WO2020246239A1 - Wavelength-conversion member and light-emitting device - Google Patents

Wavelength-conversion member and light-emitting device Download PDF

Info

Publication number
WO2020246239A1
WO2020246239A1 PCT/JP2020/019904 JP2020019904W WO2020246239A1 WO 2020246239 A1 WO2020246239 A1 WO 2020246239A1 JP 2020019904 W JP2020019904 W JP 2020019904W WO 2020246239 A1 WO2020246239 A1 WO 2020246239A1
Authority
WO
WIPO (PCT)
Prior art keywords
conversion member
wavelength conversion
light
emitting device
wavelength
Prior art date
Application number
PCT/JP2020/019904
Other languages
French (fr)
Japanese (ja)
Inventor
嶺一 高田
浅野　秀樹
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Publication of WO2020246239A1 publication Critical patent/WO2020246239A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the present invention relates to a wavelength conversion member that converts excitation light into light of another wavelength, and a light emitting device using the same.
  • next-generation light sources In recent years, attention has been increasing to light emitting devices using LEDs (Light Emitting Diodes) and LDs (Laser Diodes) as next-generation light sources to replace fluorescent lamps and incandescent lamps.
  • LEDs Light Emitting Diodes
  • LDs Laser Diodes
  • a light emitting device that combines an LED that emits blue light and a wavelength conversion member that absorbs a part of the light from the LED and converts it into yellow light has been proposed.
  • This light emitting device emits white light which is a composite light of blue light emitted from an LED and transmitted through a wavelength conversion member and yellow light emitted from a wavelength conversion member.
  • the wavelength conversion member a member in which an inorganic phosphor is dispersed in a resin matrix has been used.
  • the resin is deteriorated by the light from the LED and the brightness of the light source tends to be lowered.
  • the resin matrix is deteriorated by the heat generated by the LED or high-energy short-wavelength (blue to ultraviolet) light, causing discoloration or deformation. Therefore, a wavelength conversion member made of a completely inorganic solid in which an inorganic phosphor is dispersed and fixed in a glass matrix instead of a resin has been proposed (see, for example, Patent Document 1).
  • the wavelength conversion member has a feature that the glass as a base material is less likely to be deteriorated by the heat of the LED chip or the irradiation light, and problems such as discoloration and deformation are less likely to occur.
  • Patent Document 2 as a method for mass-producing the wavelength conversion member as described above, after producing a base material of a large-area plate-shaped wavelength conversion member in which an inorganic phosphor is dispersed and fixed in a glass matrix, the wavelength conversion is performed.
  • a method of individualizing the base material of the member has been proposed. Specifically, a method has been proposed in which a dividing groove (scribe line) is formed on the surface of the base material of the wavelength conversion member in a predetermined pattern, and the base material of the wavelength conversion member is cut along the dividing groove. ..
  • FIG. 4 is a schematic cross-sectional view showing a light emitting device using a conventional wavelength conversion member.
  • the wavelength conversion member 31 is placed on the light source 32 installed at the bottom of the housing 33, and is used as the light emitting device 30 by surrounding the side surface of the wavelength conversion member 31 (and the light source 32) with the reflective resin 34. ..
  • the reflective resin 34 has a role of reflecting the light leaking from the side surface of the wavelength conversion member 31 and increasing the light extraction efficiency from the light emitting surface (upper surface) of the wavelength conversion member 31.
  • FIG. 4 is a schematic cross-sectional view showing a light emitting device using a conventional wavelength conversion member.
  • the wavelength conversion member 31 is placed on the light source 32 installed at the bottom of the housing 33, and is used as the light emitting device 30 by surrounding the side surface of the wavelength conversion member 31 (and the light source 32) with the reflective resin 34. ..
  • the reflective resin 34 has a role of reflecting the light leaking from the side surface of the wavelength conversion member 31 and increasing the
  • the side surface portion (for example, the upper part of the side surface) of the wavelength conversion member 31 may be exposed by sliding down. As a result, there is a problem that light leaks from the exposed side surface portion and the light extraction efficiency from the light emitting surface of the wavelength conversion member 31 is lowered.
  • the present invention suppresses the reflective resin surrounding the side surface portion from sliding downward when it is cured and contracted when used as a component of a light emitting device, and improves the efficiency of light extraction from the light emitting surface. It is an object of the present invention to provide a wavelength conversion member which can be enhanced.
  • the wavelength conversion member of the present invention is a wavelength conversion member having a first main surface and a second main surface facing each other, and a side surface connecting the first main surface and the second main surface.
  • the surface roughness Sa of the side surface is 0.1 to 0.8 ⁇ m.
  • the anchoring effect at the contact portion with the reflective resin is increased, so that the reflective resin slides downward when it is cured or contracted. It is possible to prevent the side surface portion of the wavelength conversion member from being exposed. As a result, it is possible to improve the light extraction efficiency from the light emitting surface of the wavelength conversion member.
  • the wavelength conversion member of the present invention preferably has an inorganic matrix and a phosphor powder dispersed in the inorganic matrix.
  • the average particle size of the phosphor powder is preferably 1 to 50 ⁇ m.
  • the average particle size indicates a value (D 50 ) measured by a laser diffraction method.
  • the wavelength conversion member of the present invention preferably has a thickness of 0.01 to 1 mm.
  • the light emitting device of the present invention is characterized by including the above-mentioned wavelength conversion member, a light source that irradiates the wavelength conversion member with excitation light, and a reflective resin that surrounds the wavelength conversion member.
  • the wavelength conversion member of the present invention it is possible to suppress a problem that the reflective resin surrounding the side surface of the wavelength conversion member slides downward when cured or contracted to expose the side surface portion of the wavelength conversion member. As a result, it is possible to improve the light extraction efficiency from the light emitting surface of the wavelength conversion member.
  • FIG. 1 It is a perspective view which shows one Embodiment of the wavelength conversion member of this invention. It is a schematic cross-sectional view which shows one Embodiment of the light emitting device using the wavelength conversion member of this invention. It is a top view for demonstrating the manufacturing method of the wavelength conversion member of this invention.
  • (A) is a schematic cross-sectional view showing a light emitting device manufactured by using a conventional wavelength conversion member, and (b) is a downward slide when the reflective resin in the light emitting device of (a) is cured and contracted. It is a schematic cross-sectional view which shows the state.
  • FIG. 1 is a perspective view showing an embodiment of the wavelength conversion member of the present invention.
  • the wavelength conversion member 1 has a plate shape having a rectangular (square or rectangular) plane shape.
  • the planar shape of the wavelength conversion member 1 is not limited to a rectangle, and may be another shape such as a polygon or a circle other than the rectangle.
  • the wavelength conversion member 1 has a first main surface 1a and a second main surface 1b facing each other, and a side surface 1c connecting the first main surface 1a and the second main surface 1b.
  • FIG. 2 is a schematic cross-sectional view showing a light emitting device 10 using the wavelength conversion member 1.
  • the wavelength conversion member 1 is placed on a light source 2 installed at the bottom of the housing 3, and is used as a light emitting device 10 by surrounding the side surface of the wavelength conversion member 1 (and the light source 2) with a reflective resin 4. ..
  • the wavelength conversion member 1 may be placed directly on the light source 2 or may be adhered via an adhesive layer (not shown).
  • the wavelength conversion member 1 has, for example, an inorganic matrix and a phosphor powder dispersed in the inorganic matrix.
  • the phosphor particles emit fluorescence when the excitation light is incident. Therefore, when the excitation light is incident from the second main surface 1b of the wavelength conversion member 1, the combined light of the excitation light and fluorescence is emitted from the first main surface 1a of the wavelength conversion member 1.
  • the phosphor particles are not particularly limited as long as they emit fluorescence when the excitation light is incident.
  • Specific examples of the phosphor particles include oxide phosphors, nitride phosphors, oxynitride phosphors, chloride phosphors, acidified phosphors, sulfide phosphors, acid sulfide phosphors, and halogens. Examples thereof include one or more selected from a compound fluorescent substance, a chalcogen compound fluorescent substance, an aluminate fluorescent substance, a halophosphate compound fluorescent substance, and a garnet-based compound fluorescent substance.
