WO2020258540A1 - 指纹识别模组及显示装置 - Google Patents

指纹识别模组及显示装置 Download PDF

Info

Publication number
WO2020258540A1
WO2020258540A1 PCT/CN2019/106646 CN2019106646W WO2020258540A1 WO 2020258540 A1 WO2020258540 A1 WO 2020258540A1 CN 2019106646 W CN2019106646 W CN 2019106646W WO 2020258540 A1 WO2020258540 A1 WO 2020258540A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
away
touch
substrate
identification module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/106646
Other languages
English (en)
French (fr)
Inventor
周永祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Publication of WO2020258540A1 publication Critical patent/WO2020258540A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to the field of display, in particular to a fingerprint identification module and a display device.
  • the ultrasonic fingerprint recognition technology has stronger environmental adaptability because it is not interfered by water and oil pollution, and can be used in more complex environments.
  • ultrasonic fingerprint recognition has gradually received widespread attention and has been increasingly used in various fields, such as improving the security of electronic products such as mobile phones, computers, tablets and access control systems.
  • fingerprint unlocking The rapidity of this brings a lot of convenience to people's lives.
  • the purpose of the present invention is to solve the problem that the excess heat of the existing ultrasonic fingerprint identification module diffuses to the piezoelectric film layer, which destroys the performance of the fingerprint module to transmit and receive ultrasonic waves; the excess heat will generate thermal current and increase the noise of fingerprint identification , Thereby affecting technical issues such as the accuracy of fingerprint recognition.
  • the present invention provides a fingerprint recognition module, including: an array substrate; a piezoelectric film layer provided on a surface of one side of the array substrate; and a touch display layer provided on the piezoelectric film layer The surface on the side far away from the array substrate; wherein the piezoelectric film layer includes: a heat insulation layer provided on the surface of the array substrate; and an insulation layer provided on the heat insulation layer far from the array substrate At the edge of one side; the first electrode layer is arranged on the surface of the insulating layer on the side away from the insulating layer; the piezoelectric material layer is arranged on the surface of the first electrode layer on the side away from the insulating layer And a second electrode layer, which is provided on the surface of the piezoelectric material layer away from the first electrode layer.
  • the material of the heat insulation layer includes silica gel or liquid metal.
  • the touch display layer includes: a first polarizer arranged on the surface of the piezoelectric film layer away from the array substrate; a first substrate layer arranged on the first polarizer away from the The surface on one side of the piezoelectric film layer; the first liquid crystal layer is arranged on the surface of the first substrate layer away from the first polarizer; the second substrate layer is arranged on the surface of the first liquid crystal layer away from the The surface on the side of the first substrate layer; the first touch layer is provided on the surface of the second substrate layer on the side away from the first liquid crystal layer; and the first polarizer is provided on the first touch layer The surface on the side away from the second substrate layer.
  • the touch display layer includes: a second polarizer, arranged on the surface of the piezoelectric film layer away from the array substrate; a third substrate layer, arranged on the second polarizer away from the The surface of the piezoelectric film layer; the second liquid crystal layer is provided on the surface of the third substrate layer away from the second polarizer; the second touch layer is provided on the second liquid crystal layer away from the surface The surface on the side of the third substrate layer; the fourth substrate layer is provided on the surface of the second touch layer away from the second liquid crystal layer; and the second polarizer is provided on the fourth substrate layer A surface away from the side of the second touch layer.
  • the touch display layer includes: a display layer, arranged on the surface of the piezoelectric film layer away from the array substrate; a second adhesive layer, arranged on the display layer away from the piezoelectric film layer A surface on one side; and a third touch layer disposed on the surface of the second adhesive layer away from the display layer.
  • the fingerprint recognition module further includes: a first adhesive layer, which is provided on the surface of the polarizer on a side away from the touch layer; and a protective layer, which is provided on the first adhesive layer away from the touch layer The surface on one side.
  • the material of the first electrode layer and the second electrode layer includes at least one of silver, aluminum, molybdenum, gold, chromium, nickel, copper, and platinum.
  • the material of the piezoelectric material layer includes at least one of aluminum nitride, lead zirconate titanate, polyvinylidene fluoride, and polyvinylidene fluoride-trifluoroethylene copolymer.
  • the material of the protective layer includes any one of glass, sapphire, and transparent polymer materials.
  • the present invention also provides a display device including the above fingerprint identification module.
  • the technical effect of the present invention is that a heat insulation layer is added on the surface of the piezoelectric film layer near the side of the array substrate to absorb excess heat, improve the heat dissipation of the fingerprint identification module, protect the fingerprint module, and increase the service life of the fingerprint module And the stability of the device.
  • FIG. 1 is a schematic diagram of the fingerprint identification module according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic diagram of the piezoelectric film layer according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic diagram of another fingerprint identification module according to Embodiment 2 of the present invention.
  • FIG. 4 is a schematic diagram of the fingerprint identification module according to Embodiment 3 of the present invention.
  • a first polarizer 302, a first substrate layer; 303, a first liquid crystal layer; 304, a second substrate layer; 305, a first touch layer; 306, a first polarizer;
  • Second polarizer 312, third substrate layer; 313, second liquid crystal layer; 314, second touch layer; 315, fourth substrate layer; 316, second polarizer;
  • the component can be directly placed on the other component; there may also be an intermediate component on which the component is placed , And the intermediate component is placed on another component.
  • a component is described as “installed to” or “connected to” another component, both can be understood as directly “installed” or “connected”, or a component is “installed to” or “connected to” through an intermediate component Another component.
  • This embodiment provides a first display device, which includes a first fingerprint identification module.
  • the first fingerprint recognition module includes an array substrate 1, a piezoelectric film layer 2, a touch display layer 3, a first adhesive layer 4 and a protective layer 5.
  • the array substrate 1 is the circuit layer of the display panel, including the gate electrode and the source and drain electrodes, and provides circuit support for the display panel to control the opening and closing of the pixel area.
  • the piezoelectric thin film layer 2 is provided on the upper surface of the array substrate 1.
  • the piezoelectric thin film layer 1 senses the voltage from the array substrate 1, the piezoelectric thin film layer 2 vibrates at a high frequency and generates ultrasonic waves. In this process, electric energy is converted Into mechanical energy, more than 90% of the energy loss is converted into heat energy.
  • the piezoelectric thin film layer 2 includes a heat insulation layer 21, an insulation layer 22, a first electrode layer 23, a piezoelectric material layer 24 and a second electrode layer 25.
