WO2020246795A1

WO2020246795A1 - Electronic device for tuning antenna

Info

Publication number: WO2020246795A1
Application number: PCT/KR2020/007200
Authority: WO
Inventors: 반성원; 김민수; 김호연; 사공민; 조현태; 김성준
Original assignee: 삼성전자 주식회사
Priority date: 2019-06-07
Filing date: 2020-06-03
Publication date: 2020-12-10
Also published as: KR20200140544A; EP3982482A4; EP3982482A1

Abstract

According to various embodiments, an electronic device may comprise: a slide frame for moving a first body from a first state to a second state; and a connection structure for electrically connecting the first body to a second body, wherein the first body includes an antenna and a first printed circuit board (PCB), the antenna is disposed in the first PCB, the second body includes a radio frequency (RF) module and a second PCB, and the RF module is disposed in the second PCB. The connection structure comprises: at least one antenna connection terminal disposed on the first PCB; and at least two RF connection terminals disposed on the second PCB, wherein the at least two RF connection terminals include a first RF connection terminal and a second RF connection terminal. The first body is electrically connected, in the first state, to the first RF connection terminal via the connection structure, and is electrically connected, in the second state, to the second RF connection terminal via the connection structure. The second PCB may include a first RF tuning circuit for the first RF connection terminal and a second RF tuning circuit for the second RF connection terminal.

Description

Electronics for antenna tuning

Various embodiments to be described later relate to an electronic device for antenna tuning.

The electronic device may transmit a signal using an antenna. In order to increase the efficiency of radiation performance, tuning of a radio frequency (RF) circuit connected to an antenna is required. In this case, when the relative position between the structure including the antenna and the structure including the RF module is changed, the radiation characteristics of the antenna due to the existing circuit elements may be changed.

There is a problem that it is difficult to optimize the radiation characteristics according to the physical location of each structure with only one tuning setting. The electronic device according to various embodiments may minimize a difference in antenna performance due to a relative position change between a structure including an antenna and a structure including a radio frequency (RF) module, and optimize antenna performance at each location.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems that are not mentioned can be clearly understood by those of ordinary skill in the technical field to which the present invention belongs from the following description. There will be.

According to various embodiments, an electronic device includes a first body including an antenna and a first PCB (print circuit board), the antenna is disposed on the first PCB, and a second body including a frequency) module and a second PCB, the RF module being disposed on the second PCB, and moving the first structure from a first state to a second state; And a connection structure electrically connecting the first structure and the second structure. The connection structure may include at least one antenna connection terminal disposed on the first PCB; And at least two or more RF connection terminals disposed on the second PCB, wherein the at least two or more RF connection terminals include a first RF connection terminal and a second RF connection terminal, and the first structure includes the first In the first state, the first RF connection terminal is electrically connected through the connection structure, the second state is electrically connected to the second RF connection terminal through the connection structure, and the second PCB is the first A first RF tuning circuit for the RF connection terminal and a second RF tuning circuit for the second RF connection terminal may be included.

An electronic device according to various embodiments of the present disclosure may provide an RF circuit for relative positions between separate structures, thereby providing optimal antenna performance at each position.

The effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the technical field to which the present disclosure belongs from the following description. will be.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

2 is a block diagram of an electronic device in a network environment including a plurality of cellular networks, according to various embodiments.

3 illustrates an example of a type of an electronic device according to various embodiments of the present disclosure.

4A illustrates an example of a structure of a slide electronic device according to various embodiments of the present disclosure.

4B is a diagram illustrating another example of a structure of a slide electronic device according to various embodiments of the present disclosure.

5 illustrates an example of a connection between structures according to various embodiments.

6 shows an example of a circuit for connection between structures according to various embodiments.

7 illustrates an example of a contact structure for connection between structures according to various embodiments.

8A illustrates an example of antenna tuning in a contact structure according to various embodiments.

8B shows an example of a circuit for antenna tuning according to various embodiments.

9A illustrates another example of antenna tuning in a contact structure according to various embodiments.

9B shows another example of a circuit for antenna tuning according to various embodiments.

10A illustrates an example of a connection structure for maintaining a connection between structures according to various embodiments.

10B illustrates another example of a connection structure for maintaining a connection between structures according to various embodiments.

11 illustrates an example of a coupling structure using a capacitor according to various embodiments.

12A illustrates an example of a coupling structure for maintaining a connection between structures according to various embodiments.

12B illustrates another example of a coupling structure for maintaining a connection between structures according to various embodiments.

12C illustrates another example of a coupling structure for maintaining a connection between structures according to various embodiments.

13 illustrates an example of a connection between structures using dielectrics according to various embodiments.

14A illustrates an example of a connection between structures using a guide-type dielectric in various embodiments.

14B shows an example of a cross-section of a connection structure between structures using a guide-type dielectric in various embodiments.

Terms used in the present disclosure are used only to describe a specific embodiment, and may not be intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the technical field described in the present disclosure. Among the terms used in the present disclosure, terms defined in a general dictionary may be interpreted as having the same or similar meaning as the meaning in the context of the related technology, and unless explicitly defined in the present disclosure, an ideal or excessively formal meaning Is not interpreted as. In some cases, even terms defined in the present disclosure cannot be interpreted to exclude embodiments of the present disclosure.

In various embodiments of the present disclosure described below, a hardware approach is described as an example. However, since various embodiments of the present disclosure include technology using both hardware and software, various embodiments of the present disclosure do not exclude a software-based approach.

Hereinafter, the present disclosure relates to an apparatus and method for antenna tuning in a wireless communication system. Specifically, the present disclosure adaptively configures an RF circuit between an antenna and an RF module according to a change in relative positions of a structure including an antenna and a structure including a radio frequency (RF) module in a wireless communication system, Describes techniques for improving radiation performance.

Terms that refer to antennas used in the following description (eg, antenna elements, array antennas, antenna modules, antenna circuits), terms that refer to structures of electronic devices (eg, structures, bodies, moving parts, fixed parts), and conductors. A term that refers to a term (e.g., a conductive member, a conductor, a conductive plate, a conductive plate, a conductive element), a term that refers to a connection between structures (e.g., a contact element, a contact structure, a contact member, a contact terminal, a connection terminal, a connection element) , A connection structure, a coupling terminal, a coupling structure), and terms referring to a circuit (eg, an RF signal line, an RF path, an RF module, an antenna line, a ground circuit, an RF circuit), and the like are illustrated for convenience of description. Accordingly, the present disclosure is not limited to terms to be described later, and other terms having an equivalent technical meaning may be used.

1 to 14B described below, and various embodiments used to describe the principles of the present disclosure in this patent specification are by way of example only, and limit the scope of the present disclosure in any way. It should not be interpreted. Those skilled in the art will appreciate that the principles of the present disclosure may be implemented in any suitably configured system or device. In addition, with respect to the description of the drawings, similar reference numerals may be used for similar or related components.

1 is a block diagram of an electronic device in a network environment 100 according to various embodiments.

Referring to FIG. 1, in a network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (for example, a short-range wireless communication network), or a second network 199 It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to implement at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least a part of data processing or operation, the processor 120 stores commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 The command or data stored in the volatile memory 132 may be processed, and result data may be stored in the nonvolatile memory 134. According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and an auxiliary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together. , A sensor hub processor, or a communication processor). Additionally or alternatively, the coprocessor 123 may be set to use less power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from the main processor 121 or as a part thereof.

The coprocessor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, an application is executed). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states related to. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176). The data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.

The input device 150 may receive a command or data to be used for a component of the electronic device 101 (eg, the processor 120) from an outside (eg, a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output an sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.

The audio module 170 may convert sound into an electric signal or, conversely, convert an electric signal into sound. According to an embodiment, the audio module 170 obtains sound through the input device 150, the sound output device 155, or an external electronic device (for example, an external electronic device directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (for example, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 176 is, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used to connect the electronic device 101 to an external electronic device (eg, electronic device 102) directly or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture a still image and a video. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 388 may be implemented as at least a part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, electronic device 102, electronic device 104, or server 108). It is possible to support establishment and communication through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an application processor), and may include one or more communication processors that support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : A LAN (local area network) communication module, or a power line communication module) may be included. Among these communication modules, a corresponding communication module is a first network 198 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (for example, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip), or may be implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 in a communication network such as the first network 198 or the second network 199. The electronic device 101 can be checked and authenticated.

The antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, provided by the communication module 190 from the plurality of antennas. Can be chosen. The signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197.

At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the

electronic devices

102 and 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more of the external

electronic devices

102, 104, or 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service by itself. In addition or in addition, it is possible to request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 101. The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

2 is a block diagram 200 of an electronic device 101 in a network environment including a plurality of cellular networks, according to various embodiments.

Referring to FIG. 2, the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit 222, a second RFIC 224, and a third RFIC. 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna ( 248. The electronic device 101 may further include a processor 120 and a memory 130. The second network 199 includes a first cellular network 292 and a second cellular network. 294). According to another embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the second network 199 may include at least one other network. According to an embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, The first RFFE 232 and the second RFFE 234 may form at least a part of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 is omitted or the third RFIC ( 226).

The first communication processor 212 may support establishment of a communication channel of a band to be used for wireless communication with the first cellular network 292 and network communication through the established communication channel. According to various embodiments, the first cellular network may be a network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. As an example, the first communication processor 212 is a radio access technology (RAT) for accessing the first cellular network and may support an LTE communication protocol defined by 3GPP. The second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 294, and a 5G network through the established communication channel. Can support communication. According to various embodiments, the second cellular network 294 may be a 5G network. As an example, the second communication processor 214 is a radio access technology for accessing a second cellular network and may support a new radio (NR) communication protocol defined by 3GPP. Additionally, according to an embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (eg, about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network 294. It is possible to establish a communication channel to communicate with, and support 5G network communication through the established communication channel. According to an embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 is a processor 120, a coprocessor (eg, the coprocessor 123 in FIG. 1), or a communication module (eg, FIG. 1 ). It may be formed in a single chip or a single package with the communication module 190). According to an embodiment, the first communication processor 212 and the second communication processor 214 are directly or indirectly connected to each other by an interface (not shown), and data or control signals in either or both directions Can offer or receive.

The first RFIC 222 transmits a baseband signal generated by the first communication processor 212 to about 700 MHz used for the first cellular network 292 (for example, an LTE network). It can be converted into a 3GHz radio frequency (RF) signal. Upon reception, an RF signal is obtained from the first cellular network 292 (eg, LTE network) through an antenna (eg, the first antenna module 242), and RFFE (eg, the first RFFE 232) is It can be preprocessed through. The first RFIC 222 may convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor 212.

The second RFIC 224, when transmitting, uses the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second cellular network 294 (for example, a 5G network). It can be converted into an RF signal (hereinafter, referred to as 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less). Upon reception, a 5G Sub6 RF signal is obtained from the second cellular network 294 (eg, 5G network) through an antenna (eg, the second antenna module 244), and RFFE (eg, the second RFFE 234). ) Can be pretreated. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by a corresponding one of the first communication processor 212 or the second communication processor 214.

The third RFIC 226 transmits the baseband signal generated by the second communication processor 214 to the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (eg, 5G network). It can be converted into an RF signal (hereinafter, 5G Above6 RF signal). Upon reception, a 5G Above6 RF signal may be obtained from the second cellular network 294 (eg, 5G network) through an antenna (eg, antenna 248) and preprocessed through the third RFFE 236. The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214. According to an embodiment, the third RFFE 236 may be formed as a part of the third RFIC 226.

According to an embodiment, the electronic device 101 may include the fourth RFIC 228 separately or at least as a part of the third RFIC 226. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal of an intermediate frequency band (eg, about 9 GHz to about 11 GHz) (hereinafter, IF (intermediate frequency) ) Signal), the IF signal may be transferred to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second cellular network 294 (eg, 5G network) through an antenna (eg, antenna 248) and converted into an IF signal by the third RFIC 226. have. The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.

According to an embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package. According to an embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to an embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be disposed on a first substrate (eg, a main PCB). In this case, the third RFIC 226 is located in a partial area (eg, lower surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is disposed in another area (eg, upper surface). Is disposed, a third antenna module 246 may be formed. By arranging the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This can reduce loss (eg, attenuation) of a signal in a high-frequency band (eg, about 6 GHz to about 60 GHz) used for communication in a 5G network, for example. Accordingly, the electronic device 101 may improve the quality or speed of communication with the second cellular network 294 (eg, a 5G network).

According to an embodiment, the antenna 248 may be formed as an antenna array including a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC 226 may include, for example, a plurality of phase shifters 238 corresponding to a plurality of antenna elements as part of the third RFFE 236. During transmission, each of the plurality of phase converters 238 may convert a phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. Upon reception, each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal received from the outside through a corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second cellular network 294 (e.g., 5G network) can be operated independently from the first cellular network 292 (e.g., LTE network) (e.g., Stand-Alone (SA)), or connected and operated ( Example: Non-Stand Alone (NSA)). For example, a 5G network may have only an access network (eg, 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (eg, next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 can access the external network (eg, the Internet) under the control of the core network (eg, evolved packed core (EPC)) of the first cellular network. have. Protocol information for communication with the first cellular network (eg, LTE protocol information) or protocol information for communication with a 5G network (eg, NR protocol information) is stored in the memory 130 and other components (eg, processor 120 ), the first communication processor 212, or the second communication processor 214).

