WO2021031735A1 - Electronic device housing and electronic device - Google Patents

Electronic device housing and electronic device Download PDF

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Publication number
WO2021031735A1
WO2021031735A1 PCT/CN2020/100947 CN2020100947W WO2021031735A1 WO 2021031735 A1 WO2021031735 A1 WO 2021031735A1 CN 2020100947 W CN2020100947 W CN 2020100947W WO 2021031735 A1 WO2021031735 A1 WO 2021031735A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
electronic device
base
antenna module
radiating
Prior art date
Application number
PCT/CN2020/100947
Other languages
French (fr)
Chinese (zh)
Inventor
杨自美
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021031735A1 publication Critical patent/WO2021031735A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279Improving the user comfort or ergonomics
    • H04M1/0283Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/18Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment

Definitions

  • This application relates to the technical field of electronic devices, and in particular to a housing of an electronic device and an electronic device.
  • This application proposes a housing for an electronic device, which has good mechanical properties and can improve the gain and efficiency of the antenna module.
  • This application also proposes an electronic device with the above-mentioned housing.
  • the electronic device has an antenna module, the antenna module is provided inside the housing, the housing includes a body, the body includes: a base, The base is formed with a mounting hole that penetrates the base along the thickness direction of the base; a radiating part, the radiating part is installed in the mounting hole, and the radiating part is adapted to be arranged opposite to the antenna module,
  • the dielectric constant of the radiation part is smaller than the dielectric constant of the base.
  • the structure and material selection of the housing can be made more flexible, due to the radiation set opposite to the antenna module
  • the dielectric constant of the part is small, which can reduce the loss when the signal passes through the housing.
  • the material selection of the base can be made more flexible.
  • the base can be made of materials with good mechanical properties, so that the mechanical properties of the housing can be ensured, and the gain and efficiency of the antenna module can be improved.
  • the electronic device includes: a housing, the housing being the housing of the electronic device according to the embodiment of the first aspect of the present application; a display screen assembly, the display screen assembly and the The housing is connected, an installation space is defined between the display screen assembly and the housing; a motherboard, the motherboard is arranged in the installation space, and the display screen assembly is electrically connected to the motherboard; an antenna module, an antenna The module is arranged in the installation space and is electrically connected to the main board.
  • the structure and material selection of the casing can be made more flexible, the mechanical performance of the casing can be ensured, and the gain and efficiency of the antenna module can be improved.
  • Figure 1 is a front view of a housing of an electronic device according to some embodiments of the present application.
  • FIG. 2 is a partial cross-sectional view of a housing of an electronic device according to some embodiments of the application;
  • FIG. 3 is a partial cross-sectional view of a housing of an electronic device according to other embodiments of the present application.
  • FIG. 4 is a partial cross-sectional view of a housing of an electronic device according to other embodiments of the present application.
  • FIG. 5 is a schematic diagram of the relative positions of the antenna module and the radiation part of the electronic device according to some embodiments of the present application.
  • FIG. 6 is a schematic diagram of the relative positions of the antenna module and the radiation part of the electronic device according to other embodiments of the present application.
  • Fig. 7 is a schematic diagram of an electronic device according to some embodiments of the present application.
  • Body 11 base 111; main body portion 1111; frame portion 1112; radiation portion 112; first radiation section 1121; second radiation section 1122; second step surface 1123; first step surface 113;
  • the housing 1 of the electronic device according to the embodiment of the present application is described below with reference to FIGS. 1 to 6.
  • the electronic device 100 has an antenna module 3, and the antenna module 3 is provided on the inner side of the housing 1 (the “shell “The inner side of the body 1" refers to the side of the housing 1 adjacent to the center of the electronic device 100).
  • the housing 1 includes a body 11, and the body 11 includes a base 111 and a radiation portion 112.
  • the base 111 is formed with a mounting hole extending through the base 111 along the thickness direction of the base 111, and the cross section of the mounting hole may be circular, polygonal (for example, rectangular), oval, or the like.
  • the radiating portion 112 is installed in the mounting hole, and the size of the radiating portion 112 is adapted to the mounting hole.
  • the radiating portion 112 is suitable for being disposed opposite to the antenna module 3, and the dielectric constant of the radiating portion 112 is smaller than the dielectric constant of the base 111.
  • the radiating part 112 is disposed opposite to the antenna module 3, the signal wave emitted by the antenna module 3 basically passes through the radiating part 112 and radiates outward. Since the dielectric constant of the radiating part 112 is smaller than the dielectric constant of the base 111, compared with the signal wave radiating out from the base 111, the loss caused when the antenna module 3 radiates the signal wave can be reduced, thereby improving The gain and efficiency of the antenna module 3 improve the antenna performance of the whole machine.
  • the material selection of the base 111 can be made more flexible.
  • the base 111 can be made of materials with good mechanical properties, so as to ensure the mechanical properties of the housing 1, for example, the housing 1 can have better structural strength and toughness as a whole. And so on to meet the requirements of use.
  • the external signal wave can pass through the radiating part 112 to reach the antenna module 3, and the loss caused when the signal wave passes through the housing 1 can also be reduced, so that the antenna module 3 can receive a stronger signal. Wave, improve the antenna performance of the whole machine.
  • the radiating part 112 is a non-metal part, for example, the radiating part 112 may be a ceramic part, a glass part, a resin part, or the like.
  • the material of the base 111 is not limited and only needs to meet the usage requirements.
  • the base 111 may be a metal piece, a ceramic piece, a glass piece, a resin piece, and the like.
  • the structure and material selection of the housing 1 can be made more flexible.
  • the relative dielectric constant of the radiating part 112 is small, which can reduce the loss caused when the signal passes through the housing 1.
  • the material selection of the base 111 can be made more flexible.
  • the base 111 can be made of materials with good mechanical properties, so that the mechanical properties of the housing 1 can be ensured, and the gain and efficiency of the antenna module 3 can be improved.
  • the dielectric constant of the radiation portion 112 is less than 5. Therefore, when the signal wave passes through the radiating part 112, the loss can be better reduced, and the intensity of the transmitted and received signals can be ensured.
  • the dielectric loss of the radiating portion 112 is less than the dielectric loss of the base 111. Therefore, when the dielectric constant and the dielectric loss of the radiating part 112 are both smaller than that of the base 111, the loss can be better reduced and the strength of the transmitted and received signals can be ensured.
  • the dielectric loss of the radiation portion 112 is less than 0.0005. Therefore, when the signal wave passes through the radiating part 112, the loss can be better reduced, and the intensity of the transmitted and received signals can be ensured.
  • the base 111 is a ceramic piece or a glass piece.
  • the base 111 can be made to have a higher structural strength, so that the housing 1 as a whole has a higher structural strength to meet the requirements of use.
  • the base 111 may be an aluminum silicate glass piece.
  • the base 111 can be further made to have a higher structural strength, so that the housing 1 as a whole has a higher structural strength, which meets the requirements of use.
  • the radiation portion 112 may be a glass member or a resin member.
  • the radiation portion 112 has a lower dielectric constant and dielectric loss, and the loss can be reduced when the signal wave passes through the radiation portion 112.
  • the radiation part 112 may be a quartz glass piece.
  • the radiation portion 112 has a lower dielectric constant and dielectric loss.
  • the dielectric constant of the radiation portion 112 can be as low as 3.7, and the dielectric loss of the radiation portion 112 can be as low as 0.0003.
  • the radiation part 112 may also be a PMMA resin part, a PC resin part, or a PE resin part.
  • the radiation portion 112 has a lower dielectric constant and dielectric loss, and the loss can be reduced when the signal wave passes through the radiation portion 112.
  • the dielectric constant of the radiation part 112 can be as low as 3.1.
