WO2021027455A1

WO2021027455A1 - Bi-directional optical sub-assembly with anti-interference performance, and bob optical module

Info

Publication number: WO2021027455A1
Application number: PCT/CN2020/101262
Authority: WO
Inventors: 石胜兵; 张先勇; 唐超群; 刘水亮; 刘玉明; 谢冬冬
Original assignee: 烽火通信科技股份有限公司
Priority date: 2019-08-09
Filing date: 2020-07-10
Publication date: 2021-02-18
Also published as: CN110488432B; BR112022001747A2; CN110488432A

Abstract

Disclosed are a bi-directional optical sub-assembly (BOSA) with an anti-interference performance, and a BOB optical module. The bi-directional optical sub-assembly comprises a BOSA shell, a ROSA structure (4), and a conductor grounding structure, wherein the BOSA shell comprises a BOSA square outer casing (1), a TOSA structure (2), and a tail fiber structure (3), the TOSA structure (2) being assembled at one end of the BOSA square outer casing (1), a TOSA circuit board (20) of the TOSA structure (2) being assembled on a PCB (5), and the tail fiber structure (3) being assembled at the other end of the BOSA square outer casing (1); one end of the ROSA structure (4) is assembled at a bottom wall of the BOSA square outer casing (1), and the other end thereof is assembled on the PCB (5); and the conductor grounding structure is located on an outer side of the ROSA structure (4), and is used for guiding an induced radiation current on the BOSA shell to a ground plane of the PCB (5). The present invention solves the problem of the area of the PCB (5) being large due to the use of an external shielding cover, also avoids changing the internal structure of the BOSA, and also guarantees the anti-interference performance.

Description

Optical transceiver integrated component and BOB optical module with anti-interference performance

Technical field

The present invention relates to the technical field of optical fiber communication, in particular to an integrated optical transceiver assembly and a BOB (BOSA on Board, BOB) optical module with anti-interference performance.

Background technique

The rapid development of the Internet has increased the demand for various high-broadband and high-speed optical fiber networks. Traditional transmission technologies have been difficult to meet the requirements of transmission capacity and speed. In order to meet the needs of a new generation of high-speed broadband networks, corresponding high-performance light-receiving and light-emitting components are required. Bi-Directional Optical Sub-Assembly (BOSA) is the most widely used device in light-emitting and light-emitting components. With EPON (Ethernet Passive Optical Network), GPON (Gigabit-capable Passive Optical Networks) and XGPON (XG-Passive Optical Network) The continuous development of communication and the continuous increase of network WIFI signal sources have put forward stricter requirements on the anti-interference of optical signals. At present, BOSA itself has weak anti-interference ability against external signals, and is susceptible to interference from external signals, which may cause communication packet loss. One of the important reasons is that when BOSA components are installed on the PCB board, due to the TOSA (Transmitter Optical Device) The TOSA circuit board of the Subassembly) structure and the pins of the ROSA (Receiver Optical Subassembly) structure are soldered on the PCB board, so that the BOSA assembly forms an inverted F antenna (see Figure 1), and the inverted F antenna The standing wave happens to be in the 5G frequency band of the WIFI signal (the specific coverage range is 5.15GHz～5.85GHz). Because BOSA shell (BOSA shell includes BOSA square jacket, TOSA structure and pigtail structure) has obvious antenna effect, it has strong coupling effect with external WIFI signal, which also leads to packet loss in BOSA communication The problem is that even if the size of the BOSA housing is changed (such as adjusting the ROSA, TOSA lead length and the interval length of ROSA, TOSA on BOSA), since the inverted F antenna structure of the BOSA housing has not been changed, it is still not possible for the WIFI signal 5G frequency band. Increasing the isolation between the BOSA housing and the external WIFI signal naturally cannot improve the anti-interference performance; and for other frequency bands, even by changing the size of the BOSA housing, it has the effect of improving the isolation between the BOSA housing and the external WIFI signal. But this effect is not obvious.

In order to improve the isolation of BOSA components, there are usually two methods: the first is to add a splitter diverter, isolator, etc. inside the BOSA. This method requires changing the internal structure of the BOSA, the process is more complicated, and the mold needs to be reopened; The second method is to use the shielding cover externally. This method will cause the PCB board area to be too large, and the cost of the shielding cover is higher. The prior art has defects and contradictions, and it is necessary to propose new methods to improve the anti-interference performance of BOSA components.

