WO2020240252A1 - Procédé et appareil de production d'un transpondeur d'identification par radiofréquence (rfid) - Google Patents

Procédé et appareil de production d'un transpondeur d'identification par radiofréquence (rfid) Download PDF

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Publication number
WO2020240252A1
WO2020240252A1 PCT/IB2019/054430 IB2019054430W WO2020240252A1 WO 2020240252 A1 WO2020240252 A1 WO 2020240252A1 IB 2019054430 W IB2019054430 W IB 2019054430W WO 2020240252 A1 WO2020240252 A1 WO 2020240252A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
substrate
contact
substrate area
areas
Prior art date
Application number
PCT/IB2019/054430
Other languages
English (en)
Inventor
Lauri Huhtasalo
Eerik HALONEN
Juha Ikonen
Original Assignee
Stora Enso Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stora Enso Oyj filed Critical Stora Enso Oyj
Priority to PCT/IB2019/054430 priority Critical patent/WO2020240252A1/fr
Priority to FI20216339A priority patent/FI20216339A1/fi
Priority to SE2151631A priority patent/SE545307C2/en
Publication of WO2020240252A1 publication Critical patent/WO2020240252A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/022—Processes or apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/0779—Antenna details the antenna being foldable or folded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention is related to a method and apparatus for production of a radio-frequency identification (RFID) transponder arranged on a carrying substrate.
  • RFID radio-frequency identification
  • RFID transponders used for a wide variety of purposes, such as for inventory, locate, identify, authenticate, configure, enable/disable and monitor items to which the tags are attached or in which the tags are embedded.
  • RFID systems may be used in retail applications to inventory and track items, in consumer- and industrial-electronics applications to configure and monitor items, in security applications to prevent loss or theft of items, in anti counterfeiting applications to ensure item authenticity, and in many, many other applications.
  • the integrated circuit In conventional RFID transponders, the integrated circuit (IC) is provided with 2 to 4 bumps or pads at their bottom side. These pads or bumps are to be connected to the leads of the conductive antenna pattern.
  • the RFID microchip is a major cost factor of the transponder, and the microchip cost is proportional to its size, and consequently there is also a need for smaller RFID microchips (IC:s). Flowever, as the size of the IC’s decreases, the assembly of the transponder, and in particular the placement of the IC to an antenna pattern, becomes more complicated, tedious and costly.
  • the bumps or pads may have a size of about 50 or 60 microns, and the separation gap is typically 0.10-0.20 mm.
  • the connection areas on the antenna conductor need to be equally closely arranged, and acceptable tolerances during manufacturing are extremely low.
  • the only available possibility to produce RFID transponders at relatively low cost is to use rather large IC:s, thereby enabling a relatively long separation between the bumps/pads, and thus enabling placement of the IC:s on the antenna pattern with somewhat less precision and with higher tolerances.
  • a method for producing radio-frequency identification (RFID) transponders arranged on a carrying substrate comprising:
  • first and second substrate areas each having at least one antenna element formed by an electrically conductive pattern arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first and second substrate areas, wherein a first antenna element arranged on the first substrate area has a first antenna terminal, and a second antenna element arranged on the second substrate area has a second antenna terminal;
  • a dual-sided integrated circuit including a first circuit block electrically coupled to a first antenna contact, disposed on a first external surface of the IC, and a second antenna contact, disposed on a second external surface of the IC opposite the first external surface of the IC; arranging the IC on the first substrate area, whereby the first antenna contact comes in mechanical contact with the first antenna terminal;
  • antenna elements Electrically connecting the antenna contacts and the antenna terminals results in the antenna elements becoming electrically and operatively connected to the integrated circuit that is electrically connected to the contact pad.
  • operatively connected is here meant that the antenna element is operable as an antenna for the integrated circuit.
  • characteristic melting point is here meant the temperature at which the material in question begins to behave as a more or less viscous liquid. If the material starts to melt at a well-defined temperature, then that temperature is the characteristic melting point. If the material is a composite where two or more constituents remain separate in different particles and/or even within a single particle, the characteristic melting point is the
  • the characteristic melting point is the melting temperature of that metal or alloy.
  • the characteristic melting point should preferably be low enough so that the integrated circuit and the first and second substrates are not damaged during the heating.
  • the characteristic melting point is less than 300 °C, and preferably less than 200 °C, for example in the range from 100 °C to 200 °C.
  • the antenna terminals contact can be made of an alloy comprising tin and bismuth. Such materials can be melted and cured quickly and often have characteristic melting points that are particularly suitable for the present invention.
  • the other parts of the antenna elements are also made of a material having a melting point at or below said characteristic melting point.
  • the antenna elements can also be made of an alloy comprising tin and bismuth.
  • the heating of the conductive material to a temperature exceeding a characteristic melting temperature of the conductive material results in a melting and solidification of the conductive material.
  • This may in itself be sufficient to form the contact.
  • the method may also comprise a step of applying a pressure onto the heated conductive material. This pressure is preferably applied relatively soon after the heating, so that the material still remains in a melted or almost melted state.
  • a good adhesion and good continuity of conductivity will be ensured.
  • the entire contact terminal(s) is not necessarily heated to a temperature at least equal to the characteristic melting point. It may be that only a portion of the contact terminal(s) is heated to such a temperature.
