WO2020258142A1 - Sound producing device - Google Patents

Sound producing device Download PDF

Info

Publication number
WO2020258142A1
WO2020258142A1 PCT/CN2019/093229 CN2019093229W WO2020258142A1 WO 2020258142 A1 WO2020258142 A1 WO 2020258142A1 CN 2019093229 W CN2019093229 W CN 2019093229W WO 2020258142 A1 WO2020258142 A1 WO 2020258142A1
Authority
WO
WIPO (PCT)
Prior art keywords
fpc board
conductive
magnetic bowl
conductive plate
sound
Prior art date
Application number
PCT/CN2019/093229
Other languages
French (fr)
Chinese (zh)
Inventor
张古清
Original Assignee
瑞声声学科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/093229 priority Critical patent/WO2020258142A1/en
Priority to CN201921002085.1U priority patent/CN210183527U/en
Publication of WO2020258142A1 publication Critical patent/WO2020258142A1/en

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers

Definitions

  • the present invention relates to the technical field of acoustics, in particular to a sound generating device.
  • the prior art speaker includes a magnetic bowl and an FPC board connected to the magnetic bowl, and the static electricity generated by the speaker is eliminated through the grounding of the FPC board.
  • the FPC board and the magnetic bowl are not well connected, it is easy to cause the speaker to have a ground failure problem. Once the problem of ground failure occurs, the static electricity generated by the speaker cannot be eliminated through the FPC board grounding, causing the static electricity to interfere with the magnetic field conducted by the magnetic bowl, thereby affecting the performance of the speaker.
  • the purpose of the present invention is to provide a sound generating device, which solves the technical problem of poor conduction between the FPC board and the magnetic bowl in the prior art.
  • a sounding device includes a sounding monomer and an FPC board electrically connected to the sounding monomer.
  • the sounding monomer includes a basin frame and a magnetic bowl arranged on the basin frame.
  • the FPC board is connected to the frame through a conductive plate.
  • the magnetic bowl is electrically connected to achieve grounding, and the conductive plate is welded and fixed to the magnetic bowl.
  • the FPC board is fixed to the conductive board through a conductive adhesive layer.
  • the area of the conductive adhesive layer is smaller than the area of the conductive plate.
  • the FPC board completely covers the conductive adhesive layer, and the FPC board and the conductive adhesive layer cover the same area on the conductive plate.
  • the conductive plate and the magnetic bowl are welded to form solder joints, and the solder joints are located on both sides of the FPC board.
  • the number of the solder joints is three, and the three solder joints are arranged at three vertices of a triangle.
  • the conductive plate is a steel plate.
  • the thickness of the conductive plate is 0.08-0.12 mm.
  • the conductive adhesive layer is a conductive pressure-sensitive adhesive.
  • the present invention provides a sound generating device.
  • the FPC board is electrically connected to the magnetic bowl through a conductive plate to achieve grounding, and the conductive board and the magnetic bowl are welded and fixed, so that reliable conduction between the FPC board and the magnetic bowl is realized, so that the sound generating device generates
  • the static electricity can be smoothly eliminated through the FPC board grounding, effectively ensuring the performance of the sound device.
  • Figure 1 is an exploded view of a vocal monomer according to an embodiment of the present invention
  • Figure 2 is a schematic perspective view of a sound generating device according to an embodiment of the present invention.
  • Figure 3 is an exploded view of a sounding device according to an embodiment of the present invention.
  • Fig. 4 is a manufacturing flow chart of the sound generating device according to an embodiment of the present invention.
  • Fig. 1 is an exploded view of a vocal monomer according to an embodiment of the present invention.
  • the sound-emitting unit 1 includes a basin frame 11 with a receiving space 112, a magnetic bowl 12 connected to the bottom of the basin frame 11 and forming a storage space with the basin frame 11, and a magnetic bowl 12 contained in the receiving space 112.
  • the magnetic circuit system 13 includes a first magnet part 131 and a second magnet part 132, the second magnet part 132 is arranged around the first magnet part 131 and forms a magnetic gap with the first magnet part 131;
  • the vibration system 14 includes a diaphragm 141 fixed on the top of the basin frame 11 and a voice coil 142 whose one end is connected to the diaphragm 141 and the other end is inserted into the magnetic gap and drives the diaphragm 141 to vibrate;
