WO2021036498A1 - Tof摄像模组及其投射模块和电子设备 - Google Patents

Tof摄像模组及其投射模块和电子设备 Download PDF

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Publication number
WO2021036498A1
WO2021036498A1 PCT/CN2020/099728 CN2020099728W WO2021036498A1 WO 2021036498 A1 WO2021036498 A1 WO 2021036498A1 CN 2020099728 W CN2020099728 W CN 2020099728W WO 2021036498 A1 WO2021036498 A1 WO 2021036498A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
module
projection
bracket
receiving
Prior art date
Application number
PCT/CN2020/099728
Other languages
English (en)
French (fr)
Inventor
魏罕钢
陈飞帆
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201921414693.3U external-priority patent/CN211321384U/zh
Priority claimed from CN201910800626.3A external-priority patent/CN112532809A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to EP20857458.2A priority Critical patent/EP4002825A4/en
Priority to US17/638,390 priority patent/US20220303443A1/en
Publication of WO2021036498A1 publication Critical patent/WO2021036498A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00—Special procedures for taking photographs; Apparatus therefor
    • G03B15/02—Illuminating scene
    • G03B15/03—Combinations of cameras with lighting apparatus; Flash units
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0272—Details of the structure or mounting of specific components for a projector or beamer module assembly

Definitions

  • the present invention relates to the technical field of camera modules, in particular to a TOF camera module and its projection module and electronic equipment.
  • the depth information camera module based on the Time of Flight (TOF), that is, the TOF camera module is one of the more popular products.
  • TOF Time of Flight
  • the TOF camera module refers to the use of the sensor to emit modulated light, and then after encountering the reflection of the object, the sensor calculates the time difference or phase difference between the emitted light and the light reflected from the object to obtain information about the object One in-depth information.
  • the existing TOF camera module usually includes a projection module, a receiving module and a circuit board, wherein the projection module and the receiving module are respectively directly installed and electrically connected to the circuit board.
  • the prior art TOF camera module also has the following at least one defect: First, the waveform of the projection light signal projected by the projection module of the TOF camera module is poor.
  • the main reason that affects the waveform of the projection light signal projected by the projection module is the wiring distance between the drive chip of the projection module and the projection unit. If the wiring distance between the drive chip and the projection unit is farther, the drive chip controls the The pulse wave projected by the projection unit is shaped like a mountain.
  • the driver chip of the prior art TOF camera module is arranged on the receiving module or stacked under the projection module, so as to reduce the size of the TOF camera module.
  • Dimensions in the XY direction length and width.
  • the wiring distance between the driving chip and the projection unit of the existing TOF camera module is relatively long, which results in a poor waveform of the projected light signal.
  • the TOF camera module is usually stacked above the circuit board of the electronic device by welding, and since the driving chip is usually stacked on the back of the projection module, As a result, the thickness of the TOF camera module in the prior art cannot be further reduced, which is not conducive to the thinning of electronic equipment.
  • the prior art TOF camera module has poor heat dissipation performance, and the high temperature of the projection module of the TOF camera module will affect the optical power of the projection unit, or affect the use of the TOF camera module life.
  • the transmitting end and receiving end of the prior art TOF camera module are assembled into one body and then assembled to the main board of the electronic device, wherein the transmitting end of the TOF camera module cannot be used independently to emit light signals of a specific waveform .
  • the transmitting end of the TOF camera module of the prior art is controlled by the receiving end, and the light signal of a preset waveform is emitted, that is, the driving chip that controls the transmitting end is packaged in the receiving end.
  • the transmitting end of the prior art TOF camera module is not a module that can exist and work independently, that is, the transmitting end of the prior art needs to work under the control of the receiving end. Therefore, the transmitting end of the TOF camera module in the prior art cannot exist independently.
  • One of the main advantages of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the distance between the driving chip of a projection module of the TOF camera module and the projection unit is reduced to reduce the distance between the driving chip and the projection unit of the TOF camera module.
  • the parasitic inductance of the projection module improves the pulse waveform quality of the optical signal projected by the projection unit and improves the signal-to-noise ratio.
  • the transmitter module includes a driver IC packaged inside.
  • the bottom of the transmitter module has solder joints, which can pass through the bottom solder joints. Directly connected to the terminal board, that is, the transmitter module can work independently of the receiver module.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the drive chip and projection unit of the projection module are attached to the same side of a circuit board of the projection module, which is beneficial to Shorten the wiring distance between the driving chip and the projection unit.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the circuit board of the projection module is a ceramic substrate, which is beneficial to improve the heat dissipation of the projection module.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the bracket of the projection module is a heat dissipation bracket, so as to improve the heat dissipation of the projection module through the bracket.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the bracket of the projection module is integrally formed on the circuit board, and the driving chip and some other electronic components are The bracket is wrapped to reduce the XY (length and width) size of the projection module.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the bracket of the projection module is integrally formed on the circuit board, which is beneficial to improve the reliability and reliability of the projection module. Overall strength.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the bracket of the projection module is integrally formed on the circuit board, reducing the manufacturing process of the projection module ,Increase productivity.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the bracket of the projection module is integrally formed on the circuit board, and the driving chip is wrapped by the bracket, So that the bracket protects the driving chip.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the bracket of the projection module is integrally formed on the circuit board and the driving chip is wrapped by the bracket, wherein The bracket conducts the heat generated by the driving chip to improve the heat dissipation performance of the projection module.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the projection module and the receiving module of the TOF camera module can be independently installed on the main board of the electronic equipment, Assembling the TOF camera module based on the design requirements of the electronic device is beneficial to improve the use performance of the TOF camera module.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the drive chip of the projection module and the projection unit are placed on the same side to reduce the The overall thickness is conducive to the lightness and thinness of the electronic device.
  • Another advantage of the present invention is to provide a TOF camera module and its projection module and electronic equipment, wherein the main board of the electronic equipment is provided with a mounting slot (hole or half hole) corresponding to the TOF camera module.
  • the receiving module of the TOF camera module is correspondingly embedded in the mounting slot (hole or half hole) of the motherboard, which is beneficial to reduce the overall thickness of the electronic device.
  • a projection module of the present invention that can achieve the foregoing objectives and other objectives and advantages includes:
  • a bracket wherein the bracket is arranged on the transmitting circuit board
  • optical element wherein the optical element is attached to the bracket, and an accommodating space is formed above the transmitting circuit board by the optical element and the bracket;
  • At least one projection unit wherein the projection unit is disposed in the accommodating space, and the projection unit is conductively attached to the transmitting circuit board;
  • At least one driving chip wherein the driving chip is conductively connected to the transmitting circuit board, the driving chip controls the projection unit through the transmitting circuit board, and the driving chip and the projection unit are located at the The same side of the transmitter circuit board.
  • the transmitting circuit board has an upper end surface and a lower end surface, and the driving chip is attached to the upper end surface of the transmitting circuit board in a manner adjacent to the projection unit.
  • the projection module further includes a connection layer through which the support and the upper end surface of the transmission circuit board are connected.
  • the connecting layer is selected from a connecting layer group consisting of an adhesive layer or a soldering layer.
  • the bracket contacts the driving chip in a thermally conductive manner, and the heat generated by the driving chip is conducted through the bracket.
  • the bracket has a accommodating cavity, the driving chip is placed in the accommodating cavity, and the bracket covers the upper surface of the driving chip in a thermal contact manner.
  • the support is selected from: a combination of a ceramic sintered support and a molded support.
  • the bracket is integrally formed on the upper end surface of the transmitting circuit board through a molding process.
  • the driving chip is covered by the bracket, and the heat generated by the driving chip is conducted through the bracket.
  • the transmitting circuit board includes:
  • a transmitting circuit substrate A transmitting circuit substrate
  • a plurality of upper solder joints wherein the upper solder joints are arranged on the upper end of the transmitter circuit substrate;
  • a plurality of lower solder joints wherein the lower solder joints are disposed at the lower end of the transmitting circuit substrate;
  • a plurality of conduction circuits wherein the conduction circuit electrically connects each of the upper solder joints and each of the lower solder joints, wherein the drive chip is conductively connected through the upper solder joints and the conduction circuit
  • the conduction circuit electrically connects each of the upper solder joints and each of the lower solder joints, wherein the drive chip is conductively connected through the upper solder joints and the conduction circuit
  • Each of the lower solder joints is electrically connected to the upper solder joint through the conduction circuit.
  • the projection module further includes a flexible board and a connector, wherein the lower solder joint of the transmitting circuit board is conductively connected to the flexible board, and the flexible board The board can connect the flexible board to the connector in a conductive manner.
  • the projection module further includes a soft board, wherein one end of the soft board is conductively connected to the transmitting circuit board.
  • the bracket includes a bracket body and is further provided with a mounting groove and at least one air escape groove, wherein the mounting groove is formed at the upper end of the bracket body, and the optical element is disposed at The installation groove and the air escape groove communicate with the accommodating space and the external environment, and the air pressure of the accommodating space and the external environment is balanced by the air escape groove.
  • the bracket includes a bracket body and is further provided with at least one glue area, and a cured glue layer is formed by curing glue between the glue area and the optical element and is formed at intervals.
  • An escape air gap wherein the escape air gap connects the accommodating space with the external environment, and the air escape gap balances the air pressure of the accommodating space and the external environment.
  • the projection module further includes at least one electrical element, wherein the electronic element is conductively connected to the transmitting circuit board.
  • the electronic component includes a photodiode for monitoring light changes in the projection module, and the photodiode is conductively connected to the driving chip for the driving chip The working state of the projection unit is controlled based on the detection information of the photodiode.
  • the electronic component includes a negative temperature coefficient device, the negative temperature coefficient device is used to monitor the temperature of the projection unit, and the negative temperature coefficient device is controlled by the transmitting circuit board. It is conductively connected to the driving chip.
  • the transmitting circuit substrate of the transmitting circuit board is selected from a ceramic substrate and a PCB board.
  • the present invention further provides a TOF camera module, including:
  • the projection module according to any one of the above, wherein the projection unit of the projection module is controlled by the drive chip to project a detection light;
  • a receiving module wherein the receiving module is arranged adjacent to the projection module, and the receiving module receives the reflected light of the detection light, and obtains depth information of the illuminated object based on the reflected light.
  • the projection module and the receiving module are arranged independently.
  • the TOF camera module includes a lens assembly, a photosensitive element, and at least one receiving circuit board, wherein the photosensitive element is attached to the receiving circuit board, and the lens assembly is based on The photosensitive path of the photosensitive element is arranged above the receiving circuit board.
  • the receiving circuit board includes a circuit board receiving end and a circuit board transmitting end integrally extending from the circuit board receiving end, wherein the projection module is arranged on the receiving circuit board Above the transmitting end of the circuit board, the transmitting circuit board of the projection module is conductively connected to the receiving circuit board.
  • the TOF camera module further includes at least one soft board, wherein the soft board is conductively connected to the transmitting circuit board of the projection module and the receiving circuit board. Transmitting end of the circuit board.
  • the TOF camera module further includes at least one base bracket, wherein the base bracket is stacked on the circuit board transmitting end of the receiving circuit board, and the projection module is Supported above the base bracket, the height of the projection module is raised by the base bracket.
  • the TOF camera module further includes at least one electronic component unit, the electronic component unit is disposed on the emitting end of the circuit board, wherein the base bracket is integrally formed on the The emitting end of the circuit board is wrapped with the electronic component unit by the base bracket.
  • the TOF camera module further includes at least one electronic component unit, the electronic component unit is disposed at the emitting end of the circuit board, and the base bracket includes a base bracket body and further At least one accommodating groove is provided, wherein the accommodating groove is formed at the lower end of the base bracket body, and the base bracket body is attached to the top of the emitting end of the circuit board.
  • the bracket wraps the electronic component unit.
  • the TOF camera module further includes at least one base bracket, wherein the base bracket is conductively disposed on the circuit board transmitting end of the receiving circuit board, and the The projection module is stacked above the base bracket, and the height of the projection module is raised by the base bracket.
  • the base support includes a base support main body and at least one support conduction circuit arranged on the base support main body, wherein the support conduction circuit is electrically connected to the projection module
  • the transmitting circuit board is at the receiving end of the circuit board.
  • the transmitting circuit board of the projection module is integrally formed on the receiving end of the circuit board of the receiving circuit board, and the height of the projection module is raised by the base bracket .
  • the base bracket is selected from the group consisting of a ceramic bracket formed by sintering ceramics and a molded base formed by integral molding.
  • the TOF camera module further includes at least one fixing frame, wherein the receiving module is arranged on the fixing frame in an adjustable optical axis manner, and the fixing frame is used to fix the Receiving module.
  • the fixing frame includes a receiving end fixing frame and a transmitting end fixing frame, wherein the receiving module is arranged on the receiving end fixing frame, and the projection module is arranged on the transmitting end fixing frame. The distance between the projection module and the receiving module is maintained by the fixing frame.
  • the present invention further provides an electronic device, including:
  • An electronic device main board wherein the electronic device main board is disposed on the electronic device host;
  • At least one TOF camera module is conductively arranged on the electronic device main board, and the TOF camera module includes:
  • the projection module according to any one of the above, wherein the projection unit of the projection module is controlled by the drive chip to project a detection light;
  • a receiving module wherein the receiving module is arranged adjacent to the projection module, and the receiving module receives the reflected light of the detection light, and obtains depth information of the illuminated object based on the reflected light.
  • the lower solder joint of the transmitting module is conductively connected to the transmitting circuit board to the electronic device main board, and the transmitting module is fixed to the electronic device main board.
  • the projection module and the receiving module are arranged independently.
  • the electronic device main board includes a main board main body, a pad area provided on the main board main body, and a receiving end mounting groove, wherein the projection module is attached to the electronic device In the pad area of the main board, the receiving module is arranged in the receiving end mounting groove, and the projection module and the receiving module are respectively conductively connected to the main board main body.
  • the receiving module is submergedly installed to the receiving end installation groove from a surface of the main board main body.
  • the electronic device main board includes a main board main body, a pad area provided on the main board main body, and a receiving end mounting hole, wherein the projection module is attached to the electronic device In the pad area of the main board, the receiving module is arranged in the receiving end mounting hole, and the projection module and the receiving module are respectively conductively connected to the main board main body.
  • the present invention further provides an electronic device including:
  • An electronic device main board wherein the electronic device main board is disposed on the electronic device host;
  • the TOF camera module as described in any one of the above, wherein the electrically conductive device is provided on the main board of the electronic device.
  • the electronic device main board includes a main board main body, a pad area and a receiving end mounting area provided on the main board main body, wherein the projection module of the TOF camera module is pasted Attached to the pad area, the receiving module is attached to the receiving end mounting area, and the receiving module is conductively connected to the main board main body.
  • Fig. 1 is an overall schematic diagram of an electronic device according to a preferred embodiment of the present invention.
  • FIG. 2A is an overall schematic diagram of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • 2B is an overall cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • 3A is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 3B is a top view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 3C is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 3D is a top view of another alternative implementation of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 3E is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 3F is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 3G is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 3H is a cross-sectional view of another alternative implementation of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 4A is a schematic perspective view of a partial adhesive installation of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 4B is a schematic cross-sectional view of the partial adhesive mounting of the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 5A is a schematic diagram of drawing glue of the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 5B is a schematic diagram of drawing glue of the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 5C is a schematic diagram of drawing glue of the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • Fig. 6 is a pulse waveform diagram projected by the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 7A is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 7B is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 7C is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 7D is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 7E is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • 7F is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 8 is an overall schematic diagram of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 9A is a cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 9B is a cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • 9C is a cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • 9D is a cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 10A is a schematic diagram of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 10B is a schematic cross-sectional view of the TOF camera module installation of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • 10C is a schematic cross-sectional view of the TOF camera module installation of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 11A is a schematic diagram of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • 11B is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • 11C is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 12A is a schematic diagram of the installation of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 12B is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 13 is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • the term “a” should be understood as “at least one” or “one or more”, that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element The number can be more than one, and the term “one” cannot be understood as a restriction on the number.
  • the electronic device includes an electronic device host 100, an electronic device mainboard 200, and at least one TOF camera module 300, wherein the TOF camera module 300 is disposed on the electronic device host 100, and the TOF camera module 300 is electrically connected to the electronic device main board 200, and the TOF camera module 300 supports the shooting operation of the TOF camera module 300 by the electronic device main board 200 of the electronic device.
  • the electronic device host 100 of the electronic device may also be equipped with other types of camera modules, such as a wide-angle camera module, a telephoto camera module, and the like.
  • the electronic device may be, but is not limited to, a smart phone, a tablet computer, or other types of devices with a photographing function.
  • the TOF camera module 300 of the electronic device includes a projection module 10 and a receiving module 20, wherein the receiving module emits light based on the control signal of the electronic device host 100, When the light emitted by the projection module 10 illuminates an object, the reflected light of the light is reflected by the object to the receiving module 20. Based on difference information such as the time difference or phase difference between the light emitted by the projection module 10 and the reflected light received by the receiving module 20, a depth information about the illuminated object is obtained.
  • the projection module 10 and the receiving module 20 of the TOF camera module 300 are electrically connected to the electronic device main board 200 of the electronic device, wherein the electronic device host 100 is controlled by the electronic device main board 200 The working state of the TOF camera module 300. It is worth mentioning that, in this preferred embodiment of the present invention, the projection module 10 and the receiving module 20 of the TOF camera module 300 can be independently installed on the electronic device mainboard 200, that is, The projection module 10 and the receiving module 20 of the TOF camera module 300 can be separately assembled to the electronic device main board 200, and the projection module 10 and the receiving module 20 are each conductively connected ⁇ The electronic device motherboard 200. It is understandable that the projection module 10 and the receiving module 20 of the TOF camera module 300 are installed independently of each other.
  • the TOF camera module 300 can be installed based on the design requirements of the electronic device.
  • the projection module 10 and the receiving module 20 That is to say, the projection module 10 and the receiving module 20 are assembled separately based on assembly requirements and design requirements, that is, the projection module 10 and the receiving module 20 are assembled on the electronic device mainboard 200 to form the TOF
  • the camera module 300 improves the applicability of the TOF camera module 300.
  • the receiving module 20 includes a lens assembly 21, a photosensitive element 22, and at least one receiving circuit board 23, wherein the lens assembly 21 is disposed above the photosensitive element 22, and the lens assembly 21
  • the component 21 provides a photosensitive path for the photosensitive element 22 for external light to be projected to the photosensitive element 22 through the photosensitive path.
  • the photosensitive element 22 converts the optical signal of the external light into an electrical signal corresponding to the optical signal, that is, photoelectric conversion.
  • the photosensitive element 22 is arranged on one surface of the receiving circuit board 23, and the photosensitive element 22 is conductively connected to the receiving circuit board 23, and the receiving circuit board 23 supports the photosensitive element 22.
  • the element 22 works, and receives the photoelectric signal of the photosensitive element 22.
  • the lens assembly 21 includes at least one optical lens 211, a frame 212, a base 213, and at least one filter element 214 disposed on the base 213, wherein the optical lens 211 is based on the receiving module 20
  • the photosensitive path is supported by the frame 212 above the base 213.
  • the light is transmitted to the filter element 214 through the optical lens 211, so that the filter element 214 can filter the light so as to filter out stray light that affects imaging.
  • the receiving module 20 may also include other elements, such as a bracket for supporting and fixing the lens assembly, or supporting the receiving module 20.
  • Working electronic components and other components are also include other elements.
  • the receiving module 20 of the TOF camera module 300 further includes a receiving end connector 24, wherein one end of the receiving end connector 24 is electrically connected to the receiving module 20
  • the receiving circuit board 23 of the receiving end connector 24 is conductively connected to the receiving circuit board 23 of the receiving module 20 to the electronic device main board 200.
  • the projection module 10 includes a bracket 11, a transmitting circuit board 12, at least one optical element 13, at least one projection unit 14, and at least one driving chip 15, wherein the projection unit 14 and the driving chip 15 are arranged in The same side of the transmitting circuit board 12.
  • the bracket 11 is arranged on the transmitting circuit board 12, wherein the optical element 13 is attached above the bracket 11 and is located in the projection path of the projection module 10, which is diffracted by the optical element 13 ( (Or beam expansion, shaping, etc.) the light signal projected by the projection unit 14.
  • the bracket 11, the transmitting circuit board 12, and the optical element 13 of the projection module 10 are sealed to form an accommodating space 101, wherein the projection unit 14 and the driving chip 15 are built in the enclosed space 101.
  • the projection unit 14 and the driving chip 15 are electrically connected to the transmitting circuit board 12 in a conductive manner, wherein the driving chip 15 controls the projection unit 14 to project light signals. Specifically, the projection unit 14 is controlled by the driving chip 15 through the transmitting circuit board 12 to control the pulse waveform of the light signal projected.