  • the present invention is based on the realization that dual-sided integrated circuits (ICs) including antenna contacts arranged on opposite surfaces allow connection to antenna elements in a very fast and reliable way, and with significantly reduced need for placement accuracy. This also enables use of very small sized ICs, and with significantly lower need for antenna gap resolution. It has further been found that this type of ICs is surprisingly well suited for production and assembling with a heat-induced attachment process. This process can e.g. be a sheet-to-sheet process, but may also be performed as a roll-to-roll process. This makes production very fast, and dramatically increases the throughput. At the same time, the assembly machine can be made simpler and less costly. Overall, this enables production of very small RFID tags and labels to a very low cost.
  • ICs integrated circuits
  • a factor that contributes to the speed and simplicity of the method is that the step of operatively connecting the antenna elements to the IC can be performed with relatively low precision, acceptable tolerances typically being in the range of ⁇ 0.5 mm.
  • mounting the IC to the antenna in a conventional way must usually be done with very high precision, typically with tolerance requirements of about +/- 50 microns.
  • the method is easy to integrate with many existing productions lines, especially production lines for producing packaging products because of the equipment typically used in such production lines. Further, since the RFID ICs may now be connected to the antenna elements close to and just before application of labels/tags to e.g. a package, or in the formation of a product, the package or product producer obtains greater control of the process. Thus, the method and apparatus of the present invention can e.g. be arranged as an integral part of a packing line, converting line or even into die cutting units. The production of the antenna elements also becomes faster, simpler and less costly, since relatively large and coarse antenna terminals may be used. The antenna elements can also be produced directly on e.g. a packaging material, whereby no extra layers and the like is needed, in contrast to in current label-based delivery formats.
  • connection in the time scale of ms can be achieved, such as in the range of ⁇ 1 s, and in particular in the range 1 -500 ms, whereas currently used boding times are typically in the range 7-9 s.
  • the mounting and connection of the ICs to the antenna elements is also made without e.g. the need to flip the IC:s, as in currently used flip-chip processes, and there is no need for thermo-compression curing and the like.
  • the first substrate area may be provided on a first substrate, and the second substrate area may be provided on a separate second substrate.
  • the first and second substrate areas may be provided on the same substrate, wherein the substrate may be folded to bring the first substrate area and the second substrate area together.
  • the one or more substrate(s) may be provided in the forms of sheets and/or webs, and may e.g. be provided in the form of a roll of substrate web.
  • the method may e.g. be a roll-to roll process, in which input rolls are provided at one end and output rolls are received at the other.
  • the process is highly suitable for fully automated production.
  • the method/apparatus also preferably comprises re-winding of the assembled web on an output roll, at a re-winding station.
  • the roll-to-roll process is highly suitable for production of RFID transponders arranged on a carrying substrate forming RFID labels or RFID tags.
  • the substrate(s) may form a packaging material, and wherein the RFID transponders arranged on a carrying substrate forms a packaging blank for an intelligent packaging product.
  • This can also be made in a roll-to-roll process, but may alternatively be made in a sheet-to-sheet process or in a roll-to-sheet process.
  • the antenna elements may be provided directly on a package material, in the form of a sheet or a web, and the ICs may be connected to the antenna elements e.g. in a packaging converting facility.
  • packaging blanks for use as intelligent packages, and with integrated RFID transponders can be produced in a very efficient way.
  • the heating may be applied be means of a contactless heating technique. Using such a technique helps to reduce the risk of the antenna element and/or the contact pads becoming smeared out. Also, such techniques typically allow for the heating step to be performed with relatively low precision, thus helping to make this step simple and fast.
  • the method may comprise pressing the heated antenna elements, and in particular the antenna terminals, and the corresponding antenna contacts against each other. This may further strengthen the mechanical connection between the antenna element and the contacts.
  • the antenna terminals may be pressed against the corresponding antenna contacts simultaneously with the heating, and/or after the heating.
  • the pressure may be applied by a nip.
  • the nip may have a surface temperature at or above the characteristic melting point. If pressure is applied after heating, as a separate step, the surface temperature of the nip is preferably lower than the characteristic melting point.
  • An adhesive may be arranged on at least one of the first and second substrate areas, the adhesive being arranged to adhere the first and second substrate areas together after the first and second substrate areas have been brought in mechanical contact.
  • the adhesive helps to create a strong attachment between the first and second substrate areas.
  • the adhesive may also act as dielectric material between the conductor pattern/antenna element below the IC and conductor pattern/antenna element above the IC, and will consequently also serve the purpose of preventing short-circuiting of those antenna elements/conductor patterns.
  • a lamination nip may also be used to apply pressure onto the assembled substrate, to provide an even better lamination.
  • the one or more substrate(s) can be made of at least one of: paper, board, polymer film, textile and non-woven material.
  • the substrate(s) can be made of paper.
  • the RFID transponders become particularly suitable for attachment to objects made of paper materials, such as boxes for packaging.
  • the RFID transponders may be either passive, i.e. powered by a reader’s electromagnetic field, or active, i.e. powered by an onboard battery.
  • the antenna elements may be produced in various ways.