  • the vibration system 14 includes a diaphragm 141 fixed on the top of the basin frame 11 The upper diaphragm 141, one end connected to the upper diaphragm 141, the other end is inserted into the magnetic gap and the voice coil 142 driving the upper diaphragm 141 to vibrate, and the lower diaphragm 143 fixed to the frame 11 and opposite to the upper diaphragm 141 at intervals. .
  • Fig. 2 is a schematic perspective view of a sound generating device according to an embodiment of the present invention
  • Fig. 3 is an exploded view of the sound generating device according to an embodiment of the present invention.
  • the sounding device 10 includes a sounding unit 1 and an FPC board 4 electrically connected to the sounding unit 1.
  • the sounding unit 1 includes a basin frame 11 and a magnetic bowl 12 arranged on the basin frame 11.
  • FPC The plate 4 is electrically connected to the magnetic bowl 12 through the conductive plate 2 to achieve grounding, and the conductive plate 2 and the magnetic bowl 12 are welded and fixed.
  • the FPC board 4 is electrically connected to the magnetic bowl 12 through the conductive board 2 to achieve grounding, and the conductive board 2 and the magnetic bowl 12 are welded and fixed, so that reliable conduction between the FPC board 4 and the magnetic bowl 12 is achieved, thereby
  • the static electricity generated by the sound generating device 10 can be smoothly eliminated through the grounding of the FPC board 4, and the performance of the sound generating device 10 is effectively ensured.
  • the FPC board 4 is fixed to the conductive board 2 through the conductive adhesive layer 3.
  • the area of the conductive adhesive layer 3 is smaller than the area of the conductive plate 2, so that the conductive adhesive layer 3 attached to the middle of the conductive plate 2 can expose the upper and lower parts of the conductive plate 2, thereby facilitating laser welding.
  • the FPC board 4 completely covers the conductive adhesive layer 3, and the area covered by the FPC board 4 and the conductive adhesive layer 3 on the conductive plate 2 is equal, so that the FPC board 4 and the conductive adhesive layer 3 can be reliably They are bonded together to ensure reliable conduction between the FPC board 4 and the magnetic bowl 12.
  • the conductive plate 2 and the magnetic bowl 12 are welded to form solder joints 21, the solder joints 21 are located on both sides of the FPC board 4, the number of solder joints 21 is three, and the three solder joints 21 represent three vertices of a triangle. Set up.
  • the triangular welding area formed by the three welding points 21 not only enables the conductive plate 2 to be reliably welded to the magnetic bowl 12, but also saves welding costs. It can be understood that, in an alternative embodiment, the solder joints 21 on both sides of the FPC board 4 are not limited to three, and can be specifically determined according to actual requirements.
  • the conductive plate 2 is a steel plate, which has the advantages of high strength, high temperature resistance, high pressure resistance, corrosion resistance, abrasion resistance, and the like. It can be understood that, in an alternative embodiment, the conductive plate 2 may also be a conductive metal plate or a conductive alloy plate. In this embodiment, the thickness of the steel plate is 0.1 mm. After a large number of experimental tests, a steel plate with a thickness of 0.1 mm can not only meet the strength requirements, but also optimize the conduction efficiency of the sound device 10, and can save material costs. It can be understood that, in an alternative embodiment, the thickness of the conductive plate 2 is not limited to 0.1 mm, and can be selected in the range of 0.08-0.12 mm.
  • the conductive adhesive layer 3 is a conductive pressure-sensitive adhesive, which is also called a thermosetting conductive adhesive. It can be understood that, in an alternative embodiment, the conductive adhesive layer 3 may also be conductive silver glue or other conductive adhesives.
  • the FPC board 4 is provided with a first connecting portion 41 and a second connecting portion 42 extending outward, and the side of the basin frame 11 opposite to the PBC board is provided with a first boss 111 and a second boss 112.
  • the first connecting portion 41 is fixed in the first boss 111 and electrically connected to the voice coil lead;
  • the second connecting portion 42 is fixed in the second boss 112 and electrically connected to the voice coil lead.
  • Fig. 4 is a manufacturing flow chart of a sound emitting device according to an embodiment of the present invention. Including the following steps:

