WO2020244029A1

WO2020244029A1 - Led display structure

Info

Publication number: WO2020244029A1
Application number: PCT/CN2019/096294
Authority: WO
Inventors: 龚文; 邵鹏睿; 张雨晨
Original assignee: 深圳市晶台股份有限公司
Priority date: 2019-06-05
Filing date: 2019-07-17
Publication date: 2020-12-10
Also published as: TWM591708U; KR20200141020A; CN209747512U

Abstract

The invention relates to the technical field of semiconductor light-emitting devices, and particularly relates to an LED display structure comprising a substrate. A pad is provided on the substrate. An LED integrated chip is provided on the pad, and includes several independently controlled light-emitting dots. An electrode of the LED integrated chip is connected to a circuit of the substrate by means of a bonding wire. A quantum dot layer is provided on the top of each light-emitting dot, a filter layer is provided on the top of the quantum dot layer, and a light-emitting unit consisting of the light-emitting dot, the quantum dot layer, and the filter layer is encapsulated by means of a packaging adhesive. The use of the integrated LED chip can greatly reduce the chip size. Since only one chip having multiple independently controlled light-emitting dots is required, the pitch of the LED display can be effectively reduced, and the display density and the display quality can be improved.

Description

An LED display structure

Technical field

The utility model relates to the technical field of semiconductor light emitting devices, in particular to an LED display structure.

Background technique

With the continuous enrichment of LED application scenarios, people have higher and higher requirements for the performance and size of LEDs, and LED display devices are constantly developing in the direction of high density and high resolution. The chip size is a key technical problem to solve the size miniaturization. With existing chips, when designing lamp beads or display devices, it is necessary to reserve the positions of the three chips and the reserved chip spacing to avoid the accuracy of the die-bonding machine. It is difficult to continue to reduce the size significantly.

Utility model content

The utility model can greatly reduce the chip size by using the integrated LED chip. Only one chip is needed, and the chip has multiple independently controlled light-emitting points, which can effectively reduce the LED display pitch, increase the display density, and improve the display quality.

The technical scheme of the utility model is:

An LED display structure includes a substrate, the substrate is provided with a pad, an LED integrated chip is arranged on the pad, the LED integrated chip includes a plurality of independently controlled light-emitting points, and the electrodes of the LED integrated chip The circuit of the substrate is conducted through the bonding wire, the top of the light-emitting dot is provided with a quantum dot layer, and the top of the quantum dot layer is provided with a filter layer. The light-emitting dot and the quantum dot layer And the light-emitting unit composed of the filter layer is packaged.

The substrate contains multiple light-emitting units, and each light-emitting unit is equipped with an LED integrated chip. An LED integrated chip contains multiple light-emitting points, which reduces the distance of LED display. At the same time, quantum dots are sprayed on the light-emitting points on the chip. The quantum dot layer is used to obtain light of different colors. A filter layer is set on the outside of the quantum dot layer to absorb the light of the excitation light source band to improve the quality of the light source and display quality. Finally, an encapsulant is molded externally for chips and quantum The dots and internal circuits provide an application environment for isolating water and oxygen and realize high-density LED display.

Further, the LED integrated chip includes a front-mounted chip, a flip-chip or a vertical chip.

Further, the LED integrated chip has a common pole or non-common pole structure.

Further, the distance between the plurality of light-emitting points is 2-50um.

Preferably, the distance between the several light-emitting points is 26um.

The distance between multiple light-emitting points on the same LED integrated chip is set reasonably, and the distance is set to 2-50um, which is very small. However, the existing LED light uses a single chip and a single light-emitting point, which is compared with LED integrated chips. Not only is there two more chips, but also a spacing to solve the die-bonding error is required. Therefore, this design greatly reduces the display spacing between the LEDs to make the light more dense. At the same time, the spacing is optimally set to 26um to avoid neighboring The luminous range between the two luminous points of the luminescent point covers each other, ensuring that the luminous range is fully utilized to the greatest extent while maintaining close contact with a very small distance, saving design costs and optimizing the luminous effect.

