WO2021022885A1 - Metamaterial, radome and aircraft - Google Patents

Abstract

The present invention provides a metamaterial, comprising a base material layer and a metal microstructure layer superposed on the base material layer. The metal microstructure layer has periodically arranged single-direction communication structures. The base material layer and the metal microstructure layer together form an integral whole, and the end of the integral whole in a single direction is connected to a connection terminal, and communicates with an external power supply by means of the connection terminal to form a conductive path for electrical heating based on the ohmic heating characteristics of metal. In addition, the present invention further provides a radome and an aircraft. According to the technical solution provided by the present invention, specific structural design is performed on the metal microstructure layer, so that the metal microstructure layer not only serves as an electric heating unit having an electric heating de-icing function, and but also serves as an electromagnetic modulation structure that allows electromagnetic signal transmission within the working frequency range of an electromagnetic transceiver device, but shields the electromagnetic waves outside the working frequency range so as to suppress the interference of clutter signals.

Description

A metamaterial, radome and aircraft Technical field

The invention relates to the field of materials, and more specifically, to a metamaterial, a radome and an aircraft.

Background technique

The freezing of air vehicles during flight is a widespread physical phenomenon and one of the major hidden dangers that cause flight safety accidents. When the aircraft is flying under icy weather conditions, the supercooled water droplets in the atmosphere hit the surface of the aircraft and are prone to protruding parts of the fuselage, such as the leading edge of the wing, the leading edge of the rotor, the leading edge of the tail rotor, and the engine intake , Airspeed tube, aircraft windshield glass and radome and other components surface sublimation to form ice. The icing of the aircraft will not only increase the weight, but also destroy the aerodynamic shape of the aircraft, change the flow field around it, destroy the aerodynamic performance, cause the maximum lift of the aircraft to decrease, increase the flight resistance, and reduce the flight performance. In severe cases, it will cause flight safety. Fatal threat. In addition, for military aircraft, such as unmanned aerial vehicles and transport aircraft, icing will directly limit their flight area and greatly affect their combat capabilities. Therefore, deicing protection must be carried out for the key parts prone to freezing.

The existing deicing methods mainly include: hot gas deicing, mechanical deicing, microwave deicing, and electric deicing. However, the use of the hot air deicing method using bleed air requires the design of a complicated air supply pipeline to distribute the hot air drawn from the engine compressor to the parts that need to be deiced, and will affect the power and work efficiency of the engine; use airbags and expansion tubes The mechanical deicing method that shrinks and expands to break the ice layer will destroy the aerodynamic shape of the aircraft, and the deicing will not be complete; microwave deicing is easily captured by radar; in addition, traditional electric deicing generally uses metal foil, metal wire, and conductive metal Films, resistance wires, etc. are used as electric heating units, which are not suitable for parts that require electromagnetic transmission functions.

Therefore, how to achieve both deicing and electromagnetic modulation functions on aerospace vehicles to ensure the transmission of electromagnetic signals has become a pain point that the industry urgently needs to solve.

Summary of the invention

In view of the above problems, the present invention provides a metamaterial, wherein the metamaterial includes a base material layer and a metal microstructure layer superimposed on the base material layer, and the metal microstructure layer has periodic arrangement A single-direction connection structure, wherein the base material layer and the metal microstructure layer form a whole, and the ends of the whole in a single direction are connected with connecting terminals, and are connected to an external power source through the connecting terminals Through, forming a conductive path to use the metal energized heating characteristics for electrical heating.

Preferably, the metamaterial further includes a first prepreg layer, and the first prepreg layer is bonded to the metal microstructure layer through a layer of adhesive.

Preferably, the metamaterial further includes a second prepreg layer, and the second prepreg layer is bonded to the base material layer through a layer of adhesive.

Preferably, the metamaterial further includes a sandwich layer, and the sandwich layer is bonded to the second prepreg layer through a layer of glue film.

Preferably, the metamaterial further includes a third prepreg layer, and the third prepreg layer is bonded to the sandwich layer through a layer of glue film.

Preferably, there is at least one metal connection line among the plurality of metal periodic units periodically arranged between the connection terminals.

Preferably, any metal connecting line includes a plurality of periodic metal units sequentially connected in a horizontal direction, the metal units are V-shaped, and the opening angle of the V-shaped is greater than 0 degrees and less than or equal to 180 degrees.

Preferably, in the metal microstructure layer, a plurality of periodic metal units are sequentially connected in a single direction in any metal connecting line, and the metal units are in a rectangular wave shape.

In addition, the present invention also provides a radome, wherein the radome includes any of the above metamaterials.

In addition, the present invention also provides an aircraft, wherein the aircraft includes any of the above metamaterials.