  • the drive chip 15 is arranged adjacent to the projection unit 14, so that the drive chip 15 can control the projection unit 14 to project a light signal of a required waveform .
  • the projection unit 14 and the driving chip 15 are attached to the same side of the transmitting circuit board 12, and the driving chip 15 is arranged adjacent to the projection unit 14 so that The wiring distance between the driving chip 15 and the projection unit 14 is shortened, the parasitic inductance of the projection unit 14 is reduced, and the waveform quality of the light signal projected by the projection unit 14 is improved, so as to improve the reliability of the projection module 10. Noise ratio.
  • the separation distance between the driving chip 15 and the projection unit 14 is less than or equal to 0.5 mm.
  • the transmitting circuit board 12 of the projection module 10 has an upper end surface (front or upper surface) 121 and a lower end surface (back or lower surface) 122, wherein the projection unit 14 and the driving chip 15 are attached to The upper end surface 121 of the transmitting circuit board 12 and the projection unit 14 are electrically connected to the transmitting circuit board 12 from the upper end surface 121 by the driving chip 12.
  • the bracket 11 is disposed on the upper end surface 121 of the transmitting circuit board 12.
  • the bracket 11 is attached to the upper end surface 121 of the transmitting circuit board 12, and the bracket 11 supports the projection path of the optical element 13 on the projection module 10.
  • the bracket 11 is attached to the upper end surface 121 of the transmitting circuit board 12 by means of gluing.
  • the projection module 10 further includes a connecting layer 16, wherein the connecting layer 16 is disposed on the upper end surface 121 of the transmitting circuit board 12, and the bracket 11 is glued to the connecting layer 16 It is attached above the upper end surface 121 in a manner.
  • the connecting layer 16 may be, but not limited to, a thermally conductive adhesive layer, a soldering layer, that is, an adhesive with higher heat dissipation, to improve the heat dissipation of the projection module 10 performance.
  • the connecting layer 16 may be, but not limited to, an adhesive layer, a soldering layer, and other materials having a connection and installation function.
  • the bracket 11 can be made by injection molding or sintering processes, that is, the bracket 11 can be integrally formed by injection molding or sintering processes.
  • the bracket 11 is a ceramic sintered ceramic bracket device. More preferably, the bracket is made of aluminum nitride ceramic (Aluminum nitride, ALN) material. Since the thermal conductivity of aluminum nitride ceramic material is better than other ceramic materials, the coefficient of thermal expansion (CTE) is smaller, so It has good heat dissipation, which is beneficial to the working reliability of the TOF module.
  • ALN aluminum nitride ceramic
  • CTE coefficient of thermal expansion
  • the bracket 11 of the projection module 10 includes a bracket body 111 and further has a bearing surface 112 and a mounting groove 113 formed above the bearing surface 112, wherein the optical element 13 is attached to the bracket
  • the supporting surface 112 of the 11 supports the optical element 13 in the mounting groove 113 by the support body 111.
  • the optical element 13 is attached to the mounting groove 113 at the upper end of the bracket 11 in an adhesive manner, that is, the optical element 13 is pasted above the bearing surface 112 of the bracket 11 .
  • the projection module 10 further includes a plurality of electronic components 17, wherein the plurality of electronic components 17 are electrically connected to the transmitting circuit board 12, and at least one of the electronic components 17 passes through the transmitting circuit board 12.
  • the projection unit 14 of the projection module 10 is conductively connected, and at least one of the electronic components 17 is conductively connected to the driving chip 15 through the transmitting circuit board 12.
  • the electronic component 17 is used to support the operation of the projection unit 14 and/or the driving chip 15 of the projection module 10.
  • the electronic component 17 is conductively arranged on the upper end surface 121 of the transmitting circuit board 12, and the electronic component 17 is built in the enclosed space 101.
  • the electronic component 17 may be a passive electronic device such as a resistor, a capacitor, or an inductor, and the electronic component 17 may also be another type of electronic device that cooperates with the driving chip 15.
  • the electronic component 17 can reduce the parasitic inductance between the driving chip 15 and the projection unit 14 to ensure that the waveform of the optical signal emitted by the projection module 10 is close to an ideal square wave.
  • the electronic component 17 can also be installed in other positions of the TOF camera module 300, such as the receiving circuit board 23 of the receiving module 20; Or the electronic component 17 is mounted on the electronic device mainboard 200 of the electronic device to further reduce the overall structure of the TOF camera module 300, which is beneficial to reduce the overall volume of the electronic device.
  • the electrical component 17 can improve the pulse waveform of the optical signal projected by the projection unit 14, the electronic component 17 does not need to be installed on the transmitting circuit board 12.
  • the electronic component 17 is mounted on the receiving circuit board 23 of the receiving module 20, wherein the electronic component 17 passes through the The conduction between the receiving circuit board 23 and the transmitting circuit board 12 is supported to support the operation of the projection unit 14 and/or the driving chip 15; or the electronic component 17 is installed on the electronic device main board 200, wherein The electronic component 17 supports the operation of the projection unit 14 and/or the driving chip 15 through the electronic device motherboard 200.
  • the projection module 10 and the receiving module 20 of the TOF camera module 300 are conductively connected to the electronic device main board 200 through respective connectors.
  • the TOF camera module 300 further includes at least one fixing frame 30, wherein the receiving module 20 is adjustably disposed on the fixing frame 30, and the receiving module 20 is fixed to the electronic device by the fixing frame 30.
  • Device motherboard 200 After the receiving module 20 is conductively arranged on the electronic device mainboard 200, the position of the receiving module 20 on the fixing frame 30 is adjusted so that the optical axis of the receiving end of the receiving module 20 and the projection The optical axis of the transmitting end of the module 10 is adapted so that the TOF camera module 300 has good shooting performance.
  • the projection module 10 and/or the receiving module 20 of the TOF camera module 300 may also be conductively connected to the electronic device main board through other conduction methods 200.
  • the projection module 10 and/or the receiving module 20 are connected to the electronic device main board 200 in a welding manner.
  • the conduction connection mode of the TOF camera module 300 is merely exemplary here, and not a limitation.
  • the fixing frame 30 can be used to adjustably fix and support the projection module 10 and the receiving module 20, or the fixing frame 30 can be used to adjustably fix and support the projection module 10 and the receiving module 20.
  • the fixing frame 30 includes a receiving end fixing frame 31 and a transmitting end fixing frame 32, wherein the receiving module 20 is adjustably arranged on the receiving end fixing frame 31, and the projection module 10 is arranged
  • the frame 32 is fixed at the transmitting end.
  • the receiving end fixing frame 31 includes a receiving end fixing frame main body 311 and a receiving end adjusting groove 312, wherein the receiving module 20 is held in the receiving end adjusting groove 312 by the receiving end fixing frame main body 311.
  • the receiving module 20 is arranged in the receiving end adjustment slot 312 of the receiving end fixing frame 31 in an optical axis adjustable manner, and the receiving end adjustment slot 312 is adjusted by adjusting the optical axis.
  • the position of the receiving module 20 at the receiving end adjustment slot 312 adjusts the receiving end optical axis of the receiving module 20 so that the optical axis direction of the receiving module 20 is adapted to the projection module 10.
  • the projection module 10 is arranged on the transmitting end fixing frame 32, and the position of the projection module 10 is raised by the transmitting end fixing frame 32. It is worth mentioning that the overall height of the projection module 10 is lower than the height of the receiving module 20, and the overall height of the projection module 10 is raised by the transmitting end fixing frame 32 of the fixing frame 30, so that The height of the upper end surface of the projection module 10 is adapted to the height of the upper end surface of the receiving module 20.
  • the projection module 10 can also be adjusted to the transmitting end fixing frame 32, so as to adjust the projection module 10 by adjusting the optical axis of the transmitting end of the projection module 10.
  • the position in the fixing frame 30 is such that the optical axis of the projection module 10 and the optical axis of the receiving module 20 are adapted to each other. As shown in FIG.
  • the projection unit 14 is attached to the upper end surface 121 of the transmitting circuit board 12, wherein one electrode (negative electrode) of the projection unit 14 is provided on the upper end surface 121, so The other electrode (positive electrode) of the projection unit 14 is welded to the transmitting circuit board 12 through a wire, and the circuit board 12 is electrically connected to the electronic device main board 200 for the electronic device main board 200 to pass through the
  • the transmitting circuit board 12 supports the operation of the projection unit 14.
  • the driving chip 15 and the electronic component 17 are arranged on the upper end surface 121 of the transmitting circuit board 12 by welding, and the transmitting circuit board 12 realizes all the problems.
  • the driving chip 15 is connected to the electronic device main board 200, and the electronic component 17 is connected to the electronic device main board 200.
  • the projection unit 14 is disposed adjacent to the driving chip 15, or the driving chip 15 is attached to the emission circuit board in a manner adjacent to the projection unit 14. 12.
  • the lead connecting the projection unit 14 is arranged on one side of the projection unit 14 in a manner facing away from the driving chip 15, or is arranged on the end of the projection unit 14 facing away from the driving chip 15 for The lead wire of the projection unit 14 is connected.
  • the lead connecting the projection unit 14 is arranged on the side away from the drive chip 15 so that the projection unit 14 and the drive chip 15
  • the driving chip 15 is as close as possible. It is understandable that the closer the relative positions of the projection unit 14 and the driving chip 15 are, the closer the waveform of the light signal reflected by the driving chip 15 to the projection unit 14 is closer to an ideal waveform, such as a square wave. .
  • the lead connecting the projection unit 14 is arranged on the side that is not adjacent to the driving chip 15.
  • the lead connecting the projection unit 14 is arranged on the driving chip 15 and the projection unit. On the same side of 14. It can be understood that the lead connecting the projection unit 14 is arranged far away from the driving chip 15, which can reduce the heat generated during the operation of the driving chip 15 from being conducted to the lead.
  • the projection module 10 is conductively arranged on the electronic device main board 200 (or the circuit board of the electronic device), wherein in this preferred embodiment of the present invention, all of the projection module 10
  • the transmitting circuit board 12 is connected to the electronic device main board 200 by welding.
  • the transmitting circuit board 12 of the projection module 10 further includes a transmitting circuit substrate 120, a plurality of (two or more) upper solder joints 123, at least a lower solder joint 124, and a plurality of conduction circuits 125 , wherein the upper solder joint 123 is disposed on the upper end surface 121 of the transmitter circuit substrate 120, and the lower solder joint 124 is disposed on the lower end surface 122 of the transmitter circuit substrate 120.
  • the upper solder joint 123 solders the projection unit 14, the driving chip 15 and the electronic component 17 of the projection module 10 to the upper end surface 121 of the transmitting circuit board 12.
  • Each of the upper solder joints 123 and the lower solder joints 124 is electrically connected to the conduction circuit 125 to realize the driving chip 15 and the emitting unit of the projection module 10 through the conduction circuit 125 14's conduction connection.
  • one end of the at least one conduction circuit 125 of the transmitting circuit board 12 is connected to an upper solder joint 123, wherein the upper solder joint 123 is electrically connected to the driving chip 15, and the other end of the conduction circuit 125 is electrically connected.
  • the other upper solder joint 123 connected to the upper end surface 121, wherein the other upper solder joint 123 is electrically connected to an electrode of the projection unit 14.
  • the driver chip 15 is arranged adjacent to the projection unit 14, which can effectively reduce the wiring distance between the driver chip 15 and the projection unit 14, which is beneficial to improve the driver chip. 15 controls the waveform of the light emitted by the projection unit 14.
  • the driving chip 15 of the projection module 10 drives (controls) the transmission and projection unit 14 to work through the conduction circuit 125 of the transmission circuit board 12.
  • One end of the at least one conducting circuit 125 of the transmitting circuit board 12 is connected to at least one solder joint 123, wherein the upper solder joint 123 is electrically connected to the driving chip 15, and the other end of the conducting circuit 125 is electrically connected to the solder joint.
  • Point 124 to realize the internal and external conduction of the circuit board 12.
  • the conductive circuit 125 electrically connected to an upper solder joint 123, wherein the upper solder joint 123 is connected to the electronic component 17, and the other end of the conductive circuit 125 is electrically connected to the lower solder joint 124 to The internal and external conduction of the circuit board 12 is realized.
  • the emitting circuit board 12 is a ceramic substrate, wherein the driving chip 15, the projection unit 14, and the electronic components 17 arranged on the emitting circuit board 12 conduct the generated heat in a thermally conductive manner To the transmitting circuit board 12, heat is dissipated by the transmitting circuit board 12.
  • the material of the transmitting circuit board 12 is merely exemplary here, and not limiting.
  • the projection module 10 is electrically connected to the electronic device main board 200 through the lower solder joints 124 of the transmitting circuit board 12 to realize the projection module 10 and the electronic device The conduction connection of the device main board 200.
  • 3C and 3E show another alternative embodiment of a projection module 10 of the TOF camera module 300 of the present invention, wherein the projection module 10 includes a bracket 11A, a transmitting circuit board 12, and at least one optical element 13. At least one projection unit 14, at least one driving chip 15, and at least one electronic component 17, wherein the projection unit 14 and the driving chip 15 are arranged on the same side of the transmitting circuit board 12. It is worth mentioning that the difference from the above-mentioned preferred embodiment is the bracket 11A, wherein the bracket 11A is integrally formed on the transmitting circuit board 12. The bracket 11A is integrally formed above the transmitting circuit board 12 through a molding process, and the driving chip 15 of the projection module 10 is covered by the bracket 11A.
  • the bracket 11A is an integral molded bracket, that is, the bracket 11A is integrally formed on the upper end surface 121 of the transmitter circuit board 12 through a molding process. .
  • the bracket 11A wraps the driving chip 15 on the transmitting circuit board 12, or the driving chip 15 is covered on the bracket 11A and the transmitting circuit board 12.
  • the bracket 11A covers (wraps) the drive chip 15 through a molding or sintering process, which can effectively reduce the XY (length and width) size of the projection module 10, which is beneficial to reducing the TOF camera.
  • the overall volume of the module 300 It is understandable that the driving chip 15 is covered (wrapped) by the bracket 11A, and the bracket 11A can protect the driving chip 15.
  • the bracket 11A covers (wraps) the driver chip 15 through a molding process, and the bracket 11A further Fixing the driving chip 15 improves the strength (reliability) of the projection module 10.
  • the driving chip 15 is covered by the bracket 11A, and the heat generated by the driving chip 15 during operation is conducted to the bracket 11A through thermal conduction, so that the bracket 11A can dissipate heat, thereby avoiding the driving projection
  • the heat generated by the module 10 accumulates in the enclosed space 101, which affects the accuracy and detection distance of the light signal projected by the projection unit 14, or affects the service life of the TOF camera module 300.
  • the bracket 11A is integrally formed on the transmitting circuit board 12 through a molding process, and the bracket 11A conducts the heat generated by the driving chip 15 by means of heat transfer, which improves the performance of the projection module 10 Thermal performance.
  • the bracket 11A is further provided with at least one air escape groove 114A, wherein the air escape groove 114A communicates with the accommodating space 101 in the external environment.
  • the projection module 10 is baked or exposed to make the glue between the optical element 13 and the bracket 11A (Colloid) is cured.
  • the air escape groove 114A guides the air flow in the accommodating space 101 to prevent the air in the accommodating space 101 from expanding, which may cause the optical The element 13 cannot be attached to the bracket 11A.
  • the air escape groove 114A is formed at the upper end of the bracket body 111A of the bracket 11A, wherein the air escape groove 114 is connected to the mounting groove 113A of the bracket 11A. Therefore, when the optical element 13 is installed in the mounting groove 113A, the accommodating space 101 is connected to the external environment through the air escape groove 114A, so that the air escape groove 114A guides the container outward. The air in the accommodating space 101 avoids excessive air pressure in the accommodating space 101. It can be understood that, in the preferred embodiment of the present invention, the location and the manner of forming the escaped air groove 114A are merely exemplary here, and not limited. More preferably, after the glue pasting the optical element 13 is cured, the air escape groove 114 of the bracket 11A is selectively blocked to seal the accommodating space 101.
  • 3F or 3G shows another two alternative implementations of a projection module 10 of the TOF camera module 300 of the present invention, wherein the projection module 10 includes a bracket 11B, a transmitting circuit board 12, and at least one optical element 13. At least one projection unit 14, at least one driving chip 15, and at least one electronic component 17, wherein the projection unit 14 and the driving chip 15 are arranged on the same side of the transmitting circuit board 12.
  • the bracket 11B is arranged on the transmitting circuit board 12 in an adhesive manner.
  • the bracket 11B can be made by injection molding or sintering processes, that is, the bracket 11B can be integrally formed by injection molding or sintering processes.
  • the bracket 11B is a ceramic sintered ceramic bracket.
  • the bracket 11B of the projection module 10 includes a bracket body 111B and further has a bearing surface 112B and a mounting groove 113B formed above the bearing surface 112B, wherein the optical element 13 is attached to the bracket
  • the supporting surface 112B of 11B supports the optical element 13 in the mounting groove 113B by the bracket body 111B.
  • the difference from the above-mentioned first preferred embodiment is that the support 11B covers the upper surface of the drive chip 15, wherein the drive chip 15 is covered by the support 11B in a thermally conductive manner, and the support 11B conducts The heat generated by the driving chip 15.
  • the bracket 11B is covered above the driving chip 15, and the driving chip 15 is further fixed to the transmitting circuit board 12 by the bracket 11B to protect the driving chip 15.
  • the bracket 11B is further provided with an accommodating cavity 110B, wherein the accommodating cavity 110B is formed under the bracket body 111B of the bracket 11B, and the driving chip 15 is The bracket body 111B covers the accommodating cavity 110B.
  • the heat generated by the driving chip 15 is conducted outward by the bracket body 111B of the bracket 11B, wherein the upper surface of the driving chip 15 is completely or partially covered by the bracket body 111B of the bracket 11B, and
  • the bracket body 111B contacts the driving chip 15 in a thermally conductive manner, so that the bracket body 111B can dissipate heat.
  • the bracket 11B is further provided with at least one thermally conductive surface 115B, wherein the thermally conductive surface 115B is formed above the accommodating cavity 110B.
  • the heat conduction surface 115B of the bracket 11B transmits the heat generated by the driving chip 15 during operation through the bracket body 111B of the bracket 11B in a manner of direct thermal contact or indirect thermal conduction. Conduction, to avoid heat accumulation in the accommodating space 101.
  • FIG. 3H shows another alternative implementation of a projection module 10 of the TOF camera module 300 of the present invention.
  • the projection module 10 includes a bracket 11, a transmitting circuit board 12 ⁇ , at least one optical element 13, at least one projection unit 14, at least one driving chip 15, and at least one electronic element 17, wherein the projection unit 14 and the The driving chip 15 is arranged on the same side of the transmitting circuit board 12.
  • the difference from the above-mentioned first preferred embodiment lies in the transmitting circuit board 12' of the projection module 10 of the TOF camera module, wherein the transmitting circuit board 12' can be molded or integrated with ceramics. It is formed by sintering, and the projection unit 14 of the projection module 10 is electrically connected to the driving chip 15 through the circuit board 12 ′.
  • the transmitting circuit board 12 ′ of the projection module 10 is also conductively connected to the electronic device main board 200.
  • the bracket 11, the projection unit 14, and the driving chip 15 of the projection module 10 are arranged above the transmitting circuit board 12 ⁇ , and the bracket 11, The overall height of the projection unit 14 and the driving chip 15. Therefore, the thickness of the transmitting circuit board 12' can be designed based on the design requirements of the TOF camera module 300, so that the height of the projection module 10 and the receiving module 20 of the TOF camera module 300 Match.
  • the transmitting circuit board 12' is an integrated ceramic circuit board formed by ceramic sintering, wherein the ceramic circuit board has good thermal conductivity, which is beneficial to improve the projection module 10's heat dissipation.
  • the material of the transmitting circuit board 12' is merely exemplary here, and not a limitation. Therefore, the transmitting circuit board 12' can also be implemented as another type of circuit board, such as an integrated molded circuit board.
  • the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently installed structures, wherein the projection module 10
  • the transmitting circuit board 12' can be integrally formed on the electronic device main board 200.
  • the transmitting circuit board 12' of the projection module 10 can also be integrally formed on the receiving module 20; or the transmitting circuit board 12' can also be integrally formed on the receiving module 20.
  • Other electrical connection devices such as a soft board, are then electrically connected to the projection module 10 to the electronic device main board 200 through the soft board.
  • the transmitting circuit board 12 ⁇ includes a transmitting circuit substrate 120 ⁇ disposed on a plurality of upper solder joints 123 ⁇ , a plurality of lower solder joints 124 ⁇ , and at least one conduction circuit 125.
