WO2020241219A1 - Substrate structure - Google Patents

Substrate structure Download PDF

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Publication number
WO2020241219A1
WO2020241219A1 PCT/JP2020/018790 JP2020018790W WO2020241219A1 WO 2020241219 A1 WO2020241219 A1 WO 2020241219A1 JP 2020018790 W JP2020018790 W JP 2020018790W WO 2020241219 A1 WO2020241219 A1 WO 2020241219A1
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WO
WIPO (PCT)
Prior art keywords
sheet
wiring member
shaped wiring
base substrate
terminal
Prior art date
Application number
PCT/JP2020/018790
Other languages
French (fr)
Japanese (ja)
Inventor
俊悟 平谷
奥見　慎祐
有延 中村
原口　章
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2020241219A1 publication Critical patent/WO2020241219A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • This disclosure relates to a substrate structure.
  • Patent Document 1 discloses a circuit configuration including a plurality of bus bars, a semiconductor switching element, and a control circuit board.
  • a metal bus bar component plate having a shape in which a plurality of bus bars are connected to each other is formed, and a control circuit board is adhered to the bus bar component plate.
  • Patent Document 2 discloses an electrical junction box including a pair of bus bars and a blocking unit mounted on the pair of bus bars to energize and shut off the pair of bus bars.
  • a pair of bus bars are arranged in parallel, and an FPC is attached on the bus bars. In this state, the power semiconductor is mounted on the bus bar and FPC.
  • the element may be mounted on the bus bar in a state of being fixed to both the bus bar and the sheet-shaped wiring member. In such a case, it is required to suppress the mounting defect of the element.
  • the purpose of this disclosure is to suppress mounting defects of the element.
  • the substrate structure of the present disclosure includes a base substrate including a plurality of conductive plates and an insulating portion, an element mounted on the main surface of the base substrate, and a sheet-shaped wiring member including a conductor, and the insulation is provided.
  • the section holds the plurality of conductive plates along the same plane in a state of being interposed between the plurality of conductive plates, and the sheet-like wiring member is superposed on the main surface of the base substrate.
  • At least a part of the shape wiring member is fixed to the base substrate, the element includes a plurality of terminals, and at least one of the plurality of terminals is electrically connected to at least one of the plurality of conductive plates. It is a substrate structure which is fixed in a state of being connected to the conductor and at least one of the plurality of terminals is fixed in a state of being electrically connected to the conductor.
  • FIG. 1 is a schematic exploded perspective view showing an electrical connection box according to the first embodiment.
  • FIG. 2 is an exploded perspective view showing the substrate structure.
  • FIG. 3 is a plan view showing the substrate structure.
  • FIG. 4 is a sectional view taken along line IV-IV of FIG.
  • FIG. 5 is a sectional view taken along line VV of FIG.
  • FIG. 6 is an exploded perspective view showing an adhesive portion according to a modified example.
  • FIG. 7 is an exploded perspective view showing an adhesive portion according to another modified example.
  • FIG. 8 is a plan view showing the substrate structure according to the second embodiment.
  • FIG. 9 is a sectional view taken along line IX-IX in FIG.
  • the substrate structure of the present disclosure is as follows.
  • a base substrate including a plurality of conductive plates and an insulating portion, an element mounted on the main surface of the base substrate, and a sheet-shaped wiring member including a conductor are provided, and the insulating portion is the plurality.
  • the plurality of conductive plates are held along the same plane in a state of being interposed between the conductive plates of the above, and at least the sheet-like wiring members are superposed on the main surface of the base substrate.
  • the element has a plurality of terminals, and at least one of the plurality of terminals is electrically connected to at least one of the plurality of conductive plates.
  • at least a part of the sheet-shaped wiring member is fixed to the base substrate in a state where the sheet-shaped wiring member is overlapped with the main surface of the base substrate. Therefore, when each terminal of the element is fixed to at least one of the plurality of conductive plates in a state of being electrically connected to the conductor, the element and the sheet-shaped wiring member are displaced from each other. Is unlikely to occur. As a result, mounting defects of the element are suppressed.
  • the element includes a first terminal, a second terminal, and a control terminal as the plurality of terminals, and energizes between the first terminal and the second terminal in response to a control signal to the control terminal. And a switching element that shuts off, and is fixed in a state where at least one of the first terminal, the second terminal, and the control terminal is electrically connected to one of the plurality of conductive plates. At least one of the first terminal, the second terminal, and the control terminal may be fixed in a state of being connected to the conductor. As a result, when the switching element is mounted on the base substrate, mounting defects are suppressed.
  • the sheet-shaped wiring member may be fixed to the base substrate in a pair of side regions facing each other with the elements arranged between them.
  • the sheet-shaped wiring member is fixed to the base substrate in an area effective for suppressing the misalignment between the sheet-shaped wiring member and the element.
  • the sheet-shaped wiring member may be fixed to the base substrate in a region surrounding the element.
  • the sheet-shaped wiring member is fixed to the base substrate in an area effective for suppressing the misalignment between the sheet-shaped wiring member and the element.
  • the sheet-shaped wiring member may be fixed to the base substrate via an adhesive portion that spreads in a plane shape.
  • the sheet-shaped wiring member is firmly fixed to the base substrate.
  • the element includes a plurality of elements, the sheet-shaped wiring member is fixed to the base substrate via a sheet-shaped adhesive portion, and the sheet-shaped adhesive portion collectively surrounds the plurality of elements. It may include an area. Even when a plurality of elements are mounted, the sheet-shaped wiring member is fixed to the base substrate in an area effective for suppressing the positional deviation between the sheet-shaped wiring member and the element. Further, the sheet-shaped adhesive portion is suitable for being provided in a region surrounding a plurality of elements together.
  • the sheet-shaped wiring member is attached to the base substrate via an adhesive in which a fixing hole is formed in the sheet-shaped wiring member and the fixing hole is filled and adhered to the base substrate. It may be fixed to.
  • the sheet-shaped wiring member is fixed to the base substrate by filling the fixing holes with the adhesive in a state where the sheet-shaped wiring member is overlapped with the base substrate. Therefore, the sheet-shaped wiring member is fixed at a position as accurate as possible with respect to the base substrate. Moreover, the fixing work is also easy.
  • the substrate structure according to the first embodiment will be described.
  • the electrical junction box 10 including the substrate structure 20 will be described as an example.
  • FIG. 1 is a schematic exploded perspective view showing the electrical connection box 10 according to the first embodiment.
  • FIG. 2 is an exploded perspective view showing the substrate structure 20.
  • FIG. 3 is a plan view showing the substrate structure 20.
  • FIG. 4 is a sectional view taken along line IV-IV of FIG.
  • FIG. 5 is a sectional view taken along line VV of FIG.
  • the thickness and the like of each part may be exaggerated in FIGS. 4 and 5.
  • the electrical junction box 10 includes a substrate structure 20, a housing 12, and a control substrate 14.
  • the housing 12 is made of resin or the like.
  • the substrate structure 20 and the control substrate 14 are housed in the housing 12.
  • the housing 12 is formed with a recess for exposing the external connection portion 33 of the substrate structure 20 to the outside.
  • the substrate structure 20 includes a base substrate 30, an element 40, and a sheet-shaped wiring member 50.
  • the base substrate 30 includes a plurality of conductive plates 32A and 32B and an insulating portion 38.
  • the element 40 is mounted on the main surface of the base substrate 30.
  • the sheet-shaped wiring member 50 is a sheet-shaped wiring member including conductors 52a and 52b.
  • the base substrate 30 includes a first conductive plate 32A and a second conductive plate 32B as a plurality of conductive plates 32A and 32B.
  • the element 40 is connected to the first conductive plate 32A and the second conductive plate 32B.
  • the current flows through the first conductive plate 32A, the element 40, and the second conductive plate 32B.
  • the direction in which the current flows may be any of the first conductive plate 32A to the second conductive plate 32B and the second conductive plate 32B to the first conductive plate 32A.
  • the control board 14 is connected to the board structure 20.
  • the control board 14 controls the operation of the board structure 20.
  • the control board 14 controls on / off of the current flowing through the board structure 20.
  • the electric junction box 10 is provided, for example, in a power supply path between a power source and various electrical components in an automobile.
  • the substrate structure 20 includes a base substrate 30, an element 40, and a sheet-shaped wiring member 50.
  • the base substrate 30 includes a first conductive plate 32A, a second conductive plate 32B, and an insulating portion 38.
  • the first conductive plate 32A and the second conductive plate 32B are members formed of a metal plate or the like.
  • the first conductive plate 32A and the second conductive plate 32B are sometimes called a bus bar.
  • the first conductive plate 32A and the second conductive plate 32B are formed in a square plate shape.
  • the first conductive plate 32A and the second conductive plate 32B function as an external path for the current flowing through the element 40.
  • the insulating portion 38 holds the first conductive plate 32A and the second conductive plate 32B along the same plane in a state of being interposed between the first conductive plate 32A and the second conductive plate 32B.
  • a straight edge portion is formed on a part of the outer periphery of the first conductive plate 32A.
  • a straight edge portion is formed on a part of the outer periphery of the second conductive plate 32B.
  • the straight edge portion of the first conductive plate 32A and the straight edge portion of the second conductive plate 32B are parallel to each other and face each other with a gap.
  • the insulating portion 38 is a portion formed of resin or the like.
  • the insulating portion 38 is a portion formed by using the first conductive plate 32A and the second conductive plate 32B as inserts.
  • the insulating portion 38 includes an insulating interposing portion 38a and an insulating holding portion 38b.
  • the insulating intervening portion 38a is provided between the straight edge portion of the first conductive plate 32A and the straight edge portion of the second conductive plate 32B.
  • the insulating interposition portion 38a keeps the first conductive plate 32A and the second conductive plate 32B in a state of being insulated as reliably as possible.
  • the insulation holding portion 38b is provided so as to surround the outer periphery of the first conductive plate 32A and the second conductive plate 32B.
  • the first conductive plate 32A and the second conductive plate 32B are held along the same plane in a state where the first conductive plate 32A and the second conductive plate 32B are surrounded by the insulating intervening portion 38a and the insulating holding portion 38b. To.
  • the insulation holding portion 38b it is not necessary for the insulation holding portion 38b to surround the entire outer circumference of the first conductive plate 32A and the second conductive plate 32B.
  • Holes 33h are formed in the first conductive plate 32A and the second conductive plate 32B.
  • the portion of the first conductive plate 32A and the second conductive plate 32B in which the hole 33h is formed functions as an external connecting portion 33 for connecting the first conductive plate 32A and the second conductive plate 32B to an external conductive path. can do.
  • the element 40 is an element connected to the first conductive plate 32A and the second conductive plate 32B.
  • the element 40 is an element suitable for the application of the electrical junction box 10.
  • a semiconductor switching element exemplified by a field effect transistor (hereinafter, also referred to as “FET”) is adopted.
  • the element 40 may be a resistor, a coil, or a capacitor.
  • the element 40 is EFT. More specifically, the element 40 is, for example, a surface mount type power MOSFET.
  • the element 40 includes an element main body 41 and a plurality of terminals 42, 43, 44.
  • the element 40 includes a first terminal 42, a second terminal 43, and a control terminal 44.
  • One of the first terminal 42 and the second terminal 43 functions as a source electrode, and the other functions as a drain electrode.
  • the first terminal 42 is a source electrode and the second terminal 43 is a drain electrode.
  • the control terminal 44 is, for example, a control terminal into which a control signal is input.
  • the element 40 energizes and shuts off between the first terminal 42 and the second terminal 43.
  • the control terminal 44 is a gate electrode.
  • the element body 41 is formed, for example, in a flat rectangular parallelepiped shape.
  • the first terminal 42 is provided so as to project from the bottom of the element main body 41 to one side.
  • the second terminal 43 and the control terminal 44 are provided so as to project from the other side of the element main body 41.
  • a plurality of second terminals 43 are provided.
  • At least one of the plurality of terminals 42, 43, 44 is fixed in a state of being electrically connected to at least one of the plurality of conductive plates 32A, 32B. Further, at least one of the plurality of terminals 42, 43, 44 is fixed in a state of being connected to the conductors 52a, 52b of the sheet-shaped wiring member 50.
  • the first terminal 42 is fixed in a state of being electrically connected to the first conductive plate 32A.
  • the second terminal 43 and the control terminal 44 are fixed in a state of being electrically connected to the conductors 52a and 52b of the sheet-shaped wiring member 50.
  • the first terminal may be fixed in a state of being electrically connected to the conductor of the sheet-shaped wiring member, and the second terminal 43 may be fixed in a state of being electrically connected to the conductive plate.
  • the control terminal may be fixed in a state of being electrically connected to the conductive plate.
  • the element main body 41 is located on the first conductive plate 32A.
  • the first terminal 42 is connected to the first conductive plate 32A by the solder 35 (see FIG. 4).
  • the solder connection portion of the two parts may be fixed in a state where the two parts are electrically connected.
  • the two parts may be connected by a conductive adhesive.
  • the second terminal 43 extends from the element main body 41 on the first conductive plate 32A to the second conductive plate 32B side. That is, the second terminal 43 extends from the side opposite to the first terminal 42 with respect to the element main body 41.
