WO2020260846A1

WO2020260846A1 - Kit and panel for a mobile computing device

Info

Publication number: WO2020260846A1
Application number: PCT/GB2020/050596
Authority: WO
Inventors: Max HASTIE
Original assignee: Hastie Max
Priority date: 2019-06-24
Filing date: 2020-03-11
Publication date: 2020-12-30
Also published as: GB2585008A; GB201909006D0

Abstract

A module for a mobile computing device. The module includes a housing. The module also includes one or more electronic components located inside the housing. The module further includes at least one connector provided at an outer surface of the housing for connecting the module to another module to allow power and data to be passed between the modules. The module also includes at least one attachment portion for attaching the housing to a surface of a substantially planar panel having corresponding attachment portions. A substantially planar panel is attachable to an outer surface of a mobile computing device. The panel includes a first surface for attachment to the surface of the mobile computing device. The panel also includes a second surface having a plurality of attachment portions for attaching a plurality of the modules thereto. The panel and modules may be provided in a kit.

Description

KIT AND PANEL FOR A MOBILE COMPUTING DEVICE

BACKGROUND

The present specification relates to a substantially planar panel attachable to an outer surface of a mobile computing device, to a kit including the substantially planar panel and to a mobile computing device.

Mobile computing devices include devices such as laptops, mobile telephones and tablets. Devices of this kind typically have limited space inside their housings for providing components such as memory (e.g. RAM), storage (such as an SSD or HDD), or a battery.

On the other hand, while it is possible to connect external devices (e.g. storage such as an SSD or HDD) to a mobile computing device, such external devices are typically bulky and inconvenient to carry around with the mobile computing device. Moreover, connectivity between the mobile computing device and a plurality of such external devices may be problematic, not least because the mobile computing device may only have a limited number of external ports of the appropriate type.

US 2017/351347 A1 describes a plurality of modules that are connected to the front side and back side of an electronic device via corresponding attachment/detachment units. The electronic device includes an orientation detection unit that detects the orientation of the electronic device. Based on a selection of a module to be removed and a touch operation on a touch panel of the electronic device, the selected module is determined to be either on the front side or the back side of the electronic device. When the electronic device is in an orientation suitable for removal of the selected module, the module is disconnected from the electronic device by a corresponding attachment/detachment unit.

US 2017/293507 A1 describes managing operation of an electronic device based on the connection(s) of hardware module(s) to the electronic drive via a support housing. The electronic device may detect when a hardware module connects to the support housing. The electronic device may identify a function associated with the hardware module, where the function may be a built-in function of the hardware module itself or of the electronic device. The electronic device may accordingly activate the identified function.

EP 3 101 878 A1 describes a mobile terminal including a main body, a controller mounted in the main body and comprising a controller memory, and at least one component module assembled or attached to the main body, wherein the controller compares locked/unlocked state information and identification information of the component module with identification information registered in the controller memory and checks accessibility of the component module based on the result of the comparison, and when the component module is accessible, the controller controls functions of the component module or a locked state of the component module.

US 2009/036162 A1 describes a combinational mobile communication device that includes a communication device main-body and at least a swappable function expansion component. The design and structure of the swappable function expansion component is modularized, thus making it suitable to combine with a communication device main-body into an integral mobile communication device. The swappable function expansion component includes a function expansion module, and a shell. This shell can be combined with a communication device main-body to form a part of the outer shell of a mobile communication device, such as a front outer shell, a back outer shell, or a side outer shell. The communication device main-body may be combined with a plurality of swappable function expansion components as required through the respective connection interfaces.

US 2017/196270 A1 describes a cell phone module for a modular phone providing an e-cigarette functionality. As well as making use of the battery power of the cell phone or external swappable battery, the module provides a data interface with the cell phone to provide functions such as monitoring of e-cigarette use as an aid to smoking cessation.

US 6,353,535 B1 describes a portable computer that has a first housing portion having a main body and a second housing portion which is reconfigurable. In the first configuration, the second housing portion is flat and in the second configuration, the second housing portion forms a receptacle for temporarily accommodating one or more option units such as CD- ROM drives or floppy disk drives.

SUMMARY

Aspects of the present disclosure are set out in the accompanying independent and dependent claims. Combinations of features from the dependent claims may be combined with features of the independent claims as appropriate and not merely as explicitly set out in the claims.