Abstract

A sound producing device (10), comprising a sound producing monomer (1) and an FPC board (4) electrically connected to the sound producing monomer (1). The sound producing monomer (1) comprises a frame (11) and a magnetic bowl (12) provided on the frame (11). The FPC board (4) is electrically connected to the magnetic bowl (12) by means of a conductive plate (2) to realize grounding, and the conductive plate (2) is welded and fixed with the magnetic bowl (12). The FPC board (4) is electrically connected to the magnetic bowl (12) by means of the conductive plate (2) to realize grounding, and the conductive plate (2) is welded and fixed with the magnetic bowl (12), so that reliable conduction between the FPC board (4) and the magnetic bowl (12) is realized, static electricity generated by the sound producing device (10) can be smoothly eliminated by means of the grounding of the FPC board (4), and the performance of the sound producing device (10) is effectively ensured.

Description

发声装置Sound device 技术领域Technical field
本发明涉及声学技术领域,尤其涉及一种发声装置。The present invention relates to the technical field of acoustics, in particular to a sound generating device.
背景技术Background technique
随着移动互联网时代的到来,智能移动设备的数量不断上升。而在众多移动设备之中,手机无疑是最常见、最便携的移动终端设备。目前,手机的功能及其多样,其中之一便是高品质的音乐功能,而手机中的扬声器便是实现这个高品质音乐功能的必备条件之一。With the advent of the mobile Internet era, the number of smart mobile devices continues to rise. Among many mobile devices, mobile phones are undoubtedly the most common and portable mobile terminal devices. At present, the functions of mobile phones are extremely diverse. One of them is the high-quality music function, and the speaker in the mobile phone is one of the necessary conditions for realizing this high-quality music function.
现有技术的扬声器包括磁碗以及与磁碗连接的FPC板,扬声器产生的静电通过FPC板接地消除。但是,当FPC板和磁碗导通不畅时,容易导致扬声器出现接地失效的问题。一旦出现接地失效的问题,则扬声器产生的静电无法通过FPC板接地消除,导致静电干扰磁碗导通的磁场,从而影响扬声器的性能。The prior art speaker includes a magnetic bowl and an FPC board connected to the magnetic bowl, and the static electricity generated by the speaker is eliminated through the grounding of the FPC board. However, when the FPC board and the magnetic bowl are not well connected, it is easy to cause the speaker to have a ground failure problem. Once the problem of ground failure occurs, the static electricity generated by the speaker cannot be eliminated through the FPC board grounding, causing the static electricity to interfere with the magnetic field conducted by the magnetic bowl, thereby affecting the performance of the speaker.
因此,有必要提供一种发声装置,使FPC板和磁碗始终保持可靠的导通。Therefore, it is necessary to provide a sounding device to keep the FPC board and the magnetic bowl in reliable conduction.
技术问题technical problem
本发明的目的在于提供一种发声装置,其解决了现有技术中FPC板和磁碗导通不畅的技术问题。The purpose of the present invention is to provide a sound generating device, which solves the technical problem of poor conduction between the FPC board and the magnetic bowl in the prior art.
技术解决方案Technical solutions
为了解决上述技术问题,本发明提供的技术方案为:In order to solve the above technical problems, the technical solutions provided by the present invention are:
一种发声装置,包括发声单体以及与所述发声单体电连接的FPC板,所述发声单体包括盆架以及设置在所述盆架上的磁碗,所述FPC板通过导电板与所述磁碗电连接实现接地,所述导电板与所述磁碗焊接固定。A sounding device includes a sounding monomer and an FPC board electrically connected to the sounding monomer. The sounding monomer includes a basin frame and a magnetic bowl arranged on the basin frame. The FPC board is connected to the frame through a conductive plate. The magnetic bowl is electrically connected to achieve grounding, and the conductive plate is welded and fixed to the magnetic bowl.