2 illustrates a plurality of cellular networks, the electronic device 101 illustrated in FIG. 2 is only an example, and various embodiments of the present disclosure are not limited thereto. According to various embodiments, the electronic device 101 may include an antenna for a first cellular network (eg, LTE) or a second cellular network (eg, NR, 6Ghz or less). According to various embodiments, the antenna may include a metal antenna.

The present disclosure relates to an electronic device including two or more structures. That is, the electronic device may include a first structure and a second structure. The first structure may include an antenna. The second structure may include an RF module and an RF circuit for connecting the RF module and the antenna. Hereinafter, an example of an electronic device according to structures is shown through FIG. 3.

3 illustrates an example 300 of a type of an electronic device (eg, the electronic device 101 of FIG. 1) according to various embodiments. The electronic device 101 may include two or more structures. The type of the electronic device 101 may be a slide type.

Referring to FIG. 3, the electronic device 300 may include a first structure 310 and a second structure 360 disposed to overlap the first structure 310. According to various embodiments, the first structure 310 may include an antenna for wireless communication. The second structure 360 may include an RF module (eg, RFIC) for wireless communication and an RF circuit connected to an antenna. According to an embodiment, the first structure 310 may include a display 325. The first structure 310 may be positioned on the front surface of the electronic device 101, and the second structure 360 may be positioned on the rear side of the electronic device 101.

The first structure 310 may be a structure capable of moving (eg, linear movement or curved movement) along one surface of the second structure 360. For example, the first structure 310 may be a structure capable of linear movement 350 along the x-axis. Below. For convenience of explanation, the direction in which the X-coordinate decreases on the x-axis of the first structure 310 is referred to as downward movement, and the direction in which the X-coordinate increases on the x-axis of the first structure 310 is referred to as upward movement. . The first structure 310 may vertically move on the x-axis.

Two states may be defined according to the vertical movement of the first structure 310. The two states may include a first state 300a and a second state 300b. The first structure may be referred to as a slide moving part. The second structure may be referred to as a fixing part.

In the first state 300a, the first structure 310 may at least partially overlap the second structure 360 when viewed from above on a plane perpendicular to the z-axis. The first state 300a may be defined as a state in which the first structure 310 overlaps the second structure 360 in the largest area. The first state 300a may be referred to as a slide-down state. In the second state 300b, the first structure 310 may at least partially overlap the second structure 360 when viewed from above on a plane perpendicular to the z-axis. The second state 300b may be defined as a state in which the first structure 310 overlaps the second structure 360 in the smallest area. The second state 300b may be referred to as a slide-up state. According to an embodiment, an area overlapping in the second state 300b may be smaller than an area overlapping in the first state 300a.

According to various embodiments, a relative positional relationship between the first structure and the second structure may vary according to the movement of the first structure. For example, as the first structure moves, a length of a transmission line between an antenna included in the first structure and an RF circuit included in the second structure may vary. In addition, for example, according to the movement of the first structure, the size of an overlapping region between the first structure and the second structure may vary. That is, the movement of the first structure including the antenna may cause spatial characteristics between the first structure including the antenna and the second structure including the RF module to be different. Movement of the first structure may affect the electric and/or magnetic fields associated with the antenna. Accordingly, according to various embodiments, the electronic device 101 may include a structure for providing antenna performance optimized for each state.

In FIG. 3, a slide type in which the first structure 310 is opened in the x-axis direction from the second structure 360 is described as an example, but various embodiments of the present disclosure are not limited thereto. A slide type in which the first structure 310 is opened in the y-axis direction from the second structure 360 may also be understood as an embodiment of the present disclosure.

In addition, although FIG. 3 defines a state between structures of the electronic device as one of two states, the present disclosure is not limited thereto. Of course, three or more states may be defined according to the movement of the first structure. In addition to the case where the first structure is in the highest or lowest position, the intermediate state can be defined as the third state.

In addition, although FIG. 3 illustrates a slide-type structure as an example, various embodiments of the present disclosure include not only a slide type, but also a type of an electronic device in which two structures are separated and have a plurality of physical shapes according to a relative position between the two structures. Applicable to For example, the tuning structure according to various embodiments of the present disclosure may also be applied to a type of electronic device including a structure different from a structure that is folded or folded (for example, a foldable electronic device including segmented structures). I can.

As described in FIG. 3, the present disclosure relates to an electronic device including two or more structures. Specifically, the present disclosure relates to a connection method between a first structure including an antenna circuit including an antenna and a second structure including a main circuit including an RF module and a processor, and antenna tuning according to each connection method. Hereinafter, for convenience of description, the first structure is referred to as a slide moving part and the second structure is referred to as a fixed part, but various embodiments of the present disclosure are not limited thereto. According to an embodiment, the first structure may be a fixing part, and the second structure may be a slide moving part. That is, the front portion including the display of the electronic device 101 is fixed, and the rear portion may vertically move. According to another embodiment, both the first structure and the second structure may be slide moving parts. That is, both the first structure and the second structure may be moved up and down.

Conventional slide-type electronic devices use a coaxial cable or a flexible printed circuit board (FPCB) when connecting the antenna mounted on the slide moving part and the antenna circuit mounted on the fixed part according to the vertical movement of the slide moving part. It was implemented to move the connected parts together. However, the vertical movement of the slide moving unit may affect the electromagnetic field conditions such as dielectrics of the electronic device and relative changes with the display. In addition, a mounting space may be additionally required so that a coaxial cable or an FPCB can move like a slide moving part.

Various embodiments of the present disclosure may solve the problem due to insufficient mounting space by electrically connecting a structure including an antenna and a structure including an RF circuit directly through a contact method (hereinafter, a contact method) or a coupling method. I can. However, even if the connection between the two structures is implemented by a contact method or a coupling method, if the relative position between the first structure and the second structure is changed, the relative distance between the antenna and the RF circuit varies, so that the characteristics of the RF path through which signals are transmitted. This can be different. In addition, as the physical location changes, the magnetic field formed by conductive members disposed in the electronic device changes, which affects antenna performance. Accordingly, the electronic device according to various embodiments may configure an RF circuit for antenna tuning in each state according to a relative position between the first structure including the antenna and the RF circuit and the second structure including the RF module. have. During contact or coupling, antenna performance can be optimized according to the conditions between structures by individually tuning the RF circuits connected to the antennas according to the state (eg, slide-down state, slide-up state) between structures.

Hereinafter, in the present disclosure, antenna tuning may mean a circuit design for improving antenna performance. Antenna performance may be affected by a frequency band in which communication is performed, element values in an RF circuit connected to the antenna, a length of a transmission line constituting an RF circuit, and an arrangement between conductors. The antenna performance may include a resonant frequency formed through an antenna and an RF path, a signal gain obtained in a communication frequency band through an antenna, and a standing wave ratio or reflection coefficient obtained through an antenna and an RF path. In addition, the optimized performance may be defined according to a standing wave ratio (SWR), a return loss, or a resonance frequency. For example, an RF circuit connected to an antenna may operate as an impedance matching circuit in a communication frequency band. Through impedance matching, the electronic device 101 may provide high antenna performance (eg, low reflection coefficient, low resonance error, high signal gain).

Hereinafter, the present disclosure refers to the range of the frequency band as a low-frequency band (for example, less than 1.3 GHz), an intermediate frequency band (for example, 1.3 GHz or more and less than 2.2 GHz), and a high-frequency band (high- frequency band, eg, 2.2GHz or more), but various embodiments of the present disclosure are not limited thereto. High and low frequency bands may be differently defined according to the performance of an antenna provided in the electronic device.

4A illustrates an example 400 of a structure of a slide electronic device (eg, the electronic device 101 of FIG. 1) according to various embodiments. The electronic device 101 may include a structure for a full slide operation.

Referring to FIG. 4, an electronic device (eg, the electronic device 101 of FIG. 1) may include a lower portion 400a and an upper portion 400b. The lower part 400a may refer to a region located relatively below the y-axis, and the upper part 400b may refer to a region located relatively above the y-axis.

The lower part 400a may include cellular antennas. According to an embodiment, the lower part 400a may include at least one of a first cellular antenna 411, a second cellular antenna 412, and a third cellular antenna 413. The first cellular antenna 411 may support transmission or reception of signals in a low frequency band (LB), a mid frequency band (MB), and an ultra-high frequency band (UHB). . In addition, as an example, the third cellular antenna 413 may support transmission or reception of signals in an intermediate frequency band (MB) and a high frequency band (HB). According to an embodiment, the first cellular antenna 411 may include a metal antenna segmented structure.

The upper part 400b may include auxiliary antennas. According to an embodiment, the upper part 400b may include a first auxiliary antenna 421, a second auxiliary antenna 422, a third auxiliary antenna 423, and a fourth auxiliary antenna 424. According to another embodiment, the first auxiliary antenna 421 of the above-described embodiment may be replaced with a first auxiliary antenna 425 disposed on a side portion instead of being disposed on the upper end of the upper portion 400b. The first

auxiliary antenna

421 or 425 may support transmission or reception of signals in the low frequency band (LB) and the ultra high frequency band (UHB). The second auxiliary antenna 422 may support transmission or reception of signals in an intermediate frequency band (MB) and a high frequency band (HB). The third auxiliary antenna 423 may support transmission or reception of signals in an intermediate frequency band (MB) and a high frequency band (HB). The fourth auxiliary antenna 424 may support transmission or reception of a signal in an ultra high frequency band (UHB).

The upper part 400b may include wireless local area network (WLAN) antennas. According to an embodiment, the upper part 400b may include a first WLAN antenna 431 and a second WLAN antenna 432. The first WLAN antenna 431 may support transmission or reception of a GPS signal and a 2.4 GHz or 5 GHz WLAN (eg, Wi-Fi) signal. The second wireless LAN antenna 432 may support transmission or reception of a wireless LAN (eg, Wi-Fi) signal of 2.4 GHz or 5 GHz.

The electronic device (eg, the electronic device 101 of FIG. 1) may include two structures that are divided up and down the slide segment 440. The two structures may include a first structure as a slide moving part and a second structure as a fixed part. The electronic device 101 may include a slide frame 450 that forms a guide rail so that the first structure moves up and down on the second structure. The slide frame 450 may provide a direction for slide movement of the first structure. In order to move the first structure up and down on the y-axis based on the slide segment 440, the electronic device 101 may include a motor 460 for driving the slide.

According to various embodiments, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure positioned on the upper end 400b. The first structure may include at least one antenna disposed on the upper end 400b. Specifically, antennas may be mounted on the PCB of the first structure. As the first structure moves according to the slide frame, the distance between the antenna of the first structure and the RF module of the electronic device 101 may vary.

4B illustrates another example 480 of a structure of a slide electronic device (eg, the electronic device 101 of FIG. 1) according to various embodiments. The electronic device 101 may include a structure for a pop-up slide operation. Description of the same or similar to the example 400 of the structure of FIG. 4A may be omitted.

Referring to FIG. 4B, the electronic device (for example, the electronic device 101 of FIG. 1) may include two structures that are divided up and down the slide segment 485. The two structures may include a first structure as a slide moving part and a second structure as a fixed part. For example, the electronic device may include a first structure capable of performing a slide operation in a form in which a partial area of a mechanism, such as a camera area disposed on an upper end of the electronic device, protrudes.

Like FIG. 4A, the electronic device may include a slide frame 490 for guiding a direction of a slide operation of the first structure. The first structure may move upward or downward along the slide frame 490 on the y-axis. That is, the slide frame 490 may be configured to provide a guide rail in the y-axis direction in the drawing.

4A and 4B illustrate the structure of a slide-type electronic device. Depending on the shape of the slide, the position of the slide segment and the antenna mounting structure may be changed. In addition, as the arrangement of the antenna mounted on the structure for the slide operation is changed, the setting of the tuning circuit for providing the optimized performance of the antenna may be changed. According to various embodiments, the tuning circuit for providing the optimized performance of the antenna may be set based on at least one of a slide type, a state between structures according to a slide operation, a position of a segment part, an arrangement of an antenna, and a position. . Hereinafter, a connection structure between structures according to a slide operation and a tuning circuit design method according to each connection will be described through FIGS. 5 to 9B.

5 shows an example 500 of connections between structures according to various embodiments. In the present disclosure, the connection structure between structures may include a structure that is directly connected through contact between each structure and a conductive member (hereinafter, a contact structure) or a structure that is electrically connected through a conductive plate of each structure. Hereinafter, a contact structure in FIG. 5 is described as an example, but this is only an example and does not limit the embodiments of the present disclosure.

Referring to FIG. 5, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 510 and a second structure 560. A situation where the first structure 510 is a moving part of the slide electronic device and the second structure 560 is a fixed part of the slide electronic device is described as an example.

The first structure 510 may include a first printed circuit board (PCB) 520. The first structure 510 may include an antenna (not shown) disposed on the first PCB 520. The antenna may be electrically connected to the first PCB 520. The first structure 510 may include a circuit configured in the first PCB 520 and connected to an antenna (hereinafter, an antenna connection circuit). The first structure 510 may include a first antenna connection terminal 521 and a second antenna connection terminal 522 for connecting the antenna and the second structure 560. Here, the antenna connection terminal may mean a conductive member for connecting another structure and an antenna. The first PCB 520 may include a first antenna connection terminal 521 and a second antenna connection terminal 522. According to various embodiments, the antenna connection terminal may be connected to a conductive member for connection with another structure.

