WO2021037794A3 - Grabentransistor - Google Patents

Grabentransistor Download PDF

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Publication number
WO2021037794A3
WO2021037794A3 PCT/EP2020/073626 EP2020073626W WO2021037794A3 WO 2021037794 A3 WO2021037794 A3 WO 2021037794A3 EP 2020073626 W EP2020073626 W EP 2020073626W WO 2021037794 A3 WO2021037794 A3 WO 2021037794A3
Authority
WO
WIPO (PCT)
Prior art keywords
trench transistor
gate
trench
layer
isolation layer
Prior art date
Application number
PCT/EP2020/073626
Other languages
English (en)
French (fr)
Other versions
WO2021037794A2 (de
Inventor
Dick Scholten
Klaus Heyers
Wolfgang Feiler
Stephan Schwaiger
Jan-Hendrik Alsmeier
Christian Tobias Banzhaf
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to US17/635,823 priority Critical patent/US20220320306A1/en
Priority to CN202080074240.XA priority patent/CN114600254A/zh
Publication of WO2021037794A2 publication Critical patent/WO2021037794A2/de
Publication of WO2021037794A3 publication Critical patent/WO2021037794A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
    • H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692—Surface layout
    • H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42356—Disposition, e.g. buried gate electrode
    • H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
    • H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7827—Vertical transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Element Separation (AREA)

Abstract

Es wird ein Grabentransistor (100) bereitgestellt, aufweisend: ein Halbleitergebiet (2), eine in dem Halbleitergebiet (2) ausgebildete Grabenstruktur (1), eine Gate-Isolationsschicht (3, 4) und eine auf der Gate-Isolationsschicht (3, 4) ausgebildete elektrisch leitende Gateschicht (5) in der Grabenstruktur (1), und einen Gatekontakt (6), der mit der Gateschicht (5) in einem Randbereich (7a) des Grabentransistors (100) elektrisch leitend verbunden ist, wobei eine Dicke (8) der Gate-Isolationsschicht (3, 4) in dem Randbereich (7a) des Grabentransistors (100) größer ist als in einem aktiven Bereich (7b) des Grabentransistors (100).
PCT/EP2020/073626 2019-08-23 2020-08-24 Grabentransistor WO2021037794A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/635,823 US20220320306A1 (en) 2019-08-23 2020-08-24 Trench transistor
CN202080074240.XA CN114600254A (zh) 2019-08-23 2020-08-24 沟槽式晶体管

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019212646.4A DE102019212646A1 (de) 2019-08-23 2019-08-23 Grabentransistor
DE102019212646.4 2019-08-23

Publications (2)

Publication Number Publication Date
WO2021037794A2 WO2021037794A2 (de) 2021-03-04
WO2021037794A3 true WO2021037794A3 (de) 2021-05-14

Family

ID=72243104

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2020/073626 WO2021037794A2 (de) 2019-08-23 2020-08-24 Grabentransistor

Country Status (4)

Country Link
US (1) US20220320306A1 (de)
CN (1) CN114600254A (de)
DE (1) DE102019212646A1 (de)
WO (1) WO2021037794A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11469307B2 (en) * 2020-09-29 2022-10-11 Taiwan Semiconductor Manufacturing Company, Ltd. Thicker corner of a gate dielectric structure around a recessed gate electrode for an MV device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015733A (ja) * 1999-07-02 2001-01-19 Fuji Electric Co Ltd 半導体装置およびその製造方法
US20050017293A1 (en) * 2003-05-30 2005-01-27 Infineon Technologies Ag Semiconductor component
JP2005197274A (ja) * 2003-12-26 2005-07-21 Nec Electronics Corp 半導体装置及びその製造方法
US20070040215A1 (en) * 2005-08-17 2007-02-22 Ling Ma Power semiconductor device with interconnected gate trenches
US20070155104A1 (en) * 2006-01-05 2007-07-05 Marchant Bruce D Power device utilizing chemical mechanical planarization
US20100102382A1 (en) * 2007-09-28 2010-04-29 Sanyo Electric Co., Ltd. Trench gate type transistor and method of manufacturing the same
US20120261737A1 (en) * 2009-11-20 2012-10-18 Force Mos Technology Co. Ltd. Trench mosfet with trenched floating gates and trenched channel stop gates in termination
US8809948B1 (en) * 2012-12-21 2014-08-19 Alpha And Omega Semiconductor Incorporated Device structure and methods of making high density MOSFETs for load switch and DC-DC applications
US20170250256A1 (en) * 2016-02-29 2017-08-31 Infineon Technologies Austria Ag Semiconductor Device with Needle-Shaped Field Plates and a Gate Structure with Edge and Node Portions
US20190245033A1 (en) * 2018-02-05 2019-08-08 Ubiq Semiconductor Corp. Power semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358338A (ja) * 2000-06-14 2001-12-26 Fuji Electric Co Ltd トレンチゲート型半導体装置
JP4178789B2 (ja) * 2001-12-18 2008-11-12 富士電機デバイステクノロジー株式会社 半導体装置およびその製造方法
JP4446202B2 (ja) * 2006-09-22 2010-04-07 エルピーダメモリ株式会社 半導体装置及び半導体装置の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015733A (ja) * 1999-07-02 2001-01-19 Fuji Electric Co Ltd 半導体装置およびその製造方法
US20050017293A1 (en) * 2003-05-30 2005-01-27 Infineon Technologies Ag Semiconductor component
JP2005197274A (ja) * 2003-12-26 2005-07-21 Nec Electronics Corp 半導体装置及びその製造方法
US20070040215A1 (en) * 2005-08-17 2007-02-22 Ling Ma Power semiconductor device with interconnected gate trenches
US20070155104A1 (en) * 2006-01-05 2007-07-05 Marchant Bruce D Power device utilizing chemical mechanical planarization
US20100102382A1 (en) * 2007-09-28 2010-04-29 Sanyo Electric Co., Ltd. Trench gate type transistor and method of manufacturing the same
US20120261737A1 (en) * 2009-11-20 2012-10-18 Force Mos Technology Co. Ltd. Trench mosfet with trenched floating gates and trenched channel stop gates in termination
US8809948B1 (en) * 2012-12-21 2014-08-19 Alpha And Omega Semiconductor Incorporated Device structure and methods of making high density MOSFETs for load switch and DC-DC applications
US20170250256A1 (en) * 2016-02-29 2017-08-31 Infineon Technologies Austria Ag Semiconductor Device with Needle-Shaped Field Plates and a Gate Structure with Edge and Node Portions
US20190245033A1 (en) * 2018-02-05 2019-08-08 Ubiq Semiconductor Corp. Power semiconductor device

Also Published As

Publication number Publication date
DE102019212646A1 (de) 2021-02-25
CN114600254A (zh) 2022-06-07
WO2021037794A2 (de) 2021-03-04
US20220320306A1 (en) 2022-10-06

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