According to an aspect of the present disclosure, there is provided a kit comprising: at least one module for a mobile computing device, the or each module comprising: a housing; one or more electronic components located inside the housing; at least one connector provided at an outer surface of the housing for connecting the module to another module to allow power and data to be passed between the modules; and

at least one attachment portion for attaching the housing to a surface of a substantially planar panel having corresponding attachment portions; and

said substantially planar panel, wherein the substantially planar panel is attachable to an outer surface of the mobile computing device, the panel comprising:

a first surface for attachment to said surface of said mobile computing device; and

a second surface including a plurality of attachment portions for attaching a plurality of said modules to the panel.

A kit including a module according to embodiments of this invention may provide a convenient way of enhancing the functionality of a mobile computing device. The modules may be attached to the panel which is itself attachable to a surface of the mobile computing device in a manner that allows the modules to pass power and data between them. The modules may allow unused space on a surface of the power and data to be utilised.

The or each module may include a plurality of the attachment portions located on a common surface of the housing. The attachment portions may be arranged in an array. This may allow the attachment portions to be lined up with corresponding attachment portions arranged in an array on the planar panel. The regular layout of the attachment portions in an array can allow for attachment of each module in one of a plurality of predetermined positions on the planar panel. This may, for instance, allow the modules to tesselate when located on the panel, thereby maximising the use of space on the panel.

At least some of the attachment portion(s) may be located at a different surface of the housing to the surface at which the at least one connector is located. This can allow the connectors to connect with adjacent modules on the planar panel, without interfering with the means by which the modules are attached to the panel.

The housing may include first and second substantially planar major surfaces. The attachment portion or attachment portions may be located at one of the major surfaces. The housing may also include at least one further surface extending between the major surfaces. The at least one connector may be located at the further surface. Again, this can allow adjacent modules attached to the panel to be connected together for the passing of power and data between them, in a manner that does not interfere with the means by which the modules are attached to the panel.

The or each module may include one or more further attachment portions located at the at least one further surface for attaching the or each module to another module having corresponding attachment portions. This can provide additional security for the modules on the panel, since the modules may be attached to the panel and also attached to each other.

At least one of the at least one further surfaces may include a plurality of the connectors. This may allow multiple communication points between adjacent modules on the panel, and/or may allow a first module to connect with multiple other modules located to one side of the first module.

The attachment portions of the or each module may include magnets. For instance, permanent magnets such as rare earth magnets may be used. This can allow the modules conveniently and securely to be attached to the planar panel in a manner that may also facilitate swift removal.

The electronic component(s) located inside the housing include one or more of: memory; a processor; storage; a battery; a card reader (e.g. for instance a Secure Digital, Compact Flash or XQD card); an antenna for wireless connectivity; and an I/O interface. It is envisaged that multiple modules including a variety of different kinds of components may be attached to the module in accordance with user requirements, making for a highly flexible system for adding functionality to the mobile computing device.

The housing may further include at least one port for connecting the module to an external device other than another said module. By way of example, the ports may be serial or parallel ports. In one example, the ports include Universal Serial Bus ports (e.g. USB-B or USB-C).

A surface of the housing including the attachment portion or attachment portions may be polygonal in shape. This may allow tessellation of a plurality of the modules when they are attached to the surface of the substantially planar panel. It is envisaged that the polygonal shape may, for instance, be rectangular (e.g. oblong or square), triangular or hexagonal.

According to another aspect of the present disclosure, there is provided a substantially planar panel attachable to an outer surface of a mobile computing device, the panel comprising:

a first surface for attachment to said surface of said mobile computing device; and a second surface including a plurality of attachment portions for attaching a plurality of modules to the panel, the or each module comprising:

a housing;

one or more electronic components located inside the housing; at least one connector provided at an outer surface of the housing for connecting the module to another module to allow power and data to be passed between the modules; and

at least one attachment portion for attaching the housing to said second surface of said substantially planar panel.

A substantially planar panel according to embodiments of this invention may provide a convenient way of enhancing the functionality of a mobile computing device. The substantially planar panel can allow modules of the kind set out in claims 1 to 9 to be attached thereto in a manner that allows the modules to pass power and data between them. The substantially planar panel may allow unused space on a surface of the power and data to be utilised.

