WO2020258271A1 - 柔性显示屏及其制作方法、显示面板 - Google Patents

柔性显示屏及其制作方法、显示面板 Download PDF

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Publication number
WO2020258271A1
WO2020258271A1 PCT/CN2019/093788 CN2019093788W WO2020258271A1 WO 2020258271 A1 WO2020258271 A1 WO 2020258271A1 CN 2019093788 W CN2019093788 W CN 2019093788W WO 2020258271 A1 WO2020258271 A1 WO 2020258271A1
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WIPO (PCT)
Prior art keywords
layer
flexible display
display screen
pixel unit
substrate
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PCT/CN2019/093788
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English (en)
French (fr)
Inventor
王帅
Original Assignee
深圳市柔宇科技有限公司
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to PCT/CN2019/093788 priority Critical patent/WO2020258271A1/zh
Priority to CN201980079827.7A priority patent/CN113330597A/zh
Publication of WO2020258271A1 publication Critical patent/WO2020258271A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the embodiments of the present application relate to the field of display technology, in particular to a flexible display screen, a manufacturing method thereof, and a display panel.
  • OLED screens Due to its unique advantages, flexible OLED screens have been widely used in various electronic devices in recent years. Different from traditional LCD materials, the light-emitting materials in OLED devices are usually polymers or small organic molecules, and the cathode materials are usually low in work function. Active metals such as magnesium and aluminum. These luminescent materials and cathode materials are very sensitive to water vapor and oxygen. The penetration of water and oxygen will greatly reduce the lifespan and product yield of OLED devices. In order to achieve commercialization, the service life and stability of OLED devices According to the requirements of performance, OLED devices are usually flexibly packaged.
  • the embodiments of the present application aim to provide a flexible display screen, a manufacturing method thereof, and a display panel, so as to solve the technical problem that the edge of the existing packaging area is likely to be the origin of cracks.
  • a flexible display screen including:
  • a substrate, the substrate is provided with pixel units
  • a crack prevention part, the crack prevention part surrounds the pixel unit and is formed on the substrate, and the crack prevention part and the pixel unit form an encapsulation area;
  • a thin film encapsulation layer the thin film encapsulation layer is deposited in the encapsulation area, and when the crack prevention part is used for deposition, it prevents the deposition material of the thin film encapsulation layer from diffusing out of the encapsulation area.
  • the height of the crack prevention part is greater than the height of the pixel unit.
  • the flexible display screen further includes a moisture absorption part formed between the film packaging layer and the crack prevention part.
  • a groove is formed between the crack prevention part and the film packaging layer, and the moisture absorption part is formed in the groove.
  • the surface of the moisture absorption portion away from the substrate is flush with the surface of the film packaging layer away from the substrate.
  • the side of the moisture absorption part away from the crack prevention part is attached to the side of the film packaging layer
  • the thin film encapsulation layer includes a plurality of barrier layers and a plurality of depletion layers, and a plurality of the barrier layers and a plurality of the depletion layers are alternately formed in the deposition area, and one of the barrier layers or One of the depression layers is formed on the pixel unit.
  • the thickness of the barrier layer and/or the depression layer at any position in the packaging area is the same.
  • each of the barrier layers and/or each of the depletion layers are attached to the side surfaces of the anti-cracking portion close to the pixel unit.
  • the flexible display screen further includes a barrier structure that surrounds the pixel unit and is formed on the substrate, and the barrier structure is attached to the crack prevention portion away from the pixel unit. side.
  • the barrier structure includes several water blocking parts and several crack blocking parts, and the several water blocking parts and the several crack blocking parts alternately surround the pixel unit and are formed on the substrate in turn.
  • a side surface of one of the water blocking parts or one of the crack blocking parts is attached to a side surface of the crack preventing part away from the pixel unit.
  • a display panel including: a first protective layer
  • An extruded deformation layer, the extruded deformation layer is located on the first protective layer;
  • the flexible display screen is located on a side of the squeezed deformation layer away from the first protective layer;
  • a second protective layer where the second protective layer is located on a side of the flexible display screen away from the first protective layer;
  • the pressure sensor is located between the second protective layer and the squeeze deformation layer.
  • a method for manufacturing a flexible display screen including:
  • the crack prevention portion surrounds the pixel unit and is formed on the substrate, and the crack prevention portion and the pixel unit form an encapsulation area;
  • a mask process is used to deposit a thin-film packaging layer in the packaging area, and during deposition, the anti-crack portion prevents the deposition material of the thin-film packaging layer from diffusing out of the packaging area.
  • the method further includes:
  • a moisture absorption part is formed between the film encapsulation layer and the crack prevention part.
  • a barrier structure is formed on the side of the anti-cracking portion away from the pixel unit, and the barrier structure surrounds the pixel unit and is formed on the substrate.
  • the mask process is used to deposit the
  • the deposition material of the thin-film encapsulation layer can be prevented from diffusing out of the encapsulation area, and the diffusion area generated by the mask process can be eliminated, thereby eliminating the origin of cracks.
  • the flexible display is bent When the screen is not easily cracked, the flexible display screen has a good protective effect, and the use performance of the flexible display screen is improved.
  • FIG. 1 is a schematic structural diagram of a flexible display screen provided by one of the embodiments of the present application.
  • FIG. 2 is a schematic structural diagram of a flexible display screen shown in another embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a flexible display screen shown in another embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a flexible display screen shown in another embodiment of the present application.
  • Fig. 5 is a flowchart of a method for manufacturing a flexible display screen provided by one embodiment of the present application.
  • the flexible display screen 100 includes a substrate 20, a pixel unit 40, an anti-cracking portion 60 and a thin film packaging layer 80.
  • the substrate 20 is provided with pixel units 40, and the number of the pixel units 40 can be arbitrarily set to multiple according to actual conditions, and a plurality of the pixel units 40 can be arranged in an array.
  • the pixel unit 40 can also be replaced by a driving unit, a touch unit, a display unit, etc., and various types of units or modules provided on the substrate 20 are sensitive to water vapor and oxygen. Encapsulation protection is required.
  • the anti-cracking portion 60 surrounds the pixel unit 40 and is formed on the substrate 20, the anti-cracking portion 60 can be arranged around the pixel unit 40 at a predetermined distance, and the anti-cracking portion 60 can also be directly attached to the pixel unit 40. It is attached to and arranged around the pixel unit 40.
  • the crack prevention part 60 is a tetragon
  • the crack prevention part 60 may be a hollow cylinder or a hollow tetragon
  • the hollow cylinder or the hollow tetragonal crack prevention part is separated by a predetermined distance (10- 20um) is arranged on the substrate 20 around the square pixel unit.