  • the second terminal 43 is located on the insulating interposition portion 38a.
  • the control terminal 44 is next to the second terminal 43 and extends from the element main body 41 on the first conductive plate 32A to the second conductive plate 32B side. That is, the control terminal 44 extends from the side opposite to the first terminal 42 with respect to the element main body 41.
  • the control terminal 44 is located on the insulating interposition portion 38a.
  • the sheet-shaped wiring member 50 is a member in which the conductor is covered with an insulating member and formed in a sheet shape.
  • the sheet-shaped wiring member 50 is a flexible printed circuit board (FPC) is exemplified. That is, the sheet-shaped wiring member 50 is a sheet-shaped member in which a conductor formed of a metal foil (copper foil) or the like is sandwiched between a pair of resin films 51.
  • the sheet-shaped wiring member 50 is formed on the first main surface of the base substrate 30 in a sheet shape that extends over a region including a region on which the element 40 is mounted.
  • the sheet-shaped wiring member 50 includes a relay conductor 52a and a linear conductor 52b as conductors.
  • the relay conductor 52a is formed so as to extend from the lower region of the second terminal 43 of the element 40 toward the second conductive plate 32B.
  • the relay conductor 52a is formed in a rectangular region extending from a region extending downwardly of the plurality of second terminals 43 toward the second conductive plate 32B.
  • the resin film 51 on the side of the second terminal 43 is formed with an opening 51h1 that opens in a region directly below the second terminal 43.
  • the resin film 51 on the side of the second terminal 43 is formed with an opening 51h2 that opens in a region closer to the second conductive plate 32B than the opening 51h1.
  • the relay conductor 52a can be exposed.
  • the sheet-shaped wiring member 50 is formed with a through hole 51h3 that penetrates in a region away from the opening 51h2.
  • the second conductive plate 32B can be exposed in the through hole 51h3.
  • the sheet-shaped wiring member 50 is superposed on the main surface 30A of the base substrate 30, and the second terminal 43 is electrically connected to the relay conductor 52a exposed at the opening 51h1 and fixed.
  • the second terminal 43 is connected to the relay conductor 52a by the solder 36 (see FIG. 4).
  • the relay conductor 52a exposed by the opening 51h2 and the second conductive plate 32B exposed by the through hole 51h3 are electrically connected.
  • the relay conductor 52a and the second conductive plate 32B are connected by a solder 37.
  • the solder 37 extends so as to connect the opening 51h2 and the through hole 51h3 (see FIG. 4).
  • the second terminal 43 is electrically connected to the second conductive plate 32B via the solder 36, the relay conductor 52a, and the solder 37. Therefore, the element 40 is mounted on the main surface 30A of the base substrate 30 in a state of being connected to the first conductive plate 32A and the second conductive plate 32B. By controlling the element 40 on and off, the current can be switched between the first conductive plate 32A and the second conductive plate 32B between the energized state and the interrupted state.
  • the second terminal 43 may be directly connected to the second conductive plate 32B by solder or the like.
  • the control terminal 44 is connected to the linear conductor 52b.
  • the linear conductor 52b is a linear conductor extending from the lower region of the control terminal 44 toward any part of the outer circumference of the base substrate 30.
  • the resin film 51 on the control terminal 44 side is formed with an opening 51h4 that opens in a region directly below the control terminal 44.
  • the control terminal 44 is fixed in a state of being electrically connected to the linear conductor 52b exposed by the opening 51h4.
  • the control terminal 44 is connected to the linear conductor 52b by the solder 34 (see FIG. 5).
  • a through hole 51h5 is formed in the lower region of the first terminal 42 of the sheet-shaped wiring member 50.
  • the first conductive plate 32A can be exposed in the through hole 51h5.
  • the first terminal 42 is connected to the first conductive plate 32A exposed by the through hole 51h5 with a solder 35 or the like.
  • the sheet-shaped wiring member 50 may extend outward from the base board 30 and be connected to the control board 14.
  • the linear conductor 52b may extend outward of the sheet-shaped wiring member 50 and be connected to the control board 14.
  • the control signal output from the control board 14 is given to the control terminal 44 via the linear conductor 52b.
  • the sheet-shaped wiring member 50 may extend in the region where the relay conductor 52a and the linear conductor 52b exist. From another point of view, the sheet-shaped wiring member 50 extends in the lower region of at least a plurality of terminals 42, 43, 44 connected to the conductor (here, the second terminal 43 and the control terminal 44). Just do it. For example, the sheet-shaped wiring member 50 does not need to extend around the element main body 41.
  • the plurality of elements 40 are mounted side by side along the boundary between the first conductive plate 32A and the second conductive plate 32B.
  • the linear conductor 52b branches and extends toward the control terminals 44 of the plurality of elements 40.
  • the plurality of elements 40 are all located on the first conductive plate 32A side and mounted on the base substrate 30.
  • the sheet-shaped wiring member 50 is formed with openings 51h1, 51h2, 51h4 and through holes 51h3, 51h5 corresponding to each of the plurality of elements 40.
  • the number of elements 40 is arbitrary, and may be one, two, or four or more.
  • the first conductive plate 32A and the second conductive plate 32B are held along the same plane by the insulating portion 38. Therefore, the sheet-shaped wiring member 50 does not need to have a role of holding the first conductive plate 32A and the second conductive plate 32B in a constant positional relationship. From this point of view, it is not necessary for the sheet-shaped wiring member 50 to be fixed to the first conductive plate 32A and the second conductive plate 32B.
  • the sheet-shaped wiring member 50 is fixed on the base substrate 30 in a state where the first terminal 42 of the element 40 is electrically connected to the first conductive plate 32A. Further, the second terminal 43 and the control terminal 44 are fixed in a state of being electrically connected to the conductors 52a and 52b of the sheet-shaped wiring member 50. If the sheet-shaped wiring member 50 is displaced or warped with respect to the base substrate 30 during these fixings, the fixing points of the terminals 42, 43, and 44 will be displaced, resulting in mounting defects. obtain.
  • the sheet-shaped wiring member 50 is fixed to the base board 30 in a state where the sheet-shaped wiring member 50 is superposed on the main surface 30A of the base board 30.
  • the adhesive portion 60 that spreads in a plane shape is a portion that spreads in a plane shape that exhibits adhesiveness to both the base substrate 30 and the sheet-shaped wiring member 50.
  • the adhesive portion 60 extends between the base substrate 30 and the sheet-shaped wiring member 50 in a region having a minimum width larger than the thickness dimension thereof.
  • the adhesive portion 60 that spreads in a plane shape may be one that changes from a liquid to a solid and adheres to both the base substrate 30 and the sheet-like wiring member 50.
  • the adhesive portion 60 that spreads out in a plane shape may be adhered to the base substrate 30 and the sheet-shaped wiring member 50 by being pressed against the base substrate 30 and the sheet-shaped wiring member 50 while maintaining a soft state.
  • the double-sided adhesive sheet is an example of a sheet-like adhesive portion in which both sides are adhesive.
  • the double-sided adhesive sheet is, for example, a member in which adhesive layers are formed on both sides of a sheet-like base material.
  • the sheet-shaped wiring member 50 is attached to the base substrate 30 via the double-sided adhesive sheet in a state where the double-sided adhesive sheet is attached to one main surface of the sheet-shaped wiring member 50.
  • the adhesive portion 60 spreading in a planar shape is a solidified state in which a liquid adhesive is adhered to the base substrate 30 and the sheet-shaped wiring member 50.
  • the sheet-shaped wiring member 50 and the base substrate 30 are overlapped with each other in a state where the liquid adhesive is applied to the sheet-shaped wiring member 50 or the base substrate 30.
  • the liquid adhesive solidifies in a state of spreading in a plane between the sheet-shaped wiring member 50 and the base substrate 30, and keeps the sheet-shaped wiring member 50 and the base substrate 30 in an adhesive state.
  • the adhesive portion 60 extending in a plane shape may be extended in any region between the sheet-shaped wiring member 50 and the base substrate 30.
  • the sheet-shaped wiring member 50 is preferably fixed to the base substrate 30 in a region surrounding the element 40.
  • the sheet-shaped wiring member 50 extends on the base substrate 30 in a region that surrounds the entire plurality of terminals 42.
  • the through holes 51h3 and 51h5 are formed in the sheet-shaped wiring member 50.
  • the adhesive portions 60 spreading in a plane shape are distributed as a whole around a plurality of elements 40 of the sheet-shaped wiring member 50. Further, in the adhesive portion 60 extending in a planar shape, through holes 61h3 and 61h5 are formed at locations corresponding to the through holes 51h3 and 51h5. Therefore, the adhesive portions 60 spreading in a plane shape are distributed in the region surrounding the element 40.
  • the sheet-shaped wiring member 50 is fixed to the base substrate 30 via an adhesive portion 60 in a region surrounding the element 40.
  • the adhesive portions 60 may be distributed in a region surrounding the plurality of elements 40 together and a region surrounding the plurality of elements 40 individually.
  • the adhesive portion 60 is distributed in a region surrounding the plurality of elements 40 together and a region surrounding the elements 40 individually (see FIG. 2).
  • the adhesive portion 60B is distributed in a region surrounding a plurality of elements 40 together.
  • the adhesive portion 60B does not individually surround the plurality of elements 40. Therefore, the adhesive portion 60B does not exist between the plurality of elements 40.
  • the adhesive portion 60B is formed with one through hole 61h5B that continuously extends in the lower region of the plurality of elements 40.
  • the sheet-like adhesive portions may include a region that collectively surrounds a plurality of elements 40.
  • the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a region that collectively surrounds the element 40. Therefore, the fixing work becomes easy.
  • FIG. 7 is an exploded perspective view showing another modified example of the adhesive portion 60 spreading in a planar shape.
  • the adhesive portion 60C extending in a plane shape is provided in a pair of side regions facing each other with the elements 40 arranged between them.
  • a plurality of elements 40 are arranged in parallel.
  • the pair of adhesive portions 60C are provided on both side regions of the plurality of elements 40 along the direction in which the plurality of elements 40 are arranged.
  • the adhesive portion 60C is formed in a shape that spreads in a square shape.
  • the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a pair of side regions facing each other with a plurality of elements 40 arranged in between.
  • the sheet-shaped wiring member may be provided in a pair of side regions facing each other with the elements 40 arranged in between for each element 40.
  • the base may have a small fixed area. The misalignment of the sheet-shaped wiring member 50 with respect to the substrate 30 is effectively suppressed.
  • the substrate structure 20 is manufactured as follows, for example.
  • the sheet-shaped wiring member 50 is fixed on the base substrate 30 via the adhesive portion 60.
  • the element 40 is mounted on the base substrate 30.
  • the solder paste is applied to a portion of the first conductive plate 32A exposed through the through hole 51h5 and a portion of the second conductive plate 32B exposed through the through hole 51h3. Further, the solder paste is applied to the opening 51h1 portion, the portion reaching the through hole 51h3 from the opening 51h2, and the opening 51h4 portion of the sheet-shaped wiring member 50.
  • the element 40 is placed on the base substrate 30 and the sheet-shaped wiring member 50. In this state, the solder paste is heated to melt and then solidify.
  • the first terminal 42 is connected to the first conductive plate 32A by the solder 35.
  • the second terminal 43 is connected to the relay conductor 52a by the solder 36, and the relay conductor 52a is connected to the second conductive plate 32B by the solder 37.
  • the control terminal 44 is connected to the linear conductor 52b by the solder 34.
  • the sheet-shaped wiring member 50 When the element 40 is mounted on the base board 30, the sheet-shaped wiring member 50 is fixed to the base board 30, so that the sheet-shaped wiring member 50 is unlikely to be displaced with respect to the base board 30. Further, even if heat is applied to the sheet-shaped wiring member 50 and the sheet-shaped wiring member 50 is likely to warp, the sheet-shaped wiring member 50 is unlikely to float from the base substrate 30. Therefore, misalignment of the terminals 42, 43, and 44 is unlikely to occur, and mounting defects are suppressed.
  • the substrate structure 20 According to the substrate structure 20 according to the first embodiment, at least a part of the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a state where the sheet-shaped wiring member 50 is overlapped with the main surface 30A of the base substrate 30. ing. Therefore, when each of the terminals 42, 43, 44 of the element 40 is fixed in a state of being electrically connected to at least one of the plurality of conductive plates 32A, 32B and the conductors 52a, 52b, the element 40 Positional deviation from the sheet-shaped wiring member 50 is unlikely to occur. As a result, mounting defects of the element 40 are suppressed.
  • An example of the element 40 is a switching element.
  • Such a switching element can be mounted in a state of straddling the conductive plates 32A and 32B suitable for energizing a large current and the sheet-shaped wiring member 50 suitable for transmitting a signal. That is, at least one of the terminals 42, 43, 44 is fixed in a state of being electrically connected to one of the plurality of conductive plates 32A, 32B, and the other of the terminals 42, 43, 44. At least one of them is fixed in a state of being connected to the conductors 52a and 52b.
  • the element 40 which is such a switching element, is mounted on the base substrate 30, mounting defects are suppressed.
  • the sheet-shaped wiring member 50 may be fixed to the base substrate 30 via the adhesive portion 60C in a pair of side regions facing each other with the elements 40 arranged in between.
