WO2020252865A1 - 有机发光显示面板及其制造方法、封装薄膜 - Google Patents

有机发光显示面板及其制造方法、封装薄膜 Download PDF

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Publication number
WO2020252865A1
WO2020252865A1 PCT/CN2019/099749 CN2019099749W WO2020252865A1 WO 2020252865 A1 WO2020252865 A1 WO 2020252865A1 CN 2019099749 W CN2019099749 W CN 2019099749W WO 2020252865 A1 WO2020252865 A1 WO 2020252865A1
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Prior art keywords
layer
organic light
inorganic
inorganic layer
emitting device
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English (en)
French (fr)
Inventor
马凯
王杲祯
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/623,519 priority Critical patent/US11201312B2/en
Publication of WO2020252865A1 publication Critical patent/WO2020252865A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of Organic Light-Emitting Diode (OLED) display, in particular to an organic light-emitting display panel, a manufacturing method thereof, and a packaging film.
  • OLED Organic Light-Emitting Diode
  • Organic light-emitting display panels have the advantages of low cost, wide viewing angle, high contrast, and bendable. At present, they have achieved remarkable results in small-size and large-size applications, and continue to invade liquid crystal displays (Liquid Crystal Display, LCD) market share.
  • LCD Liquid Crystal Display
  • Organic light-emitting devices are an important part of organic light-emitting display panels, and water and oxygen have a great impact on their lifespan.
  • the prior art organic light emitting display panel adopts thin film packaging (Thin Film Encapsulation, TFE) method for packaging organic light-emitting devices.
  • TFE Thifilm Encapsulation
  • the current encapsulation film used in the TFE method still has insufficient water and oxygen barrier capabilities, especially when covering stacked structures or steps, etc., the inorganic layer is prone to fracture or peeling in its bending area and boundary area (Peeling) , Thereby forming a water and oxygen channel.
  • water and oxygen molecules invade from the water and oxygen channels generated by the fracture of the inorganic layer through the water and oxygen channels.
  • the organic layer does not have the ability to block water and oxygen.
  • the water and oxygen molecules will quickly pass through the organic layer and then at the junction of the organic layer and the inorganic layer. Continue to move and continue to invade when it finds the water and oxygen channel generated by the fracture of the next inorganic layer until it invades the organic light-emitting device. It can be seen that the fracture of the inorganic layer will seriously affect the barrier ability of the packaging film to water and oxygen molecules.
  • the present invention provides an organic light-emitting display panel, which includes an organic light-emitting device, an inorganic layer encapsulating the organic light-emitting device, and an auxiliary encapsulation layer, the auxiliary encapsulation layer covering at least a bending area and a boundary area of the inorganic layer.
  • the present invention additionally provides an encapsulation film, which includes an inorganic substance layer and an auxiliary encapsulation layer, and the auxiliary encapsulation layer at least covers the bending area and the boundary area of the inorganic substance layer.
  • the present invention also provides a manufacturing method of an organic light emitting display panel, including:
  • An auxiliary encapsulation layer is formed on the outer surface of the inorganic layer, and the auxiliary encapsulation layer covers at least the bending area and the boundary area of the inorganic layer.
  • an auxiliary encapsulation layer is added outside the inorganic layer, and the auxiliary encapsulation layer covers at least the bending area and boundary area of the inorganic layer. Even if the inorganic layer is broken or peeled off in the bending area and boundary area, the The water and oxygen channels generated at the fracture or peeling point will also be blocked by the auxiliary packaging layer, thereby ensuring the water and oxygen barrier ability of the packaging film to the organic light-emitting device.
  • FIG. 1 is a schematic structural diagram of an embodiment of the packaging film of the present invention
  • FIG. 2 is a partial cross-sectional view of an embodiment of the organic light emitting display panel of the present invention.
  • FIG. 3 is a top view of the structure of an embodiment of the auxiliary packaging layer of the present invention.
  • FIG. 4 is a schematic flowchart of an embodiment of a method for manufacturing an organic light emitting display panel of the present invention
  • FIG. 5 is a schematic flowchart of another embodiment of a method for manufacturing an organic light emitting display panel of the present invention.
  • a primary purpose of the present invention is to add an auxiliary encapsulation layer outside the inorganic layer, and the auxiliary encapsulation layer at least covers the bending area and boundary area of the inorganic layer, that is, the inorganic layer is most prone to fracture Or an auxiliary encapsulation layer is added to the peeled bending area and boundary area, even if the inorganic layer is broken or peeled in its bending area and boundary area, the water and oxygen channels generated at the fracture or peeling will be blocked by the auxiliary encapsulation layer In order to ensure that the packaging film still has a strong water and oxygen barrier to organic light-emitting devices.
  • FIG. 1 is a schematic structural diagram of an embodiment of the packaging film of the present invention.
  • the packaging film 100 includes a main packaging layer 110 and an auxiliary packaging layer 120.
  • the top surface of the area where the main packaging layer 110 covers the protruding structure has a height difference from the top surfaces of other areas, that is, the top surfaces of the two areas are not aligned. Therefore, as shown in FIG. 1, when the main encapsulation layer 110 is covered, it may bend due to the height difference, that is, there is a bending area 110 a shown by a dashed line in the figure. The main encapsulation layer 110 is deformed in the bending area 110a and easily breaks. In addition, the main packaging layer 110 is also prone to peeling off at the interface with the substrate 200 carrying the protruding structure, that is, the boundary area 110b of the main packaging layer 110 shown by the dashed line in the figure.