  • a phosphor that emits green light, yellow light, or red light as fluorescence can be used.
  • the average particle size of the phosphor particles is preferably 1 to 50 ⁇ m, more preferably 5 to 30 ⁇ m. If the average particle size of the phosphor particles is too small, the emission intensity may decrease. On the other hand, if the average particle size of the phosphor particles is too large, the emission color may become non-uniform.
  • the content of the phosphor particles in the wavelength conversion member 1 is preferably 1% by volume or more, more preferably 1.5% by volume or more, and further preferably 2% by volume or more.
  • the content of the phosphor particles in the wavelength conversion member 1 is preferably 70% by volume or less, more preferably 50% by volume or less, and further preferably 30% by volume or less. If the content of the phosphor particles is too small, the wavelength conversion member 1 needs to be thickened in order to obtain a desired emission color, and as a result, the internal scattering of the obtained wavelength conversion member 1 increases, so that light is extracted. Efficiency may be reduced. On the other hand, if the content of the phosphor particles is too large, the wavelength conversion member 1 needs to be thinned in order to obtain a desired emission color, so that the mechanical strength of the wavelength conversion member 1 may decrease.
  • the inorganic material used in the inorganic matrix is not particularly limited as long as it can be used as a dispersion medium for phosphor particles, and for example, glass can be used.
  • glass for example, borosilicate glass, phosphate glass, tin phosphate glass, bismuthrate glass and the like can be used.
  • the borosilicate-based glass in mass%, SiO 2 30 ⁇ 85% , Al 2 O 3 0 ⁇ 30%, B 2 O 3 0 ⁇ 50%, Li 2 O + Na 2 O + K 2 O 0 ⁇ 10%, and Examples thereof include those containing 0 to 50% of MgO + CaO + SrO + BaO.
  • the Suzurin salt-based glass, in mol%, SnO 30 ⁇ 90%, include those containing P 2 O 5 1 ⁇ 70% .
  • the thickness of the wavelength conversion member 1 is preferably 0.01 to 1 mm, more preferably 0.05 to 0.5 mm, and even more preferably 0.1 to 0.3 mm. If the thickness of the wavelength conversion member 1 is too small, it may be difficult to obtain sufficient emission intensity. In addition, the mechanical strength of the wavelength conversion member 1 may be insufficient. On the other hand, if the thickness of the wavelength conversion member 1 is too large, the scattering or absorption of light in the wavelength conversion member 1 becomes too large, and the light extraction efficiency may be lowered.
  • the surface roughness Sa of the side surface 1c of the wavelength conversion member 1 is 0.1 to 0.8 ⁇ m, preferably 0.1 to 0.5 ⁇ m, and particularly preferably 0.2 to 0.4 ⁇ m. If the surface roughness Sa is too small, the anchoring effect at the contact portion with the reflective resin 34 becomes small, so that when the reflective resin 34 is cured and contracted, it slides downward and the side surface 1c of the wavelength conversion member 1 is easily exposed. Become. As a result, light leaks from the exposed side surface 1c, and the light extraction efficiency from the first main surface 1a of the wavelength conversion member 1 tends to decrease. On the other hand, if the surface roughness Sa is too large, chipping is likely to occur in the peripheral portion of the main surface 1a of the wavelength conversion member 1 during manufacturing. As a result, the reflective resin 34 flows to the chipping portion, the area of the main surface 1a (light emitting area) becomes small, and the light extraction efficiency tends to decrease.
  • the wavelength conversion member 1 may be a wavelength conversion member made of ceramics such as YAG ceramics, in addition to those exemplified above.
  • the light source 2 an LED or LD can be used.
  • the light source 2 is connected to an external power source by electrodes (not shown).
  • a white LTCC Low Temperature Co-fired Ceramics
  • the housing 3 for example, a white LTCC (Low Temperature Co-fired Ceramics) or the like that can efficiently reflect the light rays emitted from the light source 2 is used.
  • a sintered body of glass powder and an inorganic powder such as aluminum oxide, titanium oxide or niobium oxide.
  • a material having high thermal conductivity may be used in order to efficiently release the heat generated from the light source 2.
  • ceramics or the like because it is excellent in heat resistance and weather resistance.
  • Specific examples thereof include a housing made of ceramics such as aluminum oxide and aluminum nitride.
  • the reflective resin 4 is provided to reflect the light leaked from the side surface 1c of the wavelength conversion member 1 or the side surface of the light source 2.
  • the reflective resin 4 is made of a resin composition (highly reflective resin) containing a white pigment such as titanium oxide.
  • a resin composition highly reflective resin
  • the resin include silicone-based resin, epoxy-based resin, acrylic-based resin, urethane-based resin, and the like.
  • the curing means include photocuring, thermosetting, room temperature curing (curing by reacting with moisture, or two-component mixed reaction curing).
  • FIG. 3 is a plan view for explaining a method for manufacturing the wavelength conversion member of the present invention.
  • the base material 20 of the wavelength conversion member is prepared.
  • the base material 20 of the wavelength conversion member is a plate-shaped member having main surfaces facing each other, and a plurality of wavelength conversion members 1 can be obtained by cutting in a desired pattern.
  • the base material 20 of the wavelength conversion member can be produced, for example, as follows.
  • An organic vehicle is added to a mixed powder of a glass powder to be a glass matrix and a phosphor powder to prepare a paste.
  • a green sheet is obtained by applying the paste on a base film such as PET (polyethylene terephthalate) by the doctor blade method and drying.
  • the base material 20 of the wavelength conversion member is obtained by firing the green sheet near the softening point of the glass powder.
  • the base material 20 of the wavelength conversion member is cut along the planned cutting line C and separated into individual pieces.
  • a pattern corresponding to the shape and dimensions of the wavelength conversion member 1 finally manufactured is selected. As a result, a plurality of wavelength conversion members 1 are obtained.
  • the base material 20 of the wavelength conversion member is cut by dicing.
  • the surface roughness of the side surface 1c of the wavelength conversion member 1 can be adjusted to a desired range by appropriately selecting the count of the cutting blade used for dicing (the count of the abrasive grains used for the cutting blade). It will be possible. Specifically, the count of the cutting blade is preferably 600 to 2000, more preferably 800 to 1500. If the count of the cutting blade is too large, the surface roughness of the side surface 1c of the wavelength conversion member 1 becomes small, and as described above, the problem that the reflective resin 4 is cured and contracted and slides downward tends to occur.
  • Table 1 shows Examples (No. 2 to 4) and Comparative Examples (No. 1, 5, 6) of the present invention.
  • a master plate (50 mm ⁇ 50 mm ⁇ 0.2 mm, phosphor concentration 8.3% by volume) of a wavelength conversion member in which YAG phosphor powder was dispersed in a borosilicate glass matrix (softening point 850 ° C.) was prepared.
  • the base material of the wavelength conversion member was diced at 1 mm intervals in the X direction and the Y direction using a dicing device to separate them into pieces.
  • the cutting blade a blade in which artificial diamond abrasive grains were fixed with a metal bond was used, and the count (abrasive grain count) was as shown in Table 1.
  • the base material of the wavelength conversion member was scribed by using a scriber at intervals of 1 mm in each of the X and Y directions, and then cut along the scribe line to form individual pieces.
  • a plurality of wavelength conversion members were obtained from the base material of the wavelength conversion member.
  • Table 1 shows the results of measuring the surface roughness Sa of the side surface of the obtained wavelength conversion member using a 3D measurement laser microscope (OLS4000 manufactured by Olympus Corporation).
  • the surface roughness Sa indicates an average value of data measured for 10 arbitrarily selected samples among the wavelength conversion members obtained by individualizing the base material.
  • a light emitting device Using the obtained wavelength conversion member, a light emitting device according to FIG. 2 was manufactured. A blue LED having an excitation wavelength of 450 nm was used as a light source, and a resin composition in which titania powder was dispersed in a silicone resin was used as a reflective resin. The wavelength conversion member was bonded to the surface of the LED with a silicone resin. It was confirmed that the reflective resin slipped off at the interface between the wavelength conversion member and the reflective resin when the reflective resin was cured and shrunk by heating. The results are shown in Table 1.
  • No. 1 which is an example.
  • the light emitting devices 1 to 4 no sliding off was confirmed when the reflective resin was cured and shrunk.
  • Wavelength conversion member 1a First main surface 1b Second main surface 1c Side surface 2, 32 Light source 3, 33 Housing 4, 34 Reflective resin 10, 30 Light emitting device 20 Base material of wavelength conversion member

