WO2020249460A1 - Dispositif et procédé de référencement et de calibrage d'un système laser - Google Patents

Dispositif et procédé de référencement et de calibrage d'un système laser Download PDF

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Publication number
WO2020249460A1
WO2020249460A1 PCT/EP2020/065487 EP2020065487W WO2020249460A1 WO 2020249460 A1 WO2020249460 A1 WO 2020249460A1 EP 2020065487 W EP2020065487 W EP 2020065487W WO 2020249460 A1 WO2020249460 A1 WO 2020249460A1
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WIPO (PCT)
Prior art keywords
laser
measuring
scanners
photodiode
referencing
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PCT/EP2020/065487
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German (de)
English (en)
Inventor
Thomas WESTPHALEN
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Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
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Publication of WO2020249460A1 publication Critical patent/WO2020249460A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/31—Calibration of process steps or apparatus settings, e.g. before or during manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/44—Radiation means characterised by the configuration of the radiation means
    • B22F12/45—Two or more
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90—Means for process control, e.g. cameras or sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/277—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the invention relates to a device for referencing and calibrating a laser system.
  • the invention also relates to a method for operating the device.
  • Laser systems have been used in industrial production for some time. For example, laser systems for processing workpieces made of metal are known. Laser systems are also known for the production of molded parts, for example made of metal, without shaping tools. Corresponding manufacturing processes are now often summarized under the popular term "3-D printing". Other terms used synonymously are, for example, “additive manufacturing processes” or “generative manufacturing processes”. Such processes are characterized by the layered structure of the molded parts to be produced. A three-dimensional manufacturing task is reduced to two dimensions through the layer-by-layer build-up process without shaping tools. The manufacturing costs do not depend on the complexity of the geometry, but essentially on the volume of the component to be built. As a result, such processes offer a number of systematic advantages compared to conventional manufacturing processes such as primary forming or machining.
  • a special additive manufacturing process is Laser Powder Bed Fusion (LPBF), also known as Selective Laser Melting (SLM) or selective laser melting.
  • LPBF Laser Powder Bed Fusion
  • SLM Selective Laser Melting
  • the material to be processed for example a metal
  • the powdery material is locally completely remelted by means of laser radiation and forms a solid material layer after solidification.
  • the base plate is lowered by the amount of a layer thickness and powder is applied again. This cycle is repeated until all layers have melted.
  • the finished component is cleaned of excess powder, processed as required or immediately used.
  • the layer thicknesses typical for the structure of the component range between 15 pm and 500 pm for all materials.
  • the data for guiding the laser beam are generated from a 3D CAD body using software.
  • the component is divided into individual layers ("slicing").
  • the paths (vectors) that the laser beam travels are generated for each layer.
  • the process can take place in a protective gas atmosphere, for example with argon or nitrogen.
  • Components manufactured by selective laser melting are characterized by high specific densities (> 99%). This ensures that the mechanical properties of the additively manufactured component largely correspond to those of the base material.
  • a component with selective densities can also be specifically manufactured, for example according to bionic principles or to ensure a partial E-module.
  • selective elasticities are often desired within a component and cannot be produced in this way using conventional processes.
  • the process can also be used for prototyping. Since no manufacturing molds are required to manufacture the part, the time to market can be reduced. The material properties of prototypes produced in this way are very close to those of series products, if not even identical to those of series products.
  • Another advantage of the method is the great freedom of geometry, which enables the production of component shapes that cannot be produced with shape-related processes or only with great effort. Furthermore, storage costs can be reduced, since specific components do not have to be stored, but can be produced generatively if required.
  • corresponding laser systems have two or more movable deflection units for the laser beams.
  • the laser beams move over the movement of the deflection units from the control software calculated trajectories on one building level.
  • the scanning areas of two or more deflection units represent independent reference systems that do not have any external reference. If the scanning areas are to be seamlessly next to one another or to overlap, mutual referencing must take place.
  • the deflection angles are maximum at the overlapping boundaries of the scanning areas, for example 20 °.
  • the edges can be aligned with one another with a fixed working distance. If there are minor changes in the working distance to the working plane (e.g.
  • an offset of approx. 80 pm occurs, which leads to clear optical and mechanical disturbances of the component structure with a track width of 100 pm.
  • Referencing is understood here and below to relate two or more geometric areas, in particular two scan fields, to one another.