Summary of the invention

In view of the defects in the prior art, the purpose of the present invention is to provide an integrated optical transceiver assembly and BOB optical module with anti-interference performance, which not only solves the problem of large PCB board area caused by the use of an external shielding cover, but also avoids modification Internal structure of BOSA components.

To achieve the above objectives, the technical solution adopted by the present invention is: an integrated optical transceiver assembly with anti-interference performance, which includes:

BOSA housing, the BOSA housing includes:

-BOSA square jacket;

-TOSA structure, which is assembled on one end of the BOSA square jacket, and the TOSA circuit board of the TOSA structure is used for assembly on a PCB board;

-Pigtail structure, which is assembled at the other end of the BOSA square jacket;

ROSA structure, one end of which is assembled on the bottom wall of the BOSA square jacket, and the other end is used for assembly on the PCB board;

Conductor grounding structure, one end of which is assembled on the BOSA square jacket, and the other end is used for assembly on the PCB board. The conductor grounding structure is located outside the ROSA structure and is used to attach the BOSA shell The induced radiation current is guided to the ground plane of the PCB board.

Further, the conductor grounding structure includes at least one piece of metal sheet, one end of the metal sheet is assembled on the side wall of the BOSA square casing, and the other end is formed with a welding part for connecting with the PCB board.

Further, the welding part is substantially perpendicular to the metal sheet.

Further, the welding part is formed by bending one end of the metal sheet away from the BOSA square jacket toward the side of the ROSA structure or away from the side of the ROSA structure.

Further, the metal sheet is inserted into the PCB board, and a part of the metal sheet located in the PCB board forms the welding part.

Further, the side wall of the BOSA square jacket set provided with the metal sheet is completely covered by the metal sheet.

Further, the conductor grounding structure includes at least one BOSA grounding pin, one end of the BOSA grounding pin is assembled on the bottom wall of the BOSA square casing, and the other end is used to connect with the PCB board.

Further, the BOSA ground pin is located at the corner of the bottom wall of the BOSA square jacket.

Further, when there is one BOSA ground pin, the BOSA ground pin is located on one of the four corners of the bottom wall of the BOSA square jacket;

When there are two BOSA ground pins, the two BOSA ground pins are respectively located on two of the four corners of the bottom wall of the BOSA square jacket, and the two BOSA ground pins are located on the bottom wall of the BOSA square jacket Diagonal

When there are three BOSA ground pins, the three BOSA ground pins are respectively located on three of the four corners of the bottom wall of the BOSA square jacket;

When there are four BOSA ground pins, the four BOSA ground pins are respectively located on the four corners of the bottom wall of the BOSA square jacket.

Further, the conductor grounding structure includes a metal sleeve, one end of the metal sleeve is assembled on the bottom wall of the BOSA square jacket, and the other end is used to connect with the PCB board.

Further, the horizontal projection of the metal sleeve is located within the horizontal projection range of the BOSA square jacket.

The present invention also provides a BOB optical module, which includes:

PCB board;

As for the optical transceiver integrated assembly described above, the TOSA circuit board of the TOSA structure, the ROSA structure and the conductor grounding structure are all assembled on the PCB board.

The present invention also provides an integrated optical transceiver assembly with anti-interference performance, which includes:

BOSA housing, the BOSA housing includes:

-BOSA square jacket;

One end of the conductor grounding structure is used for assembling on the BOSA square jacket, and the other end is used for assembling on the PCB board. When the conductor grounding structure is assembled on the BOSA square jacket, the The conductor ground structure is located outside the ROSA structure and is used to guide the induced radiation current on the BOSA shell to the ground plane of the PCB board.

Compared with the prior art, the advantages of the present invention are:

The method adopted by the present invention is to add a conductor grounding structure. One end of the conductor grounding structure is assembled on the BOSA square casing, and the other end is assembled on the PCB board. The conductor grounding structure is used to connect the BOSA housing and the ground plane of the PCB board. Connected together, so that the induced radiation current on the BOSA housing flows directly to the ground plane of the PCB board, eliminating the radiation effect of the BOSA housing, thereby destroying the antenna effect of the BOSA housing and reducing the coupling effect between it and the external WIFI signal , Thereby improving the isolation between the BOSA housing and the external WIFI signal, and ultimately improving the anti-interference performance of the BOSA component.