Further, the substrate includes a cup-bowl type substrate, a flat-plate type array light-emitting unit substrate, a multilayer circuit substrate, and a multilayer circuit array light-emitting unit substrate with a driving IC.

Further, the filter layer includes a filter film. The outside of the quantum dot layer is covered with a commercially available filter film, and the light-emitting points of different colors cover the filter film of different colors.

Description of the drawings

Figure 1 is a schematic diagram of the structure of the utility model;

Fig. 2 is a schematic top view of the application of a common-polar form factor chip in the utility model;

Fig. 3 is a schematic top view of the application of a non-common electrode type formal chip in the utility model;

Figure 4 is a schematic top view of the vertical chip applied to the utility model;

Figure 5 is a schematic top view of flip-chip applications in the present utility model;

In the picture: 1-substrate, 2-LED integrated chip, 3-light-emitting point, 4-quantum dot layer, 5-filter layer, 6-encapsulation glue, 7-common-polar formal mounting chip, 8-non-common-polar formal mounting Chip, 9-vertical chip, 10-flip chip.

Detailed ways

The attached drawings are only for illustrative purposes and cannot be understood as a limitation of this patent; in order to better illustrate this embodiment, some parts of the attached drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; It is understandable for the personnel that some well-known structures in the drawings and their descriptions may be omitted. The positional relationship described in the drawings is only for illustrative purposes and cannot be understood as a limitation of the patent.

Example 1:

As shown in Figure 1, an LED display structure includes a substrate 1 with a circuit, the substrate 1 is provided with a pad, and an LED integrated chip 2 is fixed on the pad by die-bonding glue. The LED integrated chip 2 contains 3 independent controls. The light-emitting points 3 are red, green, and blue light-emitting points 3 respectively. The electrodes of the LED integrated chip 2 are connected to the circuit of the substrate 1 through the bonding wire, and the top of each light-emitting point 3 is sprayed with different colors The quantum dots form the corresponding red light quantum dot layer, green light quantum dot layer and blue light quantum dot layer to obtain light of different colors. The top of each quantum dot layer 4 is covered with a filter layer 5 of corresponding color. Including commercially available filter films, and finally encapsulating the light-emitting unit composed of light-emitting dots 3, quantum dot layer 4 and filter layer 5 with encapsulating glue 6, to provide an application environment for isolating water and oxygen for chips, quantum dots and internal circuits. Realize LED high-density display.

The substrate 1 contains multiple light-emitting units, and each light-emitting unit is equipped with an LED integrated chip 2. One LED integrated chip 2 contains multiple light-emitting points 3, and at the same time, quantum dots are sprayed on the light-emitting points 3 on the chip to form quantum dots. Layer 4 to obtain light of different colors. A filter layer 5 is provided on the outside of the quantum dot layer 4 to absorb the light of the excitation light source and improve the quality of the light source and display quality. Finally, an encapsulant 6 is molded on the outside as a chip , Quantum dots and internal circuits provide an application environment for isolating water and oxygen, realizing high-density LED display.

In this embodiment, the distance between multiple light-emitting points 3 on the same LED integrated chip 2 is set reasonably, and the distance is set to 2-50um, which is very small. However, the existing LED light uses a single chip with a single light-emitting point. Compared with the LED integrated chip, it not only has two more chips, but also needs to reserve a distance to solve the die-bonding error. Therefore, the design greatly reduces the display distance between the LEDs and makes the light emission more dense. The optimal setting is 26um to avoid the light-emitting range between the two adjacent light-emitting points 3 from covering each other, to ensure that the light-emitting range is fully utilized to the maximum extent while maintaining close contact with extremely small spacing, saving design costs and optimizing the light-emitting effect.

In this embodiment, the quantum dot layer 4 is divided into a red light quantum dot layer, a green light quantum dot layer, and a blue light quantum dot layer. The red light quantum dot layer is mixed with light that can be excited by the light emitted by the LED integrated chip to produce a wavelength of 615-680nm. The light red light quantum dot material is silica gel or epoxy glue, the green light quantum dot layer is mixed with the green light quantum dot material that can be excited by the light emitted by the LED integrated chip to produce green light with a wavelength of 518-580nm. The quantum dot layer is silica gel or epoxy glue mixed with blue quantum dot materials that can be excited by the light emitted by the LED integrated chip to produce blue light with a wavelength of 420-480 nm.

