WO2020244356A1

WO2020244356A1 - Housing assembly, processing method therefor, and electronic device

Info

Publication number: WO2020244356A1
Application number: PCT/CN2020/089700
Authority: WO
Inventors: 杨光明
Original assignee: Oppo广东移动通信有限公司
Priority date: 2019-06-04
Filing date: 2020-05-12
Publication date: 2020-12-10
Also published as: CN110290653A

Abstract

A housing assembly (10), a processing method therefor, and an electronic device (100). The housing assembly (10) comprises: a substrate (1), which is provided with an inner surface and an outer surface which are arranged opposite to each other, the substrate (1) being a transparent piece; a touch layer (2), which is provided at the inner surface of the substrate (1), the touch layer (2) being suitable for electrically connecting to a motherboard (20) of the electronic device (100); and a decorative layer (10a), which is provided at a side surface of the touch layer (2) away from the substrate (1).

Description

Shell assembly and its processing method and electronic equipment

This application is filed based on a Chinese patent application with an application number of 201910482055.3 and an application date of June 4, 2019, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated by reference into this application.

Technical field

This application relates to the technical field of electronic equipment, and in particular to a housing assembly and its processing method, and electronic equipment.

Background technique

In related technologies, the housing component of the electronic device has been developed as an appearance effect window, and has no actual function, poor functionality, and poor customer experience.

Summary of the invention

The present application provides a housing assembly of an electronic device. The housing assembly can implement a touch function, has strong functionality, and is beneficial to improving user experience.

The application also provides a processing method of the housing assembly.

The application also provides an electronic device including the above-mentioned housing assembly.

The housing assembly of an electronic device according to an embodiment of the present application includes: a substrate having an inner surface and an outer surface arranged opposite to each other, the substrate is a transparent part; a touch layer, the touch layer is arranged on the On the inner surface of the substrate, the touch control layer is suitable for being electrically connected to the main board of the electronic device; and a decoration layer, the decoration layer is provided on a surface of the touch control layer away from the substrate.

According to the housing assembly of the embodiment of the present application, by providing a touch layer on the inner surface of the substrate, and at the same time, the touch layer is electrically connected to the main board of the electronic device, so as to realize the touch function of the housing assembly and improve the performance of the housing assembly. Functionality, users can use user-defined functions without entering the electronic device interface to avoid cumbersome unlocking, and it can also help cancel some physical buttons, realize the full-screen design of electronic devices, and improve users’ Use experience and ease of use.

The electronic device according to the embodiment of the present application includes: a main board; and the above-mentioned housing assembly, and the touch control layer is electrically connected to the main board.

According to the electronic device of the embodiment of the present application, by providing the above-mentioned housing assembly, the touch function of the housing assembly can be realized, and the functionality of the housing assembly is improved. The user can use the user without entering the interface of the electronic device. The custom function avoids cumbersome unlocking, and can also help cancel some physical buttons, realize the full-screen design of the electronic device, and improve the user's experience and convenience.

The method for processing the housing assembly of the electronic device according to the embodiment of the present application includes the following steps: providing a substrate, the substrate comprising opposite outer and inner surfaces, the inner surface comprising a first area and a second area; The inner surface of the substrate is coated with a conductive material to form a conductive material layer; a photoresist is applied to the surface of the conductive material layer on the side away from the substrate to form a photoresist layer; the use includes a transparent portion and a non-transparent portion The photomask shields the photoresist layer, wherein one of the light-transmitting portion and the non-light-transmitting portion corresponds to the first region, and the other of the light-transmitting portion and the non-light-transmitting portion One corresponds to the second area; exposing the photoresist layer to remove the part of the photoresist layer corresponding to the first area; and the conductive material layer corresponds to the first area Remove part of to form a touch layer; remove the remaining part of the photoresist layer covering the touch layer to expose the touch layer.