  • the sheet-shaped wiring member 50 is unlikely to be misaligned even at a small number of fixing points, and it is unlikely that the sheet-like wiring member 50 is greatly floated around the element 40. Therefore, the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a region effective for suppressing the positional deviation between the sheet-shaped wiring member 50 and the element 40 at a relatively small number of fixing points.
  • the sheet-shaped wiring member 50 may be fixed to the base substrate 30 by the adhesive portions 60 and 60B in the region surrounding the element 40.
  • the sheet-shaped wiring member 50 is fixed to the base substrate 30 around the element 40. Therefore, the sheet-shaped wiring member 50 is unlikely to be displaced around the element 40, and the sheet-shaped wiring member 50 is unlikely to float. Therefore, the sheet-shaped wiring member 50 is fixed to the base substrate 30 in an area effective for suppressing the positional deviation between the sheet-shaped wiring member 50 and the element 40.
  • the sheet-shaped wiring member 50 is fixed to the base substrate 30 via the adhesive portions 60, 60B, 60C extending in a plane shape, the sheet-shaped wiring member 50 is firmly fixed to the base substrate 30. To.
  • the sheet-like adhesive portions 60 and 60B are sheet-like adhesive portions such as double-sided adhesive sheets
  • the sheet-like adhesive portions may include an area that collectively surrounds a plurality of elements 40.
  • the sheet-shaped wiring member 50 is fixed to the base substrate 30 in an area effective for suppressing the positional deviation between the sheet-shaped wiring member 50 and the element 40. ..
  • the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a region that collectively surrounds the plurality of elements 40. Therefore, the work of fixing the sheet-shaped wiring member 50 to the base substrate 30 becomes easy.
  • FIG. 8 is a plan view showing the substrate structure 120 according to the second embodiment.
  • FIG. 9 is a sectional view taken along line IX-IX in FIG. In FIG. 9, the thickness of each part may be exaggerated.
  • the same reference numerals are given to the components as described in the first embodiment, and the description thereof is omitted.
  • the following configuration is adopted instead of the adhesive portion 60 as a structure for fixing the sheet-shaped wiring member 50 and the base substrate 30.
  • a fixing hole 158h is formed in the sheet-shaped wiring member 50.
  • a pair of fixing holes 158h are formed in a pair of lateral regions in which the elements 40 are arranged in between.
  • a plurality of elements 40 are provided in parallel.
  • the pair of fixing holes 158h are formed in the outer regions on both sides in the direction in which the plurality of elements 40 are arranged.
  • the pair of fixing holes 158h are formed at positions shifted in the direction connecting the first terminal 42 and the second terminal 43 of the element 40.
  • the number of fixing holes may be one, or a larger number may be formed.
  • the adhesive 160 is filled in the fixing hole 158h in a state where the sheet-shaped wiring member 50 is superposed on the base substrate 30.
  • the adhesive 160 is supplied from, for example, a nozzle 168 having a small opening and injected into the fixing hole 158h.
  • the adhesive 160 is adhered to the inner peripheral surface of the fixing hole 158h and also to the main surface 30A of the base substrate 30.
  • the adhesive 160 protrudes from the fixing hole 158h on the side opposite to the base substrate 30.
  • the protruding portion 161 has an outer diameter larger than the inner diameter of the fixing hole 158h. The protruding portion 161 is caught on the outward surface of the sheet-shaped wiring member 50 at the peripheral edge of the fixing hole 158h.
  • the adhesive 160 does not have to be adhered to the inner peripheral surface of the fixing hole 158h.
  • the adhesive 160 is adhered to the first conductive plate 32A, but may be adhered to the second conductive plate 32B or the insulating portion 38.
  • the same effect as that of the first embodiment can be obtained except for the effect that the sheet-shaped wiring member 50 is fixed to the base substrate 30 by using the adhesive portion that spreads in a plane shape.
  • the sheet-shaped wiring member 50 is fixed to the base substrate 30 by filling the fixing holes with the adhesive 160 in a state where the sheet-shaped wiring member 50 is overlapped with the base substrate 30. At this time, the filling operation of the adhesive 160 can be performed while the position of the sheet-shaped wiring member 50 with respect to the base substrate 30 is adjusted. Therefore, the sheet-shaped wiring member 50 is fixed at a position as accurate as possible with respect to the base substrate 30. Further, the fixing work of the sheet-shaped wiring member 50 can be easily performed.
  • the configuration in which the sheet-shaped wiring member 50 is fixed to the base substrate 30 is not limited to the above example.
  • the sheet-shaped wiring member 50 may be fixed to the base substrate 30 by ultrasonic welding, heat welding, or the like.
  • planar adhesive portions 60, 60B, 60C in the first embodiment and the configuration using the fixing holes 158h and the adhesive 160 in the second embodiment may be used in combination.

Abstract

The purpose of the present invention is to suppress defects in implementation of an element. This substrate structure comprises a base substrate that includes a plurality of electroconductive plates and an insulation part, an element, and a sheet-form wiring member that includes a conductor. The plurality of electroconductive plates are held along the same plane in a state in which the insulation part has been interposed between the plurality of electroconductive plates. At least part of the sheet-form wiring member is secured to the base substrate in a state in which the sheet-form wiring member overlaps a main surface of the base substrate. At least one of a plurality of terminals of the element is secured in a state of being electrically connected to at least one of the plurality of electroconductive plates. At least one other terminal from among the plurality of terminals is secured in a state of being electrically connected to the conductor.

Description

基板構造体Board structure
　本開示は、基板構造体に関する。 This disclosure relates to a substrate structure.
　特許文献１は、複数本のバスバと、半導体スイッチング素子と、制御回路基板とを備えた回路構成体を開示している。回路構成体が製造されるにあたり、複数本のバスバ同士がつながった形状をもつ金属製のバスバ構成板が形成され、このバスバ構成板に制御回路基板が接着される。 Patent Document 1 discloses a circuit configuration including a plurality of bus bars, a semiconductor switching element, and a control circuit board. When the circuit component is manufactured, a metal bus bar component plate having a shape in which a plurality of bus bars are connected to each other is formed, and a control circuit board is adhered to the bus bar component plate.
　特許文献２は、一対のバスバと、一対のバスバ上に実装されて当該一対のバスバ間の通電及び遮断を行う遮断部とを備えた電気接続箱を開示している。電気接続箱が製造されるにあたり、一対のバスバが並列配置され、このバスバ上にＦＰＣが貼り付けられる。この状態でパワー半導体がバスバ及びＦＰＣに実装される。 Patent Document 2 discloses an electrical junction box including a pair of bus bars and a blocking unit mounted on the pair of bus bars to energize and shut off the pair of bus bars. When the electrical junction box is manufactured, a pair of bus bars are arranged in parallel, and an FPC is attached on the bus bars. In this state, the power semiconductor is mounted on the bus bar and FPC.
特開２００３－１６４０３９号公報Japanese Unexamined Patent Publication No. 2003-164039 特開２０１６－２２０２７７号公報JP-A-2016-220277
　ここで、制御回路基板又はＦＰＣによってではなく、複数のバスバをインサート物としてインサート金型成形することによって、複数のバスバを所定の位置関係に保つことが提案されている。 Here, it is proposed to maintain a plurality of bus bars in a predetermined positional relationship by forming an insert mold using a plurality of bus bars as inserts, not by a control circuit board or FPC.
　また、素子がバスバ及びシート状配線部材の双方に固定された状態でバスバに実装されることがある。このような場合において、素子の実装不良を抑制することが要請される。 In addition, the element may be mounted on the bus bar in a state of being fixed to both the bus bar and the sheet-shaped wiring member. In such a case, it is required to suppress the mounting defect of the element.
　そこで、本開示は、素子の実装不良を抑制することを目的とする。 Therefore, the purpose of this disclosure is to suppress mounting defects of the element.
　本開示の基板構造体は、複数の導電板と、絶縁部とを含むベース基板と、前記ベース基板の主面に実装された素子と、導体を含むシート状配線部材と、を備え、前記絶縁部は、前記複数の導電板の間に介在した状態で、前記複数の導電板を同一平面に沿って保持し、前記シート状配線部材が前記ベース基板の主面に重ね合された状態で、前記シート状配線部材の少なくとも一部が前記ベース基板に固定されており、前記素子が複数の端子を備え、前記複数の端子のうちの少なくとも１つが前記複数の導電板のうちの少なくとも１つに電気的に接続された状態で固定され、前記複数の端子のうちの他の少なくとも１つが前記導体に電気的に接続された状態で固定されている、基板構造体である。 The substrate structure of the present disclosure includes a base substrate including a plurality of conductive plates and an insulating portion, an element mounted on the main surface of the base substrate, and a sheet-shaped wiring member including a conductor, and the insulation is provided. The section holds the plurality of conductive plates along the same plane in a state of being interposed between the plurality of conductive plates, and the sheet-like wiring member is superposed on the main surface of the base substrate. At least a part of the shape wiring member is fixed to the base substrate, the element includes a plurality of terminals, and at least one of the plurality of terminals is electrically connected to at least one of the plurality of conductive plates. It is a substrate structure which is fixed in a state of being connected to the conductor and at least one of the plurality of terminals is fixed in a state of being electrically connected to the conductor.
　本開示によれば、素子の実装不良が抑制される。 According to the present disclosure, mounting defects of the element are suppressed.
図１は実施形態１に係る電気接続箱を示す概略分解斜視図である。FIG. 1 is a schematic exploded perspective view showing an electrical connection box according to the first embodiment. 図２は基板構造体を示す分解斜視図である。FIG. 2 is an exploded perspective view showing the substrate structure. 図３は基板構造体を示す平面図である。FIG. 3 is a plan view showing the substrate structure. 図４は図３のＩＶ－ＩＶ線断面図である。FIG. 4 is a sectional view taken along line IV-IV of FIG. 図５は図３のＶ－Ｖ線断面図である。FIG. 5 is a sectional view taken along line VV of FIG. 図６は変形例に係る接着部を示す分解斜視図である。FIG. 6 is an exploded perspective view showing an adhesive portion according to a modified example. 図７は他の変形例に係る接着部を示す分解斜視図である。FIG. 7 is an exploded perspective view showing an adhesive portion according to another modified example. 図８は実施形態２に係る基板構造体を示す平面図である。FIG. 8 is a plan view showing the substrate structure according to the second embodiment. 図９は図８におけるＩＸ－ＩＸ線断面図である。FIG. 9 is a sectional view taken along line IX-IX in FIG.
　［本開示の実施形態の説明］
　最初に本開示の実施態様を列記して説明する。 [Explanation of Embodiments of the present disclosure]
First, embodiments of the present disclosure will be listed and described.
　本開示の基板構造体は、次の通りである。 The substrate structure of the present disclosure is as follows.
　（１）複数の導電板と、絶縁部とを含むベース基板と、前記ベース基板の主面に実装された素子と、導体を含むシート状配線部材と、を備え、前記絶縁部は、前記複数の導電板の間に介在した状態で、前記複数の導電板を同一平面に沿って保持し、前記シート状配線部材が前記ベース基板の主面に重ね合された状態で、前記シート状配線部材の少なくとも一部が前記ベース基板に固定されており、前記素子が複数の端子を備え、前記複数の端子のうちの少なくとも１つが前記複数の導電板のうちの少なくとも１つに電気的に接続された状態で固定され、前記複数の端子のうちの他の少なくとも１つが前記導体に電気的に接続された状態で固定されている、基板構造体である。本開示によると、前記シート状配線部材が前記ベース基板の主面に重ね合された状態で、前記シート状配線部材の少なくとも一部が前記ベース基板に固定されている。このため、前記素子の各端子が、前記複数の導電板のうちの少なくとも１つと、前記導体とに電気的に接続された状態で固定される際に、素子とシート状配線部材との位置ずれが生じ難い。これにより、素子の実装不良が抑制される。 (1) A base substrate including a plurality of conductive plates and an insulating portion, an element mounted on the main surface of the base substrate, and a sheet-shaped wiring member including a conductor are provided, and the insulating portion is the plurality. The plurality of conductive plates are held along the same plane in a state of being interposed between the conductive plates of the above, and at least the sheet-like wiring members are superposed on the main surface of the base substrate. A state in which a part is fixed to the base substrate, the element has a plurality of terminals, and at least one of the plurality of terminals is electrically connected to at least one of the plurality of conductive plates. It is a substrate structure fixed with a wire and fixed at least one of the plurality of terminals in a state of being electrically connected to the conductor. According to the present disclosure, at least a part of the sheet-shaped wiring member is fixed to the base substrate in a state where the sheet-shaped wiring member is overlapped with the main surface of the base substrate. Therefore, when each terminal of the element is fixed to at least one of the plurality of conductive plates in a state of being electrically connected to the conductor, the element and the sheet-shaped wiring member are displaced from each other. Is unlikely to occur. As a result, mounting defects of the element are suppressed.