The technical solution provided by the present invention solves the problem that the existing electrothermal deicing method cannot realize the electromagnetic signal transmission due to the shielding of the electromagnetic signal by the metal layer through the design of the conductive metal path and the specific design of the metal path, and can suppress the internal electromagnetic The interference of external electromagnetic signals outside the working frequency band of the transceiver device makes it possible to arrange electromagnetic transceiver devices such as microwave and millimeter wave antennas in places with a good electromagnetic transmission field of view. This will lead to the trend of multi-sensing integration and full-airspace sensing for aircraft. Lay the foundation for development and further improve the complete information chain of high-end aviation equipment.

Description of the drawings

1 is a schematic cross-sectional view of a multi-layered structure included in the metamaterial in the first embodiment of the present invention;

2 is a schematic cross-sectional view of another multi-layer structure included in the metamaterial in the second embodiment of the present invention;

3 is a schematic diagram of a two-dimensional cross-sectional view of another multi-layer stack included in the metamaterial in the second embodiment of the present invention;

4 is a schematic diagram of the periodic arrangement of in-line metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

5 is a schematic diagram of the S21 curve of the metamaterial in the second embodiment of the present invention under TE polarization as a function of the incident angle theta;

6 is a schematic diagram of the S21 curve of the metamaterial in the second embodiment of the present invention under TM polarization as a function of the incident angle theta;

FIG. 7 is a schematic diagram of another periodic arrangement of in-line metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

FIG. 8 is a schematic diagram of the S21 curve of the metamaterial in FIG. 7 under TE polarization as a function of the incident angle theta in the second embodiment of the present invention;

FIG. 9 is a schematic diagram of the S21 curve of the metamaterial in FIG. 7 under TM polarization as a function of the incident angle theta in the second embodiment of the present invention;

10 is a schematic diagram of a periodic arrangement of V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

11 is a schematic diagram of the S21 curve of the metamaterial in FIG. 10 under TE polarization as a function of the incident angle theta in the second embodiment of the present invention;

12 is a schematic diagram of the S21 curve of the metamaterial in FIG. 10 under TM polarization as a function of the incident angle theta in the second embodiment of the present invention;

13 is a schematic diagram of another periodic arrangement of V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

14 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 13 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention;

15 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 13 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention;

16 is a schematic diagram of the third periodic arrangement of V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

FIG. 17 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 16 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention;

18 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 16 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention;

19 is a schematic diagram of the periodic arrangement of semicircular metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

20 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 19 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention;

FIG. 21 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 19 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention;

22 is a schematic diagram of the periodic arrangement of sine-wave metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

FIG. 23 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 22 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention;

24 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 22 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

detailed description

The following examples may enable those skilled in the art to more fully understand the present invention, but do not limit the present invention in any way.

FIG. 1 is a schematic cross-sectional view of a multi-layer structure included in a metamaterial in an embodiment of the present invention.

As shown in Figure 1, the metamaterial of the present invention adopts a multi-layer structure design. Specifically, the metamaterial includes a base material layer 1 and a metal microstructure layer 2 superimposed on the base material layer 1. The metal microstructure layer 2 has periodicity A single horizontal connection structure with a sexual arrangement, wherein the base material layer 1 and the metal microstructure layer 2 form a whole, and the ends of the whole in a single direction are connected to the terminal 3, and are connected to each other through the two terminals 3 The external power supply is turned on to form a conductive path, and the metal is heated by electric heating. Among them, the base material layer 1 can be either a flexible base material layer or a rigid base material layer. The specific requirements depend on actual application scenarios. For example, if the metamaterial is applied to a curved surface, a flexible base material layer is required. If it is flat, either a rigid base material layer or a flexible base material layer can be selected. Among them, the base material layer 1 has the characteristics of excellent insulation performance, high and low temperature resistance, and good mechanical properties such as tensile. The whole formed by the base material layer 1 and the metal microstructure layer 2 is called a soft metal plate. The end of the flexible board in the horizontal direction is connected with the terminal 3, and the terminal 3 can be connected to the metal on the metal microstructure layer 2 by welding, or other connection methods, as long as the terminal 3 and the metal microstructure layer 2 are satisfied The two terminals 3 are connected to the positive and negative poles of the external power supply through the power cord, so that the metal on the metal microstructure layer 2, the two terminals 3, the power cord, and the external power supply A conductive path structure is formed, and the external power source uses this electrical path structure to perform electric heating by using the energized heating characteristic of the metal microstructure layer 2.