其中,所述FPC板通过导电粘接层与所述导电板固定。Wherein, the FPC board is fixed to the conductive board through a conductive adhesive layer.
其中,所述导电粘结层的面积小于所述导电板的面积。Wherein, the area of the conductive adhesive layer is smaller than the area of the conductive plate.
其中,所述FPC板完全覆盖所述导电粘结层,并且所述FPC板和所述导电粘结层在所述导电板上覆盖的面积相等。Wherein, the FPC board completely covers the conductive adhesive layer, and the FPC board and the conductive adhesive layer cover the same area on the conductive plate.
其中,所述导电板与所述磁碗焊接形成焊点,所述焊点位于所述FPC板的两侧。Wherein, the conductive plate and the magnetic bowl are welded to form solder joints, and the solder joints are located on both sides of the FPC board.
其中,所述焊点的数量为三个,三个所述焊点呈三角形的三个顶点设置。Wherein, the number of the solder joints is three, and the three solder joints are arranged at three vertices of a triangle.
其中,所述导电板为钢板。Wherein, the conductive plate is a steel plate.
其中,所述导电板的厚度为0.08-0.12mm。Wherein, the thickness of the conductive plate is 0.08-0.12 mm.
其中,所述导电粘结层为导电性压敏粘合剂。Wherein, the conductive adhesive layer is a conductive pressure-sensitive adhesive.
有益效果Beneficial effect
本发明提供了一种发声装置,FPC板通过导电板与磁碗电连接实现接地,并且导电板与磁碗焊接固定,使得FPC板和磁碗之间实现可靠的导通,从而使发声装置产生的静电能够顺利通过FPC板接地消除,有效地保证了发声装置的性能。The present invention provides a sound generating device. The FPC board is electrically connected to the magnetic bowl through a conductive plate to achieve grounding, and the conductive board and the magnetic bowl are welded and fixed, so that reliable conduction between the FPC board and the magnetic bowl is realized, so that the sound generating device generates The static electricity can be smoothly eliminated through the FPC board grounding, effectively ensuring the performance of the sound device.
附图说明Description of the drawings
参照附图,本发明的公开内容将更加显然。应当了解,这些附图仅仅用于说明的目的,而并非意在对本发明的保护范围构成限制。图中:With reference to the drawings, the disclosure of the present invention will be more apparent. It should be understood that these drawings are only for illustrative purposes and are not intended to limit the protection scope of the present invention. In the picture:
图1为本发明的一个实施例的发声单体的爆炸图;Figure 1 is an exploded view of a vocal monomer according to an embodiment of the present invention;
图2为本发明的一个实施例的发声装置的示意性立体图;Figure 2 is a schematic perspective view of a sound generating device according to an embodiment of the present invention;
图3为本发明的一个实施例的发声装置的爆炸图; Figure 3 is an exploded view of a sounding device according to an embodiment of the present invention;
图4为本发明的一个实施例的发声装置的制造流程图。Fig. 4 is a manufacturing flow chart of the sound generating device according to an embodiment of the present invention.
本发明的实施方式Embodiments of the invention
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.
图1为本发明的一个实施例的发声单体的爆炸图。Fig. 1 is an exploded view of a vocal monomer according to an embodiment of the present invention.
从图中可以看出,该发声单体1包括具有收容空间112的盆架11、连接于盆架11的底部并与盆架11形成收纳空间的磁碗12、收容于收容空间112内的磁路系统13和振动系统14;磁路系统13包括第一磁体部131和第二磁体部132,第二磁体部132围绕第一磁体部131设置并与第一磁体部131形成磁间隙;振动系统14包括固设于盆架11的顶部的振膜141和一端连接于振膜141另一端插入磁间隙并驱动振膜141振动的音圈142;振动系统14包括固设于盆架11的顶部的上振膜141、一端连接于上振膜141另一端插入磁间隙并驱动上振膜141振动的音圈142,以及固定于盆架11并与上振膜141相对且间隔设置的下振膜143。