  • the upper solder joint 123 ⁇ is arranged on the upper end of the transmitting circuit substrate 120 ⁇ , and at least one upper solder joint 123 ⁇ is used to be conductively connected to the projection of the projection module 10
  • at least one upper solder joint 123' is used to be conductively connected to the driving chip 15 of the projection module 10
  • at least one upper solder joint 123' is used to be conductively connected
  • the upper solder joint 123 ⁇ is electrically connected to the lower solder joint 124 ⁇ through the conduction circuit 125 ⁇ , and corresponds to the upper solder joint of the drive chip 15
  • the solder joint 123 ⁇ is electrically connected to the upper solder joint 123 ⁇ for conducting the projection unit 14 through the conduction circuit 125 ⁇ , so that the projection unit 14 and the driving chip 15 are conductively connected .
  • the conduction circuit 125 ⁇ , the upper solder joint 123 ⁇ , and the lower solder joint 124 ⁇ are integrally disposed on the transmitter circuit substrate 120 ⁇ , or are preset
  • the transmitting circuit substrate 120' is integrally formed by sintering or molding.
  • the upper solder joint 123' is embedded on the upper end surface of the transmitter circuit substrate 120 ⁇
  • the lower solder joint 124 ⁇ is embedded on the lower end surface of the transmitter circuit substrate 120 ⁇
  • the transmitting circuit substrate 120' of the transmitting circuit board 12' is preset with the conducting circuit 125' and the upper solder joint 123 before the sintering or molding process. ⁇ and the lower solder joint 124 ⁇ to ensure that the projection unit 14, the drive chip 15 and the electronic component 17 that are electrically connected to the upper solder joint 123 ⁇ can be conducted.
  • the electronic component 17 may also include active electronic components, wherein the electronic component 17 is electrically connected to the emitting circuit board 12 of the projection module 10, by means of the The electronic component 17 controls or supports the operation of the driving chip 15 of the projection module 10.
  • the electronic component 17 further includes at least one photodiode (PD), wherein the photodiode 171 is disposed on the transmitting circuit board 12, and the photodiode 171 is conductively connected to the Driver chip 15.
  • the photodiode 171 is a monitoring device for human eye safety and skin safety.
  • the photodiode 171 monitors the change of light in the projection module 10, converts the received light into a corresponding current signal, and transmits it to the driver.
  • the chip 15 is used for the driving chip 15 to control the working power of the projection unit 14 based on the monitored light change. It is understandable that once the projection is abnormal, the photodiode 171 sends a control signal to the driving chip 15 for the driving chip 15 to stop the projection work of the projection unit 14 to protect the TOF camera module 300 jobs.
  • the photodiode 171 is attached to the upper end surface 121 of the transmitting circuit board 12, and an electrode (a negative electrode) of the photodiode 171 is disposed on the upper end surface. 121.
  • the other electrode (anode) of the photodiode 171 is welded to the transmitting circuit board 12 through a wire, and the circuit board 12 is electrically connected to the electronic device main board 200 for the electronic device main board 200
  • the operation of the photodiode 171 is supported by the transmitting circuit board 12.
  • the photodiode 171 is disposed adjacent to the projection unit 14, or the projection unit 14 is attached to the transmission circuit board 12 in a manner adjacent to the photodiode 171.
  • the lead connecting the photodiode 171 is provided on the side of the photodiode 171 in a manner facing away from the projection unit 14, or is provided at the end of the photodiode 171 facing away from the projection unit 14 for The lead of the photodiode 171 is connected.
  • the lead connecting the photodiode 171 is arranged on the side away from the projection unit 14 so that the photodiode 171 and the projection unit 14 The projection unit 14 is as close as possible.
  • the lead connecting the photodiode 171 is arranged on the side not adjacent to the projection unit 14.
  • the lead connecting the photodiode 171 is arranged on the projection unit 14.
  • the lead connecting the photodiode 171 is arranged far away from the projection unit 14, which can reduce the heat generated during the operation of the projection unit 14 from being conducted to the lead.
  • the electronic component 17 further includes a negative temperature coefficient device (negative temperature coefficient, NTC) 172, wherein the negative temperature coefficient device 172 is conductively disposed on the transmitting circuit board 12.
  • the negative temperature coefficient device 172 is used to monitor the real-time temperature of the projection unit 14 and transmit the data to the driving chip 15 in real time, so that the driving chip 15 can control the projection based on the negative temperature coefficient device 172.
  • the optical element 13 is attached to the bracket 11 in an adhesive manner, wherein the projection module 10 is provided with an air escape structure, wherein the escape The air structure connects the accommodating space 101 to the external environment, so that the air escape structure guides the gas in the accommodating space 101 to the external environment during the glue drying process, and balances the accommodating space 101 and the external air pressure .
  • the air escape structure of the projection module 10 can balance the air pressure between the accommodating space 101 and the outside, so as to prevent the optical element 13 from falling off during the baking process of the projection module 10.
  • the bracket 11 is further provided with at least one painting area 110, wherein the glue is coated on the painting area 110 of the bracket 11.
  • the glue drawing area 110 is provided on the bearing surface 112 of the bracket 11, that is, glue is coated on the bearing surface 112 of the bracket 11.
  • the optical element 13 is arranged in the mounting groove 113 of the bracket 11, wherein the glue between the paint area 110 and the optical element 13 is cured to form at least one cured adhesive layer 116, and by the The cured adhesive layer 116 fixes the optical element 13 on the supporting surface 112 of the bracket 11.
  • the paste range and thickness of the cured adhesive layer 116 after curing and molding are determined by the amount of glue applied to the glue area 110 and the application range of the glue.
  • the cured adhesive layer 116 that is cured and molded blocks the gap between the bracket 11 and the optical element 13.
  • the cured adhesive layer 116 formed after the glue is cured has a certain thickness, wherein the cured adhesive layer 116 isolates the accommodating space 101 from the external environment.
  • an air escape gap 117 is formed between the unpainted glue area 110 and the optical element 13, wherein after the glue is cured, the air escape gap 117 is formed on the same part of the cured glue layer 116.
  • the air escape gap 117 connects the accommodating space 101 to the external environment.
  • the air escape gap 117 guides the interior of the accommodating space 101 The gas moves to maintain the pressure balance between the accommodating space 101 and the external environment.
  • FIG. 5A shows several different ways of painting the glue area 110.
  • three sides of the glue area 110 are coated with glue, wherein the cured glue layer 116 formed by curing the glue is formed on three sides of the glue area 110.
  • glue is applied to the three sides of the glue area 110, and the air escape gap 117 is formed above the glue area 110 where the glue is applied.
  • glue is applied to the glue drawing area 110, wherein at least one gap is provided during the glue coating process, and the air escape gap 117 is formed at the gap position after the glue is cured and formed.
  • the position where the painting glue starts and the position where the painting glue ends are not connected to form a painting glue gap; or, the glue application is interrupted during the painting process to form the painting glue gap.
  • the notch position can be set at the corner of the paint, the start position of the paint is on one side of the corner position, and the end position is on the other side of the corner position, so that one corner is less experienced when drawing a line. It should be noted that the speed of drawing glue at the corner position should be reduced. Less corners (or arcs) and more straight lines are beneficial to improve production efficiency.
  • Fig. 6 of the drawings of the specification shows the pulse waveform of the detection light signal emitted by the projection unit 14 controlled by the driving chip 15 of the projection module 10 of the present invention.
  • the driving chip 15 controls the projection unit 14 to emit the optical signal in a square wave manner. It is worth mentioning that the shorter the wiring distance between the driving chip 15 of the projection module 10 and the projection unit 14 is, the closer the pulse waveform of the optical signal projected by the projection unit 14 is In the square wave.
  • the projection unit 14 may be a vertical cavity surface emitting laser (VCSEL).
  • VCSEL vertical cavity surface emitting laser
  • FIGS 7A to 7F of the accompanying drawings of the specification of the present invention show several other alternative implementations of the projection module 10 of the TOF camera module 300, wherein the projection module 10 is connected by a soft board.
  • the projection module 10 is connected to the electronic device main board 200 in a conductive manner.
  • FIG. 7A and 7C illustrate two alternative implementations of the projection module 10 of the TOF camera module 300, wherein the projection module 10 includes a bracket 11, a transmitting circuit board 12C, and at least one optical element 13 At least one projection unit 14, at least one driving chip 15, and at least one electronic component 17, wherein the projection unit 14 and the driving chip 15 are arranged on the same side of the transmitting circuit board 12C.
  • the transmitting circuit board 12C is in conductive communication with the electronic device main board 200 through a soft board connection.
  • the projection module 10 further includes at least one flexible board 103C and a connector 102C, wherein one end of the flexible board 103C can be electrically connected to the transmitting circuit board 12C, and the other end of the flexible board 103C One end is conductively connected to the electronic device main board 200 through the connector 102C.
  • solder joints do not need to be provided under the transmitter circuit board 12C of the projection module 10, and the transmitter is conductively connected through the flexible board 103C.
  • the circuit board 12C is on the main board 200 of the electronic device.
  • the soft board 103C is a flexible circuit board, which can be bent so as to electrically connect the projection module 10 to the electronic device main board 200.
  • the transmitting circuit board 12C is conductively connected to the electronic device main board 200 through the soft board 103C.
  • the bracket 11 is attached to the upper surface of the transmitting circuit board 12C.
  • the bracket 11 can be made by injection molding or sintering, that is, the bracket 11 can be integrally formed by injection molding or sintering.
  • the bracket 11 is a ceramic sintered ceramic bracket device.
  • the connector 102C is conductively arranged above one end of the flexible board 103C.
  • the connector 102C is conductively arranged under one end of the flexible board 103C.
  • FIG. 7A and 7C illustrate two alternative implementations of the projection module 10 of the TOF camera module 300, wherein the projection module 10 includes a bracket 11, a transmitting circuit board 12C, and at least one optical element 13 At least one projection unit 14, at least one driving chip 15, and at least one electronic component 17, wherein the projection unit 14 and the driving chip 15 are arranged on the same side of the transmitting circuit board 12C.
  • the bracket 11 of the projection module 10 is a molded bracket, wherein the bracket 11 is integrally formed on the transmitting circuit board 12C through a molding process. Upper surface.
  • the projection module 10 includes a bracket 11, a transmitting circuit board 12, and at least one optical element 13. At least one projection unit 14, at least one driving chip 15, and at least one electronic component 17, wherein the projection unit 14 and the driving chip 15 are arranged on the same side of the transmitting circuit board 12.
  • the difference from the above-mentioned preferred embodiment is the manner in which the transmitting circuit board 12 of the projection module 10 is connected to the main board 200 of the electronic device.
  • the projection module 10 further includes a flexible board 103C and a connector 102C, wherein the flexible board 103C is a flexible circuit board.
  • One end of the soft board 103C is attached to the bottom of the transmitting circuit board 12, wherein the transmitting circuit board 12 is conductively connected to the soft board 103C by welding, and the soft board 103C is electrically connected to the soft board 103C.
  • the transmitting circuit board 12 is connected to the main board 200 of the electronic device.
  • the other end of the flexible board 103C is electrically connected to the connector 102C, wherein the connector 102C is conductively connected to the electronic device main board 200, and the connector 102C is conductively connected to the
  • the soft board 103C is on the main board 200 of the electronic device.
  • the structure and function of the transmitting circuit board 12 are the same as those of the above-mentioned first preferred embodiment.
  • the lower solder joint 124 of the transmitting circuit board 12 is electrically connected to one end of the soft board 103C, and the transmitting circuit board 12 is conductively connected to the electronic device main board 200 through the soft board 103C.
  • the transmitting circuit board 12 is conductively attached to the soft board 103C, and the transmitting circuit board 12 is electrically connected to the electronic device main board 200 through the soft board 103C.
  • the bracket 11 can be made by injection molding or sintering processes, that is, the bracket 11 can be integrally formed by injection molding or sintering processes.
  • the bracket 11 is arranged above the transmitting circuit board 12 in a pasting manner or an integral molding manner.
  • the TOF camera module 300D is assembled into an integrated camera module, wherein the TOF camera module 300D includes a projection module 10D and a receiving module 20D, wherein the projection module 10D is disposed adjacent to the receiving module 10D.
  • Module 20D, and the projection module 10D is conductively connected to the receiving module 20D, and the receiving module 20D controls the operation of the projection module 10D.
  • the projection module 10D is conductively disposed on the receiving module 20D, wherein the receiving module 20D is conductively connected to the electronic device main board 200, that is, the electronic device main board 200 passes through the receiving module 20D supports the operation of the projection module 10D.
  • the TOF camera module 300D may also include a frame, which is used to fix the projection module 10D and the receiving module 20D, and to hold the projection module 10 The relative position between the receiving module 20D and the receiving module 20D is fixed.
  • the receiving module 20D includes a lens assembly 21D, a photosensitive element 22D, and at least one receiving circuit board 23D.
  • the lens assembly 21D is disposed above the photosensitive element 22D.
  • the component 21D provides a photosensitive path for the photosensitive element 22D, for external light to be projected to the photosensitive element 22D through the photosensitive path.
  • the receiving circuit board 23D includes a circuit board receiving end 231D and a circuit board transmitting end 232D integrally extending from the circuit board receiving end 231D, wherein the photosensitive element 22D
  • the receiving end 231D of the circuit board is attached to the receiving circuit board 23D.
  • the projection module 10D is electrically connected to the circuit board transmitting end 232D of the receiving circuit board 23D.
  • the receiving circuit board 23D supports the projection module 10D and positions the projection module 10D and the receiving circuit board 23D. The distance between the receiving modules 20D.
  • the projection module 10D and the receiving module 20D of the TOF camera module 300D are assembled into an integrated structure, wherein when the TOF camera module 300D is installed on the electronic device main board 200 , The projection module 10D and the receiving module 20D are integrally mounted on the electronic device mainboard 200.
  • the height dimension of the projection module 10D is smaller than the height dimension of the receiving module 20D, wherein the projection module 10D is stacked on the circuit board transmitting end 232D of the receiving module 20D, thereby The upper end position of the projection module 10D is raised so that the overall height of the projection module 10D and the receiving module 20D of the TOF camera module 300 are close to each other.
  • the top of the projection module 10D and the receiving module 20D are at the same height, which is beneficial to improve the shooting quality of the TOF camera module 300D.
  • the projection module 10D includes a bracket 11D, a transmitting circuit board 12D, at least one optical element 13D, at least one projection unit 14D, at least one driving chip 15, and at least one electronic component.
  • the projection unit 14D and the driving chip 15D are arranged on the same side of the transmitting circuit board 12D.
  • the bracket 11D is disposed on the transmitting circuit board 12D, wherein the optical element 13D is attached above the bracket 11D and is located in the projection path of the projection module 10D, which is diffracted by the optical element 13D ( (Or beam expansion, shaping, etc.) the light signal projected by the projection unit 14D.
  • the bracket 11D, the transmitting circuit board 12D, and the optical element 13D of the projection module 10D are sealed to form an accommodating space 101D, wherein the projection unit 14D and the driving chip 15D are built in the enclosed space 101D.
  • the receiving module 20D of the TOF camera module 300D further includes a receiving end connector 24D, wherein one end of the receiving end connector 24D is electrically connected to the receiving module 20D.
  • the receiving circuit board 23D is conductively connected to the receiving circuit board 23D of the receiving module 20D to the electronic device main board 200 through the receiving end connector 24.
  • the projection module 10D is conductively connected to the receiving circuit board 23D of the receiving module 20D through a soft board connection.
  • the TOF camera module 300D further includes a soft board 103D, wherein the soft board 103D is conductively connected to the transmitting circuit board 12D of the projection module 10D and the receiving circuit board 23D of the receiving module 20D .
  • the soft board 103D is a flexible circuit board, wherein the soft board 103D can be turned over to electrically connect the transmitting circuit board 12D stacked above the receiving module 20D to the receiving circuit The circuit board transmitter 232D of the board 23D.
  • the TOF camera module 300D further includes a base bracket 30D, wherein the base bracket 30D is placed on the circuit board transmitting end 232D of the receiving circuit board 23D, and the base bracket 30D lifts the base bracket 30D.
  • the height of the projection module 10D is such that the height of the projection module 10D is similar to or parallel to the height of the receiving module 20D.
  • the base bracket 30D is cushioned under the transmitting circuit board 12D of the projection module 10D, and the projection module 10D is supported by the base bracket 30D.
  • the transmitting circuit board 12D of the projection module 10D is attached to the upper surface of the base bracket 30D, and the base bracket 30D fixedly overlaps the projection module 10D on the receiving circuit board 23D.
  • the circuit board transmitter 232D is used to transmitting circuit board 12D.
  • the base bracket 30D is integrally formed on the circuit board transmitting end 232D of the receiving circuit board 23D through a molding process or a sintering process.
  • the base support 30D is implemented as a molded base, wherein the base support 30D is disposed under the transmitting circuit board 12D in a thermally conductive manner, and the base support 30D conducts The heat generated by the emitting circuit board 12D is described.
  • the TOF camera module 300D further includes at least one electronic component unit 40D, wherein the electronic component unit 40D is disposed on the receiving circuit board 23D, and is used to support the projection module 10D of the TOF camera module 300D Or the receiving module 20D works.
  • the electronic component unit 40D is conductively arranged on the circuit board transmitting end 232D of the receiving circuit board 23D.
  • the electronic component unit 40D is covered by the base bracket 30D, and the electronic component unit 40D is protected by the base bracket 30D.
  • the TOF camera module 300D further includes at least one shielding cover 50D, wherein the shielding cover 50D is disposed on the transmitting module 10D, and the shielding cover 50D shields the radio frequency signal generated by the transmitting module 10D, thereby avoiding The radio frequency signal generated by the transmitting module 10D affects terminal equipment.
  • the shielding cover 50D is a metal cover, wherein the shielding cover 50D is enclosed on the outside of the transmitting module 10D. It is worth mentioning that when the bracket 11D of the transmitting module 10D is made of a material that does not have a shielding function, such as plastic or ceramic, the shielding cover 50D shields the radio frequency generated by the projection unit 14D from affecting other electronic components.
  • the electronic component unit 40D includes but is not limited to capacitors, resistors, inductors, and the like.
  • the electronic component unit 40D can reduce the parasitic inductance between the driving chip and the projection module, so as to ensure the waveform integrity of the optical signal emitted by the projection module. It is understandable that although the electronic component unit 40D can improve the pulse waveform of the light signal projected by the projection unit 14D, the electronic component unit 40D can be attached to the electronic device according to design requirements.
  • FIG. 9B shows another alternative implementation of the TOF camera module 300D of the electronic device according to the above-mentioned preferred embodiment of the present invention.
  • a base bracket 30E of the TOF camera module 300D is attached to the receiving circuit board 23D of the projection module 10D and the receiving module 20D by pasting. , To increase the height of the projection module 10D, so that the projection module 10D and the receiving module 20D have similar heights.
  • the base support 30E is integrally formed by a molding process or a sintering process, wherein the base support 30E includes a base support main body 31E, and is further provided with a support upper end surface 32E and a lower end surface 33E of a bracket, wherein the lower end surface 33E of the bracket is attached to the upper surface of the receiving circuit board 23D.
  • the transmitting circuit board 12D of the projection module 10D is arranged on the upper end surface 32E of the bracket of the base bracket 30E, and the height position of the projection module 10D is raised by the base bracket body 31E.
  • the base bracket 30E is an integrated ceramic bracket.
  • the transmitting circuit board 12D of the projection module 10D is attached to the base bracket 30E in a thermally conductive manner, wherein the transmitting circuit board 12D conducts the heat generated by the projection module 10D to the The base bracket 30E is used for heat dissipation of the base bracket 30E.
  • the base bracket 30E is further provided with an accommodating groove 34E, wherein the accommodating groove 34E is formed at the lower end of the base bracket main body 31E, and the electronic component unit 40D is held by the base bracket 30E.
  • the base bracket body 31E covers the accommodating groove 34E.
  • Fig. 9C shows another alternative implementation of the TOF camera module 300D of the electronic device according to the above preferred embodiment of the present invention.
  • the difference from the above-mentioned preferred embodiment is that the projection module 10D is conductively connected to the receiving module 20D by means of solder joint connection.
  • the TOF camera module 300D further includes a base bracket 30F, wherein the base bracket 30F is placed on the circuit board transmitting end 232D of the receiving circuit board 23D, and the base bracket 30F lifts
  • the height of the projection module 10D is such that the height of the projection module 10D is similar to or parallel to the height of the receiving module 20D.
  • the base bracket 30F is cushioned under the transmitting circuit board 12D of the projection module 10D, and the projection module 10D is supported by the base bracket 30F.