As shown in Figure 1, in the metal soft board, the metal on the base material layer 1 is etched through an etching process, and then processed into various metal microstructure patterns that are actually required. There is no metal microstructure layer in the metal microstructure layer 2. The etched area retains the metal, and the remaining metal in the metal microstructure layer 2 forms a single-direction connected structure, which is a single-direction connected structure with periodic arrangement, for example, a single-direction connected structure can be It is a straight-line horizontal connection structure such as in-line, V-shaped, and rectangular waveforms, and it can also be a curvilinear horizontal connection structure such as sinusoidal waveforms and semicircular shapes.

Wherein, in the metal microstructure layer 2, each metal periodic unit includes two ends, and one of the ends of two adjacent metal periodic units is connected. Specifically, the end of the first metal periodic unit is connected to the adjacent The end of the second metal periodic unit is connected, the other end of the second metal periodic unit is connected to the end of the adjacent third metal periodic unit, and the other end of the third metal periodic unit is connected to the adjacent fourth The ends of the metal periodic units are connected,..., according to this rule, are connected in sequence to form a connected structure in the horizontal direction. Among them, in the metal microstructure layer 2, there is at least one metal connection line among the multiple metal periodic units periodically arranged between the two connection terminals 3, which can ensure that the two connection terminals 3 at both ends of the metal soft plate are energized. The conductive path is formed as a heating unit, so that the metamaterial structure has the function of electric heating and deicing. Any metal connecting line includes a plurality of metal periodic units connected sequentially in a single direction, and the metal periodic units are in a straight shape or V And the opening angle of the V-shape is greater than 0 degrees and less than or equal to 180 degrees, or any metal connecting line includes a plurality of metal periodic units sequentially connected in the horizontal direction, and the metal periodic units are rectangular waves shape.

As shown in Figure 1, the metamaterial also includes a first prepreg layer 4 and a second prepreg layer 5, which are respectively adhered to the front and back surfaces of the metal soft board by two layers of adhesives 6. Specifically, The first prepreg layer 4 is bonded to the front surface of the metal microstructure layer 2 through a layer of adhesive 6; the back surface of the metal microstructure layer 2 is superimposed on the front surface of the base material layer 1, and the second prepreg layer 5 passes through Another layer of adhesive 6 is bonded to the opposite side of the base material layer 1. Among them, the respective prepregs in the first prepreg layer 4 and the second prepreg layer 5 are fiber prepregs such as glass or quartz, which play the role of insulation and strength support. The two layers of adhesive 6 The function is to better bond the first prepreg layer 4 and the second prepreg layer 5 on the front and back surfaces of the metal soft board.

In this embodiment, the metal microstructure layer 2 has a periodically arranged single-directional connecting structure. The preparation of the periodically arranged single-directional connecting structure is to etch the base material layer 1 in a soft metal plate. The metal on the upper surface is etched, and then processed into various metal microstructure patterns that are actually required. The metal microstructure patterns are connected in a single direction. Specifically, this connected metal structure pattern can be regarded as a metal structure with a grid. For the pattern, in terms of external physical characteristics, the pattern of a metal structure with a gate can be seen as some unidirectional metal lines etched in a certain arrangement on the surface of a complete metal layer. The electrons generated by this type of grid metal structure pattern can flow unrestricted under electromagnetic wave irradiation. From the point of view of frequency response characteristics, the grid type metal structure pattern has the possibility of electromagnetic waves incident in the direction of electric field polarization parallel to the direction of the grid. The low-frequency cut-off, high-pass electromagnetic modulation effect basically has no effect on the field of another orthogonal polarization direction. Specifically, the mechanism of this low-frequency cut-off high-pass electromagnetic modulation effect is shown in:

a) When the low-frequency electromagnetic wave with the polarization direction of the electric field parallel to the direction of the grid is irradiated on the surface of the grid-shaped metal structure pattern, it will excite a large amount of free electrons to move in the same direction for a long time, thereby obtaining a larger The kinetic energy. The lower the frequency of the incident electromagnetic wave, the more energy the electrons absorb. Therefore, the weaker the transmission ability of the incident electromagnetic wave, the smaller the transmission coefficient;

b) When high-frequency electromagnetic waves are incident, the direction of the electric field changes rapidly, the speed that the electrons can reach is small, and the energy absorbed by the electrons is less. Therefore, the incident electromagnetic waves have a high transmission capacity and a high transmission coefficient.

In this embodiment, the surface of such a grid-shaped metal structure pattern can be freely combined with non-connected ring-shaped metal surface micro-elements and patch-type metal surface micro-elements to achieve the required electromagnetic modulation characteristics. The invention combines the electromagnetic response characteristics, structure and strength requirements of the electromagnetic transceiver device, selects materials for the composite layer containing electric heating and electromagnetic modulation functions, and performs integrated design of thickness, metal structure pattern, etc., to achieve structure, strength and composite electric heating Integrated part with electromagnetic modulation function.

