WO2021031508A1 - 中空墙板及其加工方法 - Google Patents

中空墙板及其加工方法 Download PDF

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Publication number
WO2021031508A1
WO2021031508A1 PCT/CN2020/070167 CN2020070167W WO2021031508A1 WO 2021031508 A1 WO2021031508 A1 WO 2021031508A1 CN 2020070167 W CN2020070167 W CN 2020070167W WO 2021031508 A1 WO2021031508 A1 WO 2021031508A1
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WO
WIPO (PCT)
Prior art keywords
upper substrate
substrate
wall panel
lower substrate
hollow
Prior art date
Application number
PCT/CN2020/070167
Other languages
English (en)
French (fr)
Inventor
丁欣欣
丁泽成
王文广
周东珊
颜裕
武鹏
Original Assignee
浙江亚厦装饰股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浙江亚厦装饰股份有限公司 filed Critical 浙江亚厦装饰股份有限公司
Priority to SG11202008823RA priority Critical patent/SG11202008823RA/en
Publication of WO2021031508A1 publication Critical patent/WO2021031508A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/02—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore of moulding techniques only
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/30—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/30—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure
    • E04C2/34—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure composed of two or more spaced sheet-like parts

Definitions

  • the invention relates to the technical field of decoration and fitting, in particular to a hollow wallboard and a processing method thereof.
  • the existing integrated wall panels basically adopt single-sided cladding, that is, only the decorative film is covered on the facing side of the wall panel.
  • the technicians discovered that, because the linear thermal expansion coefficient and elastic modulus of the decorative film and the wallboard are inconsistent, the degree of thermal expansion and contraction of the decorative film and the wallboard is inconsistent due to the temperature difference during use. Lead to deformation of the wall panel and affect the flatness of the wall.
  • the embodiment of the present invention proposes a hollow wall panel and a processing method thereof to solve the above technical problems.
  • An embodiment of the present invention provides a hollow wall panel, which includes: an upper substrate, a lower substrate, and a coating layer.
  • the upper substrate has a facing surface and a back surface, and the coating layer is attached to the facing surface.
  • the back surface is provided with a plurality of ribs, the lower substrate is attached to the plurality of ribs, and is arranged opposite to the upper substrate, the temperature difference stress between the lower substrate and the upper substrate is equal to the upper substrate Thermal stress of the substrate.
  • multiple ribs are arranged along the width direction of the back surface, each rib is perpendicular to the back surface, and the distance between adjacent ribs is equal.
  • a plurality of boss portions corresponding to the ribs are provided on the lower substrate, and the ribs are fixedly connected to the boss portions.
  • the ribs located on both sides of the upper base plate in the width direction are the left rib and the right rib respectively, the right rib is provided with a plug-in plate, and the left rib corresponds to the upper base and the left rib on the lower base
  • the left protruding part forms an inserting groove for inserting with the inserting board.
  • a bent board which includes a horizontal board and a vertical board connected vertically, the horizontal board is fixedly connected with the upper base plate and is coplanar, and the vertical board and the right rib are both vertically connected with the plug-in board.
  • the side of the lower base plate where the insertion slot is located extends toward the side away from the insertion plate to form a fixing plate for fixing to the wall.
  • the left protrusion is hollow, and the width of the end surface of the left protrusion facing the upper substrate is equal to the sum of the groove depth of the insertion groove and the thickness of the left rib.
  • a plurality of functional grooves are provided on the surface of the lower substrate facing away from the upper substrate, and the plurality of functional grooves are arranged in parallel along the width direction of the lower substrate, and the distance between adjacent functional grooves is equal.
  • the upper substrate and the lower substrate have a double-layer extrusion structure.
  • the embodiment of the present invention also provides a processing method based on the above-mentioned hollow wallboard, which includes: after the upper substrate is extruded and molded, and then cooled and shaped; and the material of the lower substrate is configured according to the temperature difference stress of the cladding layer to the upper substrate, and the The material is extruded on the basis of the upper substrate to obtain the lower substrate, which is cooled and shaped; a coating layer is pasted on the decorative surface of the upper substrate.