  • the auxiliary packaging layer 120 covers the outer surface of the main packaging layer 110, and at least covers the bending area 110a and the boundary area 110b.
  • the auxiliary encapsulation layer 120 not only covers the bending area 110a and the boundary area 110b, but also extends outward and is attached to a part of the substrate 200 to achieve a larger area of coverage.
  • the encapsulation film 100 adds an auxiliary encapsulation layer 120 to the bending area 110a and the boundary area 110b of the main encapsulation layer 110 that are most likely to be broken or peeled. Even if the main encapsulation layer 110 is broken or peeled in these two areas, The water and oxygen channels generated at the fracture or peeling will also be blocked by the auxiliary packaging layer 120, so as to ensure that the packaging film 100 still has a strong water and oxygen barrier to the packaged device, which is beneficial to ensure the normal use of the packaged device.
  • the material of the main encapsulation layer 110 may be an inorganic substance, such as one or more of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and the like.
  • the presence of the bending area 110a allows the main encapsulation layer 110 to cover the device it protects.
  • the covered device may have an uneven surface, such as a protruding mesa structure. In this case, the covered device may have an uneven surface.
  • the area 110a covers the flat surface part of the protected device, and the bent area 110a covers the above-mentioned protruding mesa structure, so as to realize the main packaging layer 110 adaptable to the device it protects. Combine and cover.
  • the auxiliary encapsulation layer 120 may be made of materials with high step coverage and good film-forming compactness, such as inorganic substances, including but not limited to one or more of aluminum oxide, zirconium oxide, and titanium oxide.
  • the material of the auxiliary encapsulation layer 120 is alumina, and the auxiliary encapsulation layer 120 may be deposited by atomic layer deposition (Atomic Layer Deposition, ALD) process.
  • ALD atomic layer deposition
  • physical vapor deposition Physical Vapor Deposition
  • the thickness of the auxiliary encapsulation layer 120 may be smaller than the thickness of the main encapsulation layer 110, and the step coverage of the main encapsulation layer 110 may be smaller than the step coverage of the auxiliary encapsulation layer 120.
  • step coverage can be understood as the coverage effect of the encapsulation layer on structures with height differences.
  • the encapsulation layer covers the higher part and covers the lower part, and the encapsulation layer (such as the main encapsulation layer 110) at the high-low junction A bending area is generated. If the packaging layer does not break in the bending area, that is, complete coverage is not formed, then it is considered that the step coverage of the packaging layer and the material constituting the packaging layer is low; if there is no fracture, It is considered that the step coverage of the encapsulation layer and the material constituting the encapsulation layer is relatively high.
  • the auxiliary encapsulation layer 120 can cover one side of the main encapsulation layer 110, and is not limited to the outer surface shown in FIG. 1.
  • the present invention can cover the auxiliary encapsulation layer 120 on the inner surface of the main encapsulation layer 110 according to actual application scenarios or requirements. Or both sides.
  • the aforementioned encapsulation film 100 covers the surface to be encapsulated with different characteristics through the combination of the main encapsulation layer 110 and the auxiliary encapsulation layer 120 according to their respective structural characteristics, that is, the main encapsulation layer 110 covers the entire coverage area, and the auxiliary encapsulation
  • the layer 120 is designed to compensate or strengthen coverage for the areas where the main encapsulation layer 110 is not well covered (that is, the bending area 110a that is prone to breakage and the boundary area 110b that is prone to peeling). When the main encapsulation layer 110 is broken and peeled, it assists The encapsulation layer 120 allows the encapsulation film 100 to still have a complete film layer that blocks water and oxygen molecules.
  • the auxiliary encapsulation layer 120 can be used to reinforce the above-mentioned areas of the main encapsulation layer 110 that may be fractured and peeled, thereby Provide a layer with a higher water and oxygen barrier on one side of the protected device.
  • its water and oxygen barrier can be between 10 -4 ⁇ 10 -6 g/cm 2 /day, and the water and oxygen barrier is very good, which is very effective for the protected device.
  • the packaging effect is very ideal.
  • packaging film 100 can be applied to the packaging structure of an organic light emitting display panel to provide protection for components including organic light emitting devices.
  • the encapsulation of the organic light emitting device is taken as an example below, and detailed description will be given in conjunction with the drawings.
  • the organic light emitting display panel may include an encapsulation film 100, a substrate 200, and an organic light emitting device 300.
  • the organic light emitting device 300 is disposed on the substrate 200 and is located in the pixel area defined by the pixel definition layer, and the packaging film 100 encapsulates the organic light emitting device 300 on the substrate 200.
  • the substrate 200 is a base substrate of an organic light-emitting display panel, and is used to carry various structural layers and electronic components of the organic light-emitting display panel.
  • the substrate 200 may be a flexible board with bendable characteristics, and its main component includes but is not limited to polyimide (PI).
  • the substrate 200 may be covered with a buffer layer, which has a water and oxygen barrier function, and its main components include but are not limited to silicon nitrogen compounds, silicon oxygen compounds, silicon oxynitride, and the like.
  • the substrate 200 may also be provided with various switching devices and wiring for realizing screen display of the organic light emitting display panel, such as TFT (Thin Film Transistor, thin film transistor).
  • TFT Thin Film Transistor, thin film transistor
  • the organic light emitting device 300 may include a control circuit layer (also called an Array circuit layer), an anode, a hole transport layer (HTL), an organic light emitting layer, an electron transport layer (ETL), and a cathode, which are sequentially arranged on the substrate 200.