　（２）前記素子は、前記複数の端子として第１端子と第２端子と制御端子とを含み、前記制御端子への制御信号に応じて前記第１端子と前記第２端子との間で通電及び遮断を行うスイッチング素子であり、前記第１端子、前記第２端子及び前記制御端子のうちの少なくとも１つが前記複数の導電板のうちの１つに電気的に接続された状態で固定され、前記第１端子、前記第２端子及び前記制御端子のうちの他の少なくとも１つが前記導体に接続された状態で固定されていてもよい。これにより、スイッチング素子がベース基板に対して実装される際に、実装不良が抑制される。 (2) The element includes a first terminal, a second terminal, and a control terminal as the plurality of terminals, and energizes between the first terminal and the second terminal in response to a control signal to the control terminal. And a switching element that shuts off, and is fixed in a state where at least one of the first terminal, the second terminal, and the control terminal is electrically connected to one of the plurality of conductive plates. At least one of the first terminal, the second terminal, and the control terminal may be fixed in a state of being connected to the conductor. As a result, when the switching element is mounted on the base substrate, mounting defects are suppressed.
　（３）前記シート状配線部材は、前記素子を間に配置して対向する一対の側方領域で、前記ベース基板に固定されていてもよい。シート状配線部材と素子との位置ずれを抑制するのに効果的な領域で、シート状配線部材がベース基板に固定される。 (3) The sheet-shaped wiring member may be fixed to the base substrate in a pair of side regions facing each other with the elements arranged between them. The sheet-shaped wiring member is fixed to the base substrate in an area effective for suppressing the misalignment between the sheet-shaped wiring member and the element.
　（４）前記シート状配線部材は、前記素子を囲む領域で、前記ベース基板に固定されていてもよい。シート状配線部材と素子との位置ずれを抑制するのに効果的な領域で、シート状配線部材がベース基板に固定される。 (4) The sheet-shaped wiring member may be fixed to the base substrate in a region surrounding the element. The sheet-shaped wiring member is fixed to the base substrate in an area effective for suppressing the misalignment between the sheet-shaped wiring member and the element.
　（５）前記シート状配線部材が前記ベース基板に対して面状に広がる接着部を介して固定されていてもよい。シート状配線部材がベース基板に対してしっかりと固定される。 (5) The sheet-shaped wiring member may be fixed to the base substrate via an adhesive portion that spreads in a plane shape. The sheet-shaped wiring member is firmly fixed to the base substrate.
　（６）前記素子は、複数の素子を備え、前記シート状配線部材が前記ベース基板に対してシート状接着部を介して固定され、前記シート状接着部は、前記複数の素子をまとめて囲む領域を含んでもよい。複数の素子が実装される場合でも、シート状配線部材と素子との位置ずれを抑制するのに効果的な領域で、シート状配線部材がベース基板に固定される。また、シート状接着部は、複数の素子をまとめて囲む領域に設けられるのに適する。 (6) The element includes a plurality of elements, the sheet-shaped wiring member is fixed to the base substrate via a sheet-shaped adhesive portion, and the sheet-shaped adhesive portion collectively surrounds the plurality of elements. It may include an area. Even when a plurality of elements are mounted, the sheet-shaped wiring member is fixed to the base substrate in an area effective for suppressing the positional deviation between the sheet-shaped wiring member and the element. Further, the sheet-shaped adhesive portion is suitable for being provided in a region surrounding a plurality of elements together.
　（７）前記シート状配線部材に固定用孔が形成され、前記固定用孔に充填されて前記ベース基板に接着された状態となった接着剤を介して、前記シート状配線部材が前記ベース基板に固定されていてもよい。シート状配線部材がベース基板に重ね合された状態で接着剤が固定用孔に充填されることで、シート状配線部材がベース基板に固定される。このため、シート状配線部材がベース基板に対してなるべく正確な位置で固定される。また、その固定作業も容易である。 (7) The sheet-shaped wiring member is attached to the base substrate via an adhesive in which a fixing hole is formed in the sheet-shaped wiring member and the fixing hole is filled and adhered to the base substrate. It may be fixed to. The sheet-shaped wiring member is fixed to the base substrate by filling the fixing holes with the adhesive in a state where the sheet-shaped wiring member is overlapped with the base substrate. Therefore, the sheet-shaped wiring member is fixed at a position as accurate as possible with respect to the base substrate. Moreover, the fixing work is also easy.
　［本開示の実施形態の詳細］
　本開示の基板構造体の具体例を、以下に図面を参照しつつ説明する。なお、本開示はこれらの例示に限定されるものではなく、請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 [Details of Embodiments of the present disclosure]
Specific examples of the substrate structure of the present disclosure will be described below with reference to the drawings. It should be noted that the present disclosure is not limited to these examples, but is indicated by the scope of claims and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.
　[実施形態１]
　以下、実施形態１に係る基板構造体について説明する。実施形態１では、基板構造体２０を備える電気接続箱１０が例として説明される。 [Embodiment 1]
Hereinafter, the substrate structure according to the first embodiment will be described. In the first embodiment, the electrical junction box 10 including the substrate structure 20 will be described as an example.
　図１は実施形態１に係る電気接続箱１０を示す概略分解斜視図である。図２は基板構造体２０を示す分解斜視図である。図３は基板構造体２０を示す平面図である。図４は図３のＩＶ－ＩＶ線断面図である。図５は図３のＶ－Ｖ線断面図である。なお、説明の便宜上、図４及び図５において各部の厚み等が誇張して描かれている場合がある。 FIG. 1 is a schematic exploded perspective view showing the electrical connection box 10 according to the first embodiment. FIG. 2 is an exploded perspective view showing the substrate structure 20. FIG. 3 is a plan view showing the substrate structure 20. FIG. 4 is a sectional view taken along line IV-IV of FIG. FIG. 5 is a sectional view taken along line VV of FIG. For convenience of explanation, the thickness and the like of each part may be exaggerated in FIGS. 4 and 5.
　＜電気接続箱の全体構成＞
　電気接続箱１０は、基板構造体２０と、筐体１２と、制御基板１４とを備える。 <Overall configuration of electrical junction box>
The electrical junction box 10 includes a substrate structure 20, a housing 12, and a control substrate 14.
　筐体１２は、樹脂等で形成されている。筐体１２内には、基板構造体２０及び制御基板１４が収容される。筐体１２には、基板構造体２０の外部接続部３３を外部に露出させるための凹部が形成されている。 The housing 12 is made of resin or the like. The substrate structure 20 and the control substrate 14 are housed in the housing 12. The housing 12 is formed with a recess for exposing the external connection portion 33 of the substrate structure 20 to the outside.
　基板構造体２０は、ベース基板３０と、素子４０と、シート状配線部材５０とを備える。ベース基板３０は、複数の導電板３２Ａ、３２Ｂと、絶縁部３８とを備える。素子４０は、ベース基板３０の主面に実装されている。シート状配線部材５０は、導体５２ａ、５２ｂを含むシート状の配線部材である。 The substrate structure 20 includes a base substrate 30, an element 40, and a sheet-shaped wiring member 50. The base substrate 30 includes a plurality of conductive plates 32A and 32B and an insulating portion 38. The element 40 is mounted on the main surface of the base substrate 30. The sheet-shaped wiring member 50 is a sheet-shaped wiring member including conductors 52a and 52b.
　ここでは、ベース基板３０は、複数の導電板３２Ａ、３２Ｂとして、第１導電板３２Ａと第２導電板３２Ｂとを備える。素子４０は、第１導電板３２Ａと第２導電板３２Ｂとに接続される。本基板構造体２０において、電流は、第１導電板３２Ａと、素子４０と、第２導電板３２Ｂとを経て流れる。電流が流れる方向は、第１導電板３２Ａから第２導電板３２Ｂ、第２導電板３２Ｂから第１導電板３２Ａのいずれであってもよい。 Here, the base substrate 30 includes a first conductive plate 32A and a second conductive plate 32B as a plurality of conductive plates 32A and 32B. The element 40 is connected to the first conductive plate 32A and the second conductive plate 32B. In the substrate structure 20, the current flows through the first conductive plate 32A, the element 40, and the second conductive plate 32B. The direction in which the current flows may be any of the first conductive plate 32A to the second conductive plate 32B and the second conductive plate 32B to the first conductive plate 32A.
　制御基板１４は、基板構造体２０に接続されている。制御基板１４は、基板構造体２０の動作を制御する。例えば、制御基板１４は、基板構造体２０を流れる電流をオンオフ制御する。 The control board 14 is connected to the board structure 20. The control board 14 controls the operation of the board structure 20. For example, the control board 14 controls on / off of the current flowing through the board structure 20.
　本電気接続箱１０は、例えば、自動車において、電源と、各種電装品との間の電力供給経路に設けられる。 The electric junction box 10 is provided, for example, in a power supply path between a power source and various electrical components in an automobile.
　＜基板構造体＞
　基板構造体２０は、ベース基板３０と、素子４０と、シート状配線部材５０とを備える。 <Board structure>
The substrate structure 20 includes a base substrate 30, an element 40, and a sheet-shaped wiring member 50.
　ベース基板３０は、第１導電板３２Ａと第２導電板３２Ｂと絶縁部３８を備える。第１導電板３２Ａ及び第２導電板３２Ｂは、金属板等によって形成された部材である。第１導電板３２Ａ及び第２導電板３２Ｂは、バスバと呼ばれることもある。ここでは、一例として、第１導電板３２Ａ及び第２導電板３２Ｂは、方形板状に形成されている。第１導電板３２Ａ及び第２導電板３２Ｂは、素子４０を流れる電流の外部経路として機能する。 The base substrate 30 includes a first conductive plate 32A, a second conductive plate 32B, and an insulating portion 38. The first conductive plate 32A and the second conductive plate 32B are members formed of a metal plate or the like. The first conductive plate 32A and the second conductive plate 32B are sometimes called a bus bar. Here, as an example, the first conductive plate 32A and the second conductive plate 32B are formed in a square plate shape. The first conductive plate 32A and the second conductive plate 32B function as an external path for the current flowing through the element 40.
　絶縁部３８は、第１導電板３２Ａと第２導電板３２Ｂとの間に介在した状態で、第１導電板３２Ａと第２導電板３２Ｂとを同一平面に沿って保持する。ここでは、第１導電板３２Ａにおける外周囲の一部に、直線縁部が形成されている。また、第２導電板３２Ｂにおける外周囲の一部に直線縁部が形成されている。第１導電板３２Ａの直線縁部と第２導電板３２Ｂの直線縁部とが互いに平行状態で間隔をあけて対向している。 The insulating portion 38 holds the first conductive plate 32A and the second conductive plate 32B along the same plane in a state of being interposed between the first conductive plate 32A and the second conductive plate 32B. Here, a straight edge portion is formed on a part of the outer periphery of the first conductive plate 32A. Further, a straight edge portion is formed on a part of the outer periphery of the second conductive plate 32B. The straight edge portion of the first conductive plate 32A and the straight edge portion of the second conductive plate 32B are parallel to each other and face each other with a gap.
　絶縁部３８は、樹脂等によって形成された部分である。絶縁部３８は、第１導電板３２Ａと第２導電板３２Ｂをインサート物として金型成形された部分である。 The insulating portion 38 is a portion formed of resin or the like. The insulating portion 38 is a portion formed by using the first conductive plate 32A and the second conductive plate 32B as inserts.
　より具体的には、絶縁部３８は、絶縁介在部３８ａと、絶縁保持部３８ｂとを備える。絶縁介在部３８ａは、第１導電板３２Ａの直線縁部と第２導電板３２Ｂの直線縁部との間に設けられている。絶縁介在部３８ａによって、第１導電板３２Ａと第２導電板３２Ｂとがなるべく確実に絶縁された状態に保たれる。絶縁保持部３８ｂは、第１導電板３２Ａ及び第２導電板３２Ｂの外周囲を囲むように設けられている。第１導電板３２Ａと第２導電板３２Ｂとが絶縁介在部３８ａ及び絶縁保持部３８ｂによって囲まれた状態で、第１導電板３２Ａと第２導電板３２Ｂとが同一平面に沿うように保持される。 More specifically, the insulating portion 38 includes an insulating interposing portion 38a and an insulating holding portion 38b. The insulating intervening portion 38a is provided between the straight edge portion of the first conductive plate 32A and the straight edge portion of the second conductive plate 32B. The insulating interposition portion 38a keeps the first conductive plate 32A and the second conductive plate 32B in a state of being insulated as reliably as possible. The insulation holding portion 38b is provided so as to surround the outer periphery of the first conductive plate 32A and the second conductive plate 32B. The first conductive plate 32A and the second conductive plate 32B are held along the same plane in a state where the first conductive plate 32A and the second conductive plate 32B are surrounded by the insulating intervening portion 38a and the insulating holding portion 38b. To.
　絶縁保持部３８ｂが第１導電板３２Ａ及び第２導電板３２Ｂの外周囲の全体を囲んでいる必要は無い。絶縁介在部３８ａが第１導電板３２Ａの直線縁部と第２導電板３２Ｂの直線縁部とに接合されることによって、第１導電板３２Ａと第２導電板３２Ｂとが同一平面に沿った状態に保たれれば、絶縁保持部３８ｂは省略され得る。 It is not necessary for the insulation holding portion 38b to surround the entire outer circumference of the first conductive plate 32A and the second conductive plate 32B. By joining the insulating interposition portion 38a to the straight edge portion of the first conductive plate 32A and the straight edge portion of the second conductive plate 32B, the first conductive plate 32A and the second conductive plate 32B are aligned on the same plane. If kept in that state, the insulation holding portion 38b may be omitted.