  • the transmitting circuit board 12D of the projection module 10D is attached to the upper surface of the base bracket 30F, and the base bracket 30F fixedly overlaps the projection module 10D on the receiving circuit board 23D.
  • the circuit board transmitter 232D The base bracket 30F is configured to be conductively connected to the transmitting circuit board 12D of the projection module 10D and the receiving circuit board 23D of the receiving module 20D.
  • the base support 30F includes a base support main body 31F, and at least one support conduction circuit 35F disposed on the base support main body 31F.
  • the bracket conducting circuit 35F is built into the base bracket main body 31F, wherein one end (upper end) of the bracket conducting circuit 35F is electrically connected to the transmitting circuit board 12D of the projection module 10D, and the bracket The other end (lower end) of the conducting circuit 35F is electrically connected to the receiving circuit board 23D of the receiving module 20D.
  • the base bracket 30F is conductively connected to the transmitting circuit board 12D and the circuit board transmitting end 232D of the receiving circuit board 23D.
  • the transmitting circuit board 12D of the projection module 10D has a solder joint connection structure, that is, the lower end of the transmission circuit board 12D of the projection module 10D is guided by solder joints.
  • the bracket conducting circuit 35F that is connected to the base bracket 30F in a grounded manner.
  • the base bracket 30D is integrally formed on the circuit board transmitting end 232D of the receiving circuit board 23D through a molding process or a sintering process.
  • the base support 30D is implemented as a ceramic base.
  • the transmitting circuit board 12D of the projection module 10D is attached to the base bracket 30F in a thermally conductive manner, wherein the transmitting circuit board 12D conducts the heat generated by the projection module 10D to the The base bracket 30F is used for heat dissipation from the base bracket 30F.
  • FIG. 9D shows another alternative implementation of the TOF camera module 300D of the electronic device according to the above preferred embodiment of the present invention.
  • the TOF camera module A transmitting circuit board 12G of the projection module 10D is integrally formed on the transmitting circuit board 23D of the receiving module 20D.
  • the transmitting circuit board 12G is conductively disposed on the receiving circuit board 23D, and the projection unit 14D of the projection module 10D, the driving chip 15D, and the support 11D are lifted by the transmitting circuit board 12G. Overall height.
  • the transmitting circuit board 12G is an integrated ceramic circuit board formed by sintering ceramics, wherein the ceramic circuit board has good thermal conductivity, which is beneficial to improve the projection module 10D.
  • the heat dissipation It can be understood that the material of the transmitting circuit board 12G is only taken as an example, and not a limitation. Therefore, the transmitting circuit board 12G can also be implemented as other types of circuit board types such as an integrated molded circuit board.
  • the transmitting circuit board 12G includes a transmitting circuit substrate 120G disposed on a plurality of upper solder joints 123G, a plurality of lower solder joints 124G, and at least one conducting circuit 125G, wherein the upper The solder joints 123G are arranged on the upper end of the transmitter circuit substrate 120G, at least one of the upper solder joints 123G is used to be conductively connected to the projection unit 14D of the projection module 10D, and at least one of the upper solder joints is connected to the projection unit 14D of the projection module 10D.
  • the point 123G is used to be conductively connected to the driving chip 15D of the projection module 10D, and at least one of the upper solder joints 123G is used to be conductively connected to the electronic component of the projection module 10D 17D.
  • the upper solder joint 123G is electrically connected to the lower solder joint 124G through the conduction circuit 125G, and corresponds to the upper solder joint 123G of the drive chip 15D It is electrically connected to at least one of the upper solder joints 123G through at least one of the conductive circuits 125G, wherein the upper solder joint 123G is electrically connected to an electrode of the projection unit 14D, so that the projection unit 14D and the projection unit 14D are electrically connected to each other.
  • the driving chip 15D is conductively connected.
  • the conduction circuit connecting the driving chip 15D and the projection unit 14D is arranged on the upper surface layer of the transmitting circuit substrate 120G.
  • the conduction circuit 125G, the upper solder joint 123G, and the lower solder joint 124G are integrally disposed on the transmitting circuit substrate 120G, or the conductive circuit 125G is preset
  • the transmitting circuit substrate 120G is integrally formed by sintering or molding.
  • the upper solder joint 123G is embedded in the upper end surface of the transmitter circuit substrate 120G
  • the lower solder joint 124G is embedded in the lower end surface of the transmitter circuit substrate 120G
  • the conduction circuit 125G is built-in (wrapped) On the transmitting circuit substrate 120G.
  • the transmitting circuit substrate 120G of the transmitting circuit board 12G is preset with the conduction circuit 125G, the upper solder joint 123G and the The lower solder joint 124G ensures that the projection unit 14D, the driving chip 15D and the electronic component 17D electrically connected to the upper solder joint 123G can be conducted.
  • the transmitting circuit board 12G of the projection module 10D of the preferred embodiment of the present invention is integrally formed on the receiving circuit board 23D, wherein the lower solder joint 124G is arranged to be electrically connected to The receiving circuit board 23D. It is easy for those skilled in the art to think that the projection module 10D may also be conductively disposed on the receiving circuit board 23D of the receiving module 20D in other ways, such as a flexible board connection. Exemplarily, the transmitting circuit board 12G of the projection module 10D is integrally formed on a soft board, and the projection module 10D is conductively connected to the receiving module 20D through the soft board. The receiving circuit board 23D.
  • the projection module 10D may also be conductively attached to the receiving circuit board 23D of the receiving module 20D by means of gluing, such as forming The latter projection module 10D is attached to the receiving circuit board 23D of the receiving module 20D through conductive silver glue.
  • the TOF camera module 300 of the electronic device is installed on the main board 200 of the electronic device.
  • the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently mounted on the electronic device main board 200.
  • the electronic device motherboard 200 of the electronic device may be, but is not limited to, a circuit board, wherein the projection module 10 and the receiving module 20 of the TOF camera module 300 are independent
  • the ground is electrically connected to the main board 200 of the electronic device.
  • the TOF camera module 300 can be installed on the front or back of the electronic device mainboard 200.
  • the TOF camera module is implemented as the front camera device of the electronic device;
  • the TOF camera module 300 is When installed on the back of the electronic device main board 200, the TOF camera module is implemented as a rear camera of the electronic device.
  • the position of the TOF camera module is only taken as an example, and not a limitation.
  • the electronic device main board 200 includes a main board main body 210, a land area 220 and a receiving end mounting groove 230 disposed on the main board main body 210, wherein the land area 220 is Formed on the front or back of the main board main body 210, the receiving end mounting groove 230 is formed at one end of the main board main body 210, such as the top end of the main board main body 210.
  • the projection module 10 of the TOF camera module 300 is conductively arranged on the pad area 220, wherein the transmission circuit board 12 of the projection module 10 can be connected by solder joints or a floppy disk.
  • the method is electrically connected to the main board main body 210 of the electronic device main board 200.
  • the emitting circuit board 12 of the projection module 10 is arranged in the pad area 220 in a manner that solder joints are conductive.
  • the fixing frame 30 of the TOF camera module 300 is fixed to the main board main body 210 of the electronic device mainboard 200, and the fixing frame 30 fixes and supports the receiving frame of the TOF camera module 300.
  • Module 20 After the projection module 10 of the TOF camera module 300 is fixedly installed on the main board body 210, the receiving module 20 can be adjusted based on the fixing frame 30 so that the TOF camera module The projection optical axis of the projection module 10 of the group 300 and the receiving optical axis of the receiving module 20 are adapted. In short, after the TOF camera module 300 is fixed to the electronic device main board 200, the position of the receiving module 20 in the fixing frame 30 can be adjusted to adjust the receiving module 20 to adapt to The projection module 10.
  • the receiving module 20 of the TOF camera module 300 is embeddedly mounted to the receiving end installation slot 230, wherein the receiving module 20 is conductively connected to the main board main body 210. It is understandable that the receiving module 20 is submergedly mounted to the receiving end mounting groove 230 based on a surface (front or back) of the main board main body 210 of the electronic device main board 200 to lower the receiving module The height difference between the upper end surface of 20 and the upper end of the projection module 10. It can be understood that the receiving module 20 of the TOF camera module 300 is mounted to the receiving end mounting groove 230, which is beneficial to reduce the overall thickness of the electronic device, and is beneficial to the lighter and thinner of the electronic device.
  • the electronic device mainboard 200 may also include a fixing mechanism for fixing the receiving module 20.
  • the fixing mechanism fixes the receiving device 20 to the main board main body 210 of the electronic device main board 200.
  • FIG. 10A and FIG. 10B show two different installation methods of the TOF camera module 300, that is, the pad area 220 of the electronic device main board 200 can be arranged on the side of the receiving end installation groove 230 Side (underside, right or left). Therefore, when the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently mounted on the electronic device mainboard 200, the projection module 10 and the receiving module 20 may have various types. Layout method.
  • the TOF camera module 300 of the electronic device is mounted on the electronic device mainboard 200.
  • the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently mounted on the electronic device main board 200.