  • a control circuit layer also called an Array circuit layer
  • an anode also called an Array circuit layer
  • HTL hole transport layer
  • organic light emitting layer organic light emitting layer
  • ETL electron transport layer
  • cathode cathode
  • the packaging film 100 may include a second inorganic layer 110 (ie, the aforementioned main packaging layer 110), an auxiliary packaging layer 120, an organic layer 130, and a first inorganic layer 140.
  • the first inorganic substance layer 140 covers the cathode of the organic light emitting device 300 and covers the pixel definition layer. At the same time, the first inorganic substance layer 140 also extends to the side of the organic light emitting device 300 to encapsulate the organic light emitting device 300 on the substrate. 200 up.
  • the organic substance layer 130 is disposed on the first inorganic substance layer 140, and it can be made by using an ink-jet printing (IJP) process.
  • IJP ink-jet printing
  • the second inorganic layer 110 covers the organic layer 130 and extends to the side of the organic layer 130 to cover the first inorganic layer 140 and a part of the substrate 200.
  • the second inorganic layer 110 has a function of blocking water and oxygen, and may be made of inorganic materials.
  • the material and manufacturing process of the second inorganic layer 110 and the first inorganic layer 140 may be the same, for example, chemical vapor deposition (CVD) processes may be used.
  • the organic light emitting device 300 and the substrate 200 have a height difference, and the step coverage of the first inorganic layer 140 is poor due to the material properties of inorganic substances such as silicon nitride, silicon oxide, and silicon oxynitride, and the first inorganic layer 140
  • the thickness is usually between 0.5-1.5 ⁇ m, so that when the first inorganic layer 140 is formed on the organic light-emitting device 300, it is likely to be broken in the bending area 140a, and at the boundary with the substrate 200 The area 140b is peeled off.
  • the second inorganic layer 110 is likely to be broken in the bending area 110a during film formation, and peeling off in the boundary area 110b contacting the substrate 200.
  • the auxiliary encapsulation layer 120 is disposed on the outer surface of the second inorganic layer 110, and it covers at least the bending area 110a and the boundary area 110b.
  • the auxiliary encapsulation layer 120 is disposed around the organic light emitting device 300.
  • the thickness of the auxiliary encapsulation layer 120 can be between 50 and 100 nm. Referring to FIG. 3, the width d can be between 100 and 200 um.
  • the material can be made of a material with higher step coverage and better film density.
  • inorganic substances include, but are not limited to, one or more of alumina, zirconia, and titania.
  • the auxiliary encapsulation layer 120 may be made by an atomic layer deposition process. in particular:
  • an atomic layer deposition process is used to form an entire inorganic layer covering the organic layer 130.
  • the entire inorganic layer not only covers the bending area 110a and the boundary area 110b, but also completely covers Directly above the organic light emitting device 300; then, a layer of photoresist is coated on the whole surface of the inorganic layer, and the photoresist completely covers the whole surface of the inorganic layer; The photoresist is exposed, and the light-transmitting area of the photomask corresponds to directly above the organic light-emitting device 300, thereby exposing the photoresist directly above the organic light-emitting device 300, and the exposed part of the photoresist can be Development and removal.
  • the inorganic layer directly above the organic light-emitting device 300 is exposed, and the unexposed part of the photoresist still covers the entire surface of the inorganic layer; further, the exposed part of the inorganic layer is Etching is performed to remove the exposed part of the inorganic layer; finally, ashing is used to remove the remaining photoresist, and the remaining inorganic layer can be used to obtain the auxiliary encapsulation layer 120.
  • the auxiliary encapsulation layer 120 can also be prepared by any film forming process such as physical vapor deposition, pulsed laser deposition, magnetron sputtering and the like.
  • the thickness of the auxiliary encapsulation layer 120 may be smaller than the thickness of the main encapsulation layer 110, and the step coverage of the second inorganic layer 110 may be smaller than that of the auxiliary encapsulation layer 120.
  • the organic light-emitting display panel combines the second inorganic layer 110 and the auxiliary encapsulation layer 120, and according to their respective structural characteristics, forms the organic light-emitting device 300 with different characteristics, that is, the second inorganic layer 110 can be regarded as Covering the entire coverage area, and the auxiliary encapsulation layer 120 can compensate or strengthen the coverage for the areas where the second inorganic layer 110 has a poor coverage effect (that is, the aforementioned bending area 110a that is prone to breakage and the boundary area 110b that is prone to peeling) .
  • the auxiliary encapsulation layer 120 can ensure that the encapsulation film 100 still has a complete film layer that blocks water and oxygen molecules.
  • the auxiliary encapsulation layer 120 may be used to reinforce the above-mentioned areas of the second inorganic layer 110 that may be broken and peeled, so as to provide a film layer with higher water and oxygen barrier capability on the side of the organic light emitting device 700 as much as possible.
  • the outer surface of the first inorganic layer 140 may also be covered with an auxiliary encapsulation layer 120, which covers the bending area of the first inorganic layer 140 140a and border area 140b.
  • the auxiliary encapsulation layer 120 also forms compensation or strengthened coverage for the areas where the first inorganic layer 140 has a poor coverage effect, and the water and oxygen channels of the first inorganic layer 140 at the fracture will be blocked by the auxiliary encapsulation layer 120, thereby The water and oxygen barrier capability of the organic light emitting device 300 is further ensured.
