WO2021027326A1 - 硅棒截断设备 - Google Patents

硅棒截断设备 Download PDF

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Publication number
WO2021027326A1
WO2021027326A1 PCT/CN2020/087097 CN2020087097W WO2021027326A1 WO 2021027326 A1 WO2021027326 A1 WO 2021027326A1 CN 2020087097 W CN2020087097 W CN 2020087097W WO 2021027326 A1 WO2021027326 A1 WO 2021027326A1
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WO
WIPO (PCT)
Prior art keywords
cutting
silicon rod
wire
wheel
swing arm
Prior art date
Application number
PCT/CN2020/087097
Other languages
English (en)
French (fr)
Inventor
苏静洪
卢建伟
俞佳文
沈鑫佳
韩鸣明
张钦亮
Original Assignee
天通日进精密技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201910750639.4A external-priority patent/CN112388853A/zh
Priority claimed from CN201910749710.7A external-priority patent/CN112388851A/zh
Priority claimed from CN201910749720.0A external-priority patent/CN112388852A/zh
Application filed by 天通日进精密技术有限公司 filed Critical 天通日进精密技术有限公司
Priority to EP20853079.0A priority Critical patent/EP4015175A4/en
Publication of WO2021027326A1 publication Critical patent/WO2021027326A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • This application relates to the technical field of multi-wire cutting, and in particular to a silicon rod cutting device for cutting silicon rods.
  • Wire cutting technology is currently the most advanced silicon material processing technology in the world. Its principle is that the high-speed running steel wire drives the cutting edge material attached to the steel wire or directly uses diamond wire to rub the workpiece to be processed to achieve wire cutting. the goal of. In the cutting process, the steel wire or diamond wire is guided by the wire wheel to form a wire saw or a wire net on the cutting roller, and the workpiece to be processed is realized by the rise and fall of the worktable or the rise and fall of the wire saw or the wire net The feed of the workpiece.
  • the cooling water automatic spraying device installed on the equipment sprays cold water to the cutting parts of the steel wire or diamond wire and the processed parts, and the cutting is generated by the reciprocating movement of the steel wire or diamond wire to remove the material to be processed. Cut into multiple pieces at the same time.
  • Wire cutting technology has the advantages of high efficiency, high productivity, and high precision compared with traditional blades, grinding wheels and internal cutting.
  • the current silicon rod cutting machine needs to cut off the impurity layers at the head and tail of the silicon rod that does not meet the production requirements in the processing process before cutting the silicon rod, and then perform slicing and sampling to test the material characteristics of the silicon rod to be cut;
  • the sample acquisition technology is to cut off the head or tail of the silicon rod by moving the cutting frame or silicon rod a short distance, and then repeat the cutting operation to intercept the silicon wafer sample. It is difficult to accurately control the short-distance movement of the cutting rack or the silicon rod, and it is difficult to unify the specifications of the cut samples and easily cause waste of the silicon rod material.
  • the sampling operation in the traditional process also reduces the cutting efficiency.
  • the purpose of this application is to provide a silicon rod cutting device that can automatically switch between different processes, including a cutting system with a single wire saw and a multi-wire saw at the same time, an automatic feeding device and
  • the automatic blanking device is used to solve the problems in the prior art that the precision of sample acquisition is difficult to control, the sample acquisition causes waste of silicon rod material and reduces the cutting efficiency, and the transfer of workpieces in different procedures causes workpiece damage, complicated procedures, and low efficiency.
  • the present application provides a silicon rod cutting device, including a silicon rod feeding device, which is arranged between a storage area and a cutting work area for placing in the storage area
  • the silicon rod to be cut is transferred to the cutting work area
  • the wire cutting device includes an upper cutting frame suspended in the cutting work area, and the cutting frame is provided with a single-wire wire saw and a multi-wire wire saw for When performing a cutting operation on the silicon rod placed in the cutting work area, the first cutting state of cutting by the multi-wire saw and the cutting by the single-wire saw are realized by the rotation of the cutting frame
  • the silicon rod blanking device is arranged at the discharge end of the cutting work area, and is used to clamp and transport the single-stage silicon rod section that meets the specifications of the workpiece after being cut for clamping for blanking.
  • the wire cutting device includes: a cutting frame, rotatably disposed on a lifting mechanism, including a rotating part, a first cantilever extending from the rotating part in a first direction, The second cantilever extending from the rotating part in the second direction, the third cantilever extending from the rotating part in the third direction;
  • the first multi-wire cutting wheel is arranged at the extension end of the first cantilever and has at least two wire grooves
  • the second multi-wire cutting wheel, arranged at the extension end of the second cantilever has at least two wire grooves, and a multi-wire line is formed around the cutting line segment between the first multi-wire cutting wheel and the second multi-wire cutting wheel Saw;
  • a single wire cutting wheel arranged at the extended end of the third cantilever, around the second multi-wire cutting wheel and the cutting line segment between the single wire cutting wheel to form a single wire saw; wherein the silicon rod is cut During operation, the cutting frame rotates around its rotating part to realize the conversion between the first cutting state of cutting
  • the extension line of the multi-wire saw and the extension line of the single-wire saw form an angle of 90°; the cutting frame can achieve ⁇ 45° on the lifting mechanism Or 90° rotation.
  • the extension line of the multi-wire saw and the extension line of the single-wire saw form an angle of 60°; the cutting frame can achieve ⁇ 60° on the lifting mechanism Or 120° rotation.
  • the first cutting state is a fetching operation state; the second cutting state is a cutting operation state.
  • the cutting wire is wound between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel in a circular winding manner end to end.
  • the first multi-wire cutting wheel or the second multi-wire cutting wheel is driven to rotate by a driving motor to run around the first and second multi-wire cutting wheels , And the cutting line between the single-line cutting wheels.
  • the cutting line is a stranded cutting line formed by twisting at least two cutting lines.
  • the silicon rod cutting device further includes a tension detection mechanism, including a tension wheel arranged on the cutting frame for detecting and adjusting the first multi-wire cutting wheel and the second The tension of the cutting line between multi-wire cutting wheels and single-wire cutting wheels.
  • a tension detection mechanism including a tension wheel arranged on the cutting frame for detecting and adjusting the first multi-wire cutting wheel and the second The tension of the cutting line between multi-wire cutting wheels and single-wire cutting wheels.
  • the silicon rod cutting device further includes at least one wire wheel arranged on the cutting frame to realize the commutation of the cutting line.
  • the cutting wire is guided by the wire wheel to wind around the first multi-wire cutting wheel and the second multi-wire cutting wheel at least twice, and once guided by the wire wheel The single wire cutting wheel.
  • the cutting line is wound around a pay-off reel with a head end and a take-up reel at a tail end, and is wound around the first multi-wire cutting by means of a plurality of wire wheels. Between the wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.
  • the cutting wire is guided by the wire wheel to wind around the first multi-wire cutting wheel and the second multi-wire cutting wheel at least twice, and once guided by the wire wheel The single wire cutting wheel.
  • the silicon rod cutting device further includes at least one tension detection mechanism, including a tension wheel arranged on the cutting frame, the lifting mechanism or the frame, for detecting and adjusting The tension of the cutting line between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.
  • at least one tension detection mechanism including a tension wheel arranged on the cutting frame, the lifting mechanism or the frame, for detecting and adjusting The tension of the cutting line between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.
  • the single-wire cutting wheel when the silicon rod cutting device is in the first cutting state, the single-wire cutting wheel is not in contact with the cutting line; switching from the first cutting state to the second cutting state When the cutting frame rotates around its rotating part so that the single-wire cutting wheel presses the cutting wire, until the second cutting state, the cutting wire is wound on the single-wire cutting wheel to make the The cutting line segment between the single-wire cutting wheel and the second multi-wire cutting wheel forms a single-wire saw.
  • the silicon rod cutting equipment further includes a locking device, which is arranged on the lifting mechanism and is used to rotate the cutting frame around its rotating part to realize the first cutting The cutting frame is locked after the conversion between the state and the second cutting state is completed.
  • the silicon rod cutting device further includes a cutting frame displacement device, which is arranged between the lifting mechanism and the base, and is used for linear displacement along the axial direction of the silicon rod to adjust the cutting position. Describe the length of the silicon rod.
  • a leveling detection device is provided on the lifting mechanism for detecting the level of the axis of the silicon rod to be cut placed in the working area.
  • the silicon rod cutting equipment further includes a leveling device, which is arranged in the working area, and is used to perform a correction on the to-be-cut placed in the working area according to the detection result of the leveling detection device.
  • the axis of the silicon rod is leveled.
  • the silicon rod feeding device includes: a first rotating shaft, which is driven to rotate by a first driving device; and at least two swing arm assemblies, which are respectively pivotally connected to the first shaft according to a preset interval On a rotating shaft, the at least two swing arm assemblies are used to carry the silicon rods to be cut, and are driven by the first rotating shaft to transfer the silicon rods to be cut to the cutting work area of the cutting device; each The swing arm assembly includes a swing arm body axially connected to the first rotating shaft and a supporting mechanism provided on the swing arm body, the supporting mechanism is used to follow the movement of the swing arm to support it During the transfer operation, the part is kept in a state of carrying the silicon rod to be cut.
  • the supporting mechanism includes a manipulator provided at the end of the swing arm body for following the movement of the swing arm so that the supporting portion is kept in the load during the transfer operation. The state of the silicon rod to be cut.
  • the silicon rod cutting device further includes at least two transfer stations corresponding to the swing arm assembly one-to-one, which are arranged on the base of the cutting device and are used for separately At least two swing arm assemblies are respectively axially connected to the first rotating shaft according to a preset interval.
  • the at least two transfer stations include a second movement mechanism for linearly displacing at least one swing arm assembly on the first rotating shaft to adjust the separation distance of the at least two swing arm assemblies.
  • there are four swing arm assemblies including a first swing arm assembly and a second swing arm assembly respectively disposed at both ends of the first rotating shaft, and are respectively pivotally connected according to a preset interval The third swing arm assembly and the fourth swing arm assembly between the two ends of the first rotating shaft.
  • the transfer table of the third swing arm assembly or the fourth swing arm assembly includes a second movement mechanism that is linearly displaced on the first rotating shaft.
  • the silicon rod cutting device further includes a second rotating shaft driven by a second driving device, the second rotating shaft is parallel to the first rotating shaft, and the second driving device follows The working state of the first driving device outputs a corresponding rotation speed or/and rotation angle to the second rotating shaft.
  • the first driving device and the second driving device are respectively disposed on opposite ends of the first rotating shaft or the second rotating shaft.
  • the second rotating shaft is axially connected to the swing arm assembly and is located between the first rotating shaft on the swing arm body and the supporting mechanism.
  • the supporting mechanism includes: a manipulator assembly, arranged at the end of the swing arm body, including: a manipulator body, and movably arranged on the manipulator body for carrying the to-be-cut
  • the supporting member of the silicon rod, the supporting member is dynamically connected to the second rotating shaft, and when the second rotating shaft rotates, the supporting member is driven to rotate on the manipulator body, so that the supporting member is in the transfer operation Keep in the state of supporting the silicon rod to be cut.
  • the swing arm body has a built-in space.
  • the supporting mechanism includes: a driving gear, which is arranged in the built-in space of the swing arm body, and is axially connected to the second rotating shaft for driving on the second rotating shaft Rotate downward;
  • the driven gear is axially connected to the built-in space of the swing arm body and meshes with the driving gear;
  • the manipulator assembly is arranged at the end of the swing arm body, including the manipulator body, and is movably arranged at the The manipulator body is used to carry the supporting member of the silicon rod to be cut, and the supporting member includes a tooth part meshing with the driven gear, and a supporting member used to conform to the outer contour of the silicon rod to be cut. Care department.
  • the number of teeth of the tooth portion of the supporting portion is greater than the number of teeth of the driven gear, and the number of teeth of the driven gear is greater than the number of teeth of the driving gear.
  • the contact surface between the supporting portion and the silicon rod to be cut has a buffer material.
  • the swing arm assembly is provided with a detection device for detecting the contact between the supporting portion and the silicon rod to be cut.
  • the silicon rod cutting device further includes an end reclaiming device, which is arranged at at least one end of the cutting work area, and is also used to accept a cutting tail for the end of the silicon rod to be cut. material.
  • the silicon rod blanking device of the silicon rod cutting device is provided with a sensor device for detecting the cutting position of the end of the silicon rod to be cut.
  • the sensor device is a contact sensor.
  • the silicon rod blanking device includes: a reclaiming arm, which can be movably suspended on the frame of the silicon rod cutting equipment, and includes a telescopic mechanism; The bottom end of the reclaiming arm is used to clamp a single section of silicon rod that meets the specifications of the workpiece after being cut.
  • the clamping member includes: a first clamping block including a first rack and a first clamping portion linked with the first rack; a second clamping block opposite to Mirrored arrangement on the first clamping block, including a second rack and a second clamping part linked with the second rack, a drive gear, connected to a power output shaft of a motor, and connected to the first tooth
  • the bar meshes with the second rack, and is used to drive the first clamping portion and the second clamping portion to move toward each other to perform a clamping action when rotating forward, and drive the first clamp when moving backward
  • the holding part and the second holding part move back to perform a release action.
  • a buffer material is provided on the clamping surfaces of the first clamping portion and the second clamping portion for clamping the single-stage silicon rod section.
  • the silicon rod cutting equipment of the present application is equipped with a rotatable cutting frame.
  • the cutting frame can be rotated to different cutting states.
  • the realization of multi-wire saw cutting and single-wire saw cutting solves the problem of low efficiency in obtaining samples through multiple cuts and difficulty in controlling the thickness of the samples and easily waste materials.
  • the silicon rod cutting equipment of the present application also includes a silicon rod feeding device, which is provided with at least two swing arm assemblies that can move along the axial direction of the silicon rod to be cut, and is matched with the supporting part of the end of the swing arm assembly through a manipulator or a manipulator assembly , In the process of transferring the silicon rods to be cut, the silicon rods are always in a load-bearing state to realize automatic feeding, which effectively improves economic efficiency and safety.
  • the silicon rod cutting equipment of the present application also includes an automatic unloading device, and a driving device is provided for the reclaiming arm and the clamping member that is movably suspended on the frame to realize the functions of clamping and conveying, and improve the entire silicon rod cutting process. Continuity, effectively improve the production efficiency of enterprises.
  • FIG. 1 shows a schematic structural diagram of an embodiment of the silicon rod cutting device of the present application.
  • FIG. 2 shows a schematic diagram of the first cutting state in an embodiment of the silicon rod cutting device of this application.
  • Fig. 3 shows an enlarged schematic diagram of the position a in Fig. 2.
  • FIG. 4 shows a schematic diagram of a second cutting state in an embodiment of the silicon rod cutting device of the present application.
  • Fig. 5 shows a schematic diagram of the cutting frame in an intermediate state in an embodiment of the silicon rod cutting device of the present application.
  • Fig. 6 shows a schematic diagram of a cutting frame in an embodiment of the silicon rod cutting device of the present application.
  • FIG. 7 shows a schematic diagram of the first cutting state in an embodiment of the silicon rod cutting device of this application.
  • FIG. 8 shows a schematic diagram of a second cutting state in an embodiment of the silicon rod cutting device of this application.
  • FIG. 9 shows a schematic diagram of an intermediate state of the silicon rod cutting device according to an embodiment of the present application.
  • Fig. 10 shows a schematic diagram of a cutting frame in an embodiment of the silicon rod cutting device of the present application.
  • FIG. 11 shows a schematic diagram of a silicon rod feeding device in an embodiment of the silicon rod cutting device of this application.
  • Fig. 12 is an enlarged schematic diagram of b in Fig. 11.
  • Fig. 13 is an enlarged schematic diagram of c in Fig. 11.
  • FIG. 14 shows a schematic diagram of a swing arm assembly in an embodiment of the silicon rod stage equipment of this application.
  • FIG. 15 shows a schematic diagram of a swing arm assembly in an embodiment of the silicon rod stage equipment of this application.
  • FIG. 16 shows a schematic diagram of a swing arm assembly in an embodiment of the silicon rod stage equipment of this application.
  • FIG. 17 shows a schematic diagram of a swing arm assembly in an embodiment of the silicon rod stage equipment of this application.
  • FIG. 18 shows a schematic diagram of a swing arm assembly in an embodiment of the silicon rod stage equipment of this application.
  • FIG. 19 shows a schematic diagram of a swing arm assembly in an embodiment of the silicon rod stage equipment of this application.
  • FIG. 20 shows a schematic diagram of a silicon rod blanking device in an embodiment of the silicon rod cutting device of this application.
  • 21a and 21b show schematic diagrams of a silicon rod blanking device in an embodiment of the silicon rod cutting device of the present application.
  • FIG. 22 shows a schematic diagram of a clamping part of a silicon rod blanking device in an embodiment of the silicon rod cutting device of this application.
  • FIG. 23 shows a schematic diagram of a driving device of a silicon rod blanking device in an embodiment of the silicon rod cutting device of this application.
  • FIG. 24 shows a schematic diagram of a driving device of a silicon rod blanking device in an embodiment of the silicon rod cutting device of this application.
  • Fig. 25 is an enlarged schematic diagram of d in Fig. 21b.
  • first, second, etc. are used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element.
  • the first multi-wire cutting wheel may be referred to as the second multi-wire cutting wheel, and similarly, the second multi-wire cutting wheel may be referred to as the first multi-wire cutting wheel without departing from the various described embodiments Range.
  • the first multi-wire cutting wheel and the second multi-wire cutting wheel are both describing a cutting wheel, but unless the context clearly indicates otherwise, they are not the same multi-wire cutting wheel. Similar situations also include the first cantilever, the second cantilever and the third cantilever, the first swing arm assembly and the second swing arm assembly, or the first movement mechanism and the second movement mechanism, the first clamping portion and the second clamp Holding Ministry and so on.
  • A, B or C or "A, B and/or C” means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C” .
  • An exception to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.
  • the process of silicon ingot operation starts with cutting the original long silicon ingot to form multiple short silicon ingots (that is, the silicon ingot section that meets the specifications of the workpiece after cutting the silicon ingot and cut off).
  • the cutting operation uses equipment that is silicon ingot cutting equipment. .
  • there is a worktable on the silicon rod cutting equipment For example, the cutting wire of steel wire or diamond wire is guided by the wire wheel to form a wire saw on the cutting roller to cut the single silicon rod to be processed as the subsequent silicon.
  • the existing sample acquisition methods generally cut off the head or tail of the silicon rod by moving the cutting frame or the silicon rod, and then repeat the cutting operation to intercept the silicon wafer sample.
  • the thickness of the intercepted silicon wafer sample depends on the moving distance controlled manually. , It is difficult to accurately control the short-distance movement of the cutting frame or the silicon rod, and it is difficult to unify the specifications of the intercepted samples. At the same time, it is difficult to realize the short-distance movement required for the silicon wafer samples (for example, 2mm-20mm). The waste of materials and the sampling operation that requires human control in the traditional process also reduces the cutting efficiency.
  • the first dimension direction is the axial direction of the silicon rod to be cut or forward and backward
  • the second dimension direction is left and right, for example
  • the direction of the linear displacement of the feeding device between the storage area and the cutting work area is left or right
  • the third dimension direction is the ascending and descending direction or the up and down direction, such as the ascending or descending direction of the cutting frame.
  • FIG. 1 shows the structure diagram of the silicon rod cutting device in an embodiment of the application, including a wire cutting device 1, a silicon rod feeding device 2, and a silicon rod unloading device 3.
  • FIG. 2 shows a side view of the wire cutting device of the present application in a first cutting state in an embodiment.
  • the wire cutting device of the present application is used to perform cutting operations on silicon rods.
  • the cutting operations are, for example, cutting operations, square root operations, or slicing operations; in an embodiment, the silicon rods include single crystals. Silicon rods and polycrystalline silicon rods.
  • Single crystal silicon rods are used to grow rod-shaped single crystal silicon from the melt by the Czochralski method or the suspension zone melting method. For example, it is usually about 5000mm (for example, the specification of 5360mm, etc.) in silicon rod processing.
  • Single crystal silicon rods with a length of about 800 mm, etc., polycrystalline silicon is a silicon rod that uses precipitation techniques such as chemical vapor deposition to precipitate silicon on the surface of the silicon core wire; but it is not limited to this.
  • the wire cutting device can also be used to cut off polysilicon ingots, or other long strips of hard materials that need to be cut off.
  • the wire cutting device 1 of the silicon rod cutting device applied to the silicon rod cutting operation of the present application includes a cutting frame 111, a first multi-wire cutting wheel 112 and a second multi-wire cutting wheel 113, and
  • the cutting line segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 forms a multi-wire saw 1121, and the single-wire cutting wheel 114 is wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114
  • the cutting line segments form a single wire saw (not shown in the embodiment shown in FIG. 2); the winding system 12, the frame 13, the lifting mechanism 14, and the base 15.
  • the lifting mechanism 14 moves up and down to drive the first group.
  • the multi-wire saw 1121 formed by the cutting line segment between the wire cutting wheel 112 and the second multi-wire cutting wheel 113 moves up and down in the lifting direction to realize the alignment Multi-wire cutting of the silicon rod to be processed (not shown in the figure) under the multi-wire saw 1121.
  • the parallel cutting wire saws cut the silicon rod to be processed at the same time.
  • the silicon rod slice is also obtained as the required silicon wafer sample.
  • the first cutting state is the slice taking state.
  • the winding system 12 of the wire cutting device of the present application further includes a cutting wire 121, a wire wheel 1221, a wire wheel 1222, and a tension detection component 123.
  • the wire cutting equipment further includes a cutting frame displacement device which is arranged between the frame and the machine base.
  • the frame 13 The machine base of the wire cutting equipment is movably connected with the horizontal guide rail (not shown in the figure) in the first dimension direction.
  • the machine base includes a horizontal guide rail in a first dimension direction, and a guide groove matching the horizontal guide rail is provided at the bottom of the frame 13 of the cutting system.
  • the cutting frame displacement device drives the cutting frame to move linearly along the front and rear directions on the cutting work area (or cutting table) of the machine base, so that the wire saw (single wire saw or multi-wire wire saw, but in the cutting work
  • the cutting frame is usually in the state of a single wire saw, that is, the second cutting state described in this application) linearly displaced along the axial direction of the silicon rod, and the length of the silicon rod can be adjusted and truncated to obtain the desired Single-stage silicon rod section that meets the specifications of the workpiece.
  • a driving mechanism is provided inside or outside the frame 13 for driving the frame 13 to move on the horizontal guide rail of the base 15.
  • the drive mechanism of the frame 13 includes: a traveling screw (not shown in the figure) arranged along the guide rail of the frame and connected to the frame 13, and a traveling screw connected to the traveling screw Motor (not shown in the figure).
  • the traveling motor is used to drive the rack 13 to travel along the guide rail.
  • the traveling motor on the rack 13 is connected to the traveling screw laid on the guide rail to realize the rack 13 along the first rail on the guide rail.
  • the one-dimensional direction is the relative movement between the axial direction of the silicon rod to be cut on the supporting device and the frame 13.
  • the cutting frame 111 is movably connected with the frame 13 in the lifting direction, and is fixed on the frame 13 in the first dimension direction, that is, the cutting wire saw on the cutting frame 111 and the carrying device to be cut are realized
  • the relative displacement of the silicon rod in the axial direction of the silicon rod to be cut may be driven by external force.
  • FIG. 3 shows an enlarged schematic view of the wire cutting device of FIG. 2 at a.
  • the frame 13 has a guide rail structure for cooperating with the lifting and moving of the lifting mechanism 14.
  • the frame 13 includes a lifting rail 131, and the lifting mechanism 14 has a guide groove that matches the lifting rail (not shown in the figure).
  • a driving mechanism (not shown in the figure) is provided inside or outside the lifting mechanism 14 for driving the lifting mechanism 14 moves on the guide rail 131 of the rack 13.
  • the driving mechanism of the lifting mechanism 14 includes: a traveling screw arranged along the guide rail of the frame 13 and connected to the lifting mechanism 14, and a traveling motor connected to the traveling screw.
  • the traveling motor is used to drive the elevating mechanism 14 to travel along the guide rail.
  • the traveling motor on the elevating mechanism 14 is connected with the traveling screw laid on the guide rail to realize that the elevating mechanism 14 is perpendicular to the guide rail.
  • the direction of the relative movement of the frame 13 and the restriction of the movement of the lifting mechanism 14 relative to the frame 13 is a single degree of freedom of the lifting direction.
  • the connecting assembly of the lifting mechanism 14 and the lifting rail of the frame 13 further includes a limit block for limiting the lifting mechanism 14 from excessive displacement during the lifting movement.
  • the wire wheel 122 is arranged on the cutting frame and the frame to realize the commutation of the cutting line and guide the cutting line.
  • the wire wheel may include a horizontal wire wheel, a longitudinal wire wheel, As well as oblique wire guide wheels, etc., they can be installed on different installation structures according to the routing mode of the cutting line to achieve the purpose of guiding the cutting line.
  • the wire cutting device adopts a non-closed winding method, and the cutting wire is wound around a pay-off reel at the head end, and wound on a take-up reel at its tail end, and passes through a plurality of wire wheels.
  • the guiding method is wound between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel, so that in the first cutting state, the cutting frame performs a lifting and cutting operation to intercept the wafer samples, and the second cutting In the state, the cutting frame performs a lifting and cutting operation to cut the silicon rod.
  • FIG. 2 shows a side view of an embodiment of the wire cutting device of this application in a non-closed winding method, including a cutting frame 111, a first multi-wire cutting wheel 112, a second multi-wire cutting wheel 113,
  • the wire is wound between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire saw 1121.
  • the single-wire cutting wheel 114 is wound around the second multi-wire cutting wheel 113 and the single wire.
  • a single wire saw (not shown in the cutting state shown in the figure) can be formed between the cutting wheels 114; the winding system 12 and the machine base 15.
  • the cutting frame 111 is rotatably arranged on the lifting mechanism 14, and the rotating frame includes a rotating part 1111, a first cantilever 1112, a second cantilever 1113, and a third cantilever 1114.
  • the rotation axis center of the rotation portion 1111 of the rotation portion 1111 is the rotation center of the cutting frame 111;
  • the first cantilever 1112 is a beam structure extending along the rotation portion 1111 in a first direction;
  • the second cantilever 1113 is a beam structure extending in the second direction along the rotating part 1111;
  • the third cantilever 1114 is a beam structure extending in the third direction along the rotating part 1111;
  • the cantilever 1113 and the third cantilever 1114 are both located on the rotating fixed plate of the cutting frame 111, that is, rotate with the rotation of the rotating part 1111.
  • the central axis of the rotating shaft of the rotating part 1111 is connected to a drive motor, and the motor shaft, namely the power output shaft, drives the cutting frame 111 to rotate along the rotating part 1111.
  • the spatial positions of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 on the cutting frame 111 are arranged approximately to form a T-shaped structure, and the rotation center of the cutting frame 111 is set at the intersection of the three cantilevers of the cutting frame 111 End area.
  • the position of the rotation center is set in the center of gravity area of the cutting frame 111 according to the structure and material characteristics of the cutting frame 111 to reduce structural wear caused by the dead weight of the cutting frame 111 to the torque of the rotating part 1111 shaft.
  • the free ends (that is, the extension ends) of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are connected to the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 112, respectively.
  • the cutting wheel 113 and the single-wire cutting wheel 114 are rotatably connected.
  • a multi-wire saw 1121 is formed between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113.
  • the second multi-wire cutting wheel 113 is connected to the single-wire cutting wheel.
  • a single wire saw 1141 is formed between 114.
  • the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 are all located on the rotating fixed plate of the cutting frame 111, that is, rotate with the rotation of the rotating part 1111.
  • the first multi-wire cutting wheel 112 is a cutting wheel provided with at least two wire grooves (including two or more wire grooves), and is rotatably arranged at the extended end of the first cantilever 1112 away from the center of rotation ,
  • the arrangement of the various wire grooves on the cutting wheel is parallel to each other to ensure that the cutting lines wound on the cutting wheel are parallel to each other.
  • the basic structure and installation method of the cutting wheel are well-known or easily known to those skilled in the art. Repeat it again.
  • the second multi-wire cutting wheel 113 is a cutting wheel provided with at least two wire grooves, and is rotatably arranged at the extended end of the second cantilever 1113 away from the center of rotation.
  • the arrangement of the respective wire grooves on the cutting wheel is mutually Parallel, in particular, the distance between adjacent grooves of the second multi-wire cutting wheel is equal to the distance between adjacent grooves of the first multi-wire cutting wheel, so as to achieve winding between two multi-wire cutting wheels
  • the cutting sections of the multi-wire saw 1121 formed by the cutting lines meet the spatial relationship parallel to each other.
  • the single-wire cutting wheel 114 is rotatably arranged at the extended end of the third cantilever 1114 away from the center of rotation, and conforms to the cutting line segment between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 to form a single-wire saw
  • the plane of the groove of the single-wire cutting wheel 114 in the first dimension is the same plane as the plane of the at least one groove of the second multi-wire cutting wheel 113 in the first dimension.
  • the single-wire cutting wheel 114 may be provided with a cutting wheel with a plurality of wire grooves. In the winding mode, the cutting wire is wound on the wire groove of the single-wire cutting wheel once to realize the extraction Single wire saw.
  • the cutting frame 111 rotates around its rotating part 1111 to realize the first cutting state of cutting by the multi-wire saw 1121 and The switching of the second cutting state of cutting is performed by the single wire saw.
  • the lifting mechanism 14 moves up and down to drive the cutting line segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire saw 1121 (
  • the embodiment shown in FIG. 2 is a double-wire wire saw) moving up and down in the lifting direction to realize multi-wire cutting of the silicon rod to be processed (not shown in the figure) under the multi-wire saw 1121.
  • the cutting lines 121 parallel to each other cut the silicon rods to be processed at the same time, and the silicon rod slices, that is, the required silicon wafer samples, can be intercepted.
  • the rotating part 1111 connected to the cutting frame and the lifting mechanism is a rotary flange lock, that is, the cutting frame 111 and the lifting mechanism 14 pass through a rotary method.
  • Lanpan lock 1111 is movably connected.
  • the rotary flange lock 1111 includes a first flange, a second flange (not shown in the figure), bolts and nuts.
  • the first flange is provided with a plurality of diameters larger than the diameter of the bolt screw and smaller than the diameter of the bolt head.
  • the first through hole and the second flange are provided with a plurality of second through holes corresponding to the first through hole, the second through hole includes a large round hole and a small round hole, the large round hole and the small round hole communicate with each other from the side wall
  • the nut is a 7-shaped nut, the diameter of one end of the nut is larger than the diameter of the small round hole and smaller than the diameter of the large round hole.
  • the combination of the nut and the special-shaped hole makes the flange lock disassembly and assembly easier and labor-saving.
  • the connecting nut in the flange lock may be a wing nut.
  • connection between the cutting frame and the lifting mechanism can be configured as a rotating part driven by a worm gear, including a worm gear, a forward worm, a reverse worm, a driver, and a motor.
  • the forward rotation worm and the reverse rotation worm mesh with the worm gear respectively, the driver controls the magnitude and direction of the current in the motor, and the motor provides torque to the worm gear through the worm to realize the rotation of the cutting frame.
  • the cutting wire 121 may be a steel wire, or may be a small hard wire made of diamond, etc.
  • the diamond wire formed by inlaying particles on the cutting steel wire can also be the diamond wire described in Chinese Patent 201620281204.1 (title of invention: diamond wire and multi-wire cutting equipment), that is, the diamond wire includes: steel wire, the steel wire It is divided into at least two types of cutting sections arranged at intervals; at least two diamond-like layers respectively plated on the at least two types of cutting sections, and the particle grades of each of the diamond layers are different.
  • the winding of the diamond wire on the yarn storage cylinder may preferably be a single-layer winding.
  • the wire storage drum wire arrangement described in Chinese patent 200910197800.6 (title of the invention: wire storage drum wire arrangement mechanism of the diamond wire cutting machine) can be adopted.
  • the cutting system composed of each frame 13 and the cutting frame includes at least one tension detection mechanism, and the tension detection mechanism includes at least one tension wheel 123, which is arranged at all
  • the cutting frame 111, the lifting mechanism 14 or the frame 13 are used to detect and adjust the tension between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114.
  • the tension wheel 123 can adopt the tension adjustment mechanism described in Chinese patent 200910199387.7 (title of invention: tension adjustment mechanism of diamond wire square machine); it can also adopt Chinese patent 201410245524.7 (title of invention: multi-thread Cutting equipment and its tension adjustment mechanism) described in the real-time sensing of the tension of the steel wire or cutting wire between the traction assembly and the wire storage drum (spool) and the tension of the steel wire or diamond wire between the traction assembly and the cutting zone According to the sensed tension value, the tension of the steel wire or diamond wire on the bobbin and the tension of the steel wire or diamond wire in the cutting zone can be adjusted respectively.
  • the tension detection mechanism may also use a tension transition wheel (not shown) to ensure that the cutting line 121 is in a tension balance state during the cutting process.
  • the cutting frame 111 is introduced through the first tension transition wheel, and after winding the cutting wheel on the cutting frame 111, it is led out to the guide wheel 1221 of the frame 13 through the second tension transition wheel, and guided by the guide wheel 1221 Wound on the take-up barrel 125.