  • the heat insulation layer 21 is provided on the upper surface of the array substrate 1 and can be directly formed into a film on the upper surface of the array substrate 1.
  • the heat insulation layer 21 may be heat-dissipating silica gel or liquid metal heat-conducting heat sink.
  • the silica gel and the heat sink have excellent properties.
  • the heat dissipation capacity can absorb and diffuse the excess energy.
  • the heat insulation layer 21 is very thin and does not occupy additional space, so it will not affect the first fingerprint identification module.
  • the heat insulation layer 21 is preferably silica gel.
  • the silica gel can be directly purchased or self-made.
  • the self-made method of silica gel specifically includes steps S1 to S5.
  • the first reaction liquid preparation step is to add 100 parts of vinyl silicone oil, 3-8 parts of methyl silicone oil, 7-15 parts of hydrogen-containing silicone oil, 500-800 parts of zinc oxide and 40-100 parts of alumina into the stirred tank, Stir for 1.5 to 2 hours at a temperature of 60 to 80° C. and a rotation speed of 300 r to 500 rpm to form a first reaction liquid.
  • the second reaction liquid preparation step after stirring uniformly, add 3-8 parts fumed silica and 2-5 parts silane coupling agent to the first reaction liquid at a temperature of 60-80°C and a rotation speed of 300r ⁇ Stir at 500 rpm for 30-50 minutes to obtain a second reaction liquid.
  • the second reaction liquid is cooled to room temperature, 0.5 to 1.2 parts of catalyst are added, and stirred at a rotation speed of 150r to 180rpm for 30 to 45 minutes.
  • S4 is a vacuuming step, where the vacuum degree is less than -0.09MPa, the bubbles are removed, and the paste is obtained.
  • S5 curing step calender the paste in the middle of the PET film into a sheet with a thickness of 0.5 to 5.0 mm, cut it into the required size, and cure for 1 to 1.5 hours at a temperature of 140 to 150°C to obtain silica gel .
  • the heat insulation layer 21 is used to insulate the array substrate 1 and the piezoelectric film layer 2.
  • the heat insulation layer 21 insulates excess heat, improves the heat dissipation of the fingerprint recognition module, and prevents the heat from entering the piezoelectric film layer 2 after diffusion. Into the piezoelectric film layer 2, it will affect the performance of the piezoelectric film layer 2, thereby destroying the performance of the fingerprint identification module to transmit and receive ultrasonic waves, and the piezoelectric materials are all pyroelectric materials, and the excess heat will increase the first fingerprint
  • the noise of the recognition module affects the accuracy of fingerprint recognition.
  • a heat insulation layer 21 is added to protect the piezoelectric film layer 2, thereby improving the recognition effect of the first fingerprint recognition module, improving the stability of the first fingerprint recognition module, and extending the first fingerprint recognition module.
  • the service life of a fingerprint recognition module is added to protect the piezoelectric film layer 2, thereby improving the recognition effect of the first fingerprint recognition module, improving the stability of the first fingerprint recognition module, and extending the first fingerprint recognition module.
  • the insulating layer 22 is arranged on the upper surface of the insulating layer 21 and on the edge of the insulating layer 21, leaving a cavity in the middle.
  • the cavity provides space for the vibration of the piezoelectric film layer 2 to prevent vibration during vibration. This causes problems such as separation between the film layers, and at the same time, the insulating layer 22 plays an insulating role to prevent the subsequent electrode layer and the array substrate 1 from short-circuiting.
  • the material of the insulating layer 22 includes insulating materials such as butyl rubber, acrylic rubber, nitrile rubber, silicone rubber, polyurethane, polyvinyl chloride, and epoxy resin.
  • the above-mentioned materials have a wide operating temperature range, which can meet the operating requirements in the range of -50 to 200 °C.
  • the insulating material is cheap, the molding process is simple, and the manufacturing cost is low.
  • the first electrode layer 23 is provided on the upper surface of the insulating layer 22.
  • the material of the first electrode layer 23 includes silver (Ag), aluminum (Al), molybdenum (Mo), gold (Au), chromium (Cr), nickel (Ni) ), at least one of copper (Cu) and platinum (Pt).
  • the piezoelectric material layer 24 is provided on the upper surface of the first electrode layer 23.
  • the material of the piezoelectric material layer 24 includes aluminum nitride (AlN), lead zirconate titanate (PZT), polyvinylidene fluoride (PVDF), and copolymers. At least one of polyvinylidene fluoride-trifluoroethylene copolymer (P(VDF-TrFE)).
  • the second electrode layer 25 is provided on the upper surface of the piezoelectric material layer 24.
  • the material of the second electrode layer 25 includes silver (Ag), aluminum (Al), molybdenum (Mo), gold (Au), chromium (Cr), and nickel. At least one of (Ni), copper (Cu), and platinum (Pt).
  • the touch display layer 3 is provided on the upper surface of the piezoelectric film layer 2.
  • the touch display layer 3 is used for touch and display.
  • the touch layer in this embodiment is in cell touch.
  • the touch display layer 3 includes a first polarizer 301, a first substrate layer 302, a first liquid crystal layer 303, a second substrate layer 304, a first touch layer 305, and a first polarizer 306.
  • the first polarizer 301 is provided on the upper surface of the piezoelectric film layer 2, and the first polarizer 301 has good polarization properties.
  • the first substrate layer 302 is provided on the upper surface of the first polarizer 301, and the material of the first substrate layer 302 is glass, which is used for film formation of subsequent film layers.
  • the first liquid crystal layer 303 is provided on the upper surface of the first substrate layer 302.
  • the liquid crystal layer 303 is used for display and can be directly formed on the first substrate layer 302.
  • the second substrate layer 304 is provided on the upper surface of the first liquid crystal layer 303, and the material of the second substrate layer 304 is glass, which is used for forming the subsequent film layer.
  • the first touch layer 305 is provided on the upper surface of the first substrate layer 304.
  • the first touch layer 305 is used for touch control and can be directly formed on the second substrate layer 304.
  • the first polarizer 305 is disposed on the upper surface of the first touch layer 304, and the first polarizer 305 plays a role of polarizing light to ensure a good display effect.
  • the protective layer 5 is bonded to the first polarizing plate 305 through the first adhesive layer 4.
  • the protective layer 5 is made of a light-transmitting material, including any one of glass, sapphire, and transparent polymer materials.
  • the protective layer 5 is used to protect the touch display layer 3.
  • the technical effect of the first fingerprint display module in this embodiment is that high-frequency vibration occurs in the piezoelectric film layer to form ultrasonic waves, and a large amount of heat is generated in the process of converting electrical energy into mechanical energy, which increases on the lower surface of the piezoelectric film layer.
  • Heat insulation layer the heat insulation layer can isolate excess heat, prevent heat from entering the piezoelectric film layer, improve the heat dissipation of the first fingerprint identification module, and avoid affecting the first fingerprint display module to transmit and receive ultrasonic waves The performance protects the first fingerprint identification module, thereby improving the service life and stability of the first fingerprint identification module.
  • This embodiment provides a second display device, and the display device includes a second fingerprint identification module.
  • the second fingerprint recognition module includes an array substrate 1, a piezoelectric film layer 2, a touch display layer 3, a first adhesive layer 4 and a protective layer 5.