As can be seen from the figure, the sound-emitting unit 1 includes a basin frame 11 with a receiving space 112, a magnetic bowl 12 connected to the bottom of the basin frame 11 and forming a storage space with the basin frame 11, and a magnetic bowl 12 contained in the receiving space 112. The magnetic circuit system 13 and the vibration system 14; the magnetic circuit system 13 includes a first magnet part 131 and a second magnet part 132, the second magnet part 132 is arranged around the first magnet part 131 and forms a magnetic gap with the first magnet part 131; the vibration system 14 includes a diaphragm 141 fixed on the top of the basin frame 11 and a voice coil 142 whose one end is connected to the diaphragm 141 and the other end is inserted into the magnetic gap and drives the diaphragm 141 to vibrate; the vibration system 14 includes a diaphragm 141 fixed on the top of the basin frame 11 The upper diaphragm 141, one end connected to the upper diaphragm 141, the other end is inserted into the magnetic gap and the voice coil 142 driving the upper diaphragm 141 to vibrate, and the lower diaphragm 143 fixed to the frame 11 and opposite to the upper diaphragm 141 at intervals. .
图2为本发明的一个实施例的发声装置的示意性立体图;图3为本发明的一个实施例的发声装置的爆炸图。Fig. 2 is a schematic perspective view of a sound generating device according to an embodiment of the present invention; Fig. 3 is an exploded view of the sound generating device according to an embodiment of the present invention.
从图中可以看出,该发声装置10包括发声单体1以及与发声单体1电连接的FPC板4,发声单体1包括盆架11以及设置在盆架11上的磁碗12, FPC板4通过导电板2与磁碗12电连接实现接地,导电板2与磁碗12焊接固定。It can be seen from the figure that the sounding device 10 includes a sounding unit 1 and an FPC board 4 electrically connected to the sounding unit 1. The sounding unit 1 includes a basin frame 11 and a magnetic bowl 12 arranged on the basin frame 11. FPC The plate 4 is electrically connected to the magnetic bowl 12 through the conductive plate 2 to achieve grounding, and the conductive plate 2 and the magnetic bowl 12 are welded and fixed.
在本实施例中,FPC板4通过导电板2与磁碗12电连接实现接地,并且导电板2与磁碗12焊接固定,使得FPC板4和磁碗12之间实现可靠的导通,从而使发声装置10产生的静电能够顺利通过FPC板4接地消除,有效地保证了发声装置10的性能。 In this embodiment, the FPC board 4 is electrically connected to the magnetic bowl 12 through the conductive board 2 to achieve grounding, and the conductive board 2 and the magnetic bowl 12 are welded and fixed, so that reliable conduction between the FPC board 4 and the magnetic bowl 12 is achieved, thereby The static electricity generated by the sound generating device 10 can be smoothly eliminated through the grounding of the FPC board 4, and the performance of the sound generating device 10 is effectively ensured.
在本实施例中,FPC板4通过导电粘接层3与导电板2固定。In this embodiment, the FPC board 4 is fixed to the conductive board 2 through the conductive adhesive layer 3.
在本实施例中,导电粘结层3的面积小于导电板2的面积,使得贴合在导电板2中部的导电粘结层3能够露出导电板2的上下部分,从而方便激光焊接。In this embodiment, the area of the conductive adhesive layer 3 is smaller than the area of the conductive plate 2, so that the conductive adhesive layer 3 attached to the middle of the conductive plate 2 can expose the upper and lower parts of the conductive plate 2, thereby facilitating laser welding.
在本实施例中,FPC板4完全覆盖导电粘结层3,并且FPC板4和导电粘结层3在导电板2上覆盖的面积相等,使得FPC板4和导电粘结层3能够可靠的贴合在一起,从而保证FPC板4和磁碗12之间实现可靠的导通。In this embodiment, the FPC board 4 completely covers the conductive adhesive layer 3, and the area covered by the FPC board 4 and the conductive adhesive layer 3 on the conductive plate 2 is equal, so that the FPC board 4 and the conductive adhesive layer 3 can be reliably They are bonded together to ensure reliable conduction between the FPC board 4 and the magnetic bowl 12.