  • the auxiliary encapsulation layer 120 can be made of a transparent material, and on the basis of the foregoing, it can further cover directly above the organic light emitting device 300.
  • At least one of the first inorganic layer 140, the organic layer 130, the second inorganic layer 110, and the auxiliary encapsulation layer 120 may be doped with a water-absorbing material.
  • the water-absorbing material can be used to absorb water molecules invaded into the first inorganic layer 140, the organic layer 130, the second inorganic layer 110 and the auxiliary encapsulation layer 120.
  • the introduction of the water-absorbing material provides another layer for blocking water molecules. The guarantee increases the difficulty for water molecules to reach the organic light emitting device 300, and further improves the ability to block water molecules.
  • the water-absorbing material includes, but is not limited to, nano-scale calcium oxide, that is, nano-scale calcium oxide particles.
  • the doping concentration of the water-absorbing material can be directed along the organic light emitting device 300 to the bending area 110a and the boundary area of the second inorganic layer 110.
  • the direction of 110b increases sequentially, that is, the closer to the area where fracture and peeling may occur, the higher the doping concentration of the water-absorbing material.
  • the manufacturing method of the organic light emitting display panel includes:
  • S402 forming an organic light-emitting device and an inorganic layer encapsulating the organic light-emitting device on a substrate.
  • the manufacturing method adds an auxiliary encapsulation layer on the outer surface of the inorganic layer, and the auxiliary encapsulation layer covers at least the bending area and the boundary area of the inorganic layer, that is, the inorganic layer is most likely to be broken or peeled.
  • An auxiliary encapsulation layer is added to the bending area and the boundary area. Even if the inorganic layer is broken or peeled off in the bending area and the boundary area, the water and oxygen channel generated at the fracture or peeling will be blocked by the auxiliary encapsulation layer. Ensure that the packaging film still has a strong water and oxygen barrier to the organic light-emitting device.
  • the manufacturing method can be used to manufacture the aforementioned organic light emitting display panel, and the various structural elements prepared by the manufacturing method can be referred to above.
  • the manufacturing method of the organic light emitting display panel may include the following steps:
  • S505 forming a second inorganic layer covering the organic layer and the first inorganic layer.