  • the hollow wallboard and its processing method provided by the embodiments of the present invention provide an upper substrate, a lower substrate and a cladding layer, and set the temperature difference stress of the lower substrate to the upper substrate and the temperature difference stress of the cladding layer to the upper substrate to be the same, so that
  • the lower base plate can overcome the deformation problem caused by the temperature difference of the single-sided cladding wallboard, and ensure the flatness of the wallboard.
  • all components can be industrialized in the factory. Only simple assembly is required on site, the structure is simple, and the weight is small. The installation efficiency can be improved, and the technical requirements for installation workers can be reduced, and labor costs can be reduced.
  • the wall panels do not need to be bonded on site, which is environmentally friendly and pollution-free.
  • Fig. 1 is a schematic structural diagram of a hollow wall panel according to an embodiment of the present invention.
  • Fig. 2 is a partial enlarged view of A in Fig. 1.
  • Fig. 3 is a partial enlarged view of B in Fig. 1.
  • Figure 4 is an assembly diagram of the hollow wall panel of the embodiment of the present invention.
  • Fig. 5 is a schematic diagram of the processing of the hollow wallboard of the embodiment of the present invention.
  • FIG. 1 shows a schematic structural diagram of a hollow wallboard according to an embodiment of the present invention.
  • the hollow wallboard provided by an embodiment of the present invention includes an upper substrate 2, a lower substrate 3 and a cladding layer 1.
  • the upper substrate 2 has a facing surface and a back surface, and the covering layer 1 is attached to the facing surface.
  • a plurality of ribs 21 are provided on the back surface. In this embodiment, there is a gap between adjacent ribs 21.
  • the lower substrate 3 is attached to a plurality of ribs 21 and is arranged opposite to the upper substrate 2.
  • the temperature difference stress of the lower substrate 3 to the upper substrate 2 is equal to the temperature difference stress of the coating layer 1 to the upper substrate 2.
  • the temperature difference stress is the stress formed by thermal expansion and contraction of different materials when the temperature is increased or decreased.
  • the hollow wall panel During the use of the hollow wall panel, affected by the temperature, the hollow wall panel will expand and contract with heat.
  • the temperature difference stress of the lower substrate 3 and the cladding layer 1 to the upper substrate 2 is equal, the temperature difference stress of the lower substrate 3 to the upper substrate 2 offsets the temperature difference stress of the cladding layer 1 to the upper substrate 2, so that the hollow wallboard will not deform .
  • the hollow wallboard provided by the embodiment of the present invention is provided with an upper substrate, a lower substrate and a cladding layer, and the temperature difference stress of the lower substrate to the upper substrate and the temperature difference stress of the cladding layer to the upper substrate are set equal, so that the lower substrate can overcome
  • the deformation problem caused by the temperature difference of the single-sided cladding wallboard ensures the flatness of the wallboard, and all components can be industrialized in the factory. Only simple assembly is required on site, the structure is simple, and the weight is small, which not only improves installation efficiency It can also reduce the technical requirements for installation workers and reduce labor costs. At the same time, the wallboard does not need to be bonded on site, which is environmentally friendly and pollution-free.
  • a plurality of ribs 21 are arranged along the width direction of the back surface, and each rib 21 is perpendicular to the back surface, and the distance between adjacent ribs 21 is equal to facilitate the arrangement of the ribs 21 and facilitate the processing and manufacturing of the upper substrate 2 .
  • a plurality of boss portions 31 corresponding to the ribs 21 are provided on the lower substrate 3 one-to-one, and the end surface of the ribs 21 is fixedly connected to the end surface of the boss portion 31.
  • the upper substrate 2 and the lower substrate 3 have a double-layer extrusion structure, which can satisfy the requirement that the same part is composed of different materials, and there are more choices in the structural design of the parts.