According to the method for processing the housing assembly of the electronic device according to the embodiment of the present application, by providing a touch layer on the inner surface of the substrate, the touch function of the housing assembly can be realized, and the functionality of the housing assembly can be improved. Use user-defined functions without entering the interface of the electronic device to avoid cumbersome unlocking, and it can also help cancel some physical buttons, realize the full-screen design of the electronic device, and improve the user experience and ease of use .

The additional aspects and advantages of the present application will be partially given in the following description, and some will become obvious from the following description, or be understood through the practice of the present application.

Description of the drawings

The above and/or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, in which:

Fig. 1 is a schematic diagram of a processing method of a housing assembly according to some embodiments of the present application;

Fig. 2 is a flowchart of a processing method of a housing assembly according to some embodiments of the present application;

Fig. 3 is a schematic structural diagram of a housing assembly according to some embodiments of the present application;

Fig. 4 is a schematic diagram of an electronic device according to some embodiments of the present application, wherein the dashed box indicates the main board.

Reference signs:

Electronic equipment 100;

Housing assembly 10; substrate 1; first area 11; second area 12; touch layer 2; carrier 3; texture layer 4; color layer 5; base color layer 6; decoration layer 10a; main board 20;

Mask 200; light-transmitting part 201; non-light-transmitting part 202;

Conductive material layer 300;

Photoresist layer 400.

Detailed ways

The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary, and are only used to explain the present application, and cannot be understood as a limitation to the present application.

The housing assembly 10 of the electronic device 100 according to the embodiment of the present application is described below with reference to the drawings. Specifically, the housing assembly 10 is a rear housing of the electronic device 100.

As shown in FIG. 3, the housing assembly 10 of the electronic device 100 according to the embodiment of the present application may include: a substrate 1, a touch layer 2 and a decoration layer 10a. Wherein, the housing assembly 10 in the embodiment of the present application can be processed by the processing method described below.

Specifically, as shown in FIG. 3, the substrate 1 includes opposite inner and outer surfaces, the touch layer 2 is provided on the inner surface of the substrate 1, and the touch layer 2 is suitable for electrical connection with the main board 20 of the electronic device 100. By setting the touch layer 2 on the inner surface of the substrate 1, using capacitive touch technology, when a finger touches the housing assembly 10, the current induction of the human body can be used to work. Due to the human body electric field, the user and the surface of the housing assembly 10 A coupling capacitor is formed. For high-frequency current, the capacitor is a direct conductor, so the finger draws a small current from the contact point. At the same time, since the touch layer 2 is electrically connected to the main board 20, the main board 20 calculates the touch Point or path, therefore, touch operation signals such as the user's tapping, sliding or drawing corresponding graphics on the housing assembly 10 can be fed back to the main board 20, so that the main board 20 can control the electronic device 100 to respond according to corresponding operation gestures. For example, a variety of control signals are preset on the motherboard 20, and different control signals correspond to different operation gestures. When the user operates a certain operation gesture on the housing assembly 10, the touch layer 2 and the motherboard 20 Signals are transmitted between them, so that the main board 20 controls the electronic device 100 to respond according to the control signal corresponding to the operation gesture.

Thus, by providing the touch layer 2 on the inner surface of the substrate 1, and at the same time, the touch layer 2 is electrically connected to the motherboard 20 of the electronic device 100, so that the touch function of the housing assembly 10 can be realized, and the performance of the housing assembly 10 is improved. Functionality, users can use user-defined functions without entering the interface of the electronic device 100, avoiding cumbersome unlocking, and it can also help to cancel some physical buttons, realize the full-screen design of the electronic device 100, and improve User experience and ease of use.

The substrate 1 is a transparent member, for example, the substrate 1 may be a resin member or a glass member. When the substrate 1 is a resin part, the substrate 1 can be made of PMMA (polymethyl methacrylate)/PC (Polycarbonate, polycarbonate) composite sheet, and the substrate 1 can also be made of PC/PET (polyethylene terephthalate, Polyethylene terephthalate) composite sheet, the substrate 1 can be made of PET sheet, the substrate 1 can also be made of PI (polyimide) material or COP (Cyclo Olefin Polymer, cycloolefin polymer) material production. The PET material has good tensile properties and good permeability. Therefore, when the substrate 1 has a 3D shape, the material of the substrate 1 can optionally be PET.

