GB2585008A

GB2585008A - Module and kit for a mobile computing device

Info

Publication number: GB2585008A
Application number: GB1909006.7A
Authority: GB
Inventors: Hastie Max
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-06-24
Filing date: 2019-06-24
Publication date: 2020-12-30
Also published as: WO2020260846A1; GB201909006D0

Abstract

A module 60 for a mobile computing device, preferably a laptop, mobile telephone or tablet including a housing with one or more electrical components inside. These components may be a processor, memory, storage, battery, card reader, antenna or I/O interface. There are one or more connectors 80 on the outer surface of the housing for connecting the module to another module to allow power and data to be passed. The module has at least one attachment portion (fig.4A, 82), preferably magnetic, for attaching to the surface of a substantially planar panel having corresponding attachment portions 52. The panel is attachable to an outer surface of a mobile computing device on a first surface, the second surface having a plurality of attachment portions 52 arranged in an array, to allow a tessellation of polygonal modules to attached. There may also be a port for connecting to an external device.

Description

Intellectual Property Office Application No. GII1909006.7 RTM Date:4 November 2019 The following terms are registered trade marks and should be read as such wherever they occur in this document: XQD -page 3 Velcro -page 8 Intellectual Property Office is an operating name of the Patent Office www.gov.uk /ipo MODULE AND KIT FOR A tv1OBILE:'COMPUTING DEVICE

BACKGROUND

The present specification relates to a for a mobile computing device, to a substantially planar panel attachable outer surface of a mobile computing device, and to a mobile computing device.

Mobile mpating devices include devices such as laptops, mobile telephones and tablets. Devices of this kind typically have limited space inside their housings for providing components such as memory (e.g. RAM), storage (such as an SSD or HDD), or a battery.

On the other hand, while it is possible 0 connect external devices (e.g. storage such as an SSD or HDD) to a mobile computing device, such external devices are typically bulky and inconvenient to carry around with the mobile computing device. Moreover, connectivity between the mobile computing device and a plurality of such e:term devices may be problematic, least because the mobile computing device may only have a limited munbe of external pouts of the appropriate type,

SUMMARY

Aspects of the Present disclosure, are set out in the accompanying independent and claims. Combinations of to o n the dependent claims may be combined with features of the independent claims as appropriate and not merely as explicit! et out the claims.

According to an aspect of the; present disclosure, is provided a module for a mobile computing device, the module comprising: a housing; one or more eetrom components located inside the housing: at least one connector provided at an outer surface of the housing for connecting the 171 dule to another module to allow' power and data to be passed between the nodules; and at least one attachment portion for attaching the housing to a surface of a substantially planar land having corresponding attachment portions.

A modute according to embodiments of this invention may provide a convenient way of enhancing the functionality of a mobile computing device. The modules may be attached to a panel which is itself attached to a surface of the mobile computing device in a manner that allows the modules to pass power and data between them. The modules may allow unused space on a suri ce of the power and data to be utilised emodulemay include a p rrality of the att it portions located on a common surface of the housing. The attachment portions may be rranged in an array. This may 25 allow the attachment portions to be lined up with corresponding attachment nortions arranged in an array on the planar panel. The regular layout of the attachment portions an array can allow for attachment of each module in one of a plurality of predetermined positions on the planar panel. This mass, th °dales to tess.elate when located on the panel, thereby maximising the use of space on the panel.

At leasa some of the achm ion located at a face of the housing to the surface at ww lhich the at least one connectoris located. T is can allow the connectors to connect with adjacent modules on the planar panel, without interfering with the means by which the modules are attached to the panel.

The housing may include first and second substantially planar major surfaces, The attachment portion or attachment portions may be located at one of the major surfaces. The housing may also include at least one further surface extending between the major surfaces, The at least one connector may ioe located at the further surface, Again, this can allow adjacent modules attached to the panel to be connected together for the passing of power and data between them, in a manner that does not interfere with the means by which the modules are attached to the panel.

The module may include one or more further attachment portions located at the at least one further surface for attaching the module to another module having corresponding attachment portions. This can provide additional security for the modules on the panel, since the modules may be attached to the panel and also attached to each other.

At least one of the at least one further surfaces may include a plurality of the connectors. This may allow multiple communication points between adjacent modules on the panel, and/or may allow a first module to connect with multiple other modules located to one side of the first module.