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Optical Filters (AREA)

Abstract

The present invention provides a wavelength-conversion member in which, when the wavelength-conversion member is used as a structural member of a light-emitting device, downward sliding can be suppressed when a reflective resin that encloses a side surface section has undergone curing and shrinking, and in which the efficiency at which light is extracted from a light-emitting surface can be increased.　A wavelength-conversion member 1 having a first main surface 1a and a second main surface 1b that face each other, and a side surface 1c that connects the first main surface 1a and the second main surface 1b, wherein the wavelength conversion member 1 is characterized in that the surface roughness Sa of the side surface 1c is 0.1-0.8 µm.

Description

波長変換部材及び発光装置Wavelength conversion member and light emitting device
　本発明は、励起光を別の波長の光に変換する波長変換部材、及び、それを用いた発光装置に関する。 The present invention relates to a wavelength conversion member that converts excitation light into light of another wavelength, and a light emitting device using the same.
　近年、蛍光ランプや白熱灯に変わる次世代の光源として、ＬＥＤ（Light Emitting Diode）やＬＤ（Laser Diode）を用いた発光装置に対する注目が高まってきている。そのような次世代光源の一例として、青色光を出射するＬＥＤと、ＬＥＤからの光の一部を吸収して黄色光に変換する波長変換部材とを組み合わせた発光装置が提案されている。この発光装置は、ＬＥＤから出射され、波長変換部材を透過した青色光と、波長変換部材から出射された黄色光との合成光である白色光を発する。 In recent years, attention has been increasing to light emitting devices using LEDs (Light Emitting Diodes) and LDs (Laser Diodes) as next-generation light sources to replace fluorescent lamps and incandescent lamps. As an example of such a next-generation light source, a light emitting device that combines an LED that emits blue light and a wavelength conversion member that absorbs a part of the light from the LED and converts it into yellow light has been proposed. This light emitting device emits white light which is a composite light of blue light emitted from an LED and transmitted through a wavelength conversion member and yellow light emitted from a wavelength conversion member.
　波長変換部材としては、従来、樹脂マトリクス中に無機蛍光体を分散させたものが用いられてきた。しかしながら、当該波長変換部材を用いた場合、ＬＥＤからの光により樹脂が劣化し、光源の輝度が低くなりやすいという問題がある。特に、ＬＥＤが発する熱や高エネルギーの短波長（青色～紫外）光によって樹脂マトリクスが劣化し、変色や変形を起こすという問題がある。そこで、樹脂に代えてガラスマトリクス中に無機蛍光体を分散固定した完全無機固体からなる波長変換部材が提案されている（例えば、特許文献１参照）。当該波長変換部材は、母材となるガラスがＬＥＤチップの熱や照射光により劣化しにくく、変色や変形といった問題が生じにくいという特徴を有している。 Conventionally, as the wavelength conversion member, a member in which an inorganic phosphor is dispersed in a resin matrix has been used. However, when the wavelength conversion member is used, there is a problem that the resin is deteriorated by the light from the LED and the brightness of the light source tends to be lowered. In particular, there is a problem that the resin matrix is deteriorated by the heat generated by the LED or high-energy short-wavelength (blue to ultraviolet) light, causing discoloration or deformation. Therefore, a wavelength conversion member made of a completely inorganic solid in which an inorganic phosphor is dispersed and fixed in a glass matrix instead of a resin has been proposed (see, for example, Patent Document 1). The wavelength conversion member has a feature that the glass as a base material is less likely to be deteriorated by the heat of the LED chip or the irradiation light, and problems such as discoloration and deformation are less likely to occur.
　特許文献２には、上記のような波長変換部材を量産する方法として、ガラスマトリクス中に無機蛍光体を分散固定した大面積の板状の波長変換部材の母材を作製した後、当該波長変換部材の母材を個片化する方法が提案されている。具体的には、波長変換部材の母材の表面に所定のパターンで分割溝（スクライブ線）を形成し、当該分割溝に沿って前記波長変換部材の母材を割断する方法が提案されている。 In Patent Document 2, as a method for mass-producing the wavelength conversion member as described above, after producing a base material of a large-area plate-shaped wavelength conversion member in which an inorganic phosphor is dispersed and fixed in a glass matrix, the wavelength conversion is performed. A method of individualizing the base material of the member has been proposed. Specifically, a method has been proposed in which a dividing groove (scribe line) is formed on the surface of the base material of the wavelength conversion member in a predetermined pattern, and the base material of the wavelength conversion member is cut along the dividing groove. ..
特開２００３－２５８３０８号公報Japanese Unexamined Patent Publication No. 2003-258308 特開２０１８－９７０６０号公報JP-A-2018-97060
　上記のようにして得られた波長変換部材は、ＬＥＤ等の光源と組み合わせることにより発光装置として使用される。図４は従来の波長変換部材を使用した発光装置を示す模式的断面図である。波長変換部材３１は、筐体３３の底部に設置された光源３２上に載置され、波長変換部材３１（及び光源３２）の側面を反射樹脂３４で包囲することにより発光装置３０として使用される。反射樹脂３４は波長変換部材３１の側面から漏出する光を反射し、波長変換部材３１の光出射面（上面）からの光取出し効率を高める役割を有する。しかしながら、図４の（ｂ）に示す通り、波長変換部材３１の側面に接触している反射樹脂３４が硬化、収縮した際に、波長変換部材３１と反射樹脂３４との密着性が低く、下方にずり落ちて波長変換部材３１の側面部分（例えば側面の上部）が露出する場合がある。その結果、露出した当該側面部分から光が漏出して、波長変換部材３１の光出射面からの光取出し効率が低下するという問題があった。 The wavelength conversion member obtained as described above is used as a light emitting device by combining with a light source such as an LED. FIG. 4 is a schematic cross-sectional view showing a light emitting device using a conventional wavelength conversion member. The wavelength conversion member 31 is placed on the light source 32 installed at the bottom of the housing 33, and is used as the light emitting device 30 by surrounding the side surface of the wavelength conversion member 31 (and the light source 32) with the reflective resin 34. .. The reflective resin 34 has a role of reflecting the light leaking from the side surface of the wavelength conversion member 31 and increasing the light extraction efficiency from the light emitting surface (upper surface) of the wavelength conversion member 31. However, as shown in FIG. 4B, when the reflective resin 34 in contact with the side surface of the wavelength conversion member 31 is cured and contracted, the adhesion between the wavelength conversion member 31 and the reflective resin 34 is low, and the adhesion is low. The side surface portion (for example, the upper part of the side surface) of the wavelength conversion member 31 may be exposed by sliding down. As a result, there is a problem that light leaks from the exposed side surface portion and the light extraction efficiency from the light emitting surface of the wavelength conversion member 31 is lowered.
　以上に鑑み、本発明は、発光装置の構成部材として使用した際に、側面部分を包囲する反射樹脂が硬化、収縮した際に下方にずり落ちることを抑制し、光出射面からの光取出し効率を高めることが可能な波長変換部材を提供することを目的とする。 In view of the above, the present invention suppresses the reflective resin surrounding the side surface portion from sliding downward when it is cured and contracted when used as a component of a light emitting device, and improves the efficiency of light extraction from the light emitting surface. It is an object of the present invention to provide a wavelength conversion member which can be enhanced.
　本発明の波長変換部材は、互いに対向する第１の主面と第２の主面、及び、第１の主面と第２の主面を接続する側面を有している波長変換部材であって、側面の面粗さＳａが０．１～０．８μｍであることを特徴とする。本発明の波長変換部材は、側面の面粗さＳａを上記の通り大きくすることで、反射樹脂との接触部分における投錨効果が大きくなるため、反射樹脂が硬化、収縮した際に下方にずり落ちて波長変換部材の側面部分が露出することを抑制できる。その結果、波長変換部材の光出射面からの光取出し効率を高めることが可能となる。 The wavelength conversion member of the present invention is a wavelength conversion member having a first main surface and a second main surface facing each other, and a side surface connecting the first main surface and the second main surface. The surface roughness Sa of the side surface is 0.1 to 0.8 μm. In the wavelength conversion member of the present invention, by increasing the surface roughness Sa on the side surface as described above, the anchoring effect at the contact portion with the reflective resin is increased, so that the reflective resin slides downward when it is cured or contracted. It is possible to prevent the side surface portion of the wavelength conversion member from being exposed. As a result, it is possible to improve the light extraction efficiency from the light emitting surface of the wavelength conversion member.