  • the first tension transition wheel cooperates with the pay-off drum to adjust the cutting line 121 between the first tension transition wheel and the first multi-wire cutting wheel to ensure that the cutting line 121 is in a balanced state.
  • the two tension transition wheels cooperate with the wire take-up barrel to adjust the cutting line 121 between the second tension transition wheel and the second multi-wire cutting wheel or the single-wire cutting wheel to ensure that the cutting line 121 is in a balanced state.
  • the cutting system further includes a winding motor to drive and run the cutting line 121 between the take-up reel 125 and the pay-off reel 124.
  • the wire cutting device of the present application is further improved in that it also includes a locking device, which is arranged on the lifting mechanism and is used for checking the cutting state after the cutting frame is switched between different cutting states. Freeze.
  • the cantilever degree of freedom of the cutting frame is greater than 0.
  • the contact force between the cutting line 121 and the silicon rod to be cut may cause the cutting frame to rotate.
  • the use of a locking device is an implementation means to make the cutting frame After the driving motor of the rotating part rotates and reaches the preset position of the cutting state, it stops rotating and is in a locked state.
  • the locking device includes a rotary locking cylinder, and the rotary locking cylinder is in a relaxed state during the rotation process of the cutting frame conversion, so that the cutting frame reaches a preset value. After the cutting state, it enters the braking state.
  • the locking device also includes a positioning device.
  • the rotation of the cutting frame is a passive rotation driven by a driving motor, and the rotation state of the cutting frame is controlled by the motor.
  • the moment of inertia of the cutting frame itself can maintain the cutting frame to continue to rotate after the motor stops running.
  • the rotational angular velocity and duration of the rotary motion driven by the moment of inertia are difficult to manipulate manually, which will affect the cutting frame after stopping.
  • the positioning device is arranged on the lifting mechanism and includes a fixed module for automatically detecting the line, and a positioning fixture assembly.
  • the fixed module for automatically detecting the line detects After the parts in the cutting frame are placed in the positioning fixture assembly, the cylinder of the locking cylinder is rotated to extend, and the positioning fixture assembly is pushed to clamp the cutting frame so that the relative movement of the cutting frame and the lifting mechanism is 0.
  • the winding method of the wire cutting device is non-closed, with the pay-off drum as the starting point and the take-up drum as the end point, and the cutting line 121 passes through the on-line cutting device Frame and cutting frame, the cutting line 121 starts from the pay-off drum and is wound on the frame according to the arrangement of the wire wheels, and then from the frame 13 to the cutting frame 111 to cut the wire wheels and the first multi-wire The wheel 112, the second multi-thread cutting wheel 113, and the single-thread cutting wheel 114 perform winding. After winding on the cutting frame, the cutting wire 121 is guided from the frame to the winding drum through the wire wheel.
  • the winding method of the cutting line 121 on the cutting frame is to be wound from the frame to the wire wheel 1222 along the wire groove tangent point of the wire wheel 1222 as the starting point ,
  • the direction of the cutting line 121 is the tangential direction;
  • first multi-wire cutting wheel 112 Sequentially wound around the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, the wire wheel 1221, and the cutting line 121 guided by the wire wheel 1221 in one round is in the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 112
  • the first cutting wire saw is formed between the wire cutting wheels 113;
  • the cutting line 121 starting from the cutting line of the wire groove of the wire wheel 1221 sequentially circulates through the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and after being surrounded by the second multi-wire cutting wheel 113, it forms the same
  • the second cutting wire saw in which the first cutting wire saw of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 are parallel to each other in one round will form a multi-wire saw 1121, that is, two parallel wire saws are finally formed Cutting wire saw;
  • the extension cord extending from the tangent pay-off of the lower edge of the second multi-wire cutting wheel is wound to the wire wheel 1223 on the frame as the end point of the winding on the cutting frame 111.
  • the wire cutting device there may be multiple tension wheels around which the cutting wire on one frame of the wire cutting device passes.
  • the loop winding method may pass through the first multi-wire cutting wheel and the second multi-wire cutting wheel more than two times, forming parallel
  • the cutting wire saw can cut multiple samples of silicon wafers in one lifting and cutting of the cutting frame.
  • the first cutting state is that the cutting frame 111 rotates to the level where the lower edge of the first multi-wire cutting wheel 112 is located and the lower edge of the second multi-wire cutting wheel 113 is located
  • the horizontal plane is the state of the same horizontal plane, and the common horizontal plane is located below the structure of the cutting frame 111 in the first cutting state, and is wound between the first multi-wire cutting wheel 111 and the second multi-wire cutting wheel 113
  • the cutting line 121 forms a multi-wire saw, and the multi-wire saw is a horizontal parallel line, that is, the first cutting state is a chip-taking operation state that can intercept a silicon wafer sample in one cutting action.
  • the single wire cutting wheel and the cutting wire 121 are in a separated state (non-contact state).
  • the wire cutting device is shown in the second cutting state.
  • the second cutting state is that the cutting frame 111 rotates to the level where the lower edge of the second multi-wire cutting wheel 113 is located and the level where the lower edge of the single-wire cutting wheel 114 is located.
  • the state of the same horizontal plane, and the common horizontal plane is located below the structure of the cutting frame 111 in the first cutting state, and is wound around the section 121 of the cutting line between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114
  • a horizontal single wire saw 1141 is formed. That is, the second cutting state is a state where the silicon rod can be cut in one cutting action.
  • the extension line of the first cantilever 1112 of the cutting frame 111 and the extension line of the second cantilever 1113 form an angle of 45°
  • the extension line of the second cantilever 1113 and the extension line of the third cantilever 1114 form an angle.
  • the cantilever structure of the cutting frame 111 takes the center line of the second cantilever 1113 as a line of symmetry and is approximately symmetrical.
  • the extension line of the multi-wire saw and the extension line of the single-wire saw form an angle of 90°.
  • the first cutting state to the first cutting state can be realized by 90° rotation around the rotation axis, or the conversion from the intermediate state to the first cutting state or the second cutting state can be realized by ⁇ 45° rotation around the rotation axis.
  • FIG. 5 shows a side view of the cutting frame in an intermediate state in an embodiment of the wire cutting device of this application.
  • the intermediate state is that the cutting frame 111 is in a relaxed state in the locking device, that is, the cutting frame 111 and the positioning When the clamp assembly is separated, it is in a natural static state under the gravity action of the cutting frame 111.
  • the single-wire saws between the wheels 114 are at a certain angle to the horizontal.
  • the single-wire saw and the single-wire cutting wheel 114 are in a tangent state; the cutting frame is approximately a T-shaped structure placed upright in a space, that is, the cutting frame 111 The state where the center of gravity of the part below the horizontal plane where the center of rotation is located is the lowest.
  • the single wire cutting wheel 114 and the cutting wire 121 are in a separated state.
  • the single-wire cutting 114 wheel follows the rotation of the third cantilever 1114 of the cutting frame 111 around the center of rotation and the cutting line 121 separates from the first cutting state to
  • the intermediate state touches tangentially and then reaches the compressed state in the second cutting state. After reaching the position of the second cutting state, it is locked by the rotary locking cylinder to be stationary.
  • the wire groove in the single-wire cutting wheel 114 that is on the same plane as the cutting line 121 in the first dimension direction is rotated to the second cutting state and then contacts the cutting line 121 and presses the cutting line 121 to a horizontal state to form a second multi-wire Single wire saw between cutting wheel 113 and single wire cutting wheel 114.
  • the process includes the following cutting state: adjusting the position of the silicon rod (the silicon rod to be cut) on the supporting device and then clamping, Keep the silicon rod still, adjust the position of the frame in the first dimension direction, so that the cutting wire saw is located at the head (or tail) to be intercepted, or in the case of two wire frames, the two cutting frames are respectively located on the silicon to be cut At the top of the junction section of the bar's head and tail) and the part that meets the processing specifications, the motor drives the cutting frame to rotate a certain angle (45° in the illustrated embodiment) from the natural static intermediate state to the first cutting state of the multi-wire saw cutting.
  • the cutting frame is locked by rotating the locking cylinder, the lifting mechanism is lowered to drive the wire saw to move to contact the silicon rod and continue cutting, that is, the silicon wafer sample is intercepted when the head is cut off; the lifting mechanism rises away from the silicon rod after the sampling is completed.
  • the traveling motor on the horizontal guide rail adjusts the position of the frame in the first dimension, and the motor connected to the rotation axis of the cutting frame drives the cutting frame to rotate at a certain angle (90 in the illustrated embodiment °) to the second cutting state of single-wire cutting, the cutting line and the single-wire cutting wheel gradually separate to the compressed state during rotation, until the cutting line is wound on the single-wire cutting wheel, and a horizontal single line is formed in the second cutting state Wire saw, and the cutting frame is locked by the rotating locking cylinder, and the lifting mechanism drives the cutting wire saw down to cut to obtain the silicon rod section; repeat the steps of the single wire saw to cut the silicon rod according to the requirements of the crystal section until the completion of the alignment Cutting operation of the whole silicon rod.
  • the locking cylinder is in a relaxed state, and the cutting frame rotates from the second cutting state to a certain angle (45° in the illustrated embodiment) to an intermediate state.
  • the angle between the first cantilever 1112, the second cantilever 1113, and the third cantilever 1113 of the first cutting frame 111 can be changed.
  • the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114 are respectively fixed on the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 .
  • the angle between the extension lines is 60°.
  • the mutual conversion between the first cutting state and the second cutting state can be realized by rotating 120° around the rotation axis, from the intermediate state to the second cutting state.
  • the conversion of the first cutting state or the second cutting state can be realized by rotating around the rotation axis by ⁇ 60°.
  • the winding system of the wire cutting device of the present application adopts a closed winding structure, and the cutting wire 121 is wound around the wire in an end-to-end circular winding manner.
  • the cutting line 121 passes through the cutting grooves of the first multi-line cutting wheel 112 and the second multi-line cutting wheel 113 to wind around the cutting wheel, and the formed cutting line is saw in the tangential direction of the cutting groove.
  • the cutting line 121 is guided by the wire wheel to wind around the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 at least twice, and once guided by the wire wheel to the single-wire cutting wheel 114 .
  • the distance between the plurality of wire grooves surrounding the first multi-wire cutting wheel 112 and the distance between the plurality of wire grooves surrounding the second multi-wire cutting wheel 113 are correspondingly equal, that is, along the first
  • the multi-wire cutting wheel 112 and the cutting line 121 drawn from the tangential direction of the slot of the second multi-wire cutting wheel 113 satisfy a mutually parallel spatial relationship.
  • the cutting frame 111 is rotatably disposed on a lifting mechanism (not shown in the figure).
  • the cutting frame 111 includes a rotating portion 1111, a first cantilever 1112, a second cantilever 1113, and a third cantilever 1114.
  • the center of the rotation axis of the rotating portion 1111 is the center of rotation of the cutting frame;
  • the first cantilever 1112 is a beam structure extending along the rotating portion 1111 in the first direction;
  • the second cantilever 1113 is along the The rotating part 1111 extends in the second direction;
  • the third cantilever 1114 is a beam structure extending in the third direction along the rotating part 1111;
  • the three cantilevers 1114 are all located on the rotating fixed plate of the cutting frame 111, that is, they rotate with the rotation of the rotating part 1111.
  • the central axis of the rotating shaft of the rotating part 1111 is connected to a driving motor, and the motor shaft, ie, the power output shaft, drives the cutting frame to rotate along the rotating part.
  • the spatial arrangement of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 on the cutting frame approximately form a T-shaped structure, and the rotation center of the cutting frame is set at the intersection of the three cantilever arms of the cutting frame.
  • the position of the rotation center is set in the center of gravity area of the cutting frame according to the structure and material characteristics of the cutting frame, so as to reduce the structural wear caused by the dead weight of the cutting frame to the torque of the rotating part shaft.
  • the free ends (that is, the extension ends) of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are connected to the first multi-wire cutting wheel and the second multi-wire cutting wheel, respectively.
  • the wheel and the single-wire cutting wheel are fixedly connected, a multi-wire saw 1121 is formed between the first multi-wire cutting wheel and the second multi-wire cutting wheel, and a single-wire saw is formed between the second multi-wire cutting wheel and the single-wire cutting wheel (Not shown in the illustrated embodiment).
  • the first multi-wire cutting wheel 112 is a cutting wheel provided with at least two wire grooves, and is fixedly arranged at the extending end of the first cantilever 1112 away from the center of rotation, wherein the arrangement of the wire grooves on the cutting wheel is parallel to each other, To ensure that the cutting lines wound on the cutting wheel are parallel to each other, the basic structure and installation method of the cutting wheel are well known or easily known to those skilled in the art, and will not be repeated here.
  • the second multi-wire cutting wheel 113 is a cutting wheel provided with at least two wire grooves, and is rotatably arranged at the extended end of the second cantilever 1113 away from the center of rotation.
  • the arrangement of the respective wire grooves on the cutting wheel is mutually Parallel, in particular, the distance between adjacent grooves of the second multi-wire cutting wheel 113 is equal to the distance between adjacent grooves of the first multi-wire cutting wheel 112, so as to achieve winding around the two multi-wire cutting wheels
  • the cutting sections of the multi-wire saw formed by the cutting lines between the cutting lines meet the mutual parallel spatial relationship.
  • the single-wire cutting wheel 114 is rotatably arranged at the extended end of the third cantilever 1114 away from the center of rotation, and conforms to the cutting line segment between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 to form a single-wire saw
  • the plane of the groove of the single-wire cutting wheel 114 in the first dimension is the same plane as the plane of the at least one groove of the second multi-wire cutting wheel 113 in the first dimension.
  • the single wire cutting wheel 114 may be a cutting wheel provided with a plurality of wire grooves. In the winding mode, the cutting wire winds the wire groove of the single wire cutting wheel 114 once, that is, A single wire saw can be drawn out.
  • the cutting frame rotates around its rotating part to realize the first cutting state of cutting by the multi-wire saw and by the The single wire saw performs the conversion of the second cutting state of cutting.
  • the lifting mechanism moves up and down to drive the cutting line segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire saw 1121 (such as The embodiment shown in Figure 1 is a double-wire wire saw) moving up and down in the lifting direction to realize the multi-wire cutting of the silicon rod to be processed (not shown in the figure) located under the multi-wire saw 1121, in one lifting movement
  • the parallel cutting wire saws cut the silicon rods to be processed at the same time, and the silicon rod slices can be cut to obtain the required silicon wafer samples.
  • the rotating part 1111 connecting the cutting frame and the lifting mechanism is a rotating flange lock.
  • the rotary flange lock includes a first flange, a second flange (not shown in the figure), bolts and nuts.
  • the first flange is provided with a plurality of first flanges with a diameter larger than the diameter of the bolt screw and smaller than the diameter of the bolt head.
  • a through hole, the second flange is provided with a plurality of second through holes corresponding to the first through hole, the second through hole includes a large round hole and a small round hole, the large round hole and the small round hole communicate with each other from the side wall;
  • the nut is a 7-shaped nut.
  • the connecting nut in the flange lock may be a wing nut.
  • connection between the cutting frame and the lifting mechanism can be configured as a rotating part driven by a worm gear, including a worm gear, a forward worm, a reverse worm, a driver, and a motor.
  • the forward rotation worm and the reverse rotation worm mesh with the worm gear respectively, the driver controls the magnitude and direction of the current in the motor, and the motor provides torque to the worm gear through the worm to realize the rotation of the cutting frame.
  • the cutting line 121 is a stranded cutting line formed by twisting at least two cutting lines.
  • the stranded wire cutting line is formed by two or more steel wire single wires or diamond wire single wires used for stranding around the stranding shaft rotating at the same angular velocity and cooperating with the strand winding method to advance at a uniform speed, or by multiple stranding wires.
  • a single wire is formed by twisting in a certain direction and rules. Compared with the single wire cutting wire with the same cross-sectional area as the stranded wire, the stranded wire cutting wire has higher mechanical properties and flexibility, and the cutting wire is repeatedly worn during the extended cutting. Fatigue life.
  • the winding method of the cutting line 121 is a closed ring structure.
  • the winding method of the cutting line 121 is to start from the single-wire cutting wheel 114 along the line groove of the single-wire cutting wheel 1114. Starting point, the direction of the cutting line 121 is the tangential direction;
  • the cutting line 121 guided by the wire wheel 122 in one round is in the first multi-wire cutting wheel and the second multi-wire cutting wheel.
  • the first cutting wire saw is formed between the cutting wheels;
  • the cutting line 121 that starts from the cutting line of the wire groove of the wire wheel circulates and passes through the second multi-wire cutting wheel 113.
  • the first multi-wire cutting wheel 112 is surrounded by the first multi-wire cutting wheel 112 to form the same
  • a multi-wire saw 1121 is formed between 113;
  • the cutting line 121 is wound to the single-wire cutting wheel 114 via the tensioning wheel 123, and reaches the hypothetical cutoff point on the single-wire cutting wheel 114, that is, the end-to-end loop winding method is realized in the actual winding.
  • the contact between the cutting line 121 and the cutting wheel on the cutting groove is inferior arc (an arc with an angle less than 180°)
  • the cutting line 121 is under tension between the cutting wheels
  • the winding position is
  • the single-line cutting wheel or the multi-line cutting wheel, the tensioning wheel and the wire wheel constitute the convex outer edge.
  • the wire cutting device there may be multiple wire wheels 122 through which the looped wire on one cutting frame 111 passes.
  • the wire cutting device there may be a plurality of tension wheels 123 through which the ring-shaped winding on one cutting frame 111 passes.
  • the loop winding method may pass through the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 more than two times to form mutually parallel cutting wire saws.
  • the cutting frame can cut multiple wafer samples in one lifting and cutting.
  • the winding system formed by the circular winding method further includes a drive motor (not shown in the figure), which is arranged on the first multi-wire cutting wheel 112 or the second multi-wire cutting wheel 113
  • the drive motor is the power source for running the cutting wire in the winding system, and the drive motor directly drives the first multi-wire cutting wheel 112 or the second multi-wire cutting wheel 113,
  • the cutting line 121 is driven to rotate around the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114.
  • the tension detection mechanism includes a tensioning wheel 123 arranged on the cutting frame for detecting and adjusting the cutting between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114
  • the tension of the line 121 affects the yield and processing accuracy in cutting.
  • the tension detection mechanism detects and adjusts the tension of the cutting line to reach a set threshold and maintain a constant value during cutting.
  • the constant value is a certain range allowed by the numerical center.
  • the tension wheel 123 is used to adjust the tension of the cutting line 121, which can reduce the probability of breaking of the cutting line 121 and reduce consumables.
  • the role of the cutting line 121 is very important, but even the best cutting line 121, its extension and wear resistance are also limited, that is to say, the cutting line 121 will gradually become thinner in the reciprocating motion, until the final Was pulled off. Therefore, the current wire cutting equipment generally designs a tension compensation mechanism of the cutting line 121 to compensate for the extension of the cutting line 121 during reciprocating travel, and the use of a tension wheel 123 is an implementation means.
  • the tension detection mechanism at least includes a tension wheel, a tension sensor, a servo motor and a screw rod.
  • the tension wheel is arranged between the single-wire cutting wheel and the first multi-wire cutting wheel, and is used for pulling the rigid wire or diamond wire between the single-wire cutting wheel and the first multi-wire cutting wheel;
  • the tension sensor is arranged on the tension wheel, continuously senses the tension value of the diamond wire on the tension wheel, and sends out a drive signal when the tension value is less than a preset value;
  • the servo motor is electrically connected to the tension The sensor is used to start working after receiving the drive signal sent by the tension sensor; one end of the screw rod is connected to the tension wheel, and the other end is connected to the servo motor, and the tension wheel is pulled when the servo motor is working Perform unidirectional displacement to adjust the tension of the steel wire or diamond wire.
  • the tension adjustment mechanism further includes a slide rail, which is arranged between the servo motor and the tension wheel, and is used when the screw rod pulls the tension wheel When the time, the tension wheel slides on the slide rail.
  • the servo motor has a rotating shaft, and the screw shaft is connected to the rotating shaft of the servo motor; when the tension sensor senses the tension of the steel wire or diamond wire for the first time, the tension sensor senses the tension
  • the set value is the initial value of tension.
  • the tension value sensed by the tension sensor is the current tension value
  • the preset value sensed by the tension sensor is the tension value at the previous moment.
  • the wire cutting device of the present application is further improved in that it also includes a locking device, which is arranged on the lifting mechanism and is used for checking the cutting state after the cutting frame is switched between different cutting states. Freeze.
  • the cantilever degree of freedom of the cutting frame is greater than 0.
  • the contact force between the cutting line and the silicon rod to be cut may cause the cutting frame to rotate.
  • the use of a locking device is an implementation means to make the cutting frame in The drive motor of the rotating part is driven to rotate and reaches the preset cutting position, and then stops rotating and is in a locked state.
  • the locking device includes a rotary locking cylinder, and the rotary locking cylinder is in a relaxed state during the rotation process of the cutting frame conversion, so that the cutting frame reaches a preset value. After the cutting state, it enters the braking state.
  • the locking device also includes a positioning device.
  • the rotation of the cutting frame is a passive rotation driven by a driving motor, and the rotation state of the cutting frame is controlled by the motor.
  • the moment of inertia of the cutting frame itself can maintain the cutting frame to continue to rotate after the motor stops running.
  • the rotational angular velocity and duration of the rotary motion driven by the moment of inertia are difficult to manipulate, which will affect the space where the cutting frame is stopped.
  • Location positioning is arranged on the lifting mechanism and includes a fixed module for automatically detecting the line, and a positioning fixture assembly.
  • the fixed module for automatically detecting the line detects After the parts in the cutting frame are placed in the positioning fixture assembly, the cylinder of the locking cylinder is rotated to extend, and the positioning fixture assembly is pushed to clamp the cutting frame so that the relative movement of the cutting frame and the lifting mechanism is 0.
  • the extension line of the first cantilever 1112 of the cutting frame 111 and the extension line of the second cantilever 1113 form an angle of 45°
  • the extension line of the second cantilever 1113 and the extension line of the third cantilever 1114 form a 45° angle.
  • the cantilever structure of the cutting frame 111 takes the center line of the second cantilever 1113 as a line of symmetry, and is approximately symmetrical.
  • the cutting frame 111 rotates around the center of rotation to switch between different cutting states, the first cutting state
  • the mutual conversion to the second cutting state can be realized by 90° rotation around the rotation axis, and the conversion from the intermediate state to the first cutting state or the second cutting state can be realized by ⁇ 45° rotation around the rotation axis.
  • the first cutting state is a state where the cutting frame 111 is rotated to the same horizontal plane as the horizontal plane at the lower edge of the first multi-wire cutting wheel 112 and the horizontal plane at the lower edge of the second multi-wire cutting wheel 113, and the common horizontal plane is located in the first Below the structure of the cutting frame 111 in a cutting state, a cutting line segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 forms a multi-wire saw 1121, and the multi-wire saw 1121 A horizontal parallel line. That is to say, the first cutting state is a state in which a silicon wafer sample can be intercepted in a single cutting action. In particular, for the wire cutting device in different embodiments, the first cutting state is the same as that of the wire cutting device. The status of the fetching operation.
  • FIG. 8 shows a side view of the wire cutting device in an embodiment of the present application in the second cutting state, where the cutting frame 111 rotates to the horizontal plane where the lower edge of the second multi-wire cutting wheel 113 is located
  • the horizontal plane is the same level as the lower edge of the single-wire cutting wheel 114, and the common horizontal plane is located below the structure of the cutting frame 111 in the first cutting state, and is wound around the second multi-wire cutting wheel 113 and the single-wire cutting
  • the cutting line between the wheels 114 forms a horizontal single wire saw.
  • the second cutting state is a state where the silicon rod can be cut in one cutting action.
  • the second cutting state is the silicon rod cutting state of the wire cutting device. .
  • FIG. 9 shows a side view of an intermediate state of the wire cutting device in an embodiment of the present application.
  • the intermediate state is that the cutting frame 111 is in a relaxed state when the locking device is in a relaxed state, that is, the cutting frame 111 is separated from the positioning clamp assembly
  • the multi-wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114
  • the single wire saws in between are all at a certain angle with the horizontal line, and the cutting frame 111 is approximately a T-shaped structure placed upright in a space, that is, the part of the center of gravity below the horizontal plane where the rotation center of the cutting frame 111 is located is the lowest.
  • the cutting system cuts the silicon rods to be cut placed on the silicon rod carrier device. Adjust the position of the silicon rod on the carrier device or the horizontal position of the frame on the base of the wire cutting device according to the characteristics of the silicon rod to be cut, such as the length of the first or tail impurity layer to be cut, to determine that the cutting frame is in the first After the position in the dimensional direction, the travel motor on the frame lifting mechanism drives the displacement of the lifting mechanism in the lifting direction, and cooperates with the driving motor of the circular winding of the cutting line to drive the cutting line, and then the cutting operation can be performed.
  • the process includes the following cutting conditions: adjusting the position of the silicon rod on the supporting device and then clamping, keeping the silicon rod stationary, and adjusting The position of the frame in the first dimension direction makes the cutting wire saw above the junction between the head to be intercepted and the part that meets the processing specifications, and the motor drives the cutting frame to rotate at a certain angle from the natural static intermediate state (in the illustrated embodiment, it is 45°) Up to the first cutting state of wire saw cutting and the cutting frame is locked by the rotating locking cylinder, the lifting mechanism descends to drive the wire saw to move to contact the silicon rod and continue cutting, that is, the silicon is cut when the head is cut.
  • the natural static intermediate state in the illustrated embodiment, it is 45°
  • the traveling motor on the horizontal guide adjusts the position of the frame in the first dimension, and the motor is connected by the rotating shaft of the cutting frame
  • the cutting frame is driven to rotate a certain angle (90° in the illustrated embodiment) to the second cutting state of single-line cutting, and the cutting frame is locked by the rotating locking cylinder, and the lifting mechanism drives the cutting wire saw down to cut to obtain the silicon rod cut Section;
  • the locking cylinder is in a relaxed state, and the cutting frame rotates from the second cutting state to a certain angle (45° in the illustrated embodiment) to an intermediate state.
  • the included angle between the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 of the first cutting frame 111 can be changed.
  • the first multi-cutting wheel 112, the second multi-cutting wheel 113, and the single-wire cutting wheel 114 are respectively fixed on the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114.
  • the included angle is 60°.
  • the mutual conversion between the first cutting state and the second cutting state can be realized by rotating 120° around the rotation axis, from the intermediate state to the first state.
  • the conversion of the cutting state or the second cutting state can be realized by rotating at ⁇ 60° around the rotation axis.
  • the wire cutting device there may be a plurality of tension wheels around which the ring-shaped winding on one cutting frame passes.
  • the loop winding method may pass through the first multi-wire cutting wheel and the second multi-wire cutting wheel more than two times to form a cutting wire saw parallel to each other. Multiple silicon wafer samples can be intercepted in one lift cutting.
  • the silicon rods are usually not equal-diameter cylinders, but are of a large end and a small end or other types.
  • the bearing surface of the supporting device is set horizontally, and the axis of the silicon rod to be cut may not be horizontal.
  • the cutting section obtained by the vertical lifting movement of the lifting mechanism for cutting is not perpendicular to the axis of the silicon rod to be cut, that is, the cutting surface is inclined, and the section of the silicon rod does not meet the processing requirements.
  • a further improvement of the wire cutting device of the present application lies in that it further includes a level detection device (not shown), which is arranged on the lifting mechanism and is used to detect the level of the axis of the silicon rod to be cut.
  • the level detection device on the lifting mechanism includes a first contact measuring instrument and a second contact measuring instrument, which are used to detect the level of the axis of the silicon rod to be cut.
  • the first contact measuring instrument is used to measure the horizontal data of the silicon rod to be cut in the cutting work area at the measurement position corresponding to the first contact measuring instrument
  • the second contact measuring instrument is used to measure the silicon rod to be cut in the cutting work area Level data at the measurement position corresponding to the second contact measuring instrument.
  • a further improvement of the wire cutting device of the present application lies in that it further includes a leveling device (not shown), which is arranged in the work area and is used for placing in the cutting work area according to the detection result of the level detection device.
  • the axis of the silicon rod to be cut is leveled.
  • the leveling device adopts a horizontal centering structure, and when the level detecting device detects that the axis of the silicon rod to be cut is in a non-level state, the rotation driving mechanism drives the workpiece carrier device to rotate to adjust the axis level of the workpiece.
  • the leveling device includes: a rotation fulcrum structure, a rotation drive mechanism, and an offset limit mechanism.
  • the rotation fulcrum structure is located below the silicon rod carrying device for carrying the silicon rods to be cut in the working area, and serves as a rotation fulcrum for the rotation of the silicon rod carrying device.
  • the rotation driving mechanism is located below the silicon rod carrying device, and is used for driving the silicon rod carrying device to rotate around the rotation fulcrum structure to adjust the level of the axis of the silicon rod to be cut.
  • the offset limit mechanism is arranged adjacent to the rotation driving mechanism, and is used for limiting the deviation of the silicon rod carrying device in the horizontal direction when the silicon rod carrying device rotates (upward and downward) around the rotation fulcrum structure.
  • the first contact measuring instrument corresponds to the rotation fulcrum structure, and is used to measure the first point of the apex of the silicon rod to be cut at the rotation fulcrum structure.
  • a height data (it can be an absolute height or a relative height relative to the silicon rod carrying device).
  • the second contact measuring instrument corresponds to the rotation driving mechanism, and is used to measure the second height data of the apex of the silicon rod to be cut at the rotation driving mechanism (it may be an absolute height or a relative height relative to the silicon rod carrying device).
  • the first height data measured by the first contact measuring instrument and the second height data measured by the first contact measuring instrument can be combined to calculate the adjustment amount of the silicon rod carrying device at the rotating drive mechanism , And use the rotation driving mechanism to act according to the adjustment amount to drive the silicon rod carrying device to rotate around the rotation fulcrum structure to complete horizontal centering, so that the axis of the silicon rod to be cut is adjusted to a horizontal state.
  • the leveling device (not shown) of the wire cutting device of the present application can also be set to a level that adjusts the level of the silicon rod to be cut by adjusting the spacer block Aligning mechanism.
  • the leveling device is arranged on the silicon rod carrying device in the working area, and is used for adjusting the axis of the silicon rod to be cut to a horizontal state.
  • the horizontal centering mechanism includes two adjustment pads, a level detection unit, and a driving motor.
  • the two adjustment pads are respectively arranged at the head and tail ends of the silicon rod carrying device in the corresponding working area, and are used to support the silicon rod to be cut.
  • the level detection unit is used to detect the levelness of the silicon rods to be cut supported by the two adjustment pads.
  • the drive motor is associated with at least one of the two adjustment pads, and is used to control the associated at least one adjustment pad to make a lifting movement to ensure that the axis of the silicon rod to be cut is adjusted to a horizontal state .
  • the workpiece horizontal centering mechanism can adjust the axis level of the workpiece to be cut carried by the silicon rod carrying device to a horizontal state, and cut to obtain a single-piece workpiece section that meets the workpiece specifications.
  • the workpiece horizontal centering mechanism due to the use of the workpiece horizontal centering mechanism, it can ensure that the axis of the workpiece to be cut is horizontal and the cutting section of each segment of the workpiece after cutting is perpendicular to the axis, which meets the requirements of workpiece processing and improves the workpiece Cutting quality and yield rate.
  • the silicon rod cutting device disclosed in the present application designs a rotatable cutting frame, and by setting the single wire cutting wheel and the multi wire cutting wheel on the cutting frame at the same time, Different winding systems are designed to realize the conversion of single-wire saw and multi-wire saw through rotation.
  • the cutting frame can be rotated to different settings to realize multi-wire saw cutting and single-wire saw cutting, and the silicon rod to be cut is cut off During the operation, the cutting frame can be adjusted to cut off and cut samples, so as to achieve the purpose of obtaining samples in one lift cutting and cutting in silicon rod processing according to needs, which solves the inefficient and difficult control of obtaining samples through multiple cuttings
  • the thickness of the sample is easy to waste materials; in addition, the cutting frame is arranged on the lifting mechanism on the frame, and the frame can be moved along the base in the first dimension, so that the cutting wire saw can be adjusted according to the processing specifications.
  • the wire cutting device of the present application improves the cutting efficiency of the equipment while also increasing the pass rate of the product. It also improves the utilization rate of processing raw materials, effectively overcomes various shortcomings of the existing technology, and has high industrial value.
  • this application provides the following embodiments in the first aspect.
  • the respective embodiments are represented by serial numbers, for example, the numbers 1, 2, 3, 4... can represent embodiment 1, respectively.
  • this application provides:
  • a wire cutting device applied to silicon rod cutting equipment for cutting silicon rods characterized in that it comprises:
  • the cutting frame is rotatably arranged on a lifting mechanism, and includes a rotating part, a first cantilever extending from the rotating part in a first direction, and a second cantilever extending from the rotating part in a second direction.
  • a third cantilever whose rotating part extends in the third direction;
  • the first multi-wire cutting wheel is arranged at the extension end of the first cantilever and has at least two wire grooves;
  • the second multi-wire cutting wheel is arranged at the extension end of the second cantilever and has at least two wire grooves, and a multi-wire saw is formed around the cutting line segment between the first multi-wire cutting wheel and the second multi-wire cutting wheel ;
  • the single-wire cutting wheel is arranged at the extension end of the third cantilever, and a single-wire saw is formed around the cutting line segment between the second multi-wire cutting wheel and the single-wire cutting wheel;
  • the cutting frame rotates around its rotating part to realize the first cutting state of cutting by the multi-wire saw and the first cutting state of the single-wire saw. 2. Conversion of cutting state.