Compared with the prior art by adding splitter deflectors, isolators and other methods inside BOSA components, the present invention does not need to modify the internal structure of BOSA components, has no effect on the packaging process of BOSA components, and therefore has broader Universality and convenience;

Compared with the prior art method of welding the shielding cover, the present invention wraps the BOSA assembly in the shielding area of the shielding cover to avoid the BOSA assembly from being interfered by external signals. The present invention removes the shielding cover and only connects the shielding cover through the conductor grounding structure. The induced radiation current on the BOSA shell directly flows to the ground plane of the PCB board, thereby destroying the antenna effect of the BOSA shell, and the conductor grounding structure is only outside the ROSA structure, which not only saves costs, but also reduces the PCB layout area , Provide convenience for structure miniaturization.

Description of the drawings

Figure 1 is a schematic diagram of the structural comparison between BOB optical module (left) and inverted F antenna (right);

Figure 2 is a schematic structural diagram of an optical transceiver integrated assembly with anti-interference performance provided by an embodiment of the present invention (the conductor grounding structure adopts a metal sheet);

Figure 3 is a schematic diagram of the structure of Figure 2 when mounted on a PCB board;

4 is a schematic diagram of the back structure of FIG. 3;

5 is a schematic diagram of the structure of an integrated optical transceiver assembly with anti-interference performance provided by an embodiment of the present invention (the conductor grounding structure adopts BOSA grounding pins);

Figure 6 is a schematic diagram of the structure of Figure 5 when mounted on a PCB board;

FIG. 7 is a schematic structural diagram of an optical transceiver integrated assembly with anti-interference performance provided by an embodiment of the present invention (the conductor grounding structure adopts a metal sleeve);

Figure 8 is a schematic diagram of the structure of Figure 7 when mounted on a PCB board;

9 is a diagram of isolation between the optical transceiver integrated component and the on-board antenna on the PCB board provided by an embodiment of the present invention (the conductor grounding structure is not installed);

FIG. 10 is a diagram of isolation between the optical transceiver integrated component and the on-board antenna on the PCB provided by an embodiment of the present invention (the conductor grounding structure has been installed, and the conductor grounding structure uses metal sheets).

In the picture: 1. BOSA square jacket; 2. TOSA structure; 20. TOSA circuit board; 3. Pigtail structure; 4. ROSA structure; 40. ROSA pins; 5. PCB board; 6. Metal sheet; 60. Welding part 7. BOSA grounding pin; 8. Metal sleeve; 9. First antenna; 10. Second antenna; 11. Third antenna.

detailed description

The present invention will be further described in detail below in conjunction with the drawings and embodiments.

Referring to Figures 2 and 3, the first embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance. The integrated optical transceiver assembly includes a BOSA housing, a ROSA structure 4, and a conductor grounding structure; a BOSA housing The body includes a BOSA square jacket 1, a TOSA structure 2 and a pigtail structure 3. The BOSA square jacket 1 can adopt a cubic or rectangular structure. The TOSA structure 2 is set at one end of the BOSA square jacket 1, and the TOSA circuit board 20 of the TOSA structure 2 is used for Set on the PCB board 5; the pigtail structure 3 is set on the other end of the BOSA square jacket 1; one end of the ROSA structure 4 is set on the bottom wall of the BOSA square jacket 1, and the other end is used for assembly on the PCB board 5. The ROSA structure 4 has multiple ROSA pins 40, and the ROSA pins 40 are soldered on the PCB board 5. In this embodiment, there are five ROSA pins 40; one end of the conductor grounding structure is assembled on the BOSA square jacket 1, and the other end is used for assembly Set on the PCB board 5, the conductor grounding structure is located outside the ROSA structure 4, and the conductor grounding structure is used to guide the induced radiation current on the BOSA housing to the ground plane of the PCB board 5.

The present invention proposes the antenna effect of the BOSA housing for the first time, and regards the BOSA assembly mounted on the PCB board 5 as an inverted F antenna. The purpose of the present invention is to reduce the antenna effect of the BOSA housing, thereby improving the anti-interference performance of the BOSA assembly.