  • the substrate 111 is an aluminosilicate glass piece
  • the radiating part 112 is a quartz glass piece.
  • the mechanical properties of the aluminosilicate glass piece are better than those of the quartz glass piece.
  • the constant and dielectric loss are lower than that of aluminosilicate glass. Therefore, the structural strength of the base 111 can be ensured to ensure the structural strength of the casing 1, and the dielectric constant and the dielectric loss of the radiating portion 112 can be lower than that of the base 111, reducing the generation of signal waves when passing through the radiating portion 112. The loss to ensure the natural performance of the whole machine.
  • the projection of the antenna module 3 on the reference surface is located within the projection of the radiating portion 112 on the reference surface.
  • the projection of the radiating portion 112 on the reference surface may be slightly larger than that of the antenna module 3 on the reference surface.
  • the projection of the reference plane which is perpendicular to the thickness direction of the radiation portion 112. Therefore, the signal waves generated by the antenna module 3 can pass through the radiating portion 112 as much as possible and pass through the base 111 as little as possible, so that the loss caused when the signal waves pass through the housing 1 can be further reduced.
  • the projection length and width of the antenna module 3 on the reference surface are 23 mm and 4.2 mm, respectively, and the projection length and width of the radiating portion 112 on the reference surface are 24 mm and 4.5 mm, respectively.
  • the base 111 includes a main body portion 1111 and a frame portion 1112 connected to one side in the thickness direction of the main body portion 1111.
  • the frame portion 1112 extends along the circumferential direction of the main body portion 1111,
  • the frame portion 1112 is formed in a ring shape, and a mounting hole for mounting the radiation portion 112 is formed on the main body portion 1111. Therefore, when the antenna module 3 and the main body portion 1111 are directly facing each other, the main body portion 1111 can be provided with a mounting hole for installing the radiating portion 112, and the radiating portion 112 can be made larger, and the signal wave penetration can be better reduced. The loss caused when passing through the shell 1.
  • the base 111 includes a main body portion 1111 and a frame portion 1112 connected to one side in the thickness direction of the main body portion 1111.
  • the frame portion 1112 extends along the circumferential direction of the main body portion 1111, and the frame portion 1112 It is formed in a ring shape, and a mounting hole for mounting the radiating portion 112 is formed on the frame portion 1112. Therefore, when the antenna module 3 and the frame portion 1112 are directly facing each other, a mounting hole for installing the radiating portion 112 can be provided on the frame portion 1112, making the position of the antenna module 3 more flexible.
  • the antenna module 3 can be installed in the electronic
  • the outer peripheral side of the main board 2 of the device 100 is beneficial to reduce the thickness of the whole machine.
  • the base 111 includes a main body 1111 and a frame 1112 connected to one side in the thickness direction of the main body 1111.
  • the frame 1112 extends along the circumferential direction of the main body 1111.
  • the frame 1112 is formed in a ring shape. Both the portion 1111 and the frame portion 1112 may be formed with mounting holes for mounting the radiating portion 112, thereby making the location of the antenna module 3 more flexible.
  • the mounting holes for mounting the radiating portion 112 are multiple (for example, two) arranged at intervals, and the number of the radiating portions 112 is the same as the number of the mounting holes And one to one correspondence.
  • the ability of the electronic device 100 to receive and transmit signals can be enhanced.
  • the radiation portion 112 and the inner wall of the mounting hole may be connected by an adhesive layer 12. Therefore, it is convenient to install and fix the radiation part 112 in the installation hole.
  • the adhesive layer 12 may be a UV adhesive layer, so that the radiation portion 112 and the base 111 can have a higher connection strength.
  • the thickness d of the adhesive layer 12 ranges from 0.03 to 0.08 mm, for example, the thickness d of the adhesive layer 12 may be 0.05 mm. Therefore, the connection strength between the radiation portion 112 and the base 111 can be ensured, and the adhesive layer 12 uses less material.
  • the base 111 and the radiation part 112 are both transparent parts.
  • the base 111 is an aluminosilicate glass part
  • the radiation part 112 is a quartz glass part
  • the radiation part 112 is between the inner wall of the mounting hole It is connected by an adhesive layer 12, where the adhesive layer 12 can be a transparent glue, so that the joint between the radiating portion 112 and the base 111 is also transparent, so that the radiating portion 112 and the base 111 are integrated in appearance and cannot be seen Dividing line.
  • the radiating portion 112 and the inner wall of the mounting hole can also be connected by welding.
  • the radiating portion 112 and the inner wall of the mounting hole can be welded by thermal welding, laser welding, or the like. Therefore, a reliable connection between the radiation portion 112 and the inner wall of the mounting hole can be achieved.
  • the material of the base 111 and the radiation portion 112 are relatively close, for example, when the base 111 is made of aluminosilicate glass and the radiation portion 112 is made of quartz glass, the radiation portion 112 and the inner wall of the mounting hole are connected by welding to make the radiation portion The connection between 112 and the base 111 is more reliable.
  • the outer surface of the radiation portion 112 and the outer surface of the corresponding part of the base 111 are located in the same plane or in the same curved surface. As a result, the outer surface of the housing 1 has a better touch and appearance.
  • the inner surface of the radiating portion 112 and the inner surface of the corresponding portion of the base 111 are located in the same plane or the same curved surface
  • the inner surface of the radiating portion 112 and the inner surface of the corresponding portion of the base 111 The surface can also be located in the same plane or the same curved surface. Therefore, the inner surface of the main body 11 is located in the same plane or the same curved surface, and the outer surface of the main body 11 is located in the same plane or the same curved surface, so that the structure of the main body 11 is simple, beautiful, and has a better tactile feel.
  • the thickness of the base 111 is 0.55 mm
  • the thickness of the radiation portion 112 is also 0.55 mm.
  • the mounting hole for installing the radiating portion 112 includes a first hole section and a second hole section with different apertures, and the aperture of the first hole section may be larger than The aperture of the second hole section.
  • the first hole section may be adjacent to the inner side of the housing 1 (the direction e in FIG. 4 is the direction toward the inner side of the housing 1), and the radiating portion 112 includes a first radiating section 1121 with different cross-sectional areas.
  • the second radiating section 1122 the cross-sectional area of the first radiating section 1121 is larger than the cross-sectional area of the second radiating section 1122, the first radiating section 1121 is fitted in the first hole section, and the second radiating section 1122 is fitted in the second hole within paragraph.
  • a first step surface 113 can be formed between the first hole section and the second hole section, and a second step surface matching the first step surface is formed between the first radiation section 1121 and the second radiation section 1122. Therefore, the connection area between the radiation portion 112 and the inner wall of the mounting hole can be increased, and the connection strength and connection reliability of the radiation portion 112 and the base 111 can be further improved.
  • the housing 1 includes a decoration layer 13 provided on at least one of the inner surface of the body 11 and the outer surface of the body 11.
  • the decorative layer 13 may be provided only on the inner surface of the body 11 (the direction e in FIG.
  • the decorative layer 13 may cover the entire inner surface of the body 11, thereby covering radiation
  • the outer boundary of the junction of 111; or, the inner surface of the body 11 and the outer surface of the body 11 are both provided with a decorative layer 13, which can cover the inner boundary of the junction of the radiating portion 112 and the base 111 and at the same time can cover the radiating portion The outer boundary of the junction of 112 and the base 111.
  • the joint between the radiating portion 112 and the base 111 can be covered to make the appearance more beautiful, and the appearance of the housing 1 can be made richer by providing the decorative layer 13 of different colors and textures.
  • the decoration layer 13 can play a role in protecting the junction between the radiation portion 112 and the base 111.
  • the decoration layer 13 may be an ink layer, a coating layer, a film layer, or the like.