  • the shape and position of the anti-crack portion 60 can be arbitrarily set as needed, as long as the anti-crack portion 60 surrounds the pixel unit 40 and is formed on the substrate 20.
  • the crack prevention portion 60 and the pixel unit 40 form an encapsulation area 10, and when the crack prevention portion 60 is arranged around the pixel unit 40 at a predetermined distance, the encapsulation area 10 includes the crack prevention portion 60
  • the space area between the pixel unit 40 and the pixel unit 40 also includes an upper area of the pixel unit 40 facing away from the substrate 20.
  • the space area and the upper area together form the packaging area 10.
  • the packaging area 10 is only the upper area of the pixel unit 40 facing away from the substrate 20 .
  • the thin film encapsulation layer 80 is deposited in the encapsulation area 10, and when the crack prevention portion 60 is used for deposition, it prevents the deposition material of the thin film encapsulation layer 80 from diffusing out of the encapsulation area 10.
  • the diffusion area can extend hundreds of ⁇ m, and the diffusion area is more than 80% smaller than the required thickness of the normal thin film encapsulation layer 80. Because the thickness of the diffusion area is thin, the diffusion area is easy to It becomes the origin of cracks. When the flexible display screen 100 is bent, cracks are prone to occur at the origin of the cracks. The cracks start from the origin of the cracks and extend to the entire screen, causing irreversible damage to the flexible display screen 100 , Affecting the use of products.
  • the height of the anti-cracking portion 60 is greater than the height or thickness of the pixel unit 40, and when the height of the anti-cracking portion 60 is greater than the height of the pixel unit 40,
  • the mask is attached to the side of the crack prevention part 60 away from the substrate 20, and then the deposition material is deposited on In the packaging area 10, due to the blocking effect of the anti-crack portion 60, it can be ensured that the deposition material is only deposited into the packaging area 10, and the deposition material is prevented from diffusing out of the packaging area 10, thereby eliminating The diffusion area produced by the mask process eliminates the origin of cracks.
  • the flexible display screen 100 is bent, it is not easy to produce cracks, which has a good protective effect on the flexible display screen 100 and improves The performance of the flexible display screen 100 is described.
  • the anti-crack portion 60 when the anti-crack portion 60 is not provided, when the deposition material of the thin-film encapsulation layer 80 is deposited by the mask process, the diffusion area formed during the deposition process can extend hundreds of ⁇ m, even up to the millimeter level. It is not conducive to a narrow frame design.
  • the anti-crack portion 60 is provided to eliminate the diffusion area, so that the frame width can be appropriately reduced as needed to achieve a narrow frame design.
  • plasma enhanced chemical vapor deposition Pulsma Enhanced Chemical Vapor DeposiSion: PECVD
  • low pressure chemical vapor deposition Low Pressure Chemical Vapor DeposiSion: LPCVD
  • atmospheric pressure chemical vapor deposition ASmospheric Pressure Chemical Vapor DeposiSion: APCVD
  • electronic cyclotron resonance chemical vapor deposition ElecSron CycloSron Resonance Chemical Vapor DeposiSion: ECR-CVD
  • the deposition method can be selected as required, as long as the deposition method requires a mask.
  • the material of the substrate 20 may be one of organic polymers such as polyimide, polyimide, polycarbonate, polyethylene terephthalate, and polyethersulfone substrate.
  • the substrate 20 can be made of other different flexible materials as needed, for example: thermoplastic semi-crystalline polymers, such as PET, PEN, and PEEK, which have good transparency, low thermal expansion coefficient, and good resistance. Water resistance to oxygen, and the price is relatively cheap; non-crystalline thermoplastic polymers, such as PC, PES, which are made by solvent injection or melt injection molding, have better optical transparency and higher glass transition temperature, when PC, When the thickness of the PES film reaches 0.1mm, the transmittance in the visible light range can reach over 85%.
  • the flexible display screen 100 further includes a buffer layer 50, the buffer layer 50 is disposed on the side of the substrate 20 close to the encapsulated film layer 80, the buffer layer 50 can be effective , Which prevents water and oxygen from corroding the pixel unit 40.
  • the buffer layer 50 can be a single layer or a stack of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and the like.
  • the pixel unit 40 includes a driving circuit, a pixel electrode, an organic light-emitting element, a common electrode, a gate line, a data line, etc.
  • the driving circuit includes a thin film transistor located on an island, and the drain of the thin film transistor is The pixel electrode is connected, the pixel electrode is electrically connected to one side of the organic light emitting element, and the opposite side of the organic light emitting element is electrically connected to the common electrode.
  • the driving circuit supplies current to the organic light-emitting element through the turned-on thin film transistor and pixel electrode, so that the organic light-emitting element emits light and displays the screen.
  • the pixel unit 40 and the substrate 20 are packaged with non-conductive adhesive (NCA) technology.
  • the non-conductive adhesive is a material that does not contain conductive particles.
  • NCP Non-conductive adhesive
  • NCF non-conductive film
  • the non-conductive adhesive is a non-conductive film, and the non-conductive film is attached between the pixel unit 40 and the substrate 20.
  • the pressure causes the bumps of the pixel unit 40 to penetrate the non-conductive film directly below it and directly contact the corresponding circuit of the substrate 20, thereby achieving electrical connection.
  • the non-conductive film is cured by heat, and its shrinkage can fix the direct contact between the bumps of the pixel unit 40 and the printed lines.
  • the curing shrinkage of the non-conductive film at a certain temperature can not only ensure a stable electrical connection between the pixel unit 40 and the substrate 20, but also provide a certain mechanical connection, which ensures good bonding performance of the package from these two aspects. .
  • the material of the anti-cracking portion 60 can be an inorganic material, such as one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride.
  • the material of the anti-cracking part 60 can also be an organic material, such as epoxy resin, acrylic resin, polyimide resin, polyethylene naphthalate, polyethylene terephthalate. One or more.
  • the thin film encapsulation layer 80 is used to encapsulate the pixel unit 40 and block the corrosion of the pixel unit 40 by external water and oxygen.
  • the pixel unit 40 is an OLED pixel unit 40
  • the light-emitting material in the pixel unit 40 is usually a polymer or small organic molecules
  • the cathode material is usually an active metal with a low work function, such as magnesium aluminum.
  • the luminescent material and the cathode material are very sensitive to water vapor and oxygen, and the penetration of water and oxygen will greatly reduce the life of the pixel unit 40. Therefore, the pixel unit 40 needs to be packaged to avoid corrosion of the pixel unit 40 by external water and oxygen.