　本発明の波長変換部材は、無機マトリクスと、無機マトリクス中に分散された蛍光体粉末を有することが好ましい。 The wavelength conversion member of the present invention preferably has an inorganic matrix and a phosphor powder dispersed in the inorganic matrix.
　本発明の波長変換部材は、蛍光体粉末の平均粒子径が１～５０μｍであることが好ましい。なお本明細書において、平均粒子径はレーザー回折法により測定された値（Ｄ５０）を示す。 In the wavelength conversion member of the present invention, the average particle size of the phosphor powder is preferably 1 to 50 μm. In this specification, the average particle size indicates a value (D 50 ) measured by a laser diffraction method.
　本発明の波長変換部材は、厚みが０．０１～１ｍｍであることが好ましい。 The wavelength conversion member of the present invention preferably has a thickness of 0.01 to 1 mm.
　本発明の発光装置は、上記の波長変換部材、波長変換部材に励起光を照射する光源、及び、波長変換部材を包囲する反射樹脂、を備えることを特徴とする。 The light emitting device of the present invention is characterized by including the above-mentioned wavelength conversion member, a light source that irradiates the wavelength conversion member with excitation light, and a reflective resin that surrounds the wavelength conversion member.
　本発明の波長変換部材によれば、波長変換部材の側面を包囲する反射樹脂が、硬化、収縮した際に下方にずり落ちて波長変換部材の側面部分が露出するという不具合を抑制できる。その結果、波長変換部材の光出射面からの光取出し効率を高めることが可能となる。 According to the wavelength conversion member of the present invention, it is possible to suppress a problem that the reflective resin surrounding the side surface of the wavelength conversion member slides downward when cured or contracted to expose the side surface portion of the wavelength conversion member. As a result, it is possible to improve the light extraction efficiency from the light emitting surface of the wavelength conversion member.
本発明の波長変換部材の一実施形態を示す斜視図である。It is a perspective view which shows one Embodiment of the wavelength conversion member of this invention. 本発明の波長変換部材を使用した発光装置の一実施形態を示す模式的断面図である。It is a schematic cross-sectional view which shows one Embodiment of the light emitting device using the wavelength conversion member of this invention. 本発明の波長変換部材の製造方法を説明するための平面図である。It is a top view for demonstrating the manufacturing method of the wavelength conversion member of this invention. （ａ）は従来の波長変換部材を用いて作製した発光装置を示す模式的断面図であり、（ｂ）は（ａ）の発光装置における反射樹脂が硬化、収縮した際に下方にずり落ちた様子を示す模式的断面図である。(A) is a schematic cross-sectional view showing a light emitting device manufactured by using a conventional wavelength conversion member, and (b) is a downward slide when the reflective resin in the light emitting device of (a) is cured and contracted. It is a schematic cross-sectional view which shows the state.
　以下、本発明の波長変換部材及び発光装置の実施形態を図面を用いて詳細に説明する。 Hereinafter, embodiments of the wavelength conversion member and the light emitting device of the present invention will be described in detail with reference to the drawings.
　（波長変換部材及び発光装置）
　図１は、本発明の波長変換部材の一実施形態を示す斜視図である。波長変換部材１は、平面形状が矩形（正方形または長方形）の板状である。波長変換部材１の平面形状は矩形に限定されず、矩形以外の多角形や円形等の他の形状であってもよい。波長変換部材１は、互いに対向する第１の主面１ａと第２の主面１ｂ、及び、第１の主面１ａと第２の主面１ｂを接続する側面１ｃを有する。 (Wavelength conversion member and light emitting device)
FIG. 1 is a perspective view showing an embodiment of the wavelength conversion member of the present invention. The wavelength conversion member 1 has a plate shape having a rectangular (square or rectangular) plane shape. The planar shape of the wavelength conversion member 1 is not limited to a rectangle, and may be another shape such as a polygon or a circle other than the rectangle. The wavelength conversion member 1 has a first main surface 1a and a second main surface 1b facing each other, and a side surface 1c connecting the first main surface 1a and the second main surface 1b.
　図２は、波長変換部材１を使用した発光装置１０を示す模式的断面図である。波長変換部材１は、筐体３の底部に設置された光源２上に載置され、波長変換部材１（及び光源２）の側面を反射樹脂４で包囲することにより発光装置１０として使用される。なお、波長変換部材１は、光源２上に直接載置してもよいし、図示しない接着剤層を介して接着してもよい。 FIG. 2 is a schematic cross-sectional view showing a light emitting device 10 using the wavelength conversion member 1. The wavelength conversion member 1 is placed on a light source 2 installed at the bottom of the housing 3, and is used as a light emitting device 10 by surrounding the side surface of the wavelength conversion member 1 (and the light source 2) with a reflective resin 4. .. The wavelength conversion member 1 may be placed directly on the light source 2 or may be adhered via an adhesive layer (not shown).
　波長変換部材１は、例えば無機マトリクスと、無機マトリクス中に分散された蛍光体粉末を有する。蛍光体粒子は励起光の入射により蛍光を出射する。従って、励起光が波長変換部材１の第２の主面１ｂから入射すると、波長変換部材１の第１の主面１ａから励起光及び蛍光の合成光が出射される。 The wavelength conversion member 1 has, for example, an inorganic matrix and a phosphor powder dispersed in the inorganic matrix. The phosphor particles emit fluorescence when the excitation light is incident. Therefore, when the excitation light is incident from the second main surface 1b of the wavelength conversion member 1, the combined light of the excitation light and fluorescence is emitted from the first main surface 1a of the wavelength conversion member 1.
　蛍光体粒子は、励起光の入射により蛍光を出射するものであれば、特に限定されるものではない。蛍光体粒子の具体例としては、例えば、酸化物蛍光体、窒化物蛍光体、酸窒化物蛍光体、塩化物蛍光体、酸塩化物蛍光体、硫化物蛍光体、酸硫化物蛍光体、ハロゲン化物蛍光体、カルコゲン化物蛍光体、アルミン酸塩蛍光体、ハロリン酸塩化物蛍光体及びガーネット系化合物蛍光体から選ばれた１種以上等が挙げられる。励起光として青色光を用いる場合、例えば、緑色光、黄色光または赤色光を蛍光として出射する蛍光体を用いることができる。 The phosphor particles are not particularly limited as long as they emit fluorescence when the excitation light is incident. Specific examples of the phosphor particles include oxide phosphors, nitride phosphors, oxynitride phosphors, chloride phosphors, acidified phosphors, sulfide phosphors, acid sulfide phosphors, and halogens. Examples thereof include one or more selected from a compound fluorescent substance, a chalcogen compound fluorescent substance, an aluminate fluorescent substance, a halophosphate compound fluorescent substance, and a garnet-based compound fluorescent substance. When blue light is used as the excitation light, for example, a phosphor that emits green light, yellow light, or red light as fluorescence can be used.
　蛍光体粒子の平均粒子径は、１～５０μｍであることが好ましく、５～３０μｍであることがより好ましい。蛍光体粒子の平均粒子径が小さすぎると、発光強度が低下する場合がある。一方、蛍光体粒子の平均粒子径が大きすぎると、発光色が不均一になる場合がある。 The average particle size of the phosphor particles is preferably 1 to 50 μm, more preferably 5 to 30 μm. If the average particle size of the phosphor particles is too small, the emission intensity may decrease. On the other hand, if the average particle size of the phosphor particles is too large, the emission color may become non-uniform.