　第１導電板３２Ａと第２導電板３２Ｂには、孔３３ｈが形成されている。第１導電板３２Ａと第２導電板３２Ｂのうち孔３３ｈが形成された部分は、第１導電板３２Ａと第２導電板３２Ｂとを外部の導電路に接続するための外部接続部３３として機能することができる。 Holes 33h are formed in the first conductive plate 32A and the second conductive plate 32B. The portion of the first conductive plate 32A and the second conductive plate 32B in which the hole 33h is formed functions as an external connecting portion 33 for connecting the first conductive plate 32A and the second conductive plate 32B to an external conductive path. can do.
　素子４０は、第１導電板３２Ａ及び第２導電板３２Ｂに接続された素子である。素子４０は電気接続箱１０の用途に応じた素子である。素子４０は、例えば電界効果トランジスタ（以下「ＦＥＴ」とも称す：field effect transistor）で例示される半導体スイッチング(switching)素子が採用される。素子４０は抵抗であってもよいし、コイルであってもよいし、コンデンサであってもよい。 The element 40 is an element connected to the first conductive plate 32A and the second conductive plate 32B. The element 40 is an element suitable for the application of the electrical junction box 10. As the element 40, for example, a semiconductor switching element exemplified by a field effect transistor (hereinafter, also referred to as “FET”) is adopted. The element 40 may be a resistor, a coil, or a capacitor.
　ここでは、素子４０がＥＦＴである場合が例示される。より具体的には、素子４０は、例えば、面実装タイプのパワーＭＯＳＦＥＴである。素子４０は、素子本体部４１と、複数の端子４２、４３、４４とを備える。ここでは、素子４０は、第１端子４２と、第２端子４３と、制御端子４４とを備える。第１端子４２及び第２端子４３の一方がソース（source）電極として機能し、他方がドレイン（drain）電極として機能する。以下では、第１端子４２がソース電極であり、第２端子４３がドレイン電極であるが例示される。 Here, the case where the element 40 is EFT is exemplified. More specifically, the element 40 is, for example, a surface mount type power MOSFET. The element 40 includes an element main body 41 and a plurality of terminals 42, 43, 44. Here, the element 40 includes a first terminal 42, a second terminal 43, and a control terminal 44. One of the first terminal 42 and the second terminal 43 functions as a source electrode, and the other functions as a drain electrode. In the following, the first terminal 42 is a source electrode and the second terminal 43 is a drain electrode.
　素子４０が半導体スイッチング素子等の第１スイッチング素子である場合を想定すると、制御端子４４は、例えば、制御信号が入力される制御端子である。この制御端子４４に入力される制御信号に応じて、素子４０が、第１端子４２と第２端子４３との間で通電及び遮断を行う。素子４０がＦＥＴである場合を想定すると、制御端子４４はゲート電極である。 Assuming that the element 40 is a first switching element such as a semiconductor switching element, the control terminal 44 is, for example, a control terminal into which a control signal is input. In response to the control signal input to the control terminal 44, the element 40 energizes and shuts off between the first terminal 42 and the second terminal 43. Assuming that the element 40 is an FET, the control terminal 44 is a gate electrode.
　素子本体部４１は例えば偏平な直方体状に形成される。ここでは、第１端子４２は、素子本体部４１の底部から一側部に突出するように設けられる。第２端子４３及び制御端子４４が素子本体部４１の他側部から突出するように設けられる。ここでは、第２端子４３は複数設けられている。 The element body 41 is formed, for example, in a flat rectangular parallelepiped shape. Here, the first terminal 42 is provided so as to project from the bottom of the element main body 41 to one side. The second terminal 43 and the control terminal 44 are provided so as to project from the other side of the element main body 41. Here, a plurality of second terminals 43 are provided.
　複数の端子４２、４３、４４のうちの少なくとも１つが複数の導電板３２Ａ、３２Ｂのうちの少なくとも１つの電気的に接続された状態で固定されている。また、複数の端子４２、４３、４４のうちの少なくとも１つがシート状配線部材５０の導体５２ａ、５２ｂに接続された状態で固定されている。 At least one of the plurality of terminals 42, 43, 44 is fixed in a state of being electrically connected to at least one of the plurality of conductive plates 32A, 32B. Further, at least one of the plurality of terminals 42, 43, 44 is fixed in a state of being connected to the conductors 52a, 52b of the sheet-shaped wiring member 50.
　ここでは、第１端子４２が第１導電板３２Ａに電気的に接続された状態で固定されている例が説明される。また、第２端子４３及び制御端子４４がシート状配線部材５０の導体５２ａ、５２ｂに電気的に接続された状態で固定されている例が説明される。他の例として、第１端子がシート状配線部材の導体に電気的に接続された状態で固定され、第２端子４３が導電板に電気的に接続された状態で固定されてもよい。導電板によって制御信号用の経路が形成されている場合には、制御端子が当該導電板に電気的に接続された状態で固定されてもよい。 Here, an example will be described in which the first terminal 42 is fixed in a state of being electrically connected to the first conductive plate 32A. Further, an example will be described in which the second terminal 43 and the control terminal 44 are fixed in a state of being electrically connected to the conductors 52a and 52b of the sheet-shaped wiring member 50. As another example, the first terminal may be fixed in a state of being electrically connected to the conductor of the sheet-shaped wiring member, and the second terminal 43 may be fixed in a state of being electrically connected to the conductive plate. When the path for the control signal is formed by the conductive plate, the control terminal may be fixed in a state of being electrically connected to the conductive plate.
　第１端子４２が第１導電板３２Ａに電気的に接続された状態で固定されていることから、素子本体部４１は、第１導電板３２Ａ上に位置している。 Since the first terminal 42 is fixed in a state of being electrically connected to the first conductive plate 32A, the element main body 41 is located on the first conductive plate 32A.
　ここでは、第１端子４２は第１導電板３２Ａに半田３５によって接続されている（図４参照）。ここで、２つの部分の半田による接続箇所は、当該２つの部分が電気的に接続された状態で固定されればよい。例えば、当該２つの部分は導電性接着剤によって接続されてもよい。 Here, the first terminal 42 is connected to the first conductive plate 32A by the solder 35 (see FIG. 4). Here, the solder connection portion of the two parts may be fixed in a state where the two parts are electrically connected. For example, the two parts may be connected by a conductive adhesive.
　第２端子４３は、第１導電板３２Ａ上の素子本体部４１から第２導電板３２Ｂ側に延出している。つまり、第２端子４３は、素子本体部４１に対して第１端子４２とは反対側から延出している。第２端子４３は、絶縁介在部３８ａ上に位置している。 The second terminal 43 extends from the element main body 41 on the first conductive plate 32A to the second conductive plate 32B side. That is, the second terminal 43 extends from the side opposite to the first terminal 42 with respect to the element main body 41. The second terminal 43 is located on the insulating interposition portion 38a.
　制御端子４４は、第２端子４３の隣で、第１導電板３２Ａ上の素子本体部４１から第２導電板３２Ｂ側に延出している。つまり、制御端子４４は、素子本体部４１に対して第１端子４２とは反対側から延出している。制御端子４４は、絶縁介在部３８ａ上に位置している。 The control terminal 44 is next to the second terminal 43 and extends from the element main body 41 on the first conductive plate 32A to the second conductive plate 32B side. That is, the control terminal 44 extends from the side opposite to the first terminal 42 with respect to the element main body 41. The control terminal 44 is located on the insulating interposition portion 38a.
　シート状配線部材５０は、導体が絶縁部材で覆われてシート状に形成された部材である。ここでは、シート状配線部材５０が、フレキシブルプリント基板（FPC:flexible printed circuit）である場合が例示される。つまり、シート状配線部材５０は、金属箔（銅箔）等で形成された導体が一対の樹脂フィルム５１で挟まれたシート状の部材である。 The sheet-shaped wiring member 50 is a member in which the conductor is covered with an insulating member and formed in a sheet shape. Here, a case where the sheet-shaped wiring member 50 is a flexible printed circuit board (FPC) is exemplified. That is, the sheet-shaped wiring member 50 is a sheet-shaped member in which a conductor formed of a metal foil (copper foil) or the like is sandwiched between a pair of resin films 51.
　シート状配線部材５０は、ベース基板３０の第１主面上において、素子４０が実装された領域を含む領域に広がるシート状に形成されている。シート状配線部材５０は、導体として、中継導体５２ａと、線状導体５２ｂとを備える。中継導体５２ａは、素子４０における第２端子４３の下方領域から第２導電板３２Ｂに向けて延出するように形成されている。ここでは、中継導体５２ａは、複数の第２端子４３の下方全体に広がる領域から第２導電板３２Ｂに向けて広がる方形状領域に形成されている。 The sheet-shaped wiring member 50 is formed on the first main surface of the base substrate 30 in a sheet shape that extends over a region including a region on which the element 40 is mounted. The sheet-shaped wiring member 50 includes a relay conductor 52a and a linear conductor 52b as conductors. The relay conductor 52a is formed so as to extend from the lower region of the second terminal 43 of the element 40 toward the second conductive plate 32B. Here, the relay conductor 52a is formed in a rectangular region extending from a region extending downwardly of the plurality of second terminals 43 toward the second conductive plate 32B.
　一対の樹脂フィルム５１のうち第２端子４３側の樹脂フィルム５１には、第２端子４３の真下の領域で開口する開口５１ｈ１が形成されている。また、同じく第２端子４３側の樹脂フィルム５１には、開口５１ｈ１よりも第２導電板３２Ｂ側の領域で開口する開口５１ｈ２が形成されている。開口５１ｈ１、５１ｈ２では、中継導体５２ａが露出することができる。 Of the pair of resin films 51, the resin film 51 on the side of the second terminal 43 is formed with an opening 51h1 that opens in a region directly below the second terminal 43. Similarly, the resin film 51 on the side of the second terminal 43 is formed with an opening 51h2 that opens in a region closer to the second conductive plate 32B than the opening 51h1. At the openings 51h1 and 51h2, the relay conductor 52a can be exposed.
　さらに、シート状配線部材５０には、開口５１ｈ２から離れた領域で貫通する貫通孔５１ｈ３が形成されている。貫通孔５１ｈ３では、第２導電板３２Ｂが露出することができる。 Further, the sheet-shaped wiring member 50 is formed with a through hole 51h3 that penetrates in a region away from the opening 51h2. The second conductive plate 32B can be exposed in the through hole 51h3.
　シート状配線部材５０がベース基板３０の主面３０Ａ上に重ね合された状態で、第２端子４３が開口５１ｈ１で露出する中継導体５２ａに電気的に接続された状態で固定される。例えば、第２端子４３は半田３６によって中継導体５２ａ接続されている（図４参照）。また、開口５１ｈ２で露出する中継導体５２ａと、貫通孔５１ｈ３で露出する第２導電板３２Ｂとが電気的に接続されている。ここでは、中継導体５２ａと第２導電板３２Ｂとが、半田３７によって接続されている。半田３７は、開口５１ｈ２と貫通孔５１ｈ３との間を繋ぐように延在している（図４参照）。このため、第２端子４３は、半田３６、中継導体５２ａ及び半田３７を介して第２導電板３２Ｂに電気的に接続される。もって、素子４０は、第１導電板３２Ａ及び第２導電板３２Ｂに接続された状態で、ベース基板３０の主面３０Ａに実装される。素子４０をオンオフ制御することで、第１導電板３２Ａと第２導電板３２Ｂとの間で電流が通電する状態及び遮断される状態との間で切替えられる。なお、第２端子４３は、第２導電板３２Ｂに直接半田等で接続されていてもよい。 The sheet-shaped wiring member 50 is superposed on the main surface 30A of the base substrate 30, and the second terminal 43 is electrically connected to the relay conductor 52a exposed at the opening 51h1 and fixed. For example, the second terminal 43 is connected to the relay conductor 52a by the solder 36 (see FIG. 4). Further, the relay conductor 52a exposed by the opening 51h2 and the second conductive plate 32B exposed by the through hole 51h3 are electrically connected. Here, the relay conductor 52a and the second conductive plate 32B are connected by a solder 37. The solder 37 extends so as to connect the opening 51h2 and the through hole 51h3 (see FIG. 4). Therefore, the second terminal 43 is electrically connected to the second conductive plate 32B via the solder 36, the relay conductor 52a, and the solder 37. Therefore, the element 40 is mounted on the main surface 30A of the base substrate 30 in a state of being connected to the first conductive plate 32A and the second conductive plate 32B. By controlling the element 40 on and off, the current can be switched between the first conductive plate 32A and the second conductive plate 32B between the energized state and the interrupted state. The second terminal 43 may be directly connected to the second conductive plate 32B by solder or the like.