  • the thin film encapsulation layer 80 includes a plurality of barrier layers 82 and a plurality of depletion layers 84, and a plurality of the barrier layers 82 and a plurality of the depletion layers 84 are alternately formed in the deposition area, and one of the barrier layers 82 Or one of the depression layers 84 is formed on the pixel unit 40.
  • the barrier layer 82 is used to block water and oxygen.
  • the material of the barrier layer 82 can be one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride.
  • the depletion layer 84 is provided to cover the defects of the barrier layer 82 to achieve planarization and release the barrier layer 82. Between the stress, realize flexible packaging.
  • the material of the depletion layer 84 may be one or more of epoxy resin, acrylic resin, polyimide resin, polyethylene naphthalate, and polyethylene terephthalate .
  • the mask process is used to deposit the barrier layer 82 and/or the depression layer 84, since the anti-crack portion 60 is arranged around the pixel unit 40, the mask process is used to deposit the barrier layer 82 and /Or when the depression layer 84 is used, a mask is attached to the side of the anti-crack portion 60 away from the substrate 20, so as to ensure that the deposition material is only deposited in the packaging area 10, and each The side surfaces of each of the barrier layers 82 and/or each of the depletion layers 84 are attached to the side surface of the crack prevention portion 60 close to the pixel unit 40. Therefore, the diffusion area generated by the mask process can be eliminated, thereby eliminating the origin of cracks. When the flexible display screen 100 is bent, cracks are not easily generated, which has a good protective effect on the flexible display screen 100. The use performance of the flexible display screen 100 is improved.
  • the anti-crack portion 60 is arranged around the pixel unit 40, when the barrier layer 82 and/or the de-trapping layer 84 is deposited by a mask process, the mask is attached to the anti-crack The portion 60 is away from the side of the substrate 20, and makes the openings on the mask face the deposition area.
  • the barrier layer 82 and/or the depletion layer 84 can be placed on the package The thickness corresponding to any position in the region 10 is the same. Therefore, the diffusion area generated by the mask process can be eliminated, thereby eliminating the origin of cracks.
  • the flexible display screen 100 is bent, cracks are not easily generated, which has a good protective effect on the flexible display screen 100. The use performance of the flexible display screen 100 is improved.
  • the flexible display screen 100 further includes a moisture absorption portion 70 formed between the film packaging layer 80 and the crack prevention portion 60 .
  • a groove 30 or a through groove may be provided on the film encapsulation layer 80 or the anti-cracking portion 60, the moisture absorption portion 70 is formed in the groove 30 or the through groove, and the moisture absorption portion 70 can also be laminated between the thin film encapsulation layer 80 and the crack prevention part 60.
  • the hygroscopic part 70 is uniformly dispersed with hygroscopic nanoparticles, the material of the hygroscopic nanoparticles is metal oxide, such as calcium oxide, barium oxide, etc., and the particle size of the hygroscopic nanoparticles ranges from 4-6 microns . Since the moisture absorption portion 70 contains hygroscopic nanoparticles, it can further effectively block the erosion of the water and oxygen in the external environment on the areas on both sides of the pixel unit 40 on the basis of the thin film encapsulation layer 80, thereby improving The service life and stability of the pixel unit 40.
  • the crack prevention portion 60 and the thin film encapsulation layer 80 A groove 30 is formed therebetween, and the moisture absorption portion 70 is formed in the groove 30 through a mask process.
  • the barrier layer 82 and/or the depletion layer 84 is deposited by a mask process, the barrier layer 82 and/or the The thickness of the depletion layer 84 corresponding to any position in the packaging area 10 is the same, because the barrier layer 82 and/or the thickness of the depletion layer 84 corresponding to any position in the packaging area 10 are the same.
  • the cross-section of the encapsulation film layer can be convex, and a groove 30 is formed between the protruding portion of the encapsulation film layer and the crack prevention portion 60, and the moisture absorption portion 70 is formed in the groove 30 Inside.
  • the surface of the moisture absorption portion 70 away from the substrate 20 is flush with the surface of the film packaging layer 80 away from the substrate 20.
  • the moisture absorption part 70 can be attached to the side of the anti-cracking part 60 The side of the film encapsulation layer 80.
  • the flexible display screen 100 further includes a barrier structure 90 that surrounds the pixel unit 40 and is formed on the substrate 20, and the barrier structure 90 is attached Attached to the side surface of the crack prevention part 60 away from the pixel unit 40.
  • the blocking structure 90 includes a plurality of water blocking portions 92 and a plurality of crack blocking portions 94, and the plurality of water blocking portions 92 and the plurality of crack blocking portions 94 alternately surround the pixel unit 40 and are formed on the substrate 20.
  • the side surface of one of the water blocking parts 92 or one of the crack blocking parts 94 is attached to the side of the crack preventing part 60 away from the pixel unit 40.
  • the water blocking portion 92 is used to effectively block the erosion of the area on both sides of the pixel unit 40 by water and oxygen in the external environment.
  • the material of the barrier layer 82 can be one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride.
  • the crack blocking portion 94 is used to block the generation of cracks, and the material of the blocking portion can be epoxy resin, acrylic resin, polyimide resin, polyethylene naphthalate, polyethylene terephthalate One or more of glycol esters.
  • one of the embodiments of the present application provides a method for manufacturing the flexible display screen 100. It should be noted that the above explanation of the implementation of the flexible display screen 100 is also applicable to the flexible display screen 100 of this embodiment. In order to avoid redundancy, the preparation method of, will not be detailed here. It should be noted that in the following embodiments, the following steps do not necessarily have a certain sequence. Those of ordinary skill in the art can understand from the description of the embodiments of the present application that in different embodiments, the following The steps may have a different execution order, that is, they may be executed in parallel, or they may be executed interchangeably. In different embodiments, some of the following steps may also be omitted or replaced.
  • the manufacturing method of the array substrate includes:
  • Step S51 Provide a substrate.
  • the base 20 may be a polyimide film, or one of organic polymer films such as polycarbonate, polyethylene terephthalate, and polyethersulfone substrates.
  • Step S52 forming a pixel unit on the substrate.
  • the plurality of pixel units 40 are fabricated on the substrate 20 by evaporation or inkjet printing, and the plurality of pixel units 40 are arranged in an array.
  • Step S53 forming a crack prevention portion on the substrate, the crack prevention portion surrounds the pixel unit and is formed on the substrate, and the crack prevention portion and the pixel unit form an encapsulation area.
  • the anti-cracking part 60 is formed by a deposition (ASmospheric Pressure Chemical Vapor DeposiSion: APCVD) method or an electron cyclotron resonance chemical vapor deposition (ElecSron CycloSron Resonance Chemical Vapor DeposiSion: ECR-CVD) method or a sputtering method.