The attachment portions may include magnets. For instance, permanent magnets such as rare earth magnets may be used. This can allow the modules conveniently and securely to be attac ed to the planar panel in a manner that may also facilitate swill removal.

The electronic component(s) located inside the housing include one or more of memory; a processor; storage; a battery; a card reader (e.g. for instance a Secure Digital, Compact Flash or XQD card); an antenna for wireless connectivity, and an DO interface. It is envisaged that multiple modules including a variety of different kinds of components may be attached to the module in accordance with user requirements, making for a highly flexible system for adding ftinctionality to the mobile computing device, The housing may further include at least one port for connecting the module to an external device other than another said module. By way of example, the ports may be serial or parallel ports. In one example, the ports include Universal Serial Bus ports (e.g. USB-B or USB-C).

A surface of the housing including the attachment attachmentportion or attachment portions may be polygonal in shape. This may allow tessellation of a plurality'ofthe modules when they are attached to the surface of the substantially planar panel. It is envisaged that the polygonal shape may, for instance, be rectangular (e.g. oblong or square), triangular or hexagonal.

According to another aspect of the present disclosure, there is provided a substantially planar panel attachable to an outer surface of a mobile computing device, the panel comprising: a first surface for attachment to the surface of t ie mobile computing device; and cond surface including a plurality of attachment portions for attaching a plurality daalcs according to any of claims 1 to 9 to the panel-A substantially planar panel mbodiments of this invention may pro -(1 a convenient way of enhancing the fun of a mobile computing device.

substantially planar panel can allow modules of the kind set out in claims I to 9 to be attached thereto in a manner that allows the modules to pass power and data between them. The substantially planar panel may allow unused space on a surface of the power and data to be'utilised.

The attachment portions may be arranged in an array, to allow aliow tessellation of a plurality of the modules when they arc attached to the panel. This may allow the usage of space on the panel to be maximised To use, the attachment portions may be lined up with corresponding attachment portions arranged in an array on the modules. The regular layout of the attachment portions in an array can allow for attachment of each module in one of a plurality of predetermined positions on the planar panel.

The attaa hment portions ay include magnet,. For instance, permanent magnet:s such as rare earth magnets may be used. Tins can allow the convenient y and securely to be attached to the planar a manner that may also facilitate swift removal.

According o a further aspect of the present disclosure, 'there is provided a kit comprising: ones module according to any of claims 1 to a substantially planar panel according to any of claims 10 to 12.

According to another aspect of the present disclosure, there is provided a mobile computing device having an outer surface to which is attached the substantial/3/ planar panel * of any of claims 10 to 12, wherein at least one module according to any of claims 1 to 9 is attached to the substantially planar panel.

The mobile computing device may be a laptop, mobile telephone or tablet.

BRIEF'DESCRIPTIONOF TEE DRAWINGS'

Embodiments of this disclosure will be described hereinafter, by way cif example only, with reference to the accompanying drawings in which like reference signs relate to like elements and in which: Figure 1 shows a mobile computing device with as suns tally planar panel attached thereto, in accordance with an embodiment of this disclosure; Figure 2 shows a side view of the mobile computing device of Figure; Figure 3 shows the underside of a mobile computing device according to an diment of this disclosure, showing the panel in more detail; es 4A and 4B show a module according to an embodiment of this Isola e; e 5 shows a mobile computing device with a number of modules substantiallyplanar panel, according to an embodiment of this disclosure; and Figure 6 shows a mobile computing device with a number of modules attached' to the substantially planar panel, according to an embodiment of this disclosure.

DRI I1) SCR Embodiments of this disclosu re described in the following re accompanying drawings.

Figure 1 shows a t computing device of Figu 10. However, it is et ged kinds of mobile comnuting devi rice. l Figure 2 shows a side view of the mobile this embodiment, the mobile computing device is a laptop nibodiments of this disclosure are applicable to other uch as mobile telephones or tablets.

The laptop 10 has a noosing ovided In t 14. The two parts h housing are hingedly attached together. The first housing hamper display 16 second part housing incorporates user input devices such as a keyboard 18 and a traekpad 20.