在本实施例中,导电板2与磁碗12焊接形成焊点21,焊点21位于FPC板4的两侧,焊点21的数量为三个,三个焊点21呈三角形的三个顶点设置。由三个焊点21形成的三角形焊区,不仅能够使导电板2可靠的焊接在磁碗12上,而且能够节省焊接成本。可以了解,在可选的实施例中,FPC板4两侧的焊点21并不局限于三个,具体可以根据实际的需求而定。In this embodiment, the conductive plate 2 and the magnetic bowl 12 are welded to form solder joints 21, the solder joints 21 are located on both sides of the FPC board 4, the number of solder joints 21 is three, and the three solder joints 21 represent three vertices of a triangle. Set up. The triangular welding area formed by the three welding points 21 not only enables the conductive plate 2 to be reliably welded to the magnetic bowl 12, but also saves welding costs. It can be understood that, in an alternative embodiment, the solder joints 21 on both sides of the FPC board 4 are not limited to three, and can be specifically determined according to actual requirements.
在本实施例中,导电板2为钢板,钢板具有强度高,抗高温、高压,耐腐蚀、磨损等优点。可以了解,在可选的实施例中,导电板2也可以为导电的金属板或者导电的合金板等。在本实施例中,钢板的厚度为0.1mm,经过大量的试验测试,0.1mm厚度的钢板不仅可以在满足强度要求的同时,使得发声装置10的导通效率最佳,而且可以节省材料成本。可以了解,在可选的实施例中,导电板2的厚度并不局限于0.1mm,可以在0.08-0.12mm的范围内进行选择。In this embodiment, the conductive plate 2 is a steel plate, which has the advantages of high strength, high temperature resistance, high pressure resistance, corrosion resistance, abrasion resistance, and the like. It can be understood that, in an alternative embodiment, the conductive plate 2 may also be a conductive metal plate or a conductive alloy plate. In this embodiment, the thickness of the steel plate is 0.1 mm. After a large number of experimental tests, a steel plate with a thickness of 0.1 mm can not only meet the strength requirements, but also optimize the conduction efficiency of the sound device 10, and can save material costs. It can be understood that, in an alternative embodiment, the thickness of the conductive plate 2 is not limited to 0.1 mm, and can be selected in the range of 0.08-0.12 mm.
在本实施例中,导电粘结层3为导电性压敏粘合剂,导电性压敏粘合剂又称为热固导电胶。可以了解,在可选的实施例中,导电粘结层3也可以为导电银胶或者其他的导电粘合剂。In this embodiment, the conductive adhesive layer 3 is a conductive pressure-sensitive adhesive, which is also called a thermosetting conductive adhesive. It can be understood that, in an alternative embodiment, the conductive adhesive layer 3 may also be conductive silver glue or other conductive adhesives.
在本实施例中,FPC板4上设有向外延伸的第一连接部41和第二连接部42,盆架11相对PBC板的侧面设有第一凸台111和第二凸台112。第一连接部41固定在第一凸台111内,并且和音圈引线电连接;第二连接部42固定在第二凸台112内,并且和音圈引线电连接。 In this embodiment, the FPC board 4 is provided with a first connecting portion 41 and a second connecting portion 42 extending outward, and the side of the basin frame 11 opposite to the PBC board is provided with a first boss 111 and a second boss 112. The first connecting portion 41 is fixed in the first boss 111 and electrically connected to the voice coil lead; the second connecting portion 42 is fixed in the second boss 112 and electrically connected to the voice coil lead.
图4是根据本发明的一个实施例的发声装置的制造流程图。包括如下步骤:Fig. 4 is a manufacturing flow chart of a sound emitting device according to an embodiment of the present invention. Including the following steps:
S102,将FPC板和导电粘合层的第一端面贴合;S102, bonding the FPC board and the first end surface of the conductive adhesive layer;
S104,将导电粘合层的第二端面和导电板的第一端面贴合;S104, bonding the second end surface of the conductive adhesive layer to the first end surface of the conductive plate;
S106,通过激光点焊将导电板的第二端面固定到磁碗上。S106: Fix the second end surface of the conductive plate to the magnetic bowl by laser spot welding.
以上所述的仅是本发明的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出改进,但这些均属于本发明的保护范围。The above are only the embodiments of the present invention. It should be pointed out here that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present invention, but these all belong to the present invention. The scope of protection.