The attachment portions of the substantially planar panel may be arranged in an array, to allow tessellation of a plurality of the modules when they are attached to the panel. This may allow the usage of space on the panel to be maximised. In use, the attachment portions may be lined up with corresponding attachment portions arranged in an array on the modules. The regular layout of the attachment portions in an array can allow for attachment of each module in one of a plurality of predetermined positions on the planar panel.

The attachment portions of the substantially planar panel may include magnets. For instance, permanent magnets such as rare earth magnets may be used. This can allow the modules conveniently and securely to be attached to the planar panel in a manner that may also facilitate swift removal.

According to another aspect of the present disclosure, there is provided a mobile computing device having an outer surface to which is attached the substantially planar panel of any of claims 10 to 12.

At least one said module may be attached to the substantially planar panel.

The mobile computing device may be a laptop, mobile telephone or tablet. BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of this disclosure will be described hereinafter, by way of example only, with reference to the accompanying drawings in which like reference signs relate to like elements and in which:

Figure 1 shows a mobile computing device with a substantially planar panel attached thereto, in accordance with an embodiment of this disclosure;

Figure 2 shows a side view of the mobile computing device of Figure 1;

Figure 3 shows the underside of a mobile computing device according to an embodiment of this disclosure, showing the panel in more detail;

Figures 4A and 4B show a module according to an embodiment of this disclosure;

Figure 5 shows a mobile computing device with a number of modules attached to the substantially planar panel, according to an embodiment of this disclosure; and

Figure 6 shows a mobile computing device with a number of modules attached to the substantially planar panel, according to an embodiment of this disclosure.

DETAILED DESCRIPTION

Embodiments of this disclosure are described in the following with reference to the accompanying drawings.

Figure 1 shows a mobile computing device. Figure 2 shows a side view of the mobile computing device of Figure 1. In this embodiment, the mobile computing device is a laptop 10. However, it is envisaged that embodiments of this disclosure are applicable to other kinds of mobile computing devices, such as mobile telephones or tablets.

The laptop 10 has a housing that is provided in two parts 12, 14. The two parts of the housing are hingedly attached together. The first part 12 of the housing incorporates a display 16. The second part 14 of the housing incorporates user input devices such as a keyboard 18 and a trackpad 20.

The laptop 10 has a surface upon which a substantially planar panel 50 is attached. In this embodiment, the surface to which the panel 50 is attached is an underside 22 of the second part 14 of the housing. It is envisaged that the panel 50 may instead be attached to another surface of the laptop, such as the upper surface of the first part 12 of the housing (i.e. the surface of the first part of the housing opposite the display 16). This may allow the panel to be attached to the laptop without interfering with the operation of any fans located inside the second part of the housing of the laptop (i.e. by covering any air inlets/outlets located in the underside 22 of the laptop). In the case of a mobile telephone or tablet, the panel 50 may, for instance, be attached to an underside of the mobile telephone or tablet (this would typically be a surface of the housing of the mobile telephone or tablet opposite a display of the mobile telephone or tablet).

Figure 3 shows the underside 22 of the laptop, thereby to illustrate the panel 50 in more detail. The panel 50 is substantially planar.

The panel 50 has a first major surface and a second major surface. The first major surface is attachable to the surface of a mobile computing device. The first surface (not visible in the figures) of the panel 50 in the present embodiment is attached to the underside 22 of the laptop 10. The first surface of the panel 50 may be attached to the mobile computing device using, for instance, an adhesive or some other means.

The panel 50 also has a second major surface 56, which is opposite the first major surface. The second major surface 56 of the panel 50 can be seen in Figure 3.

The second major surface 56 of the panel 50 is provided with a plurality of attachment portions 52. As will be described below, the attachment portions 52 can allow a plurality of modules to be attached to the surface 56. The attachment portions in this embodiment comprise magnets. For instance, permanent magnets such as rare earth based (e.g. Neodymium) magnets may be used. The magnets may be attached to, or embedded within the surface 56.

Other kinds of attachment portions are envisaged.

In one embodiment, hook and loop attachment portions may be used (e.g. Velcro). It will be appreciated that the hooks may be provided on the panel 50 for attachment to corresponding loops located on a surface of the module, or the arrangement may be reversed, with the loops located on the panel 50, for attachment to corresponding hooks located on the surface of the module.

In another embodiment, the attachment portions may comprise press-fit connections comprising an opening in the panel 50 for receiving a corresponding member extending from a surface of the module. It will be appreciated that the arrangement may be reversed, with members located on the panel 50 for insertion into corresponding openings provided in a surface of the module. The connection between the openings and the members may comprise a friction fit (i.e. a press fit).

