WO2021022871A1

WO2021022871A1 - Endoscope head end part and endoscope

Info

Publication number: WO2021022871A1
Application number: PCT/CN2020/092224
Authority: WO
Inventors: 朱能兵; 陈云亮
Original assignee: 深圳开立生物医疗科技股份有限公司
Priority date: 2019-08-08
Filing date: 2020-05-26
Publication date: 2021-02-11
Also published as: CN110584576A

Abstract

Disclosed is an endoscope head end part, comprising a head end seat (1, 1a, 1d, 1e), an imaging module (2, 2a, 2b, 2c), and an image sensing module (3, 3a, 3b). The image sensing module (3) comprises a sensor chip assembly (31, 31a, 31b) and an electronic component (32a), and the sensor chip assembly (31, 31a, 31b) and the electronic component (32a) are packaged in a three-dimensional packaging manner such that same form a whole; and a mounting hole (11a) is arranged in the head end seat (1, 1a, 1d, 1e), the imaging module (2, 2a, 2b, 2c) is arranged in the mounting hole (11a), and the image sensing module (3, 3a, 3b) is connected to a rear end of the head end seat (1, 1a, 1d, 1e) in a manner of corresponding to the mounting hole (11a). The sensor chip assembly (31, 31a, 31b) and the electronic component (32a) are packaged in the three-dimensional packaging manner, and the overall contour dimensions of the image sensing module (3, 3a, 3b) can be reduced, such that the contour dimensions of the head end part can be effectively reduced to a certain extent. Further disclosed is a corresponding endoscope.

Description

Endoscope lens end and endoscope

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201910730458.5, and the title of the invention is "endoscope lens end and endoscope" on August 8, 2019. The entire content is incorporated into this by reference. Applying.

Technical field

This application relates to the field of medical devices, in particular to the end of an endoscope lens and an endoscope.

Background technique

The endoscope has an image sensor module, an optical lens, a light source, a mechanical device, etc., and the insertion part can be inserted into the body through a natural hole, so that it can be detected in the corresponding body cavity. The external dimension of the insertion part directly affects the comfort of the testee, and the external dimension of the insertion part is mainly limited by the size of its head end.

The head end of the endoscope is usually provided with an image sensor module, an image transmission module, a clamp opening, etc. The overall size is relatively large, and each structural part of the head end is an indispensable part, and The size of each structural part is determined after countless optimizations under the premise of ensuring the function of use, which makes it very difficult to reduce the overall size of the insertion part of the endoscope under the established structural design scheme and assembly process. The larger head end increases the difficulty of inserting the insertion part and is easy to cause discomfort to the tester. If the overall size is reduced only by reducing the size of the assembly structure, the adjustment margin is small. In addition, a thin-walled structure with a small thickness will be formed, which increases the difficulty of processing structural parts and the difficulty of assembling and sealing the end of the endoscope lens, and it is difficult to ensure the use function.

Summary of the invention

According to an embodiment of the present invention, an end portion of an endoscope lens that can be reduced in size to a certain extent is provided, so that the end portion of the endoscope lens is further miniaturized, so as to solve the technical problem of large end portion size of the endoscope lens, and provide a An endoscope having the end of the endoscope lens.

The technical solutions adopted by the present invention to solve the above technical problems are:

One aspect of the embodiments of the present invention provides an end portion of an endoscope lens, which includes a head end base, an imaging module, and an image sensor module, wherein the image sensor module includes a sensor chip assembly and electronic components, so The sensor chip assembly and the electronic components are packaged as a whole by three-dimensional packaging; the head end seat is provided with a mounting hole, the imaging module is arranged in the mounting hole, and the image sensor module The corresponding mounting hole is connected to the rear end of the head end seat.

In a preferred embodiment, the imaging module includes an objective lens, the objective lens has a lens barrel, a lens holder, and an imaging element packaged in the corresponding lens barrel, and the objective lens is fixedly mounted on the lens barrel through the lens holder. Inside the mounting hole.

In a preferred embodiment, the imaging module includes a lens barrel and an imaging element arranged in the lens barrel, and the imaging module is directly installed in the mounting hole through the lens barrel.

In a preferred embodiment, the imaging module includes an imaging element, and the imaging element is directly packaged in the mounting hole.

In a preferred embodiment, the sensor chip assembly and the electronic components are three-dimensionally packaged by means of 3D printing.

As an improvement of the above technical solution, the sensor chip assembly is parallel to the cross section of the end of the endoscope lens.