  • the wire cutting device characterized in that the extension line of the multi-wire saw and the extension line of the single-wire saw form an angle of 90°; the cutting frame is in the The lifting mechanism can achieve ⁇ 45° or 90° rotation.
  • the wire cutting device characterized in that the extension line of the multi-wire saw and the extension line of the single-wire saw form an angle of 60°; the cutting frame is in the The lifting mechanism can achieve ⁇ 60° or 120° rotation.
  • the cutting wire is a stranded wire cutting wire formed by twisting at least two cutting wires.
  • the wire cutting device characterized in that it further comprises a tension detection mechanism, including a tensioning wheel arranged on the cutting frame for detecting and adjusting the first multi-wire cutting wheel, The tension of the cutting line between the second multi-wire cutting wheel and the single-wire cutting wheel.
  • a tension detection mechanism including a tensioning wheel arranged on the cutting frame for detecting and adjusting the first multi-wire cutting wheel, The tension of the cutting line between the second multi-wire cutting wheel and the single-wire cutting wheel.
  • the wire cutting device further comprising at least one wire wheel arranged on the cutting frame to realize the reversing of the cutting wire.
  • the wire cutting device characterized in that the cutting wire is wound around a pay-off reel at the head end and a take-up reel at the tail end, and is guided by a plurality of wire wheels. Between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.
  • the wire cutting device characterized in that it further comprises at least one tension detection mechanism, including a tension wheel arranged on the cutting frame, the lifting mechanism or the frame for detecting And adjust the tension of the cutting line between the first multi-line cutting wheel, the second multi-line cutting wheel, and the single-line cutting wheel.
  • at least one tension detection mechanism including a tension wheel arranged on the cutting frame, the lifting mechanism or the frame for detecting And adjust the tension of the cutting line between the first multi-line cutting wheel, the second multi-line cutting wheel, and the single-line cutting wheel.
  • the wire cutting device characterized in that, in the first cutting state of the wire cutting device, the single wire cutting wheel does not contact the cutting wire; When the state is switched to the second cutting state, the cutting frame rotates around its rotating part so that the single wire cutting wheel presses the cutting wire until the second cutting state is reached, the cutting wire is wound around the single wire On the cutting wheel, the cutting line segment between the single-wire cutting wheel and the second multi-wire cutting wheel forms a single-wire saw.
  • the present application applies for a silicon rod loading device for transferring the silicon rods to be cut placed in the storage area to the cutting work area (cutting workbench) of the silicon rod cutting device.
  • the common method of the existing silicon rod feeding technology is the use of a hoisting device.
  • the use of a hoisting device to transport the silicon rod to be cut requires the use of a clamp constructed of inelastic material to clamp the silicon rod.
  • the clamping material is directly connected to the silicon rod. Contact may cause damage to the surface of the silicon rod.
  • a single silicon rod has a mass of about 400kg, a length of about 5000mm (for example, 5360mm, etc.) or about 800mm and other different specifications.
  • the center of gravity of the silicon rod will rise once it is lost during the lifting process. There is a big safety hazard. At the same time, the movement of the hoisting device is usually in the lifting direction and the horizontal direction along a straight line, with low mobility; another common existing method for feeding silicon rods is manual transportation, which seriously affects the enterprise Production efficiency.
  • FIG. 11 shows a schematic diagram of a silicon rod loading device applied for in the second aspect of this application.
  • the silicon rod loading device includes a first rotating shaft 21 and at least two swing arm assemblies 25A, 25B.
  • the first rotating shaft 21 is driven to rotate by a first driving device 23, and the length direction of the first rotating shaft 21 is set in the length direction of the silicon rod 16 to be cut in the silicon rod cutting work area 17, and the first driving device 23
  • the shaft is connected to the first rotating shaft 21 and arranged at one end of the first rotating shaft 21.
  • the first driving device 23 includes a driving motor 231, and a power output shaft of the driving motor 231 is axially connected to the first rotating shaft 21 at one end of the first rotating shaft 21.
  • each of the swing arm assemblies 25 includes a swing arm body that is axially connected to the first rotating shaft 21 And a supporting mechanism provided on the swing arm body, the supporting mechanism is used to follow the movement of the swing arm so that the supporting portion remains in a state of supporting the silicon rod 16 to be cut during transfer operations And the relative position of the silicon rod to be cut 16 and the supporting part in the transfer operation is not changed, in other words, the relative position of the silicon rod to be cut 16 and the supporting part in the transfer operation is not changed
  • the change means that the silicon rod 16 to be cut is in a static state relative to the supporting part during the transfer operation.
  • the at least two swing arm assemblies 25A, 25B are, for example, pivotally connected to the first rotating shaft 21 according to a predetermined interval of about 800 mm (the shortest length crystal rod required under normal circumstances). on.
  • the supporting mechanism includes a manipulator arranged at the end of the swing arm body to follow the movement of the swing arm.
  • the swing arm body and the supporting mechanism are driven by a first driving device to rotate around the first rotating shaft.
  • the manipulator follows the movement of the swing arm
  • the support portion rotates relative to the swing arm body under the action of the manipulator, that is, the support portion rotates relative to the center of the circle circumscribed by the support portion
  • the rotation driven by the first driving device and the rotation relative to the swing arm body are jointly determined.
  • the manipulator when the silicon rod feeding device transports the silicon rods to be cut from the storage area to the cutting area, the manipulator follows the movement of the swinging arm to make the support
  • the angular velocity generated by the rotating part relative to the swing arm body and the angular velocity of the swing arm rotating around the first axis of rotation remain the same, but in opposite directions, the angular velocity of the supporting part rotating relative to the center of its circumscribed circle remains at 0, the There is no relative movement between the supporting part and the silicon rod to be cut on the supporting part.
  • the machine base of the silicon rod feeding device is provided with at least two transfer stations corresponding to the swing arm assembly one to one, for separately connecting the at least two swing arm assemblies according to The preset intervals are respectively connected to the first rotating shaft.
  • the movable connection between the transfer platform and the corresponding swing arm assembly limits the movement of the corresponding swing arm assembly relative to the transfer platform to a form of rotation around the first rotation axis, and the swing arm assembly follows the corresponding transfer platform The displacement produces corresponding displacement.
  • the first rotating shaft penetrates each of the swing arm components, and when the first driving device drives the first rotating shaft to rotate, each swing arm component that is pivotally connected to the rotating shaft through the transfer table is rotated around the first rotating shaft.
  • FIG. 12 shows an enlarged schematic diagram of the silicon rod feeding device of the present application at b in FIG. 11.
  • the swing arm body 251 is driven by the first rotating shaft 21, and the power output of the first rotating shaft 21 Driven by the shaft, which is the motor shaft of the first driving device, the swing arm body 251 can rotate around the first rotating shaft 21.
  • the end (end) of the swing arm body 251 away from the first rotating shaft 21 is fixedly connected to the supporting mechanism 252, and the first rotating shaft 21 drives the swing arm body 251 on the normal plane of the axis of the first rotating shaft 21
  • the supporting mechanism 252 is driven to change in the spatial position, so that the supporting mechanism 252 moves in a swing direction between the storage area and the cutting area.
  • each of the transfer stations 27 has a first movement mechanism that linearly shifts between the storage area and the cutting work area, including the transfer stations 27 on the front side and the rear side.
  • Two horizontal guide rails 271 are provided on the two surfaces, and the transfer platform 27 is movably connected to a guide groove (not shown in the figure) provided with a corresponding second dimension guide through the horizontal guide 271 in the second dimension.
  • the carrying platform 28 is provided with a second movement mechanism to realize the linear displacement of the transfer platform 27 relative to the carrying platform 28 in the second dimension.
  • a driving mechanism is provided inside or outside the transfer platform 27 for driving the transfer platform 27 to move on the horizontal guide rail 271 of the base.
  • the driving mechanism of the transfer table 27 includes: a traveling screw (not shown in the figure) arranged along the horizontal guide rail and connected to the transfer table 27, and a traveling motor connected to the traveling screw (Not shown in the figure).
  • the traveling motor is used to drive the transfer platform 27 to travel along the guide rail 271.
  • the traveling motor on the transfer platform 27 is connected to the traveling screw laid on the guide rail to realize the transfer platform 27 along the guide rail.
  • the second dimension direction is the displacement in the shortest distance between the storage area and the cutting area.
  • the first movement mechanism for the linear displacement of the transfer table between the material storage area and the cutting work area may adopt a form in which a traveling motor cooperates with a ball screw pair.
  • the ball screw pair includes a ball screw and a screw nut adapted to the ball screw.
  • the screw nut is connected to the transfer table, and the traveling motor drives the ball screw to rotate so as to pass the screw
  • the bar nut drives the transfer platform to move linearly along the guide groove provided on the bearing platform.
  • the silicon rod feeding device is provided with a second movement for linear displacement of at least one swing arm assembly 25 on the first rotation shaft 21 (ie displacement in the first dimension direction). mechanism.
  • the bottom of the carrying platform 28 further includes a guide rail assembly in the first dimension, which passes through the bottom guide groove (not shown in the figure) of the carrying platform 28 and is set on the base 15
  • the guide rails in the first dimension are movably connected.
  • the second movement mechanism is the guide rail assembly of the carrying table 28, including a driving mechanism arranged inside or outside the carrying table 28, for driving the carrying table 28 to move on the guide rail in the first dimension of the base .
  • the driving mechanism of the carrying table 28 includes: a traveling screw (not shown in the figure) arranged along the bottom guide rail of the carrying table 28 and connected to the carrying table 28, and a traveling motor (in the figure) connected to the traveling screw Not shown).
  • the traveling motor is used to drive the carrying table 28 to travel along the machine base guide rail, and the traveling motor on the carrying table 28 is connected to the traveling screw laid on the machine base guide rail to realize that the carrying table 28 is in position.
  • the displacement of the guide rail of the machine base along the first dimension direction that is, the linear direction parallel to the first rotating shaft 21.
  • the second motion mechanism for linearly displacing at least one swing arm assembly on the first shaft may adopt a form in which a traveling motor cooperates with a ball screw pair, and the ball screw pair includes A ball screw and a screw nut adapted to the ball screw, the screw nut is connected to the bearing platform, and the traveling motor drives the ball screw to rotate, thereby driving the ball screw through the screw nut
  • the bearing table moves linearly along the guide groove set on the base.
  • silicon rods are usually not equal-diameter cylinders, but one big end and one small end or other types.
  • the position of the center of gravity of different silicon rods in the length direction of the silicon rod is determined by the specific shape of the silicon rod, and it is transferred in the silicon rod. It is necessary to satisfy the balance between the torque generated by the support of different supporting mechanisms for the silicon rod and the gravitational moment to ensure that the silicon rod does not fall off in the axial direction during transfer.
  • at least one of the supporting platforms corresponding to the at least two transfer platforms is provided with a bottom guide rail assembly, that is, a second motion mechanism to drive the transfer platform on the carrying platform to move in the linear direction of the first rotation axis.
  • the number of the carrying platforms that can move along the linear direction of the first rotating shaft can also be greater than one.
  • the carrying table provided with the second movement mechanism drives the corresponding transfer table and the swing arm assembly to move in the linear direction of the first rotating shaft to realize the position adjustment of the swing arm assembly on the first rotating shaft, that is, to realize the position of the supporting mechanism relative to the silicon rod.
  • the adjustment in the length direction of the silicon rod realizes the adjustment of the position of the supporting mechanism relative to the center of gravity of the silicon rod.
  • the common silicon rod length in silicon rod processing is about 800mm to 5000mm, and the common silicon rod mass is about 400kg or heavier.
  • two silicon rod supporting mechanisms ensure the balance of the silicon rod.
  • the two supporting points or surfaces in the silicon rod transfer are located at the two ends of the silicon rod.
  • the surface of the silicon rod in contact with the supporting points at both ends bears greater pressure and may damage the integrity of the silicon rod structure.
  • the number of the swing arm assembly is four at intervals, including a first swing arm assembly 25A and a second swing arm assembly located at both ends of the first rotating shaft.
  • the arm assembly 25B, and the third swing arm assembly 25C and the fourth swing arm assembly 25D which are respectively pivotally connected between the two ends of the first rotating shaft 21 according to a preset interval.
  • the pressure at the contact surface of each supporting mechanism 252 and the silicon rod is lower than the pressure of the contact surface of the two supporting mechanisms 252 or the fixture in the common technology.
  • the bearing platform corresponding to the transfer platform of the third swing arm assembly 25C or the fourth swing arm assembly 25D is provided with a second movement mechanism to drive the transfer platform on the bearing platform to move on the first rotation axis. 21
  • the linear displacement is used to adjust the bearing position according to the position of the center of gravity of the silicon rod to be cut.
  • the second movement mechanism may be configured as a guide rail assembly with a drive motor.
  • the silicon rod feeding device further includes a second rotating shaft 22, and the second rotating shaft 22 consists of a Driven by the second driving device 24, the first, second, third and fourth swing arm assemblies are arranged in parallel with the first rotating shaft 21, and are axially connected to the swing arm assembly 25 and located on the swing arm Between the first rotating shaft 21 of the main body 251 and the supporting mechanism 252, the second driving device 24 is disposed at one end of the second rotating shaft 22.
  • a further improvement of the present application is that the first driving device and the second driving device are respectively arranged at both ends of the first shaft or the second shaft in the length direction, and are respectively located in the axial connection between the first shaft and the first swing arm assembly.
  • the end of the rotating shaft at the point where the second rotating shaft and the second swing arm assembly are axially connected realize the quality balance of the mechanical layout of the swing arm assembly in the length direction, and realize the improvement of the structural space utilization rate of the swing arm assembly in the spatial layout.
  • the volume of the swing arm assembly is correspondingly reduced.
  • the swing arm body includes a built-in space, that is, the swing arm body is configured as a structure with an accommodation space for storing the first shaft, the second shaft, and the swing arm Axle connection assembly for the main body.
  • the supporting mechanism of the swing arm assembly includes a driving gear, a driven gear and a manipulator assembly
  • the manipulator assembly includes a manipulator body and a supporting member.
  • FIG. 14 shows a cross-sectional view of the swing arm body 251 and the supporting mechanism 252 of the silicon rod feeding device of this application.
  • the internal space of the swing arm body 251 is provided with gears that mesh with each other, from the end of the swing arm to The end directions are respectively a driving gear 2522 and a driven gear 2523.
  • the driving gear 2522 of each swing arm assembly 25 is axially connected to the second shaft 22, and is driven by the second shaft 22 to rotate; the driven gear 2523 and The driving gear 2522 meshes, and the tooth portion 252121 of the supporting member 25212 meshes with the driven gear 2523 at the same time.
  • the manipulator body 25211 is fixedly arranged at the end of the swing arm body 251 of the swing arm structure, and is a U-shaped, C-shaped, or crescent-shaped steel structure curved in a circular arc in the length direction ( Figure Not shown in), the symmetry axis of the arc length direction and the symmetry axis of the swing arm structure are arranged coaxially.
  • the supporting member 25212 is movably arranged on the manipulator body 25211, and is used to carry the silicon rod 16 to be cut, and includes a tooth portion 252121 meshing with the driven gear 2523 and a contour that can accommodate the silicon to be cut.
  • the tooth portion 252121 is an arc-shaped rack structure and is movably arranged on the manipulator body 25211.
  • the arc of the rack conforms to the arc of the manipulator body 25211 and is set in the U-shape and C-shape of the manipulator body 25211. , Or inside the crescent cavity.
  • the supporting portion 252122 is fixedly arranged on the tooth portion 252121 and follows the tooth portion 252121 to move.
  • the U-shaped, C-shaped, or crescent-shaped steel structure of the manipulator body 25211 is a U-shaped, C-shaped, or crescent-shaped structure with gaps. As shown in the figure, the gaps are set in At the symmetry axis of the circular arc circumference, the driven gear 2523 of the supporting mechanism 252 and the tooth 252121 of the supporting member 25212 mesh with each other at the gap in the middle.
  • the supporting portion 252122 of the manipulator assembly 2521 is provided with a row of cylindrical balls arranged in parallel on the contour, and the cylindrical balls are in direct contact with the surface of the silicon rod 16 to be cut during the silicon rod transfer.
  • the radius of the arc formed by the common tangent of the cylindrical ball is slightly larger than the common radius of silicon rods, and is used to ensure that the supporting mechanism 252 realizes that the supported silicon rods can be placed in the inner circular grooves when the silicon rods are carried.
  • the arc surfaces of the two are similar to limit the displacement of the silicon rod such as rolling during load.
  • the second driving device may be configured as a driving motor, and the motor shaft is axially connected to the second rotating shaft 22 to drive the rotation of the second rotating shaft 22 to realize the shaft connection to the second rotating shaft 22 on the rotation of the driving gear 2522.
  • the driving gear 2522 in the built-in space of the swing arm body is driven by the second rotating shaft 22 to rotate at the speed and direction of the second driving shaft.
  • the driven gear 2523 meshed with it generates a rotation opposite to the rotation direction of the driving gear 2522.
  • the angular velocity of the driven gear 2523 is determined by the relationship between the number of teeth of the driving gear 2522 and the driven gear 2523 and the driving gear
  • the rotation speed of 2522 is determined; further, the tooth 252121 meshing with the driven gear 2523 produces a rotation opposite to the rotation direction of the driven gear 2523, and the angular velocity of the rotation of the tooth 252121 is determined by the radius of the arc where the tooth 252121 is located.
  • the relationship with the radius of the passive wheel and the rotation speed of the passive wheel are jointly determined.
  • the rotational angular velocity of the tooth portion 252121 is determined by the relationship between the motor speed of the second driving device (variable value) and the number of teeth or radius of the driving gear 2522, the driven gear 2523, and the rack (fixed value), That is, the rotational angular velocity of the supporting member 25212 relative to the manipulator body 25211 is determined by the rotation speed output by the second driving device, and the rotation direction is the same as the rotation direction output by the second driving device.
  • a further improvement of the present application is that there may be a cooperative relationship between the torque of the second driving device and the driving motor corresponding to the first driving mechanism.
  • the swing arm assembly shown in FIGS. 14 to 16 is driven by the first driving device in different states of rotating around the first rotating shaft 21 during the silicon rod transfer, and the silicon rod transfer is performed by the silicon rod feeding device.
  • the swing arm assembly 25 is driven by rotation about the first rotating shaft 21, and the rotation of the rotating shaft drives the swing arm body 251 on the first rotating shaft.
  • the rotational angular velocity of the swing arm body 251 is determined by the first driving device.
  • the swing arm body 251 and the manipulator assembly 2521 at its end follow the swing arm body 251 to rotate with the first rotating shaft 21 as the rotation center and the angular velocity of the first rotating shaft 21 as the rotational speed.
  • the second driving device drives the second rotating shaft 22 to rotate in a direction opposite to the direction of the first rotating shaft 21 in the load-bearing state, so as to realize the rotation of the supporting member 25212 around the center of the arc of the rack.
  • the rotation of the supporting member 25212 with the center of the first shaft 21 at the same time is defined as the first rotation movement
  • the rotation of the center of the arc of the rack is defined as the second rotation movement
  • the second rotation movement is the bearing
  • the supporting member 25212 follows the synthesis of the first rotational movement controlled by the first rotating shaft 21 performed by the swing arm body 251 and the rotational movement relative to the manipulator main body 25211 controlled by the second rotating shaft 22.
  • the cooperative relationship between the first driving device and the second driving device is the relationship between the size of the rotation speed and the direction.
  • the first driving device and the second driving device respectively control the two rotational movements of the supporting portion 252122, so that the The angular velocity of the second rotation of the supporting member 25212 is 0, and the silicon rod 16 to be cut in the transfer state is displaced from the storage area to the cutting zone along with the movement of the supporting member 25212, and keeps the position relative to the supporting member 252122. changes happened.
  • the first driving device and the second driving device can work independently of each other, respectively controlling the first rotational movement and the rotational movement of the rack relative to the manipulator body to jointly control the bearing
  • the space position of the support part changes and the angle of the second rotation movement.
  • the running table guide rail assembly drives the running table, the swing arm assembly and the manipulator assembly set on it, to feed along the vertical direction of the silicon rod to be cut on a horizontal plane, until the supporting portion Contact with the silicon rod to be cut; after the supporting part contacts the silicon rod to be cut, the supporting member is driven by the second rotating shaft to rotate relative to the manipulator body, so that the supporting part is located directly under the silicon rod to be cut, supporting The contact position between the part and the silicon rod to be cut is located at the arc-shaped symmetry axis and the adjacent area of the supporting part, and then the silicon rod transfer process operated by the first driving device and the second driving device in a cooperative relationship is performed.
  • the traveling motor of the transfer table guide rail and the traveling motor of the bearing table guide rail respectively drive the swing arm assembly and the manipulator provided on the swing arm assembly in the second dimension direction , Linear movement in the first dimension.
  • a further improvement of the application is that the number of teeth of the tooth portion 252121 of the supporting portion 252122 is greater than the number of teeth of the driven gear 2523, and the number of teeth of the driven gear 2523 is greater than the number of teeth of the driving gear 2522.
  • the angular velocity of the driving gear 2522, the angular velocity of the driven gear 2523, and the The magnitude relationship of the angular velocity of the tooth portion 252121 is successively reduced, so that the precise control of the supporting member 25212 in the second rotation movement is realized.
  • the contact surface between the supporting portion 252122 and the silicon rod to be cut has a buffer material.
  • the contact surface between the supporting portion 252122 and the silicon rod to be cut is made of elastic rubber material, or silicone or other materials with elastic deformation, damping characteristics or cushioning characteristics. It is made to protect the surface of the silicon rod to be cut in contact with it from scratches or bumps.
  • FIG. 17 shows a cross-sectional view of the swing arm body 251 and the supporting mechanism 252 in another embodiment.
  • the supporting mechanism 252 includes a driving gear 2522 arranged in the internal space of the swing arm body 251 and The manipulator assembly 2521 at the end of the arm body 251.
  • the driving gear 2522 is axially connected with the second rotating shaft, and is driven by the second rotating shaft to follow the second rotating shaft to rotate.
  • the manipulator assembly 2521 includes a manipulator body 25211 and a supporting member 25212.
  • the manipulator body 25211 is fixedly arranged at the end of the swing arm body 251 and includes a groove structure curved in a circular arc in the length direction.
  • the supporting member 25212 is movably arranged on the manipulator body 25211 to carry the silicon rod to be cut, and includes a tooth 252121 meshing with the passive driving gear 2522 and a contour that can accommodate the silicon to be cut.
  • the tooth portion 252121 is an arc-shaped rack structure and is movably arranged on the manipulator body 25211.
  • the arc of the rack conforms to the arc of the structural slot of the manipulator body 25211 and is arranged on the manipulator body 25211.
  • the tooth portion 252121 meshes with the driving gear 2522 in the built-in space of the swing arm body 251, and the driving gear 2522 in the built-in space drives the supporting member 25212 to rotate relative to the manipulator body 25211 under the rotation of the second rotating shaft.
  • the supporting portion 252122 is fixedly arranged on the tooth portion 252121 and follows the tooth portion 252121 to move.
  • the supporting member 25212 follows the manipulator body 25211 to rotate around the first rotating shaft driven by the first driving device, and at the same time rotates relative to the manipulator body 25211 driven by the second driving device.
  • the second driving device includes a driving motor, which is axially connected to the second rotation shaft at one end of the second rotation shaft.
  • the second driving device drives the second rotating shaft to rotate, thereby driving the driving gear 2522 in the built-in space of the swing arm structure to rotate at the same angular velocity as the second rotating shaft.
  • the tooth portion 252121 is driven by the driving gear 2522 meshing with it. A certain angular velocity rotates relative to the manipulator body 25211.
  • the rotation speed of the supporting member 25212 around the first rotating shaft 21 is determined by the first driving device.
  • the rotation of the supporting member 25212 relative to the manipulator body 25211 is determined by the second driving device, the tooth portion 252121 and the driving gear of the built-in space
  • the radius ratio of 2522 determines that the first driving device and the second driving device independently control the two rotational movements of the supporting member 25212 respectively.
  • the first driving device and the second driving device drive the first rotating shaft and the second rotating shaft to rotate in a certain cooperative relationship, and the supporting portion 252122 is circumscribed relative to its circle.
  • the rotation speed of the center of the circle is the vector sum of the rotation of the supporting portion 252122 around the first rotation axis and the rotation relative to the manipulator body 25211.
  • the swing arm assembly is rotated to different angles around the first rotating shaft in the load state.
  • the first driving device 23 and the second driving device 24 operating in the coordinated relationship support the support
  • the angle changes of the member 25212 relative to the center of the circumscribed circle are mutually compensated, so that the angular velocity of the supporting portion 252122 relative to the rotational movement with the center of the circumscribed circle of the supporting portion 252122 as the rotation center is always zero.
  • the first driving device and the second driving device are driven in the cooperative relationship during the transfer operation, so that the supporting member 25212 does not rotate relative to the supported silicon rod to be cut during the transfer process in the loaded state.
  • the number of teeth of the tooth portion 252121 is greater than the number of teeth of the driving gear 2522 in the built-in space of the swing arm body 251, and the angular velocity transmission controlled by the second driving device is transmitted from the second rotating shaft to the The tooth portion 252121 is a speed reduction transmission, so as to realize precise control of the supporting member 25212 during the rotation of the supporting member 25212 relative to the manipulator body 25211.
  • the supporting mechanism of the swing arm assembly includes a manipulator assembly, and the manipulator assembly is disposed at the end of the swing arm body.
  • the manipulator assembly includes a manipulator body and a supporting member.
  • the manipulator body is fixedly arranged on the swing arm body to follow the movement of the swing arm body; the supporting member is movably arranged on the manipulator body for carrying the The silicon rod to be cut.
  • the supporting member is dynamically connected with the second rotating shaft, and when the second rotating shaft rotates, the supporting member is driven to rotate on the manipulator body.
  • the rotation of the supporting member relative to the manipulator is controlled by the second drive device to rotate the second rotating shaft, and the second rotating shaft drives the supporting member to rotate at a certain speed;
  • the manipulator body follows the swing arm body and is driven by a first driving device to rotate around the first shaft.
  • the first driving device and the second driving device can respectively drive the rotation of the swing arm body around the first rotating shaft and the rotation of the supporting member relative to the manipulator body, respectively.
  • the first driving device and the second driving device drive the first rotating shaft and the second rotating shaft to rotate in a certain cooperative relationship.
  • the supporting member follows the manipulator body to rotate around the first shaft under the drive of a first drive device, and at the same time rotates relative to the manipulator body under the drive of the second drive device, the first drive device and
  • the second driving device outputs rotational speed in a coordinated relationship, so that the operation of the first driving device and the second driving device compensate each other for changes in the angle of the supporting member relative to the center of the circumscribed circle, so as to realize the supporting part
  • the angular velocity with respect to the rotational movement with the center of the circumscribed circle of the supporting portion as the rotation center is always zero.
  • the first driving device and the second driving device are driven in the cooperative relationship during the transfer operation, so that the supporting member does not rotate relative to the supported silicon rod to be cut during the transfer process in the loaded state.
  • the manipulator assembly is driven by the first rotating shaft to follow the swing arm body to swing , Until the supporting portion and the silicon rod are at the same level, the rotational movement of the swing arm assembly is independently driven by the first driving device during the swing process;
  • the operating platform guide rail assembly drives the operating platform and the The swing arm assembly and the manipulator assembly are fed along the vertical direction of the silicon rod to be cut on a horizontal plane until the supporting part contacts the silicon rod to be cut; after the supporting part contacts the silicon rod to be cut, the second The two rotating shafts drive the supporting member to rotate relative to the manipulator body, so that the supporting part is located directly below the silicon rod to be cut, and the contact position between the supporting part and the silicon rod to be cut is located on the arc symmetry axis of the supporting part and In the adjacent area, the silicon rod transfer process is performed by the first driving device and the second driving device in a cooperative relationship.
  • the traveling motor of the guide rail of the transfer table and the traveling motor of the bearing table rail respectively drive the swing arm assembly and the manipulator provided on the swing arm assembly in the second dimension Direction, linear movement in the first dimension.
  • the linear movement of the carrying table along the guide groove of the machine base in the first dimension, the linear movement of the transfer table relative to the carrying table in the second dimension, and the rotation driven by the first driving device or the second driving device. Movements are independent of each other.
  • a further improvement of the silicon rod feeding device of the present application is that the swing arm assembly is provided with a detection device for detecting the contact between the supporting portion and the silicon rod to be cut, and is used in feeding work, The contact between the supporting part and the silicon rod to be cut is detected, and after the manipulator supports the silicon rod to be cut, the driving motors of the first and second rotation shafts are started to work, that is, the swing arm is raised to perform feeding .
  • the detection device includes a pressure sensor disposed on the supporting portion, and the pressure sensor includes a pressure sensitive element and a signal processing unit.
  • the manipulator assembly is driven by the first rotating shaft to follow the swing arm body to swing until the supporting part and the silicon rod are at the same level.
  • the rotational movement of the swing arm assembly is independently driven by the first driving device;
  • the running table guide rail assembly drives the running table, the swing arm assembly and the manipulator assembly arranged on it, along the horizontal plane of the silicon rod to be cut Feed in the vertical direction until the supporting part contacts the silicon rod to be cut;
  • the pressure sensitive element of the pressure sensor contacts the silicon rod to be cut and outputs a contact signal, and the transfer table is in the second dimension direction Perform a short-distance retreat operation relative to the silicon rod to be cut; when the supporting part is separated from the silicon rod to be cut, the supporting member is driven by the second rotating shaft to rotate relative to the manipulator body to make the supporting
  • the supporting part is located directly below the silicon rod to be cut, and then the swing arm assembly rotates to lift the silicon rod.
  • the supporting part is shared by the first driving device, the second driving device, the running table guide rail assembly, and the bearing table guide rail assembly.
  • the silicon rod to be cut is transferred from the storage area to the cutting area in a driving state.
  • the silicon rod feeding device transports the silicon rods to be cut to the cutting area, and the swing arm body rotates to place the silicon rods to be cut on the bearing table of the cutting work area, so that the driving motor of the second rotating shaft drives the second
  • the rotating shaft rotates in the reverse direction to drive the supporting part to rotate to release the bottom of the silicon rod to be cut, and to make the transfer table away from the silicon rod to be cut in the second dimension direction.
  • the supporting part approaches the silicon rod to be cut until the contact stops, and then rotates to the Supporting under the silicon rod to be cut can prevent the stability of the silicon rod to be cut from being damaged or the surface structure being destroyed during the support, and ensure the transportation safety of the entire silicon rod transfer process.
  • the silicon ingot stage equipment disclosed in the present application in the second aspect, provides a silicon ingot feeding device.
  • a swing arm assembly structure driven by a first driving device it can carry and transfer the silicon to be cut.
  • the supporting mechanism of the swing arm assembly is provided with a corresponding motion follower or a manipulator assembly driven by a second driving device.
  • the supporting part of the silicon rod feeding device When the supporting part of the silicon rod feeding device is in the supporting state, it is preset according to the mechanical structure
  • the relationship between the driving device of the driving device simultaneously drives the first driving device and the second driving device, so as to realize the smooth transportation effect of the silicon rod to be cut and the supporting part without relative movement during transportation; furthermore, the swing arm assembly in the present application It can be set on a transfer platform that can move in the second dimension, and the transfer platform can be movably set on a bearing platform that can move in the first dimension.
  • the silicon rod feeding device is There is a large transportation range and flexibility in the transportation overshoot; the silicon rod feeding device of the present application realizes automatic feeding, increases the transportation efficiency of silicon rods, ensures the safety of transportation, and improves the mobility of the transportation process. It effectively overcomes the shortcomings of the existing technology and has high industrial value.
  • this application provides the following embodiments in the second aspect.
  • the number groups used in the embodiments provided in different aspects are independent of each other.
  • the first Embodiment 1 provided by this aspect is not the same embodiment as Embodiment 1 provided by the second aspect.
  • the present application provides the following embodiments in the second aspect.
  • the respective embodiments are represented by serial numbers, for example The numbers 1, 2, 3, 4... can respectively represent embodiment 1, embodiment 2, embodiment 3, embodiment 4...,
  • a silicon rod feeding device for transferring silicon rods to be cut placed in a storage area to a cutting work area of a cutting device, characterized in that it comprises:
  • the first rotating shaft is driven to rotate by a first driving device
  • At least two swing arm assemblies are respectively pivotally connected to the first rotating shaft according to a preset interval.
  • the at least two swing arm assemblies are used to carry the silicon rods to be cut, and are driven by the first rotating shaft.
  • the silicon rods to be cut are transferred to the cutting work area of the cutting equipment;
  • each of the swing arm assemblies includes a swing arm body axially connected to the first rotating shaft and a supporting mechanism provided on the swing arm body.
  • the supporting mechanism is used to follow the movement of the swing arm so that the supporting portion is kept in a state of supporting the silicon rod to be cut during the transfer operation.
  • the supporting mechanism includes a manipulator arranged at the end of the swing arm body for following the movement of the swing arm to make it
  • the supporting part is kept in a state of supporting the silicon rod to be cut during the transfer operation.