The second structure 560 may include a second PCB 570. The second structure 560 may include an RF module (not shown) disposed on the second PCB 570. For example, the RF module may be implemented as an RFIC. The second structure 560 may include a circuit (hereinafter, referred to as an RF circuit) disposed on the second PCB 570 and connected to an RF module or a ground (GND). The RF circuit may include at least one tuning circuit. The tuning circuit may be a matching circuit connected to ground or a circuit connected to an RF module. The second structure 560 includes a first RF connection terminal 571, a second RF connection terminal 572, and a third RF connection terminal 573 for connection between the RF circuit and the first structure 510 can do. Here, the RF connection terminal may mean a conductive member for connecting another structure and an RF module. The second PCB 570 may include a first RF connection terminal 571, a second RF connection terminal 572, and a third RF connection terminal 573.

The first state 500a may be a state in which the first structure is located relatively below the y-axis. The first state 500a may be referred to as a slide-down or a closed state. In the first state 500a, the first antenna connection terminal 521 may be electrically connected to the first RF connection terminal 571. According to an embodiment, the first antenna connection terminal 521 may be in physical contact with the first RF connection terminal 571 through a conductive contact member. As the conductive contact member is physically connected between the first antenna connection terminal 521 and the first RF connection terminal 571, an electrical RF path may be formed. According to another embodiment, the first antenna connection terminal 521 may be coupled to the first RF connection terminal 571 through a capacitor. Due to the charging charge of the capacitor, an electrical RF path may be formed between the first antenna connection terminal 521 and the first RF connection terminal 571. Like the first antenna connection terminal 521 and the first RF connection terminal 571, the second antenna connection terminal 522 may be electrically connected to the second RF connection terminal 572.

The second state 500b may be a state in which the first structure is located relatively above the y-axis. The second state 500b may be referred to as a slide-up or open state. In the second state 500b, the first antenna connection terminal 521 may be electrically connected to the second RF connection terminal 572. According to an embodiment, the first antenna connection terminal 521 may physically contact the second RF connection terminal 572 through a conductive contact member. As the conductive contact member is physically connected between the first antenna connection terminal 521 and the second RF connection terminal 572, an electrical RF path may be formed. According to another embodiment, the first antenna connection terminal 521 may be coupled to the second RF connection terminal 572 through a capacitor. Due to the charging charge of the capacitor, an electrical RF path may be formed between the first antenna connection terminal 521 and the second RF connection terminal 572. Like the first antenna connection terminal 521 and the second RF connection terminal 572, the second antenna connection terminal 522 may be electrically connected to the third RF connection terminal 573.

As the first structure 510 moves from bottom to top, the electronic device 101 may change from the first state 500a to the second state 500b. As the first state 500a is changed to the second state 500b, the RF connection terminal connected to each antenna connection terminal may vary. According to an embodiment, the antenna connection terminal may be connected to the RF connection terminal through a contact structure. As the first structure 510 moves from bottom to top, like the contact method 545, the first antenna connection terminal ( The 521 may be detached from the first RF connection terminal 571 located relatively below on the y-axis and connected to the second RF connection terminal 572 located relatively above on the y-axis.

The second structure 560 may include an RF circuit. The RF circuit may include an RF circuit configuration connected to the first structure 510 in a first state 500a and an RF circuit configuration connected to the second structure 560 in a second state 500b. For example, the RF circuit disposed on the second PCB 570 includes a first tuning circuit including a first RF connection terminal 571, a second tuning circuit including a second RF connection terminal 572, and A third tuning circuit including a third RF connection terminal 573 may be included. At this time, since the first tuning circuit is connected to the antenna connection circuit of the first structure 510 only in the slide-down state in the first state 500a to form an RF path, the antenna tuning in the first state 500a It may include elements for. Since the third tuning circuit is connected to the antenna connection circuit of the first structure 510 only in the slide-up state, which is the second state 500b, to form an RF path, an element for antenna tuning in the second state 500b Can include.

As described above, the second structure 560 according to various embodiments has different configurations of the RF connection terminal connected to the communication path according to the movement of the first structure 510, so that it differs according to the location of the first structure 510. It may include a configured RF circuit. Since the tuning circuit corresponding to each RF connection terminal of the second structure 560 is composed of elements that provide optimal antenna performance in each state, the electronic device provides high antenna performance even if the position of the first structure is changed. can do.

Hereinafter, an example of a circuit configuration of each structure for providing optimal antenna performance is shown through FIG. 6.

6 shows an example 600 of a circuit for connections between structures according to various embodiments. 6 is a diagram illustrating a connection between the first structure 510 and the second structure 560 of FIG. 5 as a circuit. The first structure 610 and the second structure 660 may correspond to each of the first structure 510 and the second structure 560 of FIG. 5. The first structure 610 is a moving part of the slide electronic device, and the second structure 660 is a fixed part of the slide electronic device. Hereinafter, a description of the same or similar configuration as in FIG. 5 may be omitted.

The electronic device (eg, the electronic device 101 of FIG. 1) includes a connection part for signal transmission between the first structure 610 and the second structure 660 in each of the slide-up state and the slide-down state. I can. The electronic device 101 may include a tuning unit for optimizing antenna performance in each of the slide-up state and the slide-down state.

Referring to FIG. 6, the first structure 610 may include an antenna 611. The antenna 611 may be electrically connected to a first PCB (eg, the first PCB 520 of FIG. 5 ). The first structure 610 may include an antenna connection circuit 630 disposed on the first PCB. The first structure 610 may include a first antenna connection terminal 621 and a second antenna connection terminal 622 for connecting the antenna connection circuit and the second structure 660.

The second structure 660 may include an RF module 675. For example, the RF module 675 may be implemented as an RFIC. The second structure 660 includes a circuit (hereinafter, referred to as an RF circuit) 680 disposed on a second PCB (eg, the second PCB 570 of FIG. 5) and connected to an RF module or a ground (GND). Can include. The second structure 660 includes a first RF connection terminal 671, a second RF connection terminal 672, and a third RF connection terminal 673 for connection between the RF circuit and the first structure 610 can do. According to an embodiment, the RF circuit 680 may include a tuning circuit according to each RF circuit terminal. The RF circuit 680 includes a first tuning circuit 681 connected to the first RF connection terminal 671, a second tuning circuit 682 connected to the second RF connection terminal 672, and a third RF connection. A third tuning circuit 683 connected to the terminal 673 may be included.

Meanwhile, the tuning circuit configured in each RF connection terminal is only an example, and the present disclosure is not limited thereto. The RF circuit 680 may include one tuning circuit for a plurality of RF connection terminals. For example, the RF circuit 680 may include a tuning circuit for the first RF connection terminal 671 and the second RF connection terminal 672 and another tuning circuit for the third RF connection terminal 673. . As another example, the RF circuit 680 may include a tuning circuit for the first RF connection terminal 671 and another tuning circuit for the second RF connection terminal 672 and the third RF connection terminal 673. have.

According to various embodiments, the electronic device 101 may move the first structure 610 upward and downward, and thus, the antenna connection terminals of the first structure 610 (for example, the The RF connection terminals of the second structure 660 connected to the 2 antenna connection terminal 622 may include a different connection structure. For example, the electronic device 101 includes a first RF connection terminal 671 of the second structure 660 and a second RF connection terminal ( 672, and a third RF connection terminal 673 disposed relatively above the second RF connection terminal 672 on the y-axis. Here, the y-axis means an axis along the slide movement direction. In the slide-down state, the first antenna connection terminal 621 may be connected to the first RF connection terminal 671. In the slide-down state, the second antenna connection terminal 622 may be connected to the second RF connection terminal 672. Thereafter, in the slide-up state, the first antenna connection terminal 621 may be connected to the second RF connection terminal 672. In addition, the second antenna connection terminal 622 may be connected to the third RF connection terminal 673.

According to various embodiments, the electronic device 101 may include an RF circuit 680 including a different RF circuit configuration in each state. The electronic device 101 may include a connection structure configured to have different RF connection terminals connected to the first structure 610 in a slide-up state and a slide-down state, respectively. As the RF connection terminals are changed, the configuration of the RF path formed from the antenna to the RF module through the connection of the antenna circuit of the first structure 610 and the RF circuit of the second structure 660 may be changed.

In the RF circuit 680 according to various embodiments, a tuning circuit for an RF terminal contacted or electrically connected to the first structure 610 in each state (eg, slide-up or slide-down) may be individually configured. I can. For example, in the slide-down state, the RF circuit 680 including the first tuning circuit 681 and the second tuning circuit 682 may be designed to optimize antenna performance. In addition, as an example, in a slide-up state, the RF circuit 680 including the second tuning circuit 682 and the third tuning circuit 683 may be designed to optimize antenna performance. The electronic device 101 may include a first structure 610, a second structure 660, and a connection structure forming different RF paths in each of a slide-up state and a slide-down state.

7 illustrates an example 700 of a contact structure for connection between structures according to various embodiments.

Referring to FIG. 7, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 710 and a second structure 760. The first structure 710 may be a moving part of the slide electronic device (eg, the electronic device 101 of FIG. 1 ), and the second structure 760 may be a fixing part of the slide electronic device. A cross-sectional view 700a illustrates a contact structure including terminals for connection between the first structure 710 and the second structure 760, and another cross-sectional view 700b illustrates internal terminals of each structure.

The first structure 710 may include a first PCB 720. The first structure 710 may include an antenna 711 disposed on the first PCB 720. The first structure 710 may include a first antenna connection terminal 721 and/or a second antenna connection terminal 722 disposed on the first PCB 720 and connected to the antenna 711. Each antenna connection terminal may be a conductive member.

The second structure 760 may include a second PCB 770. The second structure 760 may include an RF module disposed on the second PCB 770. The second structure 760 may include a contact pad disposed on the second PCB 770. The contact pad may be a first RF connection terminal 771 connected to an RF module or ground (GND) on the second PCB 770, a second RF connection terminal 772, and/or a third RF connection terminal ( 773) may be included.

According to various embodiments, referring to the cross-sectional view 700a, the first antenna connection terminal 721 may be physically attached to the contact member 745. The contact member 745 may be a conductive member. The contact member 745 may physically contact the first RF connection terminal 771 of the second structure 760. An RF path may be formed from the antenna 711 of the first structure 710 to the RF module (not shown) of the second structure 760 according to the physical contact of the conductive members.

In order to transmit a signal through an antenna through a wireless channel or receive a signal from the wireless channel, a path through which an RF signal is transmitted may be required. The RF signal can be transmitted through a contact structure that makes physical contact.

An electronic device according to various embodiments may include a contact structure that moves up and down when the first structure 710 moves up and down, referring to another cross-sectional view 700a. The contact structure includes an antenna connection terminal of the first structure 710 (eg, a first antenna connection terminal 721, a second antenna connection terminal 722), and an RF connection terminal of the second structure 760 (eg, a first An RF connection terminal 771, a second RF connection terminal 772, a third RF connection terminal 773, and a contact member 745 may be included. Through the contact structure including the contact member 745, the electronic device 101 may be connected without a coaxial cable or FPCB for connection between the antenna of the first structure 710 and the RF circuit of the second structure 760. .

8A shows an example 800 of antenna tuning in a contact structure according to various embodiments. The contact structure may mean a structure in which two structures are connected by physically contacting a contact member having conductivity between the antenna connection terminal of the first structure and the RF connection terminal of the second structure, as shown in FIG. 7.

Referring to FIG. 8A, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 810 and a second structure 860. A situation where the first structure 810 is a moving part of the slide electronic device 101 and the second structure 860 is a fixed part of the slide electronic device is described as an example.

The first structure 810 may include a first PCB 820. The first structure 810 may include an antenna 811 disposed on the first PCB 820. The first structure 810 may include an antenna connection circuit configured in the first PCB 820. The antenna 811 may be connected to the first antenna connection terminal 821 and the second antenna connection terminal 822 through an antenna connection circuit. The first antenna connection terminal 821 and the second antenna connection terminal 822 may be disposed on the first structure 810 through an antenna connection circuit.

The second structure 860 may include a second PCB 870. The second structure 860 may include an RF module (eg, RFIC) 875 disposed on the second PCB 870. The second structure 860 may constitute an RF circuit in the second PCB. The ground may be connected to the first RF connection terminal 871 and the third RF connection terminal 873 through an RF circuit. The RF module 875 may be connected to the second RF connection terminal 872 through an RF circuit. The first RF connection terminal 871, the second RF connection terminal 872, and the third RF connection terminal 873 may be disposed on the second structure 860 through an RF circuit.

Referring to the cross-sectional view 800a, the electronic device may be in a slide-down state. The first antenna connection terminal 821 may be in physical contact with the first contact member 845a. The second antenna connection terminal 822 may physically contact the second contact member 845b. The first contact member 845a may physically contact the first RF connection terminal 871. The second contact member 845b may physically contact the second RF connection terminal 872. In order to become a slide-up state, the first structure 810 may move to the right on the x-axis. In the slide-up state, the first contact member 845a may physically contact the second RF connection terminal 872. The second contact member 845b may physically contact the third RF connection terminal 873. Through each contact member, the antenna connection terminal and the RF connection terminal may be electrically connected. An RF path through which signals are transmitted from the antenna 811 to the RF module 875 or from the RF module 875 to the antenna 811 may be formed.

Referring to the internal circuit diagram 800b, the second structure 860 may include a tuning circuit corresponding to each RF connection terminal. The first RF connection terminal 871 may be connected to the first tuning circuit 881. The first tuning circuit 881 may be connected to the ground. The first tuning circuit 881 may include a transmission line having a first length, an inductor, and/or a capacitor. The second RF connection terminal 872 may be connected to the second tuning circuit 882. The second tuning circuit may be connected to the RF module 875. The second tuning circuit 882 may include an inductor and a capacitor. The third RF connection terminal 873 may be connected to the third tuning circuit 883. The third tuning circuit 883 may be connected to the ground. The third tuning circuit 883 may include a transmission line having a second length, an inductor, and/or a capacitor.