The attachment portions 52 may be arranged in an array. In the example shown in Figure 3, the attachment portions 52 are arranged in an oblong array. Various kinds of array are envisaged, e.g. rectangular (e.g. oblong or square), triangular or hexagonal. The arrangement of the attachment portions 52 in an array may allow for tessellation of the aforementioned modules when they are attached to the surface 56. The geometry of the modules may be matched to the geometry of the array. For instance, the modules may have the same symmetry as the array, to facilitate their tessellation on the surface. By way of example, the modules may be rectangular (e.g. oblong or square) in the case of a rectangular array as discussed below in relation to Figure 5, or may be triangular in the case of a triangular array, or may be hexagonal in the case of a hexagonal array.

As part of the arrangement of the attachment portions 52 in an array, it is noted that the attachment portions may be grouped in clusters. Each cluster may be located at a respective lattice point of the array. Examples of such clusters are shown in Figure 3. The cluster 54 in Figure 3, which is located at a corner of the oblong array in includes a single attachment portion 52, the cluster 55 in Figure 3, which is located along a peripheral edge of the array includes two attachment portions 52, and the cluster 58 in Figure 3, which is located inside the array in includes four attachment portions 52. Similar principles may apply to square, triangular and hexagonal arrays of the attachment portions 52.

Figures 4A and 4B show a module 60 according to an embodiment of this disclosure. In this embodiment, the module 60 has a first (“upper”) major surface 64 for attachment to the surface 56 of the panel, and a second (“lower”) major surface 62 on an opposite side of the module 60. Figure 4A shows the“top” of the module 60 (whereby the surface 64 is visible), and Figure 4B shows the“bottom” of the module 60 (whereby the surface 62 is visible).

The module 60 has a housing. The housing may, for example, comprise metal or plastic. One or more electronic components are located inside the housing. The electronic components may, for instance, comprise memory, a processor, storage, a battery, a card reader, an antenna for wireless connectivity, and/or an I/O interface. The electronic components may be used to enhance the functionality of the mobile computing device (the laptop 10, in this embodiment). Accordingly, the module 60, and other like modules, may be provided to enhance the battery life, processing power, memory/storage space, I/O capability, and/or connectivity of the mobile computing device.

The housing in this embodiment includes the aforementioned first and second major surfaces 64, 62. The housing in this embodiment also includes one or more further surfaces, which may extend between the first and second major surfaces 64, 62 at a periphery of the housing. These further surface(s) include first and second opposite side surfaces 66, 68, and third and fourth opposite side surfaces 70, 72. In the present embodiment the surfaces 70, 72 have a longer dimension than the surfaces 66, 68, and the surfaces 66, 68 are each orthogonal to the surfaces 70, 72, providing the module 60 with an oblong profile. It will be appreciated that the side surfaces of the housing may be configured differently in the case of modules that are rectangular (e.g. oblong or square), triangular or hexagonal, so as to match the symmetry of the array of attachment portions 52 provided on the panel 50. In the present embodiment, each surface of the housing is substantially planar, although this is not considered to be essential.

The module 60 has at least one connector 80. Each connector 80 is provided at an outer surface of the housing, to allow the module 60 to be connected to another module 60 of the same or similar kind. In this way, the modules 60 may be interconnected when they are located on the panel 50 (e.g. in a tessellating arrangement). The connectors 80 are electrical connectors that can allow power and data to be passed between the modules 60. The connectors 80 may include any suitable kind of connector for transferring power and data. For instance, Universal Serial Bus (USB) connectors may be used.

In this embodiment, the module has four connectors 80, and each connector 80 is provided on a respective one of the side surfaces 66, 68, 70, 72. It will be appreciated that in other embodiments, not all of the side surfaces 66, 68, 70, 72 of the housing may be provided with a connector 80. On the other hand, it will be appreciated that more than one connector 80 may be provided on each side surface 66, 68, 70, 72.

In this embodiment, each connector 80 is located at a center of each side surface 66, 68, 70, 72 of the housing, although again this is not considered essential. The arrangement of the connectors in this way may nevertheless facilitate the interconnection of a plurality of like modules 60 when they are provided in an (e.g. tessellating) arrangement on the panel 50.