  • the array substrate 1 is the circuit layer of the display panel, including the gate electrode and the source and drain electrodes, and provides circuit support for the display panel to control the opening and closing of the pixel area.
  • the piezoelectric thin film layer 2 is provided on the upper surface of the array substrate 1.
  • the piezoelectric thin film layer 1 senses the voltage from the array substrate 1, the piezoelectric thin film layer 2 vibrates at a high frequency and generates ultrasonic waves. In this process, electric energy is converted Into mechanical energy, more than 90% of the energy loss is converted into heat energy.
  • the piezoelectric thin film layer 2 includes a heat insulation layer 21, an insulation layer 22, a first electrode layer 23, a piezoelectric material layer 24 and a second electrode layer 25.
  • the heat insulation layer 21 is provided on the upper surface of the array substrate 1 and can be directly formed into a film on the upper surface of the array substrate 1.
  • the heat insulation layer 21 may be heat-dissipating silica gel or liquid metal heat-conducting heat sink.
  • the silica gel and the heat sink have excellent properties.
  • the heat dissipation capacity can absorb and diffuse the excess energy.
  • the heat insulation layer 21 is very thin and does not occupy additional space, so it will not affect the first fingerprint identification module.
  • the heat insulation layer 21 is preferably silica gel.
  • the silica gel can be directly purchased or self-made.
  • the self-made method of silica gel specifically includes steps S1 to S5.
  • the first reaction liquid preparation step is to add 100 parts of vinyl silicone oil, 3-8 parts of methyl silicone oil, 7-15 parts of hydrogen-containing silicone oil, 500-800 parts of zinc oxide and 40-100 parts of alumina into the stirred tank, Stir for 1.5 to 2 hours at a temperature of 60 to 80° C. and a rotation speed of 300 r to 500 rpm to form a first reaction liquid.
  • the second reaction liquid preparation step after stirring uniformly, add 3-8 parts fumed silica and 2-5 parts silane coupling agent to the first reaction liquid at a temperature of 60-80°C and a rotation speed of 300r ⁇ Stir at 500 rpm for 30-50 minutes to obtain a second reaction liquid.
  • the second reaction liquid is cooled to room temperature, 0.5 to 1.2 parts of catalyst are added, and stirred at a rotation speed of 150r to 180rpm for 30 to 45 minutes.
  • S4 is a vacuuming step, where the vacuum degree is less than -0.09MPa, the bubbles are removed, and the paste is obtained.
  • S5 curing step calender the paste in the middle of the PET film into a sheet with a thickness of 0.5 to 5.0 mm, cut it into the required size, and cure for 1 to 1.5 hours at a temperature of 140 to 150°C to obtain silica gel .
  • the heat insulation layer 21 is used to insulate the array substrate 1 and the piezoelectric film layer 2, and the heat insulation layer 21 insulates excess heat, improves the heat dissipation of the second fingerprint recognition module, and prevents heat from entering the piezoelectric film layer 2 after diffusion If the heat diffuses into the piezoelectric film layer 2, it will affect the performance of the piezoelectric film layer 2, thereby destroying the performance of the fingerprint recognition module to transmit and receive ultrasonic waves.
  • the piezoelectric materials are all thermoelectric materials, and the excess heat will increase fingerprints
  • the noise of the recognition module affects the accuracy of fingerprint recognition. Therefore, in this embodiment, a heat insulation layer 21 is added to protect the piezoelectric film layer 2, thereby improving the recognition effect of the fingerprint recognition module, improving the stability of the fingerprint recognition module, and prolonging the service life of the fingerprint recognition module.
  • the insulating layer 22 is arranged on the upper surface of the insulating layer 21 and on the edge of the insulating layer 21, leaving a cavity in the middle.
  • the cavity provides space for the vibration of the piezoelectric film layer 2 to prevent vibration during vibration. This causes problems such as separation between the film layers, and at the same time, the insulating layer 22 plays an insulating role to prevent the subsequent electrode layer and the array substrate 1 from short-circuiting.
  • the material of the insulating layer 22 includes insulating materials such as butyl rubber, acrylic rubber, nitrile rubber, silicone rubber, polyurethane, polyvinyl chloride, and epoxy resin.
  • the above-mentioned materials have a wide operating temperature range, which can meet the operating requirements in the range of -50 to 200 °C.
  • the insulating material is cheap, the molding process is simple, and the manufacturing cost is low.
  • the first electrode layer 23 is provided on the upper surface of the insulating layer 22.
  • the material of the first electrode layer 23 includes silver (Ag), aluminum (Al), molybdenum (Mo), gold (Au), chromium (Cr), nickel (Ni) ), at least one of copper (Cu) and platinum (Pt).
  • the piezoelectric material layer 24 is provided on the upper surface of the first electrode layer 23.
  • the material of the piezoelectric material layer 24 includes aluminum nitride (AlN), lead zirconate titanate (PZT), polyvinylidene fluoride (PVDF), and copolymers. At least one of polyvinylidene fluoride-trifluoroethylene copolymer (P(VDF-TrFE)).
  • the second electrode layer 25 is provided on the upper surface of the piezoelectric material layer 24.
  • the material of the second electrode layer 25 includes silver (Ag), aluminum (Al), molybdenum (Mo), gold (Au), chromium (Cr), and nickel. At least one of (Ni), copper (Cu), and platinum (Pt).
  • the touch display layer 3 is provided on the upper surface of the piezoelectric film layer 2, and the touch display layer 3 is used for touch and display.
  • the touch layer in this embodiment is on cell touch.
  • the touch display layer 3 includes a second polarizer 311, a third substrate layer 312, a second liquid crystal layer 313, a second touch layer 314, a fourth substrate layer 315, and a second polarizer 316.
  • the second polarizer 311 is disposed on the upper surface of the piezoelectric film layer 2, and the second polarizer 311 has good polarization properties.
  • the third substrate layer 312 is provided on the upper surface of the second polarizer 311, and the material of the third substrate layer 312 is glass, which is used for forming a subsequent film layer.
  • the second liquid crystal layer 313 is disposed on the upper surface of the third substrate layer 312.
  • the second liquid crystal layer 313 is used for display and can be directly formed on the third substrate layer 312.
  • the second touch layer 314 is disposed on the upper surface of the second liquid crystal layer 313.
  • the second touch layer 314 is used for touch control and can be directly formed on the second liquid crystal layer 313.
  • the fourth substrate layer 315 is provided on the upper surface of the second touch layer 314, and the material of the fourth substrate layer 315 is glass, which is used for film formation of subsequent film layers.
  • the second polarizer 316 is disposed on the upper surface of the fourth substrate layer 315, and the second polarizer 316 plays a role of polarizing light to ensure a good display effect.
  • the protective layer 5 is adhered to the second polarizing plate 316 through the first adhesive layer 4.
  • the protective layer 5 is made of a light-transmitting material, including any one of glass, sapphire, and transparent polymer materials.
  • the protective layer 5 is used to protect the touch display layer 3.
  • the technical effect of the first fingerprint display module in this embodiment is that high-frequency vibration occurs in the piezoelectric film layer to form ultrasonic waves, and a large amount of heat is generated in the process of converting electrical energy into mechanical energy, which increases on the lower surface of the piezoelectric film layer.
  • Heat insulation layer the heat insulation layer can isolate excess heat, prevent heat from entering the piezoelectric film layer, improve the heat dissipation of the first fingerprint identification module, and avoid affecting the first fingerprint display module to transmit and receive ultrasonic waves The performance protects the first fingerprint identification module, thereby improving the service life and stability of the first fingerprint identification module.