  • Calibration refers to a measuring process for the reliably reproducible determination and documentation of the deviation of one device compared to another device. In a second step, the determined deviation is used to correct the subsequent use of the device.
  • a laser system is understood to mean, in particular, a device with which a molded part is machined or produced by means of laser beams.
  • the laser system has at least one beam source for generating or coupling in laser beams and a deflection unit.
  • the machining or setting process is accordingly referred to as a laser machining process.
  • molded part is used here to refer to a three-dimensional workpiece.
  • the molded part can have any complex three-dimensional shape.
  • Laser beams in the form of electromagnetic waves are generated in the beam source.
  • Laser beams are characterized by high intensity, a very narrow frequency range, sharp focus of the beam and a long coherence length. With a very wide frequency range, extremely short and intense beam pulses with an exact repetition frequency are also possible.
  • Laser beams are created by their generation in the form of a stimulated emission.
  • the laser works like an optical amplifier, typically in resonant feedback.
  • the energy required for this is provided by a laser medium (e.g. crystal, gas or liquid) in which there is an inversion of the population due to external energy input.
  • the resonant feedback is usually caused by the fact that the laser medium is located in an electromagnetic resonator for the radiation of a certain direction and wavelength.
  • the direction of the laser beam is changed in the deflection unit of the laser system.
  • the deflection unit of a laser system as used in the invention is movable.
  • the deflection unit has a mirror that is in two planes is tiltable.
  • the inclination is caused by actuators, the actuators being controlled by control software depending on the trajectory to be followed by the laser beam.
  • the deflection unit is also referred to as a scanner or channel.
  • scanning area or scanning field is understood to mean the area that can be scanned by a laser beam emerging from a deflection unit. Scanning a surface with a laser beam is also known as scanning.
  • the deflection changes the path to be covered by the laser beam between the point of exit from the deflection unit and the impact on the working plane. As a result of this change in path, the laser beam is not focused equally at all points on the working plane, which results in a maximum size of the scanning area that can be sensibly scanned by a deflection unit.
  • the working distance denotes the distance between the deflection unit and the process level, i.e. the plane in which the laser beam is focused.
  • the laser beam has a diameter.
  • the laser follows a trajectory, leaving a track with a track width that depends on the laser beam diameter at the respective location.
  • Burn-in is understood here to mean a marking produced by the impact of a laser beam on a substrate.
  • the object of the invention is to provide a device for the simple referencing and calibration of laser systems with a plurality of scan fields, the scan fields being able to be aligned relative to a height-invariant reference and thus also relative to one another.
  • Another object of the invention is to provide a method with which simple referencing and calibration of laser systems with multiple scan fields is possible, the scan fields being able to be aligned relative to a height-invariant reference and thus also relative to one another.
  • the first object of the invention is achieved with a device according to independent claim 1.
  • Advantageous further developments of the device emerge from claims 2 to 8.
  • the second object of the invention is achieved with a method according to the independent claim 9.
  • Advantageous developments of the method result from claims 10 to 15.
  • the inventive device for referencing and calibrating a laser system with multiple scan fields and multiple scanners is characterized in that the device has at least two scanners and three measuring arrangements, the at least three measuring arrangements being arranged between the at least two scanners and each measuring arrangement set up for this is to record one measuring zone in each process level.
  • the device has at least two scanners and three measuring arrangements, the at least three measuring arrangements being arranged between the at least two scanners and each measuring arrangement set up for this is to record one measuring zone in each process level.
  • a measuring arrangement is understood to mean an arrangement of different, interacting devices which are set up to detect the location of a point in a plane with respect to its x and y coordinates.
  • the measuring zone is the area in the process level in which a point can be detected by the measuring arrangement.
  • the device according to the invention it is possible to align several scan fields relative to a height-invariant reference and thus also relative to one another.
  • the alignment can be carried out in-line, i.e. during the laser machining process. This improves multi-channel laser processes in such a way that adjacent scan fields can be seamlessly joined together with parallel laser processing. Particularly in additive manufacturing processes such as the LPBF process, this leads to an improvement in the mechanical and optical component properties.
  • At least one measuring arrangement has a camera with a camera sensor.
  • At least one measuring arrangement additionally has an objective.
  • the lens is designed to be telecentric. A great depth of field can thus be achieved.