In this embodiment, according to the requirements of structural strength, electromagnetic control performance, etc., the metamaterial can further add a new composite dielectric layer, as shown in FIG. 2.

2 is a schematic cross-sectional view of another multi-layer structure included in the metamaterial in an embodiment of the present invention.

As shown in Fig. 2, the dashed frame A represents the metamaterial in Fig. 1, and the dashed frame B represents the newly added composite dielectric layer. On the basis of the metamaterial structure shown in FIG. 1, the metamaterial in FIG. 2 also includes a core layer 7 and a third prepreg layer 8, wherein one side of the core layer 7 passes through a layer of adhesive film 9 and the first The two prepreg layers 5 are bonded, and the third prepreg layer 8 is bonded to the other side of the sandwich layer 7 through another adhesive film 9. In this embodiment, in order to achieve more excellent electromagnetic modulation performance, the present invention can also be separately embedded in the sandwich layer 7 or the third prepreg layer 8 as shown in Figure 1 (ie the base material layer 1 and The metal microstructure layer 2 is formed as an electromagnetic modulation layer.

FIG. 3 is a schematic diagram of a two-dimensional cross-sectional view of another multi-layer stack included in the metamaterial in the second embodiment of the present invention.

The structure diagram shown in Figure 3 is a two-dimensional cross-sectional schematic diagram of pressing the multi-layered structure in Figure 2 together to form a multi-layered metamaterial. The metamaterial structure shown in Figure 3 is a kind of integrated deicing , The function of electromagnetic modulation and the function of structural load-bearing in one sandwich structure, including a total of 9 layers, specifically, from top to bottom, the thickness of the first prepreg layer 4 is d ₁ , and the thickness of a layer of adhesive 6 is d ₂ , the thickness of the metal soft board (including the base material layer 1 and the metal microstructure layer 2) is d ₃ , the thickness of the other layer of adhesive 6 is d ₄ , and the thickness of the second prepreg layer 5 is d ₅ , The thickness of one layer of adhesive film 9 is d ₆ , the thickness of the sandwich layer 7 is d ₇ , the thickness of another layer of adhesive film 9 is d ₈ , and the thickness of the third prepreg layer 8 is d ₉ .

Among them, the prepregs of the first prepreg layer 4, the second prepreg layer 5, and the third prepreg layer 8 are all low-dielectric, low-loss quartz fiber cyanate ester prepregs. High permeability and bearing effect. At the same time, the first prepreg layer 4, the second prepreg layer 5, and the third prepreg layer 8 are all a good skin material. The first prepreg layer 4, The second prepreg layer 5 can be used as the outer skin material, and the third prepreg layer 8 can be used as the inner skin material. Both layers of adhesive 6 can be glued to achieve bonding, and the metal soft board is used as the electrical The heating layer is mainly composed of heating materials and insulating materials. The metal microstructure layer 2 in the present invention is the heating material, which is made of metal copper with high resistivity and high conductivity. The base material layer 1 in the present invention is the insulating material. It is mainly a polyimide (PI) film with excellent comprehensive performance, and the sandwich layer 7 is used as a honeycomb layer to achieve electromagnetic performance optimization and bearing functions.

Among them, the thickness of the metal layer in the metal microstructure layer 2 is determined according to the actual required resistance. The thicker the metal layer, the smaller the resistance, while the thinner the metal layer, the larger the resistance. In this embodiment, the thickness of the metal layer in the metal microstructure layer 2 is 18 μm, and the thickness of the base material layer 1 (that is, the PI film) is 25 μm. Therefore, the metal soft plate composed of the two in the present invention has the electric heating layer Flexible and easy to stick on curved parts, and the metal copper can be designed into hollow patterns of different topologies to achieve frequency-selected electromagnetic modulation function. At the same time, the metal microstructure layer 2 is a connected structure to ensure that the metal in the metal microstructure layer 2 is in After power-on, a conductive path can be formed to realize the function of energized heating and deicing. In order to realize the high-pass frequency selection function of single-polarization low-frequency cutoff, the metal microstructure layer 2 also needs to have a periodic arrangement structure and a horizontal connection structure. The adhesive film is used to achieve adhesion between the layers of the present invention. Among the materials used above, the dielectric constant of the skin material is 3.15, the loss tangent value is 0.006, the dielectric constant of the film material is 2.7, the loss tangent value is 0.0065, and the dielectric constant of the PI film material is 3.2 The loss tangent value is 0.002, the dielectric constant of the honeycomb material is 1.11, and the loss tangent value is 0.006.

4 is a schematic diagram of the periodic arrangement of in-line metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention.