In various embodiments, the first RF tuning circuit 881 includes at least one of a first capacitor, a first resistor, a first inductor, or a first chip (eg, a compensation circuit), and the second RF tuning circuit ( The 882 may include at least one of a second capacitor, a second resistor, a second inductor, or a second chip (eg, a compensation circuit). Here, at least one of the first capacitor, the first resistor, the first inductor, and the first chip has a value at which a standing wave ratio related to the first antenna in the first state is maximum, and the second capacitor, At least one of the second resistor, the second inductor, and the second chip may have a value at which a standing wave ratio related to the second antenna in the second state becomes maximum.

In the slide-down state, only the first RF connection terminal 871 and the second RF connection terminal 872 are connected to the first structure 810 through the first contact member 845a and the second contact member 845b, respectively. Therefore, the third tuning circuit 883 may be deactivated. According to various embodiments, the electronic device may optimize antenna performance in a slide-down state through the design of the first tuning circuit 881 and the second tuning circuit 882. According to various embodiments, the design of a tuning circuit for optimizing antenna performance includes a circuit design that lowers a reflection coefficient or a return loss of an antenna end, a circuit design that increases a signal gain transmitted through an antenna, and corresponds to the impedance of the antenna end. At least one of the design of the impedance matching circuit may be included. The third tuning circuit 883 may not affect the design of a tuning circuit for minimizing return loss to the antenna in a slide-down state. According to an embodiment, a value of a capacitor and an inductor of the tuning circuit for optimization may be predetermined values (eg, experimental values).

In the slide-up state, only the second RF connection terminal 872 and the third RF connection terminal 873 are connected to the first structure 810 through the first contact member 845a and the second contact member 845b, respectively. Therefore, the first tuning circuit 881 may be deactivated. According to various embodiments, the electronic device may optimize antenna performance in a slide-up state through the design of the second tuning circuit 882 and the third tuning circuit 883. The first tuning circuit 881 may not affect the design of the tuning circuit for minimizing return loss to the antenna in the slide-up state. According to an embodiment, a value of a capacitor and an inductor of the tuning circuit for optimization may be predetermined values (eg, experimental values).

According to various embodiments, the length of a line from the antenna 811 to the second structure 860 may vary according to the slide movement of the first structure 810. When the antenna 811 moves upward on the y-axis in the internal circuit diagram 800b, the distance between the second structure 860 and the antenna 811 may increase. That is, the length of the transmission line through which the RF signal is transmitted from the second structure 860 to the antenna 811 may be increased. Conversely, when the antenna 811 moves downward on the y-axis, the distance between the second structure 860 and the antenna 811 may decrease. That is, the length of the transmission line through which the RF signal is transmitted from the second structure 860 to the antenna 811 may be reduced. Since there is only one antenna 811, in order to configure a tuning circuit that optimizes the performance of the antenna 811, it may be required to compensate for the length of the transmission line that varies in each state.

According to an embodiment, the transmission line of the first tuning circuit 881 activated in the slide-down state is slide-up in order to compensate for a transmission line having a short length between the antenna 811 and the second structure 860. It may be configured to be longer than the transmission line of the third tuning circuit 883 activated in the state. In other words, the electronic device 101 includes a first tuning circuit 881 including a transmission line having a first length and a third tuning circuit 883 including a transmission line having a second length shorter than the first length. Can include. Further, according to another embodiment, since the environment (interference) around the antenna in the slide-up-state and the slide-down state is different, a circuit in which a compensation element for the slide-down state is further added may be configured. That is, the tuning circuit according to various embodiments of the present disclosure may electrically maintain the resonant frequency, which varies according to the length of the antenna, at a desired frequency, and also, the peripheral devices according to the slide-up state or the slide-down state. It can be used to optimize property changes that may occur with water.

8B shows an example 850 of circuitry for antenna tuning in accordance with various embodiments. 8B is a diagram illustrating a connection between the first structure 810 and the second structure 860 of FIG. 8A as a circuit. The first structure 810 and the second structure 860 may correspond to the first structure 610 and the second structure 860 of FIG. 6, respectively. A situation where the first structure 810 is a moving part of the slide electronic device and the second structure 860 is a fixed part of the slide electronic device is described. Hereinafter, a description of the same or similar configuration as in FIG. 6 may be omitted.

Referring to FIG. 8B, the first structure 810 may include an antenna 811. The first structure 810 may include a first antenna connection terminal 821 and a second antenna connection terminal 822. The first structure 810 may include an antenna connection circuit 830 connecting the antenna 811 to each antenna connection terminal. The antenna connection circuit may have a two-terminal structure.

The second structure 860 may include an RF module 875. For example, the RF module 875 may be implemented as an RFIC. The second structure 860 may include a first RF connection terminal 871, a second RF connection terminal 872, and a third RF connection terminal 873. The second structure 860 may include an RF circuit 880 for electrical connection between the RF module 875 and the RF connection terminal. Each RF connection terminal may be connected to the RF module 875 or ground. The RF circuit 880 may include a tuning circuit according to each RF circuit terminal. The RF circuit 880 includes a first tuning circuit 881 connected to the first RF connection terminal 871, a second tuning circuit 882 connected to the second RF connection terminal 872, and a third RF connection. A third tuning circuit 883 connected to the terminal 873 may be included. That is, the RF circuit 880 may have a 3-terminal structure.

According to various embodiments, in the slide-down state, the electronic device (eg, the electronic device 101 of FIG. 1) is connected to the first antenna connection terminal 821 through the first RF connection terminal 871 , An RF circuit 880 connected to the second antenna connection terminal 822 through the second RF connection terminal 872 may be included. At this time, the connection between the first antenna connection terminal 821 and the first RF connection terminal 871 is performed only in the slide-down state, and the first tuning circuit 881 connected to the first RF connection terminal 871 Can be designed based on optimization settings for the slide-down state. The first tuning circuit 881 may include a transmission line and a passive element (eg, resistor, inductor, capacitor). The length of the transmission line and values of the passive elements may be values determined for optimization setting of the slide-down state. The optimization setting may include at least one of setting a circuit for increasing a gain of the antenna 811, setting a circuit for reducing return loss, and setting a circuit for providing a low resonance error in a corresponding frequency band. That is, in the optimization setting, the first tuning circuit 881 may operate as an impedance matching circuit for RF paths configured in a slide-down state.

According to various embodiments, in the slide-down state, the third tuning circuit 883 may be deactivated. According to an embodiment, in the slide-down state, the third tuning circuit 883 may operate as an open circuit or may be connected to a terminating resistor so as not to affect the tuning circuit design.

In the slide-up state, in the electronic device, the first antenna connection terminal 821 and the second RF connection terminal 872 are connected, and the second antenna connection terminal 822 and the third RF connection terminal 873 are connected. It may include an RF circuit 880. At this time, the connection between the second antenna connection terminal 822 and the third RF connection terminal 873 is performed only in the slide-up state, and the third tuning circuit 883 connected to the third RF connection terminal 873 Can be designed based on the optimization setting for the slide-up state. The third tuning circuit 883 may include a transmission line and a passive element (eg, a resistance, an inductor, and a capacitor). The length of the transmission line and values of the passive elements may be values determined for optimal setting of the slide-up state.

According to various embodiments, in the slide-up state, the first tuning circuit 881 may be deactivated. According to an embodiment, in the slide-up state, the first tuning circuit 881 may operate as an open circuit or may be connected to a terminating resistor in order not to affect the tuning circuit design.

According to various embodiments, the electronic device (eg, the electronic device 101 of FIG. 1) includes a second tuning circuit 883 having a transmission line having a shorter length than the first tuning circuit 881. A structure 860 may be included. The physical distance between the antenna 811 and the second structure 860 in the slide-up state may be longer than the physical distance between the antenna 811 and the second structure 860 in the slide-down state. Since the length of the transmission line of the third tuning circuit 883 is shorter than the length of the transmission line of the first tuning circuit 881, antenna radiation according to the length of the RF path increases in the slide-up state compared to the slide-down state. Characteristics can be compensated.

The connection structure of FIGS. 8A to 8B connects the first structure 810 and the second structure 860 using the two-terminal structure antenna connection circuit 830 and the three-terminal structure RF circuit 880 And provided a tuning circuit for each connection state. However, the antenna connection circuit 830 of the two-terminal structure or the RF circuit 880 of the three-terminal structure are only examples for explanation, and various embodiments of the present disclosure are not limited thereto. Hereinafter, as an alternative example, embodiments of a connection structure using a 1-terminal structure antenna connection circuit and a 2-terminal structure RF circuit will be described with reference to FIGS. 9A to 9B.

9A illustrates another example 900 of antenna tuning in a contact structure according to various embodiments. The contact structure may mean a structure in which two structures are connected by physically contacting a contact member having conductivity between the antenna connection terminal of the first structure and the RF connection terminal of the second structure, as shown in FIG. 7.

Referring to FIG. 9A, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 910 and a second structure 960. A situation where the first structure 910 is a moving part of the slide electronic device 101 and the second structure 960 is a fixed part of the slide electronic device is described as an example.

The first structure 910 may include a first PCB 920. The first structure 910 may include an antenna 911 disposed on the first PCB 920. The first structure 910 may include an antenna connection circuit configured in the first PCB 920. The antenna 911 may be connected to the first antenna connection terminal 921 through an antenna connection circuit. The first antenna connection terminal 921 may be disposed on the first structure 910 through an antenna connection circuit.

The second structure 960 may include a second PCB 970. The second structure 960 may include an RF module (eg, RFIC) 975 disposed on the second PCB 970. The second structure 960 may constitute an RF circuit in the second PCB. The first RF connection terminal 971 and the second RF connection terminal 972 may be connected to the ground through an RF circuit. In addition, the first RF connection terminal 971 and the second RF connection terminal 972 may be connected to the RF module 975 through an RF circuit. The first RF connection terminal 971 and the second RF connection terminal 972 may be disposed on the second structure 960 through an RF circuit.

Referring to the cross-sectional view 900a, the electronic device may be in a slide-down state. The first antenna connection terminal 921 may physically contact the first contact member 945a and the second contact member 945b. The first contact member 945a and the second contact member 945b may physically contact the first RF connection terminal 971. In order to become a slide-up state, the first structure 910 may move to the right on the x-axis. In the slide-up state, the first contact member 945a and the second contact member 945b may physically contact the second RF connection terminal 972. Through each contact member, the antenna connection terminal and the RF connection terminal may be electrically connected. An RF path through which signals are transmitted from the antenna 911 to the RF module 975 or from the RF module 975 to the antenna 911 may be formed.

According to various embodiments, since the first antenna connection terminal 921 is connected to the two contact members, the connection between the first structure 910 and the second structure 960 may be maintained even during slide movement. A detailed description is described through FIG. 10B.

Referring to the internal circuit diagram 900b, the second structure 960 may include a tuning circuit corresponding to each RF connection terminal. The first RF connection terminal 971 may be connected to the first tuning circuit 981. The first tuning circuit 981 may be connected to the ground and the RF module 975. The first tuning circuit 981 may include a transmission line having a first length, an inductor, and/or a capacitor. The second RF connection terminal 972 may be connected to the second tuning circuit 982. The second tuning circuit may be connected to the ground and the RF module 975. The second tuning circuit 982 may include a transmission line having a second length, an inductor, and/or a capacitor.

In the slide-down state, since only the first RF connection terminal 971 is connected to the first structure 910 through the first contact member 945a and the second contact member 945b, the second tuning circuit 982 is Can be disabled. According to various embodiments, the electronic device may optimize antenna performance in a slide-down state through the design of the first tuning circuit 981. According to various embodiments, the design of a tuning circuit for optimizing antenna performance includes a circuit design that lowers a reflection coefficient or a return loss of an antenna end, a circuit design that increases a signal gain transmitted through an antenna, and corresponds to the impedance of the antenna end. At least one of the design of the impedance matching circuit may be included. The second tuning circuit 982 may not affect the design of the tuning circuit for minimizing return loss to the antenna in the slide-down state. According to an embodiment, a value of a capacitor and an inductor of the tuning circuit for optimization may be predetermined values (eg, experimental values).

In the slide-up state, since only the second RF connection terminal 972 is connected to the first structure 910 through the first contact member 945a and the second contact member 945b, the first tuning circuit 981 is Can be disabled. According to various embodiments, the electronic device may optimize antenna performance in a slide-down state through the design of the second tuning circuit 982. The first tuning circuit 981 may not affect the design of a tuning circuit for minimizing return loss to the antenna in the slide-up state. According to an embodiment, a value of a capacitor and an inductor of the tuning circuit for optimization may be predetermined values (eg, experimental values).

According to various embodiments, the length of the line from the antenna 911 to the second structure 960 may vary according to the slide movement of the first structure 910. As mentioned in FIG. 8A, since the length between the antenna 911 and the second structure 960 in the slide-up state is longer than the length in the slide-down state, the transmission line of the second tuning circuit 982 is An RF circuit including a first tuning circuit 981 including a long transmission line may be disposed on the second structure 960.

9B shows another example of a circuit for antenna tuning according to various embodiments. FIG. 9B is a diagram illustrating a connection between the first structure 910 and the second structure 960 of FIG. 9A as a circuit. The first structure 910 and the second structure 960 may correspond to the first structure 610 and the second structure 960 of FIG. 6, respectively. The first structure 910 is a moving part of the slide electronic device, and the second structure 960 is a fixed part of the slide electronic device. Hereinafter, a description of the same or similar configuration as in FIG. 6 may be omitted.