  • the objective has a first and a second lens.
  • the measuring zone measures e.g. 1 mm x 1 mm and is mapped onto the camera sensor as an image of the measuring zone.
  • At least one measuring arrangement can also have a photodiode.
  • the photodiode can be a fiber-coupled photodiode.
  • the camera-based solution the photodiode
  • Measuring zone cannot be spatially resolved directly with the photodiode.
  • the deflection units are used to spatially scan the laser spot relative to the measuring arrangement, for example in a meandering manner.
  • the photodiode signal is recorded as a function of the respective x and y directions.
  • the absolute reference position can be determined from the positions of the maxima and a correction value can be calculated.
  • a camera sensor is a device for recording two-dimensional images from light by electrical or mechanical means. In most Cases, semiconductor-based camera sensors are used in digital cameras that can pick up light up to the mid-infrared.
  • An objective is understood to be a collecting optical system that generates a real optical image of an object.
  • an objective has one or more optical lenses.
  • Telecentric lenses are special optical lenses that are characterized by the fact that the entrance or exit pupil is at infinity, so that the angle at which the main rays strike the image plane is 90 °.
  • a photodiode is a semiconductor diode which e.g. converts visible light at a p-n junction or pin junction into an electrical current through the internal photoelectric effect. It is used, among other things, to convert light into an electrical voltage or current or to receive information transmitted by light.
  • a reference position or a reference point is understood to mean a point in the building plane, the position of which is known in a corresponding coordinate system.
  • a reference point is used to determine the elements of the orientation of a measurement image.
  • a light source is generally understood here to mean a place from which light emanates.
  • a laser pointer is used here as a light source.
  • a laser pointer is a handy light pointer that emits a low-power laser beam, usually max. 3 mW generated.
  • the device has at least two scanners and three measuring arrangements.
  • the measuring arrangements can e.g. be placed in three places between two deflectors. In this way, the overlap of the scan fields can be checked in three places and corrected if necessary.
  • the device has four scanners and thirteen measuring arrangements in order to check and, if necessary, correct the alignment of the respective scan fields with respect to the edge area or with respect to one another. Furthermore, it has proven to be advantageous if the device furthermore has a light source which is set up to optically display the position of the measurement zone.
  • the light source can, for example, be a commercially available laser pointer.
  • the method according to the invention for referencing and calibrating a laser system with the device described above, wherein the at least two scanners have a controller, the controller transmitting a deflection angle to the scanner for each point on a trajectory to be followed by a laser beam, is characterized in that each the at least two scanners each deflects a laser spot into a current position in a measurement zone, the current position of the laser spot being recorded via image processing, then the deviation of the current position of each laser spot from a respective, previously determined reference point calculated and sent to the Control of the respective scanner is passed.
  • the control can thus add the deviation of the current position of each laser spot from a respective reference point as a lead angle to the respective deflection angle.
  • the scan field increases when the distance between the scanner and the scan field increases. The scaling can be stored relatively easily in the scanner control and adapted dynamically.
  • the correction value can be passed on to the control of the deflection units, for example in the form of an updated correction file, so that the control can hold the deviations from the target position in advance.
  • This makes it possible to align several scan fields relative to a height-invariant reference and thus also relative to one another.
  • the alignment can be carried out in-line, i.e. during the laser machining process. This improves multi-channel laser processes in such a way that adjacent scan fields can be seamlessly joined together with parallel laser processing. In particular in additive manufacturing processes such as the LPBF process, this leads to an improvement in the mechanical and optical component properties.
  • Image processing is understood here to mean the processing of location signals, in particular two-dimensional location signals, ie signals that can be assigned to a location in a plane.
  • the result of image processing can be an image or a set of features of the input signal.
  • the deflection angle describes the change in the direction of propagation of a light beam.
  • a laser beam is generated in a laser system and deflected by a deflection angle using a scanner.
  • the scanner is usually set up to change the deflection angle continuously or quasi continuously.
  • a lead angle is understood to mean a correction angle for the deflection angle.
  • the laser spot generated for referencing and calibration has a laser power with which no material processing takes place. This makes it possible to ensure that initially only a referencing or calibration of the device takes place without material being processed.
  • a camera with a camera sensor and an objective is used for image processing, the measurement zone being mapped as an image on the camera sensor.