　波長変換部材１における蛍光体粒子の含有量は、１体積％以上であることが好ましく、１．５体積％以上であることがより好ましく、２体積％以上であることがさらに好ましい。波長変換部材１における蛍光体粒子の含有量は、７０体積％以下であることが好ましく、５０体積％以下であることがより好ましく、３０体積％以下であることがさらに好ましい。蛍光体粒子の含有量が少なすぎると、所望の発光色を得るために波長変換部材１を厚くする必要があり、その結果、得られる波長変換部材１の内部散乱が増加することで、光取出し効率が低下する場合がある。一方、蛍光体粒子の含有量が多すぎると、所望の発光色を得るために波長変換部材１を薄くする必要があるため、波長変換部材１の機械的強度が低下する場合がある。 The content of the phosphor particles in the wavelength conversion member 1 is preferably 1% by volume or more, more preferably 1.5% by volume or more, and further preferably 2% by volume or more. The content of the phosphor particles in the wavelength conversion member 1 is preferably 70% by volume or less, more preferably 50% by volume or less, and further preferably 30% by volume or less. If the content of the phosphor particles is too small, the wavelength conversion member 1 needs to be thickened in order to obtain a desired emission color, and as a result, the internal scattering of the obtained wavelength conversion member 1 increases, so that light is extracted. Efficiency may be reduced. On the other hand, if the content of the phosphor particles is too large, the wavelength conversion member 1 needs to be thinned in order to obtain a desired emission color, so that the mechanical strength of the wavelength conversion member 1 may decrease.
　無機マトリクスに用いられる無機材料は、蛍光体粒子の分散媒として用いることができるものであれば特に限定されないが、例えばガラスを用いることができる。無機マトリクスに用いられるガラスとしては、例えば、ホウ珪酸塩系ガラス、リン酸塩系ガラス、スズリン酸塩系ガラス、ビスマス酸塩系ガラス等を用いることができる。ホウ珪酸塩系ガラスとしては、質量％で、ＳｉＯ２　３０～８５％、Ａｌ２Ｏ３　０～３０％、Ｂ２Ｏ３　０～５０％、Ｌｉ２Ｏ＋Ｎａ２Ｏ＋Ｋ２Ｏ　０～１０％、及びＭｇＯ＋ＣａＯ＋ＳｒＯ＋ＢａＯ　０～５０％を含有するものが挙げられる。スズリン酸塩系ガラスとしては、モル％で、ＳｎＯ　３０～９０％、Ｐ２Ｏ５　１～７０％を含有するものが挙げられる。 The inorganic material used in the inorganic matrix is not particularly limited as long as it can be used as a dispersion medium for phosphor particles, and for example, glass can be used. As the glass used for the inorganic matrix, for example, borosilicate glass, phosphate glass, tin phosphate glass, bismuthrate glass and the like can be used. The borosilicate-based glass, in mass%, SiO 2 30 ~ 85% , Al 2 O 3 0 ~ 30%, B 2 O 3 0 ~ 50%, Li 2 O + Na 2 O + K 2 O 0 ~ 10%, and Examples thereof include those containing 0 to 50% of MgO + CaO + SrO + BaO. The Suzurin salt-based glass, in mol%, SnO 30 ~ 90%, include those containing P 2 O 5 1 ~ 70% .
　波長変換部材１の厚みは０．０１～１ｍｍが好ましく０．０５～０．５ｍｍがより好ましく、０．１～０．３ｍｍがさらに好ましい。波長変換部材１の厚みが小さすぎると、十分な発光強度が得られにくくなる場合がある。また、波長変換部材１の機械的強度が不十分になる場合がある。一方、波長変換部材１の厚みが大きすぎると、波長変換部材１における光の散乱や吸収が大きくなりすぎ、光取出し効率が低くなる場合がある。 The thickness of the wavelength conversion member 1 is preferably 0.01 to 1 mm, more preferably 0.05 to 0.5 mm, and even more preferably 0.1 to 0.3 mm. If the thickness of the wavelength conversion member 1 is too small, it may be difficult to obtain sufficient emission intensity. In addition, the mechanical strength of the wavelength conversion member 1 may be insufficient. On the other hand, if the thickness of the wavelength conversion member 1 is too large, the scattering or absorption of light in the wavelength conversion member 1 becomes too large, and the light extraction efficiency may be lowered.
　波長変換部材１の側面１ｃの面粗さＳａは０．１～０．８μｍであり、０．１～０．５μｍ、特に０．２～０．４μｍであることが好ましい。面粗さＳａが小さすぎると、反射樹脂３４との接触部分における投錨効果が小さくなるため、反射樹脂３４が硬化、収縮した際に下方にずり落ちて波長変換部材１の側面１ｃが露出しやすくなる。その結果、露出した側面１ｃから光が漏出し、波長変換部材１の第１の主面１ａからの光取出し効率が低下しやすくなる。一方、面粗さＳａが大きすぎると、製造する際に波長変換部材１の主面１ａの周辺部にチッピングが発生しやすくなる。その結果、反射樹脂３４がチッピング部に流動し、主面１ａの面積（光出射面積）が小さくなり光取り出し効率が低下する傾向がある。 The surface roughness Sa of the side surface 1c of the wavelength conversion member 1 is 0.1 to 0.8 μm, preferably 0.1 to 0.5 μm, and particularly preferably 0.2 to 0.4 μm. If the surface roughness Sa is too small, the anchoring effect at the contact portion with the reflective resin 34 becomes small, so that when the reflective resin 34 is cured and contracted, it slides downward and the side surface 1c of the wavelength conversion member 1 is easily exposed. Become. As a result, light leaks from the exposed side surface 1c, and the light extraction efficiency from the first main surface 1a of the wavelength conversion member 1 tends to decrease. On the other hand, if the surface roughness Sa is too large, chipping is likely to occur in the peripheral portion of the main surface 1a of the wavelength conversion member 1 during manufacturing. As a result, the reflective resin 34 flows to the chipping portion, the area of the main surface 1a (light emitting area) becomes small, and the light extraction efficiency tends to decrease.
　なお波長変換部材１としては、上記に例示したもの以外にも、例えばＹＡＧセラミックス等のセラミックスからなる波長変換部材であってもよい。 The wavelength conversion member 1 may be a wavelength conversion member made of ceramics such as YAG ceramics, in addition to those exemplified above.
　光源２としては、ＬＥＤやＬＤを使用することができる。なお、光源２は図示しない電極により外部電源と接続されている。 As the light source 2, an LED or LD can be used. The light source 2 is connected to an external power source by electrodes (not shown).
　筐体３としては、例えば、光源２から発せられた光線を効率良く反射させることができる白色のＬＴＣＣ（Low Temperature Co-fired Ceramics）等が用いられる。具体的には、酸化アルミニウムや酸化チタン、酸化ニオブ等の無機粉末とガラス粉末との焼結体が挙げられる。あるいは、筐体３としては、光源２から発せられた熱を効率よく放出させるため、熱伝導率が高い材料を使用してもよい。特に耐熱性、耐候性に優れることからセラミックス等を用いることが好ましい。具体的には、酸化アルミニウムや窒化アルミニウム等のセラミックスからなる筐体が挙げられる。 As the housing 3, for example, a white LTCC (Low Temperature Co-fired Ceramics) or the like that can efficiently reflect the light rays emitted from the light source 2 is used. Specific examples thereof include a sintered body of glass powder and an inorganic powder such as aluminum oxide, titanium oxide or niobium oxide. Alternatively, as the housing 3, a material having high thermal conductivity may be used in order to efficiently release the heat generated from the light source 2. In particular, it is preferable to use ceramics or the like because it is excellent in heat resistance and weather resistance. Specific examples thereof include a housing made of ceramics such as aluminum oxide and aluminum nitride.
　反射樹脂４は、波長変換部材１の側面１ｃあるいは光源２の側面から漏れ出た光を反射するため設けられている。反射樹脂４は、例えば酸化チタン等の白色顔料を含む樹脂組成物（高反射樹脂）からなる。樹脂の具体例としては、シリコーン系樹脂、エポキシ系樹脂、アクリル系樹脂、ウレタン系樹脂等が挙げられる。硬化手段としては、光硬化や熱硬化、常温硬化（水分と反応し硬化、あるいは２液混合反応硬化）等が挙げられる。 The reflective resin 4 is provided to reflect the light leaked from the side surface 1c of the wavelength conversion member 1 or the side surface of the light source 2. The reflective resin 4 is made of a resin composition (highly reflective resin) containing a white pigment such as titanium oxide. Specific examples of the resin include silicone-based resin, epoxy-based resin, acrylic-based resin, urethane-based resin, and the like. Examples of the curing means include photocuring, thermosetting, room temperature curing (curing by reacting with moisture, or two-component mixed reaction curing).
　（波長変換部材の製造方法）
　図３は、本発明の波長変換部材の製造方法を説明するための平面図である。
　まず、波長変換部材の母材２０を準備する。波長変換部材の母材２０は、互いに対向する主面を有する板状部材であり、所望のパターンで切断することにより複数の波長変換部材１を得ることができる。波長変換部材の母材２０は、例えば以下のようにして作製することができる。 (Manufacturing method of wavelength conversion member)
FIG. 3 is a plan view for explaining a method for manufacturing the wavelength conversion member of the present invention.
First, the base material 20 of the wavelength conversion member is prepared. The base material 20 of the wavelength conversion member is a plate-shaped member having main surfaces facing each other, and a plurality of wavelength conversion members 1 can be obtained by cutting in a desired pattern. The base material 20 of the wavelength conversion member can be produced, for example, as follows.
　ガラスマトリクスとなるガラス粉末と、蛍光体粉末との混合粉末に対し、有機ビークルを添加してペーストを作製する。ペーストをＰＥＴ（ポリエチレンテレフタラート）等の基材フィルム上にドクターブレード法にて塗布し、乾燥することによりグリーンシートを得る。グリーンシートをガラス粉末の軟化点付近で焼成することにより波長変換部材の母材２０を得る。 An organic vehicle is added to a mixed powder of a glass powder to be a glass matrix and a phosphor powder to prepare a paste. A green sheet is obtained by applying the paste on a base film such as PET (polyethylene terephthalate) by the doctor blade method and drying. The base material 20 of the wavelength conversion member is obtained by firing the green sheet near the softening point of the glass powder.