  • the silicon rod feeding device according to embodiment 1, characterized in that it further comprises at least two transfer stations corresponding to the swing arm assembly one-to-one, which are arranged on the base of the cutting equipment and are used to separately
  • the at least two swing arm components are respectively pivotally connected to the first rotating shaft according to a preset interval.
  • the silicon rod feeding device characterized in that the at least two transfer stations include a second movement mechanism for linear displacement of at least one swing arm assembly on the first rotating shaft to adjust the The separation distance of at least two swing arm assemblies.
  • the silicon rod feeding device characterized in that the 4 swing arm assemblies include a first swing arm assembly and a second swing arm assembly respectively disposed at both ends of the first rotating shaft , And the third swing arm assembly and the fourth swing arm assembly respectively pivotally connected between the two ends of the first rotating shaft according to a preset interval.
  • the silicon rod feeding device further comprising a second rotating shaft driven by a second driving device, the second rotating shaft being parallel to the first rotating shaft, and the second rotating shaft
  • the driving device outputs a corresponding rotation speed or/and rotation angle to the second rotating shaft following the working state of the first driving device.
  • the supporting mechanism comprises: a manipulator assembly, which is arranged at the end of the swing arm body, includes: a manipulator body, and is movably arranged on the The manipulator body is used to carry the supporting member for carrying the silicon rod to be cut, the supporting member is dynamically connected to the second rotating shaft, and when the second rotating shaft rotates, the supporting member is driven to rotate on the manipulator body, In order to keep the supporting member in a state of supporting the silicon rod to be cut during the transfer operation.
  • a manipulator assembly which is arranged at the end of the swing arm body, includes: a manipulator body, and is movably arranged on the The manipulator body is used to carry the supporting member for carrying the silicon rod to be cut, the supporting member is dynamically connected to the second rotating shaft, and when the second rotating shaft rotates, the supporting member is driven to rotate on the manipulator body, In order to keep the supporting member in a state of supporting the silicon rod to be cut during the transfer operation.
  • the driving gear is arranged in the built-in space of the swing arm body and is axially connected to the second rotating shaft for rotating under the driving of the second rotating shaft;
  • a driven gear which is axially connected to the built-in space of the swing arm body and meshes with the driving gear
  • the manipulator assembly is arranged at the end of the swing arm body, including a manipulator body, and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut, the supporting member including the passive The gear meshing tooth part and the supporting part used for conforming to the outer contour of the silicon rod to be cut.
  • the silicon rod feeding device characterized in that the contact surface of the supporting portion and the silicon rod to be cut has a buffer material.
  • the silicon rod cutting equipment of the present application applies for a silicon rod blanking device in the third aspect, the silicon rod blanking device is arranged at the discharge end of the cutting work area, and is used for clamping and transporting the cut-off part to meet the specifications of the workpiece
  • the single-stage silicon rod is cut into sections to facilitate cutting.
  • the method of handling the silicon ingot sections processed by the silicon ingot cutting equipment is usually manual handling or pushing and pulling the cutting table, which affects the production efficiency of the enterprise; the common quality of the silicon ingot to be cut is about 400kg and above.
  • the push-pull handling method requires a lot of manpower, and the safety and economy are low.
  • FIG. 20 there is shown a schematic structural view of an embodiment of the silicon rod blanking device of the silicon rod cutting device of the present application.
  • the silicon rod blanking device includes: a take-out arm 31 and a clamping member 32.
  • the reclaiming arm 31 is movably arranged on the top frame 19 of the silicon rod cutting device in a suspended shape, and can be translated along the top frame 19, the reclaiming arm 31 includes a telescopic mechanism; The axis of the translational movement of the arm 31 is set directly above the axis of the silicon rod to be cut in the cutting area.
  • the clamping member 32 is arranged at the bottom end of the reclaiming arm 31, and is used to clamp a single-segment silicon rod that meets the workpiece specifications after being cut in the cutting area.
  • the reclaiming arm 31 and the clamping member 32 present a left-right or mirror-symmetric structure as a whole.
  • the reclaiming arm 31 and the top frame 19 are movably connected by a guide rail assembly
  • the guide rail assembly includes: a guide groove 312 provided on the top frame 19, which is fixedly arranged on the top frame 19
  • the guide rail 311 on the upper part of the material arm 31 is arranged on the material reclaiming arm driving mechanism 313 on the upper part of the material arm 31.
  • the guide rail 311 and the matched guide groove 312 are arranged in the first dimension direction, so that the reclaiming arm 31 generates an axial displacement relative to the silicon rod along the guide groove 312.
  • the position of the silicon rod section adjusts the position of the reclaiming arm 31 to realize subsequent clamping of the silicon rod section.
  • the reclaiming arm drive mechanism 311 includes: a traveling screw (not shown in the figure) arranged along the guide rail 311 on the upper part of the reclaiming arm 31 and connected to the reclaiming arm 31, and The traveling motor 313 is connected to the traveling screw.
  • the traveling motor 313 is used to drive the reclaiming arm 31 to travel along the guide rail 311.
  • the traveling motor 313 on the reclaiming arm 31 is connected to the traveling screw laid on the guide rail 311 to realize the reclaiming
  • the arm 31 moves on the guide rail 311 along the first dimension, that is, along the axial direction of the silicon rod or silicon rod section placed in the cutting area.
  • the reclaiming arm drive mechanism may adopt a form in which a traveling motor and a ball screw pair are matched, and the ball screw pair includes a ball screw and a wire adapted to the ball screw.
  • a screw nut, the screw nut is connected to the reclaiming arm, and the traveling motor drives the ball screw to rotate, so that the screw nut drives the reclaiming arm along the guide groove of the top frame Do straight motions.
  • the guide rail assembly further includes a limiting block (not shown in the figure) for limiting excessive displacement of the reclaiming arm on the top frame.
  • the limit block can be set to a control stroke type, a fixed type or an adjustable type according to the movement requirements of the reclaiming arm.
  • FIG. 21 shows a schematic diagram of the silicon rod blanking device in an embodiment of this application, wherein FIG. 21a is a front view of the silicon rod blanking device, and FIG. 21b is a rear view of the silicon rod blanking device view.
  • the telescopic mechanism 314 can be configured as a lifting rail assembly.
  • the lifting rail assembly includes: a lifting rail 3141, a guide groove 3142 matching the lifting rail 3141, and a lifting rail driving mechanism 3143, Wherein: the lifting rail 3141 is fixedly arranged on the upper part of the clamping member 32 and arranged along the lifting direction; the guide groove 3142 structure matched with the lifting rail 3141 is arranged on the reclaiming arm 31, along the reclaiming arm The symmetry axis of 31 is arranged in the lifting direction; the driving mechanism of the lifting rail 3141 can be set as a cylinder telescopic assembly, which is arranged between the reclaiming arm 31 and the clamping member 32, and the two ends are respectively connected to the reclaiming arm 31 With the clamping member 32, the expansion and contraction of the lifting shaft 31433 of the air cylinder telescoping assembly drives the clamping member 32 to move in the lifting direction.
  • the cylinder telescopic assembly includes: a cylinder support 31431, a cylinder 31432, and a lifting shaft 31433 connected to the cylinder 31432, wherein the cylinder support 31431 is disposed on the reclaiming arm 31 , Fixedly connected to the reclaiming arm 31, in a quadrilateral shape; the cylinder 31432 is arranged on the cylinder support 31431, and the cylinder support 31431 serves as a fixed bottom plate of the cylinder 31432; the cylinder 31432 includes a cylinder cone rod ( (Not shown in the figure), the cylinder cone rod penetrates the cylinder support 31431 and extends into the telescopic space below the cylinder support 31431; the lifting shaft 31433 is arranged at the lower end of the cylinder cone rod, and includes a A compound valve with a two-way control of retracting, the compound valve is also rod-shaped; in an implementation of this embodiment, the lower end of the cylinder cone rod is connected to the lifting shaft 31433
  • the cylinder 31432 drives the cylinder cone rod to drive the telescopic movement of the lifting shaft 31433, and the lifting guide 3141 of the clamping member 32 moves along the reclaiming arm under the push and pull of the lifting shaft 31433.
  • the lifting guide groove 3142 of 31 performs lifting and conveying, so as to realize the displacement of the clamping member 32 in the lifting direction as a whole.
  • FIG. 22 shows a schematic structural view of a clamping member in an embodiment of the silicon rod blanking device of this application.
  • the clamping member includes a first clamping block 321, a second clamping block 322 and a driving gear , wherein: the first clamping block 321 includes a first rack and a first clamping portion 3212 linked with the first rack; the second clamping block 322 is relative to the first clamping block 321 is arranged in a mirror image, including a second rack and a second clamping portion 3222 linked with the second rack; one end of the first rack is fixedly arranged on the first clamping portion 3212, and the first rack One end of the two racks is fixedly arranged on the second clamping portion 3222; the driving gear is arranged on the horizontal construction plate 35 in the middle of the clamping piece, and the driving gear is connected to the power output shaft of a motor and simultaneously It meshes with the first rack and the second rack.
  • the first clamping portion 3212 and the second clamping portion 3222 move toward each other, even if As a result, the distance between the first clamping portion 3212 and the second clamping portion 3222 can be reduced, and the clamping action can be performed; when the driving gear rotates in the reverse direction under the driving of the motor, the first clamping portion 3212 and the second clamping portion 3212 The second clamping portion 3222 moves back, that is, the distance between the first clamping portion 3212 and the second clamping portion 3222 is increased, and the release action can be performed.
  • the clamping surfaces of the bottom ends of the first clamping portion 3212 and the second clamping portion 3222 for contacting the silicon rod section are designed to be arc-shaped, and the arc-shaped of the clamping surface
  • the radius of is designed to be the outer diameter of a common silicon rod, which is used to close the arc surface cut by the silicon rod;
  • the length of the clamping part is designed to be the common section length of the silicon rod cut according to the processing specifications.
  • the lower surface of the horizontal construction board 35 is provided with two mutually parallel guide rails 351 arranged along the second dimension direction.
  • the first clamping portion 3212 and the second clamping portion 3222 pass through the guide rails 351 on the lower surface of the horizontal construction board 35. Activities are provided on the horizontal construction board 35.
  • the tops of the first clamping portion 3212 and the second clamping portion 3222 are respectively fixedly provided with a first horizontal sliding block assembly 3213 and a second horizontal sliding block assembly 3223, the first horizontal sliding block assembly 3213 and the second horizontal sliding block
  • the block assembly 3223 is movably arranged on the guide rail of the horizontal building board 35 and can slide along the guide rail 351 of the horizontal building board.
  • the first horizontal sliding block assembly 3213 and the second horizontal sliding block assembly 3223 respectively move along the guide rails of the horizontal building plate.
  • the first horizontal slider assembly 3213 is two sliders whose bottom is fixedly arranged above the first clamping portion 3212, and the line connecting the two sliders at the fixed position on the first clamping portion 3212 is in the first In a one-dimensional direction;
  • the second horizontal slider assembly 3223 is two sliders whose bottom is fixedly arranged above the second clamping portion 3222, and the two sliders are fixed in position on the second clamping portion 3222 The line is in the first dimension.
  • FIGS 23 to 24 show the structural schematic diagrams of the clamping member driving device in different states.
  • the view direction is a projection of the structure viewed from the bottom to the top of the clamping member.
  • the driving gear 323 is set On the horizontal building plate 35 of the clamping member, a power output shaft of a driving motor is axially connected, and the driving motor 324 is fixedly arranged on the lower surface of the horizontal building plate 35.
  • the first rack 3211 and the second rack 3221 mesh with the front side and the rear side of the driving gear 323, respectively.
  • the first rack 3211 and the second rack 3221 are shown as The upper and lower sides of the driving gear 323 of the driving gear 323 mesh with each other.
  • the first rack 3211 and the second rack 3221 respectively produce corresponding movements.
  • the first rack 3211 When the driving gear 323 rotates, it moves in a direction opposite to the linear velocity of the upper tooth part of the driving gear 323; when the driving gear 323 rotates, the second rack 3221 moves along the lower tooth part of the driving gear 323. The linear velocity moves in the opposite direction.
  • the teeth symmetrical about the gear center (such as the upper and lower teeth in the illustrated embodiment) must satisfy the relationship of the opposite linear velocity, that is, the first meshing with the two sides of the driving gear 323 respectively.
  • the movement directions of the rack 3211 and the second rack 3221 are always opposite, which are represented as moving toward or away from each other.
  • the driving gear 323 is in a forward rotation state, and the first rack 3211 and the second rack 3221 are close to each other; in the embodiment shown in FIG. 24, the driving gear 323 is in reverse rotation. State, the first rack 3211 and the second rack 3221 are far away from each other.
  • the first rack 3211 and the second rack 3221 produce corresponding movement toward or away from each other.
  • the movements of the first rack 3211 and the second rack 3221 respectively drive the The first horizontal sliding block assembly 3213 and the second horizontal sliding block assembly 3223 of the first clamping portion and the second clamping portion slide toward or away from each other along the mutually parallel guide rails provided on the bottom surface of the horizontal building plate 35, That is, the first clamping part and the second clamping part move closer to or away from each other.
  • the process for the silicon rod blanking device to clamp the processed silicon rod section is as follows:
  • the reclaiming arm of the silicon rod blanking device is driven by the traveling motor of the upper guide rail of the reclaiming arm to move along the guide groove on the top frame, and cuts and moves to the silicon rod along the first dimension direction, and the silicon rod is blanked
  • the clamping part of the device moves along the first dimension under the driving of the reclaiming arm.
  • the reclaiming arm moves along The movement of the top frame guide groove stops.
  • the driving gear of the clamping member is reversed by the motor, and the first clamping part and the second clamping part are separated to a value greater than The distance of the diameter of the silicon rod section to prevent the clamping part from touching the silicon rod section during the descending movement.
  • the telescopic mechanism such as an air cylinder telescopic component, drives the lifting shaft to move in the lifting direction, so that the first and second clamping parts move downward to approach the silicon rod section to be clamped to the first clamping part
  • the second clamping part and the silicon rod section are located on the same horizontal plane, that is, the telescopic movement is stopped.
  • the reversal movement of the drive motor is relatively independent of the movement of the telescopic mechanism.
  • only the first and second clamping parts need to run to the level of the silicon rod section (that is, the first clamping
  • the second clamping portion and the second clamping portion are respectively located on the left and right sides of the silicon rod section), and it is sufficient that the clamping member does not collide with the silicon rod section during movement.
  • the driving gear rotates forward to control the first clamping portion and the second clamping portion to approach each other, that is, to approach the silicon rod section, and stop when they contact and clamp the silicon rod to cut off movement.
  • the clamping member maintains a clamped state after clamping the silicon rod section.
  • the clamping member is driven by the telescopic mechanism to move up and down, and the top frame and
  • the guide rail assembly between the reclaiming arms drives the reclaiming arm and the clamping piece to move in the first dimension as a whole, until the silicon rod is cut and placed in a preset position, the first clamping part and the second clamping part are separated and released And along with the take-out arm and the clamping part away from the placed silicon rod section.
  • a further improvement of the present application is that the first clamping part and the second clamping part of the silicon rod blanking device are used to clamp the single-stage silicon rod section on the clamping surface provided with a buffer material, and
  • the clamping surface can be provided with elastic rubber materials, polyethylene foam plastics, silicone rubber or other materials with elastic deformation, damping characteristics or cushioning characteristics to protect the surface of the silicon rod section in contact with it from being scratched. Hurt or bump.
  • a further improvement of the present application is that the silicon rod blanking device is also provided with a sensor 33 for detecting the position of the end (ie, the head or tail) of the silicon rod to be cut.
  • FIG. 25 is an enlarged schematic view of FIG. 21b at d.
  • the sensor element 33 is fixedly arranged on the mirror image line of the bearing connecting the horizontal construction plate of the clamping element 32 and the lifting rail.
  • the sensor device 33 is a contact sensor, and includes a circular ring-shaped measuring head 331, a signal line 332, and a telescopic rod 333.
  • the measuring head 331 is movably arranged at the free end of the telescopic rod 333 and can rotate around the center of the ring of the measuring head 331, and the fixed end of the telescopic rod 333 is arranged on the mirror symmetry line of the bearing.
  • the ring surface of the circular measuring head 331 is the contact surface, which is used to measure the height data of the contact between the corresponding measuring head 331 and the silicon rod 16 to be cut (it can be absolute height or relative to the silicon rod The relative height of the carrying device).
  • the linear velocity direction of the lowest point of the measuring head 331 is in the first dimension, that is, the axial direction of the silicon rod 16 to be cut, so as to prevent the measuring head 331 from being
  • damage to the circular measuring head 331 or the surface of the silicon rod 16 to be cut is caused.
  • the telescopic rod 333 controls the measuring head 331 to drop to just touch the surface of the silicon rod 16 to be cut, and the contact sensor follows the reclaiming arm 31 to move relative to the silicon rod 16 to be cut in the first dimension direction to realize the measuring head 331 Move along the surface of the silicon rod 16 to be cut, collect height data at different positions in real time, and detect the end (that is, the head or tail) that needs to be cut and the end that needs to be cut by the diameter change at the end of the silicon rod 16 to be cut.
  • the boundary line of the middle section of the processed silicon rod is
  • the sensor element 33 is used to detect the end position of the silicon rod to be cut, which avoids the inaccuracy of human judgment, which makes the cut end too long and causes waste or the cut part is too short to make the processed head and tail end of the silicon rod not cut. It conforms to the workpiece specifications, effectively improves the qualification rate of the workpieces of the silicon ingot section adjacent to the end of the silicon ingot, and improves the utilization rate of the material.
  • a further improvement of the silicon rod cutting device of the present application is that it also includes an end reclaiming device.
  • the end reclaiming device is arranged at at least one end of the cutting work area, and is used to receive the cutting tail material from the end of the silicon rod to be cut.
  • the silicon rod cutting operation it is necessary to cut a silicon wafer sample from the silicon rod to be cut, and the thickness of the sample is usually 2-20 mm, that is, it cannot be transported by a silicon rod blanking device.
  • the end reclaiming device includes a rotating arm and an arc groove; the rotating arm is arranged on the adjacent cutting frame of the discharge end of the silicon rod cutting device, and is movably arranged on the rotating shaft with an axis in the lifting direction.
  • the discharge end is adjacent to the bottom of the cutting frame.
  • the arc-shaped groove is fixedly arranged at the free end of the rotating arm, and the arc-shaped groove has a semi-open structure, so that the silicon wafer sample can be inserted from the side of the arc-shaped groove.
  • the end reclaiming device further includes a driving device having a power output shaft such as a motor for axially connecting the rotating arm shaft to drive the rotating arm during cutting.
  • a driving device having a power output shaft such as a motor for axially connecting the rotating arm shaft to drive the rotating arm during cutting.
  • the bottom of the frame rotates around the shaft.
  • the end reclaiming device further includes a rotating arm locking device for locking the rotating arm when the rotating arm rotates under the wafer sample to be cut.
  • the rotating arm In the process of cutting the wafer sample, the rotating arm is driven by the driving device of the end reclaiming device to rotate until the arc groove is located below the wafer sample to be cut and the rotation is stopped.
  • the rotating arm locking device locks the rotating arm.
  • the cutting frame adjacent to the discharging end is driven by the drive motor of the cutting frame to rotate to the first cutting state of double-line cutting, and the lifting mechanism drives the cutting wire saw to feed for cutting.
  • the rotating arm For the silicon wafer sample in the groove, the rotating arm is driven by the power output shaft to rotate away from the cutting frame, that is, to receive and obtain the silicon wafer sample.
  • the silicon ingot cutting device provided by the silicon ingot cutting device of the present application in the third aspect is movably connected to the reclaiming arm through the reclaiming arm and the clamping part arranged on the frame, and the telescopic cylinder assembly With the clamping member, the driving device is used to drive the two clamping parts of the clamping member to move toward or away from each other in the second dimension direction to complete the clamping and releasing of the cut silicon rod section; further, the present application
  • the reclaiming arm of the silicon rod blanking device is slidably arranged on the frame through the driving device, and the lifting motion of the clamping piece and the clamping or releasing action of the clamping part can be realized to cut the silicon rod.
  • the transportation between preset positions effectively realizes the automation of the silicon rod blanking process and connects different processes, which effectively improves the production efficiency of the enterprise and has high industrial value.
  • the present application provides the following embodiments in the third aspect.
  • the number groups provided in the embodiments provided in different aspects are independent of each other.
  • the third aspect of this application The embodiment 1 provided by the aspect is not the same embodiment as the embodiment 1 provided by the first aspect and the embodiment 1 provided by the second aspect.
  • the present application provides the following embodiments in the third aspect.
  • the serial number represents the various embodiments, for example, the numbers 1, 2, 3, 4... can respectively represent Example 1, Example 2, Example 3, Example 4...,
  • a silicon rod cutting device characterized in that it comprises:
  • the silicon rod feeding device is arranged between a storage area and a cutting work area, and is used to transfer the silicon rods to be cut placed in the storage area to the cutting work area;
  • the wire cutting device includes an upper cutting frame suspended in the cutting work area, and the cutting frame is provided with a single wire saw and a multi-wire saw for cutting off the silicon rods placed in the cutting work area During operation, the conversion between the first cutting state of cutting by the multi-wire saw and the second cutting state of cutting by the single wire saw is realized by the rotation of the cutting frame;
  • the silicon rod blanking device is arranged at the discharging end of the cutting work area, and is used for clamping and transporting the single-segment silicon rod section that meets the specifications of the workpiece after being cut for clamping for blanking.
  • the first rotating shaft is driven to rotate by a first driving device
  • At least two swing arm assemblies are respectively pivotally connected to the first rotating shaft according to a preset interval.
  • the at least two swing arm assemblies are used to carry the silicon rods to be cut, and are driven by the first rotating shaft.
  • the silicon rods to be cut are transferred to the cutting work area of the cutting equipment;
  • each of the swing arm assemblies includes a swing arm body axially connected to the first rotating shaft and a supporting mechanism provided on the swing arm body.
  • the supporting mechanism is used to follow the movement of the swing arm so that the supporting portion is kept in a state of supporting the silicon rod to be cut during the transfer operation.
  • the silicon rod cutting device characterized in that, the supporting mechanism includes a manipulator arranged at the end of the swing arm body for following the movement of the swing arm to support it The support part is kept in a state of supporting the silicon rod to be cut during the transfer operation.
  • the silicon rod cutting device characterized in that it further comprises at least two transfer stations corresponding to the swing arm assembly one-to-one, which are arranged on the base of the cutting device and are used to separately
  • the at least two swing arm components are respectively axially connected to the first rotating shaft according to a preset interval.
  • the silicon rod cutting device characterized in that the at least two transfer stations include a second movement mechanism for linear displacement of at least one swing arm assembly on the first rotating shaft to adjust the at least The separation distance of the two swing arm components.
  • the silicon rod cutting device characterized in that the 4 swing arm assemblies include a first swing arm assembly and a second swing arm assembly respectively disposed at both ends of the first rotating shaft, And the third swing arm assembly and the fourth swing arm assembly are respectively pivotally connected between the two ends of the first rotating shaft according to a preset interval.
  • the silicon rod cutting device according to embodiment 4, further comprising a second rotating shaft driven by a second driving device, the second rotating shaft being parallel to the first rotating shaft, and the second driving The device follows the working state of the first driving device and outputs a corresponding rotation speed or/and rotation angle to the second rotating shaft.
  • the supporting mechanism comprises: a manipulator assembly, arranged at the end of the swing arm body, including: a manipulator body, and movably arranged on the manipulator
  • the main body is used to carry the supporting member of the silicon rod to be cut, the supporting member is dynamically connected to the second rotating shaft, and when the second rotating shaft rotates, the supporting member is driven to rotate on the manipulator body to The supporting member is kept in a state of supporting the silicon rod to be cut during the transfer operation.
  • the driving gear is arranged in the built-in space of the swing arm body and is axially connected to the second rotating shaft for rotating under the driving of the second rotating shaft;
  • a driven gear which is axially connected to the built-in space of the swing arm body and meshes with the driving gear
  • the manipulator assembly is arranged at the end of the swing arm body, including a manipulator body, and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut, the supporting member including the passive The gear meshing tooth part and the supporting part used for conforming to the outer contour of the silicon rod to be cut.
  • the silicon rod cutting device characterized in that the swing arm assembly is provided with a detection device for detecting the contact between the supporting portion and the silicon rod to be cut.
  • the cutting frame is rotatably arranged on a lifting mechanism, and includes a rotating part, a first cantilever extending from the rotating part in a first direction, and a second cantilever extending from the rotating part in a second direction.
  • a third cantilever whose rotating part extends in the third direction;
  • the first multi-wire cutting wheel is arranged at the extension end of the first cantilever and has at least two wire grooves;
  • the second multi-wire cutting wheel is arranged at the extension end of the second cantilever and has at least two wire grooves, and a multi-wire saw is formed around the cutting line segment between the first multi-wire cutting wheel and the second multi-wire cutting wheel ;
  • the single-wire cutting wheel is arranged at the extension end of the third cantilever, and a single-wire saw is formed around the cutting line segment between the second multi-wire cutting wheel and the single-wire cutting wheel;
  • the cutting frame rotates around its rotating part to realize the first cutting state of cutting by the multi-wire saw and the first cutting state of the single-wire saw. 2. Conversion of cutting state.
  • the silicon rod cutting device according to embodiment 22, further comprising a tension detection mechanism, including a tensioning wheel arranged on the cutting frame for detecting and adjusting the first multi-wire cutting wheel , The tension of the cutting line between the second multi-line cutting wheel and the single-line cutting wheel.
  • a tension detection mechanism including a tensioning wheel arranged on the cutting frame for detecting and adjusting the first multi-wire cutting wheel , The tension of the cutting line between the second multi-line cutting wheel and the single-line cutting wheel.
  • the silicon rod cutting device according to embodiment 28, characterized in that it further comprises at least one tension detection mechanism, including a tensioning wheel arranged on the cutting frame, the lifting mechanism or the frame for Detect and adjust the tension of the cutting line between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.
  • at least one tension detection mechanism including a tensioning wheel arranged on the cutting frame, the lifting mechanism or the frame for Detect and adjust the tension of the cutting line between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.
  • the silicon rod cutting device characterized in that, in the first cutting state of the wire cutting device, the single wire cutting wheel does not contact the cutting wire; When the cutting state is switched to the second cutting state, the cutting frame rotates around its rotating part so that the single-wire cutting wheel presses the cutting line until the second cutting state is reached, the cutting line is wound around the On the single-wire cutting wheel, the cutting line segment between the single-wire cutting wheel and the second multi-wire cutting wheel forms a single-wire saw.
  • a locking device which is arranged on the lifting mechanism and is used to rotate the cutting frame around its rotating part to realize the After the conversion between the first cutting state and the second cutting state is completed, the cutting frame is locked.
  • the silicon rod cutting device according to embodiment 18, characterized in that it further comprises a cutting frame displacement device, which is arranged between the lifting mechanism and the base for linear displacement along the axial direction of the silicon rod. Adjust the length of the silicon rod to be cut off.
  • the silicon rod cutting equipment according to embodiment 34 characterized in that it further comprises a leveling device, which is arranged in the working area, and is configured to be placed in the working area according to the detection result of the leveling detection device. The axis of the silicon rod to be cut is leveled.
  • the reclaimer arm which can be movably suspended on the top frame of the silicon rod cutting device, includes a telescopic mechanism
  • the clamping piece is arranged at the bottom end of the reclaiming arm and is used for clamping a single-stage silicon rod section that meets the specifications of the workpiece after being cut.
  • clamping member comprises:
  • the first clamping block includes a first rack and a first clamping portion linked with the first rack;
  • the second clamping block is arranged in a mirror image relative to the first clamping block, and includes a second rack and a second clamping part linked with the second rack,
  • the drive gear is connected to the power output shaft of a motor and meshes with the first rack and the second rack for driving the first clamping portion and the second clamping portion when rotating forward When moving in opposite directions, the first clamping part and the second clamping part are driven to move back to perform a release action.