  • the upper substrate 2 is first extruded and formed, and after cooling and shaping, the lower substrate 3 is extruded and formed on the basis of the upper substrate 2, and then the setting of the upper substrate 2 and the lower substrate 3 can be completed. .
  • the ribs 21 located on both sides in the width direction of the upper base plate 2 are respectively a left rib 21-1 and a right rib 21-2.
  • the right rib 21-2 is provided with an insertion plate 5, and the left rib 21-1 is formed and inserted with the upper base plate 2, and the left protrusion 31-1 corresponding to the left rib plate 21-1 on the lower base plate 3
  • plug-in boards 5 and plug-in slots 4 By arranging plug-in boards 5 and plug-in slots 4 on both sides of the width direction of the hollow wallboard, the connection of adjacent hollow wallboards can be facilitated and the decoration efficiency can be improved.
  • the hollow wall panel 100 and the hollow wall panel 200 are inserted into the insertion slot 4 through the insertion plate 5.
  • the hollow wall panel further includes a bent panel 22.
  • the bent board 22 includes a horizontal board and a vertical board connected vertically.
  • the horizontal plate is fixedly connected to the upper substrate 2 and is coplanar. Both the vertical board and the right rib 21-2 are vertically connected to the plug-in board 5.
  • the bent plate 22, the right rib 21-2 and the plug-in plate 5 enclose a hollow area.
  • the strength of the plug-in board 5 can be increased, so as to achieve better plug-in connection.
  • the cladding layer 1 is attached to the veneer, the end surface of the upper substrate 2 in the width direction, the bending plate 22, the surface of the plug board 5 away from the lower substrate, and the end surface of the plug board 5 so as to Better improve the decorative effect.
  • the side of the lower base plate 3 where the insertion slot 4 is located extends toward the side away from the insertion plate 5 to form a fixing plate 32 for fixing to the wall.
  • the fixing plate 32 is fixed on the wall by screws 6 to increase the installation firmness of the hollow wallboard.
  • a positioning recess 321 is provided on the fixing plate 32.
  • the left protrusion 31-1 is hollow, and the width of the end surface of the left protrusion 31-1 facing the upper substrate 2 is equal to the groove depth of the insertion groove 4 and the left rib
  • the sum of the thickness of the board 21-1 can ensure the depth of the insertion slot 4, thereby ensuring the insertion firmness of the insertion board 5 and the insertion slot 4.
  • a plurality of functional grooves 33 are provided on the surface of the lower substrate 3 facing away from the upper substrate 2.
  • a plurality of functional grooves 33 are arranged in parallel along the width direction of the lower substrate 3, and the distance between adjacent functional grooves 33 is equal.
  • the surface of the lower substrate 3 facing away from the upper substrate 2 is recessed in a direction approaching the upper substrate 2, and a boss is formed on the surface of the lower substrate 3 facing the upper substrate 2.
  • Each boss corresponds to three boss parts 31, and the three boss parts 31 are respectively located at the two ends and the middle position in the width direction of the boss.
  • the cross section of the functional groove 33 perpendicular to the length direction is an isosceles trapezoid.
  • the width of the upper base of the isosceles trapezoid close to the upper base 2 is smaller than the width of the lower base far from the upper base 2.
  • the covering layer 1 includes a decorative layer and an adhesive layer, and the decorative layer is attached to the decorative surface of the upper substrate 2 through the adhesive layer, which not only facilitates the attachment of the covering layer 1, but also ensures the quality of the covering layer 1. Bond firmness.
  • the decorative layer can be a plastic decorative film such as PVC (Polyvinylchloride), PE (Polyethylene), PVDF (polyvinylidenefluoride, polyvinylidene fluoride), and the adhesive layer can be made of PUR (polyurethane). ) Coating glue.
  • PVC Polyvinylchloride
  • PE Polyethylene
  • PVDF polyvinylidenefluoride
  • the adhesive layer can be made of PUR (polyurethane). ) Coating glue.