As an improvement of the above technical solution, the cross section of the sensor chip assembly and the end portion of the endoscope is inclined at an acute angle, and the front end of the sensor chip assembly is provided with a light guide device, and the light guide device is used to make light It is incident perpendicular to the surface of the sensor chip assembly.

As an improvement of the above technical solution, the cross-section of the sensor chip assembly and the end of the endoscope lens is inclined at 45°.

As an improvement of the above technical solution, the light guide device is a prism, and the surface of the prism facing the sensor chip assembly is parallel or attached to the surface of the sensor chip assembly.

In another aspect of the embodiments of the present invention, there is provided an endoscope, including an insertion portion and an operating portion, the operating portion is used to operate the insertion portion to perform actions, and the tip end of the insertion portion is set to any of the foregoing The end of the endoscopic lens of the technical solution.

The above technical solutions have at least the following advantages or beneficial effects:

The end of the endoscope lens includes a head end seat, an imaging module, and an image sensing module. The image sensing module includes a sensor chip assembly and electronic components. The sensor chip assembly and electronic components are packaged as a whole through three-dimensional packaging; The head end seat is provided with a mounting hole, the imaging module is arranged in the mounting hole, and the image sensing module corresponding to the mounting hole is connected to the rear end of the head end seat. The sensor chip and electronic components are packaged in a three-dimensional packaging method, which can reduce the overall size of the image sensor module, which can effectively reduce the size of the head end to a certain extent, and realize the fineness of the endoscope It can effectively improve the clinical experience of subjects. The endoscope with the end of the above-mentioned endoscope lens also has the above-mentioned beneficial effects.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly describe the drawings that need to be used in the description of the embodiments:

Figure 1 is a cross-sectional view of the end of a conventional endoscope lens;

2 is a schematic diagram of a first embodiment in which an image sensor module is used at the end of an endoscope lens;

3 is a schematic diagram of a second embodiment in which an image sensor module is used at the end of the endoscope lens;

4 is a schematic diagram of the image sensor modules and their projection comparisons in FIGS. 1, 2, and 3;

5 is a schematic diagram of a first embodiment in which an imaging module is used at the end of an endoscope lens;

6 is a schematic diagram of a second embodiment in which an imaging module is used at the end of an endoscope lens;

FIG. 7 is a schematic diagram of a third embodiment in which an imaging module is used at the end of the endoscope lens.

detailed description

Fig. 1 is a cross-sectional view of the end of a conventional endoscope lens. Referring to Fig. 1, the end of the endoscope lens usually adopts a head end mount 1 as an assembly structure, and the external dimensions of the end of the endoscope lens are mainly limited by the head end mount 1. The dimensions of the upper clamp crossing 13 and the image transmission module. For the clamp crossing 13, different types of endoscopes, the size of the clamp crossing 13 has standard requirements. For the image transmission module, the image transmission module consists of an image sensor module. The group 3 and the imaging module 2 are composed of a mounting hole 11 for installing the imaging module 2 on the head end base 1. The image sensor module 3 includes a sensor chip 31, electronic components and an image sensor 33. The traditional solution is The sensor chip and electronic components are packaged in a T-shape with a two-dimensional circuit board to form a T-shape package structure as shown in the figure. In order to facilitate circuit layout and protect the sensor chip 31, the size of the circuit board 32 is usually larger than that of the sensor chip 31 The size of the sensor chip has a corresponding size according to the selection. Therefore, when the required sensor chip is selected, the size of the image sensor module 3 is too large, which is required in the end of the endoscope lens. The assembly space is also too large. Under the condition of meeting the requirements of processing, assembly and sealing, it is difficult to further reduce the outer dimensions of the end of the endoscope lens. The end portion of the endoscope lens provided by the embodiment of the present invention can effectively reduce the external size of the head end portion to a certain extent.

In the following, the concept, specific structure and technical effects of the present invention will be clearly and completely described in conjunction with the embodiments and drawings to fully understand the purpose, features and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work belong to The scope of protection of the present invention. In addition, all the connection/connection relationships involved in the patent do not only refer to the direct connection of the components, but rather that a better connection structure can be formed by adding or reducing connection accessories according to specific implementation conditions. The description of the top, bottom, left, right and other orientations involved in the present invention is only relative to the mutual positional relationship of the components of the present invention in the drawings. The various technical features of the present invention can be combined interactively under the premise of not conflicting with each other.