  • the forming of the conductive pattern can be made by printing with conductive ink, such as silver ink, i.e. ink comprising conductive silver particles, or particles of carbon, copper, graphene, etc.
  • the ink may also comprise two or more different materials, such as particles of different materials, or particles comprising two or more materials.
  • the ink may comprise a material having a characteristic melting point being similar, identical or below the characteristic melting point of the contact pads.
  • the solvent can be evaporated by means of heating at an elevated temperature, by use of photonic curing, or the like.
  • the forming of the conductive pattern can also be made by first providing a conductive layer on the substrate, and the removing or forming this conductive layer into the desired conductive pattern, e.g. by means of grinding, cutting, or the like.
  • This can e.g. be made in the way disclosed in EP 1 665 912 and WO 2005/027599, said documents hereby being incorporated in their entirety by reference.
  • at least the ink used to form the antenna terminals is thermoplastic, and has a relatively low characteristic melting point, such as below 300 deg. C, to reduce the risk of damage to the IC:s due to the heat.
  • the forming of conductive material in a pattern comprise: transferring a conductive material in a pattern corresponding to said electrically conductive pattern to a surface of the substrate; and heating the conductive material to a temperature exceeding a characteristic melting temperature of the conductive material.
  • the conductive material is preferably in the form of electrically conductive solid particles.
  • the transferring of conductive material to the substrate surface may e.g. comprise direct printing of electrically conductive particles as a part of a compound that contains, in addition of the electrically conductive solid particles, a fluid or gelatinous substance.
  • the electrically conductive solid particles may also be in the form of dry powder.
  • an adhesive area may be created on the surface of the substrate prior to transfer of the particles.
  • Curing may be effected by heating, or by a combination of heat and pressure. In case both heat and pressure are used, the curing may be referred to as sintering.
  • the transferred conductive material e.g. in the form of particles, is converted into a continuously conducting pattern affixed to the web substrate.
  • the sintering is preferably carried out in a nip comprising two opposing nip members, at least one of which may be heatable, between which the web is fed.
  • the curing may also comprise irradiation of the conductive material, e.g. with UV radiation, e-beam radiation or the like.
  • the two antenna elements arranged on the two substrate areas may be identical or symmetrical to each other.
  • the two antenna elements have essentially the same size and coverage area.
  • one of the antenna elements is larger than the other.
  • the two antenna elements when electrically connected to the IC, together form an antenna for the RFID transponder, wherein the first antenna element forms X% of the antenna and the second antenna element forms 100-X% of the antenna, where X > 0.
  • X may here be 50, whereby the two antenna elements have the same size, but X may also be any number between 1 -and 99, such as between 25 and 50.
  • the dual-sided ICs can e.g. be made and designed in accordance with the disclosures of US 9489611 and US 2014/0144992, said documents hereby incorporated in their entirety by reference.
  • the internal wirings of the microchip are designed so that the IC has one antenna contact at one side, and another antenna contact at the other.
  • the antenna contacts on the IC are preferably relatively large, in terms of the size of the IC.
  • at least one of the first antenna contact and the second antenna contact may include a conductive pad spanning substantially an entirety of the first external surface or the second external surface of the IC, respectively.
  • a bump of smaller length and width dimensions may also be used, on one or both sides of the IC.
  • the IC can be provided with a bump on each of the two opposing sides, or with a pad on each of the two opposing sides, or with a bump on one side and a pad on the other.
  • the bumps/pads could be made of any commonly used material, such as gold, aluminum or copper.
  • an electrically conductive pattern forming the antenna elements for the RFID transponder, can be formed as an integral part of a conventional label converting process. This enables the production of labels with integrated electrically conductive patterns in a much faster and more cost-efficient way.
  • the same process may also comprise, as an integrated step, the arrangement and connection of the integrated circuit, i.e. the RFID chip.
  • steps that are conventionally performed separately in each of these processes such as insertion of web rolls, threading of webs through the production path, re-winding, etc, can hereby be performed only once, which makes the process much more cost and time efficient. It also reduces the overall need for manufacturing machinery and production space.
  • an apparatus for producing a radio-frequency identification transponder on a carrying substrate comprising:
  • an input station to receive one or more substrate, the substrate(s) having a first substrate area and a second substrate area, the first and second substrate areas each having at least one antenna element formed by an electrically conductive pattern arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first and second substrate areas, wherein a first antenna element arranged on the first substrate area has a first antenna terminal, and a second antenna element arranged on the second substrate area has a second antenna terminal;
  • a placement device arranged to place a dual-sided integrated circuit (IC) on the first substrate area, the IC including a first circuit block electrically coupled to a first antenna contact, disposed on a first external surface of the IC, and a second antenna contact, disposed on a second external surface of the IC opposite the first external surface of the IC, and wherein the IC is placed on the first substrate area in such a way that the first antenna contact comes in mechanical contact with the first antenna terminal;
  • IC dual-sided integrated circuit
  • a transfer device configured to bring the first substrate area and the second substrate area together, thereby bringing the second antenna contact in mechanical contact with the second antenna terminal;
  • a heating device configured to heat the first and second substrate areas in the vicinity of the IC to a temperature at least equal to a
  • the apparatus may be realized based on a conventional label converting machine, but with added equipment and stations to form the electrically conductive pattern, and for connecting an integrated circuit, such as an RFID chip, to the electrically conductive pattern.