  • This embodiment provides a third display device, and the display device includes a third fingerprint identification module.
  • the third fingerprint recognition module includes an array substrate 1, a piezoelectric film layer 2, a touch display layer 3, a first adhesive layer 4 and a protective layer 5.
  • the array substrate 1 is the circuit layer of the display panel, including the gate electrode and the source and drain electrodes, and provides circuit support for the display panel to control the opening and closing of the pixel area.
  • the piezoelectric thin film layer 2 is provided on the upper surface of the array substrate 1.
  • the piezoelectric thin film layer 1 senses the voltage from the array substrate 1, the piezoelectric thin film layer 2 vibrates at a high frequency and generates ultrasonic waves. In this process, electric energy is converted Into mechanical energy, more than 90% of the energy loss is converted into heat energy.
  • the piezoelectric thin film layer 2 includes a heat insulation layer 21, an insulation layer 22, a first electrode layer 23, a piezoelectric material layer 24 and a second electrode layer 25.
  • the heat insulation layer 21 is provided on the upper surface of the array substrate 1 and can be directly formed into a film on the upper surface of the array substrate 1.
  • the heat insulation layer 21 may be heat-dissipating silica gel or liquid metal heat-conducting heat sink.
  • the silica gel and the heat sink have excellent properties.
  • the heat dissipation capacity can absorb and diffuse the excess energy.
  • the heat insulation layer 21 is very thin and does not occupy additional space, so it will not affect the first fingerprint identification module.
  • the heat insulation layer 21 is preferably silica gel.
  • the silica gel can be directly purchased or self-made.
  • the self-made method of silica gel specifically includes steps S1 to S5.
  • the first reaction liquid preparation step is to add 100 parts of vinyl silicone oil, 3-8 parts of methyl silicone oil, 7-15 parts of hydrogen-containing silicone oil, 500-800 parts of zinc oxide and 40-100 parts of alumina into the stirred tank, Stir for 1.5 to 2 hours at a temperature of 60 to 80° C. and a rotation speed of 300 r to 500 rpm to form a first reaction liquid.
  • the second reaction liquid preparation step after stirring uniformly, add 3-8 parts fumed silica and 2-5 parts silane coupling agent to the first reaction liquid at a temperature of 60-80°C and a rotation speed of 300r ⁇ Stir at 500 rpm for 30-50 minutes to obtain a second reaction liquid.
  • the second reaction liquid is cooled to room temperature, 0.5 to 1.2 parts of catalyst are added, and stirred at a rotation speed of 150r to 180rpm for 30 to 45 minutes.
  • S4 is a vacuuming step, where the vacuum degree is less than -0.09MPa, the bubbles are removed, and the paste is obtained.
  • S5 curing step calender the paste in the middle of the PET film into a sheet with a thickness of 0.5 to 5.0 mm, cut it into the required size, and cure for 1 to 1.5 hours at a temperature of 140 to 150°C to obtain silica gel .
  • the heat insulation layer 21 is used to absorb excess heat, improve the heat dissipation of the third fingerprint recognition module, and prevent the heat from entering the piezoelectric film layer 2 after diffusion. If the heat diffuses into the piezoelectric film layer 2, it will affect the pressure The performance of the electrical thin film layer 2 destroys the performance of transmitting and receiving ultrasonic waves of the third fingerprint identification module, and the piezoelectric materials are all thermoelectric materials, and excess heat will increase the noise of the third fingerprint identification module, thereby Affect the accuracy of the third fingerprint recognition. Therefore, in this embodiment, a heat insulation layer 21 is added to protect the piezoelectric film layer 2, thereby improving the recognition effect of the third fingerprint recognition module, improving the stability of the third fingerprint recognition module, and extending the first fingerprint recognition module. The service life of three fingerprint recognition modules.
  • the insulating layer 22 is arranged on the upper surface of the insulating layer 21 and on the edge of the insulating layer 21, leaving a cavity in the middle.
  • the cavity provides space for the vibration of the piezoelectric film layer 2 to prevent vibration during vibration. This causes problems such as separation between the film layers, and at the same time, the insulating layer 22 plays an insulating role to prevent the subsequent electrode layer and the array substrate 1 from short-circuiting.
  • the material of the insulating layer 22 includes insulating materials such as butyl rubber, acrylic rubber, nitrile rubber, silicone rubber, polyurethane, polyvinyl chloride, and epoxy resin.
  • the above-mentioned materials have a wide operating temperature range, which can meet the operating requirements in the range of -50 to 200 °C.
  • the insulating material is cheap, the molding process is simple, and the manufacturing cost is low.
  • the first electrode layer 23 is provided on the upper surface of the insulating layer 22.
  • the material of the first electrode layer 23 includes silver (Ag), aluminum (Al), molybdenum (Mo), gold (Au), chromium (Cr), nickel (Ni) ), at least one of copper (Cu) and platinum (Pt).
  • the piezoelectric material layer 24 is provided on the upper surface of the first electrode layer 23.
  • the material of the piezoelectric material layer 24 includes aluminum nitride (AlN), lead zirconate titanate (PZT), polyvinylidene fluoride (PVDF), and copolymers. At least one of polyvinylidene fluoride-trifluoroethylene copolymer (P(VDF-TrFE)).
  • the second electrode layer 25 is provided on the upper surface of the piezoelectric material layer 24.
  • the material of the second electrode layer 25 includes silver (Ag), aluminum (Al), molybdenum (Mo), gold (Au), chromium (Cr), and nickel. At least one of (Ni), copper (Cu), and platinum (Pt).
  • the touch display layer 3 is provided on the upper surface of the piezoelectric film layer 2, and the touch display layer 3 is used for touch and display.
  • the touch layer in this embodiment is on cell touch.
  • the touch display layer 3 includes a display layer 321, a second adhesive layer 322, and a third touch layer 323.
  • the touch mode in this embodiment is an integrated touch structure (OGS).
  • the display layer 321 is provided on the upper surface of the piezoelectric film layer 2.
  • the display layer 321 is used for display, including pixel areas, data lines, scan lines, etc., which are all prior art and will not be described in detail here.
  • the third touch layer 323 is bonded to the display layer 321 through the second adhesive layer 322, and the third touch layer 323 is used for touch.
  • the protective layer 5 is bonded to the third touch layer 323 through the first adhesive layer 4.
  • the protective layer 5 is made of a light-transmitting material, including any one of glass, sapphire, and transparent polymer materials.
  • the protective layer 5 is used to protect the touch display layer 3.
  • the technical effect of the first fingerprint display module in this embodiment is that high-frequency vibration occurs in the piezoelectric film layer to form ultrasonic waves, and a large amount of heat is generated in the process of converting electrical energy into mechanical energy, which increases on the lower surface of the piezoelectric film layer.
  • Heat insulation layer the heat insulation layer can isolate excess heat, prevent heat from entering the piezoelectric film layer, improve the heat dissipation of the first fingerprint identification module, and avoid affecting the first fingerprint display module to transmit and receive ultrasonic waves The performance protects the first fingerprint identification module, thereby improving the service life and stability of the first fingerprint identification module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Optics & Photonics (AREA)
  • Multimedia (AREA)
  • Image Input (AREA)
  • Position Input By Displaying (AREA)