The laptop 10 has a surface upon which a substantially planar a lel 50 is attached. In this embodiment, the surface to which the panel 50 is attached is an underside 22 of the second part 14 of the housing. It is envisaged that the panel 50 may instead be attached to another surface of the laptop, such as the upper surface of the first part 12 of the housing (i.e. the surface of the first part of the housing opposite the display 16). This may allow the panel to be attached to the laptop without interfering with the operation of any fans located inside the second part of the housing of the laptop (i e. by covering any air inlets/outlets located in the underside 22 of the laptop). In the case of a mobile telephone or tablet, the panel 50 may, for instance, be attached to an underside of the mobile telephone or tablet (this would typically be a surface of the housing of the mobile telephone or tablet opposite a display of the mobile telephone or tablet).

Figure 3 shows the underside 22 of the laptop, thereby to illustrate the panel 50 in detail. he panel 50 is substantially planar.

The panel 50 has a first major sur ace and a 8' amd major surface. The first major surface is attachable to the surface of a mobile computing device. The that surface (not e figures) of the panel 50 in the present embodiment is attached to the underside 22 of th laptop 10. The first su of the panel 50 may be attached to the mobile computing device using, iriStatiee, an adhesive or Seine Other Means.

The panel 50 also has a second major surface 56, whielt is opposite the firs major surface. The second major surface 56 of the panel 50 can he seen M Figure 3.

second major surface 56 of the panel 50 is provided with-a plurality of attachment portions 52. As will be described below, the attachment portions can allow a plurality of modules to be attached to the surface 56. The attachment portions in this embodiment comprise magnets. For instance, permanent magnets such as rare earth based (e.g. Neodymium) magnets may be used. The magnets may he attached to, or embedded within the, surface 56.

Other kinds of <attachment portionsr tents are en isaged.

In one embodimenthook and oop attachment at achment portions naay be used (e.g. V lc appreciated that the hooks may be provided on the panel 50 for attachment to riding loops located on a surface of the module, or the arrangement may be reversed, with the loops located on the panel 50, for attachment to corresponding hooks located on the surface of the module.

In another embodiment, the attachment portions:mays comprise press-fit connections comprising an opening in the panel 50 for receivi ng a corresponding member extending from a surface of the module. It \All he appreciated that the arrangement may be reversed, with members located on the panel 50 for insertion into ponding openings provided in a surface of the module. The connection between the openings and the members may comprise a friction'fit (i.e. a press fit), e attachment portions 52 may be arranged in an aitiy. In the example sho: is 30 Figure 3, the attachment portions 52 are arranged in an oblong array. Various kinds of array envisaged, e.g. rectangular (e.g. oblong or square), triangular or hexagonal. The arrangement' of the adaeament portions 52 in an array may allow for tessellation of the aforementioned modules when they are attached to the surface 56, The geometry of the modules may be matched to the geometry of the array. For instance, the modules may have the same symmetry as the array, to facilitate their tessellation on the surface. By way of example, the modules may be rectangular (e.g. oblong or square) the case of a rectangular array as discussed below in relation to Figure 5, or may be triangular in the case of a triangular array, or may he hexagonal in the case of a hexagonal ana As part of he arrangement of the attachment portions 52 in an array, it is noted that the attachment portions may be grouped in clusters. Each cluster may be located at a respective lattice point of Examples of such clusters are shown in Figure 3. The cluster 54 in Figure 3, which is located at a corner of the oblong array in includes a single attachment portion 52, the cluster 55 in. Figure 3, which is located along a peripheral edge of the array includes two attachment portions 52, and the cluster 58 in Figure 3, which is located inside the array in includes four attachment portions 52. Similar principles may apply to square, triangular and hexagonal arrays of the attachment portions 52, Figures 4A and 413 show a module 60 o an embodiment of this disclosure.

diment, the module 60 has a first ("u pe major surface 64 for attachment to the surface 56 of the panel, and a second ("lower") major surface 62 on an opposite side of the module 60. Figure 4A shows the "top" of the module 60 (whereby the surface 6 visible), and Figure 4B shows the "bottom" of the module 60 (whereby the surface 62 is visible).

The module 60 has a housing, The housing may, 'or example, comprise metal 131 stie. One or more electronic components are" located inside theHhousing. The electronic nc s may, for mast tnce, comprise memory, a processor, storage, a battery, a card reader, an antenna for wireless connectivity, and/or an I/O interface. The electronic components may be used to enhance the functionality of the mobile computing device (the laptop 10, in this embodiment). Accordingly, the module 60, and other like modules, may be provided to enhance the battery life, processing power, storage space, ItO capa and/or cta. eeti ity of the mobile computing device.