  • the embodiment of the present invention also provides a processing method based on the above-mentioned hollow wallboard, as shown in FIG. 5, which includes:
  • the material of the lower substrate 3 is configured according to the temperature difference stress of the coating layer 1 to the upper substrate 2, and the lower substrate 3 is obtained by extrusion molding on the basis of the upper substrate 2 by using the material, and cooling and shaping;
  • the ratio of various ingredients can be obtained by conversion of linear thermal expansion coefficient, elastic modulus and thickness. According to the ratio of ingredients, The material of the lower substrate 3. Then, using this material, the lower substrate 3 is extruded on the basis of the upper substrate 2.
  • the linear expansion coefficient of the lower substrate 3 is greater than the linear expansion coefficient of the upper substrate 2, which not only facilitates extrusion molding, but also ensures the temperature difference and pressure of the lower substrate 3 to the upper substrate 2.
  • the coating layer 1 is pasted on the decorative surface of the upper substrate 2.
  • the adhesive layer is coated on the veneer of the upper substrate 2 first, and then the covering layer 1 is attached to the adhesive layer.
  • the hollow wallboard processing method provided by the embodiment of the present invention sets the upper substrate, the lower substrate and the cladding layer, and sets the temperature difference stress of the lower substrate to the upper substrate and the temperature difference stress of the cladding layer to the upper substrate to be the same, so that the lower substrate It can overcome the deformation problem caused by the temperature difference of the single-sided cladding wallboard, ensure the flatness of the wallboard, and all parts can be industrialized in the