As shown in FIG. 4, the basic unit of the metal microstructure on the metal microstructure layer 2 is in a straight shape and includes two ends. One of the ends of two adjacent straight-shaped metal microstructures is connected. Specifically, in the first In the row, the end of the first inline metal microstructure is connected to the end of the adjacent second inline metal microstructure, and the other end of the second inline metal microstructure is connected to the adjacent third inline The ends of the metal microstructures are connected, and the other end of the third one-shaped metal microstructure is connected to the end of the adjacent fourth one-shaped metal microstructure,..., according to this rule, they are connected in sequence to form a horizontal direction In the second row, multiple in-line metal microstructures are connected in the same way as in the first row; in the third row, fourth row, ... In the N row, the connection mode of the multiple in-line metal microstructures is the same as that of the first row; in this way, the metal microstructures on the metal microstructure layer 2 realize a one-dimensional connected arrangement, in the horizontal direction For the connection structure, an energization loop can be formed by the connection terminals on both sides, that is, the two ends of the horizontal connection structure in each row are respectively connected to the two connection terminals 3. As shown in FIG. 4, the metal line widths of the in-line metal microstructures are all ww, the distance between two adjacent rows of metal microstructures are both p, and the metal line widths are all ww.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 4 is applied to the laminated structure shown in FIG. 3, and the main structure size design is shown in Table 1 below. :

Table 1 Main structural dimensions

parameter	Value (mm)
d 1	0.3
d 2	0.1
d 3	0.043
d 4	0.1
d 5	0.3
d 6	0.2
d 7	5.6
d 8	0.2
d 9	0.3
ww	0.04
p	10

Then simulate the metamaterial in Figure 3 according to the dimensions in the above table, and the results are shown in Figures 5 and 6.

It can be seen from Fig. 5 and Fig. 6 that when the incident angle theta=0～70°, the TM polarization exhibits high-pass characteristics at 4-18GHz, and the transmitted wave is greater than -0.8dB; at the incident angle theta=0～60° When the TM polarization exhibits cut-off characteristics at 0-0.6GHz, the transmitted wave is less than -9dB; when the incident angle theta = 0-60°, the transmitted wave is basically a pure medium property, and the transmitted wave is basically a pure medium property at 0-20GHz. The wave is greater than -0.834dB.

It can be seen from the above simulation results that the metal wire continuous in the horizontal direction is equivalent to a high-pass frequency selective structure with TM polarization low-frequency cut-off, which can achieve relatively independent modulation of TM waves without affecting another polarization. Similarly, by changing the periodic arrangement of the metal wires in the vertical continuous direction, as shown in Figure 7, the metal wires continuous in the vertical direction are equivalent to the high-pass frequency selective structure of the TE polarization low-frequency cutoff, which can realize the TE Wave relatively independent modulation, the specific dimensions are shown in Table 1.

Then simulate the metamaterial in Figure 7 according to the dimensions in the above table, and the results are shown in Figures 8 and 9.

FIG. 8 is a schematic diagram of the S21 curve of the metamaterial in FIG. 7 under TE polarization as a function of the incident angle theta in the second embodiment of the present invention.

FIG. 9 is a schematic diagram of the S21 curve of the metamaterial in FIG. 7 under TM polarization as a function of the incident angle theta in the second embodiment of the present invention.

It can be seen from Fig. 8 and Fig. 9 that when the incident angle theta=0～70°, the TE polarization exhibits high-pass characteristics at 8-16GHz, and the transmitted wave is greater than -1.3dB; at the incident angle theta=0～80° When the TE polarization exhibits cut-off characteristics at 0-1.3GHz, the transmitted waves are all less than -10dB; when the incident angle theta = 0～70°, the TM polarization transmitted waves basically behave as pure dielectric properties, and the transmission is at 0-18GHz. The wave is greater than -0.8dB.

Therefore, from the simulation results of Fig. 5, Fig. 6, Fig. 8 and Fig. 9, the metamaterial in the present invention realizes the function of high-frequency wave transmission. This kind of unidirectional continuous metal wire is linear. All of the horizontally connected structures can combine electromagnetic modulation functions on the basis of electric heating and deicing, and can realize the single-polarization low-frequency cut-off function.

In addition, in the present invention, not only the periodic arrangement of linear horizontally connected structures such as in-line metal microstructures can realize electric heating and deicing functions and electromagnetic modulation functions, other linear horizontally connected structures, For example, any side of the metal wire can be bent (such as V-shaped) or transformed into any polygonal periodic boundary (such as rectangular waveform), and the bent metal wire can form a connected structure as long as it meets the horizontal one-dimensional continuous arrangement The conductive path is realized, and the deicing function can be realized when the electric heating layer is energized, and the main structure size in the laminated structure can be designed to have the electromagnetic modulation function.