  • a photodiode is alternatively or additionally used for image processing, the laser spot being spatially scanned relative to the measuring arrangement, the photodiode outputting a photodiode signal for each point defined via the respective x and y position and the photodiode signal as a function the respective x- and y-direction is recorded, the absolute reference position being determined from the positions of the maxima of the photodiode signals and a correction value being determined.
  • the measuring arrangement is more compact when using a photodiode as an alternative to the camera.
  • the positions of the measurement zones in the process level are displayed optically by means of a light source. The operator of the device receives feedback on the procedural status.
  • the method is carried out during a laser machining process.
  • the accuracy of the laser machining process is increased, while at the same time the time required for referencing or calibrating the device is minimized.
  • Fig. 2 is a schematic representation of two scanners AEi, AE 2 with Messanord voltage MA,
  • FIG. 4 shows a schematic representation of four overlapping scan fields SFi - SF 4 , Fig. Its schematic representation of the measuring arrangement based on a camera sensor KS and an objective O,
  • FIG. 6 shows a schematic representation of the measuring arrangement based on a photodiode PD and an objective O
  • FIG. 1 shows a schematic illustration of the relative offset Dc of a first laser spot LSi and a second laser spot LS 2 within one
  • Scan field SF as a result of the height offset Dz as the difference between the distances z a , z b of the scanners AEi or AE 2 from the process level PE.
  • the distance between the scanners AE 1 , AE 2 from the process level PE z a.
  • the distance between the scanners AE 1 , AE 2 from the process level PE is z b , wherein in the selected example z b is greater than z a by the difference Dz .
  • the distance difference z means that the laser spots LS 1 and LS 2 no longer impinge on the process level PE at the same point, as can be seen in the situation in part a) of the figure, but are offset from one another by a beam offset Dc.
  • Fig. 2 shows a schematic representation of two scanners AE 1 , AE 2 with Messan order MA. Analogous to the situations shown in FIGS. 1 a) and b), there is also a height offset Dz between the scanners AE 1 , AE 2 and the different z positions of the respective process level PE in parts a) and b). Between the scanners AEi and AE 2 , however, a measuring arrangement MA is now arranged, which is set up to each detect a measuring zone MZ in a process level PE.
  • the scanners AEi, AE 2 have a control whereby the controller transmits a deflection angle 0 a to the scanner AEi, AE 2 for each point on a trajectory to be followed by a laser beam.
  • the scanners AEi, AE 2 each deflect a laser spot LSi, LS 2 into a current position in a measuring zone MZ.
  • the current position of the laser spots LSi, LS 2 is recorded via image processing integrated in the measuring arrangement MA.
  • the deviation of the current position of the laser spots LSi, LS 2 from a respective, previously determined reference point is then calculated and transferred as a correction value to the control of the respective scanner AEi, AE 2 .
  • the control can add the deviation of the current position of each laser spot from a respective reference point as a lead angle 0 / to the respective deflection angle 0 a , so that the deflection now takes place with the deflection angle corrected by the lead angle.
  • the scan field increases when the distance between the scanner and the scan field increases.
  • the scaling can be stored relatively easily in the scanner control and adapted dynamically.
  • Measuring arrangements are arranged at three points between two deflection units AEi, AE 2 . In this way, the overlap of the two scan fields SFi and SF 2 can be checked at three points and corrected if necessary.
  • Fig. 4 shows a schematic representation of four overlapping scan fields SFi - SF 4. At the edge and in the overlapping areas are 13 measuring zones MZi - MZ 13. Thus, the overlap of the four scan fields SFi can be checked to SF4 to thirteen positions and corrected if necessary
  • FIG. 5 shows a schematic illustration of the measuring arrangement MA based on a camera sensor KS and an objective O.
  • the objective O has a first lens Li and a second lens L 2 as well as a diaphragm BL between the lenses Li, L 2 .
  • the measuring arrangement MA is directed towards the measuring zone MZ.
  • the measuring zone MZ is imaged as an image of the measuring zone BMZ on the camera sensor KS via the objective O, the lenses Li, L 2 and the diaphragm BL.
  • Deviation of the current position of the laser spots LSi, LS 2 (not shown in the figure) from a respective, previously determined reference point is calculated and sent as a correction value to the controller (not shown in the figure) of the respective scanner AEi, AE 2 (not in the figure shown).