The decoration layer 10a is provided on the side surface of the touch layer 2 away from the substrate 1, thereby helping to improve the appearance effect of the housing assembly 10 and improve the user experience. Moreover, the substrate 1 is a transparent part, and the substrate 1 does not shield the decoration layer 10a, and the user can observe the effect of the decoration layer from the outer surface of the substrate 1.

According to the housing assembly 10 of the embodiment of the present application, the touch layer 2 is provided on the inner surface of the substrate 1, and the touch layer 2 is electrically connected to the main board 20 of the electronic device 100, thereby realizing the touch function of the housing assembly 10 , The functionality of the housing assembly 10 is improved, and the user can use user-defined functions without entering the interface of the electronic device 100, avoiding cumbersome unlocking, and it can also help cancel some physical buttons to realize the electronic device 100 The full-screen design is conducive to improving user experience and ease of use.

In some optional embodiments of the present application, as shown in FIG. 3, the decoration layer 10 a includes: a carrier sheet 3, a texture layer 4, a color layer 5 and a base color layer 6. Specifically, the carrier sheet 3 is a transparent piece, and the carrier sheet 3 may be a PC film, a PET film, a TPU (Thermoplastic Polyurethanes, thermoplastic polyurethane elastomer rubber) film, or the like.

The slide 3 includes a first surface and a second surface that are arranged oppositely. The second surface is connected to the touch layer 2, and the texture layer 4 is provided on the first surface of the slide 3. The texture layer 4 can realize the texture of the housing assembly 10 Effect, the color layer 5 is set on the surface of the texture layer 4 facing away from the slide 3. The color layer 5 can achieve the color effect of the housing assembly 10, and the base color layer 6 is set on the side of the color layer 5 facing away from the slide 3. On the surface, the base color layer 6 can be a cover ink to prevent the slide 3 from transmitting light.

Optionally, the texture layer 4 may have light transmittance, for example, the texture layer 4 is transparent, so that the color layer 5 can be easily observed.

Thus, by arranging the texture layer 4, the color layer 5 and the base color layer 6 on the carrier sheet 3, and then connecting the carrier sheet 3 to the touch layer 2, the carrier sheet 3 has a thinner thickness. Better processing advantages and yield. In addition, the processing of the slide 3 (for example, the texture layer 4, the color layer 5, etc. are sequentially formed on the slide 3) and the processing of the substrate 1 (for example, the touch layer 2 is formed on the substrate 1, etc.) can be performed simultaneously, which can improve The production efficiency of the housing assembly 10.

Since PET has the advantages of good tensile properties, good permeability, and low price, and since the carrier sheet 3 needs to be provided with a texture layer 4, optionally, the carrier sheet 3 is made of PET material.

Optionally, the thickness of the slide 3 may range from 0.05 mm to 0.4 mm. Therefore, by setting the thickness of the carrier sheet 3 within the above range, the carrier sheet 3 can have a structural strength that meets the requirements, and at the same time, the overall thickness of the housing assembly 10 can be made smaller, which is beneficial to the lightness and thinness of the whole machine.

Optionally, the thickness of the texture layer 4 may be 12um-18um. As a result, the housing assembly 10 can have a better texture effect, and the overall thickness of the housing assembly 10 can be made smaller. Optionally, the texture layer 4 can be formed on the carrier sheet 3 using a UV transfer process and a transfer device. The texture layer 4 can be formed of colorless UV ink, and the texture layer 4 can also be formed of colored UV ink. Ink formation.

Optionally, the thickness of the color layer 5 may be 150 nm-350 nm. Therefore, the housing assembly 10 can have a better color effect, and the overall thickness of the housing assembly 10 can be made smaller. The color layer 5 can achieve a single color or a gradient color effect.

For example, the color layer 5 may be a colored ink layer.