Fig. 2 is a schematic diagram of the first embodiment of the image sensor module used at the end of the endoscope lens. Referring to Fig. 2, the end of the endoscope lens includes a head end seat 1a, an imaging module 2 and an image sensor module 3a, and imaging The module 2 is used for optical imaging. The image sensor module 3a includes a sensor chip assembly 31a and electronic components 32a. The sensor chip assembly 31a is used to receive the light transmitted by the imaging module 2 and convert it into electrical signals. The sensor chip assembly 31a and The electronic components 32a are packaged as a whole by means of three-dimensional packaging; the head end base 1a is used as the mounting structure of each module on the end of the endoscope lens. The head end base 1a is provided with a clamp opening 13 and a mounting hole 11a, and the image sensor The module 3a is connected to the rear end of the head end base 1a corresponding to the mounting hole 11a, and the imaging module 2 is fixedly installed in the mounting hole 11a.

The three-dimensional package of the chip can form a three-dimensional package structure, which is a conventional packaging method used in the field of chip processing, which improves many performances of the chip, such as size, weight, speed, output and energy consumption. The three-dimensional package structure has an internal flow channel medium. For the transmission of electrical signals, it meets the requirements of high density, high performance, and low cost, and overcomes the shortcomings of the prior art of long interconnection gold lines, low space utilization, high process requirements or high costs. Specifically, the chip assembly 31a and the electronic components 32a can be three-dimensionally packaged by 3D printing, and the internal flow channel medium is formed by 3D printing, thereby forming a three-dimensional packaging structure. The 3D printing three-dimensional packaging structure is one of the three-dimensional packaging fields of chips. A conventional technical means. Compared with the solution using a two-dimensional package shape T-shaped structure, the sensor chip assembly 31a and the electronic components 32a adopt a three-dimensional packaging method, eliminating the external connection structure, forming a three-dimensional circuit connection structure, and solving the needs of two-dimensional electronic components There is enough panel space to install the required electronic components, and there is no need to set a protective edge around the outer edge of the sensor chip assembly, which can eliminate the space occupation of the electronic components in the T-shaped structure, making the image sensor module The overall size of 3a can be determined by the selected sensor chip assembly 31a, so that the overall external size of the image sensing module 3a can be reduced accordingly. Therefore, the head end base 1a can be further reduced, and the endoscope lens end 1 can be Reducing the size to a certain extent and realizing the miniaturization of the endoscope can effectively improve the clinical experience of the subject.

Among them, the image sensor module 3a has multiple implementations:

The first implementation of the image sensing module:

Fig. 2 is a schematic diagram of the first embodiment of the end of the endoscope lens adopting the image sensor module. Referring to Fig. 2, a clamp opening 13 and a mounting hole 11a are provided on the head end seat 1a, and the image sensor module 3a corresponds to The mounting hole 11a is connected to the rear end of the head end seat 1a, and the imaging module 2a is fixedly installed in the mounting hole 11a. The inner sensor chip assembly 31a and the electronic components 32a are packaged as a whole by three-dimensional packaging, wherein the sensor chip assembly is parallel In the cross section of the end of the endoscope lens, the external dimensions of the electronic component 32a formed after the three-dimensional packaging can be consistent with the external dimensions of the sensor chip assembly 31a, and the light transmitted by the imaging module can be received vertically by the sensor chip assembly , To ensure imaging quality, help improve the accuracy and reliability of diagnosis.

The second implementation of the image sensor module:

Fig. 3 is a schematic diagram of a second embodiment in which an image sensor module is used at the end of the endoscope lens; referring to Fig. 3, the cross-section of the sensor chip assembly 31b and the end of the endoscope lens are inclined at an acute angle, and the sensor chip assembly A light guide device 34 is arranged in front of 31b to allow light to be perpendicularly incident on the surface of the sensor chip assembly to ensure imaging quality. The light guide device 34 can be fixedly connected to the front end of the sensor chip assembly by bonding.

The light guide device 34 may be a prism, and the surface of the prism facing the sensor chip assembly 31b is parallel or attached to the surface of the sensor chip assembly 31b, so that the light transmitted by the imaging module 2b can be refracted by the prism and be received by the sensor chip assembly 31b vertically To ensure the image quality, the principle of light guiding of the prism is optical common sense. How to obtain the vertical light by changing the optical path through the prism can be derived by those skilled in the art through conventional optical principles, so I will not repeat it here.

The inclination angle of the sensor chip assembly 31b can be set reasonably according to specific requirements. For example, the sensor chip assembly can be set such that the surface and the end cross-section of the endoscope are 40°-50°, preferably 45°, and a corresponding prism is set to make light It hits the surface of the sensor chip assembly vertically.