Referring to FIG. 9B, the first structure 910 may include an antenna 911. The first structure 910 may include a first antenna connection terminal 921. The first structure 910 may include an antenna connection circuit 930 connecting the antenna 911 and the first antenna connection terminal 921. The antenna connection circuit may have a one-terminal structure.

The second structure 960 may include an RF module 975. For example, the RF module 975 may be implemented as an RFIC. The second structure 960 may include a first RF connection terminal 971 and a second RF connection terminal 972. The second structure 960 may include an RF circuit 980 for electrical connection between the RF module 975 and an RF connection terminal. Each RF connection terminal can be connected to the RF module and ground. The RF circuit 980 may include a tuning circuit according to each RF circuit terminal. The RF circuit 980 may include a first tuning circuit 981 connected to the first RF connection terminal 971 and a second tuning circuit 982 connected to the second RF connection terminal 972. That is, the RF circuit 980 may have a two-terminal structure.

According to various embodiments, in the slide-down state, the electronic device (eg, the electronic device 101 of FIG. 1) is connected to the first antenna connection terminal 921 through the first RF connection terminal 971. RF circuitry 980 may be included. At this time, the connection between the first antenna connection terminal 921 and the first RF connection terminal 971 is performed only in the slide-down state, and the first tuning circuit 981 connected to the first RF connection terminal 971 Can be designed based on the optimization setting for the slide-down state. The first tuning circuit 981 may include a transmission line and a passive element (eg, resistor, inductor, capacitor). The length of the transmission line and values of the passive elements may be values determined for optimization setting of the slide-down state. The optimization setting may include at least one of setting a circuit for increasing a gain of the antenna 911, setting a circuit for reducing return loss, and setting a circuit for providing a low resonance error in a corresponding frequency band. That is, in the optimization setting, the first tuning circuit 981 may operate as an impedance matching circuit for RF paths configured in a slide-down state.

According to various embodiments, in the slide-down state, the second tuning circuit 982 may be deactivated. According to an embodiment, in the slide-down state, the second tuning circuit 982 may operate as an open circuit or may be connected to a terminating resistor in order not to affect the tuning circuit design.

In the slide-up state, the electronic device may include an RF circuit 880 connected to the first antenna connection terminal 921 through the second RF connection terminal 972. At this time, the connection between the first antenna connection terminal 921 and the second RF connection terminal 972 is performed only in the slide-up state, and the second tuning circuit 982 connected to the second RF connection terminal 972 Can be designed based on the optimization setting for the slide-up state. The second tuning circuit 982 may include a transmission line and a passive element (eg, resistance, inductor, capacitor). The length of the transmission line and values of the passive elements may be values determined for optimal setting of the slide-up state.

According to various embodiments, in the slide-up state, the first tuning circuit 981 may be deactivated. According to an embodiment, in the slide-up state, the first tuning circuit 981 may operate as an open circuit or may be connected to a terminating resistor so as not to affect the tuning circuit design.

According to various embodiments, the electronic device may include a second structure 960 including a second tuning circuit 982 having a transmission line having a length shorter than that of the first tuning circuit 981. The length of the physical line between the antenna 911 and the second structure 960 in the slide-up state is longer than the length of the physical line between the antenna 911 and the second structure 960 in the slide-down state Therefore, the length of the transmission line of the second tuning circuit 982 can be implemented to be shorter than the length of the transmission line of the first tuning circuit 981. Accordingly, antenna radiation characteristics according to the length of the RF path that increase in the slide-up state compared to the slide-down state may be compensated.

10A illustrates examples 1000a, 1000b, and 1000c of connection structures for maintaining connections between structures according to various embodiments. In the embodiments of FIG. 10A, as shown in FIGS. 8A to 8B, a connection structure including three RF connection terminals is described as an example.

Referring to FIG. 10A, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 810 and a second structure 860. The first structure 810 may include an antenna. The second structure 860 may include an RF circuit. The first structure 810 may include a first antenna connection terminal 821 and a second antenna connection terminal 822. The second structure 860 may include a first RF connection terminal 871, a second RF connection terminal 872, and a third RF connection terminal 873. The electronic device may include a connector. The connection part may include a first contact member 845a and a second contact member 845b. The first contact member 845a may be attached to the first antenna connection terminal 821. The second contact member 845b may be attached to the second antenna connection terminal 822.

The electronic device according to various embodiments may include a connection structure in which a connection between the first structure 810 and the second structure 860 is maintained by connecting any one of the antenna connection terminals to the RF circuit. In the present disclosure, the connection structure includes an antenna connection terminal disposed on a first PCB of the first structure, a contact member connected to the antenna connection terminal, and a contact member physically attached to the contact member and disposed on the second PCB of the second structure. It may include an RF connection terminal.

In the electronic device according to various embodiments, when the contact between the second contact member 845b and the second structure 860 is separated, a contact between the first contact member 845a and the second structure 860 is maintained. It may include a connection structure. In addition, the electronic device 101 according to various embodiments of the present disclosure includes a second contact member 845b and a second structure 860 when the first contact member 845a is separated from the second structure 860. It may include a connection structure in which the contact is maintained.

According to various embodiments, the electronic device may include a connection part that forms a difference between a time when one contact member falls from the second structure 860 and a time when another contact member falls from the second structure 860. For example, when the first structure 810 slides, the electronic device 101 has a second RF connection terminal from a point in time when the first contact member 845a disconnects the contact with the first RF connection terminal 871. A structure in which the second contact member 845b is maintained connected to the second RF connection terminal 872 during a period up to the point of contact with the 872 may be included. In addition, for example, when the first structure 810 slides, the electronic device 101 is a third RF connection terminal from the point when the second contact member 845b disconnects the contact with the second RF connection terminal 872. A structure in which the connection of the first contact member 845a to the second RF connection terminal 872 is maintained during the period up to the point of contact with the 873 may be included.

The first state 1000a may be a slide-down state. In the first state 1000a, the first contact member 845a may be connected to the first RF connection terminal 871. The second contact member 845b may be connected to the second RF connection terminal 872.

The second state 1000b may be a state that is moving from a slide-down state to a slide-up state. That is, the second state 1000b represents a situation in which the first structure 810 is further moved to the right ((+) x-axis direction) in the first state 1000a. Even if the first contact member 845a is separated from the first RF connection terminal 871, the second contact member 845b is connected to the second RF connection terminal 872 through a structure in which the connection is maintained. And a connection between the second structures 860 may be maintained. The electronic device 101 has a connection structure in which the second contact member 845b maintains contact with the second RF connection terminal 872 until the first contact member 845a is connected to the second RF connection terminal 872 It may include.

The third state 1000c may be a slide-up state. That is, in the third state 1000c, in the second state 1000b, the first structure 810 is further moved to the right ((+) x-axis direction). Even though the second contact member 845b is separated from the second RF connection terminal 872, the first structure 810 is formed through a structure in which the first contact member 845a is connected to the second RF connection terminal 872. And a connection between the second structures 860 may be maintained. The electronic device 101 has a connection structure in which the first contact member 845a maintains contact with the second RF connection terminal 872 until the second contact member 845b is connected to the third RF connection terminal 873 It may include.

An electronic device according to various embodiments may include a second structure 860 composed of three RF terminals. One of the three RF terminals may include an RF terminal having a different length of the contact area. The length of the area for contacting the contact member (hereinafter, the contact area) may be greater than the RF connection terminals at both ends. Here, the length of the contact area may be a length corresponding to the slide movement direction (eg, x-axis).

According to various embodiments, through a connection structure in which the length of the contact area between the RF connection terminals is different, the time when each of the contact members is separated from and attached to the second structure 860 (hereinafter, contact movement time) overlap with each other. May not be. Specifically, when the first contact member 845a connected to the first antenna connection terminal 821 of the first structure 810 is separated from the second structure 960 (for example, the first RF connection terminal 871) The second contact member 845b is attached to the second structure 860 from the point of separation from the second structure 860 (for example, the point of contact with the second RF connection terminal 872). From the point of separation (eg, the point of separation from the second RF connection terminal 872) to the point of reattachment to the second structure 860 (eg, the point of contact with the third RF connection terminal 873) and on the time axis May not overlap.

According to various embodiments of the present disclosure, the electronic device does not overlap with the point in time at which the contact of each contact member with the second structure 860 is released, so that the first structure 810 is irrespective of the slide movement of the first structure 810. And the second structure 860 may include a connection structure in which contact is maintained.

10B illustrates another example of a

connection structure

1050a, 1050b, and 1050c for maintaining a connection between structures according to various embodiments. In the embodiments of FIG. 10B, a connection structure including two RF connection terminals as shown in FIGS. 9A to 9B is described as an example.

Referring to FIG. 10B, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 910 and a second structure 960. The first structure 910 may include an antenna. The second structure 960 may include an RF circuit. The first structure 910 may include a first antenna connection terminal 921. The second structure 960 may include a first RF connection terminal 971 and a second RF connection terminal 972. The electronic device 101 may include a connector. The connection part may include a first contact member 945a and a second contact member 945b. The first contact member 945a may be attached to the first antenna connection terminal 921. The second contact member 945b may also be attached to the first antenna connection terminal 921.

In an electronic device according to various embodiments, when the second contact member 945b is separated from the second structure 960, the first contact member 945a is a connection structure in which the contact with the second structure 960 is maintained. It may include. Also, in the electronic device 101 according to various embodiments, when the first contact member 945a is separated from the second structure 960, the second contact member 945b makes a contact with the second structure 960. This may include a retained connection structure.

According to various embodiments, the electronic device may include a connection portion that forms a difference between a time when one contact member falls from the second structure 960 and a time when another contact member falls from the second structure 960. For example, when the first structure 910 slides, the electronic device 101 starts the second RF connection terminal when the second contact member 945b is disconnected from the contact with the first RF connection terminal 971. A structure in which the first contact member 945a is connected to the first RF connection terminal 971 may be maintained during the period until the point of contact with the 972. Also, for example, when the first structure 810 slides, the second RF connection terminal 972 starts when the first contact member 945a is disconnected from the contact with the first RF connection terminal 971. A structure in which the second contact member 945b is maintained connected to the second RF connection terminal 972 during a period up to the point of contact with the second contact member 945b may be included.

The first state 1050a may be a slide-down state. In the first state 1050a, both the first contact member 945a and the second contact member 945b may be connected to the first RF connection terminal 971.

The second state 1050b may be a state that is moving from a slide-down state to a slide-up state. That is, the second state 1050b represents a situation in which the first structure 910 is further moved to the right ((+)x-axis direction) in the first state 1050a. The first contact member 945a may be connected to the first RF connection terminal 971, but the second contact member 945b may be connected to the second RF connection terminal 972. Even if the second contact member 945b is separated from the first RF connection terminal 971, the first structure 910 is formed through a structure in which the first contact member 945a is connected to the first RF connection terminal 971. And a connection between the second structures 960 may be maintained. For example, when the call state changes from slide-down to slide-up or slide-up to slide-down state, the connection between the antenna and the RF module is maintained, thereby preventing call disconnection due to a complete short and ensuring safety. have.

The third state 1050c may be a slide-up state. That is, the third state 1050c is a situation in which the first structure 910 is further moved to the right ((+)x-axis direction) in the second state 1050b. Even if the first contact member 945a is separated from the first RF connection terminal 921, the first structure 910 is formed through a structure in which the first contact member 945a is connected to the first RF connection terminal 921. And a connection between the second structures 960 may be maintained.

An electronic device according to various embodiments of the present disclosure may include a second structure 960 including two RF terminals having different contact areas. As the lengths of the contact areas of the RF connection terminals are different, the time (ie, contact movement time) when each of the contact members is separated from and attached to the second structure 960 may not overlap with each other. Specifically, when the first contact member 945a connected to the first antenna connection terminal 921 of the first structure 910 is separated from the second structure 960 (for example, the first RF connection terminal 971) The second contact member 945b is attached to the second structure 960 from the time of separation from the second structure 960 (e.g., the contact point with the second RF connection terminal 972). From the point of separation (e.g., the point of separation from the first RF connection terminal 971) to the point of reattachment to the second structure 960 (e.g., the point of contact with the second RF connection terminal 972) and on the time axis. May not overlap.

According to various embodiments of the present disclosure, in the electronic device, the point of time at which each contact member releases contact with the second structure 960 does not overlap, so that the first structure 910 and the second structure 960 are irrespective of the slide movement. It may include a connection structure in which the contact is maintained.

In FIGS. 10A and 10B, embodiments of a structure for preventing a complete disconnection between an antenna and an RF circuit during a slide operation process so that the point in time at which contact is released between the contact members do not overlap each other are described.

Although two contact members have been described as examples in FIGS. 10A and 10B, the present disclosure is not limited thereto. The electronic device 101 according to various embodiments may include three or more contact members. In order to maintain the connection between the first structure and the second structure, a region in which the time of each contact member separated from the first structure and reconnected to the second structure (hereinafter, referred to as the contact movement time) overlaps (that is, all contact members It may include a connection structure that is designed so that an area where the contact movement time of the two overlaps) does not occur. This is because, when the contact movement times of all the contact members are at least partially overlapped, complete disconnection occurs between the first structure and the second structure.