Abstract

一种指纹识别模组及显示装置，所述指纹识别模组包括阵列基板(1)、压电薄膜层(2)、显示层以及触控层(3)；其中，所述压电薄膜层(2)包括：隔热层(21)、绝缘层(22)、第一电极层(23)，设于所述绝缘层(22)远离所述隔热层(21)一侧的表面以及第二电极层(25)。其效果在于，在压电薄膜层(2)靠近阵列基板(1)一侧的表面增加隔热层(21)，吸收多余的热量，提高指纹识别模组的散热性，保护指纹模组，提高指纹模组的使用寿命以及器件的稳定性。

Description

指纹识别模组及显示装置 技术领域
本发明涉及显示领域，特别涉及一种指纹识别模组及显示装置。
 背景技术
目前，超声波指纹识别技术由于不受水和油污干扰，具有更强的环境适应能力，可以用于更加复杂的环境。从而超声波指纹识别逐渐得到广泛的重视，被越来越多地被用于各个领域，如提升手机、电脑、平板和门禁系统等电子产品的安全性，相比于传统的数字密码，由于指纹解锁的快速性，给人们的生活带来很多的便利。
但是当前超声波指纹传感器的性能并不尽如人意。给压电薄膜层输入电能，使其转换成机械能发生高频振动，从而发生超声波；当超声波发射回来，也会引起压电薄膜层的振动，再转换成电能，这个能量转换的效率很低，通常低于10%。在能量的转换过程中会有大量的能量损失，转换成热能。所产生的热能会破坏指纹模组的性能，使其逐渐失效。
 技术问题
本发明的目的在于，解决现有的超声波指纹识别模组多余的热量扩散到压电薄膜层，破坏指纹模组发射和接收超声波的性能；多余的热量会产生热电流，增大指纹识别的噪声，从而影响指纹识别的精度等技术问题。
 技术解决方案
为实现上述目的，本发明提供一种指纹识别模组，包括：阵列基板；压电薄膜层，设于所述阵列基板一侧的表面；以及触控显示层，设于所述压电薄膜层远离所述阵列基板一侧的表面；其中，所述压电薄膜层包括：隔热层，设于所述阵列基板一侧的表面；绝缘层，设于所述隔热层远离所述阵列基板一侧的边缘处；第一电极层，设于所述绝缘层远离所述隔热层一侧的表面；压电材料层，设于所述第一电极层远离所述绝缘层一侧的表面；以及第二电极层，设于所述压电材料层远离所述第一电极层一侧的表面。
进一步地，所述隔热层的材质包括硅胶或液态金属。
进一步地，所述触控显示层包括：第一偏光片，设于所述压电薄膜层远离所述阵列基板一侧的表面；第一衬底层，设于所述第一偏光片远离所述压电薄膜层一侧的表面；第一液晶层，设于所述第一衬底层远离所述第一偏光片一侧的表面；第二衬底层，设于所述第一液晶层远离所述第一衬底层一侧的表面；第一触控层，设于所述第二衬底层远离所述第一液晶层一侧的表面；以及第一偏光板，设于所述第一触控层远离所述第二衬底层一侧的表面。
进一步地，所述触控显示层包括：第二偏光片，设于所述压电薄膜层远离所述阵列基板一侧的表面；第三衬底层，设于所述第二偏光片远离所述压电薄膜层一侧的表面；第二液晶层，设于所述第三衬底层远离所述第二偏光片一侧的表面；第二触控层，设于所述第二液晶层远离所述第三衬底层一侧的表面；第四衬底层，设于所述第二触控层远离所述第二液晶层一侧的表面；以及第二偏光板，设于所述第四衬底层远离所述第二触控层一侧的表面。
进一步地，所述触控显示层包括：显示层，设于所述压电薄膜层远离所述阵列基板一侧的表面；第二胶层，设于所述显示层远离所述压电薄膜层一侧的表面；以及第三触控层，设于所述第二胶层远离所述显示层一侧的表面。
进一步地，所述指纹识别模组还包括：第一胶层，设于偏光板远离所述触控层一侧的表面；以及保护层，设于所述第一胶层远离所述触控层一侧的表面。
进一步地，所述第一电极层及所述第二电极层的材质包括银、铝、钼、金、铬、镍、铜、铂中的至少一种。
进一步地，所述压电材料层的材质包括氮化铝、锆钛酸铅、聚偏氟乙烯、聚偏氟乙烯－三氟乙烯共聚物中的至少一种。
进一步地，所述保护层的材质包括玻璃、蓝宝石、透明高分子材料中的任一种。
为实现上述目的，本发明还提供一种显示装置，包括上述指纹识别模组。
 有益效果
本发明的技术效果在于，在压电薄膜层靠近阵列基板一侧的表面增加隔热层，吸收多余的热量，提高指纹识别模组的散热性，保护指纹模组，提高指纹模组的使用寿命以及器件的稳定性。
 附图说明
图1为本发明实施例1所述的指纹识别模组的示意图；
图2为本发明实施例1所述的压电薄膜层的示意图；
图3为本发明实施例2所述的另一种指纹识别模组的示意图；
图4为本发明实施例3所述的指纹识别模组的示意图。
部分组件标识如下：
1、阵列基板；2、压电薄膜层；3、触控显示层；4、第一胶层；5、保护层；
21、隔热层；22、绝缘层；23、第一电极层；24、压电材料层；25、第二电极层；
301、第一偏光片；302、第一衬底层；303、第一液晶层；304、第二衬底层；305、第一触控层；306、第一偏光板；
311、第二偏光片；312、第三衬底层；313、第二液晶层；314、第二触控层；315、第四衬底层；316、第二偏光板；
321、显示层；322、第二胶层；323、第三触控层。
 本发明的最佳实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是附图中的方向，本文所使用的方向用语是用来解释和说明本发明，而不是用来限定本发明的保护范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的，本发明并没有限定每个组件的尺寸和厚度。
当某些组件，被描述为“在”另一组件“上”时，所述组件可以直接置于所述另一组件上；也可以存在一中间组件，所述组件置于所述中间组件上，且所述中间组件置于另一组件上。当一个组件被描述为“安装至”或“连接至”另一组件时，二者可以理解为直接“安装”或“连接”，或者一个组件通过一中间组件“安装至”或“连接至”另一个组件。
实施例1
本实施例提供第一种显示装置，所述显示装置包括第一指纹识别模组。
如图1所示，所述第一指纹识别模组包括阵列基板1、压电薄膜层2、触控显示层3、第一胶层4及保护层5。
阵列基板1为显示面板的电路层，包括栅极及源漏极，给显示面板提供电路支持，用以控制像素区的开启和关闭。
压电薄膜层2设于阵列基板1的上表面，当压电薄膜层1感应到来自阵列基板1的电压后，压电薄膜层2发生高频振动，产生超声波，在这个过程中，电能转换成机械能，有90%以上的能量损失，转换成热能。
如图2所示，压电薄膜层2包括隔热层21、绝缘层22、第一电极层23、压电材料层24及第二电极层25。
隔热层21设于阵列基板1的上表面，可直接在阵列基板1的上表面成膜，隔热层21可为散热硅胶或液态金属导热散热片，所述硅胶与所述散热片具有优良的散热能力，可将多余的能量吸收和扩散出去。隔热层21很薄，不占据额外的空间，因此不会对所述第一指纹识别模组产生影响。
在本实施例中，隔热层21优选为硅胶，硅胶可直接购买或自制，硅胶自制方法具体包括步骤S1~S5。
S1第一反应液制备步骤，将100份乙烯基硅油，3～8份甲基硅油，7～15份含氢硅油，500～800份氧化锌及40～100份氧化铝加入到搅拌釜中，在温度为60～80℃，转速为300r～500rpm下搅拌1.5～2小时，形成第一反应液。S2第二反应液制备步骤，搅拌均匀后在所述第一反应液中加入3～8份气相二氧化硅与2～5份硅烷偶联剂，在温度为60～80℃，转速为300r～500rpm下搅拌30～50分钟，得到第二反应液。S3催化步骤，将所述第二反应液冷却到室温，加入0.5～1.2份催化剂，在转速150r～180rpm下搅拌30～45分钟。S4抽真空步骤，其中真空度小于-0.09MPa，脱去气泡，得到膏状料。S5固化步骤，将所述膏状料在PET膜中间压延成0.5～5.0毫米厚度的片状，裁切成所需大小，在140～150℃的温度条件下，固化1～1.5小时，得到硅胶。
隔热层21用以隔绝阵列基板1与压电薄膜层2，隔热层21隔绝多余的热量，提高指纹识别模组的散热性，防止热量扩散后进入压电薄膜层2内，若热量扩散进入压电薄膜层2，则会影响压电薄膜层2的性能，从而破坏指纹识别模组发射和接收超声波的性能，且压电材料都为热电材料，多余的热量会增加所述第一指纹识别模组的噪声，从而影响指纹识别的精准性。所以在本实施例中增加隔热层21来保护压电薄膜层2，进而改善所述第一指纹识别模组的识别效果，提高所述第一指纹识别模组的稳定性，延长所述第一指纹识别模组的使用寿命。