For another example, the color layer 5 may also be a coating layer. Optionally, the color layer 5 may be a metal oxide with high and low refractive index or other non-conductive coating. For example, the coating layer may include at least one of TiO2 layer, NbO2 layer, Nb2O3 layer, Nb2O2 layer, Nb2O5 layer, SiO2 layer and ZrO2 layer. The coating layer can be a single-layer structure or a multilayer structure. When the coating layer is a single layer structure, the coating layer can be one of TiO2 layer, NbO2 layer, Nb2O3 layer, Nb2O2 layer, Nb2O5 layer, SiO2 layer and ZrO2 layer. When the coating layer is a multilayer structure, the coating layer may include at least two of TiO2 layer, NbO2 layer, Nb2O3 layer, Nb2O2 layer, Nb2O5 layer, SiO2 layer and ZrO2 layer. It is understandable that different film thicknesses also affect the color effect.

In some optional embodiments of the present application, the thickness of the base color layer 6 is 20 um-30 um. As a result, the base color layer 6 can have a good light leakage prevention effect and prevent the carrier sheet 3 from transmitting light.

In order to obtain a better light leakage prevention effect, the base color layer 6 can be processed by multiple printing and curing methods. Specifically, for example, the base color layer 6 may include multiple sub-base color layers 6, that is, the first sub-base color. From layer 6 to the N-th base color layer 6, a first sub-base color layer 6 can be printed on the color layer 5. After the first sub-base color layer 6 is cured, then the first sub-base color layer 6 is printed The two sub-base color layers 6 are cured, and so on. Optionally, the thickness of each sub-base color layer 6 is 5-8 microns.

In some optional embodiments of the present application, the second surface and the touch layer 2 are connected by an adhesive. Specifically, for example, the second surface can be pasted into the touch layer 2 through a UV adhesive, so that the connection is reliable, the cost is low, and the processing is convenient.

The electronic device 100 according to an embodiment of the present application is described below with reference to the accompanying drawings.

4, the electronic device 100 according to the embodiment of the present application may include a main board 20 and the housing assembly 10 in the above-mentioned embodiment. Wherein, the touch layer 2 is electrically connected to the main board 20.

According to the electronic device 100 of the embodiment of the present application, by providing the above-mentioned housing assembly 10, the touch function of the housing assembly 10 can be realized, and the functionality of the housing assembly 10 can be improved. The user can enter the interface of the electronic device 100 without entering In the case of using user-defined functions to avoid cumbersome unlocking, it can also facilitate the cancellation of some physical buttons, realize the full-screen design of the electronic device 100, and improve the user experience and ease of use.

Exemplarily, the electronic device 100 of the present application may be any of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is exemplarily shown in FIG. 4). Specifically, the electronic device 100 may be a mobile phone or a smart phone (for example, a phone based on iPhoneTM, AndroidTM), a portable game device (for example, Nintendo DSTM, PlayStationPortableTM, Gameboy AdvanceTM, iPhoneTM), a laptop Type computers, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices, such as watches, earphones, pendants, headsets, etc. The electronic device 100 can also be other wearable devices (for example, Head-mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos or smart watches).

The processing method of the housing assembly 10 of the electronic device 100 according to the embodiment of the present application is described below.

Referring to FIG. 1, the processing method of the housing assembly 10 of the electronic device 100 according to the embodiment of the present application includes the following steps:

A substrate 1 is provided. The substrate 1 includes opposite outer and inner surfaces. The inner surface includes a first area 11 and a second area 12. The position indicated by the dotted line in FIG. 1 divides the inner surface into a first area 11 and a second area. Area 12. Specifically, the inner surface of the substrate 1 refers to the surface facing the inside of the electronic device 100, and the outer surface of the substrate 1 is the exterior surface.