factory. Only simple assembly is required on site, the structure is simple, and the weight is small, which can not only improve The installation efficiency can also reduce the technical requirements for installation workers and reduce labor costs. At the same time, the wall panels do not need to be bonded on site, which is environmentally friendly and pollution-free.

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Finishing Walls (AREA)

Abstract

一种中空墙板及其加工方法，其包括：上基板（2）、下基板（3）和包覆层（1），所述上基板（2）具有相对设置的饰面和背面，所述包覆层（1）贴合在所述饰面上，所述背面上设置有多根肋板（21），所述下基板（3）分别与多根肋板（21）贴合，且与所述上基板（2）相对设置，所述下基板（3）对上基板（2）的温差应力等于包覆层（1）对上基板（2）的温差应力。该中空墙板中的下基板（3）能够克服单面包覆墙板受温差影响引起的变形问题，保证墙板的平整程度，而且所有部件均可在工厂内工业化生产，现场只需进行简单装配，结构简单，重量小，不仅能够提高安装效率，而且还可降低对安装工人的技术要求，降低人工成本，同时墙板现场不需要粘接，环保无污染。

Description

中空墙板及其加工方法 技术领域
本发明涉及装饰装修技术领域，具体涉及一种中空墙板及其加工方法。
 背景技术
目前，市场上出现了大量装饰膜包覆的集成墙板，由于其具有安装简便、饰面形式多样、可拆卸、满足装配式装修要求等优势，大大提高了墙板的安装效率及装饰效果，且即装即用，无传统装修的空置期，吸引了很多消费者。
 技术问题
基于控制成本原因，现有的集成墙板基本采用单面包覆，即只在墙板的饰面侧包覆装饰膜。技术人员在实现本发明的过程中发现，由于装饰膜与墙板的线性热膨胀系数、弹性模量均不一致，在使用过程中，受温差影响，装饰膜与墙板的热胀冷缩程度不一致，导致墙板变形，影响墙面平整度。
 技术解决方案
有鉴于此，本发明实施例提出一种中空墙板及其加工方法，以解决上述技术问题。
本发明实施例提出一种中空墙板，其包括：上基板、下基板和包覆层，所述上基板具有相对设置的饰面和背面，所述包覆层贴合在所述饰面上，所述背面上设置有多根肋板，所述下基板分别与多根肋板贴合，且与所述上基板相对设置，所述下基板对上基板的温差应力等于包覆层对上基板的温差应力。
可选地，多根肋板沿背面的宽度方向排布，每根肋板均与背面垂直，相邻肋板的间距相等。
可选地，所述下基板上设置有多个与肋板一一对应的凸台部，所述肋板与凸台部固定连接。
可选地，位于上基板宽度方向两侧的肋板分别左肋板和右肋板，右肋板上设置有插接板，左肋板与上基板、下基板上与左肋板相对应的左凸起部形成与插接板插接的插接槽。
可选地，还包括弯折板，弯折板包括垂直连接的横板和竖板，横板与上基板固定连接，且共面，竖板和右肋板均与插接板垂直连接。
可选地，所述下基板上插接槽所在的一侧朝向远离插接板的一侧延伸，形成用于与墙面固定的固定板。
可选地，所述左凸起部中空，且所述左凸起部朝向上基板的端面的宽度等于插接槽的槽深和左肋板的厚度之和。
可选地，所述下基板背离上基板的板面上设置有多个功能槽，多个所述功能槽沿下基板的宽度方向平行排布，且相邻功能槽的间距相等。
可选地，所述上基板和下基板为双层挤出结构。
本发明实施例还提供一种基于上述的中空墙板的加工方法，其包括：将上基板挤出成型后，冷却定型；根据包覆层对上基板的温差应力配置下基板的材质，采用该材质在上基板的基础上挤出成型得到下基板，并冷却定型；在上基板的饰面上贴设包覆层。
 有益效果
本发明实施例提供的中空墙板及其加工方法通过设置上基板、下基板和包覆层，并且将下基板对上基板的温差应力和包覆层对上基板的温差应力设置为相同，使得下基板能够克服单面包覆墙板受温差影响引起的变形问题，保证墙板的平整程度，而且所有部件均可在工厂内工业化生产，现场只需进行简单装配，结构简单，重量小，不仅能够提高安装效率，而且还可降低对安装工人的技术要求，降低人工成本，同时墙板现场不需要粘接，环保无污染。