The module 60 also includes at least one attachment portion 82. Each attachment portion 82 in this embodiment is located at the second major surface 62. This can allow the attachment portions to line up with corresponding attachment portions 52 located on the panel 50, for attaching the module 60 to the panel 50.

Each attachment portion 82 may thus be of a kind that is suitable for attaching to the corresponding attachment portions 52 located on the panel 50. For instance, in the present embodiment, the attachment portions 82 comprise magnets such as permanent magnets (e.g. rare earth based (e.g. Neodymium) magnets) of a kind similar to those provided on the panel in Figure 3. The magnets may be attached to, or embedded within the surface 64.

The attachment portions 82 may be arranged to line up with the corresponding attachment portions 52 on the panel 50. For instance, where the attachment portions 52 are provided in an array, the attachment portions 82 may be arranged to match the symmetry and spacing of the array. In the present embodiment, the attachment portions 82 are located at respective corners of the surface 64 for attaching to the corresponding attachment portions 52 of a single cell of the array of attachment portions 52 on the panel 50. However, it is envisaged the module may span more than one cell of the array of attachment portions 52 when it is attached to the panel 50. Examples of this will be discussed below in relation to Figure 5. In this embodiment, the attachment portions 82 are arranged in an oblong configuration. It will be appreciated that the attachment portions may be arranged in, for instance, a rectangular (e.g. oblong or square), triangular or hexagonal configuration according to the configuration of the array of attachment portions 52 on the panel 50.

The module 60 may optionally include one or more further attachment portions 84. These further attachment portions 84 may be located on the side surfaces of the housing. For instance, in the present embodiment, the side surfaces 66, 68, 70, 72 are each provided with two further attachment portions 84. The further attachment portions 84 can be provided for attaching the module 60 to another like module 60 having corresponding attachment portions 84. This can provide additional security for the modules 60 when they are mounted on the panel 50, since the modules 50 may be attached to the panel 50 and also attached to each other. The further attachment portions 84 may be configured similarly to the attachment portions 52, 82 - for instance the attachment portions in this embodiment comprise permanent magnets such as rare earth based (e.g. Neodymium) magnets. Again, the magnets may be attached to, or embedded within the side surfaces of the housing. In some embodiments, the module 60 may include at least one port for connecting the module 60 to an external device other than another like module 60. By way of example, the ports may be serial or parallel ports. In one example, the ports include Universal Serial Bus ports (e.g. USB-B or USB-C). This can allow the connectivity of the mobile computing device to be enhanced by providing additional means by which to connect the mobile computing device to external devices (e.g. a mobile communications device (for providing power to the device for charging the device), another mobile computing device such as a laptop, tablet or mobile communications device (for transferring data to/from the other mobile computing device), printers, monitors, a wired local area network (LAN) or any other kind of external device).

Figure 5 shows a mobile computing device with a number of modules 60 attached to the substantially planar panel 50, according to an embodiment of this disclosure. Again, in this embodiment, the mobile computing device is a laptop, and the panel 50 and modules are substantially as described above in relation to Figures 1 to 4.

Figure 5 illustrates how the modules 60 may tesselate on the panel 50, and how the connectors 80 may line up to allow power and data to pass between the modules 60. Note that in this example, three modules 61, 63, 65 are shown. Each module is of a different size. For instance, module 63 is twice the size of module 61, and module 65 is twice the size of module 63. The different sizes of the modules may provide a degree of flexibility for accommodating the types of electronic components described above. For instance, a larger module such as module 65 may be appropriate for housing a battery, whereas a smaller module such as module 61 may be appropriate for housing an I/O interface.

Module 61 in this example is of a similar configuration and size as the module 60 described above in relation to Figures 4 A and 4B. Module 63 is provided with more attachment portions than the module 61, and spans two cells of the array of attachment portions 52 on the panel 50. The attachment portions on the module 63 may be positioned to line up with the attachment portions 52 of two cells in the array, as can be seen in Figure 5. Module 65 is provided with more attachment portions than the module 61 and the module 63, and spans four cells of the array of attachment portions 52 on the panel 50. Again, the attachment portions on the module 63 may be positioned to line up with the attachment portions 52 of four cells in the array, as can be seen in Figure 5.