  • a mask process is used to keep the shape and position of the openings of the mask consistent with the crack prevention part 60, so that the crack prevention part 60 surrounds the pixel unit 40 and is formed in The substrate 20.
  • the method further includes:
  • a moisture absorption part is formed between the film encapsulation layer and the crack prevention part.
  • a groove 30 is formed between the crack prevention portion 60 and the thin film encapsulation layer 80, and then the moisture absorption portion 70 is formed in the groove 30 through a mask process.
  • Step S54 using a mask process to deposit a thin-film packaging layer in the packaging area, and during deposition, the anti-cracking portion prevents the deposition material of the thin-film packaging layer from diffusing out of the packaging area.
  • magnetron sputtering, thermal evaporation or other film forming methods are used to deposit the thin film encapsulation layer 80.
  • a mask process is used to make a surface of the mask abut the crack prevention part The 60 is far away from the surface of the substrate 20, so as to ensure that the anti-crack portion 60 can prevent the deposition material of the thin film encapsulation layer 80 from diffusing out of the encapsulation area 10 during deposition.
  • the method further includes: forming a barrier structure 90 on the side of the anti-cracking portion 60 away from the pixel unit 40, the barrier structure 90 surrounds the pixel unit 40 and is formed on the substrate 20, and the barrier structure 90 includes a water blocking part 92 and a crack blocking part 94.
  • the barrier structure 90 is deposited by magnetron sputtering, thermal evaporation or other film forming methods.
  • a mask process is used to make a surface of the mask abut the crack prevention part 60 Keep away from the surface of the substrate 20, make the shape and position of the opening of the mask consistent with the water blocking portion 92 and/and the crack blocking portion 94, so that the water blocking portion 92 and/and The crack blocking portion 94 surrounds the pixel unit 40 and is formed on the substrate 20.
  • Another embodiment of the present application further provides a display panel, including: a first protective layer, an extruded deformation layer, the flexible display screen 100 in any of the above embodiments, a second protective layer, and a pressure sensor; On the first protective layer; the flexible display screen 100 is located on the side of the extruded deformation layer away from the first protective layer; the second protective layer is located on the side of the flexible display screen 100 away from the first protective layer; the pressure sensor is located on the second protective layer and Squeeze between the deformed layers.
  • the first protective layer bends and squeezes the squeezed deformed layer, and the squeezed deformed layer corresponding to the bent area will be Is compressed.
  • the squeezing deformation layer converts the deformation force when the flexible display panel is bent into a squeezing force, and transmits the squeezing force to the pressure sensor through the flexible display screen 100, and the more the flexible display panel is bent Larger, the greater the force transmitted to the pressure sensor, the user can adjust the degree of bending of the flexible display panel according to the force detected by the pressure sensor, so that the force received at the bend of the flexible display panel is kept within a certain range , Thereby improving the safety of the flexible display panel to a certain extent.