10A and 10B, a method for maintaining the connection during slide movement in the contact type connection portion through the RF connection terminal disposed in the middle of the contact area longer than other RF connection terminals has been described. However, in the present disclosure, the connection part for maintaining the connection may be implemented in a manner other than the length of the contact area of the RF connection terminal. According to an embodiment, the distance between the first antenna connection terminal 821 and the second antenna connection terminal 822 is configured to be longer than the length of each RF connection terminal, so that the electronic device 101 has at least one antenna connection terminal. May include a connection structure having a structure that is always in contact with the RF connection terminal.

In FIGS. 10A to 10B, it has been described that the first structure and the second structure are connected through a contact member including a conductive member, but the shape of the contact member may be configured in various ways. The electronic device according to various embodiments may include a contact member having a rolling structure. In order to reduce abrasion due to repeated operations in which the contact with the second structure (or the first structure) is separated and reattached, the contact member may have a shape for rolling. The shape for rolling may include a shape of a cylinder or a sphere that can be rotated according to the slide movement. In addition, even if the first structure slides, in order to maintain the connection between the first structure and the second structure, the contact movement time of the rolling type first contact member overlaps the contact movement time of the rolling type second contact member. May not be.

11 shows an example 1100 of a coupling structure using a capacitor according to various embodiments. Coupling may refer to a phenomenon in which AC signal energy is transmitted to each other electrically or magnetically between separate spaces or lines. Unlike the connection structure through a contact between the first structure and the second structure described in FIGS. 8A to 10B, the first structure and the second structure are electrically connected through coupling even if the first structure and the second structure are not in contact. Embodiments of the structure for the following are described together with FIG. 11.

Referring to FIG. 11, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 1110 and a second structure 1160. The first structure 1110 is a moving part of the slide electronic device 101, and the second structure 1160 is a fixed part of the slide electronic device.

The first structure 1110 may include a first PCB 1120. The first structure 1110 may include an antenna 1111 disposed on the first PCB 1120. The first structure 1110 may include an antenna connection circuit configured in the first PCB 1120. The antenna 1111 may be connected to the first antenna connection terminal 1121 and the second antenna connection terminal 1122 through an antenna connection circuit. The first antenna connection terminal 1121 and the second antenna connection terminal 1122 may be disposed on the first structure 1110 through an antenna connection circuit.

The second structure 1160 may include a second PCB 1170. The second structure 1160 may include an RF module (eg, RFIC) 1175 disposed on the second PCB 1170. The second structure 1160 may constitute an RF circuit in the second PCB. The ground may be connected to the first RF connection terminal 1171 and the third RF connection terminal 1173 through an RF circuit. The RF module 1175 may be connected to the second RF connection terminal 1172 through an RF circuit. The first RF connection terminal 1171, the second RF connection terminal 1172, and the third RF connection terminal 1173 may be disposed on the second structure 1160 through an RF circuit.

Referring to the cross-sectional view 1100a, the electronic device may be in a slide-down state. The first antenna connection terminal 1121 may include a conductive plate). The second antenna connection terminal 1122 may include a conductive plate. Similarly, each of the first RF connection terminal 1171, the second RF connection terminal 1172, and the third RF connection terminal 1173 may include a conductive plate. The electronic device may include a connection structure in which electric charges are charged by forming a space by two or more conductive plates. For example, electric charges are charged in the conductive plate of the first antenna connection terminal 1121 and the conductive plate of the first RF connection terminal 1171, so that the electronic device 101 comprises a first structure 1110 and a second structure ( It may include a connection structure 1145a providing an equivalent circuit such as a capacitor is inserted between the 1160. In addition, for example, electric charges are charged in the conductive plate of the second antenna connection terminal 1122 and the conductive plate of the second RF connection terminal 1172, so that the electronic device is configured with the first structure 1110 and the second structure 1160. ) May include a connection structure 1145b that provides an equivalent circuit such that a capacitor is inserted therebetween.

In order to become a slide-up state, the first structure 1110 may move to the right on the x-axis. Even if the conductive plates are not accurately symmetric, the electronic device may include a structure in which the RF connection between the first structure 1110 and the second structure 1160 is shorted. According to various embodiments, the electronic device may include a connection structure including conductive plates providing a value of a capacitor greater than a reference value. The reference value may be determined based on a space formed between each conductive plate, a size of an area of the conductive plate, a dielectric constant, and a distance between the first structure and the second structure.

Even in the slide-up state, the electronic device may include a connection structure in which electric charges are charged by forming a space between two or more conductive plates. For example, as electric charges are charged in the conductive plate of the first antenna connection terminal 1121 and the conductive plate of the second RF connection terminal 1172, the electronic device 101 is configured with a first structure 1110 and a second structure ( It may include a connection structure 1145c that provides an equivalent circuit such as a capacitor is inserted between the 1160. In addition, for example, by charging electric charges in the conductive plate of the second antenna connection terminal 1122 and the conductive plate of the third RF connection terminal 1173, the electronic device 101 has the first structure 1110 and the second A connection structure 1145d that provides an equivalent circuit such as a capacitor is inserted between the structures 1160 may be included.

Referring to the internal circuit diagram 1100b, the second structure 1160 may include a tuning circuit corresponding to each RF connection terminal. The first tuning circuit 1181, the second tuning circuit 1182, and the third tuning circuit 1183 are the first tuning circuit 881, the second tuning circuit 882, and the third tuning circuit ( 883), respectively. The design of the tuning circuit corresponding to each of the slide-down state and the slide-up state is the same as those of FIGS. 8A and 8B, and description thereof may be omitted.

The electronic device has described a connection structure coupled between the first structure and the second structure by forming a capacitance through conductive plates included in each antenna connection terminal or each RF terminal. The antenna connection terminals and RF connection terminals illustrated in FIG. 11 are only examples for coupling, and various embodiments of the present disclosure may not be limited to the configuration illustrated in FIG. 11. For example, the first structure may be connected to one antenna connection terminal and the second structure may be connected to three antenna connection terminals. For another example, the first structure may be connected to one antenna connection terminal and the second structure may be connected to two antenna connection terminals. Hereinafter, a method for maintaining the connection during slide movement according to each coupling-based connection structure will be described with reference to FIGS. 12A to 12C.

12A illustrates an example 1200a of a coupling structure for maintaining a connection between structures according to various embodiments. The RF circuit may include three RF terminals and a tuning circuit connected to each of the RF terminals.

Referring to FIG. 12A, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 1210. The first structure 1210 may include a first PCB 1220 and an antenna disposed on the first PCB 1220. Also, the electronic device may include a second structure 1260. The second structure 1260 may include a second PCB 1270 and an RF module disposed on the second PCB 1270. Also, the electronic device may include a first coupling structure connecting the first structure and the second structure.

The first coupling structure according to various embodiments may include a first antenna connection terminal 1211 and a second antenna connection terminal 1212 connected to the first structure 1210. Each antenna connection terminal may include a conductive plate. The first coupling structure according to various embodiments may include a first RF connection terminal 1221, a second RF connection terminal 1222, and a third RF connection terminal 1223 connected to the second structure 1260. I can. Each RF connection terminal may include a conductive plate.

The first structure 1210 according to various embodiments may move along one surface of the second structure 1260. For example, the position of the first structure 1210 may be changed from the first state 1201a to the third state 1203a through the second state 1202a as a slide-up operation. For another example, the position of the first structure 1210 may be changed from the third state 1203a to the first state 1201a through the second state 1202a through a slide-down operation.

The first state 1201a may be a slide-down state. In the first state 1201a, the conductive plate of the first antenna connection terminal 1211 may at least partially overlap the conductive plate of the first RF connection terminal 1221 when viewed from above when a plane perpendicular to the y-axis is viewed. For example, the conductive plate of the first antenna connection terminal 1211 may be disposed at a position symmetrical to the conductive plate of the first RF connection terminal 1221. The conductive plate of the second antenna connection terminal 1212 may be disposed at a position symmetrical to the conductive plate of the second RF connection terminal 1222. As the two conductive plates form a symmetrical plane, electric charges may be charged between the two conductive plates. The electronic device 101 may include a structure in which the first structure 1210 and the second structure 1260 are electrically connected through a capacitance formed between the first structure 1210 and the second structure 1260. have.

The second state 1202a may be a state that is moving from a slide-down state to a slide-up state. That is, the second state 1202a represents a situation in which the first structure 1210 is further moved to the right ((+) x-axis direction) in the first state 1201a. The first antenna connection terminal 1211 and the second antenna connection terminal 1212 may move to the right (in the direction of the (+) x axis) according to the movement of the first structure 1210.

Even if the conductive plate of the first antenna connection terminal 1211 is separated from the conductive plate of the first RF connection terminal 1221 by a predetermined distance or more, the conductive plate of the first antenna connection terminal 1211 is Electrical connection between the first structure 1210 and the second structure 1260 may be maintained as the conductive plate is approached within a certain distance. Similarly, even if the connection is disconnected as the conductive plate of the second antenna connection terminal 1212 is separated from the conductive plate of the second RF connection terminal 1222 by a predetermined distance or more, the conductive plate of the second antenna connection terminal 1212 is Electrical connection between the first structure 1210 and the second structure 1260 may be maintained as the RF connection terminal 1223 approaches the conductive plate within a predetermined distance.

According to various embodiments of the present disclosure, even if the first antenna connection terminal 1211 and the second antenna connection terminal 1212 perform a slide movement, the electronic device may include the first RF connection terminal 1221, the second RF connection terminal 1222, and And a first coupling structure configured to be connected to at least one of the third RF connection terminals 1223. Each connection terminal may include a conductive plate. The first coupling structure is the area of the conductive plate of each terminal, the distance between the antenna connection terminals, the history distance between the RF connection terminals, the distance between the conductive plate of the antenna connection terminal and the conductive plate of the RF connection terminal, or between the conductive plates. It may be determined based on at least one of the dielectrics located at.

On the other hand, since the two conductive plates operate as capacitors from the viewpoint of the RF circuit, the capacitance formed between the two conductive plates affects the antenna performance. According to various embodiments, the electronic device 101 may include a connection structure for maintaining capacitance within a certain error range in order to maintain the same circuit performance in a slide-up state and a slide-down state as well as in a slide-moving state. I can. For example, even though the overlapping area of the conductive plate of the first antenna connection terminal 1211 and the conductive plate of the first RF connection terminal 1221 on a plane perpendicular to the y-axis decreases, the conductivity of the second RF connection terminal 1222 As the area overlapping the plate and the surface increases, the capacitance may be maintained within a certain range.

The third state 1203a may be a slide-up state. That is, in the third state 1203a, in the second state 1202a, the first structure 1210 is further moved to the right ((+)x-axis direction). In the third state 1203a, the conductive plate of the first antenna connection terminal 1211 may at least partially overlap the conductive plate of the second RF connection terminal 1222 when viewed from above on a plane perpendicular to the y-axis. For example, the conductive plate of the first antenna connection terminal 1211 may be disposed at a position symmetrical to the conductive plate of the second RF connection terminal 1222. The conductive plate of the second antenna connection terminal 1212 may be disposed at a position symmetrical to the conductive plate of the third RF connection terminal 1223. As the two conductive plates form a symmetrical plane, electric charges may be charged between the two conductive plates. The electronic device may include a structure in which the first structure 1210 and the second structure 1260 are electrically connected through a capacitance formed between the first structure 1210 and the second structure 1260.

12B illustrates another example 1200b of a coupling structure for maintaining a connection between structures according to various embodiments. The RF circuit may include three RF terminals and a tuning circuit connected to each of the RF terminals.

Referring to FIG. 12B, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 1210. The first structure 1210 may include a first PCB 1220 and an antenna disposed on the first PCB 1220. Also, the electronic device 101 may include a second structure 1260. The second structure 1260 may include a second PCB 1270 and an RF module disposed on the second PCB 1270. Further, the electronic device 101 may also include a second coupling structure connecting the first structure and the second structure.

The second coupling structure according to various embodiments may include a first antenna connection terminal 1241 connected to the first structure 1210. Unlike the first coupling structure of FIG. 12A, the first structure 1210 may include one antenna connection terminal. The first antenna connection terminal 1241 may include a conductive plate. The conductive plate of the first antenna connection terminal 1241 may have a larger area than the conductive plate of each antenna connection terminal of FIG. 12A. A larger area conductive plate can provide a larger capacitance value. In various embodiments, the second coupling structure may include a first RF connection terminal 1251, a second RF connection terminal 1252, and a third RF connection terminal 1253 connected to the second structure 1260. have. Each RF connection terminal may include a conductive plate.

The first structure 1210 according to various embodiments may move along one surface of the second structure 1260. For example, the position of the first structure 1210 may be changed from the first state 1201b to the third state 1203b through the second state 1202b as a slide-up operation. For another example, the position of the first structure 1210 may be changed from the third state 1203b to the first state 1200b through the second state 1202b through a slide-down operation.

The first state 1201b may be a slide-down state. In the first state 1201b, the conductive plate of the first antenna connection terminal 1241 is a first RF connection terminal 1251, a second RF connection terminal 1252, and a surface perpendicular to the y-axis viewed from above. It may partially overlap at least one of the third RF connection terminals 1253. For example, the conductive plate of the first antenna connection terminal 1241 may be disposed at a position symmetrical to the conductive plate of the first RF connection terminal 1251 and the conductive plate of the second RF connection terminal 1252. As the conductive plate of the first antenna connection terminal 1241 forms a symmetrical plane with the two conductive plates, an equivalent circuit including two capacitors may be formed. The electronic device includes a structure in which the first structure 1210 and the second structure 1260 are electrically connected through an equivalent circuit including a capacitor formed between the first structure 1210 and the second structure 1260 can do.

