前記水分量調整工程が、前記第５工程と前記第６工程との間に設けられている、請求項１～７のいずれか一項に記載のケース型フィルムコンデンサの製造方法。 The method for manufacturing a case-type film capacitor according to any one of claims 1 to 7, wherein the water content adjusting step is provided between the fifth step and the sixth step.
  9. 　ケースと、前記ケースに収容されたフィルムコンデンサ素子と、前記フィルムコンデンサ素子を封止する封止樹脂と、を備えるケース型フィルムコンデンサの製造システムであって、
    　誘電体フィルム及び該フィルムの一方面上に設けられた金属蒸着膜を有する金属化フィルムを積層又は巻回する手段と、
    　積層又は巻回された前記金属化フィルムを成形する手段と、
    　成形された前記金属化フィルムにメタリコン電極を設けることによりフィルムコンデンサ素子を得る手段と、
    　前記フィルムコンデンサ素子の前記メタリコン電極に外部引き出し端子を取り付ける手段と、
    　外部引き出し端子が取り付けられた前記フィルムコンデンサ素子をケースに収容する手段と、
    　前記ケースに収容された前記フィルムコンデンサ素子を樹脂で封止する手段と、
    　前記フィルムコンデンサ素子に含まれる水分量を調整する水分量調整手段と、
    を備える、ケース型フィルムコンデンサの製造システム。     A case-type film capacitor manufacturing system including a case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element.
    A means for laminating or winding a dielectric film and a metallized film having a metal vapor deposition film provided on one surface of the film.
    A means for forming the metallized film laminated or wound, and
    A means for obtaining a film capacitor element by providing a metallikon electrode on the molded metallized film, and
    A means for attaching an external lead-out terminal to the metallikon electrode of the film capacitor element, and
    A means for accommodating the film capacitor element to which an external lead-out terminal is attached in a case,
    A means for sealing the film capacitor element housed in the case with a resin,
    A water content adjusting means for adjusting the water content contained in the film capacitor element, and
    A case-type film capacitor manufacturing system.
  10. 　水分量が調整された前記フィルムコンデンサ素子を所定の湿度で保管する手段を更に備える、請求項９に記載のケース型フィルムコンデンサの製造システム。 The case-type film capacitor manufacturing system according to claim 9, further comprising means for storing the film capacitor element having an adjusted water content at a predetermined humidity.
  11. 　水分量が調整された前記フィルムコンデンサ素子に絶縁オイルを含浸するオイル含浸手段を更に備える、請求項９又は１０に記載のケース型フィルムコンデンサの製造システム。 The case-type film capacitor manufacturing system according to claim 9 or 10, further comprising an oil impregnating means for impregnating the film capacitor element having an adjusted water content with insulating oil.
  12. 　ケースと、前記ケースに収容されたフィルムコンデンサ素子と、前記フィルムコンデンサ素子を封止する封止樹脂と、を備え、
    　前記フィルムコンデンサ素子に含まれる水分量が０．２５質量％以下である、ケース型フィルムコンデンサ。     A case, a film capacitor element housed in the case, and a sealing resin for sealing the film capacitor element are provided.
    A case-type film capacitor in which the amount of water contained in the film capacitor element is 0.25% by mass or less.
PCT/JP2019/035263 2019-09-06 2019-09-06 Encased film capacitor manufacturing method and manufacturing system WO2021044630A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016532U (en) * 1983-07-08 1985-02-04 日新電機株式会社 Molded capacitor
JPH0357921U (en) * 1989-10-09 1991-06-05
WO2019146755A1 (en) * 2018-01-25 2019-08-01 株式会社村田製作所 Film capacitor, and outer case for film capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016532U (en) * 1983-07-08 1985-02-04 日新電機株式会社 Molded capacitor
JPH0357921U (en) * 1989-10-09 1991-06-05
WO2019146755A1 (en) * 2018-01-25 2019-08-01 株式会社村田製作所 Film capacitor, and outer case for film capacitor

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