  • the electronic device main board 200 includes a main board main body 210, a land area 220 and a receiving end mounting hole 230 ⁇ provided on the main board main body 210, wherein the land area 220 is formed in On the front or back of the main board main body 210, the receiving end mounting hole 230' is formed at one end of the main board main body 210, such as the top end of the main board main body 210.
  • the projection module 10 of the TOF camera module is electrically connected to the pad area 220, wherein the transmitting circuit board 12 of the projection module 10 can be connected by solder joints or a floppy disk. It is electrically connected to the main board main body 210 of the electronic device main board 200.
  • the receiving end mounting hole 230' is a through hole or half formed in the main board main body 210. Through hole.
  • the receiving module 20 of the TOF camera module 300 is embeddedly mounted to the receiving end mounting hole 230 ′, wherein the receiving module 20 is conductively connected to the main board main body 210. It is understandable that the receiving module 20 is submergedly mounted to the receiving end mounting hole 230 ⁇ based on a surface (front or back) of the main board main body 210 of the electronic device main board 200 to reduce the receiving The height difference between the upper end surface of the module 20 and the upper end of the projection module 10.
  • the projection module 10 of the TOF camera module 300 can raise the position of the projection module 10 through a bracket with a connected circuit, so that the The height of the projection module 10 and the receiving module 20 are similar.
  • the projection module 10 of the TOF camera module 300 is electrically connected to the main board from the pad area 220 of the electronic device main board 200 in a raised manner.
  • Main body 210 is electrically connected to the main board from the pad area 220 of the electronic device main board 200 in a raised manner.
  • the TOF camera module 300 of the electronic device is mounted on the electronic device mainboard 200.
  • the TOF camera module 300 assembled as a whole is mounted on the electronic device mainboard 200.
  • the electronic device mainboard 200 includes a mainboard main body 210, a land area 220 and a receiving end mounting area 230" arranged on the mainboard main body 210, wherein the land area 220 is formed On the front or back of the main board main body 210, the receiving end mounting hole 230" is formed at one end of the main board main body 210, such as the top end of the main board main body 210.
  • the projection module 10 of the TOF camera module is conductively disposed on the pad area 220, wherein the transmitting circuit board 12 of the projection module 10 can be connected by solder joints or floppy disks. It is electrically connected to the main board main body 210 of the electronic device main board 200.
  • the projection module 10 and the receiving module 20 of the TOF camera module 300 are attached to the main board main body 210 of the electronic device main board 200, wherein the pad area 220 and the receiving module
  • the end mounting area 230" is a mounting area formed on one surface of the main board main body 210. It can be understood that, in other embodiments of the present invention, the pad area 220 and the receiving end mounting area 230 ′′ are holes, grooves, half holes, etc. formed in the main board main body 210.
  • the projection module 10 and the receiving module 20 of the TOF camera module 300 can be submergedly mounted from one surface (front or back) of the main board main body 210 of the electronic device main board 200
  • the pad area 220 and the receiving end mounting area 230" are used to reduce the overall thickness of the electronic device.
  • the electronic device mainboard 200 may also include a fixed mounting mechanism for fixedly mounting the TOF camera module 300, and the TOF camera module 300 is fixedly mounted on the electronic device by the fixed mounting mechanism. Motherboard 200.
  • the difference from the above-mentioned preferred embodiment is that the projection module 10 and the receiving module 20 of the TOF camera module 300 are respectively arranged on the fixing frame 30, and by the fixing The frame 30 fixes the projection module 10 and the receiving module 20 to the electronic device main board 200.
  • the receiving module 20 is adjustably arranged on the receiving end fixing frame 31 of the fixing frame 30, and the transmitting end fixing frame 32 of the fixing frame 30 is used. To raise the height position of the transmitting module 20.
  • the projection module 10 and the receiving module 20 are fixed to the fixing frame 30 respectively, and the projection module 10 and the receiving module 20 are fixed and supported by the fixing frame 30.
  • the projection module 10 is supported by the transmitting end fixing frame 32 of the fixing frame 30 to be raised, wherein the bottom of the projection module 10 is supported by the transmitting end fixing frame. 32 is raised so that the upper end plane of the projection module 10 is flush with the receiving module 20 or is in a substantially parallel position. It is understandable that the projection module 10 is lifted by the fixing frame 30 to form a retreat space below the projection module 10, wherein the retreat space can be used to install or accommodate other electronic components.
  • the electronic component may be an electronic component supporting the TOF camera module 300, or other electronic components implemented as the electronic device.
  • the projection module 10 is mounted on the electronic device main board 200 in an elevated manner by the fixing frame 30, and the projection module 10 is elevated. , And between the electronic device mainboards 200, an escape space where other electronic components can be installed is formed to form a space overlap, which is beneficial to improve the space utilization rate.
  • the fixing frame 30 lifts the projection module 10 so that the projection module 10 is stacked on the main board 200 of the electronic device, thereby improving the space utilization rate.
  • the fixing frame 30 supports the projection module 10, and when the fixing frame 30 is a metal frame, the fixing frame 30 shields the The radio frequency signal generated by the projection module 10, that is, the fixing frame 30 made of metal can be used as a shield to shield the interference signal generated by the projection module 10. If the fixing frame is made of 30 plastic materials, at least one shielding cover 50D is provided on the outside of the projection module 10, and the radio frequency signal generated by the projection module 10 is shielded by the shielding cover.

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Abstract

本发明提供一TOF摄像模组及其投射模块和电子设备，其中所述TOF摄像模组包括一投射模块和一接收模块，其中所述投射模块的所述投射单元被所述驱动芯片控制而投射一检测光线，其中所述接收模块被邻近地设置于所述投射模块，所述接收模块接收所述检测光线的反射光线，和基于所述反射光线获得被照物体的一深度信息。所述接收模块包括一发射电路板、一支架、一光学元件、至少一投射单元以及至少一驱动芯片，其中所述驱动芯片被可导通地连接所述发射电路板，所述驱动芯片通过所述发射电路板控制所述投射单元，其中所述驱动芯片和所述投射单元位于所述发射电路板的同侧。

Description

TOF摄像模组及其投射模块和电子设备 技术领域
本发明涉及摄像模组技术领域，尤其涉及一TOF摄像模组及其投射模块和电子设备。
背景技术
随着生物识别技术，例如人脸识别技术的逐渐完善，正被广泛地应用于各类移动终端(手机、平板电脑)以实现基于生物特征的各类应用开发，比如密码解锁，快捷支付等。在人脸识别技术中，基于飞行时间法则(Time of Flight，TOF)的深度信息摄像模组，即TOF摄像模组是其中较为热门的产品之一。
TOF摄像模组，即指利用传感器发出经过调制后的光线，然后遇到物体反射后，传感器通过计算发射光线和接收到来自于物体反射的光线的时间差或者是相位差，来获得关于该物体的一深度信息。现有的TOF摄像模组，其通常包括一投射模块、一接收模块和一电路板，其中所述投射模块和所述接收模块分别直接安装并电连接于电路板。
由于目前的电子设备，比如智能手机、平板电脑等的需求是轻薄化和全面屏的发展趋势，而摄像模组的设计也趋向于小型化。现有技术的TOF摄像模组还存在下述至少一缺陷：首先，所述TOF摄像模组的投射模块投射的投射光信号的波形差。影响所述投射模块投射的投射光信号波形的主要原因是所述投射模块的驱动芯片和投射单元的走线距离，若驱动芯片与投射单元的走线距离越远则所述驱动芯片控制所述投射单元投射得到的脉冲波形成类似山峰状。
由于驱动芯片自身的尺寸较大，现有技术的TOF摄像模组的所述驱动芯片被设置于所述接收模块或叠置于所述投射模块的下方，以便于减小所述TOF摄像模组XY方向(长宽)的尺寸。但是现有这种TOF摄像模组的所述驱动芯片和所述投射单元的走线距离较长，导致投射光信号的波形较差。其次，电子设备在被组装时，所述TOF摄像模组通常被通过焊接的方式叠置在所述电子设备的电路板的上方，并且由于驱动芯片通常被叠置在所述投射模块的背面，导致现有技术的TOF摄像模组的厚度无法进一步被减小，不利于电子设备的轻薄化。另一方面，现有技术的TOF摄像模组的散热性能较差，而TOF摄像模组的所述投射模块温度过高则会影响投射单元的光功率，或影响所述TOF摄像模组的使用 寿命。
现有技术的TOF摄像模组的发射端和接收端被组装成一体后再被组装至电子设备的主板，其中所述TOF摄像模组的发射端不能够独立地使用而发射特定波形的光信号。因为，现有技术的TOF摄像模组的所述发射端由所述接收端控制，而发射预设波形的所述光信号，即控制所述发射端的驱动芯片被封装在所述接收端。现有技术的TOF摄像模组的所述发射端不是一个能够独立存在和工作的模组，即现有技术的所述发射端需要在所述接收端的控制下工作。因此，现有技术的TOF摄像模组的所述发射端不能独立的存在。
发明内容
本发明的一个主要优势在于提供一TOF摄像模组及其投射模块和电子设备，其中通过减小所述TOF摄像模组的一投射模块的驱动芯片与投射单元的走线距离，减小所述投射模块的寄生电感，提升所述投射单元投射出的光信号的脉冲波形质量，提高信噪比。
本发明的另一优势在于提供了一具有完整功能的发射端模组，所述发射端模组包括一封装于内部的驱动IC，所述发射端模组底部具有焊点，可通过底部焊点与终端主板直接导通，即发射端模组可独立于接收端模组独立工作。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模块的驱动芯片和投射单元被贴附于所述投射模块的一电路板的同侧，有利于缩短所述驱动芯片和所述投射单元之间的走线距离。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模块的所述电路板为陶瓷基板，有利于提高所述投射模块的散热性。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模块的支架为散热性支架，以通过所述支架提高所述投射模块的散热性。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模块的所述支架一体地成型于所述电路板，所述驱动芯片及部分其他电子元件被所述支架包裹，以减小所述投射模块的XY(长宽)尺寸。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模块的所述支架一体地成型于所述电路板，有利于提高所述投射模块的可靠性和整体强度。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模块的所述支架被一体地成型于所述电路板，减小所述投射模块的制造加工工艺，提高 生产效率。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模块的所述支架被一体地成型于所述电路板，所述驱动芯片被所述支架包裹，以便所述支架保护所述驱动芯片。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模块的所述支架被一体地成型于所述电路板所述驱动芯片被所述支架包裹，其中所述支架传导所述驱动芯片产生的热量，提高所述投射模块的散热性能。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述TOF摄像模组的所述投射模块和接收模块可被独立地设置于所述电子设备的主板，可基于所述电子设备的设计需求组装所述TOF摄像模组，有利于提高所述TOF摄像模组的使用性能。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述投射模组的所述驱动芯片和所述投射单元被置于同侧，以降低所述投射模块的整体厚度，有利于所述电子设备的轻薄化。
本发明的另一个优势在于提供一TOF摄像模组及其投射模块和电子设备，其中所述电子设备的主板设有对应于所述TOF摄像模组的安装槽(孔或半孔)，所述TOF摄像模组的所述接收模块被对应地嵌入至所述主板的所述安装槽(孔或半孔)，有利于降低所述电子设备整体厚度。本发明的其它优势和特点通过下述的详细说明得以充分体现并可通过所附权利要求中特地指出的手段和装置的组合得以实现。
依本发明的一个方面，能够实现前述目的和其他目的和优势的本发明的一投射模块，包括：
一发射电路板；
一支架，其中所述支架被设置于所述发射电路板；
一光学元件，其中所述光学元件被贴附于所述支架，藉由所述光学元件和所述支架在所述发射电路板的上方形成一容置空间；
至少一投射单元，其中所述投射单元被设置于所述容置空间，所述投射单元被可导通地贴附于所述发射电路板；以及
至少一驱动芯片，其中所述驱动芯片被可导通地连接所述发射电路板，所述驱动芯片通过所述发射电路板控制所述投射单元，其中所述驱动芯片和所述投射单元位于所述发射电路板的同侧。
根据本发明的一个实施例，所述发射电路板具有一上端面和一下端面，其中所述驱动芯片被以邻近于所述投射单元的方式贴附于所述发射电路板的所述上端面。
根据本发明的一个实施例，所述投射模块进一步包括一连接层，藉由所述连接层连接所述支架与所述发射电路板的所述上端面。
根据本发明的一个实施例，所述连接层选自：胶粘层、或锡焊层组成的连接层组。
根据本发明的一个实施例，所述支架以热传导的方式接触所述驱动芯片，藉由所述支架传导所述驱动芯片产生的热量。
根据本发明的一个实施例，所述支架具有一容置腔，所述驱动芯片被置于所述容置腔，所述支架以热接触的方式遮盖所述驱动芯片的上表面。
根据本发明的一个实施例，所述支架选自：陶瓷烧结支架和模塑支架组成的支架组合。
根据本发明的一个实施例，所述支架通过模塑工艺被一体地成型于所述发射电路板的所述上端面。
根据本发明的一个实施例，所述驱动芯片被所述支架覆盖，藉由所述支架传导所述驱动芯片产生的热量。
根据本发明的一个实施例，所述发射电路板包括：
一发射电路基板；
多个上焊点，其中所述上焊点被设置于所述发射电路基板的上端；
多个下焊点，其中所述下焊点被设置于所述发射电路基板的下端；以及
多个导通电路，其中所述导通电路电气连接各所述上焊点和各所述下焊点，其中所述驱动芯片通过所述上焊点和所述导通电路可导通地连接，各所述下焊点通过所述导通电路电气连接于所述上焊点。
根据本发明的一个实施例，所述投射模块进一步包括一软板和一连接器，其中所述发射电路板的所述下焊点可导通地连接于所述软板，藉由所述软板可导通地连接所述软板于所述连接器。
根据本发明的一个实施例，所述投射模块进一步包括一软板，其中所述软板的一端被可导通地连接于所述发射电路板。
根据本发明的一个实施例，所述支架包括一支架主体和进一步设有一安装槽以及至少一逃气槽，其中所述安装槽被形成于所述支架主体的上端，所述光学元件被设置于所述安装槽，所述逃气槽连通所述容置空间于外界环境，藉由所述逃气槽平衡所述容置空间与外界环境的气压。
根据本发明的一个实施例，所述支架包括一支架主体和进一步设有至少一画胶区，在所述画胶区和所述光学元件之间由胶水固化形成一固化胶层和间隔地形成一逃气缝隙，其中所述逃气缝隙连通所述容置空间于外界环境，藉由所述逃气缝隙平衡所述容置空间与外界环境的气压。
根据本发明的一个实施例，所述投射模块进一步包括至少一电气元件，其中所述电子元件被可导通地连接于所述发射电路板。
根据本发明的一个实施例，所述电子元件包括一光电二极管，用于监控所述投射模块内光线变化，所述光电二极管被可导通地连接于所述驱动芯片，以供所述驱动芯片基于所述光电二极管的检测信息控制所述投射单元的工作状态。
根据本发明的一个实施例，所述电子元件包括一负温度系数器件，所述负温度系数器件被用于监控所述投射单元的温度，所述负温度系数器件通过所述发射电路板被可导通地连接于所述驱动芯片。
根据本发明的一个实施例，所述发射电路板的所述发射电路基板选自陶瓷基板、PCB板。
根据本发明的另一方面，本发明进一步提供一TOF摄像模组，包括：
如上任一所述的投射模块，其中所述投射模块的所述投射单元被所述驱动芯片控制而投射一检测光线；和
一接收模块，其中所述接收模块被邻近地设置于所述投射模块，所述接收模块接收所述检测光线的反射光线，和基于所述反射光线获得被照物体的一深度信息。