　制御端子４４は、線状導体５２ｂに接続されている。線状導体５２ｂは、制御端子４４の下方領域からベース基板３０の外周のいずれかの箇所に向けて延びる線状の導体である。一対の樹脂フィルム５１のうち制御端子４４側の樹脂フィルム５１には、制御端子４４の直下の領域で開口する開口５１ｈ４が形成されている。制御端子４４は、開口５１ｈ４で露出する線状導体５２ｂに電気的に接続された状態で固定される。ここでは、制御端子４４は、半田３４によって線状導体５２ｂに接続されている（図５参照）。 The control terminal 44 is connected to the linear conductor 52b. The linear conductor 52b is a linear conductor extending from the lower region of the control terminal 44 toward any part of the outer circumference of the base substrate 30. Of the pair of resin films 51, the resin film 51 on the control terminal 44 side is formed with an opening 51h4 that opens in a region directly below the control terminal 44. The control terminal 44 is fixed in a state of being electrically connected to the linear conductor 52b exposed by the opening 51h4. Here, the control terminal 44 is connected to the linear conductor 52b by the solder 34 (see FIG. 5).
　なお、シート状配線部材５０のうち第１端子４２の下方領域には貫通孔５１ｈ５が形成されている。この貫通孔５１ｈ５では、第１導電板３２Ａが露出することができる。第１端子４２は、当該貫通孔５１ｈ５で露出する第１導電板３２Ａに半田３５等で接続される。 A through hole 51h5 is formed in the lower region of the first terminal 42 of the sheet-shaped wiring member 50. The first conductive plate 32A can be exposed in the through hole 51h5. The first terminal 42 is connected to the first conductive plate 32A exposed by the through hole 51h5 with a solder 35 or the like.
　シート状配線部材５０は、ベース基板３０の外方に向けて延出し、制御基板１４に接続されていてもよい。この場合、線状導体５２ｂは、シート状配線部材５０の外方に向けて延出し、制御基板１４に接続されてもよい。これにより、制御基板１４から出力される制御信号が、線状導体５２ｂを介して、制御端子４４に与えられる。 The sheet-shaped wiring member 50 may extend outward from the base board 30 and be connected to the control board 14. In this case, the linear conductor 52b may extend outward of the sheet-shaped wiring member 50 and be connected to the control board 14. As a result, the control signal output from the control board 14 is given to the control terminal 44 via the linear conductor 52b.
　シート状配線部材５０は、上記中継導体５２ａ及び線状導体５２ｂが存在する領域で広がっていればよい。別の見方をすれば、シート状配線部材５０は、少なくとも複数の端子４２、４３、４４のうち導体に接続されるもの（ここでは、第２端子４３及び制御端子４４）の下方領域で広がっていればよい。例えば、シート状配線部材５０は、素子本体部４１の周辺に広がっている必要は無い。 The sheet-shaped wiring member 50 may extend in the region where the relay conductor 52a and the linear conductor 52b exist. From another point of view, the sheet-shaped wiring member 50 extends in the lower region of at least a plurality of terminals 42, 43, 44 connected to the conductor (here, the second terminal 43 and the control terminal 44). Just do it. For example, the sheet-shaped wiring member 50 does not need to extend around the element main body 41.
　また、本実施形態１では、素子４０が複数である場合が例示されている。 Further, in the first embodiment, a case where there are a plurality of elements 40 is exemplified.
　ベース基板３０の主面３０Ａにおいては、複数の素子４０は、第１導電板３２Ａと第２導電板３２Ｂとの境界に沿って並んで実装されている。線状導体５２ｂは、複数の素子４０のそれぞれの制御端子４４に向けて分岐して延出している。複数の素子４０は、全て第１導電板３２Ａ側に位置してベース基板３０に実装されている。 On the main surface 30A of the base substrate 30, the plurality of elements 40 are mounted side by side along the boundary between the first conductive plate 32A and the second conductive plate 32B. The linear conductor 52b branches and extends toward the control terminals 44 of the plurality of elements 40. The plurality of elements 40 are all located on the first conductive plate 32A side and mounted on the base substrate 30.
　このため、シート状配線部材５０には、複数の素子４０のそれぞれに対応して、開口５１ｈ１、５１ｈ２、５１ｈ４、貫通孔５１ｈ３、５１ｈ５が形成されている。 Therefore, the sheet-shaped wiring member 50 is formed with openings 51h1, 51h2, 51h4 and through holes 51h3, 51h5 corresponding to each of the plurality of elements 40.
　なお、素子４０の数は任意であり、１つであってもよいし、２つであってもよいし、４つ以上であってもよい。 The number of elements 40 is arbitrary, and may be one, two, or four or more.
　上記第１導電板３２Ａ及び第２導電板３２Ｂは、絶縁部３８によって同一平面に沿うように保持されている。このため、シート状配線部材５０は、第１導電板３２Ａ及び第２導電板３２Ｂを一定の位置関係で保持する役割を有している必要は無い。この点からすると、シート状配線部材５０が第１導電板３２Ａ及び第２導電板３２Ｂに固定される必要は無い。 The first conductive plate 32A and the second conductive plate 32B are held along the same plane by the insulating portion 38. Therefore, the sheet-shaped wiring member 50 does not need to have a role of holding the first conductive plate 32A and the second conductive plate 32B in a constant positional relationship. From this point of view, it is not necessary for the sheet-shaped wiring member 50 to be fixed to the first conductive plate 32A and the second conductive plate 32B.
　しかしながら、シート状配線部材５０がベース基板３０に重ね合された状態で、素子４０の第１端子４２が第１導電板３２Ａに電気的に接続された状態で固定される。さらに、第２端子４３及び制御端子４４がシート状配線部材５０の導体５２ａ、５２ｂに電気的に接続された状態で固定される。これらの固定を行う際に、ベース基板３０に対してシート状配線部材５０が位置ずれしたり、反ったりしてしまうと、端子４２、４３、４４の固定箇所がずれてしまい、実装不良が生じ得る。 However, the sheet-shaped wiring member 50 is fixed on the base substrate 30 in a state where the first terminal 42 of the element 40 is electrically connected to the first conductive plate 32A. Further, the second terminal 43 and the control terminal 44 are fixed in a state of being electrically connected to the conductors 52a and 52b of the sheet-shaped wiring member 50. If the sheet-shaped wiring member 50 is displaced or warped with respect to the base substrate 30 during these fixings, the fixing points of the terminals 42, 43, and 44 will be displaced, resulting in mounting defects. obtain.
　そこで、シート状配線部材５０がベース基板３０の主面３０Ａに重ね合された状態で、シート状配線部材５０の少なくとも一部がベース基板３０に固定される。 Therefore, at least a part of the sheet-shaped wiring member 50 is fixed to the base board 30 in a state where the sheet-shaped wiring member 50 is superposed on the main surface 30A of the base board 30.
　本実施形態においては、シート状配線部材５０が面状に広がる接着部６０を介してベース基板３０に対して固定される例が説明される。面状に広がる接着部６０とは、ベース基板３０及びシート状配線部材５０の両方に対して接着性を呈する面状に広がった部分である。例えば、接着部６０は、その厚み寸法よりも大きい最小幅の領域で、ベース基板３０とシート状配線部材５０との間に広がる。ここで、面状に広がる接着部６０は、液体から固体となってベース基板３０及びシート状配線部材５０の両方に接着するものであってもよい。面状に広がる接着部６０は、柔らかい状態を保ったままベース基板３０及びシート状配線部材５０に押付けられることでベース基板３０及びシート状配線部材５０に接着するものであってもよい。 In the present embodiment, an example in which the sheet-shaped wiring member 50 is fixed to the base substrate 30 via the adhesive portion 60 extending in a plane shape will be described. The adhesive portion 60 that spreads in a plane shape is a portion that spreads in a plane shape that exhibits adhesiveness to both the base substrate 30 and the sheet-shaped wiring member 50. For example, the adhesive portion 60 extends between the base substrate 30 and the sheet-shaped wiring member 50 in a region having a minimum width larger than the thickness dimension thereof. Here, the adhesive portion 60 that spreads in a plane shape may be one that changes from a liquid to a solid and adheres to both the base substrate 30 and the sheet-like wiring member 50. The adhesive portion 60 that spreads out in a plane shape may be adhered to the base substrate 30 and the sheet-shaped wiring member 50 by being pressed against the base substrate 30 and the sheet-shaped wiring member 50 while maintaining a soft state.
　面状に広がる接着部６０の一例は、両面粘着シートである。両面粘着シートは、両面が粘着性を呈するシート状接着部の一例である。両面粘着シートは、例えば、シート状基材の両面に粘着層が形成された部材である。両面粘着シートがシート状配線部材５０の一方主面に貼付けられた状態で、シート状配線部材５０が両面粘着シートを介してベース基板３０に貼付けられる。 An example of the adhesive portion 60 that spreads in a planar shape is a double-sided adhesive sheet. The double-sided adhesive sheet is an example of a sheet-like adhesive portion in which both sides are adhesive. The double-sided adhesive sheet is, for example, a member in which adhesive layers are formed on both sides of a sheet-like base material. The sheet-shaped wiring member 50 is attached to the base substrate 30 via the double-sided adhesive sheet in a state where the double-sided adhesive sheet is attached to one main surface of the sheet-shaped wiring member 50.
　面状に広がる接着部６０の他の例は、液状の接着剤がベース基板３０とシート状配線部材５０に接着した状態で固化したものである。例えば、液状の接着剤がシート状配線部材５０又はベース基板３０に塗布された状態で、シート状配線部材５０とベース基板３０とが重ね合される。これにより、液状の接着剤がシート状配線部材５０とベース基板３０との間に面状に広がった状態で固化し、シート状配線部材５０とベース基板３０とを接着状態に保つ。 Another example of the adhesive portion 60 spreading in a planar shape is a solidified state in which a liquid adhesive is adhered to the base substrate 30 and the sheet-shaped wiring member 50. For example, the sheet-shaped wiring member 50 and the base substrate 30 are overlapped with each other in a state where the liquid adhesive is applied to the sheet-shaped wiring member 50 or the base substrate 30. As a result, the liquid adhesive solidifies in a state of spreading in a plane between the sheet-shaped wiring member 50 and the base substrate 30, and keeps the sheet-shaped wiring member 50 and the base substrate 30 in an adhesive state.
　面状に広がる接着部６０は、シート状配線部材５０とベース基板３０との間において如何なる領域に広がっていてもよい。 The adhesive portion 60 extending in a plane shape may be extended in any region between the sheet-shaped wiring member 50 and the base substrate 30.
　シート状配線部材５０は、素子４０を囲む領域で、ベース基板３０に固定されていることが好ましい。ここでは、シート状配線部材５０は、複数の端子４２の全体を囲むような領域でベース基板３０上に広がっている。シート状配線部材５０には、上記貫通孔５１ｈ３、５１ｈ５が形成されている。 The sheet-shaped wiring member 50 is preferably fixed to the base substrate 30 in a region surrounding the element 40. Here, the sheet-shaped wiring member 50 extends on the base substrate 30 in a region that surrounds the entire plurality of terminals 42. The through holes 51h3 and 51h5 are formed in the sheet-shaped wiring member 50.
　面状に広がる接着部６０は、シート状配線部材５０のうち複数の素子４０の周囲で全体的に分布している。また、面状に広がる接着部６０には、当該貫通孔５１ｈ３、５１ｈ５に対応する箇所に貫通孔６１ｈ３、６１ｈ５が形成されている。このため、面状に広がる接着部６０は、素子４０を囲む領域に分布している。シート状配線部材５０は、素子４０を囲む領域で、接着部６０を介してベース基板３０に固定されている。 The adhesive portions 60 spreading in a plane shape are distributed as a whole around a plurality of elements 40 of the sheet-shaped wiring member 50. Further, in the adhesive portion 60 extending in a planar shape, through holes 61h3 and 61h5 are formed at locations corresponding to the through holes 51h3 and 51h5. Therefore, the adhesive portions 60 spreading in a plane shape are distributed in the region surrounding the element 40. The sheet-shaped wiring member 50 is fixed to the base substrate 30 via an adhesive portion 60 in a region surrounding the element 40.
　複数の素子４０を前提とすると、接着部６０は、複数の素子４０をまとめて囲む領域及び個別に囲む領域に分布していてもよい。実施形態１では、接着部６０が複数の素子４０をまとめて囲む領域及び個別に囲む領域に分布している例が示される（図２参照）。 Assuming that a plurality of elements 40 are assumed, the adhesive portions 60 may be distributed in a region surrounding the plurality of elements 40 together and a region surrounding the plurality of elements 40 individually. In the first embodiment, an example is shown in which the adhesive portion 60 is distributed in a region surrounding the plurality of elements 40 together and a region surrounding the elements 40 individually (see FIG. 2).
　図６に示す変形例では、接着部６０Ｂが複数の素子４０をまとめて囲む領域に分布している例が示される。接着部６０Ｂは、複数の素子４０を個別に囲んでいない。このため、複数の素子４０の間には、接着部６０Ｂは存在しない。ここでは、接着部６０Ｂには、複数の素子４０の下方領域に連続して広がる１つの貫通孔６１ｈ５Ｂが形成されている。 In the modified example shown in FIG. 6, an example is shown in which the adhesive portion 60B is distributed in a region surrounding a plurality of elements 40 together. The adhesive portion 60B does not individually surround the plurality of elements 40. Therefore, the adhesive portion 60B does not exist between the plurality of elements 40. Here, the adhesive portion 60B is formed with one through hole 61h5B that continuously extends in the lower region of the plurality of elements 40.