 附图说明
图1是本发明实施例的中空墙板的结构示意图。
图2是图1中A的局部放大图。
图3是图1中B的局部放大图。
图4是本发明实施例的中空墙板的装配图。
图5是本发明实施例的中空墙板的加工示意图。
 本发明的实施方式
以下结合附图以及具体实施例，对本发明的技术方案进行详细描述。其中相同的零部件用相同的附图标记表示。需要说明的是，下面描述中使用的词语“前”、“后”、“左”、“右”、“上”和“下”指的是附图中的方向，词语“内”和“外”分别指的是朝向或远离特定部件几何中心的方向。
图1示出了本发明实施例的中空墙板的结构示意图，如图1所示，本发明实施例提供的中空墙板，其包括：上基板2、下基板3和包覆层1。
如图2所示，所述上基板2具有相对设置的饰面和背面，所述包覆层1贴合在所述饰面上。
所述背面上设置有多根肋板21。在本实施例中，相邻肋板21之间具有间隙。
所述下基板3分别与多根肋板21贴合，且与所述上基板2相对设置，所述下基板3对上基板2的温差应力等于包覆层1对上基板2的温差应力。
其中，所述温差应力，是在升温或降温情况下，不同材料热胀冷缩形成的应力。
中空墙板在使用过程中，受温度影响，中空墙板会发生热胀冷缩。
由于下基板3与包覆层1对上基板2的温差应力相等，下基板3对上基板2的温差应力抵消了包覆层1对上基板2的温差应力，使得中空墙板不会发生变形。
本发明实施例提供的中空墙板通过设置上基板、下基板和包覆层，并且将下基板对上基板的温差应力和包覆层对上基板的温差应力设置为相等，使得下基板能够克服单面包覆墙板受温差影响引起的变形问题，保证墙板的平整程度，而且所有部件均可在工厂内工业化生产，现场只需进行简单装配，结构简单，重量小，不仅能够提高安装效率，而且还可降低对安装工人的技术要求，降低人工成本，同时墙板现场不需要粘接，环保无污染。
进一步地，多根肋板21沿背面的宽度方向排布，每根肋板21均与背面垂直，相邻肋板21的间距相等，以方便肋板21的设置，便于上基板2的加工制造。
优选地，所述下基板3上设置有多个与肋板21一一对应的凸台部31，所述肋板21的端面与凸台部31的端面固定连接。
通过设置凸台部31，可方便肋板21与下基板3的连接。
进一步地，上基板2与下基板3为双层挤出结构，可满足同一零件由不同材料组成，零件的结构设计有更多选择。
在本实施例中，上基板2先挤出成型，且冷却定型后，再在上基板2的基础上将下基板3挤出成型，冷却定型，即可完成上基板2和下基板3的设置。
可选地，如图3-4所示，位于上基板2宽度方向两侧的肋板21分别左肋板21-1和右肋板21-2。
右肋板21-2上设置有插接板5，左肋板21-1与上基板2、下基板3上与左肋板21-1相对应的左凸起部31-1形成与插接板5插接的插接槽4。
通过在中空墙板宽度方向的两侧上设置插接板5和插接槽4，可方便相邻中空墙板的连接，提高装修效率。
如图4所示，中空墙板100和中空墙板200通过插接板5与插接槽4插接。
进一步地，中空墙板还包括弯折板22。弯折板22包括垂直连接的横板和竖板。
横板与上基板2固定连接，且共面。竖板和右肋板21-2均与插接板5垂直连接。弯折板22与右肋板21-2、插接板5围成中空区域。
通过设置弯折板22，可增加插接板5的强度，以便更好地实现插接。
如图1-3所示，包覆层1与饰面、上基板2宽度方向的端面、弯折板22、插接板5背离下基板的板面以及插接板5的端面贴合，以便更好地提高装饰效果。
优选地，所述下基板3上插接槽4所在的一侧朝向远离插接板5的一侧延伸，形成用于与墙面固定的固定板32。固定板32通过螺钉6固定在墙面上，以增加中空墙板的安装牢固性。
进一步地，所述固定板32上设置有定位凹陷321。通过设置定位凹陷321，可方便螺钉6的安装，提高装修效率。
较佳地，如图2所示，所述左凸起部31-1中空，且所述左凸起部31-1朝向上基板2的端面的宽度等于插接槽4的槽深和左肋板21-1的厚度之和，可保证插接槽4的深度，从而保证插接板5与插接槽4的插接牢固性。
进一步地，所述下基板3背离上基板2的板面上设置有多个功能槽33。
多个功能槽33沿下基板3的宽度方向平行排布，相邻功能槽33的间距相等。
通过设置功能槽33，不仅可便于中空墙板的应力释放，还可增加墙板与墙面之间的空气流通。