  • the pattern forming station comprises a particle handler for transferring a conductive material in a pattern corresponding to the electrically conductive pattern to a surface of the face material web; and a heater for heating the conductive material to a temperature exceeding a characteristic melting temperature of the conductive material.
  • the apparatus may further comprise a pressing device arranged to press the first and second substrate areas against each other over the IC.
  • the pressure may e.g. be applied by a nip, wherein the surface temperature of the nip may be lower than said characteristic melting point.
  • the apparatus may further comprise an adhesive applicator, arranged to provide an adhesive on at least one of the first and second substrate areas, the adhesive being arranged to adhere the first and second substrate areas together after the first and second substrate areas have been brought in mechanical contact.
  • an adhesive applicator arranged to provide an adhesive on at least one of the first and second substrate areas, the adhesive being arranged to adhere the first and second substrate areas together after the first and second substrate areas have been brought in mechanical contact.
  • Fig 1 is a schematic illustration of a production line for producing RFID labels or RFID tags in accordance a method and apparatus of an embodiment of the present invention
  • Fig 2 is a schematic illustration of a production line for producing RFID labels or RFID tags in accordance with another embodiment of the present invention.
  • Fig 3 is a schematic illustration of a production line for producing RFID labels or RFID tags in accordance with still another embodiment of the present invention.
  • Fig 4a-c are schematic illustrations of RFID transponders producible by the present invention, where Fig 4a illustrate top views of two substrate webs provided with complementary antenna elements, Fig 4b illustrate a top view of the antenna elements of Fig 4a assembled together with IC:s, where the substrate webs are shown as fully transparent, and Fig 4c is a side view of one of the transponders in Fig 4b;
  • Fig 5 is a schematic illustration of a substrate web provided with two complementary antenna elements, intended to be folded over each other to form the antenna;
  • Fig 6 is a schematic illustration of second embodiment of a foldable substrate web
  • Fig 7 is a schematic illustration of third embodiment of a foldable substrate web
  • Fig 8 is a schematic illustration of fourth embodiment of a foldable substrate web.
  • Fig. 9a and b are schematic illustrations of a production line for producing RFID labels or RFID tags in accordance with yet another embodiment of the present invention.
  • the invention will in the following primarily be exemplified in relation to a roll-to-roll process, where the substrates are provided in the form of webs arranged on rolls. Flowever, it is to be appreciated by the skilled reader, that the process may also be used for substrates of other types, such as sheets. Thus, the process may also be embodied as a sheet-to-sheet process or a roll-to-sheet process.
  • the system 100 comprises a first input or unwind station 101 a, provided with a reel holder for receiving rolls 102a of a substrate web 200a.
  • the substrate web can e.g. be paper.
  • the substrate material is preferably a fibrous web, and can be of any of a wide variety of materials, widths and thicknesses. Paper and polymer films (plastics) are suitable, but other similar non-conductive surfaces may be also used.
  • the substrate material may also be coated, and a multilayered web may also be used.
  • the substrate web is transferred to a particle handler 103a, arranged to transfer a conductive material in a pattern onto a surface of the substrate web.
  • the pattern corresponds to the electrically conductive pattern of one of the antenna elements to be provided in the RFID transponder.
  • an adhesion area may be formed in the surface of the web, as is per se known in the art, in order to maintain the particles in the desired place until melting and pressing has occurred.
  • the adhesion area may be formed in correspondence with the intended pattern for the electrically conductive pattern to be formed, and may e.g. be formed by dispersive adhesion (i.e. gluing) or electrostatic adhesion. This may e.g. be performed by an adhesive printing or lacquering section (not separately shown) that is configured to spread an adhesive or lacquer onto the substrate to create an adhesion area of predetermined form, or by an electric charger section that is configured to create a spatial distribution of static electric charge in the web material to create an adhesion area of predetermined form.
  • the particles may directly be transferred onto the web in correspondence with the electrically conductive pattern to be formed.
  • the electrically conductive solid particles may come as a part of a compound that contains, in addition to the electrically conductive solid particles, a fluid or gelatinous substance that has adhesive properties. In that case, the preparatory creation of adhesion areas may be omitted.
  • the conductive material is then cured to form a solidified, more compact pattern.
  • This can e.g. be made by application of heat with a heater 104a.
  • the conductive material is preferably heated to a temperature exceeding a characteristic melting temperature of the conductive material.
  • the heating is preferably a non-contacting heating, which reduces the risk of smearing or unwanted macroscopic changes in the spatial distribution of conductive material on the surface of the web.
  • heating methods that are contacting may also be used. Especially if heating is made with low or very low contact pressure, it may well have the same advantageous non smearing characteristics. As a result of the heating, a melt is created.
  • Non-contacting heating may e.g. be obtained by infrared radiation, laser heating, or heating with other types of radiation, inductive heating, streaming with hot gas, etc.
  • heating may also be made by bringing the substrate web or the conductive material into contact with a heated body, such as a heated nip.