Claims (9)

  1. 一种发声装置,其特征在于,包括发声单体以及与所述发声单体电连接的FPC板,所述发声单体包括盆架以及设置在所述盆架上的磁碗,所述FPC板通过导电板与所述磁碗电连接实现接地,所述导电板与所述磁碗焊接固定。A sound-producing device, characterized in that it comprises a sound-producing unit and an FPC board electrically connected to the sound-producing unit. The sound-producing unit includes a basin frame and a magnetic bowl arranged on the basin frame. The FPC board Grounding is achieved by electrically connecting the conductive plate and the magnetic bowl, and the conductive plate and the magnetic bowl are welded and fixed.
  2. 根据权利要求1所述的发声装置,所述FPC板通过导电粘接层与所述导电板固定。The sound emitting device according to claim 1, wherein the FPC board is fixed to the conductive board through a conductive adhesive layer.
  3. 根据权利要求2所述的发声装置,其特征在于:所述导电粘结层的面积小于所述导电板的面积。3. The sound emitting device according to claim 2, wherein the area of the conductive adhesive layer is smaller than the area of the conductive plate.
  4. 根据权利要求3所述的发声装置,其特征在于:所述FPC板完全覆盖所述导电粘结层,并且所述FPC板和所述导电粘结层在所述导电板上覆盖的面积相等。3. The sound emitting device of claim 3, wherein the FPC board completely covers the conductive adhesive layer, and the FPC board and the conductive adhesive layer cover the same area on the conductive plate.
  5. 根据权利要求1所述的发声装置,其特征在于:所述导电板与所述磁碗焊接形成焊点,所述焊点位于所述FPC板的两侧。The sound generating device according to claim 1, wherein the conductive plate and the magnetic bowl are welded to form solder joints, and the solder joints are located on both sides of the FPC board.
  6. 根据权利要求5所述的发声装置,其特征在于:所述焊点的数量为三个,三个所述焊点呈三角形的三个顶点设置。The sounding device according to claim 5, wherein the number of the solder joints is three, and the three solder joints are arranged at three vertices of a triangle.
  7. 根据权利要求1所述的发声装置,其特征在于:所述导电板为钢板。The sounding device according to claim 1, wherein the conductive plate is a steel plate.
  8. 根据权利要求1所述的发声装置,其特征在于:所述导电板的厚度为0.08-0.12mm。The sounding device according to claim 1, wherein the thickness of the conductive plate is 0.08-0.12 mm.
  9. 根据权利要求1所述的发声装置,其特征在于:所述导电粘结层为导电性压敏粘合剂。The sound generating device according to claim 1, wherein the conductive adhesive layer is a conductive pressure-sensitive adhesive.
PCT/CN2019/093229 2019-06-27 2019-06-27 Sound producing device WO2020258142A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2019/093229 WO2020258142A1 (en) 2019-06-27 2019-06-27 Sound producing device
CN201921002085.1U CN210183527U (en) 2019-06-27 2019-06-29 Sound producing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/093229 WO2020258142A1 (en) 2019-06-27 2019-06-27 Sound producing device