根据本发明的一个实施例，所述投射模块和所述接收模块被相独立地设置。
根据本发明的一个实施例，所述TOF摄像模组包括一镜头组件、一感光元件、以及至少一接收电路板，其中所述感光元件被贴附于所述接收电路板，所述镜头组件基于所述感光元件的感光路径被设置于所述接收电路板的上方。
根据本发明的一个实施例，所述接收电路板包括一电路板接收端和自所述电路板接收端一体延伸的一电路板发射端，其中所述投射模块被设置于所述接收电路板的所述电路板发射端上方，所述投射模块的所述发射电路板被可导通地连接于所述接收电路板。
根据本发明的一个实施例，所述TOF摄像模组进一步包括至少一软板，其中所述软板可导通地连接所述投射模块的所述发射电路板于所述接收电路板的所述电路板发射端。
根据本发明的一个实施例，所述TOF摄像模组进一步包括至少一基座支架，其中所述基座支架被叠置于所述接收电路板的所述电路板发射端，所述投射模块被支撑在所述基座 支架上方，藉由所述基座支架提升所述投射模块的高度。
根据本发明的一个实施例，所述TOF摄像模组进一步包括至少一电子元件单元，所述电子元件单元被设置于所述电路板发射端，其中所述基座支架被一体地成型于所述电路板发射端，藉由所述基座支架包裹所述电子元件单元。
根据本发明的一个实施例，所述TOF摄像模组进一步包括至少一电子元件单元，所述电子元件单元被设置于所述电路板发射端，所述基座支架包括一基座支架主体和进一步设有至少一容置槽，其中所述容置槽被形成于所述基座支架主体的下端，所述基座支架主体被贴附于所述电路板发射端的上方，藉由所述基座支架包裹所述电子元件单元。
根据本发明的一个实施例，所述TOF摄像模组进一步包括至少一基座支架，其中所述基座支架被可导通地设置于所述接收电路板的所述电路板发射端，所述投射模块被叠置于所述基座支架的上方，藉由所述基座支架提升所述投射模块的高度。
根据本发明的一个实施例，所述基座支架包括一基座支架主体和设置于所述基座支架主体的至少一支架导通电路，其中所述支架导通电路电气连接所述投射模块的所述发射电路板于所述电路板接收端。
根据本发明的一个实施例，所述投射模块的所述发射电路板被一体地成型于所述接收电路板的所述电路板接收端，藉由所述基座支架提升所述投射模块的高度。
根据本发明的一个实施例，所述基座支架选自：陶瓷烧结而成的陶瓷支架和模塑一体成型的模塑基座组成的模塑支架。
根据本发明的一个实施例，所述TOF摄像模组进一步包括至少一固定架，其中所述接收模块被以光轴可调节的方式设置于所述固定架，藉由所述固定架固定所述接收模块。
根据本发明的一个实施例，所述固定架包括一接收端固定架和一发射端固定架，其中所述接收模块被设置于所述接收端固定架，所述投射模块被设置于发射端固定架，藉由所述固定架保持所述投射模块和所述接收模块之间的距离。
根据本发明的另一方面，本发明进一步提供一电子设备，包括：
一电子设备主机；
一电子设备主板，其中所述电子设备主板被设置于所述电子设备主机；以及
至少一TOF摄像模组，所述TOF摄像模组被可导通地设置于所述电子设备主板，所述TOF摄像模组包括：
如上任一所述的投射模块，其中所述投射模块的所述投射单元被所述驱动芯片控制而投射一检测光线；和
一接收模块，其中所述接收模块被邻近地设置于所述投射模块，所述接收模块接收所述检测光线的反射光线，和基于所述反射光线获得被照物体的一深度信息。
根据本发明的一个实施例，所述发射模块的所述下焊点导通地连接所述发射电路基板于所述电子设备主板，固定所述发射模块于所述电子设备主板。
根据本发明的一个实施例，所述投射模块和所述接收模块被相独立地设置。
根据本发明的一个实施例，所述电子设备主板包括一主板主体和设置于所述主板主体的一焊盘区以及一接收端安装槽，其中所述投射模块被贴附设置于所述电子设备主板的所述焊盘区，所述接收模块被设置于所述接收端安装槽，所述投射模块和所述接收模块分别被可导通地连接于所述主板主体。
根据本发明的一个实施例，所述接收模块自所述主板主体的一个表面下潜地安装至所述接收端安装槽。
根据本发明的一个实施例，所述电子设备主板包括一主板主体和设置于所述主板主体的一焊盘区以及一接收端安装孔，其中所述投射模块被贴附设置于所述电子设备主板的所述焊盘区，所述接收模块被设置于所述接收端安装孔，所述投射模块和所述接收模块分别被可导通地连接于所述主板主体。
依本发明的另一个方面，本发明进一步提供一电子设备，包括：
一电子设备主机；
一电子设备主板，其中所述电子设备主板被设置于所述电子设备主机；以及
如上任一所述的TOF摄像模组，其中所述被可导通地设置于所述电子设备主板。
根据本发明的一个实施例，所述电子设备主板包括一主板主体和设置于所述主板主体的一焊盘区以及一接收端安装区，其中所述TOF摄像模组的所述投射模块被贴附于所述焊盘区，所述接收模块被贴附于所述接收端安装区，所述接收模块被可导通地连接于所述主板主体。
通过对随后的描述和附图的理解，本发明进一步的目的和优势将得以充分体现。
本发明的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
图1是根据本发明的一个较佳实施例的一电子设备的整体示意图。
图2A是根据本发明上述较佳实施例的所述电子设备的一TOF摄像模组的整体示意图。
图2B是根据本发明上述较佳实施例的所述电子设备的一TOF摄像模组的整体剖视图。
图3A是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图3B是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的俯视图。
图3C是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图3D是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的另一可选实施方式的俯视图。
图3E是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图3F是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图3G是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图3H是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的另一可选实施方式的剖视图。
图4A是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的局部胶粘贴装示意透视图。
图4B是根据本发明上述较佳实施例的所述TOF摄像模组的所述投射模块的局部胶粘贴装示意剖视图。
图5A是根据本发明上述较佳实施例的所述TOF摄像模组的所述投射模块的画胶示意图。
图5B是根据本发明上述较佳实施例的所述TOF摄像模组的所述投射模块的画胶示意图。
图5C是根据本发明上述较佳实施例的所述TOF摄像模组的所述投射模块的画胶示意图。
图6是根据本发明上述较佳实施例的所述TOF摄像模组的所述投射模块投射的脉冲波形图。
图7A是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图7B是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图7C是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图7D是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图7E是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图7F是根据本发明上述较佳实施例的所述TOF摄像模组的一投射模块的剖视图。
图8是根据本发明上述较佳实施例的所述电子设备的一TOF摄像模组的整体示意图。
图9A是根据本发明上述较佳实施例的所述电子设备的一TOF摄像模组的剖视图。
图9B是根据本发明上述较佳实施例的所述电子设备的一TOF摄像模组的剖视图。
图9C是根据本发明上述较佳实施例的所述电子设备的一TOF摄像模组的剖视图。
图9D是根据本发明上述较佳实施例的所述电子设备的一TOF摄像模组的剖视图。
图10A是根据本发明上述较佳实施例的所述电子设备的所述TOF摄像模组的安装示意图。
图10B是根据本发明上述较佳实施例的所述电子设备的所述TOF摄像模组安装的剖面示意图。
图10C是根据本发明上述较佳实施例的所述电子设备的所述TOF摄像模组安装的剖面示意图。
图11A是根据本发明上述较佳实施例的所述电子设备的所述TOF摄像模组的安装示意图。
图11B是根据本发明上述较佳实施例的所述电子设备的所述TOF摄像模组安装的剖面示意图。
图11C是根据本发明上述较佳实施例的所述电子设备的所述TOF摄像模组安装的剖面示意图。
图12A是根据本发明上述较佳实施例的所述电子设备的一TOF摄像模组的安装示意图。
图12B是根据本发明上述较佳实施例的所述电子设备的所述TOF摄像模组安装的剖面示意图。
图13是根据本发明上述较佳实施例的所述电子设备的所述TOF摄像模组安装的剖面示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方 位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
参照本发明说明书附图之图1所示，依照本发明一个较佳实施例的一电子设备在接下来的描述中被阐明。所述电子设备包括一电子设备主机100、一电子设备主板200以及和至少一TOF摄像模组300，其中所述TOF摄像模组300被设置于所述电子设备主机100，所述TOF摄像模组300被可导通地连接于所述电子设备主板200，藉由所述电子设备的所述电子设备主板200支持所述TOF摄像模组300拍摄作业。可以理解的是，所述电子设备的所述电子设备主机100还可以被搭载有其它类型的摄像模组，比如广角摄像模组、长焦摄像模组等。示例性地，所述电子设备可以但不限于一智能手机、平板电脑或其他类型的具有拍摄功能的装置。
如图2A至图7F所示，所述电子设备的所述TOF摄像模组300包括一投射模块10和一接收模块20，其中所述接收模块基于所述电子设备主机100的控制信号发射光线，其中所述投射模块10发射的光线照射物体时，所述光线的反射光线被所述物体反射至所述接收模块20。基于所述投射模块10发射的所述光线和所述接收模块20接收到的所述反射光线的时间差或相位差等差异信息获得关于被照射物体的一深度信息。
所述TOF摄像模组300的所述投射模块10和所述接收模块20被电气连接于所述电子设备的所述电子设备主板200，其中所述电子设备主机100通过所述电子设备主板200控制所述TOF摄像模组300的工作状态。值得一提的是，在本发明的该优选实施例中，所述TOF摄像模组300的所述投射模块10和所述接收模块20可被独立地安装于所述电子设备主板200，即所述TOF摄像模组300的所述投射模块10和所述接收模块20可被各自分开地组装至所述电子设备主板200，并且所述投射模块10和所述接收模块20各自被导通地连接于所述电子设备主板200。可以理解的是，所述TOF摄像模组300的所述投射模块10和所述接收模块20被相互独立地安装，因此，可基于所述电子设备的设计需求安装所述TOF摄像模组300的所述投射模块10和所述接收模块20。也就是说，基于组装需求和设计需求分别独立地组装所述投射模块10和所述接收模块20，即在所述电子设备主板200组装所述投射模块10和所述接收模块20成所述TOF摄像模组300，提高所述TOF摄像 模组300的适用性。
详细地说，所述接收模块20包括一镜头组件21、一感光元件22、以及至少一接收电路板23，其中所述镜头组件21被设置于所述感光元件22的上方，藉由所述镜头组件21为所述感光元件22提供一感光路径，以供外界光线通过所述感光路径投射至所述感光元件22。所述感光元件22转化所述外界光线的光信号为对应于所述光信号对应的电信号，即光电转换。所述感光元件22被设置于所述接收电路板23的一个表面，并且所述感光元件22被可导通地连接于所述接收电路板23，藉由所述接收电路板23支持所述感光元件22工作，和接收所述感光元件22的光电信号。
所述镜头组件21包括一至少一光学镜片211、一镜架212、一基座213以及设置于所述基座213的至少一滤光元件214，其中所述光学镜片211基于所述接收模块20的所述感光路径被所述镜架212支撑于所述基座213的上方。光线经由所述光学镜片211传输至所述滤光元件214，以供所述滤光元件214对光线过滤，以滤除影响成像的杂光。本领域技术人员可以理解的是，在本发明的该优选实施例中，所述接收模块20还可以包括其它元件，比如用于支撑和固定所述镜头组件的支架、或支持所述接收模块20工作的电子元器件等元件。
如图2A和图2B所示，所述TOF摄像模组300的所述接收模块20进一步包括一接收端连接器24，其中所述接收端连接器24的一端被电气连接于所述接收模块20的所述接收电路板23，藉由所述接收端连接器24可导通地连接所述接收模块20的所述接收电路板23于所述电子设备主板200。
所述投射模块10包括一支架11、一发射电路板12、至少一光学元件13、至少一投射单元14、以及至少一驱动芯片15，其中所述投射单元14和所述驱动芯片15被设置于所述发射电路板12的同侧。所述支架11被设置于所述发射电路板12，其中所述光学元件13被贴附于所述支架11上方，并位于所述投射模块10的投射路径，藉由所述光学元件13衍射(或扩束、整形等)所述投射单元14投射的光信号。所述投射模块10的所述支架11、所述发射电路板12以及所述光学元件13密封形成一容置空间101，其中所述投射单元14和所述驱动芯片15被内置于所述封闭空间101。
所述投射单元14和所述驱动芯片15被可导通地电气连接于所述发射电路板12，其中所述驱动芯片15控制所述投射单元14投射出光信号。具体而言，所述投射单元14被所述驱动芯片15通过所述发射电路板12控制投射出的所述光信号的脉冲波形。优选地，在本发明的该优选实施例中，所述驱动芯片15被邻近地设置于所述投射单元14，以使得所 述驱动芯片15可以控制所述投射单元14投射出需求波形的光信号。
值得一提的是，所述投射单元14和所述驱动芯片15被贴附于所述发射电路板12的同侧，并且所述驱动芯片15被邻近地设置于所述投射单元14，以使得所述驱动芯片15和投射单元14之间的走线距离缩短，降低所述投射单元14的寄生电感，提高所述投射单元14投射的光信号的波形质量，以提高所述投射模块10的信噪比。优选地，在本发明的该优选实施例中，所述驱动芯片15和所述投射单元14之间的间隔距离小于等于0.5mm。
所述投射模块10的所述发射电路板12具有一上端面(正面或上表面)121和一下端面(背面或下表面)122，其中所述投射单元14和所述驱动芯片15被贴附于所述发射电路板12的所述上端面121，并且所述投射单元14被所述驱动芯片12自所述上端面121电气连接于所述发射电路板12。所述支架11被设置于所述发射电路板12的上端面121。
如图3A所示，所述支架11被贴附于所述发射电路板12的所述上端面121，所述支架11支撑所述光学元件13于所述投射模块10的所述投射路径。所述支架11通过胶粘的方式贴附于所述发射电路板12的所述上端面121。相应地，所述投射模块10进一步包括一连接层16，其中所述连接层16被设置于所述发射电路板12的所述上端面121，所述支架11于所述连接层16以粘贴的方式贴附于所述上端面121的上方。优选地，在本发明的该优选实施例中，所述连接层16可以但不限于导热胶层、锡焊层，即具有较高散热性的粘合剂，以提高所述投射模块10的散热性能。优选地，在本发明该优选实施例中，所述连接层16可以但不限于胶粘层、锡焊层等具有连接安装作用的材料。
值得一提的是，所述支架11可通过注塑或烧结等工艺制得，即所述支架11可通过注塑或烧结等工艺一体成型。优选地，在本发明的该优选实施例中，所述支架11为陶瓷烧结的陶瓷支架装置。更优选地，所述支架采用氮化铝陶瓷(Aluminum nitride，ALN)材料，由于氮化铝陶瓷材料的热导率优于其他陶瓷材料，热膨胀系数(coefficient of thermal expansion，CTE)较小，因此具有良好的散热性，有利于所述TOF模组的工作可靠性。
所述投射模块10的所述支架11包括一支架主体111和进一步具有一承载面112以及形成于所述承载面112上方的一安装槽113，其中所述光学元件13被贴附于所述支架11的所述承载面112，藉由所述支架主体111支撑所述光学元件13于所述安装槽113。优选地，所述光学元件13被以胶粘的方式贴附在所述支架11上端的所述安装槽113，即所述光学元件13被粘贴于所述支架11的所述承载面112的上方。
所述投射模块10进一步包括多个电子元件17，其中所述多个电子元件17被可导通地电气连接于所述发射电路板12，至少一所述电子元件17通过所述发射电路板12可导通地 连接于所述投射模块10的所述投射单元14，和至少一所述电子元件17通过所述发射电路板12可导通地连接于所述驱动芯片15。所述电子元件17用于支持所述投射模块10的所述投射单元14和/或所述驱动芯片15工作。在本发明的该优选实施例中，所述电子元件17被可导通地设置于所述发射电路板12的所述上端面121，所述电子元件17被内置于所述封闭空间101。
所述电子元件17可以是电阻、电容、电感等无源电子器件，所述电子元件17还可以是配合所述驱动芯片15工作的其他种类的电子器件。所述电子元件17能够降低驱动芯片15与所述投射单元14之间的寄生电感，以保证所述投射模块10所发出的所述光信号的波形接近理想方波。可以理解的是，在本发明的该优选实施例中，所述电子元件17还可被安装于所述TOF摄像模组300的其它位置，比如所述接收模块20的所述接收电路板23；或所述电子元件17被安装于所述电子设备的所述电子设备主板200，以进一步地缩小所述TOF摄像模组300的整体结构，有利于减小所述电子设备的整体体积。也就是说，所述电气元件17虽然可以改善所述投射单元14投射出的光信号的脉冲波形，但是所述电子元件17并不需要被设置于所述发射电路板12。基于所述TOF摄像模组300的设计需求或所述电子设备的整体设计需求，安装所述电子元件17于所述接收模块20的所述接收电路板23，其中所述电子元件17通过所述接收电路板23与所述发射电路板12之间的导通，而支持所述投射单元14和/或所述驱动芯片15工作；或安装所述电子元件17于所述电子设备主板200，其中所述电子元件17通过所述电子设备主板200支持所述投射单元14和/或所述驱动芯片15工作。
如图2A和图2B所示，所述TOF摄像模组300的所述投射模块10和所述接收模块20通过各自的连接器可导通地连接于所述电子设备主板200。所述TOF摄像模组300进一步包括至少一固定架30，其中所述接收模块20被可调整地设置于所述固定架30，藉由所述固定架30固定所述接收模块20于所述电子设备主板200。所述接收模块20被可导通地设置于所述电子设备主板200后，调整所述接收模块20在所述固定架30的位置，以便所述接收模块20的接收端光轴和所述投射模块10的发射端光轴相适配，以便所述TOF摄像模组300具有良好的拍摄性能。
可选地，在本发明的其他实施例中，所述TOF摄像模组300的所述投射模块10和/或接收模块20还可通过其他导通方式可导通地连接于所述电子设备主板200，比如焊接导通的方式，所述投射模块10和/或接收模块20以焊接的方式连接于所述电子设备主板200。可以理解的是，在本发明的该优选实施例中，所述TOF摄像模组300的导通连接方式在此 仅仅作为示例性的，而非限制。
值得一提的是，在本发明的该优选实施例中，所述固定架30可被用于可调整地固定和支撑所述投射模块10和所述接收模块20，或者所述固定架30被用于可调整地固定和支撑所述接收模块20，其中所述接收模块20被直接或间接地固定于所述电子设备主板200，通过调整所述接收模块20的接收端光轴，以使得所述接收端光轴适应于所述发射端光轴。
优选地，所述固定架30包括一接收端固定架31和一发射端固定架32，其中所述接收模块20被可调整地设置于所述接收端固定架31，所述投射模块10被设置于所述发射端固定架32。所述接收端固定架31包括一接收端固定架主体311和接收端调整槽312，其中所述接收模块20被所述接收端固定架主体311保持在所述接收端调整槽312。可以理解的是，在本发明的该优选实施例中，所述接收模块20被以光轴可调整地方式设置在所述接收端固定架31的所述接收端调整槽312内，通过调整所述接收模块20在所述接收端调整槽312的位置，调整所述接收模块20的所述接收端光轴，以使得所述接收模块20的光轴方向适应于所述投射模块10。
所述投射模块10被设置于所述发射端固定架32，藉由所述发射端固定架32抬高所述投射模块10的位置。值得一提的是，所述投射模块10的整体高度低于所述接收模块20的高度，通过所述固定架30的所述发射端固定架32提升所述投射模块10的整体高度，以使得所述投射模块10的上端面的高度与所述接收模块20的上端面高度相适配。
本领域技术人员可以理解的是，所述投射模块10还可被调整地设置于所述发射端固定架32，以便以调整所述投射模块10的发射端光轴的方式调整所述投射模块10在所述固定架30中的位置，以便所述投射模块10的光轴和所述接收模块20的光轴相互适配。如图3A所示，所述投射单元14被贴附于所述发射电路板12的所述上端面121，其中所述投射单元14的一个电极(负极)被设置于所述上端面121，所述投射单元14的另一电极(正极)通过引线焊接于所述发射电路板12，藉由所述电路板12电气连接于所述电子设备主板200，以供所述电子设备主板200通过所述发射电路板12支持所述投射单元14工作。另外，在本发明的该优选实施例中，所述驱动芯片15和所述电子元件17通过焊接的方式设置于所述发射电路板12的上端面121，藉由所述发射电路板12实现所述驱动芯片15与所述电子设备主板200的导通，和实现所述电子元件17与所述电子设备主板200的导通。
如图3A和图3B所示，所述投射单元14被邻近地设置于所述驱动芯片15，或者所述驱动芯片15被以邻近于所述投射单元14的方式贴附于所述发射电路板12。连接所述投射单元14的引线被以背对于所述驱动芯片15的方式设置在所述投射单元14的一侧，或者 在所述投射单元14背向于所述驱动芯片15的一端设置用于连接所述投射单元14的所述引线。简言之，为了布置所述投射单元14与所述驱动芯片15更加接近，连接所述投射单元14的所述引线被布置在远离所述驱动芯片15的一侧，以便所述投射单元14和所述驱动芯片15尽可能地靠近。可以理解的是，所述投射单元14和所述驱动芯片15的相对位置越近，则所述驱动芯片15控制所述投射单元14反射的光信号的波形越接近于理想波形，比如投射方波。
可选地，连接所述投射单元14的引线被设置在不与所述驱动芯片15相邻的一侧，比如连接所述投射单元14的引线被设置在所述驱动芯片15和所述投射单元14的同侧。可以理解的是，连接所述投射单元14的引线被设置远离所述驱动芯片15，可减少所述驱动芯片15工作时产生的热量传导至所述引线。
相应地，所述投射模块10被可导通地设置于所述电子设备主板200(或所述电子设备的电路板)，其中在本发明的该优选实施例中，所述投射模块10的所述发射电路板12通过焊接的方式导通于所述电子设备主板200。相应地，所述投射模块10的所述发射电路板12进一步包括一发射电路基板120、多个(两个或两个以上)上焊点123、至少一下焊点124以及多个导通电路125，其中所述上焊点123被设置于所述发射电路基板120的所述上端面121，所述下焊点124被设置于所述发射电路基板120的所述下端面122。所述上焊点123焊接所述投射模块10的所述投射单元14、所述驱动芯片15以及所述电子元件17于所述发射电路板12的所述上端面121。
各所述上焊点123和所述下焊点124被电气连接于所述导通电路125，以通过所述导通电路125实现所述投射模块10的所述驱动芯片15和所述发射单元14的导通连接。具体而言，所述发射电路板12的至少一导通电路125的一端连接一上焊点123，其中该上焊点123电气连接于述驱动芯片15，所述导通电路125的另一端电气连接所述上端面121的另一上焊点123，其中所述另一上焊点123电气连接于所述投射单元14的一个电极。可以理解的是，所述驱动芯片15被邻近地设置于所述投射单元14，可有效地减小所述驱动芯片15和所述投射单元14之间的布线距离，有利于提高所述驱动芯片15控制所述投射单元14发射光线的波形。
所述投射模块10的所述驱动芯片15通过所述发射电路板12的所述导通电路125驱动(控制)所述发射投射单元14工作。所述发射电路板12的至少一导通电路125的一端连接至少一焊点123，其中该上焊点123电气连接所述驱动芯片15，其中所述导通电路125的另一端电气连接一下焊点124，以实现所述电路板12的内外导通。存在至少一导通电路 125的一端电气连接于一上焊点123，其中所述上焊点123连接所述电子元件17，其中所述导通电路125的另一端电气连接一下焊点124，以实现所述电路板12的内外导通。
优选地，所述发射电路板12为陶瓷基板，其中被设置于所述发射电路板12的所述驱动芯片15、所述投射单元14以及所述电子元件17以热传导的方式将产生的热量传导至所述发射电路板12，藉由所述发射电路板12散热。可以理解的是，在本发明的该优选实施例中，所述发射电路板12的材料在此仅仅作为示例性质的，而非限制。
在本发明的该优选实施例中，所述投射模块10通过所述发射电路板12的所述下焊点124电气连接于所述电子设备主板200，以实现所述投射模块10与所述电子设备主板200的导通连接。
图3C和图3E示出了本发明上述TOF摄像模组300的一投射模块10的另一可选实施方式，其中所述投射模块10包括一支架11A、一发射电路板12、至少一光学元件13、至少一投射单元14、至少一驱动芯片15、以及至少一电子元件17，其中所述投射单元14和所述驱动芯片15被设置于所述发射电路板12的同侧。值得一提的是，与上述较佳实施例不同的是所述支架11A，其中所述支架11A被一体成型地设置于所述发射电路板12。所述支架11A通过模塑工艺一体成型于所述发射电路板12的上方，并且所述投射模块10的所述驱动芯片15被所述支架11A覆盖。