　面状に広がる接着部６０、６０Ｂがシート状接着部である場合、当該シート状接着部は、複数の素子４０をまとめて囲む領域を含むよい。この場合、単一のシート状接着部がシート状配線部材５０又はベース基板３０に貼付けられれば、シート状配線部材５０が、素子４０をまとめて囲む領域で、ベース基板３０に固定される。このため、固定作業が容易となる。 When the adhesive portions 60 and 60B spreading in a plane shape are sheet-like adhesive portions, the sheet-like adhesive portions may include a region that collectively surrounds a plurality of elements 40. In this case, if a single sheet-shaped adhesive portion is attached to the sheet-shaped wiring member 50 or the base substrate 30, the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a region that collectively surrounds the element 40. Therefore, the fixing work becomes easy.
　図７は面状に広がる接着部６０の他の変形例を示す分解斜視図である。同図に示すように、面状に広がる接着部６０Ｃは、素子４０を間に配置して対向する一対の側方領域に設けられる。ここでは、複数の素子４０が並列状態で並んでいる。一対の接着部６０Ｃは、複数の素子４０が並ぶ方向に沿って、複数の素子４０の両側領域に設けられる。接着部６０Ｃは、方形状に広がる形状に形成される。これにより、シート状配線部材５０は、複数の素子４０を間に配置して対向する一対の側方領域で、ベース基板３０に固定される。 FIG. 7 is an exploded perspective view showing another modified example of the adhesive portion 60 spreading in a planar shape. As shown in the figure, the adhesive portion 60C extending in a plane shape is provided in a pair of side regions facing each other with the elements 40 arranged between them. Here, a plurality of elements 40 are arranged in parallel. The pair of adhesive portions 60C are provided on both side regions of the plurality of elements 40 along the direction in which the plurality of elements 40 are arranged. The adhesive portion 60C is formed in a shape that spreads in a square shape. As a result, the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a pair of side regions facing each other with a plurality of elements 40 arranged in between.
　複数の素子４０を前提とした場合において、シート状配線部材は、それぞれの素子４０について、素子４０を間に配置して対向する一対の側方領域に設けられていてもよい。 When a plurality of elements 40 are premised, the sheet-shaped wiring member may be provided in a pair of side regions facing each other with the elements 40 arranged in between for each element 40.
　いずれにせよ、シート状配線部材５０が、少なくとも１つの素子４０を間に配置して対向する一対の側方領域で、ベース基板３０に固定されていれば、少ない固定面積であっても、ベース基板３０に対するシート状配線部材５０の位置ずれが有効に抑制される。 In any case, if the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a pair of side regions facing each other with at least one element 40 arranged between them, the base may have a small fixed area. The misalignment of the sheet-shaped wiring member 50 with respect to the substrate 30 is effectively suppressed.
　上記基板構造体２０は例えば次のようにして製造される。 The substrate structure 20 is manufactured as follows, for example.
　まず、ベース基板３０上に接着部６０を介してシート状配線部材５０が固定される。 First, the sheet-shaped wiring member 50 is fixed on the base substrate 30 via the adhesive portion 60.
　次に、素子４０がベース基板３０上に実装される。例えば、半田ペーストが、第１導電板３２Ａのうち貫通孔５１ｈ５で露出する部分、第２導電板３２Ｂのうち貫通孔５１ｈ３で露出する部分に塗布される。また、半田ペーストが、シート状配線部材５０のうち開口５１ｈ１部分、開口５１ｈ２から貫通孔５１ｈ３に達する部分、開口５１ｈ４部分に塗布される。そして、素子４０がベース基板３０及びシート状配線部材５０上に置かれる。この状態で、半田ペーストが加熱されて溶融した後、固化する。これにより、第１端子４２が半田３５により第１導電板３２Ａに接続される。第２端子４３が半田３６によって中継導体５２ａ接続され、中継導体５２ａが半田３７によって第２導電板３２Ｂに接続される。また、制御端子４４が半田３４によって線状導体５２ｂに接続される。 Next, the element 40 is mounted on the base substrate 30. For example, the solder paste is applied to a portion of the first conductive plate 32A exposed through the through hole 51h5 and a portion of the second conductive plate 32B exposed through the through hole 51h3. Further, the solder paste is applied to the opening 51h1 portion, the portion reaching the through hole 51h3 from the opening 51h2, and the opening 51h4 portion of the sheet-shaped wiring member 50. Then, the element 40 is placed on the base substrate 30 and the sheet-shaped wiring member 50. In this state, the solder paste is heated to melt and then solidify. As a result, the first terminal 42 is connected to the first conductive plate 32A by the solder 35. The second terminal 43 is connected to the relay conductor 52a by the solder 36, and the relay conductor 52a is connected to the second conductive plate 32B by the solder 37. Further, the control terminal 44 is connected to the linear conductor 52b by the solder 34.
　素子４０がベース基板３０に実装される際、シート状配線部材５０はベース基板３０に固定されているため、シート状配線部材５０はベース基板３０に対して位置ずれし難い。また、シート状配線部材５０に熱が加わって反りそうになっても、シート状配線部材５０がベース基板３０から浮き難い。このため、端子４２、４３、４４の位置ずれ等が生じ難く、実装不良が抑制される。 When the element 40 is mounted on the base board 30, the sheet-shaped wiring member 50 is fixed to the base board 30, so that the sheet-shaped wiring member 50 is unlikely to be displaced with respect to the base board 30. Further, even if heat is applied to the sheet-shaped wiring member 50 and the sheet-shaped wiring member 50 is likely to warp, the sheet-shaped wiring member 50 is unlikely to float from the base substrate 30. Therefore, misalignment of the terminals 42, 43, and 44 is unlikely to occur, and mounting defects are suppressed.
　＜実施形態１の効果等＞
　本実施形態１に係る基板構造体２０によると、シート状配線部材５０がベース基板３０の主面３０Ａに重ね合された状態で、シート状配線部材５０の少なくとも一部がベース基板３０に固定されている。このため、素子４０の各端子４２、４３、４４が、複数の導電板３２Ａ、３２Ｂの少なくとも１つと、導体５２ａ、５２ｂとに電気的に接続された状態で固定される際に、素子４０とシート状配線部材５０との位置ずれが生じ難い。これにより、素子４０の実装不良が抑制される。 <Effects of Embodiment 1>
According to the substrate structure 20 according to the first embodiment, at least a part of the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a state where the sheet-shaped wiring member 50 is overlapped with the main surface 30A of the base substrate 30. ing. Therefore, when each of the terminals 42, 43, 44 of the element 40 is fixed in a state of being electrically connected to at least one of the plurality of conductive plates 32A, 32B and the conductors 52a, 52b, the element 40 Positional deviation from the sheet-shaped wiring member 50 is unlikely to occur. As a result, mounting defects of the element 40 are suppressed.
　また、素子４０の一例は、スイッチング素子である。かかるスイッチング素子は、大電流の通電に適した導電板３２Ａ、３２Ｂと信号を伝送するのに適したシート状配線部材５０とに跨って状態で実装され得る。すなわち、各端子４２、４３、４４のうちの少なくとも１つが複数の導電板３２Ａ、３２Ｂのうちの１つに電気的に接続された状態で固定され、各端子４２、４３、４４のうちの他の少なくとも１つが導体５２ａ、５２ｂに接続された状態で固定される。このようなスイッチング素子である素子４０がベース基板３０に対して実装される際に、実装不良が抑制される。 An example of the element 40 is a switching element. Such a switching element can be mounted in a state of straddling the conductive plates 32A and 32B suitable for energizing a large current and the sheet-shaped wiring member 50 suitable for transmitting a signal. That is, at least one of the terminals 42, 43, 44 is fixed in a state of being electrically connected to one of the plurality of conductive plates 32A, 32B, and the other of the terminals 42, 43, 44. At least one of them is fixed in a state of being connected to the conductors 52a and 52b. When the element 40, which is such a switching element, is mounted on the base substrate 30, mounting defects are suppressed.
　シート状配線部材５０が、素子４０を間に配置して対向する一対の側方領域で、接着部６０Ｃを介してベース基板３０に固定されていてもよい。この場合、接着部６０Ｃは、素子４０の両側に設けられているため、少ない固定箇所でも、シート状配線部材５０が位置ずれし難く、また、素子４０の周辺で大きく浮いた状態となり難い。このため、比較的少ない固定箇所で、シート状配線部材５０と素子４０との位置ずれを抑制するのに効果的な領域で、シート状配線部材５０がベース基板３０に固定される。 The sheet-shaped wiring member 50 may be fixed to the base substrate 30 via the adhesive portion 60C in a pair of side regions facing each other with the elements 40 arranged in between. In this case, since the adhesive portions 60C are provided on both sides of the element 40, the sheet-shaped wiring member 50 is unlikely to be misaligned even at a small number of fixing points, and it is unlikely that the sheet-like wiring member 50 is greatly floated around the element 40. Therefore, the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a region effective for suppressing the positional deviation between the sheet-shaped wiring member 50 and the element 40 at a relatively small number of fixing points.
　また、シート状配線部材５０は、素子４０を囲む領域で、接着部６０、６０Ｂによって、ベース基板３０に固定されていてもよい。この場合、素子４０の周囲で、シート状配線部材５０がベース基板３０に固定される。このため、素子４０の周辺で、シート状配線部材５０が位置ずれし難く、また、シート状配線部材５０が浮いた状態となり難い。このため、シート状配線部材５０と素子４０との位置ずれを抑制するのに効果的な領域で、シート状配線部材５０がベース基板３０に固定される。 Further, the sheet-shaped wiring member 50 may be fixed to the base substrate 30 by the adhesive portions 60 and 60B in the region surrounding the element 40. In this case, the sheet-shaped wiring member 50 is fixed to the base substrate 30 around the element 40. Therefore, the sheet-shaped wiring member 50 is unlikely to be displaced around the element 40, and the sheet-shaped wiring member 50 is unlikely to float. Therefore, the sheet-shaped wiring member 50 is fixed to the base substrate 30 in an area effective for suppressing the positional deviation between the sheet-shaped wiring member 50 and the element 40.
　また、シート状配線部材５０は、ベース基板３０に対して面状に広がる接着部６０、６０Ｂ、６０Ｃを介して固定されるため、シート状配線部材５０がベース基板３０に対してしっかりと固定される。 Further, since the sheet-shaped wiring member 50 is fixed to the base substrate 30 via the adhesive portions 60, 60B, 60C extending in a plane shape, the sheet-shaped wiring member 50 is firmly fixed to the base substrate 30. To.
　接着部６０、６０Ｂが両面接着シート等のシート状接着部である場合、シート状接着部は、複数の素子４０をまとめて囲む領域を含むとよい。これにより、複数の素子４０が実装される場合でも、シート状配線部材５０と素子４０との位置ずれを抑制するのに効果的な領域で、シート状配線部材５０がベース基板３０に固定される。また、単一のシート状接着部がシート状配線部材５０又はベース基板３０に貼付けられれば、シート状配線部材５０が複数の素子４０をまとめて囲む領域でベース基板３０に固定される。このため、ベース基板３０に対するシート状配線部材５０の固定作業が容易となる。 When the adhesive portions 60 and 60B are sheet-like adhesive portions such as double-sided adhesive sheets, the sheet-like adhesive portions may include an area that collectively surrounds a plurality of elements 40. As a result, even when a plurality of elements 40 are mounted, the sheet-shaped wiring member 50 is fixed to the base substrate 30 in an area effective for suppressing the positional deviation between the sheet-shaped wiring member 50 and the element 40. .. Further, if a single sheet-shaped adhesive portion is attached to the sheet-shaped wiring member 50 or the base substrate 30, the sheet-shaped wiring member 50 is fixed to the base substrate 30 in a region that collectively surrounds the plurality of elements 40. Therefore, the work of fixing the sheet-shaped wiring member 50 to the base substrate 30 becomes easy.
　[実施形態２]
　実施形態２に係る基板構造体１２０について説明する。図８は実施形態２に係る基板構造体１２０を示す平面図である。図９は図８におけるＩＸ－ＩＸ線断面図である。図９において各部の厚み等が誇張して描かれている場合がある。なお、本実施形態２の説明において、実施形態１で説明したものと同様構成要素については同一符号が付されてその説明が省略される。 [Embodiment 2]
The substrate structure 120 according to the second embodiment will be described. FIG. 8 is a plan view showing the substrate structure 120 according to the second embodiment. FIG. 9 is a sectional view taken along line IX-IX in FIG. In FIG. 9, the thickness of each part may be exaggerated. In the description of the second embodiment, the same reference numerals are given to the components as described in the first embodiment, and the description thereof is omitted.
　実施形態２では、シート状配線部材５０とベース基板３０とを固定する構造として、接着部６０に代えて次の構成が採用される。 In the second embodiment, the following configuration is adopted instead of the adhesive portion 60 as a structure for fixing the sheet-shaped wiring member 50 and the base substrate 30.