10 is a schematic diagram of a periodic arrangement of V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

As shown in Figure 10, the basic unit of the metal microstructure on the metal microstructure layer 2 is V-shaped and symmetrical on both sides, including two ends. One of the ends of two adjacent V-shaped metal microstructures is connected. In the first row, the end of the first V-shaped metal microstructure is connected to the end of the adjacent second V-shaped metal microstructure, and the other end of the second V-shaped metal microstructure is connected to the adjacent first The ends of the three V-shaped metal microstructures are connected, and the other end of the third V-shaped metal microstructure is connected to the end of the adjacent fourth V-shaped metal microstructure,..., according to this rule, they are connected in sequence to form The connecting structure in the horizontal direction, that is, the overall horizontal direction is also V-shaped; in the second row, the connection mode of the multiple V-shaped metal microstructures is the same as the connection mode in the first row; in the third and fourth rows In the row...Nth row, the connection mode of the multiple V-shaped metal microstructures is also the same as that of the first row; in this way, the metal microstructures on the metal microstructure layer 2 realize a one-dimensional connected arrangement , It is a connecting structure in the horizontal direction, and an energization loop can be formed by the connecting terminals on both sides, that is, the two ends of the horizontal connecting structure in each row are connected to two connecting terminals 3 respectively. As shown in Figure 10, the metal line width of the V-shaped metal microstructure is both ww, the distance between two adjacent rows of metal microstructures is p, and the left and right sides of the V-shaped metal microstructure are both a. The opening angle of the V-shaped metal microstructure is greater than 0 degrees and less than or equal to 180 degrees.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 10 is applied to the laminated structure shown in FIG. 3, and the main structure size design is shown in Table 2 below :

Table 2 Main structural dimensions

parameter	Value (mm)
d 1	0.3
d 2	0.1
d 3	0.043
d 4	0.1
d 5	0.3
d 6	0.2
d 7	5.6
d 8	0.2
d 9	0.3
ww	0.04
p	10

a	5
Opening angle of V-shaped metal microstructure	120°

Then simulate the metamaterial in Figure 3 according to the dimensions in the above table, and the results are shown in Figures 11 and 12.

FIG. 11 is a schematic diagram of the S21 curve of the metamaterial in FIG. 10 under TE polarization as a function of the incident angle theta in the second embodiment of the present invention.

FIG. 12 is a schematic diagram of the S21 curve of the metamaterial in FIG. 10 under TM polarization as a function of the incident angle theta in the second embodiment of the present invention.

It can be seen from Fig. 11 and Fig. 12 that when the incident angle theta=0～70°, the TM polarization exhibits high-pass characteristics at 7-20GHz, and the transmitted wave is greater than -1dB; when the incident angle theta=0～70° , TM polarization shows cut-off characteristics at 0-0.8GHz, and the transmitted wave is less than -9.8dB; when the incident angle theta = 0～60°, TE polarization transmission basically shows pure dielectric properties, and the transmission is at 0-18GHz. The wave is greater than -0.64dB.

FIG. 13 is a schematic diagram of another periodic arrangement of V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention.

As shown in FIG. 13, the basic unit of the metal microstructure on the metal microstructure layer 2 is V-shaped and the opening angle of the V-shaped metal microstructure is 60 degrees, and other parameters are the same as those shown in FIG. 10.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 13 is applied to the laminated structure shown in FIG. 3, and the main structure size design is shown in Table 3 below. :

Table 3 Main structural dimensions

parameter	Value (mm)
d 1	0.3
d 2	0.1
d 3	0.043
d 4	0.1
d 5	0.3
d 6	0.2
d 7	5.6
d 8	0.2
d 9	0.3
ww	0.04
p	10

a	5
Opening angle of V-shaped metal microstructure	60°

Then simulate the metamaterial in Figure 13 according to the dimensions in the above table, and the results are shown in Figures 14 and 15.

14 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 13 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention.

15 is a schematic diagram of the change of the S21 curve of the metamaterial of FIG. 13 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

It can be seen from Fig. 14 and Fig. 15 that when the incident angle theta = 0°, the transmission of TE polarization at 0-16GHz is greater than -0.64dB; the polarization of TM shows high-pass characteristics, and the transmission at 3-20GHz is greater than- 0.66dB, low frequency has cut-off function. Therefore, the periodic arrangement of linear horizontally connected structures such as V-shaped metal microstructures in the present invention can also realize the electric heating deicing function and the electromagnetic modulation function.

16 is a schematic diagram of a third periodic arrangement of V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention.