  • the heating of the conductive material to a temperature exceeding a characteristic melting temperature of the conductive material results in a melting and solidification of the conductive material. This may in itself be sufficient to form the electrically conductive pattern, in particular if the heating also involves contacting the transferred particles with pressure.
  • the method may also comprise a step of applying a pressure onto the heated conductive material, subsequent to the heating but prior to lamination.
  • This pressure may be applied by a nip (not shown), and preferably the surface temperature of the nip is lower than the characteristic melting temperature.
  • This pressure is preferably applied relatively soon after the heating, so that the material still remains in a melted or almost melted state.
  • the pressure will cause the previously melted material to solidify in the form of an essentially continuous, electrically conductive layer that covers an area on the face material web corresponding to the intended electrically conductive pattern.
  • the nip may be a non-heated nip.
  • the nip is heated to a temperature only somewhat lower than the characteristic melting temperature, such as 30-60 degrees C lower. This ensures for example that the melt will not solidify prematurely, before it would become pressed against the substrate.
  • the nip will cause the previously molten material of the originally solid electrically conductive particles to solidify again, but this time not in the form of separate particles but in the form of an essentially continuous, electrically conductive layer, arranged in the predetermined pattern.
  • the nip temperature may be equal or almost equal to the characteristic melting temperature of the used electrically conductive material.
  • the pressing step may in some embodiments be omitted.
  • other nips used in the process e.g. the lamination nip discussed in more detail below, may be arranged to provide a pressure sufficient also for solidifying the melted particles, even without any additional pressing step prior to lamination.
  • the electrically conductive solid particles may be of any metal, and may e.g. be of pure metal. However, the particles are preferably formed of alloys, and most preferably non-eutectic alloys. In particular, it is preferred to use particles of metallic compounds that are - or resemble - so-called low temperature solders.
  • the alloys preferably comprise tin and bismuth.
  • a non-limiting example list of such metallic compounds includes (indicated percentages are weight percentages):
  • the first four listed examples melt between 180 and 220 degrees centigrade, while the four last-mentioned may melt at
  • the particle-type conductive matter consists essentially of metal or metal alloy particles.
  • the metal or metal alloy preferably has an atmospheric-pressure characteristic melting temperature of less than 300 degrees C, and more preferably less than 250 degrees C, and most preferably less than 200 degrees C, such as in the range 50-250 deg. C, or preferably within the range 100-200 deg. C, which makes the method suitable, for example, for conventional paper, the physical properties of which may permanently change at too high temperatures.
  • Suitable metals include, e.g. tin, bismuth, indium, zinc, nickel, or similar, used as single metals or in combinations.
  • tin-bismuth tin-bismuth-zinc, tin-bismuth-indium or tin-bismuth-zinc-indium in different ratios may be used.
  • the ratio of tin in the alloy is preferably 20 - 90 wt- percent, and most preferably 30 - 70, wt- percent of the total weight of the components in the alloy.
  • the material transfer may e.g. be obtained by:
  • Electro-photographic transfer where the particles may be deposited in a solvent.
  • the solvent is evaporated or absorbed by the substrate (in particular paper or board), where after the sintering is carried out for (almost) dry particles.
  • Screen printing where particles in liquid form (i.e. where particles are arranged in solvent or suspension) are transferred to the substrate through a web-like screen means (cloth or metal) or through a stencil.
  • the forming of the conductive pattern can be made by printing with silver ink, i.e. ink comprising conductive silver particles. The solvent can then be evaporated by means of heating at an elevated temperature, by use of photonic curing, or the like.
  • the forming of the conductive pattern can also be made by first providing a conductive layer on the web, and the removing or forming this conductive layer into the desired conductive pattern, e.g. by means of grinding, cutting, or the like.
  • a second roll 102b of a second substrate web 200b is provided on a second reel holder.
  • the second substrate web may e.g. be a paper material, and may e.g. be the same material as in the first substrate web 200a. Flowever, it is also possible to use different material in the two substrates.
  • the second substrate web can be of any width and thickness. Flowever, the width preferably corresponds to the width of the first substrate web.
  • the second substrate web is also provided with electrically conducting pattern, to form second antenna elements to be provided in the RFID transponder.
  • a particle handler 103b arranged to transfer a conductive material in a pattern onto a surface of the substrate web.
  • the conductive material is then cured to form a solidified, more compact pattern.
  • This can e.g. be made by application of heat with a heater 104b.
  • the conductive material is preferably heated to a temperature exceeding a characteristic melting temperature of the conductive material.
  • the forming of the second antenna elements can be made in the same way as for the first antenna elements, or alternatively be varied and different in accordance with the discussion above.
  • the first antenna elements and the second antenna elements are complementary to each other, and thereby together, when combined, form the entire antenna of the RFID transponder.
  • Each antenna is further provided with an antenna terminal, to be electrically connected to a corresponding antenna contact of an IC. This will be discussed in more detail in the following.
  • the first substrate web continues to an adhesive applicator 105, providing a layer of adhesive on a surface of the substrate web.
  • the adhesive may e.g. be a pressure sensitive adhesive (PSA) or a pressure sensitive hot melt adhesive.
  • PSA pressure sensitive adhesive
  • the adhesive is preferably a non-conductive adhesive, such as a non-conductive paste (NCP), or an anisotropic conductive paste (ACP).