Module 61 in this example includes four connectors 80, as described above in relation to Figures 4A and 4B. The larger size of the modules 63, 65 in this example provides more space for the provision of connectors 80. In this example, module 63 includes six connectors, while modules 65 includes ten connectors 80, as shown in Figure 5. Note that the connectors 80 on each size of module may be positioned to connect with corresponding connectors 80 of the other modules on the panel 50, even when differently sized modules are located next to each other. This may be achieved by spacing the connectors 80 (i.e. on the sides of the modules that have more than one connector 80) by a distance equal to the array spacing in that direction. For instance, in Figure 5, the longer sides of the module 65 each have four connectors 80 and the spacing (“d”) between adjacent connectors 80 is the same as the distance between two adjacent lattice points in the array of attachment portions 52 on the panel 50 in that direction.

Figure 6 shows a mobile computing device with a number of modules 61, 63, 65 attached to the substantially planar panel, according to an embodiment of this disclosure. Again, in this embodiment, the mobile computing device is a laptop, and the panel 50 and modules are substantially as described above in relation to Figures 1 to 4.

Figure 6 illustrates the tessellating nature of the arrangement of modules 61, 63, 65. It will be appreciated that different arrangements of modules of different sizes may be provided on the panel 50, in a tessellating fashion. As in the example of Figure 5, the modules in this example are differently sized. In particular, there are four modules 61, two modules 63 and two modules 65 of the kind described above in relation to Figure 4. The connectors 80 described above can allow each module in the arrangement to communicate (transfer power and data) with each of its nearest neighbor modules. In accordance with an embodiment of the invention, one of the modules may be provided with a port for connecting to the arrangement of modules on the panel with the mobile computing device. For instance, the port may be a Universal Serial Bus (e.g. USB-B or USB-C) port. The connection between the port of the module and the mobile computing device may be implemented using an appropriate cable. This can allow the mobile computing device to communicate with and send/receive power to/from the modules on the panel 50. As described above, the connectors can allow power and data to pass between the modules, whereby the mobile computing device may communicate and send/receive power to/from the modules on the panel 50 through the module having the aforementioned port, and via the connectors 80.

In accordance with an embodiment of the invention, one of the modules may be configured to manage/control the other modules on the panel 50. For instance, the module may control the routing of data through the modules and to and from the mobile computing device. The module may also control the routing of power between the modules and to/from the mobile computing device, bearing in mind that one or more of the modules may comprise a battery module for enhancing the battery lifetime of the mobile computing device.

As will be appreciated from the description of, for example, Figures 4 A and 4B, the modules may be relatively flat (that is to say, the distance between the first and second major surfaces 62, 64 is smaller than the dimensions of the edges of each major surface 62, 64). This small form factor can allow the panel and modules to be installed with minimum impact on the overall size of the mobile computing device.

In one embodiment, there may be provided a kit including a panel substantially of the kind described above, and one or more modules of the kind described above. The modules may include different kinds of electronic components. This can allow a diverse range of additional functionality to be provided for the mobile computing device. For instance, one or more of the modules may include memory, one or more of the modules may include a processor, one or more of the modules may include storage, one or more of the modules may include a battery, one or more of the modules may include a card reader, one or more of the modules may include an antenna for wireless connectivity, and/or one or more of the modules may include an I/O interface. The electronic components in the modules may be selected according to the needs of the user.

Accordingly, there has been described a module for a mobile computing device. The module includes a housing. The module also includes one or more electronic components located inside the housing. The module further includes at least one connector provided at an outer surface of the housing for connecting the module to another module to allow power and data to be passed between the modules. The module also includes at least one attachment portion for attaching the housing to a surface of a substantially planar panel having corresponding attachment portions. A substantially planar panel is attachable to an outer surface of a mobile computing device. The panel includes a first surface for attachment to the surface of the mobile computing device. The panel also includes a second surface having a plurality of attachment portions for attaching a plurality of the modules thereto. The panel and modules may be provided in a kit.

Aspects of the invention are set out in the following series of numbered clauses.

1. A module for a mobile computing device, the module comprising:

a housing;

at least one attachment portion for attaching the housing to a surface of a substantially planar panel having corresponding attachment portions. . The module of clause 1 comprising a plurality of said attachment portions located on a common surface of the housing, wherein the attachment portions are arranged in an array. . The module of any preceding clause, wherein the housing comprises:

first and second substantially planar major surfaces, wherein the attachment portion or attachment portions is/are located at one of said major surfaces; and at least one further surface extending between the major surfaces, wherein the at least one connector is located at said further surface. The module of clause 4, comprising one or more further attachment portions located at the at least one further surface for attaching the module to another module having corresponding attachment portions. The module of clause 4 or clause 5, wherein at least one of the at least one further surface includes a plurality of said connectors. The module of any preceding clause, wherein the attachment portions comprise magnets.