Since the standing wave of the inverted F antenna formed by the BOSA housing happens to be in the 5G frequency band of the WIFI signal, the method adopted by the present invention improves the isolation between the BOSA housing and the external WIFI signal 5G frequency band, and ultimately improves the anti-interference of the BOSA component The performance has a very good effect, but the method adopted by the present invention is not only applicable to the 5G frequency band.

Referring to Figure 2, Figure 3 and Figure 4, the second embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance. The difference between this embodiment and the first embodiment is that this embodiment provides a conductor The specific structure form of the grounding structure, specifically, the conductor grounding structure includes at least one metal sheet 6, one end of the metal sheet 6 is assembled on the side wall of the BOSA square casing 1, and the other end is formed with a welding part 60 for connecting with the PCB board 5. The metal sheet 6 is welded to the PCB board 5 through the welding part 60, the size of the welding part 60 is not limited, and the welding part 60 is subject to welding. In order to ensure a better drainage effect of the induced radiation current, in FIG. 2, two metal sheets 6 are provided, and they are respectively arranged on the two side walls of the BOSA square casing 1, and the ROSA structure 4 is located between the two metal sheets 6.

Along the axial direction of the pigtail structure 3, the width of the metal sheet 6 is preferably not less than the width of the BOSA square jacket 1 to ensure a better anti-interference effect. In this embodiment, the width of the metal sheet 6 is approximately equal to the BOSA square jacket The width of 1, see Figure 2.

As shown in FIG. 2, in this embodiment, the metal sheet 6 preferably can completely cover the side wall of the BOSA square jacket 1 so that the BOSA component has a better anti-interference effect.

As shown in FIG. 2, the welding part 60 is substantially perpendicular to the metal sheet 6 so that the welding part 60 can be flush with the PCB board 5; the welding part 60 is located on the side of the ROSA structure 4 at the end of the metal sheet 6 away from the BOSA square casing 1 or It is bent in a direction away from the side where the ROSA structure 4 is located. Of course, the metal sheet 6 can also be directly inserted into the PCB board 5 so that the part located in the PCB board 5 forms a welding portion 60.

If the design is bent away from the side where the ROSA structure 4 is located, this bending design can easily connect the BOSA square jacket 1 to the ground plane of the PCB board through the metal sheet 6 so that the induced radiation current on the BOSA square jacket 1 is directly The flow to the ground plane of the PCB board 5 eliminates the radiation effect of the BOSA housing, thereby eliminating the antenna effect of the BOSA square housing.

If a design that is bent toward the side where the ROSA structure 4 is located or directly inserted into the PCB board 5 is adopted, such a bending design can reserve more board layout space near the BOSA component, which facilitates the subsequent miniaturization of equipment.

In this embodiment, three metal sheets 6 can also be provided. The three metal sheets 6 are connected in a U-shaped structure. Except for the two outer sheets connected to the two side walls of the BOSA square jacket 1, the middle sheet 6 is set on the BOSA Square jacket 1 on the top wall.

Referring to Figures 5 and 6, the third embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance. The difference between this embodiment and the first embodiment is that this embodiment provides a conductor grounding structure The specific structure form, specifically, the conductor grounding structure includes at least one BOSA grounding pin 7. One end of the BOSA grounding pin 7 is assembled on the bottom wall of the BOSA square casing 1, and the other end is used to connect to the PCB board 5. This embodiment adopts BOSA The grounding pin 7 makes the induced radiation current on the BOSA square casing 1 flow directly to the ground plane of the PCB board 5, thereby eliminating the radiation effect of the BOSA housing, thereby eliminating the antenna effect of the BOSA square housing.

In order to obtain a better anti-interference effect, the BOSA grounding pins 7 are arranged at the four corners of the bottom wall of the BOSA square jacket 1.

When there is only one BOSA grounding pin 7, the BOSA grounding pin 7 is set on one of the four corners of the bottom wall of the BOSA square jacket 1. When there are two BOSA grounding pins 7, it needs to be located on the opposite corner of the bottom wall of the BOSA square jacket 1. When the BOSA grounding pin 7 is 3, install them on any three of the four corners of the bottom wall of the BOSA square jacket 1. When the BOSA grounding pin 7 is greater than or equal to 4, four of them The BOSA grounding pins 7 are respectively installed on the four corners of the bottom wall of the BOSA square jacket 1, as shown in FIG. 5. In this embodiment, the BOSA grounding pins 7 are provided at four corners, and the ROSA structure 4 is located on the four BOSAs. In the space enclosed by the grounding pin 7.