The using in this embodiment includes the aforementioned first and second major surfaces 64, 62. The housing in this embodiment also includes one or more further surfaces, which may extend between the first and second major surfaces 64, 62 at a periphery of the housing, These further surtace(s) include first and second opposite side surfaces 66, 68, and 1.0 third and fi urth opposite side surfaces 70, /2, In the present embodiment the surfaces 70, 72 have a longer dimension than the surfaces 66, 68, and the surfaces 66, 68 are each orthogonal to the surf- 70, 72, providing the module 60 with an oblong pro lc. It w li be appreciated that the side surfaces of the housing may be configured differently in the case of modules that are rectangular {e.g. oblong or square) triangular or hexagonal, so as to match the symmetry of the array of attachment portions 52 provided on the panel 50. In the present embodiment, each surface of the housing is substantially planar, although this is not considered to be essential.

nodule 60 has at least one connector 80. Each connector 80 is provided at an outer surface of housing, to allow he module 60 to be connected to another module 60 of the same or similar kind. In this wa s 60 may be interconnected when they are o ted on the panel 50 ( e.g. in a tessellating aim The connectors 80 are electrical connectors that can allow power and data to be passed between the modules 60, The connectors SO may include any suitable kind of connector for transferring power and data. For instance, Universal Serial Bus (USH) connectors may he used.

embodiment, the module connectors 0, and each connector 80 is providedon a respective one of the side surfaces66. 68, 70, 72. It will be appreciated that in other embodiments, not all of the side surfaces 66, 68, 70, 72 of the housing may be provided with a connector 80. On the other hand, it will be appreciated that more than one connector 80 may be provided on each side surface 66, 68, 70, 72.

In this embodiment, each connector is located at a center of each side surface 66, 68, 70,14, of the housing, although again this is not considered essential. The arrangement of the connectors in this vay may nevertheless facilitate the interconnection of "a plurality of like modules 60 when they are provided in an (e.g. tessellating) arrangement on the panel 50.

I module 60 also includes at teas one attachment portion 82. Each attachment portion 8 embodiment is located at the second major surface 62. This can allow the attachment portions to line up with corresponding attachment portions 52 located on the panel 50, for attaching the module 60 to the panel 50, ttachment p 2 may thus be of a kind that is suitable for attaching to the 52 located on the panel 50. For instance, in the present corresponding attachment embodiment, the attachment ions 82 comprise magnets such as permanent magnets (e.g. rare earth based (e.g. Ncodynm um) magnets) of a kind similar to those provided on the panel in Figure 3. The magnets may be attached to, or embedded within the surface 64 Theattachment portions 82 may be arranged to line up with the corresponding attachment portions 52 on the panel 50. For instance, where the attachment, portions 52 are provided in an array, the attachment portions 82 may be arranged to match the symmetry and tospacing of the array. In the present embodiment, the attachment portions 82 are located at respective corners of the surface 64 for attaching to the corresponding attachment portions 52 of a single cell of the array of attachment portions 52 on the panel 50. However, it is the module may span more than one cell of the array of attachment portions 5: when when. it is at ached to the panel 50. Examples of this will be discussed below el Figure 5. In this embodiment, the attachment portions 82 are arranged in an ol n configuration. It wilt he appreciated that the attachment portions may he arranged in, for instance, a rectangular (e.g. oblong or square), triangular or hexagonal configuration according le configuration of the array of attachment portions 52 man the panel 50.

The module 60 may optionally include once or lore further attachment portions 84.

These further attachment portions 84 may be located on the side surfaces of the housing. For instance, in the present embodiment, the side surfaces 66, 68, 70, 72 are each provided with two fmther attachment portions 84. The further attachment portions 84 can be provided for attaching the module 60 to another like module 60 having corresponding attachment portions 84. This can provide additiotmal security for the modules 60 when they are mounted on the panel 50, since the modules 50 may be attached to the panel 50 and also attached to each other, The further attachment portions 84 may be configured similarly to the attachment portions 52, 82 -for instance the attachment portions in this embodiment comprise permanent magnets such as rare earth based (e.g. Neodymium) magnets. Again, the magnets 30 may be attached to, or embedded within the side surfaces of the housing.

mhodiments, the module 60 may include at least tine port for connecting h module to an external deviceother' than another like module By way of example, the ports may be serial or parallel ports. In one example, the portsinclude Universal Serial Bus ports e.g. USB-1 or t/SB-C) can allow the connectivity of die mobile co iputing device to he enhanced by providing anditional means by which to connect the mobile computing device to external devices (e.g. a mobile communications device (for providing o the device for charging the device), another mobile computing device such as a laptop, tablet or mobile communications device (for transferring data toffrom the other mobile computing device), printers, monitors, a wired local area network (LAN) or any other kind of external device).