  • both the base 111 and the radiating portion 112 may be transparent parts, so that the main body 11 is transparent, and the inner surface of the main body 11 can be covered with the decorative layer 13, so that the color and texture displayed by the decorative layer 13 can be seen from the appearance. Etc. to enrich the appearance of the housing 1.
  • the decoration layer 13 can cover the inner boundary line of the junction between the radiation portion 112 and the base 111, and to a certain extent, the decoration layer 13 can weaken the outer boundary line of the junction between the radiation portion 112 and the base 111.
  • the electronic device 100 includes: a housing 1, a display assembly 5, and a main board 2.
  • the housing 1 is the housing 1 of the electronic device according to the embodiment of the first aspect of the present application.
  • the display screen assembly 5 is connected to the housing 1, and an installation space is defined between the display screen assembly 5 and the housing 1.
  • the main board 2 is arranged in the installation space and the display screen assembly 5 is electrically connected to the main board 2
  • the antenna module 3 is arranged in the installation space and the antenna module 3 is electrically connected to the main board 2.
  • the antenna module 3 is a millimeter wave antenna module. Therefore, it is possible to make the signal propagation have a larger bandwidth, and improve the signal transmission quality and transmission speed.
  • 5G NR mainly uses two frequency bands: FR1 frequency band and FR2 frequency band.
  • the frequency range of FR1 band is 450MHz ⁇ 6GHz, also called sub-6GHz band; the frequency range of FR2 band is 24.25GHz ⁇ 52.6GHz, usually called millimeter wave (mm Wave).
  • mm Wave millimeter wave
  • the structure and material selection of the housing 1 can be made more flexible, the mechanical performance of the housing 1 can be ensured, and the gain and the antenna module 3 can be improved. effectiveness.
  • the electronic device 100 of the present application may be any one of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is exemplarily shown in FIG. 7).
  • the electronic device 100 may be a mobile phone or a smart phone (for example, a phone based on iPhoneTM, AndroidTM), a portable game device (for example, Nintendo DSTM, PlayStation PortableTM, Gameboy AdvanceTM, iPhoneTM), a laptop Type computers, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices, such as watches, earphones, pendants, headsets, etc.
  • the electronic device 100 can also be other wearable devices (for example, Head-mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic device 100 or smart watches).
  • HMD Head-mounted devices

Abstract

Provided are an electronic device housing (1) and an electronic device (100); the electronic device (100) has an antenna module (3), the antenna module (3) is arranged inside the housing (1), and the housing (1) comprises a body (11); the body (11) comprises: a base body (111) and a radiating part (112). The base (111) is formed having a mounting hole running through the base (111) along the direction of the thickness of the base (111); the radiating part (112) is mounted in the mounting hole, the radiating part (112) is suitable for being arranged opposite to the antenna module (3), and the dielectric constant of the radiating part (112) is smaller than the dielectric constant of the base body (111).

Description

电子设备的壳体及电子设备Shell of electronic equipment and electronic equipment
相关申请的交叉引用Cross references to related applications
本申请基于申请号为201910768138.9,申请日为2019年8月20日的中国专利申请提出,并要求该中国专利申请的优先权,该中国专利申请的全部内容在此引入本申请作为参考。This application is filed based on a Chinese patent application with the application number 201910768138.9 and the filing date on August 20, 2019, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated into this application by reference.
技术领域Technical field
本申请涉及电子设备技术领域,尤其是涉及一种电子设备的壳体及电子设备。This application relates to the technical field of electronic devices, and in particular to a housing of an electronic device and an electronic device.
背景技术Background technique
相关技术中,例如手机等电子设备的壳体,由于其结构的限制,很难同时兼顾壳体的机械性能和对信号的影响。例如,在壳体具有较好的机械性能时,信号穿过壳体时损失较大;在壳体对于信号的损失影响较小时,整个壳体的机械性能无法保证。In the related art, for the housing of electronic equipment such as mobile phones, due to its structural limitation, it is difficult to simultaneously take into account the mechanical performance of the housing and the influence on the signal. For example, when the housing has good mechanical properties, the signal will lose more when passing through the housing; when the housing has a small influence on the signal loss, the mechanical performance of the entire housing cannot be guaranteed.
发明内容Summary of the invention
本申请提出了一种电子设备的壳体,该壳体具有良好的机械性能且可以提高天线模块的增益和效率。This application proposes a housing for an electronic device, which has good mechanical properties and can improve the gain and efficiency of the antenna module.
本申请还提出了一种具有上述壳体的电子设备。This application also proposes an electronic device with the above-mentioned housing.
根据本申请第一方面实施例的电子设备的壳体,所述电子设备具有天线模块,所述天线模块设在所述壳体的内侧,所述壳体包括本体,所述本体包括:基体,所述基体上形成有沿所述基体的厚度方向贯穿所述基体的安装孔;辐射部,所述辐射部安装在所述安装孔内,所述辐射部适于与所述天线模块相对设置,所述辐射部的介电常数小于所述基体的介电常数。According to the housing of the electronic device of the embodiment of the first aspect of the present application, the electronic device has an antenna module, the antenna module is provided inside the housing, the housing includes a body, the body includes: a base, The base is formed with a mounting hole that penetrates the base along the thickness direction of the base; a radiating part, the radiating part is installed in the mounting hole, and the radiating part is adapted to be arranged opposite to the antenna module, The dielectric constant of the radiation part is smaller than the dielectric constant of the base.
根据本申请实施例的电子设备的壳体,通过将壳体的本体设置成包括介电常数不同的两个部分,可以使得壳体的结构和选材更为灵活,由于与天线模块相对设置的辐射部的介电常数较小,可以减少信号穿过壳体时产生的损失。并且,可以使得基体的选材更为灵活,例如基体可以选用机械性能好的材料制成,从而可以保证壳体的机械性能的同时,可以提高天线模块的增益和效率。According to the housing of the electronic device of the embodiment of the present application, by arranging the body of the housing to include two parts with different dielectric constants, the structure and material selection of the housing can be made more flexible, due to the radiation set opposite to the antenna module The dielectric constant of the part is small, which can reduce the loss when the signal passes through the housing. In addition, the material selection of the base can be made more flexible. For example, the base can be made of materials with good mechanical properties, so that the mechanical properties of the housing can be ensured, and the gain and efficiency of the antenna module can be improved.
根据本申请第二方面实施例的电子设备,包括:壳体,所述壳体为根据本申请上述第一方面实施例的电子设备的壳体;显示屏组件,所述显示屏组件与所述壳体相连,所述显示屏组件与所述壳体之间限定出安装空间;主板,所述主板设在所述安装空间内,所述显 示屏组件与所述主板电连接;天线模块,天线模块设在所述安装空间内且与所述主板电连接。The electronic device according to the embodiment of the second aspect of the present application includes: a housing, the housing being the housing of the electronic device according to the embodiment of the first aspect of the present application; a display screen assembly, the display screen assembly and the The housing is connected, an installation space is defined between the display screen assembly and the housing; a motherboard, the motherboard is arranged in the installation space, and the display screen assembly is electrically connected to the motherboard; an antenna module, an antenna The module is arranged in the installation space and is electrically connected to the main board.
根据本申请实施例的电子设备,通过设置上述的壳体,可以使得壳体的结构和选材更为灵活,可以保证壳体的机械性能的同时,可以提高天线模块的增益和效率。According to the electronic device of the embodiment of the present application, by providing the above-mentioned casing, the structure and material selection of the casing can be made more flexible, the mechanical performance of the casing can be ensured, and the gain and efficiency of the antenna module can be improved.
本申请的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。The additional aspects and advantages of the present application will be partially given in the following description, and some will become obvious from the following description, or be understood through the practice of the present application.