A conductive material is coated on the inner surface of the substrate 1 to form a conductive material layer 300. As shown in FIG. 1, the conductive material layer 300 covers the first region 11 and the second region 12. Optionally, the conductive material may be nano-silver or ITO (Indium Tin Oxides). Specifically, the substrate 1 may be formed into a 3D shape to make the housing assembly 10 present a 3D shape, such as a small-angle 3D shape, and the substrate 1 may also be formed into a 2.5D shape to make the housing assembly 10 present a 2.5 shape; when the substrate 1 is formed as In 3D, in order to make the conductive material and the substrate 1 better fit, the conductive material needs to have a certain degree of toughness and stretchability, so the conductive material is selected as nano silver.

A photoresist is coated on the surface of the conductive material layer 300 away from the substrate 1 to form the photoresist layer 400. Specifically, the photoresist can be a positive photoresist or a negative photoresist. The part of the positive photoresist irradiated with light will dissolve in the photoresist developer, while the part that is not irradiated will not dissolve. For the photoresist developer, the part of the negative photoresist that is exposed to light will not dissolve in the photoresist developer, and the part that is not illuminated will dissolve in the photoresist developer.

The photoresist layer 400 is shielded by a mask 200 including a light-transmitting portion 201 and a non-light-transmitting portion 202, wherein one of the light-transmitting portion 201 and the non-light-transmitting portion 202 corresponds to the first region 11 and is transparent The other of the portion 201 and the non-transmissive portion 202 corresponds to the second area 12. Specifically, as shown in FIG. 1, the photomask 200 includes a light-transmitting portion 201 and a non-light-transmitting portion 202. When the light irradiates the photomask 200, the light (arrow M in FIG. 1 indicates the light) can pass from the light-transmitting portion 201 passes through but cannot pass through the non-transmissive part 202. For example, the photomask 200 includes a solid part and a hollow part. The hollow part allows light to pass through, but the solid part cannot pass through the light.

The photoresist layer 400 is exposed to light to remove the portion of the photoresist layer 400 corresponding to the first region 11, that is, light is emitted from the side of the photomask 200 away from the photoresist layer 400 (as shown by the arrow in FIG. 1 M), a part of the light can pass through the light-transmitting part 201 to illuminate the part of the photoresist layer 400 corresponding to the light-transmitting part 201, and the other part of the light cannot pass through the non-light-transmitting part 202, thereby achieving the purpose of development. Specifically, when the photoresist is a positive photoresist, the first area 11 corresponds to the light-transmitting part 201, and the second area 12 corresponds to the non-light-transmitting part 202. At this time, light can pass through the light-transmitting part 201 and be projected to The part of the photoresist layer 400 corresponding to the first region 11 is dissolved in the developer and removed, while the part of the photoresist layer 400 corresponding to the second region 12 still exists; when the photoresist is negative light When blocking, the first area 11 corresponds to the non-transmissive portion 202, and the second area 12 corresponds to the transparent portion 201. At this time, light can pass through the transparent portion 201 and project to the second area of the photoresist layer 400. The part corresponding to 12 does not dissolve in the developer solution but still exists, while the part of the photoresist layer 400 corresponding to the first region 11 is dissolved in the developer solution and removed.

The portion of the conductive material layer 300 corresponding to the first region 11 is removed to form the touch layer 2. Specifically, as shown in FIG. 1, when the portion of the photoresist layer 400 corresponding to the first region 11 is removed, the portion of the conductive material layer 300 corresponding to the first region 11 can be easily exposed, thereby exposing the conductive material layer. The part of 300 corresponding to the first area 11 is removed so that the remaining part of the conductive material layer 300 forms the touch layer 2. It can be understood that the touch layer 2 is at this time on the photoresist layer 400 corresponding to the second area 12 The state of partial coverage. For example, an etching solution is used to remove the portion of the conductive material layer 300 corresponding to the first region 11, that is, the portion not protected by the photoresist layer 400.