在一个具体实施例中，下基板3背离上基板2的板面朝向靠近上基板2的方向凹陷，在下基板3朝向上基板2的板面上形成凸台。
每个凸台上对应三个凸台部31，三个凸台部31分别位于凸台宽度方向的两端以及中间位置上。
在一个具体实施例中，功能槽33垂直于长度方向的横截面为等腰梯形。等腰梯形靠近上基板2的上底的宽度小于远离上基板2的下底的宽度。
进一步地，包覆层1包括装饰层和粘接层，装饰层通过粘接层贴合在上基板2的饰面上，不仅便于包覆层1的贴合，还可保证包覆层1的粘接牢固性。
在本实施例中，装饰层可以为PVC（Polyvinylchloride，聚氯乙烯）、PE（Polyethylene，聚乙烯）、PVDF（polyvinylidenefluoride，聚偏二氟乙烯）等塑料装饰膜，粘接层可以采用PUR（聚氨酯）包覆胶。
本发明实施例还提供一种基于如上所述的中空墙板的加工方法，如图5所示，其包括：
将上基板2挤出成型后，冷却定型；
根据包覆层1对上基板2的温差应力配置下基板3的材质，采用该材质在上基板2的基础上挤出成型得到下基板3，并冷却定型；
基于包覆层1对上基板2的温差应力等于下基板3对上基板2的温差应力，通过线性热膨胀系数、弹性模量以及厚度换算可得各种配料的配比，根据配比配料，得到下基板3的材质。然后，利用该材质，在上基板2的基础上挤出下基板3。
在本实施例中，所述下基板3的线性膨胀系数大于上基板2的线性膨胀系数，不仅方便挤出成型，而且还可保证下基板3对上基板2的温差压力。
在上基板2的饰面上贴设包覆层1。
先在上基板2的饰面上涂布粘接层，然后再将包覆层1贴合在粘接层上。
本发明实施例提供的中空墙板加工方法通过设置上基板、下基板和包覆层，并且将下基板对上基板的温差应力和包覆层对上基板的温差应力设置为相同，使得下基板能够克服单面包覆墙板受温差影响引起的变形问题，保证墙板的平整程度，而且所有部件均可在工厂内工业化生产，现场只需进行简单装配，结构简单，重量小，不仅能够提高安装效率，而且还可降低对安装工人的技术要求，降低人工成本，同时墙板现场不需要粘接，环保无污染。
以上，结合具体实施例对本发明的技术方案进行了详细介绍，所描述的具体实施例用于帮助理解本发明的思想。本领域技术人员在本发明具体实施例的基础上做出的推导和变型也属于本发明保护范围之内。

Claims (10)

  1. 一种中空墙板，其特征在于，包括：上基板、下基板和包覆层，所述上基板具有相对设置的饰面和背面，所述包覆层贴合在所述饰面上，所述背面上设置有多根肋板，所述下基板分别与多根肋板贴合，且与所述上基板相对设置，所述下基板对上基板的温差应力等于包覆层对上基板的温差应力。
  2. 如权利要求1所述的中空墙板，其特征在于，多根肋板沿背面的宽度方向排布，每根肋板均与背面垂直，相邻肋板的间距相等。
  3. 如权利要求2所述的中空墙板，其特征在于，所述下基板上设置有多个与肋板一一对应的凸台部，所述肋板与凸台部固定连接。
  4. 如权利要求3所述的中空墙板，其特征在于，位于上基板宽度方向两侧的肋板分别左肋板和右肋板，右肋板上设置有插接板，左肋板与上基板、下基板上与左肋板相对应的左凸起部形成与插接板插接的插接槽。
  5. 如权利要求4所述的中空墙板，其特征在于，还包括弯折板，弯折板包括垂直连接的横板和竖板，横板与上基板固定连接，且共面，竖板和右肋板均与插接板垂直连接。
  6. 如权利要求4所述的中空墙板，其特征在于，所述下基板上插接槽所在的一侧朝向远离插接板的一侧延伸，形成用于与墙面固定的固定板。
  7. 如权利要求6所述的中空墙板，其特征在于，所述左凸起部中空，且所述左凸起部朝向上基板的端面的宽度等于插接槽的槽深和左肋板的厚度之和。
  8. 如权利要求1所述的中空墙板，其特征在于，所述下基板背离上基板的板面上设置有多个功能槽，多个所述功能槽沿下基板的宽度方向平行排布，且相邻功能槽的间距相等。
  9. 如权利要求1-8任一所述的中空墙板，其特征在于，所述上基板和下基板为双层挤出结构。
  10. 一种基于权利要求1-9任一所述的中空墙板的加工方法，其特征在于，包括：
    将上基板挤出成型后，冷却定型；
    根据包覆层对上基板的温差应力配置下基板的材质，采用该材质在上基板的基础上挤出成型得到下基板，并冷却定型；
    在上基板的饰面上贴设包覆层。
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