The module of any preceding clause, wherein the electronic component(s) located inside the housing include one or more of:

memory;

a processor;

storage;

a battery;

a card reader;

an antenna for wireless connectivity; and

an I/O interface.

The module of any preceding clause, wherein the housing further comprises at least one port for connecting the module to an external device other than another said module.

The module of any preceding clause, wherein a surface of the housing including said attachment portion or attachment portions is polygonal in shape, to allow tessellation of a plurality of said modules when they are attached to the surface of the substantially planar panel. 10. A substantially planar panel attachable to an outer surface of a mobile computing device, the panel comprising:

a second surface including a plurality of attachment portions for attaching a plurality of modules according to any preceding clause to the panel.

1 1. The panel of clause 10, wherein the attachment portions are arranged in an array, to allow tessellation of a plurality of said modules when they are attached to the panel.

12. The panel of clause 11, wherein the attachment portions comprise magnets.

13. A kit comprising:

at least one module according to any of clauses 1 to 9; and

a substantially planar panel according to any of clauses 10 to 12.

14. A mobile computing device having an outer surface to which is attached the substantially planar panel of any of clauses 10 to 12, wherein at least one module according to any of clauses 1 to 9 is attached to the substantially planar panel.

15. The mobile computing device of clause 14, wherein the mobile computing device is a laptop, mobile telephone or tablet.

Although particular embodiments of this disclosure have been described, it will be appreciated that many modifications/additions and/or substitutions may be made within the scope of the claims.

Claims

1 A kit comprising:

at least one module for a mobile computing device, the or each module comprising:

a housing;

one or more electronic components located inside the housing;

at least one connector provided at an outer surface of the housing for connecting the module to another module to allow power and data to be passed between the modules; and

at least one attachment portion for attaching the housing to a surface of a substantially planar panel having corresponding attachment portions; and said substantially planar panel, wherein the substantially planar panel is attachable to an outer surface of the mobile computing device, the panel comprising:

2. The kit of claim 1, wherein the or each module comprises a plurality of said attachment portions located on a common surface of the housing, wherein the attachment portions are arranged in an array.

3. The kit of any preceding claim, wherein the housing of the or each module comprises:

first and second substantially planar major surfaces, wherein the attachment portion or attachment portions is/are located at one of said major surfaces; and

at least one further surface extending between the major surfaces, wherein the at least one connector is located at said further surface.

4. The kit of claim 4, wherein the or each module comprises one or more further attachment portions located at the at least one further surface for attaching the module to another module having corresponding attachment portions.

5. The kit of claim 4 or claim 5, wherein at least one of the at least one further surface includes a plurality of said connectors.

6. The kit of any preceding claim, wherein the attachment portions of the or each module comprise magnets.

7. The kit of any preceding claim, wherein the electronic component(s) located inside the housing of the or each include one or more of:

memory;

a processor;

storage;

a battery;

a card reader;

an antenna for wireless connectivity; and

an I/O interface.

8. The kit of any preceding claim, wherein the housing of the or each module further comprises at least one port for connecting the module to an external device other than another said module.

9. The kit of any preceding claim, wherein a surface of the housing of the or each module including said attachment portion or attachment portions is polygonal in shape, to allow tessellation of a plurality of said modules when they are attached to the surface of the substantially planar panel.

10. A substantially planar panel attachable to an outer surface of a mobile computing device, the panel comprising:

a second surface including a plurality of attachment portions for attaching a plurality of modules to the panel, the or each module comprising:

a housing;

11. The panel of claim 10, wherein the attachment portions of the substantially planar panel are arranged in an array, to allow tessellation of a plurality of said modules when they are attached to the panel.

12. The panel of claim 11, wherein the attachment portions of the substantially planar panel comprise magnets.

13. A mobile computing device having an outer surface to which is attached the substantially planar panel of any of claims 10 to 12.

14. The mobile computing device of claim 13, further comprising at least one said module attached to the second surface of the panel.

15. The mobile computing device of claim 13 or claim 14, wherein the mobile computing device is a laptop, mobile telephone or tablet.