  • FIG. 6 shows a schematic representation of the measuring arrangement based on a photodiode PD and an objective O.
  • the measuring arrangement MA can also have a photodiode PD and an objective O.
  • the measuring zone MZ cannot be spatially resolved directly with the photodiode PD.
  • light can be directed onto the measuring zone MZ, the reflection of which can be directed onto the photodiode in order to generate a photodiode signal.
  • the light can spatially scan the measuring zone MZ relative to the measuring arrangement MA, for example in a meandering manner.
  • the photodiode signal is recorded as a function of the respective x and y directions.
  • the absolute reference position can be determined from the positions of the maxima and a correction value can be calculated.
  • FIG. 6 In part a) of FIG. 6, an arrangement is shown in which visible light from a light source LQ is passed into an objective O via a dichrotic mirror SK and a light wave guide LWZ.
  • the objective O has two lenses Li and L 2 , through which the light from the light source LQ is imaged in the measuring zone MZ. The lighting is used to visualize the measuring zone.
  • the portion of the laser radiation reflected by the process level is now coupled back into an optical waveguide LWZ via an objective O with the two lenses Li and L 2 , from where it is passed through the dichroic mirror - gel S falls on a photodiode PD.
  • Part b) of FIG. 6 shows an alternative arrangement in which the reflected laser radiation from the measurement zone MZ falls onto a photodiode PD via an objective O with two lenses Li and L 2 .
  • part c) of FIG. 6 a further alternative arrangement is shown in which visible light from a light source LQ, which is net angeord directly on the lens 0 and can couple light directly into the lens 0, via a dichroic mirror arranged in the lens 0 SK and two lenses Li and L 2 arranged in the objective 0 are imaged in the measuring zone MZ. This illumination of the measuring zone is used to visualize the measuring zone.
  • the load radiation reflected by the process level in the measuring zone is now directed, analogously to b), via the objective 0 with the two lenses Li and L 2 back through the dichroic mirror SK, which is semi-transparent, directly to a photodiode PD arranged directly on the objective 0.
  • FIG. 7 shows a schematic representation of the detection of the measurement zone MZ by scanning the laser spot LS along the x and y directions.
  • the scanning in the y direction is shown on the left side of the figure.
  • the laser spot LS is directed in the x direction onto the measuring zone MZ at four exemplary y positions.
  • the photodiode signal is shown as a current from the photodiode PD for the four different y-positions on the x-axis.
  • the curves of positions y, y 2 and y 3 each have a peak at x max , while the laser spot LS does not hit the measuring zone at position y and accordingly the photodiode does not output a signal for this position.
  • the x-position of the measuring zone MZ has thus been found.
  • the right side of the illustration shows the analogous procedure for finding the y-position of the measuring zone MZ.

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  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un dispositif pour référencer et calibrer un système laser. L'invention concerne en outre un procédé pour faire fonctionner le dispositif. Le dispositif selon l'invention pour référencer et calibrer un système laser comportant plusieurs champs de balayage et plusieurs scanners, est caractérisé en ce que le dispositif comprend au moins un arrangement de mesure, l'au moins un arrangement de mesure étant disposé entre les plusieurs scanners et chaque arrangement de mesure étant adapté pour détecter respectivement une zone de mesure dans un plan de processus. Le procédé selon l'invention pour référencer et calibrer un système laser comportant plusieurs champs de balayage et plusieurs scanners, dans lequel les scanners ont une commande, dans lequel la commande transmet un angle de déviation au scanner pour chaque point sur une courbe de trajet à parcourir par un faisceau laser, est caractérisé en ce que en ce que chacun des différents scanners dévie respectivement un spot laser dans une position actuelle dans une zone de mesure, la position actuelle du spot laser étant détectée au moyen d'un traitement d'image, l'écart de la position actuelle de chaque spot laser par rapport à un point de référence respectif, préalablement déterminé, est ensuite calculé et transféré comme valeur de correction à la commande du scanner respectif.
PCT/EP2020/065487 2019-06-14 2020-06-04 Dispositif et procédé de référencement et de calibrage d'un système laser WO2020249460A1 (fr)

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DE102019116214.9A DE102019116214A1 (de) 2019-06-14 2019-06-14 Vorrichtung und Verfahren zur Referenzierung und Kalibrierung einer Laseranlage

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