In actual soldering, the BOSA ground pin 7 can be embedded in the PCB board 5, but the part penetrating the PCB board 5 should not exceed the length of the ROSA pin 40 penetrating the PCB board 5.

Referring to Figures 7 and 8, the fourth embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance. The difference between this embodiment and the first embodiment is that this embodiment provides a conductor grounding structure The specific structure form, specifically, the conductor grounding structure includes a metal sleeve 8. The metal sleeve 8 can adopt a cylindrical structure or a square structure. One end of the metal sleeve 8 is assembled on the bottom wall of the BOSA square casing 1, and the other end is used for Connect with PCB board 5.

The ROSA structure 4 passes through the middle of the metal sleeve 8 and is soldered on the PCB board 5 through ROSA pins 40. The bottom surface of the metal sleeve 8 is welded on the ground plane of the PCB board 5 by SMT, and the ROSA structure 4 is just wrapped around the metal sleeve 8. Through this design scheme, the metal sleeve 8, the ground plane of the PCB board 5 and the BOSA square jacket 1 just form a shielding cover, which wraps the easily disturbed ROSA structure 4 in the BOSA assembly, which can ground the BOSA shell and eliminate Its antenna effect, and the formed shield structure can resist the interference of external signals, achieving a double effect.

In order to ensure a good connection between the metal sleeve 8 and the BOSA square casing 1, the horizontal projection of the metal sleeve 8 is within the horizontal projection range of the BOSA square casing 1.

The height of the metal sleeve 8 does not affect the welding of the ROSA structure 4. In actual operation, the metal sleeve 8 is welded first, and then the BOSA square jacket 1 is clamped on the metal frame to weld the pins 40 of the ROSA structure 4 and the TOSA structure 2 TOSA circuit board 20, finally reduce the length of ROSA pin 40.

In addition, when a metal sleeve 8 is used for the conductor grounding structure, the top of the metal sleeve 8 can be directly supported or closely attached to the bottom of the BOSA square jacket 1, and the bottom end can be resisted or closely attached to the PCB board 5 without welding. ; In order to better guide the induced radiation current on the BOSA shell to the ground plane of the PCB board 5, the butt joint structure can also be welded on the PCB board 5, and the bottom end of the metal sleeve 8 resists or closely fits in In the docking structure, the docking structure can adopt a shape adapted to the metal sleeve 8, and the docking structure is provided with a docking groove adapted to the metal sleeve 8. For example, when the metal sleeve 8 adopts a square structure, the docking structure also adopts a square structure. In the structure, a butting groove is formed on the end surface of the butting structure, and the bottom end of the metal sleeve 8 is just butted and held or tightly fitted in the butting groove.

Referring to FIG. 3 or FIG. 6 or FIG. 8, the fifth embodiment of the present invention provides a BOB (BOSA on Board, BOB for short) optical module, which includes a PCB board 5 and an optical transceiver assembly as described above. 4, three of the four corners on the PCB board 5 are provided with a first antenna 9, a second antenna 10, and a third antenna 11; the TOSA circuit board 20 and the ROSA structure 4 of the TOSA structure 2 Both the conductor grounding structure and the conductor grounding structure are assembled on the PCB board 5, and the BOSA housing induced radiation current is guided to the PCB board 5 through the conductor grounding structure.

In order to understand the anti-interference effect of this embodiment more intuitively, as a comparison, the BOB optical module when the present invention is not implemented is simulated. At the same time, the BOB optical module provided in this embodiment is simulated, wherein the conductor grounding structure adopts two pieces Metal sheet 6 (that is, the optical transceiver assembly in Figure 2 is welded on the PCB board 5 to obtain the BOB optical module in Figure 3 for simulation), the simulation results are shown in Figures 9 and 10:

Figure 9 is a simulation of HFSS, when the method of the present invention is not implemented, one of the five pins of the ROSA structure (denoted as Pin) and the three on-board antennas on the PCB (ie the first antenna 9, the second The simulation result of the isolation between the antenna 10 and the third antenna 11), it can be found that the third antenna 11 (denoted as T1), the first antenna 9 (denoted as T2) and the second antenna 10 (denoted as T3) and the pin Pin The average isolation between the 5GHz frequency band is about -45dB (the isolation between the third antenna 11 and pin Pin is recorded as T1_pin, the isolation between the first antenna 9 and pin Pin is recorded as T2_pin, and the isolation between the second antenna 10 and pin Pin is marked as T2_pin. The isolation is denoted as T3_pin).