As shown in Figure 16, the basic unit of the metal microstructure on the metal microstructure layer 2 is V-shaped and the opening angle of the V-shaped metal microstructure is 90 degrees, and the distance p between two adjacent rows of metal microstructures is 12mm, other parameters are the same as those shown in FIG. 10, and multiple metal microstructures in any row are sequentially connected in a horizontal direction to form a rectangular wave shape.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 16 is applied to the laminated structure shown in FIG. 3, and the main structure size design is shown in Table 4 below. :

Table 4 Main structural dimensions

parameter	Value (mm)
d 1	0.3mm
d 2	0.1mm
d 3	0.043mm
d 4	0.2mm
d 5	0.3mm
d 6	0.2mm
d 7	5.6mm
d 8	0.2mm

d 9	0.3mm
ww	0.04mm
p	12mm
a	5mm
Opening angle of V-shaped metal microstructure	90°

Then simulate the metamaterial in Figure 16 according to the dimensions in the above table, and the results are shown in Figures 17 and 18.

FIG. 17 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 16 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention.

FIG. 18 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 16 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

It can be seen from Figure 17 and Figure 18 that when the incident angle theta = 0°, the TE polarization at 0-18GHz has a wave penetration greater than -0.54dB; the TM polarization shows high-pass characteristics, and the wave penetration at 3-20GHz is greater than- 0.95dB, low frequency has cut-off function. Therefore, in the present invention, linear horizontally connected structures, such as in-line linear metal microstructures, V-shaped bent metal microstructures, rectangular wave bent metal microstructures, etc., as long as they meet the requirements of one-dimensional continuous horizontal alignment The cloth can form a connected structure to realize a conductive path, and then can realize the deicing function when the electric heating layer is energized, and the main structure size in the laminated structure can be designed to have the electromagnetic modulation function.

In addition, in the present invention, not only the periodic arrangement of the linear single-directional communication structure can realize the electric heating deicing function and the electromagnetic modulation function, but the periodic arrangement of the curved single-directional communication structure can also realize the electric heating deicing function. Ice function and electromagnetic modulation function.

19 is a schematic diagram of the periodic arrangement of the semicircular metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention.

As shown in Figure 19, the basic unit of the metal microstructure on the metal microstructure layer 2 is semicircular, including multiple rows of semicircular metal microstructures arranged in a continuous period in the horizontal direction. In any row, multiple The semicircular metal microstructures are sequentially connected in the horizontal direction to form a curved horizontal connection structure. The spacing between rows is p, the diameter of the semicircle is a, and the line of the semicircular metal microstructure The width is ww.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 19 is applied to the laminated structure shown in FIG. 3, and the main structure size design is shown in Table 5 below. :

Table 5 Main structural dimensions

parameter	Value (mm)
d 1	0.3
d 2	0.1
d 3	0.043
d 4	0.1
d 5	0.3
d 6	0.2
d 7	5.6
d 8	0.2
d 9	0.3
ww	0.04
p	8
a	4

Then simulate the metamaterial in Figure 19 according to the dimensions in the above table, and the results are shown in Figures 20 and 21.

FIG. 20 is a schematic diagram of the change of the S21 curve of the metamaterial of FIG. 19 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention.

FIG. 21 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 19 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

It can be seen from Figure 20 and Figure 21 that when the incident angle theta = 0°, the TE polarization at 0-20GHz has a wave penetration greater than -0.35dB; the TM polarization shows high-pass characteristics, and the wave penetration at 6-20GHz is greater than- 1dB, low frequency has cut-off function.

22 is a schematic diagram of the periodic arrangement of the sinusoidal wave metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention.

As shown in Figure 22, the basic unit of the metal microstructure on the metal microstructure layer 2 is sinusoidal, including multiple rows of sinusoidal metal microstructures arranged continuously and periodically in the horizontal direction. In any row, multiple sinusoidal waveforms The metal microstructures are sequentially connected in the horizontal direction to form a curved horizontal connection structure, the spacing between the rows is p, the period of the sine wave is a, and the line width of the semicircular metal microstructure is ww.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 22 is applied to the laminated structure shown in FIG. 3, and the main structure size design is shown in Table 6 below. :

Table 6 Main structural dimensions

parameter	Value (mm)
d 1	0.3
d 2	0.1
d 3	0.043
d 4	0.1
d 5	0.3
d 6	0.2
d 7	5.6
d 8	0.2
d 9	0.3
ww	0.04
p	15
a	10

Then the metamaterial in Figure 22 is simulated according to the dimensions in the above table, and the results are shown in Figure 23 and Figure 24.

FIG. 23 is a schematic diagram of the change of the S21 curve of the metamaterial of FIG. 22 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention.