绝缘层22设于隔热层21的上表面，且设于隔热层21的边缘处，中间留有空腔，所述空腔为压电薄膜层2的振动提供空间，防止在振动过程中造成膜层间的脱离等问题，同时绝缘层22起到绝缘作用，防止后续的电极层与阵列基板1产生短路问题。绝缘层22的材质包括丁基橡胶、丙烯酸酯橡胶、丁腈橡胶和硅橡胶、聚氨酯、聚氯乙烯和环氧树脂等绝缘材料。上述各种材料的使用温度范围很宽，可以满足-50～200°C范围内的使用要求。并且绝缘材料价格便宜，成型加工工艺简单，使用制造成本低廉。
第一电极层23设于绝缘层22的上表面，第一电极层23的材质包括银（Ag）、铝（Al）、钼（Mo）、金（Au）、铬（Cr）、镍（Ni）、铜（Cu）、铂（Pt）中的至少一种。
压电材料层24设于第一电极层23的上表面，压电材料层24的材质包括氮化铝（AlN），锆钛酸铅（PZT），聚偏氟乙烯（PVDF）、共聚物为聚偏氟乙烯－三氟乙烯共聚物（P(VDF-TrFE)）中的至少一种。
第二电极层25设于压电材料层24的上表面，第二电极层25的材质包括银（Ag）、铝（Al）、钼（Mo）、金（Au）、铬（Cr）、镍（Ni）、铜（Cu）、铂（Pt）中的至少一种。
触控显示层3设于压电薄膜层2的上表面，触控显示层3用以触控及显示，本实施例中的触控层为in cell触控。
在本实施例中，触控显示层3包括第一偏光片301、第一衬底层302、第一液晶层303、第二衬底层304、第一触控层305及第一偏光板306。
第一偏光片301设于压电薄膜层2的上表面，第一偏光片301具有良好的偏光性。
第一衬底层302设于第一偏光片301的上表面，第一衬底层302的材质为玻璃，用作后续膜层的成膜。
第一液晶层303设于第一衬底层302的上表面，液晶层303用以显示，可直接在第一衬底层302上成膜。
第二衬底层304设于第一液晶层303的上表面，第二衬底层304的材质为玻璃，用作后续膜层的成膜。
第一触控层305设于第一衬底层304的上表面，第一触控层305用以触控，可直接在第二衬底层304上成膜。
第一偏光板305设于第一触控层304的上表面，第一偏光板305起到偏光作用，保证良好的显示效果。
保护层5通过第一胶层4粘合至第一偏光板305。保护层5的材质为透光材料，包括玻璃、蓝宝石、透明高分子材料中的任一种，保护层5用以保护触控显示层3。
本实施例所述第一指纹显示模组的技术效果在于，在压电薄膜层发生高频振动形成超声波，在电能转换为机械能的过程中会产生大量热量，在压电薄膜层的下表面增加隔热层，所述隔热层能隔绝多余的热量，防止热量进入压电薄膜层，提高所述第一指纹识别模组的散热性，避免影响所述第一指纹显示模组发射和接收超声波的性能，保护所述第一指纹识别模组，进而提高所述第一指纹识别模组的使用寿命以及稳定性。
实施例2
本实施例提供第二种显示装置，所述显示装置包括第二指纹识别模组。
如图3所示，所述第二指纹识别模组包括阵列基板1、压电薄膜层2、触控显示层3、第一胶层4及保护层5。
阵列基板1为显示面板的电路层，包括栅极及源漏极，给显示面板提供电路支持，用以控制像素区的开启和关闭。
压电薄膜层2设于阵列基板1的上表面，当压电薄膜层1感应到来自阵列基板1的电压后，压电薄膜层2发生高频振动，产生超声波，在这个过程中，电能转换成机械能，有90%以上的能量损失，转换成热能。
如图2所示，压电薄膜层2包括隔热层21、绝缘层22、第一电极层23、压电材料层24及第二电极层25。
隔热层21设于阵列基板1的上表面，可直接在阵列基板1的上表面成膜，隔热层21可为散热硅胶或液态金属导热散热片，所述硅胶与所述散热片具有优良的散热能力，可将多余的能量吸收和扩散出去。隔热层21很薄，不占据额外的空间，因此不会对所述第一指纹识别模组产生影响。
在本实施例中，隔热层21优选为硅胶，硅胶可直接购买或自制，硅胶自制方法具体包括步骤S1~S5。
S1第一反应液制备步骤，将100份乙烯基硅油，3～8份甲基硅油，7～15份含氢硅油，500～800份氧化锌及40～100份氧化铝加入到搅拌釜中，在温度为60～80℃，转速为300r～500rpm下搅拌1.5～2小时，形成第一反应液。S2第二反应液制备步骤，搅拌均匀后在所述第一反应液中加入3～8份气相二氧化硅与2～5份硅烷偶联剂，在温度为60～80℃，转速为300r～500rpm下搅拌30～50分钟，得到第二反应液。S3催化步骤，将所述第二反应液冷却到室温，加入0.5～1.2份催化剂，在转速150r～180rpm下搅拌30～45分钟。S4抽真空步骤，其中真空度小于-0.09MPa，脱去气泡，得到膏状料。S5固化步骤，将所述膏状料在PET膜中间压延成0.5～5.0毫米厚度的片状，裁切成所需大小，在140～150℃的温度条件下，固化1～1.5小时，得到硅胶。
隔热层21用以隔绝阵列基板1与压电薄膜层2，隔热层21隔绝多余的热量，提高所述第二指纹识别模组的散热性，防止热量扩散后进入压电薄膜层2内，若热量扩散进入压电薄膜层2，则会影响压电薄膜层2的性能，从而破坏指纹识别模组发射和接收超声波的性能，且压电材料都为热电材料，多余的热量会增加指纹识别模组的噪声，从而影响指纹识别的精准性。所以在本实施例中增加隔热层21来保护压电薄膜层2，进而改善指纹识别模组的识别效果，提高指纹识别模组的稳定性，延长指纹识别模组的使用寿命。
绝缘层22设于隔热层21的上表面，且设于隔热层21的边缘处，中间留有空腔，所述空腔为压电薄膜层2的振动提供空间，防止在振动过程中造成膜层间的脱离等问题，同时绝缘层22起到绝缘作用，防止后续的电极层与阵列基板1产生短路问题。绝缘层22的材质包括丁基橡胶、丙烯酸酯橡胶、丁腈橡胶和硅橡胶、聚氨酯、聚氯乙烯和环氧树脂等绝缘材料。上述各种材料的使用温度范围很宽，可以满足-50～200°C范围内的使用要求。并且绝缘材料价格便宜，成型加工工艺简单，使用制造成本低廉。
第一电极层23设于绝缘层22的上表面，第一电极层23的材质包括银（Ag）、铝（Al）、钼（Mo）、金（Au）、铬（Cr）、镍（Ni）、铜（Cu）、铂（Pt）中的至少一种。
压电材料层24设于第一电极层23的上表面，压电材料层24的材质包括氮化铝（AlN），锆钛酸铅（PZT），聚偏氟乙烯（PVDF）、共聚物为聚偏氟乙烯－三氟乙烯共聚物（P(VDF-TrFE)）中的至少一种。
第二电极层25设于压电材料层24的上表面，第二电极层25的材质包括银（Ag）、铝（Al）、钼（Mo）、金（Au）、铬（Cr）、镍（Ni）、铜（Cu）、铂（Pt）中的至少一种。
触控显示层3设于压电薄膜层2的上表面，触控显示层3用以触控及显示，本实施例中的触控层为on cell触控。
在本实施例中，触控显示层3包括第二偏光片311、第三衬底层312、第二液晶层313、第二触控层314、第四衬底层315及第二偏光板316。
第二偏光片311设于压电薄膜层2的上表面，第二偏光片311具有良好的偏光性。
第三衬底层312设于第二偏光片311的上表面，第三衬底层312的材质为玻璃，用作后续膜层的成膜。
第二液晶层313设于第三衬底层312的上表面，第二液晶层313用以显示，可直接在第三衬底层312上成膜。
第二触控层314设于第二液晶层313的上表面，第二触控层314用以触控，可直接在第二液晶层313上成膜。
第四衬底层315设于第二触控层314的上表面，第四衬底层315的材质为玻璃，用作后续膜层的成膜。
第二偏光板316设于第四衬底层315的上表面，第二偏光板316起到偏光作用，保证良好的显示效果。
保护层5通过第一胶层4粘合至第二偏光板316。保护层5的材质为透光材料，包括玻璃、蓝宝石、透明高分子材料中的任一种，保护层5用以保护触控显示层3。
本实施例所述第一指纹显示模组的技术效果在于，在压电薄膜层发生高频振动形成超声波，在电能转换为机械能的过程中会产生大量热量，在压电薄膜层的下表面增加隔热层，所述隔热层能隔绝多余的热量，防止热量进入压电薄膜层，提高所述第一指纹识别模组的散热性，避免影响所述第一指纹显示模组发射和接收超声波的性能，保护所述第一指纹识别模组，进而提高所述第一指纹识别模组的使用寿命以及稳定性。
实施例3
本实施例提供第三种显示装置，所述显示装置包括第三指纹识别模组。
如图4所示，所述第三指纹识别模组包括阵列基板1、压电薄膜层2、触控显示层3、第一胶层4及保护层5。