Figure 5 shows a mobile computing device with a number of modules 60 attached to the substantially planar panel 50, according to an embodiment of this disclosure. Again, in this embodiment, the mobile computing device is a laptop, and the panel 50 and modules are substantially as described above in relation to Figures 1 to 4.

Figure 5 illustrates how the modules 60 n sseiate on the panel 50, and 'SW the connectors 80 may line up to a that in this example, three mock For instance, module 63 is twice power and data tc paxs between the modules 60. Note 61, 63, 65 arc sh Each module is of a different size.

odule 61, and module 65 is twice the size of module 63, The different sizes of the modules may provide a degree of flexihili accommodating the types of eicct: onic components described above. For instance, a la module such as module 65 may be appropriate fur housing a 1 module such as module 61 maq he appropriate for housing an 1/0 in zbercas a sma Module 61 in this example is of a similarconfiguration guration and size as the 60 described above in relation to Figures 4A and 4B, Module 63 is provided with more attachment portions than the module 61. and spans two cells of the array of attachment portions on the panel 50. The attachment portions on the module 63 may be positioned to line up isith the attachment portions 52 of two cells in the array, as can be seen in Figure 5.

is provided me portions than the module 61 a module 63, and spans four c array of att thment portions 52 on the panel 50.

Again, the attachment portions on module 6 s may be positioned to line up with the attachment portions 52 of four cells in the array, as rn be seen in Figure 5.

Module 61 in this example includes flour connectors 80, as described above in relation to Figures 4A and 413, The larger size of the modules 63, 65 in this example provides more space for the provision of connectors 80. In this example, module 63 includes six connectors, while modules 65 includes ten connectors 80, as shown in Figure 5, Note that the connectors on each size of module may be positioned to connect with corresponding connectors 80 of the other modules on the panel 50, even when differently sized modules are located next to each other. This may be achieved by spacing the connectors 80 (i.e. on the sides of the modules that have more than one connector 80) by a distance equal to the array spacing in that direction. For instance, in Haire 5, the longer sides of the module 65 each have four connectors 80 and the spacing re) between adjacent connectors 80 is the same as the distance between two adjacent lattice points in the array of attachment portions 52 on the panel 50 in that direction.

Figure 6 shows a mobile computing device with a number of modules 61, 63, 65 attached to the substantially planar panel, according to an embodiment of this disclosure. Again, in this embodiment, the mobile computing device is a laptop, and the panel 50 and modules are substantially as described above in relation to Figures 1 to 4.

Figure 6 illustrates the tessellating nature of the arrangement of modules 61, 63, 65. it will be appreciated that different arrangements of modules of different sizes may he provided on the panel 50, in a tessellating fashion. As in the example of Figure 5, the modules in this example are differently sized, in particular, there are four modules 61, two modules 63 and two modules 65 of the kind described above in relation to Figure 4. The connectors 80 described above can allow each module in the arrangement to communicate (transfer power and data) with each of its nearest neighbor modules.

In accordance with an embodiment of the invention, one of the modules may be provided with a port for connecting to the arrangement of modules on the panel with the mobile computing device. For instance, the port may be a Universal. Serial Bus (e.g. USB-B or USB-C) port, The connection between the port of the module and the mobile computing device may he implemented using an appropriate cable. This can allow Me mobile computing device to communicate with and send/receive power to/from the modules on the panel 50. As described above, the connectors ca allow power and data to pass between the I 4 modules, whereby the mobile computing device may communicate and send receiv=e power to/from the modules on the panel 50 through the module having the aforementioned port, and via the connectors go.

accordance an embodiment cf the invention, one of the 'aid les n ay configured to manage/control the other modules on the panel 50. For instance, the module nrol the routing of data through the modules and to and from the mobile computing device. The module may also control the routing of power between the modules and to/from thee mobile computing device, bearing in mind that one or more of the modules may comprise a battery module for enhancing the battery lifetime of the mobile coinputing device, As will be appreciated4 from the dese ption of for exit' tile, Figures 4A and 4B, the modules may be relatively flat (that is to say, the rdistance between the first and second major surfaces 62, 64 is smaller than the dimensions of the edges of each major surface 62, 64), This small form factor can allow the panel and modules to be installed with minimum impact on'the overall size of the mobile computing device.