  • NCP non-conductive paste
  • ACP anisotropic conductive paste
  • the adhesive/paste is preferably arranged for thermal compression bonding.
  • the adhesive is preferably applied in liquid form, and cured/solidified when heated. Flowever, acrylic adhesive,, hot-melt adhesive or any other suitable adhesive may also be used.
  • the adhesive can, additionally or alternatively, be provided after placement of the IC.
  • the first substrate is brought to a transfer device 106 arranged to place IC:s at suitable positions on the first substrate.
  • the IC:s are dual-sided IC:s, each having a circuit block electrically coupled to a first antenna contact, disposed on a first external surface, and a second antenna contact, disposed on second, opposite external surface of the IC.
  • the IC:s may e.g. be of any of the types disclosed in US 9489611 and US
  • the IC:s are placed over the antenna elements of the first substrate web, and more particularly so that the first antenna contacts of the IC:s come in mechanical contact with the first antenna terminals of the first antenna elements.
  • the transfer device may comprise a pick-and-place equipment or the like, picking the IC:s from a storage supply, such as a stack, a container, a batch hopper, a wafer or the like, and placing the IC:s at the intended position on the first substrate web.
  • the picking tool may e.g. operate by vacuum.
  • the placement of the IC:s on the first web can also be obtained in simpler ways. For example, the IC:s may simply be dropped onto the first substrate web from a short height, and at controlled times.
  • the IC:s Due to the high tolerances, placement of the IC:s can be made while the web is moving. However, if there is need for higher precision, the web may alternatively be brought to intermittent quick halts during the placement.
  • the two webs, the first substrate web with the first antenna elements and the IC:s placed in contact with the first antenna elements, and the adhesive, and the second substrate web with the second antenna elements are then brought together, and laminated in a lamination nip 109.
  • the webs are brought together so that the second antenna contact of the IC:s, arranged on the opposite side of the IC:s, and facing away from the first substrate web, towards the second substrate web, are brought into contact with the second antenna terminals, provided on the second antenna elements.
  • the lamination nip 109 exerts a pressure towards the webs, thereby effecting lamination.
  • the lamination nip may also optionally be a heated nip, thereby also effecting lamination by additional heating.
  • the substrates are further heated to a temperature exceeding the characteristic melting point of the material forming the antenna elements, and in particular at the areas corresponding to the first and second antenna terminals.
  • the heat can be applied by the nip 109. However, additionally or alternatively, heat can be provided upstream or downstream from the lamination nip 109.
  • the heating of the antenna terminals makes the material solder into contact with the antenna contacts of the IC, thereby forming an electrical contact between the first antenna contact and the first antenna terminal, and between the second antenna contact and the second antenna terminal, respectively.
  • a die cutter 110 or the like may be provided in order to separate the labels/tags from each other, and to provide the desired shape and dimensions of the labels/tags.
  • the die cutting station may e.g. be used to perforate the web, or completely cut through the web material along cutting lines.
  • the die cutting station is preferably held in registration with the insertion stations so that the laminated label web may be cut without cutting through an electrically conductive pattern.
  • the die cutting station may comprise cutting elements, e.g. in the form of one or more rotary die or other types of tooling for cutting or perforating used for forming labels or tags.
  • the die cutting station may also comprise a monitor or sensor to identify the location of the electrically conductive pattern, to ensure that cutting does not occur over the electrically conductive patterns.
  • a waste matrix removal station 110 may be provided, and the removed matrix may be rolled onto a waste roll 111.
  • the finished, laminated web may then be re-winded onto a third roll 113 at a re-winding station 112.
  • the labels may also be provided with an additional layer of adhesive on an outer surface, useable to adhere the label to packages, containers and the like.
  • the labels may further comprise an easily removable release liner to cover the adhesive.
  • the labels may further comprise printed information, in the form of text, digits, bar codes, etc.
  • the system may further comprise a printing station, e.g. for printing the first substrate web.
  • the printing station (not shown) can e.g. be arrange prior to the particle handler 103.
  • the roll 102 of substrate web may also comprise pre-printed label stock.
  • the printing can be made by flexographic printing, off-set printing or any other printing method.
  • the re-winding station 113 may also comprise post-processing means that are configured to post-process the final web, for example by cooling, removing static electric charge, coating, evaporation of volatile components of substances present within or on the web, or the like.
  • One or more tensioning devices may also be provided along the production line, to control the tension of the webs, as is per se known in the art.
  • the complete RFID transponders are formed within a single process, including formation of the antenna elements, placement of the IC:s and connecting the IC:s to the antenna elements.
  • the antenna elements may be provided on the substrate webs in a separate procedure, and the rolls of substrate webs already containing the antenna elements may be used as input material for a process in which the IC:s are brought into place and the webs are laminated. Such an embodiment is illustrated in Fig. 2.
  • a programming and/or testing station may be provided.
  • the RFID transponders may be programmed, in case they are not preprogrammed before placement on the labels, and the function of each RFID transponder may be tested and verified.
  • the programming and/or testing station may comprise an interrogator system comprising an RFID antenna or multiple antenna arrays for checking and testing the functionality of each RFID transponder. More specifically, the station may comprise an RFID reader or an RFID reader/writer.