The second state 1202b may be a state that is moving from a slide-down state to a slide-up state. That is, the second state 1202b represents a situation in which the first structure 1210 is further moved to the right ((+)x-axis direction) in the first state 1201b. The first antenna connection terminal 1241 may move to the right (in the direction of the (+) x axis) according to the movement of the first structure 1210.

Even if the conductive plate of the first antenna connection terminal 1241 is separated from the conductive plate of the first RF connection terminal 1251 by a predetermined distance or more, the conductive plate of the first antenna connection terminal 1241 is By keeping the conductive plate within a certain distance, electrical connection between the first structure 1210 and the second structure 1260 may be maintained. When viewed from above on a plane perpendicular to the y-axis, the conductive plate of the second RF connection terminal 1252 may completely overlap the conductive plate of the first antenna connection terminal 1241. The electronic device according to various embodiments may include a coupling structure in which overlapping of conductive plates is maintained according to a slide movement. That is, even if the first structure 1210 moves, the electrical connection between the first structure 1210 and the second structure 1260 may be maintained.

According to various embodiments of the present disclosure, even if the first antenna connection terminal 1241 performs a slide movement, the first RF connection terminal 1251, the second RF connection terminal 1252, and the third RF connection terminal 1253 It may include a second coupling structure configured to be connected to at least one of. Each connection terminal may include a conductive plate. The second coupling structure includes the area of the conductive plate of the antenna connection terminal, the area of the conductive plate of each RF connection terminal, the distance between the conductive plate of the antenna connection terminal and the conductive plate of the RF connection terminal, the hysteresis distance between the RF connection terminals, or It may be determined based on at least one of the dielectrics positioned between the conductive plates.

The third state 1203b may be a slide-up state. That is, in the third state 1203b, in the second state 1202b, the first structure 1210 is further moved to the right ((+)x-axis direction). In the third state 1203b, the conductive plate of the first antenna connection terminal 1241 is the conductive plate of the second RF connection terminal 1252 and the third RF connection terminal 1253 when viewed from above on a plane perpendicular to the y-axis. ) May be at least partially overlapped with the conductive plate. For example, the conductive plate of the first antenna connection terminal 1241 may be disposed at a position symmetrical to the conductive plate of the second RF connection terminal 1252 and the conductive plate of the third RF connection terminal 1253. An equivalent circuit comprising two capacitors can be formed. The electronic device may include a structure in which the first structure 1210 and the second structure 1260 are electrically connected through a capacitor formed between the first structure 1210 and the second structure 1260.

12C illustrates another example 1200c of a coupling structure for maintaining a connection between structures according to various embodiments. The RF circuit may include two RF terminals and a tuning circuit connected to each of the RF terminals.

Referring to FIG. 12C, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 1210. The first structure 1210 may include a first PCB 1220 and an antenna disposed on the first PCB 1220. Also, the electronic device may include a second structure 1260. The second structure 1260 may include a second PCB 1270 and an RF module disposed on the second PCB 1270. Further, the electronic device 101 may also include a third coupling structure connecting the first structure and the second structure.

The third coupling structure according to various embodiments may include a first antenna connection terminal 1271 connected to the first structure 1210. Unlike the first coupling structure of FIG. 12A, the first structure 1210 may include one antenna connection terminal. The first antenna connection terminal 1271 may include a conductive plate. The conductive plate of the first antenna connection terminal 1271 may have a larger area than the conductive plate of each antenna connection terminal of FIG. 12A. A larger area conductive plate can provide a larger capacitance value. In various embodiments, the third coupling structure may include a first RF connection terminal 1281 and a second RF connection terminal 1282 connected to the second structure 1260. Unlike the second coupling structure of FIG. 12B, the second structure 1260 may include two RF connection terminals. Each RF connection terminal may include a conductive plate.

The first structure 1210 according to various embodiments may move along one surface of the second structure 1260. For example, the position of the first structure 1210 may be changed from the first state 1201c to the third state 1203c through the second state 1202c as a slide-up operation. For another example, the position of the first structure 1210 may be changed from the third state 1203c to the first state 1201c through the second state 1202c through a slide-down operation.

The first state 1201c may be a slide-down state. In the first state 1201c, the conductive plate of the first antenna connection terminal 1271 may at least partially overlap the first RF connection terminal 1251 when viewed from above when a plane perpendicular to the y-axis is viewed. For example, the conductive plate of the first antenna connection terminal 1271 may be disposed at a position symmetrical to the conductive plate of the conductive plate of the first RF connection terminal 1281. As the conductive plate of the first antenna connection terminal 1271 forms a symmetrical plane with the conductive plate of the first RF connection terminal 1281, an equivalent circuit including a capacitor may be formed. The electronic device includes a structure in which the first structure 1210 and the second structure 1260 are electrically connected through an equivalent circuit including a capacitor formed between the first structure 1210 and the second structure 1260 can do.

The second state 1202c may be a state that is moving from a slide-down state to a slide-up state. That is, the second state 1202b represents a situation in which the first structure 1210 is further moved to the right ((+)x-axis direction) in the first state 1201b. The first antenna connection terminal 1271 may move to the right (in the direction of the (+) x axis) according to the movement of the first structure 1210. Even if the conductive plate of the first antenna connection terminal 1271 is spaced apart from the conductive plate of the first RF connection terminal 1281 by a certain distance or more, a certain range according to proximity to the conductive plate of the second RF connection terminal 1282 An equivalent circuit including a capacitor in the can be formed. An equivalent circuit including one capacitor and up to two capacitors may be formed. Electrical connection between the first structure 1210 and the second structure 1260 may be maintained through a connection structure including an equivalent circuit.

The third state 1203c may be a slide-up state. That is, in the third state 1203c, in the second state 1202c, the first structure 1210 is further moved to the right ((+)x-axis direction). In the third state 1203c, the conductive plate of the first antenna connection terminal 1271 may at least partially overlap the conductive plate of the second RF connection terminal 1282 when viewed from above on a plane perpendicular to the y-axis. For example, the conductive plate of the first antenna connection terminal 1271 may be disposed at a position symmetrical to the conductive plate of the second RF connection terminal 1282. As the two conductive plates are symmetric, the connection part of the electronic device may include a circuit including a capacitor. The electronic device may include a structure in which the first structure 1210 and the second structure 1260 are electrically connected through a capacitor formed between the first structure 1210 and the second structure 1260.

13 illustrates an example 1300 of connection between structures using dielectrics according to various embodiments. Since the coupling structure for connection between the structures is similar to the coupling structure of FIG. 7, a description of the same or similar configuration may be omitted.

Referring to FIG. 13, as shown in the first cross-sectional view 1300a, the electronic device (eg, the electronic device 101 of FIG. 1) may include a first structure 1310 and a second structure 1360. have. A situation where the first structure 1310 is a moving part of the slide electronic device and the second structure 1360 is a fixed part of the slide electronic device is described as an example. The first structure 1310 may include a first PCB 1320. The first structure 1310 may be connected to the first antenna connection terminal 1321 and the second antenna connection terminal 1322 through an antenna connection circuit disposed on the first PCB 1320. The first antenna connection terminal 1321 and the second antenna connection terminal 1322 may be disposed on the first structure 1310 through an antenna connection circuit. The second structure 1360 may include a second PCB 1370. The second structure 1360 is connected to the first RF connection terminal 1371, the second RF connection terminal 1372, and the third RF connection terminal 1373 through an RF connection circuit disposed on the second PCB 1370. Can be connected. The electronic device according to various embodiments may include a dielectric 1350 disposed between each antenna connection terminal and each RF connection terminal. Electrical connection between the first structure 1310 and the second structure 1360 may be maintained through the dielectric 1350.

The electronic device 101 may include a connection structure for connecting the first structure 1310 and the second structure 1360. The connection structure may include each antenna connection terminal, each RF connection terminal, and a dielectric 1350. Referring to the second cross-sectional view 1300b, the dielectric 1350 may be connected to both each antenna connection terminal and each RF connection terminal. A dielectric material is an insulator having a polarity in an electric field, and may include an insulating material. The higher the dielectric constant of the dielectric, the shorter the length of the line may be, and this may enable a small circuit. According to various embodiments, the electronic device 101 includes a coupling structure having a reduced size by disposing a dielectric having a dielectric constant higher than the permittivity of air between the first structure 1310 and the second structure 1360. can do.

Referring to the internal circuit diagram 1300c, the first RF connection terminal 1371, the second RF connection terminal 1372, and the third RF connection terminal 1373 may contact the dielectric 1350. The dielectric 1350 may contact the first antenna connection terminal 1321 and the second antenna connection terminal 1322. The first antenna connection terminal 1321 and the second antenna connection terminal 1322 may be connected to the antenna 1311. The second structure 1360 may include a tuning circuit corresponding to each RF terminal. The first RF connection terminal 1371 may be connected to the ground through a first tuning circuit. The second RF connection terminal 1372 may be connected to the RFIC 1375 through a second tuning circuit. The third RF connection terminal 1373 may be connected to the ground through a third tuning circuit. According to an embodiment, in a slide-down state, the first tuning circuit and the second tuning circuit may be circuits for impedance matching of an antenna. According to an embodiment, in the slide-up state, the second tuning circuit and the third tuning circuit may be circuits for impedance matching of an antenna.

14A illustrates an example 1400 of connection between structures using a guide-type dielectric in various embodiments. The structures may include a first structure including an antenna and a second structure including an RF module.

Referring to FIG. 14A, an electronic device (eg, the electronic device 101 of FIG. 1) may include a first PCB 1420 of a first structure and a second PCB 1470 of a second structure. The electronic device may include a coupling structure for connection between the first structure and the second structure. The coupling structure according to various embodiments includes a first antenna connection terminal 1421 disposed on the first PCB 1420, a first RF connection terminal 1471 disposed on the second PCB 1470, and a second RF connection. A terminal 1472 and/or a dielectric 1450 may be included. The coupling structure is from top to bottom on the z-axis in the order of the first PCB 1420, the first antenna connection terminal 1421, the dielectric 1450, the first RF connection terminal 1471, and the second PCB 1470. It may be a laminated structure forming a layer.

The dielectric material 1450 according to various embodiments may have a guide shape. Here, the guide shape means a shape for guiding a direction in which the first structure, which is a moving part of the slide electronic device 101, moves. For example, like the first cross-sectional view 1400a and the second cross-sectional view 1400b, the first PCB 1420 may move left and right. The first PCB 1420 is included in the first structure and may move together. The dielectric 1450 may be in the form of guiding the first PCB 1420 to move left and right. The dielectric 1450 according to various embodiments may be disposed to surround a surface of the first antenna connection terminal 1421 to guide the first structure (ie, the first PCB 1420 ).

14B shows an example 1401 of a cross-section of a connection structure between structures using a guide-type dielectric in various embodiments. 14B is a cross-sectional view of the stacked structure of FIG. 14A viewed from above on a plane perpendicular to the moving direction of the first PCB 1420.

Referring to FIG. 14B, the dielectric 1450 may be disposed between the first PCB 1420 and the second PCB 1470 so as to surround the surfaces of the first antenna connection terminal 1421. As the first structure 1410 moves, the first antenna connection terminal 1421 attached to the first PCB 1420 of the first structure 1410 may also move. The dielectric 1450 may be disposed to guide the moving direction of the first antenna connection terminal 1421. Through the guide-type dielectric, it is possible to minimize the problem that the coupling space is not kept constant due to external pressure or the clearance between the slide moving part and the fixed part. By arranging the dielectric in a shape surrounding the surfaces of the first antenna connection terminal 1421 disposed on the first PCB 1420 of the first structure 1410, it is possible to reduce vibration in a direction perpendicular to the slide direction. . In other words, the electronic device 101 is an antenna tuning circuit connected to each RF connection terminal by minimizing variability in antenna characteristics due to a change in capacitance through a slide moving part, that is, a guide according to the moving direction of the first structure 1410 Can reduce the performance degradation.

According to various embodiments, the first antenna connection terminal 1421 may include a conductive member. Each of the first RF connection terminal 1471 and the second RF connection terminal 1472 may include a conductive member. For example, the conductive member may be stainless use steel (SUS).

A connection structure of an electronic device (eg, the electronic device 101 of FIG. 1) according to various embodiments may include a coupling structure 1490 in which a guide-type dielectric 1450 and the SUS 1471 are coupled. The coupling structure 1490 may be disposed on the second PCB 1470 of the second structure 1460. For example, the coupling structure 1490 may be mounted on the surface of the second PCB 1470. A device mounted on the surface may be referred to as a surface-mount device (SMD). The SUS 1421 may also be mounted on the surface of the first PCB 1420 of the first structure 1410. By implementing a coupling connection structure through the capacitor structure of the SUS 1421-the dielectric 1450-the SUS 1471, the coupling structure 1490 can be supplemented with the left and right shaking when the slide moves up and down. By minimizing movement due to the slide movement, the electronic device can transmit a more robust signal.

The electronic device 101 according to various embodiments may reduce a space of a connection structure including a conductive plate by increasing capacitance through a connection structure including a dielectric material. For example, as the dielectric constant of the dielectric increases, the area of the conductive plate for providing the same capacitance value decreases, and a connection structure including a high dielectric constant may be advantageous in securing a large mounting space.