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Abstract

一种硅棒截断设备，包括：硅棒上料装置（2），设置在一储料区及一切割工作区（17）之间，用于将放置于储料区的待切割硅棒（16）转移至切割工作区（17）；线切割装置（1），包括悬设于切割工作区（17）的切割架（111），切割架（111）上设置有单线线锯（1141）及多线线锯（1121），用于对放置于切割工作区（17）的待切割硅棒（16）进行截断作业时，通过切割架（111）的转动以实现藉由多线线锯（1121）进行切割的第一切割状态以及藉由单线线锯（1141）进行切割的第二切割状态的转换；硅棒下料装置（3），设置于切割工作区（17）的出料端。

Description

硅棒截断设备 技术领域
本申请涉及多线切割技术领域，特别是涉及一种用于对硅棒进行切割作业的硅棒截断设备。
背景技术
线切割技术是目前世界上较先进的硅材料加工技术，它的原理是由高速运行的钢线带动附着在钢线上的切割刃料或者直接采用金刚线对待加工工件进行摩擦，从而达到线切割的目的。在切割过程中，钢线或金刚线通过导线轮引导，在切割辊上形成一根线锯或者一张线网，而待加工工件通过工作台的上升下降或线锯或线网的上升下降实现工件的进给。在压力泵的作用下，装配在设备上的冷却水自动喷洒装置将冷水喷洒至钢线或金刚线和加工件的切削部位，由钢线或金刚线往复运行产生切削，以将待加工材料一次同时切割为多块。线切割技术与传统的刀锯片、砂轮片及内圆切割相比具有效率高、产能高、精度高等优点。
目前的硅棒截断机在对硅棒进行截断前需要先截除加工工艺中不符合生产要求的硅棒首部与尾部杂质层，再进行切片取样片以检验待截断硅棒的材料特性；现有的样片获取技术，在截除硅棒首部或尾部后通过短距离移动切割架或硅棒，再重复一次切割操作以截取硅片样片。对切割架或硅棒的短距离移动难以精确控制，对截取的样片规格难以统一同时容易造成对硅棒材料的浪费，传统工序上进行取样的操作也降低了截断效率。
一般情况下，在相关技术中，每个工序作业所需的作业是独立布置，作业设备分散在不同的生产单位或生产车间或生产车间的不同生产区域，执行不同工序作业的工件的转换需要进行搬运调配，工序繁杂，效率低下，需大量的人力或转运设备，安全隐患大，另外，各个工序的作业设备之间的流动环节多，在工件转移过程中提高了工件损伤的风险，易产生非生产因素造成的不合格或不合理耗损。
发明内容
鉴于以上所述现有技术的缺点，本申请的目的在于提供一种可以自动进行不同工序切换硅棒截断设备，包括同时带有单线线锯与多线线锯的切割系统、自动上料装置与自动下料装置，用于解决现有技术中获取样片精度难以控制、获取样片造成硅棒物料浪费且降低截断效率，不同工序中工件转移带来工件损伤、工序繁杂、效率低下等问题。
为实现上述目的及其他相关目的，本申请提供一种硅棒截断设备，包括硅棒上料装置， 设置在一储料区及一切割工作区之间，用于将放置于所述储料区的待切割硅棒转移至所述切割工作区；线切割装置，包括悬设于所述切割工作区的上侧切割架，所述切割架上设置有单线线锯及多线线锯，用于对放置于所述切割工作区的硅棒进行截断作业时，通过所述切割架的转动以实现藉由所述多线线锯进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换；硅棒下料装置，设置于所述切割工作区的出料端，用于夹持并运输截断后符合工件规格的单段硅棒截段夹持以便下料。
在本申请的一些实施例中，所述线切割装置包括：切割架，可旋转地设置于一升降机构上，包括旋转部，自所述旋转部朝第一方向延伸的第一悬臂，自所述旋转部朝第二方向延伸的第二悬臂，自所述旋转部朝第三方向延伸的第三悬臂；第一多线切割轮，设置于所述第一悬臂的延伸端，具有至少二线槽；第二多线切割轮，设置于所述第二悬臂的延伸端，具有至少二线槽，绕于所述第一多线切割轮及第二多线切割轮之间的切割线段形成多线线锯；单线切割轮，设置于所述第三悬臂的延伸端，绕于所述第二多线切割轮及单线切割轮之间的切割线段形成单线线锯；其中，对所述硅棒进行截断作业时，所述切割架绕其旋转部转动以实现藉由所述多线线锯进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换。
在本申请的一些实施例中，所述多线线锯的延长线与所述单线线锯的延长线之间呈90°夹角；所述切割架于所述升降机构上可实现±45°或90°的旋转。
在本申请的一些实施例中，所述多线线锯的延长线与所述单线线锯的延长线之间呈60°夹角；所述切割架于所述升降机构上可实现±60°或120°的旋转。
在本申请的一些实施例中，所述第一切割状态为取片作业状态；所述第二切割状态为截断作业状态。
在本申请的一些实施例中，所述切割线以首尾相接的环形绕线方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间。
在本申请的一些实施例中，所述第一多线切割轮或第二多线切割轮藉由一驱动电机驱动旋转以运行绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间的切割线。
在本申请的一些实施例中，所述切割线为至少两根切割线绞合形成的绞线切割线。
在本申请的一些实施例中，所述硅棒截断设备还包括张力检测机构，包括设置于所述切割架上的张紧轮，用于检测并调整所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间切割线的张力。
在本申请的一些实施例中，所述硅棒截断设备还包括至少一个导线轮，设置于所述切割架上以实现所述切割线的换向。
在本申请的一些实施例中，所述切割线经所述导线轮导向至少两次绕于所述第一多线切割轮及第二多线切割轮，并经所述导线轮导向一次绕于所述单线切割轮。
在本申请的一些实施例中，所述切割线通过首端绕于一放线筒及尾端绕于一收线筒，并通过多个导线轮导向的方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间。
在本申请的一些实施例中，所述切割线经所述导线轮导向至少两次绕于所述第一多线切割轮及第二多线切割轮，并经所述导线轮导向一次绕于所述单线切割轮。
在本申请的一些实施例中，所述硅棒截断设备还包括至少一个张力检测机构，包括设置于所述切割架上、所述升降机构或机架上的张紧轮，用于检测并调整所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间切割线的张力。
在本申请的一些实施例中，所述硅棒截断设备在所述第一切割状态下，所述单线切割轮与所述切割线不接触；由所述第一切割状态切换至第二切割状态时，所述切割架绕其旋转部转动以使所述单线切割轮压迫所述切割线，直至到所述第二切割状态时，所述切割线绕于所述单线切割轮上以使所述单线切割轮及第二多线切割轮之间的切割线段形成单线线锯。
在本申请的一些实施例中，所述硅棒截断设备还包括锁紧装置，设置在所述升降机构上，用于在所述切割架绕其旋转部转动以实现藉由所述第一切割状态以及第二切割状态的转换完成后对所述切割架进行锁紧。
在本申请的一些实施例中，所述硅棒截断设备还包括切割架位移装置，设置在所述升降机构与机座之间，用于沿所述硅棒的轴向直线位移以调节截断所述硅棒的长度。
在本申请的一些实施例中，所述升降机构上设置有调平检测装置，用于检测放置在工作区的待切割硅棒的轴心水平度。
在本申请的一些实施例中，所述硅棒截断设备还包括调平装置，设置在所述工作区，用于依据所述调平检测装置的检测结果对放置在所述工作区的待切割硅棒的轴心进行调平。
在本申请的一些实施例中，所述硅棒上料装置包括：第一转轴，藉由一第一驱动装置驱动旋转；以及至少二摆臂组件，依据预设间隔分别轴接于所述第一转轴上，所述至少二摆臂组件用以承载所述待切割硅棒，并在所述第一转轴的驱动下将所述待切割硅棒转移至所述切割设备的切割工作区；各所述摆臂组件包括轴接于所述第一转轴的摆臂本体以及设置于所述摆臂本体的承托机构，所述承托机构用于跟随所述摆臂的运动以使其承托部在转移作业时，保持处于承载所述待切割硅棒的状态。
在本申请的一些实施例中，所述承托机构包括一机械手，设置于所述摆臂本体的末端，用于跟随所述摆臂的运动以使其承托部在转移作业时保持处于承载所述待切割硅棒的状态。
在本申请的一些实施例中，所述的硅棒截断设备还包括与所述摆臂组件一一对应的至少二转运台，设置在所述切割设备的机座上，用于分别将所述至少二摆臂组件依据预设间隔分别轴接于所述第一转轴上。
在本申请的一些实施例中，所述至少二转运台包括令至少一摆臂组件在所述第一转轴上直线位移的第二运动机构以调节所述至少二摆臂组件的间隔距离。
在本申请的一些实施例中，所述摆臂组件为4个，包括分别设置于所述第一转轴的两端的第一摆臂组件与第二摆臂组件，及依据预设间隔分别轴接于所述第一转轴的两端之间的第三摆臂组件与第四摆臂组件。
在本申请的一些实施例中，所述第三摆臂组件或第四摆臂组件的转运台包括在所述第一转轴上直线位移的第二运动机构。
在本申请的一些实施例中，所述的硅棒截断设备还包括由一第二驱动装置驱动的第二转轴，所述第二转轴与所述第一转轴平行，所述第二驱动装置跟随所述第一驱动装置工作状态输出对应的转速或/及转角给所述第二转轴。
在本申请的一些实施例中，所述第一驱动装置及所述第二驱动装置分别设置于第一转轴或所述第二转轴的相对两端。
在本申请的一些实施例中，所述第二转轴轴接于所述摆臂组件上，并位于所述摆臂本体上的第一转轴与所述承托机构之间。
在本申请的一些实施例中，所述承托机构包括：机械手组件，设置于所述摆臂本体的末端，包括：机械手本体，以及活动设置于所述机械手本体上用于承载所述待切割硅棒的承托件，所述承托件动力连接所述第二转轴，并在第二转轴转动时带动所述承托件在所述机械手本体转动，以使所述承托件在转移作业时保持处于承载所述待切割硅棒的状态。
在本申请的一些实施例中，所述摆臂本体具有一内置空间。
在本申请的一些实施例中，所述承托机构包括：主动齿轮，设置于所述摆臂本体的内置空间中，并轴接于所述第二转轴，用于在所述第二转轴驱动下转动；被动齿轮，轴接于所述摆臂本体的内置空间中，并与所述主动齿轮相啮合；机械手组件，设置于所述摆臂本体的末端，包括机械手本体，以及活动设置于所述机械手本体上用于承载所述待切割硅棒的承托件，所述承托件包括与所述被动齿轮相啮合的齿部，以及用于顺应所述待切割硅棒的外轮廓的承托部。
在本申请的一些实施例中，所述承托部齿部的齿数大于所述被动齿轮的齿数，所述被动齿轮的齿数大于所述主动齿轮的齿数。
在本申请的一些实施例中，所述承托部与所述待切割硅棒的接触面具有缓冲材料。
在本申请的一些实施例中，所述摆臂组件设置有检测装置，用于检测所述承托部与所述待切割硅棒的接触。
在本申请的一些实施例中，所述硅棒截断设备还包括端部取料装置，设置在所述切割工作区的至少一端，还用承接对所述待切割硅棒的端部的切割尾料。
在本申请的一些实施例中，所述硅棒截断设备的硅棒下料装置设置有用于检测所述待切割硅棒端部切割位置的传感器件。
在本申请的一些实施例中，所述传感器件为接触式传感器。
在本申请的一些实施例中，所述硅棒下料装置包括：取料臂，可平移地悬置在所述硅棒截断设备的机架上，包括伸缩机构；夹持件，设置在所述取料臂的底端，用于夹持截断后符合工件规格的单段硅棒截段。
在本申请的一些实施例中，所述夹持件包括：第一夹持块，包括第一齿条以及与所述第一齿条联动的第一夹持部；第二夹持块，相对于所述第一夹持块镜像设置，包括第二齿条以及与所述第二齿条联动的第二夹持部，驱动齿轮，连接一电机的动力输出轴，并与所述第一齿条与所述第二齿条相啮合，用于在正向转动时带动所述第一夹持部及第二夹持部相向运动以执行夹持动作，在逆向动时带动所述第一夹持部及第二夹持部背向运动以执行释放动作。
在本申请的一些实施例中，所述第一夹持部及第二夹持部用于夹持所述单段硅棒截段的夹持面上设置有缓冲材料。
综上所述，本申请的硅棒截断设备，通过设置计了一种可旋转的切割架，通过在切割架上同时设置单线切割轮与多线切割轮，使得切割架旋转至不同切割状态可实现多线线锯切割与的单线线锯截断，解决了通过多次切割获得样片效率低下且难以控制样片厚度容易浪费材料的问题。
另外，本申请的硅棒截断设备还包括硅棒上料装置，设置可沿待切割硅棒轴向移动至少两个摆臂组件，并通过机械手或机械手组件与摆臂组件末端的承托部配合，在对待切割硅棒移送过程中确保硅棒始终处于承载状态以实现自动上料，有效提高经济效益与安全性。
另外，本申请的硅棒截断设备还包括自动下料装置，对活动悬吊在机架上取料臂与夹持件设置驱动装置，实现夹持与运送功能，提高整个硅棒截断的作业工序的连续性，有效提高企业生产效率。
附图说明
图1显示为本申请硅棒截断设备在一实施例结构示意图。
图2显示为本申请硅棒截断设备在一实施例中第一切割状态示意图。
图3显示为图2中a处放大示意图。
图4显示为本申请硅棒截断设备在一实施例中第二切割状态示意图。
图5显示为本申请硅棒截断设备在一实施例中切割架处于中间状态的示意图。
图6显示为本申请硅棒截断设备在一实施例中切割架示意图。
图7显示为本申请硅棒截断设备在一实施例中第一切割状态示意图。
图8显示为本申请硅棒截断设备在一实施例中第二切割状态示意图。
图9显示为本申请硅棒截断设备在一实施例中中间状态示意图。
图10显示为本申请硅棒截断设备在一实施例中切割架示意图。
图11显示为本申请硅棒截断设备在一实施例中硅棒上料装置示意图。
图12显示为图11中b处放大示意图。
图13显示为图11中c处放大示意图。
图14显示为本申请硅棒阶段设备在一实施例中摆臂组件示意图。
图15显示为本申请硅棒阶段设备在一实施例中摆臂组件示意图。
图16显示为本申请硅棒阶段设备在一实施例中摆臂组件示意图。
图17显示为本申请硅棒阶段设备在一实施例中摆臂组件示意图。
图18显示为本申请硅棒阶段设备在一实施例中摆臂组件示意图。
图19显示为本申请硅棒阶段设备在一实施例中摆臂组件示意图。
图20显示为本申请硅棒截断设备在一实施例中硅棒下料装置示意图。
图21a及图21b显示为本申请硅棒截断设备在一实施例中硅棒下料装置示意图。
图22显示为本申请硅棒截断设备在一实施例中硅棒下料装置夹持部件示意图。
图23显示为本申请硅棒截断设备在一实施例中硅棒下料装置驱动装置示意图。
图24显示为本申请硅棒截断设备在一实施例中硅棒下料装置驱动装置示意图。
图25显示为图21b中d处放大示意图。
具体实施方式
以下由特定的具体实施例说明本申请的实施方式，熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本申请的其他优点及功效。
在下述描述中，参考附图，附图描述了本申请的若干实施例。应当理解，还可使用其他实施例，并且可以在不背离本公开的精神和范围的情况下进行机械组成、结构以及操作上的改变。下面的详细描述不应该被认为是限制性的，并且本申请的实施例的范围仅由公布的专利的权利要求书所限定。这里使用的术语仅是为了描述特定实施例，而并非旨在限制本申请。 空间相关的术语，例如“上”、“下”、“左”、“右”、“下面”、“下方”、“下部”、“上方”、“上部”等，可在文中使用以便于说明图中所示的一个元件或特征与另一元件或特征的关系。
虽然在一些实例中术语第一、第二等在本文中用来描述各种元件，但是这些元件不应当被这些术语限制。这些术语仅用来将一个元件与另一个元件进行区分。例如，第一多线切割轮可以被称作第二多线切割轮，并且类似地，第二多线切割轮可以被称作第一多线切割轮，而不脱离各种所描述的实施例的范围。第一多线切割轮和第二多线切割轮均是在描述一个切割轮，但是除非上下文以其他方式明确指出，否则它们不是同一个多线切割轮。相似的情况还包括第一悬臂、第二悬臂与第三悬臂，第一摆臂组件与第二摆臂组件，抑或是第一运动机构与第二运动机构、第一夹持部与第二夹持部等。
再者，如同在本文中所使用的，单数形式“一”、“一个”和“该”旨在也包括复数形式，除非上下文中有相反的指示。应当进一步理解，术语“包含”、“包括”表明存在所述的特征、步骤、操作、元件、组件、项目、种类、和/或组，但不排除一个或多个其他特征、步骤、操作、元件、组件、项目、种类、和/或组的存在、出现或添加。此处使用的术语“或”和“和/或”被解释为包括性的，或意味着任一个或任何组合。因此，“A、B或C”或者“A、B和/或C”意味着“以下任一个：A；B；C；A和B；A和C；B和C；A、B和C”。仅当元件、功能、步骤或操作的组合在某些方式下内在地互相排斥时，才会出现该定义的例外。
在现有的硅材料加工中，基于硅棒固有的硬脆特质，通常由线切割技术完成。硅棒作业的工序起始于对原始的长硅棒进行截断作业以形成多段短硅棒(即切割硅棒截断后的符合工件规格的硅棒截段)，截断作业使用设备即硅棒截断设备。一般情况下，在硅棒截断设备上设有工作台，例如为钢线或金刚线的切割线通过导线轮的引导在切割辊上形成线锯对待加工的单根硅棒进行切割，作为后续硅片加工作业的前序过程，硅棒截断中需要进行截取样片以检验硅棒的材料特性是否满足工艺要求。现有的样片获取手段，一般在截除硅棒首部或尾部后通过移动切割架或硅棒，再重复一次切割操作以截取硅片样片，所截取硅片样片的厚度依赖于人为控制的移动距离，对切割架或硅棒的短距离移动难以精确控制，对截取的样片规格难以统一同时难以实现硅片样片所需的短距离移动(比如为2mm～20mm)，即容易过量移动造成对硅棒材料的浪费，传统工序上需要人为控制的取样操作也降低了截断效率。
另外，在一般情况下，每个工序作业所需的作业是独立布置，作业设备分散在不同的生产单位或生产车间或生产车间的不同生产区域，执行不同工序作业的工件的转换需要进行搬运调配，工序繁杂，效率低下，需大量的人力或转运设备，安全隐患大，另外，各个工序的作业设备之间的流动环节多，在工件转移过程中提高了工件损伤的风险，易产生非生产因素 造成的不合格或不合理耗损。
在本申请提供的实施例中，为明确空间的方位，定义一个由第一维度方向、第二维度方向、第三维度方向定义的三维空间，所述第一维度方向、第二维度方向、第三维度方向均为直线方向且相互两两垂直。以一放置在切割区的待切割硅棒为参考，所述第一维度方向为待切割硅棒的轴向亦或为前向及后向；第二维度方向为左向及右向，例如为上料装置在储料区与切割工作区之间直线位移的方向为左向或右向；第三维度方向为升、降方向或上、下方向，例如切割架上升或下降的方向。
请参阅图1，显示为申请的硅棒截断设备在一实施例中的结构示意图，包括线切割装置1，硅棒上料装置2，硅棒下料装置3。
请参阅图2，显示为本申请的线切割装置在一实施方式中第一切割状态下的侧视图。如图所示，本申请的线切割装置，用于对硅棒进行切割作业，所述切割作业例如为截断作业或开方作业或者切片作业等；在实施例中，所述硅棒包括单晶硅棒与多晶硅棒，单晶硅棒即通过用直拉法或悬浮区熔法从熔体中生长出棒状单晶硅，例如在硅棒加工中常见的大约为5000mm(例如为5360mm的规格等)长度的单晶硅棒或者大约为800mm长度的单晶硅棒等，多晶硅即采用析出技术如化学气相沉积技术使硅在硅芯线表面析出的硅棒；但并不局限于此，在本申请的其他可能的实施例中，所述线切割装置还可以被用于截断多晶硅的硅锭，或者其他长条状且需要截断处理的硬质材料。
如图2所示，本申请的应用于对硅棒进行切割作业的硅棒截断设备的线切割装置1包括切割架111，第一多线切割轮112与第二多线切割轮113及绕于第一多线切割轮112及第二多线切割轮113之间的切割线段形成多线线锯1121，单线切割轮114及绕于所述第二多线切割轮113及单线切割轮114之间的切割线段形成单线线锯(图2所示实施例中未显示)；绕线系统12，机架13，升降机构14，以及机座15。
诚如前述，硅棒截断前通常需要进行截取样片以检验硅棒的材料特性是否满足工艺要求，如图2显示的处于第一切割状态的线切割装置，升降机构14进行升降移动带动第一多线切割轮112及第二多线切割轮113之间的切割线段形成的多线线锯1121(如图2所示实施例为双线线锯)在升降方向进行升降移动，实现对位于所述多线线锯1121下方的待加工硅棒(图中未显示)的多线切割，在一次升降运动的截断操作中，相互平行的切割线锯同时对待加工硅棒进行切割，在对待加工硅棒截断的同时，也一并获得硅棒切片即所需的硅片样片。在实施例中，所述第一切割状态即取片状态。
在图2显示的实施例中，本申请的线切割设备的绕线系统12还包括切割线121、导线轮1221、导线轮1222，及张力检测部件123。
本申请的进一步改进在于，所述线切割设备还包括切割架位移装置，所述切割架位移装置设置于机架和机座之间，在本实施例的一实现方式中，所述机架13与线切割设备的机座通过在第一维度方向的水平导轨(图中未显示)活动连接。所述机座上包括第一维度方向的水平导轨，所述切割系统的机架13底部设置有配合所述水平导轨的导轨槽。通过所述切割架位移装置带动切割架在机座的切割工作区(或切割工作台)上沿着前后方向进行直线位移，以使线锯(单线线锯或多线线锯，但在截断工作中，切割架通常处于单线线锯的状态，即本申请中所述的第二切割状态)沿所述硅棒的轴向直线位移，进而可以调节截断所述硅棒的长度，以得到期望的符合工件规格的单段硅棒截段。
在一实施例中，所述机架13内部或外部设置有驱动机构，用于驱动机架13在所述机座15的水平导轨上移动。在一个实施例中，所述机架13驱动机构包括：沿所述机座导轨设置且与所述机架13连接的行进丝杠(图中未显示)，与所述行进丝杠连接的行进电机(图中未显示)。利用所述行进电机，驱动所述机架13沿着导轨行进，所述机架13上的行进电机与铺设于导轨上的所述行进丝杠连接，实现所述机架13在导轨上沿第一维度方向即承载装置上的待切割硅棒的轴向与所述机架13的相对移动。所述切割架111在升降方向活动连接与所述机架13，在第一维度方向固定在所述机架13上，即实现所述切割架111上的切割线锯与承载装置上的待切割硅棒在所述待切割硅棒轴向方向的相对位移。在本实施例的另一实现方式中，所述切割架111相对于机座的水平移动可由外力驱动。
请参阅图3，显示为图2的线切割装置在a处的放大示意图，所述机架13上具有用于配合所述升降机构14升降移动的导轨结构，在图3所示的实施例中，所述机架13上包括升降导轨131，所述升降机构14具有配合所述升降导轨的导槽(图中未予以显示)。
在本实施例的一实现方式中，为实现所述升降机构14相对于所述机架13的升降，升降机构14内部或外部设置有驱动机构(图中未予以显示)，用于驱动升降机构14在所述机架13的导轨131上移动。在一个实施例中，所述升降机构14的驱动机构包括：沿所述机架13导轨设置且与所述升降机构14连接的行进丝杠，与所述行进丝杠连接的行进电机。利用所述行进电机，驱动所述升降机构14沿着导轨行进，所述升降机构14上的行进电机与铺设于导轨上的所述行进丝杠连接，实现所述升降机构14在导轨上沿垂直方向与所述机架13的相对移动并限制升降机构14相对于机架13的移动在于升降方向的单一自由度。
在本申请的另一实施例中，所述升降机构14与机架13升降导轨的连接组件中还包括限位块，用于限制所述升降机构14在升降运动中不发生过度位移。
所述导线轮122设置于所述切割架及机架上以实现所述切割线的换向，并且对切割线进行引导，在具体实现方式上，导线轮可包括横向导线轮、纵向导线轮、以及斜向导线轮等， 它们在安装时可根据切割线的走线方式而设置在不同的安装结构上以实现引导切割线的目的。
在本申请的一些实施例中，所述线切割装置采用非封闭的绕线方式，所述切割线首端绕于一放线筒，尾端绕于一收线筒，并通过多个导线轮导向的方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间，实现在第一切割状态下切割架进行一次升降切割操作截取硅片样片，第二切割状态下切割架进行一次升降切割操作进行硅棒截断。
请参阅图2，显示为本申请的线切割装置采用非封闭时绕线方式的一实施例侧视图，包括切割架111，第一多线切割轮112、第二多线切割轮113、由切割线绕于第一多线切割轮112及第二多线切割轮113之间的形成的多线线锯1121，单线切割轮114、由切割线绕于所述第二多线切割轮113及单线切割轮114之间可形成单线线锯(图示切割状态下未予以显示)；绕线系统12，以及机座15。
所述切割架111为以可旋转的方式设置于升降机构14上，旋转架包括：旋转部1111，第一悬臂1112，第二悬臂1113，以及第三悬臂1114。其中，旋转部1111所述旋转部1111的转轴中心即为切割架111的旋转中心；所述第一悬臂1112为沿着所述旋转部1111在第一方向延伸的梁结构；所述第二悬臂1113为沿着所述旋转部1111在第二方向延伸的梁结构；所述第三悬臂1114为沿着所述旋转部1111在第三方向延伸的梁结构；所述第一悬臂1112、第二悬臂1113及第三悬臂1114均位于所述切割架111的旋转固定板上，即随着旋转部1111的旋转而转动。
在实施方式中，所述旋转部1111的转轴中心轴接一驱动电机，由电机轴即动力输出轴带动所述切割架111沿旋转部1111的旋转。
所述切割架111上的第一悬臂1112、第二悬臂1113及第三悬臂1114的空间位置排列近似组成一T型结构，所述切割架111的旋转中心设置在切割架111三个悬臂的交汇端区域。在具体实现方式上，所述旋转中心的位置根据切割架111的结构与材料特征设置在切割架111重心区域，减少切割架111自重对旋转部1111转轴的力矩带来的结构磨损。在图2所示的实施例中，所述第一悬臂1112、第二悬臂1113及第三悬臂1114的自由端(即延伸端)分别与所示第一多线切割轮112、第二多线切割轮113及单线切割轮114转动连接，所述第一多线切割轮112与第二多线切割轮113之间形成多线线锯1121，所述第二多线切割轮113与单线切割轮114之间形成单线线锯1141。所述第一悬臂1112、第二悬臂1113及第三悬臂1114均位于所述切割架111的旋转固定板上，即随着旋转部1111的旋转而转动。
所述第一多线切割轮112为设置了至少两个线槽(包括两个或者两个以上的线槽)的切割轮，可转动地设置于所述第一悬臂1112远离旋转中心的延伸端，其中各个线槽在切割轮上的排列相互平行，以确保在切割轮上缠绕的切割线相互平行，切割轮的基本结构与安装方式 为本领域技术人员所熟知或可轻易获知，在此不再赘述。
所述第二多线切割轮113为设置了至少两个线槽的切割轮，可转动地设置于所述第二悬臂1113远离旋转中心的延伸端，其中各个线槽在切割轮上的排列相互平行，特别的，所述第二多线切割轮的相邻线槽的间距与所述第一多线切割轮的相邻线槽的间距相等，以实现绕于两个多线切割轮之间的切割线形成的多线线锯1121的切割段满足相互平行的空间关系。
所述单线切割轮114可转动地设置于所述第三悬臂1114远离旋转中心的延伸端，顺应绕于所述第二多线切割轮113及单线切割轮114之间的切割线段形成单线线锯，所述单线切割轮114的线槽在第一维度方向所处的平面与第二多线切割轮113的至少一个线槽在第一维度方向所处的平面为同一平面。
在一示例性的实施方式中，所述单线切割轮114可以设置了多个线槽的切割轮，在绕线方式中切割线对所述单线切割轮的线槽绕线一次，即可实现引出单根线锯。
在一示例性的实施方式中，对所述硅棒进行截断作业时，所述切割架111绕其旋转部1111转动以实现藉由所述多线线锯1121进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换。
如图2显示的处于第一切割状态的线切割装置，升降机构14进行升降移动带动第一多线切割轮112及第二多线切割轮113之间的切割线段形成的多线线锯1121(如图2所示实施例为双线线锯)在升降方向进行升降移动，实现对位于所述多线线锯1121下方的待加工硅棒(图中未显示)的多线切割，在一次升降运动的截断操作中，相互平行的切割线121距同时对待加工硅棒进行切割，可截取获得硅棒切片即所需的硅片样片。
在本申请的一些实施方式中，如图3所示，所述切割架与升降机构连接的旋转部1111为旋转式法兰盘锁，即，所述切割架111与升降机构14通过旋转式法兰盘锁1111活动连接。所述旋转式法兰盘锁1111包括第一法兰、第二法兰(图中未显示)、螺栓和螺母，第一法兰设有复数个直径大于螺栓螺杆直径且小于螺栓头部直径的第一通孔，第二法兰设有复数个与第一通孔对应的第二通孔，第二通孔包括一大圆孔和一小圆孔，大圆孔与小圆孔从侧壁彼此连通；在本实施例中，所述螺母为7字螺母，螺母的一端直径大于小圆孔的直径且小于大圆孔的直径，螺母与异形孔的结合使得法兰盘锁拆装更加简单省力。在本申请的另一实施例中，所述法兰盘锁中的连接螺母可为蝶形螺母。
在本申请的另一些实施方式中，所述切割架与升降机构的连接可设置为通过蜗轮蜗杆传动的旋转部，包括蜗轮、正转蜗杆、反转蜗杆、驱动器及电机。所述正转蜗杆与反转蜗杆分别与蜗轮啮合，所述驱动器控制电机中电流的大小和方向，电机通过蜗杆给蜗轮提供力矩以实现所述切割架的旋转。
如图2所示，显示为非封闭绕线方式下的本申请的线切割设备侧视图，在图示实施例中，所述切割线121可以为钢线，也可以为由金刚石等的微小硬颗粒镶嵌在切割钢线上形成的金刚线，也可以采用如中国专利201620281204.1(发明名称：金刚线及多线切割设备)中描述的金刚线，即，所述金刚线包括：钢丝，所述钢丝分为间隔设置的至少两类切割区段；分别镀设于至少两类切割区段的至少两类金刚石层，各个所述金刚石层的颗粒级数不同。
在选为金刚线的具体实施例中，为避免缠绕在贮丝筒(包括一个放线筒124，一个收线筒125)上的金刚线因高速走线产生的不可避免的摩擦而导致磨损，所述金刚线在贮丝筒上的缠绕可以优选为单层缠绕。针对金刚线在贮丝筒上的缠绕方式，可以采用中国专利200910197800.6(发明名称：金刚线截断机的贮丝筒排丝机构)中描述的贮丝筒排丝机构。
在本申请的一些实施例中，对每一机架13与切割架组成的切割系统，至少包括一个张力检测机构，所述张力检测机构包括至少一个张紧轮123，张紧轮123设置在所述切割架111、升降机构14或机架13上，用于检测并调整所述第一多线切割轮112、第二多线切割轮113、以及单线切割轮114之间的张力。在具体实现方式上，所述张紧轮123可以采用中国专利200910199387.7(发明名称：金刚线开方机的张力调整机构)中描述的张力调整机构；还可以采用中国专利201410245524.7(发明名称：多线切割设备及其张力调整机构)中描述的实时感测牵引组件与贮丝筒(绕线筒)之间的钢线或切割线的张力和牵引组件与切割区之间钢线或金刚线的张力并可根据感测的张力值而分别对绕线筒上的钢线或金刚线的张力和切割区的钢线或金刚线的张力进行调整的方式。
在本申请的一些实施方式中，所述张力检测机构还可采用张力过渡轮(未予以图示)确保切割过程中切割线121处于张力平衡状态。所述切割线121从放线筒124出发的切割线121在绕过机架13后，依次对切割架111上的第一多线切割轮112、第二多线切割轮113或单线切割轮114进行绕线前，通过第一张力过渡轮引入切割架111，在完成对切割架111上的切割轮绕线后通过第二张力过渡轮引出至机架13的导向轮1221，经由导向轮1221导向绕于收线筒125上。切割时，所述第一张力过渡轮与放线筒配合以调节所述第一张力过渡轮与在第一多线切割轮之间的切割线121以确保切割线121处于平衡状态，所述第二张力过渡轮与收线筒配合以调节所述第二张力过渡轮与第二多线切割轮或单线切割轮之间的切割线121以确保切割线121处于平衡状态。
在本申请的一些实施例中，所述切割系统中还包括绕线电机，以驱动运行收线筒125至放线筒124之间的切割线121。
本申请的线切割装置进一步改进还在于，还包括锁紧装置，所述锁紧装置设置在所述升降机构上，用于在所述切割架在不同切割状态之间转换完成后对切割状态的定格。所述切割 架的悬臂自由度大于0，在切割过程中切割线121与待切割硅棒的接触受力可能使切割架产生旋转，采用锁紧装置即是一种实施手段，使所述切割架在旋转部的驱动电机带动旋转后到达所预设的切割状态的位置后停止转动并处于锁紧状态。
在本申请实施例的一实现方式中，所述锁紧装置包括转动锁紧气缸，转动锁紧气缸在切割架进行切割状态转换的旋转过程中处于放松状态，达到在所述切割架达到预设切割状态后进入制动状态。