附图说明Description of the drawings
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, in which:
图1是根据本申请一些实施例的电子设备的壳体的主视图;Figure 1 is a front view of a housing of an electronic device according to some embodiments of the present application;
图2是根据本申请一些实施例的电子设备的壳体的局部剖面图;2 is a partial cross-sectional view of a housing of an electronic device according to some embodiments of the application;
图3是根据本申请另一些实施例的电子设备的壳体的局部剖面图;3 is a partial cross-sectional view of a housing of an electronic device according to other embodiments of the present application;
图4是根据本申请又一些实施例的电子设备的壳体的局部剖面图;4 is a partial cross-sectional view of a housing of an electronic device according to other embodiments of the present application;
图5是根据本申请一些实施例的电子设备的天线模块与辐射部的相对位置示意图;5 is a schematic diagram of the relative positions of the antenna module and the radiation part of the electronic device according to some embodiments of the present application;
图6是根据本申请另一些实施例的电子设备的天线模块与辐射部的相对位置示意图;6 is a schematic diagram of the relative positions of the antenna module and the radiation part of the electronic device according to other embodiments of the present application;
图7是根据本申请一些实施例的电子设备的示意图。Fig. 7 is a schematic diagram of an electronic device according to some embodiments of the present application.
附图标记:Reference signs:
电子设备100; Electronic equipment 100;
壳体1;Shell 1
本体11;基体111;主体部1111;框部1112;辐射部112;第一辐射段1121;第二辐射段1122;第二台阶面1123;第一台阶面113; Body 11; base 111; main body portion 1111; frame portion 1112; radiation portion 112; first radiation section 1121; second radiation section 1122; second step surface 1123; first step surface 113;
粘胶层12;装饰层13; Adhesive layer 12; Decoration layer 13;
主板2;天线模块3; Motherboard 2; Antenna module 3;
显示屏组件5。 Display assembly 5.
具体实施方式detailed description
下面详细描述本申请的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary, and are only used to explain the present application, and cannot be understood as a limitation to the present application.
下面参考图1-图6描述根据本申请实施例的电子设备的壳体1。The housing 1 of the electronic device according to the embodiment of the present application is described below with reference to FIGS. 1 to 6.
如图1-图6所示,根据本申请第一方面实施例的电子设备的壳体1,所述电子设备100 具有天线模块3,天线模块3设在壳体1的内侧(所述“壳体1的内侧”是指壳体1的邻近电子设备100的中心的一侧)。As shown in Figures 1 to 6, according to the housing 1 of the electronic device of the embodiment of the first aspect of the present application, the electronic device 100 has an antenna module 3, and the antenna module 3 is provided on the inner side of the housing 1 (the "shell "The inner side of the body 1" refers to the side of the housing 1 adjacent to the center of the electronic device 100).
具体而言,壳体1包括本体11,本体11包括:基体111和辐射部112。基体111上形成有沿基体111的厚度方向贯穿基体111的安装孔,安装孔的横截面可以为圆形、多边形(例如矩形)、椭圆形等。辐射部112安装在安装孔内,辐射部112的大小与安装孔相适配,辐射部112适于与天线模块3相对设置,辐射部112的介电常数小于基体111的介电常数。Specifically, the housing 1 includes a body 11, and the body 11 includes a base 111 and a radiation portion 112. The base 111 is formed with a mounting hole extending through the base 111 along the thickness direction of the base 111, and the cross section of the mounting hole may be circular, polygonal (for example, rectangular), oval, or the like. The radiating portion 112 is installed in the mounting hole, and the size of the radiating portion 112 is adapted to the mounting hole. The radiating portion 112 is suitable for being disposed opposite to the antenna module 3, and the dielectric constant of the radiating portion 112 is smaller than the dielectric constant of the base 111.
在将该壳体1用于电子设备100时,由于辐射部112与天线模块3相对设置,天线模块3发射的信号波基本穿过辐射部112向外辐射。由于辐射部112的介电常数小于基体111的介电常数,与信号波全部从基体111部分穿过向外辐射相比,可以减少天线模块3向外辐射信号波时产生的损失,从而可以提高天线模块3的增益和效率,提高整机的天线性能。并且,可以使得基体111的选材更为灵活,例如基体111可以选用机械性能好的材料制成,从而可以保证壳体1的机械性能,例如可以使得壳体1整体具有较好的结构强度、韧性等,满足使用要求。When the housing 1 is used in the electronic device 100, since the radiating part 112 is disposed opposite to the antenna module 3, the signal wave emitted by the antenna module 3 basically passes through the radiating part 112 and radiates outward. Since the dielectric constant of the radiating part 112 is smaller than the dielectric constant of the base 111, compared with the signal wave radiating out from the base 111, the loss caused when the antenna module 3 radiates the signal wave can be reduced, thereby improving The gain and efficiency of the antenna module 3 improve the antenna performance of the whole machine. In addition, the material selection of the base 111 can be made more flexible. For example, the base 111 can be made of materials with good mechanical properties, so as to ensure the mechanical properties of the housing 1, for example, the housing 1 can have better structural strength and toughness as a whole. And so on to meet the requirements of use.
当然,在天线模块3接收信号时,外部信号波可以穿过辐射部112到达天线模块3,也可以减少信号波穿过壳体1时产生的损失,使得天线模块3可以接收到较强的信号波,提高整机的天线性能。Of course, when the antenna module 3 receives a signal, the external signal wave can pass through the radiating part 112 to reach the antenna module 3, and the loss caused when the signal wave passes through the housing 1 can also be reduced, so that the antenna module 3 can receive a stronger signal. Wave, improve the antenna performance of the whole machine.
需要说明的是,辐射部112为非金属件,例如辐射部112可以为陶瓷件、玻璃件、树脂件等。基体111的材料不作限制,满足使用要求即可,例如基体111可以为金属件、陶瓷件、玻璃件、树脂件等。It should be noted that the radiating part 112 is a non-metal part, for example, the radiating part 112 may be a ceramic part, a glass part, a resin part, or the like. The material of the base 111 is not limited and only needs to meet the usage requirements. For example, the base 111 may be a metal piece, a ceramic piece, a glass piece, a resin piece, and the like.
根据本申请实施例的电子设备的壳体1,通过将壳体1的本体11设置成包括介电常数不同的两个部分,可以使得壳体1的结构和选材更为灵活,由于与天线模块3相对设置的辐射部112的介电常数较小,可以减少信号穿过壳体1时产生的损失。并且,可以使得基体111的选材更为灵活,例如基体111可以选用机械性能好的材料制成,从而可以保证壳体1的机械性能的同时,可以提高天线模块3的增益和效率。According to the housing 1 of the electronic device of the embodiment of the present application, by setting the body 11 of the housing 1 to include two parts with different dielectric constants, the structure and material selection of the housing 1 can be made more flexible. 3 The relative dielectric constant of the radiating part 112 is small, which can reduce the loss caused when the signal passes through the housing 1. In addition, the material selection of the base 111 can be made more flexible. For example, the base 111 can be made of materials with good mechanical properties, so that the mechanical properties of the housing 1 can be ensured, and the gain and efficiency of the antenna module 3 can be improved.
根据本申请的一些实施例,辐射部112的介电常数小于5。由此,在信号波穿过辐射部112时,可以更好地减少损失,保证发射和接收信号的强度。According to some embodiments of the present application, the dielectric constant of the radiation portion 112 is less than 5. Therefore, when the signal wave passes through the radiating part 112, the loss can be better reduced, and the intensity of the transmitted and received signals can be ensured.