  • the first protective layer is also used to protect the extrusion deformation layer from being damaged
  • the second protective layer is used to protect the pressure sensor from being damaged
  • the second protective layer can also protect the flexible display screen 100.
  • the squeeze deformation layer can be deformed under the action of force, when the side where the first protective layer is provided in the flexible display panel is impacted, the squeeze deformation layer can be deformed, which acts as a buffer, thereby The probability of damage when the flexible display panel receives an impact is reduced.
  • the display panel of the present application provides a flexible display screen
  • the flexible display screen includes a substrate, the substrate is provided with a pixel unit; an anti-cracking portion, the anti-cracking portion surrounds the pixel unit And formed on the substrate, the crack prevention part and the pixel unit form an encapsulation area; and a thin film encapsulation layer, the thin film encapsulation layer is deposited in the encapsulation area, and the crack prevention part is used for During deposition, the deposition material blocking the thin film encapsulation layer from diffusing out of the encapsulation area.
  • the deposition material of the thin film encapsulation layer can be prevented from diffusing out of the The packaging area, in turn, can eliminate the diffusion area produced by the mask process, thereby eliminating the origin of cracks.
  • the flexible display is bent, it is not easy to produce cracks, which has a good protective effect on the flexible display , The use performance of the flexible display screen is improved.

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Abstract

一种柔性显示屏（100）及其制作方法、显示面板，其中柔性显示屏（100）包括基底（20）、防裂部（60）及薄膜封装层（80），基底（20）设置有像素单元（40）；防裂部（60）与像素单元（40）形成有封装区域（10）；薄膜封装层（80）沉积于封装区域（10）内，防裂部（60）用于沉积时，阻隔薄膜封装层（80）的沉积材料扩散出封装区域（10）。通过设置防裂部（60），在采用掩膜版工艺沉积薄膜封装层（80）时，阻隔薄膜封装层（80）的沉积材料扩散出封装区域（10），从而消除采用掩膜版工艺而产生的扩散区域，从而消除了裂纹发源处，当弯折柔性显示屏（100）时，不易产生裂纹。

Description

柔性显示屏及其制作方法、显示面板 技术领域
本申请实施例涉及显示技术领域，特别是涉及一种柔性显示屏及其制作方法、显示面板。
背景技术
柔性OLED屏幕由于其独特的优势，近些年来被广泛应用于各种电子设备，区别于传统LCD材料，OLED器件中的发光材料通常为聚合物或有机小分子，阴极材料通常为功函数较低的活泼金属如镁铝等，这些发光材料与阴极材料对水汽和氧气非常敏感，水氧的渗透会大大缩减OLED器件的寿命及产品的良率，为了达到商业化对于OLED器件的使用寿命和稳定性要求，通常对OLED器件进行柔性封装。
然而，在柔性封装的过程中，掩膜版与需要沉积的衬底之间存在一定距离，导致在涂覆、沉积或溅射过程中会在封装区域的边缘处形成阴影区域，该区域比封装区域的厚度小80％以上，当弯折屏幕时，容易成为裂纹发源处，产生裂纹。
发明内容
本申请实施例旨在提供一种柔性显示屏及其制作方法、显示面板，以解决现有封装区域的边缘处容易成为裂纹发源处的技术问题。
本申请实施例解决其技术问题提供以下技术方案：
一种柔性显示屏，包括：
基底，所述基底设置有像素单元；
防裂部，所述防裂部围绕所述像素单元并形成于所述基底上，所述防裂部与所述像素单元形成有封装区域；以及
薄膜封装层，所述薄膜封装层沉积于所述封装区域内，并且，所述防裂部用于沉积时，阻隔所述薄膜封装层的沉积材料扩散出所述封装区域。
可选地，所述防裂部的高度大于所述像素单元的高度。
可选地，所述柔性显示屏还包括吸湿部，所述吸湿部形成于所述薄膜封装层和所述防裂部之间。
可选地，所述防裂部和所述薄膜封装层之间形成有凹槽，所述吸湿部形成于所述凹槽内。
可选地，所述吸湿部远离所述基底的表面与所述薄膜封装层远离所述基底的表面平齐。
可选地，所述吸湿部远离所述防裂部的侧面贴附于所述薄膜封装层的侧
面。
可选地，所述薄膜封装层包括若干阻隔层和若干消陷层，若干所述阻隔层和若干所述消陷层依次交替形成于所述沉积区域内，且其中一个所述阻隔层或其中一个所述消陷层形成于所述像素单元上。
可选地，所述阻隔层和/或所述消陷层在所述封装区域内任意位置对应的厚度皆相同。
可选地，每个所述阻隔层和/或每个所述消陷层的侧面均贴附于所述防裂部靠近所述像素单元的侧面。
可选地，所述柔性显示屏还包括阻隔结构，所述阻隔结构围绕所述像素单元并形成于所述基底上，且所述阻隔结构贴附于所述防裂部远离所述像素单元的侧面。
可选地，所述阻隔结构包括若干阻水部和若干阻裂部，若干所述阻水部和若干所述阻裂部依次交替围绕所述像素单元并形成于所述基底上。