阵列基板1为显示面板的电路层，包括栅极及源漏极，给显示面板提供电路支持，用以控制像素区的开启和关闭。
压电薄膜层2设于阵列基板1的上表面，当压电薄膜层1感应到来自阵列基板1的电压后，压电薄膜层2发生高频振动，产生超声波，在这个过程中，电能转换成机械能，有90%以上的能量损失，转换成热能。
如图2所示，压电薄膜层2包括隔热层21、绝缘层22、第一电极层23、压电材料层24及第二电极层25。
隔热层21设于阵列基板1的上表面，可直接在阵列基板1的上表面成膜，隔热层21可为散热硅胶或液态金属导热散热片，所述硅胶与所述散热片具有优良的散热能力，可将多余的能量吸收和扩散出去。隔热层21很薄，不占据额外的空间，因此不会对所述第一指纹识别模组产生影响。
在本实施例中，隔热层21优选为硅胶，硅胶可直接购买或自制，硅胶自制方法具体包括步骤S1~S5。
S1第一反应液制备步骤，将100份乙烯基硅油，3～8份甲基硅油，7～15份含氢硅油，500～800份氧化锌及40～100份氧化铝加入到搅拌釜中，在温度为60～80℃，转速为300r～500rpm下搅拌1.5～2小时，形成第一反应液。S2第二反应液制备步骤，搅拌均匀后在所述第一反应液中加入3～8份气相二氧化硅与2～5份硅烷偶联剂，在温度为60～80℃，转速为300r～500rpm下搅拌30～50分钟，得到第二反应液。S3催化步骤，将所述第二反应液冷却到室温，加入0.5～1.2份催化剂，在转速150r～180rpm下搅拌30～45分钟。S4抽真空步骤，其中真空度小于-0.09MPa，脱去气泡，得到膏状料。S5固化步骤，将所述膏状料在PET膜中间压延成0.5～5.0毫米厚度的片状，裁切成所需大小，在140～150℃的温度条件下，固化1～1.5小时，得到硅胶。
隔热层21用以吸收多余的热量，提高所述第三指纹识别模组的散热性，防止热量扩散后进入压电薄膜层2内，若热量扩散进入压电薄膜层2，则会影响压电薄膜层2的性能，从而破坏所述第三指纹识别模组发射和接收超声波的性能，且压电材料都为热电材料，多余的热量会增加所述第三指纹识别模组的噪声，从而影响所述第三指纹识别的精准性。所以在本实施例中增加隔热层21来保护压电薄膜层2，进而改善所述第三指纹识别模组的识别效果，提高所述第三指纹识别模组的稳定性，延长所述第三指纹识别模组的使用寿命。
绝缘层22设于隔热层21的上表面，且设于隔热层21的边缘处，中间留有空腔，所述空腔为压电薄膜层2的振动提供空间，防止在振动过程中造成膜层间的脱离等问题，同时绝缘层22起到绝缘作用，防止后续的电极层与阵列基板1产生短路问题。绝缘层22的材质包括丁基橡胶、丙烯酸酯橡胶、丁腈橡胶和硅橡胶、聚氨酯、聚氯乙烯和环氧树脂等绝缘材料。上述各种材料的使用温度范围很宽，可以满足-50～200°C范围内的使用要求。并且绝缘材料价格便宜，成型加工工艺简单，使用制造成本低廉。
第一电极层23设于绝缘层22的上表面，第一电极层23的材质包括银（Ag）、铝（Al）、钼（Mo）、金（Au）、铬（Cr）、镍（Ni）、铜（Cu）、铂（Pt）中的至少一种。
压电材料层24设于第一电极层23的上表面，压电材料层24的材质包括氮化铝（AlN），锆钛酸铅（PZT），聚偏氟乙烯（PVDF）、共聚物为聚偏氟乙烯－三氟乙烯共聚物（P(VDF-TrFE)）中的至少一种。
第二电极层25设于压电材料层24的上表面，第二电极层25的材质包括银（Ag）、铝（Al）、钼（Mo）、金（Au）、铬（Cr）、镍（Ni）、铜（Cu）、铂（Pt）中的至少一种。
触控显示层3设于压电薄膜层2的上表面，触控显示层3用以触控及显示，本实施例中的触控层为on cell触控。
在本实施例中，触控显示层3包括显示层321、第二胶层322及第三触控层323，本实施例中的触控模式为一体化触控结构（OGS）。
显示层321设于压电薄膜层2的上表面，显示层321用以显示，包括像素区、数据线、扫描线等，都为现有技术，在此不作具体阐述。
第三触控层323通过第二胶层322粘合至显示层321，第三触控层323用以触控。
保护层5通过第一胶层4粘合至第三触控层323。保护层5的材质为透光材料，包括玻璃、蓝宝石、透明高分子材料中的任一种，保护层5用以保护触控显示层3。
本实施例所述第一指纹显示模组的技术效果在于，在压电薄膜层发生高频振动形成超声波，在电能转换为机械能的过程中会产生大量热量，在压电薄膜层的下表面增加隔热层，所述隔热层能隔绝多余的热量，防止热量进入压电薄膜层，提高所述第一指纹识别模组的散热性，避免影响所述第一指纹显示模组发射和接收超声波的性能，保护所述第一指纹识别模组，进而提高所述第一指纹识别模组的使用寿命以及稳定性。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种指纹识别模组，其包括：
    阵列基板；
    压电薄膜层，设于所述阵列基板一侧的表面；以及
    触控显示层，设于所述压电薄膜层远离所述阵列基板一侧的表面；
    其中，所述压电薄膜层包括：
    隔热层，设于所述阵列基板一侧的表面；
    绝缘层，设于所述隔热层远离所述阵列基板一侧的边缘处；
    第一电极层，设于所述绝缘层远离所述隔热层一侧的表面；
    压电材料层，设于所述第一电极层远离所述绝缘层一侧的表面；以及
    第二电极层，设于所述压电材料层远离所述第一电极层一侧的表面。
  2. 如权利要求1所述的指纹识别模组，其中，
    所述隔热层的材质包括硅胶或液态金属。
  3. 如权利要求1所述的指纹识别模组，其中，
    所述触控显示层包括：
    第一偏光片，设于所述压电薄膜层远离所述阵列基板一侧的表面；
    第一衬底层，设于所述第一偏光片远离所述压电薄膜层一侧的表面；
    第一液晶层，设于所述第一衬底层远离所述第一偏光片一侧的表面；
    第二衬底层，设于所述第一液晶层远离所述第一衬底层一侧的表面；
    第一触控层，设于所述第二衬底层远离所述第一液晶层一侧的表面；以及
    第一偏光板，设于所述第一触控层远离所述第二衬底层一侧的表面。
  4. 如权利要求1所述的指纹识别模组，其中，
    所述触控显示层包括：
    第二偏光片，设于所述压电薄膜层远离所述阵列基板一侧的表面；
    第三衬底层，设于所述第二偏光片远离所述压电薄膜层一侧的表面；
    第二液晶层，设于所述第三衬底层远离所述第二偏光片一侧的表面；
    第二触控层，设于所述第二液晶层远离所述第三衬底层一侧的表面；
    第四衬底层，设于所述第二触控层远离所述第二液晶层一侧的表面；以及
    第二偏光板，设于所述第四衬底层远离所述第二触控层一侧的表面。
  5. 如权利要求1所述的指纹识别模组，其中，
    所述触控显示层包括：
    显示层，设于所述压电薄膜层远离所述阵列基板一侧的表面；
    第二胶层，设于所述显示层远离所述压电薄膜层一侧的表面；以及
    第三触控层，设于所述第二胶层远离所述显示层一侧的表面。
  6. 如权利要求1所述的指纹识别模组，其还包括：
    第一胶层，设于偏光板远离所述触控层一侧的表面；以及
    保护层，设于所述第一胶层远离所述触控层一侧的表面。
  7. 如权利要求1所述的指纹识别模组，其中，
    所述第一电极层及所述第二电极层的材质包括银、铝、钼、金、铬、镍、铜、铂中的至少一种。
  8. 如权利要求1所述的指纹识别模组，其中，
    所述压电材料层的材质包括氮化铝、锆钛酸铅、聚偏氟乙烯、聚偏氟乙烯－三氟乙烯共聚物中的至少一种。
  9. 如权利要求6所述的指纹识别模组，其中，
    所述保护层的材质包括玻璃、蓝宝石、透明高分子材料中的任一种。
  10. 一种显示装置，包括如权利要求1所述的指纹识别模组。
PCT/CN2019/106646 2019-06-25 2019-09-19 指纹识别模组及显示装置 Ceased WO2020258540A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910554076.1 2019-06-25
CN201910554076.1A CN110348334A (zh) 2019-06-25 2019-06-25 指纹识别模组及显示装置