Publications (1)

Publication Number Publication Date
WO2020258142A1 true WO2020258142A1 (en) 2020-12-30

Family

ID=69839435

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/093229 WO2020258142A1 (en) 2019-06-27 2019-06-27 Sound producing device

Country Status (2)

Country Link
CN (1) CN210183527U (en)
WO (1) WO2020258142A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213126464U (en) * 2020-09-25 2021-05-04 瑞声科技(新加坡)有限公司 Sound production monomer and speaker box
CN112468908B (en) * 2020-12-18 2022-03-01 瑞声新能源发展(常州)有限公司科教城分公司 Loudspeaker enclosure and method of assembling the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080298629A1 (en) * 2007-05-31 2008-12-04 Kun-Li Huang Loudspeaker
CN103517189A (en) * 2012-06-29 2014-01-15 华为终端有限公司 Loudspeaker and terminal
CN206524965U (en) * 2017-01-22 2017-09-26 瑞声科技(新加坡)有限公司 Microphone device
CN206524946U (en) * 2017-01-20 2017-09-26 瑞声科技(新加坡)有限公司 Loudspeaker
CN206524961U (en) * 2017-01-20 2017-09-26 瑞声科技(新加坡)有限公司 Loudspeaker
CN107852550A (en) * 2015-05-08 2018-03-27 奥音科技(北京)有限公司 Electric capacity vibrating diaphragm locating and tracking
CN208908489U (en) * 2018-08-01 2019-05-28 瑞声科技(新加坡)有限公司 Loudspeaker

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080298629A1 (en) * 2007-05-31 2008-12-04 Kun-Li Huang Loudspeaker
CN103517189A (en) * 2012-06-29 2014-01-15 华为终端有限公司 Loudspeaker and terminal
CN107852550A (en) * 2015-05-08 2018-03-27 奥音科技(北京)有限公司 Electric capacity vibrating diaphragm locating and tracking
CN206524946U (en) * 2017-01-20 2017-09-26 瑞声科技(新加坡)有限公司 Loudspeaker
CN206524961U (en) * 2017-01-20 2017-09-26 瑞声科技(新加坡)有限公司 Loudspeaker
CN206524965U (en) * 2017-01-22 2017-09-26 瑞声科技(新加坡)有限公司 Microphone device
CN208908489U (en) * 2018-08-01 2019-05-28 瑞声科技(新加坡)有限公司 Loudspeaker

Also Published As

Publication number Publication date
CN210183527U (en) 2020-03-24

Similar Documents

Publication Publication Date Title
JP2005286984A (en) Speaker for mobile terminal and its manufacturing method
JP2008054068A (en) Piezoelectric electroacoustic transducer
CN204929238U (en) Miniature sounder
JPWO2007097077A1 (en) Piezoelectric sounding body
US10827276B2 (en) Micro-speaker
US10341779B2 (en) Miniature sounding device
WO2018058852A1 (en) Microacoustic device
JP3844012B2 (en) Piezoelectric electroacoustic transducer
JP3917746B2 (en) Piezoelectric sounder
JP2008028593A (en) Piezoelectric electroacoustic transducer
WO2020258142A1 (en) Sound producing device
WO2020029639A1 (en) Speaker
WO2020134370A1 (en) Sound generating component
US10820112B2 (en) Speaker
US10979823B2 (en) Sound generator
WO2021000210A1 (en) Loudspeaker box and electronic terminal device
CN109275073A (en) The assembly method and loudspeaker of loudspeaker
TW515219B (en) Microspeaker
CN204046803U (en) Minitype acoustic generator
KR20110103597A (en) High efficiency micro speaker of conductive glue
CN209823995U (en) Sound production device
KR100937335B1 (en) Micro speaker and method for fabricating the same
TWI663881B (en) Pronunciation device
WO2022088278A1 (en) Speaker and electronic terminal
WO2020133093A1 (en) Speaker

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19935247

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19935247

Country of ref document: EP

Kind code of ref document: A1