Figure 10 is a diagram of one of the five pins of the ROSA structure obtained by HFSS simulation (denoted as Pin) and the three on-board antennas on the PCB board (namely the first antenna 9 , The simulation results of the isolation between the second antenna 10 and the third antenna 11), you can find the third antenna 11 (denoted as T1), the first antenna 9 (denoted as T2) and the second antenna 10 (denoted as T3) The isolation between the pin and Pin in the 5GHz frequency band is around -70dB on average. That is, by implementing the method of the present invention, the isolation between the BOSA and the onboard antennas (ie, the first antenna 9, the second antenna 10, and the third antenna 11) is increased by about 25 dB in the 5 GHz frequency band. In the actual test, under the same circumstances, the BOSA is wrapped in a shielding cover, and the third antenna 11, the first antenna 9 and the second antenna 10 tested by the vector network analyzer are in the 5GHz frequency band between any pin of the ROSA structure The average isolation is around -65dB. That is, the method of the present invention can achieve the effect of anti-interference, and the shielding cover can be removed by implementing the method of the present invention, thereby saving production costs.

2 and 3, the sixth embodiment of the present invention provides an integrated optical transceiver assembly with anti-interference performance, which includes a BOSA housing, a ROSA structure 4 and a conductor grounding structure; the BOSA housing includes a BOSA square Jacket 1, TOSA structure 2 and pigtail structure 3; TOSA structure 2 is set at one end of BOSA square jacket 1, and TOSA circuit board 20 of TOSA structure 2 is used for assembly on PCB board 5; pigtail structure 3 is set at The other end of the BOSA square jacket 1; one end of the ROSA structure 4 is assembled on the bottom wall of the BOSA square jacket 1, and the other end is used for assembly on the PCB board 5; one end of the conductor grounding structure is used for assembly on the BOSA square jacket 1, and the other end Used for assembly on the PCB board 5. When the conductor grounding structure is assembled on the BOSA square casing 1, the conductor grounding structure is located outside the ROSA structure 4 and is used to guide the induced radiation current on the BOSA housing to the PCB board 5. On the ground plane.

In short, the present invention regards the BOSA component mounted on the PCB board 5 as an inverted F antenna, and grounds the BOSA shell by using the metal sheet 6, the BOSA ground pin 7, and the metal sleeve 8 to ground the BOSA shell. The radiation current is introduced into the ground plane of the PCB board 5, which eliminates the antenna effect of the BOSA housing, thereby improving its anti-interference ability. The method proposed by the present invention is flexible and changeable, does not need to change the internal structure of BOSA components, does not need to add sensitive components such as beam splitters, isolators, etc., does not need a shielding cover, opens up more space to the PCB board 5, and has a more compact Operability, more general applicability and lower production costs.

The present invention is not limited to the above-mentioned embodiments. For those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also regarded as the protection of the present invention. Within range. The content not described in detail in this specification belongs to the prior art known to those skilled in the art.

Claims

An integrated optical transceiver assembly with anti-interference performance, characterized in that it comprises:

BOSA housing, the BOSA housing includes:

-BOSA square jacket (1);

-TOSA structure (2), which is assembled on one end of the BOSA square jacket (1), and the TOSA circuit board (20) of the TOSA structure (2) is used for assembly on the PCB board (5);

-The pigtail structure (3), which is assembled at the other end of the BOSA square jacket (1);

ROSA structure (4), one end of which is assembled on the bottom wall of the BOSA square jacket (1), and the other end is used for assembly on the PCB board (5);