In combination with the above solution, refer to Figure 4. Figure 4 is a schematic diagram of the three

image sensing modules

3, 3a, 3b and their projection comparison shown in Figures 1, 2, and 3. The three

image sensing modules

3, 3a, 3b The same sensor chip components are selected to project the three image sensor modules onto the end surface to obtain their respective projection areas S1, S2, S3, among which:

Figure a in Figure 4 is a schematic diagram of the image sensor 3 shown in Figure 1, and its projected area is S1;

Figure b in Figure 4 is a schematic diagram of the first implementation of the image sensor 3a shown in Figure 2, and its projected area is S2;

Figure c in Figure 4 is a schematic diagram of the first implementation of the image sensor 3b shown in Figure 3, with a projection area of S3;

It can be seen that S1>S2>S3, the smaller the area S projected to the end surface, the smaller the size of the corresponding endoscope end can be made. Therefore, adopting the image

sensing module solutions

2a and 2b provided by the embodiments of the present invention can further reduce the size of the end of the endoscope lens, which is helpful to realize the miniaturization of the endoscope, thereby effectively improving the clinical Experience.

For the end of the endoscope lens of the image sensor module of any one of the above embodiments, the imaging module of the imaging module may also have multiple embodiments:

The first implementation of the imaging module:

Fig. 5 is a schematic diagram of a first embodiment of an imaging module used at the end of an endoscope lens. Referring to Fig. 5, the imaging module 2a of this embodiment includes an objective lens. Conventional objective lenses in the field of endoscopes can be selected according to specific needs. The objective lens has a lens The barrel 21a, the lens holder 22a, and the imaging element 23a enclosed in the corresponding lens barrel. In the objective lens, the imaging element is usually a lens or an aspherical lens (not shown). The imaging module 2a is fixedly installed in the mounting hole through the lens holder 22a. It can be seen from the foregoing that the end of the endoscopic lens of this embodiment adopts the

image sensor modules

3a and 3b of the above-mentioned embodiment without changing the configuration of other original modules and ensuring the use function, which can provide a larger size adjustment margin. The size of the end of the endoscope can be appropriately reduced as needed.

When assembling, the imaging module 2a can be inserted into the mounting hole 11c first, and then the

image sensor modules

3a, 3b corresponding to the mounting hole 11c are connected to the rear end of the head end seat 1c, and the

image sensor modules

3a, 3b and the head end seat 1c, adjust the imaging parameters of the imaging module 2a, such as the depth of field, after the adjustment is completed, the field of view can be detected and confirmed, and then the

image sensor modules

3a, 3b and imaging module 2a It is fixedly connected in the mounting hole 11c, and can be fixedly installed by dispensing glue.

The second implementation of the imaging module:

6 is a schematic diagram of a second embodiment of an imaging module used at the end of an endoscope lens. Referring to FIG. 6, the imaging module 2b of this embodiment includes a lens barrel 21b and an imaging element 23b arranged in the lens barrel. For 23b, a lens or an aspheric lens (not shown) used in a conventional objective lens can be selected, and the imaging module 2b is directly installed in the mounting hole 11d through the lens barrel 21b. Under the premise of using the above-mentioned image sensor module, this embodiment adopts the head end base 1d to realize the function of the lens base to complete the installation and positioning of the imaging module 2b, and the lens base is omitted. Therefore, the head end base 1d can To a certain extent, further reduce the external dimensions.

When assembling, the

image sensor modules

3a, 3b corresponding to the mounting holes 11d can be connected to the rear end of the head end base 1d, the relative positions of the imaging elements are preset and fixed in the lens barrel 21b, and then the imaging module 2b Place it in the mounting hole 11d, adjust the imaging parameters of the imaging module 2b, such as the depth of field, by adjusting the relative position of the imaging module 2b and the head end base 1d. After the adjustment is completed, the field of view can be detected and confirmed, and then the imaging The module 2b is fixedly connected in the mounting hole 11d through the lens barrel 21b.

The end part of the endoscope lens of this embodiment can reduce the external size of the end part of the endoscope lens in structure; in assembly, the number of structural parts at the end part of the endoscope lens is reduced, thereby reducing the possible existence between the structural parts. The number of failed packaging areas simplifies the assembly process and improves the sealing performance of the head end. In processing, removing the lens holder can leave more processing allowance for the head end holder. While appropriately reducing the outline size, the head end The thin wall between the mounting holes on the seat can also be appropriately thickened, which can reduce the processing difficulty and reduce the risk of deformation or edge breakage. At the same time, the increase in the thickness of the thin wall can also improve the reliability of the seal.