In one embodiment, there may be provided a kit including a panel substantially of the kind described above, and one or more modules of the kind described above, The modules may include different kinds of etectroriie components. This Call allow a diverse range of additional functionality to be provided for the mobile computing device. For instance, one or more of the modules may include memory, one or more of the modules may include a processor, one or more of the modules may include storage, one or more of the modules may include or more of the modules may include a card reader, one or more of the 2 5 modules may include an antenna for wireless connectivity, and/or one or more of xs, may include an ItO interface. The electronic components in the modules may be selected according to the needs of the userr Accordingly, there has been described a mmodule for a mobile computing device. The module d housing. d, le also includes one or more electronic components located inside the housing. The module further includes at least one connector provided at an out ir surface of the housing for connecting the module to another module to allow power and data to be passed between the modules, The module also includes at least one attachment portion tor attaching the housing to a surface of a substantially planar panel having corresponding attachment portions. A substantially planar panel is attachable to an outer surface of a mobile computing device. The panel includes a first surface for attachment to the surface of the mobile computing device. l'he panel also includes a second surface having a plurality of attachment portions ibr attaching a plurality of the modules thereto. The panel :modules may be provided in a kit.

Although particular embodiments of this disclosure have been described, be appreciated that many modifications/additions and/or substitutions may be made the scope of the claims. C 'WS

Claims

A module for fora mobile.computing dev ce, the ms duleo pris g: a him& * one, or more electronic components located inside the housing; at least one connector provided at an outer surface of the housing for connecting the module to another module to ally ipower and data to he passed between the:modules; and one attachment portion attaching the housing to a surface substant_ally,planar panel having corresponding attachment, portions, The module of claim I comprising a plurality of said attachment portions located on a common surface of the housing, wherein the attachment portions are arranged in an array.The module of any preceding claim, whet-ein the housing comprises': first and second substantially planar major surfaces, wherein the ent portion or attachment portions istare located at one of said major surfaces; and at least one further surface extending between the major surfaces, wherein the st one connector is located at said further surface.The module of claim 4, comprising one or g further attachment portion s located at the at least one further surface for attaching tlpe module to another module having corresponding attachment portions.The module of claim 4 or claim 5, wherein ast one of he at least one further surface includes a plurality of said connectors, module of any preceding claim, NV.ereiu the attachment portions rprise magnets, The module of any preceding claim, wherein electronic ompone) located inside the housing include one or more of: memory; at lea a processor; storage; a battery; a card reader; an antenna for wireless connectivity; and an I/O interface, 8. The module of any preceding claim, wherein the housing further comprises at least one port for connecting the module to an external device other than another said module, 9 The module of any preceding claim, wherein a surface of the housing including said attachment portion or attachment portions is polyuonal in shape, to allow tessellation of a plurality of said modules when they are attached to the surface of the substantially planar panel.10. A substantially planar panel attachable to an outer surface of a mobile computing device, the panel comprising: a first surface for attachment to said surface of said mobile computing device; and a second surface including a plurality of attachment portions for attaching 'a plurality of thedideStiecording to any preceding:claim to the panel.The panel of claim 10, wherein the attachment portions are arranged in an array, to allow tessellation of a plurality of said modules when they are attached to the panel, The panel of claim 11, wherein the attachment portions comprise magnets, A kit comprising: at least one module according to any of claims 1 to 9; and a substantially planar panel according to any of claims 10 to 12. 11. 12. 13.14, A mobile computing device having an outer surface to which is attached the substantially planar panel of any of claims 10 to 12, wherein at least one module according to any of claims 1 to 9 is attached to the substantially planar panel.i5 The mobile computing device of claim 14, wherein the mobile computing device is a laptop, mobile telephone or tablet.OO417r T 20