本申请的进一步改进在于，所述锁紧装置中还包括定位装置，在切割状态的转换中，所述切割架的旋转为驱动电机带动的被动旋转，由电机控制切割架的旋转状态，在一实施场景中，切割架自身具有的转动惯量在电机停止运行后可维持切割架继续旋转，由转动惯量带动的旋转运动的旋转角速度与持续时间难以人为操控，则会影响对切割架停止运转后所处的空间位置的定位。所述定位装置设置在所述升降机构上，包括一个自动检测线的固定模块，定位夹具组件，当旋转架旋转至第一切割状态位置或第二切割状态位置时，自动检测线的固定模块检测到切割架中有零件放置于定位夹具组件后，转动锁紧气缸的气缸伸出，推动定位夹具组件夹紧切割架使切割架与升降机构相对运动的自由度为0。
请参阅图3，在如图所示的实施例中，所述线切割装置的绕线方式为非封闭式，以放线筒为起点，收线筒为终点，切割线121在线切割装置上经过机架与切割架，所述切割线121从放线筒出发，在机架上根据导线轮的排列进行绕线，继而从机架13到切割架111对所述导线轮、第一多线切割轮112、第二多线切割轮113及单线切割轮114进行绕线，在切割架上绕线结束后切割线121从机架经导线轮引导绕至收线筒。
为便于说明和理解本申请的绕线方式，令所述切割线121在切割架上的绕线方式为从机架绕至导线轮1222开始沿所述导线轮1222的线槽切点为起始点，切割线121走向为切线方向；
依次绕于所述第一多线切割轮112，第二多线切割轮113，导线轮1221，一次环绕中经由导线轮1221引导后的切割线121在第一多线切割轮112与第二多线切割轮113间形成第一条切割线锯；
经过一次环绕后从导线轮1221线槽切线起始的切割线121依次环绕经过第一多线切割轮112，第二多线切割轮113，由第二多线切割轮113环绕后，形成与第一次环绕中第一多线切割轮112与第二多线切割轮113的第一条切割线锯平行的第二条切割线锯，即形成多线线锯1121，即最终形成两条互相平行的切割线锯；
从第二多线切割轮下缘的切线放线延伸的延长线绕至机架上的导线轮1223处，作为在切割架111上绕线的终点。
在本申请的某些实施例中，所述线切割装置中一个机架上的切割线绕过的张紧轮可设置为多个。
在本申请的某些实施例中，基于工艺要求的取片数量，所述环形绕线方式经过第一多线切割轮与第二多线切割轮可为大于二次的多次，形成相互平行的切割线锯，在切割架一次升降切割中可截取得多片硅片样片。
如图2所示第一切割状态下的线切割装置示意图，所述第一切割状态为切割架111旋转至第一多线切割轮112下缘所在水平面与第二多线切割轮113下缘所在水平面为同一水平面的状态，且该共有的水平面位于所述第一切割状态下的切割架111结构的下方，绕于所述第一多线切割轮111及第二多线切割轮113之间的切割线121形成多线线锯，所述多线线锯呈水平的平行线，即所述第一切割状态为在一次切割动作中可截取得硅片样片的取片作业状态。在所述第一切割状态下，所述单线切割轮与切割线121处于分离状态(不接触的状态)。
如图4所示，显示为第二切割状态下的线切割装置，所述第二切割状态为切割架111旋转至第二多线切割轮113下缘所在水平面与单线切割轮114下缘所在水平面为同一水平面的状态，且该共有的水平面位于所述第一切割状态下的切割架111结构的下方，绕于所述第二多线切割轮113及单线切割轮114之间的切割线121段形成水平的单线线锯1141。即所述第二切割状态为在一次切割动作中可进行硅棒截断的状态。在所述第二切割状态下，所述切割架111的第一悬臂1112延长线与第二悬臂1113延长线呈45°夹角，所述第二悬臂1113延长线与第三悬臂1114延长线呈45°夹角，所述切割架111的悬臂结构以第二悬臂1113中心线为对称线，呈近似对称状。所述多线线锯的延长线与所述单线线锯的延长线之间呈90°夹角，所述切割架111绕旋转中心旋转以进行不同切割状态的转换时，第一切割状态至第二切割状态之间的相互转换可通过绕旋转轴90°的旋转以实现，或者，从中间状态至第一切割状态或第二切割状态的转换可通过绕旋转轴的±45°旋转以实现。
请参阅图5，显示为本的申请线切割装置在一实施例中切割架在中间状态的侧视图，所述中间状态为切割架111在锁紧装置处于放松状态即所述切割架111与定位夹具组件分离时受到切割架111重力作用的自然静止状态，此时第一多线切割轮112与第二多线切割轮113之间的多线线锯、第二多线切割轮113与单线切割轮114之间的单线线锯均与水平线呈一定夹角，所述单线线锯与单线切割轮114为相切状态；切割架近似呈一空间直立放置的T型结构，即使得切割架111的旋转中心所在水平面之下的部分重心最低的状态。
图2显示为第一切割状态下的线切割装置，所述单线切割轮114与所述切割线121处于分离状态。在切割过程的转换中，切割架111转换至第二切割状态时所述单线切割114轮随着切割架111的第三悬臂1114绕旋转中心的旋转与切割线121从第一切割状态的分离至中间 状态接触相切继而至第二切割状态下的压迫状态，在达到第二切割状态的位置后由转动锁紧气缸锁紧而静止。所述单线切割轮114中与切割线121在第一维度方向处于同一平面的线槽在旋转至第二切割状态后与切割线121接触并压迫切割线121至水平状态，以形成第二多线切割轮113与单线切割轮114之间的单线线锯。
在本申请的线切割装置对承载装置上的硅棒进行一次完整切割的过程中，所述过程包括以下切割状态：调整硅棒(待切割的硅棒)在承载装置的位置后进行夹紧，使硅棒保持静止，调整机架在第一维度方向的位置，使切割线线锯位于需截取的首部(或者尾部，又或者两个线架的情况下，两个切割架分别位于待切割硅棒的首尾两侧)与符合加工规格的部位交接段上方，电机驱动切割架从自然静止的中间状态旋转一定角度(图示实施例中为45°)至多线线锯切割的第一切割状态并由转动锁紧气缸将切割架锁紧，升降机构下降带动线锯移动至接触硅棒并继续进行切割，即在截除首部时截取得硅片样片；截取样片完成后升降机构上升远离硅棒，依据预设的硅棒截段长度由水平导轨上的行进电机调整机架在第一维度方向的位置，由切割架旋转轴轴接的电机驱动切割架旋转一定角度(图示实施例中为90°)至单线切割的第二切割状态，旋转中切割线与所述单线切割轮从分离逐渐至压迫状态，直至切割线绕于所述单线切割轮上，在第二切割状态时形成水平的单线线锯，并由转动锁紧气缸将切割架锁紧，升降机构带动切割线锯下降进行切割获得硅棒截段；重复单线线锯的步骤按照晶段的要求对硅棒进行截断作业直至完成对整根硅棒的切割操作。在切割架完成切割作业后，所述锁紧气缸处于放松状态，所述切割架从第二切割状态旋转一定角度(图示实施例中为45°)至中间状态。
在本申请的线切割装置的另一些实施例中，如图6所示，所述第切割架111的第一悬臂1112、第二悬臂1113与第三悬臂1113之间所呈的夹角可以改变如图所示的120°，所述第一多线切割轮112、第二多线切割轮113及单线切割轮114分别固定在所述第一悬臂1112、第二悬臂1113及第三悬臂1114上。所述第一多线切割轮112与第二多线切割轮113之间的多线线锯1121的延长线与所述第二多线切割轮113与单线切割轮114之间的单线线锯1141的延长线之间呈60°夹角。所述切割架111绕旋转中心1111旋转以进行不同切割状态的转换时，第一切割状态至第二切割状态之间的相互转换可通过绕旋转轴120°的旋转以实现，从中间状态至第一切割状态或第二切割状态的转换可通过绕旋转轴的±60°旋转以实现。
在本申请的另一些实施例中，如图7所示，本申请的线切割装置的绕线系统采用封闭式绕线结构，所述切割线121以首尾相接的环形绕线方式绕于所述切割架111上第一多线切割轮112、第二多线切割轮113、以及单线切割轮114之间。所述切割线121通过第一多线切割轮112及第二多线切割轮113的切割槽绕于切割轮上，所形成的切割线线锯在切割槽的切线 方向。所述切割线121经所述导线轮导向至少两次绕于所述第一多线切割轮112及第二多线切割轮113，并经所述导线轮导向一次绕于所述单线切割轮114。所述切割线121在第一多线切割轮112上环绕的多个线槽之间距离与在第二多线切割轮113上环绕的多个线槽之间的距离对应相等，即沿第一多线切割轮112与第二多线切割轮113的线槽切线方向引出的切割线121锯之间满足相互平行的空间关系。
所述切割架111为以可旋转的方式设置于一升降机构(图中未予以显示)上，切割架111包括：旋转部1111，第一悬臂1112，第二悬臂1113，以及第三悬臂1114。其中，所述旋转部1111的转轴中心即为切割架的旋转中心；所述第一悬臂1112为沿着所述旋转部1111在第一方向延伸的梁结构；所述第二悬臂1113为沿着所述旋转部1111在第二方向延伸的梁结构；所述第三悬臂1114为沿着所述旋转部1111在第三方向延伸的梁结构；所述第一悬臂1112、第二悬臂1113及第三悬臂1114均位于所述切割架111的旋转固定板上，即随着旋转部1111的旋转而转动。
在本申请的一些实施方式中，所述旋转部1111的转轴中心轴接一驱动电机，由电机轴即动力输出轴带动所述切割架沿旋转部的旋转。
所述切割架上的第一悬臂1112、第二悬臂1113及第三悬臂1114的空间位置排列近似组成一T型结构，所述切割架的旋转中心设置在切割架三个悬臂的交汇端区域。在具体实现方式上，所述旋转中心的位置根据切割架的结构与材料特征设置在切割架重心区域，减少切割架自重对旋转部转轴的力矩带来的结构磨损。在图1所示的实施例中，所述第一悬臂1112、第二悬臂1113及第三悬臂1114的自由端(即延伸端)分别与所示第一多线切割轮、第二多线切割轮及单线切割轮固定连接，所述第一多线切割轮与第二多线切割轮之间形成多线线锯1121，所述第二多线切割轮与单线切割轮之间形成单线线锯(图示实施例中未显示)。
所述第一多线切割轮112为设置了至少两个线槽的切割轮，固定设置于所述第一悬臂1112远离旋转中心的延伸端，其中各个线槽在切割轮上的排列相互平行，以确保在切割轮上缠绕的切割线相互平行，切割轮的基本结构与安装方式为本领域技术人员所熟知或可轻易获知，在此不再赘述。
所述第二多线切割轮113为设置了至少两个线槽的切割轮，可转动地设置于所述第二悬臂1113远离旋转中心的延伸端，其中各个线槽在切割轮上的排列相互平行，特别的，所述第二多线切割轮113的相邻线槽的间距与所述第一多线切割轮112的相邻线槽的间距相等，以实现绕于两个多线切割轮之间的切割线形成的多线线锯的切割段满足相互平行的空间关系。
所述单线切割轮114可转动地设置于所述第三悬臂1114远离旋转中心的延伸端，顺应绕于所述第二多线切割轮113及单线切割轮114之间的切割线段形成单线线锯，所述单线切割 轮114的线槽在第一维度方向所处的平面与第二多线切割轮113的至少一个线槽在第一维度方向所处的平面为同一平面。
在本申请的另一实施方式中，所述单线切割轮114可以为设置了多个线槽的切割轮，在绕线方式中切割线对所述单线切割轮114的线槽绕线一次，即可实现引出单根线锯。
在本申请的一些实施例中，对所述硅棒进行截断作业时，所述切割架绕其旋转部转动以实现藉由所述多线线锯进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换。
如图7显示的处于第一切割状态的线切割装置，升降机构进行升降移动带动第一多线切割轮112及第二多线切割轮113之间的切割线段形成的多线线锯1121(如图1所示实施例为双线线锯)在升降方向进行升降移动，实现对位于所述多线线锯1121下方的待加工硅棒(图中未显示)的多线切割，在一次升降运动的截断操作中，相互平行的切割线锯同时对待加工硅棒进行切割，可截取获得硅棒切片即所需的硅片样片。
在本申请的一些实施方式中，所述切割架与升降机构连接的旋转部1111为旋转式法兰盘锁。所述旋转式法兰盘锁包括第一法兰、第二法兰(图中未显示)、螺栓和螺母，第一法兰设有复数个直径大于螺栓螺杆直径且小于螺栓头部直径的第一通孔，第二法兰设有复数个与第一通孔对应的第二通孔，第二通孔包括一大圆孔和一小圆孔，大圆孔与小圆孔从侧壁彼此连通；在本实施例中，所述螺母为7字螺母，螺母的一端直径大于小圆孔的直径且小于大圆孔的直径，螺母与异形孔的结合使得法兰盘锁拆装更加简单省力。在本申请的另一实施例中，所述法兰盘锁中的连接螺母可为蝶形螺母。
在本申请的另一些实施方式中，所述切割架与升降机构的连接可设置为通过蜗轮蜗杆传动的旋转部，包括蜗轮、正转蜗杆、反转蜗杆、驱动器及电机。所述正转蜗杆与反转蜗杆分别与蜗轮啮合，所述驱动器控制电机中电流的大小和方向，电机通过蜗杆给蜗轮提供力矩以实现所述切割架的旋转。
在图7所示实施例中，所述切割线121为至少两根切割线相互绞合形成的绞线切割线。所述绞线切割线由用于绞合的两根或多根钢线单线或金刚线单线绕绞线轴以同一个角速度旋转并配合绞线缠绕方式匀速前进形成，或由用于绞合的多根单线以一定的方向与规则绞合形成，相比与绞线有相同截面积的单线切割线，所述绞线切割线的机械性与柔韧性较高，延长切割中切割线在重复磨损之下的疲劳寿命。
请参阅图7，在如图所示的实施例中，所述切割线121的绕线方式为封闭的环状结构，为便于说明和理解本申请的绕线方式，假设在切割线环线中的一点作为截断点，将该点作为绕线的起始点，在一个实施方式中，所述切割线121的绕线方式为从单线切割轮114开始沿所 述单线切割轮1114的线槽切点为起始点，切割线121走向为切线方向；
依次绕于所述第二多线切割轮113，第一多线切割轮112，导线轮122，一次环绕中经由导线轮122引导后的切割线121在第一多线切割轮与第二多线切割轮间形成第一条切割线锯；
经过一次环绕后从导线轮线槽切线起始的切割线121依次环绕经过第二多线切割轮113，第一多线切割轮112，由第一多线切割轮112环绕后，形成与第一次环绕中第一多线切割轮112与第二多线切割轮113的第一条切割线锯平行的第二条切割线锯，即在第一多线切割轮112与第二多线切割轮113之间形成了多线线锯1121；
切割线121经由张紧轮123绕至单线切割轮114，到达所述单线切割轮114上假设的截断点，即在实际绕线中实现了所述首尾相接的环形绕线方式。
在一些示例中，所述切割线121与切割轮在切割槽上的接触均为劣弧(角度小于180°的弧)，切割线121在切割轮间处于张紧状态，绕线位置为在所述单线切割轮或多线切割轮、张紧轮以及导线轮构成的凸边形的外缘。
在本申请的某些实施例中，所述线切割装置中一个切割架111上的环形绕线经过的导线轮122可设置为多个。
在本申请的某些实施例中，所述线切割装置中一个切割架111上的环形绕线经过的张紧轮123可设置为多个。
在本申请的某些实施例中，所述环形绕线方式经过第一多线切割轮112与第二多线切割轮113可为大于二次的多次，形成相互平行的切割线锯，在切割架一次升降切割中可截取得多片硅片样片。
在本申请的一些实施方式中，所述环形绕线方式形成的绕线系统中还包括驱动电机(图中未予以显示)，设置于第一多线切割轮112或第二多线切割轮113邻位，在本实施例中，所述驱动电机为所述绕线系统中运行切割线的动力源，所述驱动电机直接驱动第一多线切割轮112或第二多线切割轮113，用于驱动旋转以运行绕于第一多线切割轮112、第二多线切割轮113及单线切割轮114之间的切割线121。
所述张力检测机构包括设置于所述切割架上的张紧轮123，用于检测并调整所述第一多线切割轮112、第二多线切割轮113、以及单线切割轮114之间切割线121的张力。在线切割加工中，切割线121张力大小影响切割中的成品率和加工精度，所述张力检测机构进行张力检测并调整使切割线的张力达到设定的一定阈值并在切割中保持一恒定值或以恒定值为数值中心所允许的一定范围。
所述张紧轮123用于调整切割线121的张力，可以减少切割线121的断线概率，减少耗材。在切割作业中，切割线121的作用举足轻重，但即便最好的切割线121，其延伸度及耐磨 度也是有限度的，也就是说切割线121在往复运动中会逐渐变细，直至最终被拉断。因此，现在的线切割设备一般都会设计切割线121张力补偿机构，用于弥补切割线121往返行走中的延伸度，采用张紧轮123即是一种实施手段。
在申请的一些实施例中，所述张力检测机构至少包括：张紧轮，张力传感器，伺服电机以及丝杆。其中，所述张紧轮设置于所述单线切割轮与第一多线切割轮之间，用于牵引所述单线切割轮与第一多线切割轮之间的刚线或金刚线；所述张力传感器设置于所述张紧轮上，不断感测所述张紧轮上金刚线的张力值，并于该张力值小于预设值时发出驱动信号；所述伺服电机电性连接所述张力传感器，用于接收到所述张力传感器发出的驱动信号后开始工作；所述丝杆一端连接所述张紧轮，另一端连接所述伺服电机，并于伺服电机工作时牵引所述张紧轮进行单向位移，以调整所述钢线或金刚线的张力。
本申请的线切割装置的进一步改进在于，张力调整机构还包括一滑轨，所述滑轨设置于所述伺服电机与张紧轮之间，用以当所述丝杆牵引所述张紧轮时，使所述张紧轮于所述滑轨上滑行。所述伺服电机具有一转轴，所述丝杆轴接于所述伺服电机的转轴上；当所述张力传感器第一次感测钢线或金刚线张力的时候，所述张力传感器感测的预设值为张力初始值，于切割作业过程中，所述张力传感器感测的张力值为当前的张力值，所述张力传感器感测的预设值为上一时刻的张力值。
本申请的线切割装置进一步改进还在于，还包括锁紧装置，所述锁紧装置设置在所述升降机构上，用于在所述切割架在不同切割状态之间转换完成后对切割状态的定格。所述切割架的悬臂自由度大于0，在切割过程中切割线与待切割硅棒的接触受力可能使切割架产生旋转，采用锁紧装置即是一种实施手段，使所述切割架在旋转部的驱动电机带动旋转后到达所预设的切割状态的位置后停止转动并处于锁紧状态。
在本申请实施例的一实现方式中，所述锁紧装置包括转动锁紧气缸，转动锁紧气缸在切割架进行切割状态转换的旋转过程中处于放松状态，达到在所述切割架达到预设切割状态后进入制动状态。
本申请的进一步改进在于，所述锁紧装置中还包括定位装置，在切割状态的转换中，所述切割架的旋转为驱动电机带动的被动旋转，由电机控制切割架的旋转状态，在具体实施切割架自身具有的转动惯量在电机停止运行后可维持切割架继续旋转，由转动惯量带动的旋转运动的旋转角速度与持续时间难以人为操控，则会影响对切割架停止运转后所处的空间位置的定位。所述定位装置设置在所述升降机构上，包括一个自动检测线的固定模块，定位夹具组件，当旋转架旋转至第一切割状态位置或第二切割状态位置时，自动检测线的固定模块检测到切割架中有零件放置于定位夹具组件后，转动锁紧气缸的气缸伸出，推动定位夹具组件 夹紧切割架使切割架与升降机构相对运动的自由度为0。
如图7所示，所述切割架111的第一悬臂1112延长线与第二悬臂1113延长线呈45°夹角，所述第二悬臂1113延长线与第三悬臂1114延长线呈45°夹角，所述切割架111的悬臂结构以第二悬臂1113中心线为对称线，呈近似对称状。所述多线线锯1121的延长线与所述单线线锯1141的延长线之间呈90°夹角，所述切割架111绕旋转中心旋转以进行不同切割状态的转换时，第一切割状态至第二切割状态之间的相互转换可通过绕旋转轴90°的旋转以实现，从中间状态至第一切割状态或第二切割状态的转换可通过绕旋转轴的±45°旋转以实现。
所述第一切割状态为切割架111旋转至第一多线切割轮112下缘所在水平面与第二多线切割轮113下缘所在水平面为同一水平面的状态，且该共有的水平面位于所述第一切割状态下的切割架111结构的下方，绕于所述第一多线切割轮112及第二多线切割轮113之间的切割线段形成多线线锯1121，所述多线线锯1121呈水平的平行线。即所述第一切割状态为在一次切割动作中可截取得硅片样片的取片作业状态，特别的，对不同实施例中的线切割装置，所述第一切割状态均为线切割装置的取片作业状态。
请参阅图8，显示为本申请的线切割装置在一实施例中第二切割状态下的侧视图，所述第二切割状态为切割架111旋转至第二多线切割轮113下缘所在水平面与单线切割轮114下缘所在水平面为同一水平面的状态，且该共有的水平面位于所述第一切割状态下的切割架111结构的下方，绕于所述第二多线切割轮113及单线切割轮114之间的切割线段形成水平的单线线锯。即所述第二切割状态为在一次切割动作中可进行硅棒截断的状态，特别地，对不同实施例中的线切割装置，所述第二切割状态均为线切割装置的硅棒截断状态。
请参阅图9，显示为本申请的线切割装置在一实施例中的中间状态侧视图，所述中间状态为切割架111在锁紧装置处于放松状态即所述切割架111与定位夹具组件分离时收切割架111重力作用的自然静止状态，此时第一多线切割轮112与第二多线切割轮113之间的多线线锯、第二多线切割轮113与单线切割轮114之间的单线线锯均与水平线呈一定夹角，切割架111近似呈一空间直立放置的T型结构，即使得切割架111的旋转中心所在水平面之下的部分重心最低的状态。
所述线切割装置对待切割硅棒进行切割的具体实现过程中，在完成对待切割硅棒的运送与上料后，由切割系统对放置在硅棒承载装置上的待切割硅棒进行切割。根据所述待切割硅棒的特性如需截除的首部或尾部杂质层长度调整硅棒在承载装置上的位置或机架在所述线切割装置底座上的水平位置，确定切割架在第一维度方向的位置后由机架升降机构上的行进电机驱动升降机构在升降方向的位移，配合切割线环形绕线的驱动电机驱动运行切割线，即可 进行切割操作。
在本申请的线切割装置对承载装置上的硅棒进行一次完整切割的过程中，所述过程包括以下切割状态：调整硅棒在承载装置的位置后进行夹紧，使硅棒保持静止，调整机架在第一维度方向的位置，使切割线线锯位于需截取的首部与符合加工规格的部位交接段上方，电机驱动切割架从自然静止的中间状态旋转一定角度(图示实施例中为45°)至多线线锯切割的第一切割状态并由转动锁紧气缸将切割架锁紧，升降机构下降带动线锯移动至接触硅棒并继续进行切割，即在截除首部时截取得硅片样片；截取样片完成后升降机构上升远离硅棒，依据预设的硅棒截段长度由水平导轨上的行进电机调整机架在第一维度方向的位置，由切割架旋转轴轴接的电机驱动切割架旋转一定角度(图示实施例中为90°)至单线切割的第二切割状态，并由转动锁紧气缸将切割架锁紧，升降机构带动切割线锯下降进行切割获得硅棒截段；重复上一步骤所述操作至硅棒尾部，即切割架完成对整根硅棒的切割操作。在切割架完成切割作业后，所述锁紧气缸处于放松状态，所述切割架从第二切割状态旋转一定角度(图示实施例中为45°)至中间状态。
请参阅图10，在本申请的线切割装置的另一些实施例中，所述第切割架111的第一悬臂1112、第二悬臂1113与第三悬臂1114之间所呈的夹角可以改变，所述第一多切割轮112、第二多切割轮113及单线切割轮114分别固定在所述第一悬臂1112、第二悬臂1113及第三悬臂1114上。所述第一多切割轮112与第二多切割轮113之间的多线线锯的延长线与所述第二多切割轮113与单线切割轮114之间的单线线锯的延长线之间呈60°夹角。所述切割架111绕旋转中心旋转以进行不同切割状态的转换时，第一切割状态至第二切割状态之间的相互转换可通过绕旋转轴120°的旋转以实现，从中间状态至第一切割状态或第二切割状态的转换可通过绕旋转轴的±60°旋转以实现。
在本申请的某些实施例中，所述线切割装置中一个切割架上的环形绕线绕过的张紧轮可设置为多个。
在本申请的某些实施例中，所述环形绕线方式经过第一多线切割轮与第二多线切割轮可为大于二次的多次，形成相互平行的切割线锯，在切割架一次升降切割中可截取得多片硅片样片。
在实际生产工艺中，硅棒通常不是等径的圆柱体，而是一头大一头小或者其他类型，所述承载装置的承载面设置是水平的，则待切割硅棒的轴心可能不是水平的，此时升降机构垂直升降运动进行切割所得的切割截面与所切割的硅棒轴心不相垂直即所得切割面为斜面，则所得硅棒截段不符合加工要求。本申请的线切割装置的进一步改进在于，还包括水平检测装置(未予以图示)，所述水平检测装置设置于升降机构上，用于检测待切割硅棒的轴心水平度。
在本申请的一些实施例中，进一步地，所述升降机构上的水平检测装置包括第一接触式测量仪和第二接触式测量仪，用于检测待切割硅棒的轴心水平度。第一接触式测量仪用于测量切割工作区的待切割硅棒在第一接触式测量仪对应的测量位置处的水平数据，第二接触式测量仪用于测量切割工作区的待切割硅棒在第二接触式测量仪对应的测量位置处的水平数据。
本申请的线切割装置的进一步改进在于，还包括调平装置(未予以图示)，所述调平装置设置于工作区，用于依据所述水平检测装置的检测结果对放置在切割工作区的待切割硅棒的轴心进行调平。所述调平装置通过水平调心结构，在水平检测装置检测到所述待切割硅棒轴心处于非水平状态时，利用转动驱动机构驱动工件承载装置转动以调整工件的轴心水平度。
在本申请的一个实施例中，调平装置包括：转动支点结构、转动驱动机构以及偏移限位机构。转动支点结构位于用于工作区中承载待切割硅棒的硅棒承载装置的下方，作为硅棒承载装置转动的转动支点。转动驱动机构位于硅棒承载装置的下方，用于驱动硅棒承载装置绕着转动支点结构作转动以调整所述待切割硅棒的轴心水平度。偏移限位机构邻设于转动驱动机构，用于限制硅棒承载装置在绕着转动支点结构作转动(上下偏动)时于水平方向上出现偏移。
在本申请的线切割装置的调平装置进行调平的一个实施例中，所述第一接触式测量仪对应于转动支点结构，用于测量待切割硅棒在转动支点结构处的顶点的第一高度数据(可以是绝对高度也可以是相对于硅棒承载装置的相对高度)。第二接触式测量仪对应于转动驱动机构，用于测量待切割硅棒在转动驱动机构处的顶点的第二高度数据(可以是绝对高度也可以是相对于硅棒承载装置的相对高度)。后续，即可综合第一接触式测量仪所测得的第一高度数据和第一接触式测量仪所测得的第二高度数据而计算得出硅棒承载装置在转动驱动机构处的调整量，并利用转动驱动机构根据所述调整量作动以带动硅棒承载装置绕着转动支点结构作转动，完成水平调心，使得待切割硅棒的轴心调整为水平状态。
可选的，在本申请另一实施例中，本申请的线切割装置的调平装置(未予以图示)，还可设置为通过调整垫块以进行待切割硅棒的水平度调整的水平调心机构。所述调平装置设于工作区的硅棒承载装置上，用于将待切割硅棒的轴心调成水平状态。所述水平调心机构包括：两个调整垫块、水平检测单元，以及驱动电机。
所述两个调整垫块分别设于对应的工作区中的硅棒承载装置的首尾两端，用于承托待切割硅棒。
所述水平检测单元用于检测两个所述调整垫块所承托的待切割的硅棒的水平度。
所述驱动电机与两个所述调整垫块中的至少一者关联，用于控制所关联的至少一个所述调整垫块作升降运动以确保将待切割的硅棒的轴心调成水平状态。
如此，利用工件水平调心机构可将硅棒承载装置所承载的待切割工件的轴心水平度调整为水平状态，并通过切割以获得符合工件规格的单段工件截段。另外，由于采用了工件水平调心机构，能确保待切割工件的轴心为水平状态且使得切割后的各段工件截段的切割断面均与轴心相垂直，符合工件加工要求，提高了工件的切割质量和良品率。
综上所述，本申请公开的硅棒截断设备，在第一方面提供的线切割装置，设计了一种可旋转的切割架，通过在切割架上同时设置单线切割轮与多线切割轮，设计了不同绕线系统以实现单线线锯与多线线锯通过旋转的转化，切割架旋转至不同设定状态可实现多线线锯切割与的单线线锯切割，在对待切割硅棒进行截断作业中可通过调整切割架实现截断与截取样片，以达到根据需要，可在一次升降切割中取得样片，在硅棒加工中进行截断的目的，解决了通过多次切割获得样片效率低下且难以控制样片厚度容易浪费材料的问题；再者，所述切割架设置在机架上的升降机构上，所述机架可沿着机座在第一维度方向移动，可以实现按照加工规格调节切割线锯位置以获得合格加工硅棒截断，解决了工件所需的加工尺寸不一的问题；本申请的线切割装置，在提高了在提高了设备的截断作业效率的同时也提高了产品的合格率，并提高了加工的原料利用率，有效克服了现有技术的种种缺点而具有高度产业价值。
基于上述各示例，本申请在第一方面提供了以下各实施例，在以下说明中，通过序号代表所述各实施例，例如数字1，2，3，4…可分别代表实施例1，实施例2，实施例3，实施例4….，在此，本申请提供了：
1.一种线切割装置，应用于对硅棒进行切割作业的硅棒截断设备，其特征在于，包括：
切割架，可旋转地设置于一升降机构上，包括旋转部，自所述旋转部朝第一方向延伸的第一悬臂，自所述旋转部朝第二方向延伸的第二悬臂，自所述旋转部朝第三方向延伸的第三悬臂；
第一多线切割轮，设置于所述第一悬臂的延伸端，具有至少二线槽；
第二多线切割轮，设置于所述第二悬臂的延伸端，具有至少二线槽，绕于所述第一多线切割轮及第二多线切割轮之间的切割线段形成多线线锯；
单线切割轮，设置于所述第三悬臂的延伸端，绕于所述第二多线切割轮及单线切割轮之间的切割线段形成单线线锯；
其中，对所述硅棒进行截断作业时，所述切割架绕其旋转部转动以实现藉由所述多线线锯进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换。
2.根据实施例1所述的线切割装置，其特征在于，所述多线线锯的延长线与所述单线线锯的延长线之间呈90°夹角；所述切割架于所述升降机构上可实现±45°或90°的旋转。
3.根据实施例1所述的线切割装置，其特征在于，所述多线线锯的延长线与所述单线线锯的 延长线之间呈60°夹角；所述切割架于所述升降机构上可实现±60°或120°的旋转。
4.根据实施例1所述的线切割装置，其特征在于，所述第一切割状态为取片作业状态；所述第二切割状态为截断作业状态。
5.根据实施例1所述的线切割装置，其特征在于，所述切割线以首尾相接的环形绕线方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间。
6.根据实施例5所述的线切割装置，其特征在于，所述第一多线切割轮或第二多线切割轮藉由一驱动电机驱动旋转以运行绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间的切割线。
7.根据实施例5或6所述的线切割装置，其特征在于，所述切割线为至少两根切割线绞合形成的绞线切割线。
8.根据实施例5所述的线切割装置，其特征在于，还包括张力检测机构，包括设置于所述切割架上的张紧轮，用于检测并调整所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间切割线的张力。
9.根据实施例8所述的线切割装置，其特征在于，还包括至少一个导线轮，设置于所述切割架上以实现所述切割线的换向。
10.根据实施例9所述的线切割装置，其特征在于，所述切割线经所述导线轮导向至少两次绕于所述第一多线切割轮及第二多线切割轮，并经所述导线轮导向一次绕于所述单线切割轮。
11.根据实施例1所述的线切割装置，其特征在于，所述切割线通过首端绕于一放线筒及尾端绕于一收线筒，并通过多个导线轮导向的方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间。
12.根据实施例11所述的线切割装置，其特征在于，所述切割线经所述导线轮导向至少两次绕于所述第一多线切割轮及第二多线切割轮，并经所述导线轮导向一次绕于所述单线切割轮。
13.根据实施例11所述的线切割装置，其特征在于，还包括至少一个张力检测机构，包括设置于所述切割架上、所述升降机构或机架上的张紧轮，用于检测并调整所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间切割线的张力。
14.根据实施例11所述的线切割装置，其特征在于，所述线切割装置在所述第一切割状态下，所述单线切割轮与所述切割线不接触；由所述第一切割状态切换至第二切割状态时，所述切割架绕其旋转部转动以使所述单线切割轮压迫所述切割线，直至到所述第二切割状态时，所述切割线绕于所述单线切割轮上以使所述单线切割轮及第二多线切割轮之间的切割线段形成单线线锯。
15.根据实施例1所述的线切割装置，其特征在于，还包括锁紧装置，包括转动锁紧气缸。
16.根据实施例1所述的线切割装置，其特征在于，还包括切割架位移装置，设置在所述升降机构与机座之间，用于沿所述硅棒的轴向直线位移以调节截断所述硅棒的长度。
17.根据实施例1所述的线切割装置，其特征在于，所述升降机构上设置有调平检测装置，用于检测放置在工作区的待切割硅棒的轴心水平度。
18.根据实施例17所述的线切割装置，其特征在于，还包括调平装置，设置在所述工作区，用于依据所述调平检测装置的检测结果对放置在所述工作区的待切割硅棒的轴心进行调平。
本申请在第二方面申请一种硅棒上料装置，用于将放置于储料区的待切割硅棒转移至硅棒截断装置的切割工作区(切割工作台)。现有的硅棒上料技术，常见手段为使用吊装装置，采用吊装装置对待切割硅棒进行运送需要使用非弹性材料构造的夹具对硅棒进行夹持，夹持中夹具材料与硅棒的直接接触可能造成硅棒表面的破坏，常见单根硅棒质量大约为400kg，长度大约为5000mm(例如为5360mm的规格等)或者大约为800mm等不同的规格，吊装过程硅棒重心升高则一旦灭失存在较大的安全隐患，同时吊装装置的运动通常为升降方向和沿一直线的水平方向，机动性较低；另一常见的对硅棒进行上料的现有手段为人工输送，严重影响企业的生产效率。