In this embodiment, the substrate 1 includes a cup-bowl type substrate, a flat-plate type substrate, a multilayer circuit array light-emitting unit substrate, and a multilayer circuit array light-emitting unit substrate with a driver IC.

In this embodiment, the LED integrated chip 2 includes a face-mounted chip, a flip-chip or a vertical chip, and the LED integrated chip has a common pole or non-common pole structure.

Example 2:

As shown in FIG. 2, this embodiment is similar to Embodiment 1, except that the LED integrated chip adopts the common-polar form chip 7 for display application. It can be seen that the three light-emitting elements of the common-pole form Each point is provided with a cathode electrode and shares an anode electrode. The three cathode electrodes and one anode electrode are all connected to the circuit pins of the substrate 1 through bonding wires.

Example 3:

As shown in Fig. 3, this embodiment is similar to embodiment 1, except that the LED integrated chip adopts non-common-polar formal mounting chip 8 for display application. It can be seen that three of the non-common-polar formal mounting chip 8 Each light-emitting point is provided with a cathode electrode and an anode electrode, and the three cathode electrodes and the three anode electrodes are all connected to the circuit pins of the substrate 1 through bonding wires.

Example 4:

As shown in Fig. 4, this embodiment is similar to embodiment 1, except that the LED integrated chip adopts a vertical chip 9 for display applications. It can be seen that each of the three light-emitting points of the vertical chip 9 is provided with one The bottom of the cathode electrode is made of a metal material as the anode electrode and the circuit pad is welded, and the cathode electrode is connected to the circuit pin of the substrate 1 through the bonding wire.

Example 5:

As shown in FIG. 5, the LED integrated chip adopts the flip chip 10 for display applications. The flip chip 10 includes a common pole type and a non-common pole type. Among them, the common pole type flip chip is the same as the common pole type in the second embodiment. The structural sequence of the front-mounted chip 7 is reversed, and the structural sequence of the non-common-polarized flip-chip 8 in the embodiment 3 is reversed. When a common-polarized flip-chip or a non-common-polarized flip-chip is installed , Both the cathode and anode electrodes are connected to the pads of the substrate 1 by soldering, so that the electrode and the circuit connection of the substrate 1 are connected. Because the common or non-common flip chip is installed, both electrodes It is in direct solder contact with the substrate 1, and its top surface has the same structure. Therefore, when a common pole flip chip or a non-common pole flip chip is mounted on the substrate 1, the top view is the same, that is, as shown in Figure 5, either It shows a top view of a common pole flip chip applied on the substrate 1, and may also show a top view of a non-common pole flip chip applied on the substrate 1.

Obviously, the above-mentioned embodiments of the present utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. It is unnecessary and impossible to list all implementation methods here. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model shall be included in the protection scope of the claims of the utility model.

Claims

An LED display structure, characterized in that it comprises a substrate, the substrate is provided with a pad, the pad is provided with an LED integrated chip, the LED integrated chip includes a plurality of independently controlled light-emitting points, the LED The electrodes of the integrated chip are connected to the circuit of the substrate through bonding wires, a quantum dot layer is provided on the top of the light-emitting point, and a filter layer is provided on the top of the quantum dot layer. The light-emitting point is The light emitting unit composed of the quantum dot layer and the filter layer is packaged.
The LED display structure of claim 1, wherein the LED integrated chip includes a face-mounted chip, a flip-chip or a vertical chip.
The LED display structure of claim 1, wherein the LED integrated chip has a common pole or non-common pole structure.
The LED display structure according to claim 1, wherein the distance between the plurality of light-emitting points is 2-50um.
An LED display structure according to claim 4, wherein the distance between the plurality of light-emitting points is 26um.
The LED display structure according to claim 1, wherein the substrate includes a cup-bowl type substrate, a flat-plate type substrate, a multilayer circuit array light-emitting unit substrate, and a multilayer circuit array light-emitting unit substrate with a driver IC.
The LED display structure of claim 1, wherein the filter layer comprises a filter film.