  • S506 Form an auxiliary encapsulation layer on the outer surface of the second inorganic layer, the auxiliary encapsulation layer covering at least the bending area and the boundary area of the second inorganic layer.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

本发明公开一种有机发光显示面板及其制造方法、封装薄膜。本发明通过在无机物层的外侧增设辅助封装层，且该辅助封装层至少覆盖无机物层的弯折区域和边界区域，即使无机物层在弯折区域和边界区域发生断裂或剥离，在该断裂或剥离处产生的水氧通道也会被辅助封装层阻断，从而确保封装薄膜对有机发光器件的水氧阻隔能力。

Description

有机发光显示面板及其制造方法、封装薄膜 技术领域
本发明涉及有机发光（Organic Light-Emitting Diode, OLED）显示领域，尤其涉及一种有机发光显示面板及其制造方法、封装薄膜。
 背景技术
有机发光显示面板具有成本低、视角宽、对比度高、以及可弯折等优点，目前在小尺寸和大尺寸等方面的应用均取得显著成效，并在不断侵占液晶显示器（Liquid Crystal Display, LCD）的市场份额。
有机发光器件作为有机发光显示面板的重要组成部分，水氧对其寿命存在较大影响，一是容易与有机发光器件的阴极的导电材料发生反应；二是容易与有机发光器件的空穴传输层和电子传输层发生化学反应，进而引起有机发光器件失效。为了解决这个问题，现有技术的有机发光显示面板采用薄膜封装（Thin Film Encapsulation, TFE）方式对有机发光器件进行封装。TFE方式所采用的封装薄膜包括交叠的无机物层和有机物层，用以防止水氧入侵至有机发光器件。
但是，当前TFE方式所采用的封装薄膜对水氧的阻隔能力仍有不足，尤其是在覆盖堆叠结构或台阶等时，无机物层容易在其弯折区域以及边界区域发生断裂或剥离（Peeling），从而形成水氧通道。具体地，水氧分子通过水氧通道从无机物层断裂产生的水氧通道侵入，有机物层没有阻隔水氧的能力，水氧分子会快速通过有机物层，然后在有机物层和无机物层的交界继续移动，并在找到下一个无机物层断裂产生的水氧通道时继续向内侵入，直至入侵至有机发光器件。由此可见，无机物层的断裂会严重影响封装薄膜对水氧分子的阻隔能力。
 技术问题
现有的无机物层发生断裂或剥离时会导致封装薄膜对有机发光器件的水氧阻隔能力不足的问题。
 技术解决方案
本发明提供一种有机发光显示面板，包括有机发光器件、封装所述有机发光器件的无机物层和辅助封装层，所述辅助封装层至少覆盖所述无机物层的弯折区域和边界区域。
本发明另外提供一种封装薄膜，包括无机物层和辅助封装层，辅助封装层至少覆盖无机物层的弯折区域和边界区域。
本发明还提供一种有机发光显示面板的制造方法，包括：
提供基板；
在所述基板上形成有机发光器件及封装有机发光器件的无机物层；
在所述无机物层的外表面形成辅助封装层，所述辅助封装层至少覆盖所述无机物层的弯折区域和边界区域。
 有益效果
本发明通过在无机物层的外侧增设辅助封装层，且该辅助封装层至少覆盖无机物层的弯折区域和边界区域，即使无机物层在弯折区域和边界区域发生断裂或剥离，在该断裂或剥离处产生的水氧通道也会被辅助封装层阻断，从而确保封装薄膜对有机发光器件的水氧阻隔能力。
 附图说明
图1是本发明的封装薄膜一实施例的结构示意图；
图2是本发明的有机发光显示面板一实施例的局部结构剖视图；
图3是本发明的辅助封装层一实施例的结构俯视图；
图4是本发明的有机发光显示面板的制造方法一实施例的流程示意图；
图5是本发明的有机发光显示面板的制造方法另一实施例的流程示意图。
 本发明的实施方式
本发明的一首要目的是：通过在无机物层的外侧增设辅助封装层，且该辅助封装层至少覆盖无机物层的弯折区域和边界区域，也就是说，在无机物层最容易发生断裂或剥离的弯折区域和边界区域增设辅助封装层，即使无机物层在其弯折区域和边界区域发生断裂或剥离，在该断裂或剥离处产生的水氧通道也会被辅助封装层阻断，以此确保封装薄膜仍然具有较强的对有机发光器件的水氧阻隔能力。
下面将结合本发明的附图，对本发明所提供的各个示例性的实施例提供的技术方案进行清楚、完整地描述。本领域普通技术人员应当理解的是，本发明各实施例旨在用于解释本发明，而不能理解为对本发明的限制。在不冲突的情况下，下述各个实施例及其技术特征可以相互组合。且在本发明实施例的附图中，相同或类似的标号自始至终表示相同或类似的结构元件或具有相同或类似功能的元件。
本发明提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附图的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
图1为本发明的封装薄膜一实施例的结构示意图。参见图1，所述封装薄膜100包括主封装层110和辅助封装层120。
在封装薄膜100覆盖堆叠结构或台阶等凸出结构时，所述主封装层110覆盖凸出结构的区域的顶面和其他区域的顶面具有高度差，即这两个区域的顶面未齐平，由此，如图1所示，主封装层110覆盖时会因存在所述高度差而发生弯折，即存在图中虚线所示的弯折区域110a。主封装层110在该弯折区域110a发生形变而容易发生断裂。另外，所述主封装层110在与承载该凸出结构的基板200的交界处，即图中虚线所示的主封装层110的边界区域110b，也容易发生剥离。
所述辅助封装层120覆盖在主封装层110的外表面，且其至少覆盖所述弯折区域110a和边界区域110b。在一实施例中，辅助封装层120不仅覆盖弯折区域110a和边界区域110b，同时还会向外延伸并与基板200的一部分贴合以实现较大面积的覆盖。
所述封装薄膜100通过在主封装层110的最容易发生断裂或剥离的弯折区域110a和边界区域110b增设辅助封装层120，即使主封装层110在这两处区域发生断裂或剥离，在该断裂或剥离处产生的水氧通道也会被辅助封装层120阻断，以此确保封装薄膜100仍然具有较强的对所封装器件的水氧阻隔能力，有利于保障所封装器件的正常使用。
详细而言，所述主封装层110的材料可以是无机物，例如硅的氮化物、硅的氮氧化物、硅的氧化物、铝的氧化物等的一种或多种。所述弯折区域110a的存在允许主封装层110在覆盖其所保护的器件时，被覆盖的器件可以具有不平整的表面，例如具有凸出的台状结构，在这种情况下，弯折区域110a覆盖在被保护器件的具有平整表面的部分，而所述弯折区域110a覆盖在上述凸出的台状结构上，以此实现主封装层110对其所保护的器件具有适应性的贴合以及覆盖。