根据本申请的一些实施例,辐射部112的介电损耗小于基体111的介电损耗。由此,使得辐射部112的介电常数和介电损耗均小于基体111时,可以更好地减少损失,保证发射和接收信号的强度。According to some embodiments of the present application, the dielectric loss of the radiating portion 112 is less than the dielectric loss of the base 111. Therefore, when the dielectric constant and the dielectric loss of the radiating part 112 are both smaller than that of the base 111, the loss can be better reduced and the strength of the transmitted and received signals can be ensured.
根据本申请的一些实施例,辐射部112的介电损耗小于0.0005。由此,在信号波穿过辐射部112时,可以更好地减少损失,保证发射和接收信号的强度。According to some embodiments of the present application, the dielectric loss of the radiation portion 112 is less than 0.0005. Therefore, when the signal wave passes through the radiating part 112, the loss can be better reduced, and the intensity of the transmitted and received signals can be ensured.
根据本申请的一些实施例,基体111为陶瓷件或玻璃件。由此,可以使得基体111具 有较高的结构强度,从而使得壳体1整体具有较高的结构强度,满足使用要求。例如,基体111可以为铝硅玻璃件。由此,可以进一步地使得基体111具有较高的结构强度,从而使得壳体1整体具有较高的结构强度,满足使用要求。According to some embodiments of the present application, the base 111 is a ceramic piece or a glass piece. As a result, the base 111 can be made to have a higher structural strength, so that the housing 1 as a whole has a higher structural strength to meet the requirements of use. For example, the base 111 may be an aluminum silicate glass piece. Thus, the base 111 can be further made to have a higher structural strength, so that the housing 1 as a whole has a higher structural strength, which meets the requirements of use.
根据本申请的一些实施例,辐射部112可以为玻璃件或树脂件。由此,使得辐射部112具有较低的介电常数和介电损耗,在信号波穿过辐射部112时,可以减少损失。According to some embodiments of the present application, the radiation portion 112 may be a glass member or a resin member. As a result, the radiation portion 112 has a lower dielectric constant and dielectric loss, and the loss can be reduced when the signal wave passes through the radiation portion 112.
可选地,辐射部112可以为石英玻璃件。由此,使得辐射部112具有较低的介电常数和介电损耗。例如,在辐射部112为石英玻璃件时,辐射部112的介电常数可以低至3.7,辐射部112的介电损耗可以低至0.0003。Optionally, the radiation part 112 may be a quartz glass piece. As a result, the radiation portion 112 has a lower dielectric constant and dielectric loss. For example, when the radiation portion 112 is a quartz glass piece, the dielectric constant of the radiation portion 112 can be as low as 3.7, and the dielectric loss of the radiation portion 112 can be as low as 0.0003.
可选地,辐射部112也可以为PMMA树脂件、PC树脂件或PE树脂件。由此,使得辐射部112具有较低的介电常数和介电损耗,在信号波穿过辐射部112时,可以减少损失。例如,在辐射部112为PC树脂件时,辐射部112的介电常数可以低至3.1。Optionally, the radiation part 112 may also be a PMMA resin part, a PC resin part, or a PE resin part. As a result, the radiation portion 112 has a lower dielectric constant and dielectric loss, and the loss can be reduced when the signal wave passes through the radiation portion 112. For example, when the radiation part 112 is a PC resin part, the dielectric constant of the radiation part 112 can be as low as 3.1.
例如,在本申请的一些具体实施例中,基体111为铝硅玻璃件,辐射部112为石英玻璃件,铝硅玻璃件的机械性能优于石英玻璃件的机械性能,石英玻璃件的介电常数和介电损耗均低于铝硅玻璃件。由此既可以保证基体111的结构强度,以保证壳体1的结构强度,同时可以使得辐射部112的介电常数和介电损耗均低于基体111,减少信号波穿过辐射部112时产生的损失,保证整机的天性性能。For example, in some specific embodiments of the present application, the substrate 111 is an aluminosilicate glass piece, and the radiating part 112 is a quartz glass piece. The mechanical properties of the aluminosilicate glass piece are better than those of the quartz glass piece. The constant and dielectric loss are lower than that of aluminosilicate glass. Therefore, the structural strength of the base 111 can be ensured to ensure the structural strength of the casing 1, and the dielectric constant and the dielectric loss of the radiating portion 112 can be lower than that of the base 111, reducing the generation of signal waves when passing through the radiating portion 112. The loss to ensure the natural performance of the whole machine.
根据本申请的一些实施例,参照图5和图6,天线模块3在参考面的投影位于辐射部112在参考面的投影内,例如辐射部112在参考面的投影可以略大于天线模块3在参考面的投影,所述参考面垂直于辐射部112的厚度方向。由此,可以使得天线模块3产生的信号波尽可能多的从辐射部112穿过且尽可能少地从基体111穿过,从而可以进一步地减少信号波穿过壳体1时产生的损失。例如,天线模块3在参考面的投影的长宽分别为23mm、4.2mm,辐射部112在参考面的投影的长宽分别为24mm、4.5mm。According to some embodiments of the present application, referring to FIGS. 5 and 6, the projection of the antenna module 3 on the reference surface is located within the projection of the radiating portion 112 on the reference surface. For example, the projection of the radiating portion 112 on the reference surface may be slightly larger than that of the antenna module 3 on the reference surface. The projection of the reference plane, which is perpendicular to the thickness direction of the radiation portion 112. Therefore, the signal waves generated by the antenna module 3 can pass through the radiating portion 112 as much as possible and pass through the base 111 as little as possible, so that the loss caused when the signal waves pass through the housing 1 can be further reduced. For example, the projection length and width of the antenna module 3 on the reference surface are 23 mm and 4.2 mm, respectively, and the projection length and width of the radiating portion 112 on the reference surface are 24 mm and 4.5 mm, respectively.
根据本申请的一些实施例,参照图1和图5,基体111包括主体部1111和连接在主体部1111的厚度方向上一侧的框部1112,框部1112沿主体部1111的周向延伸,框部1112形成为环形,用于安装辐射部112的安装孔形成在主体部1111上。由此,在天线模块3与主体部1111正对时,可以在主体部1111上设置用于安装辐射部112的安装孔,且可以使得辐射部112设置的较大,更好地减少信号波穿过壳体1时产生的损失。According to some embodiments of the present application, referring to FIGS. 1 and 5, the base 111 includes a main body portion 1111 and a frame portion 1112 connected to one side in the thickness direction of the main body portion 1111. The frame portion 1112 extends along the circumferential direction of the main body portion 1111, The frame portion 1112 is formed in a ring shape, and a mounting hole for mounting the radiation portion 112 is formed on the main body portion 1111. Therefore, when the antenna module 3 and the main body portion 1111 are directly facing each other, the main body portion 1111 can be provided with a mounting hole for installing the radiating portion 112, and the radiating portion 112 can be made larger, and the signal wave penetration can be better reduced. The loss caused when passing through the shell 1.
根据本申请的一些实施例,参照图6,基体111包括主体部1111和连接在主体部1111的厚度方向上一侧的框部1112,框部1112沿主体部1111的周向延伸,框部1112形成为环形,用于安装辐射部112的安装孔形成在框部1112上。由此,在天线模块3与框部1112正对时,可以在框部1112上设置用于安装辐射部112的安装孔,使得天线模块3的位置更为灵活,例如天线模块3可以设置在电子设备100的主板2的外周侧,有利于减小整机的 厚度。According to some embodiments of the present application, referring to FIG. 6, the base 111 includes a main body portion 1111 and a frame portion 1112 connected to one side in the thickness direction of the main body portion 1111. The frame portion 1112 extends along the circumferential direction of the main body portion 1111, and the frame portion 1112 It is formed in a ring shape, and a mounting hole for mounting the radiating portion 112 is formed on the frame portion 1112. Therefore, when the antenna module 3 and the frame portion 1112 are directly facing each other, a mounting hole for installing the radiating portion 112 can be provided on the frame portion 1112, making the position of the antenna module 3 more flexible. For example, the antenna module 3 can be installed in the electronic The outer peripheral side of the main board 2 of the device 100 is beneficial to reduce the thickness of the whole machine.