　次に、波長変換部材の母材２０を切断予定線Ｃに沿って切断し、個片化する。切断予定線Ｃは、最終的に製造される波長変換部材１の形状や寸法に応じたパターンが選択される。これにより複数の波長変換部材１を得る。 Next, the base material 20 of the wavelength conversion member is cut along the planned cutting line C and separated into individual pieces. For the planned cutting line C, a pattern corresponding to the shape and dimensions of the wavelength conversion member 1 finally manufactured is selected. As a result, a plurality of wavelength conversion members 1 are obtained.
　本実施形態では、波長変換部材の母材２０をダイシングにより切断する。ここで、ダイシングに使用する切断ブレードの番手（切断ブレードに使用される砥粒の番手）を適宜選択することにより、波長変換部材１の側面１ｃの面粗さを所望の範囲に調製することが可能となる。具体的には、切断ブレードの番手は６００～２０００番が好ましく、８００～１５００番がより好ましい。切断ブレードの番手が大きすぎると、波長変換部材１の側面１ｃの面粗さが小さくなり、上述したように反射樹脂４が硬化、収縮した際に下方にずり落ちるという問題が発生しやすくなる。一方、切断ブレードの番手が小さすぎると、切断時に波長変換部材１の周囲にチッピング等の不具合が発生し、反射樹脂がチッピング部に流動することで、波長変換部材１の主面１ａの面積（光出射面積）が小さくなり光取出し効率が低下する傾向がある。 In the present embodiment, the base material 20 of the wavelength conversion member is cut by dicing. Here, the surface roughness of the side surface 1c of the wavelength conversion member 1 can be adjusted to a desired range by appropriately selecting the count of the cutting blade used for dicing (the count of the abrasive grains used for the cutting blade). It will be possible. Specifically, the count of the cutting blade is preferably 600 to 2000, more preferably 800 to 1500. If the count of the cutting blade is too large, the surface roughness of the side surface 1c of the wavelength conversion member 1 becomes small, and as described above, the problem that the reflective resin 4 is cured and contracted and slides downward tends to occur. On the other hand, if the count of the cutting blade is too small, problems such as chipping occur around the wavelength conversion member 1 during cutting, and the reflective resin flows to the chipping portion, so that the area of the main surface 1a of the wavelength conversion member 1 ( The light emission area) tends to be small, and the light extraction efficiency tends to decrease.
　以下に、本発明を実施例を用いて詳細に説明するが、本発明はこれらの実施例に限定されるものではない。 The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples.
　表１は、本発明の実施例（Ｎｏ．２～４）及び比較例（Ｎｏ．１、５、６）を示す。 Table 1 shows Examples (No. 2 to 4) and Comparative Examples (No. 1, 5, 6) of the present invention.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　（波長変換部材及び発光装置の作製）
　ホウケイ酸系ガラスマトリクス（軟化点８５０℃）中にＹＡＧ蛍光体粉末が分散した波長変換部材の母板（５０ｍｍ×５０ｍｍ×０．２ｍｍ、蛍光体濃度８．３体積％）を準備した。Ｎｏ．１～５については、波長変換部材の母材について、ダイシング装置を用いてＸ方向及びＹ方向にそれぞれ１ｍｍ間隔でダイシングを行い個片化した。なお、切断ブレードとしては人造ダイヤモンド砥粒をメタルボンドで固着させたブレードを使用し、番手（砥粒の番手）は表１に示す通りとした。また、Ｎｏ．６については、波長変換部材の母材について、Ｘ方向及びＹ方向にそれぞれ１ｍｍ間隔で、スクライバーを用いてスクライブ線を形成した後、スクライブ線に沿って割断を行い個片化した。以上の方法により、波長変換部材の母材から複数の波長変換部材を得た。 (Manufacturing of wavelength conversion member and light emitting device)
A master plate (50 mm × 50 mm × 0.2 mm, phosphor concentration 8.3% by volume) of a wavelength conversion member in which YAG phosphor powder was dispersed in a borosilicate glass matrix (softening point 850 ° C.) was prepared. No. For Nos. 1 to 5, the base material of the wavelength conversion member was diced at 1 mm intervals in the X direction and the Y direction using a dicing device to separate them into pieces. As the cutting blade, a blade in which artificial diamond abrasive grains were fixed with a metal bond was used, and the count (abrasive grain count) was as shown in Table 1. In addition, No. Regarding No. 6, the base material of the wavelength conversion member was scribed by using a scriber at intervals of 1 mm in each of the X and Y directions, and then cut along the scribe line to form individual pieces. By the above method, a plurality of wavelength conversion members were obtained from the base material of the wavelength conversion member.
　得られた波長変換部材の側面の面粗さＳａを、３Ｄ測定レーザー顕微鏡（オリンパス社製ＯＬＳ４０００）を用いて測定した結果を表１に示す。なお面粗さＳａは、母材の個片化により得られた波長変換部材のうち、任意に選択した１０個の試料について測定したデータの平均値を示す。 Table 1 shows the results of measuring the surface roughness Sa of the side surface of the obtained wavelength conversion member using a 3D measurement laser microscope (OLS4000 manufactured by Olympus Corporation). The surface roughness Sa indicates an average value of data measured for 10 arbitrarily selected samples among the wavelength conversion members obtained by individualizing the base material.
　得られた波長変換部材を用いて、図２に準ずる発光装置を作製した。光源としては励起波長４５０ｎｍの青色ＬＥＤ、反射樹脂としてはシリコーン樹脂中にチタニア粉末を分散した樹脂組成物を使用した。波長変換部材はＬＥＤの表面にシリコーン樹脂で接着した。加熱によって反射樹脂が硬化、収縮した際の波長変換部材と反射樹脂の界面における反射樹脂のずり落ちを確認した。結果を表１に示す。 Using the obtained wavelength conversion member, a light emitting device according to FIG. 2 was manufactured. A blue LED having an excitation wavelength of 450 nm was used as a light source, and a resin composition in which titania powder was dispersed in a silicone resin was used as a reflective resin. The wavelength conversion member was bonded to the surface of the LED with a silicone resin. It was confirmed that the reflective resin slipped off at the interface between the wavelength conversion member and the reflective resin when the reflective resin was cured and shrunk by heating. The results are shown in Table 1.
　（発光特性の評価）
　作製した発光装置（反射樹脂硬化後のもの）に１．０Ａの直流電流を印加して光源を点灯した。波長変換部材の第１の主面から発せられる光を積分球内部に取り込んだ後、標準光源によって校正された分光器へ導光し、光のエネルギー分布スペクトルを測定した。得られたスペクトルに標準比視感度を掛け合わせることにより、全光束値を算出した。結果を表１に示す。なお表１における全光束値は、Ｎｏ．２の全光束値を１とした場合の相対値で示している。 (Evaluation of light emission characteristics)
A direct current of 1.0 A was applied to the manufactured light emitting device (after curing the reflective resin) to turn on the light source. After taking the light emitted from the first main surface of the wavelength conversion member into the integrating sphere, the light was guided to a spectroscope calibrated by a standard light source, and the energy distribution spectrum of the light was measured. The total luminous flux value was calculated by multiplying the obtained spectrum by the standard luminosity function. The results are shown in Table 1. The total luminous flux values in Table 1 are No. It is shown as a relative value when the total luminous flux value of 2 is 1.
　表１に示す通り、実施例であるＮｏ．１～４の発光装置では、反射樹脂が硬化、収縮した際のずり落ちは確認されなかった。一方、比較例であるＮｏ．５、６の発光装置では、反射樹脂が硬化、収縮した際のずり落ちが確認された。そのため、実施例の発光装置と比較して、光出射面からの光取出し効率に劣っていた。なお、Ｎｏ．１で作製した波長変換部材には、周辺部に一部チッピングが確認され、実施例の発光装置と比較して、光出射面からの光取出し効率に劣っていた。 As shown in Table 1, No. 1 which is an example. In the light emitting devices 1 to 4, no sliding off was confirmed when the reflective resin was cured and shrunk. On the other hand, No. In the light emitting devices 5 and 6, it was confirmed that the reflective resin slipped off when it was cured and shrunk. Therefore, the light extraction efficiency from the light emitting surface is inferior to that of the light emitting device of the embodiment. In addition, No. In the wavelength conversion member produced in No. 1, some chipping was confirmed in the peripheral portion, and the light extraction efficiency from the light emitting surface was inferior to that of the light emitting device of the embodiment.
　１、３１　波長変換部材
　１ａ　第１の主面
　１ｂ　第２の主面
　１ｃ　側面
　２、３２　光源
　３、３３　筐体
　４、３４　反射樹脂
　１０、３０　発光装置
　２０　波長変換部材の母材 1, 31 Wavelength conversion member 1a First main surface 1b Second main surface 1c Side surface 2, 32 Light source 3, 33 Housing 4, 34 Reflective resin 10, 30 Light emitting device 20 Base material of wavelength conversion member