所述辅助封装层120可选用台阶覆盖率较高、成膜致密性较好的材料制得，例如无机物，包括但不限于为氧化铝、氧化锆、氧化钛的一种或多种。在一具体实施例中，所述辅助封装层120的材质为氧化铝，辅助封装层120可以通过原子层沉积（Atomic Layer Deposition, ALD）工艺制得。当然，根据各种材质的成膜特性，具体实施例也可以采用物理气相沉积（Physical Vapor Deposition, PVD）、脉冲激光沉积（Pulsed laser deposition, PLD）、磁控溅射等任一种成膜工艺制得辅助封装层120。所述辅助封装层120的厚度可以小于主封装层110的厚度，而主封装层110的台阶覆盖率可以小于辅助封装层120的台阶覆盖率。
应当指出，所谓台阶覆盖率可以理解为封装层对存在高度落差的结构的覆盖效果。举例而言，对于上述存在高度落差的结构的覆盖场景，封装层对较高的部分形成了覆盖，对较低的部分也形成了覆盖，而在高低交界处封装层（例如主封装层110）产生了弯折区域，如果封装层在该弯折区域没有发生断裂即未形成完整的覆盖，此时就认为该封装层和构成该封装层的材料的台阶覆盖率较低；若不存在断裂，则认为该封装层和构成该封装层的材料的台阶覆盖率较高。
该辅助封装层120可以覆盖在主封装层110的一侧，并不限于图1所示的外表面，本发明可以根据实际应用场景或需求将辅助封装层120覆盖在主封装层110的内表面或者两侧表面。
前述封装薄膜100通过主封装层110和辅助封装层120的组合，根据各自的结构特点，对所要封装的表面形成不同特点的覆盖，即主封装层110为整个覆盖范围内的覆盖，而辅助封装层120针对主封装层110覆盖效果欠佳的区域（即容易发生断裂的弯折区域110a和容易发生剥离的边界区域110b）形成弥补或加强覆盖，当主封装层110上出现断裂及剥离时，辅助封装层120使得封装薄膜100依然具有完整的阻隔水氧分子的膜层，而当不存在上述断裂时，辅助封装层120可用于加强主封装层110的上述有可能产生断裂及剥离的区域，从而在被保护器件的一侧提供水氧阻隔能力较高的膜层。例如，对于采用氧化铝制得的辅助封装层120，其水氧阻隔性可以介于10 -4~10 -6g/cm 2/day之间，水氧阻隔能力非常良好，对被保护器件的封装效果非常理想。
应当指出的是，上述封装薄膜100可以应用于有机发光显示面板的封装结构中，为包括有机发光器件在内的部件提供保护。下面以对有机发光器件进行封装为例，并结合附图进行详细介绍。
图2为本发明的有机发光显示面板一实施例的局部结构剖视图。参见图2，有机发光显示面板可以包括封装薄膜100、基板200及有机发光器件300。有机发光器件300设置于基板200上且位于像素定义层限定的像素区域内，封装薄膜100将有机发光器件300封装于基板200上。
所述基板200为有机发光显示面板的衬底基板，用于承载有机发光显示面板的各结构层及电子元件。为适应于有机发光显示面板的可弯折特性，基板200可以是具有可弯折特性的柔性板件，其主要成分包括但不限于为聚酰亚胺（Polyimide, PI）。可选地，基板200可覆盖有缓冲层（buffer layer），该缓冲层具有阻水隔氧功能，其主要成分包括不限于硅氮化合物、硅氧化合物、硅氮氧化物等。另外，该基板200还可以设置有用于实现有机发光显示面板进行画面显示的各种开关器件以及走线等，例如TFT（Thin Film Transistor, 薄膜晶体管）。
所述有机发光器件300可以包括依次设置于基板200上的控制电路层（又称Array电路层 ）、阳极、空穴传输层（HTL）、有机发光层、电子传输层（ETL）以及阴极，具体可参阅现有技术。
所述封装薄膜100可以包括第二无机物层110（即前述主封装层110）、辅助封装层120、有机物层130以及第一无机物层140。
所述第一无机物层140覆盖于有机发光器件300的阴极上，并覆盖像素定义层，同时第一无机物层140还向有机发光器件300的侧方延伸以将有机发光器件300封装于基板200上。
所述有机物层130设置于第一无机物层140上，其可以采用喷墨打印（Ink-jet Printing, IJP）工艺制得。
所述第二无机物层110覆盖有机物层130，并向有机物层130的侧方延伸以覆盖第一无机物层140、及基板200的一部分。第二无机物层110具有阻水隔氧功能，可以采用无机材料制得。可选地，第二无机物层110和第一无机物层140的材质、制造工艺等可以相同，例如可以均采用化学气相沉积（Chemical Vapor Deposition, CVD）工艺。
有机发光器件300和基板200具有高度差，且由于氮化硅、氧化硅、氮氧化硅等无机物的材料特性导致第一无机物层140的台阶覆盖率较差，并且第一无机物层140的厚度通常介于0.5-1.5μm之间，从而使得第一无机物层140在有机发光器件300上成膜时很大几率在其弯折区域140a发生断裂，并且在与基板200相接的边界区域140b发生剥离。同理，第二无机物层110在成膜时很大几率在其弯折区域110a发生断裂，并且在与基板200相接的边界区域110b发生剥离。
所述辅助封装层120设置于第二无机物层110的外表面，且其至少覆盖弯折区域110a和边界区域110b。可选地，结合图3所示，所述辅助封装层120围绕所述有机发光器件300设置。
所述辅助封装层120的厚度可以介于50~100nm，参阅图3，宽度d可以介于100~200um之间，其材料可选用台阶覆盖率较高、成膜致密性较好的材料制得，例如无机物，包括但不限于为氧化铝、氧化锆、氧化钛的一种或多种。在一种具体实施例中，所述封辅助封装层120可以采用原子层沉积的工艺制得。具体而言：
请一并参阅图2和图3，首先采用原子层沉积工艺形成覆盖有机物层130的一整面无机物层，该一整面无机物层不仅覆盖弯折区域110a和边界区域110b，还完全覆盖有机发光器件300的正上方；然后，在该一整面无机物层上涂覆一层光刻胶，该光刻胶完全覆盖所述一整面无机物层；接着，采用光罩对这层光刻胶进行曝光，光罩的透光区域与所述有机发光器件300的正上方相对应，从而对位于有机发光器件300的正上方的光刻胶进行曝光，曝光部分的光刻胶可被显影去除，此时位于有机发光器件300的正上方的无机物层得以暴露，而未被曝光部分的光刻胶仍覆盖于一整面无机物层上；进一步，对无机物层的暴露部分进行刻蚀，以去除该暴露部分的无机物层；最后，灰化去除剩余的光刻胶，剩余的无机物层即可制得所述封辅助封装层120。