在其他的实施例中,基体111包括主体部1111和连接在主体部1111的厚度方向上一侧的框部1112,框部1112沿主体部1111的周向延伸,框部1112形成为环形,主体部1111和框部1112上均可以形成有用于安装辐射部112的安装孔,由此使得天线模块3的位置设置地更为灵活。In other embodiments, the base 111 includes a main body 1111 and a frame 1112 connected to one side in the thickness direction of the main body 1111. The frame 1112 extends along the circumferential direction of the main body 1111. The frame 1112 is formed in a ring shape. Both the portion 1111 and the frame portion 1112 may be formed with mounting holes for mounting the radiating portion 112, thereby making the location of the antenna module 3 more flexible.
根据本申请的一些实施例,参照图1、图5和图6,用于安装辐射部112的安装孔为间隔设置的多个(例如两个),辐射部112的数量与安装孔的数量相同且一一对应。由此,可以增强电子设备100接收和发射信号的能力。According to some embodiments of the present application, referring to FIGS. 1, 5, and 6, the mounting holes for mounting the radiating portion 112 are multiple (for example, two) arranged at intervals, and the number of the radiating portions 112 is the same as the number of the mounting holes And one to one correspondence. Thus, the ability of the electronic device 100 to receive and transmit signals can be enhanced.
需要说明的是,本申请所述的“多个”是指两个或两个以上。It should be noted that the "plurality" in this application refers to two or more.
根据本申请的一些实施例,参照图2-图4,辐射部112与安装孔的内壁之间可以通过粘胶层12相连。由此,方便辐射部112安装固定在安装孔内。可选地,粘胶层12可以为UV胶层,由此可以使得辐射部112与基体111之间具有较高的连接强度。According to some embodiments of the present application, referring to FIGS. 2 to 4, the radiation portion 112 and the inner wall of the mounting hole may be connected by an adhesive layer 12. Therefore, it is convenient to install and fix the radiation part 112 in the installation hole. Optionally, the adhesive layer 12 may be a UV adhesive layer, so that the radiation portion 112 and the base 111 can have a higher connection strength.
可选地,参照图2-图4,粘胶层12的厚度d的取值范围为0.03-0.08mm,例如粘胶层12的厚度d可以为0.05mm。由此,可以保证辐射部112与基体111的连接强度,且使得粘胶层12的用料较少。Optionally, referring to FIGS. 2 to 4, the thickness d of the adhesive layer 12 ranges from 0.03 to 0.08 mm, for example, the thickness d of the adhesive layer 12 may be 0.05 mm. Therefore, the connection strength between the radiation portion 112 and the base 111 can be ensured, and the adhesive layer 12 uses less material.
例如,在本申请的一些具体实施例中,基体111和辐射部112均为透明件,例如基体111为铝硅玻璃件,辐射部112为石英玻璃件,辐射部112与安装孔的内壁之间通过粘胶层12相连,其中粘胶层12可以为透明胶,由此使得辐射部112与基体111的结合处也是透明的,使得辐射部112和基体111在外观上融为一体,看不出分界线。For example, in some specific embodiments of the present application, the base 111 and the radiation part 112 are both transparent parts. For example, the base 111 is an aluminosilicate glass part, the radiation part 112 is a quartz glass part, and the radiation part 112 is between the inner wall of the mounting hole It is connected by an adhesive layer 12, where the adhesive layer 12 can be a transparent glue, so that the joint between the radiating portion 112 and the base 111 is also transparent, so that the radiating portion 112 and the base 111 are integrated in appearance and cannot be seen Dividing line.
根据本申请的一些实施例,辐射部112与安装孔的内壁之间也可以焊接连接,例如辐射部112与安装孔的内壁之间可以通过热熔焊接、激光焊接等进行焊接连接。由此,可以使得辐射部112与安装孔的内壁之间实现可靠的连接。在基体111和辐射部112的材质比较接近时,例如在基体111为铝硅玻璃件,辐射部112为石英玻璃件时,辐射部112与安装孔的内壁之间采用焊接连接,可以使得辐射部112与基体111的连接更为可靠。According to some embodiments of the present application, the radiating portion 112 and the inner wall of the mounting hole can also be connected by welding. For example, the radiating portion 112 and the inner wall of the mounting hole can be welded by thermal welding, laser welding, or the like. Therefore, a reliable connection between the radiation portion 112 and the inner wall of the mounting hole can be achieved. When the material of the base 111 and the radiation portion 112 are relatively close, for example, when the base 111 is made of aluminosilicate glass and the radiation portion 112 is made of quartz glass, the radiation portion 112 and the inner wall of the mounting hole are connected by welding to make the radiation portion The connection between 112 and the base 111 is more reliable.
根据本申请的一些实施例,参照图5和图6,辐射部112的外表面与基体111的对应部分的外表面位于同一平面或同一曲面内。由此,使得壳体1的外表面具有更好的触感和外观美观性。According to some embodiments of the present application, referring to FIGS. 5 and 6, the outer surface of the radiation portion 112 and the outer surface of the corresponding part of the base 111 are located in the same plane or in the same curved surface. As a result, the outer surface of the housing 1 has a better touch and appearance.
进一步地,参照图5和图6,在辐射部112的外表面与基体111的对应部分的外表面位于同一平面或同一曲面内的同时,辐射部112的内表面与基体111的对应部分的内表面也可以位于同一平面或同一曲面内。由此,使得本体11的内表面位于同一平面或同一曲面内,且使得本体11的外表面位于同一平面或同一曲面内,使得本体11的结构简单、美观,且具有较好的触感。例如,基体111的厚度为0.55mm,辐射部112的厚度也为0.55mm。Further, referring to FIGS. 5 and 6, while the outer surface of the radiating portion 112 and the outer surface of the corresponding portion of the base 111 are located in the same plane or the same curved surface, the inner surface of the radiating portion 112 and the inner surface of the corresponding portion of the base 111 The surface can also be located in the same plane or the same curved surface. Therefore, the inner surface of the main body 11 is located in the same plane or the same curved surface, and the outer surface of the main body 11 is located in the same plane or the same curved surface, so that the structure of the main body 11 is simple, beautiful, and has a better tactile feel. For example, the thickness of the base 111 is 0.55 mm, and the thickness of the radiation portion 112 is also 0.55 mm.
根据本申请的一些实施例,参照图4,沿基体111的厚度方向,用于安装辐射部112的安装孔包括孔径不同的第一孔段和第二孔段,第一孔段的孔径可以大于第二孔段的孔径,第一孔段可以邻近壳体1的内侧(图4中的方向e是朝向壳体1的内侧的方向),辐射部112包括横截面积不同的第一辐射段1121和第二辐射段1122,第一辐射段1121的横截面积大于第二辐射段1122的横截面积,第一辐射段1121配合在第一孔段内,第二辐射段1122配合在第二孔段内。由此,可以使得第一孔段和第二孔段之间形成有第一台阶面113,以及第一辐射段1121和第二辐射段1122之间形成有与第一台阶面配合的第二台阶面1123,由此可以增大辐射部112与安装孔的内壁之间的连接面积,进一步地提高辐射部112与基体111的连接强度和连接可靠性。According to some embodiments of the present application, referring to FIG. 4, along the thickness direction of the base 111, the mounting hole for installing the radiating portion 112 includes a first hole section and a second hole section with different apertures, and the aperture of the first hole section may be larger than The aperture of the second hole section. The first hole section may be adjacent to the inner side of the housing 1 (the direction e in FIG. 4 is the direction toward the inner side of the housing 1), and the radiating portion 112 includes a first radiating section 1121 with different cross-sectional areas. And the second radiating section 1122, the cross-sectional area of the first radiating section 1121 is larger than the cross-sectional area of the second radiating section 1122, the first radiating section 1121 is fitted in the first hole section, and the second radiating section 1122 is fitted in the second hole Within paragraph. Thereby, a first step surface 113 can be formed between the first hole section and the second hole section, and a second step surface matching the first step surface is formed between the first radiation section 1121 and the second radiation section 1122. Therefore, the connection area between the radiation portion 112 and the inner wall of the mounting hole can be increased, and the connection strength and connection reliability of the radiation portion 112 and the base 111 can be further improved.