请参阅图11，显示为本申请在第二方面申请的一种硅棒上料装置的示意图，所述硅棒上料装置包括第一转轴21与至少两摆臂组件25A、25B。
所述第一转轴21由一第一驱动装置23驱动旋转，所述第一转轴21的长度方向设置在硅棒切割工作区17的待切割硅棒16的长度方向，所述第一驱动装置23轴接第一转轴21并设置在所述第一转轴21一端。
在本申请的一实施例中，所述第一驱动装置23包括一驱动电机231，所述驱动电机231的动力输出轴在所述第一转轴21的一端与第一转轴21轴接。
所述摆臂组件少为两个，依据预先设置的间隔分别轴接于所述第一转轴21上，所述至少二摆臂组件25A、25B用以承载所述待切割硅棒16，并在所述第一转轴21的驱动下将所述待切割硅棒16转移至所述切割设备的切割工作区17；各所述摆臂组件25包括轴接于所述第一转轴21的摆臂本体以及设置于所述摆臂本体的承托机构，所述承托机构用于跟随所述摆臂的运动以使其承托部在转移作业时，保持处于承载所述待切割硅棒16的状态并且使得所述待切割硅棒16与所述承托部在转移运作中的相对位置不发生改变，换言之，所述待切割硅棒16与所述承托部在转移运作中的相对位置不发生改变是指转移运作中，所述待切割硅棒16相对于所述承托部处于静止的状态。
在一个示例性的实施例中，所述的至少两个摆臂组件25A、25B例如为依据大约800mm(通常情况下要求的最短长度晶棒)的预设间隔轴接于所述第一转轴21上。
在本申请的一些实施例中，所述承托机构包括一机械手，设置在所述摆臂本体末端，跟随所述摆臂运动。所述摆臂本体与承托机构在第一驱动装置驱动下绕所述第一转轴旋转。所述机械手在跟随所述摆臂的运动中使所述承托部在机械手的作用下产生相对于所述摆臂本体的旋转，即所述承托部相对于承托部外接圆圆心的旋转由所述第一驱动装置驱动的旋转与相对所述摆臂本体的旋转共同决定。
在本申请的一实施中，在所述硅棒上料装置将所述待切割硅棒从储料区运送至切割区的过程中，所述机械手跟随摆所述臂的运动使得所述承托部产生相对所述摆臂本体旋转的角速度与所述摆臂绕第一转轴旋转的角速度保持大小相等，方向相反，所述承托部相对于其外接圆圆心旋转的角速度保持为0，所述承托部与在承托部上的待切割硅棒之间不发生相对移动。
在本申请的一些实施例中，所述硅棒上料装置的机座上设置有与所述摆臂组件一一对应的至少二个转运台，用于分别将所述至少两摆臂组件依据预先设置的间隔分别轴接在所述第一转轴上。在一实现方式中，所述转运台与对应摆臂组件的活动连接将对应摆臂组件相对转运台的运动限制在绕第一转轴旋转的运动形式内，所述摆臂组件随着对应转运台的位移而产生相应位移。所述第一转轴贯穿于所述每一摆臂组件并在第一驱动装置驱动第一转轴旋转时同时使得通过转运台轴接于转轴上的每一摆臂组件产生绕第一转轴的旋转。
请参阅图12，显示为本申请硅棒上料装置在图11中b处放大示意图，如图所示，所述摆臂本体251由第一转轴21进行驱动，在第一转轴21的动力输出轴即所述第一驱动装置的电机轴带动下，所述摆臂本体251可实现绕第一转轴21的旋转。所述摆臂本体251远离所述第一转轴21的一端(末端)固定连接所述承托机构252，在所述第一转轴21带动所述摆臂本体251在第一转轴21轴线的法平面旋转运动时带动所述承托机构252整体在空间位置发生变化，使得承托机构252整体在储料区与切割区之间呈摇摆方向的运动。
在本申请的一实施例中，所述每一转运台27具有在所述储料区域与所述切割工作区之间直线位移的第一运动机构，包括转运台27在前侧及后侧的两个面上设置的水平方向导轨271，所述转运台27通过在第二维度方向的所述水平方向导轨271活动连接于一设置有相应的第二维度方向导槽(图中未显示)的承载台28，所述承载台28上设置有第二运动机构以实现转运台27相对所述承载台28在第二维度方向的直线位移。
在本申请的一些实施例中，所述转运台27内部或外部设置有驱动机构，用于驱动转运台27在所述机座的水平导轨271上移动。在一个实施例中，所述转运台27驱动机构包括：沿所述水平导轨设置且与所述转运台27连接的行进丝杠(图中未显示)，与所述行进丝杠连接 的行进电机(图中未显示)。利用所述行进电机，驱动所述转运台27沿着导轨271行进，所述转运台27上的行进电机与铺设于导轨上的所述行进丝杠连接，实现所述转运台27在导轨上沿第二维度方向即储料区与切割区之间的最短距离方向的位移。
在本申请的另一实施例中，所述转运台在所述储料区域与所述切割工作区之间直线位移的第一运动机构可以采用行进电机与滚珠丝杠副配合的形式，所述滚珠丝杠副包括滚珠丝杠及与滚珠丝杠相适配的丝杠螺母，所述丝杠螺母与所述转运台相连，所述行进电机带动所述滚珠丝杠旋转，从而通过所述丝杠螺母带动所述转运台沿所述承载台上设置的导槽做直线运动。
在本申请的一些实施例中，所述硅棒上料装置中设置有令至少一摆臂组件25在所述第一转轴21上直线位移(即在第一维度方向的位移)的第二运动机构。在本实施例的一实现方式中，所述承载台28底部还包括一第一维度方向的导轨组件，通过承载台28的底部导槽(图中未显示)与设置于机座15上设置的第一维度方向的导轨活动连接。所述第二运动机构为所述承载台28的导轨组件，包括设置在承载台28内部或外部的驱动机构，用于驱动所述承载台28在所述机座的第一维度方向导轨上移动。所述承载台28驱动机构包括：沿所述承载台28底部导轨设置且与所述承载台28连接的行进丝杠(图中未显示)，与所述行进丝杠连接的行进电机(图中未显示)。利用所述行进电机，驱动所述承载台28沿着机座导轨行进，所述承载台28上的行进电机与铺设于机座导轨上的所述行进丝杠连接，实现所述承载台28在机座导轨上沿第一维度方向即平行于第一转轴21直线方向的位移。
在本申请的另一实施方式中，令至少一摆臂组件在所述第一转轴上直线位移的第二运动机构可以采用行进电机与滚珠丝杠副配合的形式，所述滚珠丝杠副包括滚珠丝杠及与滚珠丝杠相适配的丝杠螺母，所述丝杠螺母与所述承载台相连，所述行进电机带动所述滚珠丝杠旋转，从而通过所述丝杠螺母带动所述承载台沿做机座上设置的导槽做直线运动。
实际生产工艺中，硅棒通常不是等径的圆柱体，而是一头大一头小或者其他类型，不同硅棒的重心在硅棒长度方向上的位置由硅棒的具体形态决定，在硅棒转移中需要满足不同承托机构对硅棒的支持产生的力矩与重力力矩相互平衡以确保硅棒在转移中不发生轴向的掉落。在本申请的一些实施例中，所述至少二转运台对应的承载台至少有一承载台设置了底部导轨组件即第二运动机构以带动实现承载台上的转运台在第一转轴直线方向的位移，所述可沿着第一转轴直线方向运动的承载台数量也可以大于一。所述设置有第二运动机构的承载台带动对应转运台及摆臂组件在第一转轴直线方向的运动以实现摆臂组件在第一转轴上的位置调整，即实现承托机构相对硅棒在硅棒长度方向上的调整，进而实现承托机构位置相对硅棒重心位置的调整。
诚如前述，在硅棒加工中常见的硅棒长度为大约800mm至5000mm，常见硅棒质量大约为400kg或更重，在硅棒转移中由两个硅棒承托机构保证硅棒的平衡，通常硅棒转移中的两个承托点或面位于硅棒两端，与两端承托处接触的硅棒表面承受的压力较大可能破坏硅棒结构的完整，请参阅图11显示的本申请的硅棒上料装置的侧视图，在图示实施例中，所述摆臂组件数量为间隔设置的四个，包括位于所述第一转轴两端的第一摆臂组件25A与第二摆臂组件25B，及依据预设的间隔分别轴接于所述第一转轴21两端之间的第三摆臂组件25C与第四摆臂组件25D。在硅棒转移中每一承托机构252与硅棒接触面处的压强小于常见技术中两个承托机构252或夹具运送中接触面压强。
在本申请的一些实施例中，所述第三摆臂组件25C或第四摆臂组件25D的转运台对应的承载台设置了第二运动机构以实现带动承载台上的转运台在第一转轴21直线方向的位移，用于根据所述待切割硅棒的重心位置调节承载位置。在本实施例的一实现方式中，所述第二运动机构可设置为带有驱动电机的导轨组件。
在本申请的一些实施例中，如图13所示，显示为图11中c处的放大示意图，所述硅棒上料装置还包括有一第二转轴22，所述第二转轴22由一第二驱动装置24驱动，与第一转轴21平行设置地贯穿所述第一、第二、第三及第四摆臂组件，轴接于所述摆臂组件25之上，并且位于所述摆臂本体251的第一转轴21与所述承托机构252之间，所述第二驱动装置24设置在第二转轴22一端。
本申请的进一步改进在于，所述第一驱动装置与第二驱动装置分别设置在第一转轴或第二转轴在长度方向的两端，分别位于所述第一转轴与第一摆臂组件轴接处、第二转轴与第二摆臂组件轴接处的转轴末端，在长度方向上实现所述摆臂组件机械布局的质量均衡，在空间布局上实现所述摆臂组件结构空间利用率提高而相应减少所述摆臂组件体积。
在本申请的一些实施中，所述摆臂本体包含一内置空间，即所述摆臂本体设置为具有容纳空间的结构，用于存容所述第一转轴、第二转轴与所述摆臂本体轴接的轴接组件。
在本申请的一些实施例中，所述摆臂组件的承托机构包括一主动齿轮、一被动齿轮与一机械手组件，所述机械手组件包括机械手本体与承托件。
请参阅图14，显示为本申请的硅棒上料装置的摆臂本体251及承托机构252的剖视图，所述摆臂本体251的内置空间中设置有相互啮合的齿轮，从摆臂端至末端方向分别为一主动齿轮2522，一被动齿轮2523，所述每一摆臂组件25的主动齿轮2522轴接与第二转轴22，在第二转轴22的驱动下转动；所述被动齿轮2523与主动齿轮2522啮合，同时所述承托件25212的齿部252121与所述被动齿轮2523啮合。
如图14所示，所述机械手本体25211固定设置在所述摆臂结构的摆臂本体251末端，为 一在长度方向呈圆弧弯曲的U型、C型、或月牙型的钢结构(图中未予以显示)，弧长方向对称轴与摆臂结构的对称轴共轴设置。
所述承托件25212活动设置于所述机械手本体25211上，用于承载所述待切割硅棒16，包括与所述被动齿轮2523相啮合的齿部252121与轮廓可顺应容纳所述待切割硅棒16的承托部252122。所述齿部252121为弧形的齿条结构，活动设置在机械手本体25211上，所述齿条的弧形顺应机械手本体25211的弧形镶嵌的设置在所述机械手本体25211的U型、C型、或月牙型的腔内部。所述承托部252122固定设置在齿部252121上，跟随齿部252121运动。
在本申请的一实施例中，所述机械手本体25211的U型、C型、或月牙型钢结构为存在缺口的U型、C型、或月牙型结构，如图所示，所述缺口设置在圆弧周长的对称轴处，使得所述承托机构252的被动齿轮2523与所述承托件25212的齿部252121在中部缺口处相啮合。
在本申请的一实施例中，所述机械手组件2521的承托部252122轮廓上设置有平行设置的一列圆柱滚珠，所述圆柱滚珠在硅棒转移中与待切割硅棒16表面直接接触，所述圆柱滚珠沿的公切线形成的圆弧半径略大于硅棒常见半径范围，用于在承载硅棒时确保所述承托机构252实现所承载硅棒的可放置在其内圆槽内，并使得两者的弧面相近而限制承载时硅棒发生滚动等位移。
在本申请的一实施例中，所述第二驱动装置可设置为一驱动电机，电机轴与所述第二转轴22轴接带动第二转轴22的旋转，实现轴接于所述第二转轴22上的主动齿轮2522的旋转。所述摆臂主体内置空间中的主动齿轮2522在第二转轴22的带动下以所述第二驱动转轴的转速及方向旋转。在所述主动齿轮2522的带动下与其啮合的被动齿轮2523产生相对于主动齿轮2522旋转方向相反的旋转，所述被动齿轮2523旋转的角速度大小由主动齿轮2522与被动齿轮2523的齿数关系及主动齿轮2522的转速大小决定；进一步地，与所述被动齿轮2523啮合的齿部252121产生相对于被动齿轮2523旋转方向相反的旋转，所述齿部252121旋转的角速度大小由齿部252121所在圆弧的半径与所述被动轮的半径之间的大小关系及被动轮的转速大小共同决定。即所述齿部252121的旋转角速度由所述第二驱动装置的电机转速(为可变值)和所述主动齿轮2522、被动齿轮2523及齿条的齿数或半径关系决定(为固定值)，即所述承托件25212相对机械手本体25211的旋转角速度由第二驱动装置输出的转速决定，旋转方向与所述第二驱动装置输出的旋转方向相同。
本申请的进一步改进在于，所述第二驱动装置与第一驱动机构对应的驱动电机之间转矩可存在协同关系。如图14至图16所示的摆臂组件在硅棒转移中由第一驱动装置的驱动下绕所述第一转轴21转动的不同状态，在所述硅棒上料装置进行硅棒转移的过程中，当所述承托机构252的承托部252122处于承载状态时，所述摆臂组件25藉由绕第一转轴21的转动带 动，所转轴的旋转带动摆臂本体251在第一转轴21的法平面内的角位移，所述摆臂本体251的旋转角速度由第一驱动装置决定。所述摆臂本体251及其末端的机械手组件2521跟随摆臂本体251以第一转轴21为旋转中心、第一转轴21旋转的角速度为转速进行旋转运动。
特别的，所述第二驱动装置在承载状态中驱动所述第二转轴22在与第一转轴21转向相反的方向旋转，以实现所述承托件25212绕齿条圆弧所在圆心的旋转，所述承托件25212同时进行以第一转轴21为圆心的旋转定义为第一旋转运动，齿条圆弧所在圆心的旋转定义为第二旋转运动，所述第二旋转运动即为所述承托件25212跟随摆臂本体251进行的由第一转轴21控制的第一旋转运动与由第二转轴22控制的相对于机械手本体25211的旋转运动的合成。
所述第一驱动装置与第二驱动装置的协同关系即转速大小与方向的关系，所述第一驱动装置与第二驱动装置分别控制所述承托部252122的两个旋转运动，使得所述承托件25212第二旋转的角速度为0，所述处于转移状态的待切割硅棒16随承托件25212的运动在储料区至切割区间位移，并保持与承托部252122的相对位置不发生改变。
在本申请的另一实施例中，所述第一驱动装置与第二驱动装置可以相互独立工作，分别控制所述第一旋转运动与齿条相对所述机械手本体的旋转运动，以共同控制承托部空间位置改变及第二旋转运动转过的角度。在对位于储料区的待切割硅棒进行转移前，所述机械手组件在第一转轴的驱动下摆动至所述承托部与硅棒处于同一水平高度，所述承托部在摆动中仅存在第一旋转运动；所述运转台导轨组件驱动运转台与设置在其上的摆臂组件和机械手组件在水平面上沿所述待切割硅棒的垂线方向进给，直至所述承托部与待切割硅棒接触；所述承托部接触到待切割硅棒后由第二转轴驱动承托件进行相对机械手本体的转动，使所述承托部位于待切割硅棒正下方，承托部与所述待切割硅棒的接触位置位于承托部弧形的对称轴线及邻位区域，继而进行由第一驱动装置与第二驱动装置以协同关系运行的硅棒转移过程。进一步的，在所述硅棒转移过程中，所述转运台导轨的行进电机、所述承载台导轨的行进电机分别驱动所述摆臂组件及设置于摆臂组件上的机械手在第二维度方向、第一维度方向的直线运动。所述承载台沿机座导槽在第一维度方向的直线运动、所述转运台相对承载台进行的第二维度方向的直线运动与所述第一驱动装置或第二驱动装置装置驱动的旋转运动相互独立。
本申请的进一步改进在于，所述承托部252122齿部252121的齿数大于所述被动齿轮2523的齿数，所述被动齿轮2523的齿数大于所述主动齿轮2522的齿数，在由第二驱动装置及所述主动齿轮2522、被动齿轮2523及齿部252121的齿数或半径关系共同决定的第二旋转运动中，遵循齿轮外部啮合的基本原理所述主动齿轮2522的角速度、所述被动齿轮2523角速度、所述齿部252121角速度的大小关系为依次减小，实现在第二旋转运动中对所述承托件25212的精确控制。
在本申请的一实施例中，所述承托部252122与所述待切割硅棒的接触面具有缓冲材料。在本实施例的一些实现方式中，所述承托部252122与待切割硅棒的接触面的采用具有弹性的橡胶材料制成，或者硅胶或由其他具有弹性形变、阻尼特性或缓冲特性的材料制成，以保护与其接触的所述待切割硅棒的表面不被划伤或磕碰。
请参阅图17，显示为另一实施例中摆臂本体251及承托机构252的剖视图，所述承托机构252包括一设置于所述摆臂本体251内置空间的主动齿轮2522和设置于摆臂本体251末端的机械手组件2521。所述主动齿轮2522与所述第二转轴轴接，在第二转轴的带动下跟随第二转轴转动。所述机械手组件2521包括机械手本体25211和承托件25212，所述机械手本体25211固定设置在摆臂本体251末端，包括一在长度方向呈圆弧弯曲的槽结构。
所述承托件25212活动设置在所述机械手本体25211上，用于承载所述待切割硅棒，包括与所述被动主动齿轮2522相啮合的齿部252121与轮廓可顺应容纳所述待切割硅棒的承托部252122。所述齿部252121为弧形的齿条结构，活动设置在机械手本体25211上，所述齿条的弧形顺应机械手本体25211的结构槽的弧形镶嵌的设置在所述机械手本体25211上。所述齿部252121与所述摆臂本体251内置空间的主动齿轮2522啮合，在第二转轴的转动下藉由内置空间的主动齿轮2522带动所述承托件25212相对机械手本体25211旋转。所述承托部252122固定设置在齿部252121上，跟随齿部252121运动。
所述承托件25212跟随所述机械手本体25211在第一驱动装置驱动下绕所述第一转轴旋转，同时在所述第二驱动装置的驱动下相对所述机械手本体25211旋转。在本实施例的一实现方式中，所述第二驱动装置包括一驱动电机，在所述第二转轴的一端与所述第二转轴轴接。所述第二驱动装置驱动第二转轴转动，进而带动所述摆臂结构内置空间的主动齿轮2522与第二转轴以相同角速度转动，所述齿部252121在与其啮合的主动齿轮2522的带动下以一定角速度相对于机械手本体25211转动。所述承托件25212绕第一转轴21旋转的转速由第一驱动装置决定，所述承托件25212相对机械手本体25211的转动由第二驱动装置及所述齿部252121与内置空间的主动齿轮2522的半径比决定，所述第一驱动装置与第二驱动装置分别独立控制所述承托件25212的两个旋转运动。
在本申请的一实施例中，所述第一驱动装置与所述第二驱动装置在一定的协同关系下驱动所述第一转轴与第二转轴旋转，所述承托部252122相对其外接圆圆心的旋转速度由承托部252122绕第一转轴的旋转和相对机械手本体25211的旋转的矢量和。如图17至图19所示的摆臂组件在承载状态下绕第一转轴旋转至不同角度的示意图，所述协同关系下运行的第一驱动装置23与第二驱动装置24对所述承托件25212相对其外接圆圆心的角度改变相互补偿，以实现所述承托部252122相对于以承托部252122的外接圆圆心为旋转中心的旋转运动的角 速度始终为0。所述第一驱动装置与第二驱动装置在转移作业中以所述协同关系驱动，实现所述承托件25212在处于承载状态的转移过程中与所承载的待切割硅棒不发生相对转动。
在本申请的另一实施例中，所述齿部252121的齿数大于所述摆臂本体251内置空间的主动齿轮2522的齿数，由第二驱动装置控制的角速度传动从所述第二转轴至所述齿部252121为减速传动，以实现在所述承托件25212相对机械手本体25211的旋转中对所述承托件25212的精确控制。
在本申请的另一实施例中，所述摆臂组件的承托机构包括机械手组件，所述机械手组件设置于所述摆臂本体的末端。所述机械手组件包括机械手本体与承托件，所述机械手本体固定设置在所述摆臂本体上跟随摆臂本体运动；所述承托件活动设置在所述机械手本体上，用于承载所述待切割硅棒。所述承托件与所述第二转轴动力连接，在第二转轴转动时带动所述承托件在所述机械手本体转动。
在本实施例的一实现方式中，所述承托件相对于所述机械手的转动由第二驱动装置控制第二转轴转速，藉由第二转轴带动所述承托件以一定转速转动；所述机械手本体跟随所述摆臂本体由第一驱动装置驱动进行绕所述第一转轴旋转。所述第一驱动装置与第二驱动装置可相对独立的分别驱动所述摆臂本体绕第一转轴的旋转与所述承托件相对机械手本体的旋转。
在本申请的另一实施例中，所述第一驱动装置与所述第二驱动装置在一定的协同关系下驱动所述第一转轴与第二转轴旋转。所述承托件跟随所述机械手本体在第一驱动装置驱动下绕所述第一转轴旋转，同时在所述第二驱动装置的驱动下相对所述机械手本体旋转，所述第一驱动装置与所述第二驱动装置以协同关系输出转速，使得所述第一驱动装置与第二驱动装置的运行对所述承托件相对其外接圆圆心的角度改变相互补偿，以实现所述承托部相对于以承托部的外接圆圆心为旋转中心的旋转运动的角速度始终为0。所述第一驱动装置与第二驱动装置在转移作业中以所述协同关系驱动，实现所述承托件在处于承载状态的转移过程中与所承载的待切割硅棒不发生相对转动。
在本申请的硅棒上料装置进行硅棒转移的过程中，在对位于储料区的待切割硅棒进行转移前，所述机械手组件在第一转轴的驱动下跟随所述摆臂本体摆动，至所述承托部与硅棒处于同一水平高度，在摆动过程中所述摆臂组件的旋转运动由第一驱动装置独立驱动；所述运转台导轨组件驱动运转台与设置在其上的摆臂组件和机械手组件在水平面上沿所述待切割硅棒的垂线方向进给，直至所述承托部与待切割硅棒接触；所述承托部接触到待切割硅棒后由第二转轴驱动承托件进行相对机械手本体的转动，使所述承托部位于待切割硅棒正下方，承托部与所述待切割硅棒的接触位置位于承托部弧形的对称轴线及邻位区域，继而进行由第一驱动装置与第二驱动装置以协同关系运行的硅棒转移过程。
进一步的，在所述硅棒转移过程中，所述转运台的导轨的行进电机、所述承载台导轨的行进电机分别驱动所述摆臂组件及设置于摆臂组件上的机械手在第二维度方向、第一维度方向的直线运动。所述承载台沿机座导槽在第一维度方向的直线运动、所述转运台相对承载台进行的第二维度方向的直线运动与所述第一驱动装置或第二驱动装置装置驱动的旋转运动相互独立。
本申请的硅棒上料装置的进一步改进还在于，所述摆臂组件设置有检测装置，用于检测所述承托部与所述待切割硅棒的接触，用于在上料工作中，检测到承托部与所述待切割硅棒的接触，并在机械手承托待切割的硅棒后，令所述第一转轴及第二转轴的驱动电机开始工作，即抬升摆臂执行送件。
在本申请的一些实施例中，所述检测装置包括压力传感器，设置于所述承托部，所述压力传感器包括压力敏感元件与信号处理单元。在对位于储料区的待切割硅棒进行转移前，所述机械手组件在第一转轴的驱动下跟随所述摆臂本体摆动，至所述承托部与硅棒处于同一水平高度，在摆动过程中所述摆臂组件的旋转运动由第一驱动装置独立驱动；所述运转台导轨组件驱动运转台与设置在其上的摆臂组件和机械手组件在水平面上沿所述待切割硅棒的垂线方向进给，直至所述承托部与待切割硅棒接触；所述压力传感器的压力敏感元件接触到所述待切割硅棒，输出接触信号，所述转运台在第二维度方向上执行一短距离的相对所述待切割硅棒后退的操作；在所述承托部与待切割硅棒的分离状态下由第二转轴驱动承托件进行相对机械手本体的转动，使所述承托部位于待切割硅棒正下方，继而所述摆臂组件转动将硅棒抬起，所述承托部在第一驱动装置、第二驱动装置、运转台导轨组件、及承载台导轨组件共同驱动的状态下从储料区至切割区转移所述待切割硅棒。所述硅棒上料装置将待切割硅棒运送至切割区，所述摆臂本体旋转将待切割硅棒放置在切割工作区的承载台面上，令所述第二转轴的驱动电机驱动第二转轴反向转动，驱动所述承托部转动以释放所述待切割硅棒的底部，并令转运台在第二维度方向远离待切割硅棒。
利用所述检测装置，通过对压力高敏感的压力敏感元件或接触式传感器，在对待切割硅棒转移的前在所述承托部靠近待切割硅棒过程至接触即停止，后续旋转至所述待切割硅棒下方进行承托，可防止所述待切割硅棒在承托中稳定被破坏或表面结构被破坏，确保硅棒转移全过程的运送安全。
综上所述：本申请公开的硅棒阶段设备，在第二方面提供的一种硅棒上料装置，通过设置一通过第一驱动装置驱动的摆臂组件结构，实现承载并转移待切割硅棒，并对摆臂组件的承载机构设置相应的运动跟随装置或由第二驱动装置驱动的机械手组件，在所述硅棒上料装置的承托部处于承载状态时，根据机械结构以预设的驱动装置之间的关系同时驱动第一驱动 装置与第二驱动装置，以实现运送中待切割硅棒与承托部不发生相对移动的平稳运送效果；再者，本申请中的摆臂组件可设置在可沿第二维度方向运动的转运台上，同时转运台可活动设置在可沿第一维度方向运动的承载台上，各个运动之间相对独立，使所述硅棒上料装置在运送过冲中有较大的运送范围与灵活性；本申请的硅棒上料装置，在实现自动化上料，增加硅棒运送效率的同时确保了运送的安全性，并提高了运送过程的机动性，有效克服了现有技术的种种缺点而具有高度产业价值。
基于上述各示例，本申请在第二方面提供了以下各实施例，特别的，在本申请提供的实施例中，不同方面所提供的实施例采用的编号组相互独立，例如，本申请第一方面提供的实施例1与第二方面提供的实施例1不是同一实施例，在此，本申请在第二方面提供了以下实施例，在以下说明中，通过序号代表所述各实施例，例如数字1，2，3，4…可分别代表实施例1，实施例2，实施例3，实施例4….，
1.一种硅棒上料装置，用于将放置于一储料区的待切割硅棒转移至一切割设备的切割工作区，其特征在于，包括：
第一转轴，藉由一第一驱动装置驱动旋转；以及
至少二摆臂组件，依据预设间隔分别轴接于所述第一转轴上，所述至少二摆臂组件用以承载所述待切割硅棒，并在所述第一转轴的驱动下将所述待切割硅棒转移至所述切割设备的切割工作区；各所述摆臂组件包括轴接于所述第一转轴的摆臂本体以及设置于所述摆臂本体的承托机构，所述承托机构用于跟随所述摆臂的运动以使其承托部在转移作业时，保持处于承载所述待切割硅棒的状态。
2.根据实施例1所述的硅棒上料装置，其特征在于，所述承托机构包括一机械手，设置于所述摆臂本体的末端，用于跟随所述摆臂的运动以使其承托部在转移作业时保持处于承载所述待切割硅棒的状态。
3.根据实施例1所述的硅棒上料装置，其特征在于，还包括与所述摆臂组件一一对应的至少二转运台，设置在所述切割设备的机座上，用于分别将所述至少二摆臂组件依据预设间隔分别轴接于所述第一转轴上。
4.根据实施例3所述的硅棒上料装置，其特征在于，所述至少二转运台包括在所述储料区与所述切割工作区之间直线位移的第一运动机构。
5.根据实施例3所述的硅棒上料装置，其特征在于，所述至少二转运台包括令至少一摆臂组件在所述第一转轴上直线位移的第二运动机构以调节所述至少二摆臂组件的间隔距离。
6.根据实施例5所述的硅棒上料装置，其特征在于，所述摆臂组件4个，包括分别设置于所述第一转轴的两端的第一摆臂组件与第二摆臂组件，及依据预设间隔分别轴接于所述第一 转轴的两端之间的第三摆臂组件与第四摆臂组件。
7.根据实施例6所述的硅棒上料装置，其特征在于，所述第三摆臂组件或第四摆臂组件的转运台包括在所述第一转轴上直线位移的第二运动机构。
8.根据实施例3所述的硅棒上料装置，其特征在于，还包括由一第二驱动装置驱动的第二转轴，所述第二转轴与所述第一转轴平行，所述第二驱动装置跟随所述第一驱动装置工作状态输出对应的转速或/及转角给所述第二转轴。
9.根据实施例8所述的硅棒上料装置，其特征在于，所述第一驱动装置及所述第二驱动装置分别设置于第一转轴或所述第二转轴的相对两端。
10.根据实施例8所述的硅棒上料装置，其特征在于，所述第二转轴轴接于所述摆臂组件上，并位于所述摆臂本体上的第一转轴与所述承托机构之间。
11.根据实施例10所述的硅棒上料装置，其特征在于，所述承托机构包括：机械手组件，设置于所述摆臂本体的末端，包括：机械手本体，以及活动设置于所述机械手本体上用于承载所述待切割硅棒的承托件，所述承托件动力连接所述第二转轴，并在第二转轴转动时带动所述承托件在所述机械手本体转动，以使所述承托件在转移作业时保持处于承载所述待切割硅棒的状态。
12.根据实施例10所述的硅棒上料装置，其特征在于，所述摆臂本体具有一内置空间。
13.根据实施例12所述的硅棒上料装置，其特征在于，所述承托机构包括：
主动齿轮，设置于所述摆臂本体的内置空间中，并轴接于所述第二转轴，用于在所述第二转轴驱动下转动；
被动齿轮，轴接于所述摆臂本体的内置空间中，并与所述主动齿轮相啮合；
机械手组件，设置于所述摆臂本体的末端，包括机械手本体，以及活动设置于所述机械手本体上用于承载所述待切割硅棒的承托件，所述承托件包括与所述被动齿轮相啮合的齿部，以及用于顺应所述待切割硅棒的外轮廓的承托部。
14.根据实施例13所述的硅棒上料装置，其特征在于，所述承托部齿部的齿数大于所述被动齿轮的齿数，所述被动齿轮的齿数大于所述主动齿轮的齿数。
15.根据实施例13所述的硅棒上料装置，其特征在于，所述承托部与所述待切割硅棒的接触面具有缓冲材料。
16.根据实施例1所述的硅棒上料装置，其特征在于，所述摆臂组件设置有检测装置，用于检测所述承托部与所述待切割硅棒的接触。
本申请的硅棒截断设备在第三方面申请一种硅棒下料装置，所述硅棒下料装置设置于所述切割工作区的出料端，用于夹持并运输截断后符合工件规格的单段硅棒截段，以便于下料。 现有技术中对硅棒截断设备加工后的硅棒截段进行搬运的方式通常为人工搬运或推拉截断台面，影响企业的生产效率；常见的待切割硅棒质量大约为400kg及以上，人工及推拉搬运的方式需要大量人力，安全性与经济性低下。
如图20所示，显示为本申请的硅棒截断设备的硅棒下料装置在一实施例中的结构示意图，所述硅棒下料装置包括：取料臂31与夹持件32。
所述取料臂31呈悬吊状活动设置在所述硅棒截断设备的顶架19上，可沿着所述顶架19平移，所述取料臂31包括有一伸缩机构；所述取料臂31平移运动的轴线设置在切割区内的待切割硅棒轴线的正上方。
所述夹持件32设置在所述取料臂31的底端，用于夹持在切割区进行截断后的符合工件规格的单段硅棒截断。所述取料臂31与所述夹持件32在整体上呈现左右对称或镜像对称的结构。
在本实施例的一实现方式中，所述取料臂31与所述顶架19通过一导轨组件活动连接，所述导轨组件包括：设置在顶架19上的导槽312，固定设置于取料臂31上部的导轨311，设置于所述取料臂31上部的取料臂驱动机构313。所述导轨311与相配合的所述导槽312设置在第一维度方向，使所述取料臂31沿着所述导槽312产生相对硅棒轴向的位移，在实际中根据加工后的硅棒截段的位置调整取料臂31的位置以实现后续对硅棒截段的夹持。
在本申请的一实施例中，所述取料臂驱动机构311包括：沿所述取料臂31上部的导轨311设置且与取料臂31连接的行进丝杠(图中未显示)，与所述行进丝杠连接的行进电机313。利用所述行进电机313，驱动所述取料臂31沿着导轨311行进，所述取料臂31上的行进电机313与铺设于导轨311上的所述行进丝杠连接，实现所述取料臂31在导轨311上沿第一维度方向即沿放置于切割区的硅棒或硅棒截段的轴向运动。
在本申请的另一实施例中，所述取料臂驱动机构可以采用行进电机与滚珠丝杠副配合的形式，所述滚珠丝杠副包括滚珠丝杠及与滚珠丝杠相适配的丝杠螺母，所述丝杠螺母与所述取料臂相连，所述行进电机带动所述滚珠丝杠旋转，从而通过所述丝杠螺母带动所述取料臂沿所述顶架设置的导槽做直线运动。
在本申请的另一实施例中，所述导轨组件还包括限位块(图中未予以显示)，用于限制所述取料臂在顶架上的过度位移。在本实施例的实现方式中，所述限位块可根据所述取料臂的运动需要设置为控制行程式、固定式或可调节式。
请参阅图21，显示为本申请的硅棒下料装置在一实施例中的示意图，其中图21a为所述硅棒下料装置的正视图，图21b为所述硅棒下料装置的后视图。在本申请的一实施例中，所述伸缩机构314可设置为一升降导轨组件，所述升降导轨组件包括：升降导轨3141、与升降 导轨3141相配合的导槽3142及升降导轨驱动机构3143，其中：所述升降导轨3141固定设置在所述夹持件32上部，沿升降方向布置；所述与升降导轨3141相配合的导槽3142结构设置在取料臂31上，沿所述取料臂31的对称轴布置在升降方向；所述升降导轨3141驱动机构可设置为气缸伸缩组件，气缸伸缩组件设置在所述取料臂31与夹持件32之间，两端分别连接取料臂31与夹持件32，通过气缸伸缩组件的升降轴31433的伸缩，带动所述夹持件32在升降方向的运动。
在本申请的一实施例中，所述气缸伸缩组件包括：气缸支座31431、气缸31432、及连接气缸31432的升降轴31433，其中：所述气缸支座31431设置在所述取料臂31上，与所述取料臂31固定连接，呈四边形；所述气缸31432设置于所述气缸支座31431上，气缸支座31431作为气缸31432固定设置的下底板；所述气缸31432包括气缸锥杆(图中未予以显示)，所述气缸锥杆贯穿所述气缸支座31431伸入所述气缸支座31431下方的伸缩空间；所述升降轴31433设置在气缸锥杆下端，包括一可实现伸、缩双向控制的复合阀，所述复合阀也为杆状；在本实施例的一实现方式中，所述气缸锥杆下端通过一联轴器与所述升降轴31433连接；所述升降轴31433下端即自由端与所述夹持件32的升降导轨3141固定连接，如图所示实施例中，所述夹持件32的升降导轨3141末端固定设置有一T型架，所述升降轴31433末端与所述T型架固定相连。