当然，根据具体实施使用材料的性质，辅助封装层120也可以采用如物理气相沉积、脉冲激光沉积、磁控溅射等任一种成膜工艺制备。辅助封装层120的厚度可以小于主封装层110的厚度，而第二无机物层110的台阶覆盖率可以小于辅助封装层120的台阶覆盖率。
所述有机发光显示面板通过第二无机物层110和辅助封装层120的组合，根据两者各自的结构特点，对有机发光器件300形成不同特点的封装，即第二无机物层110可视为整个覆盖范围内的覆盖，而辅助封装层120针对第二无机物层110覆盖效果欠佳的区域（即前述容易发生断裂的弯折区域110a和容易发生剥离的边界区域110b）形成弥补或加强覆盖。当第二无机物层110出现断裂及剥离时，所述辅助封装层120能够保证封装薄膜100依然具有完整的阻隔水氧分子的膜层，而当不存在上述断裂及剥离时，所述辅助封装层120可以用于加强第二无机物层110的上述有可能产生断裂及剥离的区域，从而尽可能的在有机发光器件700的一侧提供水氧阻隔能力较高的膜层。
基于辅助封装层120的特点，在前述实施例的基础上，第一无机物层140的外表面也可以覆盖有辅助封装层120，该辅助封装层120覆盖第一无机物层140的弯折区域140a和边界区域140b。此时，辅助封装层120同样对第一无机物层140覆盖效果欠佳的区域形成弥补或加强覆盖，第一无机物层140在断裂处的水氧通道会被辅助封装层120阻断，从而进一步确保对有机发光器件300的水氧阻隔能力。
当然，所述封辅助封装层120可以采用透明材质制得，在前述基础上，其可以进一步覆盖有机发光器件300的正上方。
请继续参见图2，在一具体实施例中，所述第一无机物层140、有机物层130、第二无机物层110以及辅助封装层120中的至少一者可以掺杂有吸水材料。该吸水材料可用于对侵入至第一无机物层140、有机物层130、第二无机物层110及辅助封装层120中的水分子进行吸收，吸水材料的引入为阻隔水分子提供了又一层保障，增加了水分子到达有机发光器件300的难度，进一步提高了阻隔水分子的能力。
该吸水材料包括但不限于大小尺度在纳米级别的氧化钙，即纳米级氧化钙颗粒，吸水材料的掺杂浓度可以沿有机发光器件300指向第二无机物层110的弯折区域110a和边界区域110b的方向依次递增，即越靠近可能发生断裂及剥离的区域，吸水材料的掺杂浓度越高。
图4为本发明的有机发光显示面板的制造方法一实施例的流程示意图。请参见图4，所述有机发光显示面板的制造方法包括：
S401：提供基板。
S402：在基板上形成有机发光器件及封装有机发光器件的无机物层。
S403：在所述无机物层的外表面形成辅助封装层，所述辅助封装层至少覆盖无机物层的弯折区域和边界区域。
所述制造方法通过在无机物层的外表面增设辅助封装层，且该辅助封装层至少覆盖无机物层的弯折区域和边界区域，也就是说，在无机物层最容易发生断裂或剥离的弯折区域和边界区域增设辅助封装层，即使无机物层在其弯折区域和边界区域发生断裂或剥离，在该断裂或剥离处产生的水氧通道也会被辅助封装层阻断，以此确保封装薄膜仍然具有较强的对有机发光器件的水氧阻隔能力。
所述制造方法可用于制造前述有机发光显示面板，该制造方法所制备的各个结构元件可参阅上述。例如，对于在有机发光显示面板的第二无机物层的外表面形成辅助封装层的场景，请参见图5，所述有机发光显示面板的制造方法可以包括如下步骤：
S501：提供基板。
S502：在基板上形成有机发光器件。
S503：形成覆盖有机发光器件的第一无机物层。
S504：在所述第一无机物层上形成有机物层。
S505：形成覆盖有机物层和第一无机物层的第二无机物层。
S506：在第二无机物层的外表面形成辅助封装层，所述辅助封装层至少覆盖第二无机物层的弯折区域和边界区域。
尽管已经相对于一个或多个实现方式示出并描述了本发明，但是本领域技术人员基于对本说明书和附图的阅读和理解将会想到等价变型和修改。本发明包括所有这样的修改和变型，并且仅由所附权利要求的范围限制。特别地关于由上述组件执行的各种功能，用于描述这样的组件的术语旨在对应于执行所述组件的指定功能（例如其在功能上是等价的）的任意组件（除非另外指示），即使在结构上与执行本文所示的本说明书的示范性实现方式中的功能的公开结构不等同。此外，尽管本说明书的特定特征已经相对于若干实现方式中的仅一个被公开，但是这种特征可以与如可以对给定或特定应用而言是期望和有利的其他实现方式的一个或多个其他特征组合。而且，就术语“包括”、“具有”、“含有”或其变形被用在具体实施方式或权利要求中而言，这样的术语旨在以与术语“包含”相似的方式包括。进一步地，应当理解的是，在本文中提及的“多个”是指两个或两个以上。对于本文中提及的步骤，其通过数字后缀仅仅是为了清晰表述实施例，便于理解，并不完全代表步骤执行的先后顺序，应当以逻辑关系的先后设定为思考。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，例如各实施例之间技术特征的相互结合，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (14)

  1. 一种有机发光显示面板，包括有机发光器件，其中，所述有机发光显示面板还包括封装有机发光器件的无机物层和辅助封装层，所述辅助封装层至少覆盖所述无机物层的弯折区域和边界区域。
  2. 根据权利要求1所述有机发光显示面板，其中，所述无机物层包括第一无机物层和第二无机物层，所述有机发光显示面板还包括有机物层，所述第一无机物层、有机物层和第二无机物层依次层叠，所述辅助封装层围绕所述有机发光器件设置且覆盖于所述第二无机物层的外表面。
  3. 根据权利要求1所述有机发光显示面板，其中，所述辅助封装层的材料成份包括氧化铝、氧化锆、氧化钛的一种或多种。
  4. 根据权利要求2所述的有机发光显示面板，其中，所述第一无机物层、有机物层、第二无机物层及辅助封装层的至少一者掺杂有吸水材料。
  5. 根据权利要求4所述的有机发光显示面板，其中，沿所述有机发光器件指向所述第二无机物层的弯折区域和边界区域的方向，所述吸水材料的浓度依次递增。
  6. 一种封装薄膜，其中，包括无机物层和辅助封装层，所述辅助封装层至少覆盖所述无机物层的弯折区域和边界区域。
  7. 根据权利要求6所述的封装薄膜，其中，所述辅助封装层的材料成份包括氧化铝、氧化锆、氧化钛的一种或多种。
  8. 根据权利要求6所述的封装薄膜，其中，所述主封装层和辅助封装层的至少一者掺杂有吸水材料。