The remaining part of the photoresist layer 400 covering the touch layer 2 is removed to expose the touch layer 2. For example, the remaining part of the photoresist layer 400 covering the touch layer 2 is removed by a peeling liquid to expose the touch layer 2. Optionally, the stripping liquid is sodium bicarbonate or potassium hydroxide. It should be noted that the shape of the touch layer 2 is related to the shape of the photomask 200. The drawing of the touch layer 2 can be designed according to actual needs, and then the photomask 200 can be prepared according to the drawings, so as to finally obtain the required touch layer 2 . Thus, by providing the touch layer 2 on the inner surface of the substrate 1, the touch function of the housing assembly 10 can be realized, and the functionality of the housing assembly 10 can be improved. The user can access the interface of the electronic device 100 without needing to The use of user-defined functions avoids cumbersome unlocking, and can also help cancel some physical buttons, realize the full-screen design of the electronic device 100, and help improve the user's experience and ease of use.

Specifically, when the housing assembly 10 is used on the electronic device 100, the touch layer 2 is suitable for electrically connecting with the main board 20 of the electronic device 100. By setting the touch layer 2 on the inner surface of the substrate 1, using capacitive touch technology, when a finger touches the housing assembly 10, the current induction of the human body can be used to work. Due to the human body electric field, the user and the surface of the housing assembly 10 A coupling capacitor is formed. For high-frequency current, the capacitor is a direct conductor, so the finger draws a small current from the contact point. At the same time, since the touch layer 2 is electrically connected to the main board 20, the main board 20 calculates the touch Point or path, therefore, touch operation signals such as the user's tapping, sliding or drawing corresponding graphics on the housing assembly 10 can be fed back to the main board 20, so that the main board 20 can control the electronic device 100 to respond according to corresponding operation gestures. For example, a variety of control signals are preset on the motherboard 20, and different control signals correspond to different operation gestures. When the user operates a certain operation gesture on the housing assembly 10, the touch layer 2 and the motherboard 20 Signals are transmitted between them, so that the main board 20 controls the electronic device 100 to respond according to the control signal corresponding to the operation gesture.

Specifically, for example, the response relationship between the operation gesture and the electronic device 100 may be as shown in the following table:

操作手势Operation gesture	响应response
∨型∨ type	拍照Take pictures
○型○ type	录音recording
×型× type	进入会议模式Enter meeting mode
横向滑动Lateral sliding	照明illumination
竖向滑动Vertical sliding	MARK地点MARK location
侧边A区域长按Long press on side A area	音量加Volume up
侧边B区域长按Long press on side B area	音量减Volume down
侧边双触Side double touch	唤醒，锁屏，挂电话Wake up, lock screen, hang up

According to the processing method of the housing assembly 10 of the electronic device 100 according to the embodiment of the present application, the touch layer 2 is provided on the inner surface of the substrate 1, and at the same time the touch layer 2 is electrically connected to the main board 20 of the electronic device 100, so as to realize the housing The touch function of the body assembly 10 improves the functionality of the housing assembly 10. The user can use user-defined functions without entering the interface of the electronic device 100, avoiding cumbersome unlocking, and is also beneficial to partially Canceling the button realizes the full-screen design of the electronic device 100, which is beneficial to improve the user's use experience and use convenience.

In some optional embodiments of the present application, the substrate 1 is a transparent piece, and the processing method of the cover further includes the following steps: providing a transparent carrier 3, forming a color layer 5 on the first surface of the carrier 3, and the color layer 5 The color effect of the housing assembly 10 can be realized. A base color layer 6 is formed on the surface of the color layer 5 facing away from the carrier 3. The base color layer 6 can be a cover ink to prevent the carrier 3 from transmitting light. The second surface of the slide 3 of the color layer 5 and the base color layer 6 is connected to the exposed touch layer 2. Therefore, on the basis of realizing the touch function of the housing assembly 10, the appearance of the housing assembly 10 can also be improved, and the user experience can be improved.