在本申请的一实施例中，由所述气缸31432驱动气缸锥杆带动升降轴31433的伸缩运动，所述夹持件32的升降导轨3141在升降轴31433的推拉作用下沿所述取料臂31的升降导槽3142进行升降运送，藉以实现所述夹持件32整体在升降方向的位移。
请参阅图22，显示为本申请的硅棒下料装置在一实施例中的夹持件的结构示意图，所述夹持件包括第一夹持块321、第二夹持块322及驱动齿轮，其中：所述第一夹持块321包括第一齿条以及与所述第一齿条联动的第一夹持部3212；所述第二夹持块322相对于所述第一夹持块321呈镜像设置，包括第二齿条以及与所述第二齿条联动的第二夹持部3222；所述第一齿条一端固定设置在所述第一夹持部3212上，所述第二齿条一端固定设置在所述第二夹持部3222上；所述驱动齿轮设置在所述夹持件中部的水平构建板35上，所述驱动齿轮连接一电机的动力输出轴，并同时与所述第一齿条、所述第二齿条相啮合，在电机带动下，所述驱动齿轮正向转动时带动所述第一夹持部3212与第二夹持部3222相向运动，即使得所述第一夹持部3212与第二夹持部3222的距离减小，即可执行夹持动作；所述驱动齿轮在电机带动下逆向转动时带动所述第一夹持部3212与第二夹持部3222背向运动，即使得所述第一夹持部3212与第二夹持部3222的距离增加，即可执行释放动作。
在本申请的一实施例中，所述第一夹持部3212及第二夹持部3222底端用于接触硅棒截 段的夹持面设计为弧形，所述夹持面的弧形的半径设计为常见硅棒外径，用于贴紧所述硅棒截断的弧面；所述夹持部的长度设计为常见的据加工规格切割后的硅棒截段长度。
所述水平构建板35下表面设置有两条沿第二维度方向布置的相互平行的导轨351，所述第一夹持部3212与第二夹持部3222通过水平构建板35下表面的导轨351活动设置在所述水平构建板35上。所述第一夹持部3212与第二夹持部3222顶部分别固定设置有第一水平滑块组件3213与第二水平滑块组件3223，所述第一水平滑块组件3213与第二水平滑块组件3223活动设置在所述水平构建板35的导轨上，可沿水平构建板的导轨351滑动。在所述第一齿条、第二齿条的带动下，所述第一水平滑块组件3213、第二水平滑块组件3223分别沿所述水平构建板的导轨运动。所述第一水平滑块组件3213为底部固定设置在所述第一夹持部3212上方的两个滑块，并且两滑块在所述第一夹持部3212上固定位置的连线在第一维度方向上；所述第二水平滑块组件3223为底部固定设置在所述第二夹持部3222上方的两个滑块，并且两滑块在所述第二夹持部3222上固定位置的连线在第一维度方向上。
请参阅图23至图24，显示为所述夹持件驱动装置在不同状态下的结构示意图，视图方向为从所述夹持件的从下至上所观察结构的投影，所述驱动齿轮323设置在所述夹持件的水平构建板35上，轴接一驱动电机的动力输出轴，所述驱动电机324固定设置在所述水平构建板35下表面上。所述第一齿条3211与第二齿条3221分别与所述驱动齿轮323的前侧与后侧啮合，在图示实施例中显示为，所述第一齿条3211与第二齿条3221分别与所述驱动齿轮323的驱动齿轮323的上侧与下侧啮合。在所述驱动齿轮323的带动下，所述第一齿条3211与第二齿条3221分别产生相应的运动，基于齿轮间或齿轮与齿条间外部啮合的基本规律，所述第一齿条3211在驱动齿轮323旋转时，沿与所述驱动齿轮323上侧齿部的线速度的反方向运动；所述第二齿条3221在驱动齿轮323旋转时，沿所述驱动齿轮323下侧齿部的线速度的反方向运动。所述驱动齿轮323旋转时关于齿轮中心对称的齿(如图示实施例中上侧与下侧的齿部)必然满足线速度方向相反的关系，即分别与驱动齿轮323两侧啮合的第一齿条3211与第二齿条3221的运动方向总是相反，表现为相向靠近或相互远离的运动。如图23所示实施例，所述驱动齿轮323处于正转状态，所述第一齿条3211与第二齿条3221相向靠近；如图24所示实施例，所述驱动齿轮323处于反转状态，所述第一齿条3211与第二齿条3221相互远离。
所述驱动齿轮323正转或逆转时，所述第一齿条3211与第二齿条3221产生相应的相向或远离运动，所述第一齿条3211与第二齿条3221的运动分别带动所述第一夹持部与第二夹持部的第一水平滑块组件3213、第二水平滑块组件3223沿着所述水平构建板35底面设置的相互平行的导轨产生相向或远离的滑动，即所述第一夹持部、第二夹持部产生相互靠近或相 互远离的运动。
在本申请的一实施例中，所述硅棒下料装置对加工后的硅棒截段进行夹持的过程如下：
所述硅棒下料装置的取料臂在取料臂上端导轨的行进电机带动下沿顶架上的导槽运动，沿第一维度方向向所述硅棒截断移动，所述硅棒下料装置的夹持部在所述取料臂的带动下沿第一维度方向运动，当所述第一及夹持部运动至位于所需夹持的硅棒截段的正上方时取料臂沿顶架导槽的运动停止。
所述取料臂及夹持件在水平方向的位置固定后，所述夹持件的驱动齿轮在电机带动下反转，另所述第一夹持部与第二夹持部分离至一大于硅棒截段直径的距离，以防止所述夹持部在下降运动中与所述硅棒截段发生触碰。所述伸缩机构如气缸伸缩组件驱动升降轴在升降方向运动，使所述第一及第二夹持部向下运动靠近所述需夹持的硅棒截段，至所述第一夹持部与第二夹持部与所述硅棒截段位于同一水平面上，即停止伸缩运动。所述驱动电机反转的运动与所述伸缩机构的运动相对独立，在实现方式上只需满足第一及第二夹持部运行至所述硅棒截段的水平面上(即第一夹持部、第二夹持部分别位于所述硅棒截段的左右两侧)，并满足运动中夹持件与硅棒截段不发生碰撞即可。
所述驱动齿轮正转以控制所述第一夹持部与所述第二夹持部相互靠近即相互趋近所述硅棒截段，至接触并夹紧所述硅棒截断时所述停止运动。
所述夹持件在夹持了硅棒截段后保持夹紧状态，根据预设的硅棒截段的摆放位置，相应的由伸缩机构驱动所述夹持件升降运动，由顶架与取料臂之间的导轨组件带动取料臂与夹持件整体在第一维度方向运动，至将硅棒截断放置在预设位置后所述第一夹持部与第二夹持部分离释放并随同取料臂与夹持部远离放置好的硅棒截段。
本申请的进一步改进在于，所述硅棒下料装置的第一夹持部与第二夹持部用于夹持所述单段硅棒截段的夹持面上设置有缓冲材料，所述夹持面上可设置采用具有弹性的橡胶材料、聚乙烯泡沫塑料、硅胶或由其他具有弹性形变、阻尼特性或缓冲特性的材料，以保护与其接触的所述硅棒截段的表面不被划伤或磕碰。
本申请的进一步改进在于，所述硅棒下料装置还设置有用于检测所述待切割硅棒的端部(即首部或尾部)位置的传感器件33。
请参阅图25，显示为图21b在d处的放大示意图，所述传感器件33固定设置在连接夹持件32水平构建板与升降导轨之间的承座的镜像称线上。在本实施例的一实现方式中，所述传感器件33为接触式传感器，包括圆环形测量头331、信号线332、伸缩杆333。
所述测量头331活动设置在所述伸缩杆333自由端，可绕测量头331圆环的圆心旋转，所述伸缩杆333固定端设置在所述承座的镜像对称线上。
在检测中所述圆环形测量头331圆环表面即为接触表面，用于测量对应的测量头331与待切割硅棒16接触处的高度数据(可以是绝对高度也可以是相对于硅棒承载装置的相对高度)。特别的，所述圆环形测量头331沿圆环中心旋转时，测量头331最低点的线速度方向在第一维度方向即待切割硅棒16的轴线方向，以避免所述测量头331为检测硅棒端部位置沿所述待切割硅棒16表面运动时产生对圆环形测量头331或待切割硅棒16表面的破坏。
检测过程中所述伸缩杆333控制测量头331下降至刚好接触待切割硅棒16表面，所述接触式传感器跟随取料臂31在第一维度方向相对待切割硅棒16运动，实现测量头331沿着所述待切割硅棒16表面运动，通过实时采集不同位置的高度数据，藉由待切割硅棒16端部存在直径变化，检测出需截除的端部(即首部或尾部)与可加工的硅棒中间段的交界线。
通过传感器件33检测所述待切割硅棒的端部位置，避免了人为判断的不精准使得截除的端部过长造成浪费或截除部位过短使加工后的首尾端硅棒截段不符合工件规格，有效提高了硅棒首尾端邻近的硅棒截段的工件合格率，并提高材料的利用率。
本申请的硅棒截断设置的进一步改进在于，还包括端部取料装置。所述端部取料装置设置在所述切割工作区的至少一端，用于承接所述待切割硅棒端部的切割尾料。在硅棒截断作业中，需要对待切割硅棒截取硅片样片，所述样片厚度通常为2～20mm，即不能通过硅棒下料装置进行运送。
所述端部取料装置包括旋转臂与弧形容槽；所述旋转臂设置在所述硅棒截断设备出料端的相邻切割架上，通过一轴线在升降方向的转轴活动设置在所述出料端相邻切割架的底部。所述弧形容槽固定设置在所述旋转臂的自由端，所述弧形容槽为半开放结构，以使得所述硅片样片可从弧形容槽的侧面放入。
在本申请的一实施例中，所述端部取料装置还包括驱动装置，所述驱动装置具有动力输出轴如电机，用于轴接所述旋转臂转轴，以驱动所述旋转臂在切割架底部绕转轴转动。进一步的，所述端部取料装置还包括旋转臂锁紧装置，用于在所述旋转臂旋转至待切割的硅片样片下时锁紧所述旋转臂。
在硅片样片截取的过程中，所述旋转臂在所述端部取料装置的驱动装置的驱动下旋转，至所述弧形容槽位于待切割的硅片样片下方即停止旋转，由所述旋转臂锁紧装置将旋转臂锁紧。所述出料端相邻的切割架在切割架的驱动电机驱动下旋转至双线切割的第一切割状态，并由升降机构带动切割线锯进给进行切割，在切割完成后截取得位于容槽内的硅片样片，所述旋转臂在动力输出轴的驱动下旋转远离切割架，即承接并取得所述硅片样片。
综上所述，本申请的硅棒截断设备在第三方面提供的硅棒下料装置，通过设置在机架上的取料臂与夹持件，通过气缸伸缩组件活动连接所述取料臂与夹持件，使用驱动装置驱动所 述夹持件的两夹持部在第二维度方向的相向或远离动作，完成对切割后的硅棒截段的夹持与释放；再者，本申请的硅棒下料装置的取料臂通过驱动装置带动可滑移的设置在机架上，配合夹持件的升降运动和夹持部的夹持或释放动作，即可实现将硅棒截段在预设位置之间的运送，有效实现硅棒下料过程的自动化并衔接不同工序，有效提高了企业生产效率，具有高度产业价值。
基于上述各示例，本申请在第三方面提供了以下各实施例，特别的，在本申请提供的实施例中，不同方面所提供的实施例采的编号组相互独立，例如，本申请第三方面提供的实施例1与第一方面提供的实施例1、第二方面提供的实施例1不是同一实施例，在此，本申请在第三方面提供了以下实施例，在以下说明中，通过序号代表所述各实施例，例如数字1，2，3，4…可分别代表实施例1，实施例2，实施例3，实施例4….，
1.一种硅棒截断设备，其特征在于，包括：
硅棒上料装置，设置在一储料区及一切割工作区之间，用于将放置于所述储料区的待切割硅棒转移至所述切割工作区；
线切割装置，包括悬设于所述切割工作区的上侧切割架，所述切割架上设置有单线线锯及多线线锯，用于对放置于所述切割工作区的硅棒进行截断作业时，通过所述切割架的转动以实现藉由所述多线线锯进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换；
硅棒下料装置，设置于所述切割工作区的出料端，用于夹持并运输截断后符合工件规格的单段硅棒截段夹持以便下料。
2.根据实施例1所述的硅棒截断设备，其特征在于，所述硅棒上料装置包括：
第一转轴，藉由一第一驱动装置驱动旋转；以及
至少二摆臂组件，依据预设间隔分别轴接于所述第一转轴上，所述至少二摆臂组件用以承载所述待切割硅棒，并在所述第一转轴的驱动下将所述待切割硅棒转移至所述切割设备的切割工作区；各所述摆臂组件包括轴接于所述第一转轴的摆臂本体以及设置于所述摆臂本体的承托机构，所述承托机构用于跟随所述摆臂的运动以使其承托部在转移作业时，保持处于承载所述待切割硅棒的状态。
3.根据实施例2所述的硅棒截断设备，其特征在于，所述承托机构包括一机械手，设置于所述摆臂本体的末端，用于跟随所述摆臂的运动以使其承托部在转移作业时保持处于承载所述待切割硅棒的状态。
4.根据实施例2所述的硅棒截断设备，其特征在于，还包括与所述摆臂组件一一对应的至少二转运台，设置在所述切割设备的机座上，用于分别将所述至少二摆臂组件依据预设间隔 分别轴接于所述第一转轴上。
5.根据实施例4所述的硅棒截断设备，其特征在于，所述至少二转运台包括在所述储料区与所述切割工作区之间直线位移的第一运动机构。
6.根据实施例4所述的硅棒截断设备，其特征在于，所述至少二转运台包括令至少一摆臂组件在所述第一转轴上直线位移的第二运动机构以调节所述至少二摆臂组件的间隔距离。
7.根据实施例6所述的硅棒截断设备，其特征在于，所述摆臂组件4个，包括分别设置于所述第一转轴的两端的第一摆臂组件与第二摆臂组件，及依据预设间隔分别轴接于所述第一转轴的两端之间的第三摆臂组件与第四摆臂组件。
8.根据实施例7所述的硅棒截断设备，其特征在于，所述第三摆臂组件或第四摆臂组件的转运台包括在所述第一转轴上直线位移的第二运动机构。
9.根据实施例4所述的硅棒截断设备，其特征在于，还包括由一第二驱动装置驱动的第二转轴，所述第二转轴与所述第一转轴平行，所述第二驱动装置跟随所述第一驱动装置工作状态输出对应的转速或/及转角给所述第二转轴。
10.根据实施例9所述的硅棒截断设备，其特征在于，所述第一驱动装置及所述第二驱动装置分别设置于第一转轴或所述第二转轴的相对两端。
11.根据实施例9所述的硅棒截断设备，其特征在于，所述第二转轴轴接于所述摆臂组件上，并位于所述摆臂本体上的第一转轴与所述承托机构之间。
12.根据实施例11所述的硅棒截断设备，其特征在于，所述承托机构包括：机械手组件，设置于所述摆臂本体的末端，包括：机械手本体，以及活动设置于所述机械手本体上用于承载所述待切割硅棒的承托件，所述承托件动力连接所述第二转轴，并在第二转轴转动时带动所述承托件在所述机械手本体转动，以使所述承托件在转移作业时保持处于承载所述待切割硅棒的状态。
13.根据实施例11所述的硅棒截断设备，其特征在于，所述摆臂本体具有一内置空间。
14.根据实施例13所述的硅棒截断设备，其特征在于，所述承托机构包括：
主动齿轮，设置于所述摆臂本体的内置空间中，并轴接于所述第二转轴，用于在所述第二转轴驱动下转动；
被动齿轮，轴接于所述摆臂本体的内置空间中，并与所述主动齿轮相啮合；
机械手组件，设置于所述摆臂本体的末端，包括机械手本体，以及活动设置于所述机械手本体上用于承载所述待切割硅棒的承托件，所述承托件包括与所述被动齿轮相啮合的齿部，以及用于顺应所述待切割硅棒的外轮廓的承托部。
15.根据实施例14所述的硅棒截断设备，其特征在于，所述承托部齿部的齿数大于所述被动 齿轮的齿数，所述被动齿轮的齿数大于所述主动齿轮的齿数。
16.根据实施例14所述的硅棒截断设备，其特征在于，所述承托部与所述待切割硅棒的接触面具有缓冲材料。
17.根据实施例2所述的硅棒截断设备，其特征在于，所述摆臂组件设置有检测装置，用于检测所述承托部与所述待切割硅棒的接触。
18.根据实施例1所述的硅棒截断设备，其特征在于，所述线切割装置包括：
切割架，可旋转地设置于一升降机构上，包括旋转部，自所述旋转部朝第一方向延伸的第一悬臂，自所述旋转部朝第二方向延伸的第二悬臂，自所述旋转部朝第三方向延伸的第三悬臂；
第一多线切割轮，设置于所述第一悬臂的延伸端，具有至少二线槽；
第二多线切割轮，设置于所述第二悬臂的延伸端，具有至少二线槽，绕于所述第一多线切割轮及第二多线切割轮之间的切割线段形成多线线锯；
单线切割轮，设置于所述第三悬臂的延伸端，绕于所述第二多线切割轮及单线切割轮之间的切割线段形成单线线锯；
其中，对所述硅棒进行截断作业时，所述切割架绕其旋转部转动以实现藉由所述多线线锯进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换。
19.根据实施例18所述的硅棒截断设备，其特征在于，所述多线线锯的延长线与所述单线线锯的延长线之间呈90°夹角；所述切割架于所述升降机构上可实现±45°或90°的旋转。20.根据实施例18所述的硅棒截断设备，其特征在于，所述多线线锯的延长线与所述单线线锯的延长线之间呈60°夹角；所述切割架于所述升降机构上可实现±60°或120°的旋转。
21.根据实施例18所述的硅棒截断设备，其特征在于，所述第一切割状态为取片作业状态；所述第二切割状态为截断作业状态。
22.根据实施例18所述的硅棒截断设备，其特征在于，所述切割线以首尾相接的环形绕线方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间。
23.根据实施例22所述的硅棒截断设备，其特征在于，所述第一多线切割轮或第二多线切割轮藉由一驱动电机驱动旋转以运行绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间的切割线。
24.根据实施例22所述的硅棒截断设备，其特征在于，所述切割线为至少两根切割线绞合形成的绞线切割线。
25.根据实施例22所述的硅棒截断设备，其特征在于，还包括张力检测机构，包括设置于所 述切割架上的张紧轮，用于检测并调整所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间切割线的张力。
26.根据实施例25所述的硅棒截断设备，其特征在于，还包括至少一个导线轮，设置于所述切割架上以实现所述切割线的换向。
27.根据实施例26所述的硅棒截断设备，其特征在于，所述切割线经所述导线轮导向至少两次绕于所述第一多线切割轮及第二多线切割轮，并经所述导线轮导向一次绕于所述单线切割轮。
28.根据实施例18所述的硅棒截断设备，其特征在于，所述切割线通过首端绕于一放线筒及尾端绕于一收线筒，并通过多个导线轮导向的方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间。
29.根据实施例28所述的硅棒截断设备，其特征在于，所述切割线经所述导线轮导向至少两次绕于所述第一多线切割轮及第二多线切割轮，并经所述导线轮导向一次绕于所述单线切割轮。
30.根据实施例28所述的硅棒截断设备，其特征在于，还包括至少一个张力检测机构，包括设置于所述切割架上、所述升降机构或机架上的张紧轮，用于检测并调整所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间切割线的张力。
31.根据实施例28所述的硅棒截断设备，其特征在于，所述线切割装置在所述第一切割状态下，所述单线切割轮与所述切割线不接触；由所述第一切割状态切换至第二切割状态时，所述切割架绕其旋转部转动以使所述单线切割轮压迫所述切割线，直至到所述第二切割状态时，所述切割线绕于所述单线切割轮上以使所述单线切割轮及第二多线切割轮之间的切割线段形成单线线锯。
32.根据实施例18所述的硅棒截断设备，其特征在于，还包括锁紧装置，设置在所述升降机构上，用于在所述切割架绕其旋转部转动以实现藉由所述第一切割状态以及第二切割状态的转换完成后对所述切割架进行锁紧。
33.根据实施例18所述的硅棒截断设备，其特征在于，还包括切割架位移装置，设置在所述升降机构与机座之间，用于沿所述硅棒的轴向直线位移以调节截断所述硅棒的长度。
34.根据实施例18所述的硅棒截断设备，其特征在于，所述升降机构上设置有调平检测装置，用于检测放置在工作区的待切割硅棒的轴心水平度。
35.根据实施例34所述的硅棒截断设备，其特征在于，还包括调平装置，设置在所述工作区，用于依据所述调平检测装置的检测结果对放置在所述工作区的待切割硅棒的轴心进行调平。
36.根据实施例1所述的硅棒截断设备，其特征在于，还包括端部取料装置，设置在所述切割工作区的至少一端，还用承接对所述待切割硅棒的端部的切割尾料。
37.根据实施例1所述的硅棒截断设备，其特征在于，所述硅棒下料装置设置有用于检测所述待切割硅棒端部切割位置的传感器件。
38.根据实施例37所述的硅棒截断设备，其特征在于，所述传感器件为接触式传感器。
39.根据实施例1所述的硅棒截断设备，其特征在于，所述硅棒下料装置包括：
取料臂，可平移地悬置在所述硅棒截断设备的顶架上，包括伸缩机构；
夹持件，设置在所述取料臂的底端，用于夹持截断后符合工件规格的单段硅棒截段。
40.根据实施例39所述的硅棒截断设备，其特征在于，所述夹持件包括：
第一夹持块，包括第一齿条以及与所述第一齿条联动的第一夹持部；
第二夹持块，相对于所述第一夹持块镜像设置，包括第二齿条以及与所述第二齿条联动的第二夹持部，
驱动齿轮，连接一电机的动力输出轴，并与所述第一齿条与所述第二齿条相啮合，用于在正向转动时带动所述第一夹持部及第二夹持部相向运动以执行夹持动作，在逆向动时带动所述第一夹持部及第二夹持部背向运动以执行释放动作。
41.根据实施例40所述的硅棒截断设备，其特征在于，所述第一夹持部及第二夹持部用于夹持所述单段硅棒截段的夹持面上设置有缓冲材料。
上述实施例仅例示性说明本申请的原理及其功效，而非用于限制本申请。任何熟悉此技术的人士皆可在不违背本申请的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本申请所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本申请的权利要求所涵盖。

Claims (41)

  1. 一种硅棒截断设备，其特征在于，包括：
    硅棒上料装置，设置在一储料区及一切割工作区之间，用于将放置于所述储料区的待切割硅棒转移至所述切割工作区；
    线切割装置，包括悬设于所述切割工作区的上侧切割架，所述切割架上设置有单线线锯及多线线锯，用于对放置于所述切割工作区的硅棒进行截断作业时，通过所述切割架的转动以实现藉由所述多线线锯进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换；
    硅棒下料装置，设置于所述切割工作区的出料端，用于夹持并运输截断后符合工件规格的单段硅棒截段夹持以便下料。
  2. 根据权利要求1所述的硅棒截断设备，其特征在于，所述硅棒上料装置包括：
    第一转轴，藉由一第一驱动装置驱动旋转；以及
    至少二摆臂组件，依据预设间隔分别轴接于所述第一转轴上，所述至少二摆臂组件用以承载所述待切割硅棒，并在所述第一转轴的驱动下将所述待切割硅棒转移至所述切割设备的切割工作区；各所述摆臂组件包括轴接于所述第一转轴的摆臂本体以及设置于所述摆臂本体的承托机构，所述承托机构用于跟随所述摆臂的运动以使其承托部在转移作业时，保持处于承载所述待切割硅棒的状态。
  3. 根据权利要求2所述的硅棒截断设备，其特征在于，所述承托机构包括一机械手，设置于所述摆臂本体的末端，用于跟随所述摆臂的运动以使其承托部在转移作业时保持处于承载所述待切割硅棒的状态。
  4. 根据权利要求2所述的硅棒截断设备，其特征在于，还包括与所述摆臂组件一一对应的至少二转运台，设置在所述切割设备的机座上，用于分别将所述至少二摆臂组件依据预设间隔分别轴接于所述第一转轴上。
  5. 根据权利要求4所述的硅棒截断设备，其特征在于，所述至少二转运台包括在所述储料区与所述切割工作区之间直线位移的第一运动机构。
  6. 根据权利要求4所述的硅棒截断设备，其特征在于，所述至少二转运台包括令至少一摆臂组件在所述第一转轴上直线位移的第二运动机构以调节所述至少二摆臂组件的间隔距离。
  7. 根据权利要求6所述的硅棒截断设备，其特征在于，所述摆臂组件4个，包括分别设置于所述第一转轴的两端的第一摆臂组件与第二摆臂组件，及依据预设间隔分别轴接于所述第一转轴的两端之间的第三摆臂组件与第四摆臂组件。
  8. 根据权利要求7所述的硅棒截断设备，其特征在于，所述第三摆臂组件或第四摆臂组件的转运台包括在所述第一转轴上直线位移的第二运动机构。
  9. 根据权利要求4所述的硅棒截断设备，其特征在于，还包括由一第二驱动装置驱动的第二转轴，所述第二转轴与所述第一转轴平行，所述第二驱动装置跟随所述第一驱动装置工作状态输出对应的转速或/及转角给所述第二转轴。
  10. 根据权利要求9所述的硅棒截断设备，其特征在于，所述第一驱动装置及所述第二驱动装置分别设置于第一转轴或所述第二转轴的相对两端。
  11. 根据权利要求9所述的硅棒截断设备，其特征在于，所述第二转轴轴接于所述摆臂组件上，并位于所述摆臂本体上的第一转轴与所述承托机构之间。
  12. 根据权利要求11所述的硅棒截断设备，其特征在于，所述承托机构包括：机械手组件，设置于所述摆臂本体的末端，包括：机械手本体，以及活动设置于所述机械手本体上用于承载所述待切割硅棒的承托件，所述承托件动力连接所述第二转轴，并在第二转轴转动时带动所述承托件在所述机械手本体转动，以使所述承托件在转移作业时保持处于承载所述待切割硅棒的状态。
  13. 根据权利要求11所述的硅棒截断设备，其特征在于，所述摆臂本体具有一内置空间。
  14. 根据权利要求13所述的硅棒截断设备，其特征在于，所述承托机构包括：
    主动齿轮，设置于所述摆臂本体的内置空间中，并轴接于所述第二转轴，用于在所述第二转轴驱动下转动；
    被动齿轮，轴接于所述摆臂本体的内置空间中，并与所述主动齿轮相啮合；
    机械手组件，设置于所述摆臂本体的末端，包括机械手本体，以及活动设置于所述机械手本体上用于承载所述待切割硅棒的承托件，所述承托件包括与所述被动齿轮相啮合的 齿部，以及用于顺应所述待切割硅棒的外轮廓的承托部。
  15. 根据权利要求14所述的硅棒截断设备，其特征在于，所述承托部齿部的齿数大于所述被动齿轮的齿数，所述被动齿轮的齿数大于所述主动齿轮的齿数。
  16. 根据权利要求14所述的硅棒截断设备，其特征在于，所述承托部与所述待切割硅棒的接触面具有缓冲材料。
  17. 根据权利要求2所述的硅棒截断设备，其特征在于，所述摆臂组件设置有检测装置，用于检测所述承托部与所述待切割硅棒的接触。
  18. 根据权利要求1所述的硅棒截断设备，其特征在于，所述线切割装置包括：
    切割架，可旋转地设置于一升降机构上，包括旋转部，自所述旋转部朝第一方向延伸的第一悬臂，自所述旋转部朝第二方向延伸的第二悬臂，自所述旋转部朝第三方向延伸的第三悬臂；
    第一多线切割轮，设置于所述第一悬臂的延伸端，具有至少二线槽；
    第二多线切割轮，设置于所述第二悬臂的延伸端，具有至少二线槽，绕于所述第一多线切割轮及第二多线切割轮之间的切割线段形成多线线锯；
    单线切割轮，设置于所述第三悬臂的延伸端，绕于所述第二多线切割轮及单线切割轮之间的切割线段形成单线线锯；
    其中，对所述硅棒进行截断作业时，所述切割架绕其旋转部转动以实现藉由所述多线线锯进行切割的第一切割状态以及藉由所述单线线锯进行切割的第二切割状态的转换。
  19. 根据权利要求18所述的硅棒截断设备，其特征在于，所述多线线锯的延长线与所述单线线锯的延长线之间呈90°夹角；所述切割架于所述升降机构上可实现±45°或90°的旋转。
  20. 根据权利要求18所述的硅棒截断设备，其特征在于，所述多线线锯的延长线与所述单线线锯的延长线之间呈60°夹角；所述切割架于所述升降机构上可实现±60°或120°的旋转。
  21. 根据权利要求18所述的硅棒截断设备，其特征在于，所述第一切割状态为取片作业状态；所述第二切割状态为截断作业状态。
  22. 根据权利要求18所述的硅棒截断设备，其特征在于，所述切割线以首尾相接的环形绕线方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间。
  23. 根据权利要求22所述的硅棒截断设备，其特征在于，所述第一多线切割轮或第二多线切割轮藉由一驱动电机驱动旋转以运行绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间的切割线。
  24. 根据权利要求22所述的硅棒截断设备，其特征在于，所述切割线为至少两根切割线绞合形成的绞线切割线。
  25. 根据权利要求22所述的硅棒截断设备，其特征在于，还包括张力检测机构，包括设置于所述切割架上的张紧轮，用于检测并调整所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间切割线的张力。
  26. 根据权利要求25所述的硅棒截断设备，其特征在于，还包括至少一个导线轮，设置于所述切割架上以实现所述切割线的换向。
  27. 根据权利要求26所述的硅棒截断设备，其特征在于，所述切割线经所述导线轮导向至少两次绕于所述第一多线切割轮及第二多线切割轮，并经所述导线轮导向一次绕于所述单线切割轮。
  28. 根据权利要求18所述的硅棒截断设备，其特征在于，所述切割线通过首端绕于一放线筒及尾端绕于一收线筒，并通过多个导线轮导向的方式绕于所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间。
  29. 根据权利要求28所述的硅棒截断设备，其特征在于，所述切割线经所述导线轮导向至少两次绕于所述第一多线切割轮及第二多线切割轮，并经所述导线轮导向一次绕于所述单线切割轮。
  30. 根据权利要求28所述的硅棒截断设备，其特征在于，还包括至少一个张力检测机构，包括设置于所述切割架上、所述升降机构或机架上的张紧轮，用于检测并调整所述第一多线切割轮、第二多线切割轮、以及单线切割轮之间切割线的张力。
  31. 根据权利要求28所述的硅棒截断设备，其特征在于，所述线切割装置在所述第一切割状态下，所述单线切割轮与所述切割线不接触；由所述第一切割状态切换至第二切割状态时，所述切割架绕其旋转部转动以使所述单线切割轮压迫所述切割线，直至到所述第二切割状态时，所述切割线绕于所述单线切割轮上以使所述单线切割轮及第二多线切割轮之间的切割线段形成单线线锯。
  32. 根据权利要求18所述的硅棒截断设备，其特征在于，还包括锁紧装置，设置在所述升降机构上，用于在所述切割架绕其旋转部转动以实现藉由所述第一切割状态以及第二切割状态的转换完成后对所述切割架进行锁紧。
  33. 根据权利要求18所述的硅棒截断设备，其特征在于，还包括切割架位移装置，设置在所述升降机构与机座之间，用于沿所述硅棒的轴向直线位移以调节截断所述硅棒的长度。
  34. 根据权利要求18所述的硅棒截断设备，其特征在于，所述升降机构上设置有调平检测装置，用于检测放置在工作区的待切割硅棒的轴心水平度。
  35. 根据权利要求34所述的硅棒截断设备，其特征在于，还包括调平装置，设置在所述工作区，用于依据所述调平检测装置的检测结果对放置在所述工作区的待切割硅棒的轴心进行调平。
  36. 根据权利要求1所述的硅棒截断设备，其特征在于，还包括端部取料装置，设置在所述切割工作区的至少一端，还用承接对所述待切割硅棒的端部的切割尾料。
  37. 根据权利要求1所述的硅棒截断设备，其特征在于，所述硅棒下料装置设置有用于检测所述待切割硅棒端部切割位置的传感器件。
  38. 根据权利要求37所述的硅棒截断设备，其特征在于，所述传感器件为接触式传感器。
  39. 根据权利要求1所述的硅棒截断设备，其特征在于，所述硅棒下料装置包括：
    取料臂，可平移地悬置在所述硅棒截断设备的顶架上，包括伸缩机构；
    夹持件，设置在所述取料臂的底端，用于夹持截断后符合工件规格的单段硅棒截段。
  40. 根据权利要求39所述的硅棒截断设备，其特征在于，所述夹持件包括：
    第一夹持块，包括第一齿条以及与所述第一齿条联动的第一夹持部；
    第二夹持块，相对于所述第一夹持块镜像设置，包括第二齿条以及与所述第二齿条联动的第二夹持部，
    驱动齿轮，连接一电机的动力输出轴，并与所述第一齿条与所述第二齿条相啮合，用于在正向转动时带动所述第一夹持部及第二夹持部相向运动以执行夹持动作，在逆向动时带动所述第一夹持部及第二夹持部背向运动以执行释放动作。
  41. 根据权利要求40所述的硅棒截断设备，其特征在于，所述第一夹持部及第二夹持部用于夹持所述单段硅棒截段的夹持面上设置有缓冲材料。
PCT/CN2020/087097 2019-08-14 2020-04-27 硅棒截断设备 WO2021027326A1 (zh)

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