根据本申请的一些实施例,参照图3,壳体1包括:装饰层13,装饰层13设在本体11的内表面和本体11的外表面中的至少一个上。例如,装饰层13可以仅设在本体11的内表面上(图3中的方向e是朝向壳体1的内侧的方向),装饰层13可以覆盖本体11的整个内表面,由此可以遮盖辐射部112与基体111的结合处的内分界线;或者,装饰层13可以仅设在本体11的外表面上,装饰层13可以覆盖本体11的整个外表面,由此可以遮盖辐射部112与基体111的结合处的外分界线;或者,本体11的内表面和本体11的外表面均设有装饰层13,可以遮盖辐射部112与基体111的结合处的内分界线且同时可以遮盖辐射部112与基体111的结合处的外分界线。由此,可以使得辐射部112与基体111的结合处被遮盖以使得外观更为美观,且可以通过设置不同色彩、纹理的装饰层13,可以使得壳体1的外观更为丰富。另外,装饰层13可以起到对辐射部112与基体111的结合处的保护作用。According to some embodiments of the present application, referring to FIG. 3, the housing 1 includes a decoration layer 13 provided on at least one of the inner surface of the body 11 and the outer surface of the body 11. For example, the decorative layer 13 may be provided only on the inner surface of the body 11 (the direction e in FIG. 3 is the direction toward the inner side of the housing 1), and the decorative layer 13 may cover the entire inner surface of the body 11, thereby covering radiation The inner boundary line of the junction between the portion 112 and the base 111; or, the decoration layer 13 may only be provided on the outer surface of the main body 11, and the decoration layer 13 may cover the entire outer surface of the main body 11, thereby covering the radiation portion 112 and the base 111 The outer boundary of the junction of 111; or, the inner surface of the body 11 and the outer surface of the body 11 are both provided with a decorative layer 13, which can cover the inner boundary of the junction of the radiating portion 112 and the base 111 and at the same time can cover the radiating portion The outer boundary of the junction of 112 and the base 111. Therefore, the joint between the radiating portion 112 and the base 111 can be covered to make the appearance more beautiful, and the appearance of the housing 1 can be made richer by providing the decorative layer 13 of different colors and textures. In addition, the decoration layer 13 can play a role in protecting the junction between the radiation portion 112 and the base 111.
可选地,装饰层13可以为油墨层、镀膜层、贴膜层等。Optionally, the decoration layer 13 may be an ink layer, a coating layer, a film layer, or the like.
例如,基体111和辐射部112可以均为透明件,由此使得本体11为透明的,可以在本体11的内表面覆盖装饰层13,从而可以从外观上看到装饰层13显示的色彩、纹理等,丰富壳体1的外观。并且,装饰层13可以遮盖辐射部112与基体111的结合处的内分界线,而且在一定程度上装饰层13可以减弱辐射部112与基体111的结合处的外分界线。For example, both the base 111 and the radiating portion 112 may be transparent parts, so that the main body 11 is transparent, and the inner surface of the main body 11 can be covered with the decorative layer 13, so that the color and texture displayed by the decorative layer 13 can be seen from the appearance. Etc. to enrich the appearance of the housing 1. In addition, the decoration layer 13 can cover the inner boundary line of the junction between the radiation portion 112 and the base 111, and to a certain extent, the decoration layer 13 can weaken the outer boundary line of the junction between the radiation portion 112 and the base 111.
参照图5-图7并结合图1-图4,根据本申请第二方面实施例的电子设备100,包括:壳体1、显示屏组件5、主板2。Referring to FIGS. 5-7 in combination with FIGS. 1 to 4, the electronic device 100 according to the embodiment of the second aspect of the present application includes: a housing 1, a display assembly 5, and a main board 2.
壳体1为根据本申请上述第一方面实施例的电子设备的壳体1,显示屏组件5与壳体1相连,显示屏组件5与壳体1之间限定出安装空间。主板2设在安装空间内且显示屏组件5与主板2电连接,天线模块3设在安装空间内且天线模块3与主板2电连接。The housing 1 is the housing 1 of the electronic device according to the embodiment of the first aspect of the present application. The display screen assembly 5 is connected to the housing 1, and an installation space is defined between the display screen assembly 5 and the housing 1. The main board 2 is arranged in the installation space and the display screen assembly 5 is electrically connected to the main board 2, the antenna module 3 is arranged in the installation space and the antenna module 3 is electrically connected to the main board 2.
可选地,天线模块3为毫米波天线模块。由此,由此可以使得信号的传播具有更大的带宽,提高信号传输质量和传输速度。Optionally, the antenna module 3 is a millimeter wave antenna module. Therefore, it is possible to make the signal propagation have a larger bandwidth, and improve the signal transmission quality and transmission speed.
根据3GPP TS 38.101协议的规定[1],5G NR主要使用两段频率:FR1频段和FR2频 段。FR1频段的频率范围是450MHz~6GHz,又叫sub-6GHz频段;FR2频段的频率范围是24.25GHz~52.6GHz,通常叫它毫米波(mm Wave)。According to the 3GPP TS 38.101 protocol [1], 5G NR mainly uses two frequency bands: FR1 frequency band and FR2 frequency band. The frequency range of FR1 band is 450MHz~6GHz, also called sub-6GHz band; the frequency range of FR2 band is 24.25GHz~52.6GHz, usually called millimeter wave (mm Wave).
根据本申请实施例的电子设备100,通过设置上述的壳体1,可以使得壳体1的结构和选材更为灵活,可以保证壳体1的机械性能的同时,可以提高天线模块3的增益和效率。According to the electronic device 100 of the embodiment of the present application, by providing the housing 1 described above, the structure and material selection of the housing 1 can be made more flexible, the mechanical performance of the housing 1 can be ensured, and the gain and the antenna module 3 can be improved. effectiveness.
示例性的,本申请的电子设备100可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图7中只示例性的示出了一种形态)。具体地,电子设备100可以为移动电话或智能电话(例如,基于iPhone TM,基于Android TM的电话),便携式游戏设备(例如Nintendo DS TM,PlayStation Portable TM,Gameboy Advance TM,iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备,其他手持设备以及诸如手表、入耳式耳机、吊坠、头戴式耳机等,电子设备100还可以为其他的可穿戴设备(例如,诸如电子眼镜、电子衣服、电子手镯、电子项链、电子纹身、电子设备100或智能手表的头戴式设备(HMD))。Exemplarily, the electronic device 100 of the present application may be any one of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is exemplarily shown in FIG. 7). Specifically, the electronic device 100 may be a mobile phone or a smart phone (for example, a phone based on iPhoneTM, AndroidTM), a portable game device (for example, Nintendo DSTM, PlayStation PortableTM, Gameboy AdvanceTM, iPhoneTM), a laptop Type computers, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices, such as watches, earphones, pendants, headsets, etc. The electronic device 100 can also be other wearable devices (for example, Head-mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic device 100 or smart watches).
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" etc. means to incorporate the implementation The specific features, structures, materials, or characteristics described by the examples or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner.