Publications (1)

Publication Number Publication Date
WO2020258540A1 true WO2020258540A1 (zh) 2020-12-30

Family

ID=68183060

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/106646 Ceased WO2020258540A1 (zh) 2019-06-25 2019-09-19 指纹识别模组及显示装置

Country Status (2)

Country Link
CN (1) CN110348334A (zh)
WO (1) WO2020258540A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105226186A (zh) * 2015-10-10 2016-01-06 深圳市华星光电技术有限公司 柔性显示装置的制作方法及制得的柔性显示装置
CN106527792A (zh) * 2016-10-25 2017-03-22 上海天马微电子有限公司 显示面板及显示装置
CN107145858A (zh) * 2017-05-02 2017-09-08 上海思立微电子科技有限公司 电子设备、超声波指纹识别装置及其制造方法
WO2019005498A1 (en) * 2017-06-26 2019-01-03 Qualcomm Incorporated DIGITAL ULTRASOUND FINGER SENSOR FOR SUB-DISPLAY APPLICATIONS

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558876B (zh) * 2011-12-29 2013-09-25 深圳德邦界面材料有限公司 一种低成本的散热硅胶片及其制备方法
US10216978B2 (en) * 2014-08-26 2019-02-26 Gingy Technology Inc. Fingerprint identification device and fingerprint identification method
CN109492468A (zh) * 2017-09-12 2019-03-19 南昌欧菲生物识别技术有限公司 显示模组及其制造方法与电子装置
CN208000613U (zh) * 2018-03-31 2018-10-23 中国石油大学(华东) 一种基于物联网的智能指纹考勤设备
CN109643378B (zh) * 2018-11-20 2024-01-26 深圳市汇顶科技股份有限公司 超声换能器件及电子装置
CN109492623B (zh) * 2018-12-28 2021-03-16 武汉华星光电技术有限公司 超声波指纹识别模组及显示面板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105226186A (zh) * 2015-10-10 2016-01-06 深圳市华星光电技术有限公司 柔性显示装置的制作方法及制得的柔性显示装置
CN106527792A (zh) * 2016-10-25 2017-03-22 上海天马微电子有限公司 显示面板及显示装置
CN107145858A (zh) * 2017-05-02 2017-09-08 上海思立微电子科技有限公司 电子设备、超声波指纹识别装置及其制造方法
WO2019005498A1 (en) * 2017-06-26 2019-01-03 Qualcomm Incorporated DIGITAL ULTRASOUND FINGER SENSOR FOR SUB-DISPLAY APPLICATIONS

Also Published As

Publication number Publication date
CN110348334A (zh) 2019-10-18

Similar Documents

Publication Publication Date Title
US11120243B2 (en) Fingerprint identification module, manufacturing method and driving method thereof, display device
US11247234B2 (en) Ultrasonic fingerprint recognition module and display panel
CN109244108B (zh) 一种oled显示基板及其制作方法、oled显示装置
US11134334B2 (en) Sounding device, manufacturing method thereof and display device
WO2023206916A1 (zh) 超声波指纹识别装置和电子设备
CN110351402B (zh) 一种显示模组、移动终端
CN109829419A (zh) 指纹识别模组及其驱动方法和制作方法、显示装置
WO2020252889A1 (zh) 屏幕发声显示装置
WO2020215628A1 (zh) 自发声显示装置
CN110276325B (zh) 超声波指纹识别组件、超声波指纹识别器件和显示装置
CN110187538B (zh) 显示装置
US11320685B2 (en) Liquid crystal display module and mobile terminal
CN107403129A (zh) 超声波指纹识别模组、超声波指纹识别器件及电子设备
CN111711900B (zh) 显示面板及其制造方法、显示装置
CN111613648B (zh) 显示装置及其制造方法
CN207182329U (zh) 电子设备
CN110764641A (zh) 显示面板及显示装置
TW202004550A (zh) 面板結構
CN111384134A (zh) 显示装置
WO2020211279A1 (zh) 超声波指纹识别模组及包括其的显示面板
CN111276521A (zh) 一种柔性显示模组和显示装置
WO2020258540A1 (zh) 指纹识别模组及显示装置
WO2020232934A1 (zh) 显示面板构造及电子装置
WO2020133719A1 (zh) 指纹识别传感模组和显示面板
CN111950324A (zh) 一种超声波传感器及其制作方法和显示面板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19935616

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19935616

Country of ref document: EP

Kind code of ref document: A1