可选地，其中一个所述阻水部或其中一个所述阻裂部的侧面贴附于所述防裂部远离所述像素单元的侧面。
本申请实施例解决其技术问题还提供以下技术方案：
一种显示面板，包括：第一保护层；
挤压变形层，所述挤压变形层位于所述第一保护层上；
以上所述的柔性显示屏，所述柔性显示屏位于所述挤压变形层远离所述第一保护层的一侧；
第二保护层，所述第二保护层位于所述柔性显示屏远离所述第一保护层的一侧；
压力传感器，所述压力传感器位于所述第二保护层和所述挤压变形层之 间。
本申请实施例解决其技术问题还提供以下技术方案：
一种柔性显示屏的制作方法，包括：
提供基底；
在所述基底上形成像素单元；
在所述基底上形成防裂部，所述防裂部围绕所述像素单元并形成于所述基底上，所述防裂部与所述像素单元形成有封装区域；
采用掩膜版工艺，在所述封装区域内沉积薄膜封装层，沉积时，所述防裂部阻隔所述薄膜封装层的沉积材料扩散出所述封装区域。
可选地，所述在所述基底上形成防裂部之后，还包括：
在所述薄膜封装层和所述防裂部之间形成吸湿部。
可选地，在所述防裂部远离所述像素单元的侧面形成阻隔结构，所述阻隔结构围绕所述像素单元并形成于所述基底上。
与现有技术相比较，在本申请实施例提供的柔性显示屏中，通过设置所述防裂部，且使所述防裂部围绕所述像素单元设置，在采用掩膜版工艺沉积所述薄膜封装层时，可以阻隔所述薄膜封装层的沉积材料扩散出所述封装区域，进而可以消除采用掩膜版工艺而产生的扩散区域，从而消除了裂纹发源处，当弯折所述柔性显示屏时，不易产生裂纹，对所述柔性显示屏起到了良好的保护作用，提高了所述柔性显示屏的使用性能。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1是本申请其中一实施例提供的一种柔性显示屏的结构示意图；
图2是本申请另一实施例示出的柔性显示屏的结构示意图；
图3是本申请再一实施例示出的柔性显示屏的结构示意图；
图4是本申请又一实施例示出的柔性显示屏的结构示意图；
图5是本申请其中一个实施例提供的一种柔性显示屏的制造方法的流程 图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
请参阅图1，本申请一实施例提供的一种柔性显示屏100，所述柔性显示屏100包括基底20、像素单元40、防裂部60及薄膜封装层80。
所述基底20设置有像素单元40，所述像素单元40的数量可根据实际情况任意设置为多个，多个所述像素单元40可呈阵列式排布。在一些实施例中，所述像素单元40也可被代替为驱动单元、触控单元及显示单元等等，所述基底20上设置的各种类型的单元或模块只要满足对水汽和氧气敏感，需要进行封装保护即可。
所述防裂部60围绕所述像素单元40并形成于所述基底20上，所述防裂部60可间隔预设距离围绕所述像素单元40设置，所述防裂部60也可直接贴附于所述像素单元40并围绕所述像素单元40设置。例如，当所述防裂部60为四方体，可设置所述防裂部60为中空圆柱体或者中空四方体，且所述中空圆柱体或者中空四方体防裂部间隔预设距离(10-20um)围绕所述四方体像素单元设置于所述基底20上。在一些实施例中，所述防裂部60的形状和位置可根据需要任意设置，只需满足所述防裂部60围绕所述像素单元40并形成于 所述基底20上即可。
所述防裂部60与所述像素单元40形成有封装区域10，当所述防裂部60间隔预设距离围绕所述像素单元40设置时，所述封装区域10包括所述防裂部60与所述像素单元40之间的间隔区域，也包括所述像素单元40远离所述基底20的一面正对的上方区域，所述间隔区域和所述上方区域共同形成为所述封装区域10。当所述防裂部60直接贴附于所述像素单元40并围绕所述像素单元40设置时，所述封装区域10仅为所述像素单元40远离所述基底20的一面正对的上方区域。
所述薄膜封装层80沉积于所述封装区域10内，并且，所述防裂部60用于沉积时，阻隔所述薄膜封装层80的沉积材料扩散出所述封装区域10。
在未设置所述防裂部60时，采用掩膜版工艺沉积所述薄膜封装层80的沉积材料时，掩膜版与所述像素单元40之间必然存在一定距离，在沉积过程中不可避免的会产生的扩散区域，所述扩散区域可延伸数百μm，且所述扩散区域比所需正常的薄膜封装层80厚度小80％以上，由于扩散区域的厚度较薄，所述扩散区域容易成为裂纹发源处，当弯折所述柔性显示屏100时，所述裂纹发源处容易产生裂纹，所述裂纹从裂纹发源处开始直至扩展到整个屏幕，对所述柔性显示屏100造成不可逆的损害，影响产品的使用。
在本实施例中，通过设置所述防裂部60，优选地，所述防裂部60的高度大于所述像素单元40的高度或厚度，当所述防裂部60的高度大于所述像素单元40的高度或厚度时，采用掩膜版工艺沉积所述薄膜封装层80的沉积材料时，将掩膜版贴附于所述防裂部60远离基底20的一面，然后将沉积材料沉积到所述封装区域10内，由于防裂部60的阻隔作用，从而可以保证所述沉积材料只沉积到所述封装区域10内，而避免所述沉积材料扩散出所述封装区域10，因此可以消除采用掩膜版工艺而产生的扩散区域，从而消除了裂纹发源处，当弯折所述柔性显示屏100时，不易产生裂纹，对所述柔性显示屏100起到了良好的保护作用，提高了所述柔性显示屏100的使用性能。
同时，在未设置所述防裂部60时，采用掩膜版工艺沉积所述薄膜封装层80的沉积材料时，在沉积过程中形成的扩散区域可延伸数百μm，甚至可达毫米级别，不利于窄边框设计，在本实施例中通过设置所述防裂部60消除了所述扩散区域，从而可根据需要适当减小边框宽度，实现窄边框设计。
所述沉积所述薄膜封装层80的沉积材料时，可采用等离子体增强化学气相沉积(Plasma Enhanced Chemical Vapor DeposiSion:筒称PECVD)方式、低压化学气相沉积方式(Low Pressure Chemical Vapor DeposiSion:筒称LPCVD)、大气压化学气相沉积(ASmospheric Pressure Chemical Vapor DeposiSion:筒称APCVD)方式或电子回旋谐振化学气相沉积(ElecSron CycloSron Resonance Chemical Vapor DeposiSion:筒称ECR-CVD)方式或溅射方式。在一些实施例中，所述沉积方式可根据需要进行选择，只要所述沉积方式需要采用掩膜版即可。
所述基底20的材质可为聚酰亚胺、聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚醚砜基板等有机聚合物中的一种。在一些实施例中，所述基底20可根据需要采用其他不同的柔性材料，例如：热塑性半结晶聚合物，如PET、PEN和PEEK，其具有良好的透明度、较低的热膨胀系数、良好的阻水阻氧能力，而且价格比较便宜；非结晶热塑性聚合物，如PC、PES，其由溶剂注造或熔融注塑而成，具有较好的光学透明度和较高的玻璃化转变温度，当PC、PES薄膜的厚度达到0.1mm时，在可见光范围内的透过率可以达到85％以上。
请参阅图2，在一些实施例中，所述柔性显示屏100还包括缓冲层50，所述缓冲层50设置于所述基底20靠近所封装薄膜层80的一面，所述缓冲层50可有效的阻隔水氧对所述像素单元40的侵蚀。所述缓冲层50可为氮化硅、氧化硅、氮氧化硅、氧化铝等中的单层或叠层。
所述像素单元40包括驱动电路、像素电极、有机发光元件、公共电极、栅极线和数据线等，所述驱动电路包括位于岛状部上的薄膜晶体管，所述薄膜晶体管的漏极与所述像素电极相连，所述像素电极与所述有机发光元件的一侧电连接，所述有机发光元件相对的另一侧与所述公共电极电连接。栅极线向驱动电路传输扫描信号、数据线向驱动电路传输数据信号后，驱动电路通过导通的薄膜晶体管和像素电极向有机发光元件提供电流，以使有机发光元件发光、进行画面的显示。