According to some embodiments of the present application, as shown in FIG. 2, the processing method of the housing assembly 10 further includes the following steps: providing a transparent carrier sheet 3, transferring a texture layer 4 on the first surface of the carrier sheet 3, The color layer 5 is provided on the surface of the layer 4 on the side away from the slide 3. The color layer 5 can realize the color effect of the housing assembly 10. The color layer 5 is formed on the surface of the color layer 5 facing away from the slide 3. The layer 6 can be a cover ink to prevent the slide 3 from transmitting light, and connect the second surface of the slide 3 formed with the color layer 5, the texture layer 4 and the ground color layer 6 to the exposed touch layer 2. Therefore, on the basis of realizing the touch function of the housing assembly 10, the appearance of the housing assembly 10 can also be improved, and the user experience can be improved.

In addition, by arranging the texture layer 4, the color layer 5 and the base color layer 6 on the carrier sheet 3, and then connecting the carrier sheet 3 to the touch layer 2, the carrier sheet 3 has a thinner thickness. Good processing advantage and yield. In addition, the processing of the slide 3 (for example, the texture layer 4, the color layer 5, etc. are sequentially formed on the slide 3) and the processing of the substrate 1 (for example, the touch layer 2 is formed on the substrate 1, etc.) can be performed simultaneously, which can improve The production efficiency of the housing assembly 10.

Specifically, in order to improve the protective effect on the slide 3, the outer surface of the slide 3 generally has a protective film. Before the texture layer 4 is transferred on the first surface of the slide 3, the protective film needs to be torn off. The film will generate static electricity, causing dust particles to be adsorbed on the slide 3, so the slide 3 needs to be electrostatically removed. In other words, before processing the texture layer 4 on the first surface of the slide 3, the slide 3 needs to be subjected to film tearing and electrostatic dust removal in sequence.

In some optional embodiments of the present application, the color layer 5 may be formed on the first surface of the carrier 3 by using magnetron sputtering or evaporation plating. Therefore, the processing method is simple and the efficiency is high.

The processing method of the housing assembly 10 according to an embodiment of the present application will be described in detail below with reference to FIGS. 1 and 2.

As shown in Figures 1 and 2, the processing method of the housing assembly 10 includes the following steps:

S1: Provide substrate 1.

S2: Coating a conductive material on the inner surface of the substrate 1 to form a conductive material layer 300. The conductive material may be nano silver.

S3: Coating a photoresist on the surface of the conductive material on the side away from the substrate 1 to form a photoresist layer 400. The photoresist may be a positive photoresist.

S4: Use the photomask 200 to block the photoresist layer 400, wherein the light-transmitting portion 201 of the photomask 200 corresponds to the first region 11, and the non-light-transmitting portion 202 of the photomask 200 corresponds to the second region 12.

S5: Expose the photoresist layer 400 to remove the part of the photoresist layer 400 corresponding to the first area 11, specifically, light can pass through the light-transmitting portion 201 and be projected to the photoresist layer 400 and the first area 11 The corresponding part is dissolved in the developer and removed, but the part of the photoresist layer 400 corresponding to the second region 12 still exists.

S6: Remove the portion of the conductive material layer 300 corresponding to the first area 11 to form the touch control layer 2. Specifically, an etching solution is used to remove the portion of the conductive material layer 300 corresponding to the first region 11.

S7: Remove the remaining part of the photoresist layer 400 covering the touch layer 2 to expose the touch layer 2. For example, the remaining part of the photoresist layer 400 covering the touch layer 2 is removed by a peeling liquid to expose the touch layer 2.

A1: Provide a transparent slide 3.

A2: The texture layer 4 is transferred to the first surface of the slide 3 and the texture layer 4 is cured.

A3: A color layer 5 is formed on the surface of the texture layer 4 away from the slide 3, and the color layer 5 can achieve the color effect of the housing assembly 10.

A4: The base color layer 6 is silk-printed on the surface of the color layer 5 facing away from the slide 3, and the base color layer 6 can be a cover ink.

S8: Connect the second surface of the carrier sheet 3 on which the color layer 5, the texture layer 4 and the base color layer 6 are formed and the exposed touch layer 2 through an adhesive through a 3D bonding device. It should be noted here that steps A1-A4 can be located at any time in S1-S7, that is, A1-A4 and S1-S7 are in no particular order, as long as step A4 and step S7 are completed before step S8 .