Claims (5)

  1. 　互いに対向する第１の主面と第２の主面、及び、第１の主面と第２の主面を接続する側面を有している波長変換部材であって、
    　側面の面粗さＳａが０．１～０．８μｍであることを特徴とする波長変換部材。     A wavelength conversion member having a first main surface and a second main surface facing each other, and a side surface connecting the first main surface and the second main surface.
    A wavelength conversion member characterized in that the surface roughness Sa of the side surface is 0.1 to 0.8 μm.
  2. 　無機マトリクスと、無機マトリクス中に分散された蛍光体粉末を有することを特徴とする請求項１に記載の波長変換部材。 The wavelength conversion member according to claim 1, further comprising an inorganic matrix and a phosphor powder dispersed in the inorganic matrix.
  3. 　蛍光体粉末の平均粒子径が１～５０μｍであることを特徴とする請求項２に記載の波長変換部材。 The wavelength conversion member according to claim 2, wherein the average particle size of the phosphor powder is 1 to 50 μm.
  4. 　厚みが０．０１～１ｍｍであることを特徴とする請求項１～３のいずれか一項に記載の波長変換部材。 The wavelength conversion member according to any one of claims 1 to 3, characterized in that the thickness is 0.01 to 1 mm.
  5. 　請求項１～４のいずれか一項に記載の波長変換部材、
    　波長変換部材に励起光を照射する光源、及び、
    　波長変換部材を包囲する反射樹脂、
    を備える発光装置。     The wavelength conversion member according to any one of claims 1 to 4.
    A light source that irradiates the wavelength conversion member with excitation light, and
    Reflective resin that surrounds the wavelength conversion member,
    A light emitting device equipped with.
PCT/JP2020/019904 2019-06-03 2020-05-20 Wavelength-conversion member and light-emitting device WO2020246239A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019103593A JP2020197627A (en) 2019-06-03 2019-06-03 Wavelength conversion member and light-emitting device
JP2019-103593 2019-06-03