在本实施例中，所述像素单元40与所述基底20之间采用非导电胶(NCA)技术封装，所述非导电胶是不含导电颗粒的材料，可采用非导电胶(NCP)和非导电膜(NCF)两种类型，在本实施例中，所述非导电胶采用的是非导电膜，所述非导电膜被贴合于所述像素单元40与所述基底20之间，加压使 像素单元40凸点穿透其正下方的所述非导电膜而与对应的基底20线路直接接触，由此实现电连接。所述非导电膜受热固化，其收缩可以固定像素单元40凸点和印制线间的直接接触。所述非导电膜在一定温度下的固化收缩不仅能保证了像素单元40和基底20之间稳定的电连接，还提供了一定的机械连接，从这两方面保证了封装体良好的键合性能。
所述防裂部60的材质可为无机材料，例如氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。所述防裂部60的材质也可为有机材料，例如环氧树脂、丙烯醛基树脂、聚酰亚胺树脂、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯中的一种或多种。
所述薄膜封装层80用于封装所述像素单元40，阻隔外界水氧对所述像素单元40的侵蚀。例如，当所述像素单元40为OLED像素单元40时，所述像素单元40内的发光材料通常为聚合物或有机小分子，阴极材料通常为功函数较低的活泼金属如镁铝等，这些发光材料与阴极材料对水汽和氧气非常敏感，水氧的渗透会大大缩减像素单元40的寿命。因此需要对所述像素单元40进行封装以避免外界水氧对所述像素单元40的侵蚀。
所述薄膜封装层80包括若干阻隔层82和若干消陷层84，若干所述阻隔层82和若干所述消陷层84依次交替形成于所述沉积区域内，且其中一个所述阻隔层82或其中一个所述消陷层84形成于所述像素单元40上。
所述阻隔层82用于阻隔水氧。所述阻隔层82材质可以是氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。
但是在制备所述阻隔层82的过程中会产生一些针孔或者异物缺陷，从而设置所述消陷层84用于覆盖所述阻隔层82的缺陷，实现平坦化，并且可以释放阻隔层82之间的应力，实现柔性封装。
所述消陷层84的材质可以是环氧树脂、丙烯醛基树脂、聚酰亚胺树脂、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯中的一种或多种。
当采用掩膜版工艺沉积所述阻隔层82和/或所述消陷层84时，由于所述防裂部60围绕所述像素单元40设置，采用掩膜版工艺沉积所述阻隔层82和/或所述消陷层84时，将掩膜版贴附于所述防裂部60远离基底20的一面，从而可以保证所述沉积材料只沉积到所述封装区域10内，并可使每个所述阻隔 层82和/或每个所述消陷层84的侧面均贴附于所述防裂部60靠近所述像素单元40的侧面。因此可以消除采用掩膜版工艺而产生的扩散区域，从而消除了裂纹发源处，当弯折所述柔性显示屏100时，不易产生裂纹，对所述柔性显示屏100起到了良好的保护作用，提高了所述柔性显示屏100的使用性能。
同时，由于所述防裂部60围绕所述像素单元40设置，采用掩膜版工艺沉积所述阻隔层82和/或所述消陷层84时，将掩膜版贴附于所述防裂部60远离基底20的一面，并使所述掩膜版上的开孔正对于所述沉积区域，在沉积时，可使所述阻隔层82和/或所述消陷层84在所述封装区域10内任意位置对应的厚度皆相同。因此可以消除采用掩膜版工艺而产生的扩散区域，从而消除了裂纹发源处，当弯折所述柔性显示屏100时，不易产生裂纹，对所述柔性显示屏100起到了良好的保护作用，提高了所述柔性显示屏100的使用性能。
请一并参阅图2和图3，在一些实施例中，所述柔性显示屏100还包括吸湿部70，所述吸湿部70形成于所述薄膜封装层80和所述防裂部60之间。具体地，可在所述薄膜封装层80或所述防裂部60上开设凹槽30或者通槽，所述吸湿部70形成于所述凹槽30或所述通槽内，所述吸湿部70也可层叠于所述薄膜封装层80和所述防裂部60之间。
所述吸湿部70内部均匀分散有吸湿性纳米颗粒，所述吸湿性纳米颗粒的材料为金属氧化物，如氧化钙、氧化钡等，所述吸湿性纳米颗粒的粒径范围为4-6微米。由于所述吸湿部70内部具有吸湿性的纳米颗粒，因此可以在所述薄膜封装层80的基础上，进一步地有效阻挡外界环境的水氧对所述像素单元40两侧区域的侵蚀，提高了像素单元40的使用寿命和稳定性。
为了能够在不增加制程工艺的前提下，使所述吸湿部70形成于所述薄膜封装层80和所述防裂部60之间，可在所述防裂部60和所述薄膜封装层80之间形成凹槽30，进而通过掩膜版工艺，使所述吸湿部70形成于所述凹槽30内。
具体地，由于所述像素单元40具有一定的厚度或高度，当采用掩膜版工艺沉积所述阻隔层82和/或所述消陷层84时，可使所述阻隔层82和/或所述消陷层84在所述封装区域10内任意位置对应的厚度皆相同，由于所述阻隔层82和/或所述消陷层84在所述封装区域10内任意位置对应的厚度皆相同，可使所述封装薄膜层的截面呈凸状，进而所述封装薄膜层的凸出部和所述防 裂部60之间形成有凹槽30，所述吸湿部70形成于所述凹槽30内。优选地，所述吸湿部70远离所述基底20的表面与所述薄膜封装层80远离所述基底20的表面平齐。
为了更好的使所述吸湿部70有效阻挡外界环境的水氧对所述像素单元40两侧区域的侵蚀，可使所述吸湿部70远离所述防裂部60的侧面贴附于所述薄膜封装层80的侧面。
请参阅图4，在一些实施例中，所述柔性显示屏100还包括阻隔结构90，所述阻隔结构90围绕所述像素单元40并形成于所述基底20上，且所述阻隔结构90贴附于所述防裂部60远离所述像素单元40的侧面。
所述阻隔结构90包括若干阻水部92和若干阻裂部94，若干所述阻水部92和若干所述阻裂部94依次交替围绕所述像素单元40并形成于所述基底20上。其中一个所述阻水部92或其中一个所述阻裂部94的侧面贴附于所述防裂部60远离所述像素单元40的侧面。
所述阻水部92用于有效阻挡外界环境的水氧对所述像素单元40两侧区域的侵蚀。所述阻隔层82材质可以是氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。
所述阻裂部94用于阻隔裂纹的产生，所述阻隔部的材质可以为环氧树脂、丙烯醛基树脂、聚酰亚胺树脂、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯中的一种或多种。
请参阅图5，本申请其中一个实施例提供一种柔性显示屏100的制造方法，需要说明的是，上述对柔性显示屏100的实施方式的解释说明也适用于本实施方式的柔性显示屏100的制备方法，为避免冗余，在此不再详细展开。需要说明的是，在下述各个实施例中，下述各步骤之间并不必然存在一定的先后顺序，本领域普通技术人员，根据本申请实施例的描述可以理解，不同实施例中，下述各步骤可以有不同的执行顺序，亦即，可以并行执行，亦可以交换执行等等；不同实施例中，下述有些步骤亦可以省略或被代替。
所述阵列基板的制造方法包括：
步骤S51:提供基底。
所述基底20可为聚酰亚胺薄膜，也可为聚碳酸酯、聚对苯二甲酸乙二醇酯、聚醚砜基板等有机聚合物薄膜中的一种。
步骤S52:在所述基底上形成像素单元。
具体地，在所述基底20上通过蒸镀或喷墨打印制作所述多个所述像素单元40，多个所述像素单元40呈阵列式排布。
步骤S53:在所述基底上形成防裂部，所述防裂部围绕所述像素单元并形成于所述基底上，所述防裂部与所述像素单元形成有封装区域。
具体地，在所述基底20上，采用等离子体增强化学气相沉积(Plasma Enhanced Chemical Vapor DeposiSion:筒称PECVD)方式、低压化学气相沉积方式(Low Pressure Chemical Vapor DeposiSion:筒称LPCVD)、大气压化学气相沉积(ASmospheric Pressure Chemical Vapor DeposiSion:筒称APCVD)方式或电子回旋谐振化学气相沉积(ElecSron CycloSron Resonance Chemical Vapor DeposiSion:筒称ECR-CVD)方式或溅射方式形成所述防裂部60。