A conductor grounding structure, one end of which is assembled on the BOSA square jacket (1), and the other end is used for assembly on the PCB board (5), the conductor grounding structure is located outside the ROSA structure (4), And it is used to guide the induced radiation current on the BOSA shell to the ground plane of the PCB board (5).
The integrated optical transceiver assembly with anti-interference performance according to claim 1, wherein the conductor grounding structure comprises at least one metal sheet (6), and one end of the metal sheet (6) is assembled in the BOSA square A welding part (60) for connecting with the PCB board (5) is formed on the side wall of the jacket (1) and the other end.
The integrated optical transceiver assembly with anti-interference performance according to claim 2, characterized in that the welding part (60) is substantially perpendicular to the metal sheet (6).
The optical transceiver integrated assembly with anti-interference performance according to claim 2, characterized in that: the welding part (60) faces the end of the metal sheet (6) away from the BOSA square jacket (1) toward the The side where the ROSA structure (4) is located or is bent in a direction away from the side where the ROSA structure (4) is located.
The integrated optical transceiver assembly with anti-interference performance according to claim 2, characterized in that: the metal sheet (6) is plugged into the PCB board (5), and the metal sheet (6) is located on the A part of the PCB board (5) forms the soldering part (60).
The integrated optical transceiver assembly with anti-interference performance according to claim 2, characterized in that: the BOSA square jacket (1) is assembled with the side wall of the metal sheet (6) covered by the metal sheet (6). Fully covered.
The integrated optical transceiver assembly with anti-interference performance according to claim 1, characterized in that: the conductor grounding structure includes at least one BOSA grounding pin (7), and one end of the BOSA grounding pin (7) is arranged in the On the bottom wall of the BOSA square jacket (1), and the other end is used to connect with the PCB board (5).
The integrated optical transceiver assembly with anti-interference performance according to claim 7, characterized in that: the BOSA grounding pin (7) is located at the corner of the bottom wall of the BOSA square jacket (1).
The optical transceiver integrated assembly with anti-interference performance of claim 8, wherein:

When there is one BOSA grounding pin (7), the BOSA grounding pin (7) is located on one of the four corners of the bottom wall of the BOSA square jacket (1);

When there are two BOSA grounding pins (7), the two BOSA grounding pins (7) are respectively located on two of the four corners of the bottom wall of the BOSA square jacket (1), and the two BOSAs are grounded The feet (7) are located on the diagonal of the bottom wall of the BOSA square jacket (1);

When there are three BOSA ground pins (7), the three BOSA ground pins (7) are respectively located on three of the four corners of the bottom wall of the BOSA square jacket (1);

When there are four BOSA grounding pins (7), the four BOSA grounding pins (7) are respectively located on the four corners of the bottom wall of the BOSA square jacket (1).
The integrated optical transceiver assembly with anti-interference performance according to claim 1, wherein the conductor grounding structure comprises a metal sleeve (8), one end of the metal sleeve (8) is assembled in the assembly The BOSA square jacket (1) is on the bottom wall, and the other end is used to connect with the PCB board (5).
The integrated optical transceiver assembly with anti-interference performance according to claim 10, wherein the horizontal projection of the metal sleeve (8) is located within the horizontal projection range of the BOSA square casing (1).
A BOB optical module, characterized in that it comprises:

PCB board (5);

The optical transceiver integrated assembly according to any one of claims 1 to 11, the TOSA circuit board (20) of the TOSA structure (2), the ROSA structure (4) and the conductor grounding structure are all assembled in the On the PCB board (5).
An integrated optical transceiver assembly with anti-interference performance, characterized in that it comprises:

BOSA housing, the BOSA housing includes:

-BOSA square jacket (1);

-TOSA structure (2), which is assembled on one end of the BOSA square jacket (1), and the TOSA circuit board (20) of the TOSA structure (2) is used for assembly on the PCB board (5);

-The pigtail structure (3), which is assembled at the other end of the BOSA square jacket (1);

ROSA structure (4), one end of which is assembled on the bottom wall of the BOSA square jacket (1), and the other end is used for assembly on the PCB board (5);

Conductor grounding structure, one end of which is used for assembling on the BOSA square jacket (1), and the other end is used for assembling on the PCB board (5), when the conductor grounding structure is assembled on the BOSA square When the jacket (1) is on, the conductor ground structure is located outside the ROSA structure (4), and is used to guide the induced radiation current on the BOSA shell to the ground plane of the PCB board (5).