In the description of this specification, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, “a plurality of” means at least two, for example, two, three, four, five, six, etc., unless otherwise specifically defined. Descriptions with reference to the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" etc. mean specific features described in connection with the embodiment or example , The structure, materials, or characteristics are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner.

Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and modifications can be made to these embodiments without departing from the principle and purpose of the present application. The scope of the application is defined by the claims and their equivalents.

Claims

A housing assembly of electronic equipment, characterized in that it comprises:

A substrate, the substrate has an inner surface and an outer surface that are arranged oppositely, and the substrate is a transparent piece;

A touch layer, the touch layer is provided on the inner surface of the substrate, and the touch layer is suitable for being electrically connected to the main board of the electronic device;

The decoration layer is provided on a surface of the touch layer that is away from the substrate.
The housing assembly of an electronic device according to claim 1, wherein the decorative layer comprises:

A transparent slide, the slide includes a first surface and a second surface opposed to each other, and the second surface is connected to the touch layer;

A texture layer, the texture layer is provided on the first surface;

A color layer, the color layer is provided on a surface of the texture layer that faces away from the slide;

The base color layer is provided on the surface of the color layer on the side facing away from the slide.
The housing assembly of an electronic device according to claim 2, wherein the second surface and the touch layer are connected by an adhesive.
The housing assembly of an electronic device according to claim 2, wherein the thickness of the texture layer is 12 μm-18 μm.
The housing assembly of an electronic device according to claim 2, wherein the thickness of the color layer is 150nm-350nm.
The housing assembly of an electronic device according to claim 2, wherein the thickness of the base color layer is 20um-30um.
An electronic device, characterized in that it comprises:

Motherboard

The housing assembly according to any one of claims 1 to 6, wherein the touch control layer is electrically connected to the main board.
A processing method of a housing assembly of an electronic device, characterized in that it comprises the following steps:

Providing a substrate, the substrate comprising opposite outer and inner surfaces, the inner surface comprising a first area and a second area;

Coating a conductive material on the inner surface of the substrate to form a conductive material layer;

Coating a photoresist on the surface of the conductive material layer that is away from the substrate to form a photoresist layer;

The photoresist layer is shielded by a photomask including a light-transmitting portion and a non-light-transmitting portion, wherein one of the light-transmitting portion and the non-light-transmitting portion corresponds to the first region, and the light-transmitting portion And the other one of the non-transparent parts corresponds to the second region;

Exposing the photoresist layer to remove a part of the photoresist layer corresponding to the first region;

Removing a portion of the conductive material layer corresponding to the first area to form a touch control layer;

The remaining part of the photoresist layer covering the touch layer is removed to expose the touch layer.
The method for processing a housing assembly of an electronic device according to claim 8, wherein the substrate is a transparent piece,

The processing method also includes the following steps:

Providing a transparent slide, the slide including a first surface and a second surface opposed to each other;

Forming a color layer on the first surface of the slide;

Forming a base color layer on the surface of the color layer on the side facing away from the slide;

The second surface of the carrier sheet on which the color layer and the base color layer are formed is connected to the exposed touch layer.
9. The method for processing a housing assembly of an electronic device according to claim 9, further comprising the following steps:

A texture layer is transferred between the first surface of the slide and the color layer.
10. The method for processing a housing assembly of an electronic device according to claim 10, wherein the carrier sheet is subjected to electrostatic dust removal treatment before transferring the texture layer.
9. The method for processing a housing assembly of an electronic device according to claim 9, wherein the color layer is formed on the first surface of the carrier sheet by magnetron sputtering or evaporation plating.
The method for processing a housing assembly of an electronic device according to any one of claims 8-12, wherein an etching solution is used to remove a portion of the conductive material layer corresponding to the first region.
The method for processing a housing assembly of an electronic device according to any one of claims 8-13, wherein the remaining part of the photoresist layer is removed by a stripping liquid.
The method for processing a housing assembly of an electronic device according to any one of claims 8-14, wherein the conductive material is nano silver or indium tin oxide.