优选地，在本发明的该优选实施例中，所述支架11A为一体式模塑支架，即所述支架11A是通过模塑工艺一体地成型于所述发射电路板12的所述上端面121。所述支架11A包裹所述驱动芯片15于所述发射电路板12，或者所述驱动芯片15被覆盖在所述支架11A和所述发射电路板12。可以理解的是，所述支架11A通过模塑或烧结工艺覆盖(包裹)所述驱动芯片15，可有效减小所述投射模块10的XY(长宽)尺寸，有利于减小所述TOF摄像模组300的整体体积。可以理解的是，所述驱动芯片15被所述支架11A覆盖(包裹)，其中所述支架11A可保护所述驱动芯片15。
可以理解的是，所述驱动芯片15被焊接于所述发射电路板12的上表面后，所述支架11A通过模塑工艺覆盖(包裹)所述驱动芯片15，藉由所述支架11A进一步地固定所述驱动芯片15，提高所述投射模块10的强度(可靠性)。所述驱动芯片15被所述支架11A覆盖，其中所述驱动芯片15在工作过程中产生的热能通过热传导的方式传导至所述支架11A，以供所述支架11A散热，从而避免所述驱动投射模块10产生的热量在所述封闭空间101中堆积，影响所述投射单元14投射光信号的精度、检测距离、或影响所述TOF摄像模组300的使用寿命。简言之，所述支架11A通过模塑工艺一体地成型于所述发射电路板12， 并且所述支架11A通过热传递的方式传导所述驱动芯片15产生的热量，提高所述投射模块10的散热性能。
如图3E所示，所述支架11A进一步设有至少一逃气槽114A，其中所述逃气槽114A连通所述容置空间101于外界环境。所述光学元件13被以胶粘的方式贴附于所述支架11A的安装槽113A后，所述投射模块10被烘烤或曝光以使得所述光学元件13与所述支架11A之间的胶水(胶体)被固化。当所述光学元件13被贴附于所述支架11A时，所述逃气槽114A引导所述容置空间101内的空气流动，避免所述容置空间101内气体膨胀，而导致所述光学元件13无法被贴附在所述支架11A。优选地，所述逃气槽114A被形成于支架11A的所述支架主体111A的上端部，其中所述逃气槽114连通于所述支架11A的所述安装槽113A。因此，当所述光学元件13被安装于所述安装槽113A时，藉由所述逃气槽114A连通所述容置空间101于外界环境，以便所述逃气槽114A向外引导所述容置空间101内的空气，避免所述容置空间101内气压过大。可以理解的是，在本发明的该优选实施例中，所逃气槽114A被形成的位置和形成方式在此仅仅作为示例性质的，而非限制。更优选地，粘贴所述光学元件13的胶水被固化后，所述支架11A的所述逃气槽114被选择性地封堵，以密封所述容置空间101。
图3F或3G示出了本发明上述TOF摄像模组300的一投射模块10的另外两种可选实施方式，其中所述投射模块10包括一支架11B、一发射电路板12、至少一光学元件13、至少一投射单元14、至少一驱动芯片15、以及至少一电子元件17，其中所述投射单元14和所述驱动芯片15被设置于所述发射电路板12的同侧。值得一提的是，与上述较佳实施例不同的是所述支架11B，其中所述支架11B被以胶粘的方式设置于所述发射电路板12。值得一提的是，所述支架11B可通过注塑或烧结等工艺制得，即所述支架11B可通过注塑或烧结等工艺一体成型。优选地，在本发明的该优选实施例中，所述支架11B为陶瓷烧结的陶瓷支架。
所述投射模块10的所述支架11B包括一支架主体111B和进一步具有一承载面112B以及形成于所述承载面112B上方的一安装槽113B，其中所述光学元件13被贴附于所述支架11B的所述承载面112B，藉由所述支架主体111B支撑所述光学元件13于所述安装槽113B。与上述第一较佳实施例不同的是所述支架11B覆盖于所述驱动芯片15的上表面，其中所述驱动芯片15以热传导的方式被所述支架11B覆盖，藉由所述支架11B传导所述驱动芯片15产生的热量。换言之，所述支架11B盖合在所述驱动芯片15上方，藉由所述支架11B进一步地固定所述驱动芯片15于所述发射电路板12，以保护所述驱动芯片 15。
如图3F和图3G所示，所述支架11B进一步设有一容置腔110B，其中所述容置腔110B被形成于所述支架11B的所述支架主体111B的下方，所述驱动芯片15被所述支架主体111B覆盖在所述容置腔110B。所述驱动芯片15产生的热量被所述支架11B的所述支架主体111B向外传导，其中所述驱动芯片15的上表面被所述支架11B的所述支架主体111B全部或部分地遮盖，并且所述支架主体111B以热传导的方式接触所述驱动芯片15，以供所述支架主体111B散热。
如图3F所述，所述支架11B进一步设有至少一热传导面115B，其中所述热传导面115B被形成于所述容置腔110B的上方，当所述支架11B被安装于所述发射电路板12时，所述支架11B的所述热传导面115B以直接热接触的方式或间接地热传导的方式将所述驱动芯片15在工作时产生的热量通过所述支架11B的所述支架主体111B向外传导，避免热量在所述容置空间101内堆积。
如图3F和图3G所示，所述支架11B的上端向内延伸，其中所述支架11B的上端覆盖在所述驱动芯片15的上方，其中所述光学元件13被所述支架11B支撑于所述投射单元14的上方。也就是说，在本发明的该优选实施例中，所述支架11B的上端向内延伸，以减小所述光学元件14的尺寸大小。图3H示出了本发明上述TOF摄像模组300的一投射模块10的另一可选实施方式。所述投射模块10包括一支架11、一发射电路板12`、至少一光学元件13、至少一投射单元14、至少一驱动芯片15、以及至少一电子元件17，其中所述投射单元14和所述驱动芯片15被设置于所述发射电路板12的同侧。与上述第一较佳实施例的不同点在于所述TOF摄像模组的所述投射模块10的所述发射电路板12`，其中所述发射电路板12`可采用模塑工艺或采取陶瓷一体烧结形成，藉由所述电路板12`导通地连接所述投射模块10的所述投射单元14于所述驱动芯片15。所述投射模块10的所述发射电路板12`还被可导通地连接于所述电子设备主板200。所述投射模块10的所述支架11、所述投射单元14以及所述驱动芯片15被设置于所述发射电路板12`的上方，藉由所述发射电路板12`提高所述支架11、所述投射单元14以及所述驱动芯片15的整体高度。因此，可基于所述TOF摄像模组300的设计需求，而设计所述发射电路板12`的厚度，以使得所述TOF摄像模组300的所述投射模块10和所述接收模块20的高度相适配。
优选地，在本发明的该优选实施例中，所述发射电路板12`为陶瓷烧结形成的一体式陶瓷电路板，其中所述陶瓷电路板具有良好的热传导性，有利于提高所述投射模块10的散热性。可以理解的是，所述发射电路板12`的材质在此仅仅作为示例性质的，而非限制。因 此，所述发射电路板12`还可以被实施为其他类型的电路板类型比如一体式模塑电路板。
值得一提的是，在本发明的该优选实施例中，所述TOF摄像模组300的所述投射模块10和所述接收模块20为独立安装的结构，其中所述投射模块10的所述发射电路板12`可被一体地成型于所述电子设备主板200。本领域技术人员可以理解的是，所述投射模块10的所述发射电路板12`还可被一体地成型于所述接收模块20；或者所述发射电路板12`还可被一体地成型于其他电气连接装置，比如软板，再由所述软板电气连接所述投射模块10于所述电子设备主板200。
具体而言，所述发射电路板12`包括一发射电路基板120`设置于所述发射电路基板120`的多个上焊点123`、多个下焊点124`以及至少一导通电路125`，其中所述上焊点123`被设置于所述发射电路基板120`的上端，至少一所述上焊点123`被用于可导通地连接于所述投射模块10的所述投射单元14，至少一所述上焊点123`被用于可导通地连接于所述投射模块10的所述驱动芯片15、至少一所述上焊点123`被用于可导通地连接于所述投射模块10的所述电子元件17。与上述第一较佳实施例相同的是，所述上焊点123`通过所述导通电路125`与所述下焊点124`电气连接，并且对应于所述驱动芯片15的所述上焊点123`通过所述导通电路125`电气连接于用于导通所述投射单元14的所述上焊点123`，以使得所述投射单元14与所述驱动芯片15导通地连接。
在本发明的该优选实施例中，所述导通电路125`、所述上焊点123`以及所述下焊点124`被一体地设置于所述发射电路基板120`，或者在预设好所述导通电路125`、所述上焊点123`以及所述下焊点124`时，通过烧结或模塑的方式一体地形成所述发射电路基板120`。所述上焊点123`被嵌入至所述发射电路基板120`的上端面，所述下焊点124`被嵌入至所述发射电路基板120`的下端面，其中所述导通电路125`被内置(包裹)于所述发射电路基板120`。在本发明的该优选实施例中，所述发射电路板12`的所述发射电路基板120`在烧结或模塑的过程之前预设好所述导通电路125`、所述上焊点123`以及所述下焊点124`，以确保被电气连接于所述上焊点123`的所述投射单元14、所述驱动芯片15以及所述电子元件17可导通。
如图3A至图3D所示，所述电子元件17还可以包括有源电子元器件，其中所述电子元件17被电气连接于所述投射模块10的所述发射电路板12，藉由所述电子元件17控制或支持所述投射模块10的所述驱动芯片15工作。所述电子元件17进一步包括至少一光电二极管171(photo diode，PD)，其中所述光电二极管171被设置于所述发射电路板12，其中所述光电二极管171被可导通地连接于所述驱动芯片15。所述光电二极管171为人眼 安全和皮肤安全的监控器件，其中所述光电二极管171监控所述投射模块10内的光线变化，并将接收到的光线转换为对应的电流信号后传输至所述驱动芯片15，以供所述驱动芯片15基于监控的光线变化控制所述投射单元14的工作功率。可以理解的是，一旦投射出现异常，所述光电二极管171发出控制信号至所述驱动芯片15，以供所述驱动芯片15中止所述投射单元14的投射工作，以保护所述TOF摄像模组300工作。
如图3A和图3B所示，所述光电二极管171被贴附于所述发射电路板12的所述上端面121，其中所述光电二极管171的一个电极(负极)被设置于所述上端面121，所述光电二极管171的另一电极(正极)通过引线焊接于所述发射电路板12，藉由所述电路板12电气连接于所述电子设备主板200，以供所述电子设备主板200通过所述发射电路板12支持所述光电二极管171工作。所述光电二极管171被邻近地设置于所述投射单元14，或者所述投射单元14被以邻近于所述光电二极管171的方式贴附于所述发射电路板12。连接所述光电二极管171的引线被以背对于所述投射单元14的方式设置在所述光电二极管171的一侧，或者在所述光电二极管171背向于所述投射单元14的一端设置用于连接所述光电二极管171的所述引线。简言之，为了布置所述光电二极管171与所述投射单元14更加接近，连接所述光电二极管171的所述引线被布置在远离所述投射单元14的一侧，以便所述光电二极管171和所述投射单元14尽可能地靠近。
如图3C和图3D所示，连接所述光电二极管171的引线被设置在不与所述投射单元14相邻的一侧，比如连接所述光电二极管171的引线被设置在所述投射单元14和所述光电二极管171的同侧。可以理解的是，连接所述光电二极管171的引线被设置远离所述投射单元14，可减少所述投射单元14工作时产生的热量传导至所述引线。
如图3A至图3D所示，所述电子元件17进一步包括一负温度系数器件(negative temperature coefficient，NTC)172，其中所述负温度系数器件172被可导通地设置于所述发射电路板12。所述负温度系数器件172用于监控所述投射单元14的实时温度，并将数据实时传送给所述驱动芯片15，以供所述驱动芯片15基于所述负温度系数器件172控制所述投射单元14的工作功率。
参照本发明说明书附图之图4A至图5C所示，所述光学元件13被以胶粘的方式贴装于所述支架11，其中所述投射模块10设有逃气结构，其中所述逃气结构连通所述容置空间101于外界环境，以便在胶水干燥的过程中由所述逃气结构引导所述容置空间101内的气体至外界环境，平衡所述容置空间101与外界气压。可以理解的是，胶水在烘干过程中所述容置空间101内气压增大膨胀会容易导致贴装于所述支架11上端的所述光学元件13 脱落。所述投射模块10的逃气结构可平衡所述容置空间101与外界的气压，避免所述投射模块10在被烘烤过程中，所述光学元件13脱落。
详细地说，在本发明的该优选实施例中，所述支架11进一步设有至少一画胶区110，其中所述胶水被涂覆在所述支架11的所述画胶区110。优选地，在本发明的该优选实施例中，所述画胶区110被设置于所述支架11的所述承载面112，即胶水被涂覆在所述支架11的所述承载面112。所述光学元件13被设置于所述支架11的所述安装槽113，其中所述画胶区110与所述光学元件13之间的胶水固化而形成至少一固化胶层116，藉由所述固化胶层116固定所述光学元件13于所述支架11的所述承载面112。值得一提的是，固化成型的所述固化胶层116的粘贴范围和胶层厚度由涂覆于所述画胶区110的胶水涂胶量和胶水的涂覆范围决定。被固化成型的所述固化胶层116封堵所述支架11与所述光学元件13之间的间隙。换言之，胶水固化后形成的所述固化胶层116具有一定厚度，其中所述固化胶层116隔绝所述容置空间101与所述外界环境。
相应地，未涂胶的所述画胶区110与所述光学元件13之间形成一逃气缝隙117，其中胶水固化后，所述逃气缝隙117被形成于所述固化胶层116的同一层。所述逃气缝隙117连通所述容置空间101于外界环境，当被涂覆于所述画胶区110的胶水被烘干固化时，所述逃气缝隙117引导所述容置空间101内的气体移动，以保持所述容置空间101与外界环境的气压平衡。
如图5A至图5C，示出了所述画胶区110几种不同的画胶方式。如图5A所示，所述画胶区110的三边被涂覆胶水，其中所述胶水固化而成的所述固化胶层116被形成在所述画胶区110的三边。换言之，胶水被涂覆于所述画胶区110的三边，其中所述逃气缝隙117被形成于为涂覆胶水的画胶区域110的上方。
如图5B和图5C所示，胶水被涂覆在所述画胶区110，其中胶水涂覆过程中设置至少一缺口，所述胶水固化成型后所述缺口位置处形成所述逃气缝隙117。优选地，在胶水画胶的过程中，画胶开始和画胶结束的位置不连接而形成画胶缺口；或者，在画胶的过程中中断涂胶而形成所述画胶缺口。
在本发明的该优选实施例中，可将缺口位置设置在画胶拐角位置，画胶开始位置在拐角位置一侧，结束位置在拐角位置的另一侧，从而画线时少经历一个拐角。须知拐角位置画胶速度是要下降的，少经历拐角(或者弧线)，多走直线有利于提高生产效率。
说明书附图之图6示出了本发明的所述投射模块10的所述驱动芯片15控制所述投射单元14发射的检测光信号的脉冲波形。优选地，在本发明的该优选实施例中，所述驱动芯 片15控制所述投射单元14以方形波的方式发射所述光信号。值得一提的是，所述投射模块10的所述驱动芯片15和所述投射单元14之间的走线距离越短，则所述投射单元14投射得到的所述光信号的脉冲波形越接近于方形波。
优选地，在本发明的该优选实施例中，投射单元14可以为垂直腔面发射激光器(vertical cavity surface emitting Laser，VCSEL)。
本发明说明书附图之图7A至图7F示出了所述TOF摄像模组300的所述投射模块10的另外几种可选实施方式，其中所述投射模块10采用软板导通的方式被可导通地设置于所述电子设备主板200，即通过设置软板的方式连通所述投射模块10于所述电子设备主板200。
图7A和图7C阐释了所述TOF摄像模组300的所述投射模块10的两种可选实施方式，其中所述投射模块10包括一支架11、一发射电路板12C、至少一光学元件13、至少一投射单元14、至少一驱动芯片15、以及至少一电子元件17，其中所述投射单元14和所述驱动芯片15被设置于所述发射电路板12C的同侧。与上述较佳实施例不同的是，所述发射电路板12C通过软板连接的方式与所述电子设备主板200可导通地连通。详细地说，所述投射模块10进一步包括至少一软板103C和一连接器102C，其中所述软板103C的一端被可电气连接于所述发射电路板12C，其中所述软板103C的另一端通过所述连接器102C可导通地连接于所述电子设备主板200。
可以理解的是，本发明的该可选实施例中，所述投射模块10的所述发射电路板12C的下方不需要设置焊点，而通过所述软板103C可导通地连接所述发射电路板12C于所述电子设备主板200。
本领域技术人员可以理解的是，所述软板103C是柔性电路版，其能够被弯曲，以便于导通地连接所述投射模块10于所述电子设备主板200。所述发射电路板12C通过所述软板103C将所述发射电路板12C可导通地连接于所述电子设备主板200。
在本发明的该优选实施例中，所述支架11被以粘贴的方式设置于所述发射电路板12C的上表面。所述支架11可通过注塑或烧结等工艺制得，即所述支架11可通过注塑或烧结等工艺一体成型。优选地，在本发明的该优选实施例中，所述支架11为陶瓷烧结的陶瓷支架装置。如图7A所示，所述连接器102C被可导通地设置于所述软板103C的一端的上方。如图7C所示，所述连接器102C被可导通地设置于所述软板103C的一端的下方。
图7A和图7C阐释了所述TOF摄像模组300的所述投射模块10的两种可选实施方式，其中所述投射模块10包括一支架11、一发射电路板12C、至少一光学元件13、至少 一投射单元14、至少一驱动芯片15、以及至少一电子元件17，其中所述投射单元14和所述驱动芯片15被设置于所述发射电路板12C的同侧。与上述较佳实施例的可选实施方式不同的是，所述投射模块10的所述支架11为模塑支架，其中所述支架11通过模塑工艺一体地成型于所述发射电路板12C的上表面。
图7E和图7F阐释了所述TOF摄像模组300的所述投射模块10的另外两种可选实施方式，其中所述投射模块10包括一支架11、一发射电路板12、至少一光学元件13、至少一投射单元14、至少一驱动芯片15、以及至少一电子元件17，其中所述投射单元14和所述驱动芯片15被设置于所述发射电路板12的同侧。与上述较佳实施例不同的是，所述投射模块10的所述发射电路板12被连通于所述电子设备主板200的方式。详细地讲，所述投射模块10进一步包括一软板103C和一连接器102C，其中所述软板103C为柔性电路板。所述软板103C的一端被贴附于所述发射电路板12的下方，其中所述发射电路板12通过焊接的方式导通地连接于所述软板103C，藉由所述软板103C电气连接所述发射电路板12于所述电子设备主板200。所述软板103C的另一端被电气连接于所述连接器102C，其中所述连接器102C被可导通地连接于所述电子设备主板200，藉由所述连接器102C导通地连接所述软板103C于所述电子设备主板200。
值得一提的是，在本发明的该可选实施方式中，所述发射电路板12的结构和功能与上述第一较佳实施例相同。所述发射电路板12的所述下焊点124被电气连接于所述软板103C的一端，藉由所述软板103C可导通地连接所述发射电路板12于所述电子设备主板200。简言之，所述发射电路板12被可导通地贴附于所述软板103C，通过所述软板103C电气连接所述发射电路板12于所述电子设备主板200。
值得一提的是，在本发明的该优选实施例中，所述支架11可通过注塑或烧结等工艺制得，即所述支架11可通过注塑或烧结等工艺一体成型。所述支架11被以粘贴的方式或一体成型的方式设置于所述发射电路板12的上方。
参照本发明说明书附图之图8至图9D所示，依照本发明上述较佳实施例的所述电子设备的一TOF摄像模组300D的另一较佳实施方式在接下来的描述中被阐明。所述TOF摄像模组300D被组装成一体式的摄像模组，其中所述TOF摄像模组300D包括一投射模块10D和一接收模块20D，其中所述投射模块10D被邻近地设置于所述接收模块20D，并且所述投射模块10D被可导通地连接于所述接收模块20D，藉由所述接收模块20D控制所述投射模块10D工作。所述投射模块10D被可导通地设置于所述接收模块20D，其中所述接收模块20D被可导通地连接于所述电子设备主板200，即所述电子设备主板200 通过所述接收模块20D的支持所述投射模块10D工作。
可以理解的是，在本发明的该优选实施例中，所述TOF摄像模组300D还可以包括镜架，其用于固定所述投射模块10D和所述接收模块20D，保持所述投射模块10和所述接收模块20D之间相对位置的固定。
详细地讲，所述接收模块20D包括一镜头组件21D、一感光元件22D、以及至少一接收电路板23D，其中所述镜头组件21D被设置于所述感光元件22D的上方，藉由所述镜头组件21D为所述感光元件22D提供一感光路径，以供外界光线通过所述感光路径投射至所述感光元件22D。与上述第一较佳实施例不同的是，所述接收电路板23D包括一电路板接收端231D和自所述电路板接收端231D一体延伸的一电路板发射端232D，其中所述感光元件22D被贴附于所述接收电路板23D的所述电路板接收端231D。所述投射模块10D被可导通地设置于所述接收电路板23D的所述电路板发射端232D，藉由所述接收电路板23D支撑所述投射模块10D和定位所述投射模块10D和所述接收模块20D之间的距离。
可以理解的是，所述TOF摄像模组300D的所述投射模块10D和所述接收模块20D被组装成一体式结构，其中所述TOF摄像模组300D在被安装于所述电子设备主板200时，所述投射模块10D和所述接收模块20D被一体地安装于所述电子设备主板200。可以理解的是，所述投射模块10D在高度方向的尺寸小于所述接收模块20D的高度尺寸，其中所述投射模块10D被叠置于所述接收模块20D的所述电路板发射端232D，从而提升所述投射模块10D上端位置，使得所述TOF摄像模组300的所述投射模块10D和所述接收模块20D的整体高度接近。优选地，所述投射模块10D和所述接收模块20D顶端高度持平，有利于提高所述TOF摄像模组300D的拍摄质量。
与上述第一较佳实施例不同的是，所述投射模块10D包括一支架11D、一发射电路板12D、至少一光学元件13D、至少一投射单元14D、至少一驱动芯片15、以及至少一电子元件17D，其中所述投射单元14D和所述驱动芯片15D被设置于所述发射电路板12D的同侧。所述支架11D被设置于所述发射电路板12D，其中所述光学元件13D被贴附于所述支架11D上方，并位于所述投射模块10D的投射路径，藉由所述光学元件13D衍射(或扩束、整形等)所述投射单元14D投射的光信号。所述投射模块10D的所述支架11D、所述发射电路板12D以及所述光学元件13D密封形成一容置空间101D，其中所述投射单元14D和所述驱动芯片15D被内置于所述封闭空间101D。
如图8所示，所述TOF摄像模组300D的所述接收模块20D进一步包括一接收端连接 器24D，其中所述接收端连接器24D的一端被电气连接于所述接收模块20D的所述接收电路板23D，藉由所述接收端连接器24可导通地连接所述接收模块20D的所述接收电路板23D于所述电子设备主板200。
如图9A所示，所述投射模块10D通过软板连接的方式可导通地连接于所述接收模块20D的所述接收电路板23D。所述TOF摄像模组300D进一步包括一软板103D，其中所述软板103D的导通地连接所述投射模块10D的所述发射电路板12D于所述接收模块20D的所述接收电路板23D。可以理解的是，所述软板103D为柔性电路板，其中所述软板103D可被翻转，以便将叠置于所述接收模块20D上方的所述发射电路板12D电气连接于所述接收电路板23D的所述电路板发射端232D。
所述TOF摄像模组300D进一步包括一基座支架30D，其中所述基座支架30D被置于所述接收电路板23D的所述电路板发射端232D，藉由所述基座支架30D提升所述投射模块10D的高度，以使所述投射模块10D的高度与所述接收模块20D的高度相似或平行。相应地，所述基座支架30D被垫在所述投射模块10D的所述发射电路板12D下方，藉由所述基座支架30D支撑所述投射模块10D。所述投射模块10D的所述发射电路板12D被贴附于所述基座支架30D的上表面，所述基座支架30D固定地叠置所述投射模块10D于所述接收电路板23D的所述电路板发射端232D。
在本发明的该优选实施例中，所述基座支架30D通过模塑工艺或烧结工艺的方式被一体地成型于所述接收电路板23D的所述电路板发射端232D。优选地，所述基座支架30D被实施为一模塑基座，其中所述基座支架30D以热传导的方式设置于所述发射电路板12D的下方，藉由所述基座支架30D传导所述发射电路板12D产生的热量。
所述TOF摄像模组300D进一步包括至少一电子元件单元40D，其中所述电子元件单元40D被设置于所述接收电路板23D，其用于支持所述TOF摄像模组300D的所述投射模块10D或所述接收模块20D工作。优选地，所述电子元件单元40D被可导通地设置于所述接收电路板23D的所述电路板发射端232D。所述电子元件单元40D被所述基座支架30D覆盖，藉由所述基座支架30D保护所述电子元件单元40D。
所述TOF摄像模组300D进一步包括至少一屏蔽罩50D，其中所述屏蔽罩50D被设置于所述发射模块10D，藉由所述屏蔽罩50D屏蔽所述发射模块10D产生的射频信号，从而避免所述发射模块10D产生的所述射频信号影响终端设备。
优选地，所述屏蔽罩50D为金属罩，其中所述屏蔽罩50D被围设在所述发射模块10D的外侧。值得一提的是，所述发射模块10D的所述支架11D为塑料或陶瓷等不具备屏蔽 功能的材质时，所述屏蔽罩50D屏蔽所述投射单元14D产生的射频影响到其它电子元器件。
值得一提的是，在本发明的该优选实施例中，所述电子元件单元40D包括但不限定为电容、电阻、电感等。所述电子元件单元40D能够降低驱动芯片与所述投射模块之间的寄生电感，以保证所述投射模块所发出的所述光信号的波形完整性。可以理解的是，所述电子元件单元40D虽然可以改善所述投射单元14D投射出的光信号的脉冲波形，所述电子元件单元40D根据设计需求，可被贴附于所述电子设备的所述电子设备主板200、所述接收模块20D的所述接收电路板23D或/和所述投射模块10D的所述发射电路板12D。因此，在本发明的该优选实施例中，所述电子元件单元40D的安装位置在此仅仅作为示例性质的，而非限制。
图9B示出了本发明上述较佳实施例的所述电子设备的所述TOF摄像模组300D的另一可选实施方式。与上述可选较佳实施例不同的是，所述TOF摄像模组300D的一基座支架30E，其通过粘贴的方式被设置于所述投射模块10D和所述接收模块20D的接收电路板23D，以提高所述投射模块10D的高度，使得所述投射模块10D与所述接收模块20D具有近似的高度。