According to various embodiments, an electronic device (eg, the electronic device 101 of FIG. 1) includes an antenna (eg, the antenna module 192 of FIG. 1), and a first PCB (print circuit board). ) (For example, a first body including the first PCB 520 in FIG. 5) (for example, the first structure 510 in FIG. 5), the antenna is disposed on the first PCB, and the RF ( radio frequency) module (eg, the RF module 675 of FIG. 6) and a second PCB (eg, the second PCB 570 of FIG. 5). Structure 560), the RF module is disposed on the second PCB, and the first structure is in a second state (eg, the first state 500a of FIG. 5) A frame (slide frame) to move to the state 2 500b); And a connection structure electrically connecting the first structure and the second structure. The connection structure may include at least one antenna connection terminal disposed on the first PCB; And at least two or more RF connection terminals disposed on the second PCB, wherein the at least two or more RF connection terminals include a first RF connection terminal (eg, the first RF connection terminal 671 of FIG. 6, FIG. 8A, The first RF connection terminal 871 of 8b, the first RF connection terminal 971 of FIGS. 9A and 9B) and the second RF connection terminal (eg, the third RF connection terminal 673 of FIG. 6, FIGS. 8A and 8B) A third RF connection terminal 873 and a second RF connection terminal 972 of FIGS. 9A and 9B), wherein the first structure includes the first RF connection terminal through the connection structure in the first state And, in the second state, electrically connected to the second RF connection terminal through the connection structure, and the second PCB is a first RF tuning circuit for the first RF connection terminal (Example: the first tuning circuit 681 of FIG. 6, the first tuning circuit 881 of FIG. 8) and a second RF tuning circuit for the second RF connection terminal (eg, the third tuning circuit of FIG. 6 ( 683) and the third tuning circuit 883 of FIG. 8 ).

According to various embodiments, the at least one antenna connection terminal may be a first antenna connection terminal (for example, the first antenna connection terminal 621 of FIG. 6 and the first antenna connection terminal 821 of FIGS. 8A and 8B) And a second antenna connection terminal (for example, the second antenna connection terminal 622 of FIG. 6 and the second antenna connection terminal 822 of FIGS. 8A and 8B), wherein the connection structure comprises: the first antenna connection terminal A first conductive member (for example, the first contact member 845a of FIG. 8A) and a second conductive member (for example, the second contact member 845b of FIG. 8A) contacting the second antenna connection terminal Can include.

According to various embodiments, in the electronic device, the at least two or more RF connection terminals include a third RF connection terminal (eg, the second RF connection terminal 672 of FIG. 6 and the second RF connection terminal of FIGS. 8A and 8B). 872)), wherein the first conductive member is disposed to be connectable to the first RF connection terminal or the third RF connection terminal, and the second conductive member includes the second RF connection terminal or the It may be arranged to be connectable to the third RF connection terminal.

According to various embodiments, the first conductive member is disposed to be separated from the first RF connection terminal and connected to the third RF connection terminal when the first structure moves from the first state to the second state. The second conductive member may be disposed to be separated from the third RF connection terminal and connected to the second RF connection terminal when the first structure moves from the first state to the second state.

According to various embodiments, in the connection structure, a first section between a time when the first conductive member is disconnected from the first RF connection terminal and a time when the third RF connection terminal is connected to the third RF connection terminal is the second conductive member. The first antenna connection terminal, the second antenna connection terminal, and the first RF connection terminal so as not to overlap with a second section between a point of separation from the third RF connection terminal and a point of connection to the second RF connection terminal , A structure in which the second RF connection terminal and the third RF connection terminal are disposed.

According to various embodiments, the at least one antenna connection terminal includes a first antenna connection terminal (eg, the first antenna connection terminal 921 of FIGS. 9A and 9B), and the connection structure includes the first antenna A first conductive member (eg, the first contact member 945a of FIG. 9A) and a second conductive member (eg, the second contact member 945b of FIG. 9A) contacting the connection terminal may be included.

According to various embodiments, the first conductive member is disposed to be separated from the first RF connection terminal and connected to the second RF connection terminal when the first structure moves from the first state to the second state. The second conductive member may be disposed to be separated from the second RF connection terminal and connected to the third RF connection terminal when the first structure moves from the first state to the second state.

According to various embodiments, in the connection structure, a first section between a time when the first conductive member is disconnected from the first RF connection terminal and a time when the second RF connection terminal is connected to the second RF connection terminal is the second conductive member. The first antenna connection terminal, the first RF connection terminal, and the second RF connection so as not to overlap with a second section between a point of separation from the first RF connection terminal and a point of connection to the second RF connection terminal It may include a structure in which terminals are arranged.

According to various embodiments, the connection structure may include a conductive member having a rolling structure in contact with at least one of the at least one antenna connection terminal and the at least two or more RF connection terminals.

According to various embodiments, the connection structure further includes a dielectric (eg, dielectric 1450 of FIG. 14) disposed between the first PCB and the second PCB, wherein the first structure is a first It may be arranged to guide a path moving from the state to the second state.

According to various embodiments, the dielectric may be disposed to surround at least two or more surfaces of a conductive member surface-mounted on the first PCB, and the dielectric may be in contact with a conductive member surface-mounted on the second PCB.

According to various embodiments, the connection structure may include: first SUS (stainless use steel) surface-mounted on the first PCB, the dielectric; And a connection structure including a second SUS surface-mounted on the second PCB.

According to various embodiments, the dielectric material may include a dielectric material having a higher dielectric constant than air.

According to various embodiments, each of the at least one antenna connection terminal may include a first conductive plate, and each of the at least two or more RF connection terminals may include a second conductive plate.

According to various embodiments, the first RF connection terminal includes a first conductive plate, the second RF connection terminal includes a second conductive plate, and the at least one antenna connection terminal includes at least one conductive plate. And the at least one conductive plate may be disposed to charge electric charges with at least one of the first conductive plate or the second conductive plate.

According to various embodiments, the at least two or more RF connection terminals further include a third RF connection terminal, the third RF connection terminal includes a third conductive plate, and the at least one conductive plate is the first conductive plate. A plate, the second conductive plate, and the third conductive plate may be disposed to charge electric charges with at least one of the plates.

According to various embodiments, the first RF tuning circuit includes at least one of a first capacitor, a first resistor, or a first inductor, and the second RF tuning circuit includes a second capacitor, a second resistor, or a second At least one of an inductor is included, and at least one of the first capacitor, the first resistor, or the first inductor has a value at which a standing wave ratio related to the first antenna in the first state is maximum, and the At least one of the second capacitor, the second resistor, and the second inductor may have a value at which a standing wave ratio related to the second antenna in the second state becomes maximum.

According to various embodiments, the first RF tuning circuit and the second RF tuning circuit may be connected to the RF module through the second PCB.

According to various embodiments, the at least two or more RF connection terminals further include a third RF connection terminal, and the second PCB includes a third RF tuning circuit for the third RF connection terminal, and the first The RF tuning circuit and the second RF tuning circuit may be connected to a ground, and the third RF tuning circuit may be connected to the RF module.

According to various embodiments, the first structure corresponds to a moving part of the slide electronic device, the second structure corresponds to a fixing part of the slide electronic device, and the first state is a slide down state. , The second state may be a slide-up state.

As described above, the electronic device according to various embodiments of the present disclosure may include a first structure, a second structure, and a connection structure connecting the first structure and the second structure. The connection structure may include a contact structure for connecting the first structure and the second structure through physical contact, or a coupling structure using a conductive plate to form an equivalent circuit including a capacitor.

Since the connection structure does not include a coaxial cable and an FPCB, but includes a contact structure or a coupling structure occupying a relatively small area, a mounting space in the electronic device may be more secured. Through this, it is possible to take advantage of a mounting space in a miniaturized mobile electronic device. In addition, by performing individual antenna tuning in each slide state and maintaining the connection during slide movement, the electronic device according to various embodiments of the present disclosure guarantees optimal antenna performance and provides real-time service (eg, call). It can be provided in a stable state.

In the present disclosure, the expressions above or below are used to determine whether a specific condition is satisfied, but this is a description for expressing an example and does not exclude descriptions of more than or less than (or within). . Conditions described as'greater than' may be replaced with'greater than', conditions described as'less than' may be replaced with'less than', and conditions described as'more and less' may be replaced with'greater than and less'

The methods according to the embodiments described in the claims or the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. One or more programs stored in a computer-readable storage medium are configured to be executable by one or more processors in an electronic device (device). The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure.

These programs (software modules, software) include random access memory, non-volatile memory including flash memory, read only memory (ROM), and electrically erasable programmable ROM. (EEPROM: electrically erasable programmable read only memory), magnetic disc storage device, compact disc-ROM (CD-ROM), digital versatile discs (DVDs) or other forms of It may be stored in an optical storage device or a magnetic cassette. Alternatively, it may be stored in a memory composed of a combination of some or all of them. In addition, a plurality of configuration memories may be included.

In addition, the program is through a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination of It may be stored in an attachable storage device that can be accessed. Such a storage device may access a device performing an embodiment of the present disclosure through an external port. In addition, a separate storage device on the communication network may access a device performing an embodiment of the present disclosure.

In the above-described specific embodiments of the present disclosure, components included in the disclosure are expressed in the singular or plural according to the presented specific embodiments. However, the singular or plural expression is selected appropriately for the situation presented for convenience of description, and the present disclosure is not limited to the singular or plural constituent elements, and even constituent elements expressed in plural are composed of the singular or in the singular. Even the expressed constituent elements may be composed of pluralities.

Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, various modifications are possible without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure is limited to the described embodiments and should not be determined, and should be determined by the scope of the claims as well as the equivalents of the claims to be described later.

Claims

In an electronic device,

A first body including an antenna and a first printed circuit board (PCB), the antenna being disposed on the first PCB;

A second body including a radio frequency (RF) module and a second PCB, the RF module being disposed on the second PCB;

A frame for moving the first structure from a first state to a second state; And

And a connection structure electrically connecting the first structure and the second structure,

The connection structure,

At least one antenna connection terminal disposed on the first PCB; And

Including at least two or more RF connection terminals disposed on the second PCB,

The at least two or more RF connection terminals include a first RF connection terminal and a second RF connection terminal,

The first structure is electrically connected to the first RF connection terminal through the connection structure in the first state, and is electrically connected to the second RF connection terminal through the connection structure in the second state,

The second PCB includes a first RF tuning circuit for the first RF connection terminal and a second RF tuning circuit for the second RF connection terminal.
The method according to claim 1,

The at least one antenna connection terminal includes a first antenna connection terminal and a second antenna connection terminal,

The connection structure includes a first conductive member in contact with the first antenna connection terminal and a second conductive member in contact with the second antenna connection terminal.
The method according to claim 2,

The at least two or more RF connection terminals further include a third RF connection terminal,

The first conductive member is disposed to be connectable to the first RF connection terminal or the third RF connection terminal,

The second conductive member is an electronic device disposed to be connectable to the second RF connection terminal or the third RF connection terminal.
The method of claim 3,

The first conductive member is disposed to be separated from the first RF connection terminal and connected to the third RF connection terminal when the first structure moves from the first state to the second state,

The second conductive member is disposed to be separated from the third RF connection terminal and connected to the second RF connection terminal when the first structure moves from the first state to the second state.
The method according to claim 1,

The at least one antenna connection terminal includes a first antenna connection terminal,

The connection structure includes a first conductive member and a second conductive member contacting the first antenna connection terminal.
The method of claim 5,

The first conductive member is disposed to be separated from the first RF connection terminal and connected to the second RF connection terminal when the first structure moves from the first state to the second state,

The second conductive member is disposed to be separated from the second RF connection terminal and connected to the third RF connection terminal when the first structure moves from the first state to the second state.
The method according to claim 1,

The connection structure includes a conductive member having a rolling structure in contact with at least one of the at least one antenna connection terminal and the at least two or more RF connection terminals.
The method according to claim 1,

The connection structure further includes a dielectric disposed between the first PCB and the second PCB,

The dielectric is disposed to guide a path through which the first structure moves from a first state to a second state.
The method of claim 8,

The connection structure,

First SUS (stainless use steel) surface-mounted on the first PCB,

The dielectric; And

Electronic device including a connection structure including a second SUS surface-mounted on the second PCB
The method according to claim 1,

Each of the at least one antenna connection terminal includes a first conductive plate,

Each of the at least two RF connection terminals includes a second conductive plate.
The method according to claim 1,

The first RF connection terminal includes a first conductive plate,

The second RF connection terminal includes a second conductive plate,

The at least one antenna connection terminal includes at least one conductive plate,

The at least one conductive plate is disposed to charge electric charges with at least one of the first conductive plate or the second conductive plate.
The method of claim 11,

The at least two or more RF connection terminals further include a third RF connection terminal,

The third RF connection terminal includes a third conductive plate,

The at least one conductive plate is disposed to charge electric charges with at least one of the first conductive plate, the second conductive plate, and the third conductive plate.
The method according to claim 1,

The first RF tuning circuit includes at least one of a first capacitor, a first resistor, or a first inductor,

The second RF tuning circuit includes at least one of a second capacitor, a second resistor, or a second inductor,

At least one of the first capacitor, the first resistor, or the first inductor has a value at which a standing wave ratio related to the first antenna in the first state becomes maximum,

At least one of the second capacitor, the second resistor, and the second inductor has a value at which a standing wave ratio related to the second antenna in the second state becomes maximum.
The electronic device of claim 13, wherein the first RF tuning circuit and the second RF tuning circuit are connected to the RF module through the second PCB.
The method of claim 13,

The at least two or more RF connection terminals further include a third RF connection terminal,

The second PCB includes a third RF tuning circuit for the third RF connection terminal,

The first RF tuning circuit and the second RF tuning circuit are connected to ground,

The third RF tuning circuit is an electronic device connected to the RF module.