在沉积过程中，使用掩膜版工艺，使所述掩膜版的开孔的形状位置与所述防裂部60保持一致，从而使所述防裂部60围绕所述像素单元40并形成于所述基底20上。
在一些实施例中，所述在所述基底上形成防裂部之后，还包括：
在所述薄膜封装层和所述防裂部之间形成吸湿部。
具体地，在所述防裂部60和所述薄膜封装层80之间形成凹槽30，进而通过掩膜版工艺，使所述吸湿部70形成于所述凹槽30内。
步骤S54:采用掩膜版工艺，在所述封装区域内沉积薄膜封装层，沉积时，所述防裂部阻隔所述薄膜封装层的沉积材料扩散出所述封装区域。
具体地，采用磁控溅射、热蒸发或其它成膜方法沉积所述薄膜封装层80，在沉积过程中，使用掩膜版工艺，使掩膜版的一表面抵靠于所述防裂部60远离所述基底20的表面，从而保证在沉积时，使所述防裂部60能够阻隔所述薄膜封装层80的沉积材料扩散出所述封装区域10。
在一些实施例中，为了有效阻挡外界环境的水氧对所述像素单元40两侧区域的侵蚀。所述方法还包括：在所述防裂部60远离所述像素单元40的侧面形成阻隔结构90，所述阻隔结构90围绕所述像素单元40并形成于所述基底20上，所述阻隔结构90包括阻水部92和阻裂部94。
具体地，采用磁控溅射、热蒸发或其它成膜方法沉积所述阻隔结构90， 在沉积过程中，使用掩膜版工艺，使掩膜版的一表面抵靠于所述防裂部60远离所述基底20的表面，使所述掩膜版的开孔的形状位置与所述阻水部92和/且所述阻裂部94保持一致，从而使所述阻水部92和/且所述阻裂部94围绕所述像素单元40并形成于所述基底20上。
本申请另一实施例还提供一种显示面板，包括：第一保护层、挤压变形层、上述任一实施例中的柔性显示屏100，第二保护层和压力传感器；挤压变形层位于第一保护层上；柔性显示屏100位于挤压变形层远离第一保护层的一侧；第二保护层位于柔性显示屏100远离第一保护层的一侧；压力传感器位于第二保护层和挤压变形层之间。
将压力传感器设置在柔性显示屏100和第二保护层之间后，在柔性显示面板发生弯折时，第一保护层弯曲并挤压挤压变形层，弯折区域对应的挤压变形层会被压缩，此时挤压变形层将弯折柔性显示面板时的形变力转变为了挤压力，并通过柔性显示屏100将挤压力传递到压力传感器上，并且柔性显示面板弯折的程度越大，则传递至压力传感器上的力也就越大，用户可以根据压力传感器检测到的力的大小调整柔性显示面板的弯折程度，使柔性显示面板的弯折处受到的力保持在一定范围内，从而在一定程度上提高了柔性显示面板的使用安全性。其中，第一保护层还用于保护挤压变形层不被损坏，第二保护层用于保护压力传感器不被损坏，该第二保护层还能够起到保护柔性显示屏100的作用。并且，由于挤压变形层在力的作用下能够发生形变，因此当柔性显示面板中设置有第一保护层的一侧受到撞击时，挤压变形层能够发生形变，起到缓冲的作用，进而降低了柔性显示面板收到撞击时损坏的概率。
与现有技术相比较，本申请显示面板中提供了一种柔性显示屏，所述柔性显示屏包括基底，所述基底设置有像素单元；防裂部，所述防裂部围绕所述像素单元并形成于所述基底上，所述防裂部与所述像素单元形成有封装区域；以及薄膜封装层，所述薄膜封装层沉积于所述封装区域内，并且，所述防裂部用于沉积时，阻隔所述薄膜封装层的沉积材料扩散出所述封装区域。通过设置所述防裂部，且使所述防裂部围绕所述像素单元设置，在采用掩膜版工艺沉积所述薄膜封装层时，可以阻隔所述薄膜封装层的沉积材料扩散出所述封装区域，进而可以消除采用掩膜版工艺而产生的扩散区域，从而消除 了裂纹发源处，当弯折所述柔性显示屏时，不易产生裂纹，对所述柔性显示屏起到了良好的保护作用，提高了所述柔性显示屏的使用性能。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；在本申请的思路下，以上实施例或者不同实施例中的技术特征之间也可以进行组合，步骤可以以任意顺序实现，并存在如上所述的本申请的不同方面的许多其它变化，为了简明，它们没有在细节中提供；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (16)

  1. 一种柔性显示屏，其特征在于，包括：
    基底，所述基底设置有像素单元；
    防裂部，所述防裂部围绕所述像素单元并形成于所述基底上，所述防裂部与所述像素单元形成有封装区域；以及
    薄膜封装层，所述薄膜封装层沉积于所述封装区域内，并且，所述防裂部用于沉积时，阻隔所述薄膜封装层的沉积材料扩散出所述封装区域。
  2. 根据权利要求1所述的柔性显示屏，其特征在于，
    所述防裂部的高度大于所述像素单元的高度。
  3. 根据权利要求1所述的柔性显示屏，其特征在于，
    所述柔性显示屏还包括吸湿部，所述吸湿部形成于所述薄膜封装层和所述防裂部之间。
  4. 根据权利要求3所述的柔性显示屏，其特征在于，
    所述防裂部和所述薄膜封装层之间形成有凹槽，所述吸湿部形成于所述凹槽内。
  5. 根据权利要求4所述的柔性显示屏，其特征在于，
    所述吸湿部远离所述基底的表面与所述薄膜封装层远离所述基底的表面平齐。
  6. 根据权利要求3所述的柔性显示屏，其特征在于，
    所述吸湿部远离所述防裂部的侧面贴附于所述薄膜封装层的侧面。
  7. 根据权利要求1-6任一项所述的柔性显示屏，其特征在于，
    所述薄膜封装层包括若干阻隔层和若干消陷层，若干所述阻隔层和若干所述消陷层依次交替形成于所述封装区域内，且其中一个所述阻隔层或其中一个所述消陷层形成于所述像素单元上。
  8. 根据权利要求7所述的柔性显示屏，其特征在于，所述阻隔层和/或所述消陷层在所述封装区域内任意位置对应的厚度皆相同。
  9. 根据权利要求7所述的柔性显示屏，其特征在于，
    每个所述阻隔层和/或每个所述消陷层的侧面均贴附于所述防裂部靠近所述像素单元的侧面。
  10. 根据权利要求1-6任一项所述的柔性显示屏，其特征在于，
    所述柔性显示屏还包括阻隔结构，所述阻隔结构围绕所述像素单元并形成于所述基底上，且所述阻隔结构贴附于所述防裂部远离所述像素单元的侧面。
  11. 根据权利要求10所述的柔性显示屏，其特征在于，
    所述阻隔结构包括若干阻水部和若干阻裂部，若干所述阻水部和若干所述阻裂部依次交替围绕所述像素单元并形成于所述基底上。
  12. 根据权利要求11所述的柔性显示屏，其特征在于，
    其中一个所述阻水部或其中一个所述阻裂部的侧面贴附于所述防裂部远离所述像素单元的侧面。
  13. 一种显示面板，其特征在于，包括：
    第一保护层；
    挤压变形层，所述挤压变形层位于所述第一保护层上；
    如权利要求1至12任一项所述的柔性显示屏，所述柔性显示屏位于所
    述挤压变形层远离所述第一保护层的一侧；
    第二保护层，所述第二保护层位于所述柔性显示屏远离所述第一保护层的一侧；
    压力传感器，所述压力传感器位于所述第二保护层和所述挤压变形层之间。
  14. 一种柔性显示屏的制作方法，其特征在于，包括：
    提供基底；
    在所述基底上形成像素单元；
    在所述基底上形成防裂部，所述防裂部围绕所述像素单元并形成于所述基底上，所述防裂部与所述像素单元形成有封装区域；
    采用掩膜版工艺，在所述封装区域内沉积薄膜封装层，沉积时，所述防裂部阻隔所述薄膜封装层的沉积材料扩散出所述封装区域。
  15. 根据权利要求14所述的方法，其特征在于，所述在所述基底上形成防裂部之后，还包括：
    在所述薄膜封装层和所述防裂部之间形成吸湿部。
  16. 根据权利要求15所述的方法，其特征在于，所述方法还包括：
    在所述防裂部远离所述像素单元的侧面形成阻隔结构，所述阻隔结构围绕所述像素单元并形成于所述基底上。
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