  • rolls 102a’ and 102b’ of substrate webs already having antenna elements are provided at a first and second input or unwind stations 101 a’ and 101 b’, provided with reel holders.
  • the antenna elements on these substrates may e.g. be produced in the same way as discussed above in relation to the first embodiment.
  • One of the substrate webs then passes an adhesive applicator 105, and an IC placement device 106, in the same way as discussed above.
  • the two webs are then brought together, to form contact between the antenna elements and the IC:s, and heat and pressure is applied by the lamination nip 109, and the final web is assembled on an output roll 113.
  • Pre-forming of the antenna elements on the substrate webs is particularly advantageous if the same type of antenna elements is used on the two webs.
  • the two substrate webs can be formed in the same process, and using the same production equipment.
  • the lamination and the forming of the electric contact to the IC can be made by hot nips.
  • the heating is provided by a hot roller 109’ with defined web tension.
  • the web tension hereby presses the IC antenna contacts and the antenna terminals together, and this, in combination with the heating, makes appropriate bonding to occur.
  • Such bonding can be done at very high speed, since only a short time (typically less than 1 s) is needed.
  • the electrical connection between the antenna contacts and the antenna terminals are, as discussed previously, formed by the heat and optional pressure applied, thereby soldering the antenna terminals onto the antenna contacts.
  • relatively large antenna contacts such as pads extending over a substantial part of the IC surface
  • the need for heat and pressure is lowered, since the electric contact may also be formed by capacitive coupling between the antenna contact and the antenna terminal.
  • the electrical connection becomes less sensitive to disturbances caused by the adhesive and the like.
  • the first and second substrate webs 200a and 200b are illustrated. Each comprises a plurality of antenna elements 201 a, 201 b.
  • the antenna elements form part of a dipole antenna, and each terminates in an antenna terminal 204a, 204b.
  • the antenna elements are producible in the ways discussed in the foregoing, and the antenna elements may take many different shapes and dimensions, as will be discussed in further detail in the following.
  • the antenna terminals 204a and 204b are connected to the antenna contacts 203a, 203b arranged on each side of the IC, thereby together forming an antenna for the RFID transponder.
  • the first antenna elements are provided on a first substrate
  • the second antenna elements are provided on a second substrate, being separate from the first substrate.
  • first antenna elements on a first substrate area on a substrate
  • second antenna elements on a second substrate area on the same substrate. After placement of the IC:s on the antenna terminals on the antenna elements on the first substrate area, the substrate is folded, so that the second substrate area is placed over the IC:s in the intended position, to be laminated and electrically connected.
  • the production apparatus for such an embodiment may be realized in a similar way as in the previously discussed embodiments, but with only one input substrate web.
  • Such a substrate web, to be used in a folding substrate, is illustrated in Fig. 5.
  • a single substrate web is provided, comprising a first substrate area 200a’ and a second substrate area 200b’.
  • the first and second substrate areas are separated by a folding line 205.
  • the first antenna elements 201 a are provided on the first substrate area 200a’, and the second antenna elements 201 b are provided on the second substrate area 200b’.
  • the substrate After placement of the IC:s on the antenna elements on the first surface area 200a’, the substrate is folded, in a folding station, so that the second surface area 200b’ comes into contact with the IC:s.
  • the antenna elements are then heated to laminate the surface areas together, and to form the electrical contact between the antenna terminals and the antenna contacts in the same way as in previously discussed embodiments.
  • the antenna elements may be designed and dimensioned in many different ways.
  • the antenna elements are extending symmetrically outwards from a centrally arranged IC.
  • the antenna elements 201 a’ and 201 b’ are arranged in a side-by-side arrangement, with the antenna terminals provided on the same side of the antenna, and both the antenna terminals extending in the same direction in relation to IC 202.
  • the antenna elements are arranged on a single substrate, foldable along a folding line 205, but the same principle may be used in a two substrate embodiment.
  • the antenna elements extend in a direction along the width direction of the substrate.
  • the antenna element may also extend along the longitudinal direction of the substrate, as illustrated in Fig. 7, where the antenna elements 201 a” and 201 b” extend in the length direction of the substrates, and are foldable over each other. Again, the same principle may be used in a two substrate embodiment.
  • the substrate is provided in a roll, to be used in a roll-to-roll process or a roll-to-sheet process.
  • the input substrate(s) may also be provided in the form of sheets.
  • the sheets may e.g. be die-cut blanks for packages.
  • the previously discussed antennas having antenna elements of essentially the same size, and being symmetrical to each other, are in particular suited for use at rather high frequencies, such as the UHF (Ultra High Frequency) band, e.g. in the range 800-1000 MHz.
  • UHF Ultra High Frequency
  • the first and second antenna elements may also be differently sized and shaped.
  • the first antenna element may form X% of the antenna, whereas the second antenna element forms 100-X% of the antenna, where X is any number between 1 and 99.
  • Such antennas are for example well suited for lower frequencies, such as antennas for use in the HF (High Frequency) band, e.g. at 13.6 MHz.
  • one of the antenna elements 201 a’ to be arranged on either the first or the second substrate or substrate areas, is shaped as a helix.
  • the helix may have circular coils, but other shapes, such as hexagonal, octagonal, rectangular, triangular, and similar, may also be contemplated.