24 is a schematic diagram of the change of the S21 curve of the metamaterial in FIG. 22 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

It can be seen from Figure 23 and Figure 24 that when the incident angle theta = 0°, the TE polarization at 0-20GHz has a wave penetration greater than -0.02dB; the TM polarization shows high-pass characteristics, and the wave penetration at 4-20GHz is greater than- 0.74dB, low frequency has cut-off function. Therefore, in the present invention, the curvilinear single-direction connected structure, such as semicircular metal microstructure, sine wave metal microstructure, etc., can form a connected structure to realize a conductive path as long as it satisfies a single-direction and one-dimensional continuous arrangement. When the electric heating layer is energized, it can realize the deicing function, and the main structure size in the laminated structure can also be designed to have the electromagnetic modulation function.

It can be seen that in the present invention, the linear and curvilinear single-directional connected structure as the basic unit structure can realize the electric heating and deicing function under the periodic arrangement, and as long as the continuous arrangement in a single direction is satisfied, the adjacent two Intersecting conditions (such as common edges, common points, collinear segments, etc.) between the unit structures can form a conductive path, and then can achieve the deicing function when the electric heating layer is energized, and by designing the laminated structure The main structure size can also make it have electromagnetic modulation function. In addition to ensuring that the metal layer is a connected structure, the electric heating layer that realizes the deicing function (ie, the metal soft board) also needs to connect the metal on the electric heating layer to the power line through solder joints to form a terminal. The terminal uses a power line Connected to the onboard power supply on the aircraft, the heat generated by the electric heating layer melts into a thin layer between the ice layer and the outer skin, reducing the adhesion between the ice layer and the outer skin, so that the aerodynamic or centrifugal force The ice is easily blown off under the action of

In addition, the present invention also provides a radome, wherein the radome includes any of the above metamaterials.

In addition, the present invention also provides an aircraft, wherein the aircraft includes any of the above metamaterials.

The technical solution provided by the present invention combines the electromagnetic modulation function on the basis of satisfying the deicing function. By designing the conductive metal passage and the specific design of the metal passage, the existing deicing method can not be guaranteed due to the shielding of electromagnetic signals by the metal layer The problem of electromagnetic signal transmission can also suppress the interference of external electromagnetic signals outside the working frequency band of the electromagnetic transceiver device inside the component, so that it is possible to arrange electromagnetic transceiver devices, such as microwaves, millimeter wave antennas, etc., in places with good electromagnetic transmission vision. At the same time, it lays the foundation for the development of aircraft towards multi-sensor integration and full-airspace perception, which will further enhance the overall information chain of high-end aviation equipment.

Those skilled in the art should understand that the above embodiments are only exemplary embodiments, and various changes, substitutions and alterations can be made without departing from the spirit and scope of the present invention.

Claims (10)

1. A metamaterial, characterized in that the metamaterial comprises a base material layer and a metal microstructure layer superimposed on the base material layer, the metal microstructure layer has a single-directional interconnected structure periodically arranged, wherein The base material layer and the metal microstructure layer together form a whole, and the ends of the whole in a single direction are connected with connection terminals, and are connected to an external power source through the connection terminals to form a conductive path to Electric heating is carried out using the characteristics of metal electric heating.
2. The metamaterial according to claim 1, wherein the metamaterial further comprises a first prepreg layer, and the first prepreg layer is adhered to the metal microstructure layer through a layer of adhesive. Pick up.
3. The metamaterial according to claim 2, wherein the metamaterial further comprises a second prepreg layer, and the second prepreg layer is bonded to the base material layer by a layer of adhesive .
4. The metamaterial according to claim 3, wherein the metamaterial further comprises a sandwich layer, and the sandwich layer is bonded to the second prepreg layer through a layer of adhesive film.
5. 4. The metamaterial according to claim 4, wherein the metamaterial further comprises a third prepreg layer, and the third prepreg layer is bonded to the sandwich layer through a layer of adhesive film.
6. The metamaterial according to claim 1, wherein in the metal microstructure layer, there is at least one metal connecting line among the plurality of metal periodic units periodically arranged between the connection terminals.
7. The metamaterial according to claim 6, wherein in the metal microstructure layer, a plurality of periodic metal units are sequentially connected in a horizontal direction in any metal connecting line, and the metal units are V-shaped , The opening angle of the V-shape is greater than 0 degrees and less than or equal to 180 degrees.
8. The metamaterial according to claim 6, wherein in the metal microstructure layer, a plurality of periodic metal units are sequentially connected in a horizontal direction in any metal connecting line, and the metal units are rectangular waves. shape.
9. A radome, characterized in that the radome comprises the metamaterial described in any one of claims 1-8.
10. An aircraft, characterized in that the aircraft comprises the metamaterial according to any one of claims 1-8.

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