  9. 根据权利要求8所述的封装薄膜，其中，沿朝向所述弯折区域和边界区域的方向，所述吸水材料的浓度依次递增。
  10. 一种有机发光显示面板的制造方法，其中，所述方法包括：
    提供基板；
    在所述基板上形成有机发光器件及封装有机发光器件的无机物层；
    在所述无机物层的外表面形成辅助封装层，所述辅助封装层至少覆盖所述无机物层的弯折区域和边界区域。
  11. 根据权利要求10所述的方法，其中，
    在所述基板上形成有机发光器件及封装有机发光器件的无机物层，包括：依次形成有机发光器件和层叠且覆盖所述有机发光器件的第一无机物层、有机物层、第二无机物层；
    在所述无机物层的外表面形成辅助封装层，包括：形成覆盖于所述第二无机物层的外表面的辅助封装层，所述辅助封装层围绕所述有机发光器件设置。
  12. 根据权利要求11所述的方法，其中，采用包括氧化铝、氧化锆、氧化钛的一种或多种材料形成所述辅助封装层。
  13. 根据权利要求11所述的方法，其中，所述第一无机物层、有机物层、第二无机物层及辅助封装层的至少一者掺杂有吸水材料。
  14. 根据权利要求13所述的方法，其中，沿所述有机发光器件指向所述第二无机物层的弯折区域和边界区域的方向，所述吸水材料的浓度依次递增。
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111063825A (zh) * 2019-12-09 2020-04-24 武汉华星光电半导体显示技术有限公司 柔性oled封装结构及其制作方法、显示装置
CN111584741B (zh) * 2020-05-08 2022-12-23 Tcl华星光电技术有限公司 显示基板、显示装置及其封装方法
CN114300634A (zh) 2021-12-17 2022-04-08 深圳市华星光电半导体显示技术有限公司 Oled显示面板及电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108198953A (zh) * 2018-02-13 2018-06-22 武汉华星光电半导体显示技术有限公司 Oled封装方法与oled封装结构
CN108649133A (zh) * 2018-03-30 2018-10-12 上海天马微电子有限公司 有机发光显示面板、其制备方法和有机发光显示装置
CN109713154A (zh) * 2018-11-26 2019-05-03 云谷（固安）科技有限公司 封装薄膜及其制备方法、显示面板及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0222649D0 (en) * 2002-09-30 2002-11-06 Microemissive Displays Ltd Passivation layer
KR100943185B1 (ko) * 2008-04-24 2010-02-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
US9209102B2 (en) * 2012-06-29 2015-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Passivation structure and method of making the same
KR102072799B1 (ko) * 2012-09-12 2020-02-04 삼성디스플레이 주식회사 유기 발광 장치 및 이의 제조 방법
KR101667800B1 (ko) * 2014-08-29 2016-10-20 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
CN104269498A (zh) * 2014-09-03 2015-01-07 京东方科技集团股份有限公司 一种有机电致发光器件及其制备方法、显示装置
US20160322603A1 (en) * 2015-04-30 2016-11-03 EverDisplay Optonics (Shanghai) Limited Display structure and manufacturing method of display device
KR102407115B1 (ko) * 2015-06-25 2022-06-09 삼성디스플레이 주식회사 유기 발광 표시 장치
CN105374946B (zh) * 2015-11-18 2017-07-04 上海天马微电子有限公司 一种柔性显示装置及其制备方法
KR102723536B1 (ko) * 2016-11-29 2024-10-31 삼성디스플레이 주식회사 표시 장치
CN106711176B (zh) * 2016-12-15 2019-08-23 上海天马有机发光显示技术有限公司 一种有机发光显示面板及其制作方法
CN106848105B (zh) 2017-04-17 2018-09-18 京东方科技集团股份有限公司 一种显示面板及其制作方法
WO2019045936A1 (en) * 2017-09-01 2019-03-07 Kateeva, Inc. TWO-STAGE PROCESS FOR FORMING CURED POLYMERIC FILMS FOR ENCAPSULATION OF ELECTRONIC DEVICES
CN108428807A (zh) * 2018-05-14 2018-08-21 云谷（固安）科技有限公司 薄膜封装结构及显示屏

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108198953A (zh) * 2018-02-13 2018-06-22 武汉华星光电半导体显示技术有限公司 Oled封装方法与oled封装结构
CN108649133A (zh) * 2018-03-30 2018-10-12 上海天马微电子有限公司 有机发光显示面板、其制备方法和有机发光显示装置
CN109713154A (zh) * 2018-11-26 2019-05-03 云谷（固安）科技有限公司 封装薄膜及其制备方法、显示面板及其制备方法

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