  • a rectangular helix is provided.
  • the helix extends in widening coils from an inner first antenna terminal 204a’”.
  • the second antenna element 201 b’ is here in the form of a bridge, connecting the outer end of the helix to a second antenna terminal 204b’”.
  • a foldable substrate is used, and the bridge is connected to the helix, and extends into the other substrate area, crossing a folding line 205.
  • the IC is placed on either the first or the second antenna terminal, and the substrate is then folded so that the IC also comes into contact with the other antenna terminal.
  • the heating and optional pressing may occur locally, only to create an electrical contact between the antenna contact of the IC and the antenna terminals, and to avoid short circuiting between the helix and the strap.
  • the adhesive may in this embodiment be of a kind providing a dielectric layer between the HF antenna helix and the bridge.
  • the bridge pattern may also have adhesive coating of the area that needs to be electrically insulated from the helix pattern.
  • the lamination is preferably made with no or relatively low heating, such as by using a cold nip.
  • Fig. 8a illustrates the two substrate webs, a first substrate web 200a being provided with a helix antenna pattern 201 a””, and a second substrate web 200b being provided with a bridge antenna pattern 201 b””.
  • an adhesive providing dielectric properties may be used to avoid short circuiting.
  • a local heating may be applied, connecting the ends of the bridge to the IC antenna contact at one end, and to the outer end of the helix at the other end. This may e.g. be accomplished by a fork-like heating element 109’, as illustrated in Fig 8b.
  • a fork-like heating element 109’ as illustrated in Fig 8b.
  • the electrically conductive pattern may function as different types of antennas, and not only dipole antennas.
  • lamination may be obtained by use of a pressure sensitive adhesive, and application of a pressure to the webs to be laminated, but other ways of laminating the webs are also feasible.
  • placement and attachment of the integrated circuit to the electrically conductive pattern can be provided as integrated steps in the process of forming the labels, but may alternatively be provided in a separate process. Such and other obvious modifications must be considered to be within the scope of the present invention, as it is defined by the appended claims.

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Abstract

L'invention concerne un procédé de production de transpondeurs d'identification par radiofréquence (RFID) disposés sur un substrat porteur, comprenant : la fourniture de deux zones de substrat, ayant chacun au moins un élément d'antenne sur lequel sont disposées des bornes d'antenne ; et la fourniture d'un circuit intégré double face (IC) ayant un contact d'antenne sur chacune de deux surfaces externes opposées. Le CI est disposé sur l'une des zones de substrat, de telle sorte qu'un des contacts d'antenne vient en contact mécanique avec l'un des terminaux d'antenne. Les deux zones de substrat sont ensuite rapprochées, amenant ainsi le deuxième contact d'antenne en contact mécanique avec le deuxième terminal d'antenne. Enfin, de la chaleur est appliquée aux zones de substrat à proximité du CI, en le chauffant à une température au moins égale à un point de fusion caractéristique des bornes d'antenne, ce qui permet de former un contact électrique entre les contacts d'antenne et le terminal d'antenne. L'invention concerne également un appareil correspondant.
PCT/IB2019/054430 2019-05-29 2019-05-29 Procédé et appareil de production d'un transpondeur d'identification par radiofréquence (rfid) WO2020240252A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/IB2019/054430 WO2020240252A1 (fr) 2019-05-29 2019-05-29 Procédé et appareil de production d'un transpondeur d'identification par radiofréquence (rfid)
FI20216339A FI20216339A1 (fi) 2019-05-29 2019-05-29 Menetelmä ja laite radiotaajuustunnistus (RFID) -transponderien valmistamiseksi
SE2151631A SE545307C2 (en) 2019-05-29 2019-05-29 Method and apparatus for producing a radio-frequency identification (rfid) transponder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2019/054430 WO2020240252A1 (fr) 2019-05-29 2019-05-29 Procédé et appareil de production d'un transpondeur d'identification par radiofréquence (rfid)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065586A1 (en) * 2004-02-06 2009-03-12 Kouji Tasaki Electronic device
US20140144992A1 (en) * 2012-09-10 2014-05-29 Impinj, Inc. Rfid integrated circuits and tags with antenna contacts on multiple surfaces
US9489611B1 (en) * 2012-04-11 2016-11-08 Impinj Inc. RFID integrated circuits with antenna contacts on multiple surfaces
WO2019073381A1 (fr) * 2017-10-13 2019-04-18 Stora Enso Oyj Procédé et appareil de production de transpondeur d'identification de radiofréquence

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065586A1 (en) * 2004-02-06 2009-03-12 Kouji Tasaki Electronic device
US9489611B1 (en) * 2012-04-11 2016-11-08 Impinj Inc. RFID integrated circuits with antenna contacts on multiple surfaces
US20140144992A1 (en) * 2012-09-10 2014-05-29 Impinj, Inc. Rfid integrated circuits and tags with antenna contacts on multiple surfaces
WO2019073381A1 (fr) * 2017-10-13 2019-04-18 Stora Enso Oyj Procédé et appareil de production de transpondeur d'identification de radiofréquence

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SE545307C2 (en) 2023-06-27
FI20216339A1 (fi) 2021-12-23

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