在本发明的该可选实施例中，所述基座支架30E被通过模塑工艺或烧结工艺一体成型，其中所述基座支架30E包括一基座支架主体31E，和进一步设有一支架上端面32E和一支架下端面33E，其中所述支架下端面33E被贴附于所述接收电路板23D的上表面。所述投射模块10D的所述发射电路板12D被设置于所述基座支架30E的所述支架上端面32E，藉由所述基座支架主体31E支撑并提高所述投射模块10D的高度位置。优选地，在本发明的该优选实施例中，所述基座支架30E为一体式陶瓷支架。所述投射模块10D的所述发射电路板12D被以热导通的方式贴附于所述基座支架30E，其中所述发射电路板12D将所述投射模块10D工作产生的热量传导至所述基座支架30E，以供所述基座支架30E散热。
所述基座支架30E进一步设有一容置槽34E，其中所述容置槽34E被形成于所述基座支架主体31E的下端，其中所述电子元件单元40D被所述基座支架30E的所述基座支架主体31E遮盖在所述容置槽34E。当所述基座支架30E被贴附于所述接收模块20D的所述接收电路板23D时，所述接收电路板23D的所述电路板发射端232D与所述基座支架30E密封所述基座支架30E的所述容置槽34E，其中所述电子元件单元40D被密封于所述容置槽34E。
图9C示出了本发明上述较佳实施例的所述电子设备的所述TOF摄像模组300D的另 一可选实施方式。与上述较佳实施例不同的是，所述投射模块10D通过焊点连接的方式可导通地连接于所述接收模块20D。
所述TOF摄像模组300D进一步包括一基座支架30F，其中所述基座支架30F被置于所述接收电路板23D的所述电路板发射端232D，藉由所述基座支架30F提升所述投射模块10D的高度，以使所述投射模块10D的高度与所述接收模块20D的高度相似或平行。相应地，所述基座支架30F被垫在所述投射模块10D的所述发射电路板12D下方，藉由所述基座支架30F支撑所述投射模块10D。所述投射模块10D的所述发射电路板12D被贴附于所述基座支架30F的上表面，所述基座支架30F固定地叠置所述投射模块10D于所述接收电路板23D的所述电路板发射端232D。所述基座支架30F被设置可导通地连接所述投射模块10D的所述发射电路板12D于所述接收模块20D的所述接收电路板23D。
相应地，所述基座支架30F包括一基座支架主体31F、设置于所述基座支架主体31F的至少一支架导通电路35F。所述支架导通电35F被内置于所述基座支架主体31F，其中所述支架导通电路35F的一端(上端)电气连接于所述投射模块10D的所述发射电路板12D，所述支架导通电路35F的另一端(下端)电气连接于所述接收模块20D的所述接收电路板23D。简言之，所述基座支架30F可导通地连接所述发射电路板12D于所述接收电路板23D的所述电路板发射端232D。优选地，在本发明的该优选实施例中，所述投射模块10D的所述发射电路板12D为焊点连通结构，即所述投射模块10D的所述发射电路板12D的下端通过焊点导通地连接于所述基座支架30F的所述支架导通电路35F。
在本发明的该优选实施例中，所述基座支架30D通过模塑工艺或烧结工艺的方式被一体地成型于所述接收电路板23D的所述电路板发射端232D。优选地，所述基座支架30D被实施为一陶瓷基座。所述投射模块10D的所述发射电路板12D被以热导通的方式贴附于所述基座支架30F，其中所述发射电路板12D将所述投射模块10D工作产生的热量传导至所述基座支架30F，以供所述基座支架30F散热。
图9D示出了本发明上述较佳实施例的所述电子设备的所述TOF摄像模组300D的另一可选实施方式，与上述较佳实施例不同的是，所述TOF摄像模组的所述投射模块10D的一发射电路板12G被一体地成型于所述接收模块20D的所述发射电路板23D。所述发射电路板12G被可导通地设置于所述接收电路板23D，藉由所述发射电路板12G提升所述投射模块10D的所述投射单元14D、所述驱动芯片15D以及支架11D的整体高度。
优选地，在本发明的该优选实施例中，所述发射电路板12G为陶瓷烧结形成的一体式陶瓷电路板，其中所述陶瓷电路板具有良好的热传导性，有利于提高所述投射模块10D的 散热性。可以理解的是，所述发射电路板12G的材质在此仅仅作为示例性质的，而非限制。因此，所述发射电路板12G还可以被实施为其他类型的电路板类型比如一体式模塑电路板。
详细地说，所述发射电路板12G包括一发射电路基板120G设置于所述发射电路基板120G的多个上焊点123G、多个下焊点124G以及至少一导通电路125G，其中所述上焊点123G被设置于所述发射电路基板120G的上端，至少一所述上焊点123G被用于可导通地连接于所述投射模块10D的所述投射单元14D，至少一所述上焊点123G被用于可导通地连接于所述投射模块10D的所述驱动芯片15D、至少一所述上焊点123G被用于可导通地连接于所述投射模块10D的所述电子元件17D。与上述第一较佳实施例相同的是，所述上焊点123G通过所述导通电路125G与所述下焊点124G电气连接，并且对应于所述驱动芯片15D的所述上焊点123G通过至少一所述的导通电路125G电气连接于至少一所述的上焊点123G，其中所述上焊点123G电气连接所述投射单元14D的一个电极，以使得所述投射单元14D与所述驱动芯片15D导通地连接。优选地，连接所述驱动芯片15D和所述投射单元14D的导通电路被布置在所述发射电路基板120G的上端表层。
在本发明的该优选实施例中，所述导通电路125G、所述上焊点123G以及所述下焊点124G被一体地设置于所述发射电路基板120G，或者在预设好所述导通电路125G、所述上焊点123G以及所述下焊点124G时，通过烧结或模塑的方式一体地形成所述发射电路基板120G。所述上焊点123G被嵌入至所述发射电路基板120G的上端面，所述下焊点124G被嵌入至所述发射电路基板120G的下端面，其中所述导通电路125G被内置(包裹)于所述发射电路基板120G。在本发明的该优选实施例中，所述发射电路板12G的所述发射电路基板120G在烧结或模塑的过程之前预设好所述导通电路125G、所述上焊点123G以及所述下焊点124G，以确保被电气连接于所述上焊点123G的所述投射单元14D、所述驱动芯片15D以及所述电子元件17D可导通。
值得一提的是，本发明的该优选实施例的所述投射模块10D的所述发射电路板12G被一体地成型于所述接收电路板23D，其中所述下焊点124G被设置电气连接于所述接收电路板23D。本领域技术人员很容易想到的是，所述投射模块10D还可通过其他方式可导通地设置于所述接收模块20D的所述接收电路板23D，比如通过软板连接的方式。示例性地，所述投射模块10D的所述发射电路板12G被一体地成型于一软板，藉由所述软板可导通地连接所述投射模块10D于所述接收模块20D的所述接收电路板23D。可以理解的是，在本发明的该可选实施例中，所述投射模块10D还可通过胶粘的方式可导通地贴附于所述 接收模块20D的所述接收电路板23D，比如成型后的所述投射模块10D通过导电银胶贴附于所述接收模块20D的所述接收电路板23D。
参照本发明说明书附图之图10A至图10C所示，依照本发明上述较佳实施例的所述电子设备的所述TOF摄像模组300被安装至所述电子设备主板200的一种可选实施方式。在本可选实施例方式中，所述TOF摄像模组300的所述投射模块10和所述接收模块20被独立地安装至所述电子设备主板200。本领域技术人员可以理解的是，所述电子设备的所述电子设备主板200可以但不限于一电路板，其中所述TOF摄像模组300的所述投射模块10和所述接收模块20被独立地可导通地设置于所述电子设备主板200。值得一提的是，所述TOF摄像模组300可被设置于所述电子设备主板200的正面或背面。换言之，所述TOF摄像模组300被设置于所述电子设备主板200的正面时，所述TOF摄像模组被实施为所述电子设备的前置摄像装置；当所述TOF摄像模组300被设置于所述电子设备主板200的背面时，所述TOF摄像模组被实施为所述电子设备的后置摄像装置。可以理解的是，所述TOF摄像模组的位置在此仅仅作为示例性质的，而非限制。
如图10A和图10B所示，所述电子设备主板200包括一主板主体210和设置于所述主板主体210的一焊盘区220以及一接收端安装槽230，其中所述焊盘区220被形成于所述主板主体210的正面或背面，所述接收端安装槽230被形成于所述主板主体210的一个端部，比如所述主板主体210的顶端。所述TOF摄像模组300的所述投射模块10被可导通地设置于所述焊盘区220，其中所述投射模块10的所述发射电路板12可通过焊点连接的方式或软盘连接的方式电气连接于所述电子设备主板200的所述主板主体210。优选地，在本发明的该优选实施例中，所述投射模块10的所述发射电路板12被以焊点导通的方式设置于所述焊盘区220。
所述TOF摄像模组300的所述固定架30被固定于所述电子设备主板200的所述主板主体210，藉由所述固定架30固定和支撑所述TOF摄像模组300的所述接收模块20，当所述TOF摄像模组300的所述投射模块10被固定地安装于所述主板主体210后，可基于所述固定架30调整所述接收模块20，以使得所述TOF摄像模组300的所述投射模块10的投射光轴和所述接收模块20的接收光轴相适应。简言之，当所述TOF摄像模组300被固定于所述电子设备主板200后，可通过调整所述接收模块20在所述固定架30中的位置，以调整所述接收模块20适应于所述投射模块10。
所述TOF摄像模组300的所述接收模块20被嵌入地安装至所述接收端安装槽230，其中所述接收模块20被可导通地连接于所述主板主体210。可以理解的是，所述接收模块 20基于所述电子设备主板200的所述主板主体210的一个表面(正面或背面)下潜地安装至所述接收端安装槽230，以降低所述接收模块20的上端面与所述投射模块10上端的高度差。可以理解的是，所述TOF摄像模组300的所述接收模块20被安装至所述接收端安装槽230，有利于降低所述电子设备的整体厚度，利于所述电子设备的轻薄化。
本领域技术人员应该理解的是，所述电子设备主板200还可以包括固定所述接收模块20的固定机构，当所述接收模块20被安装至所述电子设备主板200的所述接收端安装槽230时，所述固定机构固定所述接收装置20于所述电子设备主板200的所述主板主体210。
如图10A和图10B示出了所述TOF摄像模组300的两种不同安装方式，即所述电子设备主板200的所述焊盘区220可被设置于所述接收端安装槽230的侧边(下侧、右侧或左侧)。因此，所述TOF摄像模组300的所述投射模块10和所述接收模块20被各自独立地安装于所述电子设备主板200时，所述投射模块10和所述接收模块20可具有多种布置方式。
参照本发明说明书附图之图11A至图11C所示，依照本发明上述较佳实施例的所述电子设备的所述TOF摄像模组300被安装至所述电子设备主板200的另一种可选实施方式。在本可选实施例方式中，所述TOF摄像模组300的所述投射模块10和所述接收模块20被独立地安装至所述电子设备主板200。如图11A所示，所述电子设备主板200包括一主板主体210和设置于所述主板主体210的一焊盘区220以及一接收端安装孔230`，其中所述焊盘区220被形成于所述主板主体210的正面或背面，所述接收端安装孔230`被形成于所述主板主体210的一个端部，比如所述主板主体210的顶端。所述TOF摄像模组的所述投射模块10被可导通地设置于所述焊盘区220，其中所述投射模块10的所述发射电路板12可通过焊点连接的方式或软盘连接的方式电气连接于所述电子设备主板200的所述主板主体210。
如图11B和图11C所示，与上述较佳实施例不同的是，在本发明的该优选实施例中，所述接收端安装孔230`是形成于所述主板主体210的通孔或半透孔。所述TOF摄像模组300的所述接收模块20被嵌入地安装至所述接收端安装孔230`，其中所述接收模块20被可导通地连接于所述主板主体210。可以理解的是，所述接收模块20基于所述电子设备主板200的所述主板主体210的一个表面(正面或背面)下潜地安装至所述接收端安装孔230`，以降低所述接收模块20的上端面与所述投射模块10上端的高度差。
值得一提的是，在本发明的该优选实施例中，所述TOF摄像模组300的所述投射模块10可通过具有连通电路的支架垫高所述投射模块10的位置，以使所述投射模块10和所述 接收模块20的高度近似。换言之，在本发明的该优选实施例中，所述TOF摄像模组300的所述投射模块10自所述电子设备主板200的所述焊盘区220以垫高的方式电气连接于所述主板主体210。
参照本发明说明书附图之图12A至图13所示，依照本发明上述较佳实施例的所述电子设备的所述TOF摄像模组300被安装至所述电子设备主板200的另一种可选实施方式。与上述较佳实施例不同的是，在本可选实施例方式中，被组装成一体的所述TOF摄像模组300被安装至所述电子设备主板200。如图12A所示，所述电子设备主板200包括一主板主体210和设置于所述主板主体210的一焊盘区220以及一接收端安装区230``，其中所述焊盘区220被形成于所述主板主体210的正面或背面，所述接收端安装孔230``被形成于所述主板主体210的一个端部，比如所述主板主体210的顶端。所述TOF摄像模组的所述投射模块10被可导通地设置于所述焊盘区220，其中所述投射模块10的所述发射电路板12可通过焊点连接的方式或软盘连接的方式电气连接于所述电子设备主板200的所述主板主体210。
优选地，所述TOF摄像模组300的所述投射模块10和所述接收模块20被贴附于所述电子设备主板200的所述主板主体210，其中所述焊盘区220和所述接收端安装区230``是形成于所述主板主体210一个表面的贴装区域。可以理解的是，在本发明的其他实施例中，所述焊盘区220和所述接收端安装区230``是形成于所述主板主体210的孔、槽、半孔等。也就是说，所述TOF摄像模组300的所述投射模块10和所述接收模块20可自所述电子设备主板200的所述主板主体210的一个表面(正面或背面)下潜地安装至所述焊盘区220和所述接收端安装区230``，以降低所述电子设备的整体厚度。可以理解的是，所述电子设备主板200还可以包括固定安装所述TOF摄像模组300的固定安装机构，藉由所述固定安装机构固定地安装所述TOF摄像模组300于所述电子设备主板200。
如图13所示，与上述较佳实施例不同的是，所述TOF摄像模组300的所述投射模块10和所述接收模块20被分别设置于所述固定架30，藉由所述固定架30固定所述投射模块10和所述接收模块20于所述电子设备主板200。在本发明的该优选实施例中，所述接收模块20被可调整地设置于所述固定架30的所述接收端固定架31，所述固定架30的所述发射端固定架32被用于提升所述发射模块20的高度位置。
值得一提的是，所述投射模块10和所述接收模块20被分别固定于所述固定架30，藉由所述固定架30固定和支撑所述投射模块10和所述接收模块20。在本发明的该优选实施例中，所述投射模块10被所述固定架30的所述发射端固定架32支撑而被抬高，其中所 述投射模块10的底部被所述发射端固定架32抬高，以使所述投射模块10上端平面与所述接收模块20平齐或处于大致平行的位置。可以理解的是，所述投射模块10被所述固定架30抬升，在所述投射模块10的下方形成一避让空间，其中所述避让空间可被用于安装或容纳其他电子元件，其中所述电子元件可以是支持所述TOF摄像模组300的电子元器件，或者被实施为所述电子设备的其他电子元器件。简言之，在本发明的该优选实施例中，所述投射模块10被所述固定架30以抬高的方式安装在所述电子设备主板200的上方，并且所述投射模块10被抬高，而在所述电子设备主板200之间形成可以安装其他电子元件的避让空间，形成空间叠置，有利于提高空间利用率。
可以理解的是，所述固定架30抬升所述投射模块10，以便所述投射模块10被叠置于所述电子设备主板200的上方，提高空间利用率。
值得一提的是，在本发明的该优选实施例中，所述固定架30支撑所述投射模块10，其中当所述固定架30为金属材料的支架时，所述固定架30屏蔽所述投射模块10产生的射频信号，即金属材质的所述固定架30能够作为屏蔽罩屏蔽所述投射模块10产生的干扰信号。若所述固定架30位塑料材质时，所述则在所述投射模块10的外侧设置至少一屏蔽罩50D，藉由所述屏蔽罩屏蔽所述投射模块10产生的射频信号。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (41)

  1. 一投射模块，其特征在于，包括：
    一发射电路板；
    一支架，其中所述支架被设置于所述发射电路板；
    一光学元件，其中所述光学元件被贴附于所述支架，藉由所述光学元件和所述支架在所述发射电路板的上方形成一容置空间；
    至少一投射单元，其中所述投射单元被设置于所述容置空间，所述投射单元被可导通地贴附于所述发射电路板；以及
    至少一驱动芯片，其中所述驱动芯片被封装至所述容置空间，所述驱动芯片被可导通地连接于所述发射电路板，并且所述驱动芯片与所述投射单元同侧，所述驱动芯片基于所述发射电路板发送光控制信号至所述投射单元。
  2. 根据权利要求1所述的投射模块，其中所述发射电路板具有一上端面和一下端面，其中所述驱动芯片被以邻近于所述投射单元的方式贴附于所述发射电路板的所述上端面。
  3. 根据权利要求2所述的投射模块，其中所述投射模块进一步包括一连接层，藉由所述连接层连接所述支架与所述发射电路板的所述上端面。
  4. 根据权利要求3所述的投射模块，其中所述连接层选自：胶粘层、或锡焊层组成的组合。
  5. 根据权利要求3所述的投射模块，其中所述支架以热传导的方式接触所述驱动芯片，藉由所述支架传导所述驱动芯片产生的热量。
  6. 根据权利要求5所述的投射模块，其中所述支架具有一容置腔，所述驱动芯片被置于所述容置腔，所述支架以热接触的方式遮盖所述驱动芯片的上表面。
  7. 根据权利要求5所述的投射模块，其中所述支架选自：陶瓷烧结支架和模塑支架组成的支架组合。
  8. 根据权利要求2所述的投射模块，其中所述支架通过模塑工艺被一体地成型于所述发射电路板的所述上端面。
  9. 根据权利要求8所述的投射模块，其中所述驱动芯片被所述支架覆盖，藉由所述支架传导所述驱动芯片产生的热量。
  10. 根据权利要求2至9任一所述的投射模块，其中所述发射电路板包括：
    一发射电路基板；
    多个上焊点，其中所述上焊点被设置于所述发射电路基板的上端；
    多个下焊点，其中所述下焊点被设置于所述发射电路基板的下端；以及
    多个导通电路，其中所述导通电路电气连接各所述上焊点和各所述下焊点，其中所述驱动芯片通过所述上焊点和所述导通电路可导通地连接，各所述下焊点通过所述导通电路电气连接于所述上焊点。
  11. 根据权利要求10所述的投射模块，其中所述投射模块进一步包括一软板和一连接器，其中所述发射电路板的所述下焊点可导通地连接于所述软板，藉由所述软板可导通地连接所述软板于所述连接器。
  12. 根据权利要求2至9任一所述的投射模块，其中所述投射模块进一步包括一软板，其中所述软板的一端被可导通地连接于所述发射电路板。
  13. 根据权利要求2所述的投射模块，其中所述支架包括一支架主体和进一步设有一安装槽以及至少一逃气槽，其中所述安装槽被形成于所述支架主体的上端，所述光学元件被设置于所述安装槽，所述逃气槽连通所述容置空间于外界环境，藉由所述逃气槽平衡所述容置空间与外界环境的气压。
  14. 根据权利要求2所述的投射模块，其中所述支架包括一支架主体和进一步设有至少一画胶区，在所述画胶区和所述光学元件之间由胶水固化形成一固化胶层和间隔地形成一逃气缝隙，其中所述逃气缝隙连通所述容置空间于外界环境，藉由所述逃气缝隙平衡所述容置空间与外界环境的气压。
  15. 根据权利要求2所述的投射模块，其中所述投射模块进一步包括至少一电气元件，其中所述电子元件被可导通地连接于所述发射电路板。
  16. 根据权利要求15所述的投射模块，其中所述电子元件包括一光电二极管，用于监控所述投射模块内光线变化，所述光电二极管被可导通地连接于所述驱动芯片，以供所述驱动芯片基于所述光电二极管的检测信息控制所述投射单元的工作状态。
  17. 根据权利要求15所述的投射模块，其中所述电子元件包括一负温度系数器件，所述负温度系数器件被用于监控所述投射单元的温度，所述负温度系数器件通过所述发射电路板被可导通地连接于所述驱动芯片。
  18. 根据权利要求10所述的投射模块，其中所述发射电路板的所述发射电路基板选自：陶瓷基板和PCB板的组合。
  19. 一TOF摄像模组，其特征在于，包括：
    如权利要求1至10任一所述的投射模块，其中所述投射模块的所述投射单元被所述 驱动芯片控制而投射一检测光线；和
    一接收模块，其中所述接收模块被邻近地设置于所述投射模块，所述接收模块接收所述检测光线的反射光线，和基于所述反射光线获得被照物体的一深度信息。
  20. 根据权利要求19所述的TOF摄像模组，其中所述投射模块和所述接收模块被相独立地设置。
  21. 根据权利要求19所述的TOF摄像模组，其中所述TOF摄像模组包括一镜头组件、一感光元件、以及至少一接收电路板，其中所述感光元件被贴附于所述接收电路板，所述镜头组件基于所述感光元件的感光路径被设置于所述接收电路板的上方。
  22. 根据权利要求21所述的TOF摄像模组，其中所述接收电路板包括一电路板接收端和自所述电路板接收端一体延伸的一电路板发射端，其中所述投射模块被设置于所述接收电路板的所述电路板发射端上方，所述投射模块的所述发生电路板通过所述下焊点被可导通地连接于所述接收电路板。
  23. 根据权利要求22所述的TOF摄像模组，其中所述TOF摄像模组进一步包括至少一软板，其中所述软板可导通地连接所述投射模块的所述发射电路板于所述接收电路板的所述电路板发射端。
  24. 根据权利要求23所述的TOF摄像模组，其中所述TOF摄像模组进一步包括至少一基座支架，其中所述基座支架被叠置于所述接收电路板的所述电路板发射端，所述投射模块被支撑在所述基座支架上方，藉由所述基座支架提升所述投射模块的高度。
  25. 根据权利要求24所述的TOF摄像模组，其中所述TOF摄像模组进一步包括至少一电子元件单元，所述电子元件单元被设置于所述电路板发射端，其中所述基座支架被一体地成型于所述电路板发射端，藉由所述基座支架包裹所述电子元件单元。
  26. 根据权利要求24所述的TOF摄像模组，其中所述TOF摄像模组进一步包括至少一电子元件单元，所述电子元件单元被设置于所述电路板发射端，所述基座支架包括一基座支架主体和进一步设有至少一容置槽，其中所述容置槽被形成于所述基座支架主体的下端，所述基座支架主体被贴附于所述电路板发射端的上方，藉由所述基座支架包裹所述电子元件单元。
  27. 根据权利要求22所述的TOF摄像模组，其中所述TOF摄像模组进一步包括至少一基座支架，其中所述基座支架被可导通地设置于所述接收电路板的所述电路板发射端，所述投射模块被叠置于所述基座支架的上方，藉由所述基座支架提升所述投射模块的高度。
  28. 根据权利要求27所述的TOF摄像模组，其中所述基座支架包括一基座支架主体 和设置于所述基座支架主体的至少一支架导通电路，其中所述支架导通电路电气连接所述投射模块的所述发射电路板于所述电路板接收端。
  29. 根据权利要求22所述的TOF摄像模组，其中所述投射模块的所述发射电路板被一体地成型于所述接收电路板的所述电路板接收端，藉由所述基座支架提升所述投射模块的高度。
  30. 根据权利要求24、27或29所述的TOF摄像模组，其中所述基座支架选自：陶瓷烧结而成的陶瓷支架和模塑一体成型的模塑基座组成的模塑支架。
  31. 根据权利要求19至30任一所述的TOF摄像模组，其中所述TOF摄像模组进一步包括至少一固定架，其中所述接收模块被以光轴可调节的方式设置于所述固定架，藉由所述固定架固定所述接收模块。
  32. 根据权利要求31所述的TOF摄像模组，其中所述固定架包括一接收端固定架和一发射端固定架，其中所述接收模块被设置于所述接收端固定架，所述投射模块被设置于发射端固定架，藉由所述固定架保持所述投射模块和所述接收模块之间的距离。
  33. 一电子设备，其特征在于，包括：
    一电子设备主机；
    一电子设备主板，其中所述电子设备主板被设置于所述电子设备主机；以及
    至少一TOF摄像模组，所述TOF摄像模组被可导通地设置于所述电子设备主板，所述TOF摄像模组包括：
    如权利要求1至10任一所述的投射模块，其中所述投射模块的所述投射单元被所述驱动芯片控制而投射一检测光线；和
    一接收模块，其中所述接收模块被邻近地设置于所述投射模块，所述接收模块接收所述检测光线的反射光线，和基于所述反射光线获得被照物体的一深度信息。
  34. 根据权利要求33所述的电子设备，其中所述发射模块的所述下焊点导通地连接所述发射电路基板于所述电子设备主板，固定所述发射模块于所述电子设备主板。
  35. 根据权利要求33所述的电子设备，其中所述投射模块进一步包括一软板和一连接器，其中所述发射电路板的所述下焊点可导通地连接于所述软板，藉由所述软板可导通地连接所述软板于所述连接器。
  36. 根据权利要求33所述的电子设备，其中所述投射模块和所述接收模块被相独立地设置。
  37. 根据权利要求36所述的电子设备，其中所述电子设备主板包括一主板主体和设 置于所述主板主体的一焊盘区以及一接收端安装槽，其中所述投射模块被设置于所述电子设备主板的所述焊盘区，所述接收模块被设置于所述接收端安装槽，所述投射模块和所述接收模块分别被可导通地连接于所述主板主体。
  38. 根据权利要求37所述的电子设备，其中所述接收模块自所述主板主体的一个表面下潜地安装至所述接收端安装槽。
  39. 根据权利要求36所述的电子设备，其中所述电子设备主板包括一主板主体和设置于所述主板主体的一焊盘区以及一接收端安装孔，其中所述投射模块被贴附设置于所述电子设备主板的所述焊盘区，所述接收模块被设置于所述接收端安装孔，所述投射模块和所述接收模块分别被可导通地连接于所述主板主体。
  40. 一电子设备，其特征在于，包括：
    一电子设备主机；
    一电子设备主板，其中所述电子设备主板被设置于所述电子设备主机；以及
    如权利要求19至32任一所述的TOF摄像模组，其中所述被可导通地设置于所述电子设备主板。
  41. 根据权利要求40所述的电子设备，其中所述电子设备主板包括一主板主体和设置于所述主板主体的一焊盘区以及一接收端安装区，其中所述TOF摄像模组的所述投射模块被贴附于所述焊盘区，所述接收模块被贴附于所述接收端安装区，所述接收模块被可导通地连接于所述主板主体。
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