Publications (1)

Publication Number Publication Date
WO2020246239A1 true WO2020246239A1 (en) 2020-12-10

Family

ID=73649111

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/019904 WO2020246239A1 (en) 2019-06-03 2020-05-20 Wavelength-conversion member and light-emitting device

Country Status (3)

Country Link
JP (1) JP2020197627A (en)
TW (1) TW202106644A (en)
WO (1) WO2020246239A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222434A (en) * 2010-04-14 2011-11-04 Koito Mfg Co Ltd Light emitting module and optical wavelength converting member
WO2013018279A1 (en) * 2011-08-04 2013-02-07 株式会社小糸製作所 Optical wavelength conversion unit
WO2017195620A1 (en) * 2016-05-13 2017-11-16 パナソニックＩｐマネジメント株式会社 Light source device and lighting device
WO2018101348A1 (en) * 2016-11-30 2018-06-07 富士フイルム株式会社 Wavelength conversion member and backlight unit
WO2019029170A1 (en) * 2017-08-11 2019-02-14 厦门三安光电有限公司 Light-emitting device and fabrication method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222434A (en) * 2010-04-14 2011-11-04 Koito Mfg Co Ltd Light emitting module and optical wavelength converting member
WO2013018279A1 (en) * 2011-08-04 2013-02-07 株式会社小糸製作所 Optical wavelength conversion unit
WO2017195620A1 (en) * 2016-05-13 2017-11-16 パナソニックＩｐマネジメント株式会社 Light source device and lighting device
WO2018101348A1 (en) * 2016-11-30 2018-06-07 富士フイルム株式会社 Wavelength conversion member and backlight unit
WO2019029170A1 (en) * 2017-08-11 2019-02-14 厦门三安光电有限公司 Light-emitting device and fabrication method therefor

Also Published As

Publication number Publication date
TW202106644A (en) 2021-02-16
JP2020197627A (en) 2020-12-10

Similar Documents

Publication Publication Date Title
TWI392112B (en) Led lighting arrangement including light emitting phosphor
US11322659B2 (en) Method for manufacturing wavelength conversion member, wavelength conversion member, and light-emitting device
US20170015901A1 (en) Ceramic Phosphor Target
CN111213075B (en) Wavelength conversion member and light emitting device
WO2018225424A1 (en) Wavelength converter and method of manufacture therefor, and light-emitting device using wavelength converter
JP2016058624A (en) Light-emitting device
KR20190038473A (en) Wavelength conversion member and manufacturing method thereof
JP2008010749A (en) Light-emitting apparatus and manufacturing method thereof
WO2020246239A1 (en) Wavelength-conversion member and light-emitting device
TWI757521B (en) Wavelength conversion member and light-emitting device
JP2021057415A (en) Light-emitting device
EP3495857A1 (en) Wavelength conversion member and production method therefor
CN110494776B (en) Wavelength conversion member and light emitting device
WO2019061818A1 (en) Wavelength conversion device and light emitting device
JP6790563B2 (en) Manufacturing method of wavelength conversion member
JP7480472B2 (en) Wavelength conversion member, manufacturing method thereof, and light emitting device
JP7260793B2 (en) light emitting device
JP2018151610A (en) Wavelength conversion member and light emitting device
WO2014010211A1 (en) Light emitting module
JP2021057437A (en) Manufacturing method of device
JP2012119121A (en) Light source device and lighting system

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20819215

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20819215

Country of ref document: EP

Kind code of ref document: A1