The third embodiment of the imaging module:

FIG. 7 is a schematic diagram of a third embodiment of an imaging module used at the end of an endoscope lens. Referring to FIG. 7, the cost example image module 2c includes several imaging elements 23c for imaging, and the imaging elements 23c are directly installed in the mounting hole 11e Inside, the imaging element 23c can be a lens or an aspheric lens (not shown) used in a conventional objective lens. The imaging element 23c is directly fixed in the mounting hole 11e with the head end base 1e as an assembly lens barrel, so as to be connected to the head end base 1e. An integrally assembled structure is formed, and the imaging parameters of the imaging module 2c are adjusted by adjusting the relative positions of the

image sensor modules

3a, 3b and the head end seat 1e.

When assembling, the relative position of each imaging element can be preset and the imaging element can be fixed in the mounting hole 11e according to the packaging process of the objective lens. The imaging element can be fixed on the inner wall of the mounting hole by adhesive fixation, and then the image can be transmitted. The

sensor modules

3a, 3b are installed corresponding to the rear end of the mounting hole 11e. By adjusting the relative positions of the

image sensor modules

3a, 3b and the head end base 1e, the imaging parameters of the imaging module 2c, such as the depth of field, are adjusted. After completion, the field of view can be detected and confirmed, and then the

image sensor modules

3a, 3b are fixedly connected to the head end base 1e. The head end seat 1e is used to replace the function of the lens barrel in the prior art to complete the installation and positioning of the imaging element of the imaging module 2c, thereby eliminating the need for the lens barrel and lens holder. Therefore, the head end seat 1 only needs to be Under the condition of reliable packaging of the imaging element, the external size is reduced to a certain extent, thereby reducing the external size of the end of the endoscope lens, achieving the miniaturization of the endoscope, and effectively improving the clinical experience of the subject.

The various embodiments of the image sensing module described above can be combined with the various embodiments of the imaging module without contradiction and conflict.

The embodiment of the present invention also provides an endoscope, including an insertion part and an operation part, the operation part is used to operate the insertion part to perform actions, and the tip of the insertion part is set as the end of the endoscope lens described above, based on the above With the structural setting, the outer dimension of the end portion of the endoscope lens can be further reduced, so that the outer dimension of the insertion portion can be correspondingly reduced, thereby realizing a subtle endoscope solution, and greatly improving the comfort of the subject during testing.

The foregoing are only preferred embodiments of the present invention, but the present invention is not limited to the foregoing embodiments. Those skilled in the art can also make various equivalent modifications or substitutions without departing from the spirit of the present invention. These are equivalent Variations or replacements of are included within the scope defined by the claims of this application.

Claims

An end portion of an endoscope lens, which is characterized in that it comprises a head end seat, an imaging module and an image sensing module, wherein:

The image sensing module includes a sensor chip assembly and electronic components, and the sensor chip assembly and the electronic components are packaged as a whole by a three-dimensional packaging method;

The head end base is provided with a mounting hole, the imaging module is disposed in the mounting hole, and the image sensor module is connected to the rear end of the head end base corresponding to the mounting hole.
The end of the endoscope lens according to claim 1, wherein the imaging module includes an objective lens, the objective lens has a lens barrel, a lens holder, and an imaging element packaged in the corresponding lens barrel, and the objective lens passes through all The lens holder is fixedly installed in the mounting hole.
The end of the endoscope lens according to claim 1, wherein the imaging module includes a lens barrel and an imaging element arranged in the lens barrel, and the imaging module is directly mounted on the lens barrel through the lens barrel. Inside the mounting hole.
The end of the endoscope lens according to claim 1, wherein the imaging module includes an imaging element, and the imaging element is directly packaged in the mounting hole.
The end portion of the endoscopic lens according to claim 1, wherein the sensor chip assembly and the electronic components are three-dimensionally packaged by 3D printing.
The end portion of the endoscope lens according to any one of claims 1 to 5, wherein the sensor chip assembly is parallel to a cross section of the end portion of the endoscope lens.
The end of the endoscope lens according to any one of claims 1 to 5, wherein the cross-section of the sensor chip assembly and the end of the endoscope lens are inclined at an acute angle, and the sensor chip assembly A light guide device is provided at the front end, and the light guide device is used to make light perpendicularly incident on the surface of the sensor chip assembly.
The end portion of the endoscope lens according to claim 7, wherein the cross section of the sensor chip assembly and the end portion of the endoscope lens are inclined at 45°.
The end of the endoscope lens according to claim 7, wherein the light guide device is a prism, and a surface of the prism facing the sensor chip assembly is parallel or attached to the surface of the sensor chip assembly.
An endoscope, comprising an insertion part and an operating part, the operating part is used to operate the insertion part to perform actions, characterized in that: the tip of the insertion part is set to any one of claims 1 to 9 The end of the endoscope lens.