　すなわち、シート状配線部材５０に固定用孔１５８ｈが形成される。ここでは、一対の固定用孔１５８ｈが、素子４０を間に配置した一対の側方領域に形成される。ここでは、複数の素子４０が並列状に設けられる。一対の固定用孔１５８ｈは、複数の素子４０が並ぶ方向において、両側外方領域に形成される。ここでは、一対の固定用孔１５８ｈは、素子４０における第１端子４２と第２端子４３とを結ぶ方向においてずれた位置に形成される。固定用孔は１つであってもよいし、より多数形成されていてもよい。 That is, a fixing hole 158h is formed in the sheet-shaped wiring member 50. Here, a pair of fixing holes 158h are formed in a pair of lateral regions in which the elements 40 are arranged in between. Here, a plurality of elements 40 are provided in parallel. The pair of fixing holes 158h are formed in the outer regions on both sides in the direction in which the plurality of elements 40 are arranged. Here, the pair of fixing holes 158h are formed at positions shifted in the direction connecting the first terminal 42 and the second terminal 43 of the element 40. The number of fixing holes may be one, or a larger number may be formed.
　シート状配線部材５０がベース基板３０上に重ね合された状態で、固定用孔１５８ｈに接着剤１６０が充填される。接着剤１６０は、例えば、小さい開口を有するノズル１６８等から供給されて固定用孔１５８ｈに注入される。接着剤１６０は、固定用孔１５８ｈの内周面に接着されると共に、ベース基板３０の主面３０Ａに接着されている。好ましくは、接着剤１６０は、固定用孔１５８ｈからベース基板３０とは反対側にはみ出ている。はみ出た部分１６１は、固定用孔１５８ｈの内径よりも大きい外径をなしている。このはみ出た部分１６１が固定用孔１５８ｈの周縁部でシート状配線部材５０の外向き面に引っ掛かる。これにより、シート状配線部材５０がベース基板３０から離れる方向への移動がより抑制される。この場合、接着剤１６０は固定用孔１５８ｈの内周面に接着されなくてもよい。ここでは、接着剤１６０は、第１導電板３２Ａに接着されているが、第２導電板３２Ｂに接着されてもよいし、絶縁部３８に接着されてもよい。 The adhesive 160 is filled in the fixing hole 158h in a state where the sheet-shaped wiring member 50 is superposed on the base substrate 30. The adhesive 160 is supplied from, for example, a nozzle 168 having a small opening and injected into the fixing hole 158h. The adhesive 160 is adhered to the inner peripheral surface of the fixing hole 158h and also to the main surface 30A of the base substrate 30. Preferably, the adhesive 160 protrudes from the fixing hole 158h on the side opposite to the base substrate 30. The protruding portion 161 has an outer diameter larger than the inner diameter of the fixing hole 158h. The protruding portion 161 is caught on the outward surface of the sheet-shaped wiring member 50 at the peripheral edge of the fixing hole 158h. As a result, the movement of the sheet-shaped wiring member 50 in the direction away from the base substrate 30 is further suppressed. In this case, the adhesive 160 does not have to be adhered to the inner peripheral surface of the fixing hole 158h. Here, the adhesive 160 is adhered to the first conductive plate 32A, but may be adhered to the second conductive plate 32B or the insulating portion 38.
　本実施形態２によると、面状に広がる接着部を用いてシート状配線部材５０がベース基板３０に固定される効果を除き、上記実施形態１と同様の作用効果が得られる。 According to the second embodiment, the same effect as that of the first embodiment can be obtained except for the effect that the sheet-shaped wiring member 50 is fixed to the base substrate 30 by using the adhesive portion that spreads in a plane shape.
　本実施形態２では、シート状配線部材５０がベース基板３０に重ね合された状態で接着剤１６０が固定用孔に充填されることで、シート状配線部材５０がベース基板３０に固定される。この際、ベース基板３０に対するシート状配線部材５０の位置を調整した状態で、接着剤１６０の充填作業を行うことができる。このため、シート状配線部材５０がベース基板３０に対してなるべく正確な位置で固定される。また、シート状配線部材５０の固定作業が容易に行われ得る。 In the second embodiment, the sheet-shaped wiring member 50 is fixed to the base substrate 30 by filling the fixing holes with the adhesive 160 in a state where the sheet-shaped wiring member 50 is overlapped with the base substrate 30. At this time, the filling operation of the adhesive 160 can be performed while the position of the sheet-shaped wiring member 50 with respect to the base substrate 30 is adjusted. Therefore, the sheet-shaped wiring member 50 is fixed at a position as accurate as possible with respect to the base substrate 30. Further, the fixing work of the sheet-shaped wiring member 50 can be easily performed.
　[変形例]
　上記実施形態１、２において、シート状配線部材５０をベース基板３０に固定する構成は上記例に限られない。例えば、超音波溶接、熱溶着等によって、シート状配線部材５０がベース基板３０に固定されてもよい。 [Modification example]
In the first and second embodiments, the configuration in which the sheet-shaped wiring member 50 is fixed to the base substrate 30 is not limited to the above example. For example, the sheet-shaped wiring member 50 may be fixed to the base substrate 30 by ultrasonic welding, heat welding, or the like.
　なお、上記各実施形態及び各変形例で説明した各構成は、相互に矛盾しない限り適宜組合わせられてもよい。例えば、実施形態１における面状の接着部６０、６０Ｂ、６０Ｃと、実施形態２における固定用孔１５８ｈ及び接着剤１６０を用いた構成とが併用されてもよい。 It should be noted that the configurations described in the above embodiments and the modifications may be appropriately combined as long as they do not conflict with each other. For example, the planar adhesive portions 60, 60B, 60C in the first embodiment and the configuration using the fixing holes 158h and the adhesive 160 in the second embodiment may be used in combination.
　１０　　電気接続箱
　１２　　筐体
　１４　　制御基板
　２０　　基板構造体
　３０　　ベース基板
　３０Ａ　　主面
　３２Ａ　　第１導電板
　３２Ｂ　　第２導電板
　３３　　外部接続部
　３３ｈ　　孔
　３４、３５、３６、３７　　半田
　３８　　絶縁部
　３８ａ　　絶縁介在部
　３８ｂ　　絶縁保持部
　４０　　素子
　４１　　素子本体部
　４２　　第１端子
　４３　　第２端子
　４４　　制御端子
　５０　　シート状配線部材
　５１　　樹脂フィルム
　５１ｈ１、５１ｈ２、５１ｈ４　　開口
　５１ｈ３、５１ｈ５　　貫通孔
　５２ａ　　中継導体
　５２ｂ　　線状導体
　６０、６０Ｂ、６０Ｃ　　接着部
　６１ｈ３、６１ｈ５、６１ｈ５Ｂ　　貫通孔
　１２０　　基板構造体
　１５８ｈ　　固定用孔
　１６０　　接着剤
　１６１　　部分
　１６８　　ノズル 10 Electrical junction box 12 Housing 14 Control board 20 Board structure 30 Base board 30A Main surface 32A 1st conductive plate 32B 2nd conductive plate 33 External connection 33h Hole 34, 35, 36, 37 Solder 38 Insulation 38a Insulation intervention Part 38b Insulation holding part 40 Element 41 Element body 42 First terminal 43 Second terminal 44 Control terminal 50 Sheet-shaped wiring member 51 Resin film 51h1, 51h2, 51h4 Opening 51h3, 51h5 Through hole 52a Relay conductor 52b Linear conductor 60, 60B, 60C Adhesive part 61h3, 61h5, 61h5B Through hole 120 Substrate structure 158h Fixing hole 160 Adhesive 161 Part 168 Nozzle

Claims (7)

  1. 　複数の導電板と、絶縁部とを含むベース基板と、
    　前記ベース基板の主面に実装された素子と、
    　導体を含むシート状配線部材と、
    　を備え、
    　前記絶縁部は、前記複数の導電板の間に介在した状態で、前記複数の導電板を同一平面に沿って保持し、
    　前記シート状配線部材が前記ベース基板の主面に重ね合された状態で、前記シート状配線部材の少なくとも一部が前記ベース基板に固定されており、
    　前記素子が複数の端子を備え、
    　前記複数の端子のうちの少なくとも１つが前記複数の導電板のうちの少なくとも１つに電気的に接続された状態で固定され、
    　前記複数の端子のうちの他の少なくとも１つが前記導体に電気的に接続された状態で固定されている、基板構造体。     A base substrate including a plurality of conductive plates and an insulating portion,
    The elements mounted on the main surface of the base substrate and
    Sheet-shaped wiring members including conductors and
    With
    The insulating portion holds the plurality of conductive plates along the same plane in a state of being interposed between the plurality of conductive plates.
    At least a part of the sheet-shaped wiring member is fixed to the base board in a state where the sheet-shaped wiring member is superposed on the main surface of the base board.
    The element has a plurality of terminals
    At least one of the plurality of terminals is fixed in a state of being electrically connected to at least one of the plurality of conductive plates.
    A substrate structure in which at least one of the plurality of terminals is fixed in a state of being electrically connected to the conductor.
  2. 　請求項１に記載の基板構造体であって、
    　前記素子は、前記複数の端子として第１端子と第２端子と制御端子とを含み、前記制御端子への制御信号に応じて前記第１端子と前記第２端子との間で通電及び遮断を行うスイッチング素子であり、
    　前記第１端子、前記第２端子及び前記制御端子のうちの少なくとも１つが前記複数の導電板のうちの１つに電気的に接続された状態で固定され、
    　前記第１端子、前記第２端子及び前記制御端子のうちの他の少なくとも１つが前記導体に接続された状態で固定されている、基板構造体。     The substrate structure according to claim 1.
    The element includes a first terminal, a second terminal, and a control terminal as the plurality of terminals, and energizes and shuts off between the first terminal and the second terminal in response to a control signal to the control terminal. It is a switching element to perform
    At least one of the first terminal, the second terminal, and the control terminal is fixed in a state of being electrically connected to one of the plurality of conductive plates.
    A substrate structure in which at least one of the first terminal, the second terminal, and the control terminal is fixed in a state of being connected to the conductor.
  3. 　請求項１又は請求項２に記載の基板構造体であって、
    　前記シート状配線部材は、前記素子を間に配置して対向する一対の側方領域で、前記ベース基板に固定されている、基板構造体。     The substrate structure according to claim 1 or 2.
    The sheet-shaped wiring member is a substrate structure in which the elements are arranged between them and fixed to the base substrate in a pair of side regions facing each other.
  4. 　請求項１又は請求項２に記載の基板構造体であって、
    　前記シート状配線部材は、前記素子を囲む領域で、前記ベース基板に固定されている、基板構造体。     The substrate structure according to claim 1 or 2.
    The sheet-shaped wiring member is a substrate structure that is fixed to the base substrate in a region surrounding the element.
  5. 　請求項１から請求項４のいずれか１項に記載の基板構造体であって、
    　前記シート状配線部材が前記ベース基板に対して面状に広がる接着部を介して固定されている、基板構造体。     The substrate structure according to any one of claims 1 to 4.
    A substrate structure in which the sheet-shaped wiring member is fixed to the base substrate via an adhesive portion that spreads in a plane.
  6. 　請求項１、請求項２及び請求項４のいずれか１項に記載の基板構造体であって、
    　前記素子は、複数の素子を備え、
    　前記シート状配線部材が前記ベース基板に対してシート状接着部を介して固定され、
    　前記シート状接着部は、前記複数の素子をまとめて囲む領域を含む、基板構造体。     The substrate structure according to any one of claims 1, 2, and 4.
    The element includes a plurality of elements.
    The sheet-shaped wiring member is fixed to the base substrate via the sheet-shaped adhesive portion,
    The sheet-shaped adhesive portion is a substrate structure including a region that collectively surrounds the plurality of elements.
  7. 　請求項１から請求項３のいずれか１項に記載の基板構造体であって、
    　前記シート状配線部材に固定用孔が形成され、
    　前記固定用孔に充填されて前記ベース基板に接着された状態となった接着剤を介して、前記シート状配線部材が前記ベース基板に固定されている、基板構造体。     The substrate structure according to any one of claims 1 to 3.
    A fixing hole is formed in the sheet-shaped wiring member, and a fixing hole is formed.
    A substrate structure in which the sheet-shaped wiring member is fixed to the base substrate via an adhesive that is filled in the fixing holes and adhered to the base substrate.
PCT/JP2020/018790 2019-05-27 2020-05-11 Substrate structure WO2020241219A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006074984A (en) * 2004-08-03 2006-03-16 Auto Network Gijutsu Kenkyusho:Kk Electrical connection box
JP2013105522A (en) * 2011-11-10 2013-05-30 Auto Network Gijutsu Kenkyusho:Kk Battery wiring module
JP2015191929A (en) * 2014-03-27 2015-11-02 株式会社オートネットワーク技術研究所 Circuit configuration and method of manufacturing the same
WO2018123584A1 (en) * 2016-12-28 2018-07-05 株式会社オートネットワーク技術研究所 Circuit structure and electrical connection box

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006074984A (en) * 2004-08-03 2006-03-16 Auto Network Gijutsu Kenkyusho:Kk Electrical connection box
JP2013105522A (en) * 2011-11-10 2013-05-30 Auto Network Gijutsu Kenkyusho:Kk Battery wiring module
JP2015191929A (en) * 2014-03-27 2015-11-02 株式会社オートネットワーク技術研究所 Circuit configuration and method of manufacturing the same
WO2018123584A1 (en) * 2016-12-28 2018-07-05 株式会社オートネットワーク技術研究所 Circuit structure and electrical connection box

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