尽管已经示出和描述了本申请的实施例,本领域的普通技术人员可以理解:在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and modifications can be made to these embodiments without departing from the principle and purpose of the present application. The scope of the application is defined by the claims and their equivalents.

Claims (20)

  1. 一种电子设备的壳体,其中,所述电子设备具有天线模块,所述天线模块设在所述壳体的内侧,所述壳体包括本体,所述本体包括:A housing of an electronic device, wherein the electronic device has an antenna module, the antenna module is arranged inside the housing, the housing includes a body, and the body includes:
    基体,所述基体上形成有沿所述基体的厚度方向贯穿所述基体的安装孔;A base body formed with a mounting hole penetrating the base body along the thickness direction of the base body;
    辐射部,所述辐射部安装在所述安装孔内,所述辐射部适于与所述天线模块相对设置,所述辐射部的介电常数小于所述基体的介电常数。The radiating part is installed in the mounting hole, the radiating part is adapted to be arranged opposite to the antenna module, and the dielectric constant of the radiating part is smaller than the dielectric constant of the base.
  2. 根据权利要求1所述的电子设备的壳体,其中,所述辐射部的介电常数小于5。The housing of the electronic device according to claim 1, wherein the dielectric constant of the radiation part is less than 5.
  3. 根据权利要求1或2所述的电子设备的壳体,其中,所述辐射部的介电损耗小于所述基体的介电损耗。The housing of the electronic device according to claim 1 or 2, wherein the dielectric loss of the radiation part is smaller than the dielectric loss of the base.
  4. 根据权利要求1-3中任一项所述的电子设备的壳体,其中,所述辐射部的介电损耗小于0.0005。The housing of the electronic device according to any one of claims 1 to 3, wherein the dielectric loss of the radiation part is less than 0.0005.
  5. 根据权利要求1-4中任一项所述的电子设备的壳体,其中,所述基体为陶瓷件或玻璃件。The housing of the electronic device according to any one of claims 1 to 4, wherein the base body is a ceramic piece or a glass piece.
  6. 根据权利要求5所述的电子设备的壳体,其中,所述基体为铝硅玻璃件。The housing of the electronic device according to claim 5, wherein the substrate is an aluminum silicate glass member.
  7. 根据权利要求1-6中任一项所述的电子设备的壳体,其中,所述辐射部为玻璃件或树脂件。The housing of the electronic device according to any one of claims 1 to 6, wherein the radiation part is a glass member or a resin member.
  8. 根据权利要求7所述的电子设备的壳体,其中,所述辐射部为石英玻璃件、PMMA树脂件、PC树脂件或PE树脂件。8. The housing of the electronic device according to claim 7, wherein the radiation part is a quartz glass part, a PMMA resin part, a PC resin part, or a PE resin part.
  9. 根据权利要求1-8中任一项所述的电子设备的壳体,其中,所述天线模块在参考面的投影位于所述辐射部在所述参考面的投影内,所述参考面垂直于所述辐射部的厚度方向。The housing of the electronic device according to any one of claims 1-8, wherein the projection of the antenna module on the reference plane is located within the projection of the radiation part on the reference plane, and the reference plane is perpendicular to The thickness direction of the radiation part.
  10. 根据权利要求1-9中任一项所述的电子设备的壳体,其中,所述安装孔为间隔设置的多个,所述辐射部的数量与所述安装孔的数量相同且一一对应。The housing of the electronic device according to any one of claims 1-9, wherein the mounting holes are a plurality of spaced apart, and the number of the radiation parts is the same as the number of the mounting holes and corresponds to one to one .
  11. 根据权利要求1-10中任一项所述的电子设备的壳体,其中,所述基体包括主体部和连接在所述主体部的厚度方向上一侧的框部,所述框部沿所述主体部的周向延伸,所述安装孔形成在所述主体部上。The housing of an electronic device according to any one of claims 1-10, wherein the base includes a main body and a frame connected to one side in the thickness direction of the main body, and the frame extends along the The main body portion extends in the circumferential direction, and the mounting hole is formed on the main body portion.
  12. 根据权利要求1-10中任一项所述的电子设备的壳体,其中,所述基体包括主体部和连接在所述主体部的厚度方向上一侧的框部,所述框部沿所述主体部的周向延伸,所述安装孔形成在所述框部上。The housing of an electronic device according to any one of claims 1-10, wherein the base includes a main body and a frame connected to one side in the thickness direction of the main body, and the frame extends along the The main body portion extends in the circumferential direction, and the mounting hole is formed on the frame portion.
  13. 根据权利要求1-12中任一项所述的电子设备的壳体,其中,所述辐射部与所述安装孔的内壁之间通过粘胶层相连。The housing of the electronic device according to any one of claims 1-12, wherein the radiation part and the inner wall of the mounting hole are connected by an adhesive layer.
  14. 根据权利要求13所述的电子设备的壳体,其中,所述粘胶层的厚度范围为 0.03-0.08mm。The housing of the electronic device according to claim 13, wherein the thickness of the adhesive layer is in the range of 0.03-0.08 mm.
  15. 根据权利要求1-14中任一项所述的电子设备的壳体,其中,所述辐射部与所述安装孔的内壁之间焊接连接。The housing of the electronic device according to any one of claims 1-14, wherein the radiating part and the inner wall of the mounting hole are connected by welding.
  16. 根据权利要求1-15中任一项所述的电子设备的壳体,其中,所述辐射部的外表面与所述基体的对应部分的外表面位于同一平面或同一曲面内。The housing of the electronic device according to any one of claims 1-15, wherein the outer surface of the radiation part and the outer surface of the corresponding part of the base are located in the same plane or the same curved surface.
  17. 根据权利要求1-16中任一项所述的电子设备的壳体,其中,沿所述基体的厚度方向所述安装孔包括孔径不同的第一孔段和第二孔段,所述辐射部包括横截面积不同的第一辐射段和第二辐射段,所述第一辐射段配合在所述第一孔段内,所述第二辐射段配合在所述第二孔段内。The housing of an electronic device according to any one of claims 1-16, wherein the mounting hole includes a first hole section and a second hole section with different diameters along the thickness direction of the base, and the radiation part It includes a first radiating section and a second radiating section with different cross-sectional areas, the first radiating section is fitted in the first hole section, and the second radiating section is fitted in the second hole section.
  18. 根据权利要求1-17中任一项所述的电子设备的壳体,其中,包括:装饰层,所述装饰层设在所述本体的内表面和所述本体的外表面中的至少一个上。The housing of an electronic device according to any one of claims 1-17, further comprising: a decoration layer provided on at least one of the inner surface of the body and the outer surface of the body .
  19. 一种电子设备,其中,包括:An electronic device, including:
    壳体,所述壳体为根据权利要求1-18中任一项所述的电子设备的壳体;A housing, the housing being the housing of the electronic device according to any one of claims 1-18;
    显示屏组件,所述显示屏组件与所述壳体相连,所述显示屏组件与所述壳体之间限定出安装空间;A display screen assembly, the display screen assembly is connected to the housing, and an installation space is defined between the display screen assembly and the housing;
    主板,所述主板设在所述安装空间内,所述显示屏组件与所述主板电连接;A motherboard, the motherboard is arranged in the installation space, and the display screen assembly is electrically connected to the motherboard;
    天线模块,天线模块设在所述安装空间内且与所述主板电连接。The antenna module is arranged in the installation space and is electrically connected to the main board.
  20. 根据权利要求19所述的电子设备,其中,所述天线模块为毫米波天线模块。The electronic device according to claim 19, wherein the antenna module is a millimeter wave antenna module.
PCT/CN2020/100947 2019-08-20 2020-07-08 Electronic device housing and electronic device WO2021031735A1 (en)

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